US20060201655A1 - Heat pipe suitable for application in electronic device with limited mounting space - Google Patents

Heat pipe suitable for application in electronic device with limited mounting space Download PDF

Info

Publication number
US20060201655A1
US20060201655A1 US11/164,325 US16432505A US2006201655A1 US 20060201655 A1 US20060201655 A1 US 20060201655A1 US 16432505 A US16432505 A US 16432505A US 2006201655 A1 US2006201655 A1 US 2006201655A1
Authority
US
United States
Prior art keywords
tube
heat pipe
cutout
casing
wick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/164,325
Inventor
Chu-Wan Hong
Chang-Ting Lo
Jung-Yuan Wu
Ching-Tai Cheng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to FOXCONN TECHNOLOGY CO.,LTD. reassignment FOXCONN TECHNOLOGY CO.,LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, CHING-TAI, HONG, CHU-WAN, LO, CHANG-TING, WU, JUNG-YUAN
Publication of US20060201655A1 publication Critical patent/US20060201655A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/003Multiple wall conduits, e.g. for leak detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates generally to an apparatus for transfer or dissipation of heat from heat-generating components such as electronic components, and more particularly to a heat pipe that is suitable for use in electronic devices that have a limited mounting space, such as notebook computers.
  • Heat pipes have excellent heat transfer performance due to their low thermal resistance, and therefore are an effective means for transfer or dissipation of heat from heat sources.
  • heat pipes are widely used for removing heat from heat-generating components such as central processing units (CPUs) of computers.
  • a heat pipe is usually a vacuum casing containing therein a working fluid, which is employed to carry, under phase transitions between liquid state and vapor state, thermal energy from one section of the heat pipe (typically referring to as “evaporating section”) to another section thereof (typically referring to as “condensing section”).
  • a wick structure is provided inside the heat pipe, lining an inner wall of the casing, for drawing the working fluid back to the evaporating section after it is condensed at the condensing section.
  • the working fluid contained at the evaporating section absorbs heat generated by the heat-generating component and then turns into vapor. Due to the difference of vapor pressure between the two sections of the heat pipe, the generated vapor moves towards and carries the heat simultaneously to the condensing section where the vapor is condensed into liquid after releasing the heat into ambient environment by, for example, fins thermally contacting the condensing section. Due to the difference of capillary pressure developed by the wick structure between the two sections, the condensed liquid is then drawn back by the wick structure to the evaporating section where it is again available for evaporation.
  • the wick structure currently available for the heat pipe includes fine grooves integrally formed at the inner wall of the casing, screen mesh or bundles of fiber inserted into the casing and held against the inner wall thereof, or sintered powder combined to the inner wall of the casing by sintering process.
  • the screen mesh wick its manufacture generally involves weaving together a plurality of pliable wires or threads such as metal wires or synthetic fibers. In this sense, the screen mesh wick is formed separately and is then inserted into the casing of the heat pipe.
  • wick structure In the heat pipe, except the function to generate capillary force for drawing the condensed liquid back to the evaporating section of the heat pipe, another function of the wick structure is to provide a heat transfer path between the casing of the heat pipe and the working fluid that is contained in the casing and saturated in the wick structure. Therefore, whether the wick is maintained into intimate contact with the casing will have a great impact on the heat transfer effect of the heat pipe.
  • the screen mesh wick is made separately, in many cases a gap will exist between the screen mesh wick and the casing of the heat pipe after the screen mesh wick is inserted into the heat pipe. In order to hold the screen mesh wick against and ultimately into close contact with the casing of the heat pipe, retaining means are often used.
  • a helical spring or a round tube will generally serve this purpose.
  • the helical spring is not satisfactory in holding the screen mesh wick against the casing of heat pipe since it generally cannot apply a uniform force on the wick for pressing it against the casing due to a limited contact area between the spring and the wick.
  • a heat pipe is required to be bent into a curved one or pressed into a flattened one in order to be applicable in electronic devices that have very limited mounting space, for example, in some portable electronic devices such as notebook computers.
  • the round tube could provide a more uniform pressing force for the wick in comparison to the helical spring, the tube generally is made of rigid material such as metals and therefore adds difficulty to the bending or flattening work, since the rigidity of the tube has to be overcome in order to bend or flatten the heat pipe.
  • a heat pipe in accordance with one embodiment of the present invention includes a casing, a tube located inside the casing and a screen mesh wick located between the casing and the tube.
  • the tube defines therein a plurality of through holes and at least one cutout.
  • the wick is held against the casing by the tube. Under the support of the tube, the wick as a whole engages closely an inner surface of the casing, thereby establishing an effective heat transfer path between the casing and a working fluid that is saturated in the wick.
  • the heat pipe incorporating such tube is easily to be bent or flattened so as to enable the heat pipe to be applicable in electronic devices with limited mounting space for cooling device, such as notebook computers.
  • FIG. 1 is a longitudinal cross-sectional view of a heat pipe in accordance with a first embodiment of the present invention
  • FIG. 2 is an isometric view of the heat pipe of FIG. 1 , showing various parts thereof in the assembly process;
  • FIG. 3 is a side elevation view of a tube suitable for the heat pipe of FIG. 1 , according to a second embodiment of the present invention
  • FIG. 4 is a side elevation view of a tube suitable for the heat pipe of FIG. 1 , according to a third embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of the tube of FIG. 4 , taken along line V-V thereof.
  • FIG. 1 illustrates a heat pipe 10 in accordance with one embodiment of the present invention.
  • the heat pipe 10 includes a casing 12 , a tube 14 inserted into the casing 12 and a capillary wick 16 located between the casing 12 and the tube 14 .
  • the wick 16 is held by the tube 14 to engage closely an inner surface of the casing 12 .
  • the casing 12 is typically made of high thermally conductive materials such as copper or copper alloys. Although the casing 12 as illustrated is in a round shape, it should be recognized that other shapes, such as rectangle or the like, may also be suitable.
  • the wick 16 is a screen mesh wick having a porous structure and is saturated with a working fluid (not shown), which acts as a heat carrier for carry thermal energy inside the heat pipe 10 when undergoing a phase transition from liquid state to vaporous state.
  • the working fluid is usually selected from liquids such as water or alcohol and is compatible with the wick 16 , the tube 14 and the casing 12 .
  • the screen mesh wick 16 is typically made independently of the casing 12 by weaving together a plurality of flexible wires or threads such as metal wires or synthetic fibers. Then the wick 16 is rolled and inserted into the casing 12 .
  • the tube 14 is capable of applying a uniform pressing force on the wick 16 in order to maintain the wick 16 as a whole into close contact with the casing 12 , thus providing an effective heat transfer path between the casing 12 and the working fluid saturated in the wick 16 .
  • the tube 14 defines therein a plurality of through holes 142 through its inner and outer surfaces thereof. These through holes 142 are round in shape, although other shapes such as rectangle or triangle or the like may also be suitable. In addition, the through holes 142 may be arranged at the tube 14 regularly or irregularly.
  • the design of the through holes 142 is to enable a communication of the working fluid between the wick 16 and a hollow vapor channel (not labeled) defined in the casing 12 and the tube 14 .
  • the working fluid contained in the wick 16 receives heat from a heat source in thermal connection with an evaporating section (not labeled) of the heat pipe 10 and turns into vapor
  • the vapor goes into the vapor channel defined by the casing 12 via the through holes 142 and then moves, through the vapor channel, toward a condensing section (not labeled) of the heat pipe 10 where the vapor releases its heat and turns into liquid.
  • the condensed liquid returns from the vapor channel into the wick 16 again via the through holes 142 .
  • the through holes 142 preferably, account for about 70 percents of a total surface area of the tube 14 so as to enable the vapor to go into the vapor channel and the liquid to return back the wick 16 smoothly. In this situation, however, the tube 14 is still capable of providing enough support for the wick 16 .
  • the tube 14 defines therein a cutout 144 along a circumferential direction thereof.
  • the cutout 144 is elongated.
  • the cutout 144 extends through a large portion of a circumferential periphery of the tube 14 , but does not cut the tube 14 into two pieces. Due to the existence of the cutout 144 , the heat pipe 10 is easily to be bent into a curved configuration from the location where the cutout 144 is located, without the necessity of overcoming the rigidity of the tube 14 especially if the tube 14 is made of rigid material such as metals.
  • the cutout 144 forms a right angle with respect to an axis (not labeled) of tube 14
  • the cutout 144 may also be defined slantwise in the tube 14 and in doing so, an acute angle is formed between the cutout 144 thus defined and the axis of the tube 14 .
  • the tube 14 may be made of metals such as copper or aluminum, and in order to reduce the rigidity of the tube 14 , organic material such as polyethylene, polycarbonate, polyamide, or the like may also be suitable for the tube 14 .
  • the wick 16 which is typically made by weaving technology is firstly wrapped around on the tube 14 .
  • the tube 14 may be manufactured by pressing or forging or injection molding to form firstly a flat plate with the through holes 142 formed therein and then rolling the flat plate into the tube 14 . Then, the tube 14 , together with the wick 16 wrapped therearound, is inserted into the casing 12 after the casing 12 is heated to expand with a required extent. As the casing 12 is cooled down to its original size, the wick 16 is thereby tightly and evenly held against the inner surface of the casing 12 under the support of the tube 14 .
  • FIG. 3 illustrates a tube 14 a according to a second embodiment of the present invention.
  • the tube 14 a is divided into two separate pieces by an elongated cutout 145 transversely cutting through the tube 14 a.
  • FIGS. 4-5 illustrate a tube 14 b according to a third embodiment of the present invention.
  • the tube 14 b defines therein a pair of opposite elongate cutouts 146 along a longitudinal direction thereof.
  • Each cutout 146 has two sections (not labeled) extending from opposite ends of the tube 14 b till a middle thereof. The two sections do not communicate with each other.
  • this tube 14 b is typically suitable for use in heat pipes that need to be pressed into flattened configurations.
  • each of the tubes is capable of providing a uniform pressing force against the wick of the heat pipe so as to maintain the wick into intimate contact with the casing of the heat pipe, thereby establishing an effective heat transfer path between the casing and the working fluid saturated in the wick.
  • the heat pipes incorporating such tubes are easier to be bent or flattened in order to be applicable in modern electronic devices having a limited mounting space for a cooling device.

Abstract

A mesh-type heat pipe (10) includes a casing (12), a tube (14) located inside the casing and a screen mesh wick (16) located between the casing and the tube. The tube defines therein a plurality of through holes (142) and at least one cutout (144). The wick is held against the casing by the tube. Under the support of the tube, the wick as a whole engages closely an inner surface of the casing, thereby establishing an effective heat transfer path between the casing and a working fluid that is saturated in the wick. Meanwhile, with the cutout in the tube presented, the heat pipe incorporating such tube is easily to be bent or flattened so as to enable the heat pipe to be applicable in electronic devices with a limited mounting space for a cooling device, such as notebook computers.

Description

    FIELD OF THE INVENTION
  • The present invention relates generally to an apparatus for transfer or dissipation of heat from heat-generating components such as electronic components, and more particularly to a heat pipe that is suitable for use in electronic devices that have a limited mounting space, such as notebook computers.
  • DESCRIPTION OF RELATED ART
  • Heat pipes have excellent heat transfer performance due to their low thermal resistance, and therefore are an effective means for transfer or dissipation of heat from heat sources. Currently, heat pipes are widely used for removing heat from heat-generating components such as central processing units (CPUs) of computers. A heat pipe is usually a vacuum casing containing therein a working fluid, which is employed to carry, under phase transitions between liquid state and vapor state, thermal energy from one section of the heat pipe (typically referring to as “evaporating section”) to another section thereof (typically referring to as “condensing section”). Preferably, a wick structure is provided inside the heat pipe, lining an inner wall of the casing, for drawing the working fluid back to the evaporating section after it is condensed at the condensing section. Specifically, as the evaporating section of the heat pipe is maintained in thermal contact with a heat-generating component, the working fluid contained at the evaporating section absorbs heat generated by the heat-generating component and then turns into vapor. Due to the difference of vapor pressure between the two sections of the heat pipe, the generated vapor moves towards and carries the heat simultaneously to the condensing section where the vapor is condensed into liquid after releasing the heat into ambient environment by, for example, fins thermally contacting the condensing section. Due to the difference of capillary pressure developed by the wick structure between the two sections, the condensed liquid is then drawn back by the wick structure to the evaporating section where it is again available for evaporation.
  • The wick structure currently available for the heat pipe includes fine grooves integrally formed at the inner wall of the casing, screen mesh or bundles of fiber inserted into the casing and held against the inner wall thereof, or sintered powder combined to the inner wall of the casing by sintering process. As for the screen mesh wick, its manufacture generally involves weaving together a plurality of pliable wires or threads such as metal wires or synthetic fibers. In this sense, the screen mesh wick is formed separately and is then inserted into the casing of the heat pipe.
  • In the heat pipe, except the function to generate capillary force for drawing the condensed liquid back to the evaporating section of the heat pipe, another function of the wick structure is to provide a heat transfer path between the casing of the heat pipe and the working fluid that is contained in the casing and saturated in the wick structure. Therefore, whether the wick is maintained into intimate contact with the casing will have a great impact on the heat transfer effect of the heat pipe. However, since the screen mesh wick is made separately, in many cases a gap will exist between the screen mesh wick and the casing of the heat pipe after the screen mesh wick is inserted into the heat pipe. In order to hold the screen mesh wick against and ultimately into close contact with the casing of the heat pipe, retaining means are often used. For example, a helical spring or a round tube will generally serve this purpose. The helical spring is not satisfactory in holding the screen mesh wick against the casing of heat pipe since it generally cannot apply a uniform force on the wick for pressing it against the casing due to a limited contact area between the spring and the wick.
  • In many cases, a heat pipe is required to be bent into a curved one or pressed into a flattened one in order to be applicable in electronic devices that have very limited mounting space, for example, in some portable electronic devices such as notebook computers. Although the round tube could provide a more uniform pressing force for the wick in comparison to the helical spring, the tube generally is made of rigid material such as metals and therefore adds difficulty to the bending or flattening work, since the rigidity of the tube has to be overcome in order to bend or flatten the heat pipe.
  • Therefore, it is desirable to provide a retaining means for the screen mesh wick that could apply a uniform pressing force for the wick and meantime make the bending or flattening work to the heat pipe, if necessary, more easier.
  • SUMMARY OF INVENTION
  • A heat pipe in accordance with one embodiment of the present invention includes a casing, a tube located inside the casing and a screen mesh wick located between the casing and the tube. The tube defines therein a plurality of through holes and at least one cutout. The wick is held against the casing by the tube. Under the support of the tube, the wick as a whole engages closely an inner surface of the casing, thereby establishing an effective heat transfer path between the casing and a working fluid that is saturated in the wick. Meanwhile, with the cutout in the tube presented, the heat pipe incorporating such tube is easily to be bent or flattened so as to enable the heat pipe to be applicable in electronic devices with limited mounting space for cooling device, such as notebook computers.
  • Other advantages and novel features of the present invention will become more apparent from the following detailed description of preferred embodiment when taken in conjunction with the accompanying drawings, in which:
  • BRIEF DESCRIPTION OF DRAWINGS
  • FIG. 1 is a longitudinal cross-sectional view of a heat pipe in accordance with a first embodiment of the present invention;
  • FIG. 2 is an isometric view of the heat pipe of FIG. 1, showing various parts thereof in the assembly process;
  • FIG. 3 is a side elevation view of a tube suitable for the heat pipe of FIG. 1, according to a second embodiment of the present invention;
  • FIG. 4 is a side elevation view of a tube suitable for the heat pipe of FIG. 1, according to a third embodiment of the present invention; and
  • FIG. 5 is a cross-sectional view of the tube of FIG. 4, taken along line V-V thereof.
  • DETAILED DESCRIPTION
  • FIG. 1 illustrates a heat pipe 10 in accordance with one embodiment of the present invention. The heat pipe 10 includes a casing 12, a tube 14 inserted into the casing 12 and a capillary wick 16 located between the casing 12 and the tube 14. The wick 16 is held by the tube 14 to engage closely an inner surface of the casing 12. The casing 12 is typically made of high thermally conductive materials such as copper or copper alloys. Although the casing 12 as illustrated is in a round shape, it should be recognized that other shapes, such as rectangle or the like, may also be suitable. The wick 16 is a screen mesh wick having a porous structure and is saturated with a working fluid (not shown), which acts as a heat carrier for carry thermal energy inside the heat pipe 10 when undergoing a phase transition from liquid state to vaporous state. The working fluid is usually selected from liquids such as water or alcohol and is compatible with the wick 16, the tube 14 and the casing 12.
  • The screen mesh wick 16 is typically made independently of the casing 12 by weaving together a plurality of flexible wires or threads such as metal wires or synthetic fibers. Then the wick 16 is rolled and inserted into the casing 12. The tube 14 is capable of applying a uniform pressing force on the wick 16 in order to maintain the wick 16 as a whole into close contact with the casing 12, thus providing an effective heat transfer path between the casing 12 and the working fluid saturated in the wick 16. The tube 14 defines therein a plurality of through holes 142 through its inner and outer surfaces thereof. These through holes 142 are round in shape, although other shapes such as rectangle or triangle or the like may also be suitable. In addition, the through holes 142 may be arranged at the tube 14 regularly or irregularly. The design of the through holes 142 is to enable a communication of the working fluid between the wick 16 and a hollow vapor channel (not labeled) defined in the casing 12 and the tube 14. Specifically, when the working fluid contained in the wick 16 receives heat from a heat source in thermal connection with an evaporating section (not labeled) of the heat pipe 10 and turns into vapor, the vapor goes into the vapor channel defined by the casing 12 via the through holes 142 and then moves, through the vapor channel, toward a condensing section (not labeled) of the heat pipe 10 where the vapor releases its heat and turns into liquid. Then, the condensed liquid returns from the vapor channel into the wick 16 again via the through holes 142. Thereafter, the liquid is drawn back to the evaporating section of the heat pipe 10 via the wick 16 where it is available again for evaporation. The through holes 142, preferably, account for about 70 percents of a total surface area of the tube 14 so as to enable the vapor to go into the vapor channel and the liquid to return back the wick 16 smoothly. In this situation, however, the tube 14 is still capable of providing enough support for the wick 16.
  • In order for the heat pipe 10 to be suitable for use in electronic devices such as notebook computers where the heat pipe 10 is usually required to be in a curved or flattened configuration due to limited mounting space inside these electronic devices, the tube 14 defines therein a cutout 144 along a circumferential direction thereof. The cutout 144 is elongated. The cutout 144 extends through a large portion of a circumferential periphery of the tube 14, but does not cut the tube 14 into two pieces. Due to the existence of the cutout 144, the heat pipe 10 is easily to be bent into a curved configuration from the location where the cutout 144 is located, without the necessity of overcoming the rigidity of the tube 14 especially if the tube 14 is made of rigid material such as metals. Although in this embodiment the cutout 144 forms a right angle with respect to an axis (not labeled) of tube 14, it should be recognized that in some other circumstances the cutout 144 may also be defined slantwise in the tube 14 and in doing so, an acute angle is formed between the cutout 144 thus defined and the axis of the tube 14. It should also be recognized that if the heat pipe 10 is needed to be bent in more than one location, more than one cutout 144 may be formed in the tube 14. The tube 14 may be made of metals such as copper or aluminum, and in order to reduce the rigidity of the tube 14, organic material such as polyethylene, polycarbonate, polyamide, or the like may also be suitable for the tube 14.
  • As shown in FIG. 2, in assembly, the wick 16 which is typically made by weaving technology is firstly wrapped around on the tube 14. The tube 14 may be manufactured by pressing or forging or injection molding to form firstly a flat plate with the through holes 142 formed therein and then rolling the flat plate into the tube 14. Then, the tube 14, together with the wick 16 wrapped therearound, is inserted into the casing 12 after the casing 12 is heated to expand with a required extent. As the casing 12 is cooled down to its original size, the wick 16 is thereby tightly and evenly held against the inner surface of the casing 12 under the support of the tube 14.
  • FIG. 3 illustrates a tube 14 a according to a second embodiment of the present invention. Compared with the above-mentioned first embodiment, the tube 14 a is divided into two separate pieces by an elongated cutout 145 transversely cutting through the tube 14 a.
  • FIGS. 4-5 illustrate a tube 14 b according to a third embodiment of the present invention. The tube 14 b defines therein a pair of opposite elongate cutouts 146 along a longitudinal direction thereof. Each cutout 146 has two sections (not labeled) extending from opposite ends of the tube 14 b till a middle thereof. The two sections do not communicate with each other. In the presence of the cutouts 146, this tube 14 b is typically suitable for use in heat pipes that need to be pressed into flattened configurations.
  • According to the above-mentioned embodiments, each of the tubes is capable of providing a uniform pressing force against the wick of the heat pipe so as to maintain the wick into intimate contact with the casing of the heat pipe, thereby establishing an effective heat transfer path between the casing and the working fluid saturated in the wick. Meanwhile, with the cutouts in the tubes presented, the heat pipes incorporating such tubes are easier to be bent or flattened in order to be applicable in modern electronic devices having a limited mounting space for a cooling device.
  • It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (20)

1. A heat pipe comprising:
a casing;
a tube located inside the casing, the tube defining therein a plurality of through holes and at least one cutout; and
a screen mesh wick located between the casing and the tube and held by the tube against the casing.
2. The heat pipe of claim 1, wherein the at least one cutout extends along one of circumferential and longitudinal directions of the tube.
3. The heat pipe of claim 1, wherein the tube is divided into multiple separate pieces by the at least one cutout.
4. The heat pipe of claim 1, wherein the tube is made of one of organic material and metal material.
5. The heat pipe of claim 1, wherein the through holes account for 70 percent of a total surface area of the tube.
6. The heat pipe of claim 1, wherein the screen mesh wick is made of a plurality of flexible wires by weaving technology.
7. A method for manufacturing a heat pipe comprising steps of:
providing a tube with a plurality of through holes and at least one cutout defined therein;
wrapping a screen mesh wick onto an outer surface of the tube; and
inserting the tube and the wick into a hollow casing.
8. The method of claim 7, wherein the tube and the wick are inserted into said casing after said casing is heated to expand with a required extent.
9. The method of claim 7, wherein the screen mesh wick is made of a plurality of flexible wires by weaving technology.
10. The method of claim 7, wherein the at least one cutout is formed along one of circumferential and longitudinal directions of the tube.
11. The method of claim 7, wherein the tube is made of one of organic material and metal material.
12. A heat pipe for transferring heat from one section to another section thereof, comprising:
a metal casing having an inner surface defining a hollow space therein;
a screen mesh wick contacting the inner surface of the metal casing; and
a tube received in the hollow space and pressing the wick against the inner surface of the metal casing, wherein the tube defines a plurality of holes therethrough and at least one elongated cutout therein.
13. The heat pipe of claim 12, wherein the at least one cutout is defined in the tube along a circumferential direction thereof.
14. The heat pipe of claim 13, wherein the at least one cutout extends all through the tube and divides the tube into two pieces.
15. The heat pipe of claim 13, wherein the least one cutout is perpendicular to an axis of the tube.
16. The heat pipe of claim 13, wherein the at least one cutout is slanted to an axis of the tube.
17. The heat pipe of claim 12, wherein the at least one cutout is defined in the tube along a longitudinal direction thereof.
18. The heat pipe of claim 17, wherein the at least one cutout comprises two sections extending from two opposite ends of the tube toward a middle thereof.
19. The heat pipe claim 17, wherein the tube comprises an additional cutout extending along the longitudinal direction thereof and located opposite the at least one cutout.
20. The heat pipe of claim 19, wherein each of the at least one cutout and the additional cutout comprises two sections extending from two opposite ends of the tube toward a middle thereof.
US11/164,325 2005-03-11 2005-11-18 Heat pipe suitable for application in electronic device with limited mounting space Abandoned US20060201655A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW094107449 2005-03-11
TW094107449A TWI287612B (en) 2005-03-11 2005-03-11 Mesh-type heat pipe and method for manufacturing the same

Publications (1)

Publication Number Publication Date
US20060201655A1 true US20060201655A1 (en) 2006-09-14

Family

ID=36969591

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/164,325 Abandoned US20060201655A1 (en) 2005-03-11 2005-11-18 Heat pipe suitable for application in electronic device with limited mounting space

Country Status (2)

Country Link
US (1) US20060201655A1 (en)
TW (1) TWI287612B (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060262571A1 (en) * 2005-05-18 2006-11-23 Hon Hai Precision Industry Co., Ltd. Backlight module and method for making the same
US20060283574A1 (en) * 2005-06-15 2006-12-21 Top Way Thermal Management Co., Ltd. Thermoduct
US20100163212A1 (en) * 2008-12-26 2010-07-01 Chi-Te Chin Flat loop Heat pipe
US20110088874A1 (en) * 2009-10-20 2011-04-21 Meyer Iv George Anthony Heat pipe with a flexible structure
US20130014919A1 (en) * 2011-07-15 2013-01-17 Foxconn Technology Co., Ltd. Heat pipe
US20130068418A1 (en) * 2011-03-16 2013-03-21 Eric Joseph Gotland System and method for storing seasonal environmental energy
US20160102921A1 (en) * 2012-11-20 2016-04-14 Lockheed Martin Corporation Heat pipe with axial wick

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3789920A (en) * 1970-05-21 1974-02-05 Nasa Heat transfer device
US3857441A (en) * 1970-03-06 1974-12-31 Westinghouse Electric Corp Heat pipe wick restrainer
US4058160A (en) * 1974-03-11 1977-11-15 General Electric Company Heat transfer device
US6427765B1 (en) * 1998-09-29 2002-08-06 Korea Electronics Telecomm Heat-pipe having woven-wired wick and method for manufacturing the same
US20030183372A1 (en) * 2002-03-29 2003-10-02 Cheng-Tien Lai Heat pipe incorporating outer and inner pipes
US6648063B1 (en) * 2000-04-12 2003-11-18 Sandia Corporation Heat pipe wick with structural enhancement
US7322402B2 (en) * 2004-01-05 2008-01-29 Hul-Chun Hsu Heat pipe structure and method for fabricating the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3857441A (en) * 1970-03-06 1974-12-31 Westinghouse Electric Corp Heat pipe wick restrainer
US3789920A (en) * 1970-05-21 1974-02-05 Nasa Heat transfer device
US4058160A (en) * 1974-03-11 1977-11-15 General Electric Company Heat transfer device
US6427765B1 (en) * 1998-09-29 2002-08-06 Korea Electronics Telecomm Heat-pipe having woven-wired wick and method for manufacturing the same
US6648063B1 (en) * 2000-04-12 2003-11-18 Sandia Corporation Heat pipe wick with structural enhancement
US20030183372A1 (en) * 2002-03-29 2003-10-02 Cheng-Tien Lai Heat pipe incorporating outer and inner pipes
US7322402B2 (en) * 2004-01-05 2008-01-29 Hul-Chun Hsu Heat pipe structure and method for fabricating the same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060262571A1 (en) * 2005-05-18 2006-11-23 Hon Hai Precision Industry Co., Ltd. Backlight module and method for making the same
US7513651B2 (en) * 2005-05-18 2009-04-07 Hon Hai Precision Industry Co., Ltd. Backlight module including heat pipe with nano-scaled recesses
US20060283574A1 (en) * 2005-06-15 2006-12-21 Top Way Thermal Management Co., Ltd. Thermoduct
US7293601B2 (en) * 2005-06-15 2007-11-13 Top Way Thermal Management Co., Ltd. Thermoduct
US20100163212A1 (en) * 2008-12-26 2010-07-01 Chi-Te Chin Flat loop Heat pipe
US20110088874A1 (en) * 2009-10-20 2011-04-21 Meyer Iv George Anthony Heat pipe with a flexible structure
US20130068418A1 (en) * 2011-03-16 2013-03-21 Eric Joseph Gotland System and method for storing seasonal environmental energy
US20130014919A1 (en) * 2011-07-15 2013-01-17 Foxconn Technology Co., Ltd. Heat pipe
US20160102921A1 (en) * 2012-11-20 2016-04-14 Lockheed Martin Corporation Heat pipe with axial wick
US10538345B2 (en) * 2012-11-20 2020-01-21 Lockheed Martin Corporation Heat pipe with axial wick

Also Published As

Publication number Publication date
TWI287612B (en) 2007-10-01
TW200632269A (en) 2006-09-16

Similar Documents

Publication Publication Date Title
US7520315B2 (en) Heat pipe with capillary wick
US7594537B2 (en) Heat pipe with capillary wick
US7472479B2 (en) Heat pipe and method of producing the same
US20060207750A1 (en) Heat pipe with composite capillary wick structure
US8622117B2 (en) Heat pipe including a main wick structure and at least one auxiliary wick structure
US7866374B2 (en) Heat pipe with capillary wick
US7845394B2 (en) Heat pipe with composite wick structure
US20070267178A1 (en) Heat pipe
US7445039B2 (en) Heat pipe with multiple vapor-passages
US20060201655A1 (en) Heat pipe suitable for application in electronic device with limited mounting space
US20060196641A1 (en) Screen mesh wick and method for producing the same
US7802362B2 (en) Method of making heat pipe having composite capillary wick
US20070089864A1 (en) Heat pipe with composite wick structure
US20070240855A1 (en) Heat pipe with composite capillary wick structure
US20090020268A1 (en) Grooved heat pipe and method for manufacturing the same
US7609520B2 (en) Heat spreader with vapor chamber defined therein
US20110174464A1 (en) Flat heat pipe and method for manufacturing the same
US7866373B2 (en) Heat pipe with multiple wicks
US20070240858A1 (en) Heat pipe with composite capillary wick structure
US20060162907A1 (en) Heat pipe with sintered powder wick
US20060219391A1 (en) Heat pipe with sintered powder wick
US20070240856A1 (en) Heat pipe
US20070246194A1 (en) Heat pipe with composite capillary wick structure
US20070240852A1 (en) Heat pipe with heat reservoirs at both evaporating and condensing sections thereof
US20100155031A1 (en) Heat pipe and method of making the same

Legal Events

Date Code Title Description
AS Assignment

Owner name: FOXCONN TECHNOLOGY CO.,LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HONG, CHU-WAN;LO, CHANG-TING;WU, JUNG-YUAN;AND OTHERS;REEL/FRAME:016795/0863

Effective date: 20051031

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION