US20050107542A1 - Film adhesives containing maleimide compounds and methods for use thereof - Google Patents

Film adhesives containing maleimide compounds and methods for use thereof Download PDF

Info

Publication number
US20050107542A1
US20050107542A1 US11/008,980 US898004A US2005107542A1 US 20050107542 A1 US20050107542 A1 US 20050107542A1 US 898004 A US898004 A US 898004A US 2005107542 A1 US2005107542 A1 US 2005107542A1
Authority
US
United States
Prior art keywords
range
falls
independently
adhesive composition
defined above
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/008,980
Inventor
Puwei Liu
Stephen Dershem
Kang Yang
Carolyn Albino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Corp
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Priority to US11/008,980 priority Critical patent/US20050107542A1/en
Publication of US20050107542A1 publication Critical patent/US20050107542A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C09J179/085—Unsaturated polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/24—Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/8388—Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01018—Argon [Ar]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Definitions

  • the present invention relates to film adhesive compositions, and more particularly to the use of film adhesive compositions in stacked die microelectronic packaging applications.
  • stacked die packages typically require very thin bond lines between die (e.g., ⁇ 15 microns).
  • adhesive fillet and resin bleed associated with many adhesive formulations contribute to unreliable component performance.
  • adhesives used in stacked die applications ideally would provide (at a minimum bond line thickness) superior adhesive strength and conductivity (thermal and electrical) without producing adhesive fillet or resin bleed.
  • One possible approach to address this challenging problem lies in the use of film adhesives.
  • film adhesives which provide superior adhesive strength and conductivity when dispensed to achieve very thin bond lines in a variety of microelectronic packages, such as, for example, stacked die packages.
  • film adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the macromonomer, and at least one cure initiator.
  • invention compositions are useful as adhesives in the microelectronics industry.
  • invention film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength.
  • invention film adhesive compositions for adhesively attaching a device to a substrate
  • methods employing invention film adhesive compositions for adhesively attaching at least two semiconductor dice to a substrate in a stacked arrangement are provided.
  • assemblies comprising a first article adhered to a second article by invention film adhesive compositions.
  • adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the macromonomer, and at least one cure initiator.
  • macromonomer refers to a compound having properties suitable for use in invention film adhesive compositions.
  • macromonomers contemplated for use in the practice of the present invention typically are low melting point solids having low vapor pressures.
  • macromonomers contemplated for use in the practice of the present invention may be liquids having a molecular weight of at least about 500 grams/mole.
  • unit of ethylenic unsaturation refers to unsaturation comprising localized (i.e., non-aromatic) carbon-carbon double bonds, as shown below:
  • co-curable refers to the ability of a thermoplastic elastomer to undergo copolymerization with a macromonomer to form a three-dimensional polymeric network.
  • Macromonomers contemplated for use in the practice of the present invention include, for example, maleimides, vinyl compounds, allylated amides, and the like.
  • maleimide macromonomers contemplated for use in the practice of the present invention include compounds having the following structure: wherein:
  • Monovalent moieties or multivalent linking moieties are typically selected from
  • alkyl refers to hydrocarbyl radicals having 1 up to about 20 carbon atoms, preferably 2-10 carbon atoms; and “substituted alkyl” comprises alkyl groups further bearing one or more substituents selected from hydroxy, alkoxy, mercapto, cycloalkyl, substituted cycloalkyl, heterocyclic, substituted heterocyclic, aryl, substituted aryl, heteroaryl, substituted heteroaryl, aryloxy, substituted aryloxy, halogen, cyano, nitro, amino, amido, C(O)H, acyl, oxyacyl, carboxyl, carbamate, sulfonyl, sulfonamide, sulfuryl, and the like.
  • cycloalkyl refers to cyclic ring-containing groups containing in the range of 3 up to about 8 carbon atoms
  • substituted cycloalkyl refers to cycloalkyl groups further bearing one or more substituents as set forth above.
  • alkenyl refers to straight or branched chain hydrocarbyl groups having at least one carbon-carbon double bond, and having in the range of 2 up to about 12 carbon atoms
  • substituted alkenyl refers to alkenyl groups further bearing one or more substituents as set forth above.
  • alkylene refers to divalent hydrocarbyl radicals having 1 up to about 20 carbon atoms, preferably 2-10 carbon atoms; and “substituted alkylene” comprises alkylene groups further bearing one or more substituents as set forth above.
  • oxyalkylene refers to an alkylene moiety wherein one or more of the methylene units of the alkylene moiety has been replaced with an oxygen atom.
  • aryl refers to aromatic groups having in the range of 6 up to about 14 carbon atoms and “substituted aryl” refers to aryl groups further bearing one or more substituents as set forth above.
  • alkenylene refers to divalent, straight or branched chain hydrocarbyl groups having at least one carbon-carbon double bond, and having in the range of 2 up to about 12 carbon atoms
  • substituted alkenylene refers to alkenylene groups further bearing one or more substituents as set forth above.
  • oxyalkenylene refers to an alkenylene moiety wherein one or more of the methylene units of the alkenylene moiety has been replaced with an oxygen atom.
  • Vinyl macromonomers contemplated for use in the practice of the present invention include compounds having the following structure: wherein:
  • the multivalent linking moiety Y is typically selected from:
  • Allylated amide macromonomers contemplated for use in the practice of the present invention include compounds having the following structure: wherein:
  • Thermoplastic elastomers contemplated for use in the practice of the present invention are typically block copolymers.
  • the block copolymers have at least one unit of the general formula (A-B), or (A-B-A), wherein A is a non-elastomeric polymer block and B is an elastomeric polymer block.
  • Block copolymers contemplated for use in the practice of the present invention preferably have low dielectric constants.
  • thermoplastic elastomers contemplated for use in the practice of the present invention contain pendant and/or terminal units of ethylenic unsaturation, and therefore are able to cure with other components in the adhesive composition, such as the unsaturated macromonomer.
  • the non-elastomeric polymer block (A) is the polymerization product of one or more optionally substituted aromatic hydrocarbons containing at least one unit of ethylenic unsaturation.
  • Aromatic hydrocarbons contemplated for use in the practice of the present invention include, for example, optionally substituted styrene, optionally substituted stilbene, and the like.
  • Substituents contemplated for optional use in the practice of the present invention include for example, alkyl, alkenyl, alkynyl, hydroxy, alkoxy, alkenoxy, and the like.
  • the aromatic hydrocarbon is optionally substituted styrene.
  • the elastomeric polymer block (B) is typically the polymerization or copolymerization product of optionally substituted olefin monomers and/or optionally substituted conjugated diene monomers.
  • Olefin monomers contemplated for use in the practice of the present invention typically contain from 2 up to about 20 carbon atoms.
  • the olefin monomers contain from 2 up to about 12 carbon atoms.
  • the olefin monomers include, for example, ethylene, propylene, butylene, isobutylene, acrylonitrile, (meth)acrylate, and the like. Most preferably, the olefin monomer is acrylonitrile.
  • Conjugated diene monomers contemplated for use in the practice of the present invention typically contain from 4 up to about 20 carbon atoms.
  • the conjugated diene monomers contain from 4 up to about 12 carbon atoms.
  • the conjugated diene monomers include, for example, butadiene, isoprene, dimethylbutadiene, and the like. Most preferably, the conjugated diene monomer is butadiene.
  • the structure of the elastomeric segments can be optionally modified to increase adhesive strength of invention compositions.
  • the elastomeric segments of the block copolymers e.g., the polybutadiene segments
  • the elastomeric segments of the block copolymers may be modified via a thermally induced ene-reaction with maleic anhydride (for a review of the ene-reaction, see, for example, Oppolzer, W., Snieckus, V., Angew. Chem. Int. Ed. Engl., 1978, 17, 476).
  • Such modification has a particularly positive impact on hot die-shear values.
  • Thermoplastic elastomers contemplated for use in the practice of the present invention include, for example, polystyrene-polybutadiene-polystyrene block copolymers, polystyrene-polyisoprene-polystyrene block copolymers, polystyrene-polydimethylbutadiene-polystyrene block copolymers, polybutadiene-polyacrylonitrile block copolymers, and the like.
  • the block copolymer is a polystyrene-polybutadiene-polystyrene block copolymer or a polybutadiene-polyacrylonitrile block copolymer.
  • Adhesive compositions of the invention also contain in the range of 0.2 up to 2 weight % of at least one free radical initiator, wherein weight % (wt %) is based on the total weight of the composition.
  • free radical initiator refers to any chemical species which, upon exposure to sufficient energy (e.g., light, heat, or the like), decomposes into at least two species which are uncharged, but which each possesses at least one unpaired electron.
  • Preferred free radical initiators contemplated for use in the practice of the present invention are compounds which decompose (i.e., have a half life in the range of about 10 hours) at temperatures in the range of about 70 up to 180° C.
  • Free-radical cure initiators contemplated for use in the practice of the present invention include for example, peroxides (e.g., peroxy esters, peroxy carbonates, hydroperoxides, alkylperoxides, arylperoxides, and the like), azo compounds, and the like.
  • peroxides e.g., peroxy esters, peroxy carbonates, hydroperoxides, alkylperoxides, arylperoxides, and the like
  • azo compounds e.g., azo compounds, and the like.
  • Presently preferred peroxides contemplated for use in the practice of the present invention include dicumyl peroxide, dibenzoyl peroxide, 2-butanone peroxide, tert-butyl perbenzoate, di-tert-butyl peroxide, 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane, bis(tert-butyl peroxyisopropyl)benzene, tert-butyl hydroperoxide, and the like.
  • Presently preferred azo compounds contemplated for use in the practice of the present invention include 2,2′-azobis(2-methylpropanenitrile), 2,2′-azobis(2-methylbutanenitrile), 1,1′-azobis(cyclohexanecarbonitrile), and the like.
  • Adhesive compositions contemplated for use in the practice of the present invention typically contain in the range of about 10 wt % up to about 95 wt % thermoplastic elastomer, in the range of about 5 wt % up to about 90 wt % macromonomer having at least one unit of ethylenic unsaturation, and in the range of about 0.5 wt % up to about 2.0 wt % a cure initiator, wherein weight % is based on the total weight of the composition.
  • the macromonomer having at least one unit of ethylenic unsaturation is present in the range of about 10 wt % up to about 80 wt %.
  • Adhesive compositions according to the invention optionally further contain in the range of about 0.1 up to about 10 wt % of at least one coupling agent, based on the total weight of the composition.
  • the coupling agent is present in the range of about 0.2 wt % up to about 5 wt %.
  • Coupling agents contemplated for use in the practice of the present invention include siloxanes, silicate esters, metal acrylate salts, titanates, and the like.
  • Adhesive compositions according to the invention may optionally contain a filler.
  • Fillers contemplated for optional use in the practice of the present invention may optionally be conductive (electrically and/or thermally).
  • Electrically conductive fillers contemplated for use in the practice of the present invention include, for example, silver, nickel, gold, cobalt, copper, aluminum, graphite, silver-coated graphite, nickel-coated graphite, alloys of such metals, and the like, as well as mixtures thereof. Both powder and flake forms of filler may be used in the adhesive compositions of the present invention.
  • the flake has a thickness of less than about 2 microns, with planar dimensions of about 20 to about 25 microns.
  • Flake employed herein preferably has a surface area of about 0.15 to 5.0 m 2 /g and a tap density of about 0.4 up to about 5.5 g/cc. It is presently preferred that powder employed in the practice of the invention has a diameter of about 0.5 to 15 microns. If present, the filler typically comprises in the range of about 1 wt % up to about 95 wt % of the adhesive formulation, wherein weight % is based on the total weight of the composition.
  • Thermally conductive fillers contemplated for optional use in the practice of the present invention include, for example, aluminum nitride, boron nitride, silicon carbide, diamond, graphite, beryllium oxide, magnesia, silica, alumina, and the like.
  • the particle size of these fillers will be in the range of about 5 up to about 30 microns. Most preferably, the particle size of these fillers will be about 20 microns.
  • Electrically and/or thermally conductive fillers are optionally (and preferably) rendered substantially free of catalytically active metal ions by treatment with chelating agents, reducing agents, nonionic lubricating agents, or mixtures of such agents. Such treatment is described in U.S. Pat. No. 5,447,988, which is incorporated by reference herein in its entirety.
  • a filler may be used that is neither an electrical nor thermal conductor.
  • Such fillers may be desirable to impart some other property to the adhesive formulation such as, for example, reduced thermal expansion of the cured adhesive, reduced dielectric constant, improved toughness, increased hydrophobicity, and the like.
  • examples of such fillers include perfluorinated hydrocarbon polymers (i.e., TEFLONTM), thermoplastic polymers, thermoplastic elastomers, mica, fused silica, glass powder, and the like.
  • adhesive compositions contemplated for use in the practice of the present invention contain in the range of about 5 wt % up to about 90 wt % thermoplastic elastomer, in the range of about 5 wt % up to about 90 wt % macromonomer containing at least one unit of ethylenic unsaturation, in the range of about 0.5 wt % up to about 2.0 wt % cure initiator, in the range of about 0.5 wt % up to about 5 wt % coupling agent, and in the range of about 1 wt % up to about 95 wt % filler, wherein weight % is based on the total weight of the composition.
  • a device for adhesively attaching a device to a substrate comprising subjecting a sufficient quantity of an invention adhesive composition positioned between a substrate and a device to conditions suitable to cure the adhesive formulation.
  • Devices contemplated for use in the practice of the present invention include any surface mount component such as, for example, semiconductor die, resistors, capacitors, and the like.
  • devices contemplated for use in the practice of invention methods are semiconductor dies.
  • Substrates contemplated for use include metal substrates (e.g., lead frames), organic substrates (e.g., laminates, ball grid arrays, polyamide films), and the like.
  • Conditions suitable to cure invention film adhesive compositions comprise subjecting invention film adhesive compositions to a temperature of at least about 150° C. but less than about 300° C. for about 0.5 up to about 2 minutes. This rapid, short duration heating can be accomplished in a variety of ways, e.g., with an in-line heated rail, a belt furnace, or the like.
  • conditions suitable to cure invention film adhesive compositions comprise subjecting invention film adhesive compositions to a temperature in the range of about 120° C. up to about 200° C. for a period of about 15 minutes up to about 60 minutes.
  • These conditions can be readily produced in a variety of ways, such, for example, by placing invention film adhesive compositions in a curing oven.
  • assemblies comprising a first article permanently adhered to a second article by a sufficient quantity of an invention adhesive composition.
  • Invention Formulation 1 was prepared using the styrene-butadiene block copolymer KRATONTM D-1102 as the thermoplastic elastomeric component.
  • Octadecylmaleimide and X-BMI (X-BMI is the 1,20-bismaleimido derivative of 10,11-dioctyl-eicosane) were employed as macromonomers.
  • the maleimides used in the following invention formulations were prepared according to the procedure set forth in U.S. Pat. No. 5,973,166, the entire contents of which are incorporated by reference herein.
  • Invention Formulation 1 1. Octadecylmaleimide 1.0 g 2.
  • KRATON TM D-1102 2.5 g 3.
  • Preparation of Formulation 1 began by dissolving octadecylmaleimide in xylene. KRATON was added to this solution and allowed to dissolve completely before the remaining components were added.
  • a film of Invention Formulation 1 was cast onto a glass substrate and dried overnight. A silicon die was then placed onto the film, and the film-coated substrate was heated to 80° C. for 1 to 3 seconds. This assembly was finally cured at 185° C. for 30 minutes.

Abstract

In accordance with the present invention, there are provided film adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the macromonomer, and at least one cure initiator, and methods for use thereof. Invention compositions are useful as adhesives in the microelectronics industry. In particular, invention film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength.

Description

    FIELD OF THE INVENTION
  • The present invention relates to film adhesive compositions, and more particularly to the use of film adhesive compositions in stacked die microelectronic packaging applications.
    • BACKGROUND OF THE INVENTION
  • In response to an increasing demand for semiconductor packages that are smaller, yet more functional, the microelectronic packaging industry has recently begun producing packages containing at least two stacked semiconductor dice. Indeed, it is often advantageous to stack multiple dice into the same package in order to increase circuit density without increasing the area occupied on a circuit board by the integrated circuit package.
  • Several challenges exist with respect to producing reliable electronic components containing stacked die packages. For example, stacked die packages typically require very thin bond lines between die (e.g., <15 microns). In addition, it is known that adhesive fillet and resin bleed associated with many adhesive formulations contribute to unreliable component performance. Thus, adhesives used in stacked die applications ideally would provide (at a minimum bond line thickness) superior adhesive strength and conductivity (thermal and electrical) without producing adhesive fillet or resin bleed. One possible approach to address this challenging problem lies in the use of film adhesives.
  • Accordingly, there is a need for film adhesives which provide superior adhesive strength and conductivity when dispensed to achieve very thin bond lines in a variety of microelectronic packages, such as, for example, stacked die packages.
    • SUMMARY OF THE INVENTION
  • In accordance with the present invention, there are provided film adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the macromonomer, and at least one cure initiator. Invention compositions are useful as adhesives in the microelectronics industry. In particular, invention film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength.
  • In a further aspect of the present invention, there are provided methods employing invention film adhesive compositions for adhesively attaching a device to a substrate, and methods employing invention film adhesive compositions for adhesively attaching at least two semiconductor dice to a substrate in a stacked arrangement.
  • In a still further aspect of the invention, there are provided assemblies comprising a first article adhered to a second article by invention film adhesive compositions.
    • DETAILED DESCRIPTION OF THE INVENTION
  • In accordance with the present invention, there are provided adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the macromonomer, and at least one cure initiator.
  • As employed herein, “macromonomer” refers to a compound having properties suitable for use in invention film adhesive compositions. For example, macromonomers contemplated for use in the practice of the present invention typically are low melting point solids having low vapor pressures. Alternatively, macromonomers contemplated for use in the practice of the present invention may be liquids having a molecular weight of at least about 500 grams/mole.
  • As employed herein, “unit of ethylenic unsaturation” refers to unsaturation comprising localized (i.e., non-aromatic) carbon-carbon double bonds, as shown below:
    Figure US20050107542A1-20050519-C00001
  • As employed herein, “co-curable” refers to the ability of a thermoplastic elastomer to undergo copolymerization with a macromonomer to form a three-dimensional polymeric network.
  • Macromonomers contemplated for use in the practice of the present invention include, for example, maleimides, vinyl compounds, allylated amides, and the like. In one embodiment, maleimide macromonomers contemplated for use in the practice of the present invention include compounds having the following structure:
    Figure US20050107542A1-20050519-C00002
    wherein:
      • m=1-6,
      • R is independently selected from hydrogen or lower alkyl, and
      • X is a monovalent moiety or a multivalent linking moiety.
  • Monovalent moieties or multivalent linking moieties are typically selected from
      • (I) straight or branched chain alkyl, alkylene, oxyalkylene, alkenyl, alkenylene, oxyalkenylene, ester, or polyester, optionally containing substituents selected from hydroxy, alkoxy, carboxy, nitrile, cycloalkyl or cycloalkenyl,
      • (II) siloxanes having the structure:
        —(CR2)m′—[Si(R′)2—O]q′—Si(R′)2—(CR2)n′— or
        (CR2)m′—[Si(R′)2—O]q′—Si(R′)2—(CR2)n′—
        wherein
      •  each R is independently defined as above, and each R′ is independently selected from hydrogen, lower alkyl or aryl, m′ falls in the range of 1 up to 10, n′ falls in the range of 1 up to 10, and q′ falls in the range of 1 up to 50,
      • (III) polyalkylene oxides having the structure:
        —[(CR2)r—O—]q′—(CR2)s— or
        [(CR2)r—O—]q′—(CR2)s—
        wherein each R is independently as defined above, r falls in the range of 1 up to 10, s falls in the range of 1 up to 10, and q′ is as defined above,
      • (IV) aromatic moieties having the structure:
        Figure US20050107542A1-20050519-C00003
        wherein each R is independently as defined above, t falls in the range of 2 up to 10, u is 1, 2 or 3, and Ar is as defined above, or
        Figure US20050107542A1-20050519-C00004
        wherein
      •  Z is O or NR, wherein R is hydrogen or lower alkyl,
      • (V) urethanes having the structure
        Figure US20050107542A1-20050519-C00005
        wherein:
      •  each R1 is independently hydrogen or lower alkyl,
      •  each R2 independently is an alkyl, aryl, or arylalkyl group having 1 to 18 carbon atoms;
      •  R3 is an alkyl or alkyloxy chain having up to about 100 atoms in the chain, which chain may contain aryl substituents;
      •  X is O, S, N, or P; and
      •  v is 0 to 50,
      • (VI) aromatic moieties having the structure:
        Figure US20050107542A1-20050519-C00006
        wherein
      •  each Ar is a monosubstituted, disubstituted or trisubstituted aromatic or heteroaromatic ring having in the range of 3 up to about 10 carbon atoms,
      •  n is 1 up to about 50, and
      •  Z is selected from:
        • straight or branched chain alkyl, alkylene, oxyalkylene, alkenyl, alkenylene, oxyalkenylene, ester, or polyester, optionally containing substituents selected from hydroxy, alkoxy, carboxy, nitrile, cycloalkyl or cycloalkenyl,
        • siloxanes having the structure:
          —(CR2)m′—[Si(R′)2—O]q′—Si(R′)2—(CR2)n′—
          wherein
        •  each R is independently defined as above, and each R′ is independently selected from hydrogen, lower alkyl or aryl, m′ falls in the range of I up to 10, n′ falls in the range of 1 up to 10, and q′ falls in the range of 1 up to 50,
        •  polyalkylene oxides having the structure:
          —[(CR2)r—O—]q′—(CR2)s—
          wherein each R is independently as defined above, r falls in the range of 1 up to 10, s falls in the range of 1 up to 10, and q′ is as defined above,
      •  aromatic moieties having the structure:
        Figure US20050107542A1-20050519-C00007
        wherein each R is independently as defined above, t falls in the range of 2 up to 10, u is 1, 2 or 3, and Ar is as defined above,
      • as well as mixtures of any two or more thereof.
  • As employed herein, “alkyl” refers to hydrocarbyl radicals having 1 up to about 20 carbon atoms, preferably 2-10 carbon atoms; and “substituted alkyl” comprises alkyl groups further bearing one or more substituents selected from hydroxy, alkoxy, mercapto, cycloalkyl, substituted cycloalkyl, heterocyclic, substituted heterocyclic, aryl, substituted aryl, heteroaryl, substituted heteroaryl, aryloxy, substituted aryloxy, halogen, cyano, nitro, amino, amido, C(O)H, acyl, oxyacyl, carboxyl, carbamate, sulfonyl, sulfonamide, sulfuryl, and the like.
  • As employed herein, “cycloalkyl” refers to cyclic ring-containing groups containing in the range of 3 up to about 8 carbon atoms, and “substituted cycloalkyl” refers to cycloalkyl groups further bearing one or more substituents as set forth above.
  • As employed herein, “alkenyl” refers to straight or branched chain hydrocarbyl groups having at least one carbon-carbon double bond, and having in the range of 2 up to about 12 carbon atoms, and “substituted alkenyl” refers to alkenyl groups further bearing one or more substituents as set forth above.
  • As employed herein, “alkylene” refers to divalent hydrocarbyl radicals having 1 up to about 20 carbon atoms, preferably 2-10 carbon atoms; and “substituted alkylene” comprises alkylene groups further bearing one or more substituents as set forth above.
  • As used herein, “oxyalkylene” refers to an alkylene moiety wherein one or more of the methylene units of the alkylene moiety has been replaced with an oxygen atom.
  • As employed herein, “aryl” refers to aromatic groups having in the range of 6 up to about 14 carbon atoms and “substituted aryl” refers to aryl groups further bearing one or more substituents as set forth above.
  • As employed herein, “alkenylene” refers to divalent, straight or branched chain hydrocarbyl groups having at least one carbon-carbon double bond, and having in the range of 2 up to about 12 carbon atoms, and “substituted alkenylene” refers to alkenylene groups further bearing one or more substituents as set forth above.
  • As employed herein, “oxyalkenylene” refers to an alkenylene moiety wherein one or more of the methylene units of the alkenylene moiety has been replaced with an oxygen atom.
  • Preferred maleimides contemplated for use in the practice of the present invention include, for example, maleimides having the following structures:
    Figure US20050107542A1-20050519-C00008
  • Vinyl macromonomers contemplated for use in the practice of the present invention include compounds having the following structure:
    Figure US20050107542A1-20050519-C00009
    wherein:
      • q is 1, 2 or 3,
      • each R is independently selected from hydrogen or lower alkyl,
      • each Q is independently selected from —O—, —O—C(O)—, —C(O)— or —C(O)—O—, and
      • Y is a monovalent moiety or a multivalent linking moiety.
  • The multivalent linking moiety Y is typically selected from:
      • (I) straight or branched chain alkyl, alkylene, oxyalkylene, alkenyl, alkenylene, oxyalkenylene, ester, or polyester, optionally containing substituents selected from hydroxy, alkoxy, carboxy, nitrile, cycloalkyl or cycloalkenyl,
      • (II) siloxanes having the structure:
        —(CR2)m′—[Si(R′)2—O]q′—Si(R′)2—(CR2)n′— or
        (CR2)m′—[Si(R′)2—O]q′—Si(R′)2—(CR2)n′—
        wherein
      •  each R is independently defined as above, and each R′ is independently selected from hydrogen, lower alkyl or aryl, m′ falls in the range of 1 up to 10, n′ falls in the range of 1 up to 10, and q′ falls in the range of 1 up to 50,
      • (III) polyalkylene oxides having the structure:
        —[(CR2)r—O—]q′—(CR2)s— or
        [(CR2)r—O—]q′—(CR2)s—
        wherein each R is independently as defined above, r falls in the range of 1 up to 10, s falls in the range of 1 up to 10, and q′ is as defined above,
      • (IV) aromatic moieties having the structure:
        Figure US20050107542A1-20050519-C00010
        wherein each R is independently as defined above, t falls in the range of 2 up to 10, u is 1, 2 or 3, and Ar is as defined above, or
        Figure US20050107542A1-20050519-C00011
        wherein
      •  Z is O or NR, wherein R is hydrogen or lower alkyl,
      • (V) urethanes having the structure
        Figure US20050107542A1-20050519-C00012
        wherein:
      •  each R1 is independently hydrogen or lower alkyl,
      • each R2 independently is an alkyl, aryl, or arylalkyl group having 1 to 18 carbon atoms;
      •  R3 is an alkyl or alkyloxy chain having up to about 100 atoms in the chain, which chain may contain aryl substituents;
      •  X is O, S, N, or P; and
      •  v is 0to50,
      • (VI) aromatic moieties having the structure:
        Figure US20050107542A1-20050519-C00013
        wherein
      •  each Ar is a monosubstituted, disubstituted or trisubstituted aromatic or heteroaromatic ring having in the range of 3 up to about 10 carbon atoms,
      •  n is 1 up to about 50, and
      •  Z is selected from:
        • straight or branched chain alkyl, alkylene, oxyalkylene, alkenyl, alkenylene, oxyalkenylene, ester, or polyester, optionally containing substituents selected from hydroxy, alkoxy, carboxy, nitrile, cycloalkyl or cycloalkenyl,
        • siloxanes having the structure:
          —(CR2)m′—[Si(R′)2—O]q′—Si(R′)2—(CR2)n′—
          wherein
        •  each R is independently defined as above, and each R′ is independently selected from hydrogen, lower alkyl or aryl, m′ falls in the range of 1 up to 10, n′ falls in the range of 1 up to 10, and q′ falls in the range of 1 up to 50,
        •  polyalkylene oxides having the structure:
          [(CR2)r—O—]q′—(CR2)s—
          wherein each R is independently as defined above, r falls in the range of 1 up to 10, s falls in the range of 1 up to 10, and q′ is as defined above,
      •  aromatic moieties having the structure:
        Figure US20050107542A1-20050519-C00014
        wherein each R is independently as defined above, t falls in the range of 2 up to 10, u is 1, 2 or 3, and Ar is as defined above,
      • as well as mixtures of any two or more thereof.
  • Allylated amide macromonomers contemplated for use in the practice of the present invention include compounds having the following structure:
    Figure US20050107542A1-20050519-C00015
    wherein:
      • R′ is hydrogen, C1 up to about C18 alkyl or oxyalkyl, allyl, aryl, or substituted aryl,
      • X is as defined above, and
      • m is 1-6.
  • Thermoplastic elastomers contemplated for use in the practice of the present invention are typically block copolymers. The block copolymers have at least one unit of the general formula (A-B), or (A-B-A), wherein A is a non-elastomeric polymer block and B is an elastomeric polymer block. Block copolymers contemplated for use in the practice of the present invention preferably have low dielectric constants. In addition, thermoplastic elastomers contemplated for use in the practice of the present invention contain pendant and/or terminal units of ethylenic unsaturation, and therefore are able to cure with other components in the adhesive composition, such as the unsaturated macromonomer.
  • In one aspect of the invention, the non-elastomeric polymer block (A) is the polymerization product of one or more optionally substituted aromatic hydrocarbons containing at least one unit of ethylenic unsaturation. Aromatic hydrocarbons contemplated for use in the practice of the present invention include, for example, optionally substituted styrene, optionally substituted stilbene, and the like. Substituents contemplated for optional use in the practice of the present invention include for example, alkyl, alkenyl, alkynyl, hydroxy, alkoxy, alkenoxy, and the like. In a preferred embodiment, the aromatic hydrocarbon is optionally substituted styrene.
  • The elastomeric polymer block (B) is typically the polymerization or copolymerization product of optionally substituted olefin monomers and/or optionally substituted conjugated diene monomers. Olefin monomers contemplated for use in the practice of the present invention typically contain from 2 up to about 20 carbon atoms. Preferably, the olefin monomers contain from 2 up to about 12 carbon atoms. In a particularly preferred embodiment, the olefin monomers include, for example, ethylene, propylene, butylene, isobutylene, acrylonitrile, (meth)acrylate, and the like. Most preferably, the olefin monomer is acrylonitrile.
  • Conjugated diene monomers contemplated for use in the practice of the present invention typically contain from 4 up to about 20 carbon atoms. Preferably, the conjugated diene monomers contain from 4 up to about 12 carbon atoms. In a particularly preferred embodiment, the conjugated diene monomers include, for example, butadiene, isoprene, dimethylbutadiene, and the like. Most preferably, the conjugated diene monomer is butadiene.
  • The structure of the elastomeric segments can be optionally modified to increase adhesive strength of invention compositions. For example, the elastomeric segments of the block copolymers (e.g., the polybutadiene segments) may be modified via a thermally induced ene-reaction with maleic anhydride (for a review of the ene-reaction, see, for example, Oppolzer, W., Snieckus, V., Angew. Chem. Int. Ed. Engl., 1978, 17, 476). Such modification has a particularly positive impact on hot die-shear values.
  • Thermoplastic elastomers contemplated for use in the practice of the present invention include, for example, polystyrene-polybutadiene-polystyrene block copolymers, polystyrene-polyisoprene-polystyrene block copolymers, polystyrene-polydimethylbutadiene-polystyrene block copolymers, polybutadiene-polyacrylonitrile block copolymers, and the like. Preferably, the block copolymer is a polystyrene-polybutadiene-polystyrene block copolymer or a polybutadiene-polyacrylonitrile block copolymer.
  • Adhesive compositions of the invention also contain in the range of 0.2 up to 2 weight % of at least one free radical initiator, wherein weight % (wt %) is based on the total weight of the composition. As employed herein, the term “free radical initiator” refers to any chemical species which, upon exposure to sufficient energy (e.g., light, heat, or the like), decomposes into at least two species which are uncharged, but which each possesses at least one unpaired electron. Preferred free radical initiators contemplated for use in the practice of the present invention are compounds which decompose (i.e., have a half life in the range of about 10 hours) at temperatures in the range of about 70 up to 180° C.
  • Free-radical cure initiators contemplated for use in the practice of the present invention include for example, peroxides (e.g., peroxy esters, peroxy carbonates, hydroperoxides, alkylperoxides, arylperoxides, and the like), azo compounds, and the like. Presently preferred peroxides contemplated for use in the practice of the present invention include dicumyl peroxide, dibenzoyl peroxide, 2-butanone peroxide, tert-butyl perbenzoate, di-tert-butyl peroxide, 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane, bis(tert-butyl peroxyisopropyl)benzene, tert-butyl hydroperoxide, and the like. Presently preferred azo compounds contemplated for use in the practice of the present invention include 2,2′-azobis(2-methylpropanenitrile), 2,2′-azobis(2-methylbutanenitrile), 1,1′-azobis(cyclohexanecarbonitrile), and the like.
  • Adhesive compositions contemplated for use in the practice of the present invention typically contain in the range of about 10 wt % up to about 95 wt % thermoplastic elastomer, in the range of about 5 wt % up to about 90 wt % macromonomer having at least one unit of ethylenic unsaturation, and in the range of about 0.5 wt % up to about 2.0 wt % a cure initiator, wherein weight % is based on the total weight of the composition. Preferably, the macromonomer having at least one unit of ethylenic unsaturation is present in the range of about 10 wt % up to about 80 wt %.
  • Adhesive compositions according to the invention optionally further contain in the range of about 0.1 up to about 10 wt % of at least one coupling agent, based on the total weight of the composition. Preferably, the coupling agent is present in the range of about 0.2 wt % up to about 5 wt %. Coupling agents contemplated for use in the practice of the present invention include siloxanes, silicate esters, metal acrylate salts, titanates, and the like.
  • Adhesive compositions according to the invention may optionally contain a filler. Fillers contemplated for optional use in the practice of the present invention may optionally be conductive (electrically and/or thermally). Electrically conductive fillers contemplated for use in the practice of the present invention include, for example, silver, nickel, gold, cobalt, copper, aluminum, graphite, silver-coated graphite, nickel-coated graphite, alloys of such metals, and the like, as well as mixtures thereof. Both powder and flake forms of filler may be used in the adhesive compositions of the present invention. Preferably, the flake has a thickness of less than about 2 microns, with planar dimensions of about 20 to about 25 microns. Flake employed herein preferably has a surface area of about 0.15 to 5.0 m2/g and a tap density of about 0.4 up to about 5.5 g/cc. It is presently preferred that powder employed in the practice of the invention has a diameter of about 0.5 to 15 microns. If present, the filler typically comprises in the range of about 1 wt % up to about 95 wt % of the adhesive formulation, wherein weight % is based on the total weight of the composition.
  • Thermally conductive fillers contemplated for optional use in the practice of the present invention include, for example, aluminum nitride, boron nitride, silicon carbide, diamond, graphite, beryllium oxide, magnesia, silica, alumina, and the like. Preferably, the particle size of these fillers will be in the range of about 5 up to about 30 microns. Most preferably, the particle size of these fillers will be about 20 microns.
  • Electrically and/or thermally conductive fillers are optionally (and preferably) rendered substantially free of catalytically active metal ions by treatment with chelating agents, reducing agents, nonionic lubricating agents, or mixtures of such agents. Such treatment is described in U.S. Pat. No. 5,447,988, which is incorporated by reference herein in its entirety.
  • Optionally, a filler may be used that is neither an electrical nor thermal conductor. Such fillers may be desirable to impart some other property to the adhesive formulation such as, for example, reduced thermal expansion of the cured adhesive, reduced dielectric constant, improved toughness, increased hydrophobicity, and the like. Examples of such fillers include perfluorinated hydrocarbon polymers (i.e., TEFLON™), thermoplastic polymers, thermoplastic elastomers, mica, fused silica, glass powder, and the like.
  • In a preferred embodiment, adhesive compositions contemplated for use in the practice of the present invention contain in the range of about 5 wt % up to about 90 wt % thermoplastic elastomer, in the range of about 5 wt % up to about 90 wt % macromonomer containing at least one unit of ethylenic unsaturation, in the range of about 0.5 wt % up to about 2.0 wt % cure initiator, in the range of about 0.5 wt % up to about 5 wt % coupling agent, and in the range of about 1 wt % up to about 95 wt % filler, wherein weight % is based on the total weight of the composition.
  • In a further aspect of the invention, there are provided methods for adhesively attaching a device to a substrate comprising subjecting a sufficient quantity of an invention adhesive composition positioned between a substrate and a device to conditions suitable to cure the adhesive formulation. Devices contemplated for use in the practice of the present invention include any surface mount component such as, for example, semiconductor die, resistors, capacitors, and the like. Preferably, devices contemplated for use in the practice of invention methods are semiconductor dies. Substrates contemplated for use include metal substrates (e.g., lead frames), organic substrates (e.g., laminates, ball grid arrays, polyamide films), and the like.
  • Conditions suitable to cure invention film adhesive compositions comprise subjecting invention film adhesive compositions to a temperature of at least about 150° C. but less than about 300° C. for about 0.5 up to about 2 minutes. This rapid, short duration heating can be accomplished in a variety of ways, e.g., with an in-line heated rail, a belt furnace, or the like.
  • Alternatively, conditions suitable to cure invention film adhesive compositions comprise subjecting invention film adhesive compositions to a temperature in the range of about 120° C. up to about 200° C. for a period of about 15 minutes up to about 60 minutes. These conditions can be readily produced in a variety of ways, such, for example, by placing invention film adhesive compositions in a curing oven.
  • In a still further aspect of the invention, there are provided methods for adhesively attaching at least two semiconductor dice to a substrate in a stacked arrangement comprising curing a sufficient quantity of an invention adhesive composition positioned between the substrate and each of the die.
  • In yet another aspect of the present invention, there are provided assemblies comprising a first article permanently adhered to a second article by a sufficient quantity of an invention adhesive composition.
  • The invention will now be described in greater detail by reference to the following non-limiting example.
    • EXAMPLE
  • An adhesive composition according to the present invention was prepared as follows. Invention Formulation 1 was prepared using the styrene-butadiene block copolymer KRATON™ D-1102 as the thermoplastic elastomeric component. Octadecylmaleimide and X-BMI (X-BMI is the 1,20-bismaleimido derivative of 10,11-dioctyl-eicosane) were employed as macromonomers. The maleimides used in the following invention formulations were prepared according to the procedure set forth in U.S. Pat. No. 5,973,166, the entire contents of which are incorporated by reference herein.
    Invention Formulation 1
    1. Octadecylmaleimide  1.0 g
    2. KRATON ™ D-1102  2.5 g
    3. X-BMI  1.5 g
    4. Ricon 1301  0.2 g
    5. Silane coupling agent2  0.2 g
    6. Dicumyl peroxide 0.05 g
    7. Xylene  5.0 g
    8. TEFLON ™ filler  6.9 g

    1Polybutadiene 20% grafted with maleic anhydride (Sartomer)

    2Proprietary silane-containing coupling agent.
  • Preparation of Formulation 1 began by dissolving octadecylmaleimide in xylene. KRATON was added to this solution and allowed to dissolve completely before the remaining components were added.
  • A film of Invention Formulation 1 was cast onto a glass substrate and dried overnight. A silicon die was then placed onto the film, and the film-coated substrate was heated to 80° C. for 1 to 3 seconds. This assembly was finally cured at 185° C. for 30 minutes.
  • The film adhesive compositions were tested for room temperature die shear and hot die shear on a calibrated Dage 2400 die shear tester. The results for Invention Formulation 1 are shown below in Table 1, compared to QMI536, a non-film adhesive formulation (prepared according to U.S. Pat. No. 5,717,034) comprising the same maleimides as employed for the preparation of Invention Formulation 1. Also included in Table 1 are die shear values after the cured compositions were subjected to 85° C./85% humidity for 24 hrs.
    TABLE 1
    Room Temperature Hot Die Shear
    Die Shear (lbs) (245° C.) (lbs)
    QMI536, initial 59.1 24.4
    Invention Formulation 1, initial 88.9 25.9
    QMI536, 24 hrs. 85/85 52.6 23.9
    Invention Formulation 1, 24 hrs. 79.6 24.6
    85/85
  • The results shown above demonstrate that Invention Formulation 1 has superior adhesive strength compared to an analogous non-film forming composition.
  • While the invention has been described in detail with reference to certain preferred embodiments thereof, it will be understood that modifications and variations are within the spirit and scope of that which is described and claimed.

Claims (23)

1-15. (canceled)
16. A thermally curable film adhesive composition comprising a curable component comprising at least one macromonomer having at least one unit of ethylenic unsaturation, wherein said macromonomer is a maleimide,
in the range of about 20-90 wt % of at least one thermoplastic elastomer co-curable with said at least one macromonomer, and
at least one free radical cure initiator,
wherein wt % is based on total weight of the composition; and
wherein said free radical cure initiator is present in the range of about 0.5 wt % up to 2.0 wt %; and
wherein said macromonomer is present in the range of about 10 wt % up to about 80 wt %, wherein wt % is based on total weight of the composition.
17. An adhesive composition according to claim 16, wherein said cure initiator is a free-radical cure initiator.
18-21. (canceled)
22. An adhesive composition according to claim 16, further comprising a filler.
23. An adhesive composition according to claim 22, wherein said filler is conductive.
24. An adhesive composition according to claim 23, wherein said filler is electrically conductive.
25. An adhesive composition according to claim 23, wherein said filler is thermally conductive.
26. An adhesive composition according to claim 22, wherein said filler is non-conductive.
27. An adhesive composition according to claim 26, wherein said filler is a perfluorinated hydrocarbon polymer.
28. An adhesive composition according to claim 22, wherein said filler is present in the range of about 1 wt % up to about 95 wt %, wherein wt % is based on total weight of the composition.
29. (canceled)
30. An adhesive composition comprising at least one thermoplastic elastomer, at least one macromonomer having at least one unit of ethylenic unsaturation, and at least one cure initiator,
wherein said macromonomer is selected from the group consisting of maleimides, allylated amides, and vinyl compounds.
31. An adhesive composition according to claim 30, wherein said composition is capable of curing at a temperature in the range of about 150° C. up to about 200° C. in a period of time of about 0.25 minutes up to about 2 minutes.
32-34. (canceled)
35. An adhesive composition according to claim 30, wherein said macromonomer is a vinyl compound.
36. An adhesive composition according to claim 35, wherein said vinyl compound has the following structure:
Figure US20050107542A1-20050519-C00016
wherein:
q is 1, 2 or 3,
each R is independently selected from hydrogen or lower alkyl,
each Q is independently selected from —O—, —O—C(O)—, —C(O)— or —C(O)—O—, and
Y is a monovalent moiety or a multivalent linking moiety.
37. An adhesive composition according to claim 36, wherein Y is selected from:
(I) straight or branched chain alkyl, alkylene, oxyalkylene, alkenyl, alkenylene, oxyalkenylene, ester, or polyester, optionally containing substituents selected from hydroxy, alkoxy, carboxy, nitrile, cycloalkyl or cycloalkenyl,
(II) siloxanes having the structure:

—(CR2)m′—[Si(R′)2—O]q′—Si(R′)2—(CR2)n′— or
(CR2)m′—[Si(R′)2—O]q′—Si (R′)2—(CR2)n′—
wherein
 each R is independently defined as above, and each R′ is independently selected from hydrogen, lower alkyl or aryl, m′ falls in the range of 1 up to 10, n′ falls in the range of 1 up to 10, and q′ falls in the range of 1 up to 50,
(III) polyalkylene oxides having the structure:

—[(CR2)r—O—]q′—(CR2)s— or

(CR2)r—O—]q′—(CR2)s—
wherein each R is independently as defined above, r falls in the range of 1 up to 10, s falls in the range of 1 up to 10, and q′ is as defined above,
(IV) aromatic moieties having the structure:
Figure US20050107542A1-20050519-C00017
wherein each R is independently as defined above, t falls in the range of 2 up to 10, u is 1, 2 or 3, and Ar is as defined above, or
Figure US20050107542A1-20050519-C00018
wherein Z is O or NR, wherein R is hydrogen or lower alkyl,
(V) urethanes having the structure
Figure US20050107542A1-20050519-C00019
wherein:
 each R1 is independently hydrogen or lower alkyl,
 each R2 independently is an alkyl, aryl, or arylalkyl group having 1 to 18 carbon atoms;
 R3 is an alkyl or alkyloxy chain having up to about 100 atoms in the chain, which chain may contain aryl substituents;
 X is O, S, N, or P; and
 v is 0 to 50,
(VI) aromatic moieties having the structure:
Figure US20050107542A1-20050519-C00020
wherein
 each Ar is a monosubstituted, disubstituted or trisubstituted aromatic or heteroaromatic ring having in the range of 3 up to about 10 carbon atoms,
 n is 1 up to about 50, and
 Z is selected from:
straight or branched chain alkyl, alkylene, oxyalkylene, alkenyl, alkenylene, oxyalkenylene, ester, or polyester, optionally containing substituents selected from hydroxy, alkoxy, carboxy, nitrile, cycloalkyl or cycloalkenyl,
siloxanes having the structure:

—(CR2)m′—[Si(R′)2—O]q′—Si(R′)2—(CR2)n′—
wherein
 each R is independently defined as above, and each R′ is independently selected from hydrogen, lower alkyl or aryl, m′ falls in the range of 1 up to 10, n′ falls in the range of 1 up to 10, and q′ falls in the range of 1 up to 50,
 polyalkylene oxides having the structure:

—[(CR2)r—O—]q′—(CR2)s—
wherein each R is independently as defined above, r falls in the range of 1 up to 10, s falls in the range of 1 up to 10, and q′ is as defined above, aromatic moieties having the structure:
Figure US20050107542A1-20050519-C00021
wherein each R is independently as defined above, t falls in the range of 2 up to 10, u is 1, 2 or 3, and Ar is as defined above, as well as mixtures of any two or more thereof.
38. An adhesive composition according to claim 30, wherein said macromonomer is an allylated amide.
39. An adhesive composition according to claim 38, wherein said allylated amide has the following structure:
Figure US20050107542A1-20050519-C00022
wherein:
R′ is hydrogen, C1 up to about C18 alkyl or oxyalkyl, allyl, aryl, or substituted aryl,
m is 1-6, and
X is selected from
(I) straight or branched chain alkyl, alkylene, oxyalkylene, alkenyl, alkenylene, oxyalkenylene, ester, or polyester, optionally containing substituents selected from hydroxy, alkoxy, carboxy, nitrile, cycloalkyl or cycloalkenyl,
(II) siloxanes having the structure:

—(CR2)m′—[Si(R′)2—O]q′—Si(R′)2—(CR2)n′— or
(CR2)m′—[Si(R′)2—O]q′—Si(R′)2—(CR2)n′—
wherein
 each R is independently defined as above, and each R′ is independently selected from hydrogen, lower alkyl or aryl, m′ falls in the range of 1 up to 10, n′ falls in the range of 1 up to 10, and q′ falls in the range of 1 up to 50,
(III) polyalkylene oxides having the structure:

—[(CR2)r—O—]q′—(CR2)s— or
[(CR2)r—O—]q′—(CR2)s—
wherein each R is independently as defined above, r falls in the range of 1 up to 10, s falls in the range of 1 up to 10, and q′ is as defined above,
(IV) aromatic moieties having the structure:
Figure US20050107542A1-20050519-C00023
wherein each R is independently as defined above, t falls in the range of 2 up to 10, u is 1, 2 or 3 and Ar is as defined above, or
Figure US20050107542A1-20050519-C00024
wherein
 Z is O or NR, wherein R is hydrogen or lower alkyl,
(V) urethanes having the structure
Figure US20050107542A1-20050519-C00025
wherein:
 each R1 is independently hydrogen or lower alkyl,
 each R2 independently is an alkyl, aryl, or arylalkyl group having 1 to 18 carbon atoms;
 R3 is an alkyl or alkyloxy chain having up to about 100 atoms in the chain, which chain may contain aryl substituents;
 X is O, S, N, or P; and
 v is 0 to 50,
(VI) aromatic moieties having the structure:
Figure US20050107542A1-20050519-C00026
wherein
 each Ar is a monosubstituted, disubstituted or trisubstituted aromatic or heteroaromatic ring having in the range of 3 up to about 10 carbon atoms,
 n is 1 up to about 50, and
 Z is selected from:
straight or branched chain alkyl, alkylene, oxyalkylene, alkenyl, alkenylene, oxyalkenylene, ester, or polyester, optionally containing substituents selected from hydroxy, alkoxy, carboxy, nitrile, cycloalkyl or cycloalkenyl,
siloxanes having the structure:

(CR2)m′—[Si(R′)2—O]q′—Si(R′)2—(CR2)n′—
wherein
 each R is independently defined as above, and each R′ is independently selected from hydrogen, lower alkyl or aryl, m′ falls in the range of 1 up to 10, n′ falls in the range of 1 up to 10, and q′ falls in the range of 1 up to 50,
 polyalkylene oxides having the structure:

—[(CR2)r—O—]q′—(CR2)s—
wherein each R is independently as defined above, r falls in the range of 1 up to 10, s falls in the range of 1 up to 10, and q′ is as defined above, aromatic moieties having the structure:
Figure US20050107542A1-20050519-C00027
wherein each R is independently as defined above, t falls in the range of 2 up to 10, u is 1, 2 or 3, and Ar is as defined above, as well as mixtures of any two or more thereof.
40-45. (canceled)
46. An adhesive composition comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with said at least one macromonomer, and at least one cure initiator, which when dispensed between a device and a substrate and cured for 2 minutes at 200° C., provides a room temperature die shear of about 90 lbs.
47. An adhesive composition according to claim 46, wherein said macromonomer is a maleimide.
US11/008,980 2002-03-28 2004-12-13 Film adhesives containing maleimide compounds and methods for use thereof Abandoned US20050107542A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/008,980 US20050107542A1 (en) 2002-03-28 2004-12-13 Film adhesives containing maleimide compounds and methods for use thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/113,909 US6831132B2 (en) 2002-03-28 2002-03-28 Film adhesives containing maleimide compounds and methods for use thereof
US11/008,980 US20050107542A1 (en) 2002-03-28 2004-12-13 Film adhesives containing maleimide compounds and methods for use thereof

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US10/113,909 Division US6831132B2 (en) 2002-03-28 2002-03-28 Film adhesives containing maleimide compounds and methods for use thereof

Publications (1)

Publication Number Publication Date
US20050107542A1 true US20050107542A1 (en) 2005-05-19

Family

ID=28673669

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/113,909 Expired - Lifetime US6831132B2 (en) 2002-03-28 2002-03-28 Film adhesives containing maleimide compounds and methods for use thereof
US11/008,980 Abandoned US20050107542A1 (en) 2002-03-28 2004-12-13 Film adhesives containing maleimide compounds and methods for use thereof

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US10/113,909 Expired - Lifetime US6831132B2 (en) 2002-03-28 2002-03-28 Film adhesives containing maleimide compounds and methods for use thereof

Country Status (6)

Country Link
US (2) US6831132B2 (en)
JP (1) JP2005521764A (en)
KR (1) KR101020375B1 (en)
CN (1) CN1649920A (en)
AU (1) AU2003233460A1 (en)
WO (1) WO2003082940A1 (en)

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060142517A1 (en) * 2004-07-16 2006-06-29 Dershem Stephen M Olefin oligomers containing pendant maleimide groups
US20070155869A1 (en) * 2005-12-29 2007-07-05 Dershem Stephen M Mono-functional monomers and methods for use thereof
US20080017308A1 (en) * 2006-07-24 2008-01-24 Dershem Stephen M Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
US20080075965A1 (en) * 2005-10-21 2008-03-27 Stephen Dershem Maleimide compositions and methods for use thereof
US20080075961A1 (en) * 2003-05-05 2008-03-27 Mizori Farhad G Imide-linked maleimide and polymaleimide compounds
US20080146738A1 (en) * 2006-12-19 2008-06-19 Dershem Stephen M Rubber epoxy curatives and methods for use thereof
US20080142158A1 (en) * 2006-12-19 2008-06-19 Dershem Stephen M Hydrolytically resistant thermoset monomers
US20080210375A1 (en) * 2004-06-04 2008-09-04 Dershem Stephen M Free-radical curable polyesters and methods for use thereof
US20080262191A1 (en) * 2007-01-26 2008-10-23 Mizori Farhad G Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds
US20090050266A1 (en) * 2007-08-21 2009-02-26 Kang Yang Crosslinked polymeric materials as filler and spacers in adhesives
US20090215940A1 (en) * 2008-02-23 2009-08-27 Dershem Stephen M Soluble metal salts for use as conductivity promoters
US20090244811A1 (en) * 2008-03-25 2009-10-01 Avx Corporation Electrolytic Capacitor Assembly Containing a Resettable Fuse
US20100041823A1 (en) * 2008-08-13 2010-02-18 Designer Molecules, Inc. Novel siloxane monomers and methods for use thereof
US20100041832A1 (en) * 2008-08-13 2010-02-18 Designer Molecules, Inc. Functionalized styrene oligomers and polymers
US20100041803A1 (en) * 2008-08-13 2010-02-18 Designer Molecules, Inc. Thermosetting hyperbranched compositions and methods for use thereof
US20100041845A1 (en) * 2008-08-13 2010-02-18 Designer Molecules, Inc. Hetero-functional compounds and methods for use thereof
US20100056671A1 (en) * 2007-04-12 2010-03-04 Designer Molecules, Inc. Polyfunctional epoxy oligomers
US20100063184A1 (en) * 2007-04-16 2010-03-11 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US20100113643A1 (en) * 2007-04-09 2010-05-06 Designer Molecules, Inc. Curatives for epoxy adhesive compositions
US20100144977A1 (en) * 2008-11-20 2010-06-10 Designer Molecules, Inc. Curing agents for epoxy resins
US20100249276A1 (en) * 2007-04-09 2010-09-30 Designer Molecules, Inc. Curatives for epoxy compositions
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
US20110017400A1 (en) * 2008-03-21 2011-01-27 Designer Molecules, Inc. Anti-bleed compounds, compositions and methods for use thereof
US20110049731A1 (en) * 2009-09-03 2011-03-03 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US7928153B2 (en) * 2007-08-14 2011-04-19 Designer Molecules, Inc. Thermosetting polyether oligomers, compositions and methods for use thereof
US8308892B2 (en) 2008-04-09 2012-11-13 Designer Molecules, Inc. Di-cinnamyl compounds and methods for use thereof
US8530573B2 (en) 2006-05-10 2013-09-10 Designer Molecules, Inc. Modified calcium carbonate-filled adhesive compositions and methods for use thereof
US8637611B2 (en) 2008-08-13 2014-01-28 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
US8816021B2 (en) 2010-09-10 2014-08-26 Designer Molecules, Inc. Curable composition with rubber-like properties

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7312534B2 (en) * 2002-06-17 2007-12-25 Henkel Corporation Interlayer dielectric and pre-applied die attach adhesive materials
US8513375B2 (en) 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
WO2004099331A2 (en) * 2003-05-05 2004-11-18 Advanced Applied Adhesives Imide-linked maleimide and polymaleimide compounds
CN101014664B (en) * 2004-06-04 2012-10-10 设计者分子公司 Free-radical curable polyesters and methods for use thereof
US7691475B2 (en) * 2006-07-21 2010-04-06 3M Innovative Properties Company Anisotropic conductive adhesives
KR100885794B1 (en) * 2006-12-27 2009-02-26 제일모직주식회사 Dicing die bonding film composition using radical curing
KR20100075906A (en) * 2007-09-13 2010-07-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Low temperature bonding electronic adhesives
US8710682B2 (en) * 2009-09-03 2014-04-29 Designer Molecules Inc, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8686162B2 (en) 2010-08-25 2014-04-01 Designer Molecules Inc, Inc. Maleimide-functional monomers in amorphous form
FR2983204B1 (en) * 2011-11-30 2014-01-10 Hutchinson LIQUID COMPOSITION FOR RETICULABLE SEALING ON DEMAND, PROCESS FOR PREPARING THE SAME AND APPLICATIONS THEREOF
KR101499899B1 (en) 2011-12-27 2015-03-09 삼성전자 주식회사 Polymer for optical film, method of preparing same, and optical film including same
US9550883B2 (en) 2012-01-25 2017-01-24 Henkel IP & Holding GmbH Cyanoacrylate compositions
KR101840906B1 (en) * 2012-01-25 2018-03-21 헨켈 아이피 앤드 홀딩 게엠베하 Cyanoacrylate compositions
TWI651387B (en) 2013-09-30 2019-02-21 漢高智慧財產控股公司 Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof
CN104531047B (en) * 2015-01-13 2016-06-08 黑龙江省科学院石油化学研究院 A kind of application of thermostable heat-conductive BMI adhesive of low loading and preparation method thereof and adhesive
CN108699411B (en) * 2016-02-04 2021-03-26 苏州润邦半导体材料科技有限公司 Debondable adhesives and high temperature uses thereof
TW202000672A (en) * 2018-06-28 2020-01-01 德商漢高智慧財產控股公司 Cationically curable compositions with latent reducing agent demonstrating low cure temperature

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015695A (en) * 1989-05-09 1991-05-14 Shell Oil Company Functionalized elastomeric polymer production
US5717034A (en) * 1996-07-29 1998-02-10 Quantum Materials, Inc. Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
US5744513A (en) * 1986-07-17 1998-04-28 The Dow Chemical Company Photolytically crosslinkable thermally stable composition
US5936026A (en) * 1994-05-19 1999-08-10 E. I. Du Pont De Nemours And Company Coatings comprising self-stabilized lattices prepared in a aqueous carrier
US5973166A (en) * 1998-03-02 1999-10-26 The Dexter Corporation Method for the preparation of maleimides
US6355750B1 (en) * 1998-07-02 2002-03-12 National Starch And Chemical Investment Holding Corporation Dye attach adhesives for use in microelectronic devices
US6388037B2 (en) * 1998-07-02 2002-05-14 National Starch And Chemical Investment Holding Corporation Allylated amide compounds and die attach adhesives prepared therefrom
US20030087479A1 (en) * 2001-10-23 2003-05-08 Xiping He Adhesive wafers for die attach application
US6699929B2 (en) * 2000-05-18 2004-03-02 National Starch And Chemical Investment Holding Corporation Die attach adhesives with vinyl ether and carbamate or urea functionality

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10147762A (en) * 1996-11-20 1998-06-02 Sumitomo Bakelite Co Ltd Anisotropically conductive adhesive
JPH1112555A (en) * 1997-06-24 1999-01-19 Sumitomo Bakelite Co Ltd Anisotropically electroconductive adhesive
WO1999001519A1 (en) 1997-07-04 1999-01-14 Nippon Zeon Co., Ltd. Adhesive for semiconductor components
JP2000044905A (en) * 1998-03-18 2000-02-15 Sumitomo Bakelite Co Ltd Anisotropic, electrically conductive adhesive and electronic equipment using the same
US6265530B1 (en) * 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
JP2000248240A (en) * 1999-03-01 2000-09-12 Nitto Denko Corp Heat-releasable adhesive sheet
JP2001011135A (en) * 1999-06-30 2001-01-16 Hitachi Chem Co Ltd Resin paste composition and semiconductor apparatus using the same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5744513A (en) * 1986-07-17 1998-04-28 The Dow Chemical Company Photolytically crosslinkable thermally stable composition
US5015695A (en) * 1989-05-09 1991-05-14 Shell Oil Company Functionalized elastomeric polymer production
US5936026A (en) * 1994-05-19 1999-08-10 E. I. Du Pont De Nemours And Company Coatings comprising self-stabilized lattices prepared in a aqueous carrier
US5717034A (en) * 1996-07-29 1998-02-10 Quantum Materials, Inc. Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
US5973166A (en) * 1998-03-02 1999-10-26 The Dexter Corporation Method for the preparation of maleimides
US6355750B1 (en) * 1998-07-02 2002-03-12 National Starch And Chemical Investment Holding Corporation Dye attach adhesives for use in microelectronic devices
US6388037B2 (en) * 1998-07-02 2002-05-14 National Starch And Chemical Investment Holding Corporation Allylated amide compounds and die attach adhesives prepared therefrom
US6699929B2 (en) * 2000-05-18 2004-03-02 National Starch And Chemical Investment Holding Corporation Die attach adhesives with vinyl ether and carbamate or urea functionality
US20030087479A1 (en) * 2001-10-23 2003-05-08 Xiping He Adhesive wafers for die attach application

Cited By (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9278909B2 (en) 2003-05-05 2016-03-08 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
US20080075961A1 (en) * 2003-05-05 2008-03-27 Mizori Farhad G Imide-linked maleimide and polymaleimide compounds
US20080210375A1 (en) * 2004-06-04 2008-09-04 Dershem Stephen M Free-radical curable polyesters and methods for use thereof
US7875688B2 (en) 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
US20060142517A1 (en) * 2004-07-16 2006-06-29 Dershem Stephen M Olefin oligomers containing pendant maleimide groups
US7795362B2 (en) 2004-07-16 2010-09-14 Designer Molecules, Inc. Olefin oligomers containing pendant maleimide groups
US8043534B2 (en) 2005-10-21 2011-10-25 Designer Molecules, Inc. Maleimide compositions and methods for use thereof
US20080075965A1 (en) * 2005-10-21 2008-03-27 Stephen Dershem Maleimide compositions and methods for use thereof
US8378017B2 (en) 2005-12-29 2013-02-19 Designer Molecules, Inc. Thermosetting adhesive compositions
US20070155869A1 (en) * 2005-12-29 2007-07-05 Dershem Stephen M Mono-functional monomers and methods for use thereof
US8530573B2 (en) 2006-05-10 2013-09-10 Designer Molecules, Inc. Modified calcium carbonate-filled adhesive compositions and methods for use thereof
US8287686B2 (en) 2006-07-24 2012-10-16 Designer Molecules, Inc. Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
US20080017308A1 (en) * 2006-07-24 2008-01-24 Dershem Stephen M Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
US20080146738A1 (en) * 2006-12-19 2008-06-19 Dershem Stephen M Rubber epoxy curatives and methods for use thereof
US8344076B2 (en) 2006-12-19 2013-01-01 Designer Molecules, Inc. Hydrolytically resistant thermoset monomers
US20080142158A1 (en) * 2006-12-19 2008-06-19 Dershem Stephen M Hydrolytically resistant thermoset monomers
US7825188B2 (en) 2006-12-19 2010-11-02 Designer Molecules, Inc. Thermoplastic elastomer with acyloxyphenyl hard block segment
US20080262191A1 (en) * 2007-01-26 2008-10-23 Mizori Farhad G Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds
US20100113643A1 (en) * 2007-04-09 2010-05-06 Designer Molecules, Inc. Curatives for epoxy adhesive compositions
US8431655B2 (en) 2007-04-09 2013-04-30 Designer Molecules, Inc. Curatives for epoxy compositions
US20100249276A1 (en) * 2007-04-09 2010-09-30 Designer Molecules, Inc. Curatives for epoxy compositions
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
US20100056671A1 (en) * 2007-04-12 2010-03-04 Designer Molecules, Inc. Polyfunctional epoxy oligomers
US20100063184A1 (en) * 2007-04-16 2010-03-11 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US8063161B2 (en) 2007-04-16 2011-11-22 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US7928153B2 (en) * 2007-08-14 2011-04-19 Designer Molecules, Inc. Thermosetting polyether oligomers, compositions and methods for use thereof
US20090050266A1 (en) * 2007-08-21 2009-02-26 Kang Yang Crosslinked polymeric materials as filler and spacers in adhesives
US8398898B2 (en) 2008-02-23 2013-03-19 Designer Molecules, Inc. Soluble metal salts for use as conductivity promoters
US20090215940A1 (en) * 2008-02-23 2009-08-27 Dershem Stephen M Soluble metal salts for use as conductivity promoters
US8541531B2 (en) 2008-03-21 2013-09-24 Designer Molecules, Inc. Anti-bleed compounds, compositions and methods for use thereof
US20110017400A1 (en) * 2008-03-21 2011-01-27 Designer Molecules, Inc. Anti-bleed compounds, compositions and methods for use thereof
US7826200B2 (en) 2008-03-25 2010-11-02 Avx Corporation Electrolytic capacitor assembly containing a resettable fuse
US20090244811A1 (en) * 2008-03-25 2009-10-01 Avx Corporation Electrolytic Capacitor Assembly Containing a Resettable Fuse
US8308892B2 (en) 2008-04-09 2012-11-13 Designer Molecules, Inc. Di-cinnamyl compounds and methods for use thereof
US20100041823A1 (en) * 2008-08-13 2010-02-18 Designer Molecules, Inc. Novel siloxane monomers and methods for use thereof
US20100041803A1 (en) * 2008-08-13 2010-02-18 Designer Molecules, Inc. Thermosetting hyperbranched compositions and methods for use thereof
US20100041832A1 (en) * 2008-08-13 2010-02-18 Designer Molecules, Inc. Functionalized styrene oligomers and polymers
US8158748B2 (en) 2008-08-13 2012-04-17 Designer Molecules, Inc. Hetero-functional compounds and methods for use thereof
US8013104B2 (en) 2008-08-13 2011-09-06 Designer Molecules, Inc. Thermosetting hyperbranched compositions and methods for use thereof
US8008419B2 (en) 2008-08-13 2011-08-30 Designer Molecules, Inc. Siloxane monomers and methods for use thereof
US8637611B2 (en) 2008-08-13 2014-01-28 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
US8217120B2 (en) 2008-08-13 2012-07-10 Designer Molecules, Inc. Functionalized styrene oligomers and polymers
US20100041845A1 (en) * 2008-08-13 2010-02-18 Designer Molecules, Inc. Hetero-functional compounds and methods for use thereof
US20100144977A1 (en) * 2008-11-20 2010-06-10 Designer Molecules, Inc. Curing agents for epoxy resins
US8288591B2 (en) 2008-11-20 2012-10-16 Designer Molecules, Inc. Curing agents for epoxy resins
US8415812B2 (en) 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US20110049731A1 (en) * 2009-09-03 2011-03-03 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8816021B2 (en) 2010-09-10 2014-08-26 Designer Molecules, Inc. Curable composition with rubber-like properties

Also Published As

Publication number Publication date
KR20050012724A (en) 2005-02-02
US20030199638A1 (en) 2003-10-23
CN1649920A (en) 2005-08-03
WO2003082940A1 (en) 2003-10-09
US6831132B2 (en) 2004-12-14
KR101020375B1 (en) 2011-03-08
AU2003233460A1 (en) 2003-10-13
JP2005521764A (en) 2005-07-21

Similar Documents

Publication Publication Date Title
US6831132B2 (en) Film adhesives containing maleimide compounds and methods for use thereof
US7312534B2 (en) Interlayer dielectric and pre-applied die attach adhesive materials
US6806309B2 (en) Adhesive compositions containing organic spacers and methods for use thereof
EP1736520B1 (en) Resin composition and semiconductor devices made by using the same
TWI295312B (en) B-stageable die attach adhesives
KR100780136B1 (en) Adhesive composition
JP5456475B2 (en) Adhesive and connection structure using the same
US20040225045A1 (en) Highly conductive resin compositions
US20130075142A1 (en) Adhesive composition, use thereof, connection structure for circuit members, and method for producing same
KR20160130372A (en) Adhesive for mounting electronic component and adhesive film for mounting flip chip
JP2016092112A (en) First-supply type underfill material, electronic component device and method for manufacturing electronic component device
JP5648617B2 (en) Thermally conductive adhesive composition, adhesive sheet and thermal conductive dicing die attach film using the same
JP5577635B2 (en) Adhesive composition, adhesive for circuit connection, and circuit connector
KR20040029940A (en) Die-attaching paste and semiconductor device
JP6638380B2 (en) Pre-supply type underfill material and cured product thereof, electronic component device and method of manufacturing the same
JP2017117864A (en) First-supply type underfill material and cured product thereof, and electronic component device and manufacturing method thereof
WO2023074646A1 (en) Resin-coated metal foil, printed wiring board and manufacturing method thereof, and semiconductor package
WO2023062671A1 (en) Electronic component device manufacturing method, electronic component mounting method, and buffer sheet
JP6844685B2 (en) Pre-supplied underfill material and its cured product, electronic component equipment and its manufacturing method
JP6844680B2 (en) Manufacturing method of pre-supplied underfill material, cured product of pre-supplied underfill material, electronic component equipment and electronic component equipment
JP7465894B2 (en) Curable composition and cured product thereof
JP6707856B2 (en) Pre-supply type underfill material, method of manufacturing electronic component device, and electronic component device
WO2023062670A1 (en) Buffer sheet, method for mounting electronic component, and method for manufacturing electronic component device
JP6597845B2 (en) Pre-supplied underfill material, electronic component device, and method of manufacturing electronic component device
JP2010111847A (en) Adhesive composition and connected body

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION