US20060005953A1 - Liquid cooling device - Google Patents

Liquid cooling device Download PDF

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Publication number
US20060005953A1
US20060005953A1 US11/066,779 US6677905A US2006005953A1 US 20060005953 A1 US20060005953 A1 US 20060005953A1 US 6677905 A US6677905 A US 6677905A US 2006005953 A1 US2006005953 A1 US 2006005953A1
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US
United States
Prior art keywords
liquid
casing
container
heat
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/066,779
Inventor
Hsieh-Kun Lee
Cheng-Tien Lai
Zhi-Yong Zhou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
Original Assignee
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Technology Co Ltd filed Critical Foxconn Technology Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAI, CHENG-TIEN, LEE, HSIEH-KUN, ZHOU, ZHI-YONG
Publication of US20060005953A1 publication Critical patent/US20060005953A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a cooling device, and more particularly to a cooling device utilizing liquid for cooling a heat-generating device.
  • Liquid cooling devices were commonly utilized to cool huge systems such as furnaces.
  • Today, liquid cooling devices also are used to cool electronic or electrical components, such as chipsets, dies or computer central processing units (CPUs), by circulating the cooling liquid in a channel.
  • CPUs computer central processing units
  • a liquid cooling device comprises a casing, forming a liquid container made of metal material.
  • the casing comprises a base and a lid covering the base.
  • the base is for contacting a wait-to-be-cooled component and comprises an upper surface.
  • the lid comprises a liquid outlet and a liquid inlet.
  • Liquid pipes respectively connect the liquid outlet and the liquid inlet to a liquid tank.
  • the liquid tank is further provided with a submersible motor therein. In operation to dissipate heat from the component, the liquid in the liquid tank flows through the liquid inlet pipe into the casing, and is drawn by the motor to exit from the casing to the liquid tank for a subsequent circulation.
  • the upper surface of the base is generally flat. Heat exchange surface between the base and the liquid is limited. As a result, the liquid is only to flow in a limited surface in the casing. It is difficult to get maximized heat exchange efficiency.
  • an object of the present invention is to provide a liquid cooling device getting maximized heat exchange efficiency.
  • the casing comprises a heat-absorbing base.
  • the base comprises a porous layer interior of the casing.
  • FIG. 1 is an assembled, isometric view of a liquid cooling device in accordance with a preferred embodiment of the present invention
  • FIG. 2 is a view of a casing of the liquid cooling device of FIG. 1 ;
  • FIG. 3 is a cross-sectional view of FIG. 2 , taken along line III-III;
  • FIG. 4 is a view of a base of a casing of a liquid cooling device in accordance with the preferred embodiment of the present invention.
  • a liquid cooling device for a heat-generating component in accordance with a preferred embodiment of the present invention comprises a casing 10 , and an actuator 50 connected to the casing 10 by a liquid outlet pipe 100 and a liquid inlet pipe 200 respectively at opposite locations of the actuator 50 to form a cooling liquid circulation system.
  • the casing 10 comprises a base 11 for intimately contacting a heat generating component or source (not shown) by a side surface thereof and a lid 12 cooperating with the base 11 to form a container 14 therebetween to accommodate liquid for circulation.
  • the base 11 and the lid 12 are hermetizated by calk packing, shim, or seal, for keeping the liquid from leaking out of the container 14 .
  • a pair of tubular connectors, for connecting the pipes 100 , 200 to the casing 10 extends outwardly from the lid 12 .
  • the connectors are respectively named as liquid inlet port 18 and liquid outlet port 19 , according to the directions along which the liquid flows in the connectors.
  • the liquid inlet port 18 is disposed at a middle of the lid 12 .
  • the container 14 , the liquid outlet pipe 100 , the actuator 50 and the liquid inlet pipe 200 cooperatively define a hermetical circulation route or loop for liquid.
  • the actuator 50 can be a pump, an impeller, a promoter or the like, for actuating liquid to continuously circulate in the route along the arrow as shown in FIG. 1 .
  • a radiator is arranged on the liquid circulation route.
  • a fin member 30 is an example of the radiator.
  • a portion of the liquid outlet pipe 100 enters into the fin member 30 , so that heat, still contained in the liquid after naturally cooled in the casing 10 , is removed to the fin member 30 and is dissipated to ambient air.
  • the liquid is extremely cooled before entering the container 14 for a subsequent circulation.
  • a fan (now shown) can be mounted onto the fin member 30 for enhancing heat dissipation capability of the fin member 30 .
  • FIG. 4 shows a base 11 of a casing 10 of the liquid cooling device in accordance with the preferred embodiment of the present invention.
  • the base 11 comprises a porous layer 16 .
  • the layer 16 defines a plurality of minute pores therein by sintering metal powder. This structure increases surface between the layer 16 and the liquid. Heat exchange surface between the base 11 and the liquid is increased accordingly In use, the liquid enters into the container 14 from the liquid inlet port 18 . The liquid flows in the layer 16 to sufficiently absorb heat from the base 11 , so that heat exchange efficiency between the liquid and the base 11 is improved.
  • the layer 16 of the base 11 can be other porous metal layer, such as foaming metal.
  • the casing 10 , the fin member 30 and the actuator 50 are positioned separately, and connected by the 100 , 200 in the preferred embodiment of the present invention.
  • the fin member 30 can be directly positioned on the casing 10
  • the actuator 50 can be positioned within the fin member 30 , without the liquid outlet pipe 100 and the liquid inlet pipe 200 , to thereby save space occupied by the liquid cooling device.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A liquid cooling device includes a casing (10), a liquid inlet port (18) and a liquid outlet port (19) in communication with the casing (10). The casing (10) includes a heat-absorbing base (11). The base (11) includes a porous layer interior of the casing (10).

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a cooling device, and more particularly to a cooling device utilizing liquid for cooling a heat-generating device.
  • 2. Description of Related Art
  • Liquid cooling devices were commonly utilized to cool huge systems such as furnaces. Today, liquid cooling devices also are used to cool electronic or electrical components, such as chipsets, dies or computer central processing units (CPUs), by circulating the cooling liquid in a channel.
  • Generally, a liquid cooling device comprises a casing, forming a liquid container made of metal material. The casing comprises a base and a lid covering the base. The base is for contacting a wait-to-be-cooled component and comprises an upper surface. The lid comprises a liquid outlet and a liquid inlet. Liquid pipes respectively connect the liquid outlet and the liquid inlet to a liquid tank. The liquid tank is further provided with a submersible motor therein. In operation to dissipate heat from the component, the liquid in the liquid tank flows through the liquid inlet pipe into the casing, and is drawn by the motor to exit from the casing to the liquid tank for a subsequent circulation.
  • However, the upper surface of the base is generally flat. Heat exchange surface between the base and the liquid is limited. As a result, the liquid is only to flow in a limited surface in the casing. It is difficult to get maximized heat exchange efficiency.
    • SUMMARY OF THE INVENTION
  • Accordingly, an object of the present invention is to provide a liquid cooling device getting maximized heat exchange efficiency.
  • In order to achieve the object set out above, a liquid cooling device in accordance with a preferred embodiment of the present invention comprises a casing, a liquid inlet port and a liquid outlet port in communication with the casing. The casing comprises a heat-absorbing base. The base comprises a porous layer interior of the casing.
  • Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an assembled, isometric view of a liquid cooling device in accordance with a preferred embodiment of the present invention;
  • FIG. 2 is a view of a casing of the liquid cooling device of FIG. 1;
  • FIG. 3 is a cross-sectional view of FIG. 2, taken along line III-III; and
  • FIG. 4 is a view of a base of a casing of a liquid cooling device in accordance with the preferred embodiment of the present invention.
    • DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIGS. 1-3, a liquid cooling device for a heat-generating component in accordance with a preferred embodiment of the present invention comprises a casing 10, and an actuator 50 connected to the casing 10 by a liquid outlet pipe 100 and a liquid inlet pipe 200 respectively at opposite locations of the actuator 50 to form a cooling liquid circulation system.
  • The casing 10 comprises a base 11 for intimately contacting a heat generating component or source (not shown) by a side surface thereof and a lid 12 cooperating with the base 11 to form a container 14 therebetween to accommodate liquid for circulation. The base 11 and the lid 12 are hermetizated by calk packing, shim, or seal, for keeping the liquid from leaking out of the container 14. A pair of tubular connectors, for connecting the pipes 100, 200 to the casing 10, extends outwardly from the lid 12. The connectors are respectively named as liquid inlet port 18 and liquid outlet port 19, according to the directions along which the liquid flows in the connectors. The liquid inlet port 18 is disposed at a middle of the lid 12.
  • The container 14, the liquid outlet pipe 100, the actuator 50 and the liquid inlet pipe 200 cooperatively define a hermetical circulation route or loop for liquid. The actuator 50 can be a pump, an impeller, a promoter or the like, for actuating liquid to continuously circulate in the route along the arrow as shown in FIG. 1.
  • For promoting the cooling efficiency of the device, a radiator is arranged on the liquid circulation route. A fin member 30 is an example of the radiator. In the preferred embodiment of the present invention, a portion of the liquid outlet pipe 100 enters into the fin member 30, so that heat, still contained in the liquid after naturally cooled in the casing 10, is removed to the fin member 30 and is dissipated to ambient air. Thus, the liquid is extremely cooled before entering the container 14 for a subsequent circulation. Understandably, a fan (now shown) can be mounted onto the fin member 30 for enhancing heat dissipation capability of the fin member 30.
  • FIG. 4 shows a base 11 of a casing 10 of the liquid cooling device in accordance with the preferred embodiment of the present invention. The base 11 comprises a porous layer 16. The layer 16 defines a plurality of minute pores therein by sintering metal powder. This structure increases surface between the layer 16 and the liquid. Heat exchange surface between the base 11 and the liquid is increased accordingly In use, the liquid enters into the container 14 from the liquid inlet port 18. The liquid flows in the layer 16 to sufficiently absorb heat from the base 11, so that heat exchange efficiency between the liquid and the base 11 is improved.
  • Moreover, it is understood that the layer 16 of the base 11 can be other porous metal layer, such as foaming metal.
  • For showing clearly, the casing 10, the fin member 30 and the actuator 50 are positioned separately, and connected by the 100, 200 in the preferred embodiment of the present invention. However, it is also understood that the fin member 30 can be directly positioned on the casing 10, and the actuator 50 can be positioned within the fin member 30, without the liquid outlet pipe 100 and the liquid inlet pipe 200, to thereby save space occupied by the liquid cooling device.
  • It is understood that the invention may be embodied in other forms without departing from the spirit thereof Thus, the present example and embodiment is to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.

Claims (8)

1. A liquid cooling device comprising:
a casing comprising a heat-absorbing base, the base comprising a porous layer interior of the casing;
liquid accommodated in the casing;
an actuator,
pipes connecting the casing and the actuator,
a liquid inlet port which renders the liquid to enter the casing; and
a liquid outlet port which allows the liquid to leave the casing when actuated by the actuator.
2. The liquid cooling device of claim 1, wherein the layer is made of sintered metal powder.
3. The liquid cooling device of claim 1, wherein the layer is made of foaming metal.
4. The liquid cooling device of claim 1, further comprising a heat sink connected to the pipes.
5. A liquid cooling device for a heat-generating component, comprising:
a casing disposed next to said component, comprising a heat-absorbing base thermally contacting with said component for heat transmission from said component via said base, and a container used to receive cooling liquid therein;
a cooling liquid circulation system connected to said casing and in communication with said container for said cooling liquid so as to urge said cooling liquid flowing into said container for said heat transmission and out of said container for heat dissipation; and
at least one porous layer formed in said casing next to said base and in communication with said container so that liquid in said container is accessible and containable in said layer for said heat transmission.
6. The liquid cooling device of claim 5, wherein said layer is made of sintered metal powder and formed on a side of said base facing said container.
7. A method for cooling a heat-generating component, comprising the steps of
providing a casing having a cooling-liquid-receivable container and a heat-absorbing base disposed next to said container for thermally contacting with said component;
circulating cooling liquid between said casing and a radiator so that said cooling liquid absorbs heat from said component via said base in said container and dissipates said heat via said radiator, and
sucking said cooling liquid via a porous layer formed in said casing next to said base for enhancing heat absorption of said liquid in said container.
8. The method of claim 7, wherein said layer is made of sintered metal powder and formed on a side of said base facing said container.
US11/066,779 2004-06-25 2005-02-25 Liquid cooling device Abandoned US20060005953A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNA200410027911XA CN1713376A (en) 2004-06-25 2004-06-25 Liquid-cooled radiator
CN200410027911.X 2004-06-25

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080024988A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat receiver therefor
US20080024989A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat receiver therefor
US20080023178A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat exchanger therefor
US20080024987A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat exchanger therefor
US20140076523A1 (en) * 2012-09-19 2014-03-20 Aaron Ray Batker Pritzker Devices, systems, and methods for cooling electronic device heat spreaders
WO2016044246A1 (en) * 2014-09-15 2016-03-24 D Onofrio Nicholas Michael Liquid cooled metal core printed circuit board
US20170191709A1 (en) * 2015-12-30 2017-07-06 Msi Computer (Shenzhen) Co.,Ltd. Heat dissipation device and thermoelectric cooling module thereof
US10586760B2 (en) 2007-10-31 2020-03-10 International Business Machines Corporation Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107062963B (en) * 2017-04-27 2019-06-07 厦门大学 A kind of alternating expression micro-channel condenser for hair cell regeneration

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8289701B2 (en) * 2006-07-25 2012-10-16 Fujistu Limited Liquid cooling unit and heat receiver therefor
US20080024988A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat receiver therefor
US20080023178A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat exchanger therefor
US20080024987A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat exchanger therefor
US7710722B2 (en) 2006-07-25 2010-05-04 Fujitsu Limited Liquid cooling unit and heat exchanger therefor
US8050036B2 (en) * 2006-07-25 2011-11-01 Fujitsu Limited Liquid cooling unit and heat receiver therefor
US20080024989A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat receiver therefor
US10586760B2 (en) 2007-10-31 2020-03-10 International Business Machines Corporation Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US10622294B2 (en) 2007-10-31 2020-04-14 International Business Machines Corporation Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US11967548B2 (en) 2007-10-31 2024-04-23 International Business Machines Corporation Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US20140076523A1 (en) * 2012-09-19 2014-03-20 Aaron Ray Batker Pritzker Devices, systems, and methods for cooling electronic device heat spreaders
US9686887B2 (en) 2014-09-15 2017-06-20 Nicholas Michael D'Onofrio Liquid cooled metal core printed circuit board
WO2016044246A1 (en) * 2014-09-15 2016-03-24 D Onofrio Nicholas Michael Liquid cooled metal core printed circuit board
US20170191709A1 (en) * 2015-12-30 2017-07-06 Msi Computer (Shenzhen) Co.,Ltd. Heat dissipation device and thermoelectric cooling module thereof

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