US20060260742A1 - Methods for application of adhesive tape to semiconductor devices - Google Patents
Methods for application of adhesive tape to semiconductor devices Download PDFInfo
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- US20060260742A1 US20060260742A1 US11/497,082 US49708206A US2006260742A1 US 20060260742 A1 US20060260742 A1 US 20060260742A1 US 49708206 A US49708206 A US 49708206A US 2006260742 A1 US2006260742 A1 US 2006260742A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/107—Punching and bonding pressure application by punch
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1074—Separate cutting of separate sheets or webs
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
- Y10T156/1077—Applying plural cut laminae to single face of additional lamina
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/125—Plural severing means each acting on a different work piece
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1317—Means feeding plural workpieces to be joined
- Y10T156/1322—Severing before bonding or assembling of parts
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1317—Means feeding plural workpieces to be joined
- Y10T156/1322—Severing before bonding or assembling of parts
- Y10T156/1339—Delivering cut part in sequence to serially conveyed articles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
- Y10T156/1707—Discrete spaced laminae on adhered carrier
- Y10T156/171—Means serially presenting discrete base articles or separate portions of a single article
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
A method and apparatus for application of adhesive tape to semiconductor devices are disclosed. A first adhesively coated tape material length is supplied to a first die associated with a cutting and application mechanism. A second length of adhesively coated tape material is also provided to a second die of the cutting and application mechanism. A plurality of LOC leadframes is supplied sequentially through the application structure to apply a first decal cut from the first tape material to a first die site at a first location and to apply a second decal cut from the second tape material to a second die site at a second location.
Description
- This application is a continuation of application Ser. No. 10/639,124, filed Aug. 11, 2003, which will issue as U.S. Pat. No. 7,087,133, on Aug. 8, 2006, which is a continuation of application Ser. No. 09/484,852, filed Jan. 18, 2000, now U.S. Pat. No. 6,623,592, issued Sep. 23, 2003, which is a continuation of application Ser. No. 08/908,291, filed Aug. 7, 1997, now U.S. Pat. No. 6,096,165, issued Aug. 1, 2000.
- 1. Field of the Invention
- This invention pertains to semiconductor devices and, more particularly, to a method and apparatus for applying adhesively coated tape material segments, i.e., decals, to leadframes for semiconductor devices, particularly including Lead-Over-Chip type semiconductor device assemblies.
- 2. State of the Art
- In semiconductor manufacture, a single semiconductor die (or chip) typically has a lower surface, the back of the die, being devoid of circuitry located thereon. Each semiconductor die also has an opposite upper surface, the active surface or face of the die, having integrated circuitry constructed thereon which is electrically accessible via wire bonding pads located thereon. The wire bonding pads may be arranged in a variety of configurations on the active surface of the semiconductor device, such as along the center of the die, the edges of the die, both, etc.
- Typically, a leadframe is used to connect the wire bonding pads of the semiconductor device via wire bonds to other electronic circuitry.
- A conventional leadframe and semiconductor device assembly or packaging process employs an adhesive layer to attach the semiconductor device to the die paddle of the leadframe while the lead fingers of the leadframe extend to and terminate adjacent the peripheral edges of the semiconductor device. Typically, the adhesive used to attach the semiconductor device to the die paddle is an epoxy acrylic silicone of polyamide material.
- Alternatively, a lead-over chip (LOC) leadframe, also sometimes referred to as a lead-on-chip leadframe, is used to provide lead fingers to be electrically connected to the bond pads of the semiconductor device through wire bonds thereto and to support the semiconductor device by being adhesively secured to the active surface thereof and, subsequently, encapsulated. An LOC type semiconductor package is described in U.S. Pat. No. 4,862,245 (Pashby et al.).
- Typically, in an LOC semiconductor device assembly, the active surface of the semiconductor device is adhesively attached to the underside of the lead fingers of the leadframe through the use of a double-sided, adhesively coated tape having a thermosetting adhesive thereon, although a thermoplastic adhesive may also be used if desired. That is, the adhesively coated tape has thermosetting adhesive coated on both sides thereof and is attached to the underside of the leadframe fingers and the active surface of the semiconductor device using heat and pressure. If necessary, an oven may then be used to further cure the adhesive. After the adhesive is cured, securing the lead fingers in position on the active surface of the semiconductor device, the leadframe is transferred to a wire bonding machine where the bond wires are connected to the bond pads on the active surface of the semiconductor device and to the lead fingers of the leadframe.
- Prior to attaching the semiconductor device to the leadframe using an LOC configuration, the adhesively coated tape must be placed onto a heated leadframe that will secure the semiconductor device to the leadframe but will allow access to the bond pads of the semiconductor device. Typically, a single piece of LOC tape is distanced from a continuous roll of tape and cut, using a punch, into two tape segments, i.e., decals, that are spaced apart and cut away to provide access to the bond pads of the semiconductor device. In such an LOC configuration, the continuous strip of leadframes to which the adhesively coated tape is to be applied at die sites thereon is moved perpendicularly to the direction of feeding of the continuous roll of tape from which the tape is cut and applied to the die sites of the leadframe. In such an instance, a single punch is typically used to cut the tape from the continuous roll of tape and apply the cut tape to the die site of an individual leadframe in a one-punch operation where the tape is fed orthogonally with respect to the feeding and movement of the leadframes. The leads of the die site of the leadframe to which tape is applied by the punch are, in turn, positioned such that the tape segments are located adjacent each other on the leads of the leadframe at the die site, such leads extending orthogonally on the leadframe with respect to the movement of the leadframe through the punch assembly.
- Such a process suffers from the problem that LOC tape is an expensive material and a large amount of tape is wasted during formation of the LOC tape pieces. With a conventional LOC tape punching apparatus as described hereinbefore, the width of the tape must be large enough to punch two pieces of tape with a space therebetween for the bond pads of the semiconductor device. Therefore, typically, the pieces of tape are cut from the center of a continuous length of tape having a width that is larger than required for the individual pieces of tape. Additionally, the tape cut out for the area where the bond pads of the semiconductor device are located is also waste. In some prior art systems, as much as seventy-five percent (75%) of the tape may be wasted in the cutting and application of pieces of tape to a leadframe, such as an LOC leadframe.
- Since adhesive tape used for the LOC type semiconductor device assembly, or any leadframe design which requires the use of tape thereon, is relatively expensive and the misapplication of the tape during the manufacturing process can produce problems in the subsequent automated manufacturing processes, in turn, imposing increased costs, a method for efficiently applying adhesive tape where desired on a leadframe is desirable. Particularly, it is desirable to have tape applied to a leadframe without wasting tape and without having to apply the tape in a single punch operation to the desired die site of the leadframe.
- A system and method for applying adhesively coated tape material to the die sites of semiconductor leadframes where the die site of the leadframe is indexed to separate locations for the application of each tape segment, i.e., decal. The system and method are used to apply tape segments to leadframes having leads to which the tape segments are applied which are, in turn, parallel to the direction of movement of the leadframe through the tape die assembly, although, if desired, the leads on the leadframe may extend orthogonally with respect to the direction of movement of the leadframe and the tape segments to be applied thereto.
- A system for applying adhesively coated tape material to the die sites of semiconductor leadframes includes a first source for supplying a first length of adhesively coated tape material to a first location of a die site of the leadframe and a second source for supplying a second length of adhesively coated tape material to a second location at the die site of the leadframe after the indexing of the die site of the leadframe to another location for the application of tape thereto. Indexing means are also provided to supply and index for the application of tape to a die site of a plurality of leadframes for semiconductor devices in die site-by-die site of a leadframe-by-leadframe sequence. An “application means” is configured to receive the plurality of leadframes for semiconductor devices in a die site-by-die site of a leadframe-by-leadframe sequence and to receive the first length and the second length of adhesively coated tape materials, supplied in strip form. The application means has cutting means for independently cutting a first increment from the first length of adhesively coated tape material and applying the first increment to a first portion of a die site of a leadframe of the plurality of leadframes, supplied in strip form. The cutting means of the application means also independently cuts a second increment of the second length of adhesively coated tape material and applies the second increment to a second portion of the die site of a leadframe of the plurality of leadframes. Control means are interconnected to the application means, to the indexing means, to the first source and to the second source, all supplying operation signals to the control means.
- The operation signals operate the indexing means to supply a plurality of leadframes for semiconductor devices in leadframe-by-leadframe sequence to the application means and to position the first portion of the die site and the second portion of the die site to receive the first increment and the second increment of adhesively coated tape material, respectively. The operation signals are also supplied to operate the first source to cause the first length of adhesively coated tape material to be selectively supplied to the application means when or as the first site is positioned to receive the first increment at the first portion thereof. The operation signals are also provided to operate the second source to cause the second length of adhesively coated tape material to be supplied to the application means when or as the second portion of the first die site is positioned to receive the second increment. The control means also supplies operation signals to operate the cutting means of the application means to selectively cut and apply the first increment to the first portion of the die site of a leadframe of the plurality of leadframes and to cut and apply the second increment to the second portion of the die site of a leadframe of the plurality of leadframes.
- In the preferred arrangement, the cutting means includes a first die movable relative to a first cutting structure configured to receive the first length of the adhesively coated tape material. The cutting means also includes operation means positioned to independently move the first die relative to the first cutting structure to form the first increment and to urge the first increment toward and against the first portion of the die site of a leadframe of a plurality of leadframes. The cutting means also preferably includes a second die independently movable relative to the second cutting structure configured to receive the second length of adhesively coated tape material. The operation means is preferably positioned to move the second die relative to the second cutting structure to form the second increment and to urge the second increment toward and against the second portion of the die site of a leadframe of the plurality of leadframes.
- Desirably, the first source includes a first adhesively coated tape supply configured to supply the first length and first driving means positioned to receive the first length and to urge the first length towards the first cutting structure. The first driving means is connected to the control means to receive operation signals to urge the first length toward the first cutting structure only when a first portion of the die site of a leadframe of the plurality of leadframes is positioned or is to be positioned relative to the first portion of the die site to receive the first increment.
- The second source preferably includes a second adhesively coated tape supply configured to supply the second length and second driving means positioned to receive the second length. Second driving means also operates to urge the second length toward the second cutting structure. The second driving means is connected to the control means to receive operation signals to urge the second length toward the second cutting structure only when a second portion of the die site of a leadframe of the plurality of leadframes is positioned or is to be positioned relative to the second die to receive the second increment.
- Preferably, the first driving means is a first stepping motor connected to a first drive roller over which the first length of adhesively coated tape material is positioned. The first driving means may also include a first driven roller positioned proximate the first drive roller with the first length of adhesively coated tape material positioned between the first drive roller and the first driven roller. Similarly and desirably, the second driving means includes a second stepping motor connected to a second drive roller with a second driven roller positioned proximate the second drive roller. The second length of adhesively coated tape material is positioned between the second driven roller and the second drive roller.
- In preferred configurations, the first driving means and the second driving means both include a guide structure to guide the first length between the supply of adhesively coated tape material and the first cutting structure.
- The indexing means preferably includes a structure configured to urge the plurality of leadframes in strip form for semiconductor devices in leadframe-by-leadframe sequence relative to the application means. The plurality of leadframes is connected one to the other in a continuous strip form. The indexing means preferably includes a movable member which engages at least one indexing hole of at least one rail of the leadframe strip to move the leadframe the desired distance for the application of the adhesively coated tape material. The indexing means alternately includes a roller with a motor connected to drive the roller. The motor is connected to the control means to receive operation signals therefrom to cause the motor to move the plurality of leadframes relative to the application means in the leadframe-by-leadframe sequence. The plurality of leadframes preferably is formed in a continuous strip form having removable carrier rails or edges thereon having, in turn, drive perforations formed therein. The roller desirably includes a plurality of teeth positioned to drivingly engage a portion of the drive perforations to thereby connect to and drive the plurality of leadframes.
- The operation means of the cutting means preferably includes a first die moving mechanism. The first die moving mechanism may be a solenoid mechanism positioned to urge the first die frame to move. The solenoid is connected to receive operation signals from the control means to cause the first die moving mechanism to move the first die toward a leadframe of a plurality of leadframes.
- The application means preferably includes a block positioned opposite the first die with a leadframe of the plurality of leadframes positioned between the block and the first die. The block inhibits movement of the leadframe of the plurality of leadframes upon movement of the first die against the leadframe of a plurality of leadframes. The block is preferably sized for positioning opposite both the first die and the second die with a leadframe of the plurality of leadframes positioned between the block and the first die and with a leadframe of the plurality of leadframes positioned between the block and the second die. The block desirably includes heat means to heat the block and, in turn, the leadframe, the first increment and the second increment upon urging of the first increment and the second increment against a leadframe of the plurality of leadframes.
- The application means also may include guide structure for guiding the first length of adhesively coated tape material and guide structure for guiding the second length of adhesively coated tape material. The first cutting structure and the second cutting structure may be unitarily formed into a single structure. The operation means may be desirably configured to urge the first die and the second die together. Alternatively, the operation means may be configured to urge the first die and the second die to move independent of each other.
- In a desired alternative arrangement, the plurality of leadframes includes a first leadframe, a middle leadframe and a last leadframe. The indexing means is operable to urge the first leadframe to a first position with its first site positioned relative to the first die to receive the first increment upon activation of the first source with the second site positioned spaced to not be contacted by the second die. Control means is configured to send operation signals to activate the first source to supply the first length of adhesively coated tape material to the first cutting means and to send operation signals to not activate the second source.
- Desirably, the indexing means is also operable to urge the middle leadframe to have its first site positioned relative to the first die to receive the first increment upon activation of the first source and the first die to thereafter urge the middle leadframe to have its second site positioned relative to the second die to receive the second increment upon activation of the second source and the second die. The control means preferably sends operation signals to activate the first source to supply the first length of adhesively coated tape material to the first cutting means and to activate the second source to supply the second length of adhesively coated tape material to the second cutting means.
- Most desirably, the indexing means is operable to urge the last leadframe to be positioned with its second site positioned relative to the second die to receive the second increment upon activation of the second source and the second die. The first site is positioned to not be contacted by the first die. The operation means desirably sends operation signals (e.g., no signals) to activate the second source to supply the second length to the second cutting means and to not activate the first source. Preferably, the indexing means urges the first leadframe and the middle leadframe and the last leadframe to move continuously in sequence while simultaneously causing the first source and the second source to operate to supply the respective first length and the second length to the first cutting means and the second cutting means.
- In an alternative arrangement, a system to apply adhesively coated tape to an LOC leadframe of a plurality of LOC leadframes includes a base and a block positioned opposite the base and spaced therefrom for an LOC leadframe to pass closely and freely therebetween. Supply means is positioned relative to the base to supply the first adhesively coated tape length and the second adhesively coated tape length. Indexing means are provided to move each LOC leadframe of the plurality of leadframes relative to the base. Application means is mechanically associated with the base for cutting the first tape length into a first tape decal and applying the first tape decal to a first position at a die site of the LOC leadframe. The application means also cuts the second tape length into a second tape decal and applies the second decal to a second position of the die site of the LOC leadframe. Control means are interconnected to the supply means, to the application means and to the indexing means to supply control signals so that decals are applied to the first position of a die site on an LOC leadframe and so that decals are applied to the second position of a die site on an LOC leadframe.
- A method of attaching decals includes providing the first source, the second source, indexing means and application means. The method includes operating the first source to supply a length of first adhesively coated tape to the application means. The second source is also operated to supply a length of adhesively coated tape to the application means. The application means operates to cut the first decal from the first length of the first adhesively coated tape and applies the first decal to the first position of a die site of each LOC leadframe.
- The application means includes a first die for cutting the first decal and a second die for cutting the second decal. The indexing means operates to advance the first LOC leadframe of the plurality of leadframes to position its first site to receive the first decal, to index the first leadframe to position its second position of a die site to receive the second decal, and to concurrently index a second LOC leadframe of the plurality of LOC leadframes to position the first site of the second LOC leadframe on the plurality of LOC leadframes to receive another first decal at the same time that the first LOC leadframe is to receive the second decal.
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FIG. 1 is a simplified depiction of a system of the present invention; -
FIG. 2 is a side view of an alternative configuration of the system of the present invention; -
FIGS. 3 and 4 both together are an exploded view of an application mechanism of the present invention; -
FIG. 5 is a simplified cross-sectional side view of a portion of the application structure ofFIGS. 3 and 4 ; -
FIG. 6 is a simplified depiction of the top portions of application structures of the present invention; -
FIG. 7 is an exploded perspective rendition of drive structure for urging adhesive tape toward the application structure of the present invention; -
FIGS. 8 through 11 show several components of the driving structure ofFIG. 7 ; -
FIG. 12 is a partial cross-sectional side view of a portion of the structure ofFIG. 10 ; -
FIGS. 13 and 14 are illustrations of alternative configurations of a drive structure of the present invention; -
FIGS. 15 and 17 depict portions of an alternative configuration of a drive structure of the present invention in perspective; -
FIG. 16 is a simplified illustration of an alternative configuration of the present invention; and -
FIG. 18 is a simplified flow diagram of a method of the present invention. - Referring to drawing
FIG. 1 , asystem 10 is illustrated for applying a plurality of decals or adhesive tape increments to portions of a die site of each leadframe of a plurality of leadframes for use with semiconductor devices moving the leadframe in leadframe-by-leadframe sequence through the application structure to individually apply each adhesive tape increment to a portion of each die site of each leadframe at a separate indexed location of the die site of the leadframe. - More specifically, the
system 10 ofFIG. 1 includes afirst source 12 for supplying afirst length 14 of adhesive material. Thesystem 10 also includes asecond source 16 for supplying asecond length 18 of adhesive material. Thesystem 10 also has indexing means which here includesindexing structure 20. The die sites of a plurality of leadframes 22-26 is positioned to be moved relative toapplication structure 30 by theindexing structure 20. Theapplication structure 30 is configured to receive the plurality of leadframes 22-26 of semiconductor devices as well as to receive thefirst length 14 of adhesive material and thesecond length 18 of adhesive material. As will be discussed hereinafter, the application means includes cutting means for cutting a first increment from thefirst length 14 of adhesive material and applying the first increment to a first portion of a die site (e.g., site 90) of an individual leadframe of the plurality of leadframes 22-26 and for cutting a second increment from thesecond length 18 of adhesive material and applying the second increment to a second portion of the die site (e.g., site 96) of an individual leadframe of the plurality of leadframes 22-26 at a second location thereof. - Control means is also provided to provide control signals or operation signals to operate the system. The control means shown here includes a
controller 32 interconnected to operate the indexing means and, more particularly, theindexing structure 20. It is also interconnected to thefirst source 12 and to thesecond source 16 to respectively supply thefirst length 14 and thesecond length 18 to the application means and, more particularly, theapplication structure 30. Thecontroller 32 supplies operation signals to operate the cutting means of the application means to selectively cut and supply the first increment of thefirst length 14 to the first portion of a die site of a leadframe of the plurality of leadframes 22-26 and to selectively cut and apply the second increment from thesecond length 18 to the second portion of a die site of a leadframe of the plurality of leadframes 22-26. - The
first source 12 illustrated in drawingFIG. 1 includes a firstadhesive supply 34 configured to supply thefirst length 14. Thefirst source 12 also includes a first driving means such asfirst drive structure 36 configured to receive thefirst length 14 and to urge thefirst length 14 toward theapplication structure 30 and more specifically the first cutting structure of theapplication structure 30. The firstadhesive supply 34 includes a roll of adhesively coatedtape material 35 wound on or associated withreel 38. Thereel 38 is rotatably mounted to rotate with or aboutaxle 40. Theaxle 40 is either fixedly or rotatably mounted to other supporting structure not here shown. The adhesively coatedtape material 35 is shown passing through, over or about afirst guide 42 which is fixedly or rotatably mounted about asecond axle 44. Thesecond axle 44 is either fixedly or rotatably mounted to other support structure not here illustrated. Thefirst guide 42 is positioned to align thefirst length 14 to thefirst drive structure 36. - The
first drive structure 36 here shown includes adrive roller 46 interconnected to be driven by afirst drive shaft 48 and afirst stepping motor 50. Thefirst stepping motor 50 is interconnected by aconductor 52 to receive operating signals from thecontroller 32. That is, electrical signals are supplied viaconductor 52 to activate thefirst stepping motor 50 to, in turn, drive theroller 46 and thefirst length 14 toward theapplication structure 30. - As also seen in drawing
FIG. 1 , thesecond source 16 includes a secondadhesive supply 54 of adhesively coated tape material associated with areel 56 onaxle 40. The secondadhesive supply 54 includes a circular roll of adhesively coatedtape material 55 that passes through, over or about asecond guide 58 which is also rotatably or fixedly mounted about theaxle 44. Thesecond length 18 proceeds from the secondadhesive supply 54 to thesecond drive structure 60. - As here shown, the
second drive structure 60 includessecond drive roller 62 which is driven by asecond stepping motor 64 via asecond drive shaft 66. Thesecond stepping motor 64 is interconnected byconductor 68 to receive electrical drive signals from thecontroller 32. That is, upon receipt of an electrical signal, thesecond stepping motor 64 rotates, in turn, causing thesecond drive shaft 66 and thesecond drive roller 62 to rotate to urge thesecond length 18 toward theapplication structure 30 and, more particularly, the second cutting structure a preselected distance which preferably is the length of the increment or decal. - Also depicted in drawing
FIG. 1 , theindexing structure 20 includes amovable arm 70′ (shown in dashed lines) which engages anindexing hole 82 in the rail or edge 80 to move the strip of leadframes a desired amount or distance. Themovable arm 70′ may be actuated in any convenient manner using any suitable power source and central arrangement. Alternatively, theindexing structure 20 includes anindexing roller 70 interconnected by ashaft 72 to adrive motor 74. Thedrive motor 74 is interconnected byconductor 76 to receive operation signals from thecontroller 32. The operation signals cause thedrive motor 74 to rotate which, in turn, causes theindexing roller 70 to rotate. The plurality of leadframes for semiconductor devices is positioned to be driven by theindexing roller 70 to, in turn, cause the plurality of leadframes 22-26 to move relative to theapplication structure 30. It may be particularly noted that the plurality of leadframes 22-26 of semiconductor frames is formed to have a removable carrier rail or edge orrail rail teeth teeth application structure 30. Upon completion of certain steps in the manufacturing process, the removable carrier rails or edges 78 and 80 may be removed from the leadframes 22-26. Further, the leadframes are here shown to be joined to each other in a continuous strip form. In the manufacturing process subsequent to that herein illustrated and discussed, adjacent leadframes such asleadframes - The application means may include a
block 88 positioned above theapplication structure 30. As hereinbefore noted, each leadframe, such asleadframe 23, has a first portion of adie site 90 to receive a first increment of thefirst length 14. The first increment may also be referred to as a decal. The first increment or decal is urged upward by a die through afirst die aperture 92 in theapplication structure 30. Similarly, a second increment or decal is urged upwardly by a second die through asecond die aperture 94 to position the second decal or increment at a second site such as second portion of adie site 96. As the leadframes 22-26move 98 by operation of theindexing structure 20, the first portion of adie site 90 is positioned relative to thefirst die aperture 92. Activation of theapplication structure 30 by thecontroller 32 causes the application structure to apply the first increment or first decal through thefirst die aperture 92 to a leadframe and, more particularly, to the first portion of adie site 90 of a leadframe such asleadframe 23 of the plurality of leadframes. Similarly, on positioning of the second portion of adie site 96 relative to thesecond die aperture 94, thecontroller 32 causes theapplication structure 30 to operate and, in turn, apply the second increment or second decal through thesecond die aperture 94 to the second portion of adie site 96 of a leadframe such asleadframe 23 of the plurality of leadframes 22-26. - In operation, the first leadframe, such as
leadframe 23, is indexed to position the first portion of adie site 90 relative to thefirst die aperture 92. In turn, thecontroller 32 activates thefirst stepping motor 50 viaconductor 52 to, in turn, operate thedrive roller 46 of thefirst drive structure 36. In turn, thefirst length 14 is urged toward theapplication structure 30 so that the first increment or first decal can thereby be formed by the application structure as more fully discussed hereinafter. With the first portion of adie site 90 of theleadframe 23 positioned relative to the first die aperture, and with no second portion of a die site, such as ofleadframe 24, positioned relative to thesecond die aperture 94, thecontroller 32 does not activate thesecond stepping motor 64. In turn, thesecond length 18 is not urged toward theapplication structure 30. In turn, the second increment or decal is not formed and is not urged upward through thesecond die aperture 94. A savings in adhesively coated tape material is thereby realized. Further, adhesively coatedtape material 55 is not applied upward against theblock 88 and does not build up over time to interfere with the quality and operation of thesystem 10. That is, the adhesively coated tape material can build up and interfere with the smooth operation of the system and to potentially interfere with the quality of a particular leadframe of the plurality of leadframes. - The
controller 32 here illustrated may be any combination of electronic and electromechanical devices having an input structure to receive input data pertaining to the desired speed as well as the length of the increments and the size (e.g., length) of the leadframes. Preferably, a computing structure is positioned therewith to generate signals to, in turn, cause electromechanical devices to supply electrical energy via a plurality of relays and conductors. The electrical energy is received from the conventional sources of electrical energy via aconductor 100. A plurality of relays or the equivalent thereof in thecontroller 32 is activated to supply electrical energy viaconductors respective stepping motors application structure 30, all to form and apply the first increment and the second increment from thefirst length 14 and thesecond length 18 of the adhesively coatedtape materials conductor 76 to, in turn, cause thedrive motor 74 to index and to drive the plurality of leadframes 22-26 relative to theapplication structure 30. - Although the
controller 32 may be configured to operate theblock 88, theblock 88 may be separately powered from an external source viaconductor 102. Theblock 88 is heated to, in turn, heat the adhesive coating on the first length oftape 14 and the second length oftape 18 so that the adhesive will, in turn, adhere to each leadframe of the plurality of leadframes 22-26. - Referring now to drawing
FIG. 2 , asystem 104 similar tosystem 10 includes a source of adhesively coatedtape material 106 along withapplication structure 108. The source of adhesively coatedtape material 106 includes a first roll of adhesively coated tape material, not illustrated, as well as asecond roll 110 of adhesively coated tape material positioned to be rotatably dispensed fromreel 112. Thereel 112 rotates freely about anaxle 114 to form asecond length 116. Thesecond length 116 and a first length (not shown) pass aboutfirst guide structure 118 that includes rollers similar to thefirst guide 42 andsecond guide 58 shown inFIG. 1 . Thesecond length 116 and the first length (not shown) pass into the drivingstructure 120 that includes afirst drive roller 122 and asecond drive roller 124. A first driven roller (not shown) and thefirst drive roller 122 have the first length (not shown) passing therebetween. Asecond drive roller 124 and afirst drive roller 122 are shown with thesecond length 116 passing therebetween. A dottedline 126 represents an axle connection between thefirst drive roller 122 and asecond stepping motor 128. Thesecond stepping motor 128 is connected byconductor 130 to a controller (not here shown) similar tocontroller 32. The first length from the first source (not shown) is similarly driven by a first stepping motor (not shown). - As here shown, the
application structure 108 includes a base 132 which is positioned spaced apart adistance 136 from ablock 134 similar to block 88. Thedistance 136 is exaggerated inFIG. 2 to facilitate illustration and is selected to provide for passage of a plurality ofleadframes 138 while providing an anvil or backing for afirst die 140 and asecond die 142. - As illustrated in drawing
FIG. 2 , thefirst die 140 and thesecond die 142 pass upward through thebase 132 and other structure to cut and apply respectively a first increment of the first length and a second increment of thesecond length 116 to each portion of a die site of a leadframe of a plurality ofleadframes 138. As here shown, thefirst die 140 and thesecond die 142 are urged upwardly bydie plate 144. Thedie plate 144 passes over bushings such asbushings shoe 150. Asolenoid 152 is positioned to urge thedie plate 144 upward in order to urge thefirst die 140 and thesecond die 142 upward against a leadframe of the plurality ofleadframes 138. If desired, thedie plate 144 may comprise two or more independently actuated die plates, each being actuated by its ownseparate solenoid 152 from independent signals from thecontroller 32. - Turning now to drawing
FIGS. 3 and 4 , an application structure is shown in an exploded perspective format. As can be seen from the bottom of drawingFIG. 3 and the top of drawingFIG. 4 , the components illustrated in drawingFIG. 4 interconnect with the structure at the bottom of drawingFIG. 3 , all as more fully discussed hereinafter. The application structure illustrated in drawingFIGS. 3 and 4 is suitable for use as theapplication structure 30 illustrated in drawingFIG. 1 and theapplication structure 108 illustrated in drawingFIG. 2 . - As illustrated in drawing
FIG. 3 , abase 160 is shown formed to be generally rectilinear in shape as illustrated. It has aleft side 162 spaced apart from aright side 164. Afront cross member 166 and therear cross member 168 extend between and space theleft side member 162 from theright side member 164. Theleft side member 162, theright side member 164, thefront cross member 166 and therear cross member 168 are arranged in a rectilinear fashion as shown to define an opening orvolume 170. - The
front cross member 166 has afront lip 172 and the rear cross member has arear lip 174, both of which are provided for attachment to external supporting structure. - A
punch guide insert 176 is formed with a central portion dimensioned to snugly and slidably fit within theopening 170. Aforward portion 180 and arear portion 182 are sized to snugly fit between theleft side 162 and theright side 164 of thebase 160. More specifically, theleft side 162 and theright side 164 are spaced apart a distance 184 and, in turn, define afront notch 186 and arear notch 188. Theforward portion 180 is sized inwidth 190 to be substantially the distance 184 to, in turn, facilitate a snug relationship when theforward portion 180 is positioned in thefront notch 186. Of course, therear portion 182 similarly fits snugly in therear notch 188. - Upon positioning of the
punch guide insert 176 with thecenter portion 178 in theopening 170, and theforward portion 180 in thefront notch 186 and therear portion 182 in therear notch 188, it can be seen that apertures 192-195 formed in thepunch guide insert 176 align with corresponding apertures 196-199 formed in thebase 160 and, more particularly, in thefront cross member 166 and therear cross member 168. Appropriate fasteners, such as screws, may be used to fasten thepunch guide insert 176 to thebase 160. - The
punch guide insert 176 has aleft tape guide 200 and aright tape guide 202. It can be seen that theleft tape guide 200 and theright tape guide 202 are both C-shaped in cross-section, providing lower leftflat surface 204 and lower rightflat surface 206, respectively. It can be seen that theleft tape guide 200 has awidth 208 which is sized to be comparable to thewidth 210 of afirst length 212 of adhesively coated tape material which is comparable to thefirst length 14 shown inFIG. 1 . Thus, thefirst length 212 of adhesively coated tape material can move in and be guided and aligned by theleft tape guide 200 as the first length moves toward afirst die aperture 214 which is similar to thefirst die aperture 92 shown in drawingFIG. 1 . Notably, the leftflat surface 204 is planar or substantially level and fabricated of a metal material that will minimize the amount of friction between the leftflat surface 204 and thefirst length 212. It may also be noted that theleft tape guide 200 has aleft sidewall 216 and aright sidewall 218 in order to provide lateral support for thefirst length 212 and, more particularly, to guide thefirst length 212 as it moves toward thefirst die aperture 214. Theleft tape guide 200 provides for movement of thefirst length 212 in adirection 220. In other configurations, theleft tape guide 200 may provide for movement of a first adhesively coated tape material opposite todirection 220. - It can also be seen that the
right tape guide 202 is formed to be similar in configuration to theleft tape guide 200. More specifically, theright tape guide 202 has a left sidewall 224 and aright sidewall 226. Thewidth 228 of theright tape guide 202 is selected to provide for a snug but slidable fit of thesecond length 230. More particularly, thewidth 228 of theright tape guide 202 is selected to be substantially the same as, but slightly more than, thewidth 232 of thesecond length 230. Similarly, theright tape guide 202 extends along thefull length 234 of thepunch guide insert 176 so that a second length, such assecond length 230, may move in adirection 236 from theforward portion 180 to therear portion 182 as shown or in a direction opposite todirection 236. - As can be seen in drawing
FIG. 3 , thesecond length 230 is sized to move from theforward portion 180 through theright tape guide 202 toward thesecond die aperture 238. The rightflat surface 206 is flat or planar, similar to the leftflat surface 204. - The
punch guide insert 176 may be fabricated from any material suitable for movement of thefirst length 212 and thesecond length 230. An ASST steel has been found to be suitable; any other similar steel alloys that provide for a low friction relationship between the adhesively coated tape material and, more particularly, thesecond length 230 and the rightflat surface 206 is desired. - It should also be noted that the
width 208 of theleft tape guide 200 and thewidth 228 of theright tape guide 202 may be substantially identical. Alternatively, thewidth 208 and thewidth 228 may vary in order to accommodate tape material of different widths which may be selected as desired by the user. - As further seen in drawing
FIG. 3 , a tape lead-inguide 240 is shown to be connectable through anaperture 242 by a screw (not shown) interconnecting to acorresponding aperture 244 formed in theforward portion 180 of thepunch guide insert 176. The tape lead-inguide 240 has aleft channel insert 246 which has awidth 248 selected to snugly fit within theleft tape guide 200. Theleft channel insert 246 extends downwardly adistance 250 from theundersurface 252 of the tape lead-inguide 240. Thedistance 250 is selected to provide an upper guide surface for thefirst length 212. Similarly, aright channel insert 254 is sized to extend downwardly adistance 255 andwidth 253 to snugly fit within theright tape guide 202 to provide an upward guide surface for thesecond length 230. The tape lead-inguide 240 is sized in length 256 a distance selected to provide for aleft channel insert 246 and aright channel insert 254 ofsufficient length 256 to stably guide thefirst length 212 and thesecond length 230. - As illustrated in drawing
FIG. 3 , acutter block 258 is shown having aleft recess portion 260 sized in length 262 a distance so that upon installation, therear edge 264 is positioned proximate thefront edge 266 of thefirst die aperture 214 in thepunch guide insert 176. Therefore, a die (e.g., die 142 illustrated in drawingFIG. 2 ) passing upwardly through thefirst die aperture 214 will urge thefirst length 212 upwardly past therear edge 264 to, in turn, cause an increment or decal of thefirst length 212 to be formed and to be urged upwardly toward a portion of a die site of a leadframe of a plurality of leadframes. - Similarly, the
right portion 268 of thecutter block 258 is sized inlength 270 so that, when installed, therear edge 272 is positioned proximate thefront edge 274 of thesecond die aperture 238. Therefore, thesecond length 230, upon positioning over thesecond die aperture 238, can be formed into a second increment as it is urged past therear edge 272 of theright portion 268 to thereby form the second increment or decal which is, in turn, urged upward toward a portion of a die site of a leadframe of a plurality of leadframes. It should be understood that the use of the word “second” is intended to infer that it is second in sequence and to distinguish it from the other or first increment or decal. - A
guide insert 276 is also shown in drawingFIG. 3 having afront edge 278 formed to mate with therear edges cutter block 258.Notches first die aperture 214 and thesecond die aperture 238 so that a die may be urged upward there past with the first increment of thefirst length 212 and so that a die may be urged upward there past with the second increment or second decal of thesecond length 230. -
Apertures cutter block 258 to receive screws for interconnection withcorresponding apertures punch guide insert 176. Similarly,apertures guide insert 276 to receive screws for threaded interconnection to correspond to theapertures punch guide insert 176. - Four guide posts 294-297 are also shown in drawing
FIG. 3 . They are sized in cross-section to snugly fit within the corresponding apertures 298-301 formed in thebase 160. Screws, or any other suitable structure, may be provided to snugly secure the guide posts 294-297 within the corresponding apertures 298-301. Four bushings 302-305, shown in drawingFIG. 4 , are sized with interior apertures 306-309 to snugly and slidably fit over the guide posts 294-297. The bushings 302-305 also slidably fit through corresponding apertures 310-313 formed in apunch shoe 314. Aleft die 316 is also shown in drawingFIG. 4 . The left die 316 has awidth 320 and alength 322 selected to snugly fit within the punch shoe leftdie aperture 324 and to correspondingly register with and slide snugly through thefirst die aperture 214 in thepunch guide insert 176 shown in drawingFIG. 3 . Further, the left die 316 will pass through thenotch 280 as it proceeds upwardly toward a semiconductor device leadframe which is passing over the top surface of the application structure, which top surface is comprised of thetop surface 241 of the tape lead-inguide 240 and the correspondingtop surface 259 ofcutter block 258 and thetop surface 277 of theguide insert 276. That is, the left die 316 is sized inheight 326 to extend upwardly a distance so that thetop surface 328 contacts the leadframe of a plurality of leadframes of semiconductor devices passing over thetop surfaces first length 212 to a portion of a die site of a leadframe of the plurality of leadframes, such first site being selected by positioning a leadframe of each of the plurality of leadframes in a desired location and by selecting thewidth 190 of thepunch guide insert 176 and, more particularly, the distance between theleft tape guide 200 and theright tape guide 202. - Now referring back to drawing
FIG. 4 , theunderside 330 of theleft die 316 rests against apunch plate 332. A solenoid, or other similar device to cause upward motion of thepunch plate 332, is positioned against theunderside 334 of the punch plate to urge the plate upward and, in turn, urge the bushings 302-305 and theleft die 316 and the right die 318 upwardly through thepunch shoe 314 as more fully discussed hereinafter. The bushings 302-305 extend downward through corresponding apertures 336-339 formed in thepunch plate 332. The bushings 302-305, as well as thepunch plate 332, theleft die 316 and theright die 318, as well as thepunch shoe 314, are all held in place by retaining rings 340-343 shown in drawingFIG. 3 . - Referring back to drawing
FIG. 4 , the right die 318 has awidth 344 and alength 340′ selected to register with a corresponding punch shoeright die aperture 348 formed in thepunch shoe 314. The right die 318 has aheight 350 selected to extend upward through the punch shoeright die aperture 348 and through thesecond die aperture 238 formed in thepunch guide insert 176 and also through theright notch 282 formed in theguide insert 276 for further travel to affix a second increment or decal formed from thesecond length 230 of adhesively coated tape material in a preselected second portion of a die site of a leadframe of a plurality of leadframes. - It may be noted that the
left die 316 and the right die 318 are here shown to be of substantiallyidentical width identical lengths identical heights lengths widths - It may be noted that the distance the left die 316 and the right die 318 travel past the surface, defined by the
surfaces FIG. 3 ), is controlled by theheight 352 or length of each of the bushings 302-305. It may also be noted that theleft die 316 and the right die 318 each have arespective shoulder dice die aperture 324 and the punch shoeright die aperture 348. - It should be understood that in operation a driving mechanism, such as a
solenoid 152 shown in drawingFIG. 2 , operates to urge thepunch plate 332 upward to, in turn, drive theleft die 316 and right die 318 upward through thepunch shoe 314 and through thefirst die aperture 214 and thesecond die aperture 238. Mechanisms, other than a solenoid, may be used to urge the punch plate upward. For example, a mechanical cam structure may be provided, as well as a hydraulic piston or any other similar device which provides vertical or upward force sufficient to drive theleft die 316 and theright die 318. It may be noted that the total travel of theleft die 316 and the right die 318 is such that, at a low point, the tops are slightly below the level of theflat surfaces surfaces FIG. 3 ). Thus, the travel was slightly more than theheight 257 of the left recess portion 261 which is sized to receive thecutter block 258 and the guide insert 276 (FIG. 3 ). - Turning to drawing
FIG. 5 , a simple side view of anapplication structure 362, similar to the application structure of drawingFIGS. 3 and 4 , as well as theapplication structures tape material 364 from a supply of adhesively coated tape material extends through theapplication structure 362 to asecond die channel 366. That is, theapplication structure 362 has achannel 366 sized to snugly and slidably receive asecond die 368 to move past acutter block 370 and acorresponding guide insert 372 comparable to thecutter block 258 and thepunch guide insert 176 of drawingFIG. 3 . - Similarly, a
first die 374 is shown positioned in afirst die channel 376 for snug but slidable movement therein. A first length of adhesively coated tape material from a first supply of adhesively coated tape material extends toward thefirst die channel 376. The first die moves upward past thecutter block 370 to thereby form a first increment orfirst decal 378. The first die 374 positions and forcibly urges thefirst decal 378 to theunderside 380 of aleadframe 382 of a plurality of leadframes which are passing over theupper surface 384 of theapplication structure 362. - The
block 386 is comparable to block 134 and block 88 (FIG. 1 ) and is here shown spaced away from the upper surface 384 adistance 385 that is exaggerated to facilitate illustration. Theblock 386 is also shown spaced away from theleadframe 382 anexaggerated distance 387 to show that theleadframe 382 slidably moves proximate theblock 386. In practice, thedistance 385 and thedistance 387 is selected (e.g., 5-10 millimeters) so that theleadframes 382 readily move between theblock 386 and thesurface 384. At the same time, thedistances block 386 functions as an anvil without appreciably distorting, deflecting or bending theleadframe 382. -
Dice FIG. 5 , are shown in an upward position respectively, being the first increment ordecal 378 as well as a corresponding second decal orsecond increment 388. That is, thesecond die 368 moves upward, urging the adhesively coated tape material of thefirst increment 378 past thecutter block 370 to, in turn, form the second decal orincrement 388 and to further urge the second decal orincrement 388 upward against theunderside 380 of theleadframe 382 at a site selected by the dimensioning of the apparatus and by the movement of theleadframe 382 relative to theapplication structure 362. Similarly, the first die moves upward to form and position the first decal orincrement 378. - Referring now to drawing
FIG. 6 , a first plurality ofleadframes 390 for semiconductor devices is shown consisting of leadframes 392-399. The leadframes are positioned to move towardfirst application structure 400 and, more particularly, over thetop surface 402 of thefirst application structure 400. A second plurality ofleadframes 404 has leadframes 405-412 positioned to move over thetop surface 414 of asecond application structure 416. Athird application structure 418 is also shown. Although thefirst application structure 400,second application structure 416 and thethird application structure 418 are all shown in side-by-side relationship, such orientation is strictly for purposes of illustration. - Referring to the
third application structure 418,first tape guide 420 is shown having a central axis 422. The top 424 of a first die is shown in its first die channel extending upwardly through a first die notch 426 formed in aguide insert 428. Similarly, asecond tape guide 430 is shown having acentral axis 432. The top 434 of a second die is shown extending upwardly through asecond notch 436 in theguide insert 428. Theguide insert 428 is positioned proximate acutter block 438 which, in turn, is adjacent thetop surface 440 of a tape lead-inguide 442. As can be seen, the central axis 422 of thefirst tape guide 420 is spaced from thecentral axis 432 of the second tape guide 430 adistance 444 which may be said to be one leadframe or one pitch. In the preferred illustrations, thedistance 444 in fact is equivalent to theoverall length 446 of each leadframe 392-399 and 405-412 of the respective pluralities ofleadframes distance 444 may be a pitch which is different than thelength 446 for those leadframes having more than two sites for a first increment or decal and/or a second increment or decal. In typical applications such as that here illustrated, one pitch equals thelength 446 of one leadframe. - Referring now to the
second application structure 416, it can be seen that the second plurality ofleadframes 404 is positioned with afirst leadframe 405 having its first position of a die site positioned over the top of the first die or relative to the first die to receive the increment of the first decal therefrom. With indexing means urging the plurality ofleadframes 404 across the face ortop surface 448 of thesecond application structure 416, it can be seen that thefirst site 450 moves away from the top of the first die, such as the top 424 of the first die, so that thesecond site 452 is positioned over the top of or relative to the top 454 of the second die. Thus, as shown with respect to the first application structure, afirst leadframe 392 has itssecond site 456 positioned over the top 458 of a second die while the second or anymiddle leadframe 393 has itsfirst site 460 positioned over the top 462 of the first die. - In reference to the first plurality of
leadframes 390 and the second plurality ofleadframes 404, it can be seen that each has leadframes joined one to the other. The leadframes haveremovable edges apertures leadframes application structures leadframe 394, will proceed over thetop surface 402 of thefirst application structure 400. That is, if the plurality ofleadframes 390 is severed along aline 472,leadframe 394 becomes a last leadframe in whichfirst site 474 is positioned relative to the top 462 of the first die, after which itssecond site 476 is positioned over the top 458 of the second die. When thesecond site 476 is positioned over the top 458 of the second die, the top 462 of the first die is exposed and does not have a leadframe or a leadframe with a first site positioned thereover. Thus, a first increment or decal proceeding upward does not have a site against which it is to be positioned. In the event that the first length of the supply of adhesively coated tape material is advanced over the first die, a first increment would be formed and could potentially attach to the underside of a block such as, for example, block 386. In turn, the potential for contamination with unused increments is evident. - As hereinafter discussed, the
controller 32 sends operation signals to drivestructures 36 and 60 (FIG. 1 ) to advance thefirst length 14 and thesecond length 18 over the tops of their respective dice so that a first increment or first decal and a second increment or second decal can thereby be formed and attached at their respective first sites and second sites of each of the leadframes of the plurality of leadframes without advancing a second increment when the first leadframe is not yet positioned thereover and not forming and advancing a first increment when the last leadframe is no longer positioned over the top of the first die. - Referring now to drawing
FIGS. 7 through 11 , drive structures suitable for use as afirst drive structure 36 shown in drawingFIG. 1 and asecond drive structure 60 shown inFIG. 2 are depicted in an exploded perspective format. The illustrations of drawingFIGS. 7 through 11 are somewhat simplified to facilitate understanding. - In drawing
FIGS. 7 and 11 , alower roller base 480 is shown with aforward alignment pin 482. Thelower roller base 480 has arecess 486 formed therein sized to rotatively receive therein a lowerright roller 488 and a lowerleft roller 490. - The lower
right roller 488 is mounted to aright axle 492 and rotates independent of and relative to the lowerleft roller 490, which itself is mounted to theleft axle 494 to rotate about acommon axis 496. If the rollers are fixedly secured to theiraxles axles left roller 490 and lowerright roller 488. The respectiveright axle 492 and leftaxle 494 are positioned in and corresponding to the rightlower bearing half 498 and the leftlower bearing half 500. - In drawing
FIGS. 7 and 10 , a lower rollertop housing 502 is shown with arear aperture 504 positioned to register with the upwardly extendingrear alignment pin 484 and afront alignment aperture 506 positioned to register with theforward alignment pin 482. Aroller recess 508 is formed in the lower rollertop housing 502 to register with and receive the lowerright roller 488 and lowerleft roller 490. A rightupper bearing half 510 and a leftupper bearing half 512 is formed to receive theright axle 492 and theleft axle 494, respectively. That is, the rightlower bearing half 498 and the rightupper bearing half 510 together form a bearing to receive and support theright axle 492 therewithin. Similarly, the leftlower bearing half 500 and the leftupper bearing half 512 together receive theleft axle 494 therewithin. - An
upper roller base 514 is also shown in drawingFIGS. 7 and 9 with arear alignment aperture 516 positioned to register with therear alignment pin 484 extending upwardly from thelower roller base 480. Similarly, theupper roller base 514 has aforward alignment aperture 518 positioned to register with theforward alignment pin 482 extending upwardly from thelower roller base 480. - The
upper roller base 514 hasupper roller recess 520 formed therein to receive a rightupper roller 522 and a leftupper roller 524. The rightupper roller 522 and leftupper roller 524 are both rotatively mounted about anaxle 526 having aleft end 528 and aright end 530. Theupper roller recess 520 has at its left end 532 a pair oftabs left end 528 of theaxle 526. Thetabs diameter 544 of thecommon axle 526 at theleft end 528. Similarly, at the right end 538 a pair of spacedtabs diameter 544 of thecommon axle 526. Therefore, theleft end 528 and theright end 530 of thecommon axle 526 are rigidly supported in theupper roller recess 520 to preclude general fore and aft movement upon attachment thereto of the upper rollertop housing 546. - The upper roller top housing 546 (
FIGS. 7 and 8 ) has aroller recess 548 formed therein to rotatively receive therewithin the leftupper roller 524 and the rightupper roller 522.Apertures right end 530 of thecommon axle 526 and theleft end 528 of thecommon axle 526 to thereby rigidly hold thecommon axle 526 in place while providing for free rotation of the rightupper roller 522 and the leftupper roller 524 thereabout. Notably, the upper rollertop housing 546 is secured to theupper roller base 514 through the use of screws associated with a plurality of apertures 554-557. - Positioned between the
upper roller base 514 and the lower rollertop housing 502 is atape guide 558. Thetape guide 558 has anaperture 560 positioned to receive therear alignment pin 484 in order to align thetape guide 558 relative to the lowerright roller 488, lowerleft roller 490, rightupper roller 522 and leftupper roller 524. It also has aforward alignment aperture 562 to align with theforward alignment pin 482. - The
tape guide 558 has aroller recess 564 sized to receive the lowerleft roller 490 and lowerright roller 488 therein to extend just barely above thetop surface 566 of thetape guide 558. The lowerleft roller 490 and lowerright roller 488 will contact the first length of adhesive tape supplied from the source of adhesive tape along aright tape track 570, aleft tape track 568 and a second source for a second length of adhesive tape supplied from a second source along theright tape track 570. Theleft tape track 568 and theright tape track 570 are formed of material to provide for reduced friction so that the first length and the second length of adhesive tape may slide smoothly thereover. Theleft tape track 568 and theright tape track 570 may be slightly recessed to guide the left length and the right length and inhibit lateral movement thereof. - It may be noted that the lower
left roller 490 and the lowerright roller 488 extend upwardly through theroller recess 508 and theroller recess 564 to drivingly engage respectively the first length of adhesive tape and the second length of adhesive tape. The rightupper roller 522 is positioned as a driven or idler roller with the second length passing between the driven rightupper roller 522 and the driving lowerright roller 488. Similarly, the lowerleft roller 490 drives the leftupper roller 524 with the first length of adhesive tape passing therebetween. - The
right axle 492 extends outwardly for inner connection to a stepping motor or other means for rotating theaxle 492 incrementally to advance the second length a preselected distance to, in turn, provide the desired length of the second decal or second increment. Similarly, a stepping motor or other means is associated with theleft axle 494 to drive the lowerleft roller 490 to, in turn, advance the first length of adhesively coated tape material a desired distance or length to provide for the correct dimensions or desired dimension of the first increment or decal of adhesively coated tape material for application to each leadframe of a plurality of leadframes. - Referring now to drawing
FIG. 12 , a forward portion of thetape guide 558 is illustrated in partial cross-section. Theleft tape track 568 is shown recessed adepth 572 that is greater than the thickness of the adhesively coated tape material so that theleft tape track 568 functions as a guide for the adhesively coated tape material. Theright tape track 570 is similarly formed with a depth comparable todepth 572. - At the
front end 574 of thetape guide 558, anentry surface 576 is formed at anangle 578 extending downwardly so that thesurface 576 extends downwardly from the lowerflat surface 579 of theleft tape track 568 and a similar lower flat surface of the right tape track 570 (not here shown). It can also be seen in drawingFIG. 7 that theentry surface 576 extends outwardly at asecond angle 580. Theright tape track 570 extends outwardly at a similar angle. Thesecond angle 580 and theleft tape track 568 are provided to facilitate an entry of the respective first length of adhesively coated tape material and second length of adhesively coated tape material into their respectiveleft tape track 568 andright tape track 570. Therollers roller recess 564 so they can drivingly engage their respective lengths of adhesively coated tape material. - Turning now to drawing
FIG. 13 , a drive structure similar to that shown in drawingFIGS. 7 through 12 is depicted with afirst length 582 and asecond length 584 extending over a lowerleft roller 586 and a lowerright roller 588. Notably, theleft axle 590 has apulley 592 associated therewith drivingly interconnected with a steppingmotor 594 having a drivepulley 596 associated therewith and with abelt 600 connected thereinbetween. - Similarly, the
right roller 588 is driven byright axle 602 which, in turn, is driven by adrive pulley 604 connected by abelt 606 to a drivepulley 608. The drive pulley is driven by a steppingmotor 610. - In drawing
FIG. 14 , a similar configuration is shown in which afirst length 612 is driven by aleft pulley 614. Theleft pulley 614 is connected by aleft axle 616 and is driven by a stepping motor andpulley configuration 617 similar to that illustrated and described with respect toFIG. 13 . As can be seen, theright pulley 618 is positioned to drive asecond length 620. Theright pulley 618 is mounted to aright axle 622 and is driven by a pulley and steppingmotor arrangement 621 similar to that illustrated and described in drawingFIG. 13 . As can be seen in drawingFIG. 14 , theleft pulley 614 and theright pulley 618 are each spaced apart from each other and mounted to a separateleft axle 616 and to a separateright axle 622. Other arrangements may be provided in which a first length and a second length are separately indexed or stepped toward the application structure. - Turning now to drawing
FIG. 15 , an alternative punch shoe arrangement is shown in which there is aleft punch shoe 630 and a right punch shoe 632. Eachpunch shoe 630 and 632 is mounted to move relative to a similar plurality of bushings such asbushing 634 which functions similar to the bushing illustrated in drawingFIGS. 3 and 4 . Theleft punch shoe 630 has acentral axis 636 which, along with punch shoe dieaperture 638, is positioned to provide for a sliding relationship relative to a die similar to aleft die 316. Similarly, the right punch shoe 632 has acentral axis 640 passing through the center of the correspondingapertures bushing 634, as well as the right punch shoe dieaperture 646. InFIG. 17 , aleft punch plate 648 is shown for positioning relative to a left die, such asleft die 316, and aright punch plate 650 is shown for positioning relative to a right die, such asright die 318, as better seen in drawingFIGS. 3 and 4 . - As generally depicted in drawing
FIG. 16 , anapplication structure 652 is positioned relative to ablock 654 with a plurality of leadframes forsemiconductor devices 656 moving relative to the application structure by indexing means such as a roller 657 driven by a stepping motor (not here illustrated). Theapplication structure 652 includes aleft punch plate 648 and aright punch plate 650, both positioned to be urged upwardly byrespective solenoids conductors solenoid 658 urges theleft punch plate 648 upward to, in turn, urge the left die 666 to move upwardly through the base of theapplication structure 652 to form and advance the first increment or decal upward against the underside of each frame of the plurality of frames ofsemiconductor devices 656 upon orientation of a first site relative to theleft die 666. Similarly,punch plate 650 may be urged by itssolenoid 660 to move upward relative to the plurality of frames ofsemiconductor devices 656 to form a second increment from the second length and to urge the second increment toward and attach it to the underside of a second site of a frame positioned relative to thesecond die 670. - Arrangements, such as that depicted in drawing
FIG. 16 , may be used with a drive structure in which both the first length and the second length are simultaneously advanced. Some adhesively coated tape material will thereby be wasted because the tape will advance to each die simultaneously with a frame. However, the die will not cut a desired increment until such time as the appropriate first site or second site is presented. - In drawing
FIG. 18 , a preferred method for operating the illustrated and described apparatus of the present invention is graphically illustrated in a series of steps. More specifically, the preferred method involves an operating structure comparable to that illustrated in drawingFIGS. 3 through 12 . - More specifically, it is preferred to separately index or feed the first length to the first die. The controller is activated to urge the first length to advance a distance sufficient to form the first increment and to urge the first die upward to form and urge the first increment at the first site for each and every leadframe of the plurality of leadframes. Similarly, the controller functions to urge the second length toward the second die, the desired length sufficient to form the second increment and only when a second site is presented to or is relative to the second die. Thus, the second die and the first die may move simultaneously, but a first decal and a second decal or first increment and second increment will be formed only when the first length of adhesively coated tape material and the second length of adhesively coated tape material are selectively advanced by the controller. The controller is configured to identify when a first leadframe is being presented and, more particularly, the first site of a first leadframe is being presented to the first die. The controller may also have means to receive information to identify how many leadframes of the plurality of leadframes are in existence and to count those leadframes so that the controller knows when to not advance a first length to form a first increment because a first site is no longer positioned relative to the first die.
- Those skilled in the art will recognize that other variations of structures and devices may be provided without deviating from the principles of the invention as herein set forth and as hereinafter defined by the claims.
Claims (38)
1. A system for applying adhesively coated material to a portion of a die site of a leadframe of a plurality of leadframes for semiconductor devices, said system comprising:
a first source for supplying a first length of adhesively coated material at a first location of said die site of said leadframe;
a second source for supplying a second length of adhesively coated material at a second location of said die site of said leadframe; and
application apparatus configured to receive said plurality of leadframes for semiconductor devices in a leadframe-by-leadframe sequence, to receive said first length of adhesively coated material at the first location of said die site and to receive said second length of adhesively coated material at the second location of said die site, said application means having cutting means for cutting a first increment of said first length of adhesively coated material and applying said first increment to the first location of said die site of said leadframe of said plurality of leadframes at and for cutting a second increment of said second length of adhesively coated material and applying said second increment to the second location of said die site of said leadframe of said plurality of leadframes after the leadframe has been indexed to the second location.
2. The system of claim 1 , further comprising:
cutting structure including:
a first die located at the first location, the first die movable relative to a first cutting structure configured to receive said first length of said adhesively coated material; and
operation apparatus positioned to move said first die relative to said first cutting structure to form said first increment and to urge said first increment toward and against said first location of said die site of said leadframe of said plurality of leadframes for semiconductor devices.
3. The system of claim 2 , wherein said structure further includes:
a second die located at the second location, the second die movable relative to a second cutting structure configured to receive said second length of said adhesively coated material; and
wherein said operation apparatus is positioned to move said second die relative to said second cutting structure to form said second increment and to urge said second increment towards and against the second location of said die site of said leadframe of said plurality of leadframes for semiconductor devices.
4. The system of claim 3 , wherein said first source includes:
a first adhesively coated material supply configured to supply said first length.
5. The system of claim 4 , wherein said second source includes:
a second adhesively coated material supply configured to supply said second length.
6. The system of claim 3 , further comprising:
indexing apparatus including:
apparatus configured to urge said plurality of leadframes for semiconductor devices to move relative to said application apparatus.
7. The system of claim 2 , wherein said operation apparatus includes:
a first die moving mechanism positioned relative to said first die for urging said die to move toward a leadframe of said plurality of leadframes, said first die moving mechanism being connected to said control means to receive operation signals therefrom to cause said first die moving mechanism to move said first die toward said leadframe of said plurality of leadframes.
8. The system of claim 7 , wherein said first die moving mechanism includes:
a solenoid mechanism positioned to urge said die to move.
9. The system of claim 3 , wherein said application apparatus includes:
a block positioned opposite said first die with said leadframe of said plurality of leadframes positioned between said block and said first die to inhibit movement of said leadframe of said plurality of leadframes upon movement of said first die against said leadframe of said plurality of leadframes.
10. The system of claim 9 , wherein said block is sized for positioning opposite both said first die and said second die with a leadframe of said plurality of leadframes positioned between said block and said first die and with a leadframe of said plurality of leadframes positioned between said block and said second die to inhibit movement of said leadframe of said plurality of leadframes upon movement of said first die and said second die against said leadframe of said plurality of leadframes.
11. The system of claim 9 , wherein said block includes:
heating apparatus to heat said block and said leadframe and said first increment and said second increment upon urging of same against said leadframe.
12. The system of claim 3 , wherein said application apparatus includes:
first guide for said first length and a second guide for said second length.
13. The system of claim 3 , wherein said first cutting structure and said second cutting structure are connected.
14. The system of claim 3 , wherein said operation apparatus is configured to urge said first die and said second die to move separately and independently.
15. The system of claim 6 , wherein said plurality of leadframes includes a first leadframe, a middle leadframe and a last leadframe, and wherein said indexing apparaatus operates to urge said first leadframe to the first location of said die site with its first location positioned relative to said die site to receive said first increment upon activation of said first source and with its second location positioned to not be contacted by said second die, wherein said control means sends operation signals to activate said first source to supply said first length to said first cutting structure and to not activate said second source.
16. The system of claim 15 , wherein said indexing apparatus operates to urge said middle leadframe to have its first location of said die site positioned relative to said first die to receive said first increment upon activation of said first source and said first die and to thereafter urge said middle leadframe to have its second location of said die site positioned relative to said second die to receive said second increment upon activation of said second source and said second die, and wherein said control apparatus sends operation signals to activate said first source to supply said first length to said first cutting structure and to activate said second source to supply said second length to said second cutting structure.
17. The system of claim 16 , wherein said indexing apparatus operates to urge said last leadframe to be positioned with its second location of said die site positioned relative to said second die to receive said second increment upon activation of said second source and said second die and with is first location of said die site positioned to not be contacted by said first die, and wherein said operation apparatus sends operation signals to activate said second source to supply said second length to said second cutting structure and to not activate said first source.
18. Apparatus for application of tape to a die site of an LOC leadframe of a plurality of LOC leadframes, said apparatus comprising:
a base;
a block positioned proximate said base and spaced therefrom for an LOC leadframe to pass closely and freely therebetween;
supply structure positioned relative to said base to supply a first tape length at a first location of said die site of said leadframe and a second tape length at a second location of said die site of said leadframe to said base;
indexing structure for moving each LOC leadframe of said plurality of LOC leadframes relative to said base from the first location of said die site to the second location of said die site;
application structure mechanically associated with said base for cutting said first tape length into a first tape decal and applying said first tape decal to the first location of said die site of said LOC leadframe positioned between said base and said block at the first location and for cutting said second tape length into a second tape decal and applying said second decal to the second location of said die site on said LOC leadframe positioned between said base and said block at the second location; and
control structure connected to said application means for causing said application structure to cut said first tape length into a first tape decal and for applying said first tape decal to a first location of said die site on an LOC leadframe and to cut said second tape length into a second decal and for applying said second decal to a second location of said die site on said LOC leadframe positioned between said base and said block at the second location.
19. The apparatus of claim 18 , wherein said application structure includes a first die positioned to cut said first tape length to form said first tape decal and to urge said first tape decal to said first location of said die site, said block positioned relative to said first die to inhibit movement of said LOC leadframe of said plurality of LOC leadframes upon movement of said first die against said leadframe of said plurality of LOC leadframes.
20. The apparatus of claim 17 , wherein said application structure includes a second die positioned to cut said second tape length to form said second tape decal and to urge said second tape decal to the second location of said die site, and wherein said block is sized for positioning opposite both said first die and said second die with a leadframe of said plurality of LOC leadframes positioned between said block and said first die and with a leadframe of said plurality of leadframes positioned between said block and said second die to inhibit movement of said leadframe of said plurality of leadframes upon movement of said first die and said second die against said leadframe of said plurality of leadframes.
21. The apparatus of claim 20 , wherein said block includes:
heat means to heat said block and said LOC leadframe and said first increment and said second increment upon urging of same against said LOC leadframe.
22. The apparatus of claim 21 , wherein said application structure includes:
first guide for said first length; and
a second guide for said second length.
23. The apparatus of claim 22 , wherein said indexing structure includes structure configured to urge said plurality of LOC leadframes to move relative to said application structure.
24. The apparatus of claim 23 , wherein said application structure includes a first die moving mechanism positioned relative to said first die for urging said die to move toward an LOC leadframe of said plurality of LOC leadframes, said first die moving mechanism being connected to said control structure to receive operation signals therefrom to cause said first die moving mechanism to move said first die toward said LOC leadframe of said plurality of LOC leadframes.
25. The apparatus of claim 24 , wherein said first die moving mechanism includes a solenoid mechanism positioned to urge said die to move.
26. A method of attaching tape to a plurality of leadframes comprising
providing indexing apparatus to supply a plurality of leadframes in leadframe-by-leadframe sequence, each leadframe of said plurality of leadframes having a first location of a die site of a leadframe of said plurality of leadframes for receiving a first piece of tape of a first adhesively coated material and a second location of a die site for receiving a second piece of tape of a second adhesively coated material;
providing application apparatus to receive said first adhesively coated material at the first location of a die site, to receive said second adhesively coated material at the second location, and to receive said plurality of LOC leadframes in leadframe-by-leadframe sequence, said application apparatus having cutting apparatus for cutting and applying a first piece of tape of said first adhesively coated material to the first location of a die site and for cutting and applying a second decal of said second adhesively coated material to the second location of a die site;
operating a first source of a first adhesively coated material to supply a length of said first adhesively coated material to said application apparatus;
operating a second source of a second adhesively coated material to supply a length of said second adhesively coated material to said application apparatus;
operating said application apparatus to cut said first decal from said length of first adhesively coated material and to apply said first piece of tape to the first location of the die site of each leadframe of said plurality of LOC leadframes of said plurality of LOC leadframes at the first location;
operating said second source to supply a length of said second adhesively coated material to said application apparatus; and
operating said application means to cut said second piece of tape from said length of second adhesively coated material and to apply said second decal to a second site of each of said leadframes of said plurality of leadframes at the second location.
27. The method of claim 26 , wherein the application apparatus includes a first applicator and the second applicator includes a die configured for cutting a portion of adhesively coated material from the source of adhesively coated material.
28. The method of claim 26 , further including providing a block spacedly positioned from the application apparatus wherein each leadframe of the plurality is positioned intermediate the block and the first and second applicators during operation of the application apparatus.
29. The method of claim 28 , wherein the block is heated during the operation of the application apparatus.
30. The method of claim 27 , wherein a source of adhesively coated material comprises providing a respective supply of adhesively coated material for the first and second applicators.
31. The method of claim 27 , wherein providing a source of adhesively coated material further includes providing a drive roller assembly for controllably supplying the first and second applicators with a quantity of adhesively coated material.
32. The method of claim 30 , wherein providing a source of adhesively coated material further includes providing a drive roller assembly for each respective supply of adhesively coated material for each of the first and second applicators for controllably supplying each of the first and second applicators with a quantity of adhesively coated material.
33. The method of claim 31 , wherein operating the source of adhesively coated material comprise rotating the drive roller assembly to displace a quantity of the adhesively coated material into engagement with each of the first and second applicators.
34. The method of claim 26 , further including providing a controller for intercooperating the operation of the source of adhesively coated material and the indexing apparatus.
35. The method claim 34 , further including operating the controller to synchronize the operation of the source of adhesively coated material and the indexing apparatus.
36. The method of claim 34 , wherein providing the controller further includes incorporating the controller with the application apparatus.
37. The method of claim 36 , further including operating the controller to synchronize the operation of the source of adhesively coated material, the indexing apparatus, and the application apparatus.
38. The method of claim 30 , wherein providing the source of adhesively coated material comprises a source of thermal setting adhesively coated material.
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US11/497,082 US20060260742A1 (en) | 1997-08-07 | 2006-08-01 | Methods for application of adhesive tape to semiconductor devices |
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US10/639,124 US7087133B2 (en) | 1997-08-07 | 2003-08-11 | Methods for application of adhesive tape to semiconductor devices |
US11/497,082 US20060260742A1 (en) | 1997-08-07 | 2006-08-01 | Methods for application of adhesive tape to semiconductor devices |
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US09/484,852 Expired - Fee Related US6623592B1 (en) | 1997-08-07 | 2000-01-18 | Methods for application of adhesive tape to semiconductor devices |
US09/875,632 Expired - Fee Related US6607019B2 (en) | 1997-08-07 | 2001-06-06 | Method and apparatus for application of adhesive tape to semiconductor devices |
US10/633,926 Expired - Fee Related US6883574B2 (en) | 1997-08-07 | 2003-08-04 | Apparatus for application of adhesive tape to semiconductor devices |
US10/639,124 Expired - Fee Related US7087133B2 (en) | 1997-08-07 | 2003-08-11 | Methods for application of adhesive tape to semiconductor devices |
US11/497,082 Abandoned US20060260742A1 (en) | 1997-08-07 | 2006-08-01 | Methods for application of adhesive tape to semiconductor devices |
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US09/330,794 Expired - Fee Related US6267167B1 (en) | 1997-08-07 | 1999-06-14 | Method and apparatus for application of adhesive tape to semiconductor devices |
US09/484,852 Expired - Fee Related US6623592B1 (en) | 1997-08-07 | 2000-01-18 | Methods for application of adhesive tape to semiconductor devices |
US09/875,632 Expired - Fee Related US6607019B2 (en) | 1997-08-07 | 2001-06-06 | Method and apparatus for application of adhesive tape to semiconductor devices |
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US6096165A (en) * | 1997-08-07 | 2000-08-01 | Micron Technology, Inc. | Method and apparatus for application of adhesive tape to semiconductor devices |
US6638831B1 (en) | 2000-08-31 | 2003-10-28 | Micron Technology, Inc. | Use of a reference fiducial on a semiconductor package to monitor and control a singulation method |
JP3835420B2 (en) * | 2003-03-19 | 2006-10-18 | ソニー株式会社 | Antenna device and method for manufacturing antenna device |
JP2006041315A (en) * | 2004-07-29 | 2006-02-09 | Towa Corp | Die bonder |
CA2583969C (en) * | 2004-10-14 | 2013-10-08 | Glenn Roche | Flexible magnetised portion applicator dispensing apparatus and method |
US7742407B2 (en) * | 2005-11-10 | 2010-06-22 | Scientific-Atlanta, Llc | Quality of service management in a switched digital video environment |
US7999362B2 (en) * | 2008-01-25 | 2011-08-16 | Infineon Technologies Ag | Method and apparatus for making semiconductor devices including a foil |
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Also Published As
Publication number | Publication date |
---|---|
US6096165A (en) | 2000-08-01 |
US20010027841A1 (en) | 2001-10-11 |
US20040026044A1 (en) | 2004-02-12 |
US6623592B1 (en) | 2003-09-23 |
US7087133B2 (en) | 2006-08-08 |
US6267167B1 (en) | 2001-07-31 |
US6607019B2 (en) | 2003-08-19 |
US20040033642A1 (en) | 2004-02-19 |
US6883574B2 (en) | 2005-04-26 |
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