US20050181658A1 - Microconnectors and non-powered microassembly therewith - Google Patents
Microconnectors and non-powered microassembly therewith Download PDFInfo
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- US20050181658A1 US20050181658A1 US10/778,460 US77846004A US2005181658A1 US 20050181658 A1 US20050181658 A1 US 20050181658A1 US 77846004 A US77846004 A US 77846004A US 2005181658 A1 US2005181658 A1 US 2005181658A1
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- United States
- Prior art keywords
- microconnector
- receptacle
- manipulation probe
- connection member
- deflectable
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0005—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same
- B81C99/002—Apparatus for assembling MEMS, e.g. micromanipulators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/008—Aspects related to assembling from individually processed components, not covered by groups B81C3/001 - B81C3/002
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/13—Mechanical connectors, i.e. not functioning as an electrical connector
Definitions
- the present disclosure relates generally to MEMS devices, more specifically, to non-powered MEMS microconnectors and microassembly therewith.
- micromechanical devices and microelectronic devices including micro-electro-mechanical devices (MEMs), which comprise integrated micromechanical and microelectronic devices.
- MEMs micro-electro-mechanical devices
- microcomponent microconnector
- microdevice microassembly
- pick-and-place assembly is serial microassembly, wherein microcomponents are assembled one at a time in a serial fashion. For example, if a device is formed by coupling two microcomponents together, a gripper or other placing mechanism is used to pick up one of the two microcomponents and place it on a desired location of the other microcomponent.
- pick-and-place processes although seemingly quite simple, can present obstacles affecting assembly time, throughput and reliability.
- pick-and-place processes often employ powered “grippers” having end effectors configured to expand and/or contract in response to energy received from an integral or external power source.
- powered “grippers” having end effectors configured to expand and/or contract in response to energy received from an integral or external power source.
- structural fragility, increased packaging complexity, and uncertainties due to variations in actuator displacements limit the practical usefulness of employing such powered grippers during microassembly.
- FIG. 1 illustrates a perspective view of a portion of one embodiment of a microassembly according to aspects of the present disclosure.
- FIGS. 2 a and 2 b illustrate perspective views of intermediate stages of one embodiment of microassembly according to aspects of the present disclosure.
- FIG. 3 illustrates a perspective view of one embodiment of a microconnector according to aspects of the present disclosure.
- FIG. 4 illustrates a perspective view of one embodiment of a microconnector receptacle according to aspects of the present disclosure.
- FIG. 5 illustrates a perspective view of one embodiment of a manipulation probe according to aspects of the present disclosure.
- FIG. 6 illustrates a perspective view of another embodiment of a microassembly according to aspects of the present disclosure.
- FIGS. 7 a - c illustrate perspective views of another embodiment of a microassembly during intermediate stages of assembly according to aspects of the present disclosure.
- first and second features are formed in direct contact
- additional features may be formed interposing the first and second features, such that the first and second features may not be in direct contact.
- FIG. 1 illustrated is a perspective view of a portion of one embodiment of a microassembly 100 constructed according to aspects of the present disclosure.
- the microassembly 100 includes a microconnector 110 assembled to a receptacle 120 . A portion of an unoccupied receptacle 125 is also shown.
- the microconnector 110 has been assembled to the receptacle 120 without the use of a powered gripper or other actuator.
- the microconnector 110 and the receptacle 120 may be micro-electro-mechanical system (MEMS) components having feature dimensions that are less than about 1000 microns.
- the microconnector 110 and the receptacle 120 may also be nano-electro-mechanical system (NEMS) components having feature dimensions that are less than about 10 microns.
- MEMS micro-electro-mechanical system
- NEMS nano-electro-mechanical system
- This convention may be generally applied to any microcomponent of the microassemblies described herein.
- the microassembly 100 and others described below may include MEMS components having feature dimensions that are less than about 1000 microns and/or NEMS components having feature dimensions that are less than about 10 microns.
- the receptacles 120 , 125 are defined in or otherwise coupled to a substrate 105 , and each include a retainer 130 which, at least in the embodiment shown, includes two legs 140 .
- the legs 140 are coupled to or otherwise affixed to the substrate 105 at one end 142 and are free to translate across the substrate 105 at another end 144 .
- the ends 144 have tapered surfaces 146 , such that insertion of a portion of the microconnector 110 therebetween causes the legs 140 to deflect away from each other.
- the receptacles 120 , 125 also include an aperture 150 configured to receive a portion of the microconnector 110 , as well as one or more anchor pads 155 .
- the microconnector 110 includes a deflectable connection member 160 which, at least in the embodiment shown, includes two legs 170 .
- the legs 170 have a pre-engaged position in which they are configured to fit within the aperture 150 . Once oriented within the aperture 150 , the legs 170 may be configured to deflect away from each other to each engage and/or be engaged by a corresponding pair of receptacle legs 140 (as in the orientation shown in FIG. 1 ). In one embodiment, the legs 170 include tapered surfaces 175 to enable such deflection of the legs 170 .
- the microconnector 110 also includes one or more anchor arms 180 configured to stop or rest against one or more corresponding anchor pads 155 .
- FIGS. 2 a and 2 b illustrated are perspective views of the microassembly 100 shown in FIG. 1 during intermediate stages of assembly.
- the microconnector 110 has been retained by a manipulation probe 210 .
- the microconnector 110 may include a compliant handle 220 configured to deflect as the manipulation probe 210 is inserted, and the manipulation probe 210 may have a profile that allows it to be inserted into the compliant handle 220 by translation in one or more directions.
- the compliant handle 220 may include two or more members configured to deflect away from each other or towards each other, depending on the shape of the manipulation probe 210 .
- the microconnector 110 may be oriented as necessary for pre-assembly alignment with the receptacle 120 .
- orientation may include translation and/or rotation relative to the substrate 105 .
- the manipulation probe 210 may have been employed to remove the microconnector 110 from a configuration substantially parallel to that of the receptacle 120 and, thereafter, rotate the microconnector 110 about 90 degrees relative to the substrate 105 and align the microconnector 110 over the receptacle 120 .
- substantial parallelism of the microconnector 110 and the receptacle 120 may be maintained while the manipulation probe 210 orients the microconnector 110 relative to the receptacle 120 .
- the manipulation probe 210 may be manipulated to bring the microconnector 110 and the receptacle 120 into contact with each other.
- the microconnector 110 may include legs 170 configured to be received within an aperture 150 in the receptacle 120 as the microconnector anchor arms 180 are brought into contact with receptacle anchor pads 155 .
- the manipulation probe 210 may be further translated towards the receptacle 120 , whereby such further translation may cause the microconnector legs 170 and the receptacle legs 140 to each deflect outwards until they are allowed to engage each other.
- the manipulation probe 210 may then be translated out of the handle 220 and then substantially parallel to the substrate 105 to remove the probe 210 from the microconnector 110 , wherein the microconnector 110 may remain assembled to the receptacle 120 .
- FIG. 3 illustrated is a perspective view of one embodiment of a microconnector 300 constructed according to aspects of the present disclosure.
- the microconnector 300 is substantially similar to the microconnector 110 shown in FIGS. 1, 2 a and 2 b.
- the microconnector 300 may be defined in a single-crystalline silicon (SCS) layer, possibly having a thickness ranging between about 25 ⁇ m and about 200 ⁇ m.
- SCS single-crystalline silicon
- the SCS layer may be located over a sacrificial layer formed over a substrate 305 , wherein the sacrificial layer may comprise oxide and/or other materials and may have a thickness ranging between about 1 ⁇ m and about 30 ⁇ m.
- DRIE deep reactive ion etching
- Such a manufacturing process flow may include a backside DRIE through the substrate 305 or a handle portion thereof.
- In-plane electrical isolation may be achieved by trenches formed in the SCS layer and filled with nitride and/or another electrically insulating material.
- the microconnector 300 is released from the substrate 305 after fabrication and prior to assembly. Such a release process may employ a wet-etch of the sacrificial layer, possibly employing a 49% HF solution or other etchant chemistry.
- the microconnector 300 may also include a tether 310 defined in the SCS layer, such that the microconnector 300 does not become completely detached from the substrate 305 during the release process.
- the microconnector 300 includes a handle 320 configured to frictionally engage a manipulation probe, such as the probe 210 shown in FIG. 2 .
- the handle 320 is defined in the SCS layer as having two or more compliant legs 330 configured to deflect away from each other in response to insertion of the manipulation probe.
- the handle 320 may be a compliant handle.
- the legs 330 may be formed separated from each other by a distance about equal to or at least slightly less than the width of the manipulation probe tip or other portion configured to be grasped by the legs 330 . In one embodiment, such separation between the legs 330 may range between about 25 ⁇ m and about 300 ⁇ m. Although not limited by the scope of the present disclosure, the legs 330 may have a length ranging between about 50 ⁇ m and about 500 ⁇ m.
- the legs 330 may each include narrower members 340 connected at one end to a microconnector body 345 and at a second end to wider members 350 configured to grasp the manipulation probe.
- the narrower members 340 may each have a width ranging between about 5 ⁇ m and about 30 ⁇ m
- the wider members 350 may each have a width ranging between about 10 ⁇ m and about 100 ⁇ m.
- the microconnector 300 also includes a deflectable connection member 360 having at least one first end 365 coupled to the handle, possibly via the body 345 , as in the illustrated embodiment.
- the connection member 360 also includes at least one second end 367 configured to deflect and thereby engage a receptacle in response to disengagement of a manipulation probe from the handle 320 .
- the one or more second ends 367 may include a barb, hook, lip, extension, tab, and/or other means 368 (hereafter collectively referred to as a barb) for engaging, mating or otherwise interfacing with an edge, surface or barb of the receptacle.
- the one or more second ends 367 may also include a shoulder or other interface means 369 (hereafter collectively referred to as a shoulder) for engaging, mating or otherwise interfacing with an edge, surface or barb of the receptacle, in addition to or as an alternative to the barb 368 .
- a shoulder or other interface means 369 hereafter collectively referred to as a shoulder
- connection member 360 may include tapered surfaces 370 or other means for deflecting outward in response to translation of the manipulation probe away from a retained position within the handle 320 .
- the connection member 360 may also include an aperture 362 permitting removal of the manipulation probe after the microconnector 300 is secured to the receptacle.
- the width of the aperture 362 may be about equal to or at least slightly greater than a manipulation probe or tip thereof.
- the microconnector 300 may also include one or more anchor arms 380 coupled or integral to the body 345 and extending to a bearing plane, shoulder or other type of interface 385 configured to rest against a receptacle as a manipulation probe is translated from the handle 320 towards the aperture 362 .
- the microconnector 300 may also include a tether 310 configured to prevent inadvertent release of the microconnector 300 from the substrate 305 .
- the tether 310 Prior to microassembly of the microconnector 300 to another MEMS or NEMS component, the tether 310 may be severed to release the microconnector 300 from the substrate 305 .
- Such de-tethering of the microconnector 300 from the substrate 305 may be mechanical, such as by translating and/or rotating the microconnector 300 away from the susbtrate 305 until the tether 310 breaks, or by pressing against and/or slicing into the tether 310 with a probe or other object.
- the microconnector 300 may also be de-tethered electrically, such as by increasing a current flow through the tether 310 until the tether 310 severs, possibly by ohmic heating.
- the tether 310 may have a width ranging between about 5 ⁇ m and about 30 ⁇ m.
- the microconnector 300 may also include means for detecting when the microconnector 300 is fully engaged with a receptacle.
- the interface means 369 may include conductive contacts and/or other means which may close a circuit across anchor pads of the receptacle.
- the connection member 360 may be similarly or alternatively configured to close a circuit across the receptacle, thereby indicating engagement of the microconnector 300 and the receptacle.
- a perspective view of one embodiment of a receptacle 400 constructed according to aspects of the present disclosure illustrated is a perspective view of one embodiment of a receptacle 400 constructed according to aspects of the present disclosure.
- the receptacle 400 is substantially similar to the receptacle 120 shown in FIGS. 1, 2 a and 2 b.
- the receptacle 400 may be substantially similar in composition and manufacture to the microconnector 300 shown in FIG. 3 .
- the receptacle 400 and the microconnector 300 are defined in a common SCS layer over a common substrate 405 , possibly simultaneously.
- the receptacle 400 includes one, two or more deflectable retainers 410 .
- the retainers 410 each include one, two, or more legs 420 .
- the legs 420 each include a first end 425 coupled to the substrate 405 and a second end 427 configured to translate across the substrate 405 .
- the translation of the second ends 427 of the legs 420 across the substrate 405 may be in response to the travel of a portion of a microconnector (such as the second ends 367 of the microconnector 300 shown in FIG. 3 ) against tapered surfaces 428 of the second ends 427 .
- Each of the second ends 427 may also include a barb, hook, lip, extension, tab, and/or other means 429 (hereafter collectively referred to as a barb) for engaging, mating or otherwise interfacing with an edge, surface or barb of a microconnector.
- a barb for engaging, mating or otherwise interfacing with an edge, surface or barb of a microconnector.
- the receptacle 400 may also include one or more anchor pads 440 coupled or integral thereto.
- the anchor pads 440 may be configured to resist translation (e.g., provide a travel “stop”) of a microconnector as a manipulation probe is translated within a microconnector towards the receptacle 400 .
- the anchor pads 440 may be configured to interface with the anchor arm interfaces 385 shown in FIG. 3 .
- the receptacle 400 may also include an aperture 450 configured to receive a portion of a microconnector during microassembly.
- the aperture 450 may be sized to receive the ends 367 of the microconnector 300 shown in FIG. 3 .
- a microconnector may be inserted into the aperture 450 of the receptacle 400 until the anchor pads 440 stop translation of the microconnector into the receptacle 400 , such that further translation of a manipulation probe within the microconnector towards the receptacle 400 causes the retainers 410 to deflect and subsequently engage with the microconnector.
- FIG. 5 illustrated is a perspective view of one embodiment of a manipulation probe 500 that may be employed during microassembly according to aspects of the present disclosure.
- the manipulation probe 500 is substantially similar to the manipulation probe 210 shown in FIGS. 2 a and 2 b.
- the manipulation probe 500 may be substantially similar in composition and manufacture to the microconnector 300 shown in FIG. 3 .
- the manipulation probe 500 and the microconnector 300 (and possibly the retainer 400 shown in FIG. 4 ) are defined in a SCS layer over a common substrate, possibly simultaneously.
- the manipulation probe 500 includes a tip 510 extending from a body portion 515 .
- the tip 510 is configured to be retained by a microconnector without requiring powered actuation of the tip 510 or the microconnector.
- the tip 510 may be configured to be inserted into the handle 320 shown in FIG. 3 , thereby deflecting portions of the handle 320 , such that the handle 320 and the tip 510 may be frictionally engaged.
- the manipulation probe 500 may also include deflectable sensor members 520 .
- the sensor members 520 are thin members offset a short distance (e.g., about 100 microns or less) from the perimeter of the body 515 and coupled to the body 515 distal from the tip 510 . In this manner, the sensor members 520 may be deflected towards the body 515 upon insertion of the tip 510 into a microconnector. For example, a portion of a microconnector may bias the sensor members 520 towards the body 515 .
- the contact of the sensor members 520 with the body 515 may close an electrical circuit or otherwise provide an indication to a microassembly controller and/or operator that the tip 515 is inserted a distance into the microconnector sufficient for the manipulation probe 500 and the microconnector to be engaged.
- the manipulation probe 500 may also include probe pads, bond pads, or other contacts (hereafter collectively referred to as contacts) 530 for sensing contact of the sensor members 520 with the body 515 .
- the microassembly includes a microconnector 610 and one or more receptacles 620 .
- the microconnector 610 is substantially similar in composition and manufacture to the microconnector 300 shown in FIG. 3 .
- the microconnector 610 includes a plurality of deflectable connection members 630 which may each be substantially similar to the deflective connection member 160 of FIG. 3 .
- Each of the deflectable connection members 630 may be configured to engage or be engaged by a receptacle 620 .
- the microconnector 610 also includes one or more handles 640 configured to engage or be engaged by a manipulation probe.
- the microconnector 610 may include only one handle 640 (or only two handles 640 , such as where redundancy may be required). That is, each of the deflectable connection members 630 may be actuated by translation of a corresponding manipulation probe tip towards the receptacles 620 , although not all of the manipulation probe tips may be engaged by a handle 640 .
- the receptacles 620 may each be substantially similar to the receptacle 400 shown in FIG. 4 . However, in one embodiment, the receptacles 620 may be formed as a single, composite receptacle.
- the manipulation probe employed during microassembly of the microconnector 610 the receptacles 620 may have a number of tips corresponding to the number of deflectable connection members 630 . Otherwise, such a manipulation probe may be substantially similar to the manipulation probe 500 shown in FIG. 5 . However, a manipulation probe having fewer tips than the number of deflectable connection members 630 may also be employed during microassembly. For example, a manipulation probe including only one tip may be employed during the microassembly of a microconnector 610 having a plurality of connection members 630 . In one such embodiment, such as that illustrated in FIG.
- the handle 640 is employed to manipulate and position the microconnector 610 with a single manipulation probe tip engaged by the handle 640 , although the microconnector 610 includes 4 connection members 630 .
- the single probe tip may be employed to engage one of the connection members 630 of the microconnector 610 with the receptacle(s) 620 , such as by translating the probe tip away from the handle 640 and towards the receptacle(s) 620 . Thereafter, the probe tip may be repositioned into one of the remaining connection members 630 and again translated toward the receptacle(s) 620 to engage a second connection member 630 with the receptacle(s) 620 . This process may be repeated until each of the connection members 630 is engaged with the receptacle(s) 620 .
- FIGS. 7 a-c illustrated are perspective views of another embodiment of a microassembly 700 according to aspects of the present disclosure.
- the microassembly 700 includes two receptacles 710 oriented substantially parallel to a substrate 705 , two microconnectors 720 assembled to the receptacles 710 in an orientation that is substantially orthogonal to the substrate 705 , and a microconnector 730 assembled to the microconnectors 720 in an orientation that is substantially parallel to the substrate 705 .
- the receptacles 710 may each be substantially similar to the receptacle 400 shown in FIG. 4
- the microconnectors 720 may each be substantially similar to the microconnector 300 shown in FIG. 3
- the microconnectors 720 may also include deflectable members 725 that may each be substantially similar to the deflectable members 360 shown in FIG. 3 and/or the retainers 410 shown in FIG. 4 .
- the members 725 may be configured to deflect outward to allow the receipt and engagement of a portion of the microconnector 730 .
- the members 725 may be configured to engage protrusions 739 extending from the microconnector 730 .
- the microconnector 730 may include deflectable members configured to engage protrusions extending from the microconnectors 720 .
- the microconnectors 720 may be assembled to the receptacles 710 by a microassembly method that is substantially similar to the methods described above in reference to FIGS. 1, 2 a and 2 b.
- a manipulation probe 740 which may be employed during such microassembly may include a probe tip 745 having a wider portion 747 and a narrower portion 748 .
- the microconnector 730 may be substantially similar in composition and manufacture to the microconnector 300 shown in FIG. 3 .
- the microconnector 730 includes a handle 735 configured to receive, engage, and/or be engaged by the tip 745 of the manipulation probe 740 .
- the handle 735 may be substantially similar to the handle 320 shown in FIG. 3 .
- the handle 735 may include deflectable members 737 and an aperture 738 configured to receive and selectively retain the wider portion 747 of the manipulation probe tip 745 .
- the width of the wider portion 747 of the tip 745 may be about equal to or at least slightly greater than the width of the aperture 738
- the width of the narrower portion 748 of the tip 745 may be about equal to or at least slightly less than the width of the aperture 738 .
- the handle 735 and manipulation probe tip 745 are engaged such that the manipulation probe 740 may be translated, rotated, and otherwise manipulated to orient and align the microconnector 730 relative to the previously assembled microconnectors 720 , as shown in FIG. 7 a.
- the manipulation probe 740 may then be further translated towards the substrate 705 , such that the microconnector 730 and the microconnectors 720 become fully engaged, and the manipulation probe tip 745 may travel further into the aperture 738 of the microconnector 730 , as shown in FIG. 7 b.
- the manipulation probe 740 may be translated substantially parallel to the substrate 705 and removed through a wider portion of the microconnector aperture 738 , as shown in FIG. 7 c.
- a MEMS microconnector including a compliant handle and a deflectable connection member.
- the compliant handle is configured to frictionally engage a manipulation probe.
- the deflectable connection member includes a first end coupled to the handle and a second end configured to deflect and thereby engage a receptacle in response to disengagement of the manipulation probe from the handle.
- the present disclosure also provides a MEMS microconnector receptacle including a substrate, an aperture in the substrate configured to receive a microconnector in a pre-engaged orientation, and a deflectable retainer defined in the substrate.
- the deflectable retainer is configured to deflect away from a resting orientation in response to initial deflection of the microconnector, and is also configured to engage with the microconnector by returning towards the resting orientation in response to further deflection of the microconnector.
- the microassembly includes a receptacle and a microconnector.
- the receptacle includes an aperture and a deflectable retainer.
- the microconnector includes a compliant handle configured to frictionally engage a manipulation probe, and also includes a deflectable connection member configured to deflect in response to translation of the manipulation probe away from the compliant handle, thereby causing the receptacle deflectable retainer to deflect, such that the deflectable retainer and the deflectable connection member may become engaged.
- Another embodiment of a MEMS microassembly includes first and second substantially coplanar receptacles and first and second substantially parallel microconnectors coupled to the first and second receptacles, respectively. Such an embodiment also includes a third microconnector assembled to the first and second microconnectors and substantially parallel to the first and second receptacles. Assembly of the first and second microconnectors to the first and second receptacles, respectively, and of the third microconnector to the first and second microconnectors may also be achieved the engagement of deflectable connection members and deflectable retainers.
- the present disclosure also introduces a method of assembling MEMS components.
- the method includes frictionally engaging a microconnector with a manipulation probe, wherein the microconnector includes a deflectable connection member.
- the microconnector is oriented by manipulating the manipulation probe such that the connection member is proximate a receptacle, wherein the receptacle includes a deflectable retainer defining an aperture.
- a portion of the deflectable connection member is translated through the aperture by translating the manipulation probe until the microconnector contacts the receptacle.
- the manipulation probe is translated within the microconnector towards the receptacle to deflect the deflectable connection member and the deflectable retainer until the deflection of the deflectable retainer is allowed to decrease, the microconnector and the receptacle thereby becoming engaged.
- a method of manufacturing a MEMS microassembly includes defining a microconnector and a receptacle from a layer formed over a substrate, engaging frictionally the microconnector and a manipulation probe, and orienting the microconnector opposite the receptacle from the substrate by manipulating the manipulation probe.
- the microconnector is translated towards the receptacle by manipulating the manipulation probe until the microconnector contacts the receptacle.
- the manipulation probe is translated within the microconnector towards the receptacle, the microconnector and the receptacle thereby becoming engaged.
Abstract
Description
- This invention was made with the United States Government support under 70NANB1H3021 awarded by the National Institute of Standards and Technology (NIST). The United States Government has certain rights in the invention.
- The present disclosure relates generally to MEMS devices, more specifically, to non-powered MEMS microconnectors and microassembly therewith.
- Extraordinary advances are being made in micromechanical devices and microelectronic devices, including micro-electro-mechanical devices (MEMs), which comprise integrated micromechanical and microelectronic devices. The terms “microcomponent,” “microconnector,” “microdevice,” and “microassembly” are used herein generically to encompass microelectronic components, micromechanical components, MEMs components and assemblies thereof.
- Many methods and structures exist for coupling MEMs and other microcomponents together to form a microassembly. One such method, often referred to as “pick-and-place” assembly, is serial microassembly, wherein microcomponents are assembled one at a time in a serial fashion. For example, if a device is formed by coupling two microcomponents together, a gripper or other placing mechanism is used to pick up one of the two microcomponents and place it on a desired location of the other microcomponent. These pick-and-place processes, although seemingly quite simple, can present obstacles affecting assembly time, throughput and reliability.
- For example, pick-and-place processes often employ powered “grippers” having end effectors configured to expand and/or contract in response to energy received from an integral or external power source. However, structural fragility, increased packaging complexity, and uncertainties due to variations in actuator displacements limit the practical usefulness of employing such powered grippers during microassembly.
- Accordingly, what is needed in the art is a MEMS microconnector and a method of microassembly therewith that addresses the above-discussed issues.
- The present disclosure is best understood from the following detailed description when read with the accompanying figures. It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
-
FIG. 1 illustrates a perspective view of a portion of one embodiment of a microassembly according to aspects of the present disclosure. -
FIGS. 2 a and 2 b illustrate perspective views of intermediate stages of one embodiment of microassembly according to aspects of the present disclosure. -
FIG. 3 illustrates a perspective view of one embodiment of a microconnector according to aspects of the present disclosure. -
FIG. 4 illustrates a perspective view of one embodiment of a microconnector receptacle according to aspects of the present disclosure. -
FIG. 5 illustrates a perspective view of one embodiment of a manipulation probe according to aspects of the present disclosure. -
FIG. 6 illustrates a perspective view of another embodiment of a microassembly according to aspects of the present disclosure. -
FIGS. 7 a-c illustrate perspective views of another embodiment of a microassembly during intermediate stages of assembly according to aspects of the present disclosure. - It is to be understood that the following disclosure provides many different embodiments, or examples, for implementing different features of various embodiments. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Moreover, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed interposing the first and second features, such that the first and second features may not be in direct contact.
- Referring to
FIG. 1 , illustrated is a perspective view of a portion of one embodiment of amicroassembly 100 constructed according to aspects of the present disclosure. Themicroassembly 100 includes amicroconnector 110 assembled to areceptacle 120. A portion of anunoccupied receptacle 125 is also shown. In the illustrated embodiment, themicroconnector 110 has been assembled to thereceptacle 120 without the use of a powered gripper or other actuator. - The
microconnector 110 and thereceptacle 120 may be micro-electro-mechanical system (MEMS) components having feature dimensions that are less than about 1000 microns. Themicroconnector 110 and thereceptacle 120 may also be nano-electro-mechanical system (NEMS) components having feature dimensions that are less than about 10 microns. This convention may be generally applied to any microcomponent of the microassemblies described herein. For example, themicroassembly 100 and others described below may include MEMS components having feature dimensions that are less than about 1000 microns and/or NEMS components having feature dimensions that are less than about 10 microns. - The
receptacles substrate 105, and each include aretainer 130 which, at least in the embodiment shown, includes twolegs 140. Thelegs 140 are coupled to or otherwise affixed to thesubstrate 105 at oneend 142 and are free to translate across thesubstrate 105 at anotherend 144. Theends 144 havetapered surfaces 146, such that insertion of a portion of themicroconnector 110 therebetween causes thelegs 140 to deflect away from each other. Thereceptacles aperture 150 configured to receive a portion of themicroconnector 110, as well as one ormore anchor pads 155. - The
microconnector 110 includes adeflectable connection member 160 which, at least in the embodiment shown, includes twolegs 170. Thelegs 170 have a pre-engaged position in which they are configured to fit within theaperture 150. Once oriented within theaperture 150, thelegs 170 may be configured to deflect away from each other to each engage and/or be engaged by a corresponding pair of receptacle legs 140 (as in the orientation shown inFIG. 1 ). In one embodiment, thelegs 170 includetapered surfaces 175 to enable such deflection of thelegs 170. Themicroconnector 110 also includes one ormore anchor arms 180 configured to stop or rest against one or morecorresponding anchor pads 155. - Referring to
FIGS. 2 a and 2 b, with continued reference toFIG. 1 , illustrated are perspective views of themicroassembly 100 shown inFIG. 1 during intermediate stages of assembly. InFIG. 2 a, themicroconnector 110 has been retained by amanipulation probe 210. Themicroconnector 110 may include acompliant handle 220 configured to deflect as themanipulation probe 210 is inserted, and themanipulation probe 210 may have a profile that allows it to be inserted into thecompliant handle 220 by translation in one or more directions. Thecompliant handle 220 may include two or more members configured to deflect away from each other or towards each other, depending on the shape of themanipulation probe 210. - After engaging the
microconnector 110 with themanipulation probe 210, themicroconnector 110 may be oriented as necessary for pre-assembly alignment with thereceptacle 120. Such orientation may include translation and/or rotation relative to thesubstrate 105. For example, in the illustrated embodiment, themanipulation probe 210 may have been employed to remove themicroconnector 110 from a configuration substantially parallel to that of thereceptacle 120 and, thereafter, rotate themicroconnector 110 about 90 degrees relative to thesubstrate 105 and align themicroconnector 110 over thereceptacle 120. In other embodiments, substantial parallelism of themicroconnector 110 and thereceptacle 120 may be maintained while themanipulation probe 210 orients themicroconnector 110 relative to thereceptacle 120. - As shown in
FIG. 2 b, themanipulation probe 210 may be manipulated to bring themicroconnector 110 and thereceptacle 120 into contact with each other. As discussed above, themicroconnector 110 may includelegs 170 configured to be received within anaperture 150 in thereceptacle 120 as themicroconnector anchor arms 180 are brought into contact withreceptacle anchor pads 155. Thereafter, themanipulation probe 210 may be further translated towards thereceptacle 120, whereby such further translation may cause themicroconnector legs 170 and thereceptacle legs 140 to each deflect outwards until they are allowed to engage each other. Themanipulation probe 210 may then be translated out of thehandle 220 and then substantially parallel to thesubstrate 105 to remove theprobe 210 from themicroconnector 110, wherein themicroconnector 110 may remain assembled to thereceptacle 120. - Referring to
FIG. 3 , illustrated is a perspective view of one embodiment of amicroconnector 300 constructed according to aspects of the present disclosure. In one embodiment, themicroconnector 300 is substantially similar to themicroconnector 110 shown inFIGS. 1, 2 a and 2 b. - The
microconnector 300 may be defined in a single-crystalline silicon (SCS) layer, possibly having a thickness ranging between about 25 μm and about 200 μm. The SCS layer may be located over a sacrificial layer formed over asubstrate 305, wherein the sacrificial layer may comprise oxide and/or other materials and may have a thickness ranging between about 1 μm and about 30 μm. One or more deep reactive ion etching (DRIE) processes and/or other processes may be employed to define themicroconnector 300 from the SCS layer. Such a manufacturing process flow may include a backside DRIE through thesubstrate 305 or a handle portion thereof. In-plane electrical isolation may be achieved by trenches formed in the SCS layer and filled with nitride and/or another electrically insulating material. - The
microconnector 300 is released from thesubstrate 305 after fabrication and prior to assembly. Such a release process may employ a wet-etch of the sacrificial layer, possibly employing a 49% HF solution or other etchant chemistry. Themicroconnector 300 may also include atether 310 defined in the SCS layer, such that themicroconnector 300 does not become completely detached from thesubstrate 305 during the release process. - The
microconnector 300 includes ahandle 320 configured to frictionally engage a manipulation probe, such as theprobe 210 shown inFIG. 2 . In one embodiment, thehandle 320 is defined in the SCS layer as having two or morecompliant legs 330 configured to deflect away from each other in response to insertion of the manipulation probe. Thus, thehandle 320 may be a compliant handle. Thelegs 330 may be formed separated from each other by a distance about equal to or at least slightly less than the width of the manipulation probe tip or other portion configured to be grasped by thelegs 330. In one embodiment, such separation between thelegs 330 may range between about 25 μm and about 300 μm. Although not limited by the scope of the present disclosure, thelegs 330 may have a length ranging between about 50 μm and about 500 μm. - As in the illustrated embodiment, the legs 330 (or perhaps one or more other portions of the handle 320) may each include
narrower members 340 connected at one end to amicroconnector body 345 and at a second end towider members 350 configured to grasp the manipulation probe. Thenarrower members 340 may each have a width ranging between about 5 μm and about 30 μm, and thewider members 350 may each have a width ranging between about 10 μm and about 100 μm. - The
microconnector 300 also includes adeflectable connection member 360 having at least onefirst end 365 coupled to the handle, possibly via thebody 345, as in the illustrated embodiment. Theconnection member 360 also includes at least onesecond end 367 configured to deflect and thereby engage a receptacle in response to disengagement of a manipulation probe from thehandle 320. The one or more second ends 367 may include a barb, hook, lip, extension, tab, and/or other means 368 (hereafter collectively referred to as a barb) for engaging, mating or otherwise interfacing with an edge, surface or barb of the receptacle. The one or more second ends 367 may also include a shoulder or other interface means 369 (hereafter collectively referred to as a shoulder) for engaging, mating or otherwise interfacing with an edge, surface or barb of the receptacle, in addition to or as an alternative to thebarb 368. - The
connection member 360 may include taperedsurfaces 370 or other means for deflecting outward in response to translation of the manipulation probe away from a retained position within thehandle 320. Theconnection member 360 may also include anaperture 362 permitting removal of the manipulation probe after themicroconnector 300 is secured to the receptacle. The width of theaperture 362 may be about equal to or at least slightly greater than a manipulation probe or tip thereof. Themicroconnector 300 may also include one ormore anchor arms 380 coupled or integral to thebody 345 and extending to a bearing plane, shoulder or other type ofinterface 385 configured to rest against a receptacle as a manipulation probe is translated from thehandle 320 towards theaperture 362. - As described above, the
microconnector 300 may also include atether 310 configured to prevent inadvertent release of the microconnector 300 from thesubstrate 305. Prior to microassembly of themicroconnector 300 to another MEMS or NEMS component, thetether 310 may be severed to release the microconnector 300 from thesubstrate 305. Such de-tethering of the microconnector 300 from thesubstrate 305 may be mechanical, such as by translating and/or rotating themicroconnector 300 away from thesusbtrate 305 until thetether 310 breaks, or by pressing against and/or slicing into thetether 310 with a probe or other object. Themicroconnector 300 may also be de-tethered electrically, such as by increasing a current flow through thetether 310 until thetether 310 severs, possibly by ohmic heating. Thetether 310 may have a width ranging between about 5 μm and about 30 μm. - Although not shown in the illustrated embodiment, the
microconnector 300 may also include means for detecting when themicroconnector 300 is fully engaged with a receptacle. For example, the interface means 369 may include conductive contacts and/or other means which may close a circuit across anchor pads of the receptacle. In one embodiment, theconnection member 360 may be similarly or alternatively configured to close a circuit across the receptacle, thereby indicating engagement of themicroconnector 300 and the receptacle. - Referring to
FIG. 4 , illustrated is a perspective view of one embodiment of areceptacle 400 constructed according to aspects of the present disclosure. In one embodiment, thereceptacle 400 is substantially similar to thereceptacle 120 shown inFIGS. 1, 2 a and 2 b. Thereceptacle 400 may be substantially similar in composition and manufacture to themicroconnector 300 shown inFIG. 3 . In one embodiment, thereceptacle 400 and themicroconnector 300 are defined in a common SCS layer over acommon substrate 405, possibly simultaneously. - The
receptacle 400 includes one, two or moredeflectable retainers 410. Theretainers 410 each include one, two, ormore legs 420. Thelegs 420 each include afirst end 425 coupled to thesubstrate 405 and asecond end 427 configured to translate across thesubstrate 405. The translation of the second ends 427 of thelegs 420 across thesubstrate 405 may be in response to the travel of a portion of a microconnector (such as the second ends 367 of themicroconnector 300 shown inFIG. 3 ) against taperedsurfaces 428 of the second ends 427. Each of the second ends 427 may also include a barb, hook, lip, extension, tab, and/or other means 429 (hereafter collectively referred to as a barb) for engaging, mating or otherwise interfacing with an edge, surface or barb of a microconnector. - The
receptacle 400 may also include one ormore anchor pads 440 coupled or integral thereto. Theanchor pads 440 may be configured to resist translation (e.g., provide a travel “stop”) of a microconnector as a manipulation probe is translated within a microconnector towards thereceptacle 400. For example, theanchor pads 440 may be configured to interface with the anchor arm interfaces 385 shown inFIG. 3 . - The
receptacle 400 may also include anaperture 450 configured to receive a portion of a microconnector during microassembly. For example, theaperture 450 may be sized to receive theends 367 of themicroconnector 300 shown inFIG. 3 . Thus, a microconnector may be inserted into theaperture 450 of thereceptacle 400 until theanchor pads 440 stop translation of the microconnector into thereceptacle 400, such that further translation of a manipulation probe within the microconnector towards thereceptacle 400 causes theretainers 410 to deflect and subsequently engage with the microconnector. - Referring to
FIG. 5 , illustrated is a perspective view of one embodiment of amanipulation probe 500 that may be employed during microassembly according to aspects of the present disclosure. In one embodiment, themanipulation probe 500 is substantially similar to themanipulation probe 210 shown inFIGS. 2 a and 2 b. Themanipulation probe 500 may be substantially similar in composition and manufacture to themicroconnector 300 shown inFIG. 3 . In one embodiment, themanipulation probe 500 and the microconnector 300 (and possibly theretainer 400 shown inFIG. 4 ) are defined in a SCS layer over a common substrate, possibly simultaneously. - In the illustrated embodiment, the
manipulation probe 500 includes atip 510 extending from abody portion 515. Thetip 510 is configured to be retained by a microconnector without requiring powered actuation of thetip 510 or the microconnector. For example, thetip 510 may be configured to be inserted into thehandle 320 shown inFIG. 3 , thereby deflecting portions of thehandle 320, such that thehandle 320 and thetip 510 may be frictionally engaged. - The
manipulation probe 500 may also includedeflectable sensor members 520. In the illustrated embodiment, thesensor members 520 are thin members offset a short distance (e.g., about 100 microns or less) from the perimeter of thebody 515 and coupled to thebody 515 distal from thetip 510. In this manner, thesensor members 520 may be deflected towards thebody 515 upon insertion of thetip 510 into a microconnector. For example, a portion of a microconnector may bias thesensor members 520 towards thebody 515. Consequently, the contact of thesensor members 520 with thebody 515 may close an electrical circuit or otherwise provide an indication to a microassembly controller and/or operator that thetip 515 is inserted a distance into the microconnector sufficient for themanipulation probe 500 and the microconnector to be engaged. Themanipulation probe 500 may also include probe pads, bond pads, or other contacts (hereafter collectively referred to as contacts) 530 for sensing contact of thesensor members 520 with thebody 515. - Referring to
FIG. 6 , illustrated is perspective view of another embodiment of a microassembly 600 according to aspects of the present disclosure. The microassembly includes amicroconnector 610 and one ormore receptacles 620. Themicroconnector 610 is substantially similar in composition and manufacture to themicroconnector 300 shown inFIG. 3 . However, themicroconnector 610 includes a plurality ofdeflectable connection members 630 which may each be substantially similar to thedeflective connection member 160 ofFIG. 3 . Each of thedeflectable connection members 630 may be configured to engage or be engaged by areceptacle 620. Themicroconnector 610 also includes one ormore handles 640 configured to engage or be engaged by a manipulation probe. However, as in the illustrated embodiment, themicroconnector 610 may include only one handle 640 (or only twohandles 640, such as where redundancy may be required). That is, each of thedeflectable connection members 630 may be actuated by translation of a corresponding manipulation probe tip towards thereceptacles 620, although not all of the manipulation probe tips may be engaged by ahandle 640. - The
receptacles 620 may each be substantially similar to thereceptacle 400 shown inFIG. 4 . However, in one embodiment, thereceptacles 620 may be formed as a single, composite receptacle. - The manipulation probe employed during microassembly of the
microconnector 610 thereceptacles 620 may have a number of tips corresponding to the number ofdeflectable connection members 630. Otherwise, such a manipulation probe may be substantially similar to themanipulation probe 500 shown inFIG. 5 . However, a manipulation probe having fewer tips than the number ofdeflectable connection members 630 may also be employed during microassembly. For example, a manipulation probe including only one tip may be employed during the microassembly of amicroconnector 610 having a plurality ofconnection members 630. In one such embodiment, such as that illustrated inFIG. 6 , thehandle 640 is employed to manipulate and position themicroconnector 610 with a single manipulation probe tip engaged by thehandle 640, although themicroconnector 610 includes 4connection members 630. Once positioned, the single probe tip may be employed to engage one of theconnection members 630 of themicroconnector 610 with the receptacle(s) 620, such as by translating the probe tip away from thehandle 640 and towards the receptacle(s) 620. Thereafter, the probe tip may be repositioned into one of the remainingconnection members 630 and again translated toward the receptacle(s) 620 to engage asecond connection member 630 with the receptacle(s) 620. This process may be repeated until each of theconnection members 630 is engaged with the receptacle(s) 620. - Referring to FIGS. 7a-c collectively, illustrated are perspective views of another embodiment of a microassembly 700 according to aspects of the present disclosure. The
microassembly 700 includes tworeceptacles 710 oriented substantially parallel to asubstrate 705, twomicroconnectors 720 assembled to thereceptacles 710 in an orientation that is substantially orthogonal to thesubstrate 705, and amicroconnector 730 assembled to themicroconnectors 720 in an orientation that is substantially parallel to thesubstrate 705. - The
receptacles 710 may each be substantially similar to thereceptacle 400 shown inFIG. 4 , and themicroconnectors 720 may each be substantially similar to themicroconnector 300 shown inFIG. 3 . However, themicroconnectors 720 may also includedeflectable members 725 that may each be substantially similar to thedeflectable members 360 shown inFIG. 3 and/or theretainers 410 shown inFIG. 4 . For example, themembers 725 may be configured to deflect outward to allow the receipt and engagement of a portion of themicroconnector 730. Themembers 725 may be configured to engage protrusions 739 extending from themicroconnector 730. In another embodiment, themicroconnector 730 may include deflectable members configured to engage protrusions extending from themicroconnectors 720. Themicroconnectors 720 may be assembled to thereceptacles 710 by a microassembly method that is substantially similar to the methods described above in reference toFIGS. 1, 2 a and 2 b. Amanipulation probe 740 which may be employed during such microassembly may include aprobe tip 745 having awider portion 747 and anarrower portion 748. - The
microconnector 730 may be substantially similar in composition and manufacture to themicroconnector 300 shown inFIG. 3 . In the illustrated embodiment, themicroconnector 730 includes ahandle 735 configured to receive, engage, and/or be engaged by thetip 745 of themanipulation probe 740. Thehandle 735 may be substantially similar to thehandle 320 shown inFIG. 3 . For example, thehandle 735 may includedeflectable members 737 and anaperture 738 configured to receive and selectively retain thewider portion 747 of themanipulation probe tip 745. Thus, in one embodiment, the width of thewider portion 747 of thetip 745 may be about equal to or at least slightly greater than the width of theaperture 738, and the width of thenarrower portion 748 of thetip 745 may be about equal to or at least slightly less than the width of theaperture 738. - During microassembly, the
handle 735 andmanipulation probe tip 745 are engaged such that themanipulation probe 740 may be translated, rotated, and otherwise manipulated to orient and align themicroconnector 730 relative to the previously assembledmicroconnectors 720, as shown inFIG. 7 a. Themanipulation probe 740 may then be further translated towards thesubstrate 705, such that themicroconnector 730 and themicroconnectors 720 become fully engaged, and themanipulation probe tip 745 may travel further into theaperture 738 of themicroconnector 730, as shown inFIG. 7 b. - After the
wider portion 747 of themanipulation probe tip 745 travels through themicroconnector 730, as shown inFIG. 7 b, themanipulation probe 740 may be translated substantially parallel to thesubstrate 705 and removed through a wider portion of themicroconnector aperture 738, as shown inFIG. 7 c. - Thus, the present disclosure introduces a MEMS microconnector including a compliant handle and a deflectable connection member. The compliant handle is configured to frictionally engage a manipulation probe. The deflectable connection member includes a first end coupled to the handle and a second end configured to deflect and thereby engage a receptacle in response to disengagement of the manipulation probe from the handle.
- The present disclosure also provides a MEMS microconnector receptacle including a substrate, an aperture in the substrate configured to receive a microconnector in a pre-engaged orientation, and a deflectable retainer defined in the substrate. The deflectable retainer is configured to deflect away from a resting orientation in response to initial deflection of the microconnector, and is also configured to engage with the microconnector by returning towards the resting orientation in response to further deflection of the microconnector.
- A MEMS microassembly is also provided in the present disclosure. In one embodiment, the microassembly includes a receptacle and a microconnector. The receptacle includes an aperture and a deflectable retainer. The microconnector includes a compliant handle configured to frictionally engage a manipulation probe, and also includes a deflectable connection member configured to deflect in response to translation of the manipulation probe away from the compliant handle, thereby causing the receptacle deflectable retainer to deflect, such that the deflectable retainer and the deflectable connection member may become engaged.
- Another embodiment of a MEMS microassembly according to aspects of the present disclosure includes first and second substantially coplanar receptacles and first and second substantially parallel microconnectors coupled to the first and second receptacles, respectively. Such an embodiment also includes a third microconnector assembled to the first and second microconnectors and substantially parallel to the first and second receptacles. Assembly of the first and second microconnectors to the first and second receptacles, respectively, and of the third microconnector to the first and second microconnectors may also be achieved the engagement of deflectable connection members and deflectable retainers.
- The present disclosure also introduces a method of assembling MEMS components. In one embodiment, the method includes frictionally engaging a microconnector with a manipulation probe, wherein the microconnector includes a deflectable connection member. The microconnector is oriented by manipulating the manipulation probe such that the connection member is proximate a receptacle, wherein the receptacle includes a deflectable retainer defining an aperture. A portion of the deflectable connection member is translated through the aperture by translating the manipulation probe until the microconnector contacts the receptacle. The manipulation probe is translated within the microconnector towards the receptacle to deflect the deflectable connection member and the deflectable retainer until the deflection of the deflectable retainer is allowed to decrease, the microconnector and the receptacle thereby becoming engaged.
- A method of manufacturing a MEMS microassembly is also introduced in the present disclosure. In one embodiment, the method includes defining a microconnector and a receptacle from a layer formed over a substrate, engaging frictionally the microconnector and a manipulation probe, and orienting the microconnector opposite the receptacle from the substrate by manipulating the manipulation probe. The microconnector is translated towards the receptacle by manipulating the manipulation probe until the microconnector contacts the receptacle. The manipulation probe is translated within the microconnector towards the receptacle, the microconnector and the receptacle thereby becoming engaged.
- The foregoing has outlined features of several embodiments so that those skilled in the art may better understand the detailed description that follows. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.
Claims (40)
Priority Applications (6)
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CN2005100628134A CN1654310B (en) | 2004-02-13 | 2005-02-07 | Microconnectors ,microconnector sockets, microassembly and as well as assemby and manufacture method thereof |
EP05002767A EP1564183A3 (en) | 2004-02-13 | 2005-02-10 | Microconnectors and non-powered microassembly therewith |
KR1020050011600A KR101081634B1 (en) | 2004-02-13 | 2005-02-11 | Microconnectors and non-powered microassembly therewith |
JP2005035386A JP2005276816A (en) | 2004-02-13 | 2005-02-14 | Micro connector and non-powered microassembly with micro connector |
US11/074,448 US7025619B2 (en) | 2004-02-13 | 2005-03-08 | Sockets for microassembly |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100095368A1 (en) * | 2007-06-25 | 2010-04-15 | Niu Weiguo | Home node b access control method and system |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7096568B1 (en) | 2003-07-10 | 2006-08-29 | Zyvex Corporation | Method of manufacturing a microcomponent assembly |
US7025619B2 (en) * | 2004-02-13 | 2006-04-11 | Zyvex Corporation | Sockets for microassembly |
US7081630B2 (en) * | 2004-03-12 | 2006-07-25 | Zyvex Corporation | Compact microcolumn for automated assembly |
US6956219B2 (en) * | 2004-03-12 | 2005-10-18 | Zyvex Corporation | MEMS based charged particle deflector design |
US7314382B2 (en) | 2005-05-18 | 2008-01-01 | Zyvex Labs, Llc | Apparatus and methods of manufacturing and assembling microscale and nanoscale components and assemblies |
US7647848B2 (en) * | 2005-11-29 | 2010-01-19 | Drexel University | Integrated system for simultaneous inspection and manipulation |
US7605377B2 (en) * | 2006-10-17 | 2009-10-20 | Zyvex Corporation | On-chip reflectron and ion optics |
US8150526B2 (en) | 2009-02-09 | 2012-04-03 | Nano-Retina, Inc. | Retinal prosthesis |
US8706243B2 (en) | 2009-02-09 | 2014-04-22 | Rainbow Medical Ltd. | Retinal prosthesis techniques |
US8718784B2 (en) | 2010-01-14 | 2014-05-06 | Nano-Retina, Inc. | Penetrating electrodes for retinal stimulation |
US8442641B2 (en) | 2010-08-06 | 2013-05-14 | Nano-Retina, Inc. | Retinal prosthesis techniques |
US8428740B2 (en) | 2010-08-06 | 2013-04-23 | Nano-Retina, Inc. | Retinal prosthesis techniques |
US8571669B2 (en) | 2011-02-24 | 2013-10-29 | Nano-Retina, Inc. | Retinal prosthesis with efficient processing circuits |
WO2012162798A1 (en) | 2011-06-03 | 2012-12-06 | The Governing Council Of The University Of Toronto | Micro-nano tools with changeable tips for micro-nano manipulation |
US9370417B2 (en) | 2013-03-14 | 2016-06-21 | Nano-Retina, Inc. | Foveated retinal prosthesis |
US9474902B2 (en) | 2013-12-31 | 2016-10-25 | Nano Retina Ltd. | Wearable apparatus for delivery of power to a retinal prosthesis |
US9331791B2 (en) | 2014-01-21 | 2016-05-03 | Nano Retina Ltd. | Transfer of power and data |
WO2018050965A1 (en) * | 2016-09-14 | 2018-03-22 | Aalto University Foundation Sr | An accelerometer device and method for manufacturing the accelerometer device |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4963748A (en) * | 1988-06-06 | 1990-10-16 | Arizona Technology Development Corporation (Atdc) | Composite multipurpose multipole electrostatic optical structure and a synthesis method for minimizing aberrations |
US5122663A (en) * | 1991-07-24 | 1992-06-16 | International Business Machine Corporation | Compact, integrated electron beam imaging system |
US5963788A (en) * | 1995-09-06 | 1999-10-05 | Sandia Corporation | Method for integrating microelectromechanical devices with electronic circuitry |
US6103399A (en) * | 1995-03-10 | 2000-08-15 | Elisabeth Smela | Method for the manufacturing of micromachined structures and a micromachined structure manufactured using such method |
US6219254B1 (en) * | 1999-04-05 | 2001-04-17 | Trw Inc. | Chip-to-board connection assembly and method therefor |
US6300156B1 (en) * | 2000-04-07 | 2001-10-09 | Agere Systems Optoelectronics Guardian Corp. | Process for fabricating micromechanical devices |
US6398280B1 (en) * | 2000-05-11 | 2002-06-04 | Zyvex Corporation | Gripper and complementary handle for use with microcomponents |
US20020125208A1 (en) * | 1999-10-01 | 2002-09-12 | Delphi Technologies, Inc. | MEMS sensor structure and microfabrication process therefor |
US6561725B1 (en) * | 2000-08-21 | 2003-05-13 | Zyvex Corporation | System and method for coupling microcomponents utilizing a pressure fitting receptacle |
US6672795B1 (en) * | 2000-05-11 | 2004-01-06 | Zyvex Corporation | System and method for coupling microcomponents |
US6745567B1 (en) * | 2001-12-28 | 2004-06-08 | Zyvex Corporation | System and method for positional movement of microcomponents |
US6762116B1 (en) * | 2002-06-12 | 2004-07-13 | Zyvex Corporation | System and method for fabricating microcomponent parts on a substrate having pre-fabricated electronic circuitry thereon |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2875076B2 (en) * | 1990-11-29 | 1999-03-24 | 三井化学株式会社 | Flexible wiring board |
JP2796622B2 (en) * | 1996-03-07 | 1998-09-10 | セイコーインスツルメンツ株式会社 | Fine processing method and fine processing structure |
US5774956A (en) * | 1997-01-24 | 1998-07-07 | Michaels Of Oregon Co. | High-security buckle |
CN1558868A (en) * | 2001-11-29 | 2004-12-29 | �Ĺ���������ʽ���� | Nano gripper and method of manufacturing thereof |
-
2004
- 2004-02-13 US US10/778,460 patent/US6923669B1/en not_active Expired - Fee Related
-
2005
- 2005-02-07 CN CN2005100628134A patent/CN1654310B/en not_active Expired - Fee Related
- 2005-02-10 EP EP05002767A patent/EP1564183A3/en not_active Withdrawn
- 2005-02-11 KR KR1020050011600A patent/KR101081634B1/en not_active IP Right Cessation
- 2005-02-14 JP JP2005035386A patent/JP2005276816A/en active Pending
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4963748A (en) * | 1988-06-06 | 1990-10-16 | Arizona Technology Development Corporation (Atdc) | Composite multipurpose multipole electrostatic optical structure and a synthesis method for minimizing aberrations |
US5122663A (en) * | 1991-07-24 | 1992-06-16 | International Business Machine Corporation | Compact, integrated electron beam imaging system |
US6103399A (en) * | 1995-03-10 | 2000-08-15 | Elisabeth Smela | Method for the manufacturing of micromachined structures and a micromachined structure manufactured using such method |
US5963788A (en) * | 1995-09-06 | 1999-10-05 | Sandia Corporation | Method for integrating microelectromechanical devices with electronic circuitry |
US6219254B1 (en) * | 1999-04-05 | 2001-04-17 | Trw Inc. | Chip-to-board connection assembly and method therefor |
US20020125208A1 (en) * | 1999-10-01 | 2002-09-12 | Delphi Technologies, Inc. | MEMS sensor structure and microfabrication process therefor |
US6300156B1 (en) * | 2000-04-07 | 2001-10-09 | Agere Systems Optoelectronics Guardian Corp. | Process for fabricating micromechanical devices |
US6398280B1 (en) * | 2000-05-11 | 2002-06-04 | Zyvex Corporation | Gripper and complementary handle for use with microcomponents |
US6672795B1 (en) * | 2000-05-11 | 2004-01-06 | Zyvex Corporation | System and method for coupling microcomponents |
US6561725B1 (en) * | 2000-08-21 | 2003-05-13 | Zyvex Corporation | System and method for coupling microcomponents utilizing a pressure fitting receptacle |
US6745567B1 (en) * | 2001-12-28 | 2004-06-08 | Zyvex Corporation | System and method for positional movement of microcomponents |
US6762116B1 (en) * | 2002-06-12 | 2004-07-13 | Zyvex Corporation | System and method for fabricating microcomponent parts on a substrate having pre-fabricated electronic circuitry thereon |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100095368A1 (en) * | 2007-06-25 | 2010-04-15 | Niu Weiguo | Home node b access control method and system |
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CN1654310A (en) | 2005-08-17 |
EP1564183A2 (en) | 2005-08-17 |
CN1654310B (en) | 2012-01-04 |
EP1564183A3 (en) | 2010-12-15 |
KR20060041862A (en) | 2006-05-12 |
JP2005276816A (en) | 2005-10-06 |
US6923669B1 (en) | 2005-08-02 |
KR101081634B1 (en) | 2011-11-09 |
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