US20070145231A1 - Substrate buffer clamp - Google Patents
Substrate buffer clamp Download PDFInfo
- Publication number
- US20070145231A1 US20070145231A1 US11/312,450 US31245005A US2007145231A1 US 20070145231 A1 US20070145231 A1 US 20070145231A1 US 31245005 A US31245005 A US 31245005A US 2007145231 A1 US2007145231 A1 US 2007145231A1
- Authority
- US
- United States
- Prior art keywords
- substrate
- bar supporter
- buffer layer
- clamp
- substrate clamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A substrate clamp includes a bar supporter having a end for connecting and fixing a substrate bearing apparatus; an arm extending from another end of the bar supporter and profiling an angle with the side wall of the bar supporter; and a buffer layer arranged on the side wall of the bar supporter. The present substrate clamp can effectively decrease the split problem of the glass substrate causing from the shocking and sliding in the clamping or moving of the manufacturing processes and enhance the product yield.
Description
- 1. Field of the Invention
- The present invention generally relates to a substrate bearing apparatus, and more particularly relates to a clamp used in a substrate bearing apparatus in the manufacturing processes of the display panel.
- 2. Description of the Prior Art
- In the manufacturing processes of the display panel, the split problem of the glass substrate or the panel is always an important one of the problems need to overcome. Once the glass substrate or the panel is splitting, the glass substrate or the panel cannot be usable or reworked. Especially, accordingly the requirement of the trend of large-scale and thin film Liquid crystal display panel (LCD panel), the difficulty of the related manufacturing technology becomes higher, such as the control of the thin cell gap, stacking and aligning of the panel, the movement and position of the large-scale panel, and the wide view problem, so as the splitting probability is increasing and the yield is decreasing. Wherein, the transportation of the glass substrate or the panel is one of main reasons causing the splitting damage of the glass substrate or the panel, no matter in the process or the movement in the factory, the product yield can be improved by overcoming the splitting problem of the glass substrate and the panel.
- For example, referring to
FIG. 1A , it is a top view illustrating the clamp used in the sputtering machine for bearing a substrate in accordance with the prior technology. As theglass substrate 20 formed the membrane thereon in the sputtering machine, theglass substrate 20 is set on a bearing apparatus, such as aquartz substrate 30, and aclamp 100 is used to fix theglass substrate 20 on thequartz substrate 30. During the whole processes of the membrane formation, theglass substrate 20 is sputtered and shock and further theglass substrate 20 may be moved to the different position or rotate to different direction to form another membrane of the different material on theglass substrate 20 in the sputtering machine. Referring toFIG. 1B , it is the cross-section view illustrating the clamp according to the A-A cross-section ofFIG. 1A . Under the long time clamping and shock of the substrate bearing apparatus and theclamp 100 in the process, it easily causes the loosening of thequartz substrate 30. Hence, as theclamp 100 supporting and holding theglass substrate 20, owing to the loosening of thequartz substrate 30, the difficult positioning of theglass substrate 20, and the difficult control of the supporting force of theclamp 100, it will easily cause theclamp 100 colliding theglass substrate 20 and thequartz substrate 30. Hence, it is important to solve those problems on the yield of the display panel. - One of objects of the present invention is to provide a substrate clamp that can effectively decrease the split problem of the glass substrate causing from the shocking and sliding because of the clamping or moving in the manufacturing processes.
- In order to improve the damage problem of the substrate bearing apparatus and the glass substrate causing from the hitting of the substrate clamp, one of objects of the present invention is to provide a substrate clamp that utilize a buffer material in the contacting area between the substrate clamp and the glass substrate to reduce the hitting force therebetween so as to substantially decrease the probability of the spilt of the glass substrate.
- Accordingly, the present invention provides A substrate clamp for a substrate bearing apparatus comprising: a bar supporter, wherein a end of the bar supporter is used for connecting and fixing with the substrate bearing apparatus; an arm extending from another end of the bar supporter and profiling an angle with a sidewall of the bar supporter; and a buffer layer arranged on the sidewall of the bar supporter.
- Other advantages of the present invention will become apparent from the following description taken in conjunction with the accompanying drawings wherein are set forth, by way of illustration and example, certain embodiments of the present invention.
- The foregoing aspects and many of the accompanying advantages of this invention will become more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:
-
FIG. 1A is the top view of the clamp used in the sputtering machine for bearing a substrate in accordance with the prior technology; -
FIG. 1B is the cross-section view according to the A-A cross-section ofFIG. 1A ; -
FIG. 2 is the side view of the substrate clamp of an embodiment in accordance with the present invention; -
FIG. 3 is the 3D view of the substrate clamp of an embodiment in accordance with the present invention; -
FIG. 4A andFIG. 4B are partial cross-section views of the substrate clamp used in the substrate bearing apparatus of an embodiment in accordance with the present invention; and -
FIG. 5A andFIG. 5B are side views of the substrate clamp of different embodiments in accordance with the present invention. - Referring to
FIG. 2 , it is the side view illustrating the substrate clamp of an embodiment in accordance with the present invention. In the present embodiment, asubstrate clamp 10 includes abar supporter 12, wherein one end of thebar supporter 12 is connected and fixed to the substrate bearing apparatus. Anarm 14 is extended from another end of thebar supporter 12 and an angle between the sidewall of thebar supporter 12 and thearm 14. Besides, there is abuffer layer 16 arranged on the sidewall of thebar supporter 12. Thebuffer layer 16 has a hardness smaller than thebar supporter 12 and used for reducing the colliding force between the glass substrate and the substrate clamp and the loosening problem. Further, in the present embodiment, there is a right angle profiling between thearm 14 and the sidewall of thebar supporter 12. Such as the region A shown inFIG. 2 , the terminal of thearm 14 is a chamfered edge. In the present invention, thearm 14 extending as the angle profiling with the sidewall of thebar supporter 12 will be parallel to the glass substrate bearing on the substrate bearing apparatus, but not only limited as the right angle shown in the present embodiment. - Referring to
FIG. 3 , it is the 3-D view illustrating the substrate clamp of an embodiment in accordance with the present invention. In the present embodiment, thesubstrate clamp 10 includes abar supporter 12 that one end of thebar supporter 12 is used for connecting and fixing with the substrate bearing apparatus and anarm 14 is extending from another end of thebar supporter 12. Besides, there is a trench arranged on the sidewall of thebar supporter 12 and abuffer layer 16 is arranged in the trench. Thebuffer layer 16 is fixed in the trench on thebar supporter 12 by the thermal compression method, the fusion bonding method, or other mounting method. Wherein, the end of thebar supporter 12 connecting the substrate bearing apparatus is arranged alocking hole 18 for using a screwing element to connect and fix thesubstrate clamp 10 with the substrate bearing apparatus. -
FIG. 4A andFIG. 4B are partial cross-section views illustrating the substrate clamp used in the substrate bearing apparatus of an embodiment in accordance with the present invention. Referring toFIG. 4A , in the present embodiment, theglass substrate 20 is set on a substrate bearing apparatus, such as thequartz substrate 30, for forming the membrane on theglass substrate 20 in the sputtering machine. In the whole sputtering process, thesubstrate clamp 10 fixed with thequartz substrate 30 is used for supporting and holding theglass substrate 20. During the sputtering process, thequartz substrate 30, thesubstrate clamp 10, and theglass substrate 20 may be all in the vibrating state. If necessary, theglass substrate 20 may be moved to the different place or rotated to the different direction for forming different membranes with different materials thereon. In the present embodiment, there is abuffer layer 16 on the sidewall of thebar supporter 12 of thesubstrate clamp 10. The hardness of thebuffer layer 16 is smaller than thebar supporter 12 and thebuffer layer 16 is made of the elastic material. As thesubstrate clamp 10 clamping theglass substrate 20, thebuffer layer 16 on the sidewall will direct contact theglass substrate 20 and thequartz substrate 30 so as to reduce the shock force between thesubstrate clamp 10 and theglass substrate 20 and between thesubstrate clamp 10 and thequartz substrate 30 to substantially reduce the split problem of theglass substrate 20. - Following the description mentioned above, referring to
FIG. 4B , in the present invention, in the membrane formation process, theglass substrate 20 is set almost vertically. Thepresent substrate clamp 10 not only fix theglass substrate 20, but also utilize thebuffer layer 16 to reduce the shock force between the region A that thesubstrate clamp 10 directly contacts theglass substrate 20 and thequartz substrate 30. Thearm 14 extending from one end of thebar supporter 12 and parallel to theglass substrate 20 may further protect theglass substrate 20 sliding out of the bearing apparatus and the chamfered edge of the terminal of thearm 14 will not damage theglass substrate 20. -
FIG. 5A andFIG. 5B are side views illustrating the substrate clamp of different embodiments in accordance with the present invention. As shown inFIG. 5A , in one embodiment, thebuffer layer 16 is directly fixed on the sidewall of thebar supporter 12. Further, the buffer layer can be arranged on the sidewall of the support extending to the arm to provide further protect to the glass substrate, such as not shown in the drawing. Referring toFIG. 5B , in another embodiment, the angle between thearm 14 and thebar supporter 12 may be larger than a right angle. The angle may be designed only if thearm 14 of thesubstrate clamp 10 is parallel to theglass substrate 20. As the glass substrate is putting in or taking out of the substrate bearing apparatus, the substrate clamp will open outward so as the glass substrate sucked by the robot arm can move in or move out. If the moving glass substrate is swaying and colliding the substrate clamp, the chamfered edge of the terminal of the arm of the substrate clamp can substantially decrease the split problem of the glass substrate. - According, one of features is to utilize the chamfered edge design of the terminal of the arm of the substrate clamp and another of features is to utilize the buffer layer pad in the contacting region between the clamp and the glass substrate. The hardness of the buffer layer pad is smaller than the support of the clamp and the buffer layer pad is made of the material corresponding to the working environment. For example, the substrate clamp is used in the sputtering machine, the process temperature is about 250° C. in the process. The substrate clamp must be recyclable. After the cleaning the clamp in the strong acid or base solution, the substrate clamp can be used again. Hence, the substrate clamp must utilize the material against strong acid or base environment. In one embodiment, the substrate clamp can be made of the polybenzimidezole (PBI) material and the hardness is about HS105 (HS, Shores hardness). The buffer layer can be made of the kalrez material, such as kalrez4079 and the hardness is about HS55 to HS95. Therefore, the substrate clamp may apply to the sputtering machine in the high temperature environment and be recyclable for using again after the cleaning of the strong acid or base solution.
- To sum up the forgoing, the substrate clamp of the present invention may effectively solve the split problem of the glass substrate causing from the shocking and sliding in the clamping or moving of the manufacturing processes. Further, the present invention provides a substrate clamp that utilizes a buffer material in the contacting area between the substrate clamp and the glass substrate to reduce the hitting force therebetween so as to substantially decrease the probability of the spilt of the glass substrate.
- While the present invention is susceptible to various modifications and alternative forms, a specific example thereof has been shown in the drawings and is herein described in detail. It should be understood, however, that the invention is not to be limited to the particular form disclosed, but to the contrary, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the appended claims.
Claims (16)
1. A substrate clamp for a substrate bearing apparatus comprising:
a bar supporter, wherein a end of said bar supporter is used for connecting and fixing with said substrate bearing apparatus;
an arm extending from another end of said bar supporter and profiling an angle with a sidewall of said bar supporter; and
a buffer layer arranged on said sidewall of said bar supporter.
2. The substrate clamp according to claim 1 , wherein a terminal of said arm is a chamfered edge.
3. The substrate clamp according to claim 1 , wherein said angle of said arm extending is to make said arm parallel to a substrate bearing on said substrate bearing apparatus.
4. The substrate clamp according to claim 1 , wherein said buffer layer is fixed on said bar supporter by any one of the thermal compression method, the fusion bonding method, and other mounting method.
5. The substrate clamp according to claim 4 , wherein said sidewall of said bar supporter is arranged a trench for arranging said buffer layer therein.
6. The substrate clamp according to claim 1 , wherein said end of said bar supporter is arranged a locking hole for using a screwing element to connect and fix said substrate clamp with said substrate bearing apparatus.
7. The substrate clamp according to claim 1 , wherein the hardness of said buffer layer is smaller than said bar supporter.
8. The substrate clamp according to claim 1 , wherein said bar supporter is made of the polybenzimidezole.
9. The substrate clamp according to claim 1 , wherein a hardness of said buffer layer is HS55 to HS95.
10. A substrate clamp, which is for a substrate in a substrate bearing apparatus, wherein said substrate clamp comprising:
a bar supporter, wherein a end of said bar supporter is for connecting and fixing with said substrate bearing apparatus;
an arm extending from another end of said bar supporter and profiling an angle with a sidewall of said bar supporter and parallel to said substrate; and
a buffer layer arranged on said sidewall of said bar supporter, wherein the hardness of said buffer layer is smaller than said bar supporter.
11. The substrate clamp according to claim 10 , wherein a terminal of said arm is a chamfered edge.
12. The substrate clamp according to claim 10 , wherein said buffer layer is fixed on said bar supporter by the thermal compression method, the fusion bonding method, or other mounting method.
13. The substrate clamp according to claim 12 , wherein said sidewall of said bar supporter is arranged a trench for arranging said buffer layer therein.
14. The substrate clamp according to claim 10 , wherein said end of said bar supporter is arranged a locking hole for using a screwing element to connect and fix said substrate clamp in said substrate bearing apparatus.
15. The substrate clamp according to claim 10 , wherein said bar supporter is made of the polybenzimidezole.
16. The substrate clamp according to claim 10 , wherein a hardness of said buffer layer is about HS55 to HS95.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/312,450 US20070145231A1 (en) | 2005-12-21 | 2005-12-21 | Substrate buffer clamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/312,450 US20070145231A1 (en) | 2005-12-21 | 2005-12-21 | Substrate buffer clamp |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070145231A1 true US20070145231A1 (en) | 2007-06-28 |
Family
ID=38192493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/312,450 Abandoned US20070145231A1 (en) | 2005-12-21 | 2005-12-21 | Substrate buffer clamp |
Country Status (1)
Country | Link |
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US (1) | US20070145231A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130343069A1 (en) * | 2012-06-21 | 2013-12-26 | Yicheng Kuo | Packing device of backlight module |
US20140331927A1 (en) * | 2013-05-13 | 2014-11-13 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus |
WO2015113591A1 (en) * | 2014-01-28 | 2015-08-06 | Ev Group E. Thallner Gmbh | Device and method for removing a first substrate |
US20160192047A1 (en) * | 2014-12-31 | 2016-06-30 | Hon Hai Precision Industry Co., Ltd. | Glass loudspeaker emitting sound and accoustically-driven light |
CN110460934A (en) * | 2019-04-19 | 2019-11-15 | 友达光电股份有限公司 | Display device |
WO2022154779A1 (en) * | 2021-01-12 | 2022-07-21 | Applied Materials, Inc. | Clamping mechanisms for securing substrates on carriers |
WO2023127796A1 (en) * | 2021-12-28 | 2023-07-06 | 京セラ株式会社 | Clamping jig and cleaning device |
Citations (10)
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US4364816A (en) * | 1979-12-07 | 1982-12-21 | Emi Limited | Record matrix preparation |
US4442324A (en) * | 1982-06-24 | 1984-04-10 | Tibbetts Industries, Inc. | Encapsulated backplate for electret transducers |
US5807515A (en) * | 1993-03-05 | 1998-09-15 | Donnelly Corporation | Method for making vehicle panel assembly |
US6162336A (en) * | 1999-07-12 | 2000-12-19 | Chartered Semiconductor Manufacturing Ltd. | Clamping ring design to reduce wafer sticking problem in metal deposition |
US6231038B1 (en) * | 1998-12-01 | 2001-05-15 | Greene Tweed Of Delaware, Inc. | Two-piece clamp ring for holding semiconductor wafer or other workpiece |
US20020153676A1 (en) * | 2001-04-23 | 2002-10-24 | Ikuo Noguchi | Wafer holding device |
US6494003B1 (en) * | 2000-03-24 | 2002-12-17 | Hori Glass Co., Ltd. | Vehicle window glass and method of producing the same |
US6569302B1 (en) * | 1998-12-22 | 2003-05-27 | Steag Micro Tech Gmbh | Substrate carrier |
US6579430B2 (en) * | 2001-11-02 | 2003-06-17 | Innovative Technology Licensing, Llc | Semiconductor wafer plating cathode assembly |
US20040016452A1 (en) * | 2000-10-31 | 2004-01-29 | Junji Kunisawa | Holding unit, processing apparatus and holding method of substrates |
-
2005
- 2005-12-21 US US11/312,450 patent/US20070145231A1/en not_active Abandoned
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4364816A (en) * | 1979-12-07 | 1982-12-21 | Emi Limited | Record matrix preparation |
US4442324A (en) * | 1982-06-24 | 1984-04-10 | Tibbetts Industries, Inc. | Encapsulated backplate for electret transducers |
US5807515A (en) * | 1993-03-05 | 1998-09-15 | Donnelly Corporation | Method for making vehicle panel assembly |
US6231038B1 (en) * | 1998-12-01 | 2001-05-15 | Greene Tweed Of Delaware, Inc. | Two-piece clamp ring for holding semiconductor wafer or other workpiece |
US6569302B1 (en) * | 1998-12-22 | 2003-05-27 | Steag Micro Tech Gmbh | Substrate carrier |
US6162336A (en) * | 1999-07-12 | 2000-12-19 | Chartered Semiconductor Manufacturing Ltd. | Clamping ring design to reduce wafer sticking problem in metal deposition |
US6494003B1 (en) * | 2000-03-24 | 2002-12-17 | Hori Glass Co., Ltd. | Vehicle window glass and method of producing the same |
US20040016452A1 (en) * | 2000-10-31 | 2004-01-29 | Junji Kunisawa | Holding unit, processing apparatus and holding method of substrates |
US20020153676A1 (en) * | 2001-04-23 | 2002-10-24 | Ikuo Noguchi | Wafer holding device |
US6579430B2 (en) * | 2001-11-02 | 2003-06-17 | Innovative Technology Licensing, Llc | Semiconductor wafer plating cathode assembly |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130343069A1 (en) * | 2012-06-21 | 2013-12-26 | Yicheng Kuo | Packing device of backlight module |
US9102458B2 (en) * | 2012-06-21 | 2015-08-11 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Packing device of backlight module |
US9343287B2 (en) * | 2013-05-13 | 2016-05-17 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus including spin chuck |
US20140331927A1 (en) * | 2013-05-13 | 2014-11-13 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus |
US9922862B2 (en) | 2014-01-28 | 2018-03-20 | Ev Group E. Thallner Gmbh | Device and method for loosening a first substrate |
KR20160111392A (en) * | 2014-01-28 | 2016-09-26 | 에베 그룹 에. 탈너 게엠베하 | Device and method for removing a first substrate |
WO2015113591A1 (en) * | 2014-01-28 | 2015-08-06 | Ev Group E. Thallner Gmbh | Device and method for removing a first substrate |
KR102211334B1 (en) * | 2014-01-28 | 2021-02-03 | 에베 그룹 에. 탈너 게엠베하 | Device and method for removing a first substrate |
US20160192047A1 (en) * | 2014-12-31 | 2016-06-30 | Hon Hai Precision Industry Co., Ltd. | Glass loudspeaker emitting sound and accoustically-driven light |
CN105812989A (en) * | 2014-12-31 | 2016-07-27 | 鸿富锦精密工业(深圳)有限公司 | Loudspeaker |
US9686841B2 (en) * | 2014-12-31 | 2017-06-20 | Hon Hai Precision Industry Co., Ltd. | Glass loudspeaker emitting sound and accoustically-driven light |
CN110460934A (en) * | 2019-04-19 | 2019-11-15 | 友达光电股份有限公司 | Display device |
WO2022154779A1 (en) * | 2021-01-12 | 2022-07-21 | Applied Materials, Inc. | Clamping mechanisms for securing substrates on carriers |
WO2023127796A1 (en) * | 2021-12-28 | 2023-07-06 | 京セラ株式会社 | Clamping jig and cleaning device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: CHUNGHWA PICTURE TUBES, LTD, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, SHIH-PU;ZHANG, ZHENG-HUA;LIN, DONG-DA;REEL/FRAME:017554/0929 Effective date: 20050816 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |