US20060108686A1 - Semiconductor device for fingerprint recognition - Google Patents
Semiconductor device for fingerprint recognition Download PDFInfo
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- US20060108686A1 US20060108686A1 US11/330,293 US33029306A US2006108686A1 US 20060108686 A1 US20060108686 A1 US 20060108686A1 US 33029306 A US33029306 A US 33029306A US 2006108686 A1 US2006108686 A1 US 2006108686A1
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- semiconductor chip
- substrate
- fingerprint recognition
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- fingerprint
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M37/00—Apparatus or systems for feeding liquid fuel from storage containers to carburettors or fuel-injection apparatus; Arrangements for purifying liquid fuel specially adapted for, or arranged on, internal-combustion engines
- F02M37/04—Feeding by means of driven pumps
- F02M37/18—Feeding by means of driven pumps characterised by provision of main and auxiliary pumps
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K15/00—Arrangement in connection with fuel supply of combustion engines or other fuel consuming energy converters, e.g. fuel cells; Mounting or construction of fuel tanks
- B60K15/03—Fuel tanks
- B60K15/035—Fuel tanks characterised by venting means
- B60K15/03519—Valve arrangements in the vent line
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M21/00—Apparatus for supplying engines with non-liquid fuels, e.g. gaseous fuels stored in liquid form
- F02M21/02—Apparatus for supplying engines with non-liquid fuels, e.g. gaseous fuels stored in liquid form for gaseous fuels
- F02M21/0218—Details on the gaseous fuel supply system, e.g. tanks, valves, pipes, pumps, rails, injectors or mixers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M21/00—Apparatus for supplying engines with non-liquid fuels, e.g. gaseous fuels stored in liquid form
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- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K15/00—Arrangement in connection with fuel supply of combustion engines or other fuel consuming energy converters, e.g. fuel cells; Mounting or construction of fuel tanks
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- B60K2015/03542—Mounting of the venting means
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Definitions
- the present invention generally relates to a semiconductor device for performing fingerprint recognition, and particularly relates to a semiconductor device for performing fingerprint recognition by tracing a fingerprint provided by a finger to a recognition area of the semiconductor device for fingerprint recognition.
- portable apparatuses have become capable of providing high performances.
- portable telephones are capable of storing a large volume of personal information with increases in storage capacity, and it is universally required that the personal information not be perused by persons other than owners.
- the semiconductor device for fingerprint recognition is required to perform fingerprint recognition with high reliability.
- the electrostatic-capacity detecting method is the method of detecting an electrostatic-capacity value between a finger and an electrode formed in a fingerprint detection area of a semiconductor device for fingerprint recognition. Since a semiconductor device for fingerprint recognition using the electrostatic-capacity detecting method can be easily miniaturized, such applications in small electronic apparatuses and the like are advancing.
- the semiconductor device for fingerprint recognition of the electrostatic-capacity detecting method requires a finger to contact the electrode and to sweep in a direction, the fingerprint detection area of the semiconductor device is exposed. For this reason, the structure is such that an opening is formed in a sealing resin that encloses the semiconductor device, and the fingerprint detection area is exposed to the outside through the opening.
- packaging structures used by common semiconductor devices are used, for example, a BGA (Ball Grid Array) type packaging structure is often used.
- FIG. 1 shows an example of this kind of semiconductor device for fingerprint recognition (henceforth a fingerprint sensor).
- a fingerprint sensor I includes a semiconductor chip 2 , a substrate 3 , and a sealing resin 4 .
- a fingerprint recognition area (henceforth a sensor unit 6 ) for fingerprint recognition is formed on a circuit formation side (upper surface according to FIG. 1 ) of the semiconductor chip 2 .
- the semiconductor chip 2 detects the electrostatic-capacity value between the finger and the sensor unit 6 , and detects the fingerprint.
- the substrate 3 is a glass epoxy substrate, and is structured such that a wiring layer is formed on both upper and lower sides of a glass epoxy insulation material.
- the semiconductor chip 2 is fixed to the substrate 3 by a die bonding material 8 .
- the rear side i.e., the side opposite to the side on which the sensor unit 6 is formed, namely, the bottom surface
- a golden wire 7 electrically connects the semiconductor chip 2 to the substrate 3 .
- the sealing resin 4 is formed such that the semiconductor chip 2 and the golden wire 7 are covered, and thus protected.
- an opening 9 is formed in the sealing resin 4 at the position that corresponds to the sensor unit 6 . In this manner, even if the sealing resin 4 is formed, the finger can touch the sensor unit 6 (refer to, for example, JP,9-289268,A (page 6, FIG. 11)).
- FIG. 2 shows how the sealing resin 4 is formed.
- a molding metal 10 is prepared with a spacer 11 so that the sensor unit 6 is covered as illustrated.
- the spacer 11 is formed of a flexible material, such as plastic, and when clamping the molding metal 10 for forming the sealing resin 4 , the spacer 11 closely adheres to the sensor unit 6 such that that the sealing resin 4 is prevented from flowing into the sensor unit 6 .
- the resin can leak from a minute crevice between the semiconductor chip 2 and the spacer 11 when forming the sealing resin 4 . If the resin leaks, the resin starts covering the sensor unit 6 as shown in FIG. 3 (such leaking resin is called resin flash 12 ). When the resin flash 12 is generated on the surface of the sensor unit 6 , there is a problem in that the semiconductor chip 2 cannot properly operate, and accurate fingerprint recognition becomes impossible.
- the spacer 11 directly contacts the sensor unit 6 , and the spacer 11 is pressed by the molding metal 10 to the semiconductor chip 2 .
- the spacer 11 is made of a flexible material, such as plastic, it is well known that great clamping force is applied when clamping the molding metal 10 .
- the spacer 11 directly contacts the sensor unit 6 , there is an additional problem in that the sensor unit 6 and the semiconductor chip 2 may receive damage such as a crack and the like, causing the reliability to be degraded.
- An aspect of the present invention is to provide a semiconductor device for fingerprint recognition including a semiconductor chip that contains a fingerprint recognition area for performing fingerprint recognition, a substrate that has an opening in the position corresponding to the fingerprint recognition area, wherein the semiconductor chip is installed on the substrate by flip chip bonding, the fingerprint recognition area corresponding to the opening, and an under-fill material is provided between the semiconductor chip and the substrate except for the formation position of the opening.
- Another aspect of the present invention is to provide a semiconductor device for fingerprint recognition according to the second mode of the present invention including the semiconductor chip with the fingerprint recognition area for performing fingerprint recognition, the substrate that has the opening in the position corresponding to the fingerprint recognition area, and a sealing resin for protecting the semiconductor chip and the substrate, wherein the semiconductor chip is arranged on the substrate so that the fingerprint recognition area corresponds to the opening, a wire connection is made between the semiconductor chip and the substrate through an opening for wire, the opening for wire being formed in the substrate, and the sealing resin is provided on a first side of the substrate, the first side being opposite to a second side on which the semiconductor chip is arranged.
- another aspect of the present invention is to provide a semiconductor device for fingerprint recognition according to the third mode of the present invention including the semiconductor chip with the fingerprint recognition area for performing fingerprint recognition, and the substrate that mounts the semiconductor chip, wherein the semiconductor chip is mounted on the substrate by flip chip bonding so that the side that is opposite to the fingerprint recognition area formation side of the semiconductor chip faces the substrate with a penetration via being provided in the semiconductor chip.
- another aspect of the present invention is to provide a semiconductor device for fingerprint recognition according to the fourth mode of the present invention including the semiconductor chip having a penetration via, and the fingerprint recognition area for performing fingerprint recognition, a re-wiring that is formed on the opposite side of the fingerprint recognition area formation side of the semiconductor chip, the re-wiring being electrically connected to the fingerprint recognition area by the penetration via, and an insulated layer formed so that the opposite side is covered except for the external connection terminal formation part of the re-wiring.
- the present invention provides a semiconductor device for fingerprint recognition with high reliability that substantially obviates one or more of the problems caused by the limitations and disadvantages of the related art.
- FIG. 1 is a cross-sectional view showing an example of a conventional semiconductor device for fingerprint recognition
- FIG. 2 is a cross-sectional view for explaining the manufacturing method of the conventional semiconductor device for fingerprint recognition
- FIG. 3 is a cross-sectional view for explaining the problems of the conventional semiconductor device for fingerprint recognition
- FIG. 4 is a cross-sectional view of a semiconductor device for fingerprint recognition according to the first embodiment of the present invention.
- FIG. 5 is a front view of the semiconductor device for fingerprint recognition according to the first embodiment of the present invention.
- FIG. 6 is a bottom plan view of the semiconductor device for fingerprint recognition according to the first embodiment of the present invention.
- FIG. 7 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the second embodiment of the present invention.
- FIG. 8 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the third embodiment of the present invention.
- FIG. 9 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the fourth embodiment of the present invention.
- FIG. 10 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the fifth embodiment of the present invention.
- FIG. 11 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the sixth embodiment of the present invention.
- FIG. 12 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the seventh embodiment of the present invention.
- FIG. 13 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the eighth embodiment of the present invention.
- FIG. 14 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the ninth embodiment of the present invention.
- FIG. 15 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the tenth embodiment of the present invention.
- FIG. 16 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the eleventh embodiment of the present invention.
- FIG. 17 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the twelfth embodiment of the present invention.
- FIG. 18 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the thirteenth embodiment of the present invention.
- FIG. 19 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the fourteenth embodiment of the present invention.
- FIG. 4 , FIG. 5 , and FIG. 6 show a semiconductor device 20 A for fingerprint recognition (the semiconductor device for fingerprint recognition shall be hereafter called a fingerprint sensor for short) that is the first embodiment of the present invention.
- FIG. 4 is a cross-sectional view (taken along the A-A line in FIG. 6 ) of the fingerprint sensor 20 A
- FIG. 5 is a front view of the fingerprint sensor 20 A
- FIG. 6 is a bottom plan view of the fingerprint sensor 20 A.
- the fingerprint sensor 20 A includes a semiconductor chip 22 A and a substrate 23 A.
- the semiconductor chip 22 A includes a sensor unit 26 serving as a fingerprint recognition area that carries out fingerprint recognition, the sensor unit 26 being arranged on a circuit formation side 30 of the semiconductor chip 22 A.
- the semiconductor chip 22 A performs fingerprint recognition on the electrostatic-capacity principle as a finger sweeps across the sensor unit 26 in the directions indicated by arrows X in FIG. 6 .
- the semiconductor chip 22 A operating on the electrostatic-capacity principle is shorter in the directions indicated by arrows Y, and is longer in the directions of the arrows X, where the directions X and the directions Y are arranged to be orthogonal to each other. Accordingly, the fingerprint sensor 20 A of the present invention can be made smaller than other fingerprint recognition devices that are based on optical means.
- the substrate 23 A is a so-called glass epoxy substrate.
- the fingerprint sensor 20 A includes a glass epoxy material 32 serving as a core material, wiring layers 34 prepared on both sides of the glass epoxy material 32 , and an insulated layer 33 for protecting the wiring layers 34 , which are prepared as the substrate 23 A.
- the wiring layer 34 formed on the upper surface and the wiring layer 34 formed on the undersurface of the glass epoxy material 32 are electrically connected by a through hole electrode 44 .
- the fingerprint sensor 20 A further includes solder balls 25 prepared on the substrate 23 A, which solder balls serve as external connection terminals.
- the solder balls 25 are arranged on a chip mounting side 35 of the substrate 23 A. Accordingly, the insulated layer 33 is removed from positions on the chip mounting side 35 of the substrate 23 A where the solder balls 25 are arranged.
- the height of the solder balls 25 measured from the surface of the chip mounting side 35 is set up higher than the height of the semiconductor chip 22 A measured from the surface of the chip mounting side 35 .
- the height of the solder balls 25 from the chip mounting side 35 is also set up higher than the height of the semiconductor chip 22 A from the chip mounting side 35 .
- an opening 29 is beforehand formed in the substrate 23 A.
- the opening 29 is formed such that the opening 29 penetrates the substrate 23 A, and the form and size (area) are made to correspond to the sensor unit 26 formed in the semiconductor chip 22 A.
- the semiconductor chip 22 A is arranged on the substrate 23 A by flip chip bonding.
- a specific process for carrying out the flip chip bonding of the semiconductor chip 22 A to the substrate 23 A is as follows.
- a resin sheet that serves as an under-fill material 38 is beforehand arranged.
- the resin sheet to serve as the under-fill material 38 is arranged such that the resin sheet surrounds the formation position of the opening 29 .
- stud bumps 37 are beforehand formed on the circuit formation side 30 of the semiconductor chip 22 A.
- the stud bumps 37 are formed with metal, such as gold, and are formed at predetermined positions on the circuit formation side 30 using wire-bonding technology.
- the stud bumps 37 are electrically connected to the wiring layers 34 , and, therefore, the semiconductor chip 22 A is electrically connected to the substrate 23 A.
- the under-fill material 38 protects the bonding of the wiring layer 34 and the stud bumps 37 , the electric connection between the semiconductor chip 22 A and the substrate 23 A is reliably obtained. Further, the under-fill material 38 bonds the semiconductor chip 22 A and the substrate 23 A, i.e., the semiconductor chip 22 A and the substrate 23 A are mechanically joined by the under-fill material 38 .
- the heating temperature is such that the under-fill material 38 softens and demonstrates adhesive strength, but is not high enough to cause fusing of the under-fill material 38 . Accordingly, the resin flash does not occur, i.e., the resin sheet is prevented from being melted, and from running onto the sensor unit 26 .
- the sensor unit 26 of the semiconductor chip 22 A is exposed through the opening 29 formed in the substrate 23 A, as shown in FIG. 4 and FIG. 6 . Accordingly, fingerprint recognition is performed by a finger sweeping across the sensor unit 26 through the opening 29 .
- the opening 29 is beforehand formed in the substrate 23 A at the position corresponding to the sensor unit 26 , and the semiconductor chip 22 A is flip chip bonded to the substrate 23 A such that the sensor unit 26 corresponds to the opening 29 .
- the fingerprint sensor 20 A of the present embodiment does not use the sealing resin 4 (refer to FIG. I through FIG. 3 ) that is conventionally used, and the resin flash, i.e., the sealing resin flowing into the sensor unit 26 of the semiconductor chip 22 A is completely prevented from occurring.
- a wire is not used for the electrical connection between the semiconductor chip 22 A and the substrate 23 A. For this reason, it is not necessary to provide a wiring space in the fingerprint sensor 20 A, and, therefore, the fingerprint sensor 20 A is made thin.
- FIG. 7 is a cross-sectional view showing a fingerprint sensor 20 B that is the second embodiment of the present invention.
- the same label is attached to the same component as in the configuration shown in FIG. 4 and FIG. 6 , and the explanation thereof is not repeated.
- the fingerprint sensor 20 A of the first embodiment uses a glass epoxy substrate for the substrate 23 A that mounts the semiconductor chip 22 A
- the fingerprint sensor 20 B according to the second embodiment is characterized by using a polyimide tape 39 as the base material for a substrate 23 B for mounting the semiconductor chip 22 A.
- the wiring layer 34 of a predetermined pattern is formed on the chip mounting side 35 of the substrate 23 B.
- the stud bumps 37 of the semiconductor chip 22 A are flip chip bonded.
- the opening 29 is formed in the substrate 23 B, and the semiconductor chip 22 A is mounted on the substrate 23 B such that the sensor unit 26 corresponds to the opening 29 .
- the substrate 23 B of the present embodiment is formed by the polyimide tape 39 serving as the base material, and, therefore, can be made thinner than the substrate 23 A that employs the glass epoxy substrate. Accordingly, the fingerprint sensor 20 B of the present embodiment can be made thin by using the substrate 23 B of the polyimide tape 39 as the base material for mounting the semiconductor chip 22 A.
- FIG. 8 is a cross-sectional view showing a fingerprint sensor 20 C according to the third embodiment of the present invention.
- the same label is attached to the same component as in the configuration shown in FIG. 4 and FIG. 6 , and the explanation thereof is not repeated.
- the semiconductor chip 22 A is flip chip bonded to the substrate 23 A using the stud bumps 37 .
- the fingerprint sensor 20 C uses golden wires 27 for the electric connection between the semiconductor chip 22 A and the substrate 23 C. Further, in the present embodiment, in order to protect the golden wires 27 , a sealing resin 24 is provided.
- the opening 29 is also formed in the substrate 23 C of the present embodiment, and the semiconductor chip 22 A is mounted on the substrate 23 C such that the sensor unit 26 corresponds to the opening 29 .
- mechanical bonding of the semiconductor chip 22 A to the substrate 23 C is performed using an adhesive 41 .
- the golden wires 27 of the semiconductor chip 22 A are bonded on the circuit formation side 30 , and the circuit formation side 30 is adhesively fixed to the chip mounting side 35 of the substrate 23 C.
- openings for wire 40 are formed in the substrate 23 C, in addition to the opening 29 .
- the openings for wire 40 are prepared in the positions that correspond to the bonding positions of the golden wires 27 of the semiconductor chip 22 A.
- each golden wire 27 is connected to the predetermined bonding position of the circuit formation side 30 of the semiconductor chip 22 A, and the other end is connected to the wiring layer 34 that is formed on an opposite side 36 of the substrate 23 C (i.e., the side of the substrate 23 C opposite to the chip mounting side 35 that mounts the semiconductor chip 22 A), the golden wire 27 passing through the opening for wire 40 .
- the sealing resin 24 is formed on the opposite side 36 of the substrate 23 C.
- the sealing resin 24 is formed such that the opposite side 36 of the substrate 23 C is covered except for the formation position of the opening 29 . Further, the sealing resin 24 is also formed in the openings for wire 40 , protecting the golden wires 27 .
- the sealing resin 24 is formed by using a molding metal (not shown; refer to FIG. 2 ).
- a spacer 56 (indicated by a chain line in FIG. 8 ) is prepared between the molding metal and the substrate 23 C for forming the opening 29 (i.e., such that the sealing resin 24 is not formed where the opening 29 is formed).
- the spacer 11 directly contacts the sensor unit 6 of the semiconductor chip 2 as explained in reference to FIG. 2 . For this reason, damage can occur to the semiconductor chip 2 and the sensor unit 6 .
- the spacer 56 used when forming the sealing resin 24 contacts the opposite side 36 of the substrate 23 C.
- the spacer 56 contacts the substrate 23 C instead of the sensor unit 26 , damage does not occur to the semiconductor chip 22 A and the sensor unit 26 when forming the sealing resin 24 , and it raises the reliability of the fingerprint sensor 20 C.
- the golden wire 27 electrically connects the semiconductor chip 22 A and the substrate 23 C through the opening for wire 40 formed in the substrate 23 A. That is, a part of the height of the wire loop is included in the thickness of the substrate 23 C. Accordingly, the fingerprint sensor 20 C can be made thinner than the conventional fingerprint sensor I (refer to FIG. 1 ).
- FIG. 9 is a cross-sectional view showing a fingerprint sensor 20 D that is the fourth embodiment of the present invention.
- the same label is attached to the same component as in the configuration shown in FIG. 4 , FIG. 7 , and FIG. 8 , and the explanation thereof is not repeated.
- the fingerprint sensor 20 D according to the present embodiment is differentiated from the fingerprint sensor 20 C of the third embodiment that is shown by FIG. 8 in that the polyimide tape 39 is used as the base material of a substrate 23 D for mounting the semiconductor chip 22 A.
- the opening 29 and the openings for wire 40 are formed.
- the semiconductor chip 22 A is adhesively fixed to the chip mounting side 35 of the substrate 23 D by the adhesive 41 .
- the semiconductor chip 22 A and the substrate 23 D are electrically connected by the golden wires 27 .
- the golden wires 27 that electrically connect the semiconductor chip 22 A and the substrate 23 D are prepared through the openings for wire 40 formed in the substrate 23 D. Furthermore, on the opposite side 36 of the substrate 23 C, the sealing resin 24 for protecting the golden wires 27 is formed.
- the substrate 23 D made of the polyimide tape 39 base material is made thinner than the substrate 23 C that employs the glass epoxy substrate. Accordingly, the fingerprint sensor 20 D of the present embodiment is made thin by using the substrate 23 D of the polyimide tape 39 base material as the substrate for mounting the semiconductor chip 22 A.
- FIG. 10 is a cross-sectional view showing a fingerprint sensor 20 E that is the fifth embodiment of the present invention.
- the same label is attached to the same component as in the configuration shown in FIG. 4 and FIG. 6 , and the explanation thereof is not repeated.
- the semiconductor chip 22 A is arranged on the substrates 23 A through 23 D such that the circuit formation side 30 of the semiconductor chip 22 A faces with the chip mounting side 35 of the substrates 23 A through 23 D, respectively.
- the fingerprint sensor 20 E is structured such that the semiconductor chip 22 B is mounted on the substrate 23 E with a backside 31 that is not the circuit formation side of the semiconductor chip 22 B facing the chip mounting side 35 of the substrate 23 E.
- the circuit formation side 30 and the sensor unit 26 of the semiconductor chip 22 B of the fingerprint sensor 20 E of the present embodiment face outside (upward in FIG. 10 ).
- penetration vias 43 are formed in the semiconductor chip 22 B according to the present embodiment.
- Each penetration via 43 is formed by a conductive metal provided to a hole that vertically penetrates the semiconductor chip 22 B. In this manner, the penetration via 43 functions as wiring that electrically connects the circuit formation side 30 and the backside 31 of the semiconductor chip 22 B. An upper end of the penetration via 43 is connected to the sensor unit 26 and the electronic circuitry formed on the circuit formation side 30 , and a solder bump 42 is arranged at a lower end of the penetration via 43 .
- the semiconductor chip 22 B as described above is mounted on the substrate 23 E by bonding the solder bump 42 and the wiring layer 34 formed on the substrate 23 E. Further, the under-fill material 38 is arranged between the semiconductor chip 22 B and the substrate 23 E so that the mechanical bonding nature of the semiconductor chip 22 B and the substrate 23 E is enhanced, and the bonding positions of the penetration vias 43 and the wiring layer 34 are protected. As described above, according to the present embodiment, since the sensor unit 26 faces outside, an opening, such as the opening 29 in other embodiments, is not formed in the substrate 23 E.
- the sensor unit 26 faces outside, and the electrical connection between the semiconductor chip 22 B and the substrate 23 E is performed using the penetration vias 43 . That is, according to the present embodiment wherein the sensor unit 26 faces outside, the semiconductor chip 22 B and the substrate 23 E are electrically connected without using a wire such as the golden wire 7 of the fingerprint sensor 1 (referring to FIG. 1 ). Since the golden wire 7 is not used, there is no need to form the sealing resin 4 for protecting the golden wire 7 .
- the fingerprint sensor 20 E is made flat with no components, such as sealing resin, being provided on the circuit formation side 30 on which the sensor unit 26 is formed. That is, since there is nothing that hits a finger when sweeping the sensor unit 26 , usability is raised. Further, since the sealing resin is not used, resin flash is not a concern, and the fingerprint sensor 20 E is made thin.
- FIG. 11 is a cross-sectional view showing a fingerprint sensor 20 F that is the sixth embodiment of the present invention.
- the same label is attached to the same component as in the configuration shown in FIG. 4 , FIG. 7 , and FIG. 10 , and the explanation thereof is not repeated.
- the fingerprint sensor 20 F of the present embodiment is the same as the fingerprint sensor 20 E of the fifth embodiment shown in FIG. 10 , except that the polyimide tape 39 is used as the base material of a substrate 23 F for mounting the semiconductor chip 22 B.
- the substrate 23 F using the polyimide tape 39 as the base material is made thin compared with the substrate 23 E that is a glass epoxy substrate. Accordingly, the fingerprint sensor 20 F is made thin by using the substrate 23 F that uses the polyimide tape 39 as the base material for mounting the semiconductor chip 22 B.
- FIGS. 12 through FIG. 17 are cross-sectional views showing fingerprint sensors 20 G through 20 L, respectively, that are the seventh through the twelfth embodiments, respectively, of the present invention.
- FIG. 12 through FIG. 17 the same label is attached to the same component as in the configuration shown in FIG. 4 through FIG. 11 , and the explanation thereof is not repeated.
- the fingerprint sensors 20 G through 20 L that are the seventh through the twelfth embodiments, respectively, are the same as the fingerprint sensors 20 A through 20 F, respectively, of the first through the sixth embodiments, respectively, except that flexible substrates 45 A through 45 F, respectively, are used as the substrate for mounting the semiconductor chips 22 A and 22 B, as applicable.
- the flexible substrates 45 A through 45 F are structured with an insulated resin tape 46 that consists of a resin, such as polyimide, on which a printed circuit 47 of a predetermined pattern is provided.
- the structure of the fingerprint sensors 20 G through 20 J shown in FIG. 12 through FIG. 15 , respectively, are such that the sensor unit 26 of the semiconductor chip 22 A faces the flexible substrates 45 A through 45 D, respectively. Accordingly, the opening 29 is formed in the flexible substrates 45 A through 45 D such that the sensor unit 26 is accessible.
- the semiconductor chip 22 A is flip chip bonded at the flexible substrates 45 A and 45 B, respectively, using the stud bump 37 .
- the semiconductor chip 22 A is flip chip bonded at the flexible substrates 45 C and 45 D, respectively, using the golden wire 27 . Accordingly, the sealing resin 24 is formed in the fingerprint sensors 201 and 20 J for protecting the golden wire 27 .
- the semiconductor chip 22 B is mounted on the flexible substrates 45 E and 45 F, respectively, with the sensor unit 26 facing outside, i.e., upward in the respective drawings. For this reason, the semiconductor chip 22 B is connected to the flexible substrates 45 E and 45 F using the solder bumps 42 formed at the lower end of the penetration via 43 .
- the solder balls 25 arranged on the flexible substrates 45 A, 45 C, and 45 E, respectively, are used as external connection terminals.
- the solder balls 25 are connected to the printed circuit 47 by through holes 49 formed in the insulated resin tape 46 .
- a connector section 48 is arranged on the flexible substrates 45 B, 45 D, and 45 F, respectively, and used as an external connection terminal.
- the connector section 48 is formed in the right end section in each view of the flexible substrates 45 B, 45 D, and 45 F.
- a plan view of the connector section 48 is shown.
- the fingerprint sensors 20 G through 20 L can be shaped as required by an electronic apparatus that is equipped with the fingerprint sensors 20 G through 20 L.
- the mounting nature of the fingerprint sensors 20 G through 20 L to electronic apparatuses is improved. Further, since the solder balls 25 and the connector section 48 that are generally and economically available are used as the external connection terminal, even when the flexible substrates 45 A through 45 F are used as the substrate for mounting the semiconductor chips 22 A and 22 B, as applicable, the flexible substrates 45 A through 45 F are economically realized.
- FIG. 18 is a cross-sectional view showing a fingerprint sensor 20 M that is the thirteenth embodiment of the present invention.
- the same label is attached to the same component as in the configuration shown in FIG. 4 and FIG. 6 , and the explanation thereof is not repeated.
- the fingerprint sensor 20 M is characterized by using a TAB (Tape Automated Bonding) tape 50 as the substrate for mounting the semiconductor chip 22 A.
- TAB Pear Automated Bonding
- the TAB tape 50 includes a polyimide tape 51 that has the opening 29 at the central position, and a wiring 52 formed on the polyimide tape 51 . Further, a part of the wiring 52 extends into the opening 29 as a connection terminal 53 , and the solder bump 42 of the semiconductor chip 22 A is flip chip bonded to the connection terminal 53 .
- the number of terminals of the semiconductor chip 22 A can be increased. That is, according to the present embodiment, the number of the solder bumps 42 can be increased by using the TAB tape 50 as the substrate for mounting the semiconductor chip 22 A.
- FIG. 19 is a cross-sectional view showing a fingerprint sensor 20 N that is the fourteenth embodiment of the present invention.
- the same label is attached to the same component as in the configuration shown in FIG. 4 or FIG. 6 , and the explanation thereof is not repeated.
- the structure of the fingerprint sensor 20 N of the present embodiment is the so-called CSP (Chip Size Package) structure.
- the penetration via 43 is prepared in the semiconductor chip 22 B.
- the sensor unit 26 and the electronic circuitry formed on the circuit formation side 30 are connected to a re-wiring layer 54 formed on the backside 31 of the semiconductor chip 22 B by the penetration via 43 .
- the solder balls 25 used as the external connection terminals are arranged at the re-wiring layer 54 .
- a substrate is not used as the interposer for providing the electrical connection between the sensor unit 26 and the solder balls 25 , but the penetration vias 43 are prepared in the semiconductor chip 22 B, and the re-wiring layer 54 is formed on the backside 31 of the semiconductor chip 22 B for providing the electrical connection between the sensor unit 26 and the solder balls 25 .
- the fingerprint sensor 20 N can be made in almost the same size as the semiconductor chip 22 B, helping miniaturization of electronic apparatuses. Further, the fingerprint sensor 20 N can be manufactured on the wafer level, improving the productivity and realizing cost reduction.
- the first mode of the present invention does not require a sealing resin that is conventionally used, the resin flash (the sealing resin flowing into the fingerprint recognition area of the semiconductor chip) is not a concern. Even though the sealing resin is not used, satisfactory reliability of the semiconductor device for fingerprint recognition is obtained. Furthermore, since a wire is not used, it is not necessary to secure a space for forming a wire loop, and the semiconductor device for fingerprint recognition can be made thin.
- the sealing resin is prepared in the opposite side of the substrate, therefore, the sealing resin does not run into the semiconductor chip, and, accordingly, the sealing resin does not flow into the fingerprint recognition area. Further, since a part of the height of the wire loop is overlapped by the thickness of the substrate, even if a wire is used, the semiconductor device for fingerprint recognition according to the present invention can be made thin compared with conventional products.
- the fingerprint recognition area formation side of the semiconductor device for fingerprint recognition becomes flat, which enhances the usability when performing fingerprint recognition. Further, since sealing resin is not used, resin flash is not a concern.
- various kinds of substrate materials can be used as the substrate.
- solder ball and a connector that are generally and economically available are used according to the present invention.
- the semiconductor device for fingerprint recognition can be made almost as thin and small as the semiconductor chip.
- fingerprint recognition according to the present invention is performed based on the electrostatic-capacity principle, and not optically, the semiconductor device for fingerprint recognition can be miniaturized.
Abstract
A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability. The semiconductor device includes the semiconductor chip having a sensor unit that performs fingerprint recognition, and a substrate having an opening formed in the position corresponding to the sensor unit. The semiconductor chip is flip chip bonded to the substrate such that the sensor unit corresponds to the opening, and except for the formed position of the opening, an under-fill material is provided between the semiconductor chip and the substrate.
Description
- This is a Divisional of application Ser. No. 10/765,999 filed on Jan. 29, 2004.
- 1. Field of the present invention
- The present invention generally relates to a semiconductor device for performing fingerprint recognition, and particularly relates to a semiconductor device for performing fingerprint recognition by tracing a fingerprint provided by a finger to a recognition area of the semiconductor device for fingerprint recognition.
- In recent years, portable apparatuses have become capable of providing high performances. Especially, portable telephones are capable of storing a large volume of personal information with increases in storage capacity, and it is universally required that the personal information not be perused by persons other than owners.
- Also, systems that perform electronic banking by using a portable telephone as a terminal are available. With these developments, a fingerprint sensor that is an authentication device using the fingerprint attracts attention.
- In these applications, the semiconductor device for fingerprint recognition is required to perform fingerprint recognition with high reliability.
- 2. Description of the Related Art
- Conventionally, there are an optical detecting method and an electrostatic-capacity detecting method for fingerprint detection using a fingerprint collating system. Of these, the electrostatic-capacity detecting method is the method of detecting an electrostatic-capacity value between a finger and an electrode formed in a fingerprint detection area of a semiconductor device for fingerprint recognition. Since a semiconductor device for fingerprint recognition using the electrostatic-capacity detecting method can be easily miniaturized, such applications in small electronic apparatuses and the like are advancing.
- Since the semiconductor device for fingerprint recognition of the electrostatic-capacity detecting method requires a finger to contact the electrode and to sweep in a direction, the fingerprint detection area of the semiconductor device is exposed. For this reason, the structure is such that an opening is formed in a sealing resin that encloses the semiconductor device, and the fingerprint detection area is exposed to the outside through the opening.
- Further, as a packaging structure of the semiconductor device for fingerprint recognition, packaging structures used by common semiconductor devices are used, for example, a BGA (Ball Grid Array) type packaging structure is often used.
-
FIG. 1 shows an example of this kind of semiconductor device for fingerprint recognition (henceforth a fingerprint sensor). In essence, a fingerprint sensor I includes asemiconductor chip 2, asubstrate 3, and asealing resin 4. - A fingerprint recognition area (henceforth a sensor unit 6) for fingerprint recognition is formed on a circuit formation side (upper surface according to
FIG. 1 ) of thesemiconductor chip 2. As a finger sweeps across the upper part of thesensor unit 6, thesemiconductor chip 2 detects the electrostatic-capacity value between the finger and thesensor unit 6, and detects the fingerprint. - The
substrate 3 is a glass epoxy substrate, and is structured such that a wiring layer is formed on both upper and lower sides of a glass epoxy insulation material. Thesemiconductor chip 2 is fixed to thesubstrate 3 by adie bonding material 8. - At this instance, the rear side (i.e., the side opposite to the side on which the
sensor unit 6 is formed, namely, the bottom surface) of thesemiconductor chip 2 is fixed to thesubstrate 3 so that thesensor unit 6 is exposed to the outside for a finger to sweep across. Further, agolden wire 7 electrically connects thesemiconductor chip 2 to thesubstrate 3. - The sealing
resin 4 is formed such that thesemiconductor chip 2 and thegolden wire 7 are covered, and thus protected. In order for thesensor unit 6 to be exposed for being swept by the finger, anopening 9 is formed in thesealing resin 4 at the position that corresponds to thesensor unit 6. In this manner, even if thesealing resin 4 is formed, the finger can touch the sensor unit 6 (refer to, for example, JP,9-289268,A (page 6, FIG. 11)). -
FIG. 2 shows how thesealing resin 4 is formed. As mentioned above, it is necessary to form theopening 9 in thesealing resin 4 at the position that corresponds to thesensor unit 6. For this reason, in a conventional practice, amolding metal 10 is prepared with aspacer 11 so that thesensor unit 6 is covered as illustrated. - The
spacer 11 is formed of a flexible material, such as plastic, and when clamping themolding metal 10 for forming thesealing resin 4, thespacer 11 closely adheres to thesensor unit 6 such that that thesealing resin 4 is prevented from flowing into thesensor unit 6. - According to the
conventional fingerprint sensor 1, there is a possibility that the resin can leak from a minute crevice between thesemiconductor chip 2 and thespacer 11 when forming thesealing resin 4. If the resin leaks, the resin starts covering thesensor unit 6 as shown inFIG. 3 (such leaking resin is called resin flash 12). When theresin flash 12 is generated on the surface of thesensor unit 6, there is a problem in that thesemiconductor chip 2 cannot properly operate, and accurate fingerprint recognition becomes impossible. - Further, when forming the sealing
resin 4, thespacer 11 directly contacts thesensor unit 6, and thespacer 11 is pressed by themolding metal 10 to thesemiconductor chip 2. Although thespacer 11 is made of a flexible material, such as plastic, it is well known that great clamping force is applied when clamping themolding metal 10. For this reason, according to the conventional practice, wherein thespacer 11 directly contacts thesensor unit 6, there is an additional problem in that thesensor unit 6 and thesemiconductor chip 2 may receive damage such as a crack and the like, causing the reliability to be degraded. - An aspect of the present invention is to provide a semiconductor device for fingerprint recognition including a semiconductor chip that contains a fingerprint recognition area for performing fingerprint recognition, a substrate that has an opening in the position corresponding to the fingerprint recognition area, wherein the semiconductor chip is installed on the substrate by flip chip bonding, the fingerprint recognition area corresponding to the opening, and an under-fill material is provided between the semiconductor chip and the substrate except for the formation position of the opening.
- Another aspect of the present invention is to provide a semiconductor device for fingerprint recognition according to the second mode of the present invention including the semiconductor chip with the fingerprint recognition area for performing fingerprint recognition, the substrate that has the opening in the position corresponding to the fingerprint recognition area, and a sealing resin for protecting the semiconductor chip and the substrate, wherein the semiconductor chip is arranged on the substrate so that the fingerprint recognition area corresponds to the opening, a wire connection is made between the semiconductor chip and the substrate through an opening for wire, the opening for wire being formed in the substrate, and the sealing resin is provided on a first side of the substrate, the first side being opposite to a second side on which the semiconductor chip is arranged.
- Further, another aspect of the present invention is to provide a semiconductor device for fingerprint recognition according to the third mode of the present invention including the semiconductor chip with the fingerprint recognition area for performing fingerprint recognition, and the substrate that mounts the semiconductor chip, wherein the semiconductor chip is mounted on the substrate by flip chip bonding so that the side that is opposite to the fingerprint recognition area formation side of the semiconductor chip faces the substrate with a penetration via being provided in the semiconductor chip.
- Further still, another aspect of the present invention is to provide a semiconductor device for fingerprint recognition according to the fourth mode of the present invention including the semiconductor chip having a penetration via, and the fingerprint recognition area for performing fingerprint recognition, a re-wiring that is formed on the opposite side of the fingerprint recognition area formation side of the semiconductor chip, the re-wiring being electrically connected to the fingerprint recognition area by the penetration via, and an insulated layer formed so that the opposite side is covered except for the external connection terminal formation part of the re-wiring.
- Accordingly, the present invention provides a semiconductor device for fingerprint recognition with high reliability that substantially obviates one or more of the problems caused by the limitations and disadvantages of the related art.
-
FIG. 1 is a cross-sectional view showing an example of a conventional semiconductor device for fingerprint recognition; -
FIG. 2 is a cross-sectional view for explaining the manufacturing method of the conventional semiconductor device for fingerprint recognition; -
FIG. 3 is a cross-sectional view for explaining the problems of the conventional semiconductor device for fingerprint recognition; -
FIG. 4 is a cross-sectional view of a semiconductor device for fingerprint recognition according to the first embodiment of the present invention; -
FIG. 5 is a front view of the semiconductor device for fingerprint recognition according to the first embodiment of the present invention; -
FIG. 6 is a bottom plan view of the semiconductor device for fingerprint recognition according to the first embodiment of the present invention; -
FIG. 7 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the second embodiment of the present invention; -
FIG. 8 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the third embodiment of the present invention; -
FIG. 9 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the fourth embodiment of the present invention; -
FIG. 10 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the fifth embodiment of the present invention; -
FIG. 11 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the sixth embodiment of the present invention; -
FIG. 12 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the seventh embodiment of the present invention; -
FIG. 13 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the eighth embodiment of the present invention; -
FIG. 14 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the ninth embodiment of the present invention; -
FIG. 15 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the tenth embodiment of the present invention; -
FIG. 16 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the eleventh embodiment of the present invention; -
FIG. 17 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the twelfth embodiment of the present invention; -
FIG. 18 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the thirteenth embodiment of the present invention; and -
FIG. 19 is a cross-sectional view of the semiconductor device for fingerprint recognition according to the fourteenth embodiment of the present invention. - In the following, embodiments of the present invention are described with reference to the accompanying drawings.
-
FIG. 4 ,FIG. 5 , andFIG. 6 show asemiconductor device 20A for fingerprint recognition (the semiconductor device for fingerprint recognition shall be hereafter called a fingerprint sensor for short) that is the first embodiment of the present invention.FIG. 4 is a cross-sectional view (taken along the A-A line inFIG. 6 ) of thefingerprint sensor 20A,FIG. 5 is a front view of thefingerprint sensor 20A, andFIG. 6 is a bottom plan view of thefingerprint sensor 20A. - The
fingerprint sensor 20A includes asemiconductor chip 22A and asubstrate 23A. Thesemiconductor chip 22A includes asensor unit 26 serving as a fingerprint recognition area that carries out fingerprint recognition, thesensor unit 26 being arranged on acircuit formation side 30 of thesemiconductor chip 22A. - The
semiconductor chip 22A performs fingerprint recognition on the electrostatic-capacity principle as a finger sweeps across thesensor unit 26 in the directions indicated by arrows X inFIG. 6 . Thesemiconductor chip 22A operating on the electrostatic-capacity principle is shorter in the directions indicated by arrows Y, and is longer in the directions of the arrows X, where the directions X and the directions Y are arranged to be orthogonal to each other. Accordingly, thefingerprint sensor 20A of the present invention can be made smaller than other fingerprint recognition devices that are based on optical means. - The
substrate 23A is a so-called glass epoxy substrate. As shown inFIG. 4 , thefingerprint sensor 20A includes aglass epoxy material 32 serving as a core material, wiring layers 34 prepared on both sides of theglass epoxy material 32, and aninsulated layer 33 for protecting the wiring layers 34, which are prepared as thesubstrate 23A. Thewiring layer 34 formed on the upper surface and thewiring layer 34 formed on the undersurface of theglass epoxy material 32 are electrically connected by a throughhole electrode 44. - The
fingerprint sensor 20A further includessolder balls 25 prepared on thesubstrate 23A, which solder balls serve as external connection terminals. According to the present embodiment, thesolder balls 25 are arranged on achip mounting side 35 of thesubstrate 23A. Accordingly, theinsulated layer 33 is removed from positions on thechip mounting side 35 of thesubstrate 23A where thesolder balls 25 are arranged. - Further, the height of the
solder balls 25 measured from the surface of thechip mounting side 35 is set up higher than the height of thesemiconductor chip 22A measured from the surface of thechip mounting side 35. In addition, in another fingerprint sensor specified below wherein thesemiconductor chip 22A is wire-bonded, the height of thesolder balls 25 from thechip mounting side 35 is also set up higher than the height of thesemiconductor chip 22A from thechip mounting side 35. - Furthermore, an
opening 29 is beforehand formed in thesubstrate 23A. Theopening 29 is formed such that theopening 29 penetrates thesubstrate 23A, and the form and size (area) are made to correspond to thesensor unit 26 formed in thesemiconductor chip 22A. - The
semiconductor chip 22A is arranged on thesubstrate 23A by flip chip bonding. A specific process for carrying out the flip chip bonding of thesemiconductor chip 22A to thesubstrate 23A is as follows. On thechip mounting side 35 of thesubstrate 23A, a resin sheet that serves as an under-fill material 38 is beforehand arranged. The resin sheet to serve as the under-fill material 38 is arranged such that the resin sheet surrounds the formation position of theopening 29. - Further, stud bumps 37 are beforehand formed on the
circuit formation side 30 of thesemiconductor chip 22A. The stud bumps 37 are formed with metal, such as gold, and are formed at predetermined positions on thecircuit formation side 30 using wire-bonding technology. - When the
semiconductor chip 22A is mounted on thesubstrate 23A, heat is applied at a temperature at which the resin sheet to serve as the under-fill material 38 becomes soft, and demonstrates adhesive strength. Then, positioning is carried out such that thesensor unit 26 of thesemiconductor chip 22A and theopening 29 ofsubstrate 23A are in agreement, and flip chip bonding of thesemiconductor chip 22A on thesubstrate 23A is carried out. - In this manner, the stud bumps 37 are electrically connected to the wiring layers 34, and, therefore, the
semiconductor chip 22A is electrically connected to thesubstrate 23A. Here, since the under-fill material 38 protects the bonding of thewiring layer 34 and the stud bumps 37, the electric connection between thesemiconductor chip 22A and thesubstrate 23A is reliably obtained. Further, the under-fill material 38 bonds thesemiconductor chip 22A and thesubstrate 23A, i.e., thesemiconductor chip 22A and thesubstrate 23A are mechanically joined by the under-fill material 38. - Further, although the resin sheet to serve as the under-
fill material 38 is heated when thesemiconductor chip 22A is joined to thesubstrate 23A, as described above, the heating temperature is such that the under-fill material 38 softens and demonstrates adhesive strength, but is not high enough to cause fusing of the under-fill material 38. Accordingly, the resin flash does not occur, i.e., the resin sheet is prevented from being melted, and from running onto thesensor unit 26. - Where the
semiconductor chip 22A is mounted on thesubstrate 23A as mentioned above, thesensor unit 26 of thesemiconductor chip 22A is exposed through theopening 29 formed in thesubstrate 23A, as shown inFIG. 4 andFIG. 6 . Accordingly, fingerprint recognition is performed by a finger sweeping across thesensor unit 26 through theopening 29. - According to the
fingerprint sensor 20A of the present embodiment, theopening 29 is beforehand formed in thesubstrate 23A at the position corresponding to thesensor unit 26, and thesemiconductor chip 22A is flip chip bonded to thesubstrate 23A such that thesensor unit 26 corresponds to theopening 29. In this manner, thefingerprint sensor 20A of the present embodiment does not use the sealing resin 4 (refer to FIG. I throughFIG. 3 ) that is conventionally used, and the resin flash, i.e., the sealing resin flowing into thesensor unit 26 of thesemiconductor chip 22A is completely prevented from occurring. - Further, according to the present embodiment, a wire is not used for the electrical connection between the
semiconductor chip 22A and thesubstrate 23A. For this reason, it is not necessary to provide a wiring space in thefingerprint sensor 20A, and, therefore, thefingerprint sensor 20A is made thin. - Next, the second embodiment of the present invention is explained.
-
FIG. 7 is a cross-sectional view showing afingerprint sensor 20B that is the second embodiment of the present invention. Here inFIG. 7 , the same label is attached to the same component as in the configuration shown inFIG. 4 andFIG. 6 , and the explanation thereof is not repeated. - While the
fingerprint sensor 20A of the first embodiment uses a glass epoxy substrate for thesubstrate 23A that mounts thesemiconductor chip 22A, thefingerprint sensor 20B according to the second embodiment is characterized by using apolyimide tape 39 as the base material for asubstrate 23B for mounting thesemiconductor chip 22A. - The
wiring layer 34 of a predetermined pattern is formed on thechip mounting side 35 of thesubstrate 23B. At an electrode section of thewiring layer 34, the stud bumps 37 of thesemiconductor chip 22A are flip chip bonded. Further, theopening 29 is formed in thesubstrate 23B, and thesemiconductor chip 22A is mounted on thesubstrate 23B such that thesensor unit 26 corresponds to theopening 29. - As described above, the
substrate 23B of the present embodiment is formed by thepolyimide tape 39 serving as the base material, and, therefore, can be made thinner than thesubstrate 23A that employs the glass epoxy substrate. Accordingly, thefingerprint sensor 20B of the present embodiment can be made thin by using thesubstrate 23B of thepolyimide tape 39 as the base material for mounting thesemiconductor chip 22A. - Next, the third embodiment of the present invention is explained.
-
FIG. 8 is a cross-sectional view showing afingerprint sensor 20C according to the third embodiment of the present invention. InFIG. 8 , the same label is attached to the same component as in the configuration shown inFIG. 4 andFIG. 6 , and the explanation thereof is not repeated. - In the case of the
fingerprint sensor 20A of the first embodiment, thesemiconductor chip 22A is flip chip bonded to thesubstrate 23A using the stud bumps 37. Conversely, thefingerprint sensor 20C according to the present embodiment usesgolden wires 27 for the electric connection between thesemiconductor chip 22A and thesubstrate 23C. Further, in the present embodiment, in order to protect thegolden wires 27, a sealingresin 24 is provided. - The
opening 29 is also formed in thesubstrate 23C of the present embodiment, and thesemiconductor chip 22A is mounted on thesubstrate 23C such that thesensor unit 26 corresponds to theopening 29. According to the present embodiment, mechanical bonding of thesemiconductor chip 22A to thesubstrate 23C is performed using an adhesive 41. - According to the present embodiment, the
golden wires 27 of thesemiconductor chip 22A are bonded on thecircuit formation side 30, and thecircuit formation side 30 is adhesively fixed to thechip mounting side 35 of thesubstrate 23C. For this reason, openings forwire 40 are formed in thesubstrate 23C, in addition to theopening 29. The openings forwire 40 are prepared in the positions that correspond to the bonding positions of thegolden wires 27 of thesemiconductor chip 22A. - Accordingly, one end of each
golden wire 27 is connected to the predetermined bonding position of thecircuit formation side 30 of thesemiconductor chip 22A, and the other end is connected to thewiring layer 34 that is formed on anopposite side 36 of thesubstrate 23C (i.e., the side of thesubstrate 23C opposite to thechip mounting side 35 that mounts thesemiconductor chip 22A), thegolden wire 27 passing through the opening forwire 40. - Further, in order to protect the
golden wires 27, the sealingresin 24 is formed on theopposite side 36 of thesubstrate 23C. The sealingresin 24 is formed such that theopposite side 36 of thesubstrate 23C is covered except for the formation position of theopening 29. Further, the sealingresin 24 is also formed in the openings forwire 40, protecting thegolden wires 27. - The sealing
resin 24 is formed by using a molding metal (not shown; refer toFIG. 2 ). When the sealingresin 24 is formed, a spacer 56 (indicated by a chain line inFIG. 8 ) is prepared between the molding metal and thesubstrate 23C for forming the opening 29 (i.e., such that the sealingresin 24 is not formed where theopening 29 is formed). With theconventional fingerprint sensor 1, thespacer 11 directly contacts thesensor unit 6 of thesemiconductor chip 2 as explained in reference toFIG. 2 . For this reason, damage can occur to thesemiconductor chip 2 and thesensor unit 6. - On the other hand, according to the present embodiment, the
spacer 56 used when forming the sealingresin 24 contacts theopposite side 36 of thesubstrate 23C. Thus, since thespacer 56 contacts thesubstrate 23C instead of thesensor unit 26, damage does not occur to thesemiconductor chip 22A and thesensor unit 26 when forming the sealingresin 24, and it raises the reliability of thefingerprint sensor 20C. - In the case that a resin leak occurs from the contact section with the
spacer 56, the resin flash is generated on theopposite side 36 of thesubstrate 23C, and thesensor unit 26 is not influenced; therefore, proper operations of thesemiconductor chip 22A are obtained, and the reliability of thefingerprint sensor 20C is raised. - Further, although the
golden wire 27 is used in the present embodiment, thegolden wire 27 electrically connects thesemiconductor chip 22A and thesubstrate 23C through the opening forwire 40 formed in thesubstrate 23A. That is, a part of the height of the wire loop is included in the thickness of thesubstrate 23C. Accordingly, thefingerprint sensor 20C can be made thinner than the conventional fingerprint sensor I (refer toFIG. 1 ). - Next, the fourth embodiment of the present invention is explained.
-
FIG. 9 is a cross-sectional view showing afingerprint sensor 20D that is the fourth embodiment of the present invention. Here inFIG. 9 , the same label is attached to the same component as in the configuration shown inFIG. 4 ,FIG. 7 , andFIG. 8 , and the explanation thereof is not repeated. - The
fingerprint sensor 20D according to the present embodiment is differentiated from thefingerprint sensor 20C of the third embodiment that is shown byFIG. 8 in that thepolyimide tape 39 is used as the base material of asubstrate 23D for mounting thesemiconductor chip 22A. - As for the
substrate 23D, theopening 29 and the openings forwire 40 are formed. Thesemiconductor chip 22A is adhesively fixed to thechip mounting side 35 of thesubstrate 23D by the adhesive 41. - Further, the
semiconductor chip 22A and thesubstrate 23D are electrically connected by thegolden wires 27. Thegolden wires 27 that electrically connect thesemiconductor chip 22A and thesubstrate 23D are prepared through the openings forwire 40 formed in thesubstrate 23D. Furthermore, on theopposite side 36 of thesubstrate 23C, the sealingresin 24 for protecting thegolden wires 27 is formed. - As described above, the
substrate 23D made of thepolyimide tape 39 base material is made thinner than thesubstrate 23C that employs the glass epoxy substrate. Accordingly, thefingerprint sensor 20D of the present embodiment is made thin by using thesubstrate 23D of thepolyimide tape 39 base material as the substrate for mounting thesemiconductor chip 22A. - Next, the fifth embodiment of the present invention is explained.
-
FIG. 10 is a cross-sectional view showing afingerprint sensor 20E that is the fifth embodiment of the present invention. Here inFIG. 10 , the same label is attached to the same component as in the configuration shown inFIG. 4 andFIG. 6 , and the explanation thereof is not repeated. - In the first through fourth embodiments descried above, the
semiconductor chip 22A is arranged on thesubstrates 23A through 23D such that thecircuit formation side 30 of thesemiconductor chip 22A faces with thechip mounting side 35 of thesubstrates 23A through 23D, respectively. Conversely, according to the present embodiment, thefingerprint sensor 20E is structured such that thesemiconductor chip 22B is mounted on thesubstrate 23E with abackside 31 that is not the circuit formation side of thesemiconductor chip 22B facing thechip mounting side 35 of thesubstrate 23E. - Accordingly, the
circuit formation side 30 and thesensor unit 26 of thesemiconductor chip 22B of thefingerprint sensor 20E of the present embodiment face outside (upward inFIG. 10 ). For this reason, in order to electrically connect thesubstrate 23E to electronic circuitry and thesensor unit 26 that are formed on thecircuit formation side 30, penetration vias 43 are formed in thesemiconductor chip 22B according to the present embodiment. - Each penetration via 43 is formed by a conductive metal provided to a hole that vertically penetrates the
semiconductor chip 22B. In this manner, the penetration via 43 functions as wiring that electrically connects thecircuit formation side 30 and thebackside 31 of thesemiconductor chip 22B. An upper end of the penetration via 43 is connected to thesensor unit 26 and the electronic circuitry formed on thecircuit formation side 30, and asolder bump 42 is arranged at a lower end of the penetration via 43. - The
semiconductor chip 22B as described above is mounted on thesubstrate 23E by bonding thesolder bump 42 and thewiring layer 34 formed on thesubstrate 23E. Further, the under-fill material 38 is arranged between thesemiconductor chip 22B and thesubstrate 23E so that the mechanical bonding nature of thesemiconductor chip 22B and thesubstrate 23E is enhanced, and the bonding positions of thepenetration vias 43 and thewiring layer 34 are protected. As described above, according to the present embodiment, since thesensor unit 26 faces outside, an opening, such as theopening 29 in other embodiments, is not formed in thesubstrate 23E. - According to the
fingerprint sensor 20E of the present embodiment, thesensor unit 26 faces outside, and the electrical connection between thesemiconductor chip 22B and thesubstrate 23E is performed using thepenetration vias 43. That is, according to the present embodiment wherein thesensor unit 26 faces outside, thesemiconductor chip 22B and thesubstrate 23E are electrically connected without using a wire such as thegolden wire 7 of the fingerprint sensor 1 (referring toFIG. 1 ). Since thegolden wire 7 is not used, there is no need to form the sealingresin 4 for protecting thegolden wire 7. - Accordingly, the
fingerprint sensor 20E is made flat with no components, such as sealing resin, being provided on thecircuit formation side 30 on which thesensor unit 26 is formed. That is, since there is nothing that hits a finger when sweeping thesensor unit 26, usability is raised. Further, since the sealing resin is not used, resin flash is not a concern, and thefingerprint sensor 20E is made thin. - In the following, the sixth embodiment of the present invention is explained.
-
FIG. 11 is a cross-sectional view showing afingerprint sensor 20F that is the sixth embodiment of the present invention. Here inFIG. 11 , the same label is attached to the same component as in the configuration shown inFIG. 4 ,FIG. 7 , andFIG. 10 , and the explanation thereof is not repeated. - The
fingerprint sensor 20F of the present embodiment is the same as thefingerprint sensor 20E of the fifth embodiment shown inFIG. 10 , except that thepolyimide tape 39 is used as the base material of asubstrate 23F for mounting thesemiconductor chip 22B. - The
substrate 23F using thepolyimide tape 39 as the base material is made thin compared with thesubstrate 23E that is a glass epoxy substrate. Accordingly, thefingerprint sensor 20F is made thin by using thesubstrate 23F that uses thepolyimide tape 39 as the base material for mounting thesemiconductor chip 22B. - Next, the seventh through the twelfth embodiments of the present invention are explained.
- FIGS. 12 through
FIG. 17 are cross-sectional views showingfingerprint sensors 20G through 20L, respectively, that are the seventh through the twelfth embodiments, respectively, of the present invention. Here inFIG. 12 throughFIG. 17 , the same label is attached to the same component as in the configuration shown inFIG. 4 throughFIG. 11 , and the explanation thereof is not repeated. - The
fingerprint sensors 20G through 20L that are the seventh through the twelfth embodiments, respectively, are the same as thefingerprint sensors 20A through 20F, respectively, of the first through the sixth embodiments, respectively, except thatflexible substrates 45A through 45F, respectively, are used as the substrate for mounting thesemiconductor chips flexible substrates 45A through 45F are structured with aninsulated resin tape 46 that consists of a resin, such as polyimide, on which a printedcircuit 47 of a predetermined pattern is provided. - The structure of the
fingerprint sensors 20G through 20J shown inFIG. 12 throughFIG. 15 , respectively, are such that thesensor unit 26 of thesemiconductor chip 22A faces theflexible substrates 45A through 45D, respectively. Accordingly, theopening 29 is formed in theflexible substrates 45A through 45D such that thesensor unit 26 is accessible. - Further, as for the
fingerprint sensors FIG. 12 andFIG. 13 , respectively, thesemiconductor chip 22A is flip chip bonded at theflexible substrates stud bump 37. On the other hand, as for thefingerprint sensors 20I and 20J of the ninth and the tenth embodiments, respectively, shown inFIG. 14 andFIG. 15 , respectively, thesemiconductor chip 22A is flip chip bonded at theflexible substrates golden wire 27. Accordingly, the sealingresin 24 is formed in thefingerprint sensors golden wire 27. - Further, in the cases of the
fingerprint sensors FIG. 16 andFIG. 17 , respectively, thesemiconductor chip 22B is mounted on theflexible substrates sensor unit 26 facing outside, i.e., upward in the respective drawings. For this reason, thesemiconductor chip 22B is connected to theflexible substrates - As for the
fingerprint sensors FIG. 12 ,FIG. 14 , andFIG. 16 , respectively, thesolder balls 25 arranged on theflexible substrates solder balls 25 are connected to the printedcircuit 47 by throughholes 49 formed in theinsulated resin tape 46. - As for the
fingerprint sensors FIG. 13 ,FIG. 15 , andFIG. 17 , respectively, aconnector section 48 is arranged on theflexible substrates connector section 48 is formed in the right end section in each view of theflexible substrates FIG. 13 ,FIG. 15 , andFIG. 17 , a plan view of theconnector section 48 is shown. - As mentioned above, since the
flexible substrates 45A through 45F that can be bent are used as the substrate for mounting thesemiconductor chips fingerprint sensors 20G through 20L, respectively, can be shaped as required by an electronic apparatus that is equipped with thefingerprint sensors 20G through 20L. - In this manner, the mounting nature of the
fingerprint sensors 20G through 20L to electronic apparatuses is improved. Further, since thesolder balls 25 and theconnector section 48 that are generally and economically available are used as the external connection terminal, even when theflexible substrates 45A through 45F are used as the substrate for mounting thesemiconductor chips flexible substrates 45A through 45F are economically realized. - Next, the thirteenth embodiment of the present invention is explained.
-
FIG. 18 is a cross-sectional view showing afingerprint sensor 20M that is the thirteenth embodiment of the present invention. Here inFIG. 18 , the same label is attached to the same component as in the configuration shown inFIG. 4 andFIG. 6 , and the explanation thereof is not repeated. - The
fingerprint sensor 20M according to the present embodiment is characterized by using a TAB (Tape Automated Bonding)tape 50 as the substrate for mounting thesemiconductor chip 22A. - The
TAB tape 50 includes apolyimide tape 51 that has theopening 29 at the central position, and awiring 52 formed on thepolyimide tape 51. Further, a part of thewiring 52 extends into theopening 29 as aconnection terminal 53, and thesolder bump 42 of thesemiconductor chip 22A is flip chip bonded to theconnection terminal 53. - Since the
TAB tape 50 allows thewiring 52 being densely formed, the number of terminals of thesemiconductor chip 22A can be increased. That is, according to the present embodiment, the number of the solder bumps 42 can be increased by using theTAB tape 50 as the substrate for mounting thesemiconductor chip 22A. - Next, the fourteenth embodiment of the present invention is explained.
-
FIG. 19 is a cross-sectional view showing afingerprint sensor 20N that is the fourteenth embodiment of the present invention. Here inFIG. 19 , the same label is attached to the same component as in the configuration shown inFIG. 4 orFIG. 6 , and the explanation thereof is not repeated. - The structure of the
fingerprint sensor 20N of the present embodiment is the so-called CSP (Chip Size Package) structure. The penetration via 43 is prepared in thesemiconductor chip 22B. Thesensor unit 26 and the electronic circuitry formed on thecircuit formation side 30 are connected to are-wiring layer 54 formed on thebackside 31 of thesemiconductor chip 22B by the penetration via 43. Thesolder balls 25 used as the external connection terminals are arranged at there-wiring layer 54. - According to the
fingerprint sensor 20N of the present embodiment, unlike the embodiments described above, a substrate is not used as the interposer for providing the electrical connection between thesensor unit 26 and thesolder balls 25, but the penetration vias 43 are prepared in thesemiconductor chip 22B, and there-wiring layer 54 is formed on thebackside 31 of thesemiconductor chip 22B for providing the electrical connection between thesensor unit 26 and thesolder balls 25. - In this manner, the
fingerprint sensor 20N can be made in almost the same size as thesemiconductor chip 22B, helping miniaturization of electronic apparatuses. Further, thefingerprint sensor 20N can be manufactured on the wafer level, improving the productivity and realizing cost reduction. - As described above, according to the present invention, various effects are realized such as described below.
- Since the first mode of the present invention does not require a sealing resin that is conventionally used, the resin flash (the sealing resin flowing into the fingerprint recognition area of the semiconductor chip) is not a concern. Even though the sealing resin is not used, satisfactory reliability of the semiconductor device for fingerprint recognition is obtained. Furthermore, since a wire is not used, it is not necessary to secure a space for forming a wire loop, and the semiconductor device for fingerprint recognition can be made thin.
- Further, according to the second mode of the present invention, although sealing resin is employed, the sealing resin is prepared in the opposite side of the substrate, therefore, the sealing resin does not run into the semiconductor chip, and, accordingly, the sealing resin does not flow into the fingerprint recognition area. Further, since a part of the height of the wire loop is overlapped by the thickness of the substrate, even if a wire is used, the semiconductor device for fingerprint recognition according to the present invention can be made thin compared with conventional products.
- Further, according to the third mode of the present invention, the fingerprint recognition area formation side of the semiconductor device for fingerprint recognition becomes flat, which enhances the usability when performing fingerprint recognition. Further, since sealing resin is not used, resin flash is not a concern.
- Further, according to the present invention, various kinds of substrate materials can be used as the substrate.
- Further, as an external connection terminal prepared on the substrate, a solder ball and a connector that are generally and economically available are used according to the present invention.
- Further, according to the present invention, the semiconductor device for fingerprint recognition can be made almost as thin and small as the semiconductor chip.
- Further, since fingerprint recognition according to the present invention is performed based on the electrostatic-capacity principle, and not optically, the semiconductor device for fingerprint recognition can be miniaturized.
- Further, the present invention is not limited to these embodiments, but various variations and modifications may be made without departing from the scope of the present invention.
- The present application is based on Japanese priority application No. 2003-097095 filed on Mar. 31, 2003 with the Japanese Patent Office, the entire contents of that are hereby incorporated by reference.
Claims (3)
1. A semiconductor device for fingerprint recognition, comprising:
a semiconductor chip having a fingerprint recognition area for performing fingerprint recognition,
a substrate having a first opening that corresponds to said fingerprint recognition area, and a second opening, said semiconductor chip being installed on said substrate such that said fingerprint recognition area corresponds to said first opening, and said semiconductor chip and said substrate being electrically connected by a wire that is put through said second opening, and
a sealing resin for protecting said semiconductor chip and said substrate, said sealing resin being provided on a first surface that is opposite to a second surface on which second surface said semiconductor chip is installed, said first surface and said second surface being of said substrate.
2. A semiconductor device for fingerprint recognition, comprising:
a semiconductor chip having a fingerprint recognition area for performing fingerprint recognition, and having a penetration via, said fingerprint recognition area being prepared on a first surface of said semiconductor chip,
a substrate for mounting said semiconductor chip, wherein said semiconductor chip is flip chip bonded to said substrate with a second surface facing said substrate, said second surface being opposite to said first surface, and
an under-fill material provided between said semiconductor chip and said substrate.
3. A semiconductor device for fingerprint recognition, comprising:
a semiconductor chip having a fingerprint recognition area for performing fingerprint recognition, and a penetration via, said fingerprint recognition area being prepared on a first surface of said semiconductor chip,
a re-wiring that is formed on a second surface of said semiconductor chip, said second surface being opposite to said first surface, wherein said re-wiring is electrically connected to said fingerprint recognition area by said penetration via, and
an insulation layer for covering said second surface except for a position where an external connection terminal of said re-wiring is present.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US11/330,293 US20060108686A1 (en) | 2003-03-31 | 2006-01-12 | Semiconductor device for fingerprint recognition |
US12/382,532 US7989938B2 (en) | 2003-03-31 | 2009-03-18 | Semiconductor device for fingerprint recognition |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003097095A JP4160851B2 (en) | 2003-03-31 | 2003-03-31 | Semiconductor device for fingerprint recognition |
JP2003-097095 | 2003-03-31 | ||
US10/765,999 US7015579B2 (en) | 2003-03-31 | 2004-01-29 | Semiconductor device for fingerprint recognition |
US11/330,293 US20060108686A1 (en) | 2003-03-31 | 2006-01-12 | Semiconductor device for fingerprint recognition |
Related Parent Applications (1)
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US10/765,999 Division US7015579B2 (en) | 2003-03-31 | 2004-01-29 | Semiconductor device for fingerprint recognition |
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Application Number | Title | Priority Date | Filing Date |
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US12/382,532 Division US7989938B2 (en) | 2003-03-31 | 2009-03-18 | Semiconductor device for fingerprint recognition |
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US20060108686A1 true US20060108686A1 (en) | 2006-05-25 |
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Application Number | Title | Priority Date | Filing Date |
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US10/765,999 Expired - Lifetime US7015579B2 (en) | 2003-03-31 | 2004-01-29 | Semiconductor device for fingerprint recognition |
US11/330,293 Abandoned US20060108686A1 (en) | 2003-03-31 | 2006-01-12 | Semiconductor device for fingerprint recognition |
US12/382,532 Expired - Fee Related US7989938B2 (en) | 2003-03-31 | 2009-03-18 | Semiconductor device for fingerprint recognition |
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US10/765,999 Expired - Lifetime US7015579B2 (en) | 2003-03-31 | 2004-01-29 | Semiconductor device for fingerprint recognition |
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US12/382,532 Expired - Fee Related US7989938B2 (en) | 2003-03-31 | 2009-03-18 | Semiconductor device for fingerprint recognition |
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US (3) | US7015579B2 (en) |
JP (1) | JP4160851B2 (en) |
KR (1) | KR100946074B1 (en) |
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Also Published As
Publication number | Publication date |
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JP4160851B2 (en) | 2008-10-08 |
KR100946074B1 (en) | 2010-03-10 |
US20040188838A1 (en) | 2004-09-30 |
US7989938B2 (en) | 2011-08-02 |
CN1533741A (en) | 2004-10-06 |
CN1828880A (en) | 2006-09-06 |
CN1259024C (en) | 2006-06-14 |
US7015579B2 (en) | 2006-03-21 |
JP2004304054A (en) | 2004-10-28 |
KR20040086160A (en) | 2004-10-08 |
US20090184408A1 (en) | 2009-07-23 |
CN100413068C (en) | 2008-08-20 |
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