US20060084288A1 - Flexible land grid array connector - Google Patents
Flexible land grid array connector Download PDFInfo
- Publication number
- US20060084288A1 US20060084288A1 US10/969,369 US96936904A US2006084288A1 US 20060084288 A1 US20060084288 A1 US 20060084288A1 US 96936904 A US96936904 A US 96936904A US 2006084288 A1 US2006084288 A1 US 2006084288A1
- Authority
- US
- United States
- Prior art keywords
- metallic film
- film conductors
- major surface
- lga
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims abstract description 10
- 238000005240 physical vapour deposition Methods 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims abstract description 7
- 238000001465 metallisation Methods 0.000 claims abstract description 6
- 238000004544 sputter deposition Methods 0.000 claims abstract description 6
- 230000006355 external stress Effects 0.000 claims abstract description 4
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 17
- 238000000151 deposition Methods 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 2
- 239000002184 metal Substances 0.000 abstract description 30
- 230000035882 stress Effects 0.000 abstract description 8
- 239000011231 conductive filler Substances 0.000 abstract description 3
- 230000005489 elastic deformation Effects 0.000 abstract description 2
- 229920001971 elastomer Polymers 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- -1 siloxane core Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
Definitions
- the present invention relates to a flexible land grid array connector. More particularly, the present invention relates to a flexible connector between a land grid array connector and a printed circuit board.
- Integrated circuits are typically housed within a package, which is designed to protect the circuit from damage, provide adequate heat dissipation during operation, and provide electrical connection between the integrated circuits and the leads of a printed circuit board.
- a package which is designed to protect the circuit from damage, provide adequate heat dissipation during operation, and provide electrical connection between the integrated circuits and the leads of a printed circuit board.
- Several conventional package types such as land grid array (LGA), pin grid array (PGA), ball grid array (BGA) and column grid array (CGA), are designed to provide the above functions.
- An array of interconnection elements known as an interposer
- an interposer is placed between two arrays to be connected, and provides the electrical connection between the contact pins or pads. Since the individual contact members of an interposer can be made resilient, they can accommodate a CTE (coefficient of thermal expansion) mismatch between the module and system board.
- An LGA package is an integrated circuit package having a plurality of planar metallized areas, called lands, for interconnection between the leads of the integrated circuit and a printed circuit board.
- An LGA can be mounted to a printed circuit board with connectors, which have been developed to maintain a solderless connection between an integrated circuit package and a printed circuit board. As the number of lands is increased, the pitch between contacts decreases and manufacturing problems consequently increase.
- the manufacturing method of placing individual wires into tightly packed through-holes requires tremendous technological developments.
- Another example is a metallized polymer interconnect (MPI) connector.
- the MPI connector includes a siloxane core with conductive fillers that is positioned between the LGA module and the substrate.
- extreme stress relaxation rates are needed in order to achieve a desired level of durability.
- an LGA connector is used to interconnect an LGA package and a printed circuit board.
- the LGA connector includes an elastomeric body with a plurality of through-holes.
- Metal films are formed on inner walls of the through-holes and splay out around the mouths of their upper and lower openings.
- the metal films are formed by vacuum metallization, sputtering, chemical plating, electrical plating or PVD (physical vapor deposition).
- the through-holes have a funnel-like shape to absorb external stresses by redirecting the stress to shrink the diameters of the through-holes.
- the metal films' elastic deformation is larger than conventional metal conductive fillers so as to improve reliability.
- a triple-layered elastomeric body is provided when corresponding contact electrodes of an LGA package and a printed circuit board are mismatched in position.
- An upper elastomeric layer and a lower elastomeric layer made of rubber exist, which have a plurality of funnel-like through-holes formed by etching.
- a metal layer is formed on an inner wall and around each upper and lower opening of each through-hole of each layer.
- An interconnection elastomeric layer made of rubber exists, which has a plurality of funnel-like through-holes formed by etching.
- a metal layer is formed on an inner wall and around each upper and lower opening of each through-hole so as to interconnect the metal layer of the upper and lower elastomeric layer.
- FIG. 1A illustrates a cross-sectional view of an LGA connector according to one preferred embodiment of this invention
- FIG. 1B illustrates a cross-sectional view of an LGA connector according to another preferred embodiment of this invention
- FIG. 2 illustrates a top cross-sectional view of an LGA connector's elastomeric body according to one preferred embodiment of this invention
- FIG. 3 illustrates a cross-sectional view of an LGA connector according to yet another preferred embodiment of this invention.
- FIG. 4 illustrates a cross-sectional view of an LGA connector under upper and lower stress according to one preferred embodiment of this invention.
- the present invention provides an LGA connector for solderless connection between an LGA package and a printed circuit board.
- the LGA connector is an elastomeric body having a plurality of through-holes.
- FIG. 1A illustrates a cross-sectional view of an LGA connector according to one preferred embodiment of this invention.
- the LGA connector includes an elastomeric body 200 made of rubber, which has a plurality of funnel-like through-holes 202 formed by etching.
- a metal layer 204 is formed on an inner wall and around each upper and lower opening of each through-hole 202 .
- Each metal layer 204 is insulated from one another.
- a polyurethane layer 203 is formed by coating between the metal layer 204 and the inner wall of each through-hole 202 so as to maintain the as-deposited physical and chemical properties of the metal layers.
- the manufacturing method for coating the metal layer 204 can be vacuum metallization, chemical plating, electrical plating, physical vapor deposition or sputtering.
- FIG. 1B illustrates a cross-sectional view of an LGA connector according to another preferred embodiment of this invention:
- the LGA connector includes an elastomeric body 200 made of rubber, which has a plurality of funnel-like through holes 202 formed by etching.
- a metal layer 204 is formed on an inner wall and around each upper and lower opening of each through-hole 202 .
- Each metal layer 204 is insulated from one another.
- a bump 206 of elastomeric material is formed around each through-hole 202 so as to increase contact effect.
- a clamp 210 should be designed on a printed circuit board 106 so as to secure an LGA package 100 and the LGA connector together.
- the manufacturing method for coating the metal layer 204 can be vacuum metallization, chemical plating, electrical plating, physical vapor deposition or sputtering.
- This LGA connector could be employed to interconnect two printed circuit boards with LGA-type electrodes as well.
- FIG. 2 illustrates a top cross-sectional view of an LGA connector's elastomeric body according to one preferred embodiment of this invention.
- FIG. 2 is taken along the line A-A in FIG. 1A and illustrates an elastomeric body 200 made of rubber, which has a plurality of through-holes 202 coated by metal layers 204 .
- FIG. 3 illustrates a cross-sectional view of an LGA connector according to yet another preferred embodiment of this invention.
- this preferred embodiment discloses a triple-layered elastomeric body to resolve this issue.
- An upper elastomeric layer 200 a made of rubber exists, which has a plurality of funnel-like through-holes 202 a formed by etching.
- a metal layer 204 a is formed on an inner wall and around each upper and lower opening of each through-hole 202 a .
- Each metal layer 204 a is insulated from one another.
- a lower elastomeric layer 200 c made of rubber exists, which has a plurality of funnel-like through-holes 202 c formed by etching.
- a metal layer 204 c is formed on an inner wall and around each upper and lower opening of each through-hole 202 c .
- An interconnection elastomeric layer 200 b made of rubber exists, which has a plurality of through-holes 202 b formed by etching.
- a metal layer 204 b is formed on an inner wall and around each upper and lower opening of each through-hole 202 b so as to interconnect the metal layer 204 a and 204 c .
- the LGA connector in this preferred embodiment could interconnect an LGA package and a printed circuit board even when corresponding contact electrodes are mismatched in position.
- This LGA connector could be employed to interconnect two printed circuit boards with LGA-type electrodes as well.
- FIG. 4 illustrates a cross-sectional view of an LGA connector under upper and lower stress according to one preferred embodiment of this invention.
- the LGA connector equipped with an elastomeric body 200 and funnel-like through-holes 202 can accommodate the thermal mismatch and achieve a desired level of durability.
- pressure, under upper stress 208 a and lower stress 208 b can be absorbed by redirecting the stress to shrink the through-hole diameters.
- metal layers are more flexible than metal fillers, such that the electrical connection is more reliable.
- the disclosed LGA connector equipped with an elastomeric body and funnel-like through-holes can provide a reliable electrical connection.
- the through-holes have a funnel-like design, pressure from above and below can be absorbed by shrinking the through-hole diameters.
- metal layers are more flexible than metal fillers, such that the electrical connection is more reliable.
Abstract
An LGA connector is used to interconnect an LGA package and a printed circuit board. The LGA connector includes an elastomeric body with a plurality of through-holes. Metal films are formed on inner walls of through-holes and splay out around the mouths of their upper and lower openings. The metal films are formed by vacuum metallization, sputtering, chemical plating, electrical plating or PVD. The through-holes have a funnel-like shape to absorb external stresses and redirect the stress to shrink the through-hole diameters. Moreover, the metal films' elastic deformation is larger than conventional metal conductive fillers so as to improve reliability.
Description
- 1. Field of Invention
- The present invention relates to a flexible land grid array connector. More particularly, the present invention relates to a flexible connector between a land grid array connector and a printed circuit board.
- 2. Description of Related Art
- Integrated circuits are typically housed within a package, which is designed to protect the circuit from damage, provide adequate heat dissipation during operation, and provide electrical connection between the integrated circuits and the leads of a printed circuit board. Several conventional package types, such as land grid array (LGA), pin grid array (PGA), ball grid array (BGA) and column grid array (CGA), are designed to provide the above functions.
- The current trend for connector design in the computer field is to provide both high-density and high-reliability connections between various major circuit devices of a computer. High reliability for such connections is essential due to potential end product failure. As both module size and distance from which solder connections are located to the center of the module (i.e., the distance from neutral point, hereafter DNP) continue to increase, even CGA solder connections can become unreliable, especially due to thermal fatigue. These same concerns about broken interconnections also apply to PGA applications when the DNP is too large. Therefore, what is needed is an interconnection, which is relatively flexible and capable of accommodating the thermal mismatch over an expected temperature range that can closely match the electrical performance and density of a BGA or CGA array.
- One solution is to use an LGA connector. An array of interconnection elements, known as an interposer, is placed between two arrays to be connected, and provides the electrical connection between the contact pins or pads. Since the individual contact members of an interposer can be made resilient, they can accommodate a CTE (coefficient of thermal expansion) mismatch between the module and system board.
- An LGA package is an integrated circuit package having a plurality of planar metallized areas, called lands, for interconnection between the leads of the integrated circuit and a printed circuit board. An LGA can be mounted to a printed circuit board with connectors, which have been developed to maintain a solderless connection between an integrated circuit package and a printed circuit board. As the number of lands is increased, the pitch between contacts decreases and manufacturing problems consequently increase.
- For example, the manufacturing method of placing individual wires into tightly packed through-holes requires tremendous technological developments. Another example is a metallized polymer interconnect (MPI) connector. The MPI connector includes a siloxane core with conductive fillers that is positioned between the LGA module and the substrate. However, extreme stress relaxation rates are needed in order to achieve a desired level of durability.
- It is therefore an objective of the present invention to provide a flexible LGA connector, so as to provide reliable electrical connection and enhance its durability.
- In accordance with the foregoing and other objectives of the present invention, an LGA connector is used to interconnect an LGA package and a printed circuit board. The LGA connector includes an elastomeric body with a plurality of through-holes. Metal films are formed on inner walls of the through-holes and splay out around the mouths of their upper and lower openings. The metal films are formed by vacuum metallization, sputtering, chemical plating, electrical plating or PVD (physical vapor deposition). The through-holes have a funnel-like shape to absorb external stresses by redirecting the stress to shrink the diameters of the through-holes. Moreover, the metal films' elastic deformation is larger than conventional metal conductive fillers so as to improve reliability.
- According to another preferred embodiment, a triple-layered elastomeric body is provided when corresponding contact electrodes of an LGA package and a printed circuit board are mismatched in position. An upper elastomeric layer and a lower elastomeric layer made of rubber exist, which have a plurality of funnel-like through-holes formed by etching. A metal layer is formed on an inner wall and around each upper and lower opening of each through-hole of each layer. An interconnection elastomeric layer made of rubber exists, which has a plurality of funnel-like through-holes formed by etching. A metal layer is formed on an inner wall and around each upper and lower opening of each through-hole so as to interconnect the metal layer of the upper and lower elastomeric layer. Thus, the LGA connector in this preferred embodiment can interconnect an LGA package and a printed circuit board even when corresponding contact electrodes are mismatched in position.
- It is to be understood that both the foregoing general description and the following detailed description are by examples and are intended to provide further explanation of the invention as claimed.
- The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,
-
FIG. 1A illustrates a cross-sectional view of an LGA connector according to one preferred embodiment of this invention; -
FIG. 1B illustrates a cross-sectional view of an LGA connector according to another preferred embodiment of this invention; -
FIG. 2 illustrates a top cross-sectional view of an LGA connector's elastomeric body according to one preferred embodiment of this invention; -
FIG. 3 illustrates a cross-sectional view of an LGA connector according to yet another preferred embodiment of this invention; and -
FIG. 4 illustrates a cross-sectional view of an LGA connector under upper and lower stress according to one preferred embodiment of this invention. - Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
- In order to overcome the shortcomings of the prior art, the present invention provides an LGA connector for solderless connection between an LGA package and a printed circuit board. The LGA connector is an elastomeric body having a plurality of through-holes. There is a metal layer on an inner wall and around each upper and lower opening of each through-hole so as to interconnect an LGA package and a printed circuit board.
-
FIG. 1A illustrates a cross-sectional view of an LGA connector according to one preferred embodiment of this invention. The LGA connector includes anelastomeric body 200 made of rubber, which has a plurality of funnel-like through-holes 202 formed by etching. Ametal layer 204 is formed on an inner wall and around each upper and lower opening of each through-hole 202. Eachmetal layer 204 is insulated from one another. Apolyurethane layer 203 is formed by coating between themetal layer 204 and the inner wall of each through-hole 202 so as to maintain the as-deposited physical and chemical properties of the metal layers. The manufacturing method for coating themetal layer 204 can be vacuum metallization, chemical plating, electrical plating, physical vapor deposition or sputtering. -
FIG. 1B illustrates a cross-sectional view of an LGA connector according to another preferred embodiment of this invention: The LGA connector includes anelastomeric body 200 made of rubber, which has a plurality of funnel-like throughholes 202 formed by etching. Ametal layer 204 is formed on an inner wall and around each upper and lower opening of each through-hole 202. Eachmetal layer 204 is insulated from one another. A bump 206 of elastomeric material is formed around each through-hole 202 so as to increase contact effect. In practice, aclamp 210 should be designed on a printedcircuit board 106 so as to secure anLGA package 100 and the LGA connector together. The manufacturing method for coating themetal layer 204 can be vacuum metallization, chemical plating, electrical plating, physical vapor deposition or sputtering. This LGA connector could be employed to interconnect two printed circuit boards with LGA-type electrodes as well. -
FIG. 2 illustrates a top cross-sectional view of an LGA connector's elastomeric body according to one preferred embodiment of this invention.FIG. 2 is taken along the line A-A inFIG. 1A and illustrates anelastomeric body 200 made of rubber, which has a plurality of through-holes 202 coated bymetal layers 204. -
FIG. 3 illustrates a cross-sectional view of an LGA connector according to yet another preferred embodiment of this invention. When correspondingcontact electrodes contact electrode 101 a mismatches itscorresponding contact electrode 105 a such that they cannot be connected by the LGA connector illustrated inFIGS. 1A and 1B ), this preferred embodiment discloses a triple-layered elastomeric body to resolve this issue. An upperelastomeric layer 200 a made of rubber exists, which has a plurality of funnel-like through-holes 202 a formed by etching. Ametal layer 204 a is formed on an inner wall and around each upper and lower opening of each through-hole 202 a. Eachmetal layer 204 a is insulated from one another. A lowerelastomeric layer 200 c made of rubber exists, which has a plurality of funnel-like through-holes 202 c formed by etching. A metal layer 204 c is formed on an inner wall and around each upper and lower opening of each through-hole 202 c. Aninterconnection elastomeric layer 200 b made of rubber exists, which has a plurality of through-holes 202 b formed by etching. Ametal layer 204 b is formed on an inner wall and around each upper and lower opening of each through-hole 202 b so as to interconnect themetal layer 204 a and 204 c. Thus, the LGA connector in this preferred embodiment could interconnect an LGA package and a printed circuit board even when corresponding contact electrodes are mismatched in position. This LGA connector could be employed to interconnect two printed circuit boards with LGA-type electrodes as well. -
FIG. 4 illustrates a cross-sectional view of an LGA connector under upper and lower stress according to one preferred embodiment of this invention. The LGA connector equipped with anelastomeric body 200 and funnel-like through-holes 202 can accommodate the thermal mismatch and achieve a desired level of durability. When the through-holes have a funnel-like design, pressure, underupper stress 208 a andlower stress 208 b, can be absorbed by redirecting the stress to shrink the through-hole diameters. Moreover, metal layers are more flexible than metal fillers, such that the electrical connection is more reliable. - According to the preferred embodiments above, the disclosed LGA connector equipped with an elastomeric body and funnel-like through-holes can provide a reliable electrical connection. When the through-holes have a funnel-like design, pressure from above and below can be absorbed by shrinking the through-hole diameters. Moreover, metal layers are more flexible than metal fillers, such that the electrical connection is more reliable.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims (12)
1. An LGA connector for interconnection between an LGA packaged integrated circuit and a printed circuit board, said LGA connector comprising:
an elastomeric body, having an upper major surface, and a lower major surface opposed to said upper major surface;
a plurality of tubular metallic film conductors, each connecting an upper opening on said upper major surface to an opposed lower opening on said lower major surface, each of said plurality of tubular metallic film conductors being formed by metallic deposition around said upper opening and said opposed lower opening and onto a surface of an inner wall of a through-hole connecting said upper opening and said opposed lower opening, each of said plurality of tubular metallic film conductors being insulated from one another; and
each of said plurality of tubular metallic film conductors having an axial cross-section which tapers inwardly from said upper opening to form a funnel-like shape with a central through-hole; and
wherein each of said plurality of tubular metallic film conductors compress radially inward in reaction to external stresses exerted against said upper major surface and said lower major surface;
whereby a portion around said upper opening of each of said plurality of metallic film conductors connects to the LGA packaged integrated circuit, and a portion around said opposed lower opening of each of said plurality of metallic film conductors connects to the printed circuit board.
2. (canceled)
3. The LGA connector of claim 1 , wherein said plurality of tubular metallic film conductors are formed by vacuum metallization, chemical plating, physical vapor deposition, or sputtering.
4. (canceled)
5. An LGA connector for interconnection between an LGA packaged integrated circuit and a printed circuit board, said LGA connector comprising:
an elastomeric body, having an upper major surface, and a lower major surface opposed to said upper major surface;
a plurality of tubular metallic film conductors, each connecting an upper opening on said upper major surface to an opposed lower opening on said lower major surface, each of said plurality of tubular metallic film conductors being formed by metallic deposition around said upper opening and said opposed lower opening and onto a surface of an inner wall of a through-hole connecting said upper opening and said opposed lower opening, and each of said plurality of tubular metallic film conductors being insulated from one another; and
a polyurethane layer interposed between each of said plurality of metallic film conductors and the corresponding surface of said elastomeric body;
each of said plurality of tubular metallic film conductors having an axial cross-section which tapers inwardly from said upper opening and said opposed lower opening to form a funnel-like shape with a central through-hole; and
wherein each of said plurality of tubular metallic film conductors compress radially inward in reaction to external stresses exerted against said upper major surface and said lower major surface;
whereby a portion around said upper opening of each of said plurality of metallic film conductors connects to the LGA packaged integrated circuit, and a portion around said opposed lower opening of each of said plurality of metallic film conductors connects to the printed circuit board.
6. (canceled)
7. The LGA connector of claim 5 , wherein said plurality of tubular metallic film conductors are formed by vacuum metallization, chemical plating, physical vapor deposition, or sputtering.
8. (canceled)
9. (canceled)
10. (canceled)
11. (canceled)
12. (canceled)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/969,369 US7021941B1 (en) | 2004-10-19 | 2004-10-19 | Flexible land grid array connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/969,369 US7021941B1 (en) | 2004-10-19 | 2004-10-19 | Flexible land grid array connector |
Publications (2)
Publication Number | Publication Date |
---|---|
US7021941B1 US7021941B1 (en) | 2006-04-04 |
US20060084288A1 true US20060084288A1 (en) | 2006-04-20 |
Family
ID=36101865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/969,369 Expired - Fee Related US7021941B1 (en) | 2004-10-19 | 2004-10-19 | Flexible land grid array connector |
Country Status (1)
Country | Link |
---|---|
US (1) | US7021941B1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080094085A1 (en) * | 2004-12-16 | 2008-04-24 | Hougham Gareth G | Metalized Elastomeric Probe Structure |
US20090053908A1 (en) * | 2004-12-16 | 2009-02-26 | International Business Machines Corporation | Metalized Elastomeric Electrical Contacts |
US20090300914A1 (en) * | 2007-04-30 | 2009-12-10 | International Business Machines Corporation | Metallized Elastomeric Electrical Contacts |
US11616312B2 (en) | 2021-02-24 | 2023-03-28 | Hewlett Packard Enterprise Development Lp | Electrical socket having a plurality of wire-terminated contacts |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7758351B2 (en) * | 2003-04-11 | 2010-07-20 | Neoconix, Inc. | Method and system for batch manufacturing of spring elements |
US7597561B2 (en) * | 2003-04-11 | 2009-10-06 | Neoconix, Inc. | Method and system for batch forming spring elements in three dimensions |
US7114961B2 (en) * | 2003-04-11 | 2006-10-03 | Neoconix, Inc. | Electrical connector on a flexible carrier |
US7628617B2 (en) * | 2003-06-11 | 2009-12-08 | Neoconix, Inc. | Structure and process for a contact grid array formed in a circuitized substrate |
US7056131B1 (en) * | 2003-04-11 | 2006-06-06 | Neoconix, Inc. | Contact grid array system |
US20070020960A1 (en) * | 2003-04-11 | 2007-01-25 | Williams John D | Contact grid array system |
US7244125B2 (en) * | 2003-12-08 | 2007-07-17 | Neoconix, Inc. | Connector for making electrical contact at semiconductor scales |
US8584353B2 (en) * | 2003-04-11 | 2013-11-19 | Neoconix, Inc. | Method for fabricating a contact grid array |
US20050227510A1 (en) * | 2004-04-09 | 2005-10-13 | Brown Dirk D | Small array contact with precision working range |
US7383632B2 (en) * | 2004-03-19 | 2008-06-10 | Neoconix, Inc. | Method for fabricating a connector |
US20050205988A1 (en) * | 2004-03-19 | 2005-09-22 | Epic Technology Inc. | Die package with higher useable die contact pad area |
US7347698B2 (en) * | 2004-03-19 | 2008-03-25 | Neoconix, Inc. | Deep drawn electrical contacts and method for making |
US7354276B2 (en) * | 2004-07-20 | 2008-04-08 | Neoconix, Inc. | Interposer with compliant pins |
US20070050738A1 (en) * | 2005-08-31 | 2007-03-01 | Dittmann Larry E | Customer designed interposer |
US7357644B2 (en) * | 2005-12-12 | 2008-04-15 | Neoconix, Inc. | Connector having staggered contact architecture for enhanced working range |
US20070238332A1 (en) * | 2006-04-07 | 2007-10-11 | Lotes Co., Ltd. | Electrical connector and its manufacturing method |
WO2007124113A2 (en) * | 2006-04-21 | 2007-11-01 | Neoconix, Inc. | Clamping a flat flex cable and spring contacts to a circuit board |
US7785111B2 (en) * | 2007-08-24 | 2010-08-31 | Tyco Electronics Corporation | Electrical connector with elastomeric element |
US8215966B2 (en) * | 2010-04-20 | 2012-07-10 | Tyco Electronics Corporation | Interposer connector assembly |
US8641428B2 (en) | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
US9680273B2 (en) | 2013-03-15 | 2017-06-13 | Neoconix, Inc | Electrical connector with electrical contacts protected by a layer of compressible material and method of making it |
US20150257281A1 (en) * | 2014-03-10 | 2015-09-10 | Marvell World Trade Ltd. | Method for forming a via structure using a double-side laser process |
RU2671543C1 (en) * | 2017-06-26 | 2018-11-01 | Российская Федерация, от имени которой выступает Министерство обороны Российской Федерации | Method of creating a bilateral topological pattern in metallization on substrates with through metallized micro-holes |
RU2659726C1 (en) * | 2017-10-05 | 2018-07-03 | Российская Федерация, от имени которой выступает Государственная корпорация по космической деятельности "РОСКОСМОС" | Micromodule |
CN113270743A (en) * | 2020-02-17 | 2021-08-17 | 山一电机株式会社 | LGA socket |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5386627A (en) * | 1992-09-29 | 1995-02-07 | International Business Machines Corporation | Method of fabricating a multi-layer integrated circuit chip interposer |
US6204065B1 (en) * | 1997-03-27 | 2001-03-20 | Ngk Insulators, Ltd. | Conduction assist member and manufacturing method of the same |
US6239386B1 (en) * | 1994-07-19 | 2001-05-29 | Tessera, Inc. | Electrical connections with deformable contacts |
US6814584B2 (en) * | 2001-05-11 | 2004-11-09 | Molex Incorporated | Elastomeric electrical connector |
-
2004
- 2004-10-19 US US10/969,369 patent/US7021941B1/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5386627A (en) * | 1992-09-29 | 1995-02-07 | International Business Machines Corporation | Method of fabricating a multi-layer integrated circuit chip interposer |
US6239386B1 (en) * | 1994-07-19 | 2001-05-29 | Tessera, Inc. | Electrical connections with deformable contacts |
US6204065B1 (en) * | 1997-03-27 | 2001-03-20 | Ngk Insulators, Ltd. | Conduction assist member and manufacturing method of the same |
US6814584B2 (en) * | 2001-05-11 | 2004-11-09 | Molex Incorporated | Elastomeric electrical connector |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080094085A1 (en) * | 2004-12-16 | 2008-04-24 | Hougham Gareth G | Metalized Elastomeric Probe Structure |
US20090053908A1 (en) * | 2004-12-16 | 2009-02-26 | International Business Machines Corporation | Metalized Elastomeric Electrical Contacts |
US7771208B2 (en) * | 2004-12-16 | 2010-08-10 | International Business Machines Corporation | Metalized elastomeric electrical contacts |
US8054095B2 (en) | 2004-12-16 | 2011-11-08 | International Business Machines Corporation | Metalized elastomeric probe structure |
US20090300914A1 (en) * | 2007-04-30 | 2009-12-10 | International Business Machines Corporation | Metallized Elastomeric Electrical Contacts |
US8832936B2 (en) | 2007-04-30 | 2014-09-16 | International Business Machines Corporation | Method of forming metallized elastomeric electrical contacts |
US11616312B2 (en) | 2021-02-24 | 2023-03-28 | Hewlett Packard Enterprise Development Lp | Electrical socket having a plurality of wire-terminated contacts |
Also Published As
Publication number | Publication date |
---|---|
US7021941B1 (en) | 2006-04-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7021941B1 (en) | Flexible land grid array connector | |
US6841882B2 (en) | Elastomer interposer for grid array packages and method of manufacturing the same | |
US6663399B2 (en) | Surface mount attachable land grid array connector and method of forming same | |
US6286208B1 (en) | Interconnector with contact pads having enhanced durability | |
US6814584B2 (en) | Elastomeric electrical connector | |
US5759047A (en) | Flexible circuitized interposer with apertured member and method for making same | |
US7462939B2 (en) | Interposer for compliant interfacial coupling | |
US20040183211A1 (en) | Chip carrier with optimized circuitization pattern | |
JP2006518542A (en) | Fabrication of land grid arrays using elastomer cores and conductive metal shells or meshes | |
US7448883B2 (en) | Connector with metalized coated polymer contact | |
US6540525B1 (en) | High I/O stacked modules for integrated circuits | |
TW554574B (en) | A shielded carrier with components for land grid array connectors | |
US6927982B2 (en) | Method of connecting a device to a support, and pad for establishing a connection between a device and a support | |
US6256207B1 (en) | Chip-sized semiconductor device and process for making same | |
JP4988132B2 (en) | High reliability interposer for low cost and high reliability applications | |
US6954984B2 (en) | Land grid array structure | |
JP4210049B2 (en) | Spiral contact | |
US20070238324A1 (en) | Electrical connector | |
US7438557B1 (en) | Stacked multiple electronic component interconnect structure | |
US7363688B2 (en) | Land grid array structures and methods for engineering change | |
US6595784B2 (en) | Interposer member having apertures for relieving stress and increasing contact compliancy | |
US6434817B1 (en) | Method for joining an integrated circuit | |
US20020093089A1 (en) | Compliant mounting interface for electronic devices | |
US6809935B1 (en) | Thermally compliant PCB substrate for the application of chip scale packages | |
EP1473977A2 (en) | Electronic package with strengthened conductive pad |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SPEED TECH CORP., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, LI-SEN;HSU, CHIEN-YU;CHUANG, PING;REEL/FRAME:016041/0256 Effective date: 20041012 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20100404 |