US20060050492A1 - Thin module system and method - Google Patents
Thin module system and method Download PDFInfo
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- US20060050492A1 US20060050492A1 US10/934,027 US93402704A US2006050492A1 US 20060050492 A1 US20060050492 A1 US 20060050492A1 US 93402704 A US93402704 A US 93402704A US 2006050492 A1 US2006050492 A1 US 2006050492A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
- G11C5/143—Detection of memory cassette insertion or removal; Continuity checks of supply or ground lines; Detection of supply variations, interruptions or levels ; Switching between alternative supplies
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Abstract
A flexible circuit has contacts for mounting in a socket or card edge connector. The flexible circuit includes integrated circuit devices mounted on both sides of the edge connector contacts. Preferably, the flexible circuit is wrapped about an edge of a rigid substrate and presents contacts on both sides of the substrate for mounting in a socket. Multiple flexible circuits may be overlaid with the same strategy. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers.
Description
- The present invention relates to systems and methods for creating high density circuit modules.
- A variety of techniques are used to make high density circuit modules. Some techniques require special circuit board designs, while other techniques use conventional circuit boards.
- Memory expansion is one of the many fields in which high density circuit board solutions provide space-saving advantages. For example, the well-known DIMM (Dual In-line Memory Module) board has been used for years, in various forms, to provide memory expansion. A typical DIMM includes a conventional PCB (Printed Circuit Board) with memory devices and supporting digital logic devices mounted on both sides. The DIMM is typically mounted in the host computer system by inserting a contact-bearing edge of the DIMM into a card edge connector. Typically, systems that employ DIMMs provide limited space for such devices and most memory expansion boards are somewhat limited in the memory capacity they add to a system.
- There are several known methods to improve the limited capacity of a DIMM or other circuit board. Such methods have various cost or performance impacts. Further, many capacity increasing techniques exacerbate profile issues and contribute to thermal management complexities.
- In one scheme, small circuit boards (daughter cards) are connected to the DIMM to provide extra mounting space. The additional connection may cause, however, flawed signal integrity for the data signals passing from the DIMM to the daughter card. For example, signal traces between devices on the DIMM and devices on the daughter card may at higher speeds add to signal dispersion while added connectors are a considerable reliability issue. Other problems may arise from the connector that attaches the daughter card to the DIMM. Such flaws may cause reflections and compromise the quality of signaling waveforms and reduce the maximum speed at which the devices may operate.
- Another scheme to increase circuit board capacity is multiple die packages (MDP). This scheme increases the capacity of the memory devices on the DIMM by including multiple semiconductor die in a single device package. The additional heat generated by the multiple die typically requires, however, additional cooling capabilities to operate at maximum operating speed. Further, the MDP scheme may exhibit increased costs because of increased yield loss from packaging together multiple die that are not fully pre-tested.
- Yet another strategy to increase circuit board capacity is stacked packages. This scheme increases capacity by stacking packaged integrated circuits to create a high-density circuit module for mounting on the circuit board. In some techniques, flexible conductors are used to selectively interconnect packaged integrated circuits. Staktek Group L.P. has developed numerous systems for aggregating CSP (chipscale packaged) devices in space saving topologies. The increased component height of some stacking techniques may alter, however, system requirements such as, for example, required cooling airflow or the minimum spacing around a circuit board on its host system.
- Typically, the known methods raise thermal management issues. For example, when a conventional FBGA packaged DRAM is mounted on a DIMM, the primary thermal path is through the balls into the core of a multilayer DIMM. When, for example, a stack of devices is employed on a DIMM, the top device gets hotter when it is active versus when the lower device is active, thus stacking methods in DIMM applications may present thermal constraints.
- What is needed therefore are methods and structures for providing high capacity circuit boards in thermally efficient, reliable designs that perform well at higher frequencies but are not too large, yet can be made at reasonable cost with commonly available and readily managed materials.
- A flexible circuit has contacts for mounting in a socket or card edge connector. Preferred embodiments of the present invention can be used to provide an increased surface area circuit board module.
- In one preferred embodiment, a flexible circuit is populated on both sides with integrated circuits and wrapped about an edge of a rigid substrate. The flexible circuit presents contacts for mounting the assembly in a socket. Multiple flex circuits may be overlaid with the same scheme. The flex circuit may aligned using tooling holes in the flex circuit and substrate. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers.
- In another preferred embodiment, the invention provides a method of assembling a circuit module including mounting ICs on both sides of a flexible circuit having contacts, providing a rigid substrate, and wrapping the flexible circuit around the substrate to present contacts near the edge of the substrate for insertion into an expansion board slot.
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FIG. 1 depicts a contact-bearing first side of a flex circuit devised in accordance with a preferred embodiment of the present invention. -
FIG. 2 depicts the second side of the flex circuit ofFIG. 1 . -
FIG. 3 depicts a cross-sectional view of a module assembly devised in accordance with a preferred embodiment of the present invention. -
FIG. 4 is an enlarged view of the area marked “A” inFIG. 3 . -
FIG. 5 is a plan view depicting one side of a module assembly devised in accordance with a preferred embodiment of the present invention. -
FIG. 6 is an enlarged view of a portion of one preferred embodiment. -
FIG. 7 depicts a cutout portion of a flex circuit and substrate according to one preferred embodiment. -
FIG. 8 depicts another embodiment of the present invention having a clip. -
FIG. 9 depicts another embodiment having a thinned portion of substrate. -
FIG. 10 is a cross-sectional view of another preferred embodiment of the present invention. -
FIG. 11 depicts another preferred embodiment having an extended substrate. -
FIG. 12 depicts alternate preferred embodiment having additional layers of ICs. -
FIG. 13 depicts another embodiment having flex portions wrapped around opposing edges of a substrate. -
FIG. 14 depicts yet another embodiment having a flex portion wrapped around opposing edges of a substrate. -
FIG. 15 is a cross-sectional view of another embodiment of the present invention. -
FIG. 16 depicts an alternative embodiment of the present invention. -
FIG. 17 depicts an alternative embodiment of the present invention having CSPs on the external side of a flex circuit. -
FIG. 18 depicts an alternative embodiment of the present invention having CSPs mounted between a flex circuit and substrate. -
FIG. 19 depicts an alternative embodiment of the present invention in which the flex circuit transits over an end of the substrate opposite the edge connector contacts. -
FIG. 20 is a preferred embodiment of the present invention similar to that depicted in earlierFIG. 11 . -
FIG. 21 depicts an alternative embodiment of the present invention in which a connector provides selective interconnective facility between parts of the flex circuit on opposite lateral sides of the substrate. -
FIG. 22 depicts details from the area marked “A” inFIG. 21 . -
FIG. 23 is an elevation view of an embodiment of an alternative circuit module. -
FIG. 24 is a cross-sectional view of the embodiment ofFIG. 23 . -
FIG. 25 is an elevation view of another embodiment of the alternative circuit module ofFIG. 23 . -
FIG. 26 is a cross-sectional view of the embodiment ofFIG. 25 . -
FIG. 27 is an elevation view of yet another alternative circuit module. -
FIG. 28 is a cross-sectional view of the alternative circuit module ofFIG. 27 . -
FIGS. 1 and 2 depict opposingsides Flex circuit 12 is preferably made from conductive layers supported by one or more flexible substrate layers as further described with reference to later Figures. The construction of flex circuitry is known in the art. The entirety of theflex circuit 12 may be flexible or, as those of skill in the art will recognize, theflexible circuit structure 12 may be made flexible in certain areas to allow conformability to required shapes or bends, and rigid in other areas to provide rigid and planar mounting surfaces.Preferred flex circuit 12 hasopenings 17 for use in aligningflex circuit 12 tosubstrate 14 during assembly. -
ICs 18 onflexible circuit 12 are, in this embodiment, chip-scale packaged memory devices. For purposes of this disclosure, the term chip-scale or “CSP” shall refer to integrated circuitry of any function with an array package providing connection to one or more die through contacts (often embodied as “bumps” or “balls” for example) distributed across a major surface of the package or die. CSP does not refer to leaded devices that provide connection to an integrated circuit within the package through leads emergent from at least one side of the periphery of the package such as, for example, a TSOP. - Embodiments of the present invention may be employed with leaded or CSP devices or other devices in both packaged and unpackaged forms but where the term CSP is used, the above definition for CSP should be adopted. Consequently, although CSP excludes leaded devices, references to CSP are to be broadly construed to include the large variety of array devices (and not to be limited to memory only) and whether die-sized or other size such as BGA and micro BGA as well as flip-chip. As those of skill will understand after appreciating this disclosure, some embodiments of the present invention may be devised to employ stacks of ICs each disposed where an
IC 18 is indicated in the exemplar FIGS. - Multiple integrated circuit die may be included in a package depicted a
single IC 18. While in this embodiment memory ICs are used to provide a memory expansion board, this is not limiting and various embodiments may include a variety of integrated circuits and other components. Such variety may include microprocessors, FPGA's, RF transceiver circuitry, digital logic, as a list of non-limiting examples, or other circuits or systems which may benefit from a high-density circuit board capability.Circuit 19 depicted between a pair ofICs 18 may be a memory buffer or controller. -
FIG. 1 depicts a top orouter side 8 offlex circuit 12 havingICs 18 mounted in two rows ICR1 and ICR2. Contact arrays are disposed beneathICs 18 andcircuit 19 to provide conductive pads for interconnection to the ICs. An exemplar contact array 11A is shown as isexemplar IC 18 to be mounted at contact array 11A as depicted. The contact arrays 11A that correspond to an IC row (e.g., ICR1) may be considered a contact array set. Between the rows ICR1 and ICR2 ofICs 18,flex circuit 12 has two rows (CR1 and CR2) ofmodule contacts 20. Whenflex circuit 12 is folded as depicted in laterFIGS. 3 and 4 ,side 8 depicted inFIG. 1 is presented at the outside ofmodule 10. The opposingside 9 of flex circuit 12 (FIG. 2 ) is on the inside in the folded configurations ofFIGS. 3 and 4 . The depiction ofFIG. 1 shows two pluralities ofICs 18 alongside 8 offlex circuit 12, the pluralities or sets of ICs being referenced inFIG. 1 as ICR1 and ICR2. Other embodiments may have other numbers of rows and there may be only one such row.FIG. 2 depicts another two pluralities ofICs 18 alongside 9 offlex circuit 12 referenced as ICR3 and ICR4. Various discrete components such as termination resistors, bypass capacitors, and bias resistors may also be mounted on each ofsides flex 12. Such discrete components are not shown to simplify the drawing.Flex circuit 12 may also depicted with reference to its perimeter edges, two of which are typically long (PElong1 and PElong2) and two of which are typically shorter (PEshort1 and PEshort2). Other embodiments may employflex circuits 12 that are not rectangular in shape and may be square in which case the perimeter edges would be of equal size or other convenient shape to adapt to manufacturing particulars. However, rectangular shapes forflex circuit 12 assist in providing a low profile for a preferred module devised with use offlex circuit 12. -
FIG. 1 depicts exemplar conductive traces 21 connecting rows CR1 and CR2 ofmodule contacts 20 toICs 18. Only a few exemplar traces are shown to simplify the drawing.Traces 21 may also connect to vias that may transit to other conductive layers offlex 12 in certain embodiments having more than one conductive layer. Shown is a via 23 connecting asignal trace 23 fromcircuit 19 to atrace 25 disposed on another conductive layer offlex 12 as illustrated by the dotted line oftrace 25. In a preferred embodiment, vias connectICs 18 onside 9 of flex 12 (FIG. 2 ) tomodule contacts 20.Traces flex 12 and may traverse the rows ofmodule contacts 20 to interconnect ICs. Together the various traces and vias make interconnections needed to convey data and control signals to the various ICs. Those of skill will understand that the present invention may be implemented with only a single row ofmodule contacts 20 and may, in other embodiments be implemented as a module bearing ICs on only one side. -
FIG. 3 is a cross section view of amodule assembly 10 devised in accordance with a preferred embodiment of the present invention.Module assembly 10 is populated withICs 18 havingtop surfaces 18 T and bottom surfaces 18 B.Substrate 14 has a first and a second perimeter edges 16A and 16B appearing in the depiction ofFIG. 3 as ends.Substrate 14 typically has first and second lateral sides S1 and S2. Flex 12 is wrapped aboutperimeter edge 16A ofsubstrate 14, which in the depicted embodiment, provides the basic shape of a common DIMM board form factor such as that defined by JEDEC standard MO-256. Preferably, at least aportion 24 of the pocket offlex 12 formed by the wrapping about the substrate is laminated or otherwise connected tosubstrate 14 on both sides ofsubstrate 14.Portion 24 may vary in length depending on factors such as, for example, the height ofICs 18, the thickness ofsubstrate 14, the length ofmodule contacts 20, and the size and design of the card edge connector or socket into whichmodule assembly 10 is adapted to be mounted. Aboveportion 24 is depictedflex level transition 26 offlex circuit 12. The space betweenflex level transition 26 andsubstrate 14 may be filled with a conformal or heat conductive underfill, or may be left unfilled.Flex level transition 26 is a bend formed in a manner devised to allowflex circuit 12 to provide conductive connection from a plane at the level offlex circuit portion 24 to a plane at the level offlex circuit portion 28. The offset between the two planes is, in this embodiment, the height of asingle IC 18 added to that of adhesive 30 (FIG. 6 ).Adhesive 30 in a preferred embodiment is a thermally conductive material to take advantage of the heat dissipation characteristics that may be provided by use of an appropriately selectedsubstrate 14 comprised, for example, of a metal such as aluminum. - The inner pair of the four depicted
ICs 18 are preferably attached tosubstrate 14 with a heatconductive adhesive 30. While in this embodiment, the four depicted ICs are attached to flexcircuit 12 in opposing pairs, this is not limiting and more ICs may be connected in other arrangements such as, for example, staggered or offset arrangements. Further, while only CSP packaged ICs are shown, other ICs and components may be attached. In a preferred embodiment,ICs 18 will be memory CSPs and various discrete components such as, for example, resistors and capacitors will also be mounted onflex circuit portion 28. To simplify the drawing, the discrete components are not shown. Further, ICs and other components may be mounted to flexcircuit portion 24. - In this embodiment,
flex circuit 12 hasmodule contacts 20 positioned in a manner devised to fit in a circuit board card edge connector or socket and connect to corresponding contacts in the connector (not shown). Whilemodule contacts 20 are shown protruding from the surface offlex circuit 12, this is not limiting and other embodiments may have flush contacts or contacts below the surface level offlex 12.Substrate 14 supportsmodule contacts 20 from behindflex circuit 12 in a manner devised to provide the mechanical form required for insertion into a socket. While the depictedsubstrate 14 has uniform thickness, this is not limiting and in other embodiments the thickness or surface ofsubstrate 14 in the vicinity ofperimeter edge 16A may differ from that in the vicinity ofperimeter edge 16B. Non-limiting examples of such possible variations are found inFIGS. 9 and 10 .Substrate 14 in the depicted embodiment is preferably made of a metal such as aluminum or copper, as non-limiting examples, or where thermal management is less of an issue, materials such as FR4 (flame retardant type 4) epoxy laminate, PTFE (poly-tetra-fluoro-ethylene) or plastic. In another embodiment, advantageous features from multiple technologies may be combined with use of FR4 having a layer of copper on both sides to provide asubstrate 14 devised from familiar materials which may provide heat conduction or a ground plane. - One advantageous methodology for efficiently assembling a
circuit module 10 such as described and depicted herein is as follows. In a preferred method of assembling apreferred module assembly 10,flex circuit 12 is placed flat and both sides populated according to circuit board assembly techniques known in the art.Flex circuit 12 is then folded aboutend 16A ofsubstrate 14. Next, tooling holes 17 may be used to alignflex 12 tosubstrate 14.Flex 12 may be laminated or otherwise attached tosubstrate 14 atportions 24. Further,top surfaces 18 T ofICs 18 may be attached tosubstrate 14 in a manner devised to provide mechanical integrity or thermal conduction. -
FIG. 4 is an enlarged view of the area marked ‘A’ inFIG. 3 .Edge 16A ofsubstrate 14 is shaped like a male side edge of an edge card connector. While a particular oval-like configuration is shown,edge 16A may take on other shapes devised to mate with various connectors or sockets. The form and function of various edge card connectors are well know in the art.Flex 12 is wrapped aroundedge 16A ofsubstrate 14 and may be laminated or adhesively connected tosubstrate 14 withadhesive 30. The depicted adhesive 30 andflex 12 may vary in thickness and are not drawn to scale to simplify the drawing. The depictedsubstrate 14 has a thickness such that when assembled with theflex 12 and adhesive 30 the thickness measured betweenmodule contacts 20 falls in the range specified for the mating connector. In some other embodiments,flex circuit 12 may be wrapped aboutperimeter edge 16B or bothperimeter edges substrate 14. -
FIG. 5 depicts a plan view ofmodule assembly 10 devised in accordance with a preferred embodiment of the present invention. Those of skill will recognize thatmodule assembly 10 may replace more traditional DIMMs employed in a large variety of systems.Module assembly 10 hasflex circuit 12 wrapped about anedge 16 ofsubstrate 14.ICs 18 are mounted to flexcircuit 12 along the depicted side as described with reference to earlier Figs.Module contacts 20 are presented nearedge 22 ofmodule assembly 10 for connection to a card edge connector or socket. -
FIG. 6 is an enlarged view of a portion of one preferred embodiment showinglower IC 18 1 andupper IC 18 2.Flex 12 hasflex level transition 26 bending fromflex circuit portion 24 to flexcircuit portion 28.Flex level transition 26 has, in this embodiment, aflexible base layer 62 and aconductive layer 66. In this embodiment,conductive layer 66 contains conductive traces connectingmodule contacts 20 onflex portion 24 toBGA contacts 63 onICs Flex portion 24 has two layers, but this is not limiting and other embodiments may have other numbers of layers. The number of layers may be devised in a manner to achieve the bend radius required to bend aroundedge 16A (FIG. 4 ) or 16B, for example. The number of layers in any particular portion offlex circuit 12 may also be devised to achieve the necessary connection density given a particular minimum trace width associated with the flex circuit technology used. - In this embodiment, there are three layers at
flex portion 28 between the two depictedICs Conductive layers conductive layers conductive layer 64 andmodule contacts 20. In this preferred embodiment having a three-layer flex portion 28, the twoconductive layers Flex circuit portions - With the construction of an embodiment such as that shown in
FIG. 6 , thermal energy will be urged to move fromIC 18 1 intosubstrate 14 as exemplified by thermal vector T1 and fromIC 18 1 intoIC 18 2 whenIC 18 1 is active. Thus,IC 18 2 assists in coolingIC 18 1, consequently providing improved thermal dissipation as the heat traveling fromIC 18 1 travels more readily throughflex circuit 12 and thecontacts 63 than through less thermally conductive materials such as PCB materials. Further,flex circuit 12 may be particularly devised to operate as a heat spreader or sink adding to the thermal conduction out ofICs -
FIG. 7 depicts a cutout portion of aflex circuit 12 andsubstrate 14 according to one preferred embodiment.Flex 12 hasopenings 17 for use in aligningflex 12 tosubstrate 14 during assembly. Such alignment may be accomplished by inserting a tooling piece along the path depicted by dottedline 76 through opening 17 onflex 12 and through correspondingopening 17 onsubstrate 14.Multiple openings 17 which may function as tooling holes may appear in various places. Further, the alignment betweenflex circuit 12 andsubstrate 14 may also be implemented, for example, with an opening and protrusion combination such as a slot and tab arrangement or a hole and pin arrangement, for example. Those of skill will be able to readily adapt the teachings of this disclosure to devise corresponding opening and protrusion arrangements for alignment of flex and substrate in accordance with the present invention. - Depicted are
indents 72 which may be required by certain card edge connectors. Similar indents will typically appear along edge 16 (FIG. 5 ) ofsubstrate 14 and may require corresponding holes or indents inflex circuit 12 to match mechanical features on certain card edge connectors. -
FIG. 8 depicts another embodiment having a clip. In this embodiment,clip 82 is depicted clipped aroundICs 18.Clip 82 is preferably made of metal or other heat conducting material. Preferably,clip 82 hastrough 84 devised to mate with the end ofsubstrate 14. The attachment may further be accomplished with adhesive betweenclip 82 andsubstrate 14 orICs 18. -
FIG. 9 depicts another embodiment having a thinned portion ofsubstrate 14. In this embodiment,substrate 14 has a first thickness 1 towardedge 16A devised to provide support for an edge and surrounding area ofmodule assembly 10 as may be needed for connection to a card edge connector. Above the portion ofsubstrate 14 with thickness 1 is aportion 92 havingthickness 2. The narrower width ofportion 92 is devised to narrow the total width ofmodule assembly 10 and may provide for enhanced cooling airflow or more dense spacing ofmodule assemblies 10 in their operating environment. -
FIG. 10 is a cross-sectional view of another preferred embodiment. The depiction is facing down.Substrate 14 is selectively thinned atportion 102 underdevice 104. Depicteddevice 104 has an exposeddie 106 mounted on a substrate. Other embodiments may have otherwise packaged or mounted integrated circuits or other devices with heights greater than thetypical IC 18.ICs 18 are in preferred embodiments memory CSPs all having similar heights. In this embodiment,device 104 is taller than theother ICs 18 populating theflex 12. Thinnedportion 102 ofsubstrate 14 underneathdevice 104 accommodates the extra height so thatflex 12 remains planer and the upper surface ofdevice 104contacts substrate 14.Substrate 14 may be manufactured for this or other similar embodiments with a variety of method such as, for example, by being milled with a CNC (computer numerical controlled) machine, or being extruded, for example. This and similar embodiments may be employed to advantage to provide advantageous heat performance whendevice 104 is a FB-DIMM advanced memory buffer (AMB).Device 104 is preferably attached tosubstrate 14 with heat conductive adhesive. -
FIG. 11 depicts another embodiment having an extendedsubstrate 14. Depictedextension 112 ofsubstrate 14 extends beyond the top offlex 12.Extension 112 is shaped to provide additional surface area for convective cooling. Such shape may be achieved by methods such as, for example, milling or extrusion, which are both known in the art. Preferably, extruded aluminum is used forsubstrate 14 in this and similar embodiments. -
FIG. 12 depicts another embodiment of the invention having additional layers ofICs 18. In this embodiment, four flex level transitions 26 connect to four mountingportions 28. Each mountingportion 28 hasICs 18 on both sides.Flex circuitry 12 may be provided in this configuration by, for example, having a split flex with layers interconnected with vias atportion 24 offlex 12. Further, two flex circuits may be used and interconnected by pad to pad contacts or inter-flex contacts. -
FIG. 13 depicts another embodiment having flex portions wrapped around opposing edges ofsubstrate 14.Flex circuit 12 has connectingportion 132 wrapped aroundform portion 134 ofsubstrate 14.Form portion 134 is a type ofperimeter edge 16B shaped to provide a larger surface for transit of the flex circuit. In a preferred methodology for assembling this embodiment, the depictedICs 18 are first mounted to flexcircuit 12.Flex portion 26 associated with IC 18 a is placed in position relative to the substrate.Flex circuit 12 is then wrapped aroundedge 16 of substrate 14 a first time. Appropriate adhesive lamination or other techniques are used to attachflex 12 and ICs 18 a and 18 b tosubstrate 14. Connectingportion 132 offlex circuit 12 is wrapped aroundform portion 134. Adhesive may be used to make back-to-back connections between the depictedICs 18. Lamination or other adhesive or bonding techniques may be used to attach the two layers offlex 12 to each other atflex portions 24. Further, the two layers offlex circuitry 12 wrapped aroundedge 16A may interconnected with by pad to pad contacts or inter-flex contacts.Flex 12 is wrapped again aroundedge 16A, putting IC 18 c into position. IC 18 d is positioned back-to-back with IC 18 e and attached. -
FIG. 14 depicts another embodiment having a flex portion wrapped around opposing edges ofsubstrate 14.Flex circuit 12 has connectingportion 132 wrapped aroundform portion 134 ofsubstrate 14. Connectingportion 132 preferably has more than one conductive layer, and may have three or four or more conductive layers. Such layers may be beneficial to route signals for applications such as, for example, a FB-DIMM (fully-buffered DIMM) which may have less DIMM input/output signals than a registered DIMM, but may have more interconnect traces required among devices on the DIMM, such as, for example, the C/A copy A and C/A copy B (command/address) signals produced by an FB-DIMM advanced memory buffer (AMB).Flex 12 terminates atend 136, which may be at the level offlex portion 28 or may extend to the level ofportion 24 and be attached tosubstrate 14. While two sets ofmodule contacts 20 are shown, other embodiments may have only one set and may not haveflex 12 wrapped aroundedge 16A ofsubstrate 14. -
FIG. 15 depicts a cross-sectional view of another alternative embodiment of the present invention.Flex circuit 12exhibits contacts 20 proximal to opposingedges 192. Connectingportion 132 offlex circuit 12 is wrapped aboutform portion 134 ofsubstrate 14.Contacts 20 are, in this embodiment, arranged proximal toopposite edges 192 offlex circuit 12. In a preferred methodology for assembling this embodiment, the depictedICs 18 are first mounted to flexcircuit 12.Flex circuit 12 is wrapped aboutform portion 134 ofsubstrate 14 and preferably aligned tosubstrate 14 with tooling holes.Portion 24 offlex circuit 12 is preferably laminated tosubstrate 14. -
FIG. 16 depicts an alternative embodiment of the present invention. -
FIG. 17 depicts an alternative embodiment of the present invention having CSPs on the external side of a flex circuit. -
FIG. 18 depicts an alternative embodiment of the present invention having CSPs mounted between a flex circuit and substrate. -
FIG. 19 depicts an alternative embodiment of the present invention in which the flex circuit transits over an end of the substrate opposite the module contacts. -
FIG. 20 is a preferred embodiment of the present invention similar to that depicted in earlierFIG. 11 . -
FIGS. 21 and 22 depict an alternative embodiment of the present invention that employs aconnector 200 to provide selective interconnection betweenportions flex circuit 12 associated respectively with lateral sides S1 and S2 ofsubstrate 14. The depictedconnector 200 hasfirst part cavity 204 offlex circuit 12. One example ofconnector 200 is a 500024/50027 Molex connector but a variety of different connectors may be employed in embodiments of the invention. The depictedconnector 200 is disposed in substrate cavity and typically will have afirst part 200A and asecond part 200B. -
FIGS. 23 and 24 depict an alternative circuit module. In the embodiment shown inFIGS. 23 and 24 flex circuit 12 is a rigid flex.FIG. 23 is an elevation view.FIG. 24 is a cross-sectional view. As shown,flex circuit 12 has tworigid portions 13 connected by abend 31 at the flexible region. Imposingbend 31 inflex circuit 12 creates an open-endedpocket 32 into which may be at least partially inserted a support orsubstrate 14 as shown in earlier FIGS. and/or a heat spreader such asheat spreader 152 shown inFIG. 24 . - Both
rigid portions 13 offlex circuit 12 haveICs 18 mounted on opposing sides.Heat spreader 152 shown between rows ofICs 18, may be attached to the upper major surface of one or both of the depictedICs 18.Heat spreader 152 is preferably copper or other heat conductive metal or metal alloy.Contacts 20 are presented along the sides ofrigid portion 13 proximal to edge 16.Contacts 20 andedge 16 are sized and arranged for insertion into a card edge connector or socket. -
FIGS. 25 and 26 depict another alternative circuit module.FIG. 27 is an elevation view.FIG. 28 is a cross-sectional view. In this embodiment,substrate 14 is a circuit board preferably made of FR4 having etched copper layers.ICs 18 are mounted alongsubstrate 14.Additional ICs 18 are mounted alongflex circuit 12.Flex circuit 12 if folded over the top edge ofsubstrate 12 to interconnectICs 18 onflex circuit 12. The depicted adjacent ICs inFIG. 26 may be attached adhesively back-to-back and may be provided with a heat spreader 152 (FIG. 24 ) between them. Flex level transitions 26 bend fromflex portion 28 to flexportion 24.Flex portion 24, in this embodiment, has contacts for electrical connection tosubstrate 14.Substrate 14 hascontacts 20 for connection to a card edge connector or socket. -
FIGS. 27 and 28 depict another alternative circuit module.FIG. 28 is an elevation view.FIG. 26 is a cross-sectional view.Flex circuit 12 is bent lengthwise aboutsubstrate 14 atbend 204. Atbend 202,flex circuit 12 is bent back overheat spreader 152. Preferably, the upper major surfaces of theICs 18 adjacent tosubstrate 14 are attached tosubstrate 14. Flex level transitions 26 A and 26 B bend to alignportion 24 offlex circuit 12 for attachment tosubstrate 14.Flex transition 26 A passes through slot 121 formed insubstrate 14. In this alternative embodiment,substrate 14 is shaped in a manner devised to centercontacts 20 in the cross-section. Somecontacts 20 are depicted onsubstrate 14. In this embodiment,substrate 14 is preferably a circuit board made of FR4.Portions 24 offlex circuit 12 may have contact pads for electrical connection to corresponding contact pads onsubstrate 14. In other embodiments,flex circuit 12 may be folded about the edge ofsubstrate 14 orcontacts 20 may appear on only one side ofmodule 10. - Although the present invention has been described in detail, it will be apparent to those skilled in the art that many embodiments taking a variety of specific forms and reflecting changes, substitutions and alterations can be made without departing from the spirit and scope of the invention. The described embodiments illustrate the scope of the claims but do not restrict the scope of the claims.
Claims (57)
1. A memory expansion board comprising:
(a) a rigid substrate having two opposing lateral sides and an edge;
(b) a flex circuit wrapped about the edge of the rigid substrate, the flex circuit having a first side and a second side, a portion of the flex circuit attached to at least one of the lateral sides of the rigid substrate, the flex circuit having plural contacts adapted for connection to a circuit board socket, the plural contacts being disposed near the edge of the rigid substrate on the outside side of the flex circuit;
(c) plural memory CSPs mounted on the first side and second side of the flex circuit.
2. The memory expansion board of claim 1 in which the plural CSPs each have a top surface and one or more of the top surfaces of the plural CSPs is attached to the rigid substrate.
3. The memory expansion board of claim 1 in which the rigid substrate is made of a conductive material.
4. The memory expansion board of claim 1 in which the rigid substrate is made of a thermally conductive material.
5. The memory expansion board of claim 1 in which the rigid substrate has an extension.
6. The memory expansion board of claim 1 further comprising at least one alignment opening of the flex circuit matching at least one alignment opening of the rigid substrate.
7. The memory expansion board of claim 1 further comprising at least one alignment opening of the flex circuit matching at least one alignment protrusion of the rigid substrate.
8. The memory expansion board of claim 1 further comprising at least one alignment tab of the rigid substrate.
9. A circuit module comprising:
a substrate having a first and a second lateral side and a first perimeter edge and a second perimeter edge;
a flex circuit having a first side and a second side, the first side having expansion board contacts adapted for connection to an expansion board slot and having a set of contact arrays, the flex circuit being wrapped about the first perimeter edge of the substrate to place the expansion board contacts of the first side closer to the first perimeter edge of the substrate than is disposed the set of contact arrays and to place the second side of the flex circuit closer to the lateral sides of the substrate than is disposed the first side of the flex circuit.
10. A circuit module comprising:
a substrate having a first and a second lateral side and a first perimeter edge and a second perimeter edge;
a flex circuit having a first side and a second side, the first side having expansion board contacts adapted for connection to an expansion board slot and having a set of contact arrays, the flex circuit being wrapped about the first perimeter edge of the substrate to place the expansion board contacts of the first side closer to the second perimeter edge of the substrate than is disposed the set of contact arrays and to place the second side of the flex circuit closer to the lateral sides of the substrate than is disposed the first side of the flex circuit.
11. A circuit module comprising a flex circuit having a first side having contacts adapted for connection to a socket, a second side, and being imposed with a bend to form an open-ended pocket having an inward side and an outward side and being open at one end and closed at the other end of the pocket, the first side of the flex circuit being on the outward side of the pocket and the second side of the flex circuit being on the inward side of the pocket.
12. The circuit module of claim 11 further comprising a rigid interposer disposed at least partially in the open-ended pocket of the flex circuit.
13. The circuit module of claim 12 in which the rigid interposer is made of a conductive material.
14. The circuit module of claim 11 further comprising a support member disposed at least partially in the open-ended pocket of the flex circuit.
15. The circuit module of claim 11 further comprising a heat-conducting member disposed at least partially in the open-ended pocket of the flex circuit.
16. The circuit module of claim 12 , in which the rigid interposer has a necked narrow portion disposed adjacent to the closed end of the pocket.
17. The circuit module 11 in which the flex circuit has two end portions, each end portion having a plurality of memory CSPs mounted on the first and second sides of the flex circuit.
18. A circuit module comprising:
(a) a flex circuit having an inner side and an outer side;
(b) plural CSPs mounted along the inner side and the outer side of the flex circuit;
(c) a bend in the flex circuit between first and second portions of the flex circuit, the first and second portions each having contacts arranged along their outer side, the contacts for mounting the circuit module in a card edge connector, the bend separating a first set of the plural CSPs from a second set of the plural CSPs;
(d) a support structure about which the flex circuit transits through the bend.
19. The circuit module of claim 18 in which at least one of the CSPs on the inner side of the flex circuit is adhesively connected to the support structure.
20. The circuit module of claim 18 in which at least one of the CSPs on the inner side of the flex circuit is thermally connected to the support structure.
21. The circuit module of claim 18 in which a portion of the flex circuit is laminated to the support structure.
22. The circuit module of claim 18 in which the bend in the flex circuit creates an open-ended pocket having a closed end and an open end and the support structure exhibits a first portion having a first thickness at the closed end of the pocket and presents a second portion having a second thickness at the open end of the pocket in the flex circuit.
23. The circuit module of claim 18 in which the support structure has a first portion and a second portion, the first portion being thinner than the second portion.
24. A method for devising a circuit module comprising the steps of:
providing a flex circuit having first and second sides and first and second long perimeter edges and first and second short perimeter edges with a set of module contacts along the first side and first and second pluralities of CSPs disposed laterally about the set of module contacts to place the first plurality of CSPs nearer the first long perimeter edge of the flex circuit than is disposed the set of module contacts and the second plurality of CSPs nearer the second long perimeter edge of the flex circuit than is disposed the set of module contacts;
a substrate having first and second lateral sides and a first long perimeter edge and a second long perimeter edge;
wrapping the flex circuit about the substrate to dispose the second side of the flex circuit closer to the first and second lateral sides of the substrate than is disposed the first side of the flex circuit and to dispose the set of module contacts nearer the first long perimeter edge of the substrate than the second long perimeter edge of the substrate and to place the first plurality of CSPs closer to the first lateral side of the substrate than is disposed the second plurality of CSPs.
25. The method of claim 24 in which the provided flex circuit has third and fourth pluralities of CSPs.
26. The method of claim 24 in which the CSPs are each stacked modules composed of two or more individual CSPs.
27. A method for providing increased memory capacity for a computer system comprising the steps of:
providing a circuit module in accordance with claim 1 and inserting said module into an expansion slot.
28. A method for providing increased memory capacity for a computing system comprising the steps of:
providing a circuit module devised in accordance with claim 24 and inserting said module into an expansion slot on a motherboard.
28. A method of assembling a circuit module comprising the steps:
providing a flex circuit having a first side and a second side, the first side having a plurality of pads for mounting components and a plurality of contacts for insertion in an expansion board slot; the second side having a plurality of pads for mounting components;
mounting plural CSPs along the first side of the flex circuit;
mounting plural discrete components along the first side of the flex circuit;
mounting plural CSPs along the second side of the flex circuit;
mounting plural discrete components along the second side of the flex circuit;
providing a rigid substrate having first and second major surfaces and an edge; and
wrapping the flex circuit about the edge of the rigid substrate, with the first side facing outward, such that a first set of the plurality of contacts are disposed proximal to the edge of the rigid substrate.
29. The method of claim 28 in which the step of wrapping the flex circuit further includes wrapping such that a second set of the plurality of contacts are disposed proximal to the edge of the rigid substrate.
30. The method of claim 28 further including the step of attaching at least one of the plural CSPs along the second side of the flex circuit to the rigid substrate.
31. The method of claim 28 further including the step of thermally connecting at least one of the plural CSPs along the second side of the flex circuit to the rigid substrate.
32. The method of claim 28 further including the step of attaching a heat radiating clip to selected ones of the plural CSPs.
33. The method of claim 28 further including the step of attaching a heat radiating element to at least one of the CSPs along the first side of the flex circuit.
34. The method of claim 28 further including the step of inserting the plurality of contacts at least partially into an expansion board slot for connection to an operating environment.
35. A method of assembling a circuit module comprising the steps:
providing a flex circuit having a first side and a second side and a plurality of contacts along the first side for insertion in an expansion board slot;
mounting at least first and second CSPs along the first side of the flex circuit;
providing a rigid substrate having first and second major sides and an edge;
wrapping the flex circuit about the rigid substrate to dispose the first of the at least first and second CSPs closer to the first major side of the rigid substrate than the second major side of the substrate and dispose the second of the at least first and second CSPs closer to the second major side of the rigid substrate than the first major side of the substrate and attaching the flex circuit to the rigid substrate such that the plural contacts are presented proximal to the edge of the rigid substrate for insertion into the expansion board slot.
36. The method of claim 35 in which the step of attaching the flex circuit to the rigid substrate comprises lamination.
37. The method of claim 35 further comprising mounting third and fourth CSPs along the second side of the flex circuit.
38. The method of claim 35 in which the rigid substrate is made of heat conducting material.
39. The method of claim 35 in which the rigid substrate has first portion and a second portion, the first portion being thinner than the second portion.
40. The method of claim 35 further including the step of thinning the rigid substrate along the edge of the rigid substrate.
41. The method of claim 35 further including the step of aligning a tooling hole of the flex circuit with a tooling hole of the rigid substrate.
42. A populated flexible circuit comprising:
a flexible circuit having a first major side and a second major side, the flexible circuit exhibiting along the first major side, first-side first and second sets of contact site arrays between which is located a row of connector contacts, the second major side of the flexible circuit exhibiting second-side first and second sets of contact site arrays which correspond to the first-side first and second sets of contact site arrays, each of the first-side and second-side first and second sets of contact site arrays comprising at least two surface mount arrays, the flexible circuit providing connections between the at least two surface mount arrays of each of the first-side first and second sets of contact site arrays and the at least two surface mount arrays of each of the second-side first and second sets of contact site arrays;
a plurality of CSPs that populate the at least two surface mount arrays of each of the first-side first and second sets of contact site arrays and the at least two surface mount arrays of each of the second-side first and second sets of contact site arrays.
43. A circuit assembly comprising:
a flexible circuit having a first major side and a second major side, the flexible circuit having at least one or more rows of surface mount arrays on the first major side and two or more rows of surface mount arrays on the second major side, the flexible circuit having a arcuate bend between a selected two of the two or more rows of surface mount arrays on the second major side, the second major side facing inward to the arcuate bend, the flexible circuit having an end edge and connector contacts disposed proximal to the end edge;
a plurality of CSPs that populate the one or more rows of surface mount arrays of the first major side and the two or more rows of surface mount arrays of the second major side, each of the CSPs having a top major surface;
a support substrate partially within the arcuate bend, the support substrate having a first side and a second side and an edge, at least one of the top major surfaces of the plurality of CSPs populating the two or more rows of surface mount arrays of the second major side being attached to the support substrate, the edge of the support substrate being adapted for insertion into a card edge connector.
44. A circuit assembly comprising:
a flexible circuit having a first major side and a second major side, the flex circuit having two or more rows of surface mount arrays on the second major side, the flexible circuit having an arcuate bend between a selected two of the two or more rows of surface mount arrays on the second major side, the second major side facing inward to the arcuate bend, the flexible circuit having an end edge and connector contacts disposed proximal to the end edge;
a plurality of CSPs that populate the two or more rows of surface mount arrays of the second major side, each of the CSPs having a top major surface;
a support substrate partially within the arcuate bend, the support substrate having a first side and a second side and an edge, at least one of the top major surfaces of the plurality of CSPs populating the two or more rows of surface mount arrays of the second major side being attached to the support substrate, the edge of the support substrate being adapted for insertion into a card edge connector.
45. A circuit module comprising:
a rigid substrate having two opposing lateral sides and two opposing end edges;
a flexible circuit wrapped about at least one of the two opposing end edges, the flexible circuit having a first side and a second side each having one or more rows of contact site arrays, a portion of the flex circuit being attached to at least one of the lateral sides of the circuit board, the flex circuit having plural contacts adapted for electrical connection to a card edge connector.
46. The circuit module of claim 45 in which the plural contacts are on the first side of the flex circuit, and in which a portion of the second side of the flex circuit opposite at least some of the plural contacts is laminated to the rigid substrate.
47. A circuit module comprising:
a circuit board having two opposing lateral sides and an edge;
a flex circuit wrapped around the edge of the rigid substrate, the flex circuit having an inner side and an outer side, the inner and outer sides each having two or more rows of contact site arrays, a portion of the flex circuit being laminated to at least one of the lateral sides of the circuit board, the flex circuit having plural contacts adapted for electrical connection to the circuit board;
a plurality of CSPs mounted to the two or more rows of contacts site arrays of the inner side and the outer side of the flex circuit.
48. A method to encourage the extraction of thermal energy from a CSP that operates in conjunction with at least one other CSP comprising the steps of:
providing a first CSP having a top surface and a bottom surface, there being CSP contacts along the bottom surface;
providing a thermally conductive substrate member and attaching the first CSP to the thermally conductive substrate member;
providing a flex circuit and attaching the first CSP to the flex circuit, the attachment being effectuated employing the CSP contacts of the first CSP and employing the thermally conductive substrate member as a support for a part of the flex circuit;
providing a second CSP having a bottom surface and CSP contacts and attaching the second CSP to the flex circuit, the attachment being effectuated employing the CSP contacts of the second CSP so that the CSP contacts of the first CSP are separated from the CSP contacts of the second CSP by a part of the flex circuit.
49. The method of claim 48 further comprising a set of contacts electrically connected to the flex circuit to provide connective facility for the first and second CSPs to an operating environment.
50. The method of claim 48 in which the thermally conductive substrate member is comprised of a metal.
51. The method of claim 50 in which the thermally conductive substrate member is comprised of aluminum.
52. The method of claim 50 in which the thermally conductive substrate member is comprised of a radiative portion having fins.
53. The method of claim 48 in which the thermally conductive substrate member is comprised of FR4 and a metallic layer.
54. The method of claim 48 in which the attachment of the first CSP to the thermally conductive substrate member is by the top surface of the first CSP.
55. A circuit module to encourage the extraction of thermal energy from a CSP that operates in conjunction with at least one other CSP comprising:
a first CSP having a top surface and a bottom surface and CSP contacts, the CSP contacts being along the bottom surface;
a thermally conductive substrate member attached to the first CSP;
a flex circuit attached to the first CSP, the attachment being effectuated employing the CSP contacts of the first CSP, the thermally conductive substrate member being a support for a part of the flex circuit;
a second CSP attached the flex circuit, the attachment being effectuated employing the CSP contacts of the second CSP so that the CSP contacts of the first CSP are separated from the CSP contacts of the second CSP by at least a part of the flex circuit.
56. A circuit module comprising:
a substrate having first and second lateral sides and a cavity;
flex circuitry having a first portion adjacent to the first lateral side of the substrate and a second portion adjacent to the second lateral side of the substrate;
the flex circuitry having edge card connector contacts;
a connector having first and second parts which are selectively joinable;
the first part of the connector being connected to the first portion of the flex circuitry and the second part of the connector being connected to the second portion of the flex circuitry, the first and second parts of the flex circuitry being joined in the cavity of the substrate.
Priority Applications (39)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/934,027 US20060050492A1 (en) | 2004-09-03 | 2004-09-03 | Thin module system and method |
US11/005,992 US7480152B2 (en) | 2004-09-03 | 2004-12-07 | Thin module system and method |
US11/007,551 US7511968B2 (en) | 2004-09-03 | 2004-12-08 | Buffered thin module system and method |
US11/058,979 US7468893B2 (en) | 2004-09-03 | 2005-02-16 | Thin module system and method |
US11/068,688 US7324352B2 (en) | 2004-09-03 | 2005-03-01 | High capacity thin module system and method |
US11/077,952 US7606040B2 (en) | 2004-09-03 | 2005-03-11 | Memory module system and method |
US11/123,721 US20060053345A1 (en) | 2004-09-03 | 2005-05-06 | Thin module system and method |
US11/125,018 US7606049B2 (en) | 2004-09-03 | 2005-05-09 | Module thermal management system and method |
US11/157,565 US7423885B2 (en) | 2004-09-03 | 2005-06-21 | Die module system |
US11/173,450 US20060049512A1 (en) | 2004-09-03 | 2005-07-01 | Thin module system and method with skew reduction |
US11/187,269 US7606050B2 (en) | 2004-09-03 | 2005-07-22 | Compact module system and method |
US11/193,954 US20060049513A1 (en) | 2004-09-03 | 2005-07-29 | Thin module system and method with thermal management |
PCT/US2005/028547 WO2006028643A2 (en) | 2004-09-03 | 2005-08-10 | Circuit module system and method |
CA002515714A CA2515714A1 (en) | 2004-09-03 | 2005-08-11 | Circuit module system and method |
FR0508522A FR2878118A1 (en) | 2004-09-03 | 2005-08-11 | CIRCUIT MODULE, METHOD FOR ASSEMBLING THE SAME, SYSTEM FOR EXTRACTING HEAT ENERGY FROM CIRCUIT MODULE, AND THERMAL MANAGEMENT SYSTEM |
AU2005203591A AU2005203591A1 (en) | 2004-09-03 | 2005-08-11 | Circuit module system and method |
CNA2005101132511A CN1819185A (en) | 2004-09-03 | 2005-08-12 | Die module system and method |
GB0822086A GB2453064A (en) | 2004-09-03 | 2005-08-12 | Circuit module for memory expansion |
GB0516622A GB2417836B (en) | 2004-09-03 | 2005-08-12 | Circuit module system and method |
GB0822085A GB2452880B (en) | 2004-09-03 | 2005-08-12 | Circuit module system and method |
DE102005038254A DE102005038254A1 (en) | 2004-09-03 | 2005-08-12 | Circuit module system and method |
JP2005235451A JP2006074031A (en) | 2004-09-03 | 2005-08-15 | Circuit module system and method |
KR1020050074824A KR100880054B1 (en) | 2004-09-03 | 2005-08-16 | Circuit module system and method |
US11/231,418 US7443023B2 (en) | 2004-09-03 | 2005-09-21 | High capacity thin module system |
US11/242,962 US20060048385A1 (en) | 2004-09-03 | 2005-10-04 | Minimized profile circuit module systems and methods |
US11/255,061 US7542297B2 (en) | 2004-09-03 | 2005-10-19 | Optimized mounting area circuit module system and method |
US11/283,355 US7446410B2 (en) | 2004-09-03 | 2005-11-18 | Circuit module with thermal casing systems |
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US11/331,969 US7616452B2 (en) | 2004-09-03 | 2006-01-13 | Flex circuit constructions for high capacity circuit module systems and methods |
US11/397,597 US7760513B2 (en) | 2004-09-03 | 2006-04-03 | Modified core for circuit module system and method |
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US11/624,608 US7602613B2 (en) | 2004-09-03 | 2007-01-18 | Thin module system and method |
US11/777,925 US7522421B2 (en) | 2004-09-03 | 2007-07-13 | Split core circuit module |
US11/869,644 US7606042B2 (en) | 2004-09-03 | 2007-10-09 | High capacity thin module system and method |
US11/869,687 US7522425B2 (en) | 2004-09-03 | 2007-10-09 | High capacity thin module system and method |
US11/961,477 US7459784B2 (en) | 2004-09-03 | 2007-12-20 | High capacity thin module system |
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US12/263,060 US7737549B2 (en) | 2004-09-03 | 2008-10-31 | Circuit module with thermal casing systems |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/934,027 US20060050492A1 (en) | 2004-09-03 | 2004-09-03 | Thin module system and method |
Related Parent Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/005,992 Continuation-In-Part US7480152B2 (en) | 2004-09-03 | 2004-12-07 | Thin module system and method |
US11/007,551 Continuation-In-Part US7511968B2 (en) | 2004-09-03 | 2004-12-08 | Buffered thin module system and method |
US11/123,721 Continuation-In-Part US20060053345A1 (en) | 2004-09-03 | 2005-05-06 | Thin module system and method |
Related Child Applications (11)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/005,992 Continuation-In-Part US7480152B2 (en) | 2004-09-03 | 2004-12-07 | Thin module system and method |
US11/007,551 Continuation-In-Part US7511968B2 (en) | 2004-09-03 | 2004-12-08 | Buffered thin module system and method |
US11/068,688 Continuation-In-Part US7324352B2 (en) | 2004-09-03 | 2005-03-01 | High capacity thin module system and method |
US11/077,952 Continuation-In-Part US7606040B2 (en) | 2004-09-03 | 2005-03-11 | Memory module system and method |
US11/231,418 Continuation-In-Part US7443023B2 (en) | 2004-09-03 | 2005-09-21 | High capacity thin module system |
US11/255,061 Continuation-In-Part US7542297B2 (en) | 2004-09-03 | 2005-10-19 | Optimized mounting area circuit module system and method |
US11/283,355 Continuation-In-Part US7446410B2 (en) | 2004-09-03 | 2005-11-18 | Circuit module with thermal casing systems |
US11/331,969 Continuation-In-Part US7616452B2 (en) | 2004-09-03 | 2006-01-13 | Flex circuit constructions for high capacity circuit module systems and methods |
US11/397,597 Continuation-In-Part US7760513B2 (en) | 2004-09-03 | 2006-04-03 | Modified core for circuit module system and method |
US11/624,608 Division US7602613B2 (en) | 2004-09-03 | 2007-01-18 | Thin module system and method |
US11/777,925 Continuation-In-Part US7522421B2 (en) | 2004-09-03 | 2007-07-13 | Split core circuit module |
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US20060050492A1 true US20060050492A1 (en) | 2006-03-09 |
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US10/934,027 Abandoned US20060050492A1 (en) | 2004-09-03 | 2004-09-03 | Thin module system and method |
US11/005,992 Active 2025-08-07 US7480152B2 (en) | 2004-09-03 | 2004-12-07 | Thin module system and method |
US11/624,608 Active US7602613B2 (en) | 2004-09-03 | 2007-01-18 | Thin module system and method |
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Also Published As
Publication number | Publication date |
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US7602613B2 (en) | 2009-10-13 |
US7480152B2 (en) | 2009-01-20 |
US20070115017A1 (en) | 2007-05-24 |
US20060050496A1 (en) | 2006-03-09 |
CN1819185A (en) | 2006-08-16 |
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