US20060237304A1 - Electroplating apparatus - Google Patents
Electroplating apparatus Download PDFInfo
- Publication number
- US20060237304A1 US20060237304A1 US11/377,415 US37741506A US2006237304A1 US 20060237304 A1 US20060237304 A1 US 20060237304A1 US 37741506 A US37741506 A US 37741506A US 2006237304 A1 US2006237304 A1 US 2006237304A1
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- plate
- anode
- solution tank
- cathode
- electroplating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
Definitions
- the present invention relates to an electroplating apparatus for performing electroplating and anodic oxidation on surfaces of, for example, wafers, glass substrates, and ceramic substrates.
- wiring pitches are required to be reduced to accomplish high integration and performance.
- an interlayer insulated film is formed, and then dry etching process is performed on the interlayer insulated film to form wiring grooves into which wiring material is electroplated and filled.
- a cathode plate which is the object to be electroplated, and an anode plate are placed to face each other in a solution tank inside which electroplating solution is poured.
- a power source is connected to the cathode plate and the anode plate in order to generate electric field between the cathode plate and the anode plate to electroplate a surface of the cathode plate.
- an electroplating apparatus is rotated by 90 degrees after a cathode plate and an anode plate are installed vertically. Then, the cathode plate in a lower position and the anode plate in a higher position are held horizontally to prevent bubbles from going directly along the surface of the cathode plate.
- a method requires another device to rotate the electroplating apparatus. Accordingly, there is a problem that the whole electroplating apparatus becomes large and complicated.
- an object of the present invention to provide an electroplating apparatus which is able to form an electroplating film with an even thickness all over a surface to be electroplated so as to improve quality of the electroplating film, as well as to downsize and simplify the whole electroplating apparatus.
- an electroplating apparatus including a solution tank which has at least a bottom plate and a side plate, and inside which electroplating solution is poured, and a cathode plate and an anode plate which are horizontally placed so as to face each other in the electroplating solution in the solution tank.
- a solution tank which has at least a bottom plate and a side plate, and inside which electroplating solution is poured, and a cathode plate and an anode plate which are horizontally placed so as to face each other in the electroplating solution in the solution tank.
- one plate of the cathode plate and the anode plate is an object to be electroplated and placed in a lower position than the other plate.
- an opening through which the cathode plate and the anode plate are inserted into the solution tank is provided in the side plate of the solution tank.
- a shield plate which is detachable shields the opening of the solution tank.
- the cathode plate and the anode plate are installed, the cathode plate and the anode plate are inserted into the solution tank through the opening provided in the side plate of the solution tank. Accordingly, it is easy to install the cathode plate and the anode plate horizontally and parallel each other in the solution tank.
- the one plate of the cathode plate and the anode plate which is an object to be electroplated, is placed in the lower position than the other plate. Therefore, it is possible to let bubbles which are mainly composed of hydrogen and generated from a surface to be electroplated of the one plate, go up directly to outside without going along the surface to be electroplated of the one plate.
- the object to be electroplated may be connected to a negative electrode of a power source in order that the surface of the object to be electroplated is electroplated.
- the object to be electroplated may be also connected to a positive electrode of the power source in order that an anodic film, which is an oxide film, is formed on the surface of the object to be electroplated.
- a slot which holds the cathode plate and/or the anode plate horizontally may be provided in the side plate of the solution tank.
- a plurality of the slots which hold the cathode plate and/or the anode plate horizontally may be vertically arranged in the side plate of the solution tank in order to adjust a height of the cathode plate and/or the anode plate.
- the slots may be used to adjust a height of the other plate.
- a conductive member which conducts electricity to the other plate may be inserted downward from above toward inside of the solution tank into the other plate so as to be electrically connected to the other plate.
- the conductive member may be supported in the solution tank in such a manner that a height of the conductive member is adjustable corresponding to the height of the other plate.
- the conductive member is inserted downward from above toward inside of the solution tank.
- an end of the conductive member can be electrically connected to the other plate, which is placed in the higher of two positions of the cathode plate and the anode plate.
- the height of the conductive member in the higher position is changed, the height of the conductive member is adjusted corresponding to the height of the other plate in the higher position. Consequently, it is easy to engage and electrically connect the conductive member to the other plate in the higher position.
- the one plate may be cantilevered and attached to the shield plate.
- the one plate is attached to the shield plate in advance and then installed in the solution tank. Accordingly, the one plate can be easily cantilevered and attached to the shield plate. Thus, a worker does not need to bother to extend his/her hand into the opening of the solution tank to install the one plate in the lower position. Moreover, to install the shield plate to the solution tank, only one edge of the one plate in the lower position needs to be cantilevered.
- the other edge of the one plate in the lower position can be, for example, hung on a portion of the solution tank which faces the shield plate or engaged in a slot formed in the solution tank so that both sides of the one plate can be supported. Therefore, the one plate in the lower position is stably held in the solution tank.
- a bolt having a head may be attached to the lower side of the other end of the one plate in the lower position in order to support the other end of the one plate with the head of the bolt being touched on the bottom of the solution tank.
- a conductive member which conducts electricity to the one plate may pass through the shield plate horizontally toward inside of the solution tank so as to be electrically connected to the one plate.
- the conductive member passes through the shield plate horizontally toward inside of the solution tank. Therefore, it is easy to electrically connect the conductive member to the one plate, which is placed in the lower of two positions of the cathode plate and the anode plate.
- FIG. 1 is an exploded perspective view showing an electroplating apparatus according to an embodiment of the present invention.
- FIG. 2 is an exploded perspective view showing the electroplating apparatus with a cathode of FIG. 1 being attached to a shield plate.
- FIG. 3 is a front view of a solution tank used in the embodiment of the present invention.
- FIG. 4 is a left side view of the solution tank used in the embodiment of the present invention.
- FIG. 5 is a left side view of the electroplating apparatus according to the embodiment of the present invention.
- FIG. 6 is a front view of the electroplating apparatus according to the embodiment of the present invention.
- FIG. 7 is a front view of the electroplating apparatus from which the shield plate is detached.
- FIG. 8 is an exploded perspective view showing an anode used in the embodiment of the present invention.
- an electroplating apparatus 1 generally includes a solution tank 10 , an anode 20 , a cathode 30 , and a shield plate 40 . Electroplating solution is poured and filled inside the solution tank 10 .
- the solution tank 10 has a bottom plate 10 A, a first side plate 10 B as a front plate (hereafter referred as a side plate 10 B), a second side plate 10 C as a back plate (hereafter referred as a side plate 10 C), a third side plate 10 D as a left side plate (hereafter referred as a side plate 10 D), a fourth side plate 10 E as a right side plate (hereafter referred as a side plate 10 E), and a top plate 10 F which is fastened to brackets 10 B 1 and 10 C 1 respectively provided on upper ends of the side plates 10 B and 10 C, with bolts 11 , 11 , 11 , and 11 (see FIG. 2 ). Additionally, as shown in FIG.
- a right vertical plate 14 (hereafter referred as a vertical plate 14 ) erected on the bottom plate 10 A, a horizontal plate 13 extending horizontally from a lower portion of the vertical plate 14 , and a left vertical plate 12 (hereafter referred as a vertical plate 12 ) erected on a left end of the horizontal plate 13 are formed inside the solution tank 10 .
- a plurality of circulation holes 14 A, 14 A, . . . , and 14 A are cut through the vertical plate 14 .
- a plurality of circulation holes 13 A, 13 A, . . . , and 13 A are also cut through the horizontal plate 13 .
- a drain hole 10 A 1 is cut through the bottom plate 10 A.
- a pump attachment opening 15 to which a pump (not shown) is to be attached is cut through the side plate 10 C of the solution tank 10 between the side plate 10 E and the vertical plate 14 .
- a cover plate 16 shown in FIG. 5 is placed between upper ends of the vertical plate 12 and the vertical plate 14 .
- electroplating solution is poured from the pump in direction indicated by an arrow A as shown in FIG. 3 .
- the poured electroplating solution circulates in direction indicated by an arrow B through circulation holes 14 A and in direction indicated by an arrow B′ over the top of the vertical plate 14 , so as to be poured into a space surrounded by the vertical plates 12 and 14 and the horizontal plate 13 .
- the electroplating solution poured into the space circulates in direction indicated by an arrow C through circulation holes 13 A and in direction indicated by an arrow D over the top of the vertical plate 12 , so as to be poured under the horizontal plate 13 .
- the electroplating solution is drained outside in direction indicated by an arrow F through the drain hole 10 A 1 .
- the pump circulates the electroplating solution in predetermined direction in order to prevent the electroplating solution from staying.
- the pump prevents “residues” which are generated while a wafer (a cathode plate) 31 , which will be described later, is being electroplated, from sticking on the wafer 31 .
- an opening 17 is formed in a substantially two-tiered shape in the side plate 100 B of the solution tank 10 .
- the opening 17 includes a narrow portion 17 A which is horizontally narrower and a wide portion 17 B which is horizontally wider and connected to a lower side of the narrow portion 17 A.
- a plurality of slots 18 A, 18 A, . . . , and 18 A are vertically arranged along right and left peripheries of the narrow portion 17 A of the opening 17 .
- the slots are formed in substantially U-shapes, and a pair of the slots face each other on the right and left peripheries.
- a sealing member 19 formed as a substantially quadrangular frame is attached to the side plate 10 B of the solution tank 10 so as to surround the periphery of the opening 17 .
- holding members 51 and 51 which form parts of lock mechanisms 50 and 50 respectively are fixed and attached to a corner between the side plate 10 B and the side plate 10 D and a corner between the side plate 10 B and the side plate 10 E.
- the anode 20 includes an anode cartridge pan 21 which is made of insulation material such as acrylic and formed in a quadrangular shape having a quadrangular recess 21 A, an anode plate 22 which is made of metallic material such as steel and nickel and formed in a quadrangular shape so as to fit in the recess 21 A of the anode cartridge pan 21 , an anode cartridge holder 23 which is made of insulating material such as acrylic in order to hold the anode plate 22 between the anode cartridge holder 23 and the anode cartridge pans 21 , an anode bag 24 which is made of fibrous material such as cloths and lined on a surface (a lower side in FIG.
- anode bag holder 25 which is made of insulating material such as acrylic to hold the anode bag 24 between the anode bag holder 25 and the anode cartridge holder 23 .
- first engaging protrusions 23 A and 23 A formed in substantially quadrangular shapes are protruded on both sides of the front end of the anode cartridge holder 23 .
- a back end of the anode cartridge holder 23 is a second engaging protrusion 23 B which is protruded backward through between the anode cartridge pan 21 and the anode bag holder 25 .
- the first engaging protrusions 23 A and 23 A are engaged in the pair of the slots 18 A and 18 A (See FIG. 5 ) while the second engaging protrusion 23 B (see FIG. 8 ) is engaged in the slot 18 B.
- the anode 20 is installed.
- the anode 20 is horizontally and stably held by three points support in the electroplating solution in the solution tank 10 .
- the anode bag 24 prevents “residue”, which is generated while the wafer 31 is being electroplated, from adhering to the anode plate 22 .
- a conductive rod (a conductive member) 26 on an anode side is inserted from above into a circular hole 21 B which is cut through the anode cartridge pan 21 . Accordingly, an end (a lower end) of the conductive rod 26 on the anode side electrically contacts with the anode plate 22 . Then, the conductive rod 26 on the anode side is screwed into a screw hole (not shown) which is cut through the cover plate 16 . Thus, a worker can rotate the conductive rod 26 on the anode side in order to adjust the height of the end of the conductive rod 26 on the anode side corresponding to the height of the anode 20 .
- a cathode 30 is substantially similar to the cathode cartridge described in JP 2003-301299A.
- the cathode 30 is placed horizontally and parallel to the anode 20 in a lower position than the anode 20 .
- the cathode 30 includes the wafer 31 , which is an object to be electroplated, a cathode conductor 32 which is a conductive member to conduct electricity to the surface 31 A of the wafer 31 , a first insulator 33 which is made of insulating material such as acryl to cover the frontside (the side of the surface 31 A) of the wafer 31 and hold the cathode conductor 32 , and a second insulator 34 which is made of insulating material such as acryl to cover the backside (the opposite side of the surface 31 A) of the wafer 31 and hold the wafer 31 .
- the cathode conductor 32 includes a conductive ring plate 32 A and a conductive rod 32 B on the cathode side which is electrically connected
- a front edge of the first insulator 33 of the cathode 30 is fastened and attached to a shield plate 40 , which will be described later, in the manner of a cantilever.
- the conductive rod 32 B of the cathode conductor 32 passes through the shield plate 40 horizontally toward inside of the solution tank 10 to be electrically connected to the wafer 31 through the conductive ring plate 32 A.
- insert holes 33 A and 40 A through which the conductive rod 32 B is inserted are respectively provided in the first insulator 33 and the shield plate 40 .
- the conductive rod 32 B protrudes outside from the shield plate 40 through the insert holes 33 A and 40 A.
- a cylindrical sealing member 70 (see FIG. 5 ) fluid-tightly seals between the conductive rod 32 B and the insert hole 33 A and between the conductive rod 32 B and the insert hole 40 A. Therefore, the electroplating solution is prevented from leaking from the insert holes 33 A and 40 A.
- ring sealing members (not shown) fluid-tightly seal between the wafer 31 and the first insulator 33 and between the first insulator 33 and the second insulator 34 respectively.
- the shield plate 40 which is formed as a substantially quadrangular board member, is affixed to an outer periphery of the sealing member 19 to shield the opening 17 .
- a lever member 52 which forms a part of the lock mechanism 50 is provided on each of the right and left sides of the shield plate 40 so as to be rotatable. Then, an end of the lever member 52 is latched to the holding member 51 so as to strongly press the shield plate 40 toward the sealing member 19 . Accordingly, it is possible to fluid-tightly seal the opening 17 with the shield plate 40 and prevent the electroplating solution from leaking from the opening 17 .
- the number “ 60 ” in FIG. 5 shows a mixing tool which is able to move back and forth on the upper end of the solution tank 10 .
- the mixing tool 60 generally includes a support plate 62 which has rotatable rollers 61 and 61 on front and rear sides, vertical panels 63 and 63 which vertically hang down from the support plate 62 , and a connecting rod 64 which connects the lower ends of the vertical panels 63 and 63 .
- an operation plate 65 which is operated from outside to move the mixing tool 60 back and forth is provided to the support plate 62 .
- an actuator (not shown) actuates the operation plate 65 to move back and forth so as to cause the vertical panels 63 and 63 and the connecting rod 64 to stir the electroplating solution in order to prevent the electroplating solution from staying in the solution tank 10 .
- the conductive rod 26 on the anode side is connected to a positive electrode of a power source.
- the conductive rod 32 B on the cathode side is connected to a negative electrode of the power source. Accordingly, an electroplating film is formed on the surface 31 A of the wafer 31 of the cathode 30 .
- the cathode 30 in a lower position is placed horizontally and parallel to the anode 20 in a higher position. Therefore, it is possible to let bubbles which are mainly composed of hydrogen and generated from the surface 31 A of the wafer 31 of the cathode 30 , go up from the surface 31 A of the wafer 31 to escape outside. Thus, the bubbles do not go along the surface 31 A of the wafer 31 . As a result, it is possible to equalize the thickness of the electroplating film formed on all over the surface to be electroplated to improve quality of the electroplating film.
- the opening 17 through which the anode 20 and the cathode 30 are inserted into the solution tank 10 is formed in the side plate 10 B of the solution tank 10 . Accordingly, it is easy to insert the anode 20 and the cathode 30 horizontally into the solution tank 10 through the opening 17 . Thus, it is possible to easily install the anode 20 and the cathode 30 in the solution tank 10 so as to improve work efficiency of installing the anode 20 and the cathode 30 . Therefore, a large scale device which rotates the entire solution tank by 90 degrees as described in the well-known method is not necessary. As a result, it is possible to downsize and simplify the whole electroplating apparatus.
- the slots 18 A are provided in the side plate 10 B of the solution tank 10 .
- the slot 18 B is provided in the side plate 10 C of the solution tank 10 at a height corresponding to the slots 18 A. Accordingly, the anode 20 is engaged in the slots 18 A and 18 B so as to be held horizontally in the solution tank 10 . Thus, it is easy to install the anode 20 .
- the plurality of slots 18 A, 18 A, . . . , and 18 A and the plurality of slots 18 B, 18 B, . . . , and 18 B are respectively arranged in the side plate 10 B and the side plate 10 C of the solution tank 10 in vertical direction. Therefore, it is possible to change the installation position of the anode 20 corresponding to the height of the slot 18 A and 18 B in order to change a distance between the anode 20 and the cathode 30 . As a result, it is possible to appropriately control the thickness of the electroplating film formed on the surface 31 A of the wafer 31 of the cathode 30 .
- the conductive rod 26 is inserted downward from above toward inside of the solution tank 10 into the anode 20 which is placed in the higher of two positions of the anode 20 and the cathode 30 , so as to be electrically connected to the anode 20 .
- the conductive rod 26 is supported in the solution tank 10 in such a way that the height of the conductive rod 26 can be adjusted corresponding to the height of the anode 20 . Therefore, it is easy to adjust the height of the conductive rod 26 depending on the height of the anode 20 in order to engage the conductive rod 26 in the anode plate 22 .
- the cathode 30 is cantilevered and attached to the shield plate 40 . Therefore, to install the cathode 30 , the shield plate 40 to which the cathode 30 has been attached in advance, is installed into the solution tank 10 . Thus, the worker does not need to bother to extend his/her hand into the opening 17 of the solution tank 10 to install the cathode 30 . As a result, it is possible to easily install the cathode 30 .
- the conductive rod 32 B of the cathode conductor 32 passes through the shield plate 40 horizontally so as to be electrically connected to the cathode 30 which is placed in the lower of two positions of the anode 20 and the cathode 30 . Therefore, it is easy to electrically connect the conductive rod 32 B to the wafer 31 of the cathode 30 through the conductive ring plate 32 A.
- anode 20 is installed in the solution tank 10 in such a way that the height of the anode 20 can be changed and the cathode 30 is attached to the shield plate 40 .
- the present invention is not limited to this.
- the anode 20 may be attached to the shield plate 40
- the cathode 30 may be installed in the solution tank 10 in such a way that the height of the cathode 30 can be changed.
- an anode plate may be an object to be electroplated and placed in a lower position than a cathode plate.
- an anodic film which is an oxide film, may be formed on a surface of the anode plate.
- the sealing member 70 also has a function to prevent a problem that the electroplating solution infiltrates into a portion other than the surface 31 A of the wafer 31 in combination with the ring sealing members.
- the connecting rod 64 of the mixing tool 60 is formed as a round rod.
- the present invention is not limited to this.
- the cross section of the connecting rod 64 of the mixing tool 60 may be formed in a quadrangle, a triangle, or other shape.
- a thickness of an electroplating film formed on a surface to be electroplated of an object to be electroplated can be equalized all over the surface so as to improve quality of the electroplating film.
- a large scale device which rotates the solution tank by 90 degrees is not required. As a result, a whole electroplating apparatus is possible to be downsized and simplified.
Abstract
An electroplating apparatus is provided which includes a solution tank which has at least a bottom plate and a side plate and inside which electroplating solution is poured and a cathode plate and an anode plate which are horizontally placed so as to face each other in the electroplating solution in the solution tank, in which one plate of the cathode plate and the anode plate is an object to be electroplated and placed in a lower position than the other plate, in which an opening through which the cathode plate and the anode plate are inserted into the solution tank is provided in the side plate of the solution tank, and in which a shield plate which is detachable shields the opening of the solution tank.
Description
- This application claims the foreign priority benefit under Title 35, United States Code, §119(a)-(d) of Japanese Patent Application No. 2005-125538, filed on Apr. 22, 2005 in the Japan Patent Office, the disclosure of which is herein incorporated by reference in its entirety.
- 1. Field of the Invention
- The present invention relates to an electroplating apparatus for performing electroplating and anodic oxidation on surfaces of, for example, wafers, glass substrates, and ceramic substrates.
- 2. Description of the Related Art
- In recent years, electroplating technologies are applied to various kinds of technical fields, including wiring technologies in semi-conductors. In the field of semi-conductors, wiring pitches are required to be reduced to accomplish high integration and performance. For example, in a wiring technology employed in latest years, an interlayer insulated film is formed, and then dry etching process is performed on the interlayer insulated film to form wiring grooves into which wiring material is electroplated and filled.
- To achieve such an electroplating technology, it is required to electroplate wiring material evenly in grooves which are formed on an object to be electroplated. For this purpose, the applicant has proposed an electroplating apparatus which forms an even electroplating film on a surface to be electroplated of an object to be electroplated. (Refer to JP 2003-301299A, for example.)
- In the above-mentioned electroplating apparatus, a cathode plate, which is the object to be electroplated, and an anode plate are placed to face each other in a solution tank inside which electroplating solution is poured. A power source is connected to the cathode plate and the anode plate in order to generate electric field between the cathode plate and the anode plate to electroplate a surface of the cathode plate.
- By the way, in the electroplating apparatus described in JP 2003-301299A, bubbles mainly composed of hydrogen are generated from the surface to be electroplated of the cathode plate while the cathode plate is being electroplated. Then, the bubbles rise along the surface to be electroplated of the cathode plate one after another since the cathode plate, as well as the anode plate, is placed vertically in the solution tank. Accordingly, a thickness of an electroplating film formed on the surface to be electroplated of the cathode plate becomes uneven since the bubbles go along the surface to be electroplated of the cathode plate. As a result, there is a problem that high quality of the electroplating film cannot be always assured.
- To solve such a problem, in a well-known method, an electroplating apparatus is rotated by 90 degrees after a cathode plate and an anode plate are installed vertically. Then, the cathode plate in a lower position and the anode plate in a higher position are held horizontally to prevent bubbles from going directly along the surface of the cathode plate. However, such a method requires another device to rotate the electroplating apparatus. Accordingly, there is a problem that the whole electroplating apparatus becomes large and complicated.
- In view of such a background, it is an object of the present invention to provide an electroplating apparatus which is able to form an electroplating film with an even thickness all over a surface to be electroplated so as to improve quality of the electroplating film, as well as to downsize and simplify the whole electroplating apparatus.
- To solve the above-mentioned problem, in one aspect of the present invention, there is provided an electroplating apparatus including a solution tank which has at least a bottom plate and a side plate, and inside which electroplating solution is poured, and a cathode plate and an anode plate which are horizontally placed so as to face each other in the electroplating solution in the solution tank. In the electroplating apparatus, one plate of the cathode plate and the anode plate is an object to be electroplated and placed in a lower position than the other plate. In addition, an opening through which the cathode plate and the anode plate are inserted into the solution tank is provided in the side plate of the solution tank. Furthermore, a shield plate which is detachable shields the opening of the solution tank.
- In such a configuration, when the cathode plate and the anode plate are installed, the cathode plate and the anode plate are inserted into the solution tank through the opening provided in the side plate of the solution tank. Accordingly, it is easy to install the cathode plate and the anode plate horizontally and parallel each other in the solution tank. In addition, the one plate of the cathode plate and the anode plate, which is an object to be electroplated, is placed in the lower position than the other plate. Therefore, it is possible to let bubbles which are mainly composed of hydrogen and generated from a surface to be electroplated of the one plate, go up directly to outside without going along the surface to be electroplated of the one plate. Moreover, it is also easy to install the cathode plate and the anode plate horizontally in the solution tank as described above. Consequently, a large scale device which rotates the whole solution tank by 90 degrees described in the well-known method is not required. In the present invention, the object to be electroplated may be connected to a negative electrode of a power source in order that the surface of the object to be electroplated is electroplated. Moreover, the object to be electroplated may be also connected to a positive electrode of the power source in order that an anodic film, which is an oxide film, is formed on the surface of the object to be electroplated.
- In the electroplating apparatus, a slot which holds the cathode plate and/or the anode plate horizontally may be provided in the side plate of the solution tank.
- In such a configuration, it is required only to engage the cathode plate and/or the anode plate in the slot provided in the side plate of the solution tank in order to hold the cathode plate and/or the anode plate horizontally in the solution tank. Accordingly, it is easy to install the cathode plate and/or the anode plate.
- In the electroplating apparatus, a plurality of the slots which hold the cathode plate and/or the anode plate horizontally may be vertically arranged in the side plate of the solution tank in order to adjust a height of the cathode plate and/or the anode plate.
- In such a configuration, it is possible to change a vertical installation position of the cathode plate and/or the anode plate so as to change a distance between the cathode plate and the anode plate. Therefore, it is possible to properly control, for example, a thickness of an electroplating film formed on the surface to be electroplated of the cathode plate (or the anode plate) which is the object to be electroplated.
- In the electroplating apparatus, the slots may be used to adjust a height of the other plate. In addition, a conductive member which conducts electricity to the other plate may be inserted downward from above toward inside of the solution tank into the other plate so as to be electrically connected to the other plate. Moreover, the conductive member may be supported in the solution tank in such a manner that a height of the conductive member is adjustable corresponding to the height of the other plate.
- In such a configuration, the conductive member is inserted downward from above toward inside of the solution tank. Thus, an end of the conductive member can be electrically connected to the other plate, which is placed in the higher of two positions of the cathode plate and the anode plate. Moreover, when the height of the other plate in the higher position is changed, the height of the conductive member is adjusted corresponding to the height of the other plate in the higher position. Consequently, it is easy to engage and electrically connect the conductive member to the other plate in the higher position.
- In the electroplating apparatus, the one plate may be cantilevered and attached to the shield plate.
- In such a configuration, to install the one plate, which is placed in the lower of two positions of the cathode plate and the anode plate, the one plate is attached to the shield plate in advance and then installed in the solution tank. Accordingly, the one plate can be easily cantilevered and attached to the shield plate. Thus, a worker does not need to bother to extend his/her hand into the opening of the solution tank to install the one plate in the lower position. Moreover, to install the shield plate to the solution tank, only one edge of the one plate in the lower position needs to be cantilevered. After the shield plate has been installed in the solution tank, the other edge of the one plate in the lower position can be, for example, hung on a portion of the solution tank which faces the shield plate or engaged in a slot formed in the solution tank so that both sides of the one plate can be supported. Therefore, the one plate in the lower position is stably held in the solution tank. In addition, a bolt having a head may be attached to the lower side of the other end of the one plate in the lower position in order to support the other end of the one plate with the head of the bolt being touched on the bottom of the solution tank.
- In the electroplating apparatus, a conductive member which conducts electricity to the one plate may pass through the shield plate horizontally toward inside of the solution tank so as to be electrically connected to the one plate.
- In such a configuration, the conductive member passes through the shield plate horizontally toward inside of the solution tank. Therefore, it is easy to electrically connect the conductive member to the one plate, which is placed in the lower of two positions of the cathode plate and the anode plate.
-
FIG. 1 is an exploded perspective view showing an electroplating apparatus according to an embodiment of the present invention. -
FIG. 2 is an exploded perspective view showing the electroplating apparatus with a cathode ofFIG. 1 being attached to a shield plate. -
FIG. 3 is a front view of a solution tank used in the embodiment of the present invention. -
FIG. 4 is a left side view of the solution tank used in the embodiment of the present invention. -
FIG. 5 is a left side view of the electroplating apparatus according to the embodiment of the present invention. -
FIG. 6 is a front view of the electroplating apparatus according to the embodiment of the present invention. -
FIG. 7 is a front view of the electroplating apparatus from which the shield plate is detached. -
FIG. 8 is an exploded perspective view showing an anode used in the embodiment of the present invention. - Next, an embodiment of the present invention will be described in detail, referring to the accompanied drawings as needed.
- As shown in
FIGS. 1-4 , anelectroplating apparatus 1 generally includes asolution tank 10, ananode 20, acathode 30, and ashield plate 40. Electroplating solution is poured and filled inside thesolution tank 10. - As shown in
FIGS. 1-4 , thesolution tank 10 has abottom plate 10A, afirst side plate 10B as a front plate (hereafter referred as aside plate 10B), asecond side plate 10C as a back plate (hereafter referred as aside plate 10C), athird side plate 10D as a left side plate (hereafter referred as aside plate 10D), afourth side plate 10E as a right side plate (hereafter referred as aside plate 10E), and atop plate 10F which is fastened to brackets 10B1 and 10C1 respectively provided on upper ends of theside plates bolts FIG. 2 ). Additionally, as shown inFIG. 3 , a right vertical plate 14 (hereafter referred as a vertical plate 14) erected on thebottom plate 10A, ahorizontal plate 13 extending horizontally from a lower portion of thevertical plate 14, and a left vertical plate 12 (hereafter referred as a vertical plate 12) erected on a left end of thehorizontal plate 13 are formed inside thesolution tank 10. - Moreover, a plurality of
circulation holes FIG. 1 ) are cut through thevertical plate 14. In addition, a plurality ofcirculation holes horizontal plate 13. Furthermore, a drain hole 10A1 is cut through thebottom plate 10A. In addition, as shown inFIGS. 3 and 5 , a pump attachment opening 15 to which a pump (not shown) is to be attached is cut through theside plate 10C of thesolution tank 10 between theside plate 10E and thevertical plate 14. Moreover, acover plate 16 shown inFIG. 5 is placed between upper ends of thevertical plate 12 and thevertical plate 14. - Therefore, when the pump is operated, electroplating solution is poured from the pump in direction indicated by an arrow A as shown in
FIG. 3 . Then, the poured electroplating solution circulates in direction indicated by an arrow B throughcirculation holes 14A and in direction indicated by an arrow B′ over the top of thevertical plate 14, so as to be poured into a space surrounded by thevertical plates horizontal plate 13. Moreover, the electroplating solution poured into the space circulates in direction indicated by an arrow C throughcirculation holes 13A and in direction indicated by an arrow D over the top of thevertical plate 12, so as to be poured under thehorizontal plate 13. Then, the electroplating solution is drained outside in direction indicated by an arrow F through the drain hole 10A1. Thus, the pump circulates the electroplating solution in predetermined direction in order to prevent the electroplating solution from staying. As a result, the pump prevents “residues” which are generated while a wafer (a cathode plate) 31, which will be described later, is being electroplated, from sticking on thewafer 31. - Here, as shown in
FIGS. 1-3 , anopening 17 is formed in a substantially two-tiered shape in the side plate 100B of thesolution tank 10. Additionally, theopening 17 includes anarrow portion 17A which is horizontally narrower and awide portion 17B which is horizontally wider and connected to a lower side of thenarrow portion 17A. Moreover, a plurality ofslots narrow portion 17A of theopening 17. Here, the slots are formed in substantially U-shapes, and a pair of the slots face each other on the right and left peripheries. In addition, a plurality ofslots side plate 10C of thesolution tank 10 at positions respectively corresponding to the pairs of theslots member 19 formed as a substantially quadrangular frame is attached to theside plate 10B of thesolution tank 10 so as to surround the periphery of theopening 17. In addition, holdingmembers lock mechanisms side plate 10B and theside plate 10D and a corner between theside plate 10B and theside plate 10E. - As shown in
FIG. 8 , theanode 20 includes ananode cartridge pan 21 which is made of insulation material such as acrylic and formed in a quadrangular shape having aquadrangular recess 21A, ananode plate 22 which is made of metallic material such as steel and nickel and formed in a quadrangular shape so as to fit in therecess 21A of theanode cartridge pan 21, ananode cartridge holder 23 which is made of insulating material such as acrylic in order to hold theanode plate 22 between theanode cartridge holder 23 and the anode cartridge pans 21, ananode bag 24 which is made of fibrous material such as cloths and lined on a surface (a lower side inFIG. 8 ) of theanode cartridge holder 23, and ananode bag holder 25 which is made of insulating material such as acrylic to hold theanode bag 24 between theanode bag holder 25 and theanode cartridge holder 23. By the way, it is possible to change shape, size, and so on of anhole 25A formed in theanode bag holder 25 as needed depending on shape of asurface 31A to be electroplated of thewafer 31. - Here, first engaging
protrusions anode cartridge holder 23. Moreover, a back end of theanode cartridge holder 23 is a secondengaging protrusion 23B which is protruded backward through between theanode cartridge pan 21 and theanode bag holder 25. Accordingly, as shown inFIGS. 5-7 , the first engagingprotrusions slots FIG. 5 ) while the secondengaging protrusion 23B (seeFIG. 8 ) is engaged in theslot 18B. Thus, theanode 20 is installed. As a result, theanode 20 is horizontally and stably held by three points support in the electroplating solution in thesolution tank 10. By the way, theanode bag 24 prevents “residue”, which is generated while thewafer 31 is being electroplated, from adhering to theanode plate 22. - Moreover, a conductive rod (a conductive member) 26 on an anode side is inserted from above into a
circular hole 21B which is cut through theanode cartridge pan 21. Accordingly, an end (a lower end) of theconductive rod 26 on the anode side electrically contacts with theanode plate 22. Then, theconductive rod 26 on the anode side is screwed into a screw hole (not shown) which is cut through thecover plate 16. Thus, a worker can rotate theconductive rod 26 on the anode side in order to adjust the height of the end of theconductive rod 26 on the anode side corresponding to the height of theanode 20. - Structure of a
cathode 30 is substantially similar to the cathode cartridge described in JP 2003-301299A. Thecathode 30 is placed horizontally and parallel to theanode 20 in a lower position than theanode 20. Moreover, thecathode 30 includes thewafer 31, which is an object to be electroplated, acathode conductor 32 which is a conductive member to conduct electricity to thesurface 31A of thewafer 31, afirst insulator 33 which is made of insulating material such as acryl to cover the frontside (the side of thesurface 31A) of thewafer 31 and hold thecathode conductor 32, and asecond insulator 34 which is made of insulating material such as acryl to cover the backside (the opposite side of thesurface 31A) of thewafer 31 and hold thewafer 31. Moreover, thecathode conductor 32 includes aconductive ring plate 32A and aconductive rod 32B on the cathode side which is electrically connected to theconductive ring plate 32A. - Additionally, as shown in
FIG. 2 , a front edge of thefirst insulator 33 of thecathode 30 is fastened and attached to ashield plate 40, which will be described later, in the manner of a cantilever. Moreover, theconductive rod 32B of thecathode conductor 32 passes through theshield plate 40 horizontally toward inside of thesolution tank 10 to be electrically connected to thewafer 31 through theconductive ring plate 32A. As shown inFIGS. 1 and 2 , insertholes conductive rod 32B is inserted are respectively provided in thefirst insulator 33 and theshield plate 40. Thus, theconductive rod 32B protrudes outside from theshield plate 40 through the insert holes 33A and 40A. In addition, a cylindrical sealing member 70 (seeFIG. 5 ) fluid-tightly seals between theconductive rod 32B and theinsert hole 33A and between theconductive rod 32B and theinsert hole 40A. Therefore, the electroplating solution is prevented from leaking from the insert holes 33A and 40A. Moreover, ring sealing members (not shown) fluid-tightly seal between thewafer 31 and thefirst insulator 33 and between thefirst insulator 33 and thesecond insulator 34 respectively. - The
shield plate 40, which is formed as a substantially quadrangular board member, is affixed to an outer periphery of the sealingmember 19 to shield theopening 17. Moreover, alever member 52 which forms a part of thelock mechanism 50 is provided on each of the right and left sides of theshield plate 40 so as to be rotatable. Then, an end of thelever member 52 is latched to the holdingmember 51 so as to strongly press theshield plate 40 toward the sealingmember 19. Accordingly, it is possible to fluid-tightly seal theopening 17 with theshield plate 40 and prevent the electroplating solution from leaking from theopening 17. - The number “60” in
FIG. 5 shows a mixing tool which is able to move back and forth on the upper end of thesolution tank 10. As shown inFIGS. 5-7 , the mixingtool 60 generally includes asupport plate 62 which hasrotatable rollers vertical panels support plate 62, and a connectingrod 64 which connects the lower ends of thevertical panels operation plate 65 which is operated from outside to move themixing tool 60 back and forth is provided to thesupport plate 62. Moreover, in themixing tool 60, an actuator (not shown) actuates theoperation plate 65 to move back and forth so as to cause thevertical panels rod 64 to stir the electroplating solution in order to prevent the electroplating solution from staying in thesolution tank 10. - In such a configuration of the present embodiment, after the pump is powered on, the
conductive rod 26 on the anode side is connected to a positive electrode of a power source. In addition, theconductive rod 32B on the cathode side is connected to a negative electrode of the power source. Accordingly, an electroplating film is formed on thesurface 31A of thewafer 31 of thecathode 30. - Here, the
cathode 30 in a lower position is placed horizontally and parallel to theanode 20 in a higher position. Therefore, it is possible to let bubbles which are mainly composed of hydrogen and generated from thesurface 31A of thewafer 31 of thecathode 30, go up from thesurface 31A of thewafer 31 to escape outside. Thus, the bubbles do not go along thesurface 31A of thewafer 31. As a result, it is possible to equalize the thickness of the electroplating film formed on all over the surface to be electroplated to improve quality of the electroplating film. - Moreover, the
opening 17 through which theanode 20 and thecathode 30 are inserted into thesolution tank 10 is formed in theside plate 10B of thesolution tank 10. Accordingly, it is easy to insert theanode 20 and thecathode 30 horizontally into thesolution tank 10 through theopening 17. Thus, it is possible to easily install theanode 20 and thecathode 30 in thesolution tank 10 so as to improve work efficiency of installing theanode 20 and thecathode 30. Therefore, a large scale device which rotates the entire solution tank by 90 degrees as described in the well-known method is not necessary. As a result, it is possible to downsize and simplify the whole electroplating apparatus. - Moreover, the
slots 18A are provided in theside plate 10B of thesolution tank 10. In addition, theslot 18B is provided in theside plate 10C of thesolution tank 10 at a height corresponding to theslots 18A. Accordingly, theanode 20 is engaged in theslots solution tank 10. Thus, it is easy to install theanode 20. - Furthermore, the plurality of
slots slots side plate 10B and theside plate 10C of thesolution tank 10 in vertical direction. Therefore, it is possible to change the installation position of theanode 20 corresponding to the height of theslot anode 20 and thecathode 30. As a result, it is possible to appropriately control the thickness of the electroplating film formed on thesurface 31A of thewafer 31 of thecathode 30. - The
conductive rod 26 is inserted downward from above toward inside of thesolution tank 10 into theanode 20 which is placed in the higher of two positions of theanode 20 and thecathode 30, so as to be electrically connected to theanode 20. In addition, theconductive rod 26 is supported in thesolution tank 10 in such a way that the height of theconductive rod 26 can be adjusted corresponding to the height of theanode 20. Therefore, it is easy to adjust the height of theconductive rod 26 depending on the height of theanode 20 in order to engage theconductive rod 26 in theanode plate 22. - Moreover, the
cathode 30 is cantilevered and attached to theshield plate 40. Therefore, to install thecathode 30, theshield plate 40 to which thecathode 30 has been attached in advance, is installed into thesolution tank 10. Thus, the worker does not need to bother to extend his/her hand into theopening 17 of thesolution tank 10 to install thecathode 30. As a result, it is possible to easily install thecathode 30. - Moreover, the
conductive rod 32B of thecathode conductor 32 passes through theshield plate 40 horizontally so as to be electrically connected to thecathode 30 which is placed in the lower of two positions of theanode 20 and thecathode 30. Therefore, it is easy to electrically connect theconductive rod 32B to thewafer 31 of thecathode 30 through theconductive ring plate 32A. - In the present embodiment, description has been given to an example where the
anode 20 is installed in thesolution tank 10 in such a way that the height of theanode 20 can be changed and thecathode 30 is attached to theshield plate 40. However, the present invention is not limited to this. For example, theanode 20 may be attached to theshield plate 40, and thecathode 30 may be installed in thesolution tank 10 in such a way that the height of thecathode 30 can be changed. Moreover, an anode plate may be an object to be electroplated and placed in a lower position than a cathode plate. In this case, an anodic film, which is an oxide film, may be formed on a surface of the anode plate. - Moreover, in the present embodiment, description has been given to an example where only the ring sealing members (not shown) are used to fluid-tightly seal between the
wafer 31 and thefirst insulator 33 and between thefirst insulator 33 and thesecond insulator 34 respectively. However, the present invention is not limited to this. For example, air pressure of the back side of thewafer 31 can be made and kept negative using a pump (not shown) or the like in order to affix thewhole wafer 31 on a surface of the ring sealing member with even pressure so as to improve the sealing performance of the ring sealing member. In this case, the sealingmember 70 also has a function to prevent a problem that the electroplating solution infiltrates into a portion other than thesurface 31A of thewafer 31 in combination with the ring sealing members. - Furthermore, as shown in
FIG. 5 , in the present embodiment, description has been given to an example where the connectingrod 64 of themixing tool 60 is formed as a round rod. However, the present invention is not limited to this. For example, the cross section of the connectingrod 64 of themixing tool 60 may be formed in a quadrangle, a triangle, or other shape. - According to the present invention, a thickness of an electroplating film formed on a surface to be electroplated of an object to be electroplated can be equalized all over the surface so as to improve quality of the electroplating film. In addition, it is easy to install a cathode plate and an anode plate horizontally inside a solution tank through an opening provided in a side plate of the solution tank so as to improve work efficiency of installing the plates. Moreover, a large scale device which rotates the solution tank by 90 degrees is not required. As a result, a whole electroplating apparatus is possible to be downsized and simplified.
- While the described embodiments represent the preferred forms of the present invention, it is to be distinctly understood that the invention is not limited thereto but may be otherwise variously embodied within the spirit and scope of the following claims.
Claims (6)
1. An electroplating apparatus, comprising:
a solution tank which has at least a bottom plate and a side plate and inside which electroplating solution is poured; and
a cathode plate and an anode plate which are horizontally placed so as to face each other in the electroplating solution in the solution tank, wherein
one plate of the cathode plate and the anode plate is an object to be electroplated and placed in a lower position than the other plate, wherein
an opening through which the cathode plate and the anode plate are inserted into the solution tank is provided in the side plate of the solution tank, and wherein
a shield plate which is detachable shields the opening of the solution tank.
2. An electroplating apparatus according to claim 1 , wherein a slot which holds the cathode plate and/or the anode plate horizontally is provided in the side plate of the solution tank.
3. An electroplating apparatus according to claim 1 , wherein a plurality of slots which hold the cathode plate and/or the anode plate horizontally are vertically arranged in the side plate of the solution tank in order to adjust a height of the cathode plate and/or the anode plate.
4. An electroplating apparatus according to claim 3 , wherein the slots are used to adjust a height of the other plate, wherein
a conductive member which conducts electricity to the other plate is inserted downward from above toward inside of the solution tank into the other plate so as to be electrically connected to the other plate, and wherein
the conductive member is supported in the solution tank in such a manner that a height of the conductive member is adjustable corresponding to the height of the other plate.
5. An electroplating apparatus according to claim 4 , wherein the one plate is cantilevered and attached to the shield plate.
6. An electroplating apparatus according to claim 5 , wherein a conductive member which conducts electricity to the one plate passes through the shield plate horizontally toward inside of the solution tank so as to be electrically connected to the one plate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-125538 | 2005-04-22 | ||
JP2005125538A JP2006299367A (en) | 2005-04-22 | 2005-04-22 | Electroplating tester |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060237304A1 true US20060237304A1 (en) | 2006-10-26 |
Family
ID=36809576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/377,415 Abandoned US20060237304A1 (en) | 2005-04-22 | 2006-03-17 | Electroplating apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060237304A1 (en) |
EP (1) | EP1717352A3 (en) |
JP (1) | JP2006299367A (en) |
KR (1) | KR20060111385A (en) |
CN (1) | CN1865519B (en) |
TW (1) | TW200637935A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112853445A (en) * | 2021-01-08 | 2021-05-28 | 上海戴丰科技有限公司 | Horizontal electroplating pool with laterally-pulled anode for wafer and horizontal electroplating device for wafer |
US11332843B2 (en) * | 2019-10-30 | 2022-05-17 | Ebara Corporation | Anode assembly |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009006282A1 (en) * | 2009-01-27 | 2010-07-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process for the production of metallic crystalline surface structures by means of galvanic metal deposition |
EP2246460A1 (en) * | 2009-04-28 | 2010-11-03 | Golden Eagle Trading Ltd | Installation for the treatment of part surfaces |
JP6226229B2 (en) * | 2013-08-19 | 2017-11-08 | 株式会社山本鍍金試験器 | Plating apparatus and sensor apparatus using the same |
KR102373893B1 (en) * | 2018-03-13 | 2022-03-11 | 가부시키가이샤 야마모토메키시켄키 | Plating equipment and plating system |
CN110565154A (en) * | 2019-09-06 | 2019-12-13 | 陕西汉和新材料科技有限公司 | novel copper foil anti-oxidation electroplating anode plate |
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- 2006-03-16 EP EP06005414A patent/EP1717352A3/en not_active Withdrawn
- 2006-03-17 US US11/377,415 patent/US20060237304A1/en not_active Abandoned
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CN112853445A (en) * | 2021-01-08 | 2021-05-28 | 上海戴丰科技有限公司 | Horizontal electroplating pool with laterally-pulled anode for wafer and horizontal electroplating device for wafer |
Also Published As
Publication number | Publication date |
---|---|
KR20060111385A (en) | 2006-10-27 |
CN1865519A (en) | 2006-11-22 |
TW200637935A (en) | 2006-11-01 |
CN1865519B (en) | 2010-08-11 |
EP1717352A3 (en) | 2007-01-17 |
EP1717352A2 (en) | 2006-11-02 |
JP2006299367A (en) | 2006-11-02 |
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