US20050170075A1 - Method of evaporating film used in an organic electro-luminescent display - Google Patents
Method of evaporating film used in an organic electro-luminescent display Download PDFInfo
- Publication number
- US20050170075A1 US20050170075A1 US11/070,971 US7097105A US2005170075A1 US 20050170075 A1 US20050170075 A1 US 20050170075A1 US 7097105 A US7097105 A US 7097105A US 2005170075 A1 US2005170075 A1 US 2005170075A1
- Authority
- US
- United States
- Prior art keywords
- evaporation source
- evaporating
- mask
- metal plate
- providing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000001704 evaporation Methods 0.000 title claims abstract description 133
- 238000000034 method Methods 0.000 title claims description 34
- 230000008020 evaporation Effects 0.000 claims abstract description 85
- 239000000463 material Substances 0.000 claims abstract description 52
- 239000010409 thin film Substances 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims description 43
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000011521 glass Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 12
- 239000002019 doping agent Substances 0.000 description 12
- 239000010408 film Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Definitions
- the present invention relates to a method of evaporating thin film and, more particularly, to a method of evaporating thin film used in an organic electro-luminescent (EL) display.
- EL organic electro-luminescent
- EL display using organic compounds as luminescent materials is a laminated-film type display and has advantages of self luminescence, thin profile, light weight, and low driving voltage.
- a lamination body comprises an anode layer, a hole-injecting layer, a hole-transporting layer, an organic luminescent film, an electron-injecting layer, an electron-transporting layer, and a cathode layer. After applying an outer voltage to the OLED, both the electrons generated from the cathode layer and the holes generated from the anode layer move to reach the organic luminescent film, and then bombard the film and combine to transform electricity into luminosity.
- evaporation with a shadow mask is used to deposit and pattern thin film on the glass substrate at the same time.
- a metal mask 12 with a plurality of openings 11 is placed below a glass substrate 10
- an evaporation source 14 is placed below the metal mask 12 .
- the materials in the evaporation source 14 can pass through the openings 11 to be deposited on the predetermined regions of the glass substrate 10 .
- the evaporation source 14 is a single/point source that causes a shadow effect.
- the materials piling in the evaporation source 14 are not compact enough to reduce the thermal conductivity, thus a uniform temperature is not easily achieved in the evaporation source 14 , resulting in poor uniformity of deposition thickness.
- One solution is to reduce the distance between the evaporation source 14 and the glass substrate 10 , and the other is to rotate the glass substrate 10 during evaporation. Both methods may, however, decrease evaporation efficiency.
- U.S. Published Application No. 2001/0006827 discloses a method of using linear evaporation source to form the lamination body.
- a shadow mask 18 with a plurality of openings 17 is placed below a glass substrate 16
- a linear evaporation source 20 with a plurality of evaporation cells 22 arranged in a line is placed along X direction below the shadow mask 18 .
- the linear evaporation source 20 is moved along Y direction, and the materials in each of the evaporation cell 22 can pass through the openings 17 to be deposited on predetermined regions of the glass substrate 16 .
- this generates high costs and a complex process for controlling increased parameters.
- the present invention provides a method of evaporating thin film used in OLED to solve the above-mentioned problems.
- a mask having a plurality of openings is placed below a display substrate, and a plane evaporation source is placed below the mask.
- the plane evaporation source has a plurality of evaporating material cells respectively aligned to the openings of the mask.
- the evaporation of the evaporating material cells deposits a plurality of thin films on predetermined regions of the display substrate.
- Yet another object of the invention is to avoid shadow effect.
- FIG. 1 is a schematic diagram showing a method of using single/point evaporation source according to the prior art.
- FIGS. 2A and 2B are schematic diagrams showing a method of using linear evaporation source according to the prior art.
- FIGS. 3A to 3 C are schematic diagrams showing a method of evaporating thin film according to the first embodiment of the present invention.
- FIGS. 4A to 4 C are schematic diagrams showing a method of evaporating thin film according to the second embodiment of the present invention.
- FIGS. 5A to 5 E are schematic diagrams showing a method of evaporating thin film according to the third embodiment of the present invention.
- FIG. 6A is a schematic diagram showing a modified metal plate according to the fourth embodiment of the present invention.
- FIG. 6B is a schematic diagram showing a modified metal net according to the fourth embodiment of the present invention.
- the present invention provides a method of evaporating thin film used in organic EL display, in which a first mask with a rough pattern and a point evaporation source are employed to form a plane evaporation source, and then a second mask with a precise pattern and the planar evaporation source are employed to deposit a thin film on predetermined regions of a glass substrate.
- a first mask with a rough pattern and a point evaporation source are employed to form a plane evaporation source
- a second mask with a precise pattern and the planar evaporation source are employed to deposit a thin film on predetermined regions of a glass substrate.
- FIGS. 3A to 3 C are schematic diagrams showing a method of evaporating thin film according to the first embodiment of the present invention.
- a first mask 32 with a rough pattern is placed below a metal plate 30
- a point evaporation source 34 is placed below the first mask 32 .
- the evaporating materials in the point evaporation source 34 can pass through a plurality of openings 33 patterned on the first mask 32 , thus a plurality of first thin film 36 arranged in array are deposited on predetermined regions of the metal plate 30 .
- FIG. 3A a first mask 32 with a rough pattern is placed below a metal plate 30 , and a point evaporation source 34 is placed below the first mask 32 .
- the evaporating materials in the point evaporation source 34 can pass through a plurality of openings 33 patterned on the first mask 32 , thus a plurality of first thin film 36 arranged in array are deposited on predetermined regions of the metal plate 30 .
- FIG. 3A
- the metal plate 30 with the first thin film 36 is employed as a plane evaporation source 38 , and the first thin film 36 arranged in array are used as evaporating material cells 36 .
- the metal plate 30 is of high thermal-conductivity metallic material, such as Ta.
- the first mask 32 may be ceramic or metallic.
- the metal plate 30 can be rotated to improve the evaporation property of the first thin film 36 .
- two or more point evaporation sources 34 can be used simultaneously to save evaporation time.
- a second mask 42 with a precise pattern is placed below a glass substrate 40 , and the plane evaporation source 38 is inverted and placed below the second mask 42 where the evaporating material cells 36 are respectively aligned to a plurality of openings 43 of the second mask 42 .
- the evaporating material cells 36 can pass through the opening 43 to deposit thin film on predetermined regions of the glass substrate 40 , thus a patterned thin film layer is formed.
- the plane evaporation source 38 the distance between the glass substrate 40 and the evaporating material cell 36 can be reduced as much as possible.
- the evaporation rate is well controlled and increased, the evaporating materials are used more efficiently, and shadow effect is avoided.
- This also improves the uniformity in heating temperature of each evaporating material cell 36 on the plane evaporation source 38 , thereby the thin film deposited on the glass substrate 40 has good uniformity of thickness and distribution.
- the evaporating material cells 36 are self-aligned to the openings 43 of the second mask 42 , only a small amount of evaporating material adheres to the second mask 42 during evaporation and thus, the necessity of cleaning the second mask 42 is reduced. This prolongs the lifetime of the second mask 42 .
- the first mask 32 can be omitted during the formation of the plane evaporation source 38 , thus the first thin film 36 are more roughly formed on the metal plate 36 and the subsequent step of aligning the thin film 36 to the precisely-patterned openings 43 of the second mask 42 can be omitted.
- the second embodiment provides an evaporating method of improving the formation of the plane evaporation source to form a luminescent thin film used in the organic EL display.
- evaporation materials comprise a host material and a dopant material.
- FIGS. 4A to 4 C are schematic diagrams showing a method of evaporating thin film according to the second embodiment of the present invention. As shown in FIG. 4A , the first mask with a rough pattern is placed below the metal plate 30 , and a host material evaporation source 35 I and at least a dopant material evaporation source 35 II are placed below the first mask 32 .
- the host material evaporation source 35 I and the dopant material evaporation source 35 II must have the same evaporating temperature. In evaporating, the host material evaporation source 35 I and the dopant material evaporation source 35 II can pass through the openings 33 to deposit a plurality of first thin film 36 ′ arranged in array on the metal plate 30 .
- the metal plate 30 with the first thin films 36 ′ serves as a plane evaporation source 38 ′, and the thin film 36 ′ serve as evaporating material cells 36 ′.
- the follow-up steps are the same as the above-described method in the first embodiment, as shown in FIG. 4C , the second mask 42 with a precise pattern and the plane evaporation source 38 ′ are employed to deposit the luminescent thin film on predetermined regions of the glass substrate 40 .
- FIGS. 5A to 5 E are schematic diagrams showing a method of evaporating thin film according to the third embodiment of the present invention.
- a first mask 32 I with a rough pattern is placed below the metal plate 30 , and a host material evaporation source 35 I is placed below the first mask 32 I.
- the host material evaporation source 35 I can pass through the openings 33 of the first mask 32 I to deposit a plurality of host material film 36 I arranged in array on predetermined regions of the metal plate 30 , as shown in FIG. 5B .
- another first mask 32 II with a rough pattern is placed below a metal net 31
- a dopant material evaporation source 35 II is placed below the first mask 32 II.
- the dopant material evaporation source 35 II can pass through the openings 33 of the first mask 32 II to deposit a plurality of dopant material film 36 II arranged in array on the metal net 31 , as shown in FIG. 5D .
- the second mask 42 with a precise pattern is placed below the glass substrate 40 , the metal net 31 with the dopant material film 36 II is inverted and placed below the second mask 42 , and the metal plate 30 with the host material film 36 I is inverted and placed below the metal net 31 .
- the dopant material film 36 II and the host material film 36 I are aligned to the openings 43 of the second mask 42 , respectively.
- dopant materials and host materials are co-evaporated on predetermined regions of the glass substrate 40 to serve as luminescent thin film.
- FIG. 6A is a schematic diagram showing a modified metal plate according to the fourth embodiment of the present invention.
- a plurality of supporting ribs 46 is disposed on the backside of the metal plate 30 to provide mechanical support. Also, the supporting ribs 46 can increase the thermal conductivity of the metal plate 30 to improve the heating-temperature uniformity during evaporation.
- FIG. 6B is a schematic diagram showing a modified metal net according to the fourth embodiment of the present invention.
- a plurality of supporting ribs 46 is disposed on the back side of the metal net 31 , to provide mechanical support and increased thermal conductivity.
Abstract
In evaporating thin film used in organic electro-luminescent (EL) display, a mask having a plurality of openings is placed below a display substrate, and a plane evaporation source is placed below the mask. The plane evaporation source has a plurality of evaporating material cells which are respectively aligned to the openings of the mask. Next, evaporating the evaporating material cells, a plurality of thin films is deposited on predetermined regions of the display substrate.
Description
- 1. Field of the Invention
- The present invention relates to a method of evaporating thin film and, more particularly, to a method of evaporating thin film used in an organic electro-luminescent (EL) display.
- 2. Description of the Related Art
- In new generation panel display technologies, organic electro-luminescent (EL) display using organic compounds as luminescent materials is a laminated-film type display and has advantages of self luminescence, thin profile, light weight, and low driving voltage. In general, on a glass substrate of the OLED, a lamination body comprises an anode layer, a hole-injecting layer, a hole-transporting layer, an organic luminescent film, an electron-injecting layer, an electron-transporting layer, and a cathode layer. After applying an outer voltage to the OLED, both the electrons generated from the cathode layer and the holes generated from the anode layer move to reach the organic luminescent film, and then bombard the film and combine to transform electricity into luminosity.
- In fabricating the lamination body, conventional photolithography is not suited for patterning because the EL elements are weak with respect to water and oxygen. Thus evaporation with a shadow mask is used to deposit and pattern thin film on the glass substrate at the same time. As shown in
FIG. 1 , ametal mask 12 with a plurality ofopenings 11 is placed below aglass substrate 10, and anevaporation source 14 is placed below themetal mask 12. During evaporation, the materials in theevaporation source 14 can pass through theopenings 11 to be deposited on the predetermined regions of theglass substrate 10. However, theevaporation source 14 is a single/point source that causes a shadow effect. Also, the materials piling in theevaporation source 14 are not compact enough to reduce the thermal conductivity, thus a uniform temperature is not easily achieved in theevaporation source 14, resulting in poor uniformity of deposition thickness. One solution is to reduce the distance between theevaporation source 14 and theglass substrate 10, and the other is to rotate theglass substrate 10 during evaporation. Both methods may, however, decrease evaporation efficiency. - U.S. Published Application No. 2001/0006827 discloses a method of using linear evaporation source to form the lamination body. As shown in
FIGS. 2A and 2B , ashadow mask 18 with a plurality ofopenings 17 is placed below aglass substrate 16, and alinear evaporation source 20 with a plurality ofevaporation cells 22 arranged in a line is placed along X direction below theshadow mask 18. During evaporation, thelinear evaporation source 20 is moved along Y direction, and the materials in each of theevaporation cell 22 can pass through theopenings 17 to be deposited on predetermined regions of theglass substrate 16. However, this generates high costs and a complex process for controlling increased parameters. Also, this only improves the deposited-thickness uniformity in direction Y, but not direction X. In addition, this still cannot solve the above-mentioned problems of difficulty in achieving an uniform temperature during evaporation, and low efficiency in evaporation source material use. - The present invention provides a method of evaporating thin film used in OLED to solve the above-mentioned problems.
- In evaporating thin film, a mask having a plurality of openings is placed below a display substrate, and a plane evaporation source is placed below the mask. The plane evaporation source has a plurality of evaporating material cells respectively aligned to the openings of the mask. Next, the evaporation of the evaporating material cells deposits a plurality of thin films on predetermined regions of the display substrate.
- Accordingly, it is a principle object of the invention to strictly control the evaporation rate and increase the evaporation rate.
- It is another object of the invention to increase evaporation source material use.
- Yet another object of the invention is to avoid shadow effect.
- It is a further object of the invention to obtain thin film with good uniformity in thickness and distribution.
- These and other objects of the present invention will become readily apparent upon further review of the following specification and drawings.
-
FIG. 1 is a schematic diagram showing a method of using single/point evaporation source according to the prior art. -
FIGS. 2A and 2B are schematic diagrams showing a method of using linear evaporation source according to the prior art. -
FIGS. 3A to 3C are schematic diagrams showing a method of evaporating thin film according to the first embodiment of the present invention. -
FIGS. 4A to 4C are schematic diagrams showing a method of evaporating thin film according to the second embodiment of the present invention. -
FIGS. 5A to 5E are schematic diagrams showing a method of evaporating thin film according to the third embodiment of the present invention. -
FIG. 6A is a schematic diagram showing a modified metal plate according to the fourth embodiment of the present invention. -
FIG. 6B is a schematic diagram showing a modified metal net according to the fourth embodiment of the present invention. - Similar reference characters denote corresponding features consistently throughout the attached drawings.
- The present invention provides a method of evaporating thin film used in organic EL display, in which a first mask with a rough pattern and a point evaporation source are employed to form a plane evaporation source, and then a second mask with a precise pattern and the planar evaporation source are employed to deposit a thin film on predetermined regions of a glass substrate. Using the evaporating method to form a lamination body used in the organic EL display, especially for forming the organic luminescent layer, improves uniformity of thickness for the deposited-film and temperature uniformity during evaporation, and increases both deposition rate and evaporating material use efficiency, while also avoiding shadow effect.
-
FIGS. 3A to 3C are schematic diagrams showing a method of evaporating thin film according to the first embodiment of the present invention. First, as shown inFIG. 3A , afirst mask 32 with a rough pattern is placed below ametal plate 30, and apoint evaporation source 34 is placed below thefirst mask 32. During the evaporation, the evaporating materials in thepoint evaporation source 34 can pass through a plurality ofopenings 33 patterned on thefirst mask 32, thus a plurality of firstthin film 36 arranged in array are deposited on predetermined regions of themetal plate 30. As shown inFIG. 3B , themetal plate 30 with the firstthin film 36 is employed as aplane evaporation source 38, and the firstthin film 36 arranged in array are used as evaporatingmaterial cells 36. Preferably, themetal plate 30 is of high thermal-conductivity metallic material, such as Ta. Thefirst mask 32 may be ceramic or metallic. In addition, during the evaporation, themetal plate 30 can be rotated to improve the evaporation property of the firstthin film 36. Moreover, when the size of themetal plate 30 is unusually large, two or morepoint evaporation sources 34 can be used simultaneously to save evaporation time. - Next, as shown in
FIG. 3C , asecond mask 42 with a precise pattern is placed below aglass substrate 40, and theplane evaporation source 38 is inverted and placed below thesecond mask 42 where the evaporatingmaterial cells 36 are respectively aligned to a plurality ofopenings 43 of thesecond mask 42. In evaporating, the evaporatingmaterial cells 36 can pass through theopening 43 to deposit thin film on predetermined regions of theglass substrate 40, thus a patterned thin film layer is formed. By using theplane evaporation source 38, the distance between theglass substrate 40 and the evaporatingmaterial cell 36 can be reduced as much as possible. Therefore, without rotating theglass substrate 40, the evaporation rate is well controlled and increased, the evaporating materials are used more efficiently, and shadow effect is avoided. This also improves the uniformity in heating temperature of each evaporatingmaterial cell 36 on theplane evaporation source 38, thereby the thin film deposited on theglass substrate 40 has good uniformity of thickness and distribution. Furthermore, since the evaporatingmaterial cells 36 are self-aligned to theopenings 43 of thesecond mask 42, only a small amount of evaporating material adheres to thesecond mask 42 during evaporation and thus, the necessity of cleaning thesecond mask 42 is reduced. This prolongs the lifetime of thesecond mask 42. Moreover, thefirst mask 32 can be omitted during the formation of theplane evaporation source 38, thus the firstthin film 36 are more roughly formed on themetal plate 36 and the subsequent step of aligning thethin film 36 to the precisely-patternedopenings 43 of thesecond mask 42 can be omitted. - The second embodiment provides an evaporating method of improving the formation of the plane evaporation source to form a luminescent thin film used in the organic EL display. Generally, in evaporating luminescent thin film, evaporation materials comprise a host material and a dopant material.
FIGS. 4A to 4C are schematic diagrams showing a method of evaporating thin film according to the second embodiment of the present invention. As shown inFIG. 4A , the first mask with a rough pattern is placed below themetal plate 30, and a host material evaporation source 35I and at least a dopant material evaporation source 35II are placed below thefirst mask 32. It is noticed that the host material evaporation source 35I and the dopant material evaporation source 35II must have the same evaporating temperature. In evaporating, the host material evaporation source 35I and the dopant material evaporation source 35II can pass through theopenings 33 to deposit a plurality of firstthin film 36′ arranged in array on themetal plate 30. As shown inFIG. 4B , themetal plate 30 with the firstthin films 36′ serves as aplane evaporation source 38′, and thethin film 36′ serve as evaporatingmaterial cells 36′. The follow-up steps are the same as the above-described method in the first embodiment, as shown inFIG. 4C , thesecond mask 42 with a precise pattern and theplane evaporation source 38′ are employed to deposit the luminescent thin film on predetermined regions of theglass substrate 40. - The third embodiment provides a co-evaporating method to form a luminescent thin film used in the organic EL display, especially when the host material evaporation source and the dopant material evaporation source have different evaporating temperatures.
FIGS. 5A to 5E are schematic diagrams showing a method of evaporating thin film according to the third embodiment of the present invention. First, as shown inFIG. 5A , a first mask 32I with a rough pattern is placed below themetal plate 30, and a host material evaporation source 35I is placed below the first mask 32I. During the evaporation, the host material evaporation source 35I can pass through theopenings 33 of the first mask 32I to deposit a plurality ofhost material film 36I arranged in array on predetermined regions of themetal plate 30, as shown inFIG. 5B . At the same time, as shown inFIG. 5C , another first mask 32II with a rough pattern is placed below ametal net 31, and a dopant material evaporation source 35II is placed below the first mask 32II. During evaporation, the dopant material evaporation source 35II can pass through theopenings 33 of the first mask 32II to deposit a plurality of dopant material film 36II arranged in array on themetal net 31, as shown inFIG. 5D . - Then, as shown in
FIG. 5E , thesecond mask 42 with a precise pattern is placed below theglass substrate 40, themetal net 31 with the dopant material film 36II is inverted and placed below thesecond mask 42, and themetal plate 30 with thehost material film 36I is inverted and placed below themetal net 31. Next, using any well-known alignment technology, the dopant material film 36II and thehost material film 36I are aligned to theopenings 43 of thesecond mask 42, respectively. Finally, in evaporating, since the dopant materials can pass through theopenings 43 and the host materials can pass through themetal net 31 and theopenings 43, dopant materials and host materials are co-evaporated on predetermined regions of theglass substrate 40 to serve as luminescent thin film. - The fourth embodiment provides a modified structure to improve the above-described
metal plate 30 andmetal net 31.FIG. 6A is a schematic diagram showing a modified metal plate according to the fourth embodiment of the present invention. In the modified structure, a plurality of supportingribs 46 is disposed on the backside of themetal plate 30 to provide mechanical support. Also, the supportingribs 46 can increase the thermal conductivity of themetal plate 30 to improve the heating-temperature uniformity during evaporation.FIG. 6B is a schematic diagram showing a modified metal net according to the fourth embodiment of the present invention. In the modified structure, a plurality of supportingribs 46 is disposed on the back side of themetal net 31, to provide mechanical support and increased thermal conductivity. - It is to be understood that the present invention is not limited to the embodiments described above, but encompasses any and all embodiments within the scope of the following claims.
Claims (15)
1. A method of evaporating thin film used in organic electro-luminescent display, comprising steps of:
providing a display substrate;
providing a mask having a plurality of openings and placed below the display substrate;
providing a plane evaporation source placed below the mask, wherein the plane evaporation source has a plurality of thin films arranged in array which are respectively aligned to the openings of the mask; and
evaporating the thin films from the plane evaporation source to deposit a plurality of thin films on predetermined regions of the display substrate.
2. The method according to claim 1 , wherein the thin films are of organic electro-luminescent materials.
3. The method according to claim 1 , wherein the formation of the plane evaporation source comprises steps of:
providing a metal plate;
providing at least one kind of evaporation source placed below the metal plate; and
evaporating the evaporation source to form the thin films on the metal plate.
4. The method according to claim 3 , wherein the formation of the plane evaporation source further comprises a step of providing a mask which has a plurality of openings and is disposed between the metal plate and the evaporation source.
5. The method according to claim 3 , wherein a plurality of types of evaporation sources are provided below the metal plate.
6. The method according to claim 3 , wherein the metal plate is rotated during evaporation.
7. The method according to claim 3 , wherein the back side of the metal plate comprises a plurality of supporting ribs.
8-15. (canceled)
16. A method of evaporating thin film used in organic electro-luminescent display, comprising steps of:
providing a display substrate;
providing a mask having a plurality of openings and placed below the display substrate;
providing a plane evaporation source placed below the mask, wherein the plane evaporation source has a plurality of evaporating material cells arranged in two-dimensional array which are respectively aligned to the openings of the mask; and
evaporating the evaporating material cells from the plane evaporation source to deposit a plurality of thin films on predetermined regions of the display substrate.
17. The method according to claim 16 , wherein the evaporating material cells are of organic electro-luminescent materials.
18. The method according to claim 16 , wherein the formation of the plane evaporation source comprises steps of:
providing a metal plate;
providing at least one kind of evaporation source placed below the metal plate; and
evaporating the evaporation source to form the evaporating material cells on the metal plate.
19. The method according to claim 18 , wherein the formation of the plane evaporation source further comprises a step of providing a mask which has a plurality of openings and is disposed between the metal plate and the evaporation source.
20. The method according to claim 18 , wherein a plurality of types of evaporation sources are provided below the metal plate.
21. The method according to claim 18 , wherein the metal plate is rotated during evaporation.
22. The method according to claim 18 , wherein the back side of the metal plate comprises a plurality of supporting ribs.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/070,971 US20050170075A1 (en) | 2001-10-16 | 2005-03-02 | Method of evaporating film used in an organic electro-luminescent display |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN090125566 | 2001-10-16 | ||
TW090125566A TW529317B (en) | 2001-10-16 | 2001-10-16 | Method of evaporating film used in an organic electro-luminescent display |
US10/055,646 US6869636B2 (en) | 2001-10-16 | 2002-01-22 | Method of evaporating film used in an organic electro-luminescent display |
US11/070,971 US20050170075A1 (en) | 2001-10-16 | 2005-03-02 | Method of evaporating film used in an organic electro-luminescent display |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/055,646 Continuation US6869636B2 (en) | 2001-10-16 | 2002-01-22 | Method of evaporating film used in an organic electro-luminescent display |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050170075A1 true US20050170075A1 (en) | 2005-08-04 |
Family
ID=21679499
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/055,646 Expired - Lifetime US6869636B2 (en) | 2001-10-16 | 2002-01-22 | Method of evaporating film used in an organic electro-luminescent display |
US11/070,971 Abandoned US20050170075A1 (en) | 2001-10-16 | 2005-03-02 | Method of evaporating film used in an organic electro-luminescent display |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/055,646 Expired - Lifetime US6869636B2 (en) | 2001-10-16 | 2002-01-22 | Method of evaporating film used in an organic electro-luminescent display |
Country Status (3)
Country | Link |
---|---|
US (2) | US6869636B2 (en) |
JP (1) | JP3626736B2 (en) |
TW (1) | TW529317B (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050122035A1 (en) * | 2001-12-28 | 2005-06-09 | Osram Opto Semiconductors Gmbh | Organic light-emitting diode (led) and method for the production thereof |
US20080226814A1 (en) * | 2007-01-17 | 2008-09-18 | Fuji Electric Holdings Co., Ltd. | Method for manufacturing patterned vapor-deposited film |
US20120148730A1 (en) * | 2007-04-27 | 2012-06-14 | Semiconductor Energy Laboratory Co., Ltd. | Film Formation Method and Method for Manufacturing Light-Emitting Device |
CN107425144A (en) * | 2017-08-21 | 2017-12-01 | 江苏集萃有机光电技术研究所有限公司 | The preparation method of OLED evaporation sources, evaporated device and oled panel pel array |
CN108265265A (en) * | 2013-09-13 | 2018-07-10 | 大日本印刷株式会社 | Metallic plate, the manufacturing method of metallic plate and the method using metallic plate manufacture mask |
US10131982B2 (en) * | 2016-05-05 | 2018-11-20 | Boe Technology Group Co., Ltd. | Mask, motherboard, device and method for manufacturing mask, and system for evaporating display substrate |
US10570498B2 (en) | 2015-02-10 | 2020-02-25 | Dai Nippon Printing Co., Ltd. | Manufacturing method for deposition mask, metal plate used for producing deposition mask, and manufacturing method for said metal sheet |
US10600963B2 (en) | 2014-05-13 | 2020-03-24 | Dai Nippon Printing Co., Ltd. | Metal plate, method of manufacturing metal plate, and method of manufacturing mask by using metal plate |
US11486031B2 (en) | 2013-10-15 | 2022-11-01 | Dai Nippon Printing Co., Ltd. | Metal plate |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW529317B (en) * | 2001-10-16 | 2003-04-21 | Chi Mei Electronic Corp | Method of evaporating film used in an organic electro-luminescent display |
US20030146692A1 (en) * | 2002-01-11 | 2003-08-07 | Seiko Epson Corporation | Organic EL device and manufacturing method therefor, electrooptic apparatus, and electronic apparatus |
JP3877613B2 (en) * | 2002-03-05 | 2007-02-07 | 三洋電機株式会社 | Method for manufacturing organic electroluminescence display device |
US7067170B2 (en) * | 2002-09-23 | 2006-06-27 | Eastman Kodak Company | Depositing layers in OLED devices using viscous flow |
JP2004183044A (en) * | 2002-12-03 | 2004-07-02 | Seiko Epson Corp | Mask vapor deposition method and apparatus, mask and mask manufacturing method, display panel manufacturing apparatus, display panel and electronic equipment |
US8123862B2 (en) * | 2003-08-15 | 2012-02-28 | Semiconductor Energy Laboratory Co., Ltd. | Deposition apparatus and manufacturing apparatus |
US6983884B2 (en) | 2004-02-19 | 2006-01-10 | Neoteric Technology, Limited | Method and apparatus for monitoring transfusion of blood |
JP4716277B2 (en) * | 2004-11-26 | 2011-07-06 | 国立大学法人京都大学 | Thin film forming method, vapor deposition source substrate, and vapor deposition source substrate manufacturing method |
WO2008069259A1 (en) | 2006-12-05 | 2008-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Film formation apparatus, film formation method, manufacturing apparatus, and method for manufacturing light-emitting device |
US9048344B2 (en) | 2008-06-13 | 2015-06-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US9604245B2 (en) | 2008-06-13 | 2017-03-28 | Kateeva, Inc. | Gas enclosure systems and methods utilizing an auxiliary enclosure |
US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US8383202B2 (en) | 2008-06-13 | 2013-02-26 | Kateeva, Inc. | Method and apparatus for load-locked printing |
KR100994118B1 (en) | 2009-01-13 | 2010-11-15 | 삼성모바일디스플레이주식회사 | Organic light emitting diode and manufacturing method thereof |
TW201920882A (en) * | 2012-11-30 | 2019-06-01 | 美商凱特伊夫公司 | Method for maintenance of an industrial printing system |
WO2015100375A1 (en) | 2013-12-26 | 2015-07-02 | Kateeva, Inc. | Thermal treatment of electronic devices |
JP6113923B2 (en) | 2014-01-21 | 2017-04-12 | カティーバ, インコーポレイテッド | Apparatus and techniques for encapsulation of electronic devices |
KR102390045B1 (en) | 2014-04-30 | 2022-04-22 | 카티바, 인크. | Gas cushion apparatus and techniques for substrate coating |
JP6570147B2 (en) | 2014-11-26 | 2019-09-04 | カティーバ, インコーポレイテッド | Environmentally controlled coating system |
CN109326730B (en) * | 2017-08-01 | 2024-02-13 | 拓旷(上海)光电科技有限公司 | Manufacturing apparatus for organic light emitting diode display |
EP3704285A4 (en) * | 2017-11-01 | 2021-06-30 | BOE Technology Group Co., Ltd. | Evaporation plate for depositing deposition material on substrate, evaporation apparatus, and method of depositing deposition material on substrate |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3405251A (en) * | 1966-05-31 | 1968-10-08 | Trw Inc | Vacuum evaporation source |
US5104695A (en) * | 1989-09-08 | 1992-04-14 | International Business Machines Corporation | Method and apparatus for vapor deposition of material onto a substrate |
US5395740A (en) * | 1993-01-27 | 1995-03-07 | Motorola, Inc. | Method for fabricating electrode patterns |
US5688551A (en) * | 1995-11-13 | 1997-11-18 | Eastman Kodak Company | Method of forming an organic electroluminescent display panel |
US5904961A (en) * | 1997-01-24 | 1999-05-18 | Eastman Kodak Company | Method of depositing organic layers in organic light emitting devices |
US6224966B1 (en) * | 1997-03-18 | 2001-05-01 | Idemitsu Kosan Co., Ltd. | Organic electroluminescent device |
US20010006827A1 (en) * | 1999-12-27 | 2001-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Film formation apparatus and method for forming a film |
US20020076847A1 (en) * | 2000-09-28 | 2002-06-20 | Tsutomu Yamada | Method of attaching layer material and forming layer in predetermined pattern on substrate using mask |
US6537607B1 (en) * | 1999-12-17 | 2003-03-25 | Texas Instruments Incorporated | Selective deposition of emissive layer in electroluminescent displays |
US6592933B2 (en) * | 1997-10-15 | 2003-07-15 | Toray Industries, Inc. | Process for manufacturing organic electroluminescent device |
US6869636B2 (en) * | 2001-10-16 | 2005-03-22 | Chi Mei Optoelectronics Corporation | Method of evaporating film used in an organic electro-luminescent display |
-
2001
- 2001-10-16 TW TW090125566A patent/TW529317B/en active
-
2002
- 2002-01-22 US US10/055,646 patent/US6869636B2/en not_active Expired - Lifetime
- 2002-03-11 JP JP2002065628A patent/JP3626736B2/en not_active Expired - Fee Related
-
2005
- 2005-03-02 US US11/070,971 patent/US20050170075A1/en not_active Abandoned
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3405251A (en) * | 1966-05-31 | 1968-10-08 | Trw Inc | Vacuum evaporation source |
US5104695A (en) * | 1989-09-08 | 1992-04-14 | International Business Machines Corporation | Method and apparatus for vapor deposition of material onto a substrate |
US5395740A (en) * | 1993-01-27 | 1995-03-07 | Motorola, Inc. | Method for fabricating electrode patterns |
US5688551A (en) * | 1995-11-13 | 1997-11-18 | Eastman Kodak Company | Method of forming an organic electroluminescent display panel |
US5904961A (en) * | 1997-01-24 | 1999-05-18 | Eastman Kodak Company | Method of depositing organic layers in organic light emitting devices |
US6224966B1 (en) * | 1997-03-18 | 2001-05-01 | Idemitsu Kosan Co., Ltd. | Organic electroluminescent device |
US6592933B2 (en) * | 1997-10-15 | 2003-07-15 | Toray Industries, Inc. | Process for manufacturing organic electroluminescent device |
US6537607B1 (en) * | 1999-12-17 | 2003-03-25 | Texas Instruments Incorporated | Selective deposition of emissive layer in electroluminescent displays |
US20010006827A1 (en) * | 1999-12-27 | 2001-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Film formation apparatus and method for forming a film |
US20020076847A1 (en) * | 2000-09-28 | 2002-06-20 | Tsutomu Yamada | Method of attaching layer material and forming layer in predetermined pattern on substrate using mask |
US6869636B2 (en) * | 2001-10-16 | 2005-03-22 | Chi Mei Optoelectronics Corporation | Method of evaporating film used in an organic electro-luminescent display |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050122035A1 (en) * | 2001-12-28 | 2005-06-09 | Osram Opto Semiconductors Gmbh | Organic light-emitting diode (led) and method for the production thereof |
US7256541B2 (en) * | 2001-12-28 | 2007-08-14 | Osram Opto Semiconductors Gmbh | Organic light-emitting diode (OLED) and method for the production thereof |
US20080226814A1 (en) * | 2007-01-17 | 2008-09-18 | Fuji Electric Holdings Co., Ltd. | Method for manufacturing patterned vapor-deposited film |
US20120148730A1 (en) * | 2007-04-27 | 2012-06-14 | Semiconductor Energy Laboratory Co., Ltd. | Film Formation Method and Method for Manufacturing Light-Emitting Device |
US8734914B2 (en) * | 2007-04-27 | 2014-05-27 | Semiconductor Energy Laboratory Co., Ltd. | Film formation method and method for manufacturing light-emitting device |
CN108265265A (en) * | 2013-09-13 | 2018-07-10 | 大日本印刷株式会社 | Metallic plate, the manufacturing method of metallic plate and the method using metallic plate manufacture mask |
US10731261B2 (en) | 2013-09-13 | 2020-08-04 | Dai Nippon Printing Co., Ltd. | Metal plate, method of manufacturing metal plate, and method of manufacturing mask by use of metal plate |
US11486031B2 (en) | 2013-10-15 | 2022-11-01 | Dai Nippon Printing Co., Ltd. | Metal plate |
US10600963B2 (en) | 2014-05-13 | 2020-03-24 | Dai Nippon Printing Co., Ltd. | Metal plate, method of manufacturing metal plate, and method of manufacturing mask by using metal plate |
US11217750B2 (en) | 2014-05-13 | 2022-01-04 | Dai Nippon Printing Co., Ltd. | Metal plate, method of manufacturing metal plate, and method of manufacturing mask by using metal plate |
US10570498B2 (en) | 2015-02-10 | 2020-02-25 | Dai Nippon Printing Co., Ltd. | Manufacturing method for deposition mask, metal plate used for producing deposition mask, and manufacturing method for said metal sheet |
US10612124B2 (en) | 2015-02-10 | 2020-04-07 | Dai Nippon Printing Co., Ltd. | Manufacturing method for deposition mask, metal plate used for producing deposition mask, and manufacturing method for said metal sheet |
US10131982B2 (en) * | 2016-05-05 | 2018-11-20 | Boe Technology Group Co., Ltd. | Mask, motherboard, device and method for manufacturing mask, and system for evaporating display substrate |
CN107425144A (en) * | 2017-08-21 | 2017-12-01 | 江苏集萃有机光电技术研究所有限公司 | The preparation method of OLED evaporation sources, evaporated device and oled panel pel array |
Also Published As
Publication number | Publication date |
---|---|
JP2003123970A (en) | 2003-04-25 |
US6869636B2 (en) | 2005-03-22 |
US20030072876A1 (en) | 2003-04-17 |
JP3626736B2 (en) | 2005-03-09 |
TW529317B (en) | 2003-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6869636B2 (en) | Method of evaporating film used in an organic electro-luminescent display | |
US7785663B2 (en) | Successive vapour deposition system, vapour deposition system, and vapour deposition process | |
CN102912316B (en) | Sedimentary origin assembly and organic layer depositing device | |
TWI445445B (en) | Organic light emitting device and manufacturing method thereof | |
CN100583493C (en) | Top-emission organic electroluminescent display and method of fabricating the same | |
KR102079273B1 (en) | Multi-nozzle organic vapor jet printing | |
US20050233489A1 (en) | Method for manufacturing electroluminescence display panel and evaporation mask | |
JP5529329B2 (en) | Vapor deposition apparatus, vapor deposition method, and organic EL display device manufacturing method | |
JPH10298738A (en) | Shadow mask and vapor depositing method | |
KR20070105595A (en) | Evaporation apparatus | |
JP2004103269A (en) | Manufacture method for organic electroluminescence display device | |
JPH10319870A (en) | Shadow mask and production for color thin film el display device using the same | |
TW201123968A (en) | Apparatus and methods to form a patterned coating on an OLED substrate | |
KR20120029895A (en) | Apparatus for thin layer deposition and method for manufacturing of organic light emitting display apparatus using the same | |
JP2009506200A (en) | Thin film layer creation method | |
KR20040039910A (en) | Heating source apparatus for Organic electron luminescence | |
JP4595232B2 (en) | Thin film pattern forming method and organic electroluminescent display device manufacturing method | |
US6582523B2 (en) | Organic source boat structure for organic electro-luminescent display fabricating apparatus | |
JP2000188184A (en) | Organic thin film el element and its manufacture | |
JP2005032464A (en) | Film forming device, film forming method, organic el element, and method for manufacturing the element | |
JP2000138095A (en) | Manufacture of light emitting device | |
US20070254184A1 (en) | Organic Electric Field Light Emitting Display | |
JP2006114427A (en) | Vacuum vapor-deposition method | |
JP2002317263A (en) | Vacuum deposition system | |
WO2012108363A1 (en) | Crucible, vapor deposition apparatus, vapor deposition method, and method for manufacturing organic electroluminescent display device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |