US20050052853A1 - Board to board array type connector - Google Patents

Board to board array type connector Download PDF

Info

Publication number
US20050052853A1
US20050052853A1 US10/654,044 US65404403A US2005052853A1 US 20050052853 A1 US20050052853 A1 US 20050052853A1 US 65404403 A US65404403 A US 65404403A US 2005052853 A1 US2005052853 A1 US 2005052853A1
Authority
US
United States
Prior art keywords
supporting cover
board
pcb
type connector
array type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US10/654,044
Other versions
US6859370B1 (en
Inventor
Chien-Yu Hsu
Yen-Jang Liao
Li-Sen Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speed Tech Corp
Original Assignee
Speed Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speed Tech Corp filed Critical Speed Tech Corp
Priority to US10/654,044 priority Critical patent/US6859370B1/en
Assigned to SPEED TECH CORP. reassignment SPEED TECH CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, LI-SEN, HSU, CHIEN-YU, LIAO, YEN-JANG
Application granted granted Critical
Publication of US6859370B1 publication Critical patent/US6859370B1/en
Publication of US20050052853A1 publication Critical patent/US20050052853A1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/621Bolt, set screw or screw clamp

Definitions

  • This invention relates generally to an array type connector and, more specifically, to a board to board array type connector that connects a lower PCB and a upper board, the structure and fastening method is simple, the pins on the connector have evenly stress for better connectivity, the pins also have very good shield effect of electromagnetic interference (EMI).
  • EMI electromagnetic interference
  • the fastening structure of an array type connector as shown in FIG. 3 is an example, a microprocessor (a) connects to a lower PCB (c) through an array type connector (b); the fastening method is to have a heat sink (d) stick to top of the microprocessor (c), then have four screws (e) pass through heat sink (d) and array type connector (b) and fasten with the fastening board (f) beneath the lower PCB (c).
  • this method needs four screws (e) to lock, the process is tedious and consumes manpower, when the locking strength of four screws are different, the pressure on different area of the connector (b) will be different, such might causes bad connection condition or even causes twist on the surface of lower PCB that further introduces circuitry and component damage and/or short situation.
  • EMI electromagnetic interference
  • a board to board array type connector in accordance with the present invention comprises a an array type connector, an upper supporting cover, a lower supporting cover, a screw with a bolt and a screw nut; a center through hole each is on the center of the upper supporting cover and the lower supporting cover, several upper and lower pressing area/point surround the center through holes, the thickness in center area is thinner than that of the area near the upper and lower pressing area/point; a through hole corresponding to the upper and lower supporting covers is on the center of the array type connector.
  • the upper supporting cover is on the top of the upper PCB, the upper pressing area/point presses down on the top of the upper PCB, the lower supporting cover is on the bottom of the lower PCB, the lower pressing area/point presses up on the bottom of the lower PCB, the screw with bolt passes through all the through holes and is fastened with the screw nut on the end to assemble the whole set, such structure can make the stress distributed equilibrium to the upper and lower pressing area/point, the pressure is evenly over all the connection pins of the array type connector for better electrical conductivity.
  • the thinner center of the upper and lower supporting covers design can make the upper and lower supporting covers more elasticity to prevent loose condition when the screw with bolt is screwed tight.
  • the upper and lower supporting covers are made of conductivity material and connected to ground better shielding effect against electromagnetic interference (EMI).
  • EMI electromagnetic interference
  • FIG. 1 is an assembly view of the present invention
  • FIG. 2 is a cross-sectional view of the present invention
  • FIG. 3 is an assembly view of the prior art.
  • the present invention is composed of an array type connector ( 70 ), an upper supporting cover ( 10 ), a lower supporting cover ( 20 ), a screw with a bolt ( 30 ) and a screw nut ( 40 ); the major feature is a center through hole ( 11 ), ( 21 ) each is on the center of the upper supporting cover ( 10 ) and the lower supporting cover ( 20 ), several upper and lower pressing area/point ( 12 ) and ( 22 ) surround the center through hole ( 11 ), ( 21 ).
  • the upper supporting cover ( 10 ) and the lower supporting cover ( 20 ) apply four positioning pole ( 13 ), ( 23 ) on four corners to install on the lower PCB ( 60 ) and the upper PCB ( 50 ) respectively and accurately;
  • the upper supporting cover ( 10 ) is on the top of the upper PCB ( 50 ), the upper pressing area/point ( 12 ) presses down on the top of the upper PCB ( 50 );
  • the lower supporting cover ( 20 ) is on the bottom of the lower PCB ( 60 ), the lower pressing area/point ( 22 ) presses up on the bottom of the lower PCB ( 60 ).
  • the array connector ( 70 ) is clamped between the upper PCB ( 50 ) and the lower PCB ( 60 ), one through hole ( 61 ), ( 71 ) and ( 51 ) each corresponding to the location of the center through hole ( 11 ), ( 21 ) is on the lower PCB ( 60 ), the array connector ( 70 ) and the upper PCB ( 50 ) respectively; the screw with bolt ( 30 ) passes through all the through hole ( 11 , 21 , 51 , 61 , 71 ) and is fastened with the screw nut ( 40 ) on the end to assemble the whole set rapidly.
  • the locking strength of the screw with bolt ( 30 ) and the screw nut ( 40 ) can be spread evenly to the upper and lower pressing areapoint ( 12 ) and ( 22 ) by the strength and the elastic function of the upper supporting cover ( 10 ) and the lower supporting cover ( 20 ), such scheme achieves equilibrium pressure over the lower PCB ( 60 ), the array connector ( 70 ) and the upper PCB ( 50 ) for better electrical connection effect.
  • the upper supporting cover ( 10 ) and the lower supporting cover ( 20 ) are made from conductivity material, the upper supporting cover ( 10 ) and the lower supporting cover ( 20 ) are connected to ground, based on above structure, the upper supporting cover ( 10 ) and the lower supporting cover ( 20 ) can shield those naked connector pins from electromagnetic interference.
  • the present invention achieves equilibrium pressure over all the pins, also offers less components for easier material control and lower cost effect.
  • the lower supporting cover ( 20 ) and the screw nut ( 40 ) can be combined into one component to reduce the number of components and cost.
  • the thickness of the upper and lower pressing areapoint ( 12 ) and ( 22 ) to the center through hole ( 11 ), ( 21 ) of the upper supporting cover ( 10 ) and the lower supporting cover ( 20 ) is thinner than that of the upper and lower pressing arealpoint ( 12 ) and ( 22 ); when the screw with bolt ( 30 ) is screwed tight, the center of the upper supporting cover ( 10 ) and the lower supporting cover ( 20 ) will be depressed, such structure offers evenly distribution of stress to all area of the upper supporting cover ( 10 ) and the lower supporting cover ( 20 ),
  • the upper and lower pressing area/point ( 12 ) and ( 22 ) of the upper supporting cover ( 10 ) and the lower supporting cover ( 20 ) can be in single row, double rows, or in rectangular or circular shape.

Abstract

A board to board array type connector comprising an array type connector, an upper supporting cover, a lower supporting cover, a screw with a bolt and a screw nut; during application, the upper supporting cover is on the top of the upper PCB, the upper pressing area/point presses down on the top of the upper PCB, the lower supporting cover is on the bottom of the lower PCB, the lower pressing area/point presses up on the bottom of the lower PCB; the screw with bolt passes through all the through holes and is fastened with the screw nut on the end to assemble the whole set, the stress is distributed equilibrium to the upper and lower pressing area/point, the pressure is evenly over all the connection pins of the array type connector for better electrical conductivity.

Description

    BACKGROUND OF THE INVENTION
  • I. Field of the Invention
  • This invention relates generally to an array type connector and, more specifically, to a board to board array type connector that connects a lower PCB and a upper board, the structure and fastening method is simple, the pins on the connector have evenly stress for better connectivity, the pins also have very good shield effect of electromagnetic interference (EMI).
  • II. Description of the Prior Art
  • Heretofore, it is known that the fastening structure of an array type connector, as shown in FIG. 3 is an example, a microprocessor (a) connects to a lower PCB (c) through an array type connector (b); the fastening method is to have a heat sink (d) stick to top of the microprocessor (c), then have four screws (e) pass through heat sink (d) and array type connector (b) and fasten with the fastening board (f) beneath the lower PCB (c).
  • Based on above known structure, this method needs four screws (e) to lock, the process is tedious and consumes manpower, when the locking strength of four screws are different, the pressure on different area of the connector (b) will be different, such might causes bad connection condition or even causes twist on the surface of lower PCB that further introduces circuitry and component damage and/or short situation.
  • SUMMARY OF THE INVENTION
  • It is therefore a primary object of the invention to provide a board to board array type connector with a simple structure and assembly method to have the upper and lower pressing area/point of the upper supporting cover and the lower supporting cover stress even pressure over lower PCB, array type connector and upper PCB for better electrical conductivity and lower cost.
  • It is an objective of this invention to provide a board to board array type connector in which the top and the bottom the connector pins of the array type connector are wrapped with metal for better shielding effect against electromagnetic interference (EMI).
  • It is still an objective of this invention to provide a board to board array type connector in which the thickness of the upper and lower pressing area/point to the center through hole of the upper supporting cover and the lower supporting cover is thinner than that of the upper and lower pressing area/point to make the upper supporting cover and the lower supporting cover more elasticity to prevent loose condition when the screws with bolts are screwed tight.
  • In order to achieve the objective set forth, a board to board array type connector in accordance with the present invention comprises a an array type connector, an upper supporting cover, a lower supporting cover, a screw with a bolt and a screw nut; a center through hole each is on the center of the upper supporting cover and the lower supporting cover, several upper and lower pressing area/point surround the center through holes, the thickness in center area is thinner than that of the area near the upper and lower pressing area/point; a through hole corresponding to the upper and lower supporting covers is on the center of the array type connector.
  • Based on above description, the upper supporting cover is on the top of the upper PCB, the upper pressing area/point presses down on the top of the upper PCB, the lower supporting cover is on the bottom of the lower PCB, the lower pressing area/point presses up on the bottom of the lower PCB, the screw with bolt passes through all the through holes and is fastened with the screw nut on the end to assemble the whole set, such structure can make the stress distributed equilibrium to the upper and lower pressing area/point, the pressure is evenly over all the connection pins of the array type connector for better electrical conductivity. The thinner center of the upper and lower supporting covers design can make the upper and lower supporting covers more elasticity to prevent loose condition when the screw with bolt is screwed tight. The upper and lower supporting covers are made of conductivity material and connected to ground better shielding effect against electromagnetic interference (EMI).
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The accomplishment of the above-mentioned object of the present invention will become apparent from the following description and its accompanying drawings which disclose illustrative an embodiment of the present invention, and are as follows:
  • FIG. 1 is an assembly view of the present invention;
  • FIG. 2 is a cross-sectional view of the present invention;
  • FIG. 3 is an assembly view of the prior art.
  • DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Referring to FIG. 1 and FIG. 2, the present invention is composed of an array type connector (70), an upper supporting cover (10), a lower supporting cover (20), a screw with a bolt (30) and a screw nut (40); the major feature is a center through hole (11), (21) each is on the center of the upper supporting cover (10) and the lower supporting cover (20), several upper and lower pressing area/point (12) and (22) surround the center through hole (11), (21).
  • Based on above structure, the upper supporting cover (10) and the lower supporting cover (20) apply four positioning pole (13), (23) on four corners to install on the lower PCB (60) and the upper PCB (50) respectively and accurately; the upper supporting cover (10) is on the top of the upper PCB (50), the upper pressing area/point (12) presses down on the top of the upper PCB (50); the lower supporting cover (20) is on the bottom of the lower PCB (60), the lower pressing area/point (22) presses up on the bottom of the lower PCB (60). The array connector (70) is clamped between the upper PCB (50) and the lower PCB (60), one through hole (61), (71) and (51) each corresponding to the location of the center through hole (11), (21) is on the lower PCB (60), the array connector (70) and the upper PCB (50) respectively; the screw with bolt (30) passes through all the through hole (11,21,51,61,71) and is fastened with the screw nut (40) on the end to assemble the whole set rapidly.
  • Based on above description, the locking strength of the screw with bolt (30) and the screw nut (40) can be spread evenly to the upper and lower pressing areapoint (12) and (22) by the strength and the elastic function of the upper supporting cover (10) and the lower supporting cover (20), such scheme achieves equilibrium pressure over the lower PCB (60), the array connector (70) and the upper PCB (50) for better electrical connection effect.
  • The upper supporting cover (10) and the lower supporting cover (20) are made from conductivity material, the upper supporting cover (10) and the lower supporting cover (20) are connected to ground, based on above structure, the upper supporting cover (10) and the lower supporting cover (20) can shield those naked connector pins from electromagnetic interference. The present invention achieves equilibrium pressure over all the pins, also offers less components for easier material control and lower cost effect.
  • The lower supporting cover (20) and the screw nut (40) can be combined into one component to reduce the number of components and cost.
  • The thickness of the upper and lower pressing areapoint (12) and (22) to the center through hole (11), (21) of the upper supporting cover (10) and the lower supporting cover (20) is thinner than that of the upper and lower pressing arealpoint (12) and (22); when the screw with bolt (30) is screwed tight, the center of the upper supporting cover (10) and the lower supporting cover (20) will be depressed, such structure offers evenly distribution of stress to all area of the upper supporting cover (10) and the lower supporting cover (20), The upper and lower pressing area/point (12) and (22) of the upper supporting cover (10) and the lower supporting cover (20) can be in single row, double rows, or in rectangular or circular shape.
  • While a preferred embodiment of the invention has been shown and described in detail, it will be readily understood and appreciated that numerous omissions, changes and additions may be made without departing from the spirit and scope of the invention.

Claims (11)

1. A board to board array type connector comprising:
(a) an upper PCB and a lower PCB;
(b) an array type connector clamped between the upper PCB and the lower PCB;
(c) an upper supporting cover and a lower supporting cover, each further comprising at least one respective through hole,
said upper supporting cover being disposed on the top of the upper PCB and comprising at least one downwardly pressing area/point that presses down on the top of the upper PCB,
said lower supporting cover being disposed on the bottom of the lower PCB and comprising at least one upwardly pressing area/point that presses up on the bottom of the lower PCB;
wherein the lower PCB, the upper PCB, and said array connector each includes a respective additional through hole alienable with the respective through hole of each of said upper supporting cover and said lower supporting cover; and
(d) a screw passing through all of said through holes in said upper supporting cover, said lower supporting cover, said lower PCB, said upper PCB, and said array connector, and being fastened with a screw nut on the end of said screw.
2. The board to board array type connector recited in claim 1, wherein said lower supporting cover and said screw nut are combined into one component.
3. The board to board array type connector recited in claim 1, wherein the thickness of said upper supporting cover and said lower supporting cover, from said upwardly and downwardly pressing area/points to the center through hole of said upper supporting cover and said lower supporting cover, is thinner than that of said upwardly and downwardly pressing area/points, to make said upper supporting cover and said lower supporting cover more elastic to prevent looseness when said screw with bolt is screwed tight.
4. The board to board array type connector recited in claim 1, wherein said upper supporting cover and said lower supporting cover are made of conductivity material.
5. The board to board array type connector recited in claim 4, wherein said upper supporting cover and said lower supporting cover connect to ground for better electromagnetic interference shielding effect.
6. The board to board array type connector recited in claim 1, wherein each respective through hole is a center through hole, and comprising
a plurality of the upwardly pressing area/points disposed to surround the center through hole of said lower supporting cover, and
a plurality of the downwardly pressing area/points disposed to surround the center through hole of said upper supporting cover.
7. The board to board array type connector recited in claim 6, wherein
the respective through hole located at the center of said upper supporting cover is centrally located among the downwardly pressing area/points, and
the respective through hole located at the center of said lower supporting cover is centrally located among the upwardly pressing area/points.
8. The board to board array type connector recited in claim 6, comprising exactly one respective through hole located at the center of each of said upper supporting cover and said lower supporting cover.
9. The board to board array type connector recited in claim 8, wherein
the respective through hole located at the center of said upper supporting cover is substantially equidistant from all of the downwardly pressing area/points, and
the respective through hole located at the center of said lower supporting cover is substantially equidistant from all of the upwardly pressing area/points.
10. The board to board array type connector recited in claim 1, comprising exactly one respective through hole located at the center of each of said upper supporting cover and said lower supporting cover.
11. The board to board array type connector recited in claim 1, comprising positioning poles on at least one of the upper supporting cover and the lower supporting cover, whereby the positioning poles are fittable to the upper PCB or the lower PCB.
US10/654,044 2003-09-04 2003-09-04 Board to board array type connector Expired - Fee Related US6859370B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/654,044 US6859370B1 (en) 2003-09-04 2003-09-04 Board to board array type connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/654,044 US6859370B1 (en) 2003-09-04 2003-09-04 Board to board array type connector

Publications (2)

Publication Number Publication Date
US6859370B1 US6859370B1 (en) 2005-02-22
US20050052853A1 true US20050052853A1 (en) 2005-03-10

Family

ID=34136661

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/654,044 Expired - Fee Related US6859370B1 (en) 2003-09-04 2003-09-04 Board to board array type connector

Country Status (1)

Country Link
US (1) US6859370B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110292621A1 (en) * 2010-05-28 2011-12-01 International Business Machines Corporation Grounded lid for micro-electronic assemblies
US20120178313A1 (en) * 2011-01-11 2012-07-12 Kabushiki Kaisha Toyota Jidoshokki Substrate connection structure
WO2014085487A1 (en) * 2012-11-30 2014-06-05 Trane International Inc. Techniques and arrangements for multiple component grounding

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7033208B1 (en) * 2005-03-07 2006-04-25 Cheng Uei Precision Industry Co., Ltd. Flexible printed circuit connector
US7870888B2 (en) * 2005-08-26 2011-01-18 Illinois Tool Works Inc. Base for heat radiator, heat dissipation assembly for central processing unit, and method of using the same
US7375963B2 (en) * 2006-04-11 2008-05-20 International Business Machines Corporation System and method for cooling a module
US7503767B2 (en) * 2006-08-01 2009-03-17 General Dynamics Advanced Information Systems, Inc. Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments
CN101457783B (en) * 2007-12-14 2011-07-27 鸿富锦精密工业(深圳)有限公司 Fastening mechanism
US7753707B1 (en) * 2009-04-24 2010-07-13 Lotes Co., Ltd. Electrical connecting assembly
JP5487230B2 (en) * 2012-03-21 2014-05-07 東芝テック株式会社 Component support device and inkjet device
US9996120B1 (en) * 2015-05-22 2018-06-12 EMC IP Holding Company LLC PCB module for increased connectivity
US10334715B2 (en) * 2015-12-18 2019-06-25 Intel Corporation Systems, methods and devices for a package securing system
US9520658B1 (en) * 2016-01-28 2016-12-13 Deere & Company Fastener assembly
CN106132069B (en) * 2016-06-28 2018-12-04 广东欧珀移动通信有限公司 Pcb board and mobile terminal with it
US11443998B2 (en) * 2019-06-05 2022-09-13 Te Connectivity Solutions Gmbh Electronic assembly including optical modules

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3786168A (en) * 1971-03-11 1974-01-15 Bbc Brown Boveri & Cie Holder member for a disc-shaped semiconductor element
US4159483A (en) * 1977-11-25 1979-06-26 Cutler-Hammer, Inc. Low profile force indicating fastener, especially for semiconductor clamps
US5215472A (en) * 1991-08-22 1993-06-01 Augat Inc. High density grid array socket
US5221209A (en) * 1991-08-22 1993-06-22 Augat Inc. Modular pad array interface
US5594356A (en) * 1993-06-17 1997-01-14 Intel Corporation Interconnection device for connecting test equipment with a circuit board designed for fine pitch solder lead integrated circuit components
US5713744A (en) * 1994-09-28 1998-02-03 The Whitaker Corporation Integrated circuit socket for ball grid array and land grid array lead styles
US5730620A (en) * 1995-09-08 1998-03-24 International Business Machines Corporation Method and apparatus for locating electrical circuit members
US5793618A (en) * 1996-11-26 1998-08-11 International Business Machines Corporation Module mounting assembly
US5978223A (en) * 1998-02-09 1999-11-02 International Business Machines Corporation Dual heat sink assembly for cooling multiple electronic modules
US6181567B1 (en) * 1997-06-04 2001-01-30 Ncr Corporation Method and apparatus for securing an electronic package to a circuit board
US6337228B1 (en) * 1999-05-12 2002-01-08 Amkor Technology, Inc. Low-cost printed circuit board with integral heat sink for semiconductor package
US6400577B1 (en) * 2001-08-30 2002-06-04 Tyco Electronics Corporation Integrated circuit socket assembly having integral shielding members
US6477058B1 (en) * 2001-06-28 2002-11-05 Hewlett-Packard Company Integrated circuit device package including multiple stacked components
US6485311B2 (en) * 2001-03-20 2002-11-26 International Business Machines Corporation Compression connector actuation system
US6497582B1 (en) * 2001-08-22 2002-12-24 International Business Machines Corporation LGA connector with integrated gasket
US6529023B2 (en) * 2001-05-17 2003-03-04 International Business Machines Corporation Application and test methodology for use with compression land grid array connectors
US6545879B1 (en) * 2002-01-10 2003-04-08 Tyco Electronics Corporation Method and apparatus for mounting a lidless semiconductor device
US6549418B1 (en) * 2001-09-26 2003-04-15 Hewlett Packard Development Company, L.P. Land grid array integrated circuit device module
US6603665B1 (en) * 2002-09-12 2003-08-05 Hon Hai Precision Ind. Co., Ltd. Heat dissipating assembly with thermal plates
US6680848B2 (en) * 2001-06-19 2004-01-20 Bull S.A. Device and method for mounting integrated circuits on a printed circuit card

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3786168A (en) * 1971-03-11 1974-01-15 Bbc Brown Boveri & Cie Holder member for a disc-shaped semiconductor element
US4159483A (en) * 1977-11-25 1979-06-26 Cutler-Hammer, Inc. Low profile force indicating fastener, especially for semiconductor clamps
US5215472A (en) * 1991-08-22 1993-06-01 Augat Inc. High density grid array socket
US5221209A (en) * 1991-08-22 1993-06-22 Augat Inc. Modular pad array interface
US5594356A (en) * 1993-06-17 1997-01-14 Intel Corporation Interconnection device for connecting test equipment with a circuit board designed for fine pitch solder lead integrated circuit components
US5713744A (en) * 1994-09-28 1998-02-03 The Whitaker Corporation Integrated circuit socket for ball grid array and land grid array lead styles
US5730620A (en) * 1995-09-08 1998-03-24 International Business Machines Corporation Method and apparatus for locating electrical circuit members
US5793618A (en) * 1996-11-26 1998-08-11 International Business Machines Corporation Module mounting assembly
US6181567B1 (en) * 1997-06-04 2001-01-30 Ncr Corporation Method and apparatus for securing an electronic package to a circuit board
US5978223A (en) * 1998-02-09 1999-11-02 International Business Machines Corporation Dual heat sink assembly for cooling multiple electronic modules
US6337228B1 (en) * 1999-05-12 2002-01-08 Amkor Technology, Inc. Low-cost printed circuit board with integral heat sink for semiconductor package
US6485311B2 (en) * 2001-03-20 2002-11-26 International Business Machines Corporation Compression connector actuation system
US6529023B2 (en) * 2001-05-17 2003-03-04 International Business Machines Corporation Application and test methodology for use with compression land grid array connectors
US6680848B2 (en) * 2001-06-19 2004-01-20 Bull S.A. Device and method for mounting integrated circuits on a printed circuit card
US6477058B1 (en) * 2001-06-28 2002-11-05 Hewlett-Packard Company Integrated circuit device package including multiple stacked components
US6497582B1 (en) * 2001-08-22 2002-12-24 International Business Machines Corporation LGA connector with integrated gasket
US6400577B1 (en) * 2001-08-30 2002-06-04 Tyco Electronics Corporation Integrated circuit socket assembly having integral shielding members
US6549418B1 (en) * 2001-09-26 2003-04-15 Hewlett Packard Development Company, L.P. Land grid array integrated circuit device module
US6545879B1 (en) * 2002-01-10 2003-04-08 Tyco Electronics Corporation Method and apparatus for mounting a lidless semiconductor device
US6603665B1 (en) * 2002-09-12 2003-08-05 Hon Hai Precision Ind. Co., Ltd. Heat dissipating assembly with thermal plates

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110292621A1 (en) * 2010-05-28 2011-12-01 International Business Machines Corporation Grounded lid for micro-electronic assemblies
US8614900B2 (en) * 2010-05-28 2013-12-24 International Business Machines Corporation Grounded lid for micro-electronic assemblies
US20140016283A1 (en) * 2010-05-28 2014-01-16 International Business Machines Corporation Grounded lid for micro-electronic assemblies
US9042120B2 (en) * 2010-05-28 2015-05-26 International Business Machines Corporation Grounded lid for micro-electronic assemblies
US20120178313A1 (en) * 2011-01-11 2012-07-12 Kabushiki Kaisha Toyota Jidoshokki Substrate connection structure
US8506308B2 (en) * 2011-01-11 2013-08-13 Kabushiki Kaisha Toyota Jidoshokki Substrate connection structure
WO2014085487A1 (en) * 2012-11-30 2014-06-05 Trane International Inc. Techniques and arrangements for multiple component grounding
US9788412B2 (en) 2012-11-30 2017-10-10 Trane International Inc. Techniques and arrangements for multiple component grounding

Also Published As

Publication number Publication date
US6859370B1 (en) 2005-02-22

Similar Documents

Publication Publication Date Title
US6859370B1 (en) Board to board array type connector
US7563992B2 (en) Electronic enclosure with continuous ground contact surface
EP2587503B1 (en) Power capacitor for low voltage, provided with capacitor elements, a capacitor element and a method for producing said capacitor element
US6994586B2 (en) Printed circuit board supporting structure
US7402065B1 (en) Socket connector for carrying integrated circuit package
US10861771B2 (en) Electrical assembly equipped with auxiliary retention for facilitating heat sink installation
EP1978557B1 (en) Semiconductor module in pressure contact design and method for production of the same
DE112016005793B4 (en) Sliding thermal shield
US6011700A (en) Shielding case
WO2004100117A8 (en) Pixel patterns
DE69823574T2 (en) Semiconductor device, circuit board and their combination
US4863389A (en) Terminal for connecting electronic components
US20150041205A1 (en) Thin package structure with enhanced strength
US20050181638A1 (en) Interconnect device with opposingly oriented contacts
US9121895B2 (en) Test apparatus and pallet for parallel RF testing of printed circuit boards
JP2005026021A (en) Shielding structure of coaxial connector for base plate mounting
CA2728375C (en) Test apparatus and pallet for parallel rf testing of printed circuit boards
US20040233646A1 (en) Shell device with circuit unit
US20210145141A1 (en) Curved handle
US20110197430A1 (en) Spring actuated clamping mechanism
JP2019058054A (en) Bus-type electrical center
CN101384131A (en) Circuit board and method for manufacturing the same
CN206271945U (en) A kind of electric connector with new intershield part
DE102005055487B3 (en) Electronic structure with components connected via solderable connecting elements and method for its production
JP3362269B2 (en) Electronic equipment circuit unit

Legal Events

Date Code Title Description
AS Assignment

Owner name: SPEED TECH CORP., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HSU, CHIEN-YU;LIAO, YEN-JANG;CHEN, LI-SEN;REEL/FRAME:014480/0758

Effective date: 20030819

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20090222