US20050263401A1 - Method and apparatus for plating substrates - Google Patents
Method and apparatus for plating substrates Download PDFInfo
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- US20050263401A1 US20050263401A1 US11/088,052 US8805205A US2005263401A1 US 20050263401 A1 US20050263401 A1 US 20050263401A1 US 8805205 A US8805205 A US 8805205A US 2005263401 A1 US2005263401 A1 US 2005263401A1
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- mandrels
- plating
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- 239000000758 substrate Substances 0.000 title claims abstract description 162
- 238000007747 plating Methods 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims description 43
- 239000004033 plastic Substances 0.000 claims abstract description 17
- 229920003023 plastic Polymers 0.000 claims abstract description 17
- 239000000356 contaminant Substances 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000012811 non-conductive material Substances 0.000 abstract 1
- 229910001096 P alloy Inorganic materials 0.000 description 4
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 241000399716 Homola Species 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 239000004813 Perfluoroalkoxy alkane Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920011301 perfluoro alkoxyl alkane Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
Definitions
- This invention relates to methods and apparatus for plating substrates.
- one plates substrates there are various manufacturing processes during which one plates substrates. For example, during some processes for making magnetic disks, one places an aluminum alloy substrate in a plating bath to electroless plate a nickel-phosphorus alloy layer onto the substrate. Thereafter, the plated substrate is polished and textured, and one or more underlayers, one or more magnetic layers, and one or more protective overcoats are deposited (e.g. by sputtering) onto the plated substrate. (During some manufacturing processes, other layers are deposited onto the substrate as well.) Merely by way of example, one method for polishing a substrate is discussed in U.S. Pat. No. 6,149,696, issued to Jia on Nov. 21, 2000. A method for texturing a substrate is discussed in U.S. patent application Ser. No.
- Apparatus in accordance with one embodiment of our invention comprises a novel structure for holding substrates during plating.
- the substrates are typically planar and disk-shaped.
- the novel holding structure comprises a set of mandrels.
- mandrels are elongated members.
- the mandrels are typically cylindrical, and typically comprise notches for receiving the outer edges of the substrates.
- the mandrels are not cylindrical, and do not have circular cross sections. Also, in other embodiments, the mandrels do not have notches.
- the holding structure holds one or more sets of substrates, each substrate within a set being generally parallel to the other substrates within that set. In one embodiment, each substrate is held at its outer edge by the mandrels. Because of this, the substrates do not wobble during plating, and therefore do not touch each other during plating.
- At least one of the mandrels is removable to facilitate loading and unloading of the substrates from the holding structure.
- the substrates can be magnetic disk substrates having a central opening therein. Because of the manner in which the substrates are held at their outer edges, it is easier to load and unload the substrates compared to earlier substrate plating apparatus in which the substrates were held by a dowel extending through their central opening.
- each set is held by one side of the central mandrel and an associated set of one or more outer mandrels.
- the mandrels hold the set of substrates at the outer edges of the substrates.
- a plurality of sets of substrates abuts the central mandrel.
- three sets of substrates abut the central mandrel.
- the first, second and third set of substrates abut a top, lower left and lower right side of the central mandrel, respectively.
- This arrangement of substrates permits a larger number of substrates to be held in a given volume than if the plurality of sets of substrates did not abut a common central mandrel.
- a gear mechanism imparts planetary motion to the substrates during plating.
- This gear mechanism is mechanically coupled to the holding structure.
- the mandrels are typically held on their left and right ends by a left plate and a right plate, respectively. (In one embodiment, the mandrels are parallel.) At least some of the mandrels are removable to permit one to load and unload substrates into and from the holding structure.
- the plates comprise a slot that permits use of a tool to load and unload the holding structure.
- the tool comprises a mandrel for extending through an opening in the substrates. Thus, during loading and unloading, the tool mandrel is placed in the inner opening of the substrates, and lifts the substrates out of the holding structure.
- a method in accordance with the invention includes the act of placing one or more substrates in a holding structure as described above.
- the holding structure is coupled to apparatus for moving the substrates (typically in a planetary manner).
- the apparatus, holding structure, and substrates are placed in a bath where a layer of material is plated onto the substrates.
- the substrates are metallic (e.g. aluminum or an aluminum alloy), and a metallic layer (e.g. a nickel phosphorus alloy) is plated onto the substrates.
- the apparatus is removed from the bath, and the substrates are removed from the holding structure.
- An apparatus in accordance with another embodiment of the invention comprises a holder for holding one or more substrates during plating.
- the holder typically has a plastic exterior, and includes a plastic member for coupling with a first race of a bearing.
- a second race of the bearing is also plastic, and is coupled to a rotating structure that imparts motion to the holder (and therefore to the one or more substrates held by that holder).
- a metallic interface (typically comprising balls or rollers) is provided between the first and second races. (The metallic interface is typically passivated to prevent the interface from becoming plated during use).
- the bearing permits one to avoid or minimize the motion of plastic against plastic. This reduces the amount of friction, mechanical wear, and most importantly, generation of contaminant particles in the plating bath.
- a bearing with metallic races e.g. stainless steel
- the races are typically passivated.
- metal-on-metal wearing of the races and the interface may grind away the passivation, thereby exposing metallic surfaces to the plating bath and permitting the bearing to be plated.
- contamination particles e.g. plated material on the bearing
- the embodiment using plastic races may be more desirable.
- a gear mechanism imparts planetary motion to the one or more substrates within the holder.
- a method in accordance with another embodiment of the invention comprises the act of providing one or more substrates in a holder.
- the holder is mechanically coupled via a bearing to apparatus for imparting motion to the holder.
- the holder, one or more substrates and apparatus are placed in a plating bath, and the apparatus imparts motion to the holder.
- the holder comprises first and second plastic races, and a metallic mechanical interface (typically a set of metal balls) therebetween. As mentioned above, this reduces the amount of friction, mechanical wear and generation of contaminant particles in the plating bath.
- FIG. 1A schematically illustrates a plating bath containing apparatus that imparts motion to substrates during plating.
- FIGS. 1B and 1C illustrate portions of the apparatus that impart motion to substrates.
- FIGS. 2A and 2C illustrate a holder that holds substrates in the apparatus of FIG. 1 .
- FIG. 2B shows the holder with two of its mandrels removed.
- FIGS. 3A and 3B illustrate a portion of removable mandrels used in conjunction with the holder of FIGS. 2A to 2 C.
- FIG. 4 illustrates a tool for removing substrates from the holder of FIG. 2 .
- FIG. 5 illustrates in cross section the apparatus of FIG. 1 .
- FIG. 6 illustrates in cross section the apparatus of FIG. 5 along lines 6 - 6 .
- FIG. 7 illustrates in cross section the apparatus of FIG. 5 along lines 7 - 7 .
- FIG. 8 illustrates in cross section the apparatus of FIG. 5 along lines 8 - 8 .
- FIGS. 9A and 9B illustrate the manner in which a holder is placed into position for loading and unloading.
- FIG. 10 illustrates a second embodiment of apparatus for plating substrates in which the substrates are held at their outer edges.
- FIG. 11 illustrates a holder used in conjunction with the apparatus of FIG. 10 .
- a plating bath 8 contains apparatus 10 for holding and moving substrates S during a plating process.
- FIGS. 1B and 1C only show one substrate S. However, typically many substrates are plated simultaneously.
- the substrates comprise an aluminum alloy, and during plating, a layer (typically a metallic layer such as a nickel-phosphorus alloy) is deposited on substrates S.
- substrates S can comprise other materials, and other types of layers can plated onto substrates S.
- substrates S are disk-shaped, and can include a centrally defined opening O therein. However, in other embodiments, substrates S have other shapes.
- the plating process can be electroless plating or electroplating.
- a strike voltage is not applied to substrates S.
- substrates S are held by four holders 12 , and a drive mechanism imparts planetary motion to these holders (and therefore to the substrates S held by the holders). (Only a part of one holder 12 is shown in FIGS. 1B, 1C and 5 for ease of illustration.)
- apparatus 10 Prior to plating, apparatus 10 is removed from bath 8 , and substrates S are loaded into the apparatus. Apparatus 10 is then placed in bath 8 for plating. After plating, apparatus 10 is again removed from bath 8 , and substrates S are removed from apparatus 10 .
- outer mandrels MO are removable to facilitate loading or unloading holders 12 with substrates S.
- mandrels MC, MI and MO typically comprise notches N for holding substrates S.
- Mandrels MC, MI and MO cooperate to hold three sets of substrates S.
- Substrates S are typically generally parallel, each set abutting an associated side of central mandrel MC.
- mandrel MC two mandrels MI and two mandrels MO cooperate to hold one set of parallel substrates S.
- Holder 12 comprises six removable outer mandrels MO and six non-removable mandrels MI to hold the above-mentioned three sets of substrates S.
- FIGS. 2A, 2B , 2 C and 5 only show central mandrel MC, two removable mandrels MO and two non-removable mandrels MI
- the side views shown in FIGS. 6, 7 and 8 show the arrangement of all thirteen mandrels in a holder.
- FIG. 7 shows the manner in which one of the holders 12 holds three sets of substrates (sets SA, SB and SC).
- FIGS. 6, 7 and 8 also illustrate the manner in which apparatus 10 contains four different holders 12 .
- Mandrels MC include portions PL, PR ( FIG. 5 ) extending through and past end pieces EL, ER. As explained below, a set of wheels and gears engage portions PL, PR of mandrels MC to impart motion to mandrels MC and therefore to holders 12 . (In lieu of having mandrels MC including portions PL, PR extending through and past end pieces EL, ER, in an alternative embodiment, mandrels MC stop at end pieces EL, ER and a separate post is mounted on end pieces EL, ER to engage with the set of wheels and gears.)
- a drive shaft DS of a motor M rotates a drive gear DG, which in turn drives a right drive gear GR 1 , which in turn drives an idler shaft IS, which in turn drives a left drive gear GL 1 .
- Drive gears GR 1 and GL 1 in turn drive second gears GR 2 and GL 2 .
- Gears GR 2 and GL 2 are affixed to wheels WR ( FIG. 1B ) and WL ( FIG. 1C ), respectively.
- wheels WR and WL indirectly engage with central mandrels MC to cause central mandrels MC to rotate about a central axis A ( FIGS. 1C and 5 ) of wheels WR and WL. (Wheels WR and WL synchronously rotate about the same axis A.)
- Portion PR of central mandrel MC is rigidly connected to an inner race 16 R of a bearing BR ( FIG. 2C ).
- Bearing BR is typically a ball bearing, and can include nine metal balls, e.g. made of stainless steel (not shown). (Alternatively, other materials can be used to construct the bearing, and different numbers of balls can be used. In addition, rollers can be used in lieu of balls.)
- An outer race 18 R of bearing BR rides in an opening 22 R of wheel WR ( FIG. 1B ). As mentioned above, during use of apparatus 10 , wheel WR rotates about its central axis A, thereby causing central mandrel MC, holder 12 and the substrates held by holder 12 to rotate about axis A.
- wheel WR includes additional openings 22 R′ (identical to opening 22 R). These openings accommodate other holders 12 that are not shown in FIG. 1B for ease of illustration.
- Ring 24 R contains an opening 25 R ( FIG. 1B ) for permitting one to place holder 12 into or remove holder 12 from apparatus 10 .
- a locking piece 26 R ( FIG. 1C ) is placed in opening 25 R to prevent holder 12 from falling out of apparatus 10 .
- Portion PL of central mandrel MC is rigidly connected to a gear GL and an inner race 16 L of bearing BL ( FIG. 2A ).
- Bearing BL is identical to bearing BR, and rides in an opening in wheel WL ( FIG. 1C ) in the same manner as bearing BR rides in opening 22 R.
- Ring 24 R surrounds wheel WR and prevents bearing BR from falling out of opening 22 R.
- FIG. 1C shows three openings 22 L′ in wheel WL for accommodating additional holders, not shown in FIG. 1C for ease of illustration.
- Ring 24 L includes an opening 25 L ( FIG. 1B ) for permitting one to place holder 12 in or remove holder 12 from apparatus 10 .
- a locking piece 26 L ( FIG. 1C ) is placed in opening 25 L to prevent holder 12 from falling out of apparatus 10 .
- gears analogous to gear GL and GL 4 are provided on the right side of apparatus 10 , either in addition to or in lieu of gear GL.
- one loads substrates S into apparatus 10 .
- one removes substrates S from apparatus 10 .
- one loads and unloads one holder 12 at a time. This is accomplished by a) moving holder 12 into a position where it can be loaded and unloaded; and then b) removing mandrels MO to load or unload holder 12 .
- FIGS. 9A and 9B illustrate indentation 54 R at the bottom of opening 25 R.
- a second pin 56 ( FIG. 1B ) is inserted through wall 10 L to engage with the teeth of gear GL to thereby prevent holder 12 from rotating during loading or unloading.
- an opening can be provided in gear GL, and pin 56 is inserted through wall 10 L and the opening in gear GL.
- mandrels MO associated with the portion of holder 12 being accessed. As shown in FIGS. 2A-2C , mandrels MO are removable. When mandrels MO are removed (e.g. as shown in FIG. 2B ), one can remove substrates S from holder 12 , or load substrates S into holders 12 .
- mandrels MO extend through left and right locking plates 30 L, 30 R ( FIGS. 3A, 3B ).
- Springs 32 are coupled to an end of mandrels MO, and urge plates 30 L, 30 R against end pieces EL, ER.
- a set of pins 34 extends through openings 35 of plates 30 L, 30 R to hold plates 30 L, 30 R in place.
- One removes mandrels MO by pushing plates 30 L, 30 R away from end pieces EL, ER, past the end of pins 34 .
- One can then remove mandrels MO and load substrates S into holder 12 .
- mandrels MO thereafter, one reattaches mandrels MO to holder 12 .
- Pin 56 is removed, and holder 12 is rotated so that a second portion of the holder can be accessed.
- Mandrels MO associated with that second portion are removed, substrates are loaded therein, and mandrels MO are reattached.
- the third portion of holder 12 is similarly loaded.
- Holder 12 is then placed back into openings 25 L, 25 R, and wheels WL, WR are rotated so that one can access a second one of holders 12 .
- the second, third and fourth holders are then loaded, and locking pieces 26 L, 26 R are re-inserted into rings 24 L, 24 R.
- Apparatus 10 is then placed into bath 8 , and motor 10 is turned on to impart motion to substrates S.
- apparatus 10 is removed from bath 8 , mandrels MO are removed, and substrates S are removed from holders 12 . (As shown in FIGS. 2 and 3 , mandrels MO are typically removed and replaced two at a time, although in other embodiments this is not necessary.)
- slots 60 are provided in the end plate ER of holders 12 to facilitate loading substrates S into and removing substrates S from holder 12 .
- a U-shaped tool 62 FIG. 4
- Tool 62 is passed through openings 0 in substrates S.
- Tool 62 is passed through slot 60 so that substrates S are positioned so as to rest against mandrels MC and MI (direction 64 ).
- Tool 62 is then withdrawn (direction 66 ) so that it no longer extends through openings 0 and slot 60 .
- Mandrels MO are then attached to holder 12 .
- tool 62 is passed through slot 60 and openings O of substrates S (direction 68 ).
- Tool 62 is then lifted and through the inner diameter of substrates S (direction 70 ).
- end pieces EL and ER are metallic (e.g. electropolished stainless steel).
- end plates have improved dimensional stability compared, for example, to plastics such as PVDF, which can shrink as a result of exposure to the plating environment.
- the end pieces can be passivated.
- metallic end pieces have the additional advantage that during plating, the electrochemical environment of the surfaces of the outer substrates S directly adjacent end pieces EL and ER is similar to the electrochemical environment of the other substrates. If end pieces EL and ER were plastic, the electrochemical environment of the substrates directly adjacent to end pieces EL and ER would differ from the electrochemical environment of the other substrates, and thus the plated surfaces of the substrates directly adjacent end pieces EL and ER might not be sufficiently identical to those of the other surfaces. (This can occur because a different concentration of atoms to be plated would diffuse to the interior substrates compared to the substrates directly adjacent plates EL and ER.) Accordingly, there is a novel advantage to using metallic end pieces EL and ER.
- portions of the apparatus subject to the plating bath are metal
- FIG. 10 illustrates an alternative embodiment of apparatus 100 for holding and moving substrates such as substrate S during plating.
- Apparatus 100 comprises four holders 102 ( FIG. 11 ), each holder 102 comprising four mandrels M.
- One of the mandrels M′ is removable from holder 102 to facilitate loading and unloading of substrates S into and from holder 102 .
- Mcandrel M′ is held in place by screws 104 a, 104 b that are removed when loading or unloading holder 102 .
- Holder 102 also includes left and right end pieces EL′, ER′ for holding mandrels M. Each holder coupled to a gear mechanism (similar to the gear mechanism described above) for imparting planetary motion to the substrates.
- a method and apparatus in accordance with our invention can be used to plate various types of materials, e.g. nickel phosphorus alloys, other metals, or non-metallic materials.
- the method and apparatus can be used to plate workpieces other than magnetic disk substrates.
- workpieces encompasses articles to be plated.
- the mandrels may comprise concave regions for holding a portion of the arc of the outer edge of the substrates being plated. Also, in some embodiments, there may be sufficient clearance for the substrates to have some degree of movement while being held by the mandrels, whereas in other embodiments, the substrates may be firmly held by the mandrels.
Abstract
Description
- This Application is a continuation-in-part of co-pending U.S. Patent Application Ser. No. 10/853,953, filed May 26, 2004, incorporated herein by reference.
- This invention relates to methods and apparatus for plating substrates.
- There are various manufacturing processes during which one plates substrates. For example, during some processes for making magnetic disks, one places an aluminum alloy substrate in a plating bath to electroless plate a nickel-phosphorus alloy layer onto the substrate. Thereafter, the plated substrate is polished and textured, and one or more underlayers, one or more magnetic layers, and one or more protective overcoats are deposited (e.g. by sputtering) onto the plated substrate. (During some manufacturing processes, other layers are deposited onto the substrate as well.) Merely by way of example, one method for polishing a substrate is discussed in U.S. Pat. No. 6,149,696, issued to Jia on Nov. 21, 2000. A method for texturing a substrate is discussed in U.S. patent application Ser. No. 10/299,029, filed by Homola on Nov. 18, 2002. A method for depositing various layers onto a plated substrate is discussed in U.S. patent application Ser. No. 10/075,123, filed by Bertero et al. on Feb. 12, 2002. Jia, Homola and Bertero are incorporated by reference.
- Apparatus for plating magnetic disk substrates is discussed in U.S. Pat. No. 4,581,260, issued to Mawla on Apr. 8, 1986; U.S. Pat. No. 4,516,523 issued to Knox on May 14, 1985; and U.S. Pat. No. 5,951,763, issued to Knox on Sep. 14, 1999. In these devices the substrates are held by a dowel extending through the central opening in the substrates. The substrates are then moved through a plating bath. During plating, the substrates can wobble. Imperfections may result if they touch one another. One could try to prevent the substrates from touching one another by increasing the distance between adjacent substrates, but that would reduce the number of substrates that could be plated at one time.
- Apparatus in accordance with one embodiment of our invention comprises a novel structure for holding substrates during plating. The substrates are typically planar and disk-shaped. The novel holding structure comprises a set of mandrels. (As used herein, mandrels are elongated members.) The mandrels are typically cylindrical, and typically comprise notches for receiving the outer edges of the substrates. However, in other embodiments, the mandrels are not cylindrical, and do not have circular cross sections. Also, in other embodiments, the mandrels do not have notches.
- In one embodiment, the holding structure holds one or more sets of substrates, each substrate within a set being generally parallel to the other substrates within that set. In one embodiment, each substrate is held at its outer edge by the mandrels. Because of this, the substrates do not wobble during plating, and therefore do not touch each other during plating.
- At least one of the mandrels is removable to facilitate loading and unloading of the substrates from the holding structure. The substrates can be magnetic disk substrates having a central opening therein. Because of the manner in which the substrates are held at their outer edges, it is easier to load and unload the substrates compared to earlier substrate plating apparatus in which the substrates were held by a dowel extending through their central opening.
- In one embodiment, each set is held by one side of the central mandrel and an associated set of one or more outer mandrels. (The mandrels hold the set of substrates at the outer edges of the substrates.) Thus, a plurality of sets of substrates abuts the central mandrel. In one exemplary embodiment, three sets of substrates abut the central mandrel. The first, second and third set of substrates abut a top, lower left and lower right side of the central mandrel, respectively. This arrangement of substrates permits a larger number of substrates to be held in a given volume than if the plurality of sets of substrates did not abut a common central mandrel.
- In one embodiment, a gear mechanism imparts planetary motion to the substrates during plating. This gear mechanism is mechanically coupled to the holding structure.
- The mandrels are typically held on their left and right ends by a left plate and a right plate, respectively. (In one embodiment, the mandrels are parallel.) At least some of the mandrels are removable to permit one to load and unload substrates into and from the holding structure. The plates comprise a slot that permits use of a tool to load and unload the holding structure. The tool comprises a mandrel for extending through an opening in the substrates. Thus, during loading and unloading, the tool mandrel is placed in the inner opening of the substrates, and lifts the substrates out of the holding structure.
- A method in accordance with the invention includes the act of placing one or more substrates in a holding structure as described above. The holding structure is coupled to apparatus for moving the substrates (typically in a planetary manner). The apparatus, holding structure, and substrates are placed in a bath where a layer of material is plated onto the substrates. In one embodiment, the substrates are metallic (e.g. aluminum or an aluminum alloy), and a metallic layer (e.g. a nickel phosphorus alloy) is plated onto the substrates. After plating, the apparatus is removed from the bath, and the substrates are removed from the holding structure.
- An apparatus in accordance with another embodiment of the invention comprises a holder for holding one or more substrates during plating. The holder typically has a plastic exterior, and includes a plastic member for coupling with a first race of a bearing. A second race of the bearing is also plastic, and is coupled to a rotating structure that imparts motion to the holder (and therefore to the one or more substrates held by that holder). A metallic interface (typically comprising balls or rollers) is provided between the first and second races. (The metallic interface is typically passivated to prevent the interface from becoming plated during use). Of importance, the bearing permits one to avoid or minimize the motion of plastic against plastic. This reduces the amount of friction, mechanical wear, and most importantly, generation of contaminant particles in the plating bath.
- In one embodiment, a bearing with metallic races (e.g. stainless steel) as well as a metallic interface is employed. In such an embodiment, the races are typically passivated. Although this embodiment may be acceptable, metal-on-metal wearing of the races and the interface may grind away the passivation, thereby exposing metallic surfaces to the plating bath and permitting the bearing to be plated. Further, contamination particles (e.g. plated material on the bearing) may be generated. Accordingly, the embodiment using plastic races may be more desirable.
- In one embodiment, a gear mechanism imparts planetary motion to the one or more substrates within the holder.
- A method in accordance with another embodiment of the invention comprises the act of providing one or more substrates in a holder. The holder is mechanically coupled via a bearing to apparatus for imparting motion to the holder. The holder, one or more substrates and apparatus are placed in a plating bath, and the apparatus imparts motion to the holder. In one embodiment, the holder comprises first and second plastic races, and a metallic mechanical interface (typically a set of metal balls) therebetween. As mentioned above, this reduces the amount of friction, mechanical wear and generation of contaminant particles in the plating bath.
-
FIG. 1A schematically illustrates a plating bath containing apparatus that imparts motion to substrates during plating. -
FIGS. 1B and 1C illustrate portions of the apparatus that impart motion to substrates. -
FIGS. 2A and 2C illustrate a holder that holds substrates in the apparatus ofFIG. 1 .FIG. 2B shows the holder with two of its mandrels removed. -
FIGS. 3A and 3B illustrate a portion of removable mandrels used in conjunction with the holder ofFIGS. 2A to 2C. -
FIG. 4 illustrates a tool for removing substrates from the holder ofFIG. 2 . -
FIG. 5 illustrates in cross section the apparatus ofFIG. 1 . -
FIG. 6 illustrates in cross section the apparatus ofFIG. 5 along lines 6-6. -
FIG. 7 illustrates in cross section the apparatus ofFIG. 5 along lines 7-7. -
FIG. 8 illustrates in cross section the apparatus ofFIG. 5 along lines 8-8. -
FIGS. 9A and 9B illustrate the manner in which a holder is placed into position for loading and unloading. -
FIG. 10 illustrates a second embodiment of apparatus for plating substrates in which the substrates are held at their outer edges. -
FIG. 11 illustrates a holder used in conjunction with the apparatus ofFIG. 10 . - Referring to
FIGS. 1 and 5 , aplating bath 8 containsapparatus 10 for holding and moving substrates S during a plating process. (FIGS. 1B and 1C only show one substrate S. However, typically many substrates are plated simultaneously.) In one embodiment, the substrates comprise an aluminum alloy, and during plating, a layer (typically a metallic layer such as a nickel-phosphorus alloy) is deposited on substrates S. However, in other embodiments, substrates S can comprise other materials, and other types of layers can plated onto substrates S. - In one embodiment, substrates S are disk-shaped, and can include a centrally defined opening O therein. However, in other embodiments, substrates S have other shapes.
- The plating process can be electroless plating or electroplating. Optionally, in the case of electroless plating one can apply a strike voltage to substrates S to facilitate initiation of plating. Alternatively, in some embodiments, a strike voltage is not applied to substrates S. During plating, substrates S are held by four
holders 12, and a drive mechanism imparts planetary motion to these holders (and therefore to the substrates S held by the holders). (Only a part of oneholder 12 is shown inFIGS. 1B, 1C and 5 for ease of illustration.) - Prior to plating,
apparatus 10 is removed frombath 8, and substrates S are loaded into the apparatus.Apparatus 10 is then placed inbath 8 for plating. After plating,apparatus 10 is again removed frombath 8, and substrates S are removed fromapparatus 10. -
Holders 12 - Referring to
FIGS. 1B, 1C and 2A-2C, eachholder 12 typically comprises a central mandrel MC, a set of intermediate mandrels MI, and a set of outer mandrels MO, each connected to left and right end pieces EL and ER, respectively. Mandrels MC, MI and MO and end pieces EL, ER are typically made from a plastic such as PVDF, polypropylene, PFA, PTFE (Teflon) or PEEK. Mandrels MC, MI and MO and end pieces EL, ER are generally not metallic or electrically conductive. Using plastic material forholders 12 has the advantage that when the holders are placed in a plating bath,holders 12 are not plated. However, in an alternative embodiment, end pieces EL and ER are metallic for reasons discussed below. - As described below, outer mandrels MO are removable to facilitate loading or unloading
holders 12 with substrates S. Also, mandrels MC, MI and MO typically comprise notches N for holding substrates S. Mandrels MC, MI and MO cooperate to hold three sets of substrates S. Substrates S are typically generally parallel, each set abutting an associated side of central mandrel MC. - In the illustrated embodiment, mandrel MC, two mandrels MI and two mandrels MO cooperate to hold one set of parallel substrates S. (Mandrels MO are removable; mandrels MC and MI are not removable.)
Holder 12 comprises six removable outer mandrels MO and six non-removable mandrels MI to hold the above-mentioned three sets of substrates S. AlthoughFIGS. 2A, 2B , 2C and 5 only show central mandrel MC, two removable mandrels MO and two non-removable mandrels MI, the side views shown inFIGS. 6, 7 and 8 show the arrangement of all thirteen mandrels in a holder. In addition, inFIG. 7 shows the manner in which one of theholders 12 holds three sets of substrates (sets SA, SB and SC). (FIGS. 6, 7 and 8 also illustrate the manner in whichapparatus 10 contains fourdifferent holders 12.) - Mandrels MC include portions PL, PR (
FIG. 5 ) extending through and past end pieces EL, ER. As explained below, a set of wheels and gears engage portions PL, PR of mandrels MC to impart motion to mandrels MC and therefore toholders 12. (In lieu of having mandrels MC including portions PL, PR extending through and past end pieces EL, ER, in an alternative embodiment, mandrels MC stop at end pieces EL, ER and a separate post is mounted on end pieces EL, ER to engage with the set of wheels and gears.) - Drive Mechanism for Imparting Motion to
Holders 12 - Referring to
FIGS. 1A, 1B and 5, a drive shaft DS of a motor M (typically an electric motor) rotates a drive gear DG, which in turn drives a right drive gear GR1, which in turn drives an idler shaft IS, which in turn drives a left drive gear GL1. Drive gears GR1 and GL1 in turn drive second gears GR2 and GL2. Gears GR2 and GL2 are affixed to wheels WR (FIG. 1B ) and WL (FIG. 1C ), respectively. As described below, wheels WR and WL indirectly engage with central mandrels MC to cause central mandrels MC to rotate about a central axis A (FIGS. 1C and 5 ) of wheels WR and WL. (Wheels WR and WL synchronously rotate about the same axis A.) - Portion PR of central mandrel MC is rigidly connected to an
inner race 16R of a bearing BR (FIG. 2C ). Bearing BR is typically a ball bearing, and can include nine metal balls, e.g. made of stainless steel (not shown). (Alternatively, other materials can be used to construct the bearing, and different numbers of balls can be used. In addition, rollers can be used in lieu of balls.) Anouter race 18R of bearing BR rides in anopening 22R of wheel WR (FIG. 1B ). As mentioned above, during use ofapparatus 10, wheel WR rotates about its central axis A, thereby causing central mandrel MC,holder 12 and the substrates held byholder 12 to rotate about axis A. (Wheel WR is surrounded by astationary ring 24R, which prevents bearing BR from falling out ofopening 22R.) As mentioned above, in one embodiment, first andsecond races apparatus 10. - As shown in
FIG. 1B , wheel WR includesadditional openings 22R′ (identical toopening 22R). These openings accommodateother holders 12 that are not shown inFIG. 1B for ease of illustration. -
Ring 24R contains anopening 25R (FIG. 1B ) for permitting one to placeholder 12 into or removeholder 12 fromapparatus 10. During use, alocking piece 26R (FIG. 1C ) is placed in opening 25R to preventholder 12 from falling out ofapparatus 10. - Portion PL of central mandrel MC is rigidly connected to a gear GL and an
inner race 16L of bearing BL (FIG. 2A ). Bearing BL is identical to bearing BR, and rides in an opening in wheel WL (FIG. 1C ) in the same manner as bearing BR rides inopening 22R.Ring 24R surrounds wheel WR and prevents bearing BR from falling out ofopening 22R. -
FIG. 1C shows threeopenings 22L′ in wheel WL for accommodating additional holders, not shown inFIG. 1C for ease of illustration.Ring 24L includes anopening 25L (FIG. 1B ) for permitting one to placeholder 12 in or removeholder 12 fromapparatus 10. During use alocking piece 26L (FIG. 1C ) is placed in opening 25L to preventholder 12 from falling out ofapparatus 10. - Referring to
FIG. 1C andFIG. 5 , Gear GL (rigidly connected to portion PL of mandrel MC) engages with a stationary gear GL4 to causeholder 12 to rotate about mandrel MC, and thereby impart planetary motion toholder 12 and substrates S. The other holders 12 (not shown inFIGS. 1A-1C and 5) are similarly coupled to the gear mechanism ofapparatus 10. - The major difference between the drive mechanism on the right and left sides of
apparatus 10 is that in the illustrated embodiment, there are no gears analogous to gear GL and GL4 on the right side ofapparatus 10 for causingholder 12 to rotate about the central axis of gear GL. However, in alternate embodiments, gears analogous to gear GL and GL4 are provided on the right side ofapparatus 10, either in addition to or in lieu of gear GL. - Loading and Unloading Substrates From
Apparatus 10 - As mentioned above, before plating, one loads substrates S into
apparatus 10. After plating one removes substrates S fromapparatus 10. Typically, one loads and unloads oneholder 12 at a time. This is accomplished by a) movingholder 12 into a position where it can be loaded and unloaded; and then b) removing mandrels MO to load or unloadholder 12. - To move one of
holders 12 into a position where it may be loaded or unloaded, one first rotates wheels WL, WR untilopenings openings FIGS. 1B and 9A ). One then removes locking pieces 26 fromrings walls apparatus 10 and through an opening in lockingpieces pins 50L, 50R before removinglocking pieces FIG. 1B .) Thereafter, one pushes bearings BL, BR into anindentation 54L, 54R in the bottom ofopenings FIGS. 9A and 9B illustrateindentation 54R at the bottom ofopening 25R.) - One then rotates
holder 12 so that one can access a desired portion ofholder 12. A second pin 56 (FIG. 1B ) is inserted throughwall 10L to engage with the teeth of gear GL to thereby preventholder 12 from rotating during loading or unloading. (In an alternative embodiment, instead of engaging with the teeth of gear GL, an opening can be provided in gear GL, andpin 56 is inserted throughwall 10L and the opening in gear GL.) - Thereafter, one removes the mandrels MO associated with the portion of
holder 12 being accessed. As shown inFIGS. 2A-2C , mandrels MO are removable. When mandrels MO are removed (e.g. as shown inFIG. 2B ), one can remove substrates S fromholder 12, or load substrates S intoholders 12. - In one embodiment, mandrels MO extend through left and
right locking plates FIGS. 3A, 3B ).Springs 32 are coupled to an end of mandrels MO, andurge plates pins 34 extends throughopenings 35 ofplates plates plates pins 34. One can then remove mandrels MO and load substrates S intoholder 12. - Thereafter, one reattaches mandrels MO to
holder 12.Pin 56 is removed, andholder 12 is rotated so that a second portion of the holder can be accessed. Mandrels MO associated with that second portion are removed, substrates are loaded therein, and mandrels MO are reattached. The third portion ofholder 12 is similarly loaded.Holder 12 is then placed back intoopenings holders 12. The second, third and fourth holders are then loaded, and lockingpieces rings Apparatus 10 is then placed intobath 8, andmotor 10 is turned on to impart motion to substrates S. After plating,apparatus 10 is removed frombath 8, mandrels MO are removed, and substrates S are removed fromholders 12. (As shown inFIGS. 2 and 3 , mandrels MO are typically removed and replaced two at a time, although in other embodiments this is not necessary.) - In one embodiment,
slots 60 are provided in the end plate ER ofholders 12 to facilitate loading substrates S into and removing substrates S fromholder 12. In particular, during loading a U-shaped tool 62 (FIG. 4 ) is passed throughopenings 0 insubstrates S. Tool 62 is passed throughslot 60 so that substrates S are positioned so as to rest against mandrels MC and MI (direction 64).Tool 62 is then withdrawn (direction 66) so that it no longer extends throughopenings 0 andslot 60. Mandrels MO are then attached toholder 12. During unloading,tool 62 is passed throughslot 60 and openings O of substrates S (direction 68).Tool 62 is then lifted and through the inner diameter of substrates S (direction 70). One can then pulltool 62 throughslot 60 to remove the substrates. - Embodiment in Which End Pieces EL and ER are Metallic
- As mentioned above, in some embodiments end pieces EL and ER are metallic (e.g. electropolished stainless steel). Advantageously, such end plates have improved dimensional stability compared, for example, to plastics such as PVDF, which can shrink as a result of exposure to the plating environment. Optionally, the end pieces can be passivated.
- In another embodiment, metallic end pieces have the additional advantage that during plating, the electrochemical environment of the surfaces of the outer substrates S directly adjacent end pieces EL and ER is similar to the electrochemical environment of the other substrates. If end pieces EL and ER were plastic, the electrochemical environment of the substrates directly adjacent to end pieces EL and ER would differ from the electrochemical environment of the other substrates, and thus the plated surfaces of the substrates directly adjacent end pieces EL and ER might not be sufficiently identical to those of the other surfaces. (This can occur because a different concentration of atoms to be plated would diffuse to the interior substrates compared to the substrates directly adjacent plates EL and ER.) Accordingly, there is a novel advantage to using metallic end pieces EL and ER.
- At least some of the above-mentioned advantage concerning the electrochemical environment for the outer substrates is present even if end plates EL, ER are passivated. However, in lieu of using metallic end plates EL, ER, one could use “dummy substrates” adjacent end pieces EL and ER to achieve this result.
- In embodiments in which portions of the apparatus subject to the plating bath are metal, optionally, one may subject the apparatus to a stripping and re-passivating operation between plating steps or as desired.
- Alternative Embodiment of Apparatus for Holding Substrates
-
FIG. 10 illustrates an alternative embodiment ofapparatus 100 for holding and moving substrates such as substrate S during plating.Apparatus 100 comprises four holders 102 (FIG. 11 ), each holder 102 comprising four mandrels M. One of the mandrels M′ is removable from holder 102 to facilitate loading and unloading of substrates S into and from holder 102. (Mandrel M′ is held in place by screws 104 a, 104 b that are removed when loading or unloading holder 102.) - Holder 102 also includes left and right end pieces EL′, ER′ for holding mandrels M. Each holder coupled to a gear mechanism (similar to the gear mechanism described above) for imparting planetary motion to the substrates.
- While the invention has been described with respect to specific embodiments, those skilled in the art will appreciate that changes can be made in form and detail. For example, a method and apparatus in accordance with our invention can be used to plate various types of materials, e.g. nickel phosphorus alloys, other metals, or non-metallic materials. The method and apparatus can be used to plate workpieces other than magnetic disk substrates. As used herein, “workpieces” encompasses articles to be plated. When practicing the invention, one can either a) place the plating solution in the bath prior to placing substrates in the bath; b) place the substrates in the bath prior to placing the plating solution in the bath; or c) place the plating solution and substrates in the bath simultaneously.
- In some embodiments, the mandrels may comprise concave regions for holding a portion of the arc of the outer edge of the substrates being plated. Also, in some embodiments, there may be sufficient clearance for the substrates to have some degree of movement while being held by the mandrels, whereas in other embodiments, the substrates may be firmly held by the mandrels.
-
Pins 50 and 56 and locking pieces 26 can be tied to strings (not shown) so that they can easily be retrieved if they accidentally fall intobath 8. In lieu of engaging with gear GL, pin 56 can be pushed throughwall 10R and engage with end piece ER. - It is also noted that one aspect of the invention as described above may be practiced without practicing other aspects of the invention. Accordingly, all such changes come within our invention.
Claims (49)
Priority Applications (2)
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US11/088,052 US20050263401A1 (en) | 2004-05-26 | 2005-03-23 | Method and apparatus for plating substrates |
JP2005182579A JP2005336618A (en) | 2004-05-26 | 2005-05-26 | Method for plating substrate, and apparatus therefor |
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US10/853,953 US7498062B2 (en) | 2004-05-26 | 2004-05-26 | Method and apparatus for applying a voltage to a substrate during plating |
US11/088,052 US20050263401A1 (en) | 2004-05-26 | 2005-03-23 | Method and apparatus for plating substrates |
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US12/371,397 Expired - Fee Related US7758732B1 (en) | 2004-05-26 | 2009-02-13 | Method and apparatus for applying a voltage to a substrate during plating |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7758732B1 (en) | 2004-05-26 | 2010-07-20 | Wd Media, Inc. | Method and apparatus for applying a voltage to a substrate during plating |
US20110076412A1 (en) * | 2009-09-29 | 2011-03-31 | Schieszer Larry J | Wood grilling plank soaking device |
US20110097604A1 (en) * | 2008-03-31 | 2011-04-28 | Wd Media (Singapore) Pte. Ltd. | Perpendicular magnetic recording medium |
US20110097603A1 (en) * | 2008-03-26 | 2011-04-28 | Wd Media (Singapore) Pte. Ltd. | Perpendicular magnetic recording medium and process for manufacture thereof |
US20120100287A1 (en) * | 2010-10-20 | 2012-04-26 | Seagate Technology, Llc | Laminar flow plating rack |
US8267831B1 (en) | 2009-05-19 | 2012-09-18 | Western Digital Technologies, Inc. | Method and apparatus for washing, etching, rinsing, and plating substrates |
US8828566B2 (en) | 2010-05-21 | 2014-09-09 | Wd Media (Singapore) Pte. Ltd. | Perpendicular magnetic recording disc |
US8859118B2 (en) | 2010-01-08 | 2014-10-14 | Wd Media (Singapore) Pte. Ltd. | Perpendicular magnetic recording medium |
US8867322B1 (en) | 2013-05-07 | 2014-10-21 | WD Media, LLC | Systems and methods for providing thermal barrier bilayers for heat assisted magnetic recording media |
US8877359B2 (en) | 2008-12-05 | 2014-11-04 | Wd Media (Singapore) Pte. Ltd. | Magnetic disk and method for manufacturing same |
US8908315B2 (en) | 2010-03-29 | 2014-12-09 | Wd Media (Singapore) Pte. Ltd. | Evaluation method of magnetic disk, manufacturing method of magnetic disk, and magnetic disk |
US8941950B2 (en) | 2012-05-23 | 2015-01-27 | WD Media, LLC | Underlayers for heat assisted magnetic recording (HAMR) media |
US8947987B1 (en) | 2013-05-03 | 2015-02-03 | WD Media, LLC | Systems and methods for providing capping layers for heat assisted magnetic recording media |
US8951651B2 (en) | 2010-05-28 | 2015-02-10 | Wd Media (Singapore) Pte. Ltd. | Perpendicular magnetic recording disk |
US8980076B1 (en) | 2009-05-26 | 2015-03-17 | WD Media, LLC | Electro-deposited passivation coatings for patterned media |
US8993134B2 (en) | 2012-06-29 | 2015-03-31 | Western Digital Technologies, Inc. | Electrically conductive underlayer to grow FePt granular media with (001) texture on glass substrates |
US8995078B1 (en) | 2014-09-25 | 2015-03-31 | WD Media, LLC | Method of testing a head for contamination |
US9001630B1 (en) | 2011-03-08 | 2015-04-07 | Western Digital Technologies, Inc. | Energy assisted magnetic recording medium capable of suppressing high DC readback noise |
US9005782B2 (en) | 2008-03-30 | 2015-04-14 | WD Media, LLC | Magnetic disk and method of manufacturing the same |
US9025264B1 (en) | 2011-03-10 | 2015-05-05 | WD Media, LLC | Methods for measuring media performance associated with adjacent track interference |
US9028985B2 (en) | 2011-03-31 | 2015-05-12 | WD Media, LLC | Recording media with multiple exchange coupled magnetic layers |
US9029308B1 (en) | 2012-03-28 | 2015-05-12 | WD Media, LLC | Low foam media cleaning detergent |
US9034492B1 (en) | 2013-01-11 | 2015-05-19 | WD Media, LLC | Systems and methods for controlling damping of magnetic media for heat assisted magnetic recording |
US9042053B1 (en) | 2014-06-24 | 2015-05-26 | WD Media, LLC | Thermally stabilized perpendicular magnetic recording medium |
US9047880B1 (en) | 2011-12-20 | 2015-06-02 | WD Media, LLC | Heat assisted magnetic recording method for media having moment keeper layer |
US9064521B1 (en) | 2011-03-25 | 2015-06-23 | WD Media, LLC | Manufacturing of hard masks for patterning magnetic media |
US9082447B1 (en) | 2014-09-22 | 2015-07-14 | WD Media, LLC | Determining storage media substrate material type |
US9093122B1 (en) | 2013-04-05 | 2015-07-28 | WD Media, LLC | Systems and methods for improving accuracy of test measurements involving aggressor tracks written to disks of hard disk drives |
US9093100B2 (en) | 2008-03-17 | 2015-07-28 | Wd Media (Singapore) Pte. Ltd. | Magnetic recording medium including tailored exchange coupling layer and manufacturing method of the same |
US9142241B2 (en) | 2009-03-30 | 2015-09-22 | Wd Media (Singapore) Pte. Ltd. | Perpendicular magnetic recording medium and method of manufacturing the same |
US9153268B1 (en) | 2013-02-19 | 2015-10-06 | WD Media, LLC | Lubricants comprising fluorinated graphene nanoribbons for magnetic recording media structure |
US9159350B1 (en) | 2014-07-02 | 2015-10-13 | WD Media, LLC | High damping cap layer for magnetic recording media |
US9177586B2 (en) | 2008-09-30 | 2015-11-03 | WD Media (Singapore), LLC | Magnetic disk and manufacturing method thereof |
US9177585B1 (en) | 2013-10-23 | 2015-11-03 | WD Media, LLC | Magnetic media capable of improving magnetic properties and thermal management for heat-assisted magnetic recording |
US9183867B1 (en) | 2013-02-21 | 2015-11-10 | WD Media, LLC | Systems and methods for forming implanted capping layers in magnetic media for magnetic recording |
US9190094B2 (en) | 2013-04-04 | 2015-11-17 | Western Digital (Fremont) | Perpendicular recording media with grain isolation initiation layer and exchange breaking layer for signal-to-noise ratio enhancement |
US9196283B1 (en) | 2013-03-13 | 2015-11-24 | Western Digital (Fremont), Llc | Method for providing a magnetic recording transducer using a chemical buffer |
CN105133000A (en) * | 2015-08-27 | 2015-12-09 | 深圳市佳易研磨有限公司 | Horizontal rotating hanger device |
US9218850B1 (en) | 2014-12-23 | 2015-12-22 | WD Media, LLC | Exchange break layer for heat-assisted magnetic recording media |
US9227324B1 (en) | 2014-09-25 | 2016-01-05 | WD Media, LLC | Mandrel for substrate transport system with notch |
US9240204B2 (en) | 2010-05-21 | 2016-01-19 | Wd Media (Singapore) Pte. Ltd. | Perpendicular magnetic recording disc |
US9257134B1 (en) | 2014-12-24 | 2016-02-09 | Western Digital Technologies, Inc. | Allowing fast data zone switches on data storage devices |
US9269480B1 (en) | 2012-03-30 | 2016-02-23 | WD Media, LLC | Systems and methods for forming magnetic recording media with improved grain columnar growth for energy assisted magnetic recording |
US9275669B1 (en) | 2015-03-31 | 2016-03-01 | WD Media, LLC | TbFeCo in PMR media for SNR improvement |
US9280998B1 (en) | 2015-03-30 | 2016-03-08 | WD Media, LLC | Acidic post-sputter wash for magnetic recording media |
US9296082B1 (en) | 2013-06-11 | 2016-03-29 | WD Media, LLC | Disk buffing apparatus with abrasive tape loading pad having a vibration absorbing layer |
US9330685B1 (en) | 2009-11-06 | 2016-05-03 | WD Media, LLC | Press system for nano-imprinting of recording media with a two step pressing method |
US9339978B1 (en) | 2009-11-06 | 2016-05-17 | WD Media, LLC | Press system with interleaved embossing foil holders for nano-imprinting of recording media |
US9349404B2 (en) | 2010-05-28 | 2016-05-24 | Wd Media (Singapore) Pte. Ltd | Perpendicular magnetic recording disc |
US20160160352A1 (en) * | 2011-11-16 | 2016-06-09 | Ebara Corporation | Electroless plating apparatus |
US9382496B1 (en) | 2013-12-19 | 2016-07-05 | Western Digital Technologies, Inc. | Lubricants with high thermal stability for heat-assisted magnetic recording |
US9389135B2 (en) | 2013-09-26 | 2016-07-12 | WD Media, LLC | Systems and methods for calibrating a load cell of a disk burnishing machine |
US9401300B1 (en) | 2014-12-18 | 2016-07-26 | WD Media, LLC | Media substrate gripper including a plurality of snap-fit fingers |
US9406330B1 (en) | 2013-06-19 | 2016-08-02 | WD Media, LLC | Method for HDD disk defect source detection |
US9406329B1 (en) | 2015-11-30 | 2016-08-02 | WD Media, LLC | HAMR media structure with intermediate layer underlying a magnetic recording layer having multiple sublayers |
US9431045B1 (en) | 2014-04-25 | 2016-08-30 | WD Media, LLC | Magnetic seed layer used with an unbalanced soft underlayer |
US9449633B1 (en) | 2014-11-06 | 2016-09-20 | WD Media, LLC | Smooth structures for heat-assisted magnetic recording media |
US9447368B1 (en) | 2014-02-18 | 2016-09-20 | WD Media, LLC | Detergent composition with low foam and high nickel solubility |
US9472227B2 (en) | 2010-06-22 | 2016-10-18 | Wd Media (Singapore) Pte. Ltd. | Perpendicular magnetic recording media and methods for producing the same |
US9542968B1 (en) | 2010-08-20 | 2017-01-10 | WD Media, LLC | Single layer small grain size FePT:C film for heat assisted magnetic recording media |
US9558778B2 (en) | 2009-03-28 | 2017-01-31 | Wd Media (Singapore) Pte. Ltd. | Lubricant compound for magnetic disk and magnetic disk |
US9581510B1 (en) | 2013-12-16 | 2017-02-28 | Western Digital Technologies, Inc. | Sputter chamber pressure gauge with vibration absorber |
US9607646B2 (en) | 2013-07-30 | 2017-03-28 | WD Media, LLC | Hard disk double lubrication layer |
US9685184B1 (en) | 2014-09-25 | 2017-06-20 | WD Media, LLC | NiFeX-based seed layer for magnetic recording media |
US9818442B2 (en) | 2014-12-01 | 2017-11-14 | WD Media, LLC | Magnetic media having improved magnetic grain size distribution and intergranular segregation |
US9824711B1 (en) | 2014-02-14 | 2017-11-21 | WD Media, LLC | Soft underlayer for heat assisted magnetic recording media |
US9822441B2 (en) | 2015-03-31 | 2017-11-21 | WD Media, LLC | Iridium underlayer for heat assisted magnetic recording media |
US9990940B1 (en) | 2014-12-30 | 2018-06-05 | WD Media, LLC | Seed structure for perpendicular magnetic recording media |
US10054363B2 (en) | 2014-08-15 | 2018-08-21 | WD Media, LLC | Method and apparatus for cryogenic dynamic cooling |
US10083715B2 (en) | 2010-05-28 | 2018-09-25 | WD Media (Singapore) Pte.Ltd. | Method of manufacturing a perpendicular magnetic disc |
US10115428B1 (en) | 2013-02-15 | 2018-10-30 | Wd Media, Inc. | HAMR media structure having an anisotropic thermal barrier layer |
US10121506B1 (en) | 2015-12-29 | 2018-11-06 | WD Media, LLC | Magnetic-recording medium including a carbon overcoat implanted with nitrogen and hydrogen |
US10236026B1 (en) | 2015-11-06 | 2019-03-19 | WD Media, LLC | Thermal barrier layers and seed layers for control of thermal and structural properties of HAMR media |
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US11074934B1 (en) | 2015-09-25 | 2021-07-27 | Western Digital Technologies, Inc. | Heat assisted magnetic recording (HAMR) media with Curie temperature reduction layer |
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US11543454B2 (en) | 2018-09-25 | 2023-01-03 | Intel Corporation | Double-beam test probe |
US11674980B2 (en) | 2017-09-29 | 2023-06-13 | Intel Corporation | Low-profile gimbal platform for high-resolution in situ co-planarity adjustment |
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US7776189B2 (en) * | 2006-03-07 | 2010-08-17 | Abbott Laboratories | Method and apparatus for electropolishing metallic stents |
US8323459B2 (en) * | 2008-04-10 | 2012-12-04 | Abbott Cardiovascular Systems Inc. | Automated electropolishing process |
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HUE039958T2 (en) * | 2015-12-08 | 2019-02-28 | Schaeffler Technologies Ag | Frame for mounting of annular components and method |
IT201800010055A1 (en) * | 2018-11-06 | 2020-05-06 | Stefano Zini | EQUIPMENT FOR ELECTROLYTIC COATING TREATMENTS. |
Citations (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US655972A (en) * | 1899-12-09 | 1900-08-14 | Reinhold Hakewessell | Clutch. |
US1453419A (en) * | 1921-09-12 | 1923-05-01 | Wm A Rogers Ltd | Electroplating apparatus |
US1475937A (en) * | 1919-09-30 | 1923-12-04 | Hanson & Van Winkle Co | Phonograph-record matrix and method and apparatus for producing same |
US2211295A (en) * | 1938-04-09 | 1940-08-13 | Fafnir Bearing Co | Bearing device |
US2244197A (en) * | 1936-03-25 | 1941-06-03 | Hessler Christian Rudolph | Bearing |
US2979452A (en) * | 1954-08-23 | 1961-04-11 | Nat Forge Co | Apparatus for electroplating crankshaft journals |
US3304138A (en) * | 1964-08-14 | 1967-02-14 | Gen Motors Corp | Antifriction bearing |
US3607712A (en) * | 1969-01-21 | 1971-09-21 | Ionic International Inc | Barrel-type processing apparatus |
US3640592A (en) * | 1969-10-23 | 1972-02-08 | Textron Inc | Antifriction bearing with embedded race inserts |
US3880480A (en) * | 1971-07-06 | 1975-04-29 | Trw Inc | Nonmetallic bearing housing |
US4105310A (en) * | 1975-12-24 | 1978-08-08 | Minolta Camera Kabushiki Kaisha | Indicating device for motion picture camera |
US4305804A (en) * | 1980-05-07 | 1981-12-15 | Harshaw Chemical Company | Plating barrel contact |
US4311111A (en) * | 1978-12-27 | 1982-01-19 | Kogyo K. K. Yoshida | Apparatus for painting a multiplicity of parts together |
US4324441A (en) * | 1980-10-24 | 1982-04-13 | Rouverol William S | Rolling contact element |
US4344657A (en) * | 1978-12-31 | 1982-08-17 | Sro Kugellagerwerke J. Schmid-Roost Ag | Axial/rotary guide element |
US4516523A (en) * | 1983-12-16 | 1985-05-14 | Knox David J | Apparatus for wetting apertured discs |
US4581260A (en) * | 1984-09-25 | 1986-04-08 | Ampex Corporation | Electroless plating method and apparatus |
US4855020A (en) * | 1985-12-06 | 1989-08-08 | Microsurface Technology Corp. | Apparatus and method for the electrolytic plating of layers onto computer memory hard discs |
US4951763A (en) * | 1989-11-13 | 1990-08-28 | Hi-Speed Checkweigher Co., Inc. | Checkweigher |
US5174045A (en) * | 1991-05-17 | 1992-12-29 | Semitool, Inc. | Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers |
US5176456A (en) * | 1989-05-01 | 1993-01-05 | Koyo Seiko Co., Ltd. | Rolling bearing |
US5264256A (en) * | 1992-09-08 | 1993-11-23 | Xerox Corporation | Apparatus and process for glow discharge comprising substrate temperature control by shutter adjustment |
US5275184A (en) * | 1990-10-19 | 1994-01-04 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system |
US5358460A (en) * | 1993-01-25 | 1994-10-25 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flex-gear power transmission system for transmitting EMF between sun and ring gears |
US5716147A (en) * | 1997-02-07 | 1998-02-10 | Emerson Power Transmission Corp. | Corrosion-resistant bearing assembly |
US5750207A (en) * | 1995-02-17 | 1998-05-12 | Si Diamond Technology, Inc. | System and method for depositing coating of modulated composition |
US5951763A (en) * | 1998-02-09 | 1999-09-14 | Knox; David J. | Immersible rotatable carousel apparatus for wetting articles of manufacture |
US5997947A (en) * | 1998-04-29 | 1999-12-07 | United Technologies Corporation | Rotisserie fixture for coating airfoils |
US6065123A (en) * | 1995-03-06 | 2000-05-16 | Intel Corporation | Computer system with unattended on-demand availability |
US6065615A (en) * | 1996-02-28 | 2000-05-23 | Asahi Glass Company, Ltd. | Vertical wafer boat |
US6089377A (en) * | 1996-08-26 | 2000-07-18 | Nec Corporation | Semiconductor wafer carrier |
US6099302A (en) * | 1998-06-23 | 2000-08-08 | Samsung Electronics Co., Ltd. | Semiconductor wafer boat with reduced wafer contact area |
US6216709B1 (en) * | 1998-09-04 | 2001-04-17 | Komag, Inc. | Method for drying a substrate |
US6341935B1 (en) * | 2000-06-14 | 2002-01-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer boat having improved wafer holding capability |
US6370791B1 (en) * | 2000-03-10 | 2002-04-16 | Semitool, Inc. | Processing machine with lockdown rotor |
US6372303B1 (en) * | 1997-06-16 | 2002-04-16 | Robert Bosch Gmbh | Method and device for vacuum-coating a substrate |
US6528124B1 (en) * | 2000-12-01 | 2003-03-04 | Komag, Inc. | Disk carrier |
US6558750B2 (en) * | 2001-07-16 | 2003-05-06 | Technic Inc. | Method of processing and plating planar articles |
US6568412B2 (en) * | 2000-02-28 | 2003-05-27 | Tokyo Electron Limited | Rotary processing apparatus with holding bars having drain grooves |
US6617540B2 (en) * | 1999-04-15 | 2003-09-09 | Integrated Materials, Inc. | Wafer support fixture composed of silicon |
US6660104B2 (en) * | 2000-07-07 | 2003-12-09 | Semitool, Inc. | Dual cassette centrifugal processor |
US6664122B1 (en) * | 2001-10-19 | 2003-12-16 | Novellus Systems, Inc. | Electroless copper deposition method for preparing copper seed layers |
US6663762B2 (en) * | 1996-07-15 | 2003-12-16 | Semitool, Inc. | Plating system workpiece support having workpiece engaging electrode |
US6673216B2 (en) * | 1999-08-31 | 2004-01-06 | Semitool, Inc. | Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing |
US6709563B2 (en) * | 2000-06-30 | 2004-03-23 | Ebara Corporation | Copper-plating liquid, plating method and plating apparatus |
US6852208B2 (en) * | 2000-03-17 | 2005-02-08 | Nutool, Inc. | Method and apparatus for full surface electrotreating of a wafer |
US7498062B2 (en) * | 2004-05-26 | 2009-03-03 | Wd Media, Inc. | Method and apparatus for applying a voltage to a substrate during plating |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3137246A (en) * | 1962-03-05 | 1964-06-16 | Huss Equipment Corp | Carrier fixtures |
JPS61133380A (en) * | 1984-12-03 | 1986-06-20 | Katsukawa Kogyo Kk | Chemical surface treatment |
JPS61200874A (en) * | 1985-02-28 | 1986-09-05 | Mitsui Kinzoku Eng Kk | Apparatus for surface treatment of small steel article |
JPH0627352B2 (en) * | 1985-08-06 | 1994-04-13 | 日本電気株式会社 | Carousel for surface treatment equipment |
JPS62183036A (en) * | 1986-02-06 | 1987-08-11 | Chuo Seisakusho:Kk | Plating equipment for magnetic disc base |
JPH01275771A (en) * | 1988-04-28 | 1989-11-06 | Brother Ind Ltd | Electroless plating device and electroless plating method using the device |
DE4209732A1 (en) * | 1992-03-25 | 1993-09-30 | Schloetter Ges Mbh Salzburg | Installation for applying galvanic coatings to elongate metal objects - with fixed guideway plates and a rotatable carrier shaft with transport arms |
JP2877218B2 (en) * | 1993-03-29 | 1999-03-31 | 日本軽金属株式会社 | Surface treatment equipment |
JP2877217B2 (en) * | 1993-03-29 | 1999-03-31 | 日本軽金属株式会社 | Surface treatment equipment |
USD411176S (en) | 1997-08-20 | 1999-06-22 | Tokyo Electron Limited | Wafer boat for use in a semiconductor wafer heat processing apparatus |
US6056123A (en) | 1997-12-10 | 2000-05-02 | Novus Corporation | Semiconductor wafer carrier having the same composition as the wafers |
US6099702A (en) * | 1998-06-10 | 2000-08-08 | Novellus Systems, Inc. | Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability |
JP2000345356A (en) * | 1999-06-04 | 2000-12-12 | Mitsubishi Materials Corp | Device for plating disk substrate |
JP2001003177A (en) * | 1999-06-18 | 2001-01-09 | Mitsubishi Materials Corp | Disk substrate plating device |
DE19948423B4 (en) | 1999-10-07 | 2006-11-30 | Ina-Schaeffler Kg | Transport and assembly device for rolling element sets |
JP2001181893A (en) * | 1999-10-13 | 2001-07-03 | Sumitomo Special Metals Co Ltd | Surface treatment apparatus |
EP1139396A3 (en) * | 2000-03-31 | 2003-08-27 | Texas Instruments Incorporated | Fixture and method for uniform electroless metal deposition on integrated circuit bond pads |
JP2002038275A (en) * | 2000-07-25 | 2002-02-06 | Mitsubishi Materials Corp | Disk support |
US7067045B2 (en) * | 2002-10-18 | 2006-06-27 | Applied Materials, Inc. | Method and apparatus for sealing electrical contacts during an electrochemical deposition process |
EP1493847A3 (en) * | 2003-07-04 | 2008-10-01 | Seiko Epson Corporation | Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
-
2004
- 2004-05-26 US US10/853,953 patent/US7498062B2/en not_active Expired - Fee Related
-
2005
- 2005-03-23 US US11/088,052 patent/US20050263401A1/en not_active Abandoned
- 2005-05-23 JP JP2005149681A patent/JP4839017B2/en not_active Expired - Fee Related
- 2005-05-24 EP EP05011220A patent/EP1600529A3/en not_active Withdrawn
- 2005-05-26 MY MYPI20052384A patent/MY146519A/en unknown
-
2009
- 2009-02-13 US US12/371,397 patent/US7758732B1/en not_active Expired - Fee Related
Patent Citations (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US655972A (en) * | 1899-12-09 | 1900-08-14 | Reinhold Hakewessell | Clutch. |
US1475937A (en) * | 1919-09-30 | 1923-12-04 | Hanson & Van Winkle Co | Phonograph-record matrix and method and apparatus for producing same |
US1453419A (en) * | 1921-09-12 | 1923-05-01 | Wm A Rogers Ltd | Electroplating apparatus |
US2244197A (en) * | 1936-03-25 | 1941-06-03 | Hessler Christian Rudolph | Bearing |
US2211295A (en) * | 1938-04-09 | 1940-08-13 | Fafnir Bearing Co | Bearing device |
US2979452A (en) * | 1954-08-23 | 1961-04-11 | Nat Forge Co | Apparatus for electroplating crankshaft journals |
US3304138A (en) * | 1964-08-14 | 1967-02-14 | Gen Motors Corp | Antifriction bearing |
US3607712A (en) * | 1969-01-21 | 1971-09-21 | Ionic International Inc | Barrel-type processing apparatus |
US3640592A (en) * | 1969-10-23 | 1972-02-08 | Textron Inc | Antifriction bearing with embedded race inserts |
US3880480A (en) * | 1971-07-06 | 1975-04-29 | Trw Inc | Nonmetallic bearing housing |
US4105310A (en) * | 1975-12-24 | 1978-08-08 | Minolta Camera Kabushiki Kaisha | Indicating device for motion picture camera |
US4311111A (en) * | 1978-12-27 | 1982-01-19 | Kogyo K. K. Yoshida | Apparatus for painting a multiplicity of parts together |
US4344657A (en) * | 1978-12-31 | 1982-08-17 | Sro Kugellagerwerke J. Schmid-Roost Ag | Axial/rotary guide element |
US4305804A (en) * | 1980-05-07 | 1981-12-15 | Harshaw Chemical Company | Plating barrel contact |
US4324441A (en) * | 1980-10-24 | 1982-04-13 | Rouverol William S | Rolling contact element |
US4516523A (en) * | 1983-12-16 | 1985-05-14 | Knox David J | Apparatus for wetting apertured discs |
US4581260A (en) * | 1984-09-25 | 1986-04-08 | Ampex Corporation | Electroless plating method and apparatus |
US4855020A (en) * | 1985-12-06 | 1989-08-08 | Microsurface Technology Corp. | Apparatus and method for the electrolytic plating of layers onto computer memory hard discs |
US5176456A (en) * | 1989-05-01 | 1993-01-05 | Koyo Seiko Co., Ltd. | Rolling bearing |
US4951763A (en) * | 1989-11-13 | 1990-08-28 | Hi-Speed Checkweigher Co., Inc. | Checkweigher |
US5275184A (en) * | 1990-10-19 | 1994-01-04 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system |
US5174045A (en) * | 1991-05-17 | 1992-12-29 | Semitool, Inc. | Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers |
US5264256A (en) * | 1992-09-08 | 1993-11-23 | Xerox Corporation | Apparatus and process for glow discharge comprising substrate temperature control by shutter adjustment |
US5358460A (en) * | 1993-01-25 | 1994-10-25 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flex-gear power transmission system for transmitting EMF between sun and ring gears |
US5750207A (en) * | 1995-02-17 | 1998-05-12 | Si Diamond Technology, Inc. | System and method for depositing coating of modulated composition |
US6065123A (en) * | 1995-03-06 | 2000-05-16 | Intel Corporation | Computer system with unattended on-demand availability |
US6065615A (en) * | 1996-02-28 | 2000-05-23 | Asahi Glass Company, Ltd. | Vertical wafer boat |
US6663762B2 (en) * | 1996-07-15 | 2003-12-16 | Semitool, Inc. | Plating system workpiece support having workpiece engaging electrode |
US6089377A (en) * | 1996-08-26 | 2000-07-18 | Nec Corporation | Semiconductor wafer carrier |
US5716147A (en) * | 1997-02-07 | 1998-02-10 | Emerson Power Transmission Corp. | Corrosion-resistant bearing assembly |
US6372303B1 (en) * | 1997-06-16 | 2002-04-16 | Robert Bosch Gmbh | Method and device for vacuum-coating a substrate |
US5951763A (en) * | 1998-02-09 | 1999-09-14 | Knox; David J. | Immersible rotatable carousel apparatus for wetting articles of manufacture |
US5997947A (en) * | 1998-04-29 | 1999-12-07 | United Technologies Corporation | Rotisserie fixture for coating airfoils |
US6099302A (en) * | 1998-06-23 | 2000-08-08 | Samsung Electronics Co., Ltd. | Semiconductor wafer boat with reduced wafer contact area |
US6216709B1 (en) * | 1998-09-04 | 2001-04-17 | Komag, Inc. | Method for drying a substrate |
US6617540B2 (en) * | 1999-04-15 | 2003-09-09 | Integrated Materials, Inc. | Wafer support fixture composed of silicon |
US6673216B2 (en) * | 1999-08-31 | 2004-01-06 | Semitool, Inc. | Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing |
US6568412B2 (en) * | 2000-02-28 | 2003-05-27 | Tokyo Electron Limited | Rotary processing apparatus with holding bars having drain grooves |
US6370791B1 (en) * | 2000-03-10 | 2002-04-16 | Semitool, Inc. | Processing machine with lockdown rotor |
US6852208B2 (en) * | 2000-03-17 | 2005-02-08 | Nutool, Inc. | Method and apparatus for full surface electrotreating of a wafer |
US6341935B1 (en) * | 2000-06-14 | 2002-01-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer boat having improved wafer holding capability |
US6709563B2 (en) * | 2000-06-30 | 2004-03-23 | Ebara Corporation | Copper-plating liquid, plating method and plating apparatus |
US6660104B2 (en) * | 2000-07-07 | 2003-12-09 | Semitool, Inc. | Dual cassette centrifugal processor |
US6528124B1 (en) * | 2000-12-01 | 2003-03-04 | Komag, Inc. | Disk carrier |
US6558750B2 (en) * | 2001-07-16 | 2003-05-06 | Technic Inc. | Method of processing and plating planar articles |
US6664122B1 (en) * | 2001-10-19 | 2003-12-16 | Novellus Systems, Inc. | Electroless copper deposition method for preparing copper seed layers |
US7498062B2 (en) * | 2004-05-26 | 2009-03-03 | Wd Media, Inc. | Method and apparatus for applying a voltage to a substrate during plating |
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US7758732B1 (en) | 2004-05-26 | 2010-07-20 | Wd Media, Inc. | Method and apparatus for applying a voltage to a substrate during plating |
US9093100B2 (en) | 2008-03-17 | 2015-07-28 | Wd Media (Singapore) Pte. Ltd. | Magnetic recording medium including tailored exchange coupling layer and manufacturing method of the same |
US20110097603A1 (en) * | 2008-03-26 | 2011-04-28 | Wd Media (Singapore) Pte. Ltd. | Perpendicular magnetic recording medium and process for manufacture thereof |
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US9142241B2 (en) | 2009-03-30 | 2015-09-22 | Wd Media (Singapore) Pte. Ltd. | Perpendicular magnetic recording medium and method of manufacturing the same |
US8267831B1 (en) | 2009-05-19 | 2012-09-18 | Western Digital Technologies, Inc. | Method and apparatus for washing, etching, rinsing, and plating substrates |
US8980076B1 (en) | 2009-05-26 | 2015-03-17 | WD Media, LLC | Electro-deposited passivation coatings for patterned media |
US8596214B2 (en) * | 2009-09-29 | 2013-12-03 | Larry J. Schieszer | Wood grilling plank soaking device |
US20110076412A1 (en) * | 2009-09-29 | 2011-03-31 | Schieszer Larry J | Wood grilling plank soaking device |
US9330685B1 (en) | 2009-11-06 | 2016-05-03 | WD Media, LLC | Press system for nano-imprinting of recording media with a two step pressing method |
US9339978B1 (en) | 2009-11-06 | 2016-05-17 | WD Media, LLC | Press system with interleaved embossing foil holders for nano-imprinting of recording media |
US8859118B2 (en) | 2010-01-08 | 2014-10-14 | Wd Media (Singapore) Pte. Ltd. | Perpendicular magnetic recording medium |
US8908315B2 (en) | 2010-03-29 | 2014-12-09 | Wd Media (Singapore) Pte. Ltd. | Evaluation method of magnetic disk, manufacturing method of magnetic disk, and magnetic disk |
US9240204B2 (en) | 2010-05-21 | 2016-01-19 | Wd Media (Singapore) Pte. Ltd. | Perpendicular magnetic recording disc |
US8828566B2 (en) | 2010-05-21 | 2014-09-09 | Wd Media (Singapore) Pte. Ltd. | Perpendicular magnetic recording disc |
US9349404B2 (en) | 2010-05-28 | 2016-05-24 | Wd Media (Singapore) Pte. Ltd | Perpendicular magnetic recording disc |
US10083715B2 (en) | 2010-05-28 | 2018-09-25 | WD Media (Singapore) Pte.Ltd. | Method of manufacturing a perpendicular magnetic disc |
US8951651B2 (en) | 2010-05-28 | 2015-02-10 | Wd Media (Singapore) Pte. Ltd. | Perpendicular magnetic recording disk |
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US20120100287A1 (en) * | 2010-10-20 | 2012-04-26 | Seagate Technology, Llc | Laminar flow plating rack |
US9222191B2 (en) * | 2010-10-20 | 2015-12-29 | Seagate Technology Llc | Laminar flow plating rack |
US9001630B1 (en) | 2011-03-08 | 2015-04-07 | Western Digital Technologies, Inc. | Energy assisted magnetic recording medium capable of suppressing high DC readback noise |
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US9047880B1 (en) | 2011-12-20 | 2015-06-02 | WD Media, LLC | Heat assisted magnetic recording method for media having moment keeper layer |
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US9257134B1 (en) | 2014-12-24 | 2016-02-09 | Western Digital Technologies, Inc. | Allowing fast data zone switches on data storage devices |
US9990940B1 (en) | 2014-12-30 | 2018-06-05 | WD Media, LLC | Seed structure for perpendicular magnetic recording media |
US9280998B1 (en) | 2015-03-30 | 2016-03-08 | WD Media, LLC | Acidic post-sputter wash for magnetic recording media |
US9275669B1 (en) | 2015-03-31 | 2016-03-01 | WD Media, LLC | TbFeCo in PMR media for SNR improvement |
US9822441B2 (en) | 2015-03-31 | 2017-11-21 | WD Media, LLC | Iridium underlayer for heat assisted magnetic recording media |
CN105133000A (en) * | 2015-08-27 | 2015-12-09 | 深圳市佳易研磨有限公司 | Horizontal rotating hanger device |
US11074934B1 (en) | 2015-09-25 | 2021-07-27 | Western Digital Technologies, Inc. | Heat assisted magnetic recording (HAMR) media with Curie temperature reduction layer |
US10236026B1 (en) | 2015-11-06 | 2019-03-19 | WD Media, LLC | Thermal barrier layers and seed layers for control of thermal and structural properties of HAMR media |
US9406329B1 (en) | 2015-11-30 | 2016-08-02 | WD Media, LLC | HAMR media structure with intermediate layer underlying a magnetic recording layer having multiple sublayers |
US10121506B1 (en) | 2015-12-29 | 2018-11-06 | WD Media, LLC | Magnetic-recording medium including a carbon overcoat implanted with nitrogen and hydrogen |
US11262384B2 (en) | 2016-12-23 | 2022-03-01 | Intel Corporation | Fine pitch probe card methods and systems |
US11268983B2 (en) | 2017-06-30 | 2022-03-08 | Intel Corporation | Chevron interconnect for very fine pitch probing |
US11674980B2 (en) | 2017-09-29 | 2023-06-13 | Intel Corporation | Low-profile gimbal platform for high-resolution in situ co-planarity adjustment |
US11061068B2 (en) | 2017-12-05 | 2021-07-13 | Intel Corporation | Multi-member test probe structure |
US11774489B2 (en) | 2017-12-05 | 2023-10-03 | Intel Corporation | Multi-member test probe structure |
US11204555B2 (en) * | 2017-12-28 | 2021-12-21 | Intel Corporation | Method and apparatus to develop lithographically defined high aspect ratio interconnects |
US11822249B2 (en) | 2017-12-28 | 2023-11-21 | Intel Corporation | Method and apparatus to develop lithographically defined high aspect ratio interconnects |
US11073538B2 (en) | 2018-01-03 | 2021-07-27 | Intel Corporation | Electrical testing apparatus with lateral movement of a probe support substrate |
US11249113B2 (en) | 2018-01-05 | 2022-02-15 | Intel Corporation | High density and fine pitch interconnect structures in an electric test apparatus |
US11543454B2 (en) | 2018-09-25 | 2023-01-03 | Intel Corporation | Double-beam test probe |
US11372023B2 (en) | 2018-09-28 | 2022-06-28 | Intel Corporation | Slip-plane MEMs probe for high-density and fine pitch interconnects |
Also Published As
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US7498062B2 (en) | 2009-03-03 |
MY146519A (en) | 2012-08-15 |
EP1600529A3 (en) | 2011-01-12 |
EP1600529A2 (en) | 2005-11-30 |
JP4839017B2 (en) | 2011-12-14 |
US7758732B1 (en) | 2010-07-20 |
JP2005336612A (en) | 2005-12-08 |
US20050274605A1 (en) | 2005-12-15 |
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