US20060277923A1 - Heat-dissipation device - Google Patents
Heat-dissipation device Download PDFInfo
- Publication number
- US20060277923A1 US20060277923A1 US11/442,410 US44241006A US2006277923A1 US 20060277923 A1 US20060277923 A1 US 20060277923A1 US 44241006 A US44241006 A US 44241006A US 2006277923 A1 US2006277923 A1 US 2006277923A1
- Authority
- US
- United States
- Prior art keywords
- heat
- dissipation device
- fan
- thermo
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1632—External expansion units, e.g. docking stations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0211—Control thereof of fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat-dissipation device (1) is used for assembly on an outside portion of an electrically powered, heat-generating device (e.g., a notebook 6) for dissipation of heat produced thereby. The heat-dissipation device includes a fan (30), a thermo-electric cooler (20) disposed adjacent the fan, a processing unit (40) electrically connected with the thermo-electric cooler and the fan for controlling them, and an electrical connector (50) electrically connected with the processing unit. The connector is further electrically connected with the electrically powered, heat-generating device to be cooled. The processing unit controls the fan and the thermo-electric cooler according to signals transmitted from the electrically powered, heat-generating device, via the connector.
Description
- 1. Technical Field
- The invention relates generally to heat-dissipation devices and, particularly, to a heat-dissipation device that is generally assembled on an outside portion of an electrically-powered, heat-generating device (e.g., an electronic and/or micro-mechanical device) to dissipate heat generated thereby
- 2. Discussion of Related Art
- With the continually decreasing size of electronic and/or micro-mechanical devices, an increasing emphasis is laid on improving heat-dissipation, thus to avoid structural damage. Heat-dissipation devices, such as fans, heat sinks, water-cooling devices, and heat pipes, are widely used to dissipate heat generated by such devices. In general, the heat-dissipation devices are directly assembled in an inside portion of these devices. This arrangement is a disadvantage for decreasing size of such devices.
- What is needed, therefore, is a heat-dissipation device that has a high heat dissipation efficiency and is an advantage for decreasing size of any electronic and/or micro-mechanical device employing the same.
- A heat-dissipation device is assembled on an outside portion of an electrically-powered, heat-generating device (e.g., an electronic and/or micro-mechanical device) and is used for dissipating heat generated thereby. The heat-dissipation device includes:
-
- a thermo-electric cooler with a cooling face portion and a heat-dissipating face portion opposite to the cooling face portion;
- a fan disposed beside the cooling face portion of the thermo-electric cooler;
- a heat sink disposed on the heat-dissipating face portion of the thermo-electric cooler;
- a processing unit electrically connected with the thermo-electric cooler and the fan, the processing unit thereby being configured for controlling the thermo-electric cooler and the fan; and
- an electrical connector electrically connecting the processing unit with the heat-generating device, the electrical connector thereby being configured for facilitating a receipt of signals and electricity by the heat-dissipation device.
- Other advantages and novel features of the present heat-dissipation device will become more apparent from the following detailed description of preferred embodiments when taken in conjunction with the accompanying drawings.
- Many aspects of the present heat-dissipation device can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, the emphasis instead being placed upon clearly illustrating the principles of the present heat-dissipation device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is a plane view of a heat-dissipation device in accordance with an exemplary embodiment; -
FIG. 2 is similar toFIG. 1 , but showing a rotational state of an electrical connector of the heat-dissipation device inFIG. 1 ; -
FIG. 3 is a schematic view of the heat-dissipation device inFIG. 1 ; and -
FIG. 4 is an assembly view of the heat-dissipation device inFIG. 1 and a notebook, showing an application of the present heat-dissipation device. - The exemplifications set out herein illustrate at least one preferred embodiment of the present heat-dissipation device, in one form, and such exemplifications are not to be construed as limiting the scope of such a device in any manner.
- Reference will now be made to the drawings to describe embodiments of the present heat-dissipation device, in detail.
- Referring to FIGS. 1 to 3, a heat-
dissipation device 1 is illustrated in accordance with an exemplary embodiment. The heat-dissipation device 1 is adapted for being assembled on an outside portion of an electrically-powered, heat-generating device, such as an electronic and/or micro-mechanical device, to dissipate heat generated thereby. The heat-dissipation device 1 generally includes abase 10, a thermo-electric cooler (TEC) 20, afan 30, a processing unit 40 (e.g., a single crystal processing unit), and anelectrical connector 50 formed on thebase 10, respectively. - The
base 10 has a generally flat configuration with a generallyrectangular cavity 12 defined in a lower portion thereof. A pair of recesses 14 (only one of which is shown inFIG. 3 ) is defined in two portions of thebase 10, and each is in communication with thecavity 12. The thermo-electric cooler 20 (i.e., a refrigeration/cooling unit) is arranged on a top portion of thebase 10, with a heat-dissipating end orface portion 22 and a cooling end orface portion 24 formed/located on opposite ends/sides thereof. Aheat sink 26 is disposed on and adjacent the heat-dissipating face portion 22. Theheat sink 26 has a plurality ofheat fins 262 arranged in a parallel manner. Thefan 30 is an axial flow fan with an air-entrance end/side (not labeled). Thefan 30 is disposed beside thecooling face portion 24 of the thermo-electric cooler 20, with the air-entrance end thereof preferably facing the thermo-electric cooler 20 (in order to draw heat away therefrom). Aninterspace 32 is formed between the air-entrance end of thefan 30 and thecooling face portion 24 of the heat-dissipating face portion 24, in order to allow for airflow for effective operation of thefan 30. Theprocessing unit 40 is generally disposed in an upper portion of thebase 10 and is electrically connected with the thermo-electric cooler 20, thefan 30, and theconnector 50. - The
connector 50 has a securedend portion 52 and aport portion 54 opposite to the securedend portion 52. A channel (not labeled) is defined in an end of thesecure end portion 52. Ahinge 56 is received in the channel with two ends thereof extending from the channel, respectively. Thehinge 56, as seen inFIG. 3 , is further received in therecesses 14 of thebase 10. Theconnector 50 is rotatablely disposed in thecavity 12 of thebase 10 via the ends of thehinge 56. Theport portion 54 has data bus terminals (not labeled) arranged in a standard pattern such as USB, IEEE1394 and so on. The data bus terminals are used for transmitting temperature signals from the electronic and/or micro-mechanical device to the processing unit of the heat-dissipation device 1. Preferably, theport portion 54 has at least one power terminal (not labeled) that could be used for providing electricity for the heat-dissipation device 1 directly from the electronic and/or micro-mechanical device. - In an alternate embodiment, the
processing unit 40 and theconnector 50 could be directly assembled in a portion of thethermoelectric cooler 20 and/orfan 30, and thebase 10 could thus be omitted. - Additionally, a plurality of
condensate pipes 34 can be disposed between thefan 30 and the thermo-electric cooler 20, in order to increase the dissipation efficiency of thethermoelectric cooler 20.Such condensate pipes 34 also serve as spacers, creating room for airflow between thefan 30 and the thermo-electric cooler 20 via theinterspace 32. - In use, the heat-
dissipation device 1 is assembled on the electronic and/or micro-mechanical device with an electrical connection between the connector of the heat-dissipation device and an outside port of the electronic and/or micro-mechanical device. Theprocessing unit 40 controls the rotation speed of thefan 30 and the power of the thermo-electric cooler 20, according to the signals transmitted from the electronic and/or micro-mechanical device via theconnector 50. Therefore, the heat-dissipation device 1 controllably dissipates the heat generated by the electronic and/or micro-mechanical device. - Referring to
FIG. 4 , an exemplary heat-dissipation method of using the present heat-dissipation device to dissipate the heat generated by anotebook 6 is provided. Thenotebook 6 includes abase 60 and acover 62 hinged on an edge (not labeled) of thebase 60. Thebase 60 has akeyboard 64 formed on an upper portion thereof, and an outside port (not labeled) disposed on a side portion (not labeled) thereof. This heat-dissipation method has a series of steps of: - (a) rotating the
connector 50 to expose theport portion 54 out of thecavity 12 of base - (b) assembling the heat-
dissipation device 1 onto thenotebook 6, forming an electrical connection between theconnector 50 of the heat-dissipation device 1 and the outside port of thenotebook 6 and positioning thefan 30 so as to face thekeyboard 64; - (c) applying electricity for the heat-
dissipation device 1 via thenotebook 6; - (d) transmitting control signals to the
notebook 6 according to theprocessing unit 40 of the heat-dissipation device 1, and transmitting inner temperature signals associated with thenotebook 6 back to theprocessing unit 40, via the connection between theconnector 50 and the outside port, and - (e) controlling the
fan 30, using theprocessing unit 40, to rotate at a preferred speed and controlling the thermoelectric cooler 20 to run at a preferred power, thereby dissipating the heat from thenotebook 6 through thekeyboard 64 thereof at a rate sufficient to maintain a desired temperature within thenotebook 6. - Finally, it is to be understood that the above-described embodiments are intended to illustrate rather than limit the invention. Variations may be made to the embodiments without departing from the spirit of the invention as claimed. The above-described embodiments illustrate the scope of the invention but do not restrict the scope of the invention.
Claims (16)
1. A heat-dissipation device comprising:
a base;
a thermoelectric cooler disposed on an upper portion of the base, the thermoelectric cooler having a cooling face portion and a heat-dissipating face portion opposite to the cooling face portion;
a fan disposed on the base and near the cooling face portion of the thermo-electric cooler, the fan having an air-entrance end facing the cooling face portion of the thermo-electric cooler, an interspace defined between the air-entering end and the thermoelectric cooler;
an electrical connector disposed in a lower portion of the base, the connector having a port portion with at least one data bus terminal; and
a processing unit disposed in the base, the processing unit being electrically connected with the thermo-electric cooler, the fan, and the connector, the processing unit being configured for controlling the rotation speed of fan and the power of the thermo-electric cooler according to signals transmitted from the at least one data bus terminal of the connector.
2. The heat-dissipation device as claimed in claim 1 , further comprising a plurality of condensate pipes disposed between the fan and the thermo-electric cooler.
3. The heat-dissipation device as claimed in claim 1 , further comprising a heat sink disposed on the heat-dissipating face portion of the thermo-electric cooler, the heat sink having a plurality of heat fins arranged thereon in a parallel manner.
4. The heat-dissipation device as claimed in claim 1 , wherein the base has a cavity in the lower portion thereof, and the connector is rotatablely received in the cavity.
5. The heat-dissipation device as claimed in claim 4 , wherein a pair of recesses is defined in the base, each recess respectively communicating with the cavity, the connector further having a hinge located on an end thereof, the connector being received in the cavity via two opposite ends of the hinge, the two opposite ends of the hinge being received in the respective recesses of the base.
6. The heat-dissipation device as claimed in claim 1 , wherein at least one said data bus terminal is arranged in a standard pattern of USB or IEEE1394.
7. The heat-dissipation device as claimed in claim 1 , wherein the port portion further has at least one power terminal.
8. A cooled heat-generating assembly comprising:
an electrically-powered device having an outside port;
a heat-dissipation device assembled onto the electrically-powered device, the heat-dissipation device comprising:
an electrical connector electrically connected with the outside port of the electrically-powered device;
a processing unit electrically connected with the connector;
a fan electrically connected with the processing unit, the fan facing the electrically-powered device and having an air-entrance end; and
a thermo-electric cooler connected with the processing unit and disposed beside the air-entrance end of the fan;
wherein the processing unit transmits control signals to the electrically-powered device via the connection between the connector and the outside port, the electrically-powered device transmits temperature signals back to the processing unit, and the processing unit controls the thermoelectric cooler and the fan according to the temperature signals.
9. The cooled heat-generating assembly as claimed in claim 8 , wherein the heat-dissipation device further comprises a heat sink disposed on a face of the thermo-electric cooler opposite to the fan.
10. The cooled heat-generating assembly as claimed in claim 9 , wherein the heat sink comprises a plurality of heat fins arranged in a parallel manner.
11. The cooled heat-generating assembly as claimed in claim 8 , wherein the heat-dissipation device further comprises a plurality of condensate pipes disposed between the fan and the thermoelectric cooler.
12. A heat-dissipation device adapted for assembly on an outside portion of an electrically-powered device for dissipating heat generated thereby, the heat-dissipation device comprising:
a thermoelectric cooler with a cooling face portion and a heat-dissipating face portion opposite to the cooling face portion;
a fan disposed beside the cooling face portion of the thermoelectric cooler;
a heat sink disposed on the heat-dissipating face portion of the thermo-electric cooler,
a processing unit electrically connected with the thermo-electric cooler and the fan, the processing unit thereby being configured for controlling the thermo-electric cooler and the fan; and
an electrical connector electrically connected with the processing unit, the connector electrically connected with the electrically-powered device, the connector being adapted for applying signals and electricity received from the electrically-powered device to the heat-dissipation device.
13. The heat-dissipation device as claimed in claim 12 , further comprising a plurality of condensate pipes disposed between the air-entrance end of the fan and the cooling face portion of the thermo-electric cooler.
14. The heat-dissipation device as claimed in claim 12 , wherein the heat sink comprises a plurality of heat fins arranged in a parallel manner.
15. The heat-dissipation device as claimed in claim 12 , wherein the connector has at least one data bus terminal associated therewith.
16. The heat-dissipation device as claimed in claim 15 , wherein at least one said data bus terminal is selected from one of IEEE1394 and USB.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200510035287.2 | 2005-06-10 | ||
CNB2005100352872A CN100573415C (en) | 2005-06-10 | 2005-06-10 | Heat sink device for electronic equipment and method |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060277923A1 true US20060277923A1 (en) | 2006-12-14 |
Family
ID=37509946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/442,410 Abandoned US20060277923A1 (en) | 2005-06-10 | 2006-05-26 | Heat-dissipation device |
Country Status (2)
Country | Link |
---|---|
US (1) | US20060277923A1 (en) |
CN (1) | CN100573415C (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100242523A1 (en) * | 2009-03-31 | 2010-09-30 | Todd Rubright | Electric Cooling System for Electronic Equipment |
US20100281884A1 (en) * | 2009-01-22 | 2010-11-11 | John Myron Rawski | Thermoelectric Management Unit |
US20120176745A1 (en) * | 2011-01-11 | 2012-07-12 | Christopher Helberg | Dual Mode Portable Information Handling System Cooling |
CN103336565A (en) * | 2013-07-12 | 2013-10-02 | 凝辉(天津)科技有限责任公司 | Notebook computer battery bin heat dissipating expanding device |
US20130309899A1 (en) * | 2012-05-15 | 2013-11-21 | Motorola Mobility, Inc. | Connector and system for cooling electronic devices |
US20160150677A1 (en) * | 2014-11-26 | 2016-05-26 | Hoffman Enclosures, Inc. | Thermoelectric Cooler Controller |
KR20190055921A (en) * | 2017-11-16 | 2019-05-24 | 서울과학기술대학교 산학협력단 | Notebook computer cooling stand |
US10401925B2 (en) * | 2015-11-30 | 2019-09-03 | Lenovo (Singapore) Pte Ltd | Portable information apparatus |
US10502463B2 (en) | 2014-11-26 | 2019-12-10 | Hoffman Enclosures, Inc. | Thermoelectric cooler controller and angled mounting thereof |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102213985B (en) * | 2010-04-09 | 2015-06-17 | 鈤新科技股份有限公司 | Radiating base and radiating base system capable of being automatically started or stopped and radiating method thereof |
CN102063168A (en) * | 2010-12-27 | 2011-05-18 | 孙冰 | Novel notebook computer heat radiator |
CN103336564A (en) * | 2013-07-12 | 2013-10-02 | 凝辉(天津)科技有限责任公司 | Tablet personal computer heat dissipation docking station |
CN104331140A (en) * | 2014-11-26 | 2015-02-04 | 成都市思码特科技有限公司 | Externally connected air-cooling radiator for notebook computer |
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US5884486A (en) * | 1997-06-19 | 1999-03-23 | Northern Telecom Limited | Thermoelectric humidity pump and method for dehumidfying of an electronic apparatus |
US20030223286A1 (en) * | 2002-05-30 | 2003-12-04 | Hana Micron Inc. | Flash memory apparatus having single body type rotary cover |
US6798659B2 (en) * | 2003-02-21 | 2004-09-28 | Wilson Chen | CPU cooling structure |
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CN1154035C (en) * | 1998-12-28 | 2004-06-16 | 神达电脑股份有限公司 | Personal computer with controllable heat-dissipating fan |
JP2002006991A (en) * | 2000-06-16 | 2002-01-11 | Toshiba Corp | Rotation number control method for cooling fan of computer system |
CN1137424C (en) * | 2001-04-04 | 2004-02-04 | 仁宝电脑工业股份有限公司 | Method for starting radiation fan in note-book computer |
US20030231958A1 (en) * | 2001-11-01 | 2003-12-18 | Kensington Technology Group | Method and apparatus for portable ventilation system |
CN1220925C (en) * | 2002-08-07 | 2005-09-28 | 联想(北京)有限公司 | Method and device for closed-loop controlling cooling fan rotation speed according to CPU temperature |
US20050030171A1 (en) * | 2003-08-06 | 2005-02-10 | Tse-Hung Liu | Cooling system for computing device |
-
2005
- 2005-06-10 CN CNB2005100352872A patent/CN100573415C/en not_active Expired - Fee Related
-
2006
- 2006-05-26 US US11/442,410 patent/US20060277923A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US5884486A (en) * | 1997-06-19 | 1999-03-23 | Northern Telecom Limited | Thermoelectric humidity pump and method for dehumidfying of an electronic apparatus |
US20030223286A1 (en) * | 2002-05-30 | 2003-12-04 | Hana Micron Inc. | Flash memory apparatus having single body type rotary cover |
US6798659B2 (en) * | 2003-02-21 | 2004-09-28 | Wilson Chen | CPU cooling structure |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100281884A1 (en) * | 2009-01-22 | 2010-11-11 | John Myron Rawski | Thermoelectric Management Unit |
US20100242523A1 (en) * | 2009-03-31 | 2010-09-30 | Todd Rubright | Electric Cooling System for Electronic Equipment |
US20120176745A1 (en) * | 2011-01-11 | 2012-07-12 | Christopher Helberg | Dual Mode Portable Information Handling System Cooling |
US8405975B2 (en) * | 2011-01-11 | 2013-03-26 | Dell Products L.P. | Dual mode portable information handling system cooling |
US20130309899A1 (en) * | 2012-05-15 | 2013-11-21 | Motorola Mobility, Inc. | Connector and system for cooling electronic devices |
CN103336565A (en) * | 2013-07-12 | 2013-10-02 | 凝辉(天津)科技有限责任公司 | Notebook computer battery bin heat dissipating expanding device |
US20160150677A1 (en) * | 2014-11-26 | 2016-05-26 | Hoffman Enclosures, Inc. | Thermoelectric Cooler Controller |
US9516783B2 (en) * | 2014-11-26 | 2016-12-06 | Hoffman Enclosures, Inc. | Thermoelectric cooler controller |
US10502463B2 (en) | 2014-11-26 | 2019-12-10 | Hoffman Enclosures, Inc. | Thermoelectric cooler controller and angled mounting thereof |
US10401925B2 (en) * | 2015-11-30 | 2019-09-03 | Lenovo (Singapore) Pte Ltd | Portable information apparatus |
KR20190055921A (en) * | 2017-11-16 | 2019-05-24 | 서울과학기술대학교 산학협력단 | Notebook computer cooling stand |
KR102039225B1 (en) * | 2017-11-16 | 2019-10-31 | 서울과학기술대학교 산학협력단 | Notebook computer cooling stand |
Also Published As
Publication number | Publication date |
---|---|
CN100573415C (en) | 2009-12-23 |
CN1877488A (en) | 2006-12-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LEE, HSIN-HO;REEL/FRAME:018212/0903 Effective date: 20060518 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |