US20070066503A1 - Methods and compositions for acid treatment of a metal surface - Google Patents

Methods and compositions for acid treatment of a metal surface Download PDF

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Publication number
US20070066503A1
US20070066503A1 US11/504,014 US50401406A US2007066503A1 US 20070066503 A1 US20070066503 A1 US 20070066503A1 US 50401406 A US50401406 A US 50401406A US 2007066503 A1 US2007066503 A1 US 2007066503A1
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acid
composition
surfactant
alkyl
grams per
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US11/504,014
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Mores Basaly
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Houghton Technical Corp
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=37670962&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=US20070066503(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to US11/504,014 priority Critical patent/US20070066503A1/en
Application filed by Individual filed Critical Individual
Assigned to HOUGHTON METAL FINISHING COMPANY reassignment HOUGHTON METAL FINISHING COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BASALY, MORES
Publication of US20070066503A1 publication Critical patent/US20070066503A1/en
Priority to US12/336,582 priority patent/US8252195B2/en
Assigned to THE GOVERNOR AND COMPANY OF THE BANK OF IRELAND, AS COLLATERAL AGENT reassignment THE GOVERNOR AND COMPANY OF THE BANK OF IRELAND, AS COLLATERAL AGENT GRANT OF SECURITY INTEREST Assignors: HOUGHTON METAL FINISHING COMPANY
Assigned to HOUGHTON TECHNICAL CORP. reassignment HOUGHTON TECHNICAL CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HOUGHTON METAL FINISHING COMPANY
Priority to US13/564,880 priority patent/US20120292559A1/en
Priority to US13/564,889 priority patent/US8518286B2/en
Priority to US13/972,136 priority patent/US20130334173A1/en
Priority to US14/619,570 priority patent/US20150322576A1/en
Priority to US14/664,884 priority patent/US9732428B2/en
Priority to US15/645,481 priority patent/US10260153B2/en
Abandoned legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/16Acidic compositions
    • C23F1/20Acidic compositions for etching aluminium or alloys thereof
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02Inorganic compounds ; Elemental compounds
    • C11D3/04Water-soluble compounds
    • C11D3/042Acids
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02Inorganic compounds ; Elemental compounds
    • C11D3/04Water-soluble compounds
    • C11D3/046Salts
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/20Organic compounds containing oxygen
    • C11D3/2075Carboxylic acids-salts thereof
    • C11D3/2082Polycarboxylic acids-salts thereof
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/16Acidic compositions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00Brightening metals by chemical means
    • C23F3/02Light metals
    • C23F3/03Light metals with acidic solutions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/12Light metals
    • C23G1/125Light metals aluminium
    • C11D2111/16
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/04Anodisation of aluminium or alloys based thereon
    • C25D11/16Pretreatment, e.g. desmutting
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12993Surface feature [e.g., rough, mirror]

Definitions

  • the invention relates to compositions and methods that are useful in etching a metal surface.
  • the invention relates to novel acid compositions and methods of using such compositions in etching an aluminum surface prior to anodizing to dissolve impurities, imperfections, scale, and oxide.
  • the composition is effective in maintaining its etching capacity and in removing smut produced by the etching of an aluminum surface as well as in general cleaning.
  • Articles made of aluminum or aluminum alloy are customarily manufactured by a metal-forming operation called drawing and ironing.
  • a lubricant oil is applied to the surface of the metal being deformed, and some abraded aluminum particles and other contaminates (usually referred to as “smut”) adhere to the metal surface, especially to the inner walls of such beverage containers.
  • the surfaces are protected by subsequent chemical-conversion coating and/or paint coating techniques. Therefore, the above-mentioned lubricant oil or smut must be removed, by cleaning, from the metal surfaces before the chemical-conversion coating.
  • This surface cleaning is normally applied by means of an acidic cleaning agent, which appropriately etches the metal surfaces.
  • the currently used acidic cleaning agents used for smut-removal have generally been ones containing chromic acid or hydrofluoric acid.
  • the cleaning agent containing the hydrofluoric acid is superior in enabling the low-temperature acidic cleaning (e.g., up to 50° C.).
  • U.S. Pat. Nos. 4,728,456 and 4,851,148 disclose a cleaning agent including an acidic cleaning agent of pH 2 or below prepared from sulfuric acid and nitric acid containing little or no fluoric ions with the addition of ferric ions serving an accelerator instead of fluoride ions, and a method for controlling the oxidation-reduction potential of the cleaning bath to control the ferric ion concentration in the bath, respectively.
  • PCT published application WO 9301332-A1 discloses an acidic cleaning solution containing sulfuric acid and/or nitric acid and ferric ions serving as an accelerator for etching instead of fluoride ions, and further containing oxidized ion of diphenylamine having color-change potential (that is, at a transition of a certain potential, color becomes transparent) in the vicinity of standard oxidation-reduction potential (+0.77+/ ⁇ 0.09 V) where ferric ions (Fe 3+ ) are changed into ferrous ions (Fe 2+ ), oxidized ions of diphenylbenzidine and oxidized ions of sulfonic diphenylamine, and the cleaning process for controlling the ferric ion concentration by controlling the color-change point.
  • standard oxidation-reduction potential (+0.77+/ ⁇ 0.09 V
  • U.S. Pat. No. 3,607,484 discloses is a corrosion liquid consisting of sulfuric acid aqueous solution with the addition of metals (ions of Cu, Fe, Ni, Co, Sn, Zn, etc.) having a smaller ionization tendency than aluminum and 7 g ion/l of at least one selected from halogen ions (F ⁇ , Br ⁇ , I ⁇ ) besides Cl ⁇ , PO 4 3 ⁇ , pyrophosphoric ion, pentaphasphoric ion and so on.
  • metals ions of Cu, Fe, Ni, Co, Sn, Zn, etc.
  • 7 g ion/l of at least one selected from halogen ions (F ⁇ , Br ⁇ , I ⁇ ) besides Cl ⁇ , PO 4 3 ⁇ , pyrophosphoric ion, pentaphasphoric ion and so on.
  • Japanese Patent Publication No. 47-39823 discloses a corrosion liquid containing 0.1 to 7.0 g ion/l of at least one of Cl ⁇ , F ⁇ , Br ⁇ , I ⁇ , phosphoric ion, pyrophosphoric ion, pentaphosphoric ion and so on.
  • the etching reaction of aluminum within the acidic cleaning solution includes an anode reaction in which aluminum is changed into aluminum ions (Al 3+ ) and a cathode reaction in which H + in the cleaning solution is reduced into 1 ⁇ 2 H 2 .
  • Al 3+ aluminum ions
  • H + in the cleaning solution is reduced into 1 ⁇ 2 H 2 .
  • ferric ions (Fe 3+ ) into the acidic cleaning solution simultaneously causes a cathode action for reducing Fe 3+ into Fe 2+ and the reduction of H + , which accelerates the etching reaction of aluminum.
  • the treatment must be made at a higher temperature (70° C. to 80° C.) than the temperature (up to 50° C.) of acidic cleaning by means of acidic cleaning agent containing fluoric ions in order to obtain the same effect as the acidic cleaning by the acidic cleaning agent containing fluoride ions, which will be economically disadvantageous.
  • a multiplicity of Fe 3+ ions are contained, a precipitation derived from ferric ions is produced, and in particular, iron hydroxide which is in the form of a precipitate may adhere to the heater section.
  • WO 9301332-A1 it is necessary to perform acidic cleaning at high temperature, which will be economically disadvantageous.
  • the corrosion liquid disclosed in U.S. Pat. No. 3,607,484 and Japanese Patent Publication No. 47-39823 mainly aims to etch the aluminum alloy by electrodeposition in order to form a photoengraving.
  • the oxidation-reduction potential is over 1.08 V in the etching treatment. Therefore, the use of Br ions as halogen ions besides Cl would lead to the reaction. 2Br ⁇ ->Br 2 +2e, which leads to the production of harmful bromine gas.
  • exclusive treatment facility must be provided, which will be economically disadvantageous.
  • these corrosion liquids contain 56 g/l or more of bromide ions for its object in the examples, which is different in the object of etching from the present invention.
  • the present invention was conceived in view of the above conventional problems, of which an object is to provide an acidic cleaning solution for aluminum and aluminum alloy and its cleaning process.
  • the invention encompasses a composition for etching a metal, preferably aluminum or aluminum alloy, comprising an aqueous acidic solution comprising one or more one or more organic acids, fluoride ion compounds, such as for example a fluoride salt one or more grain refiners, and one or more surfactants.
  • the composition comprises one or more mineral acids.
  • the invention encompasses a composition for etching a metal, preferably aluminum or aluminum alloy, comprising ammonium bifluoride, hydrofluoric acid, glycolic acid, and a surfactant.
  • the invention encompasses a method of treating the surface of a metal, preferably aluminum or aluminum alloy, which comprises treating the metal (preferably the aluminum or aluminum allow) with a composition comprising an aqueous acidic solution comprising one or more one or more organic acids, fluoride ion compounds, such as for example a fluoride salt one or more grain refiners, and one or more surfactants.
  • the method further encompasses optionally treating with one or more mineral acids.
  • alkyl or “alkyl group” means a saturated, monovalent, unbranched (i.e., linear) or branched hydrocarbon chain.
  • An “alkyl group” further means a monovalent group selected from (C 1 -C 8 )alkyl, (C 2 -C 8 )alkenyl, and (C 2 -C 8 )alkynyl, optionally substituted with one or two suitable substituents.
  • the hydrocarbon chain of a hydrocarbon group is from 1 to 6 carbon atoms in length, referred to herein as “(C 1 -C 6 )hydrocarbon.”
  • alkyl groups or hydrocarbon groups include, but are not limited to, (C 1 -C 6 )alkyl groups, such as methyl, ethyl, propyl, isopropyl, 2-methyl-1-propyl, 2-methyl-2-propyl, 2-methyl-1-butyl, 3-methyl-1-butyl, 2-methyl-3-butyl, 2,2-dimethyl-1-propyl, 2-methyl-1-pentyl, 3-methyl-1-pentyl, 4-methyl-1-pentyl, 2-methyl-2-pentyl, 3-methyl-2-pentyl, 4-methyl-2-pentyl, 2,2-dimethyl-1-butyl, 3,3-dimethyl-1-butyl, 2-ethyl-1-butyl, butyl, isobutyl, t-butyl,
  • aryl refers to a monovalent aromatic hydrocarbon group derived by the removal of one hydrogen atom from a single carbon atom of a parent aromatic ring system (e.g., removal of a —H atom from benzene).
  • Typical aryl groups include, but are not limited to, groups derived from aceanthrylene, acenaphthylene, acephenanthrylene, anthracene, azulene, benzene, chrysene, coronene, fluoranthene, fluorene, hexacene, hexaphene, hexalene, as-indacene, s-indacene, indane, indene, naphthalene, octacene, octaphene, octalene, ovalene, penta-2,4-diene, pentacene, pentalene, pentaphene, perylene, phenalene, phenanthrene, picene, pleiadene, pyrene, pyranthrene, rubicene, triphenylene, trinaphthalene and the like.
  • an aryl group comprises from
  • etching or “etch” will be understood by persons of ordinary skill in the art to include, but not be limited to cleaning of an aluminum or aluminum alloy surface; dissolving impurities, imperfections, scale or oxide from an aluminum or aluminum alloy surface.
  • fluoride salt(s) and “fluoride ion compounds” are used interchangeably and will be understood by persons of ordinary skill in the art to include, but not be limited to, fluoride salts and bifluoride salts including metal salts, ammonium salts and quaternary ammonium salts.
  • fluoride metal salts include those which have high solubility, such as potassium fluorides, sodium fluoride, potassium hydrogen fluoride, sodium hydrogen fluoride and the like.
  • ammonium salts encompassed by the invention include, but are not limited to, ammonium fluoride and ammonium hydrogen fluoride (ammonium hydrogen fluoride).
  • quaternary ammonium salts encompassed by the invention include, but are not limited to, tetramethyl-ammonium fluoride, methylamine hydrofluoride, 2-hydroxyethyltrimethyl-ammonium fluoride, tetramethylammonium hydrogen fluoride.
  • grain refiner refers to any material that is added to a metal or alloy because of its high melting temperature that enhances the physical properties of the metal or alloy.
  • Illustrative examples of grain refiners include, but are not limited to, sodium, potassium, or ammonium salts.
  • Particular examples of grain refiners include, but are not limited to sodium phosphate, ammonium phosphate, or diammonium phosphate or mixtures thereof.
  • organic acid includes, but is not limited to, acetic acid, propionic acid, butyric acid, isobutyric, valeric acid, caproic acid, caprylic acid, monochloroacetic acid, dichloroacetic acid, trichloroacetic acid, monofluoroacetic acid, difluoroacetic acid, trifluoroacetic acid, .alpha.-chlorbbutyric acid, .beta.-chlorobutyric acid, .gamma.-chlorobutyric acid, lactic acid, glycolic acid, pyruvic acid, glyoxalic acid, acrylic acid and like monocarboxylic acids, methanesulfonic acid, toluenesulfonic acid and like sulfonic acids, oxalic acid, succinic acid, adipic acid, tartaric acid, citric acid and like polycarboxylic acids.
  • the invention encompasses novel aqueous acidic compositions for treating the surface of a metal.
  • the compositions are useful for treating a surface prior to anodizing the surface.
  • the compositions are useful for etching a surface to dissolve impurities, imperfections, scale and/or oxide from the metal surface.
  • the metal surface is an aluminum or aluminum alloy surface.
  • the compositions are also useful for removing or minimizing extrusion line to produce a uniform texture and better appearance for the finished surface.
  • compositions of the invention comprise one or more fluoride ion compounds, one or more organic acids, and one or more surfactants or combinations thereof.
  • the composition optionally comprises one or more grain refiners and/or one or more mineral acids.
  • Another embodiment of the invention encompasses an aqueous, acidic solution comprising one or more grain refiners, one or more fluoride ion compounds, such as for example a fluoride salt, one or more grain refiners, and one or more surfactants.
  • the composition optionally comprises one or more organic acids and/or one or more mineral acids.
  • compositions of the invention have a pH from about 2.0 to about 5.0, preferably from about 3.0 to about 4.0.
  • the compositions overcome limitations of alkaline etch solutions.
  • the organic acid of the invention includes, but is not limited to, oxalic acid or glycolic acid or mixtures thereof.
  • the organic acid is present in an amount from about 1 to about 30 grams per liter, more preferably from about 2.5 to about 25 grams per liter, and even more preferably from about 5 to about 20 grams per liter.
  • the surfactant of the invention includes, but is not limited to, nonionic surfactant, an amphoteric surfactant, or a synergistic surfactant.
  • the surfactant comprises salts of alkyl aryl sulfonates, alkyl sulfonates, alkyl ether sulfates, alkyl sulfates, alkyl taurates, alkyl sulfosuccinates, hydrocarbon derivatives, abietic acid derivatives, ethoxylated primary alcohols, and modified polyethoxylated alcohols, individually or in combinations of two or more.
  • the surfactant is present in an amount from about 1 to about 3 grams per liter.
  • the fluoride ion compound of the invention includes, but is not limited to, hydrofluoric acid, hydrofluorosilic acid, or fluoroboric acid or mixtures thereof.
  • the fluoride ion compound is a fluoride salt.
  • Preferred fluoride salts include, but are not limited to, sodium fluoride, potassium fluoride, ammonium bifluoride or mixtures thereof.
  • the fluoride ion compound is present in an amount from about 5 to about 225 grams per liter, preferably from about 10 to about 200 grams per liter, more preferably from about 20 to about 80 grams per liter, and even more preferably from about 60 to about 70 grams per liter.
  • the grain refiner of the invention includes, but is not limited to, sodium phosphate, ammonium phosphate, or diammonium phosphate or a mixture thereof.
  • the composition comprises a single grain refiner.
  • the composition comprises combinations of two or more grain refiners.
  • the grain refiner is present in an amount of from about 1 to about 50 grams per liter, preferably from about 5 to about 30 grams per liter, and more preferably from about 10 to about 20 grams per liter.
  • the mineral acid of the invention is hydrofluoric acid, nitric acid, sulfuric acid, or phosphoric acid or mixtures thereof.
  • the mineral acid is present in an amount from about 20 to about 100 grams per liter, more preferably from about 30 to about 90 grams per liter and even more preferably from about 40 to about 80 grams per liter.
  • the invention encompasses a composition for etching aluminum or aluminum alloy, comprising ammonium bifluoride, hydrofluoric acid, glycolic acid, and surfactant.
  • Another embodiment of the invention encompasses a method of treating the surface of a metal, preferably aluminum or aluminum allow, which comprises treating the metal (preferably aluminum or aluminum allow) with a composition comprising a one or more fluoride ion compounds, one or more mineral acids, one or more organic acids and one or more surfactants.
  • the treatment is done at a solution temperature of about 60° F. to about 200° F., preferably at a solution temperature of about 70° F. to about 150° F., and more preferably at a solution temperature of about 100° F. to about 120° F.
  • the treatment is done from about 0.5 to about 15 minutes, preferably from about 1 to about 10 minutes, and more preferably from about 3 to about 5 minutes.
  • the invention encompasses a novel method for treating the surface of a metal comprising contacting the surface of the metal with an aqueous acidic composition.
  • the methods are useful for treating a surface prior to anodizing the surface.
  • the methods are useful for etching a surface to dissolve impurities, imperfections, scale and/or oxide from the metal surface.
  • the metal surface is an aluminum or aluminum alloy surface. The methods are also useful for removing or minimizing extrusion line to produce a uniform texture and better appearance for the finished surface.
  • the methods of the invention comprise contacting a metal surface, preferably aluminum or aluminum alloy, with one or more fluoride ion compounds, one or more organic acids, and one or more surfactants or combinations thereof.
  • the methods optionally comprise contacting the metal surface with one or more grain refiners and/or one or more mineral acids.
  • Another embodiment of the invention encompasses a method for treating a metal surface, preferably aluminum or aluminum alloy comprising contacting the metal surface with one or more grain refiners, one or more fluoride ion compounds, such as for example a fluoride salt, one or more grain refiners, and one or more surfactants.
  • the method optionally comprises treating a metal surface with one or more organic acids and/or one or more mineral acids.
  • the methods of the invention encompass contacting a metal surface with a composition of the invention having a pH from about 2.0 to about 5.0, preferably from about 3.0 to about 4.0.
  • the methods overcome limitations of alkaline etch solutions.
  • the organic acid encompassed by the method for treating a metal surface, preferably aluminum or aluminum alloy include, but are not limited to, oxalic acid or glycolic acid or mixtures thereof.
  • the organic acid is present in an amount from about 1 to about 30 grams per liter, more preferably from about 2.5 to about 25 grams per liter, and even more preferably from about 5 to about 20 grams per liter.
  • the surfactants encompassed by the method for treating a metal surface, preferably aluminum or aluminum alloy include, but are not limited to, a nonionic surfactant, an amphoteric surfactant, or a synergistic surfactant.
  • the surfactant comprises salts of alkyl aryl sulfonates, alkyl sulfonates, alkyl ether sulfates, alkyl sulfates, alkyl taurates, alkyl sulfosuccinates, hydrocarbon derivatives, abietic acid derivatives, ethoxylated primary alcohols, and modified polyethoxylated alcohols, individually or in combinations of two or more.
  • the surfactant is present in an amount from about 1 to about 3 grams per liter.
  • the fluoride ions encompassed by the method for treating a metal surface, preferably aluminum or aluminum alloy include, but are not limited to, hydrofluoric acid, hydrofluorosilic acid, or fluoroboric acid or mixtures thereof.
  • the fluoride ion compound is a fluoride salt.
  • Preferred fluoride salts include, but are not limited to, sodium fluoride, potassium fluoride, ammonium bifluoride or mixtures thereof.
  • the fluoride ion compound is present in an amount from about 5 to about 225 grams per liter, preferably from about 10 to about 200 grams per liter, more preferably from about 20 to about 80 grams per liter, and even more preferably from about 60 to about 70 grams per liter.
  • the grain refiners encompassed by the method for treating a metal surface, preferably aluminum or aluminum alloy include, but are not limited to, sodium phosphate, ammonium phosphate, or diammonium phosphate or a mixture thereof.
  • the method comprises a single grain refiner.
  • the method comprises combinations of two or more grain refiners.
  • the grain refiner is present in an amount of from about 1 to about 50 grams per liter, preferably from about 5 to about 30 grams per liter, and more preferably from about 10 to about 20 grams per liter.
  • the mineral acid encompassed by the method for treating a metal surface, preferably aluminum or aluminum alloy include, but are not limited to, hydrofluoric acid, nitric acid, sulfuric acid, or phosphoric acid or mixtures thereof.
  • the mineral acid is present in an amount from about 20 to about 100 grams per liter, more preferably from about 30 to about 90 grams per liter and even more preferably from about 40 to about 80 grams per liter.
  • the invention encompasses a method for etching aluminum or aluminum alloy, comprising contacting the aluminum or aluminum alloy with ammonium bifluoride, hydrofluoric acid, glycolic acid, and surfactant.
  • An illustrative acidic liquid aluminum etching agent with a robust, durable cleaning activity can be obtained by preparing the acidic liquid aluminum cleaner as follows:
  • a mineral acid is exemplified by sulfuric acid, nitric acid, phosphoric acid, and the like, and at least one selection therefrom should be added.
  • the preferable concentrations are as follows: about 80 g/L for phosphoric acid, about 80 g/L for sulfuric acid, and about 80 g/L for nitric acid.
  • the mineral acid may take the form of a single acid or may comprise a combination of two or more acids, which is freely selected within a range, which does not adversely affect the surface cleaning performance.
  • Such mixed acids are exemplified by tricomponent mixed acids of 3 to 10 g/L phosphoric acid, 5 to 15 g/L sulfuric acid, and 0.5 to 2 g/L nitric acid, and by bicomponent mixed acids of 10 to 20 g/L sulfuric acid and 0.5 to 2 g/L nitric acid.
  • the pH preferably does not exceed 2.0 and more preferably is 0.6 to 2.
  • no particular restriction is placed on the lower pH limit.
  • the surfactant component preferably is a hydrocarbon derivative, abietic acid derivatives, ethoxylated primary alcohols, and modified polyethoxylated alcohols, and these may be used singly or in combinations of two or more.
  • the preferable concentration is 0.1 to 10 g/L and more preferably 0.5 to 3 g/L.
  • chelating agents useable for this purpose are exemplified by citric acid, oxalic acid, tartaric acid, gluconic acid, and the like.
  • the acidic liquid aluminum cleaner prepared according to the present invention is highly effective f or the removal of smut and scale from aluminum and aluminum alloy as well as for the etching of same.
  • Aluminum test specimens of 6063-T5 aluminum alloy were cleaned in acid cleaner, rinse then etched in the following acid etch composition: Hydrofluoric Acid 49% 7.5 g/L Fluoroboric Acid 49% 5.0 g/L Ammonium Bifluoride 60.0 g/L Sodium Phosphate 15.0 g/L Surfactant 1.0 g/L The Solution pH was adjusted to 3.4.
  • Test samples were etched in the above solution for 1.0, 3.0 and 5.0 minutes respectively.
  • the etched samples were subjected to rinse, deox, rinse, dry off and weight loss taken before and after etch were performed on all test samples to determine the aluminum dissolution or removal rate.
  • a controlled aluminum specimen was acid cleaned, rinse then etched in aqueous alkaline etch bath for 5.0 and 10.0 minutes respectively at a temperature of 145°-150° F.
  • the etch bath contained 90.0 g/L sodium hydroxide, 100.00 g/L dissolved aluminum and 2.0% volume of Houghton no-dump/long life etchant additives. As with the acid etched samples, all alkaline etched samples were subjected to rinse, deox, rinse, dry off and weight loss taken before and after etch.
  • Aluminum removal is measured in grams per square foot of aluminum removal (i.e., g/ft 2 ). All anodized samples were carefully evaluated for the quality of the etch by visual examinations and by the gloss reading using reflectometer at 60° angle. TABLE 3 Temp. Al Removed Time Etch Bath (° F.) (g/ft 2 ) (min.) Gloss Acid 115 0.70 1.0 6.2 Acid 115 1.17 3.0 5.9 Acid 115 1.42 5.0 4.9 Alkaline 145 5.4 5.0 18.1 Alkaline 145 10.5 10.0 9.4
  • Example (1) Aluminum removal rate was performed as in Example (1). All samples were anodized the same as Example (1) and the finished samples were evaluated using same method as in Example (1). Results from Examples (2) are described in Table (2). TABLE 4 Temp. Al Removed Time Etch Bath (° F.) (g/ft 2 ) (min.) Gloss Acid 110 0.85 2.0 6.0 Acid 110 1.51 6.0 4.8 Acid 110 1.53 10.0 4.2
  • Alkaline etched samples had very rough or galvanizing problem while acid etched parts had uniform matt finish.
  • compositions and methods of the invention comprising the acid etch compositions produce excellent uniform matte finish.
  • compositions and methods of the invention comprising the acid etch compositions are more effective than alkaline etch in hiding extrusion lines, scratches or defects than alkaline etch.
  • compositions and methods of the invention comprising the acid etch compositions produce lower gloss reading than alkaline etch.
  • compositions and methods of the invention comprising the acid etch compositions operates at lower bath temperature and unlike alkaline etch does not require cooling.
  • compositions and methods of the invention comprising the acid etch compositions reduces etch time to 3.0-5.0 minutes compared to 9-15 minutes in case of alkaline etch
  • compositions and methods of the invention comprising the acid etch compositions reduce waster. Due to the fact that 1.0 lb. of aluminum is removed in the etch process results in 20.0 lbs. of waste sludge, therefore acid etch presents significant waste sludge reduction.
  • compositions and methods of the invention comprising the acid etch compositions parts are easy to rinse and require less rinse tanks than alkaline etch. This presents less water consumption.
  • compositions and methods of the invention comprising the acid etch compositions are more effective in preventing pitting prior to anodizing.
  • compositions and methods of the invention comprising the acid etch compositions are not sensitive to zinc content in the aluminum alloy as in the case of alkaline etch. High zinc content results in a rough finish or galvanizing defect.

Abstract

The invention relates to compositions and methods that are useful in etching a metal surface. In particular, the invention relates to novel acid compositions and methods of using such compositions in etching a metal surface, preferably an aluminum surface prior to anodizing to dissolve impurities, imperfections, scale, and oxide. The compositions are effective in maintaining their etching capacity and in removing smut produced by the etching of a surface as well as in general cleaning.

Description

  • This application claims the benefit of copending provisional patent application No. 60/709,452, filed Aug. 19, 2005, which is incorporated herein by reference in its entirety.
  • I. FIELD OF THE INVENTION
  • The invention relates to compositions and methods that are useful in etching a metal surface. In particular, the invention relates to novel acid compositions and methods of using such compositions in etching an aluminum surface prior to anodizing to dissolve impurities, imperfections, scale, and oxide. The composition is effective in maintaining its etching capacity and in removing smut produced by the etching of an aluminum surface as well as in general cleaning.
  • II. BACKGROUND OF THE INVENTION
  • Articles made of aluminum or aluminum alloy, are customarily manufactured by a metal-forming operation called drawing and ironing. In the course of this and similar metal-forming operations a lubricant oil is applied to the surface of the metal being deformed, and some abraded aluminum particles and other contaminates (usually referred to as “smut”) adhere to the metal surface, especially to the inner walls of such beverage containers. The surfaces are protected by subsequent chemical-conversion coating and/or paint coating techniques. Therefore, the above-mentioned lubricant oil or smut must be removed, by cleaning, from the metal surfaces before the chemical-conversion coating.
  • This surface cleaning is normally applied by means of an acidic cleaning agent, which appropriately etches the metal surfaces. The currently used acidic cleaning agents used for smut-removal have generally been ones containing chromic acid or hydrofluoric acid. Especially, the cleaning agent containing the hydrofluoric acid is superior in enabling the low-temperature acidic cleaning (e.g., up to 50° C.).
  • U.S. Pat. Nos. 4,728,456 and 4,851,148 disclose a cleaning agent including an acidic cleaning agent of pH 2 or below prepared from sulfuric acid and nitric acid containing little or no fluoric ions with the addition of ferric ions serving an accelerator instead of fluoride ions, and a method for controlling the oxidation-reduction potential of the cleaning bath to control the ferric ion concentration in the bath, respectively.
  • PCT published application WO 9301332-A1 discloses an acidic cleaning solution containing sulfuric acid and/or nitric acid and ferric ions serving as an accelerator for etching instead of fluoride ions, and further containing oxidized ion of diphenylamine having color-change potential (that is, at a transition of a certain potential, color becomes transparent) in the vicinity of standard oxidation-reduction potential (+0.77+/−0.09 V) where ferric ions (Fe3+) are changed into ferrous ions (Fe2+), oxidized ions of diphenylbenzidine and oxidized ions of sulfonic diphenylamine, and the cleaning process for controlling the ferric ion concentration by controlling the color-change point.
  • U.S. Pat. No. 3,607,484 discloses is a corrosion liquid consisting of sulfuric acid aqueous solution with the addition of metals (ions of Cu, Fe, Ni, Co, Sn, Zn, etc.) having a smaller ionization tendency than aluminum and 7 g ion/l of at least one selected from halogen ions (F, Br, I) besides Cl, PO4 3−, pyrophosphoric ion, pentaphasphoric ion and so on.
  • Japanese Patent Publication No. 47-39823 discloses a corrosion liquid containing 0.1 to 7.0 g ion/l of at least one of Cl, F, Br, I, phosphoric ion, pyrophosphoric ion, pentaphosphoric ion and so on.
  • Generally, the etching reaction of aluminum within the acidic cleaning solution includes an anode reaction in which aluminum is changed into aluminum ions (Al3+) and a cathode reaction in which H+ in the cleaning solution is reduced into ½ H2. Thus, the addition of ferric ions (Fe3+) into the acidic cleaning solution simultaneously causes a cathode action for reducing Fe3+into Fe2+ and the reduction of H+, which accelerates the etching reaction of aluminum.
  • Further, the oxidizing agent is used to control the oxidation-reduction potential to control the ferric ion concentration within the bath, thereby suppressing the Fe2+ concentration which increases accordingly as the etching reaction advances and oxidizing the Fe2+ into Fe3+.
  • It is however known that the oxidizing agent typically acts to oxidize and decompose the surfactant. Therefore, the addition of an oxidizing agent into an acidic cleaning aqueous solution containing a surfactant for improving the degreasing ability may cause accumulation of oxidized decomposed substance within the cleaning bath, which will lead to a reduction in the degreasing ability on the aluminum surfaces. On the contrary, the addition of excessive oxidizing agent in order to maintain the degreasing ability will increase the operating cost.
  • In PCT published application WO 91 19830-A1 there is proposed an “acidic liquid composition and process for cleaning aluminum” containing a mineral acid selected from the group of phosphoric acid, sulfuric acid, and nitric acid, multiply charged metallic ions, surfactant, and oxidizing agent for oxidizing the multiply charged metallic ions which were reduced during the cleaning operation, with the addition of 0.05 to 5 g/l of a C2 to C10 glycol for suppressing the decomposing reaction of surfactant due to the oxidizing agent.
  • In the case of using the acidic cleaning agent disclosed in U.S. Pat. Nos. 4,728,456 and 4,851,148, however, the treatment must be made at a higher temperature (70° C. to 80° C.) than the temperature (up to 50° C.) of acidic cleaning by means of acidic cleaning agent containing fluoric ions in order to obtain the same effect as the acidic cleaning by the acidic cleaning agent containing fluoride ions, which will be economically disadvantageous. Since a multiplicity of Fe3+ ions are contained, a precipitation derived from ferric ions is produced, and in particular, iron hydroxide which is in the form of a precipitate may adhere to the heater section. Also, in the case of WO 9301332-A1, it is necessary to perform acidic cleaning at high temperature, which will be economically disadvantageous.
  • The corrosion liquid disclosed in U.S. Pat. No. 3,607,484 and Japanese Patent Publication No. 47-39823 mainly aims to etch the aluminum alloy by electrodeposition in order to form a photoengraving. In the case of coexisting with the copper ion, as disclosed by U.S. Pat. No. 3,607,484, the oxidation-reduction potential is over 1.08 V in the etching treatment. Therefore, the use of Br ions as halogen ions besides Cl would lead to the reaction. 2Br->Br2+2e, which leads to the production of harmful bromine gas. Thus, exclusive treatment facility must be provided, which will be economically disadvantageous. In addition, these corrosion liquids contain 56 g/l or more of bromide ions for its object in the examples, which is different in the object of etching from the present invention.
  • In the acidic cleaning aqueous solution disclosed in WO 9119830-A1, the content of a C2 to C10 glycol for the suppression of decomposition reaction of surfactant by the oxidizing agent is 0.05 to 5 g/l (namely, 50 to 5000 ppm) within the acidic cleaning aqueous solution, and hence the glycol compounds do not solely have the etching accelerating effect. Reversely, a large volume of addition will increase the effective ingredients, which will increase the load of liquid waste treatment.
  • The present invention was conceived in view of the above conventional problems, of which an object is to provide an acidic cleaning solution for aluminum and aluminum alloy and its cleaning process.
  • III. SUMMARY OF THE INVENTION
  • Alkaline etch is the most popular and common etch process prior to sulfuric acid anodizing. The present invention encompasses novel methods of etching a metal, preferably aluminum, to dissolve impurities, imperfections, scale and oxide from the metal surface, preferably an aluminum surface. The method also provides a technique to remove or minimize extrusion lines to produce a uniform texture and better appearance for the finished product.
  • It has now been discovered that an aluminum alloy may be etched in an acid solution at a temperature from about 70° F. to about 200° F., preferably from about 70° F. to about 150° F. The etch composition of the present invention encompasses an aqueous, acidic solution comprising at least one organic acid, at least one acid salt, at least one surfactant, at least one grain refiner, and at least one fluoride salt or a combination thereof. The etch composition can optionally further comprise at least one mineral acid. The methods of the invention provide compositions with a uniform texture.
  • In one embodiment the invention encompasses a composition for etching a metal, preferably aluminum or aluminum alloy, comprising an aqueous acidic solution comprising one or more one or more organic acids, fluoride ion compounds, such as for example a fluoride salt one or more grain refiners, and one or more surfactants. Optionally the composition comprises one or more mineral acids.
  • In another embodiment the invention encompasses a composition for etching a metal, preferably aluminum or aluminum alloy, comprising ammonium bifluoride, hydrofluoric acid, glycolic acid, and a surfactant.
  • In yet another embodiment the invention encompasses a method of treating the surface of a metal, preferably aluminum or aluminum alloy, which comprises treating the metal (preferably the aluminum or aluminum allow) with a composition comprising an aqueous acidic solution comprising one or more one or more organic acids, fluoride ion compounds, such as for example a fluoride salt one or more grain refiners, and one or more surfactants. The method further encompasses optionally treating with one or more mineral acids.
  • IV. DETAILED DESCRIPTION OF THE INVENTION A. Definitions.
  • As used herein and unless otherwise indicated, the term “alkyl” or “alkyl group” means a saturated, monovalent, unbranched (i.e., linear) or branched hydrocarbon chain. An “alkyl group” further means a monovalent group selected from (C1-C8)alkyl, (C2-C8)alkenyl, and (C2-C8)alkynyl, optionally substituted with one or two suitable substituents. Preferably, the hydrocarbon chain of a hydrocarbon group is from 1 to 6 carbon atoms in length, referred to herein as “(C1-C6)hydrocarbon.” Examples of alkyl groups or hydrocarbon groups include, but are not limited to, (C1-C6)alkyl groups, such as methyl, ethyl, propyl, isopropyl, 2-methyl-1-propyl, 2-methyl-2-propyl, 2-methyl-1-butyl, 3-methyl-1-butyl, 2-methyl-3-butyl, 2,2-dimethyl-1-propyl, 2-methyl-1-pentyl, 3-methyl-1-pentyl, 4-methyl-1-pentyl, 2-methyl-2-pentyl, 3-methyl-2-pentyl, 4-methyl-2-pentyl, 2,2-dimethyl-1-butyl, 3,3-dimethyl-1-butyl, 2-ethyl-1-butyl, butyl, isobutyl, t-butyl, pentyl, isopentyl, neopentyl, and hexyl, and longer alkyl groups, such as heptyl, and octyl. An alkyl group can be unsubstituted or substituted with one or two suitable substituents.
  • As used herein and unless otherwise indicated, the term “aryl” refers to a monovalent aromatic hydrocarbon group derived by the removal of one hydrogen atom from a single carbon atom of a parent aromatic ring system (e.g., removal of a —H atom from benzene). Typical aryl groups include, but are not limited to, groups derived from aceanthrylene, acenaphthylene, acephenanthrylene, anthracene, azulene, benzene, chrysene, coronene, fluoranthene, fluorene, hexacene, hexaphene, hexalene, as-indacene, s-indacene, indane, indene, naphthalene, octacene, octaphene, octalene, ovalene, penta-2,4-diene, pentacene, pentalene, pentaphene, perylene, phenalene, phenanthrene, picene, pleiadene, pyrene, pyranthrene, rubicene, triphenylene, trinaphthalene and the like. Preferably, an aryl group comprises from 6 to 24 carbon atoms.
  • As used herein and unless otherwise indicated, the term “etching” or “etch” will be understood by persons of ordinary skill in the art to include, but not be limited to cleaning of an aluminum or aluminum alloy surface; dissolving impurities, imperfections, scale or oxide from an aluminum or aluminum alloy surface.
  • As used herein and unless otherwise indicated, the term “fluoride salt(s)” and “fluoride ion compounds” are used interchangeably and will be understood by persons of ordinary skill in the art to include, but not be limited to, fluoride salts and bifluoride salts including metal salts, ammonium salts and quaternary ammonium salts. Illustrative examples of the fluoride metal salts include those which have high solubility, such as potassium fluorides, sodium fluoride, potassium hydrogen fluoride, sodium hydrogen fluoride and the like. Examples of the ammonium salts encompassed by the invention include, but are not limited to, ammonium fluoride and ammonium hydrogen fluoride (ammonium hydrogen fluoride). Examples of the quaternary ammonium salts encompassed by the invention include, but are not limited to, tetramethyl-ammonium fluoride, methylamine hydrofluoride, 2-hydroxyethyltrimethyl-ammonium fluoride, tetramethylammonium hydrogen fluoride.
  • As used herein and unless otherwise indicated, the term “grain refiner” refers to any material that is added to a metal or alloy because of its high melting temperature that enhances the physical properties of the metal or alloy. Illustrative examples of grain refiners include, but are not limited to, sodium, potassium, or ammonium salts. Particular examples of grain refiners include, but are not limited to sodium phosphate, ammonium phosphate, or diammonium phosphate or mixtures thereof.
  • As used herein and unless otherwise indicated, the term “organic acid” includes, but is not limited to, acetic acid, propionic acid, butyric acid, isobutyric, valeric acid, caproic acid, caprylic acid, monochloroacetic acid, dichloroacetic acid, trichloroacetic acid, monofluoroacetic acid, difluoroacetic acid, trifluoroacetic acid, .alpha.-chlorbbutyric acid, .beta.-chlorobutyric acid, .gamma.-chlorobutyric acid, lactic acid, glycolic acid, pyruvic acid, glyoxalic acid, acrylic acid and like monocarboxylic acids, methanesulfonic acid, toluenesulfonic acid and like sulfonic acids, oxalic acid, succinic acid, adipic acid, tartaric acid, citric acid and like polycarboxylic acids.
  • B. Compositions of the Invention
  • In one embodiment the invention encompasses novel aqueous acidic compositions for treating the surface of a metal. In an illustrative embodiment, the compositions are useful for treating a surface prior to anodizing the surface. In another embodiment, the compositions are useful for etching a surface to dissolve impurities, imperfections, scale and/or oxide from the metal surface. In a preferred embodiment, the metal surface is an aluminum or aluminum alloy surface. The compositions are also useful for removing or minimizing extrusion line to produce a uniform texture and better appearance for the finished surface.
  • In another embodiment, the compositions of the invention comprise one or more fluoride ion compounds, one or more organic acids, and one or more surfactants or combinations thereof. The composition optionally comprises one or more grain refiners and/or one or more mineral acids.
  • Another embodiment of the invention encompasses an aqueous, acidic solution comprising one or more grain refiners, one or more fluoride ion compounds, such as for example a fluoride salt, one or more grain refiners, and one or more surfactants. The composition optionally comprises one or more organic acids and/or one or more mineral acids.
  • In another embodiment, the compositions of the invention have a pH from about 2.0 to about 5.0, preferably from about 3.0 to about 4.0. In an illustrative embodiment, the compositions overcome limitations of alkaline etch solutions.
  • In another illustrative embodiment, the organic acid of the invention includes, but is not limited to, oxalic acid or glycolic acid or mixtures thereof. Preferably, the organic acid is present in an amount from about 1 to about 30 grams per liter, more preferably from about 2.5 to about 25 grams per liter, and even more preferably from about 5 to about 20 grams per liter.
  • In another illustrative embodiment, the surfactant of the invention includes, but is not limited to, nonionic surfactant, an amphoteric surfactant, or a synergistic surfactant. Preferably, the surfactant comprises salts of alkyl aryl sulfonates, alkyl sulfonates, alkyl ether sulfates, alkyl sulfates, alkyl taurates, alkyl sulfosuccinates, hydrocarbon derivatives, abietic acid derivatives, ethoxylated primary alcohols, and modified polyethoxylated alcohols, individually or in combinations of two or more. Preferably, the surfactant is present in an amount from about 1 to about 3 grams per liter.
  • In another illustrative embodiment, the fluoride ion compound of the invention includes, but is not limited to, hydrofluoric acid, hydrofluorosilic acid, or fluoroboric acid or mixtures thereof. In another preferred embodiment, the fluoride ion compound is a fluoride salt. Preferred fluoride salts include, but are not limited to, sodium fluoride, potassium fluoride, ammonium bifluoride or mixtures thereof. Preferably, the fluoride ion compound is present in an amount from about 5 to about 225 grams per liter, preferably from about 10 to about 200 grams per liter, more preferably from about 20 to about 80 grams per liter, and even more preferably from about 60 to about 70 grams per liter.
  • In another illustrative embodiment, the grain refiner of the invention includes, but is not limited to, sodium phosphate, ammonium phosphate, or diammonium phosphate or a mixture thereof. In an illustrative embodiment, the composition comprises a single grain refiner. In another illustrative embodiment, the composition comprises combinations of two or more grain refiners. In an illustrative embodiment, the grain refiner is present in an amount of from about 1 to about 50 grams per liter, preferably from about 5 to about 30 grams per liter, and more preferably from about 10 to about 20 grams per liter.
  • In another illustrative embodiment, the mineral acid of the invention is hydrofluoric acid, nitric acid, sulfuric acid, or phosphoric acid or mixtures thereof. Preferably, the mineral acid is present in an amount from about 20 to about 100 grams per liter, more preferably from about 30 to about 90 grams per liter and even more preferably from about 40 to about 80 grams per liter.
  • In a particular embodiment, the invention encompasses a composition for etching aluminum or aluminum alloy, comprising ammonium bifluoride, hydrofluoric acid, glycolic acid, and surfactant.
  • C. Methods of the Invention
  • Another embodiment of the invention encompasses a method of treating the surface of a metal, preferably aluminum or aluminum allow, which comprises treating the metal (preferably aluminum or aluminum allow) with a composition comprising a one or more fluoride ion compounds, one or more mineral acids, one or more organic acids and one or more surfactants.
  • In an illustrative embodiment, the treatment is done at a solution temperature of about 60° F. to about 200° F., preferably at a solution temperature of about 70° F. to about 150° F., and more preferably at a solution temperature of about 100° F. to about 120° F. Preferably, the treatment is done from about 0.5 to about 15 minutes, preferably from about 1 to about 10 minutes, and more preferably from about 3 to about 5 minutes.
  • In one embodiment the invention encompasses a novel method for treating the surface of a metal comprising contacting the surface of the metal with an aqueous acidic composition. In an illustrative embodiment, the methods are useful for treating a surface prior to anodizing the surface. In another embodiment, the methods are useful for etching a surface to dissolve impurities, imperfections, scale and/or oxide from the metal surface. In a preferred embodiment, the metal surface is an aluminum or aluminum alloy surface. The methods are also useful for removing or minimizing extrusion line to produce a uniform texture and better appearance for the finished surface.
  • In another embodiment, the methods of the invention comprise contacting a metal surface, preferably aluminum or aluminum alloy, with one or more fluoride ion compounds, one or more organic acids, and one or more surfactants or combinations thereof. The methods optionally comprise contacting the metal surface with one or more grain refiners and/or one or more mineral acids.
  • Another embodiment of the invention encompasses a method for treating a metal surface, preferably aluminum or aluminum alloy comprising contacting the metal surface with one or more grain refiners, one or more fluoride ion compounds, such as for example a fluoride salt, one or more grain refiners, and one or more surfactants. The method optionally comprises treating a metal surface with one or more organic acids and/or one or more mineral acids.
  • In another embodiment, the methods of the invention encompass contacting a metal surface with a composition of the invention having a pH from about 2.0 to about 5.0, preferably from about 3.0 to about 4.0. In an illustrative embodiment, the methods overcome limitations of alkaline etch solutions.
  • In another illustrative embodiment, the organic acid encompassed by the method for treating a metal surface, preferably aluminum or aluminum alloy, include, but are not limited to, oxalic acid or glycolic acid or mixtures thereof. Preferably, the organic acid is present in an amount from about 1 to about 30 grams per liter, more preferably from about 2.5 to about 25 grams per liter, and even more preferably from about 5 to about 20 grams per liter.
  • In another illustrative embodiment, the surfactants encompassed by the method for treating a metal surface, preferably aluminum or aluminum alloy, include, but are not limited to, a nonionic surfactant, an amphoteric surfactant, or a synergistic surfactant. Preferably, the surfactant comprises salts of alkyl aryl sulfonates, alkyl sulfonates, alkyl ether sulfates, alkyl sulfates, alkyl taurates, alkyl sulfosuccinates, hydrocarbon derivatives, abietic acid derivatives, ethoxylated primary alcohols, and modified polyethoxylated alcohols, individually or in combinations of two or more. Preferably, the surfactant is present in an amount from about 1 to about 3 grams per liter.
  • In another illustrative embodiment, the fluoride ions encompassed by the method for treating a metal surface, preferably aluminum or aluminum alloy, include, but are not limited to, hydrofluoric acid, hydrofluorosilic acid, or fluoroboric acid or mixtures thereof. In another preferred embodiment, the fluoride ion compound is a fluoride salt. Preferred fluoride salts include, but are not limited to, sodium fluoride, potassium fluoride, ammonium bifluoride or mixtures thereof. Preferably, the fluoride ion compound is present in an amount from about 5 to about 225 grams per liter, preferably from about 10 to about 200 grams per liter, more preferably from about 20 to about 80 grams per liter, and even more preferably from about 60 to about 70 grams per liter.
  • In another illustrative embodiment, the grain refiners encompassed by the method for treating a metal surface, preferably aluminum or aluminum alloy, include, but are not limited to, sodium phosphate, ammonium phosphate, or diammonium phosphate or a mixture thereof. In an illustrative embodiment, the method comprises a single grain refiner. In another illustrative embodiment, the method comprises combinations of two or more grain refiners. In an illustrative embodiment, the grain refiner is present in an amount of from about 1 to about 50 grams per liter, preferably from about 5 to about 30 grams per liter, and more preferably from about 10 to about 20 grams per liter.
  • In another illustrative embodiment, the mineral acid encompassed by the method for treating a metal surface, preferably aluminum or aluminum alloy, include, but are not limited to, hydrofluoric acid, nitric acid, sulfuric acid, or phosphoric acid or mixtures thereof. Preferably, the mineral acid is present in an amount from about 20 to about 100 grams per liter, more preferably from about 30 to about 90 grams per liter and even more preferably from about 40 to about 80 grams per liter.
  • In a particular embodiment, the invention encompasses a method for etching aluminum or aluminum alloy, comprising contacting the aluminum or aluminum alloy with ammonium bifluoride, hydrofluoric acid, glycolic acid, and surfactant.
  • An illustrative acidic liquid aluminum etching agent with a robust, durable cleaning activity can be obtained by preparing the acidic liquid aluminum cleaner as follows:
  • A mineral acid is exemplified by sulfuric acid, nitric acid, phosphoric acid, and the like, and at least one selection therefrom should be added. The preferable concentrations are as follows: about 80 g/L for phosphoric acid, about 80 g/L for sulfuric acid, and about 80 g/L for nitric acid. The mineral acid may take the form of a single acid or may comprise a combination of two or more acids, which is freely selected within a range, which does not adversely affect the surface cleaning performance. Such mixed acids are exemplified by tricomponent mixed acids of 3 to 10 g/L phosphoric acid, 5 to 15 g/L sulfuric acid, and 0.5 to 2 g/L nitric acid, and by bicomponent mixed acids of 10 to 20 g/L sulfuric acid and 0.5 to 2 g/L nitric acid.
  • Through the use of these mineral acids, the pH preferably does not exceed 2.0 and more preferably is 0.6 to 2. Preferably, no particular restriction is placed on the lower pH limit.
  • The surfactant component preferably is a hydrocarbon derivative, abietic acid derivatives, ethoxylated primary alcohols, and modified polyethoxylated alcohols, and these may be used singly or in combinations of two or more. The preferable concentration is 0.1 to 10 g/L and more preferably 0.5 to 3 g/L.
  • In addition, aluminum ions are eluted during cleaning with the acidic liquid cleaner according to the present invention, and this may reduce its cleaning efficiency. Accordingly, as a countermeasure in response to this, optionally a chelating agent, which sequesters the aluminum ions may also be present. Chelating agents useable for this purpose are exemplified by citric acid, oxalic acid, tartaric acid, gluconic acid, and the like.
  • The acidic liquid aluminum cleaner prepared according to the present invention is highly effective f or the removal of smut and scale from aluminum and aluminum alloy as well as for the etching of same.
  • The practice of the invention may be further appreciated from the following working and comparison examples, which are meant to provide illustrative embodiments and are in no way intended to limit the scope of the invention.
  • V. EXAMPLES A. Example 1
  • Aluminum test specimens of 6063-T5 aluminum alloy were cleaned in acid cleaner, rinse then etched in the following acid etch composition:
    Hydrofluoric Acid 49% 7.5 g/L
    Fluoroboric Acid 49% 5.0 g/L
    Ammonium Bifluoride 60.0 g/L
    Sodium Phosphate 15.0 g/L
    Surfactant 1.0 g/L
    The Solution pH was adjusted to 3.4.
  • Test samples were etched in the above solution for 1.0, 3.0 and 5.0 minutes respectively. The etched samples were subjected to rinse, deox, rinse, dry off and weight loss taken before and after etch were performed on all test samples to determine the aluminum dissolution or removal rate. For comparison, a controlled aluminum specimen was acid cleaned, rinse then etched in aqueous alkaline etch bath for 5.0 and 10.0 minutes respectively at a temperature of 145°-150° F.
  • The etch bath contained 90.0 g/L sodium hydroxide, 100.00 g/L dissolved aluminum and 2.0% volume of Houghton no-dump/long life etchant additives. As with the acid etched samples, all alkaline etched samples were subjected to rinse, deox, rinse, dry off and weight loss taken before and after etch.
  • All acid and alkaline etched samples were anodized as follows:
    1. Rinse Room Temperature
    2. Deox Houghton A-1745 at 7.0% volume for 1.0 min.
    3. Rinse Room Temperature
    4. Anodizing Sulfuric Acid 180 g/L
    Aluminum 10 g/L
    Current Density 18 amps per sq.ft.
    Bath Temperature 72° F.
    Anodizing Time 30 min.
    Coating Thickness 0.7 mil
    5. Rinse Room Temperature
    6. Seal A-620 (Houghton Mid-Temp. Seal) 3% volume at 180° F. for
    10.0 min.
    7. Rinse
    8. Dry off
  • Results from illustrative embodiments of the invention compared to a base alkaline etch are described in Table (1).
  • Aluminum removal is measured in grams per square foot of aluminum removal (i.e., g/ft2). All anodized samples were carefully evaluated for the quality of the etch by visual examinations and by the gloss reading using reflectometer at 60° angle.
    TABLE 3
    Temp. Al Removed Time
    Etch Bath (° F.) (g/ft2) (min.) Gloss
    Acid 115 0.70 1.0 6.2
    Acid 115 1.17 3.0 5.9
    Acid 115 1.42 5.0 4.9
    Alkaline 145 5.4 5.0 18.1
    Alkaline 145 10.5 10.0 9.4
  • D. Example 2
  • Aluminum test specimens of 6063-T5 aluminum alloy were etched in the following acid bath.
    Hydrofluoric acid 49% 10.0 g/L
    Ammonium bifluoride 80.0 g/L
    Diammonium phosphate 30.0 g/L
    Surfactant 200.0 ppm
    pH 3.4-3.6
  • Aluminum removal rate was performed as in Example (1). All samples were anodized the same as Example (1) and the finished samples were evaluated using same method as in Example (1). Results from Examples (2) are described in Table (2).
    TABLE 4
    Temp. Al Removed Time
    Etch Bath (° F.) (g/ft2) (min.) Gloss
    Acid 110 0.85 2.0 6.0
    Acid 110 1.51 6.0 4.8
    Acid 110 1.53 10.0 4.2
  • E. Example 3
  • Aluminum test specimens of 6063-T5 aluminum alloy that contained high zinc content at 0.1% in its alloy were etched separately in the following etch baths.
    Acid Etch Bath
    Bath composition same as in example (2)
    Bath temperature 110° F.
    Etch time 5.0 minutes
    Alkaline Etch Bath
    Sodium Hydroxide 8.0 oz/gal
    Aluminum 100.0 g/L
    Temperature 145.0° F.
    Etch Time 10.0 minutes
  • After etch all samples were subjected to rinse, deox, rinse, dry off and carefully evaluated.
  • F. Results
  • Alkaline etched samples had very rough or galvanizing problem while acid etched parts had uniform matt finish.
  • G. Test Results
  • 1. The compositions and methods of the invention comprising the acid etch compositions produce excellent uniform matte finish.
  • 2. The compositions and methods of the invention comprising the acid etch compositions are more effective than alkaline etch in hiding extrusion lines, scratches or defects than alkaline etch.
  • 3. The compositions and methods of the invention comprising the acid etch compositions produce lower gloss reading than alkaline etch.
  • 4. The compositions and methods of the invention comprising the acid etch compositions operates at lower bath temperature and unlike alkaline etch does not require cooling.
  • 5. The compositions and methods of the invention comprising the acid etch compositions reduces etch time to 3.0-5.0 minutes compared to 9-15 minutes in case of alkaline etch
  • 6. The compositions and methods of the invention comprising the acid etch compositions produce less aluminum removal 0.5-1.5 gr/ft2 vs 9.0-13.0 gr/ft2 in case of alkaline etch.
  • 7. The compositions and methods of the invention comprising the acid etch compositions reduce waster. Due to the fact that 1.0 lb. of aluminum is removed in the etch process results in 20.0 lbs. of waste sludge, therefore acid etch presents significant waste sludge reduction.
  • 8. The compositions and methods of the invention comprising the acid etch compositions parts are easy to rinse and require less rinse tanks than alkaline etch. This presents less water consumption.
  • 9. The compositions and methods of the invention comprising the acid etch compositions are more effective in preventing pitting prior to anodizing.
  • 10. The compositions and methods of the invention comprising the acid etch compositions are not sensitive to zinc content in the aluminum alloy as in the case of alkaline etch. High zinc content results in a rough finish or galvanizing defect.
  • The invention described and claimed herein is not to be limited in scope by the specific embodiments herein disclosed, since these embodiments are intended as illustrations of several aspects of the invention. Any equivalent embodiments are intended to be within the scope of this invention. Indeed, various modifications of the invention in addition to those shown and described herein will become apparent to those skilled in the art from the foregoing description. Such modifications are also intended to fall within the scope of the appended claims.

Claims (39)

1. A composition comprising one or more fluoride ion compounds, one or more fluoride salts, one or more mineral acids, one or more organic acids, one or more surfactants and optionally one or more grain refiners.
2. The composition of claim 1, wherein the fluoride ion compound is hydrofluoric acid, hydrofluorosilsilic acid, or fluoroboric acid or mixtures thereof.
3. The composition of claim 1, wherein the fluoride ion compound is a fluoride salt.
4. The composition of claim 3, wherein the fluoride salt is ammonium bifluoride or sodium fluoride or mixtures thereof
5. The composition of claim 1, wherein the mineral acid is hydrofluoric acid, nitric acid, sulfuric acid, or phosphoric acid or mixtures thereof.
6. The composition of claim 1, wherein the organic acid is oxalic acid or glycolic acid or mixtures thereof.
7. The composition of claim 1, wherein the surfactant is nonionic surfactant, an amphoteric surfactant, or a synergistic surfactant.
8. The composition of claim 1, wherein the surfactant comprises salts of alkyl aryl sulfonates, alkyl sulfonates, alkyl ether sulfates, alkyl sulfates, alkyl taurates, and alkyl sulfosuccinates.
9. The composition of claim 1, wherein the surfactant comprises a hydrocarbon derivatives, abietic acid derivatives, ethoxylated primary alcohols, and modified polyethoxylated alcohols, individually or in combinations of two or more.
10. The composition of claim 1, wherein the fluoride ion compound is present in an amount from about 10 to about 200 grams per liter.
11. The composition of claim 1, wherein the mineral acid is present in an amount from about 40 to about 80 grams per liter.
12. The composition of claim 1, wherein the organic acid is present in an amount from about 5 to about 20 grams per liter.
13. The composition of claim 1, wherein the surfactant is present in an amount from about 1 to about 3 grams per liter.
14. A composition for etching a metal, comprising ammonium bifluoride, hydrofluoric acid, glycolic acid, and surfactant.
15. The composition of claim 14, wherein the surfactant is nonionic surfactant, an amphoteric surfactant, or a synergistic surfactant.
16. The composition of claim 14, wherein the surfactant comprises salts of alkyl aryl sulfonates, alkyl sulfonates, alkyl ether sulfates, alkyl sulfates, alkyl taurates, and alkyl sulfosuccinates.
17. The composition of claim 14, wherein the surfactant comprises a hydrocarbon derivatives, abietic acid derivatives, ethoxylated primary alcohols, and modified polyethoxylated alcohols, individually or in combinations of two or more.
18. The composition of claim 14, wherein the ammonium bifluoride is present in an amount from about 10 to about 200 grams per liter.
19. The composition of claim 14, wherein the hydroflouric acid is present in an amount from about 40 to about 80 grams per liter.
20. The composition of claim 14, wherein the glycolic acid is present in an amount from about 5 to about 20 grams per liter.
21. The composition of claim 14, wherein the surfactant is present in an amount from about 1 to about 3 grams per liter.
22. The composition of claim 14, wherein the metal is aluminum or aluminum alloy.
23. A method of treating the surface of a metal, which comprises contacting the metal with a composition comprising a one or more fluoride ion compounds, one or more fluoride salts, one or more mineral acids, one or more organic acids and one or more surfactants and optionally one or more grain refiners.
24. The method of claim 23, wherein the treatment is done at a solution temperature of 70° F. to 150° F.
25. The method of claim 23, wherein the treatment is done at a solution temperature of 100° F. to 120° F.
26. The method of claim 23, wherein the fluoride ion compound is hydrofluoric acid, hydrofluorosilsilic acid, or fluoroboric acid or mixtures thereof.
27. The method of claim 23, wherein the fluoride ion compound is a fluoride salt.
28. The method of claim 27, wherein the fluoride salt is ammonium bifluoride or sodium fluoride or mixtures thereof
29. The method of claim 23, wherein the mineral acid is hydrofluoric acid, nitric acid, sulfuric acid, or phosphoric acid or mixtures thereof.
30. The method of claim 23, wherein the organic acid is oxalic acid or glycolic acid or mixtures thereof.
31. The method of claim 23, wherein the surfactant is nonionic surfactant, an amphoteric surfactant, or a synergistic surfactant.
32. The method of claim 23, wherein the surfactant comprises salts of alkyl aryl sulfonates, alkyl sulfonates, alkyl ether sulfates, alkyl sulfates, alkyl taurates, and alkyl sulfosuccinates.
33. The method of claim 23, wherein the surfactant comprises a hydrocarbon derivatives, abietic acid derivatives, ethoxylated primary alcohols, and modified polyethoxylated alcohols, individually or in combinations of two or more.
34. The method of claim 23, wherein the fluoride ion compound is present in an amount from about 2 to about 90 grams per liter.
35. The method of claim 23, wherein the mineral acid is present in an amount from about 40 to about 80 grams per liter.
36. The method of claim 23, wherein the organic acid is present in an amount from about 5 to about 20 grams per liter.
37. The method of claim 23, wherein the surfactant is present in an amount from about 1 to about 3 grams per liter.
38. The method of claim 23, wherein the treatment is done for about 5 minutes.
39. The method of claim 23, wherein the metal is aluminum or aluminum alloy.
US11/504,014 2005-08-19 2006-08-15 Methods and compositions for acid treatment of a metal surface Abandoned US20070066503A1 (en)

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US12/336,582 US8252195B2 (en) 2005-08-19 2008-12-17 Methods and compositions for acid treatment of a metal surface
US13/564,880 US20120292559A1 (en) 2005-08-19 2012-08-02 Methods and Compositions for Acid Treatment of a Metal Surface
US13/564,889 US8518286B2 (en) 2005-08-19 2012-08-02 Methods and compositons for acid treatment of a metal surface
US13/972,136 US20130334173A1 (en) 2005-08-19 2013-08-21 Methods and Compositions for Acid Treatment of a Metal Surface
US14/619,570 US20150322576A1 (en) 2005-08-19 2015-02-11 Methods and Compositions for Acid Treatment of a Metal Surface
US14/664,884 US9732428B2 (en) 2005-08-19 2015-03-22 Methods and compositions for acid treatment of a metal surface
US15/645,481 US10260153B2 (en) 2005-08-19 2017-07-10 Methods and compositions for acid treatment of a metal surface

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US13/564,880 Abandoned US20120292559A1 (en) 2005-08-19 2012-08-02 Methods and Compositions for Acid Treatment of a Metal Surface
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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090090635A1 (en) * 2005-08-19 2009-04-09 Houghton Metal Finishing Company Methods and compositions for acid treatment of a metal surface
GB2474760A (en) * 2009-10-20 2011-04-27 Gen Electric Method for the removal of sand from a substrate with an acid solution
US20110152151A1 (en) * 2009-12-23 2011-06-23 Lam Research Post Deposition Wafer Cleaning Formulation
CN103498185A (en) * 2013-09-03 2014-01-08 湖北实美科技有限公司 Low-temperature polishing solution
US20140162130A1 (en) * 2011-06-21 2014-06-12 Drexel University Compositions comprising free-standing two-dimensional nanocrystals
US20150001090A1 (en) * 2012-08-16 2015-01-01 Catcher Technology Co., Ltd. Method of forming skid-proof leather-texture surface on metallic substrate
US20150315712A1 (en) * 2012-12-13 2015-11-05 Parker-Hannifin Corporation Cleaning composition for metal articles
CN105420805A (en) * 2009-11-23 2016-03-23 梅特康有限责任公司 Electrolyte solution and electropolishing methods
US20170152603A1 (en) * 2015-11-30 2017-06-01 Industry-Academic Cooperation Foundation, Yeungnam University Method for surface treatment of metals using bacteria
US9691622B2 (en) 2008-09-07 2017-06-27 Lam Research Corporation Pre-fill wafer cleaning formulation
US10538431B2 (en) 2015-03-04 2020-01-21 Drexel University Nanolaminated 2-2-1 MAX-phase compositions
US10573768B2 (en) 2014-09-25 2020-02-25 Drexel University Physical forms of MXene materials exhibiting novel electrical and optical characteristics
CN111020590A (en) * 2019-11-25 2020-04-17 昆山兰博旺新材料技术服务有限公司 Environment-friendly aluminum alloy chemical polishing solution
US10720644B2 (en) 2015-04-20 2020-07-21 Drexel University Two-dimensional, ordered, double transition metals carbides having a nominal unit cell composition M′2M″nXn+1
US11278862B2 (en) 2017-08-01 2022-03-22 Drexel University Mxene sorbent for removal of small molecules from dialysate
US11470424B2 (en) 2018-06-06 2022-10-11 Drexel University MXene-based voice coils and active acoustic devices

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3023848B1 (en) * 2014-07-16 2018-04-20 Constellium Issoire PROCESS FOR RECYCLING SCRAP OF 2XXX OR 7XXX SERIES ALLOYS
US20160172188A1 (en) * 2014-12-16 2016-06-16 Samsung Sdi Co., Ltd. Rinse solution for silica thin film, method of producing silica thin film, and silica thin film
AU2016257686B2 (en) 2015-05-01 2019-09-26 Novelis Inc. Continuous coil pretreatment process
US11535818B2 (en) 2017-12-01 2022-12-27 Houghton Technical Corp. Method and compositions for cleaning aluminum cans
CN111286774A (en) * 2020-02-25 2020-06-16 上海沸莱德表面处理有限公司 Metal micro-arc oxidation pretreatment method
CN111139488A (en) * 2020-03-03 2020-05-12 广东富行洗涤剂科技有限公司 Chemical demolding liquid for high-temperature alloy and demolding treatment method thereof
AU2020203235B1 (en) * 2020-05-18 2021-10-21 Chuen Kwoon Wan Four-function steel surface treatment liquid and preparation method thereof

Citations (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2316220A (en) * 1939-04-22 1943-04-13 Aluminum Co Of America Composition for cleaning aluminum
US2316200A (en) * 1939-03-06 1943-04-13 Bettendorf Co Blade spacer
US2593449A (en) * 1950-10-26 1952-04-22 Kaiser Aluminium Chem Corp Method and composition for treating aluminum and aluminum alloys
US2687346A (en) * 1953-04-24 1954-08-24 Kelite Products Inc Process and composition for brightening the skin of aircraft
US2762694A (en) * 1954-07-22 1956-09-11 Turco Products Inc Method of etching of aluminum and its alloys
US2942956A (en) * 1958-10-13 1960-06-28 Wyandotte Chemicals Corp Aluminum brightener compositions
US3106499A (en) * 1959-05-11 1963-10-08 Rohr Corp Process and composition for cleaning and polishing aluminum and its alloys
US3326803A (en) * 1964-04-27 1967-06-20 Wyandotte Chemicals Corp Aluminum brightener composition
US3331710A (en) * 1963-08-23 1967-07-18 Hooker Chemical Corp Method for coating aluminum
US3448055A (en) * 1965-03-31 1969-06-03 Diversey Corp Aluminum alloy deoxidizing-desmutting composition and method
US3616098A (en) * 1968-03-18 1971-10-26 Dearborn Glass Co Method of producing glare-reducing glass surface
US3852232A (en) * 1969-11-26 1974-12-03 Hooker Chemical Corp Resin composition and process for bond solid particles
US3879216A (en) * 1972-09-25 1975-04-22 Austinite Corp Method and composition for cleaning surfaces
US3915811A (en) * 1974-10-16 1975-10-28 Oxy Metal Industries Corp Method and composition for electroplating aluminum alloys
US4016255A (en) * 1974-09-28 1977-04-05 Beecham Group Limited Oral hygiene compositions
US4396599A (en) * 1981-09-17 1983-08-02 Johnson & Johnson Products Inc. Anticaries composition
US4451329A (en) * 1983-08-22 1984-05-29 Wheaton Industries Methods and compositions for producing decorative frosting effects on glass
US4469544A (en) * 1983-10-28 1984-09-04 Chevron Research Company Etching fountain
US4505223A (en) * 1983-10-28 1985-03-19 Chevron Research Company Optical fiber coating apparatus
US4515771A (en) * 1983-04-11 1985-05-07 Fine Daniel H Composition and method for the preventative treatment of dental disease and apparatus for dispensing said composition
US4541945A (en) * 1982-09-30 1985-09-17 Amchem Products Inhibitor-containing acid cleaning compositions and processes
US4566889A (en) * 1983-10-28 1986-01-28 Chevron Research Company Process of fabricating a portion of an optical fiber capable of reflecting predetermined wavelength bands of light
US4725137A (en) * 1983-10-28 1988-02-16 Chevron Research Company Process and apparatus for measuring an evanescent field in an optical fiber
US4804241A (en) * 1986-12-08 1989-02-14 Chevron Research Company Optical fiber holder
US4851148A (en) * 1985-04-04 1989-07-25 Amchem Products, Inc. Method of controlling an aluminum surface cleaning composition
US4956015A (en) * 1988-01-19 1990-09-11 Mitsubishi Kasei Corporation Polishing composition
US5417819A (en) * 1994-01-21 1995-05-23 Aluminum Company Of America Method for desmutting aluminum alloys having a highly reflective surface
US5421906A (en) * 1993-04-05 1995-06-06 Enclean Environmental Services Group, Inc. Methods for removal of contaminants from surfaces
US5538600A (en) * 1994-07-27 1996-07-23 Aluminum Company Of America Method for desmutting aluminum alloys having a highly-reflective surface
US5669980A (en) * 1995-03-24 1997-09-23 Atotech Usa, Inc. Aluminum desmut composition and process
US5705089A (en) * 1992-03-11 1998-01-06 Mitsubishi Gas Chemical Company, Inc. Cleaning fluid for semiconductor substrate
US5755989A (en) * 1993-02-04 1998-05-26 Daikin Industries, Ltd. Wet etching composition having excellent wetting property for semiconductors
US5972862A (en) * 1996-08-09 1999-10-26 Mitsubishi Gas Chemical Cleaning liquid for semiconductor devices
US5976988A (en) * 1995-04-26 1999-11-02 Semiconductor Energy Laboratory Co., Ltd. Etching material and etching method
US6162301A (en) * 1997-10-21 2000-12-19 Lam Research Corporation Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
US20010048161A1 (en) * 1999-06-24 2001-12-06 Dinesh Chopra Fixed abrasive chemical-mechanical planarization of titanium nitride
US20020043026A1 (en) * 2000-06-15 2002-04-18 Qiuliang Luo Composition and method for polishing semiconductors
US6419784B1 (en) * 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US20030144163A1 (en) * 2001-11-16 2003-07-31 Mitsubishi Chemical Corporation Substrate surface cleaning liquid mediums and cleaning method
US20030172959A1 (en) * 2001-10-12 2003-09-18 Bobolink, Inc. Radioactive decontamination and translocation method
US20050214191A1 (en) * 2004-03-29 2005-09-29 Mueller Brian L Abrasives and compositions for chemical mechanical planarization of tungsten and titanium
US7029597B2 (en) * 2001-01-23 2006-04-18 Lorin Industries, Inc. Anodized aluminum etching process and related apparatus

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB945024A (en) * 1962-01-17 1963-12-18 Alan David Brite Cleaning composition and method
FR1409489A (en) * 1963-08-23 1965-08-27 Parker Ste Continentale Aluminum coating process
US3907973A (en) * 1972-03-06 1975-09-23 Gustave E Kidde Process for defluorinating phosphoric acids and production of ammonium fluosilicate and fluosilicic acid
FR2208994A1 (en) * 1972-12-05 1974-06-28 Paroy Ets Surface treatment of aluminium prior to anodising - using bath contg. phosphoric acid, fluorides and wetting agent
US4046860A (en) * 1973-05-14 1977-09-06 Kidde Gustave E Ammonium fluoride process for defluorinating phosphoric acids and production of ammonium fluosilicate
US3946134A (en) * 1973-07-23 1976-03-23 The Harshaw Chemical Company Method of encapsulating particles and the resultant product
US4116695A (en) * 1974-09-12 1978-09-26 Fuji Photo Film Co., Ltd. Method of producing a support for a printing plate
US4271134A (en) * 1979-03-08 1981-06-02 Teller Environmental Systems, Inc. Treatment of effluent gases from the manufacture of fertilizer
ATE5719T1 (en) * 1980-05-23 1984-01-15 Lonza Ag PROCESS FOR PRODUCTION OF 3-PICOLINE.
US4485078A (en) * 1982-03-16 1984-11-27 Agrico Chemical Company Process for producing wet process phosphoric acid from phosphate rocks containing fluochlorapatite and related minerals
US4472205A (en) * 1983-04-01 1984-09-18 Cortner Jay C Method for cleaning various surfaces of a single article
JPS59229498A (en) 1983-06-09 1984-12-22 Chiyoda:Kk Electrolytic defatting method by high speed current inversion
US4560390A (en) * 1983-09-22 1985-12-24 Robert Bender Method of beneficiating coal
US4765822A (en) * 1985-06-17 1988-08-23 James C. Barber And Associates, Inc. Recovery of fluorine from waste gases
US4639359A (en) * 1985-12-16 1987-01-27 International Minerals & Chemical Corp. Process of removing cationic impurities from wet process phosphoric acid
DE3709897A1 (en) * 1987-03-26 1988-10-06 Ewers Rolf METHOD OF MANUFACTURING A HYDROXYLAPATITE MATERIAL
US5234615A (en) * 1987-10-02 1993-08-10 Ecolab Inc. Article comprising a water soluble bag containing a multiple use amount of a pelletized functional material and methods of its use
US4981664A (en) * 1988-04-14 1991-01-01 International Minerals & Chemical Corporation Method of production of high purity silica and ammonium fluoride
US5165907A (en) * 1988-04-14 1992-11-24 Imcera Group Inc. Method of production of high purity silica and ammonium fluoride
US4919906A (en) * 1988-06-03 1990-04-24 James C. Barber And Associates, Inc. Processes and equipment for production of elemental phosphorus and thermal phosphoric acid
US5110320A (en) * 1990-02-13 1992-05-05 Minnesota Mining And Manufacturing Company Abrasive products bonded with color stabilized base catalyzed phenolic resin
US5232468A (en) * 1990-02-13 1993-08-03 Minnesota Mining And Manufacturing Company Abrasive products bonded with color stabilized base catalyzed phenolic resin
JPH09511262A (en) * 1993-12-10 1997-11-11 アーマー オール プロダクツ コーポレイション Wheel cleaning composition containing acid fluoride salt
US5711996A (en) * 1995-09-28 1998-01-27 Man-Gill Chemical Company Aqueous coating compositions and coated metal surfaces
JPH09256015A (en) * 1996-03-25 1997-09-30 Kobe Steel Ltd Improving agent for conveyability of pulverized fine coal
FR2758003B1 (en) * 1996-12-27 1999-06-18 France Telecom ANTI-REFLECTIVE TREATMENT OF REFLECTIVE SURFACES
KR100248113B1 (en) * 1997-01-21 2000-03-15 이기원 Cleaning and etching compositions for electrical display device and substrate
US6396148B1 (en) * 2000-02-10 2002-05-28 Epic Technologies, Inc. Electroless metal connection structures and methods
JP2001244299A (en) 2000-02-29 2001-09-07 Sony Corp Wiring board and method of manufacturing the same
JP3945964B2 (en) * 2000-06-01 2007-07-18 株式会社ルネサステクノロジ Abrasive, polishing method and method for manufacturing semiconductor device
DE10051872C2 (en) * 2000-10-19 2002-11-21 Merck Patent Gmbh Electrically conductive pigments and processes for their production
US20030045098A1 (en) * 2001-08-31 2003-03-06 Applied Materials, Inc. Method and apparatus for processing a wafer
US6824754B2 (en) * 2002-03-13 2004-11-30 Council Of Scientific And Industrial Research Solid state thermal method for the synthesis of lithium hexafluoro phosphate (LiPF)6 as battery electrolyte
JP3692109B2 (en) * 2002-10-24 2005-09-07 株式会社東芝 Manufacturing method of semiconductor device
JP2005275223A (en) * 2004-03-26 2005-10-06 Konica Minolta Medical & Graphic Inc Method for manufacturing planographic printing plate
EP1701218A3 (en) * 2005-03-11 2008-10-15 Rohm and Haas Electronic Materials LLC Polymer remover
WO2007024556A2 (en) 2005-08-19 2007-03-01 Houghton Metal Finishing Company Methods and compositions for acid treatment of a metal surface
JP5111421B2 (en) * 2009-03-27 2013-01-09 株式会社日立製作所 Positive electrode material for lithium secondary battery, lithium secondary battery, and secondary battery module using the same

Patent Citations (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2316200A (en) * 1939-03-06 1943-04-13 Bettendorf Co Blade spacer
US2316220A (en) * 1939-04-22 1943-04-13 Aluminum Co Of America Composition for cleaning aluminum
US2593449A (en) * 1950-10-26 1952-04-22 Kaiser Aluminium Chem Corp Method and composition for treating aluminum and aluminum alloys
US2687346A (en) * 1953-04-24 1954-08-24 Kelite Products Inc Process and composition for brightening the skin of aircraft
US2762694A (en) * 1954-07-22 1956-09-11 Turco Products Inc Method of etching of aluminum and its alloys
US2942956A (en) * 1958-10-13 1960-06-28 Wyandotte Chemicals Corp Aluminum brightener compositions
US3106499A (en) * 1959-05-11 1963-10-08 Rohr Corp Process and composition for cleaning and polishing aluminum and its alloys
US3331710A (en) * 1963-08-23 1967-07-18 Hooker Chemical Corp Method for coating aluminum
US3326803A (en) * 1964-04-27 1967-06-20 Wyandotte Chemicals Corp Aluminum brightener composition
US3448055A (en) * 1965-03-31 1969-06-03 Diversey Corp Aluminum alloy deoxidizing-desmutting composition and method
US3616098A (en) * 1968-03-18 1971-10-26 Dearborn Glass Co Method of producing glare-reducing glass surface
US3852232A (en) * 1969-11-26 1974-12-03 Hooker Chemical Corp Resin composition and process for bond solid particles
US3879216A (en) * 1972-09-25 1975-04-22 Austinite Corp Method and composition for cleaning surfaces
US4016255A (en) * 1974-09-28 1977-04-05 Beecham Group Limited Oral hygiene compositions
US3915811A (en) * 1974-10-16 1975-10-28 Oxy Metal Industries Corp Method and composition for electroplating aluminum alloys
US4396599A (en) * 1981-09-17 1983-08-02 Johnson & Johnson Products Inc. Anticaries composition
US4541945A (en) * 1982-09-30 1985-09-17 Amchem Products Inhibitor-containing acid cleaning compositions and processes
US4515771A (en) * 1983-04-11 1985-05-07 Fine Daniel H Composition and method for the preventative treatment of dental disease and apparatus for dispensing said composition
US4451329A (en) * 1983-08-22 1984-05-29 Wheaton Industries Methods and compositions for producing decorative frosting effects on glass
US4505223A (en) * 1983-10-28 1985-03-19 Chevron Research Company Optical fiber coating apparatus
US4566889A (en) * 1983-10-28 1986-01-28 Chevron Research Company Process of fabricating a portion of an optical fiber capable of reflecting predetermined wavelength bands of light
US4725137A (en) * 1983-10-28 1988-02-16 Chevron Research Company Process and apparatus for measuring an evanescent field in an optical fiber
US4469544A (en) * 1983-10-28 1984-09-04 Chevron Research Company Etching fountain
US4851148A (en) * 1985-04-04 1989-07-25 Amchem Products, Inc. Method of controlling an aluminum surface cleaning composition
US4804241A (en) * 1986-12-08 1989-02-14 Chevron Research Company Optical fiber holder
US4956015A (en) * 1988-01-19 1990-09-11 Mitsubishi Kasei Corporation Polishing composition
US5705089A (en) * 1992-03-11 1998-01-06 Mitsubishi Gas Chemical Company, Inc. Cleaning fluid for semiconductor substrate
US5755989A (en) * 1993-02-04 1998-05-26 Daikin Industries, Ltd. Wet etching composition having excellent wetting property for semiconductors
US5421906A (en) * 1993-04-05 1995-06-06 Enclean Environmental Services Group, Inc. Methods for removal of contaminants from surfaces
US5417819A (en) * 1994-01-21 1995-05-23 Aluminum Company Of America Method for desmutting aluminum alloys having a highly reflective surface
US5538600A (en) * 1994-07-27 1996-07-23 Aluminum Company Of America Method for desmutting aluminum alloys having a highly-reflective surface
US5669980A (en) * 1995-03-24 1997-09-23 Atotech Usa, Inc. Aluminum desmut composition and process
US5976988A (en) * 1995-04-26 1999-11-02 Semiconductor Energy Laboratory Co., Ltd. Etching material and etching method
US5972862A (en) * 1996-08-09 1999-10-26 Mitsubishi Gas Chemical Cleaning liquid for semiconductor devices
US6162301A (en) * 1997-10-21 2000-12-19 Lam Research Corporation Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
US20010048161A1 (en) * 1999-06-24 2001-12-06 Dinesh Chopra Fixed abrasive chemical-mechanical planarization of titanium nitride
US20020043026A1 (en) * 2000-06-15 2002-04-18 Qiuliang Luo Composition and method for polishing semiconductors
US6419784B1 (en) * 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US7029597B2 (en) * 2001-01-23 2006-04-18 Lorin Industries, Inc. Anodized aluminum etching process and related apparatus
US20030172959A1 (en) * 2001-10-12 2003-09-18 Bobolink, Inc. Radioactive decontamination and translocation method
US20030144163A1 (en) * 2001-11-16 2003-07-31 Mitsubishi Chemical Corporation Substrate surface cleaning liquid mediums and cleaning method
US20050214191A1 (en) * 2004-03-29 2005-09-29 Mueller Brian L Abrasives and compositions for chemical mechanical planarization of tungsten and titanium

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CN111020590A (en) * 2019-11-25 2020-04-17 昆山兰博旺新材料技术服务有限公司 Environment-friendly aluminum alloy chemical polishing solution

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US8518286B2 (en) 2013-08-27
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US20130334173A1 (en) 2013-12-19
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US20180002818A1 (en) 2018-01-04
US20120292559A1 (en) 2012-11-22
US8252195B2 (en) 2012-08-28
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US20150329973A1 (en) 2015-11-19
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US20090090635A1 (en) 2009-04-09
US20150322576A1 (en) 2015-11-12

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