US20070181781A1 - Integrated optical transceiver - Google Patents
Integrated optical transceiver Download PDFInfo
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- US20070181781A1 US20070181781A1 US11/651,525 US65152507A US2007181781A1 US 20070181781 A1 US20070181781 A1 US 20070181781A1 US 65152507 A US65152507 A US 65152507A US 2007181781 A1 US2007181781 A1 US 2007181781A1
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- 230000003287 optical effect Effects 0.000 title claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 125000006850 spacer group Chemical group 0.000 claims abstract description 46
- 230000005693 optoelectronics Effects 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 2
- 239000000835 fiber Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000010354 integration Effects 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0204—Compact construction
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0271—Housings; Attachments or accessories for photometers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0403—Mechanical elements; Supports for optical elements; Scanning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
An optical transceiver includes at least one light source and at least one detector mounted on the same surface of the same substrate. The detector is to receive light from other than a light source on the surface. At least one of the light source and the detector is mounted on the surface. An optics block having optical elements for each light source and detectors is attached via a vertical spacer to the substrate. Electrical interconnections for the light source and the detector are accessible from the same surface of the substrate with the optics block attached thereto. One of the light source and the detector may be monolithically integrated into the substrate.
Description
- The present application claims priority under 35 U.S.C. §119 to PCT/US01/07053, filed Mar. 6, 2001, and to Provisional Application Ser. No.: 60/187,034, filed Mar. 6, 2000, and under 35 U.S.C. § 120 to co-pending U.S. patent application Ser. No. 11/127,284, filed May 12, 2005, and parent Ser. No. 10/231,483, filed Aug. 30, 2002, the entire contents of all of which are hereby incorporated by reference their entirety for all purposes.
- Previous attempts at integrating a transceiver on a chip involved using monolithic integration, in which the active elements are formed in the substrate, and are thus all made of the same material. This does not allow optimum performance to be realized for at least one of the detector array and the light source array.
- Other attempts have placed the active elements, e.g., the light sources and the detectors, on different substrates. However, this increases the complexity of the system due to an increased number of components and alignment difficulty.
- The present invention is therefore directed to an integrated optical transceiver which substantially overcomes one or more of the problems due to the limitations and disadvantages of the related art.
- The above and other objects of the present invention may be realized by providing an optical transceiver including at least one light source on a first surface of a substrate, at least one detector on the first surface of the substrate, at least one of the at least one light source and the at least one detector being mounted on the substrate, the at least one detector to receive light other than from a light source on the first surface of the substrate, and an optics block having optics for both the at least one light source and the at least one detector integrated thereon, the optics block being attached to the substrate.
- The at least one light source and the at least one detector may be of different materials. One of the at least one light source and the at least one detector may be monolithically integrated with the substrate. The at least one light source may be an array of light sources and the at least one detector may be an array of detectors. The optical transceiver may include a spacer between the substrate and the optics block. The spacer may completely surround the periphery of the optics block. The spacer may include a plurality of separate spacers provided in the periphery of the optics block. The optics for the at least one light source and the at least one detector may have the same design. The optics for the at least one light source may be formed on an opposite side of the optics block from optics for the at least one detector. The optical may include interconnection features on the first surface of the substrate for the at least one light source and the at least one detector. The interconnection features may be on a same side or on opposite sides of the first surface of the substrate for both the at least one light source and the at least one detector. The optical array of light sources and the array of detectors may parallel or may form a line.
- The above and other objects of the present invention may be realized by providing a method of forming an optical transceiver including providing a plurality of detectors on a first surface of a first wafer, providing a plurality of light sources on the first surface of the first wafer, at least one of the plurality of detectors and the plurality of light sources being mounted on the first wafer, the detectors to receive light from other than the plurality of light sources on the first surface, providing electrical interconnections for each of the plurality of detectors and each of the plurality of light sources on the first surface of the first wafer, providing an optics block having at least one optical element for each of the plurality of detectors and each of the plurality of light sources, providing a vertical spacer between the optics block and the first wafer; attaching the vertical spacer, the optics block and the first wafer to one another, and singulating the first wafer into a plurality of transceivers, each transceiver having at least one light source and at least one detector.
- The method providing of the optics block may include forming the at least one optical element for each of the plurality of detectors and each of the plurality of light sources on a second wafer and attaching the second wafer to the first wafer before the singulating, with the singulating allowing access to the electrical interconnections. The providing of the vertical spacer may include forming vertical spacers for each of the transceivers on a spacer wafer and attaching the spacer wafer to the first wafer before the singulating, with the singulating allowing access to the electrical interconnections. The providing of the optics block may include forming the at least one optical element for each of the plurality of detectors and each of the plurality of light sources on a second wafer and attaching the second wafer to the spacer wafer and the first wafer before the singulating, with the singulating allowing access to the electrical interconnections. The attaching may include directly attaching the second wafer to the spacer wafer. The providing of one of the plurality of light sources and the plurality of detectors may include monolithically integrating into the first wafer. The providing electrical interconnections for each of the plurality of detectors and each of the plurality of light sources may include using the same mask for both interconnections to the detectors and the light sources.
- These and other objects of the present invention will become more readily apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating the preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.
- The foregoing and other objects, aspects and advantages will be described with reference to the drawings, in which:
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FIG. 1 is an elevational exploded top view of an optical transceiver of the present invention; -
FIG. 2 is an elevational side view of another optical transceiver of the present invention; -
FIG. 3 is a top view of another configuration of the light sources and detectors on the same substrate; -
FIG. 4 is a schematic side view of the creation of multiple transceivers in accordance with the present invention; and -
FIG. 5 is an exploded elevational perspective view of an interface in conjunction with fibers in a housing and the transceiver of the present invention. - In the following description, for purposes of explanation and not limitation, specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known devices and methods are omitted so as not to obscure the description of the present invention with unnecessary details.
- Rather than using monolithic integration, many of the advantages of integration can still be realized by providing the light source array and the detector array on the same surface of a single substrate and providing an optics block having the optical elements for both the light source array and the detector array integrated therein.
- Related, co-pending U.S. Provisional Application Ser. No. 09/690,763 entitled “Fiber Interfaces Including Parallel Arrays, Power Monitoring and/or Differential Mode Delay Compensation” filed on Oct. 18, 2000, describes a laser array and a detector array on the same substrate. In this previous application, the detector array was used for monitoring the power of the lasers, a portion of the output laser beams being directed to the detector. In accordance with the present disclosure, a light source array and a detector array are integrated on the same substrate, but, as shown in
FIGS. 1 and 2 of the present application, these detectors are for receiving a signal from a remote location, not for monitoring the light source array. Of course, an additional array of monitor detectors could be provided for monitoring the output of the light sources. - In
FIG. 1 , anoptical transceiver 100 includes alight source array 102, here shown as a vertical cavity side emitting laser (VCSEL) array, and adetector array 104 are integrated on asilicon wafer 106.Silicon interconnect tracks 108 supply power to theactive elements pads 110 allow the detector signals to be read out. - An
optics block 120 contains two sets of integrated optics, oneset 122 for thelight source array 102 and oneset 124 for thedetector array 104. The integratedoptics 122 for the light source receive light from thelight source array 102 and direct the light to a desired application. The integratedoptics 124 for the detectors receive light from a desired application and direct the light to thedetector array 104. The optics may be diffractives, refractives or hybrids thereof and may be formed lithographically on theoptics block 120. - The integrated
optics optics block 120. Since the optics for both the light source array and the detector array are aligned simultaneously, the assembly and alignment steps required for creating a transceiver are reduced. Further, the integration allows the transceiver to be smaller and have fewer parts. Depending upon the material used for the substrate, either the detector array or the light source array may be monolithically integrated therein. - The
transceiver 100 also includes aspacer 130 between the active elements and theoptics block 120. The spacer may be an integrated spacer surrounding the perimeter of the optics block, as shown inFIG. 1 . The spacer may be a separate element, formed in the optics block or formed in the substrate. The spacer may serve to protect the active elements. - In
FIG. 2 , the bonded structure of a transceiver 200 is shown. Rather than having aspacer 130 around the perimeter of the optics block 120,separate spacer elements 230 are positioned at the corners of the optics block. Also, theoptics 222 for thelight sources 202 are on a different surface of the optics block 220 than theoptics 224 for thedetectors 204. The optics for both the light sources and the detectors may have the same design. Again,light sources 202 anddetectors 204 are on thesame substrate 206, and one of them may be monolithically integrated therein. Silicon tracks 208 andpads 208 for providing power and signals to and from the active elements are also on the substrate. -
FIG. 3 is a top view of atransceiver 300 in accordance with another embodiment of the present invention. InFIG. 3 , rather than having theactive elements FIG. 3 , fourlight sources 102 and fourdetectors 104 are in a line. The spacing therebetween reduces cross-talk between the active devices. Correspondingoptical elements substrate 106, thereby allowing the optics block 120 and thesubstrate 106 to share a common edge, which may facilitate manufacturing at the wafer level. - In any of the configurations, the components may be attached using wafer-to-wafer bonding techniques, as set forth, for example, in U.S. Pat. Nos. 6,096,155 and 6,104,690, commonly assigned, which are hereby incorporated by reference in their entirety for all purposes. Both of the above configurations allow the optics for both the transmitter portion and the receiver portion to be aligned simultaneously. As used herein, the term wafer is meant to generally refer to any structure having more than one component which is to be singulated, e.g., diced, for final use. The resultant wafer having a plurality of the transceivers thereon is then singulated, i.e., vertically separated, to form a plurality of transceivers.
- A particular example of wafer bonding all three substrates together before separating is shown in
FIG. 4 . By creatingspaces 340 between the sets ofoptical elements spaces 342 between thespacers 130 for each transceiver, e.g., by etching in silicon as shown, the individual transceivers may be realized by separating thesubstrate 106 containing thelight sources 102 anddetectors 304 at the appropriate points. As shown inFIG. 4 , thedetectors 304 are monolithically integrated into thesubstrate 106. Whichever active element to be provided on the substrate has the higher effective yield is preferably the monolithically integrated element, since the monolithically integrated elements will not be able to be substituted out. Further, the metalization required for the electrical connections for both the monolithically integrated element and the additional active element on the substrate are formed using the same mask set as that for forming the monolithically integrated element. This helps insure precise alignment, since the active element to be mounted can use its metalization to provide its alignment, e.g., by solder self-alignment. The active elements that are to be mounted on the substrate may then be tested before being mounted. After mounting, they may be tested again and replaced if required before the wafer bonding. As used herein, bonding may include any type of attachment, including the use of bonding materials, surface tension or directly forming on the same substrate. As used herein, separating or singulating may include any means for realizing individual components, e.g., dicing. - The alignment of the active elements to the input and output ports corresponding thereto, typically fibers, is particularly important. One configuration for insuring proper alignment between the transceiver and fibers is shown in
FIG. 5 . As can be seen inFIG. 5 , a plurality offibers 410 are inserted into aferrule 412. The active elements of the present invention, here the linear configuration as shown inFIG. 3 , which are to be in communication with thefibers 410, are preferably provided on a silicon bench or sub-mount 416, corresponding to thecommon substrate 106 inFIG. 3 . In turn, this silicon bench 416 is preferably provided on asubstrate 418. An optics block 420 provides at least one optical element between each opto-electronic device on the sub-mount 416 and acorresponding fiber 410. The optics block 420 is preferably spaced from the opto-electronic devices by aspacer 415. The optical elements preferably include elements which collimate, focus, homogenize or otherwise couple the light. Since the optics block has two surfaces, two optical elements may be provided thereon. Further, if required, additional optics blocks may be bonded to and spaced from the optics block 420 to provide additional surfaces, as with any of the previous transceiver configurations. - The
spacer 415 is then bonded, e.g., using solder or epoxy, into place on the bench 416. The bevels which can be seen on the interior surface of thespacer 415 simply arise when using silicon as the spacer and the hole therein is formed by wet etching silicon along its crystalline plane. While wet-etching is a simple way of forming the hole in the spacer, vertical side walls may be more advantageous, e.g., for load bearing. Substantially vertical side walls may be realized by dry etching silicon. Further, other materials such as ceramic, glass, plastic, may be used for thespacer 415. If thespacer 415 is transparent to wavelengths of interest, the hole therein may not be required. - Preferably, the alignment and bonding of the
spacer 415 and the optics block 420 occur on a wafer level, and then diced to form respective dies which are then aligned to the bench 416. The alignment of thespacer 415 is not very sensitive, i.e., the spacer just needs to be aligned so that it does not block light between the optics block 420 and the opto-electronic device. While aspacer 415 may be formed directly on the optics block 420 itself, the use of a separate spacer 15 allows larger vertical separation to be achieved. The use of a separate spacer is particularly advantageous when providing optical elements on a bottom surface of the optics block 20, since the processes for forming the optics and the spacer features interfere with each other. Finally, use of a separate spacer allows the sealing off of the opto-electronic device to be more readily and stably achieved. Such sealing protects the opto-electronic device from environmental factors, such as humidity. - A
mechanical interface 422 aligns the optics block 420, which is already aligned with the electro-optical devices, with thefibers 410. This may be achieved by the provision of alignment features on both themechanical interface 422 and theferrule 412 housing thefibers 410. In the particular example shown, these alignment features consist ofholes 424 in theferrule 412, which are already typically present for aligning the ferrule with other devices, andalignment holes 426 in themechanical interface 422. Once thesealignment holes - While the present invention is described herein with reference to illustrative embodiments for particular applications, it should be understood that the present invention is not limited thereto. Those having ordinary skill in the art and access to the teachings provided herein will recognize additional modifications, applications, and embodiments within the scope thereof and additional fields in which the invention would be of significant utility without undue experimentation. Thus, the scope of the invention should be determined by the appended claims and their legal equivalents, rather than by the examples given.
Claims (25)
1-22. (canceled)
23. An optical device, comprising:
a first substrate having top and bottom surfaces;
a second substrate having top and bottom surfaces;
a spacer substrate between a substantially planar portion of the top surface of the second substrate and a substantially planar of the bottom surface of the first substrate, the spacer substrate, the first substrate and the second substrate sealing an interior space between the top surface of the second substrate and the bottom surface of the first substrate;
an optoelectronic element within the interior space; and
an electrical interconnection extending from the optoelectronic element to outside the interior space.
24. The optical device as claimed in claim 23 , further comprising an optical element having optical power therein on a first surface of the top and bottom surfaces of the first and second substrates.
25. The optical device as claimed in claim 24 , wherein the optical element is within the interior space.
26. The optical device as claimed in claim 24 , wherein the optical element is a microlens.
27. The optical device as claimed in claim 24 , wherein the optical element is a refractive element.
28. The optical device as claimed in claim 24 , wherein the optical element is a diffractive element.
29. The optical device as claimed in claim 23 , wherein the electrical interconnection extends along at least one of the first, second and spacer substrates.
30. The optical device as claimed in claim 23 , wherein the top surface of the second substrate extends in at least one direction beyond the bottom surface of the first substrate.
31. The optical device as claimed in claim 23 , wherein the optoelectronic device is mounted on the first substrate.
32. The optical device as claimed in claim 31 , wherein the electrical interconnection includes a conductive via through the second substrate.
33. The optical device as claimed in claim 23 , wherein the optoelectronic device is mounted on the second substrate.
34. The optical device as claimed in claim 23 , wherein the electrical interconnection includes a conductive via through the second substrate.
35. The optical device as claimed in claim 23 , wherein at least one of the first and second substrates is silicon.
36. The optical device as claimed in claim 23 , wherein at least one of the first and second substrates is transparent.
37. The optical device as claimed in claim 23 , wherein the first, second and spacer substrates are secured having a plurality of optoelectronic elements.
38. The optical device as claimed in claim 37 , wherein each of the plurality of optoelectronic elements is within a corresponding interior space.
39. The optical device as claimed in claim 37 , wherein secured first, second and spacer substrates are vertically separated to form a plurality of optical devices.
40. The optical device as claimed in claim 23 , wherein the spacer substrate and one of the first and second substrates are secured having a plurality of at least portions of interior spaces.
41. The optical device as claimed in claim 40 , wherein secured spacer substrate and one of the first and second substrates have a plurality of interior spaces.
42. The optical device as claimed in claim 40 , wherein secured spacer substrate and one of the first and second substrates have a plurality of optoelectronic elements within corresponding interior spaces.
43. The optical device as claimed in claim 40 , wherein a plurality of another of the first and second substrates are secured to the secured spacer substrate and one of the first and second substrates.
44. The optical device as claimed in claim 43 , wherein secured first, second and spacer substrates are vertically separated to form a plurality of optical devices.
45. The optical device as claimed in claim 43 , wherein the another of the first and second substrates is substantially unaffected by the vertical separation.
46. The optical device as claimed in claim 43 , wherein the plurality of another of the first and second substrates has a plurality of optoelectronic elements thereon.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/651,525 US20070181781A1 (en) | 2001-03-06 | 2007-01-10 | Integrated optical transceiver |
US12/379,279 US7750289B2 (en) | 2000-03-06 | 2009-02-18 | Integrated optical device including an optoelectronic element and a sealing substrate with an optical element having optical power thereon |
US12/801,941 US20100272390A1 (en) | 2000-03-06 | 2010-07-02 | Integrated optical transceiver |
US13/285,706 US20120155798A1 (en) | 1999-10-14 | 2011-10-31 | Integrated optical device including substrates stacked along an optical axis thereof |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
USPCT/US01/07053 | 2001-03-06 | ||
PCT/US2001/007053 WO2001067144A2 (en) | 2000-03-06 | 2001-03-06 | Integrated optical transceiver and related methods |
US11/127,284 US7375315B2 (en) | 2001-03-06 | 2005-05-12 | Integrated optical transceiver and related methods |
US11/651,525 US20070181781A1 (en) | 2001-03-06 | 2007-01-10 | Integrated optical transceiver |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/127,284 Continuation US7375315B2 (en) | 1999-10-14 | 2005-05-12 | Integrated optical transceiver and related methods |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/379,279 Continuation US7750289B2 (en) | 1999-10-14 | 2009-02-18 | Integrated optical device including an optoelectronic element and a sealing substrate with an optical element having optical power thereon |
Publications (1)
Publication Number | Publication Date |
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US20070181781A1 true US20070181781A1 (en) | 2007-08-09 |
Family
ID=38333090
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
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US11/651,525 Abandoned US20070181781A1 (en) | 1999-10-14 | 2007-01-10 | Integrated optical transceiver |
US12/379,279 Expired - Fee Related US7750289B2 (en) | 1999-10-14 | 2009-02-18 | Integrated optical device including an optoelectronic element and a sealing substrate with an optical element having optical power thereon |
US12/801,941 Abandoned US20100272390A1 (en) | 1999-10-14 | 2010-07-02 | Integrated optical transceiver |
US13/285,706 Abandoned US20120155798A1 (en) | 1999-10-14 | 2011-10-31 | Integrated optical device including substrates stacked along an optical axis thereof |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
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US12/379,279 Expired - Fee Related US7750289B2 (en) | 1999-10-14 | 2009-02-18 | Integrated optical device including an optoelectronic element and a sealing substrate with an optical element having optical power thereon |
US12/801,941 Abandoned US20100272390A1 (en) | 1999-10-14 | 2010-07-02 | Integrated optical transceiver |
US13/285,706 Abandoned US20120155798A1 (en) | 1999-10-14 | 2011-10-31 | Integrated optical device including substrates stacked along an optical axis thereof |
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Cited By (1)
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US20180254264A1 (en) * | 2015-09-18 | 2018-09-06 | Osram Opto Semiconductors Gmbh | Light-emitting component and method for producing a light-emitting component |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US20070181781A1 (en) * | 2001-03-06 | 2007-08-09 | Digital Optics Corporation | Integrated optical transceiver |
US7773836B2 (en) * | 2005-12-14 | 2010-08-10 | Luxtera, Inc. | Integrated transceiver with lightpipe coupler |
US9813152B2 (en) * | 2004-01-14 | 2017-11-07 | Luxtera, Inc. | Method and system for optoelectronics transceivers integrated on a CMOS chip |
US9651749B1 (en) * | 2016-03-31 | 2017-05-16 | Tyco Electronics Svenska Holdings Ab | Interposer with opaque substrate |
EP4182747A1 (en) * | 2020-07-20 | 2023-05-24 | Apple Inc. | Photonic integrated circuits with controlled collapse chip connections |
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Also Published As
Publication number | Publication date |
---|---|
US7750289B2 (en) | 2010-07-06 |
US20120155798A1 (en) | 2012-06-21 |
US20100272390A1 (en) | 2010-10-28 |
US20090152450A1 (en) | 2009-06-18 |
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Owner name: FLIR SYSTEMS TRADING BELGIUM BVBA, BELGIUM Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:DIGITALOPTICS CORPORATION EAST;REEL/FRAME:032827/0362 Effective date: 20130808 |