US20060091039A1 - Wafer storage box - Google Patents

Wafer storage box Download PDF

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Publication number
US20060091039A1
US20060091039A1 US11/010,617 US1061704A US2006091039A1 US 20060091039 A1 US20060091039 A1 US 20060091039A1 US 1061704 A US1061704 A US 1061704A US 2006091039 A1 US2006091039 A1 US 2006091039A1
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US
United States
Prior art keywords
storage box
wafer
main body
disposed
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/010,617
Inventor
Yu-Chuan Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Power Geode Tech Co Ltd
Original Assignee
Power Geode Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Power Geode Tech Co Ltd filed Critical Power Geode Tech Co Ltd
Assigned to POWER GEODE TECHNOLOGY CO. LTD. reassignment POWER GEODE TECHNOLOGY CO. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIU, YU-CHUAN
Publication of US20060091039A1 publication Critical patent/US20060091039A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions

Definitions

  • the present invention relates to a wafer storage box, and more particularly to a wafer storage box for preventing the wafer from being damaged.
  • the wafer storage box is used for storing the wafers.
  • FIG. 1 is a schematic diagram of the wafer storage box according to the prior art.
  • the wafer storage box 11 is a plastic box and used for storing a plurality of wafers 12 .
  • the amount of wafers 12 stored is dependent on the capacity of the wafer storage box 11 .
  • the wafers 12 are spaced out from each other merely with a cotton pad 13 . In this way, the quality of the wafers 12 will be affected due to the electrostatic force induced from the friction between the wafer surface and the cotton pad 13 .
  • the wafers 12 will be easily damaged because of incautious collision in conveying. Insidiously, many wafers 12 are wasted, and thus the fabrication cost is enhanced.
  • a wafer storage box is provided.
  • the wafer storage box can prevent the wafer from being damaged by the external collision force during the conveying process. Therefore, the wafer damage can be efficiently reduced and the fabrication cost can be saved.
  • a wafer storage box is provided.
  • the wafer storage box can be applied to all of the semiconductor fabrication processes. That is, both the half-finished wafer and the finished one can be stored in the wafer storage box of the present invention.
  • a storage box for storing a wafer.
  • the storage box includes a main body having a receiving portion having a bottom surface, a plurality of protruding portions formed on the bottom surface for strengthening the main body, a plurality of anti-shock members disposed on the bottom surface, and a cover connected to the main body.
  • the wafer has a frame disposed at a periphery thereof for fixing the wafer.
  • the wafer has a protective membrane adhered to an upper surface thereof.
  • the protective membrane is an adhesive membrane.
  • the wafer is wrapped in an anti-electrostatic bag, and then placed on the protruding portions and the anti-shock members.
  • the main body has a plurality of openings for passing therethrough a user's fingers and for reducing the weight of the storage box.
  • each opening is disposed at a corner of the main body.
  • the main body further has at least one recess.
  • the main body is made of the transparent material.
  • the protruding portions are ribs.
  • the anti-shock members are shock-absorbing pads.
  • the cover is made of the transparent material.
  • the storage box further includes a bar code disposed on the cover for identifying the wafer.
  • the storage box further includes a chip disposed on the cover for identifying the wafer.
  • the storage box further includes a magnetic card disposed on the cover for identifying the wafer.
  • FIG. 1 is a schematic diagram showing the wafer storage box according to the prior art
  • FIG. 2 ( a ) is a schematic diagram showing the wafer storage box according to a preferred embodiment of the present invention.
  • FIGS. 2 ( b ) and 2 ( c ) are diagrams showing different processes for storing the wafer via the wafer storage box shown in FIG. 2 ( a );
  • FIGS. 3 ( a ) to 3 ( c ) are diagrams illustrating various ways of identifying the wafer storage box according to a preferred embodiment of the present invention.
  • FIG. 2 ( a ) shows a schematic diagram of the wafer storage box according to a preferred embodiment of the present invention.
  • the wafer storage box includes a main body 21 and a cover 26 , wherein the cover 26 is connected to the main body 21 .
  • the main body 21 includes a receiving portion 22 having a bottom surface.
  • a plurality of circular ribs 23 are formed on the bottom surface of the receiving portion 22 for strengthening the main body 21 .
  • a plurality of shock-absorbing pads 24 are disposed on the bottom surface of the receiving portion 22 for preventing the wafer from being damaged by the external collision force during the conveying process. Therefore, the wafer damage can be efficiently reduced and the fabrication cost can be saved.
  • the main body 21 further includes two recesses 27 for the user to easily take out the wafer storage box from a storage cabinet for storing wafer storage boxes (not shown).
  • FIGS. 2 ( b ) and 2 ( c ) show different processes for storing the wafer via the wafer storage box shown in FIG. 2 ( a ).
  • a frame 29 has to be disposed at the periphery of the wafer 28 for fixing it.
  • an adhesive membrane 210 is adhered to the upper surface of the wafer 28 .
  • the wafer 28 is wrapped in an anti-electrostatic bag 211 and then placed on the circular ribs 23 and the shock-absorbing pads 24 , as shown in FIG. 2 ( c ).
  • the cover 26 is covered on the main body 21 , and then the wafer 28 can be conveyed.
  • the main body 21 and the cover 26 of the present invention are both made of the transparent material. Hence, the user knows whether the wafer 28 is stored inside the wafer storage box without the need to open the cover 26 . Furthermore, different sizes of wafers (such as 12 or 8 inches) can be stored in the wafer storage box of the present invention, merely by modifying the size of the wafer storage box. Additionally, the wafer storage box of the present invention further includes a bar code 31 disposed on the cover 26 . A scanner (not shown) is used for scanning the bar code 31 so as to identify the wafer 28 , as shown in FIG. 3 ( a ). Certainly, the way of employing the scanner to scan the bar code 31 can be altered.
  • a chip reading device (not shown) can be used for reading the chip 32 disposed on the cover 26 so as to identify the wafer 28 , as shown in FIG. 3 ( b ).
  • a magnetic card reading device (not shown) can be used for reading the magnetic card 33 disposed on the cover 26 so as to identify the wafer 28 , as shown in FIG. 3 ( c ).
  • the wafer storage box of the present invention can prevent the wafer from being damaged by the external collision force during the transportation process. Therefore, the wafer damage can be efficiently reduced and the fabrication cost can be saved. Moreover, the wafer storage box of the present invention can be applied to all of the semiconductor fabrication processes. That is, both the half-finished wafer and the finished one can be stored in the wafer storage box of the present invention. Accordingly, the present invention can effectively solve the problems and drawbacks in the prior art, and thus it fits the demand of the industry and is industrially valuable.

Abstract

A storage box for storing a wafer is provided. The wafer storage box includes a main body having a receiving portion having a bottom surface, a plurality of protruding portions formed on the bottom surface for strengthening the main body, a plurality of anti-shock members disposed on the bottom surface, and a cover connected to the main body.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a wafer storage box, and more particularly to a wafer storage box for preventing the wafer from being damaged.
    • BACKGROUND OF THE INVENTION
  • There are many different processes involved in the fabrication for semiconductors. In the transformation between processes, it is inevitable to store and carry the wafers. At this time, the wafer storage box is used for storing the wafers.
  • Please refer to FIG. 1, which is a schematic diagram of the wafer storage box according to the prior art. The wafer storage box 11 is a plastic box and used for storing a plurality of wafers 12. The amount of wafers 12 stored is dependent on the capacity of the wafer storage box 11. In the wafer storage box 11, the wafers 12 are spaced out from each other merely with a cotton pad 13. In this way, the quality of the wafers 12 will be affected due to the electrostatic force induced from the friction between the wafer surface and the cotton pad 13. Moreover, the wafers 12 will be easily damaged because of incautious collision in conveying. Insidiously, many wafers 12 are wasted, and thus the fabrication cost is enhanced.
  • From the above description, it is known that how to develop a wafer storage box for reducing the wafer damage so as to save the fabrication cost has become a major problem waited to be solved. In order to overcome the drawbacks in the prior art, an improved wafer storage box is provided. The particular design in the present invention not only solves the problems described above, but also is easy to be implemented. Thus, the invention has the utility for the industry.
    • SUMMARY OF THE INVENTION
  • In accordance with one aspect of the present invention, a wafer storage box is provided. The wafer storage box can prevent the wafer from being damaged by the external collision force during the conveying process. Therefore, the wafer damage can be efficiently reduced and the fabrication cost can be saved.
  • In accordance with another aspect of the present invention, a wafer storage box is provided. The wafer storage box can be applied to all of the semiconductor fabrication processes. That is, both the half-finished wafer and the finished one can be stored in the wafer storage box of the present invention.
  • In accordance with a further aspect of the present invention, a storage box for storing a wafer is provided. The storage box includes a main body having a receiving portion having a bottom surface, a plurality of protruding portions formed on the bottom surface for strengthening the main body, a plurality of anti-shock members disposed on the bottom surface, and a cover connected to the main body.
  • Preferably, the wafer has a frame disposed at a periphery thereof for fixing the wafer.
  • Preferably, the wafer has a protective membrane adhered to an upper surface thereof.
  • Preferably, the protective membrane is an adhesive membrane.
  • Preferably, the wafer is wrapped in an anti-electrostatic bag, and then placed on the protruding portions and the anti-shock members.
  • Preferably, the main body has a plurality of openings for passing therethrough a user's fingers and for reducing the weight of the storage box.
  • Preferably, each opening is disposed at a corner of the main body.
  • Preferably, the main body further has at least one recess.
  • Preferably, the main body is made of the transparent material.
  • Preferably, the protruding portions are ribs.
  • Preferably, the anti-shock members are shock-absorbing pads.
  • Preferably, the cover is made of the transparent material.
  • Preferably, the storage box further includes a bar code disposed on the cover for identifying the wafer.
  • Preferably, the storage box further includes a chip disposed on the cover for identifying the wafer.
  • Preferably, the storage box further includes a magnetic card disposed on the cover for identifying the wafer.
  • The above objects and advantages of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed descriptions and accompanying drawings, in which:
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic diagram showing the wafer storage box according to the prior art;
  • FIG. 2(a) is a schematic diagram showing the wafer storage box according to a preferred embodiment of the present invention;
  • FIGS. 2(b) and 2(c) are diagrams showing different processes for storing the wafer via the wafer storage box shown in FIG. 2(a); and
  • FIGS. 3(a) to 3(c) are diagrams illustrating various ways of identifying the wafer storage box according to a preferred embodiment of the present invention.
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • The present invention will now be described more specifically with reference to the following embodiments. It is to be noted that the following descriptions of preferred embodiments of this invention are presented herein for the purposes of illustration and description only; it is not intended to be exhaustive or to be limited to the precise form disclosed.
  • Please refer to FIG. 2(a), which shows a schematic diagram of the wafer storage box according to a preferred embodiment of the present invention. The wafer storage box includes a main body 21 and a cover 26, wherein the cover 26 is connected to the main body 21. The main body 21 includes a receiving portion 22 having a bottom surface. A plurality of circular ribs 23 are formed on the bottom surface of the receiving portion 22 for strengthening the main body 21. Moreover, a plurality of shock-absorbing pads 24 are disposed on the bottom surface of the receiving portion 22 for preventing the wafer from being damaged by the external collision force during the conveying process. Therefore, the wafer damage can be efficiently reduced and the fabrication cost can be saved.
  • Four openings 25 are disposed at four corners of the main body 21 for passing therethrough the user's fingers and for reducing the weight of the wafer storage box. In addition, the main body 21 further includes two recesses 27 for the user to easily take out the wafer storage box from a storage cabinet for storing wafer storage boxes (not shown).
  • Please refer to FIGS. 2(b) and 2(c), which show different processes for storing the wafer via the wafer storage box shown in FIG. 2(a). Before the wafer 28 being placed into the wafer storage box, a frame 29 has to be disposed at the periphery of the wafer 28 for fixing it. Next, an adhesive membrane 210 is adhered to the upper surface of the wafer 28. After that, the wafer 28 is wrapped in an anti-electrostatic bag 211 and then placed on the circular ribs 23 and the shock-absorbing pads 24, as shown in FIG. 2(c). Finally, the cover 26 is covered on the main body 21, and then the wafer 28 can be conveyed.
  • The main body 21 and the cover 26 of the present invention are both made of the transparent material. Hence, the user knows whether the wafer 28 is stored inside the wafer storage box without the need to open the cover 26. Furthermore, different sizes of wafers (such as 12 or 8 inches) can be stored in the wafer storage box of the present invention, merely by modifying the size of the wafer storage box. Additionally, the wafer storage box of the present invention further includes a bar code 31 disposed on the cover 26. A scanner (not shown) is used for scanning the bar code 31 so as to identify the wafer 28, as shown in FIG. 3(a). Certainly, the way of employing the scanner to scan the bar code 31 can be altered. For one example, a chip reading device (not shown) can be used for reading the chip 32 disposed on the cover 26 so as to identify the wafer 28, as shown in FIG. 3(b). For another example, a magnetic card reading device (not shown) can be used for reading the magnetic card 33 disposed on the cover 26 so as to identify the wafer 28, as shown in FIG. 3(c).
  • In conclusion, the wafer storage box of the present invention can prevent the wafer from being damaged by the external collision force during the transportation process. Therefore, the wafer damage can be efficiently reduced and the fabrication cost can be saved. Moreover, the wafer storage box of the present invention can be applied to all of the semiconductor fabrication processes. That is, both the half-finished wafer and the finished one can be stored in the wafer storage box of the present invention. Accordingly, the present invention can effectively solve the problems and drawbacks in the prior art, and thus it fits the demand of the industry and is industrially valuable.
  • While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.

Claims (15)

1. A storage box for storing a wafer, comprising:
a main body having a receiving portion having a bottom surface;
a plurality of protruding portions formed on said bottom surface for strengthening said main body;
a plurality of anti-shock members disposed on said bottom surface; and
a cover connected to said main body.
2. The storage box as claimed in claim 1, wherein said wafer has a frame disposed at a periphery thereof for fixing said wafer.
3. The storage box as claimed in claim 2, wherein said wafer has a protective membrane adhered to an upper surface thereof.
4. The storage box as claimed in claim 3, wherein said protective membrane is an adhesive membrane.
5. The storage box as claimed in claim 4, wherein said wafer is wrapped in an anti-electrostatic bag, and then placed on said protruding portions and said anti-shock members.
6. The storage box as claimed in claim 1, wherein said main body comprises a plurality of openings for passing therethrough a user's fingers and for reducing a weight of said storage box.
7. The storage box as claimed in claim 1, wherein each said opening is disposed at a corner of said main body.
8. The storage box as claimed in claim 1, wherein said main body further comprises at least one recess.
9. The storage box as claimed in claim 1, wherein said main body is made of a transparent material.
10. The storage box as claimed in claim 1, wherein said protruding portions are ribs.
11. The storage box as claimed in claim 1, wherein said anti-shock members are shock-absorbing pads.
12. The storage box as claimed in claim 1, wherein said cover is made of a transparent material.
13. The storage box as claimed in claim 1, further comprising a bar code disposed on said cover for identifying said wafer.
14. The storage box as claimed in claim 1, further comprising a chip disposed on said cover for identifying said wafer.
15. The storage box as claimed in claim 1, further comprising a magnetic card disposed on said cover for identifying said wafer.
US11/010,617 2004-10-28 2004-12-13 Wafer storage box Abandoned US20060091039A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW093132814 2004-10-28
TW093132814A TW200613202A (en) 2004-10-28 2004-10-28 Wafer framework storage box

Publications (1)

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US20060091039A1 true US20060091039A1 (en) 2006-05-04

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JP (1) JP2006128590A (en)
TW (1) TW200613202A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100101635A1 (en) * 2008-10-14 2010-04-29 Christian Senning Verpackungsmaschinen Gmbh & Co. Packagings for thin-layer slice-form products
EP3018703A1 (en) * 2014-11-06 2016-05-11 mechatronic Systemtechnik GmbH Device for applying a film on a substrate
CN113859723A (en) * 2021-08-27 2021-12-31 智新半导体有限公司 Collapsing loop recycling frame

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615006A (en) * 1969-06-26 1971-10-26 Ibm Storage container
US3980178A (en) * 1973-07-23 1976-09-14 Schidlowski J Carlos Protective record cover
US4681227A (en) * 1984-04-04 1987-07-21 Fuji Photo Film Co., Ltd. Cassette for stimulable phosphor sheet
US4736840A (en) * 1986-11-24 1988-04-12 Deiglmeier Jay D Protective holder for a compact disc or the like
US5353934A (en) * 1992-08-06 1994-10-11 Dai Nippon Printing Co., Ltd. Substrate holding case
US5405000A (en) * 1994-02-28 1995-04-11 Hagedon; Bryan D. Protective suspension package
US5743409A (en) * 1993-08-12 1998-04-28 Nikon Corporation Case for housing a substrate
US5788068A (en) * 1994-11-03 1998-08-04 Dubois Limited Apparatus for holding a compact disk
US6363987B1 (en) * 1999-10-01 2002-04-02 Labelwhiz.Com, Inc Compact disk labeling systems
US20020056654A1 (en) * 2000-09-29 2002-05-16 Kristin Carman Spoked compact disk holder
US6657817B2 (en) * 2000-09-19 2003-12-02 Fuji Photo Film Co., Ltd. Cassette housing case having an engagement recess and one or more engagement protrusions
US20040008613A1 (en) * 2002-07-12 2004-01-15 Beckwith Scott W. Packaging for limited lifetime optical data storage media
US6976586B2 (en) * 2002-05-10 2005-12-20 Asm America, Inc. Delicate product packaging system

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615006A (en) * 1969-06-26 1971-10-26 Ibm Storage container
US3980178A (en) * 1973-07-23 1976-09-14 Schidlowski J Carlos Protective record cover
US4681227A (en) * 1984-04-04 1987-07-21 Fuji Photo Film Co., Ltd. Cassette for stimulable phosphor sheet
US4736840A (en) * 1986-11-24 1988-04-12 Deiglmeier Jay D Protective holder for a compact disc or the like
US5353934A (en) * 1992-08-06 1994-10-11 Dai Nippon Printing Co., Ltd. Substrate holding case
US5743409A (en) * 1993-08-12 1998-04-28 Nikon Corporation Case for housing a substrate
US5405000A (en) * 1994-02-28 1995-04-11 Hagedon; Bryan D. Protective suspension package
US5788068A (en) * 1994-11-03 1998-08-04 Dubois Limited Apparatus for holding a compact disk
US6363987B1 (en) * 1999-10-01 2002-04-02 Labelwhiz.Com, Inc Compact disk labeling systems
US6657817B2 (en) * 2000-09-19 2003-12-02 Fuji Photo Film Co., Ltd. Cassette housing case having an engagement recess and one or more engagement protrusions
US20020056654A1 (en) * 2000-09-29 2002-05-16 Kristin Carman Spoked compact disk holder
US6976586B2 (en) * 2002-05-10 2005-12-20 Asm America, Inc. Delicate product packaging system
US20040008613A1 (en) * 2002-07-12 2004-01-15 Beckwith Scott W. Packaging for limited lifetime optical data storage media

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100101635A1 (en) * 2008-10-14 2010-04-29 Christian Senning Verpackungsmaschinen Gmbh & Co. Packagings for thin-layer slice-form products
EP2178114A3 (en) * 2008-10-14 2011-11-23 Christian Senning Verpackungsmaschinen GmbH & Co. Packaging for thin, disk-shaped products
EP3018703A1 (en) * 2014-11-06 2016-05-11 mechatronic Systemtechnik GmbH Device for applying a film on a substrate
CN113859723A (en) * 2021-08-27 2021-12-31 智新半导体有限公司 Collapsing loop recycling frame

Also Published As

Publication number Publication date
TW200613202A (en) 2006-05-01
JP2006128590A (en) 2006-05-18

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Legal Events

Date Code Title Description
AS Assignment

Owner name: POWER GEODE TECHNOLOGY CO. LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIU, YU-CHUAN;REEL/FRAME:016085/0255

Effective date: 20041124

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION