|Número de publicación||US20060090882 A1|
|Tipo de publicación||Solicitud|
|Número de solicitud||US 10/977,860|
|Fecha de publicación||4 May 2006|
|Fecha de presentación||28 Oct 2004|
|Fecha de prioridad||28 Oct 2004|
|Número de publicación||10977860, 977860, US 2006/0090882 A1, US 2006/090882 A1, US 20060090882 A1, US 20060090882A1, US 2006090882 A1, US 2006090882A1, US-A1-20060090882, US-A1-2006090882, US2006/0090882A1, US2006/090882A1, US20060090882 A1, US20060090882A1, US2006090882 A1, US2006090882A1|
|Cesionario original||Ioan Sauciuc|
|Exportar cita||BiBTeX, EndNote, RefMan|
|Citada por (10), Clasificaciones (15), Eventos legales (1)|
|Enlaces externos: USPTO, Cesión de USPTO, Espacenet|
1. Field of the Invention
Embodiments of the present invention relate to heat dissipation devices. In particular, an embodiment of the present invention relates to a two-phase (liquid/vapor), forced convection heat dissipation device that disperses a working fluid, which results in the prevention of bubble formation and/or creation of a thin film of the working fluid on an evaporation region for improved evaporation thereof.
2. State of the Art
The microelectronic device industry continues to see tremendous advances in technologies that permit increased circuit density and complexity, and equally dramatic decreases in package sizes. Such high density and high functionality in these microelectronic devices has resulted in an increase in the density of the power consumption by the integrated circuit components in the microelectronic device, which, in turn, increases the average junction temperature of the microelectronic device. If the temperature of the microelectronic device becomes too high, the integrated circuits within the microelectronic device may be damaged or destroyed.
Various apparatus and techniques have been used and are presently being used for removing heat from microelectronic devices. One known method of removing heat from a microelectronic device is the use of a heat pipe 300, as shown in
However, with the ever increasing temperature, simple heat pipes are not capable of removing sufficient heat from microelectronic device, as current heat pipe designs suffer from low critical heat flux and high evaporator resistance, as will be understood to those skilled in the art. Improvements to heat pipes, such as forced convection with pumps and/or microchannels, can be implemented. However, these improvements have not been entirely successful. Pumps are not sufficiently reliable and microchannels can develop liquid slugs in the vapor portion of the microchannel which blocks the vapor flow to the condensation end of microchannel causing partial or total dry-out condition resulting in heat transfer failure. Furthermore, using more complex cooling methods, such cryogenic cooling or refrigeration cooling are too expensive for use in high volume commercial electronic devices.
Therefore, it would be advantageous to develop heat dissipation device designs having an improved critical heat flux and lower evaporator resistance, while still having using simple components.
While the specification concludes with claims particularly pointing out and distinctly claiming that which is regarded as the present invention, the advantages of this invention can be more readily ascertained from the following description of the invention when read in conjunction with the accompanying drawings to which:
In the following detailed description, reference is made to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It is to be understood that the various embodiments of the invention, although different, are not necessarily mutually exclusive. For example, a particular feature, structure, or characteristic described herein, in connection with one embodiment, may be implemented within other embodiments without departing from the spirit and scope of the invention. In addition, it is to be understood that the location or arrangement of individual elements within each disclosed embodiment may be modified without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, appropriately interpreted, along with the full range of equivalents to which the claims are entitled. In the drawings, like numerals refer to the same or similar functionality throughout the several views.
An embodiment of the present invention comprises a two-phase (liquid/vapor) heat dissipation device to remove heat from a heat generating device, wherein the heat dissipation device has an internal dispersion device (e.g., a rotating device, such as a fan) and is adapted to decrease boiling resistance and increase the critical heat flux.
A working fluid 112 within the sealed housing 102, when in a liquid phase, is a dispersed by the dispersion device 108 as a liquid spray toward a vaporization region 114, within the sealed housing 102, proximate the heat generating device 106. The working fluid 112 liquid spray is dispersed substantially uniformly to form a thin layer on the vaporization region 114. Thus, the vaporization region should be substantially continuously wetted with the working fluid 112. Furthermore, the dispersion device 108 “flattens” substantially all working fluid bubbles before they can form. If such working fluid bubbles form, they impede the working fluid from wetting the vaporization region 114, which greatly reduces the efficiency of the heat dissipation device 100.
The working fluid 112 may include, but is not limited to water, Freon, acetone, alcohol, and the like. The heat from the heat generating device 106 is transferred through the sealed housing 102 by conductive heat transfer. This heat vaporizes the working fluid 112 liquid film into a vapor phase within the vaporization region 114. The vapor phase of the working fluid 112 substantially follows along a path illustrated by arrows 116 in
In a heat pipe or vapor chamber configuration of the heat dissipation device 100, the liquid phase of the working fluid 112 is absorbed by at least one wick structure 124, which can abut an interior surface 120 of the sealed housing 102. The wick structure 124 may be any appropriate material including, but not limited to, sintered porous structures (such as porous copper structures), gauzes (such as bronze mesh), wires, and the like. The liquid phase of the working fluid 112 is then transported from the condensation region 122 by the wick structure 124 in the direction illustrated by arrows 126 to an area proximate the dispersion device 108. The liquid phase of the working fluid 112 returns to the dispersion device 108, which disperses the working fluid 112 as a liquid spray toward the heat generating device 106 perpetuating the evaporation/condensation cycle described.
In an embodiment of the present invention, the heat dissipation device 100 is oriented such that the liquid phase working fluid drips onto the dispersion device 108 (shown as arrows 118), such as shown in
In an embodiment of the present invention, a heat sink (such as a plurality of high surface area, thermally conductive projections 128) may extend from a second external portion 132 of the sealed housing 102 proximate the condensation region 122. Thus, the heat absorbed by the sealed housing 102 proximate the condensation region 122 is conductively transferred to the conductive projections 128. The high surface area thermally conductive projections 128 allow heat to be convectively dissipated from the projections 128 into the air surrounding the heat dissipation device 100 (referring back to
In an embodiment of the present invention, a divider plate 134 may positioned within the sealed housing, which substantially separates the vapor phase of the working fluid 112 from the liquid phase of the working fluid 112, thereby essentially dividing the sealed housing 102 into a vapor path chamber 136 and a liquid path chamber 138. The divider plate 134 assists the vapor phase of the working fluid 112 move toward the condensation region 122 and assists the liquid phase of the working fluid 112 move toward the dispersion device 108. The divider plate 134, in one embodiment, separates an inlet side 142 of the dispersion device 108 from an outlet side 144 of the dispersion device 108 in order to prevent the vapor phase of the working fluid 112 circulating through the dispersion device 108. In one embodiment, the divider plate 134 can substantially abut the wick structure 124, so that the pressure differential created by the dispersion device 108 assists in pulling the liquid phase of the working fluid 112 through the wick structure 124 toward the dispersion device 108.
The dispersion device 108 may be a water-proof or “liquid”-proof, flat rotary fan with no hub or at least a very small hub and separates at least a portion of the vapor path chamber 136 from a portion of the liquid path chamber 138. A flat rotary fan has its motor located the fan periphery. The dispersion device 108 may comprise a rotor consisting of two flat washers with a magnet therebetween and a stator comprising a printer circuit board placed in a gap between the washers of the rotor. Power for the dispersion device 108 is delivered from an external source (not shown). As previously discussed, the dispersion device 108 distributes the working fluid 112 as a substantially uniform film on the vaporization region 114. A substantially uniform spray distribution of the working fluid 112 assists in having the vaporization region 114 substantially “wet” during operation, suppression of bubble formation, and having only a thin liquid film collecting in the vaporization region 114.
A thermally insulation material 146 may be placed abutting at least a portion of an outside surface 148 of the sealed housing 102. The thermally insulation material 146 assists in preventing the condensation of the vapor phase of the working fluid 112 on the sealed housing 102 walls within the vapor path chamber 136 and from vaporizing within the liquid path chamber 138 (from potential external heat).
Although the dispersion device 108 is described as “blowing” the liquid phase of the working fluid 112 toward the vaporization region 114, it has been found that the dispersion device 108 can spin in the opposite direction and still be effective, as shown in
It is, of course, understood that although the present detailed description discusses the heat generating device 106 in terms of a microelectronic device, it may be anything which generates heat. Furthermore, although the heat dissipation devices 100, 150, 160, and 170 are shown with a specific configuration in
The microelectronic device assemblies formed by the present invention may also be used in a computer system 210, as shown in
Having thus described in detail embodiments of the present invention, it is understood that the invention defined by the appended claims is not to be limited by particular details set forth in the above description, as many apparent variations thereof are possible without departing from the spirit or scope thereof.
|Patente citante||Fecha de presentación||Fecha de publicación||Solicitante||Título|
|US7277285 *||4 Abr 2005||2 Oct 2007||Delta Electronics, Inc.||Heat dissipation module|
|US7755186||31 Dic 2007||13 Jul 2010||Intel Corporation||Cooling solutions for die-down integrated circuit packages|
|US20050225943 *||4 Abr 2005||13 Oct 2005||Delta Electronics, Inc.||Heat dissipation module|
|US20110017431 *||8 Mar 2010||27 Ene 2011||Y.C. Lee||Flexible thermal ground plane and manufacturing the same|
|US20110041892 *||21 Ago 2009||24 Feb 2011||Alexander Levin||Heat sink system for large-size photovoltaic receiver|
|US20120211051 *||23 Ago 2012||Alexander Levin||Heat sink systems for large-size photovoltaic receiver|
|US20130056178 *||17 May 2011||7 Mar 2013||Nec Corporation||Ebullient cooling device|
|US20140202665 *||22 Ene 2013||24 Jul 2014||Palo Alto Research Center Incorporated||Integrated thin film evaporation thermal spreader and planar heat pipe heat sink|
|WO2010105125A2 *||12 Mar 2010||16 Sep 2010||Molex Incorporated||Cooling device and electronic device|
|WO2011158008A2 *||20 Jun 2011||22 Dic 2011||John Philip Roger Hammerbeck||A heat transfer device|
|Clasificación de EE.UU.||165/104.26, 257/E23.088|
|Clasificación cooperativa||F28F13/125, F28D15/04, F28D2015/0291, F28D15/06, F28D15/0233, H01L2924/0002, H01L23/427|
|Clasificación europea||F28D15/04, F28D15/02E, H01L23/427, F28D15/06, F28F13/12B|
|28 Oct 2004||AS||Assignment|
Owner name: INTEL CORPORATION, CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SAUCIUC, IOAN;REEL/FRAME:015950/0863
Effective date: 20041028