US20060244127A1 - Integrated stacked microchannel heat exchanger and heat spreader - Google Patents
Integrated stacked microchannel heat exchanger and heat spreader Download PDFInfo
- Publication number
- US20060244127A1 US20060244127A1 US11/453,428 US45342806A US2006244127A1 US 20060244127 A1 US20060244127 A1 US 20060244127A1 US 45342806 A US45342806 A US 45342806A US 2006244127 A1 US2006244127 A1 US 2006244127A1
- Authority
- US
- United States
- Prior art keywords
- heat exchanger
- microchannel heat
- stacked microchannel
- die
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
- F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Definitions
- Integrated circuits such as microprocessors generate heat when they operate and frequently this heat must be dissipated or removed from the integrated circuit die to prevent overheating. This is particularly true when the microprocessor is used in a notebook computer or other compact device where space is tightly constrained and more traditional die cooling techniques such as direct forced air cooling are impractical to implement.
- a typical microchannel heat exchanger consists of a silicon substrate in which microchannels have been formed using a subtractive microfabrication process such as deep reactive ion etching or electro-discharge machining.
- Typical microchannels are rectangular in cross-section with widths of about 100 m and depths of between 100-300 m.
- the microchannels improve a heat exchanger s coefficient of heat transfer by increasing the conductive surface area in the heat exchanger. Heat conducted into the fluid filling the channels can be removed simply by withdrawing the heated fluid.
- the microchannel heat exchanger is part of a closed loop cooling system that uses a pump to cycle a fluid such as water between the microchannel heat exchanger where the fluid absorbs heat from a microprocessor or other integrated circuit die and a remote heat sink where the fluid is cooled.
- Heat transfer between the microchannel walls and the fluid is greatly improved if sufficient heat is conducted into the fluid to cause it to vaporize.
- Such two-phase cooling enhances the efficiency of the microchannel heat exchanger because significant thermal energy above and beyond that which can be simply conducted into the fluid is consumed in overcoming the fluid s latent heat of vaporization. This latent heat is then expelled from the system when the fluid vapor condenses back to liquid form in the remote heat sink.
- Water is a particularly useful fluid to use in two-phase systems because it is cheap, has a high heat (or enthalpy) of vaporization and boils at a temperature that is well suited to cooling integrated circuits.
- microchannel heat exchangers can be enhanced by vertically stacking multiple layers of microchannel structures to form a stacked microchannel heat exchanger. Stacked microchannel heat exchangers are more efficient at removing heat from ICs because each additional layer of microchannels doubles the surface area for heat exchange per unit area of the heat exchanger.
- heat exchangers are not physically coupled directly to an IC die or package but, rather, are coupled to a metallic heat spreader that is itself coupled to the IC die or package.
- a typical heat exchanger often precludes coupling the heat exchanger directly to the heat spreader thus requiring the addition of a heat pipe or other thermally conductive structure to provide the physical and thermal coupling between the heat exchanger and the heat spreader.
- Heat pipes or similar devices are bulky and occupy valuable space within a mobile computing system.
- FIG. 1 is a cross-section view of an integrated stacked microchannel heat exchanger and spreader including a stacked microchannel heat exchanger coupled to an integrated circuit (IC) die by a layer of solder in accordance with an embodiment of the invention
- FIG. 2 is a cross-section view of an integrated stacked microchannel heat exchanger and heat spreader including a stacked microchannel heat exchanger coupled to an IC die by a layer of solder and a layer of solderable material in accordance with an embodiment of the invention
- FIG. 3 is a cross-section view of an integrated stacked microchannel heat exchanger and heat spreader including a stacked microchannel heat exchanger coupled to an IC die by a layer of adhesive in accordance with an embodiment of the invention
- FIG. 4 is a cross-section view of an integrated stacked microchannel heat exchanger and heat spreader including a stacked microchannel heat exchanger coupled to an IC die using a thermal interface material and fasteners in accordance with an embodiment of the invention
- FIG. 5 is a block diagram of a mobile computer system employing a closed loop two-phase cooling system including an integrated stacked microchannel heat exchanger and heat spreader in accordance with an embodiment of the invention
- FIG. 6 is a schematic diagram of a closed loop cooling system employing an integrated stacked microchannel heat exchanger and heat spreader in accordance with an embodiment of the invention.
- FIG. 7 is a flow diagram representing implementation of a method for cooling ICs using an integrated stacked microchannel heat exchanger and heat spreader in accordance with an embodiment of the invention
- Embodiments of integrated stacked microchannel heat exchanger and spreader apparatus, cooling systems employing the same and methods for cooling electronic components using the same are described.
- numerous specific details such as cooling apparatus and system implementations, types and interrelationships of cooling apparatus and system components, and particular embodiments of integrated stacked microchannel heat exchanger and spreaders are set forth in order to provide a more thorough understanding of the present invention. It will be appreciated, however, by one skilled in the art that embodiments of the invention may be practiced without such specific details or by utilizing, for example, different embodiments of integrated stacked microchannel heat exchanger and spreaders.
- references in the specification to one embodiment, an embodiment, an example embodiment, etc. indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described. Moreover, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
- FIG. 1 A number of figures show block diagrams of apparatus and systems comprising integrated stacked microchannel heat exchanger and spreaders, in accordance with embodiments of the invention.
- FIG. 1 A number of figures show block diagrams of apparatus and systems comprising integrated stacked microchannel heat exchanger and spreaders, in accordance with embodiments of the invention.
- FIG. 1 A number of figures show block diagrams of apparatus and systems comprising integrated stacked microchannel heat exchanger and spreaders, in accordance with embodiments of the invention.
- FIG. 1 A number of figures show block diagrams of apparatus and systems comprising integrated stacked microchannel heat exchanger and spreaders, in accordance with embodiments of the invention.
- FIG. 1 A number of figures show block diagrams of apparatus and systems comprising integrated stacked microchannel heat exchanger and spreaders, in accordance with embodiments of the invention.
- FIG. 1 A number of figures show block diagrams of apparatus and systems comprising integrated stacked microchannel heat exchanger and spreaders, in accordance with embodiments of the invention.
- FIG. 1 A number of figures show
- a stacked microchannel heat exchanger is coupled to an IC die or package using an intervening heat spreader to form an integrated heat exchanger and heat spreader.
- An intervening heat spreader to form an integrated heat exchanger and heat spreader.
- a variety of different types or forms of well-known heat spreaders can be used consistent with the invention, thus, while several embodiments of the invention are described in detail below, other types or forms of heat spreader may be used in combination with a stacked microchannel heat exchanger without departing from the scope or spirit of the invention.
- FIG. I illustrates in cross-sectional view one embodiment of an integrated stacked microchannel heat exchanger and heat spreader 100 in accordance with the invention including a stacked microchannel heat exchanger 102 physically and thermally coupled to an IC die 104 by a layer of solder 106 .
- An epoxy underfill 108 is typically employed to strengthen the interface between die 104 and the substrate 110 that die 104 is flip-bonded to by a plurality of solder bumps 112 .
- FIG. 1 illustrates die 104 flip-bonded by a plurality of solder bumps 112
- other methods of bonding die 104 to substrate 110 may be used in combination with a stacked microchannel heat exchanger without departing from the scope or spirit of the invention.
- Stacked microchannel heat exchanger 102 includes several vertically stacked layers of generally rectangular microchannels 114 having open ends and extending the length of heat exchanger 102 .
- FIG. 1 and the figures that follow the dimensions of microchannels 114 are exaggerated for clarity. The invention is not limited by the number of vertically stacked microchannel layers and the total number of microchannels in heat exchanger 102 .
- the dimensions of microchannels 114 , the number of vertically stacked microchannel layers and the total number of microchannels can vary depending on the cooling needs of die 104 .
- Heat exchanger 102 is one example of a stacked microchannel heat exchanger that may be formed using one of many well-known techniques common to industry practices. For example, single layers of microchannels 114 may be formed in thinned silicon wafers using techniques including but not limited to electro-discharge micromachining, chemical etching and laser ablation. The individual wafers of microchannel-bearing silicon may then be vertically stacked and bonded together to form stacked microchannel heat exchanger 102 . In operation, heat exchanger 102 acts as a thermal mass to absorb heat conducted from the integrated circuits within die 104 .
- die 104 and microchannel heat exchanger 102 are silicon and solder 106 is an interstitial solder such as a low-melting point indium solder for example.
- solder° 106 may initially comprise a solder preform having a pre-formed shape conducive to the particular configuration of the bonding surfaces. The solder preform is placed between the die 104 and heat exchanger 102 during a pre-assembly operation and then heated to a reflow temperature at which point the solder melts. The temperature of the solder and joined components are then lowered until the solder solidifies, thus forming a bond between the joined components.
- FIG. 2 illustrates in cross-sectional view one embodiment of an integrated stacked microchannel heat exchanger and heat spreader 200 in accordance with the invention including a stacked microchannel heat exchanger 102 physically and thermally coupled to an IC die 104 by a layer of solder 202 and a layer of solderable material 204 .
- solderable material° 204 may comprise any material to which the selected solder will bond. Such materials include but are not limited to metals such as copper (Cu), gold (Au), nickel (Ni), aluminum (Al), titanium (Ti), tantalum (Ta), silver (Ag) and Platinum (Pt).
- the layer of solderable material comprises a base metal over which another metal is formed as a top layer.
- the solderable material comprises a noble metal; such materials resist oxidation at solder reflow temperatures, thereby improving the quality of the soldered joints.
- the layer (or layers) of solderable material may be formed over the top surface of the die° 104 using one of many well-known techniques common to industry practices. For example, such techniques include but are not limited to sputtering, vapor deposition (chemical and physical), and plating.
- the formation of the solderable material layer may occur prior to die fabrication (i.e., at the wafer level) or after die fabrication processes are performed.
- solder° 202 may initially comprise a solder preform having a pre-formed shape conducive to the particular configuration of the bonding surfaces.
- FIG. 3 illustrates in cross-sectional view one embodiment of an integrated stacked microchannel heat exchanger and heat spreader 300 in accordance with the invention including a stacked microchannel heat exchanger 102 physically and thermally coupled to an IC die 104 by a layer of adhesive 302 .
- heat exchanger 102 and die 104 are both formed from silicon and adhesive 302 is a silicon-to-silicon bonding adhesive such as bisbenzocyclobutene (BCB) for example.
- BCB and similar polymers provide good heat conduction, are mechanically strong and stable up to temperatures of 300 . . . C.
- adhesive 302 is a thermal adhesive.
- Thermal adhesives sometimes called thermal epoxies, are a class of adhesives that provide good to excellent conductive heat transfer rates.
- a thermal adhesive will employ fine portions (e.g., granules, slivers, flakes, micronized, etc.) of a metal or ceramic, such as silver or alumina, distributed within in a carrier (the adhesive), such as epoxy.
- stacked microchannel heat exchanger 102 need not comprise a metal.
- stacked microchannel heat exchanger 102 may be made of any material that provides good conductive heat transfer properties.
- a ceramic carrier material embedded with metallic pieces in a manner similar to the thermal adhesives discussed above may be employed for the stacked microchannel heat exchanger 102 .
- a heat exchanger of similar properties may be employed in the embodiment of FIG. 2 if another layer of solderable material is formed over the base of the stacked microchannel heat exchanger 102 .
- FIG. 4 illustrates, in accordance with an embodiment of the invention, an integrated stacked microchannel heat exchanger and heat spreader 400 comprising stacked microchannel heat exchanger 102 coupled thermally to an integrated circuit (IC) die 104 via a Thermal Interface Material (TIM) 402 and coupled operatively to substrate 110 to which the IC die 104 is flip-bonded by a plurality of solder bumps 112 .
- IC integrated circuit
- TIM Thermal Interface Material
- TIM layer 402 serves several purposes; first, it provides a conductive heat transfer path from die 104 to heat exchanger 102 and, second, because TIM layer 402 is very compliant and adheres well to both the die 104 and heat exchanger 102 , it acts as a flexible buffer to accommodate physical stress resulting from differences in the coefficients of thermal expansion (CTE) between die 104 and heat exchanger 102 .
- CTE coefficients of thermal expansion
- Stacked microchannel heat exchanger 102 of integrated stacked microchannel heat exchanger and heat spreader 400 is physically coupled to substrate 108 through a plurality of fasteners 404 each one of the plurality of fasteners 404 coupled to a respective one of a plurality of standoffs 406 mounted on substrate 110 .
- the illustrated fasteners 404 and standoffs 406 are just one example of a number of well known assembly techniques that can be used to physically couple heat exchanger 102 to die 104 .
- heat exchanger 102 is coupled to die 104 using clips mounted on substrate 110 and extending over heat exchanger 102 in order to press heat exchanger 102 against TIM layer 402 and die 104 .
- FIGS. 1 thru 4 illustrate stacked microchannel heat exchanger 102 thermally and operatively coupled to IC die 104
- the invention is not limited in this respect and one of ordinary skill in the art will appreciate that stacked heat exchanger 102 can be thermally and operatively coupled to an IC package containing one or more IC die to form integrated stacked microchannel heat exchanger and heat spreaders while remaining within the scope and spirit of the invention.
- FIG. 5 illustrates one embodiment in accordance with the invention of a mobile computer system 500 having a closed loop two-phase cooling system 502 including an integrated stacked microchannel heat exchanger and spreader (not shown) coupled thermally and operatively to an integrated circuit (IC) die or package 504 .
- System 500 includes a bus 506 , which in an embodiment, may be a Peripheral Component Interface (PCI) bus, linking die or package 504 to a network interface 508 and an antenna 510 .
- Network interface 508 provides an interface between IC die 504 and communications entering or leaving system 500 via antenna 510 .
- the stacked microchannel heat exchanger within cooling system 502 acts as a thermal mass to absorb thermal energy from, and thereby cool, die or package 504 .
- Cooling system 502 is described in more detail below with respect to FIG. 6 . While the embodiment of system 500 is a mobile computer system, the invention is not limited in this respect and other embodiments of systems incorporating cooling systems utilizing integrated stacked microchannel heat exchanger and spreaders in accordance with the invention include, for example, desktop computer systems, server computer systems and computer gaming consoles to name only a few possibilities.
- FIG. 6 illustrates one embodiment in accordance with the invention of closed loop two-phase cooling system 502 having a stacked microchannel heat exchanger 102 coupled thermally and operatively to an integrated circuit (IC) die (not shown).
- System 502 further includes a heat rejecter° 600 and a pump° 602 .
- System 502 takes advantage of the fact, as discussed earlier, that a fluid undergoing a phase transition from a liquid state to a vapor state absorbs a significant amount of energy, known as latent heat, or heat of vaporization. This absorbed heat having been converted into potential energy in the form of the fluid s vapor state can be subsequently removed from the fluid by returning the vapor phase back to liquid.
- the stacked microchannels which typically have hydraulic diameters on the order of hundred-micrometers, are very effective for facilitating the phase transfer from liquid to vapor.
- System 502 functions as follows. As the die circuitry generates heat, the heat is conducted into stacked microchannel heat exchanger 102 . The heat increases the temperature of the thermal mass represented by heat exchanger 102 , thereby heating the temperature of the walls in the stacked microchannels. Liquid is pushed by pump° 602 into an inlet port° 604 , where it enters the inlet ends of the stacked microchannels. As the liquid passes through the stacked microchannels, further heat transfer takes place between the microchannel walls and the liquid. Under a properly configured heat exchanger, a portion of the fluid exits the stacked microchannels as vapor at an outlet port° 606 . The vapor then enters heat rejecter- 600 .
- the heat rejecter comprises a second heat exchanger that performs the reverse phase transformation as stacked microchannel heat exchanger° 102 —that is, it converts the vapor entering at an inlet end back to a liquid at the outlet of the heat rejecter. The liquid is then received at an inlet side of pump° 602 , thus completing the cooling cycle.
- the pump 602 used in the closed loop cooling system 502 employing integrated stacked microchannel heat exchanger and heat spreaders in accordance with the embodiments described herein may comprise electromechanical (e.g., MEMS-based) or electro-osmotic pumps (also referred to as “electric kinetic” or “E-K” pumps).
- Electro-osmotic pumps are advantageous over electromechanical pumps because they do not have any moving parts and hence are more reliable than electromechanical pumps. Since both of these pump technologies are known in the microfluidic arts, further details are not provided herein.
- system 502 acts to transfer the heat rejection process from the IC die or package, which, for example, is typically somewhat centrally located within the chassis of a notebook computer to the location of the heat rejecter heat exchanger, which can be located anywhere within the chassis, or even externally.
- FIG. 7 illustrates a flow diagram representing implementation of a method for cooling ICs using an integrated stacked microchannel heat exchanger and heat spreader in accordance with an embodiment of the invention.
- the ICs being cooled include a processor IC and can include additional components such as platform chipset ICs, memory ICs, video ICs, co-processors or other ICs. Some or all of the additional ICs can be spatially separated from the processor IC or can be included in an IC package along with processor IC.
- at least one stacked microchannel heat exchanger such as heat exchanger 102 is thermally coupled to a least one IC.
- a working fluid such as water is passed through the stacked microchannel heat exchanger.
- heat is transferred from the IC into working fluid within the stacked microchannel heat exchanger thereby converting a portion of the working fluid from liquid to vapor phase.
- the working fluid exiting the stacked microchannel heat exchanger is passed through a heat rejector where heat is removed from the working fluid converting the working fluid back to a liquid phase.
Abstract
Integrated stacked microchannrel heat exchanger and heat spreaders for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. In one embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an interstitial solder or a solderable material in combination with solder. In another embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an adhesive. In a further embodiment, a stacked microchannel heat exchanger is operatively coupled to an IC die or package by fasteners and is thermally coupled to the IC die or package using a thermal interface material. The integrated stacked microchannel heat exchanger and heat spreaders may be employed in a closed loop cooling system including a pump and a heat rejecter. The integrated stacked microchannel heat exchanger and heat spreaders are configured to support either a two-phase or a single-phase heat transfer process using a working fluid such as water.
Description
- Integrated circuits such as microprocessors generate heat when they operate and frequently this heat must be dissipated or removed from the integrated circuit die to prevent overheating. This is particularly true when the microprocessor is used in a notebook computer or other compact device where space is tightly constrained and more traditional die cooling techniques such as direct forced air cooling are impractical to implement.
- One technique for cooling an integrated circuit die is to attach a fluid-filled microchannel heat exchanger to the die. A typical microchannel heat exchanger consists of a silicon substrate in which microchannels have been formed using a subtractive microfabrication process such as deep reactive ion etching or electro-discharge machining. Typical microchannels are rectangular in cross-section with widths of about 100 m and depths of between 100-300 m. Fundamentally the microchannels improve a heat exchanger s coefficient of heat transfer by increasing the conductive surface area in the heat exchanger. Heat conducted into the fluid filling the channels can be removed simply by withdrawing the heated fluid.
- Typically, the microchannel heat exchanger is part of a closed loop cooling system that uses a pump to cycle a fluid such as water between the microchannel heat exchanger where the fluid absorbs heat from a microprocessor or other integrated circuit die and a remote heat sink where the fluid is cooled. Heat transfer between the microchannel walls and the fluid is greatly improved if sufficient heat is conducted into the fluid to cause it to vaporize. Such two-phase cooling enhances the efficiency of the microchannel heat exchanger because significant thermal energy above and beyond that which can be simply conducted into the fluid is consumed in overcoming the fluid s latent heat of vaporization. This latent heat is then expelled from the system when the fluid vapor condenses back to liquid form in the remote heat sink. Water is a particularly useful fluid to use in two-phase systems because it is cheap, has a high heat (or enthalpy) of vaporization and boils at a temperature that is well suited to cooling integrated circuits.
- The heat removal capacity of microchannel heat exchangers can be enhanced by vertically stacking multiple layers of microchannel structures to form a stacked microchannel heat exchanger. Stacked microchannel heat exchangers are more efficient at removing heat from ICs because each additional layer of microchannels doubles the surface area for heat exchange per unit area of the heat exchanger.
- Conventionally, heat exchangers are not physically coupled directly to an IC die or package but, rather, are coupled to a metallic heat spreader that is itself coupled to the IC die or package. In the context of mobile computing systems the size of a typical heat exchanger often precludes coupling the heat exchanger directly to the heat spreader thus requiring the addition of a heat pipe or other thermally conductive structure to provide the physical and thermal coupling between the heat exchanger and the heat spreader. Heat pipes or similar devices are bulky and occupy valuable space within a mobile computing system.
- The foregoing aspects of this invention will become more readily appreciated by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein like reference numerals refer to like parts throughout the various views unless otherwise specified. In the drawings:
-
FIG. 1 is a cross-section view of an integrated stacked microchannel heat exchanger and spreader including a stacked microchannel heat exchanger coupled to an integrated circuit (IC) die by a layer of solder in accordance with an embodiment of the invention; -
FIG. 2 is a cross-section view of an integrated stacked microchannel heat exchanger and heat spreader including a stacked microchannel heat exchanger coupled to an IC die by a layer of solder and a layer of solderable material in accordance with an embodiment of the invention; -
FIG. 3 is a cross-section view of an integrated stacked microchannel heat exchanger and heat spreader including a stacked microchannel heat exchanger coupled to an IC die by a layer of adhesive in accordance with an embodiment of the invention; -
FIG. 4 is a cross-section view of an integrated stacked microchannel heat exchanger and heat spreader including a stacked microchannel heat exchanger coupled to an IC die using a thermal interface material and fasteners in accordance with an embodiment of the invention; -
FIG. 5 is a block diagram of a mobile computer system employing a closed loop two-phase cooling system including an integrated stacked microchannel heat exchanger and heat spreader in accordance with an embodiment of the invention; -
FIG. 6 is a schematic diagram of a closed loop cooling system employing an integrated stacked microchannel heat exchanger and heat spreader in accordance with an embodiment of the invention; and -
FIG. 7 is a flow diagram representing implementation of a method for cooling ICs using an integrated stacked microchannel heat exchanger and heat spreader in accordance with an embodiment of the invention - Embodiments of integrated stacked microchannel heat exchanger and spreader apparatus, cooling systems employing the same and methods for cooling electronic components using the same are described. In the following description, numerous specific details such as cooling apparatus and system implementations, types and interrelationships of cooling apparatus and system components, and particular embodiments of integrated stacked microchannel heat exchanger and spreaders are set forth in order to provide a more thorough understanding of the present invention. It will be appreciated, however, by one skilled in the art that embodiments of the invention may be practiced without such specific details or by utilizing, for example, different embodiments of integrated stacked microchannel heat exchanger and spreaders. In other instances, methods for manufacturing integrated stacked microchannel heat exchanger and spreaders or specific mechanical details for implementing cooling apparatus or systems, for example, have not been shown in detail in order not to obscure the embodiments of the invention. Those of ordinary skill in the art, with the included descriptions will be able to implement appropriate functionality without undue experimentation.
- References in the specification to one embodiment, an embodiment, an example embodiment, etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described. Moreover, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
- A number of figures show block diagrams of apparatus and systems comprising integrated stacked microchannel heat exchanger and spreaders, in accordance with embodiments of the invention. One or more figures show flow diagrams illustrating operations for making or using integrated stacked microchannel heat exchanger and spreaders likewise in accordance with embodiments of the invention. The operations of the flow diagrams will be described with references to the systems/apparatus shown in the block diagrams. However, it should be understood that the operations of the flow diagrams could be performed by embodiments of systems and apparatus other than those discussed with reference to the block diagrams, and embodiments discussed with reference to the systems/apparatus could perform operations different than those discussed with reference to the flow diagrams.
- Integrated Stacked Microchannel Heat Exchanger and Heat Spreader
- To provide effective heat removal, a stacked microchannel heat exchanger is coupled to an IC die or package using an intervening heat spreader to form an integrated heat exchanger and heat spreader. A variety of different types or forms of well-known heat spreaders can be used consistent with the invention, thus, while several embodiments of the invention are described in detail below, other types or forms of heat spreader may be used in combination with a stacked microchannel heat exchanger without departing from the scope or spirit of the invention.
- FIG. I illustrates in cross-sectional view one embodiment of an integrated stacked microchannel heat exchanger and
heat spreader 100 in accordance with the invention including a stackedmicrochannel heat exchanger 102 physically and thermally coupled to anIC die 104 by a layer ofsolder 106. Anepoxy underfill 108 is typically employed to strengthen the interface between die 104 and thesubstrate 110 that die 104 is flip-bonded to by a plurality ofsolder bumps 112. While the embodiment ofFIG. 1 illustrates die 104 flip-bonded by a plurality ofsolder bumps 112, other methods of bonding die 104 tosubstrate 110 may be used in combination with a stacked microchannel heat exchanger without departing from the scope or spirit of the invention. - Stacked
microchannel heat exchanger 102 includes several vertically stacked layers of generallyrectangular microchannels 114 having open ends and extending the length ofheat exchanger 102. InFIG. 1 and the figures that follow the dimensions ofmicrochannels 114 are exaggerated for clarity. The invention is not limited by the number of vertically stacked microchannel layers and the total number of microchannels inheat exchanger 102. The dimensions ofmicrochannels 114, the number of vertically stacked microchannel layers and the total number of microchannels can vary depending on the cooling needs of die 104. -
Heat exchanger 102 is one example of a stacked microchannel heat exchanger that may be formed using one of many well-known techniques common to industry practices. For example, single layers ofmicrochannels 114 may be formed in thinned silicon wafers using techniques including but not limited to electro-discharge micromachining, chemical etching and laser ablation. The individual wafers of microchannel-bearing silicon may then be vertically stacked and bonded together to form stackedmicrochannel heat exchanger 102. In operation,heat exchanger 102 acts as a thermal mass to absorb heat conducted from the integrated circuits within die 104. - In one embodiment die 104 and
microchannel heat exchanger 102 are silicon andsolder 106 is an interstitial solder such as a low-melting point indium solder for example. In one embodiment solder°106 may initially comprise a solder preform having a pre-formed shape conducive to the particular configuration of the bonding surfaces. The solder preform is placed between thedie 104 andheat exchanger 102 during a pre-assembly operation and then heated to a reflow temperature at which point the solder melts. The temperature of the solder and joined components are then lowered until the solder solidifies, thus forming a bond between the joined components. -
FIG. 2 illustrates in cross-sectional view one embodiment of an integrated stacked microchannel heat exchanger andheat spreader 200 in accordance with the invention including a stackedmicrochannel heat exchanger 102 physically and thermally coupled to anIC die 104 by a layer ofsolder 202 and a layer ofsolderable material 204. - Generally, solderable material°204 may comprise any material to which the selected solder will bond. Such materials include but are not limited to metals such as copper (Cu), gold (Au), nickel (Ni), aluminum (Al), titanium (Ti), tantalum (Ta), silver (Ag) and Platinum (Pt). In one embodiment, in a process termed backside. metallization, the layer of solderable material comprises a base metal over which another metal is formed as a top layer. In another embodiment, the solderable material comprises a noble metal; such materials resist oxidation at solder reflow temperatures, thereby improving the quality of the soldered joints.
- Generally, the layer (or layers) of solderable material may be formed over the top surface of the die°104 using one of many well-known techniques common to industry practices. For example, such techniques include but are not limited to sputtering, vapor deposition (chemical and physical), and plating. The formation of the solderable material layer may occur prior to die fabrication (i.e., at the wafer level) or after die fabrication processes are performed. In one embodiment solder°202 may initially comprise a solder preform having a pre-formed shape conducive to the particular configuration of the bonding surfaces.
-
FIG. 3 illustrates in cross-sectional view one embodiment of an integrated stacked microchannel heat exchanger andheat spreader 300 in accordance with the invention including a stackedmicrochannel heat exchanger 102 physically and thermally coupled to an IC die 104 by a layer ofadhesive 302. In one embodiment,heat exchanger 102 and die 104 are both formed from silicon and adhesive 302 is a silicon-to-silicon bonding adhesive such as bisbenzocyclobutene (BCB) for example. BCB and similar polymers provide good heat conduction, are mechanically strong and stable up to temperatures of 300 . . . C. In another embodiment, adhesive 302 is a thermal adhesive. Thermal adhesives, sometimes called thermal epoxies, are a class of adhesives that provide good to excellent conductive heat transfer rates. Typically, a thermal adhesive will employ fine portions (e.g., granules, slivers, flakes, micronized, etc.) of a metal or ceramic, such as silver or alumina, distributed within in a carrier (the adhesive), such as epoxy. - A further consideration related to the embodiment of
FIG. 3 is that the stacked microchannel heat exchanger need not comprise a metal. In general, stackedmicrochannel heat exchanger 102 may be made of any material that provides good conductive heat transfer properties. For example, a ceramic carrier material embedded with metallic pieces in a manner similar to the thermal adhesives discussed above may be employed for the stackedmicrochannel heat exchanger 102. It is additionally noted that a heat exchanger of similar properties may be employed in the embodiment ofFIG. 2 if another layer of solderable material is formed over the base of the stackedmicrochannel heat exchanger 102. -
FIG. 4 illustrates, in accordance with an embodiment of the invention, an integrated stacked microchannel heat exchanger andheat spreader 400 comprising stackedmicrochannel heat exchanger 102 coupled thermally to an integrated circuit (IC) die 104 via a Thermal Interface Material (TIM) 402 and coupled operatively tosubstrate 110 to which the IC die 104 is flip-bonded by a plurality of solder bumps 112.TIM layer 402 serves several purposes; first, it provides a conductive heat transfer path fromdie 104 toheat exchanger 102 and, second, becauseTIM layer 402 is very compliant and adheres well to both thedie 104 andheat exchanger 102, it acts as a flexible buffer to accommodate physical stress resulting from differences in the coefficients of thermal expansion (CTE) betweendie 104 andheat exchanger 102. - Stacked
microchannel heat exchanger 102 of integrated stacked microchannel heat exchanger andheat spreader 400 is physically coupled tosubstrate 108 through a plurality offasteners 404 each one of the plurality offasteners 404 coupled to a respective one of a plurality ofstandoffs 406 mounted onsubstrate 110. The illustratedfasteners 404 andstandoffs 406 are just one example of a number of well known assembly techniques that can be used to physically coupleheat exchanger 102 to die 104. In another embodiment, for example,heat exchanger 102 is coupled to die 104 using clips mounted onsubstrate 110 and extending overheat exchanger 102 in order to pressheat exchanger 102 againstTIM layer 402 and die 104. - While FIGS. 1 thru 4 illustrate stacked
microchannel heat exchanger 102 thermally and operatively coupled to IC die 104, the invention is not limited in this respect and one of ordinary skill in the art will appreciate thatstacked heat exchanger 102 can be thermally and operatively coupled to an IC package containing one or more IC die to form integrated stacked microchannel heat exchanger and heat spreaders while remaining within the scope and spirit of the invention. - Cooling Systems
-
FIG. 5 illustrates one embodiment in accordance with the invention of amobile computer system 500 having a closed loop two-phase cooling system 502 including an integrated stacked microchannel heat exchanger and spreader (not shown) coupled thermally and operatively to an integrated circuit (IC) die orpackage 504.System 500 includes abus 506, which in an embodiment, may be a Peripheral Component Interface (PCI) bus, linking die orpackage 504 to anetwork interface 508 and anantenna 510.Network interface 508 provides an interface between IC die 504 and communications entering or leavingsystem 500 viaantenna 510. The stacked microchannel heat exchanger withincooling system 502 acts as a thermal mass to absorb thermal energy from, and thereby cool, die orpackage 504.Cooling system 502 is described in more detail below with respect toFIG. 6 . While the embodiment ofsystem 500 is a mobile computer system, the invention is not limited in this respect and other embodiments of systems incorporating cooling systems utilizing integrated stacked microchannel heat exchanger and spreaders in accordance with the invention include, for example, desktop computer systems, server computer systems and computer gaming consoles to name only a few possibilities. -
FIG. 6 illustrates one embodiment in accordance with the invention of closed loop two-phase cooling system 502 having a stackedmicrochannel heat exchanger 102 coupled thermally and operatively to an integrated circuit (IC) die (not shown).System 502 further includes a heat rejecter°600 and a pump°602.System 502 takes advantage of the fact, as discussed earlier, that a fluid undergoing a phase transition from a liquid state to a vapor state absorbs a significant amount of energy, known as latent heat, or heat of vaporization. This absorbed heat having been converted into potential energy in the form of the fluid s vapor state can be subsequently removed from the fluid by returning the vapor phase back to liquid. The stacked microchannels, which typically have hydraulic diameters on the order of hundred-micrometers, are very effective for facilitating the phase transfer from liquid to vapor. -
System 502 functions as follows. As the die circuitry generates heat, the heat is conducted into stackedmicrochannel heat exchanger 102. The heat increases the temperature of the thermal mass represented byheat exchanger 102, thereby heating the temperature of the walls in the stacked microchannels. Liquid is pushed by pump°602 into an inlet port°604, where it enters the inlet ends of the stacked microchannels. As the liquid passes through the stacked microchannels, further heat transfer takes place between the microchannel walls and the liquid. Under a properly configured heat exchanger, a portion of the fluid exits the stacked microchannels as vapor at an outlet port°606. The vapor then enters heat rejecter-600. The heat rejecter comprises a second heat exchanger that performs the reverse phase transformation as stacked microchannel heat exchanger°102—that is, it converts the vapor entering at an inlet end back to a liquid at the outlet of the heat rejecter. The liquid is then received at an inlet side of pump°602, thus completing the cooling cycle. - Generally, the
pump 602 used in the closedloop cooling system 502 employing integrated stacked microchannel heat exchanger and heat spreaders in accordance with the embodiments described herein may comprise electromechanical (e.g., MEMS-based) or electro-osmotic pumps (also referred to as “electric kinetic” or “E-K” pumps). Electro-osmotic pumps are advantageous over electromechanical pumps because they do not have any moving parts and hence are more reliable than electromechanical pumps. Since both of these pump technologies are known in the microfluidic arts, further details are not provided herein. - In this
manner system 502 acts to transfer the heat rejection process from the IC die or package, which, for example, is typically somewhat centrally located within the chassis of a notebook computer to the location of the heat rejecter heat exchanger, which can be located anywhere within the chassis, or even externally. -
FIG. 7 illustrates a flow diagram representing implementation of a method for cooling ICs using an integrated stacked microchannel heat exchanger and heat spreader in accordance with an embodiment of the invention. In the embodiment ofFIG. 7 the ICs being cooled include a processor IC and can include additional components such as platform chipset ICs, memory ICs, video ICs, co-processors or other ICs. Some or all of the additional ICs can be spatially separated from the processor IC or can be included in an IC package along with processor IC. Inblock 702, at least one stacked microchannel heat exchanger such asheat exchanger 102 is thermally coupled to a least one IC. Inblock 704, a working fluid such as water is passed through the stacked microchannel heat exchanger. Atblock 706, heat is transferred from the IC into working fluid within the stacked microchannel heat exchanger thereby converting a portion of the working fluid from liquid to vapor phase. Finally, atblock 708, the working fluid exiting the stacked microchannel heat exchanger is passed through a heat rejector where heat is removed from the working fluid converting the working fluid back to a liquid phase. - Thus, methods, apparatuses and systems of integrated stacked microchannel heat exchanger and heat spreaders have been described. Although the invention has been described with reference to specific exemplary embodiments, it will be evident that various modifications and changes may be made to these embodiments without departing from the broader spirit and scope of the invention. For example, while the method, apparatuses and systems for utilizing integrated stacked microchannel heat exchanger and heat spreaders are described in reference to the invention s use in a two-phase liquid cooling system, in other embodiments, such method and systems are applicable to use in a single-phase cooling system. Therefore, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense.
Claims (31)
1-30. (canceled)
31. A system, comprising:
an integrated circuit (IC) die; a stacked microchannel heat exchanger operatively and thermally coupled to the IC die;
a pump, having an inlet and an outlet, said outlet fluidly coupled to an inlet of the stacked microchannel heat exchanger; and
a heat rejecter, having an inlet fluidly coupled to an outlet of the stacked microchannel heat exchanger and an outlet fluidly coupled to the inlet of the pump, wherein the system employs a working fluid that transfers heat generated by the IC die to the heat rejecter using a two-phase heat exchange mechanism.
32. The system of claim 31 , wherein the working fluid is water.
33. The system of claim 31 , wherein the pump comprises an electro osmotic pump.
34. The system of claim 31 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC die by a layer of solder disposed between the stacked microchannel heat exchanger and the surface of the IC die.
35. The system of claim 31 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC die by an adhesive disposed between the stacked microchannel heat exchanger and the surface of the IC die.
36. The system of claim 31 , wherein the stacked microchannel heat exchanger is thermally coupled to the IC die by a thermal interface material (TIM) layer.
37. The system of claim 31 , further comprising:
a solderable layer formed on the IC die, wherein the stacked microchannel heat exchanger is operatively and thermally coupled to the IC die by the solderable layer.
38. A system, comprising:
an integrated circuit (IC) package; a stacked microchannel heat exchanger operatively and thermally coupled to the IC die;
a pump, having an inlet and an outlet, said outlet fluidly coupled to an inlet of the stacked microchannel heat exchanger; and
a heat rejecter, having an inlet fluidly coupled to an outlet of the stacked microchannel heat exchanger and an outlet fluidly coupled to the inlet of the pump, wherein the system employs a working fluid that transfers heat generated by the IC die to the heat rejecter using a two-phase heat exchange mechanism.
39. The system of claim 38 , wherein the working fluid is water.
40. The system of claim 38 , wherein the pump comprises an electro osmotic pump.
41. The system of claim 38 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC package by a layer of solder disposed between the stacked microchannel heat exchanger and the surface of the IC package.
42. The system of claim 38 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC package by an adhesive disposed between the stacked microchannel heat exchanger and the surface of the IC package.
43. The system of claim 38 , wherein the stacked microchannel heat exchanger is thermally coupled to the IC package by a thermal interface material (TIM) layer.
44. The system of claim 38 , further comprising:
a solderable layer formed on the IC package, wherein the stacked microchannel heat exchanger is operatively and thermally coupled to the IC package by the solderable layer.
45. A system comprising:
an integrated circuit (IC) die;
a network interface;
an antenna coupled to the network interface;
a bus, said bus coupling the IC die to the network interface; and
a thermal mass coupled to the IC die, the thermal mass comprising a stacked microchannel heat exchanger.
46. The system of claim 45 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC die by a layer of solder disposed between the stacked microchannel heat exchanger and the surface of the IC die.
47. The system of claim 45 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC die by an adhesive disposed between the stacked microchannel heat exchanger and the surface of the IC die.
48. The system of claim 45 , wherein the stacked microchannel heat exchanger is thermally coupled to the IC die by a thermal interface material (TIM) layer.
49. The system of claim 45 , further comprising:
a solderable layer formed on the IC die, wherein the stacked microchannel heat exchanger is operatively and thermally coupled to the IC die by the solderable layer.
50. A system comprising:
an integrated circuit (IC) package;
a network interface;
an antenna coupled to the network interface;
a bus, said bus coupling the IC package to the network interface; and
a thermal mass coupled to the IC package, the thermal mass comprising a stacked microchannel heat exchanger.
51. The system of claim 50 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC package by a layer of solder disposed between the stacked microchannel heat exchanger and the surface of the IC package.
52. The system of claim 50 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC package by an adhesive disposed between the stacked microchannel heat exchanger and the surface of the IC package.
53. The system of claim 50 , wherein the stacked microchannel heat exchanger is thermally coupled to the IC package by a thermal interface material (TIM) layer.
54. The system of claim 50 , further comprising:
a solderable layer formed on the IC package, wherein the stacked microchannel heat exchanger is operatively and thermally coupled to the IC package by the solderable layer.
55. A method; comprising:
thermally coupling at least one stacked microchannel heat exchanger to at least one IC;
passing a working fluid through the at least one stacked microchannel heat exchanger;
transferring heat produced by the at least one IC via the at least one stacked microchannel heat exchanger to the working fluid to convert a portion of the working fluid passing through the microchannels in the at least one stacked microchannel heat exchanger from a liquid to a vapor phase; and
passing the working fluid exiting the at least one stacked microchannel heat exchanger through a heat rejecter, wherein the vapor phase portion of the working fluid is converted back to a liquid phase.
56. The method of claim 55 , wherein the at least one IC includes a processor IC and at least one additional component from the following group: a platform chipset IC, a video IC, a memory IC and a co-processor IC.
57. The method of claim 55 , wherein the working fluid comprises water.
58. The method of claim 55 , wherein the working fluid is passed through the at least one stacked microchannel heat exchanger and heat rejecter via a electro-osmotic pump.
59. The method of claim 55 , wherein the heat rejecter comprises a channeled heat sink including a plurality of hollow heat sink fins having respective channels defined therein.
60. The method of claim 55 , wherein the heat rejecter comprises a stacked microchannel heat exchanger.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/453,428 US20060244127A1 (en) | 2003-12-31 | 2006-06-14 | Integrated stacked microchannel heat exchanger and heat spreader |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/750,234 US7115987B2 (en) | 2003-12-31 | 2003-12-31 | Integrated stacked microchannel heat exchanger and heat spreader |
US11/453,428 US20060244127A1 (en) | 2003-12-31 | 2006-06-14 | Integrated stacked microchannel heat exchanger and heat spreader |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/750,234 Division US7115987B2 (en) | 2003-12-31 | 2003-12-31 | Integrated stacked microchannel heat exchanger and heat spreader |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060244127A1 true US20060244127A1 (en) | 2006-11-02 |
Family
ID=34701174
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/750,234 Expired - Fee Related US7115987B2 (en) | 2003-12-31 | 2003-12-31 | Integrated stacked microchannel heat exchanger and heat spreader |
US11/453,428 Abandoned US20060244127A1 (en) | 2003-12-31 | 2006-06-14 | Integrated stacked microchannel heat exchanger and heat spreader |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/750,234 Expired - Fee Related US7115987B2 (en) | 2003-12-31 | 2003-12-31 | Integrated stacked microchannel heat exchanger and heat spreader |
Country Status (1)
Country | Link |
---|---|
US (2) | US7115987B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080203416A1 (en) * | 2007-02-22 | 2008-08-28 | Sharp Kabushiki Kaisha | Surface mounting type light emitting diode and method for manufacturing the same |
US20080203417A1 (en) * | 2007-02-22 | 2008-08-28 | Sharp Kabushiki Kaisha | Surface mounting type light emitting diode and method for manufacturing the same |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7271034B2 (en) * | 2004-06-15 | 2007-09-18 | International Business Machines Corporation | Semiconductor device with a high thermal dissipation efficiency |
DE102005033150A1 (en) * | 2005-07-13 | 2007-01-25 | Atotech Deutschland Gmbh | Microstructured cooler and its use |
US7432592B2 (en) * | 2005-10-13 | 2008-10-07 | Intel Corporation | Integrated micro-channels for 3D through silicon architectures |
CA2627182C (en) * | 2005-11-08 | 2011-12-20 | Byd Company Limited | A heat dissipating device for a battery pack, and a battery pack using the same |
US7289326B2 (en) * | 2006-02-02 | 2007-10-30 | Sun Microsystems, Inc. | Direct contact cooling liquid embedded package for a central processor unit |
TWI291752B (en) * | 2006-02-27 | 2007-12-21 | Siliconware Precision Industries Co Ltd | Semiconductor package with heat dissipating device and fabrication method thereof |
US8528628B2 (en) * | 2007-02-08 | 2013-09-10 | Olantra Fund X L.L.C. | Carbon-based apparatus for cooling of electronic devices |
US7468886B2 (en) * | 2007-03-05 | 2008-12-23 | International Business Machines Corporation | Method and structure to improve thermal dissipation from semiconductor devices |
US7548424B2 (en) | 2007-03-12 | 2009-06-16 | Raytheon Company | Distributed transmit/receive integrated microwave module chip level cooling system |
US20080237845A1 (en) * | 2007-03-28 | 2008-10-02 | Jesse Jaejin Kim | Systems and methods for removing heat from flip-chip die |
WO2009078869A1 (en) * | 2007-12-18 | 2009-06-25 | Carrier Corporation | Heat exchanger for shedding water |
US8110415B2 (en) * | 2008-04-03 | 2012-02-07 | International Business Machines Corporation | Silicon based microchannel cooling and electrical package |
WO2010050087A1 (en) * | 2008-10-31 | 2010-05-06 | パナソニック株式会社 | Layered semiconductor device and manufacturing method therefor |
US20100175854A1 (en) * | 2009-01-15 | 2010-07-15 | Luca Joseph Gratton | Method and apparatus for multi-functional capillary-tube interface unit for evaporation, humidification, heat exchange, pressure or thrust generation, beam diffraction or collimation using multi-phase fluid |
US8522569B2 (en) * | 2009-10-27 | 2013-09-03 | Industrial Idea Partners, Inc. | Utilization of data center waste heat for heat driven engine |
WO2013101212A1 (en) * | 2011-12-30 | 2013-07-04 | Intel Corporation | Direct air impingement cooling of package structures |
US9612060B2 (en) | 2010-12-07 | 2017-04-04 | Intel Corporation | Direct air impingement cooling of package structures |
US10962297B2 (en) | 2011-02-21 | 2021-03-30 | Board Of Regents, The University Of Texas System | Multidimensional heat transfer system for cooling electronic components |
WO2015095356A1 (en) * | 2013-12-17 | 2015-06-25 | University Of Florida Research Foundation, Inc. | Hierarchical hydrophilic/hydrophobic micro/nanostructures for pushing the limits of critical heat flux |
US9263366B2 (en) * | 2014-05-30 | 2016-02-16 | International Business Machines Corporation | Liquid cooling of semiconductor chips utilizing small scale structures |
DE102015214928A1 (en) * | 2015-08-05 | 2017-02-09 | Siemens Aktiengesellschaft | Component module and power module |
US10076800B2 (en) * | 2015-11-30 | 2018-09-18 | Cree Fayetteville, Inc. | Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly |
US20170186667A1 (en) * | 2015-12-26 | 2017-06-29 | Intel Corporation | Cooling of electronics using folded foil microchannels |
KR102546241B1 (en) | 2016-10-05 | 2023-06-22 | 삼성전자주식회사 | Semiconductor package |
US10553522B1 (en) | 2018-08-13 | 2020-02-04 | International Business Machines Corporation | Semiconductor microcooler |
US10553516B1 (en) | 2018-08-13 | 2020-02-04 | International Business Machines Corporation | Semiconductor microcooler |
US10490480B1 (en) | 2018-08-21 | 2019-11-26 | International Business Machines Corporation | Copper microcooler structure and fabrication |
US10685900B2 (en) * | 2018-10-22 | 2020-06-16 | Deere & Company | Packaging of a semiconductor device with phase-change material for thermal performance |
US11962129B2 (en) * | 2021-04-09 | 2024-04-16 | Lawrence Livermore National Security, Llc | Systems and methods for laser diode array having integrated microchannel cooling |
US20240006269A1 (en) * | 2022-06-29 | 2024-01-04 | Kambix Innovations, LLC. | Optimization of the thermal performance of the 3d ics utilizing the integrated chip-size double-layer or multi-layer microchannels |
Citations (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4759874A (en) * | 1987-08-03 | 1988-07-26 | The Dow Chemical Company | Benzocyclobutene-based die attach adhesive compositions |
US5727618A (en) * | 1993-08-23 | 1998-03-17 | Sdl Inc | Modular microchannel heat exchanger |
US5913108A (en) * | 1998-04-30 | 1999-06-15 | Cutting Edge Optronics, Inc. | Laser diode packaging |
US6280013B1 (en) * | 1997-11-05 | 2001-08-28 | Hewlett-Packard Company | Heat exchanger for an inkjet printhead |
US20020107006A1 (en) * | 2001-02-05 | 2002-08-08 | Yoshio Nitta | Mobile station and communication system |
US6504721B1 (en) * | 2000-09-29 | 2003-01-07 | Intel Corporation | Thermal cooling apparatus |
US20030062149A1 (en) * | 2001-09-28 | 2003-04-03 | Goodson Kenneth E. | Electroosmotic microchannel cooling system |
US6565386B1 (en) * | 2001-12-26 | 2003-05-20 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector |
US6591625B1 (en) * | 2002-04-17 | 2003-07-15 | Agilent Technologies, Inc. | Cooling of substrate-supported heat-generating components |
US6639799B2 (en) * | 2000-12-22 | 2003-10-28 | Intel Corporation | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment |
US6785134B2 (en) * | 2003-01-06 | 2004-08-31 | Intel Corporation | Embedded liquid pump and microchannel cooling system |
US20040190253A1 (en) * | 2003-03-31 | 2004-09-30 | Ravi Prasher | Channeled heat sink and chassis with integrated heat rejector for two-phase cooling |
US6821819B1 (en) * | 2001-02-21 | 2004-11-23 | Sandia Corporation | Method of packaging and assembling micro-fluidic device |
US20040266063A1 (en) * | 2003-06-25 | 2004-12-30 | Montgomery Stephen W. | Apparatus and method for manufacturing thermal interface device having aligned carbon nanotubes |
US6865081B2 (en) * | 2002-10-02 | 2005-03-08 | Atotech Deutschland Gmbh | Microstructure cooler and use thereof |
US20050062150A1 (en) * | 2003-09-24 | 2005-03-24 | Kim Sarah E. | Packaged electroosmotic pumps using porous frits for cooling integrated circuits |
US6903929B2 (en) * | 2003-03-31 | 2005-06-07 | Intel Corporation | Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink |
US6906919B2 (en) * | 2003-09-30 | 2005-06-14 | Intel Corporation | Two-phase pumped liquid loop for mobile computer cooling |
US20050128702A1 (en) * | 2003-12-12 | 2005-06-16 | Mongia Rajiv K. | Heat exchanger with cooling channels having varying geometry |
US20050169831A1 (en) * | 2004-02-04 | 2005-08-04 | Montgomery Stephen W. | Three-dimensional nanotube structure |
US6934154B2 (en) * | 2003-03-31 | 2005-08-23 | Intel Corporation | Micro-channel heat exchangers and spreaders |
US6981849B2 (en) * | 2002-12-18 | 2006-01-03 | Intel Corporation | Electro-osmotic pumps and micro-channels |
US6992381B2 (en) * | 2003-10-31 | 2006-01-31 | Intel Corporation | Using external radiators with electroosmotic pumps for cooling integrated circuits |
US6992382B2 (en) * | 2003-12-29 | 2006-01-31 | Intel Corporation | Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon |
US20060116170A1 (en) * | 2002-05-24 | 2006-06-01 | Cisco Technology, Inc. | Intelligent association of nodes with PAN coordinator |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0128495D0 (en) * | 2001-11-28 | 2002-01-23 | Waterleaf Ltd | Gaming system and method of operation thereof |
TWM255524U (en) | 2003-12-03 | 2005-01-11 | Tatung Co | Structure of laminated microstrip reflecting-array antenna |
-
2003
- 2003-12-31 US US10/750,234 patent/US7115987B2/en not_active Expired - Fee Related
-
2006
- 2006-06-14 US US11/453,428 patent/US20060244127A1/en not_active Abandoned
Patent Citations (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4759874A (en) * | 1987-08-03 | 1988-07-26 | The Dow Chemical Company | Benzocyclobutene-based die attach adhesive compositions |
US5727618A (en) * | 1993-08-23 | 1998-03-17 | Sdl Inc | Modular microchannel heat exchanger |
US6280013B1 (en) * | 1997-11-05 | 2001-08-28 | Hewlett-Packard Company | Heat exchanger for an inkjet printhead |
US5913108A (en) * | 1998-04-30 | 1999-06-15 | Cutting Edge Optronics, Inc. | Laser diode packaging |
US6504721B1 (en) * | 2000-09-29 | 2003-01-07 | Intel Corporation | Thermal cooling apparatus |
US6639799B2 (en) * | 2000-12-22 | 2003-10-28 | Intel Corporation | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment |
US6661660B2 (en) * | 2000-12-22 | 2003-12-09 | Intel Corporation | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment |
US20020107006A1 (en) * | 2001-02-05 | 2002-08-08 | Yoshio Nitta | Mobile station and communication system |
US6821819B1 (en) * | 2001-02-21 | 2004-11-23 | Sandia Corporation | Method of packaging and assembling micro-fluidic device |
US20030062149A1 (en) * | 2001-09-28 | 2003-04-03 | Goodson Kenneth E. | Electroosmotic microchannel cooling system |
US6942018B2 (en) * | 2001-09-28 | 2005-09-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic microchannel cooling system |
US6565386B1 (en) * | 2001-12-26 | 2003-05-20 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector |
US6591625B1 (en) * | 2002-04-17 | 2003-07-15 | Agilent Technologies, Inc. | Cooling of substrate-supported heat-generating components |
US20060116170A1 (en) * | 2002-05-24 | 2006-06-01 | Cisco Technology, Inc. | Intelligent association of nodes with PAN coordinator |
US6865081B2 (en) * | 2002-10-02 | 2005-03-08 | Atotech Deutschland Gmbh | Microstructure cooler and use thereof |
US6981849B2 (en) * | 2002-12-18 | 2006-01-03 | Intel Corporation | Electro-osmotic pumps and micro-channels |
US6785134B2 (en) * | 2003-01-06 | 2004-08-31 | Intel Corporation | Embedded liquid pump and microchannel cooling system |
US20040190253A1 (en) * | 2003-03-31 | 2004-09-30 | Ravi Prasher | Channeled heat sink and chassis with integrated heat rejector for two-phase cooling |
US6934154B2 (en) * | 2003-03-31 | 2005-08-23 | Intel Corporation | Micro-channel heat exchangers and spreaders |
US6903929B2 (en) * | 2003-03-31 | 2005-06-07 | Intel Corporation | Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink |
US20040266063A1 (en) * | 2003-06-25 | 2004-12-30 | Montgomery Stephen W. | Apparatus and method for manufacturing thermal interface device having aligned carbon nanotubes |
US20050062150A1 (en) * | 2003-09-24 | 2005-03-24 | Kim Sarah E. | Packaged electroosmotic pumps using porous frits for cooling integrated circuits |
US6906919B2 (en) * | 2003-09-30 | 2005-06-14 | Intel Corporation | Two-phase pumped liquid loop for mobile computer cooling |
US6992381B2 (en) * | 2003-10-31 | 2006-01-31 | Intel Corporation | Using external radiators with electroosmotic pumps for cooling integrated circuits |
US20050128702A1 (en) * | 2003-12-12 | 2005-06-16 | Mongia Rajiv K. | Heat exchanger with cooling channels having varying geometry |
US6992382B2 (en) * | 2003-12-29 | 2006-01-31 | Intel Corporation | Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon |
US20050169831A1 (en) * | 2004-02-04 | 2005-08-04 | Montgomery Stephen W. | Three-dimensional nanotube structure |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080203416A1 (en) * | 2007-02-22 | 2008-08-28 | Sharp Kabushiki Kaisha | Surface mounting type light emitting diode and method for manufacturing the same |
US20080203417A1 (en) * | 2007-02-22 | 2008-08-28 | Sharp Kabushiki Kaisha | Surface mounting type light emitting diode and method for manufacturing the same |
US8421088B2 (en) * | 2007-02-22 | 2013-04-16 | Sharp Kabushiki Kaisha | Surface mounting type light emitting diode |
US8604506B2 (en) | 2007-02-22 | 2013-12-10 | Sharp Kabushiki Kaisha | Surface mounting type light emitting diode and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
US20050139992A1 (en) | 2005-06-30 |
US7115987B2 (en) | 2006-10-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7115987B2 (en) | Integrated stacked microchannel heat exchanger and heat spreader | |
US20050141195A1 (en) | Folded fin microchannel heat exchanger | |
US6903929B2 (en) | Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink | |
US6934154B2 (en) | Micro-channel heat exchangers and spreaders | |
US20040190253A1 (en) | Channeled heat sink and chassis with integrated heat rejector for two-phase cooling | |
US7978473B2 (en) | Cooling apparatus with cold plate formed in situ on a surface to be cooled | |
Tang et al. | Integrated liquid cooling systems for 3-D stacked TSV modules | |
US10727160B2 (en) | Thermal management component | |
Sekar et al. | A 3D-IC technology with integrated microchannel cooling | |
US8266802B2 (en) | Cooling apparatus and method of fabrication thereof with jet impingement structure integrally formed on thermally conductive pin fins | |
TWI277186B (en) | Electronic assembly with fluid cooling and associated methods | |
US8063298B2 (en) | Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields | |
US20100187682A1 (en) | Electronic package and method of assembling the same | |
US10170392B2 (en) | Wafer level integration for embedded cooling | |
WO2002052644A2 (en) | Thermally enhanced microcircuit package and method of forming same | |
CN109256364B (en) | Composite phase change material based radio frequency front end miniaturized integrated heat dissipation packaging structure | |
US20060137860A1 (en) | Heat flux based microchannel heat exchanger architecture for two phase and single phase flows | |
US20090166855A1 (en) | Cooling solutions for die-down integrated circuit packages | |
US6579747B1 (en) | Method of making electronics package with specific areas having low coefficient of thermal expansion | |
KR102320177B1 (en) | Apparatus and method for creating a thermal interface bond between a semiconductor die and a passive heat exchanger | |
TWI301744B (en) | Micropin heat exchanger | |
WO2022241846A1 (en) | Lead bonding structure comprising embedded manifold type micro-channel and preparation method for lead bonding structure | |
Zhang et al. | High heat flux removal using optimized microchannel heat sink | |
Paredes et al. | Wafer-Level Integration of Embedded Cooling Approaches | |
Pilchowski et al. | All silicon multi chip module with a fully integrated cooling system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |
|
AS | Assignment |
Owner name: TAHOE RESEARCH, LTD., IRELAND Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:INTEL CORPORATION;REEL/FRAME:061827/0686 Effective date: 20220718 |