US20060254755A1 - Radiation board - Google Patents
Radiation board Download PDFInfo
- Publication number
- US20060254755A1 US20060254755A1 US11/127,080 US12708005A US2006254755A1 US 20060254755 A1 US20060254755 A1 US 20060254755A1 US 12708005 A US12708005 A US 12708005A US 2006254755 A1 US2006254755 A1 US 2006254755A1
- Authority
- US
- United States
- Prior art keywords
- case
- operation fluid
- radiation board
- circulation channels
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a radiation board adopted for use on heat generating elements of electronic devices, and particularly to a radiation board that is easy to fabricate at a low cost.
- FIG. 1 illustrates a conventional radiation device consisting of an upper lid 11 and a lower lid 12 that are coupled to form a housing compartment to house a conductive plate 13 , a spacer 14 with cubical strips formed thereon and a flow channel plate 15 .
- the housing compartment is divided into a plurality of flow passages to hold fluid.
- the fluid absorbs the heat generated by the heat-generating element and flows in the housing compartment.
- FIG. 2 depicts another radiation technique that has a case 20 housing a plurality of cubical members 21 . Fluid is filled in the case 20 and channeled by the cubical members 21 to circulate inside the case 20 .
- FIG. 3 shows yet another radiation technique that has a case 30 housing channel members 31 formed in special geometric shapes to channel a fluid to circulate in the case 30 .
- the primary object of the invention is to provide a radiation board adopted for use on electronic products that is easier to fabricate at a lower cost.
- the radiation board according to the invention mainly includes a case and a lid.
- the case has an inner wall forming a plurality of circulation channels and a bulged longitudinal strip between two neighboring circulation channels.
- the lid is bonded to the longitudinal strips and seals the case to keep an operation fluid in the case.
- the lid has miniature flutes corresponding to the circulation channels that are much smaller than the circulation channels.
- One side of the lid is in contact with a heat-generating element to transfer the heat that it generates during operation to the operation fluid filled in the case. A portion of the operation fluid is vaporized. Through the miniature flutes, the vaporized operation fluid is cooled and re-condensed into the liquid phase operation fluid, and circulated in the case through the circulation channels.
- the heat generated by the heat-generating element during operation is evenly distributed on the entire device to achieve an improved heat dissipation effect.
- FIG. 1 is a schematic view of a conventional radiation device.
- FIG. 2 is a schematic view of another conventional radiation device.
- FIG. 3 is a schematic view of yet another conventional radiation device.
- FIG. 4 is an exploded view of the radiation board of the invention.
- FIGS. 5A and 5B are fragmentary sectional and enlarged views of the radiation board of the invention.
- the radiation board according to the invention is adopted for use on electronic products. It includes a case 40 and a lid 50 .
- the case 40 has an inner wall forming a plurality of parallel circulation channels 41 .
- the outer surface of the case 40 corresponding to circulation channels 41 has a plurality of radiation fins 60 . Every two neighboring circulation channels 41 are interposed by a bulged longitudinal strip 43 .
- the lid 50 is bonded tightly to the longitudinal strip 43 and seals the case 40 on one side.
- the miniature flutes 51 are smaller than the circulation channels 41 , and are formed in a V-shape cross-section with an included angle of about 60 degrees. Moreover, the surface of the miniature flutes 51 is treated to make it coarse.
- the operation fluid 70 is confined in the case 40 and may flow freely among the circulation channels 41 , cross channel 42 and miniature flutes 51 .
- Many substances may serve as the operation fluid 70 . Water and acetone are most commonly used.
- the radiation board of the invention may be mounted onto the heat-generating element 80 of an electronic product to transfer and disperse the heat generated by the heat-generating element 80 during operation.
- the operation fluid 70 After the operation fluid 70 has absorbed the heat and filled in the closed space formed by the case 40 and the lid 50 , it flows in the circulation channels 41 , cross channel 42 and miniature flutes 51 under natural convection caused by differing temperatures and densities.
- the vaporized operation fluid 70 circulates in the case 40 due to channeling of the circulation channels 41 .
- the coarse surface of the miniature flutes 51 helps to condense the vaporized operation fluid 70 into a liquid. Hence the heat generated by the heat-generating element 80 during operation is evenly distributed to the entire device and an improved heat dissipation effect is achieved.
- the radiation board of the invention may be fabricated at a lower cost, and has an improved production yield.
Abstract
A radiation board consists of a case and a lid. The case has a plurality of circulation channels formed on an inner wall. The lid seals the case to confine an operation fluid in the circulation channels of the case. The lid has miniature flutes corresponding to the circulation channels. Heat generated by a heat-generating element during operation is transferred through the lid to the operation fluid to vaporize the operation fluid. The miniature flutes help to condense the vaporized operation fluid into a liquid again. The operation fluid circulates in the case through the circulation channels to evenly distribute heat to the entire device. The radiation board is easy to fabricate at a low cost.
Description
- The invention relates to a radiation board adopted for use on heat generating elements of electronic devices, and particularly to a radiation board that is easy to fabricate at a low cost.
- With continuous advances in semiconductor manufacturing techniques, the number of transistors in electronic elements and chip sets of electronic products is increasing. Electricity consumption and heat generated by the electronic elements have become urgent issues to be resolved.
- Among the heat generating elements in electronic products, heat generated by the central processing unit (CPU) is most significant. Researching on heat dissipation techniques for the heat generating elements of electronic products is known in the art.
FIG. 1 illustrates a conventional radiation device consisting of anupper lid 11 and alower lid 12 that are coupled to form a housing compartment to house aconductive plate 13, aspacer 14 with cubical strips formed thereon and aflow channel plate 15. The housing compartment is divided into a plurality of flow passages to hold fluid. The fluid absorbs the heat generated by the heat-generating element and flows in the housing compartment.FIG. 2 depicts another radiation technique that has acase 20 housing a plurality ofcubical members 21. Fluid is filled in thecase 20 and channeled by thecubical members 21 to circulate inside thecase 20.FIG. 3 shows yet another radiation technique that has a case 30housing channel members 31 formed in special geometric shapes to channel a fluid to circulate in the case 30. - All the radiation devices mentioned above aim to distribute the heat energy of the heat-generating element evenly to the entire device to achieve heat dissipation. While they have some degree of effect, they consist of many elements and have complicated structures. Fabrication is difficult, production yield is undesirable and production cost is high. Thus there is still room for improvement.
- The primary object of the invention is to provide a radiation board adopted for use on electronic products that is easier to fabricate at a lower cost.
- The radiation board according to the invention mainly includes a case and a lid. The case has an inner wall forming a plurality of circulation channels and a bulged longitudinal strip between two neighboring circulation channels. The lid is bonded to the longitudinal strips and seals the case to keep an operation fluid in the case. The lid has miniature flutes corresponding to the circulation channels that are much smaller than the circulation channels. One side of the lid is in contact with a heat-generating element to transfer the heat that it generates during operation to the operation fluid filled in the case. A portion of the operation fluid is vaporized. Through the miniature flutes, the vaporized operation fluid is cooled and re-condensed into the liquid phase operation fluid, and circulated in the case through the circulation channels. Hence the heat generated by the heat-generating element during operation is evenly distributed on the entire device to achieve an improved heat dissipation effect.
- The foregoing, as well as additional objects, features and advantages of the invention will be more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings.
-
FIG. 1 is a schematic view of a conventional radiation device. -
FIG. 2 is a schematic view of another conventional radiation device. -
FIG. 3 is a schematic view of yet another conventional radiation device. -
FIG. 4 is an exploded view of the radiation board of the invention. -
FIGS. 5A and 5B are fragmentary sectional and enlarged views of the radiation board of the invention. - Referring to
FIGS. 4, 5A and 5B, the radiation board according to the invention is adopted for use on electronic products. It includes acase 40 and alid 50. Thecase 40 has an inner wall forming a plurality ofparallel circulation channels 41. The outer surface of thecase 40 corresponding tocirculation channels 41 has a plurality ofradiation fins 60. Every two neighboringcirculation channels 41 are interposed by a bulgedlongitudinal strip 43. There is across channel 42 running across the distal ends of thecirculation channels 41 to allow thecirculation channels 41 to communicate with one another. - The
lid 50 is bonded tightly to thelongitudinal strip 43 and seals thecase 40 on one side. On thelid 50 there is a plurality ofparallel miniature flutes 51 corresponding to thecirculation channels 41. Theminiature flutes 51 are smaller than thecirculation channels 41, and are formed in a V-shape cross-section with an included angle of about 60 degrees. Moreover, the surface of theminiature flutes 51 is treated to make it coarse. - As the
lid 50 is sealed on thecase 40, theoperation fluid 70 is confined in thecase 40 and may flow freely among thecirculation channels 41,cross channel 42 andminiature flutes 51. Many substances may serve as theoperation fluid 70. Water and acetone are most commonly used. - The radiation board of the invention may be mounted onto the heat-generating element 80 of an electronic product to transfer and disperse the heat generated by the heat-generating element 80 during operation. When in use, first keep one side of the
lid 50 in close contact with the heat-generating element 80; heat generated by the heat-generating element 80 is transferred through thelid 50 to theoperation fluid 70 filled in thecase 40; a portion of theoperation fluid 70 absorbs the heat and becomes a vapor and liquid mixture, or is vaporized, depending on the kind ofoperation fluid 70 and the level of thermal energy provided by the heat-generating element 80. That is, theoperation fluid 70 is vaporized if it absorbs enough heat. After theoperation fluid 70 has absorbed the heat and filled in the closed space formed by thecase 40 and thelid 50, it flows in thecirculation channels 41,cross channel 42 andminiature flutes 51 under natural convection caused by differing temperatures and densities. The vaporizedoperation fluid 70 circulates in thecase 40 due to channeling of thecirculation channels 41. The coarse surface of theminiature flutes 51 helps to condense the vaporizedoperation fluid 70 into a liquid. Hence the heat generated by the heat-generating element 80 during operation is evenly distributed to the entire device and an improved heat dissipation effect is achieved. - Compared with the conventional heat radiation apparatus that are difficult to fabricate, have low production yields and high costs, the radiation board of the invention may be fabricated at a lower cost, and has an improved production yield.
- While the preferred embodiment of the invention has been set forth for the purpose of disclosure, modifications of the disclosed embodiment of the invention as well as other embodiments thereof may occur to those skilled in the art. Accordingly, the appended claims are intended to cover all embodiments which do not depart from the spirit and scope of the invention.
Claims (10)
1. A radiation board, comprising:
a case having a plurality of circulation channels formed on an inner wall to contain an operation fluid and a longitudinal strip between two neighboring circulation channels; and
a lid bonded to the longitudinal strip to seal one side of the case to confine the operation fluid in the case having a plurality of miniature flutes smaller than the circulation channels on one side thereof corresponding to the circulation channels;
wherein one side of the lid is mounted onto a heat generating element to transfer heat of the heat generating element to the operation fluid to cause a portion of the operation fluid to vaporize, the vaporized operation fluid being condensed to become liquid phase which circulates through the circulation channels to evenly distribute the heat absorbed by the operation fluid to the case and the lid.
2. The radiation board of claim 1 , wherein the case has a plurality of radiation fins on an outer surface to improve heat dissipation effect of the case.
3. The radiation board of claim 1 , wherein the miniature flutes have substantially a V-shape cross section.
4. The radiation board of claim 3 , wherein the V-shape cross section has an included angle about 60 degrees.
5. The radiation board of claim 1 , wherein the operation fluid is water.
6. The radiation board of claim 1 , wherein the operation fluid is acetone.
7. The radiation board of claim 1 , wherein the case further has cross channels to allow the neighboring circulation channels to communicate with one another.
8. The radiation board of claim 1 , wherein the miniature flutes are formed on the lid in a parallel manner.
9. The radiation board of claim 1 , wherein the circulation channels are formed in the case in a parallel manner.
10. The radiation board of claim 1 , wherein the surface of the miniature flutes is treated to become a coarse surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/127,080 US20060254755A1 (en) | 2005-05-12 | 2005-05-12 | Radiation board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/127,080 US20060254755A1 (en) | 2005-05-12 | 2005-05-12 | Radiation board |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060254755A1 true US20060254755A1 (en) | 2006-11-16 |
Family
ID=37417990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/127,080 Abandoned US20060254755A1 (en) | 2005-05-12 | 2005-05-12 | Radiation board |
Country Status (1)
Country | Link |
---|---|
US (1) | US20060254755A1 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140158326A1 (en) * | 2007-08-09 | 2014-06-12 | Coolit Systems Inc. | Fluid heat exchange systems |
JP2019105398A (en) * | 2017-12-12 | 2019-06-27 | 大日本印刷株式会社 | Vapor chamber |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
US10364809B2 (en) | 2013-03-15 | 2019-07-30 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
US11395443B2 (en) | 2020-05-11 | 2022-07-19 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
US20220338391A1 (en) * | 2019-09-06 | 2022-10-20 | Valeo Siemens Eautomotive France Sas | Plastic cover for closing a fluid-based cooling circuit for an item of electrical equipment |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
Citations (9)
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US3392781A (en) * | 1964-09-29 | 1968-07-16 | Gen Electric | Vaporizing heat transfer device |
US4635709A (en) * | 1985-12-03 | 1987-01-13 | The United States Of America As Represented By The Secretary Of The Air Force | Dual mode heat exchanger |
US4685512A (en) * | 1982-03-22 | 1987-08-11 | Grumman Aerospace Corporation | Capillary-pumped heat transfer panel and system |
US4833567A (en) * | 1986-05-30 | 1989-05-23 | Digital Equipment Corporation | Integral heat pipe module |
US5308920A (en) * | 1992-07-31 | 1994-05-03 | Itoh Research & Development Laboratory Co., Ltd. | Heat radiating device |
US5465782A (en) * | 1994-06-13 | 1995-11-14 | Industrial Technology Research Institute | High-efficiency isothermal heat pipe |
US6574963B1 (en) * | 2001-11-16 | 2003-06-10 | Intel Corporation | Electrical energy-generating heat sink system and method of using same to recharge an energy storage device |
US20040188064A1 (en) * | 2002-11-01 | 2004-09-30 | Cooligy Inc. | Channeled flat plate fin heat exchange system, device and method |
US6810947B2 (en) * | 2001-01-16 | 2004-11-02 | Denso Corporation | Cooling device |
-
2005
- 2005-05-12 US US11/127,080 patent/US20060254755A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3392781A (en) * | 1964-09-29 | 1968-07-16 | Gen Electric | Vaporizing heat transfer device |
US4685512A (en) * | 1982-03-22 | 1987-08-11 | Grumman Aerospace Corporation | Capillary-pumped heat transfer panel and system |
US4635709A (en) * | 1985-12-03 | 1987-01-13 | The United States Of America As Represented By The Secretary Of The Air Force | Dual mode heat exchanger |
US4833567A (en) * | 1986-05-30 | 1989-05-23 | Digital Equipment Corporation | Integral heat pipe module |
US5308920A (en) * | 1992-07-31 | 1994-05-03 | Itoh Research & Development Laboratory Co., Ltd. | Heat radiating device |
US5465782A (en) * | 1994-06-13 | 1995-11-14 | Industrial Technology Research Institute | High-efficiency isothermal heat pipe |
US6810947B2 (en) * | 2001-01-16 | 2004-11-02 | Denso Corporation | Cooling device |
US6574963B1 (en) * | 2001-11-16 | 2003-06-10 | Intel Corporation | Electrical energy-generating heat sink system and method of using same to recharge an energy storage device |
US20040188064A1 (en) * | 2002-11-01 | 2004-09-30 | Cooligy Inc. | Channeled flat plate fin heat exchange system, device and method |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9057567B2 (en) * | 2007-08-09 | 2015-06-16 | Coolit Systems, Inc. | Fluid heat exchange systems |
US10274266B2 (en) | 2007-08-09 | 2019-04-30 | CoolIT Systems, Inc | Fluid heat exchange sytems |
US20140158326A1 (en) * | 2007-08-09 | 2014-06-12 | Coolit Systems Inc. | Fluid heat exchange systems |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
US11714432B2 (en) | 2011-08-11 | 2023-08-01 | Coolit Systems, Inc. | Flow-path controllers and related systems |
US11661936B2 (en) | 2013-03-15 | 2023-05-30 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US10364809B2 (en) | 2013-03-15 | 2019-07-30 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
JP2019105398A (en) * | 2017-12-12 | 2019-06-27 | 大日本印刷株式会社 | Vapor chamber |
JP7069678B2 (en) | 2017-12-12 | 2022-05-18 | 大日本印刷株式会社 | Vapor chamber |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
US11725890B2 (en) | 2019-04-25 | 2023-08-15 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
US20220338391A1 (en) * | 2019-09-06 | 2022-10-20 | Valeo Siemens Eautomotive France Sas | Plastic cover for closing a fluid-based cooling circuit for an item of electrical equipment |
US11395443B2 (en) | 2020-05-11 | 2022-07-19 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: INVENTEC CORPORATION, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, WIN-HAW;LIN, MAO-CHING;LIN, SHU-JU;REEL/FRAME:016563/0563 Effective date: 20040604 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |