US20060268213A1 - Low-cost flexible film package module and method of manufacturing the same - Google Patents
Low-cost flexible film package module and method of manufacturing the same Download PDFInfo
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- US20060268213A1 US20060268213A1 US11/501,883 US50188306A US2006268213A1 US 20060268213 A1 US20060268213 A1 US 20060268213A1 US 50188306 A US50188306 A US 50188306A US 2006268213 A1 US2006268213 A1 US 2006268213A1
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- flexible film
- package
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- film package
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
Definitions
- the present invention relates to a semiconductor device used for a liquid crystal display (LCD) device and, more particularly, to a flexible film package.
- LCD liquid crystal display
- a flexible film package is a semiconductor package in which a semiconductor chip is directly attached onto a flexible thin-tape-type film so as to reduce the area occupied by the mounted semiconductor chip.
- Flexible film packages do not generally utilize solder balls as external connection terminals but instead rely on an anisotropic conductive film (ACF) that is directly attached to a printed circuit board (PCB) or a glass panel for an LCD.
- ACF anisotropic conductive film
- PCB printed circuit board
- the flexible film packages include broad categories such as tape carrier packages (TCP), chip on film (CoF) packages and other configurations known in the packaging arts.
- FIG. 1 is a plan view of a conventional flexible film package module, illustrating the manner in which the flexible film package module is mounted on an LCD substrate.
- semiconductor packages for controlling light for example, a plurality of flexible film packages 100
- semiconductor packages 600 on each of which a gate integrated circuit (IC) for controlling voltage may be mounted, are formed on a lateral surface of the glass panel 300 .
- IC gate integrated circuit
- the flexible film packages 100 are bent and mounted on the glass panel 300 and connected to a PCB 200 , which is positioned behind the glass panel 300 .
- the PCB 200 may be considerably larger than the individual packages so that a plurality of flexible film packages 100 may all be attached thereto.
- a plurality of semiconductor devices 210 for operating the LCD device may be installed at other locations on the PCB 200 .
- FIG. 2 is a plan view of one flexible film package 100 shown in FIG. 1 . As illustrated in FIG. 2 , no semiconductor chip has yet been mounted on the flexible film package 100 .
- the flexible film package 100 is formed from a polyimide film 10 , which has an excellent coefficient of thermal expansion (CTE) and is highly durable.
- a chip paddle 18 is formed on the polyimide film 10 , and the circuit pattern of the chip paddle 18 is, in turn, connected to a copper pattern 16 that is configured for extending and attaching to both the PCB and the glass panel.
- CTE coefficient of thermal expansion
- a semiconductor chip ( 110 of FIG. 3 ) may be attached to the chip paddle 18 using bump connectors and one or more slit holes 20 may be formed in the polyimide film 10 so that the polyimide film may be more easily bent.
- B 1 designates a portion of the flexible film package 100 that is attached to the PCB while B 2 designates a portion of the flexible film package 100 which is attached to the glass panel.
- TP 1 and TP 2 designate conductive pads that may be used for electrical inspection and testing conducted after the flexible film package 100 has been completed.
- a 1 designates a region where a solder resist may be is coated in order to protect the copper pattern 16 from damage or corrosion resulting from to external forces or contaminants and shorts between leads caused by conductive particulates or other foreign materials.
- a 2 designates a cutting line along which each of the individual flexible film packages 100 may be separated from other adjacent flexible packages and excess polyimide film after the assembly and electrical inspection have been completed to obtain an individual flexible film package.
- FIG. 3 is a cross-sectional view of the flexible film package module of FIG. 1 , illustrating the shape in which the flexible film package module is bent.
- the bent flexible film package 100 is attached to edges of a glass panel 300 and a PCB 200 .
- a protective cover 700 typically metal, may be disposed outside the glass panel 300 and the PCB 200 .
- a light emission unit 400 for example, a fluorescent light, may be mounted between the glass panel 300 and the PCB 200 , with a filler 500 , through which light may be transmitted, filling the space between the glass panel and the PCB.
- light from the light emission unit 400 transmits the filler 500 and penetrates the glass panel to create an image.
- the copper pattern 16 formed on the polyimide tape may be connected to the glass panel 300 and the PCB 200 using an ACF 180 .
- Reference numeral 202 denotes a copper pattern formed on the PCB 200 .
- a conventional flexible film package is disclosed in U.S. Pat. No. 6,061,246, dated May 9, 2000, entitled “Microelectric Package Including Flexible Layers and Flexible Extensions, and Liquid Crystal Display Modules Using the Same.”
- conventional flexible film packages have certain limitations.
- the polyimide films used to form the flexible film package tend to have excellent durability and CTE, they also tend to be very expensive so that a semiconductor package manufacturing process that uses a polyimide film will tend to be more costly than one that does not.
- the production cost ratio between the semiconductor package and the incorporated semiconductor chip can be as much as 6:1, a cost ratio that is generally higher than that of other kinds of semiconductor packages. Therefore, reducing the production cost for flexible film semiconductor packages would strengthen the price competitiveness of such packages.
- Exemplary embodiments of the present invention provide a lower-cost flexible film package module in which a tape film used in the flexible film package is formed from a lower-cost flexible printed circuit (FPC) insulating substrate in combination with a polyimide insulating substrate and a method of manufacturing such lower-cost flexible film package modules.
- FPC flexible printed circuit
- Exemplary embodiments of the present invention provide lower-cost flexible film package modules, comprising a plurality of semiconductor package main bodies, each of which comprises a first insulating substrate constituting a flexible film package for an LCD, the first insulating substrate formed of a polyimide material, a chip paddle formed on the first insulating substrate and a semiconductor chip mounted on the chip paddle, an input circuit pattern formed on the first insulating pattern for connecting a circuit pattern of the chip paddle to a printed circuit board, and an output circuit pattern formed on the first insulating substrate for connecting the circuit pattern of the chip paddle to a glass panel; and a input terminal connecting portion connected to the input circuit pattern of each of the semiconductor package main bodies, the input terminal connecting portion comprising a common second insulating substrate formed of a material that is less expensive than that of the first insulating substrate of each of the semiconductor package main bodies, and extending common input circuit patterns formed on the common second insulating substrate that are electrically connected to the input circuit pattern of each of the semiconductor package main bodies and finally connected to the printed circuit board.
- the first insulating substrate of each of the semiconductor package main bodies can be configured with a range of lengths, for example, about 7 mm to 20 mm, and a range of thicknesses, for example, about 25 ⁇ m to 75 ⁇ m.
- the common second insulating substrate of the input terminal connecting portion can be formed using a material that has a lower coefficient of thermal expansion and is less durable than that of the first insulating substrate.
- the common second insulating substrate of the input terminal connecting portion can include through holes to form the extending common input circuit patterns therein.
- the common second insulating substrate of the input terminal connecting portion can be formed of a flexible material and have a thickness of about 50 ⁇ m to 120 ⁇ m.
- the extending common input circuit patterns of the input terminal connecting portion can be formed on a front surface or a rear surface and connected vertically to each other.
- the input circuit pattern of each of the semiconductor package main bodies can be connected to the extended common input circuit patterns of the input terminal connecting portion using an anisotropic conductive film.
- the input circuit pattern of each of the semiconductor package main bodies can be applied to the extended common input circuit patterns of the input terminal connecting portion using thermocompression bonding.
- the semiconductor chip of each of the semiconductor package main bodies can be mounted on the chip paddle using bump connectors.
- the present invention provides a method of manufacturing lower-cost flexible film package modules.
- the method comprises preparing a plurality of semiconductor package main bodies, each of which including a chip paddle formed on a first insulating substrate, a semiconductor chip is mounted on the chip paddle, a circuit pattern of the chip paddle is connected to a printed circuit board by an input circuit pattern, and other circuit pattern of the chip paddle is connected to a glass panel by an output circuit pattern; preparing a input terminal connecting portion, the input terminal connecting portion being connected to the input circuit pattern of each of the semiconductor package main bodies, the input terminal connecting portion comprising a common second insulating substrate formed of a material that is less expensive than that of the first insulating substrate of each of the semiconductor package main bodies and extending common input circuit patterns formed on the common second insulating substrate; and connecting the input circuit pattern of each of the semiconductor package main bodies to the extending common input circuit patterns of the lower-cost input terminal connecting portion.
- the input circuit pattern of each of the semiconductor package main bodies can be connected to the extended common input circuit patterns of the lower-cost input terminal connecting portion by an anisotropic conductive film.
- the input circuit pattern of each of the semiconductor package main bodies can be connected to the extended common input circuit patterns of the input terminal connecting portions using thermocompression bonding which can include applying ultrasonic vibration in conjunction with heating.
- the printed circuit board can have a smaller width than that of the lower-cost input terminal connecting portion
- each of the semiconductor package main bodies can be a tape carrier package and each of the semiconductor package main bodies can be a chip on film package.
- the exemplary flexible film package modules of the present invention may use a tape film, which combines a first insulating substrate formed of a polyimide material and a second insulating substrate formed of a material that is less expensive than that of the first insulating substrate. Thus, the production costs associated with the flexible film package module can be reduced.
- FIG. 1 is a plan view of a conventional flexible film package module
- FIG. 2 is a plan view of one conventional flexible film package 100 shown in FIG. 1 ;
- FIG. 3 is a cross-sectional view of the conventional flexible film package module of FIG. 1 ;
- FIG. 4 is a plan view of a flexible film package module according to an exemplary embodiment of the present invention.
- FIG. 5 is a plan view of the exemplary flexible film package shown in FIG. 4 ;
- FIG. 6 is a plan view of an exemplary lower-cost input terminal connecting portion shown in FIG. 4 ;
- FIG. 7 is a cross-sectional view taken along line VII-VII′ of FIG. 6 ;
- FIG. 8 is a cross-sectional view illustrating a method of connecting a semiconductor package main body to an exemplary lower-cost input terminal connecting portion according to an embodiment of the present invention
- FIG. 9 is a cross-sectional view illustrating an exemplary method of connecting a semiconductor package main body to a lower-cost input terminal connecting portion according to another embodiment of the present invention.
- FIG. 10 is a cross-sectional view of a semiconductor package main body and the lower-cost input terminal connecting portion of FIG. 4 , illustrating the manner in which the semiconductor package main body and the lower-cost input terminal connecting portion are formed;
- FIGS. 11-13 are cross-sectional views of semiconductor package main bodies, each of which can be applied to the flexible film package module of FIG. 4 .
- a lower-cost flexible film package module is comprised of a plurality of semiconductor package main bodies 100 and a lower-cost input terminal connecting portion 150 .
- Each of the semiconductor package main bodies 100 is obtained by reducing by as much as 50% to 67% the length of a conventional flexible film package.
- a conventional flexible film package may have a typical length of about 19 mm to 38 mm
- the corresponding semiconductor package main body 100 utilized in exemplary embodiments of the present invention will have a length of about 7 mm to 20 mm. This size reduction will tend to translate directly into reduced costs for the polyimide material compared with a conventional flexible package construction.
- the lower-cost input terminal connecting portion 150 is provided to cooperate with the semiconductor package main body 100 to provide the necessary electrical connections to the PCB and glass panel.
- the lower-cost input terminal connecting portion 150 is formed from a second insulating substrate, which tends to have a lower CTE and/or be less durable (and less expensive) than the polyimide material that is used to form the first insulating substrate.
- lower-cost flexible film package modules according to the present invention include a semiconductor package main body 100 and lower-cost input terminal connecting portion 150 which are connected to each other.
- L 1 denotes the length of the second insulating substrate that replaces a portion of the polyimide insulating substrate utilized in conventional flexible film packages.
- reference numeral 190 denotes a final connecting portion between the low-cost input terminal connecting portion 150 and PCB 200 ′
- 210 denotes a semiconductor device, which is mounted on the PCB and used to operate the LCD device
- 300 denotes a glass panel
- 600 denotes a semiconductor package that functions as a gate IC.
- FIG. 5 is a plan view of the flexible film package shown in FIG. 4 .
- the exemplary lower-cost flexible film package modules of the present invention comprise a plurality of semiconductor package main bodies 100 , each of which includes a first insulating substrate 10 , a chip paddle 120 , a semiconductor chip 110 A, an input circuit pattern 130 and an output circuit pattern 140 .
- the first insulating substrate 10 may be formed from a polyimide material, a material widely used for forming flexible film packages for LCDs.
- the chip paddle 120 is formed on the first insulating substrate 10 with the semiconductor chip 110 A being mounted on the chip paddle 120 using bump connectors.
- the input circuit pattern 130 is formed on the first insulating substrate 10 and connects a circuit pattern of the chip paddle 120 to a PCB.
- the output circuit pattern 140 is formed on the first insulating substrate 10 and connects the circuit pattern of the chip paddle 120 to a glass panel.
- the lower-cost flexible film package module further comprises a lower-cost input terminal connecting portion 150 , which is connected to the input circuit pattern 130 of each of the semiconductor package main bodies 100 .
- the low-cost input terminal connection portion 150 is formed on a common second insulating substrate 170 and includes extended common input circuit patterns 152 , 160 and 154 .
- the common second insulating substrate 170 is formed of a material that is less expensive than that used to form the first insulating substrate 10 , e.g., polyimide.
- the extended common input circuit patterns 152 , 160 and 154 that are formed on the common second insulating substrate 170 may be connected to the input circuit patterns 130 of the semiconductor package main bodies 100 using an ACF or thermocompression bonding and, finally, connected to the PCB.
- the lower-cost input terminal connecting portion 150 having a length L 1 is formed of the second insulating substrate 170 , which may have a lower CTE and be somewhat less durable a higher-cost polyimide material, but which can still provide acceptable performance and reliability, the entire production cost of the flexible package can be reduced.
- the second insulating substrate 170 can be a flexible print circuit (FPC) insulating substrate.
- the pitch of the copper patterns formed on the FPC insulating substrate 170 will not generally be as fine as that of copper patterns formed on a polyimide insulating substrate, but the FPC insulating substrate 170 is flexible and can include through holes therein. Also, because the input circuit pattern 130 of the flexible film package 100 need not be as fine as the output circuit pattern 140 that is connected to the glass panel, the FPC insulating substrate can be used successfully as the second insulating substrate 170 .
- FIG. 6 is a plan view of a lower-cost input terminal connecting portion 150 as shown in FIG. 4
- FIG. 7 is a cross-sectional view taken along line VII-VII′ of FIG. 6
- the lower-cost input terminal connecting portion 150 of the present invention comprises a common second insulating substrate 170 and extended common input circuit patterns 152 , 160 , 154 , 162 and 156 , formed on the second insulating substrate 170 .
- the extending common input circuit patterns 152 , 160 , 154 , 162 and 156 may be copper patterns for electrically connecting an input circuit pattern 130 of a semiconductor package main body 100 to a PCB.
- the extended common input circuit patterns 152 , 160 , 154 , 162 and 156 are structured such that linear copper interconnections 152 , 154 and 156 , which may be disposed on a front surface and/or a rear surface of the second insulating substrate 170 , may be vertically connected to each other via through holes 160 and 162 formed in the second insulating substrate.
- FIG. 8 is a cross-sectional view illustrating an exemplary method of connecting a semiconductor package main body to a lower-cost input terminal connecting portion according to an exemplary embodiment of the present invention
- FIG. 9 is a cross-sectional view illustrating an exemplary method of connecting a semiconductor package main body to a lower-cost input terminal connecting portion according to another exemplary embodiment of the present invention.
- a conductive material layer that is easily melted for example, a tin (Sn) or solder layer 158 , may be coated on the extended common input circuit pattern 152 that is formed on the common second insulating substrate 170 and the input circuit pattern 130 that is formed on the first insulating substrate 10 . Thereafter, the patterns are aligned and heat is applied to the conductive material layer 158 and/or the patterns are compressed to connect and secure the semiconductor package main body to the lower-cost input terminal connecting portion.
- the second insulating substrate 170 on which the extended common input circuit pattern 152 is formed for contacting the first insulating substrate 10 on which the input circuit pattern 130 is formed.
- the second insulating substrate 170 can be connected to the first insulating substrate 10 using a layer of an ACF 180 or other suitable material.
- a tin or solder layer 158 or another adhesive material that can be easily melted and then hardened can be used to secure the main body to the terminal connection portion.
- FIG. 10 is a cross-sectional view of a semiconductor package main body and the low-cost input terminal connecting portion of FIG. 4 , illustrating a shape into which the semiconductor package main body and the lower-cost input terminal connecting portion may be formed.
- the glass panel 300 is connected to the PCB 200 using a flexible film package with the semiconductor chip 110 of the semiconductor package main body 100 being positioned in the center of a bent portion.
- the semiconductor chip 110 A of the semiconductor package main body 100 ′ is not positioned in the center of a bent portion, but is, instead, positioned more closely adjacent the glass panel 300 .
- reference numeral 180 denotes an ACF, and the bent portion is comprised primarily from the common second insulating substrate 170 .
- the extended common input circuit patterns 152 , 154 and 156 which may be disposed on a front surface and/or a rear surface of the common second insulating substrate 170 , may be vertically connected to corresponding patterns on the opposite surface via through holes 160 and 162 .
- Reference numeral 190 denotes a final connecting portion of the lower-cost input terminal connecting portion 150 and 112 denotes a bump connector formed on the semiconductor chip 110 A.
- FIGS. 11-13 are cross-sectional views of semiconductor package main bodies, each of which can be applied to the flexible film package module of FIG. 4 .
- a CoF package 100 A can be used as a semiconductor package main body.
- TCPs 100 B and 100 C can be used.
- a first insulating substrate 10 has a relatively small thickness and includes no hole.
- a first insulating substrate 10 ′ can have a larger thickness and include a central hole H.
- a slit hole 20 is formed in the first insulating substrate to facilitate the bending of the first insulating substrate 10 ′.
- a semiconductor chip 110 A can be selectively mounted above or below the first insulating substrate 10 ′.
- a flexible film package module constructed according to the present invention may use a tape film comprising a combination of a lower-cost FPC insulating substrate and a higher-cost polyimide film, thereby allowing the entire production cost of flexible film packages to be reduced. Also, because a PCB can be scaled down by changing the shape of the lower-cost input terminal connecting portion, a highly integrated LCD device can be embodied easily in a range of configurations.
Abstract
Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film package module includes a tape film that combines both a first insulating substrate, typically formed from a higher-cost polyimide material, and a second insulating substrate, typically formed from an insulating material or materials that are less expensive and/or provide modified performance when compared with the first insulating material. Both the first and second substrates will include complementary circuit patterns that will be electrically and physically connected to allow the composite substrate to function as a unitary substrate. The first and second substrates will also include connection regions that may be adapted for connection to printed circuit boards and/or electronic devices such as liquid crystal displays.
Description
- This application claims priority from Korean Patent Application No. 2003-54221, which was filed on Aug. 5, 2003, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.
- 1. Field of the Invention
- The present invention relates to a semiconductor device used for a liquid crystal display (LCD) device and, more particularly, to a flexible film package.
- 2. Description of the Related Art
- In recent years, the rapid development of LCD-related technologies has accelerated the shift to an information-oriented society. In general, data communication electronic devices in which an LCD is utilized are required to be thin, light-weight, and compact for portable use. Thus, new methods of mounting semiconductor chips on semiconductor packages have been proposed for LCD devices.
- While micro ball grid array (μ-BGA)-type semiconductor packages were widely used for conventional data communication electronic devices that incorporated an LCD, flexible film packages are currently being increasingly utilized. A flexible film package is a semiconductor package in which a semiconductor chip is directly attached onto a flexible thin-tape-type film so as to reduce the area occupied by the mounted semiconductor chip.
- Flexible film packages do not generally utilize solder balls as external connection terminals but instead rely on an anisotropic conductive film (ACF) that is directly attached to a printed circuit board (PCB) or a glass panel for an LCD. The flexible film packages include broad categories such as tape carrier packages (TCP), chip on film (CoF) packages and other configurations known in the packaging arts.
-
FIG. 1 is a plan view of a conventional flexible film package module, illustrating the manner in which the flexible film package module is mounted on an LCD substrate. As illustrated inFIG. 1 , in a conventional LCD device, semiconductor packages for controlling light, for example, a plurality offlexible film packages 100, are mounted on a top surface of aglass panel 300, andsemiconductor packages 600, on each of which a gate integrated circuit (IC) for controlling voltage may be mounted, are formed on a lateral surface of theglass panel 300. - The
flexible film packages 100 are bent and mounted on theglass panel 300 and connected to a PCB 200, which is positioned behind theglass panel 300. The PCB 200 may be considerably larger than the individual packages so that a plurality offlexible film packages 100 may all be attached thereto. A plurality ofsemiconductor devices 210 for operating the LCD device may be installed at other locations on the PCB 200. -
FIG. 2 is a plan view of oneflexible film package 100 shown inFIG. 1 . As illustrated inFIG. 2 , no semiconductor chip has yet been mounted on theflexible film package 100. Theflexible film package 100 is formed from apolyimide film 10, which has an excellent coefficient of thermal expansion (CTE) and is highly durable. Achip paddle 18 is formed on thepolyimide film 10, and the circuit pattern of thechip paddle 18 is, in turn, connected to acopper pattern 16 that is configured for extending and attaching to both the PCB and the glass panel. - A semiconductor chip (110 of
FIG. 3 ) may be attached to thechip paddle 18 using bump connectors and one ormore slit holes 20 may be formed in thepolyimide film 10 so that the polyimide film may be more easily bent. InFIG. 2 , B1 designates a portion of theflexible film package 100 that is attached to the PCB while B2 designates a portion of theflexible film package 100 which is attached to the glass panel. TP1 and TP2 designate conductive pads that may be used for electrical inspection and testing conducted after theflexible film package 100 has been completed. A1 designates a region where a solder resist may be is coated in order to protect thecopper pattern 16 from damage or corrosion resulting from to external forces or contaminants and shorts between leads caused by conductive particulates or other foreign materials. A2 designates a cutting line along which each of the individualflexible film packages 100 may be separated from other adjacent flexible packages and excess polyimide film after the assembly and electrical inspection have been completed to obtain an individual flexible film package. -
FIG. 3 is a cross-sectional view of the flexible film package module ofFIG. 1 , illustrating the shape in which the flexible film package module is bent. As illustrated inFIG. 3 , the bentflexible film package 100 is attached to edges of aglass panel 300 and aPCB 200. Aprotective cover 700, typically metal, may be disposed outside theglass panel 300 and the PCB 200. Alight emission unit 400, for example, a fluorescent light, may be mounted between theglass panel 300 and the PCB 200, with afiller 500, through which light may be transmitted, filling the space between the glass panel and the PCB. Thus, light from thelight emission unit 400 transmits thefiller 500 and penetrates the glass panel to create an image. - As illustrated in
FIG. 3 , thecopper pattern 16 formed on the polyimide tape may be connected to theglass panel 300 and the PCB 200 using an ACF 180.Reference numeral 202 denotes a copper pattern formed on thePCB 200. - A conventional flexible film package is disclosed in U.S. Pat. No. 6,061,246, dated May 9, 2000, entitled “Microelectric Package Including Flexible Layers and Flexible Extensions, and Liquid Crystal Display Modules Using the Same.” However, conventional flexible film packages have certain limitations. For example, although the polyimide films used to form the flexible film package tend to have excellent durability and CTE, they also tend to be very expensive so that a semiconductor package manufacturing process that uses a polyimide film will tend to be more costly than one that does not. Substantially, when a conventional flexible film package is manufactured, the production cost ratio between the semiconductor package and the incorporated semiconductor chip can be as much as 6:1, a cost ratio that is generally higher than that of other kinds of semiconductor packages. Therefore, reducing the production cost for flexible film semiconductor packages would strengthen the price competitiveness of such packages.
- Exemplary embodiments of the present invention provide a lower-cost flexible film package module in which a tape film used in the flexible film package is formed from a lower-cost flexible printed circuit (FPC) insulating substrate in combination with a polyimide insulating substrate and a method of manufacturing such lower-cost flexible film package modules.
- Exemplary embodiments of the present invention provide lower-cost flexible film package modules, comprising a plurality of semiconductor package main bodies, each of which comprises a first insulating substrate constituting a flexible film package for an LCD, the first insulating substrate formed of a polyimide material, a chip paddle formed on the first insulating substrate and a semiconductor chip mounted on the chip paddle, an input circuit pattern formed on the first insulating pattern for connecting a circuit pattern of the chip paddle to a printed circuit board, and an output circuit pattern formed on the first insulating substrate for connecting the circuit pattern of the chip paddle to a glass panel; and a input terminal connecting portion connected to the input circuit pattern of each of the semiconductor package main bodies, the input terminal connecting portion comprising a common second insulating substrate formed of a material that is less expensive than that of the first insulating substrate of each of the semiconductor package main bodies, and extending common input circuit patterns formed on the common second insulating substrate that are electrically connected to the input circuit pattern of each of the semiconductor package main bodies and finally connected to the printed circuit board.
- The first insulating substrate of each of the semiconductor package main bodies can be configured with a range of lengths, for example, about 7 mm to 20 mm, and a range of thicknesses, for example, about 25 μm to 75 μm. The common second insulating substrate of the input terminal connecting portion can be formed using a material that has a lower coefficient of thermal expansion and is less durable than that of the first insulating substrate. The common second insulating substrate of the input terminal connecting portion can include through holes to form the extending common input circuit patterns therein. The common second insulating substrate of the input terminal connecting portion can be formed of a flexible material and have a thickness of about 50 μm to 120 μm. The extending common input circuit patterns of the input terminal connecting portion can be formed on a front surface or a rear surface and connected vertically to each other.
- The input circuit pattern of each of the semiconductor package main bodies can be connected to the extended common input circuit patterns of the input terminal connecting portion using an anisotropic conductive film. The input circuit pattern of each of the semiconductor package main bodies can be applied to the extended common input circuit patterns of the input terminal connecting portion using thermocompression bonding. The semiconductor chip of each of the semiconductor package main bodies can be mounted on the chip paddle using bump connectors.
- Another exemplary embodiment the present invention provides a method of manufacturing lower-cost flexible film package modules. The method comprises preparing a plurality of semiconductor package main bodies, each of which including a chip paddle formed on a first insulating substrate, a semiconductor chip is mounted on the chip paddle, a circuit pattern of the chip paddle is connected to a printed circuit board by an input circuit pattern, and other circuit pattern of the chip paddle is connected to a glass panel by an output circuit pattern; preparing a input terminal connecting portion, the input terminal connecting portion being connected to the input circuit pattern of each of the semiconductor package main bodies, the input terminal connecting portion comprising a common second insulating substrate formed of a material that is less expensive than that of the first insulating substrate of each of the semiconductor package main bodies and extending common input circuit patterns formed on the common second insulating substrate; and connecting the input circuit pattern of each of the semiconductor package main bodies to the extending common input circuit patterns of the lower-cost input terminal connecting portion.
- The input circuit pattern of each of the semiconductor package main bodies can be connected to the extended common input circuit patterns of the lower-cost input terminal connecting portion by an anisotropic conductive film. The input circuit pattern of each of the semiconductor package main bodies can be connected to the extended common input circuit patterns of the input terminal connecting portions using thermocompression bonding which can include applying ultrasonic vibration in conjunction with heating.
- The printed circuit board can have a smaller width than that of the lower-cost input terminal connecting portion, each of the semiconductor package main bodies can be a tape carrier package and each of the semiconductor package main bodies can be a chip on film package. The exemplary flexible film package modules of the present invention may use a tape film, which combines a first insulating substrate formed of a polyimide material and a second insulating substrate formed of a material that is less expensive than that of the first insulating substrate. Thus, the production costs associated with the flexible film package module can be reduced.
- The above and other features and advantages of the present invention will become more apparent when exemplary embodiments are described in detail with reference to the attached drawings in which:
-
FIG. 1 is a plan view of a conventional flexible film package module; -
FIG. 2 is a plan view of one conventionalflexible film package 100 shown inFIG. 1 ; -
FIG. 3 is a cross-sectional view of the conventional flexible film package module ofFIG. 1 ; -
FIG. 4 is a plan view of a flexible film package module according to an exemplary embodiment of the present invention; -
FIG. 5 is a plan view of the exemplary flexible film package shown inFIG. 4 ; -
FIG. 6 is a plan view of an exemplary lower-cost input terminal connecting portion shown inFIG. 4 ; -
FIG. 7 is a cross-sectional view taken along line VII-VII′ ofFIG. 6 ; -
FIG. 8 is a cross-sectional view illustrating a method of connecting a semiconductor package main body to an exemplary lower-cost input terminal connecting portion according to an embodiment of the present invention; -
FIG. 9 is a cross-sectional view illustrating an exemplary method of connecting a semiconductor package main body to a lower-cost input terminal connecting portion according to another embodiment of the present invention; -
FIG. 10 is a cross-sectional view of a semiconductor package main body and the lower-cost input terminal connecting portion ofFIG. 4 , illustrating the manner in which the semiconductor package main body and the lower-cost input terminal connecting portion are formed; and -
FIGS. 11-13 are cross-sectional views of semiconductor package main bodies, each of which can be applied to the flexible film package module ofFIG. 4 . - These drawings have been provided to assist in the understanding of the exemplary embodiments of the invention as described in more detail below and should not be construed as unduly limiting the invention. In particular, the relative spacing, positioning, sizing and dimensions of the various elements illustrated in the drawings are not drawn to scale and may have been exaggerated, reduced or otherwise modified for the purpose of improved clarity. Those of ordinary skill in the art will also appreciate that a range of alternative configurations have been omitted simply to improve the clarity and reduce the number of drawings.
- The present invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as being limited to solely the embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.
- As illustrated in
FIG. 4 , a lower-cost flexible film package module according to an embodiment of the present invention is comprised of a plurality of semiconductor packagemain bodies 100 and a lower-cost inputterminal connecting portion 150. Each of the semiconductor packagemain bodies 100 is obtained by reducing by as much as 50% to 67% the length of a conventional flexible film package. For example, while a conventional flexible film package may have a typical length of about 19 mm to 38 mm, the corresponding semiconductor packagemain body 100 utilized in exemplary embodiments of the present invention will have a length of about 7 mm to 20 mm. This size reduction will tend to translate directly into reduced costs for the polyimide material compared with a conventional flexible package construction. The lower-cost inputterminal connecting portion 150 is provided to cooperate with the semiconductor packagemain body 100 to provide the necessary electrical connections to the PCB and glass panel. - The lower-cost input
terminal connecting portion 150 is formed from a second insulating substrate, which tends to have a lower CTE and/or be less durable (and less expensive) than the polyimide material that is used to form the first insulating substrate. Thus, lower-cost flexible film package modules according to the present invention include a semiconductor packagemain body 100 and lower-cost inputterminal connecting portion 150 which are connected to each other. InFIG. 4 , L1 denotes the length of the second insulating substrate that replaces a portion of the polyimide insulating substrate utilized in conventional flexible film packages. - Because
PCB 200′ can also be scaled down by changing the shape of the lower-cost inputterminal connecting portion 150, the production cost of an LCD device utilizing this construction can be reduced even further. InFIG. 4 ,reference numeral 190 denotes a final connecting portion between the low-cost inputterminal connecting portion 150 andPCB 200′, 210 denotes a semiconductor device, which is mounted on the PCB and used to operate the LCD device, 300 denotes a glass panel, and 600 denotes a semiconductor package that functions as a gate IC. -
FIG. 5 is a plan view of the flexible film package shown inFIG. 4 . As illustrated inFIG. 5 , the exemplary lower-cost flexible film package modules of the present invention comprise a plurality of semiconductor packagemain bodies 100, each of which includes a first insulatingsubstrate 10, achip paddle 120, asemiconductor chip 110A, aninput circuit pattern 130 and anoutput circuit pattern 140. The first insulatingsubstrate 10 may be formed from a polyimide material, a material widely used for forming flexible film packages for LCDs. Thechip paddle 120 is formed on the first insulatingsubstrate 10 with thesemiconductor chip 110A being mounted on thechip paddle 120 using bump connectors. Theinput circuit pattern 130 is formed on the first insulatingsubstrate 10 and connects a circuit pattern of thechip paddle 120 to a PCB. Theoutput circuit pattern 140 is formed on the first insulatingsubstrate 10 and connects the circuit pattern of thechip paddle 120 to a glass panel. - Also, the lower-cost flexible film package module further comprises a lower-cost input
terminal connecting portion 150, which is connected to theinput circuit pattern 130 of each of the semiconductor packagemain bodies 100. The low-cost inputterminal connection portion 150 is formed on a common secondinsulating substrate 170 and includes extended commoninput circuit patterns insulating substrate 170 is formed of a material that is less expensive than that used to form the first insulatingsubstrate 10, e.g., polyimide. The extended commoninput circuit patterns insulating substrate 170 may be connected to theinput circuit patterns 130 of the semiconductor packagemain bodies 100 using an ACF or thermocompression bonding and, finally, connected to the PCB. - Because the lower-cost input
terminal connecting portion 150 having a length L1 is formed of the second insulatingsubstrate 170, which may have a lower CTE and be somewhat less durable a higher-cost polyimide material, but which can still provide acceptable performance and reliability, the entire production cost of the flexible package can be reduced. - The second
insulating substrate 170 can be a flexible print circuit (FPC) insulating substrate. The pitch of the copper patterns formed on theFPC insulating substrate 170 will not generally be as fine as that of copper patterns formed on a polyimide insulating substrate, but theFPC insulating substrate 170 is flexible and can include through holes therein. Also, because theinput circuit pattern 130 of theflexible film package 100 need not be as fine as theoutput circuit pattern 140 that is connected to the glass panel, the FPC insulating substrate can be used successfully as the second insulatingsubstrate 170. -
FIG. 6 is a plan view of a lower-cost inputterminal connecting portion 150 as shown inFIG. 4 , andFIG. 7 is a cross-sectional view taken along line VII-VII′ ofFIG. 6 . As illustrated inFIGS. 6 and 7 , the lower-cost inputterminal connecting portion 150 of the present invention comprises a common secondinsulating substrate 170 and extended commoninput circuit patterns substrate 170. The extending commoninput circuit patterns input circuit pattern 130 of a semiconductor packagemain body 100 to a PCB. The extended commoninput circuit patterns linear copper interconnections substrate 170, may be vertically connected to each other via throughholes -
FIG. 8 is a cross-sectional view illustrating an exemplary method of connecting a semiconductor package main body to a lower-cost input terminal connecting portion according to an exemplary embodiment of the present invention, andFIG. 9 is a cross-sectional view illustrating an exemplary method of connecting a semiconductor package main body to a lower-cost input terminal connecting portion according to another exemplary embodiment of the present invention. - As illustrated in
FIG. 8 , a conductive material layer that is easily melted, for example, a tin (Sn) orsolder layer 158, may be coated on the extended commoninput circuit pattern 152 that is formed on the common secondinsulating substrate 170 and theinput circuit pattern 130 that is formed on the first insulatingsubstrate 10. Thereafter, the patterns are aligned and heat is applied to theconductive material layer 158 and/or the patterns are compressed to connect and secure the semiconductor package main body to the lower-cost input terminal connecting portion. - As illustrated in
FIG. 9 , the second insulatingsubstrate 170 on which the extended commoninput circuit pattern 152 is formed for contacting the first insulatingsubstrate 10 on which theinput circuit pattern 130 is formed. Using this construction, the second insulatingsubstrate 170 can be connected to the first insulatingsubstrate 10 using a layer of anACF 180 or other suitable material. A tin orsolder layer 158 or another adhesive material that can be easily melted and then hardened can be used to secure the main body to the terminal connection portion. -
FIG. 10 is a cross-sectional view of a semiconductor package main body and the low-cost input terminal connecting portion ofFIG. 4 , illustrating a shape into which the semiconductor package main body and the lower-cost input terminal connecting portion may be formed. - In the conventional flexible film package module shown in
FIG. 3 , theglass panel 300 is connected to thePCB 200 using a flexible film package with thesemiconductor chip 110 of the semiconductor packagemain body 100 being positioned in the center of a bent portion. However, as illustrated inFIG. 10 , in an exemplary example of the present invention, thesemiconductor chip 110A of the semiconductor packagemain body 100′ is not positioned in the center of a bent portion, but is, instead, positioned more closely adjacent theglass panel 300. InFIG. 10 ,reference numeral 180 denotes an ACF, and the bent portion is comprised primarily from the common secondinsulating substrate 170. The extended commoninput circuit patterns insulating substrate 170, may be vertically connected to corresponding patterns on the opposite surface via throughholes Reference numeral 190 denotes a final connecting portion of the lower-cost inputterminal connecting portion semiconductor chip 110A. -
FIGS. 11-13 are cross-sectional views of semiconductor package main bodies, each of which can be applied to the flexible film package module ofFIG. 4 . - As shown in
FIG. 11 , aCoF package 100A can be used as a semiconductor package main body. Alternatively, as shown inFIGS. 12 and 13 ,TCPs CoF package 100A, a first insulatingsubstrate 10 has a relatively small thickness and includes no hole. However, in theTCPs substrate 10′ can have a larger thickness and include a central hole H. Also, aslit hole 20 is formed in the first insulating substrate to facilitate the bending of the first insulatingsubstrate 10′. As shown inFIGS. 12 and 13 , in theTCPs semiconductor chip 110A can be selectively mounted above or below the first insulatingsubstrate 10′. - As long as the foregoing semiconductor package
main body - While the present invention has been particularly shown and described with reference to certain exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims.
Claims (12)
1.-9. (canceled)
10. A method of manufacturing a flexible film package module comprising:
preparing a plurality of semiconductor package main bodies, each package main body including an input circuit and an output circuit;
mounting a semiconductor chip on each of the package main bodies;
preparing a package common body, the package common body including a conductive pattern; and
electrically and mechanically attaching each of the package main bodies to the package common body, whereby the input circuits are connected to the conductive pattern in a parallel configuration.
11. A method of manufacturing a flexible film package module according to claim 10 , wherein:
preparing the package main bodies includes preparing a plurality of first insulating substrates from a first insulating material; and
preparing the package common body includes preparing a second insulating substrate from a second insulating material, wherein the first and second insulating materials are different materials.
12. A method of manufacturing a flexible film package module according to claim 11 , wherein:
the first insulating material is a polyimide having a first coefficient of thermal expansion CTE1; and
the second insulating material is a material other than a polyimide and has a second coefficient of thermal expansion CTE2, wherein CTE1<CTE2.
13. A method of manufacturing a flexible film package module according to claim 11 , wherein:
electrically and mechanically attaching each of the package main bodies to the package common body includes positioning an anisotropic conductive film between each of the input circuits and a corresponding region of the conductive pattern.
14. A method of manufacturing a flexible film package module according to claim 11 , wherein:
electrically and mechanically attaching each of the package main bodies to the package common body utilizes a thermocompression bonding process.
15. The method of claim 14 , wherein:
the thermocompression bonding process includes the simultaneous application of ultrasonic vibrations and heat to complementary portions of the input circuits and the conductive pattern.
16. A method of manufacturing a flexible film package module according to claim 11 , wherein:
preparing the package common body includes forming a connection region arranged and configured to connect the conducive pattern to a printed circuit board (PCB).
17. A method of manufacturing a flexible film package module according to claim 16 , wherein:
the package common body has a first width Web and the connection region has a second width Wer, wherein a ratio of Web:Wer is at least 2:1.
18. A method of manufacturing a flexible film package module according to claim 16 , wherein:
the package common body has a first width Web and the printed circuit board has a second width Wpcb, wherein a ratio of Web:Wpcb is at least 2:1.
19. A method of manufacturing a flexible film package module according to claim 11 , wherein:
preparing the semiconductor package main bodies included preparing a plurality of packages having a configuration selected from a group consisting of tape carrier packages (TCPs) and chip on film (COF) packages.
20. A method of manufacturing a flexible film package module according to claim 11 , comprising:
preparing a connection region on the output circuit for connection with a liquid crystal display (LCD); and
preparing a connection region on the conductive pattern for connection with a printed circuit board (PCB).
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US11/501,883 US20060268213A1 (en) | 2003-08-05 | 2006-08-10 | Low-cost flexible film package module and method of manufacturing the same |
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US8711570B2 (en) * | 2011-06-21 | 2014-04-29 | Apple Inc. | Flexible circuit routing |
US9201461B2 (en) | 2011-06-21 | 2015-12-01 | Apple Inc. | Flexible circuit routing of a touch sensitive display device comprising a set of drive lines and a set of sense lines |
US9600113B2 (en) | 2011-06-21 | 2017-03-21 | Apple Inc. | Touch sensitive display device comprising a flexible circuit routing having a set of drive lines and a set of sense lines wherein drive line traces and sense line traces are non-overlapping |
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US20170273177A1 (en) * | 2016-03-18 | 2017-09-21 | Japan Display Inc. | Flexible circuit board and display device |
US9907163B2 (en) * | 2016-03-18 | 2018-02-27 | Japan Display Inc. | Flexible circuit board and display device |
WO2022087816A1 (en) * | 2020-10-27 | 2022-05-05 | 京东方科技集团股份有限公司 | Display device and display device binding method |
Also Published As
Publication number | Publication date |
---|---|
JP2005057258A (en) | 2005-03-03 |
JP5390057B2 (en) | 2014-01-15 |
KR100699823B1 (en) | 2007-03-27 |
KR20050015422A (en) | 2005-02-21 |
US20050040504A1 (en) | 2005-02-24 |
US7109575B2 (en) | 2006-09-19 |
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