US20050257912A1 - Laser cooling system and method - Google Patents

Laser cooling system and method Download PDF

Info

Publication number
US20050257912A1
US20050257912A1 US11/033,496 US3349605A US2005257912A1 US 20050257912 A1 US20050257912 A1 US 20050257912A1 US 3349605 A US3349605 A US 3349605A US 2005257912 A1 US2005257912 A1 US 2005257912A1
Authority
US
United States
Prior art keywords
cooling
folded sheet
fins
flat portions
cooling face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/033,496
Inventor
Nathan Monty
Kenneth Lind
Kevin Armbruster
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Videojet Technologies Inc
Original Assignee
LiteLaser LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LiteLaser LLC filed Critical LiteLaser LLC
Priority to US11/033,496 priority Critical patent/US20050257912A1/en
Assigned to LITELASER LLC reassignment LITELASER LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIND, KENNETH A., ARMBRUSTER, KEVIN L., MONTY, NATHAN P.
Publication of US20050257912A1 publication Critical patent/US20050257912A1/en
Assigned to VIDEOJET TECHNOLOGIES reassignment VIDEOJET TECHNOLOGIES ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LITELASER LLC
Abandoned legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/04Arrangements for thermal management
    • H01S3/0404Air- or gas cooling, e.g. by dry nitrogen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/04Arrangements for thermal management
    • H01S3/0405Conductive cooling, e.g. by heat sinks or thermo-electric elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/04Arrangements for thermal management
    • H01S3/0407Liquid cooling, e.g. by water

Definitions

  • the present invention relates to lasers, more particularly to providing lasers with suitable cooling fins.
  • Typical cooling of a laser utilizes cooling fin arrays coupled with fans to convect heat away from the laser.
  • the fins are typically milled into the body of the laser housing or are part of an extruded heat sink that is bolted to the laser body. In either case the milling or extruding limits the size, pitch and shape of the resulting fins. In particular, heat transfer is largely dependent on the heat transfer surface area.
  • the pitch of the fins i.e. the number of fins per unit distance, is limited by the milling tool size.
  • the extrusion process has limits on fin width, fin pitch and the fin width to length ratio.
  • FIG. 1 illustrates a conventional laser package 100 , having a laser module 110 with an associated laser beam 190 also being illustrated.
  • the laser module 110 has a cooling face 115 on one side from which an array of cooling fins 105 extends.
  • the cooling fins 105 serve to conduct heat away from the laser module 110 .
  • the heat from the fins 105 is convected away via a fluid flow indicated by arrows 150 and 155 , which may typically be a flow of air or water.
  • the construction of the fin array as a flat, parallel set of fins means that the fluid flow remains substantially laminar as it passes over the fins 105 .
  • the heat transfer characteristics of the cooling system are important for the operation of the laser. For example, provision of a better heat transfer mechanism could allow either improved laser operating characteristics to be obtained or a more compact cooling system to be provided.
  • a laser system comprising: a laser module having a cooling face; and heat exchange element constructed as at least one folded sheet of thermally conductive material comprising a plurality of flat portions connected in thermal contact with the cooling face, and a plurality of interconnecting portions extending between the flat portions and away from the cooling face to form cooling fins.
  • the folded sheet as a basis for the cooling fins is not only highly convenient from an assembly point of view, and inexpensive, but also provides for highly effective heat exchange away from the laser module.
  • the folded sheet can be attached to the laser module cooling face with a large area of good thermal contact via its flat portions.
  • the fins formed by the interconnecting portions of the sheet can present a high-drag to a fluid flow being forced past the fins by a fan or pump, thereby inducing significant turbulence which is an aid to carrying heat away from the fins.
  • a highly efficient heat exchanger can be provided in a small size.
  • the thermally conductive material which the folded sheet is made of will be a metal, most preferably aluminum.
  • Another suitable metal is copper which has a high thermal conductivity but is more expensive and more difficult to work with. Other materials could also be used.
  • the interconnecting portions may be two or more flat portions separated by folds, or may be a single bowed portion.
  • the interconnecting portions may be formed of two flat portions, then the fins will have a generally triangular profile.
  • Another example is when the interconnecting portions are formed of three flat portions to provide a trapezoidal profile. In this case, the middle flat portion may be parallel to the cooling face.
  • the cooling fins can be formed from a flat sheet by a punching process known as lancing.
  • the cooling fins may be referred to as lanced offset fins.
  • the cooling fins extend in a plurality of strips arranged alongside each other such that the cooling fins in adjacent ones of the strips are offset from one another.
  • This staggered fin design can further increase turbulent flow, thereby further increasing the thermal transfer efficiency between the fins and the cooling fluid.
  • Multiple strips of mis-aligned cooling fins can be manufactured using a separate sheet for each strip, or by forming multiple strips in one sheet. In the latter case, the fin pattern can be created from a flat sheet using lancing by stretching or otherwise moving the sheet between lancing steps to produce the desired offset between adjacent strips. If the offset is 50% (i.e. half a period) and the fins extend over a length roughly equal to the length of the flat portions, then after the lancing adjacent strips are barely connected, and the sheet can be considered to have two sets of aligned strips interleaved with one another.
  • the flat portions are preferably connected to the cooling face with a bond, such as with a thermally conductive adhesive (e.g. epoxy resin) or a brazing solder.
  • a thermally conductive adhesive e.g. epoxy resin
  • the interconnecting portions are apertured. Single or multiple apertures may be provided in each interconnecting portion as desired. These apertures further assist cooling by facilitating turbulence in fluid flowing past the fins.
  • a method of assembling a laser package comprising: providing a laser module having a cooling face; providing a folded sheet of thermally conductive material comprising a plurality of flat portions arrangeable on a common plane and a plurality of interconnecting portions extending between the flat portions and away from the common plane to form fins; and bonding the flat portions of the folded sheet to the cooling face so that the folded sheet forms a heat exchange element for the laser module with the interconnecting portions extending away from the cooling face to form cooling fins.
  • This method of assembly is particularly convenient and efficient. In this way, the folded sheet can be simply offered up and attached to the laser module in a single step.
  • the best mode is to place a thermally conductive adhesive between the cooling face and the flat portions of the folded sheet.
  • An alternative is to use brazing solder instead.
  • a further significant advantage of using a folded sheet is that the folded sheet can be provided so that it is extensible and compressible by its interconnecting portions.
  • the folded sheet can then be extended or compressed by a desired amount before bonding it to the cooling face in its extended or compressed state.
  • This allows adjustment of the fin spacing, and the distance of maximum extent of the fins from the cooling face.
  • This kind of freedom is not possible with a conventional fin array where the fin size and pitch is fixed at the time of manufacture of the fin array. It is possible to exploit this design freedom by varying the fin spacing according to the cooling requirements.
  • the fin spacing can be varied along a single sheet by different degrees of extension or compression along different portions, for example to provide different cooling capacity along the length of a cooling face to take account of hot spots.
  • the folded sheet is thus extended or compressed by different amounts along different sections thereof so that the flat portions are separated by different amounts in the different sections.
  • FIG. 1 is an illustration of a conventional laser with an attached cooling fin array according to the prior art
  • FIG. 2 is an illustration of a first embodiment of the invention
  • FIG. 3 is an illustration of a second embodiment of the invention.
  • FIG. 4 is an illustration of an assembled laser system embodying the invention.
  • Fluid cooling of a laser system can involved flowing the fluid over a fin array, where the fin array conducts heat from the laser.
  • the heated fin array in turn heats the flowing fluid, which convects the heat away from the fin array.
  • the heated portion of the fluid flow depends upon the area of the fin array, the thermal transfer efficiency between the fins and the cooling fluid, and the volume of the fluid passing over the fin array. Laminar fluid flow has a lower heat transfer coefficient than the same volume of turbulent fluid flow.
  • At least one exemplary embodiment can include fins with turbulence increasing features (e.g. ridges, creases, discontinuities, abrasions, protrusions, steps, bends in the fins, and other shapes and/or additions that one of ordinary skill would understand increases turbulent flow).
  • the fin array attached to a laser, conducts heat from the laser, which is carried away by a fluid flow.
  • the fin array includes fins, which can be of various shapes.
  • the fins are made from folded heat conductive material (e.g. Aluminum, Cu, Fe, alloys including these metals, and other heat conductive material known to one of ordinary skill). Folded fins allow for far greater fin cooling area in the same volume than extruded or milled fin arrays can obtain.
  • FIG. 2 illustrates a first embodiment.
  • the fins 305 are made from a folded metal sheet available from NDM/Kintex Company, Niagara Falls, N.Y., USA. Other thermally conductive material could also be used.
  • the folded sheet has flat base portions 310 attached to a cooling face 32 of a laser module.
  • the fins are made from the base portions 310 , and interconnecting side and end portions 330 and 340 respectively, which together form cooling fins 305 .
  • the side portions 330 each contain two apertures 360 which are provided to induce turbulence.
  • the number of fins per unit distance in the direction perpendicular to the folds can be varied by extending or compressing the flexible folded sheet prior to attachment to the cooling face 320 of the laser module.
  • the fin array 300 can be attached to a portion of the laser 320 (e.g. by fasteners, thermal epoxy, welding, brazing, or other connection mechanisms as understood by one of ordinary skill).
  • the fin array is bonded to the laser module with a thermally conductive epoxy resin, namely Cast-Coat Inc. #CC3-450.
  • a device e.g. fan or pump
  • the increased turbulent fluid flow 355 increases heat transfer efficiency between heated fins and the fluid flow.
  • Various fin shapes are intended to lie within the scope of embodiments.
  • FIG. 3 illustrates a second embodiment including folded heat conductive material, forming a fin array 400 , attached to a portion of a laser 420 .
  • multiple strips of cooling fins are used which are arranged alongside each other such that the fins 405 of adjacent strips are mis-aligned in a staggered or stepped fashion with offsets 460 .
  • the fins 405 include base portions 410 , end portions 440 , and side portions 430 broadly similar to the first embodiment but with the side portions extending at more of an oblique angle relative to the cooling face 420 .
  • the offset 460 forms a turbulence inducing feature so that an initial fluid flow 450 can become more turbulent 455 after passing over the offset 460 .
  • the offset size can be any size. In example designs, the offset varies from 10% to 90% of the fin separation.
  • the multiple strips of cooling fins can be manufactured from flat sheet using a lancing process to produce lanced offset fins.
  • FIG. 4 illustrates a laser system 500 embodying the invention.
  • a fan 510 blows air 520 through a fin array 540 attached to a laser module 530 , which produces a laser beam 590 .
  • the air 520 passes over fins of the fin array 540 .
  • the fins induce turbulence of air 550 flowing through the fins, thereby increasing the efficiency of heat transfer from the laser module to the cooling fluid.
  • the fin array is flexible so that it can be compressed or expanded to shape the fin array to fit the portion of the laser attached to and provide the available surface area for convective cooling.
  • the fin array may also in principle be bent if it is ever needed to fit the cooling fin array to a curved cooling face.
  • fin arrays may be attached to multiple cooling faces on the laser module.

Abstract

A folded sheet is used as a basis for a fin array to cool laser modules. The folded sheet has flat portions that are connected in thermal contact with the laser module, and fins formed by interconnecting portions. This arrangement is highly convenient for assembly, inexpensive, and provides for highly effective heat exchange.

Description

    FIELD OF THE INVENTION
  • The present invention relates to lasers, more particularly to providing lasers with suitable cooling fins.
  • BACKGROUND OF THE INVENTION
  • Typical cooling of a laser utilizes cooling fin arrays coupled with fans to convect heat away from the laser. The fins are typically milled into the body of the laser housing or are part of an extruded heat sink that is bolted to the laser body. In either case the milling or extruding limits the size, pitch and shape of the resulting fins. In particular, heat transfer is largely dependent on the heat transfer surface area. When milling fins, the pitch of the fins, i.e. the number of fins per unit distance, is limited by the milling tool size. The extrusion process has limits on fin width, fin pitch and the fin width to length ratio.
  • FIG. 1 illustrates a conventional laser package 100, having a laser module 110 with an associated laser beam 190 also being illustrated. The laser module 110 has a cooling face 115 on one side from which an array of cooling fins 105 extends. The cooling fins 105 serve to conduct heat away from the laser module 110. The heat from the fins 105 is convected away via a fluid flow indicated by arrows 150 and 155, which may typically be a flow of air or water. The construction of the fin array as a flat, parallel set of fins means that the fluid flow remains substantially laminar as it passes over the fins 105.
  • The heat transfer characteristics of the cooling system are important for the operation of the laser. For example, provision of a better heat transfer mechanism could allow either improved laser operating characteristics to be obtained or a more compact cooling system to be provided.
  • SUMMARY OF THE INVENTION
  • According to a first aspect of the invention there is provided a laser system comprising: a laser module having a cooling face; and heat exchange element constructed as at least one folded sheet of thermally conductive material comprising a plurality of flat portions connected in thermal contact with the cooling face, and a plurality of interconnecting portions extending between the flat portions and away from the cooling face to form cooling fins.
  • Using a folded sheet as a basis for the cooling fins is not only highly convenient from an assembly point of view, and inexpensive, but also provides for highly effective heat exchange away from the laser module. First, the folded sheet can be attached to the laser module cooling face with a large area of good thermal contact via its flat portions. Second, the fins formed by the interconnecting portions of the sheet can present a high-drag to a fluid flow being forced past the fins by a fan or pump, thereby inducing significant turbulence which is an aid to carrying heat away from the fins. As a result a highly efficient heat exchanger can be provided in a small size.
  • Typically the thermally conductive material which the folded sheet is made of will be a metal, most preferably aluminum. Another suitable metal is copper which has a high thermal conductivity but is more expensive and more difficult to work with. Other materials could also be used.
  • The interconnecting portions may be two or more flat portions separated by folds, or may be a single bowed portion. For example, if the interconnecting portions are formed of two flat portions, then the fins will have a generally triangular profile. Another example is when the interconnecting portions are formed of three flat portions to provide a trapezoidal profile. In this case, the middle flat portion may be parallel to the cooling face.
  • The cooling fins can be formed from a flat sheet by a punching process known as lancing. The cooling fins may be referred to as lanced offset fins.
  • In some embodiments the cooling fins extend in a plurality of strips arranged alongside each other such that the cooling fins in adjacent ones of the strips are offset from one another. This staggered fin design can further increase turbulent flow, thereby further increasing the thermal transfer efficiency between the fins and the cooling fluid. Multiple strips of mis-aligned cooling fins can be manufactured using a separate sheet for each strip, or by forming multiple strips in one sheet. In the latter case, the fin pattern can be created from a flat sheet using lancing by stretching or otherwise moving the sheet between lancing steps to produce the desired offset between adjacent strips. If the offset is 50% (i.e. half a period) and the fins extend over a length roughly equal to the length of the flat portions, then after the lancing adjacent strips are barely connected, and the sheet can be considered to have two sets of aligned strips interleaved with one another.
  • The flat portions are preferably connected to the cooling face with a bond, such as with a thermally conductive adhesive (e.g. epoxy resin) or a brazing solder. In principle, fasteners could be used instead, but this is not preferred from an ease of assembly point-of-view and may also not maximize thermal contact unless used in combination with bonding.
  • In some embodiments, the interconnecting portions are apertured. Single or multiple apertures may be provided in each interconnecting portion as desired. These apertures further assist cooling by facilitating turbulence in fluid flowing past the fins.
  • According to a second aspect of the invention there is provided a method of assembling a laser package, the method comprising: providing a laser module having a cooling face; providing a folded sheet of thermally conductive material comprising a plurality of flat portions arrangeable on a common plane and a plurality of interconnecting portions extending between the flat portions and away from the common plane to form fins; and bonding the flat portions of the folded sheet to the cooling face so that the folded sheet forms a heat exchange element for the laser module with the interconnecting portions extending away from the cooling face to form cooling fins.
  • This method of assembly is particularly convenient and efficient. In this way, the folded sheet can be simply offered up and attached to the laser module in a single step.
  • The best mode is to place a thermally conductive adhesive between the cooling face and the flat portions of the folded sheet. An alternative is to use brazing solder instead.
  • A further significant advantage of using a folded sheet is that the folded sheet can be provided so that it is extensible and compressible by its interconnecting portions. The folded sheet can then be extended or compressed by a desired amount before bonding it to the cooling face in its extended or compressed state. This allows adjustment of the fin spacing, and the distance of maximum extent of the fins from the cooling face. This kind of freedom is not possible with a conventional fin array where the fin size and pitch is fixed at the time of manufacture of the fin array. It is possible to exploit this design freedom by varying the fin spacing according to the cooling requirements. Moreover, the fin spacing can be varied along a single sheet by different degrees of extension or compression along different portions, for example to provide different cooling capacity along the length of a cooling face to take account of hot spots. The folded sheet is thus extended or compressed by different amounts along different sections thereof so that the flat portions are separated by different amounts in the different sections.
  • Further areas of applicability of embodiments of the present invention will become apparent from the detailed description provided hereinafter. It should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are intended for purposes of illustration only and fail to limit the scope of the invention.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Embodiments of present invention will become more fully understood from the detailed description and the accompanying drawings, wherein:
  • FIG. 1 is an illustration of a conventional laser with an attached cooling fin array according to the prior art;
  • FIG. 2 is an illustration of a first embodiment of the invention;
  • FIG. 3 is an illustration of a second embodiment of the invention; and
  • FIG. 4 is an illustration of an assembled laser system embodying the invention.
  • DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS OF THE PRESENT INVENTION
  • The following description of exemplary embodiment(s) is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
  • Although the discussion herein may not discuss all details associated with the cooling of laser systems, such details, as known by one of ordinary skill, are intended to be included within the scope of embodiments discussed herein.
  • Fluid cooling of a laser system (e.g. air, gas, water, and other fluids as can be used as determined by one of ordinary skill), can involved flowing the fluid over a fin array, where the fin array conducts heat from the laser. The heated fin array in turn heats the flowing fluid, which convects the heat away from the fin array. The heated portion of the fluid flow depends upon the area of the fin array, the thermal transfer efficiency between the fins and the cooling fluid, and the volume of the fluid passing over the fin array. Laminar fluid flow has a lower heat transfer coefficient than the same volume of turbulent fluid flow.
  • To create turbulent flow at least one exemplary embodiment can include fins with turbulence increasing features (e.g. ridges, creases, discontinuities, abrasions, protrusions, steps, bends in the fins, and other shapes and/or additions that one of ordinary skill would understand increases turbulent flow). The fin array, attached to a laser, conducts heat from the laser, which is carried away by a fluid flow. In at least one embodiment, the fin array includes fins, which can be of various shapes. In at least one exemplary embodiment the fins are made from folded heat conductive material (e.g. Aluminum, Cu, Fe, alloys including these metals, and other heat conductive material known to one of ordinary skill). Folded fins allow for far greater fin cooling area in the same volume than extruded or milled fin arrays can obtain.
  • FIG. 2 illustrates a first embodiment. The fins 305 are made from a folded metal sheet available from NDM/Kintex Company, Niagara Falls, N.Y., USA. Other thermally conductive material could also be used. The folded sheet has flat base portions 310 attached to a cooling face 32 of a laser module. The fins are made from the base portions 310, and interconnecting side and end portions 330 and 340 respectively, which together form cooling fins 305. The side portions 330 each contain two apertures 360 which are provided to induce turbulence.
  • To change the surface cooling area, the number of fins per unit distance in the direction perpendicular to the folds can be varied by extending or compressing the flexible folded sheet prior to attachment to the cooling face 320 of the laser module.
  • The fin array 300 can be attached to a portion of the laser 320 (e.g. by fasteners, thermal epoxy, welding, brazing, or other connection mechanisms as understood by one of ordinary skill). In the best mode, the fin array is bonded to the laser module with a thermally conductive epoxy resin, namely Cast-Coat Inc. #CC3-450.
  • A device (e.g. fan or pump) can move the fluid flow 350 parallel to the fins 305, where the features 360 interrupt a portion of the fluid flow increasing the turbulence of the fluid flow 355. The increased turbulent fluid flow 355 increases heat transfer efficiency between heated fins and the fluid flow. Various fin shapes are intended to lie within the scope of embodiments.
  • FIG. 3 illustrates a second embodiment including folded heat conductive material, forming a fin array 400, attached to a portion of a laser 420. In this particular exemplary embodiment multiple strips of cooling fins are used which are arranged alongside each other such that the fins 405 of adjacent strips are mis-aligned in a staggered or stepped fashion with offsets 460. The fins 405 include base portions 410, end portions 440, and side portions 430 broadly similar to the first embodiment but with the side portions extending at more of an oblique angle relative to the cooling face 420. The offset 460 forms a turbulence inducing feature so that an initial fluid flow 450 can become more turbulent 455 after passing over the offset 460. The offset size can be any size. In example designs, the offset varies from 10% to 90% of the fin separation. The multiple strips of cooling fins can be manufactured from flat sheet using a lancing process to produce lanced offset fins.
  • FIG. 4 illustrates a laser system 500 embodying the invention. A fan 510 blows air 520 through a fin array 540 attached to a laser module 530, which produces a laser beam 590. The air 520 passes over fins of the fin array 540. The fins induce turbulence of air 550 flowing through the fins, thereby increasing the efficiency of heat transfer from the laser module to the cooling fluid.
  • In at least one exemplary embodiment the fin array is flexible so that it can be compressed or expanded to shape the fin array to fit the portion of the laser attached to and provide the available surface area for convective cooling. The fin array may also in principle be bent if it is ever needed to fit the cooling fin array to a curved cooling face.
  • It will also be appreciated that although the foregoing embodiments show only one cooling face to which the fin array is attached, fin arrays may be attached to multiple cooling faces on the laser module.
  • The description of the invention is merely exemplary in nature and, thus, variations that do not depart from the gist of the invention are intended to be within the scope of the embodiments of the present invention. Such variations are not to be regarded as a departure from the spirit and scope of the present invention.

Claims (12)

1.) A laser system comprising:
a laser module having a cooling face; and
a heat exchange element constructed as at least one folded sheet of thermally conductive material comprising a plurality of flat portions connected in thermal contact with the cooling face, and a plurality of interconnecting portions extending between the flat portions and away from the cooling face to form cooling fins.
2.) The system of claim 1, wherein the cooling fins extend in a plurality of strips arranged alongside each other such that the cooling fins in adjacent ones of the strips are offset from one another.
3.) The system of claim 1, wherein the flat portions are connected to the cooling face with a bond.
4.) The system of claim 3, wherein the bond comprises a thermally conductive adhesive.
5.) The system of claim 3, wherein the bond comprises a brazing solder.
6.) The system of claim 1, wherein the flat portions are connected to the cooling face with fasteners.
7.) The system of claim 1, wherein the interconnecting portions are apertured.
8.) A method of assembling a laser package, comprising:
providing a laser module having a cooling face;
providing a folded sheet of thermally conductive material comprising a plurality of flat portions arrangeable on a common plane and a plurality of interconnecting portions extending between the flat portions and away from the common plane to form fins; and
bonding the flat portions of the folded sheet to the cooling face so that the folded sheet forms a heat exchange element for the laser module with the interconnecting portions extending away from the cooling face to form cooling fins.
9.) The method of claim 8, wherein said bonding comprises placing a thermally conductive adhesive between the cooling face and the flat portions of the folded sheet.
10.) The method of claim 8, wherein said bonding comprises placing a brazing solder between the cooling face and the flat portions of the folded sheet at an elevated temperature.
11.) The method of claim 8, wherein the folded sheet is extensible and compressible by its interconnecting portions, and wherein prior to said bonding the folded sheet is extended or compressed by a desired amount and then bonded to the cooling face in its extended or compressed state.
12.) The method of claim 11, wherein the folded sheet is extended or compressed by different amounts along different sections thereof so that the flat portions are separated by different amounts in the different sections.
US11/033,496 2004-01-12 2005-01-12 Laser cooling system and method Abandoned US20050257912A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/033,496 US20050257912A1 (en) 2004-01-12 2005-01-12 Laser cooling system and method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US53554904P 2004-01-12 2004-01-12
US60515704P 2004-08-30 2004-08-30
US62205404P 2004-10-27 2004-10-27
US11/033,496 US20050257912A1 (en) 2004-01-12 2005-01-12 Laser cooling system and method

Publications (1)

Publication Number Publication Date
US20050257912A1 true US20050257912A1 (en) 2005-11-24

Family

ID=34812073

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/033,496 Abandoned US20050257912A1 (en) 2004-01-12 2005-01-12 Laser cooling system and method

Country Status (5)

Country Link
US (1) US20050257912A1 (en)
EP (1) EP1723486B1 (en)
AT (1) ATE444582T1 (en)
DE (1) DE602005016897D1 (en)
WO (1) WO2005070159A2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070189353A1 (en) * 2006-02-03 2007-08-16 Videojet Technologies Waveguide laser having reduced cross-sectional size and/or reduced optical axis distortion
US20080043801A1 (en) * 2006-06-26 2008-02-21 Videojet Technologies Inc. Optical mounting scheme for waveguide lasers and waveguide laser incorporating the same
WO2013093500A3 (en) * 2011-12-22 2013-08-15 The Science And Technology Facilities Council Turbulent flow and cryogenic gas cooled laser disc
US20160209330A1 (en) * 2015-01-21 2016-07-21 Protrustech Co., Ltd Integrated raman spectrometer and modularized laser module
US20180252383A1 (en) * 2015-09-14 2018-09-06 Valeo Vision Heat sink device for a motor vehicle lighting module
US20200333077A1 (en) * 2019-04-18 2020-10-22 The Babcock & Wilcox Company Perturbing air cooled condenser fin
US20210231933A1 (en) * 2020-01-28 2021-07-29 Panasonic Intellectual Property Management Co., Ltd. Optical unit for laser processing system and laser processing system
US11094609B2 (en) 2019-07-10 2021-08-17 National Chiao Tung University Thermal dissipation structure for integrated circuits comprising thermal dissipation trench

Citations (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US58913A (en) * 1866-10-16 Improvement in hydrometers
US131469A (en) * 1872-09-17 Improvement in pumps
US3226830A (en) * 1964-05-01 1966-01-04 Spectra Physics Mechanism for precise angular positioning of optical devices
US3638140A (en) * 1969-07-28 1972-01-25 Hughes Aircraft Co Laser-cooling system
US3763442A (en) * 1972-07-07 1973-10-02 American Laser Corp Ion laser plasma tube cooling device and method
US4005374A (en) * 1975-03-31 1977-01-25 Xonics, Inc. Pulsed gas laser with low-inductance flow-through electrodes
US4345643A (en) * 1980-11-24 1982-08-24 The United States Of America As Represented By The Secretary Of The Army Heat exchanger base for a portable laser system
US4367553A (en) * 1977-12-23 1983-01-04 Battelle Memorial Institute Pulse laser with an electrically excited gaseous active medium
US4507786A (en) * 1983-08-22 1985-03-26 The United States Of America As Represented By The Secretary Of The Army Push-pull pulsed gas laser
US4750186A (en) * 1986-01-27 1988-06-07 Asulab S.A. Sealed gas laser
US4926935A (en) * 1989-03-06 1990-05-22 Robinson Fin Machines, Inc. Compressed fin heat sink
US5140606A (en) * 1990-10-12 1992-08-18 Coherent, Inc. RF excited CO2 slab waveguide laser
US5304846A (en) * 1991-12-16 1994-04-19 At&T Bell Laboratories Narrow channel finned heat sinking for cooling high power electronic components
US5417140A (en) * 1990-06-28 1995-05-23 Mitsubishi Jukogyo Kabushiki Kaisha Flying object acceleration method by means of a rail-gun type two-stage accelerating apparatus
US5481556A (en) * 1993-10-01 1996-01-02 S.L.T. Japan Co., Ltd. Laser oscillation apparatus with cooling fan and cooling fins
US5513071A (en) * 1994-11-28 1996-04-30 Philips Electronics North America Corporation Electronics housing with improved heat rejection
US5625229A (en) * 1994-10-03 1997-04-29 Sumitomo Metal Industries, Ltd. Heat sink fin assembly for cooling an LSI package
US5748662A (en) * 1994-05-16 1998-05-05 Mitsubishi Denki Kabushiki Kaisha Laser oscillator with stabilized pointing
US5746505A (en) * 1993-09-21 1998-05-05 Mita Industrial Co., Ltd. Electrical conductor for an optical system
US5754575A (en) * 1995-10-17 1998-05-19 Universal Laser Systems, Inc. Free-space gas slab laser
US5864956A (en) * 1996-11-22 1999-02-02 Dong; Dawei Level line and limb line combination
US5901167A (en) * 1997-04-30 1999-05-04 Universal Laser Systems, Inc. Air cooled gas laser
US5953360A (en) * 1997-10-24 1999-09-14 Synrad, Inc. All metal electrode sealed gas laser
US6163969A (en) * 1998-08-04 2000-12-26 Quarton Inc. 3D laser leveler
US6195379B1 (en) * 1999-12-27 2001-02-27 Synrad, Inc. Laser assembly system and method
US6196298B1 (en) * 1997-03-22 2001-03-06 Imi Marston Limited Heat sink
US6208513B1 (en) * 1995-01-17 2001-03-27 Compaq Computer Corporation Independently mounted cooling fins for a low-stress semiconductor package
US6351478B1 (en) * 1998-09-11 2002-02-26 Cutting Edge Optronics, Inc. Passively cooled solid-state laser
US20020048295A1 (en) * 2000-10-20 2002-04-25 The Furukawa Electric Co., Ltd. Laser diode module and mounting board
US20020054615A1 (en) * 2000-11-08 2002-05-09 The Furukawa Electric Co., Ltd. Light source comprising laser diode module
US6414979B2 (en) * 2000-06-09 2002-07-02 Cymer, Inc. Gas discharge laser with blade-dielectric electrode
US6427348B1 (en) * 2000-07-17 2002-08-06 James Webb Slope block
US20020131731A1 (en) * 2001-03-16 2002-09-19 The Furukawa Electric Co., Ltd. Light source having plural laser diode modules
US20020136247A1 (en) * 2000-04-19 2002-09-26 Naoaki Ikeda Laser wavelength converter
US6538889B1 (en) * 2001-09-20 2003-03-25 Hewlett-Packard Company Heat dissipation device retention assembly
US6625025B1 (en) * 2000-07-10 2003-09-23 Nortel Networks Limited Component cooling in electronic devices
US20040010912A1 (en) * 2002-05-31 2004-01-22 Amigo Jean Method for making a heat sink device and product made thereby
US6730993B1 (en) * 2001-07-26 2004-05-04 Ciena Corporation Laser diode and heatsink quick connect/disconnect assembly
US20040114647A1 (en) * 2002-12-16 2004-06-17 Sukhman Yefim P. Laser with heat transfer system
US20050152146A1 (en) * 2002-05-08 2005-07-14 Owen Mark D. High efficiency solid-state light source and methods of use and manufacture

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2215906B (en) * 1988-02-10 1992-09-16 Mitsubishi Electric Corp Laser device
JPH06268285A (en) * 1993-03-15 1994-09-22 Toshiba Corp Gas laser tube device
JPH088493A (en) * 1994-06-20 1996-01-12 Nippon Steel Corp Heat radiating structure for semiconductor laser device
TW444158B (en) * 1998-07-08 2001-07-01 Hon Hai Prec Ind Co Ltd Heat sink device and its manufacture method
JP2002329928A (en) * 2001-02-27 2002-11-15 Ricoh Co Ltd Optical communication system

Patent Citations (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US58913A (en) * 1866-10-16 Improvement in hydrometers
US131469A (en) * 1872-09-17 Improvement in pumps
US3226830A (en) * 1964-05-01 1966-01-04 Spectra Physics Mechanism for precise angular positioning of optical devices
US3638140A (en) * 1969-07-28 1972-01-25 Hughes Aircraft Co Laser-cooling system
US3763442A (en) * 1972-07-07 1973-10-02 American Laser Corp Ion laser plasma tube cooling device and method
US4005374A (en) * 1975-03-31 1977-01-25 Xonics, Inc. Pulsed gas laser with low-inductance flow-through electrodes
US4367553A (en) * 1977-12-23 1983-01-04 Battelle Memorial Institute Pulse laser with an electrically excited gaseous active medium
US4345643A (en) * 1980-11-24 1982-08-24 The United States Of America As Represented By The Secretary Of The Army Heat exchanger base for a portable laser system
US4507786A (en) * 1983-08-22 1985-03-26 The United States Of America As Represented By The Secretary Of The Army Push-pull pulsed gas laser
US4750186A (en) * 1986-01-27 1988-06-07 Asulab S.A. Sealed gas laser
US4926935A (en) * 1989-03-06 1990-05-22 Robinson Fin Machines, Inc. Compressed fin heat sink
US5417140A (en) * 1990-06-28 1995-05-23 Mitsubishi Jukogyo Kabushiki Kaisha Flying object acceleration method by means of a rail-gun type two-stage accelerating apparatus
US5140606A (en) * 1990-10-12 1992-08-18 Coherent, Inc. RF excited CO2 slab waveguide laser
US5304846A (en) * 1991-12-16 1994-04-19 At&T Bell Laboratories Narrow channel finned heat sinking for cooling high power electronic components
US5746505A (en) * 1993-09-21 1998-05-05 Mita Industrial Co., Ltd. Electrical conductor for an optical system
US5481556A (en) * 1993-10-01 1996-01-02 S.L.T. Japan Co., Ltd. Laser oscillation apparatus with cooling fan and cooling fins
US5748662A (en) * 1994-05-16 1998-05-05 Mitsubishi Denki Kabushiki Kaisha Laser oscillator with stabilized pointing
US5625229A (en) * 1994-10-03 1997-04-29 Sumitomo Metal Industries, Ltd. Heat sink fin assembly for cooling an LSI package
US5513071A (en) * 1994-11-28 1996-04-30 Philips Electronics North America Corporation Electronics housing with improved heat rejection
US6208513B1 (en) * 1995-01-17 2001-03-27 Compaq Computer Corporation Independently mounted cooling fins for a low-stress semiconductor package
US5754575A (en) * 1995-10-17 1998-05-19 Universal Laser Systems, Inc. Free-space gas slab laser
US5864956A (en) * 1996-11-22 1999-02-02 Dong; Dawei Level line and limb line combination
US6196298B1 (en) * 1997-03-22 2001-03-06 Imi Marston Limited Heat sink
US5901167A (en) * 1997-04-30 1999-05-04 Universal Laser Systems, Inc. Air cooled gas laser
US5953360A (en) * 1997-10-24 1999-09-14 Synrad, Inc. All metal electrode sealed gas laser
US6163969A (en) * 1998-08-04 2000-12-26 Quarton Inc. 3D laser leveler
US6351478B1 (en) * 1998-09-11 2002-02-26 Cutting Edge Optronics, Inc. Passively cooled solid-state laser
US6195379B1 (en) * 1999-12-27 2001-02-27 Synrad, Inc. Laser assembly system and method
US20020136247A1 (en) * 2000-04-19 2002-09-26 Naoaki Ikeda Laser wavelength converter
US6414979B2 (en) * 2000-06-09 2002-07-02 Cymer, Inc. Gas discharge laser with blade-dielectric electrode
US6625025B1 (en) * 2000-07-10 2003-09-23 Nortel Networks Limited Component cooling in electronic devices
US6427348B1 (en) * 2000-07-17 2002-08-06 James Webb Slope block
US20020048295A1 (en) * 2000-10-20 2002-04-25 The Furukawa Electric Co., Ltd. Laser diode module and mounting board
US20020054615A1 (en) * 2000-11-08 2002-05-09 The Furukawa Electric Co., Ltd. Light source comprising laser diode module
US20020131731A1 (en) * 2001-03-16 2002-09-19 The Furukawa Electric Co., Ltd. Light source having plural laser diode modules
US6730993B1 (en) * 2001-07-26 2004-05-04 Ciena Corporation Laser diode and heatsink quick connect/disconnect assembly
US6538889B1 (en) * 2001-09-20 2003-03-25 Hewlett-Packard Company Heat dissipation device retention assembly
US20050152146A1 (en) * 2002-05-08 2005-07-14 Owen Mark D. High efficiency solid-state light source and methods of use and manufacture
US20040010912A1 (en) * 2002-05-31 2004-01-22 Amigo Jean Method for making a heat sink device and product made thereby
US20040114647A1 (en) * 2002-12-16 2004-06-17 Sukhman Yefim P. Laser with heat transfer system

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070189353A1 (en) * 2006-02-03 2007-08-16 Videojet Technologies Waveguide laser having reduced cross-sectional size and/or reduced optical axis distortion
US20080043801A1 (en) * 2006-06-26 2008-02-21 Videojet Technologies Inc. Optical mounting scheme for waveguide lasers and waveguide laser incorporating the same
US7583718B2 (en) 2006-06-26 2009-09-01 Videojet Technologies Inc. Optical mounting scheme for waveguide lasers and waveguide laser incorporating the same
KR101653079B1 (en) 2011-12-22 2016-09-09 더 사이언스 앤드 테크놀로지 팩서러티즈 카운실 Turbulent flow and cryogenic gas cooled laser disc
KR20150002581A (en) * 2011-12-22 2015-01-07 더 사이언스 앤드 테크놀로지 팩서러티즈 카운실 Mounting vane for optical element of a laser
US9083139B2 (en) 2011-12-22 2015-07-14 The Science And Technology Facilities Council Mounting vane for optical element of a laser
WO2013093500A3 (en) * 2011-12-22 2013-08-15 The Science And Technology Facilities Council Turbulent flow and cryogenic gas cooled laser disc
US20160209330A1 (en) * 2015-01-21 2016-07-21 Protrustech Co., Ltd Integrated raman spectrometer and modularized laser module
CN105806823A (en) * 2015-01-21 2016-07-27 佐信科技有限公司 Integrated raman spectrum measurement system and modularized laser module
US20170370850A1 (en) * 2015-01-21 2017-12-28 Protrustech Co., Ltd Integrated raman spectrum measurement system
US10247674B2 (en) * 2015-01-21 2019-04-02 Protrustech Co., Ltd Integrated Raman spectrum measurement system
US20180252383A1 (en) * 2015-09-14 2018-09-06 Valeo Vision Heat sink device for a motor vehicle lighting module
US20200333077A1 (en) * 2019-04-18 2020-10-22 The Babcock & Wilcox Company Perturbing air cooled condenser fin
US11094609B2 (en) 2019-07-10 2021-08-17 National Chiao Tung University Thermal dissipation structure for integrated circuits comprising thermal dissipation trench
US20210231933A1 (en) * 2020-01-28 2021-07-29 Panasonic Intellectual Property Management Co., Ltd. Optical unit for laser processing system and laser processing system
US11493743B2 (en) * 2020-01-28 2022-11-08 Panasonic Intellectual Property Management Co., Ltd. Optical unit for laser processing system and laser processing system

Also Published As

Publication number Publication date
DE602005016897D1 (en) 2009-11-12
WO2005070159A2 (en) 2005-08-04
EP1723486B1 (en) 2009-09-30
ATE444582T1 (en) 2009-10-15
WO2005070159A3 (en) 2006-11-30
EP1723486A2 (en) 2006-11-22
EP1723486A4 (en) 2008-06-25

Similar Documents

Publication Publication Date Title
EP1723486B1 (en) Laser cooling system and method
US6026895A (en) Flexible foil finned heatsink structure and method of making same
US20060254752A1 (en) Radiator and heatsink apparatus having the radiator
JP4234722B2 (en) Cooling device and electronic equipment
JPH06244328A (en) Heat sink
JP4982194B2 (en) Heating element cooling structure, driving device, and method of manufacturing heating element cooling structure
CN101351109A (en) Radiating device
US20080055855A1 (en) Heat sink for electronic components
CA2287682A1 (en) High performance fan tail heat exchanger
US20130175021A1 (en) Servo amplifier with heat sink having two sets of heat-releasing plates perpendicular to each other
JPH03181796A (en) Plate fim structure for heat exchanger
EP3550947B1 (en) Heat sink and communication product
US6749009B2 (en) Folded fin on edge heat sink
US6260610B1 (en) Convoluted fin heat sinks with base topography for thermal enhancement
US20200408473A1 (en) Deformable fin heat exchanger
JP5667739B2 (en) Heat sink assembly, semiconductor module, and semiconductor device with cooling device
JP4140549B2 (en) Cooler
JPH0955457A (en) Heat sink and its manufacture
JP2008078587A (en) Fin for heat exchange
US6747865B2 (en) Heat sink for electronic components
JP2009099995A (en) Refrigerator and electronic apparatus
JP2011003708A (en) Heat exchanger using corrugated heat radiation unit
KR100971356B1 (en) Cooler for automobile oil and manufacturing method thereof
US6883598B2 (en) Cooling element for a heat exchanger
JP2012049483A (en) Heat radiator

Legal Events

Date Code Title Description
AS Assignment

Owner name: LITELASER LLC, MICHIGAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MONTY, NATHAN P.;LIND, KENNETH A.;ARMBRUSTER, KEVIN L.;REEL/FRAME:016860/0943;SIGNING DATES FROM 20050412 TO 20050725

AS Assignment

Owner name: VIDEOJET TECHNOLOGIES, DISTRICT OF COLUMBIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LITELASER LLC;REEL/FRAME:018524/0495

Effective date: 20061114

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION