US20060042998A1 - Cushion for packing disks such as semiconductor wafers - Google Patents
Cushion for packing disks such as semiconductor wafers Download PDFInfo
- Publication number
- US20060042998A1 US20060042998A1 US11/205,414 US20541405A US2006042998A1 US 20060042998 A1 US20060042998 A1 US 20060042998A1 US 20541405 A US20541405 A US 20541405A US 2006042998 A1 US2006042998 A1 US 2006042998A1
- Authority
- US
- United States
- Prior art keywords
- cushion
- base
- cushion member
- disk
- contacting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/54—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles of special shape not otherwise provided for
- B65D85/544—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles of special shape not otherwise provided for for gramophone records
Definitions
- FIG. 6 shows selected features of one example container portion.
- FIG. 7 schematically illustrates a feature of an example embodiment.
- each cushion member 60 includes at least one contacting portion 90 near a vertex 92 between two adjacent generally linear segments of the cushion member.
- the example in FIG. 1 has two contacting portions 90 for each cushion member 60 .
- the example of FIG. 5 has one contacting portion 90 for each cushion member 60 ′.
- the contacting portions 90 in the illustrated examples are located near a vertex 92 between generally perpendicularly aligned, adjacent linear portions of the cushion member.
- the second portion 26 of the container 20 in the example of FIG. 6 includes a locking feature 100 on an inside surface 102 for securing a selected cushion 40 in place within the container 20 .
- the locking feature comprises a plurality of tabs that are arranged to allow the base 42 to snap into place on the second portion 26 .
- the same locking feature allows the cushion 40 to be selectively removed from the rest of the container.
- One advantage to this example arrangement is that it allows the cushion 40 to be replaced or recycled without requiring the entire container 20 to be replaced or recycled. If one portion of the container 40 becomes damaged, for example, that portion can be replaced without the material costs of replacing the entire container or more than one portion of the container.
Abstract
A cushion device (40) for packing disks (22) such as semiconductor wafers has a base (42) that is selectively secured within a container (20). The cushion (40) includes a plurality of cushion members (60) each having two ends supported by the base (42). In a disclosed example, the cushion members (60) have a stepped configuration between the two ends. Angles between adjacent generally linear portions of the stepped configuration change as the cushion members flex responsive to engaging a semiconductor wafer within the container. A disclosed example includes a contacting portion (90) near a vertex (92) between two adjacent linear portions of a cushion member (60). One example has contacting portions (90) of aligned cushion members spaced at an angle between about 65° and about 180°.
Description
- This application claims priority to U.S. Provisional Application No. 60/603,873, which was filed on Aug. 24, 2004.
- This invention generally relates to packing disks such as semiconductor wafers. More particularly, this invention relates to a cushion device for use in packing disks.
- Semiconductor wafers typically include an array of integrated circuits on a disc of semiconductor material. The wafers typically are manufactured in one location, packaged and shipped to another location and then arranged in particular devices. The wafers and the circuits on them must be protected during the packaging and shipping stages of a normal production cycle.
- A variety of packages have been developed for packing and shipping semiconductor wafers. One known type of package receives a stack of wafers between a top and bottom with a plurality of separators and cushions within the container. Another type of container includes a cassette that receives a series of wafers and the cassette is received between a container top and bottom. Known containers include some form of cushion to bias the wafers into a proper position within the cassette. Examples are shown in U.S. Pat. Nos. 4,966,284 and 5,228,568. The arrangement in the first of these patents relies upon cantilevered arms that are formed as part of the top of the container. One disadvantage of this arrangement is that molding the container top is complicated by the presence of the cantilevered arms. Another shortcoming of that arrangement is that the cantilevered arms may not provide a reliable and desired level of bias after several uses.
- The separate cushion of the second patent mentioned above has an advantage over the first example because it simplifies the molding process for making the container top. On the other hand, that arrangement still includes cantilevered cushion members that suffer from the same shortcoming as those in the first patent mentioned above.
- There is a need for an improved arrangement for packing semiconductor wafers or other sensitive disks in a container that includes a cassette for receiving and supporting the wafers. This invention provides an improved cushion that satisfies that need.
- An exemplary disclosed embodiment of a device for packing at least one disk includes a base. A plurality of cushion members each have a first end supported by the base and a second end supported by the base. Each cushion member has a plurality of generally linear segments between the first and second ends. Adjacent generally linear segments are transverse to each other. Each cushion member has at least one contacting portion for contacting a disk. The contacting portions are located near at least one vertex between two of the generally linear segments.
- One example includes contacting portions on first and second cushion members that are aligned with each other for contacting a single disk. The contacting portions are spaced apart such that an angle between respective reference lines from each of the first and second cushion member contacting portions to a point corresponding to a center of a disk if a disk were engaged by the first and second cushion members is in a range from about 65° to about 180°. In a disclosed example, the angle is in a range from about 120° to about 160°. In one example, the angle is about 150°. Spacing the contacting portions in this way facilitates better handling during packing and better stability during shipping, for example.
- The various features and advantages of this invention will become apparent to those skilled in the art from the following detailed description of the currently preferred embodiments. The drawings that accompany the detailed description can be briefly described as follows.
-
FIG. 1 schematically illustrates a container designed according one embodiment of this invention. -
FIG. 2 shows an elevational view of an example cushion. -
FIG. 3 is a cross-sectional illustration taken along the lines 3-3 inFIG. 2 . -
FIG. 4 is an elevational view of another example cushion. -
FIG. 5 is a cross-sectional illustration taken along the lines 5-5 inFIG. 4 . -
FIG. 6 shows selected features of one example container portion. -
FIG. 7 schematically illustrates a feature of an example embodiment. - An
example container 20 is schematically shown in an assembled condition inFIG. 1 . Thecontainer 20 is configured to safely package a plurality of wafers ordisks 22. Thecontainer 20 includes afirst portion 24 and asecond portion 26, which are secured together by a locking arrangement at 28. In one example, thelocking arrangement 28 includes hooks on one of the first orsecond portions - In the illustrated example, the
first portion 24 receives acassette 30. The wafers are received into thecassette 30 in a known manner. Thecassette 30 is configured to support thewafers 22 in a manner that keeps them spaced from each other and in a generally stable position within thecontainer 20. - Part of the wafer outer surfaces engage grooves on the
cassette 30 and another part of the outer surfaces engage acushion 40. In the illustrated example, thecushion 40 is snap fit into a secured position relative to thesecond portion 26. Thecushion 40 biases thewafers 22 into a stable position within thecassette 30 and keeps thewafers 22 from shifting about within thecontainer 20 during shipping and handling. - The
example cushion 40 shown inFIGS. 2 and 3 includes a base that is at least partially received within thesecond portion 26 of thecontainer 20. Thebase 42 in this example includes afirst support portion 44 along one lateral edge and asecond support portion 46 along a second, opposite lateral edge.Additional support portions base 42. The illustrated example includes anopen space 52 between thesupport portions - The
example base 42 also hascross bars cross bars base 42 is self-supporting in one example. Thebase 42 is adapted to be snap fit into thesecond portion 26 of thecontainer 20 so thatcushion members 60 extend toward the wafers in thecassette 30. - The
example cushion 40 includes a plurality ofcushion members 60 that have a generally stepped configuration when viewed from the perspective ofFIG. 3 . In this example, a plurality of generallylinear portions - One
end 70 of each cushion member is supported by one of thelateral support portions end 70 is supported near an end of anarm 72 that extends from thecorresponding support portion end 70 of the cushion members is spaced a selected distance from thebase 42. In this example, eacharm 72 is rigid in a longitudinal direction of the arm (i.e., in a direction extending between theend 70 of the cushion member and thecorresponding support portion 44, 46). In one example, thearms 72 comprise continuous sides of the cushion that are not separated at the position of eachcushion member 60. In another example, eachcushion member 60 has adedicated arm 72 that is separate from theother arms 72. In still another example, thearms 72 are partially integrated and partially separated. - An
opposite end 74 of eachcushion member 60 is supported by one of theexample support portions base 42. In this example, thesecond end 74 is supported immediately adjacent thecorresponding support portion - Having fixed ends 70 and 74 supported by the
base 42 provides a more stable arrangement and a more consistently reliable bias and cushion effect compared to previous designs that rely on cantilevered fingers. The stepped configuration of thecushion members 60 and the material selected to form thecushion 40 provide resiliency between the fixed, supported ends 70 and 74 that allows wafers or disks to be received between thecushion 40 and thecassette 30 without any risk of damage to the wafers or disks under expected handling procedures. One example material is polypropylene. - In the illustrated example, each
cushion member 60 has a corresponding cushion member on an opposite side of a center of thecushion 40 such that twocushion members 60 are aligned with each other to engage each wafer received between thecushion 40 and thecassette 30. Each cushion member in one example has a grooved wafer-receiving surface that tends to center a corresponding portion of a wafer edge along the cushion member. - The illustration of
FIG. 3 shows thecushion members 60 in a first configuration where the stepped configuration has a first angle between adjacent ones of the generally linear portions 62-68. When thecushion 40 engages at least one wafer within thecontainer 20, at least some of the linear portions 62-68 move responsive to contact with the wafer such that the relative angle between them changes. In one example, at least the centrally located linear portions move as thecushion member 60 flexes and the angle between the adjacent moving pieces becomes larger. -
FIGS. 4 and 5 show anotherexample cushion 40′, which may be useful for packaging wafers of a different size or different type than wafers for which theexample cushion 40 ofFIGS. 2 and 3 is suitable. In this example, eachcushion member 60′ has fewerlinear portions FIGS. 2 and 3 . In this example the second ends 74′ of thecushion members 60′ are secured to asingle support portion 48 near a center of thebase 42. Otherwise thecushion 60′ performs like thecushion 60 of the previously described example. - Referring to
FIG. 7 , a feature of a disclosed example is schematically illustrated, which provides better interaction between thecushion members 60 and thedisk 62 especially during assembly of thecontainer 20. Conventional wisdom has been to arrange a cushion member near a top of a container such that the cushion member contacts a disk near a top edge of the disk within the container. Considering the positions on the face of an analog clock, most cushion designs make contact with the disk between 11 o'clock and 1 o'clock . One example embodiment of this invention includes spacing apart contact locations between the cushion members and a disk to provide a more stable arrangement. - Referring to
FIGS. 1 and 5 , eachcushion member 60 includes at least one contactingportion 90 near avertex 92 between two adjacent generally linear segments of the cushion member. The example inFIG. 1 has two contactingportions 90 for eachcushion member 60. The example ofFIG. 5 has one contactingportion 90 for eachcushion member 60′. The contactingportions 90 in the illustrated examples are located near avertex 92 between generally perpendicularly aligned, adjacent linear portions of the cushion member. - As can be appreciated from
FIG. 7 , one example includes positioning the contactingportions 90 such that they are spaced apart so that when they contact adisk 22, an angle betweenrespective reference lines FIG. 7 , theexample disk 22 has acenter point 98. The reference lines 94 and 96 are taken between the contactingportions 90 and thecenter point 98. An angle α between thereference lines portions 90 so that they make contact with an edge of acorresponding disk 22 between about 9 o'clock and about 10:30 on one side and between about 1:30 and 3 o'clock on the other side. - Keeping the angle α greater than 65° and less than 180° provides better handling procedures. During assembly of a
container 20, as thetop portion 26 is placed in position on the bottom 24, with conventional arrangements, there is a tendency for more than one disk to be engaged by a set of corresponding cantilevered fingers, for example. This is due, in part, because of the close proximity of the positions where such fingers contact the disks (i.e., within a range less than 60° apart). By spacing apart the contacting portions 90 a greater distance, the illustrated example reduces a tendency for more than one disk to be engaged by a corresponding set ofcushion members 60 as the container is assembled into a closed condition. - Keeping the contacting
portions 90 further down the sides of a disk within the range illustrated at 99 inFIG. 7 also provides enhanced stability for keeping the disks in a more fixed position within acontainer 20 during shipping and handling, for example. The wider spring cooperates with other features of the container assembly to limit lateral movement of thedisks 22. - The
second portion 26 of thecontainer 20 in the example ofFIG. 6 includes alocking feature 100 on aninside surface 102 for securing a selectedcushion 40 in place within thecontainer 20. In one example the locking feature comprises a plurality of tabs that are arranged to allow the base 42 to snap into place on thesecond portion 26. The same locking feature allows thecushion 40 to be selectively removed from the rest of the container. One advantage to this example arrangement is that it allows thecushion 40 to be replaced or recycled without requiring theentire container 20 to be replaced or recycled. If one portion of thecontainer 40 becomes damaged, for example, that portion can be replaced without the material costs of replacing the entire container or more than one portion of the container. - The preceding description is exemplary rather than limiting in nature. Variations and modifications to the disclosed examples may become apparent to those skilled in the art that do not necessarily depart from the essence of this invention. The scope of legal protection given to this invention can only be determined by studying the following claims.
Claims (20)
1. A device for packing at least one disk, comprising;
a base; and
a plurality of cushion members having
a first end supported by the base and
a second end supported by the base,
each cushion member having a plurality of generally linear segments between the first and second ends, adjacent ones of the generally linear segments are transverse to each other, each cushion member having at least one contacting portion for contacting a disk near at least one vertex between two of the generally linear segments.
2. The device of claim 1 , comprising a first plurality of the cushion members having first ends supported near one lateral edge of the base and second ends supported near a central portion of the base and a second plurality of the cushion members having first ends supported near an opposite lateral edge of the base and second ends supported near the central portion of the base.
3. The device of claim 2 , wherein the second ends of the first plurality of cushion members is spaced from the first ends of the second plurality of cushion members.
4. The device of claim 2 , wherein the base includes openings between the first and second ends of each of the plurality of cushion members.
5. The device of claim 4 , wherein the base includes spaced apart support portions near the central portion of the base, each of the spaced apart support portions supporting the second ends of a corresponding one of the plurality of cushion members.
6. The device of claim 1 , wherein each cushion member has a plurality of the contacting portions.
7. The device of claim 1 , wherein a first of the cushion members and a second of the cushion members aligned with and parallel to the first cushion member are positioned so that the contacting portions of the first and second cushion members are spaced apart such that an angle between respective reference lines from each of the first and second cushion member contacting portions to a point corresponding to a center of a disk if the disk were engaged by the first and second cushion members is in a range from about 65° to about 180°.
8. The device of claim 7 , wherein the angle is in range from about 100° to about 170°.
9. The device of claim 7 , wherein the angle is in a range from about 120° to about 160°.
10. The device of claim 7 , wherein the angle is about 150°.
11. The device of claim 1 , wherein each generally linear segment of each cushion member is generally perpendicular to an adjacent linear segment of the corresponding cushion member.
12. The device of claim 11 , wherein at least the linear segments on each side of the vertex near the contacting portion of each cushion member move relative to each other responsive to engagement between the contacting portion and a disk.
13. The device of claim 1 , comprising a container top and a container bottom adapted to contain at least one disk and wherein the base is received at least partially against a portion of the top.
14. The device of claim 13 , wherein the top includes a plurality of locking members that secure the base in a desired position relative to the top.
15. A device for packing at least one disk, comprising:
a base; and
a plurality of cushion members depending from the base,
each cushion member having at least one contacting portion for contacting a surface on a disk, the contacting portion on a first cushion member and the contacting portion on a second cushion member aligned with and parallel to the first cushion member are spaced apart such that an angle between respective reference lines from each of the first and second cushion member contacting portions to a point corresponding to a center of a disk if the disk were engaged by the first and second cushion members is in a range from about 65° to about 180°.
16. The device of claim 15 , wherein the angle is in range from about 100° to about 170°.
17. The device of claim 15 , wherein the angle is in a range from about 120° to about 160°.
18. The device of claim 15 , wherein the angle is about 150°.
19. The device of claim 15 , wherein each cushion member includes
a first end supported by the base and
a second end supported by the base,
each cushion member having a plurality of generally linear segments between the first and second ends with the at least one contacting portion for contacting a disk near at least one vertex between two of the generally linear segments.
20. The device of claim 19 , wherein each generally linear segment of each cushion member is generally perpendicular to an adjacent linear segment of the corresponding cushion member.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/205,414 US20060042998A1 (en) | 2004-08-24 | 2005-08-17 | Cushion for packing disks such as semiconductor wafers |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US60387304P | 2004-08-24 | 2004-08-24 | |
US11/205,414 US20060042998A1 (en) | 2004-08-24 | 2005-08-17 | Cushion for packing disks such as semiconductor wafers |
Publications (1)
Publication Number | Publication Date |
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US20060042998A1 true US20060042998A1 (en) | 2006-03-02 |
Family
ID=36113050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/205,414 Abandoned US20060042998A1 (en) | 2004-08-24 | 2005-08-17 | Cushion for packing disks such as semiconductor wafers |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060042998A1 (en) |
JP (1) | JP2006066911A (en) |
KR (1) | KR20060050561A (en) |
SG (1) | SG120286A1 (en) |
TW (1) | TW200619108A (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060108258A1 (en) * | 2004-11-23 | 2006-05-25 | John Burns | Wafer container with secondary wafer restraint system |
US20090032433A1 (en) * | 2008-08-08 | 2009-02-05 | Chin-Ming Lin | Wafer container with restrainer |
US20100072107A1 (en) * | 2006-11-07 | 2010-03-25 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
EP2207199A1 (en) * | 2007-11-09 | 2010-07-14 | Shin-Etsu Polymer Co. Ltd. | Retainer and substrate storing container |
US20100236977A1 (en) * | 2009-08-26 | 2010-09-23 | Texchem Advanced Products Incorporated Sdn. Bhd. | Wafer container with adjustable inside diameter |
US20100307957A1 (en) * | 2006-06-13 | 2010-12-09 | Entegris, Inc. | Reusable resilient cushion for wafer container |
CN101673697B (en) * | 2008-09-12 | 2011-07-27 | 家登精密工业股份有限公司 | Front-opening unified pod with wafer constraint modules arranged on both sides of recessed area on door |
CN103346115A (en) * | 2013-05-09 | 2013-10-09 | 北京市塑料研究所 | Clamp for silicon wafer loader |
US20130299384A1 (en) * | 2010-10-19 | 2013-11-14 | Entegris, Inc. | Front opening wafer container with wafer cushion |
US9557922B2 (en) | 2014-05-07 | 2017-01-31 | HGST Netherlands B.V. | System and method for peer-to-peer PCIe storage transfers |
US20170062253A1 (en) * | 2010-03-11 | 2017-03-02 | Entegris, Inc. | Thin wafer shipper |
TWI579215B (en) * | 2016-10-07 | 2017-04-21 | 家登精密工業股份有限公司 | Vertical Fixing Transmission Box and Transmission Method Using the Same |
US9633877B2 (en) | 2012-05-04 | 2017-04-25 | Entegris, Inc. | Wafer container with door mounted shipping cushions |
TWI697979B (en) * | 2017-02-07 | 2020-07-01 | 日商阿基里斯股份有限公司 | Substrate container |
US11031046B2 (en) * | 2019-01-05 | 2021-06-08 | Western Digital Technologies, Inc. | Disk-shaped article shipping container |
WO2022035893A1 (en) * | 2020-08-11 | 2022-02-17 | Entegris, Inc. | Cassette hold down |
US11587810B2 (en) * | 2019-07-19 | 2023-02-21 | Entegris, Inc. | Wafer cushion |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5946539B2 (en) * | 2012-10-23 | 2016-07-06 | ミライアル株式会社 | Substrate storage container |
Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4061228A (en) * | 1976-12-20 | 1977-12-06 | Fluoroware, Inc. | Shipping container for substrates |
US4102602A (en) * | 1976-08-31 | 1978-07-25 | Volkswagenwerk Aktiengesellschaft | Rotor for an axial turbine |
US4171740A (en) * | 1976-09-07 | 1979-10-23 | Monsanto Company | Wafer packaging system |
US4555024A (en) * | 1984-04-12 | 1985-11-26 | Wacker-Chemie Gmbh | Packaging unit for semiconductor wafers |
US4966284A (en) * | 1987-07-07 | 1990-10-30 | Empak, Inc. | Substrate package |
US5253755A (en) * | 1991-03-20 | 1993-10-19 | Fluoroware, Inc. | Cushioned cover for disk container |
US5255797A (en) * | 1992-02-26 | 1993-10-26 | Fluoroware, Inc. | Wafer carrier with wafer retaining cushions |
US5538230A (en) * | 1994-08-08 | 1996-07-23 | Sibley; Thomas | Silicon carbide carrier for wafer processing |
US5555981A (en) * | 1992-05-26 | 1996-09-17 | Empak, Inc. | Wafer suspension box |
US5586658A (en) * | 1995-06-06 | 1996-12-24 | Fluoroware, Inc. | Wafer cushions for wafer shipper |
US5704493A (en) * | 1995-12-27 | 1998-01-06 | Dainippon Screen Mfg. Co., Ltd. | Substrate holder |
US5842575A (en) * | 1997-01-06 | 1998-12-01 | Empak, Inc. | Disk package for rotating memory disks |
US5864447A (en) * | 1995-08-15 | 1999-01-26 | Fujitsu Limited | Disk drive with stopper mechanism including a cushion member seated on a circumferential groove |
US5875896A (en) * | 1996-11-05 | 1999-03-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Unified semiconductor wafer packaging system to unify irregular shape buffer materials |
US6267245B1 (en) * | 1998-07-10 | 2001-07-31 | Fluoroware, Inc. | Cushioned wafer container |
US6450346B1 (en) * | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
US6601592B1 (en) * | 2000-09-01 | 2003-08-05 | Zhengming Chen | Method of semiconductor substrate batch demounting |
US6669253B2 (en) * | 2000-12-18 | 2003-12-30 | David W. Benzing | Wafer boat and boat holder |
US20040045865A1 (en) * | 2002-09-06 | 2004-03-11 | Jun Pil-Kwon | Wafer guides for processing semiconductor substrates |
US7017749B2 (en) * | 2001-05-30 | 2006-03-28 | Shin-Etsu Polymer Co., Ltd. | Precision substrate storage container and retaining member therefor |
US7344031B2 (en) * | 2004-06-11 | 2008-03-18 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2796502B2 (en) * | 1994-10-06 | 1998-09-10 | 信越ポリマー株式会社 | Wafer holding in wafer storage container |
JPH0966990A (en) * | 1995-09-04 | 1997-03-11 | Yayoi Kk | Electronic component-transfer body |
JPH1131740A (en) * | 1997-05-14 | 1999-02-02 | Komatsu Ltd | Semiconductor wafer container |
-
2005
- 2005-08-17 US US11/205,414 patent/US20060042998A1/en not_active Abandoned
- 2005-08-22 TW TW094128621A patent/TW200619108A/en unknown
- 2005-08-23 SG SG200505336A patent/SG120286A1/en unknown
- 2005-08-23 KR KR1020050077144A patent/KR20060050561A/en not_active Application Discontinuation
- 2005-08-23 JP JP2005240661A patent/JP2006066911A/en active Pending
Patent Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4102602A (en) * | 1976-08-31 | 1978-07-25 | Volkswagenwerk Aktiengesellschaft | Rotor for an axial turbine |
US4171740A (en) * | 1976-09-07 | 1979-10-23 | Monsanto Company | Wafer packaging system |
US4061228A (en) * | 1976-12-20 | 1977-12-06 | Fluoroware, Inc. | Shipping container for substrates |
US4555024A (en) * | 1984-04-12 | 1985-11-26 | Wacker-Chemie Gmbh | Packaging unit for semiconductor wafers |
US4966284A (en) * | 1987-07-07 | 1990-10-30 | Empak, Inc. | Substrate package |
US5253755A (en) * | 1991-03-20 | 1993-10-19 | Fluoroware, Inc. | Cushioned cover for disk container |
US5255797A (en) * | 1992-02-26 | 1993-10-26 | Fluoroware, Inc. | Wafer carrier with wafer retaining cushions |
US5555981A (en) * | 1992-05-26 | 1996-09-17 | Empak, Inc. | Wafer suspension box |
US5749467A (en) * | 1992-05-26 | 1998-05-12 | Empak, Inc. | Wafer suspension box |
US5538230A (en) * | 1994-08-08 | 1996-07-23 | Sibley; Thomas | Silicon carbide carrier for wafer processing |
US5586658A (en) * | 1995-06-06 | 1996-12-24 | Fluoroware, Inc. | Wafer cushions for wafer shipper |
US5864447A (en) * | 1995-08-15 | 1999-01-26 | Fujitsu Limited | Disk drive with stopper mechanism including a cushion member seated on a circumferential groove |
US5704493A (en) * | 1995-12-27 | 1998-01-06 | Dainippon Screen Mfg. Co., Ltd. | Substrate holder |
US5875896A (en) * | 1996-11-05 | 1999-03-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Unified semiconductor wafer packaging system to unify irregular shape buffer materials |
US5842575A (en) * | 1997-01-06 | 1998-12-01 | Empak, Inc. | Disk package for rotating memory disks |
US6267245B1 (en) * | 1998-07-10 | 2001-07-31 | Fluoroware, Inc. | Cushioned wafer container |
US6450346B1 (en) * | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
US6601592B1 (en) * | 2000-09-01 | 2003-08-05 | Zhengming Chen | Method of semiconductor substrate batch demounting |
US6669253B2 (en) * | 2000-12-18 | 2003-12-30 | David W. Benzing | Wafer boat and boat holder |
US7017749B2 (en) * | 2001-05-30 | 2006-03-28 | Shin-Etsu Polymer Co., Ltd. | Precision substrate storage container and retaining member therefor |
US20040045865A1 (en) * | 2002-09-06 | 2004-03-11 | Jun Pil-Kwon | Wafer guides for processing semiconductor substrates |
US7344031B2 (en) * | 2004-06-11 | 2008-03-18 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
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Also Published As
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JP2006066911A (en) | 2006-03-09 |
SG120286A1 (en) | 2006-03-28 |
KR20060050561A (en) | 2006-05-19 |
TW200619108A (en) | 2006-06-16 |
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