US20060254755A1 - Radiation board - Google Patents

Radiation board Download PDF

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Publication number
US20060254755A1
US20060254755A1 US11/127,080 US12708005A US2006254755A1 US 20060254755 A1 US20060254755 A1 US 20060254755A1 US 12708005 A US12708005 A US 12708005A US 2006254755 A1 US2006254755 A1 US 2006254755A1
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US
United States
Prior art keywords
case
operation fluid
radiation board
circulation channels
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/127,080
Inventor
Win-Haw Chen
Mao-Ching Lin
Shu-Ju Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inventec Corp
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to US11/127,080 priority Critical patent/US20060254755A1/en
Assigned to INVENTEC CORPORATION reassignment INVENTEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, WIN-HAW, LIN, MAO-CHING, LIN, SHU-JU
Publication of US20060254755A1 publication Critical patent/US20060254755A1/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/1023Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a radiation board adopted for use on heat generating elements of electronic devices, and particularly to a radiation board that is easy to fabricate at a low cost.
  • FIG. 1 illustrates a conventional radiation device consisting of an upper lid 11 and a lower lid 12 that are coupled to form a housing compartment to house a conductive plate 13 , a spacer 14 with cubical strips formed thereon and a flow channel plate 15 .
  • the housing compartment is divided into a plurality of flow passages to hold fluid.
  • the fluid absorbs the heat generated by the heat-generating element and flows in the housing compartment.
  • FIG. 2 depicts another radiation technique that has a case 20 housing a plurality of cubical members 21 . Fluid is filled in the case 20 and channeled by the cubical members 21 to circulate inside the case 20 .
  • FIG. 3 shows yet another radiation technique that has a case 30 housing channel members 31 formed in special geometric shapes to channel a fluid to circulate in the case 30 .
  • the primary object of the invention is to provide a radiation board adopted for use on electronic products that is easier to fabricate at a lower cost.
  • the radiation board according to the invention mainly includes a case and a lid.
  • the case has an inner wall forming a plurality of circulation channels and a bulged longitudinal strip between two neighboring circulation channels.
  • the lid is bonded to the longitudinal strips and seals the case to keep an operation fluid in the case.
  • the lid has miniature flutes corresponding to the circulation channels that are much smaller than the circulation channels.
  • One side of the lid is in contact with a heat-generating element to transfer the heat that it generates during operation to the operation fluid filled in the case. A portion of the operation fluid is vaporized. Through the miniature flutes, the vaporized operation fluid is cooled and re-condensed into the liquid phase operation fluid, and circulated in the case through the circulation channels.
  • the heat generated by the heat-generating element during operation is evenly distributed on the entire device to achieve an improved heat dissipation effect.
  • FIG. 1 is a schematic view of a conventional radiation device.
  • FIG. 2 is a schematic view of another conventional radiation device.
  • FIG. 3 is a schematic view of yet another conventional radiation device.
  • FIG. 4 is an exploded view of the radiation board of the invention.
  • FIGS. 5A and 5B are fragmentary sectional and enlarged views of the radiation board of the invention.
  • the radiation board according to the invention is adopted for use on electronic products. It includes a case 40 and a lid 50 .
  • the case 40 has an inner wall forming a plurality of parallel circulation channels 41 .
  • the outer surface of the case 40 corresponding to circulation channels 41 has a plurality of radiation fins 60 . Every two neighboring circulation channels 41 are interposed by a bulged longitudinal strip 43 .
  • the lid 50 is bonded tightly to the longitudinal strip 43 and seals the case 40 on one side.
  • the miniature flutes 51 are smaller than the circulation channels 41 , and are formed in a V-shape cross-section with an included angle of about 60 degrees. Moreover, the surface of the miniature flutes 51 is treated to make it coarse.
  • the operation fluid 70 is confined in the case 40 and may flow freely among the circulation channels 41 , cross channel 42 and miniature flutes 51 .
  • Many substances may serve as the operation fluid 70 . Water and acetone are most commonly used.
  • the radiation board of the invention may be mounted onto the heat-generating element 80 of an electronic product to transfer and disperse the heat generated by the heat-generating element 80 during operation.
  • the operation fluid 70 After the operation fluid 70 has absorbed the heat and filled in the closed space formed by the case 40 and the lid 50 , it flows in the circulation channels 41 , cross channel 42 and miniature flutes 51 under natural convection caused by differing temperatures and densities.
  • the vaporized operation fluid 70 circulates in the case 40 due to channeling of the circulation channels 41 .
  • the coarse surface of the miniature flutes 51 helps to condense the vaporized operation fluid 70 into a liquid. Hence the heat generated by the heat-generating element 80 during operation is evenly distributed to the entire device and an improved heat dissipation effect is achieved.
  • the radiation board of the invention may be fabricated at a lower cost, and has an improved production yield.

Abstract

A radiation board consists of a case and a lid. The case has a plurality of circulation channels formed on an inner wall. The lid seals the case to confine an operation fluid in the circulation channels of the case. The lid has miniature flutes corresponding to the circulation channels. Heat generated by a heat-generating element during operation is transferred through the lid to the operation fluid to vaporize the operation fluid. The miniature flutes help to condense the vaporized operation fluid into a liquid again. The operation fluid circulates in the case through the circulation channels to evenly distribute heat to the entire device. The radiation board is easy to fabricate at a low cost.

Description

    FIELD OF THE INVENTION
  • The invention relates to a radiation board adopted for use on heat generating elements of electronic devices, and particularly to a radiation board that is easy to fabricate at a low cost.
  • BACKGROUND OF THE INVENTION
  • With continuous advances in semiconductor manufacturing techniques, the number of transistors in electronic elements and chip sets of electronic products is increasing. Electricity consumption and heat generated by the electronic elements have become urgent issues to be resolved.
  • Among the heat generating elements in electronic products, heat generated by the central processing unit (CPU) is most significant. Researching on heat dissipation techniques for the heat generating elements of electronic products is known in the art. FIG. 1 illustrates a conventional radiation device consisting of an upper lid 11 and a lower lid 12 that are coupled to form a housing compartment to house a conductive plate 13, a spacer 14 with cubical strips formed thereon and a flow channel plate 15. The housing compartment is divided into a plurality of flow passages to hold fluid. The fluid absorbs the heat generated by the heat-generating element and flows in the housing compartment. FIG. 2 depicts another radiation technique that has a case 20 housing a plurality of cubical members 21. Fluid is filled in the case 20 and channeled by the cubical members 21 to circulate inside the case 20. FIG. 3 shows yet another radiation technique that has a case 30 housing channel members 31 formed in special geometric shapes to channel a fluid to circulate in the case 30.
  • All the radiation devices mentioned above aim to distribute the heat energy of the heat-generating element evenly to the entire device to achieve heat dissipation. While they have some degree of effect, they consist of many elements and have complicated structures. Fabrication is difficult, production yield is undesirable and production cost is high. Thus there is still room for improvement.
  • SUMMARY OF THE INVENTION
  • The primary object of the invention is to provide a radiation board adopted for use on electronic products that is easier to fabricate at a lower cost.
  • The radiation board according to the invention mainly includes a case and a lid. The case has an inner wall forming a plurality of circulation channels and a bulged longitudinal strip between two neighboring circulation channels. The lid is bonded to the longitudinal strips and seals the case to keep an operation fluid in the case. The lid has miniature flutes corresponding to the circulation channels that are much smaller than the circulation channels. One side of the lid is in contact with a heat-generating element to transfer the heat that it generates during operation to the operation fluid filled in the case. A portion of the operation fluid is vaporized. Through the miniature flutes, the vaporized operation fluid is cooled and re-condensed into the liquid phase operation fluid, and circulated in the case through the circulation channels. Hence the heat generated by the heat-generating element during operation is evenly distributed on the entire device to achieve an improved heat dissipation effect.
  • The foregoing, as well as additional objects, features and advantages of the invention will be more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic view of a conventional radiation device.
  • FIG. 2 is a schematic view of another conventional radiation device.
  • FIG. 3 is a schematic view of yet another conventional radiation device.
  • FIG. 4 is an exploded view of the radiation board of the invention.
  • FIGS. 5A and 5B are fragmentary sectional and enlarged views of the radiation board of the invention.
  • DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Referring to FIGS. 4, 5A and 5B, the radiation board according to the invention is adopted for use on electronic products. It includes a case 40 and a lid 50. The case 40 has an inner wall forming a plurality of parallel circulation channels 41. The outer surface of the case 40 corresponding to circulation channels 41 has a plurality of radiation fins 60. Every two neighboring circulation channels 41 are interposed by a bulged longitudinal strip 43. There is a cross channel 42 running across the distal ends of the circulation channels 41 to allow the circulation channels 41 to communicate with one another.
  • The lid 50 is bonded tightly to the longitudinal strip 43 and seals the case 40 on one side. On the lid 50 there is a plurality of parallel miniature flutes 51 corresponding to the circulation channels 41. The miniature flutes 51 are smaller than the circulation channels 41, and are formed in a V-shape cross-section with an included angle of about 60 degrees. Moreover, the surface of the miniature flutes 51 is treated to make it coarse.
  • As the lid 50 is sealed on the case 40, the operation fluid 70 is confined in the case 40 and may flow freely among the circulation channels 41, cross channel 42 and miniature flutes 51. Many substances may serve as the operation fluid 70. Water and acetone are most commonly used.
  • The radiation board of the invention may be mounted onto the heat-generating element 80 of an electronic product to transfer and disperse the heat generated by the heat-generating element 80 during operation. When in use, first keep one side of the lid 50 in close contact with the heat-generating element 80; heat generated by the heat-generating element 80 is transferred through the lid 50 to the operation fluid 70 filled in the case 40; a portion of the operation fluid 70 absorbs the heat and becomes a vapor and liquid mixture, or is vaporized, depending on the kind of operation fluid 70 and the level of thermal energy provided by the heat-generating element 80. That is, the operation fluid 70 is vaporized if it absorbs enough heat. After the operation fluid 70 has absorbed the heat and filled in the closed space formed by the case 40 and the lid 50, it flows in the circulation channels 41, cross channel 42 and miniature flutes 51 under natural convection caused by differing temperatures and densities. The vaporized operation fluid 70 circulates in the case 40 due to channeling of the circulation channels 41. The coarse surface of the miniature flutes 51 helps to condense the vaporized operation fluid 70 into a liquid. Hence the heat generated by the heat-generating element 80 during operation is evenly distributed to the entire device and an improved heat dissipation effect is achieved.
  • Compared with the conventional heat radiation apparatus that are difficult to fabricate, have low production yields and high costs, the radiation board of the invention may be fabricated at a lower cost, and has an improved production yield.
  • While the preferred embodiment of the invention has been set forth for the purpose of disclosure, modifications of the disclosed embodiment of the invention as well as other embodiments thereof may occur to those skilled in the art. Accordingly, the appended claims are intended to cover all embodiments which do not depart from the spirit and scope of the invention.

Claims (10)

1. A radiation board, comprising:
a case having a plurality of circulation channels formed on an inner wall to contain an operation fluid and a longitudinal strip between two neighboring circulation channels; and
a lid bonded to the longitudinal strip to seal one side of the case to confine the operation fluid in the case having a plurality of miniature flutes smaller than the circulation channels on one side thereof corresponding to the circulation channels;
wherein one side of the lid is mounted onto a heat generating element to transfer heat of the heat generating element to the operation fluid to cause a portion of the operation fluid to vaporize, the vaporized operation fluid being condensed to become liquid phase which circulates through the circulation channels to evenly distribute the heat absorbed by the operation fluid to the case and the lid.
2. The radiation board of claim 1, wherein the case has a plurality of radiation fins on an outer surface to improve heat dissipation effect of the case.
3. The radiation board of claim 1, wherein the miniature flutes have substantially a V-shape cross section.
4. The radiation board of claim 3, wherein the V-shape cross section has an included angle about 60 degrees.
5. The radiation board of claim 1, wherein the operation fluid is water.
6. The radiation board of claim 1, wherein the operation fluid is acetone.
7. The radiation board of claim 1, wherein the case further has cross channels to allow the neighboring circulation channels to communicate with one another.
8. The radiation board of claim 1, wherein the miniature flutes are formed on the lid in a parallel manner.
9. The radiation board of claim 1, wherein the circulation channels are formed in the case in a parallel manner.
10. The radiation board of claim 1, wherein the surface of the miniature flutes is treated to become a coarse surface.
US11/127,080 2005-05-12 2005-05-12 Radiation board Abandoned US20060254755A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/127,080 US20060254755A1 (en) 2005-05-12 2005-05-12 Radiation board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/127,080 US20060254755A1 (en) 2005-05-12 2005-05-12 Radiation board

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US20060254755A1 true US20060254755A1 (en) 2006-11-16

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140158326A1 (en) * 2007-08-09 2014-06-12 Coolit Systems Inc. Fluid heat exchange systems
JP2019105398A (en) * 2017-12-12 2019-06-27 大日本印刷株式会社 Vapor chamber
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US10364809B2 (en) 2013-03-15 2019-07-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US20220338391A1 (en) * 2019-09-06 2022-10-20 Valeo Siemens Eautomotive France Sas Plastic cover for closing a fluid-based cooling circuit for an item of electrical equipment
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems

Citations (9)

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US3392781A (en) * 1964-09-29 1968-07-16 Gen Electric Vaporizing heat transfer device
US4635709A (en) * 1985-12-03 1987-01-13 The United States Of America As Represented By The Secretary Of The Air Force Dual mode heat exchanger
US4685512A (en) * 1982-03-22 1987-08-11 Grumman Aerospace Corporation Capillary-pumped heat transfer panel and system
US4833567A (en) * 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
US5308920A (en) * 1992-07-31 1994-05-03 Itoh Research & Development Laboratory Co., Ltd. Heat radiating device
US5465782A (en) * 1994-06-13 1995-11-14 Industrial Technology Research Institute High-efficiency isothermal heat pipe
US6574963B1 (en) * 2001-11-16 2003-06-10 Intel Corporation Electrical energy-generating heat sink system and method of using same to recharge an energy storage device
US20040188064A1 (en) * 2002-11-01 2004-09-30 Cooligy Inc. Channeled flat plate fin heat exchange system, device and method
US6810947B2 (en) * 2001-01-16 2004-11-02 Denso Corporation Cooling device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3392781A (en) * 1964-09-29 1968-07-16 Gen Electric Vaporizing heat transfer device
US4685512A (en) * 1982-03-22 1987-08-11 Grumman Aerospace Corporation Capillary-pumped heat transfer panel and system
US4635709A (en) * 1985-12-03 1987-01-13 The United States Of America As Represented By The Secretary Of The Air Force Dual mode heat exchanger
US4833567A (en) * 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
US5308920A (en) * 1992-07-31 1994-05-03 Itoh Research & Development Laboratory Co., Ltd. Heat radiating device
US5465782A (en) * 1994-06-13 1995-11-14 Industrial Technology Research Institute High-efficiency isothermal heat pipe
US6810947B2 (en) * 2001-01-16 2004-11-02 Denso Corporation Cooling device
US6574963B1 (en) * 2001-11-16 2003-06-10 Intel Corporation Electrical energy-generating heat sink system and method of using same to recharge an energy storage device
US20040188064A1 (en) * 2002-11-01 2004-09-30 Cooligy Inc. Channeled flat plate fin heat exchange system, device and method

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9057567B2 (en) * 2007-08-09 2015-06-16 Coolit Systems, Inc. Fluid heat exchange systems
US10274266B2 (en) 2007-08-09 2019-04-30 CoolIT Systems, Inc Fluid heat exchange sytems
US20140158326A1 (en) * 2007-08-09 2014-06-12 Coolit Systems Inc. Fluid heat exchange systems
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US11714432B2 (en) 2011-08-11 2023-08-01 Coolit Systems, Inc. Flow-path controllers and related systems
US11661936B2 (en) 2013-03-15 2023-05-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10364809B2 (en) 2013-03-15 2019-07-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
JP2019105398A (en) * 2017-12-12 2019-06-27 大日本印刷株式会社 Vapor chamber
JP7069678B2 (en) 2017-12-12 2022-05-18 大日本印刷株式会社 Vapor chamber
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11725890B2 (en) 2019-04-25 2023-08-15 Coolit Systems, Inc. Cooling module with leak detector and related systems
US20220338391A1 (en) * 2019-09-06 2022-10-20 Valeo Siemens Eautomotive France Sas Plastic cover for closing a fluid-based cooling circuit for an item of electrical equipment
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems

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Owner name: INVENTEC CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, WIN-HAW;LIN, MAO-CHING;LIN, SHU-JU;REEL/FRAME:016563/0563

Effective date: 20040604

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION