US20060102195A1 - Method of cleaning substrate - Google Patents

Method of cleaning substrate Download PDF

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Publication number
US20060102195A1
US20060102195A1 US11/319,165 US31916505A US2006102195A1 US 20060102195 A1 US20060102195 A1 US 20060102195A1 US 31916505 A US31916505 A US 31916505A US 2006102195 A1 US2006102195 A1 US 2006102195A1
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Prior art keywords
pure water
glass substrate
ultraviolet rays
irradiating
dipping
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Abandoned
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US11/319,165
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Masaaki Suzuki
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Canon Inc
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Canon Inc
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Priority to US11/319,165 priority Critical patent/US20060102195A1/en
Publication of US20060102195A1 publication Critical patent/US20060102195A1/en
Abandoned legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • B08B3/022Cleaning travelling work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/26Cleaning or polishing of the conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1509Horizontally held PCB
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00Cleaning and liquid contact with solids
    • Y10S134/902Semiconductor wafer

Definitions

  • the present invention relates to a method of cleaning substrates, particularly a method of cleaning substrates suitable for cleaning glass substrates for liquid crystal devices wherein dirt on a glass substrate causing an inferior product is removed during a liquid crystal device production process.
  • the pre-cleaning by brushing or ultrasonic cleaning using a detergent is performed before the cleaning with pure water, it is possible to obtain a sufficient cleaning effect even if a shorter time is used for the cleaning with pure water.
  • this additionally requires a cleaning step using a detergent and a rinsing step, so that the total length of the required cleaning apparatus is not substantially changed.
  • the required amount of pure water is not substantially changed either because the rinsing step after the cleaning with a detergent requires an additional amount of pure water, thus also requiring a high process cost.
  • an object of the present invention is to provide a method of cleaning a substrate, whereby dirt, such as inorganic and organic matter, can be effectively removed while shortening the wet cleaning time and reducing the amount of water used.
  • Another object of the present invention is to provide a method of cleaning a substrate, whereby a glass substrate can be effectively cleaned with a minimum amount of pure water and a short time with a simple apparatus arrangement and without complex process control.
  • a method of cleaning a substrate for removing dirt on the substrate comprising irradiating a substrate surface with ultraviolet rays including wavelengths of 184.9 nm and 253.7 nm in an oxygen-containing atmosphere, and then subjecting the substrate to wet cleaning with pure water.
  • FIG. 1 is an illustration of a batch-type cleaning apparatus for use in a method of cleaning a substrate according to the present invention.
  • FIG. 2 is an illustration of a sheet-by-sheet type cleaning apparatus for use in a method of cleaning a substrate according to the present invention.
  • a glass substrate for a liquid crystal device may be cleaned for removal of dirt thereon by first irradiating a surface of the substrate with ultraviolet rays including wavelengths of 184.9 nm and 253.7 nm in an oxygen-containing atmosphere and then subjecting the substrate to wet cleaning with pure water.
  • the surface of the substrate is simultaneously irradiated with ultraviolet rays including components with wavelengths of 184.9 nm and 253.7 nm, preferably having peaks at these wavelengths, whereby oxygen in the atmosphere absorbs ultraviolet rays at 184.9 nm to form ozone and the ozone absorbs ultraviolet rays at 253.7 nm to form oxygen radicals, with which the dirt of organic matter on the glass substrate is chemically removed and the surface tension of the glass surface is reduced to improve the wettability in advance to enhance the effect of cleaning dirt of inorganic matter in a subsequent cleaning step with pure water.
  • ultraviolet rays including components with wavelengths of 184.9 nm and 253.7 nm, preferably having peaks at these wavelengths, whereby oxygen in the atmosphere absorbs ultraviolet rays at 184.9 nm to form ozone and the ozone absorbs ultraviolet rays at 253.7 nm to form oxygen radicals, with which the dirt of organic matter on the glass substrate is chemically removed and the surface tension of the glass surface is reduced to improve the
  • the irradiation means for issuing the above-mentioned wavelengths may be any, provided that they include sufficient amount of the above-mentioned wavelengths. Examples of which may include: discharge lamps, such as low pressure mercury lamps, black light fluorescent lamps, fluorescent chemical lamps, mercury arc lamps, and xenon arc lamps, and excimer lasers, such as KrF and ArF excimer lasers.
  • discharge lamps such as low pressure mercury lamps, black light fluorescent lamps, fluorescent chemical lamps, mercury arc lamps, and xenon arc lamps
  • excimer lasers such as KrF and ArF excimer lasers.
  • Such irradiation means can be combined in plurality as desired. It is also possible to use separate irradiation means for a wavelength of 184.9 nm and a wavelength of 253.7 nm.
  • the irradiation intensity of the ultraviolet rays can be varied depending on the degree of soiling or dirt on the substrate or desired cleanliness of the substrate but may generally preferably be at least 0.2 J/cm 2 , more preferably at least 0.4 J/cm 2 .
  • the irradiation of the substrate with ultraviolet radiation may be performed in an oxygen-containing atmosphere, which may conveniently be atmospheric air or preferably be an oxygen atmosphere or an atmosphere containing oxygen diluted with an inert gas, such as Ar or N 2 so as to further obviate unnecessary by-products due to irradiation with ultraviolet rays.
  • an oxygen-containing atmosphere which may conveniently be atmospheric air or preferably be an oxygen atmosphere or an atmosphere containing oxygen diluted with an inert gas, such as Ar or N 2 so as to further obviate unnecessary by-products due to irradiation with ultraviolet rays.
  • the time after the ultraviolet irradiation until the cleaning with pure water may generally be at most 30 minutes, preferably at most 10 minutes.
  • the cleaning with pure water may preferably be performed when the substrate surface shows a contact angle with water of at most 10 degrees, preferably at most 5 degrees. This means that the cleaning with pure water is started while the substrate surface shows good wettability with pure water.
  • FIG. 1 is an illustration of an outline of a batch-type cleaning apparatus for use in a method of cleaning substrates for, e.g., liquid crystal devices.
  • the apparatus includes an ultraviolet ray irradiation unit 1 , wherein 7 U-shaped low pressure mercury lamps 2 of 110 watts (“UVU-110”, available from K.K. Oak Seisakusho) having two peaks and wavelengths of 184.9 nm and 253.7 nm were arranged.
  • UVU-110 available from K.K. Oak Seisakusho
  • glass substrates 3 (300 mm ⁇ 300 mm ⁇ 1.1 mm-t), each provided with a surface pattern of electrodes and held in a cleaning cassette 4 , were supplied sheet by sheet for irradiation with ultraviolet rays for 30 seconds per sheet from a distance of about 10 mm.
  • glass substrates 3 were intentionally soiled with silica latex particles with an average particle size of 1.2 ⁇ m at a rate of about 300 particles/mm 2 and then cleaned in the above-described manner, whereby an extremely good removal rate of 98% was obtained.
  • FIG. 2 is an illustration of a sheet-by-sheet cleaning apparatus for practicing a cleaning method for liquid crystal device substrates.
  • the apparatus includes an ultraviolet ray irradiation unit 1 wherein 5 U-shaped 110 watt low pressure mercury lamps 2 (“UVU-110”, available from K.K. Oak Seisakusho) having two peaks at wavelengths of 184.9 nm and 253.7 nm were arranged.
  • UVU-110 U-shaped 110 watt low pressure mercury lamps 2
  • glass substrates 3 300 mm ⁇ 300 mm ⁇ 1.1 mm-t
  • ITO transparent electrode film
  • the substrates 3 were subjected to wet cleaning by being sprayed with warm pure water at about 30° C. from a spray nozzle 9 and then subjected to high pressure showering of pure water at about 15 kg.f/cm 2 from a shower nozzle 10 , followed by draining with air knife 11 .
  • the thus cleaned substrates were then satisfactorily coated with a positive-type photoresist by roller coating, followed by satisfactory patterning of the ITO film.
  • substrates 3 were intentionally soiled with silica latex particles with an average particle size of 1.2 ⁇ m at a rate of about 300 particles/mm 2 and then cleaned in the above-described manner, whereby a good removal rate of 96% was obtained in the case where the ultraviolet irradiation was performed before the cleaning with pure water. In contrast thereto, an inferior cleaning rate of about 89% was measured in the case where the wet cleaning alone was performed.
  • a substrate surface is irradiated with ultraviolet rays including wavelengths at 184.9 nm and 253.7 nm in an oxygen-containing atmosphere immediately before wet cleaning with pure water, whereby it becomes possible to increase the removal rate of dirt, particularly of inorganic matter. As a result, it is possible to shorten the wet cleaning time and decrease the amount of pure water, leading to a decrease in production cost.

Abstract

Dirt, particularly of inorganic matter, attached to a substrate, such as a glass substrate for liquid crystal devices, is effectively removed by irradiating the substrate with ultraviolet rays including 184.9 nm and 253.7 nm in an oxygen-containing atmosphere in advance of wet cleaning with pure water. As a result, the wet cleaning time and the amount of pure water can be reduced.

Description

  • This application is a division of application Ser. No. 10/629,636, filed Jul. 30, 2003, which is a division of application Ser. No. 09/695,925, filed Oct. 26, 2000 (now U.S. Pat. No. 6,651,680), which is in turn a division of application Ser. No. 08/743,375, filed Nov. 4, 1996 (now U.S. Pat. No. 6,217,665), which in turn is a continuation of application Ser. No. 08/013,314, filed Feb. 4, 1993 (now abandoned).
  • BACKGROUND OF THE INVENTION
  • The present invention relates to a method of cleaning substrates, particularly a method of cleaning substrates suitable for cleaning glass substrates for liquid crystal devices wherein dirt on a glass substrate causing an inferior product is removed during a liquid crystal device production process.
  • There have been known wet cleaning techniques using pure water for cleaning substrates for precision devices or appliances, such as glass substrates for liquid crystal devices. In the case of cleaning a glass substrate for a liquid crystal device already provided with a pattern of electrodes and before provision of an alignment film, for example, it has been ordinarily practiced to first remove dirt, such as dust and inorganic matter, by a combination of spraying, high pressure showering and/or ultrasonic cleaning respectively using pure water, optionally with brushing or ultrasonic cleaning with a detergent and cationic pure water as a pretreatment, and drain the water as by an air knife, a spinner or pulling out from warm pure water, or dry the substrate with, e.g., vapor of IPA (isopropyl alcohol).
  • It is also known to thereafter heat the glass substrate to about 150° C. and irradiate the substrate with ultraviolet rays at wavelengths of 184.9 nm and 253.7 nm so as to have oxygen in air absorb the ultraviolet rays at 184.9 nm to generate ozone and have the ozone absorb the ultraviolet rays at 253.7 nm to generate oxygen radicals, by which organic matter is decomposed and removed.
  • However, the above-mentioned first washing with pure water for removal of dust or inorganic matter with pure water as by a combination of spraying, high pressure showering, ultrasonic cleaning, etc., requires some length of time, thus leading to an inferior throughput of the cleaning apparatus or requiring an elongated apparatus in order to retain a high throughput using the same length of time. Further, a large amount of water is required per sheet of glass substrate, and the cleaning cost is considerably expensive.
  • Further, if the pre-cleaning by brushing or ultrasonic cleaning using a detergent is performed before the cleaning with pure water, it is possible to obtain a sufficient cleaning effect even if a shorter time is used for the cleaning with pure water. However, for an identical throughput, this additionally requires a cleaning step using a detergent and a rinsing step, so that the total length of the required cleaning apparatus is not substantially changed. Further, the required amount of pure water is not substantially changed either because the rinsing step after the cleaning with a detergent requires an additional amount of pure water, thus also requiring a high process cost.
  • SUMMARY OF THE INVENTION
  • In order to solve the above-mentioned problems, an object of the present invention is to provide a method of cleaning a substrate, whereby dirt, such as inorganic and organic matter, can be effectively removed while shortening the wet cleaning time and reducing the amount of water used.
  • Another object of the present invention is to provide a method of cleaning a substrate, whereby a glass substrate can be effectively cleaned with a minimum amount of pure water and a short time with a simple apparatus arrangement and without complex process control.
  • According to the present invention, there is provided a method of cleaning a substrate for removing dirt on the substrate, comprising irradiating a substrate surface with ultraviolet rays including wavelengths of 184.9 nm and 253.7 nm in an oxygen-containing atmosphere, and then subjecting the substrate to wet cleaning with pure water.
  • These and other objects, features and advantages of the present invention will become more apparent upon a consideration of the following description of the preferred embodiments of the present invention taken in conjunction with the accompanying drawings.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an illustration of a batch-type cleaning apparatus for use in a method of cleaning a substrate according to the present invention.
  • FIG. 2 is an illustration of a sheet-by-sheet type cleaning apparatus for use in a method of cleaning a substrate according to the present invention.
  • DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • In a preferred embodiment of the present invention, a glass substrate for a liquid crystal device may be cleaned for removal of dirt thereon by first irradiating a surface of the substrate with ultraviolet rays including wavelengths of 184.9 nm and 253.7 nm in an oxygen-containing atmosphere and then subjecting the substrate to wet cleaning with pure water.
  • More specifically, in the cleaning method for removing dirt (foreign matter) on a glass substrate according to the present invention, immediately before the wet cleaning with pure water of the substrate, the surface of the substrate is simultaneously irradiated with ultraviolet rays including components with wavelengths of 184.9 nm and 253.7 nm, preferably having peaks at these wavelengths, whereby oxygen in the atmosphere absorbs ultraviolet rays at 184.9 nm to form ozone and the ozone absorbs ultraviolet rays at 253.7 nm to form oxygen radicals, with which the dirt of organic matter on the glass substrate is chemically removed and the surface tension of the glass surface is reduced to improve the wettability in advance to enhance the effect of cleaning dirt of inorganic matter in a subsequent cleaning step with pure water.
  • The irradiation means for issuing the above-mentioned wavelengths may be any, provided that they include sufficient amount of the above-mentioned wavelengths. Examples of which may include: discharge lamps, such as low pressure mercury lamps, black light fluorescent lamps, fluorescent chemical lamps, mercury arc lamps, and xenon arc lamps, and excimer lasers, such as KrF and ArF excimer lasers.
  • Such irradiation means can be combined in plurality as desired. It is also possible to use separate irradiation means for a wavelength of 184.9 nm and a wavelength of 253.7 nm.
  • The irradiation intensity of the ultraviolet rays can be varied depending on the degree of soiling or dirt on the substrate or desired cleanliness of the substrate but may generally preferably be at least 0.2 J/cm2, more preferably at least 0.4 J/cm2.
  • The irradiation of the substrate with ultraviolet radiation may be performed in an oxygen-containing atmosphere, which may conveniently be atmospheric air or preferably be an oxygen atmosphere or an atmosphere containing oxygen diluted with an inert gas, such as Ar or N2 so as to further obviate unnecessary by-products due to irradiation with ultraviolet rays.
  • The time after the ultraviolet irradiation until the cleaning with pure water may generally be at most 30 minutes, preferably at most 10 minutes. In other words, the cleaning with pure water may preferably be performed when the substrate surface shows a contact angle with water of at most 10 degrees, preferably at most 5 degrees. This means that the cleaning with pure water is started while the substrate surface shows good wettability with pure water.
  • Anyway, standing for a long time after the ultraviolet irradiation should be avoided, since the effect of the ultraviolet irradiation is lost.
  • Hereinbelow, the present invention will be described with reference to an embodiment shown in the drawings.
  • EXAMPLE 1
  • FIG. 1 is an illustration of an outline of a batch-type cleaning apparatus for use in a method of cleaning substrates for, e.g., liquid crystal devices. Referring to FIG. 1, the apparatus includes an ultraviolet ray irradiation unit 1, wherein 7 U-shaped low pressure mercury lamps 2 of 110 watts (“UVU-110”, available from K.K. Oak Seisakusho) having two peaks and wavelengths of 184.9 nm and 253.7 nm were arranged. Into the unit 1, glass substrates 3 (300 mm×300 mm×1.1 mm-t), each provided with a surface pattern of electrodes and held in a cleaning cassette 4, were supplied sheet by sheet for irradiation with ultraviolet rays for 30 seconds per sheet from a distance of about 10 mm.
  • Then, by an automatic conveying machine, 5 sheets of the glass substrates 3 subjected to the ultraviolet irradiation together with the cleaning cassette 4 were dipped and washed for about 180 seconds in a first ultrasonic cleaning vessel 5 using pure water, and then dipped and washed for about 180 seconds in a second ultrasonic cleaning bath 6, followed by drying with EPA ( isopropyl alcohol) vapor in a chamber 7-1 in a drying vessel 7. The substrates thus cleaned were then taken out from the cleaning apparatus and subjected to coating with a polyimide forming liquid by flexograhic printing, whereby a clear polyimide film was found to be formed thereon. The first and second cleaning vessels 5 and 6 were respectively supplied with 500 liters/hour of pure water and, as a result of simple calculation, the substrates were sufficiently cleaned with pure water in a small amount of about 8 liters/sheet.
  • In contrast thereto, the same level of cleaning required about 16 liters/sheet without the preliminary ultraviolet irradiation prior to the cleaning with pure water.
  • For evaluating the cleaning performance, glass substrates 3 were intentionally soiled with silica latex particles with an average particle size of 1.2 μm at a rate of about 300 particles/mm2 and then cleaned in the above-described manner, whereby an extremely good removal rate of 98% was obtained.
  • In contrast thereto, when substrates intentionally soiled similarly as above were cleaned without being introduced into the ultraviolet ray irradiation unit 1, i.e., by directly introduced into the first cleaning bath 5, the second cleaning bath 6 and the drying bath 7, a removal rate of only 92% was obtained showing a clearly inferior cleaning state than in the case where the ultraviolet irradiation was performed in advance of the cleaning with pure water. Further, in order to obtain a removal rate of 98%, it was necessary to effect the cleaning sequence though the vessels 5-7 two cycles under identical conditions.
  • EXAMPLE 2
  • FIG. 2 is an illustration of a sheet-by-sheet cleaning apparatus for practicing a cleaning method for liquid crystal device substrates. Referring to FIG. 2, the apparatus includes an ultraviolet ray irradiation unit 1 wherein 5 U-shaped 110 watt low pressure mercury lamps 2 (“UVU-110”, available from K.K. Oak Seisakusho) having two peaks at wavelengths of 184.9 nm and 253.7 nm were arranged. Through the unit 1, glass substrates 3 (300 mm×300 mm×1.1 mm-t), each provided with a transparent electrode film (ITO) on the entirety of one face, were conveyed by conveying rollers 8 continuously sheet by sheet to be irradiated with ultraviolet rays from a height of 10 mm for about 40 seconds.
  • Then, the substrates 3 were subjected to wet cleaning by being sprayed with warm pure water at about 30° C. from a spray nozzle 9 and then subjected to high pressure showering of pure water at about 15 kg.f/cm2 from a shower nozzle 10, followed by draining with air knife 11. The thus cleaned substrates were then satisfactorily coated with a positive-type photoresist by roller coating, followed by satisfactory patterning of the ITO film.
  • For evaluating the cleaning performance similarly as in Example 1, substrates 3 were intentionally soiled with silica latex particles with an average particle size of 1.2 μm at a rate of about 300 particles/mm2 and then cleaned in the above-described manner, whereby a good removal rate of 96% was obtained in the case where the ultraviolet irradiation was performed before the cleaning with pure water. In contrast thereto, an inferior cleaning rate of about 89% was measured in the case where the wet cleaning alone was performed.
  • EXAMPLE 3
  • The substrates cleaned in Examples 1 and 2 were again subjected to irradiation with ultraviolet rays in an oxygen-containing atmosphere under similar conditions as in the previous examples, whereby further effective cleaning of the substrate surfaces could be performed.
  • As described hereinabove, according to the present invention, a substrate surface is irradiated with ultraviolet rays including wavelengths at 184.9 nm and 253.7 nm in an oxygen-containing atmosphere immediately before wet cleaning with pure water, whereby it becomes possible to increase the removal rate of dirt, particularly of inorganic matter. As a result, it is possible to shorten the wet cleaning time and decrease the amount of pure water, leading to a decrease in production cost.

Claims (9)

1-16. (canceled)
17. A method for producing a glass substrate with a transparent electrode, said method including a washing process comprising:
a providing process for providing a glass substrate with a transparent electrode;
an irradiating process for irradiating a surface of the transparent electrode with ultraviolet rays using ultraviolet exposure means;
a first conveying process for carrying the glass substrate irradiated with ultraviolet rays in a cassette;
a second conveying process for carrying the glass substrate held in the cassette in a washing vessel that uses pure water;
a dipping process for dipping the glass substrate conveyed in said second conveying process in the pure water; and
an ultrasonic wave application process for applying ultrasonic waves to the glass substrate in the pure water,
wherein the glass substrate irradiated with the ultraviolet rays is conveyed from said irradiating process to said dipping process by performing said first conveying process and said second conveying process without utilizing a substance other than pure water, and wherein the pure water is used as the sole aqueous washing medium.
18. A method according to claim 17, wherein the ultraviolet rays exhibit wavelength peaks at 184.9 nm and 253.74 nm.
19. A method for producing a liquid crystal device having a glass substrate with a transparent electrode, said method including a washing process comprising:
a providing process for providing a glass substrate with a transparent electrode;
an irradiating process for irradiating a surface of the transparent electrode with ultraviolet rays using ultraviolet exposure means;
a first conveying process for carrying the glass substrate irradiated with ultraviolet rays in a cassette;
a second conveying process for carrying the glass substrate held in the cassette in a washing vessel that uses pure water;
a dipping process for dipping the glass substrate conveyed by said second conveying process in the pure water; and
an ultrasonic wave application process for applying ultrasonic waves to the glass substrate in the pure water,
wherein the glass substrate irradiated with the ultraviolet rays is conveyed from said irradiating process to said dipping process by performing said first conveying process and said second conveying process without utilizing a substance other than pure water, and wherein the pure water is used as the sole aqueous washing medium.
20. A method according to claim 19, wherein the ultraviolet rays exhibit wavelength peaks at 184.9 nm and 253.7 nm.
21. A method for producing plural sheets of glass substrates each with a transparent electrode, said method including a washing process comprising:
a providing process for providing plural sheets of glass substrates each with a transparent electrode;
an irradiating process for irradiating each of the transparent electrodes of the plural sheets with ultraviolet rays using ultraviolet exposure means;
a first conveying process for carrying each of the glass substrates irradiated with ultraviolet rays in a cassette;
a second conveying process for carrying each of the glass substrates held in the cassette in a washing vessel that uses pure water;
a dipping process for dipping each of the glass substrates conveyed by said second conveying process in the pure water; and
an ultrasonic wave application process for applying ultrasonic waves to each of the glass substrates in the pure water,
wherein each glass substrate irradiated with the ultraviolet rays is conveyed from said irradiating process to said dipping process by performing said first conveying process and said second conveying process without utilizing a substance other than pure water, and wherein the pure water is used as the sole aqueous washing medium.
22. A method according to claim 21, wherein the washing vessel comprises ultrasonic wave generating means for generating the ultrasonic waves.
23. A method for producing plural liquid crystal devices each having a glass substrate with a transparent electrode, said method including a washing process comprising:
a providing process for providing plural sheets of glass substrates each with a transparent electrode;
an irradiating process for irradiating each of the transparent electrodes of the plural sheets with ultraviolet rays using ultraviolet exposure means;
a first conveying process for carrying each of the glass substrates irradiated with ultraviolet rays in a cassette;
a second conveying process for carrying each of the glass substrates held in the cassette in a washing vessel that uses pure water;
a dipping process for dipping each of the glass substrates conveyed by said second conveying process in the pure water; and
an ultrasonic wave application process for applying ultrasonic waves to each of the glass substrates in the pure water,
wherein each glass substrate irradiated with the ultraviolet rays is conveyed from said irradiating process to said dipping process by performing said first conveying process and said second conveying process without utilizing a substance other than pure water, and wherein the pure water is used as the sole aqueous washing medium.
24. A method according to claim 23, wherein the washing vessel comprises ultrasonic wave generating means for generating the ultrasonic waves.
US11/319,165 1992-02-07 2005-12-28 Method of cleaning substrate Abandoned US20060102195A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/319,165 US20060102195A1 (en) 1992-02-07 2005-12-28 Method of cleaning substrate

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP055985/1992 1992-02-07
JP4055985A JP2727481B2 (en) 1992-02-07 1992-02-07 Cleaning method for glass substrate for liquid crystal element
US1331493A 1993-02-04 1993-02-04
US08/743,375 US6217665B1 (en) 1992-02-07 1996-11-04 Method of cleaning substrate using ultraviolet radiation
US09/695,925 US6651680B1 (en) 1992-02-07 2000-10-26 Washing apparatus with UV exposure and first and second ultrasonic cleaning vessels
US10/629,636 US20040103913A1 (en) 1992-02-07 2003-07-30 Apparatus for washing glass substrates and process for producing a liquid crystal device
US11/319,165 US20060102195A1 (en) 1992-02-07 2005-12-28 Method of cleaning substrate

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US10/629,636 Division US20040103913A1 (en) 1992-02-07 2003-07-30 Apparatus for washing glass substrates and process for producing a liquid crystal device

Publications (1)

Publication Number Publication Date
US20060102195A1 true US20060102195A1 (en) 2006-05-18

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Application Number Title Priority Date Filing Date
US08/743,375 Expired - Fee Related US6217665B1 (en) 1992-02-07 1996-11-04 Method of cleaning substrate using ultraviolet radiation
US09/695,925 Expired - Fee Related US6651680B1 (en) 1992-02-07 2000-10-26 Washing apparatus with UV exposure and first and second ultrasonic cleaning vessels
US10/629,636 Abandoned US20040103913A1 (en) 1992-02-07 2003-07-30 Apparatus for washing glass substrates and process for producing a liquid crystal device
US10/828,347 Expired - Fee Related US6946035B2 (en) 1992-02-07 2004-04-21 Method of cleaning substrate
US10/958,343 Abandoned US20050076934A1 (en) 1992-02-07 2004-10-06 Method of cleaning substrate
US11/319,165 Abandoned US20060102195A1 (en) 1992-02-07 2005-12-28 Method of cleaning substrate

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US08/743,375 Expired - Fee Related US6217665B1 (en) 1992-02-07 1996-11-04 Method of cleaning substrate using ultraviolet radiation
US09/695,925 Expired - Fee Related US6651680B1 (en) 1992-02-07 2000-10-26 Washing apparatus with UV exposure and first and second ultrasonic cleaning vessels
US10/629,636 Abandoned US20040103913A1 (en) 1992-02-07 2003-07-30 Apparatus for washing glass substrates and process for producing a liquid crystal device
US10/828,347 Expired - Fee Related US6946035B2 (en) 1992-02-07 2004-04-21 Method of cleaning substrate
US10/958,343 Abandoned US20050076934A1 (en) 1992-02-07 2004-10-06 Method of cleaning substrate

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US6651680B1 (en) 2003-11-25
JPH05224167A (en) 1993-09-03
US20040194798A1 (en) 2004-10-07
US6946035B2 (en) 2005-09-20
US6217665B1 (en) 2001-04-17
US20040103913A1 (en) 2004-06-03
US20050076934A1 (en) 2005-04-14
JP2727481B2 (en) 1998-03-11

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