US20070137846A1 - Thermal device for heat generating source - Google Patents

Thermal device for heat generating source Download PDF

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Publication number
US20070137846A1
US20070137846A1 US11/308,941 US30894106A US2007137846A1 US 20070137846 A1 US20070137846 A1 US 20070137846A1 US 30894106 A US30894106 A US 30894106A US 2007137846 A1 US2007137846 A1 US 2007137846A1
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United States
Prior art keywords
thermal device
base
fins
heat generating
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/308,941
Inventor
Ning-Yu Wang
Zhi-Jiang Yao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WANG, NING-YU, YAO, ZHI-JIANG
Publication of US20070137846A1 publication Critical patent/US20070137846A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to thermal devices, and particularly to a thermal device for dissipating heat from or cooling off a heat generating source.
  • Computers may not work properly when the temperature of their central processing units (CPUs) rises above 64° C.
  • CPUs central processing units
  • To prevent overheating of a CPU a thermal device is often attached to the CPU for heat dissipation.
  • FIG. 4 shows one of a currently used thermal device 1 , including a base 12 , a plurality of parallel fins 14 , and two heat pipes 16 .
  • the base 12 is a slab-shaped metal block with a rectangular bottom. Two holes are defined in the base 12 .
  • the fins 14 extend up from the base 12 . Two pairs of holes are respectively defined in the base 12 and the fins 14 for receiving the heat pipes 16 therein.
  • the base 12 is coupled to a CPU.
  • the area of the base 12 is larger than that of the CPU.
  • manufacturing the thermal device 1 requires comparatively more metal raw material, which adds greatly to the cost of manufacture.
  • a thermal device for dissipating heat from a heat generating source includes a first portion, and a second portion formed on the bottom of the first portion.
  • An area of a bottom of the second portion is smaller than an area of a bottom of the first portion, and the area of the bottom of the second portion accords with an area of a contacting surface of the heat generating source.
  • FIG. 1 is an isometric view of a thermal device, in accordance with a preferred embodiment of the present invention
  • FIG. 2 is a front view of FIG. 1 without the heat pipes
  • FIG. 3 is a side view of FIG. 1 with a motherboard thereunder;
  • FIG. 4 is an isometric view of a conventional thermal device.
  • a thermal device 2 in accordance with a preferred embodiment of the present invention, including a base 22 , a plurality of parallel fins 24 , and two heat pipes 26 is shown.
  • the base 22 includes a first portion 222 and a second portion 224 .
  • the first portion 222 is generally rectangular-shaped.
  • the second portion 224 is generally square shaped, and protrudes from a middle of a bottom of the first portion 222 .
  • the dimensions of the second portion 224 are less than that of the first portion 222 . Therefore, the base 22 has a cross section that is wide at the top and narrow at the bottom.
  • An area of the bottom of the second portion 224 is the same as a top contacting surface area of a heat generating source, such as a CPU used as an example in the preferred embodiment.
  • Two parallel, arc shaped holes 226 a are defined in the first portion 222 from one end of the first portion 222 to near another end of the base 22 .
  • two arc-shaped parallel holes 226 b are defined in the second portion 224 aligned with the holes 226 a .
  • the holes 226 a , 226 b cooperate to receive ends of the heat pipes 26 .
  • the fins 24 extend up from a top surface of the first portion 222 perpendicular to the base 22 .
  • Each fin 24 is a slim rectangular-shaped metal piece with two circular holes 242 symmetrically defined near a top edge thereof. The two holes 242 are for receiving other ends of the two heat pipes 26 .
  • the generally U-shaped heat pipes 26 are inserted into the holes 226 of the base 22 and the holes 242 of the fins 24 . Heat in the base 22 will be conducted to the fins 24 by the heat pipes 26 to accelerate the process of dissipating heat from the chip.
  • the thermal device 2 is fixed on a chip 50 of a motherboard 70 .
  • the second portion 224 of the base 22 contacts the chip 50 .
  • Heat produced by the chip 50 is conducted to the second portion 224 , and then to the first portion 222 . Thereafter, the heat is conducted to the fins 24 through the heat pipes 26 , so that the chip 50 can be kept at acceptable working temperatures.
  • thermal device 2 of the preferred embodiment is comparable to the thermal device 1 .

Abstract

A thermal device for cooling a heat generating source is provided, including a first portion and a second portion which is formed from the first portion, the area of the bottom of the second portion is smaller than the area of the bottom of the first portion, and the area of the bottom of the second portion accords with a contact surface area of the heat generating source.

Description

    FIELD OF THE INVENTION
  • The present invention relates to thermal devices, and particularly to a thermal device for dissipating heat from or cooling off a heat generating source.
    • DESCRIPTION OF RELATED ART
  • Computers may not work properly when the temperature of their central processing units (CPUs) rises above 64° C. To prevent overheating of a CPU a thermal device is often attached to the CPU for heat dissipation.
  • FIG. 4 shows one of a currently used thermal device 1, including a base 12, a plurality of parallel fins 14, and two heat pipes 16. The base 12 is a slab-shaped metal block with a rectangular bottom. Two holes are defined in the base 12. The fins 14 extend up from the base 12. Two pairs of holes are respectively defined in the base 12 and the fins 14 for receiving the heat pipes 16 therein. The base 12 is coupled to a CPU. The area of the base 12 is larger than that of the CPU. However, manufacturing the thermal device 1 requires comparatively more metal raw material, which adds greatly to the cost of manufacture.
  • What is needed, therefore, is a lower cost thermal device which still provides good heat sink performance.
    • SUMMARY OF THE INVENTION
  • A thermal device for dissipating heat from a heat generating source is provided. The thermal device includes a first portion, and a second portion formed on the bottom of the first portion. An area of a bottom of the second portion is smaller than an area of a bottom of the first portion, and the area of the bottom of the second portion accords with an area of a contacting surface of the heat generating source.
  • Other advantages and novel features will be drawn from the following detailed description of a preferred embodiment with attached drawings, in which:
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an isometric view of a thermal device, in accordance with a preferred embodiment of the present invention;
  • FIG. 2 is a front view of FIG. 1 without the heat pipes;
  • FIG. 3 is a side view of FIG. 1 with a motherboard thereunder; and
  • FIG. 4 is an isometric view of a conventional thermal device.
    • DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIG. 1, a thermal device 2 in accordance with a preferred embodiment of the present invention, including a base 22, a plurality of parallel fins 24, and two heat pipes 26 is shown.
  • As shown in FIG. 1 and FIG. 2, the base 22 includes a first portion 222 and a second portion 224. The first portion 222 is generally rectangular-shaped. The second portion 224 is generally square shaped, and protrudes from a middle of a bottom of the first portion 222. The dimensions of the second portion 224 are less than that of the first portion 222. Therefore, the base 22 has a cross section that is wide at the top and narrow at the bottom. An area of the bottom of the second portion 224 is the same as a top contacting surface area of a heat generating source, such as a CPU used as an example in the preferred embodiment. Two parallel, arc shaped holes 226 a are defined in the first portion 222 from one end of the first portion 222 to near another end of the base 22. And two arc-shaped parallel holes 226 b are defined in the second portion 224 aligned with the holes 226 a. The holes 226 a, 226 b cooperate to receive ends of the heat pipes 26.
  • As shown in FIG. 2 and FIG. 3, the fins 24 extend up from a top surface of the first portion 222 perpendicular to the base 22. Each fin 24 is a slim rectangular-shaped metal piece with two circular holes 242 symmetrically defined near a top edge thereof. The two holes 242 are for receiving other ends of the two heat pipes 26.
  • Referring to FIG. 1, the generally U-shaped heat pipes 26 are inserted into the holes 226 of the base 22 and the holes 242 of the fins 24. Heat in the base 22 will be conducted to the fins 24 by the heat pipes 26 to accelerate the process of dissipating heat from the chip.
  • As shown in FIG. 3, in use, the thermal device 2 is fixed on a chip 50 of a motherboard 70. The second portion 224 of the base 22 contacts the chip 50. Heat produced by the chip 50 is conducted to the second portion 224, and then to the first portion 222. Thereafter, the heat is conducted to the fins 24 through the heat pipes 26, so that the chip 50 can be kept at acceptable working temperatures.
  • In comparing the conventional thermal device 1 of FIG. 4 with the thermal device 2 in accordance with the preferred embodiment of the present invention of FIG. 1, it can be seen that a volume of the material used for manufacturing the base 22 of the thermal device 2 is less than the volume of material used for the conventional thermal device 1. Thereby there is a reduction in cost of manufacture.
  • In comparing the conventional thermal device 1 with the thermal device 2 of the preferred embodiment under same testing conditions, (ambient temperature of 35° C., rotation speed of a cooling fan 3800 round/min, BTX style layout) we have the results:
    Testing Thermal device 1 Thermal device 2 Temperature
    component temperature (° C.) temperature (° C.) required (° C.)
    CPU 63.26 63.61 <64.1
    Sound card 43.32 43.69 <100
    Video card 67.52 67.3 <85
    Clock chips 54.81 56.87 <85
  • It is evident that the cooling performance of the thermal device 2 of the preferred embodiment is comparable to the thermal device 1.
  • It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of a preferred embodiments, together with details of the structure and function of the preferred embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (12)

1. A thermal device for a heat generating package, comprising:
a plurality of fins; and
a base having a first portion and a second portion, the first portion supporting the plurality of fins, and the second portion formed from a bottom of the first portion, the area of a contacting surface of the second portion being less than that of the bottom of the first portion, and according with that of a contacting surface of the heat generating package.
2. The thermal device as claimed in claim 1, further comprising at least a heat pipe extending from the base to the fins.
3. The thermal device as claimed in claim 2, wherein a portion of the heat pipe is exposed where the second portion does not cover the bottom of the first portion.
4. The thermal device as claimed in claim 2, wherein a hole is defined in the base for receiving the heat pipe, a top longitudinal portion of the hole is defined in the first portion, and a bottom longitudinal portion of the hole is defined in the second portion.
5. The thermal device as claimed in claim 1, wherein both the first portion and the second portion are slab-shaped metal blocks.
6. The thermal device as claimed in claim 1, wherein the second portion protrudes from the first portion.
7. The thermal device as claimed in claim 2, wherein the heat pipe is U-shaped.
8. A thermal device for cooling a heat generating source comprising:
a base with a cross section having a top dimension wider than a bottom dimension, the area of a contacting surface of the base according with a contacting surface of the heat generating source;
a plurality of fins extending from the base, and
at least a heat pipe extending from the base to the fins.
9. The thermal device as claimed in claim 8, wherein the base includes a slab-shaped first portion and a slab-shaped second portion, the area of bottom of the second portion being smaller than the area of the bottom of the first portion.
10. The thermal device as claimed in claim 12, wherein a hole is defined in the base for receiving the heat pipe, a top longitudinal portion of the hole is defined in the first portion, and a bottom longitudinal portion of the hole is defined in the second portion.
11. The thermal device as claimed in claim 8, wherein the second portion protrudes from the first portion.
12. The thermal device as claimed in claim 8, wherein the heat pipe is U-shaped.
US11/308,941 2005-12-20 2006-05-29 Thermal device for heat generating source Abandoned US20070137846A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200520120943.4 2005-12-20
CN200520120943.4U CN2874771Y (en) 2005-12-20 2005-12-20 Radiator

Publications (1)

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CN (1) CN2874771Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080078528A1 (en) * 2006-10-02 2008-04-03 Foxconn Technology Co., Ltd. Heat sink with heat pipes
US20080316707A1 (en) * 2007-06-22 2008-12-25 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040238946A1 (en) * 2002-11-07 2004-12-02 Kabushik Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Heat spreader and semiconductor device and package using the same
US6849941B1 (en) * 2004-01-07 2005-02-01 Thermagon, Inc. Heat sink and heat spreader assembly
US20050067144A1 (en) * 2003-08-25 2005-03-31 Tatung Co., Ltd. Cooling device
US20050092465A1 (en) * 2003-11-05 2005-05-05 Kuo-Len Lin Dual-layer heat dissipating structure
US20050183843A1 (en) * 2004-02-13 2005-08-25 Fujikura Ltd. Heat sink
US6945319B1 (en) * 2004-09-10 2005-09-20 Datech Technology Co., Ltd. Symmetrical heat sink module with a heat pipe for spreading of heat
US20050241808A1 (en) * 2004-04-29 2005-11-03 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20060158850A1 (en) * 2005-01-19 2006-07-20 Foxconn Technology Co., Ltd. Heat dissipation device with a heat pipe
US20070029072A1 (en) * 2005-08-08 2007-02-08 Foxconn Technology Co., Ltd. Heat dissipation device
US20070095508A1 (en) * 2005-11-02 2007-05-03 Foxconn Technology Co., Ltd. Heat dissipation device having louvered heat-dissipating fins
US7295437B2 (en) * 2005-04-22 2007-11-13 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device for multiple heat-generating components
US7327576B2 (en) * 2005-06-24 2008-02-05 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040238946A1 (en) * 2002-11-07 2004-12-02 Kabushik Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Heat spreader and semiconductor device and package using the same
US20050067144A1 (en) * 2003-08-25 2005-03-31 Tatung Co., Ltd. Cooling device
US20050092465A1 (en) * 2003-11-05 2005-05-05 Kuo-Len Lin Dual-layer heat dissipating structure
US6849941B1 (en) * 2004-01-07 2005-02-01 Thermagon, Inc. Heat sink and heat spreader assembly
US20050183843A1 (en) * 2004-02-13 2005-08-25 Fujikura Ltd. Heat sink
US20050241808A1 (en) * 2004-04-29 2005-11-03 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US6945319B1 (en) * 2004-09-10 2005-09-20 Datech Technology Co., Ltd. Symmetrical heat sink module with a heat pipe for spreading of heat
US20060158850A1 (en) * 2005-01-19 2006-07-20 Foxconn Technology Co., Ltd. Heat dissipation device with a heat pipe
US7295437B2 (en) * 2005-04-22 2007-11-13 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device for multiple heat-generating components
US7327576B2 (en) * 2005-06-24 2008-02-05 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
US20070029072A1 (en) * 2005-08-08 2007-02-08 Foxconn Technology Co., Ltd. Heat dissipation device
US20070095508A1 (en) * 2005-11-02 2007-05-03 Foxconn Technology Co., Ltd. Heat dissipation device having louvered heat-dissipating fins

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080078528A1 (en) * 2006-10-02 2008-04-03 Foxconn Technology Co., Ltd. Heat sink with heat pipes
US7694718B2 (en) 2006-10-02 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with heat pipes
US20080316707A1 (en) * 2007-06-22 2008-12-25 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US7548426B2 (en) * 2007-06-22 2009-06-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes

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Legal Events

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AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WANG, NING-YU;YAO, ZHI-JIANG;REEL/FRAME:017686/0655

Effective date: 20060421

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION