US20080016679A1 - Covered conductor and heater formed therewith - Google Patents
Covered conductor and heater formed therewith Download PDFInfo
- Publication number
- US20080016679A1 US20080016679A1 US11/428,113 US42811306A US2008016679A1 US 20080016679 A1 US20080016679 A1 US 20080016679A1 US 42811306 A US42811306 A US 42811306A US 2008016679 A1 US2008016679 A1 US 2008016679A1
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- US
- United States
- Prior art keywords
- conductor
- covering
- substrate
- heater
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60N—SEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
- B60N2/00—Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles
- B60N2/56—Heating or ventilating devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60N—SEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
- B60N2/00—Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles
- B60N2/56—Heating or ventilating devices
- B60N2/5678—Heating or ventilating devices characterised by electrical systems
- B60N2/5685—Resistance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/54—Heating elements having the shape of rods or tubes flexible
- H05B3/56—Heating cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/014—Heaters using resistive wires or cables not provided for in H05B3/54
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/029—Heaters specially adapted for seat warmers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
Landscapes
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Chair Legs, Seat Parts, And Backrests (AREA)
Abstract
There is disclosed a conductor having a conductive element and a covering surrounding at least a portion of the conductive element Preferably, the covering has an inner portion and an outer portion formed of different materials such that the melting point of the inner portion is higher than the melting point of the outer portion. The conductor is particularly useful for forming heaters, which may be integrated into a seat of an automotive vehicle.
Description
- This application is a divisional of copending application Ser. No. 11/127,562, filed on May 12, 2005, which is a continuation of copending application Ser. No. 10/295,491 filed on Nov. 15, 2002, both of which are hereby incorporated by reference.
- The present invention relates generally to covered (e.g., coated) conductors and more particularly to covered conductors for use in heating systems of automotive vehicle seats or other articles of manufacture.
- For many years, industry has been concerned with designing improved conductors for various articles and applications. As an example, industry has designed conductors suitable for integration into heaters, which may be employed in seats of automotive vehicles for providing heat to passengers within those vehicles, In the interest of continuing such innovation, the present invention provides a conductor, which may be suitable for various applications, but which has found particular utility in heaters that may be integrated within seats of automotive vehicles.
- According to one aspect of the invention, there is disclosed a conductor and a method of forming the same. The conductor is formed by providing a conductive element and applying a coating to the conductive element. Typically, the coating includes at least a portion that has a relatively low melting point, According to one preferred embodiment, the conductor has an inner portion with a first melting point and an outer portion with a second melting point that is relatively low compared to the first melting point.
- According to another aspect of the invention there is provided a heater and a method of forming the same. The heater is formed by providing a conductor as described above and contacting that conductor with a substrate. During such contact, the relatively low melting point portion of the coating of the conductor is softened by heating and integrated with the substrate. Thereafter, the relatively low melting point portion of the coating is hardened by cooling thereby attaching the conductor to the substrate.
- According to still another aspect of the invention there is provided a seat for an automotive vehicle and a method of forming the same. The seat is formed by providing a heater as just described and integrating that heater into the seat.
- The features and inventive aspects of the present invention will become more apparent upon reading the following detailed description, claims and drawings, of which the following is a brief description:
-
FIG. 1 is a sectional view of a conductor in accordance with one exemplary aspect of the present invention; -
FIG. 2 is a sectional view of another exemplary conductor in accordance with the present invention; -
FIG. 2A is a sectional view of another alternative exemplary conductor in accordance with the present invention; -
FIG. 3 is a top view of one illustrative heater element useful in accordance with the present invention; and -
FIG. 4 is a partially cut away perspective view of a seat of an automotive vehicle seat assembly in accordance with an exemplary aspect of the present invention. - The present invention is predicated upon providing an improved coated conductor. It is contemplated that the conductor may be employed in a variety of articles of manufacture including, without limitation, electronic articles such as door panels. wheels, floormats, radios, televisions, calculators, computers or the like. The conductor, however, is particularly suitable for use in heaters and even more particularly, the conductor is suitable for use in heater systems of seats for use in automotive vehicles.
- According to one aspect, the conductor of the present invention is provided with a covering (e.g., a coating) wherein at least a portion of the covering is activatable (e.g., has a relatively low melting point). Advantageously, it is possible, although not necessarily required, that the portion of the covering that is activatable (e.g., has the relatively low melting point) may be activated (e.g., heated and softened) such that the softened portion can integrate itself with a substrate for attaching the conductor to the substrate. Upon cooling it will preferably re-harden and attach to the substrate.
- Referring to
FIG. 1 , there is illustrated a schematic diagram of aconductor 10 in accordance with one aspect of the present invention. Theconductor 10 includes aconductive element 12 and a covering 14 (e.g., a coating) disposed over at least a portion of theconductive element 12. As shown, thecovering 14 is in direct contact with asurface 20 of theconductive element 12, however, it is contemplated that one or more intermediate layers may be disposed between the covering 14 and theconductive element 12, over some or all of the conductive element. - As used herein, the term
conductive element 12 is used to refer to any medium capable of carrying an electrical charge, conducting heat or electricity or a combination thereof, Accordingly, theconductive element 12 may be provided in several different shapes, sizes, configurations or the like. As examples, theconductive element 12 may be provided as one or a plurality of plates, blocks, strands, tapes, sheets, weavings, deposited traces (e.g., electrochemically deposited traces, vapor deposited traces) of combinations thereof. The shape of the element may be straight, arcuate, planar, helical, woven, twisted, wound, contoured, geometric, combinations thereof or the like. Furthermore, it is contemplated that theconductive element 12 may be formed as a single component (e.g., as a single wire) or as multiple components (e.g., as a plurality of wires wound or twisted together, axially aligned, or otherwise integrated with each other). It is also contemplated that the conductive element may include a plurality of generally parallel spaced apart wires such as for ribbon cables or the like. - The conductive element may also be formed of a variety of materials. Such materials may include metals, plastics, polymeric materials, etastomers, glass and optical materials, organic materials, inorganic materials combinations thereof or the like. Exemplary metals, which may partially or fully compose the conductive element include, without limitation, copper, aluminum, silver, tin, tungsten, gold, platinum or the like. Exemplary polymeric materials, which may partially or fully compose the conductive element include conductive polymers such as polyaniline, conjugated polymers, doped polymers, combinations thereof or the like. In one embodiment, the conductive element may be provided as a polymeric material having a dispersion of metal or carbon black.
- The covering 14, like the
conductive element 12, may be formed in a variety of different shapes, sizes and configurations. Thus, the covering may be planar, contoured, continuous, discontinuous (e.g. intermittent, porous, or the like) or combinations thereof. Preferably, the covering 14 forms a layer upon theconductive element 12 wherein the layer has a substantially uniform thickness, however, a variable thickness is also contemplated within the scope of the present invention. - It is also contemplated that the coating is so formed relative to the conductive element that some of the material is disposed in the interstices of separate filaments of the conductive element.
- According to one embodiment, the covering 14 may be formed of a singular homogeneous material. For such an embodiment, the melting temperature of the homogeneous material is typically between about 40° C. or lower and about 275° C. or higher, more preferably it is between about 90° C. and about 180° C., even more preferably it is between about 110° C. and about 160° C.
- While one embodiment contemplates a homogeneous composition of the coating material throughout the covered conductor, generally, it is preferable for the covering 14 to vary in composition at locations across a section or along the covered conductor's length. As an example, the composition of the
covering 14 will exhibit a gradient across a portion of the covering 14 (e.g., from theconductive element 12 to anouter surface 28 of the covering 14). This can be achieved by introducing a gradient within a single coating layer. It may be achieved by employing a plurality of layers, each an individual substantially homogeneous layer, or having one or more non-homogeneous layers. - By way of example, referring to
FIG. 1 , one preferredcovering 14 is formed of afirst portion 34 and asecond portion 36 with both portions being formed of compositionally different materials. Preferably, the materials are selected of thefirst portion 34 does not substantially intermix with the material of asecond portion 36. As a result, each of theportions portions - While no particular thickness are required for the
portions portions inner portion 34 or the thickness of singular homogeneous covering is preferably between about 0.001 inches or lower and about 0.1 inches or higher, more preferably between about 0.005 inches and about 0.05 inches and even more preferably between about 0.0075 inches and about 0.025 inches. Exemplary thicknesses for theouter portion 36 are preferably between about 0.0001 inches or lower and about 0.03 inches or higher, more preferably between about 0.001 inches and about 0.01 inches and even more preferably between about 0.0025 inches and about 0.0075 inches. - In a preferred embodiment, the compositions of the
first portion 34 and thesecond portion 36 are such that the material of theinner portion 34 has a higher melting point than the material of theouter portion 36. For example, the melting point of theinner portion 34 is preferably between about 10° C. and about 200° C., more preferably between about 30° C. and about 150° C. and even more preferably between about 40° C. and about 120° C. greater than the melting point of theouter portion 36. - The actual melting point of the
inner portion 34 is preferably between about 80° C. or lower and about 400° C. or higher, more preferably between about 110° C. and about 330° C., even more preferably between about 170° C. and about 275° C. The actual melting point of theouter portion 36 is preferably between about 40° C. or lower and about 275° C. or higher, more preferably between about 90° C. and about 180° C., even more preferably between about 110° C. and about 160° C. - The covering 14 is preferably formed of one or more polymeric materials, which may include plastics, thermoptastics, elastomers: combinations thereof or the like. Exemplary materials include without limitation, silicon, polytetrafluoroethylene (PTFE), polvinylchloride (PVC) polypropylene, high density polyethylene (HDPE), low density polyethylene (LDPE), fluorinated or chlorinated polyethylene. fluoroethylene propylene, polyfluoroethylen (PFE), combinations thereof or the like. It is contemplated that the materials mentioned or combinations thereof may be used as the material for a singular material homogeneous covering or a non-homogeneous covering (e.g., a covering having two or more substantially separate portions).
- Referring to
FIG. 2 , there is illustrated oneexemplary conductor 50 formed in accordance with an aspect of the present invention. InFIG. 2 , theconductor 50 is a wire that is illustrated in cross-section, Theconductor 50 includes aconductive element 52 that is comprised of a plurality (e.g., six) ofmetal strands 54 assembled together. Optionally the strands may be assembled about aninsert 56, which is formed of KEVLAR® or another material, Theconductive element 52 is substantially entirely surrounded by acovering 58. In the embodiment depicted, the covering 58 includes aninner portion 60, which is generally annular and substantially entirely surrounds theconductive element 52. The covering 58 further includes anouter portion 64 substantially entirely surrounding theinner portion 60 and theconductive element 52. In the embodiment illustrated, theinner portion 60 directly contacts theconductive element 52 and theouter portion 64 directly contacts theinner portion 60 although such is not necessarily required. - In the exemplary embodiment, the
inner portion 60 of the covering 58 is formed of fluoroethylene propylene and is about 0.005 inches thick and has a melting temperature between about 185° C. and about 215° C. Theouter portion 64 of the covering 58 is formed of polyethylene and is about 0.010 inches thick and has a melting temperature between about 90° C. and about 115° C. Thestrands 54 of theconductive element 52 are thirty eight gage and are formed of a tin/copper material with a resistance of about 0.32 ohms. Moreover, the final outside diameter of theconductive element 52 is about 0.0365 inches. - Referring to
FIG. 2 (a), there is illustrated another exemplary embodiment of aconductor 70 in accordance with the present invention. As shown theconductor 70 ofFIG. 2 (a) includes the sameconductive element 52 as theconductor 50 ofFIG. 2 . However, theconductor 70 includes a covering 72 formed of a singular homogeneous material. In particular, theentire covering 72 is formed of the polyethylene material that is used to form theouter portion 64 of theconductor 50 ofFIG. 2 (a). - Manufacture of the conductor of the present invention typically includes application of the covering to the conductive element. The skilled artisan will recognize that many techniques may be employed for applying the covering to the conductive element. For instance, the covering may be brushed, dabbed, painted, poured, pressed, extruded or otherwise placed upon the conductive element to partially or substantially fully cover or coat the conductive element. Alternatively, it is contemplated that the conductive element may be submerged in a bath of substantially molten covering material. Moreover, for conductors with covering having multiple portions of different materials, it is contemplated that the covering may be applied in stages (e.g., application of one material to form a first portion followed by application of a second different material to form a second portion).
- For forming the embodiment of
FIG. 2 , theconductive element 52 may be passed through an extruder such that the extruder coats theconductive element 52 with molten material of theinner portion 60 followed by allowing the molten material to cool, cure, harden or a combination thereof for forming theinner portion 60. Thereafter, theconductive element 52 and theinner portion 60 may be passed together through either the original extruder or another extruder such that one of these extruders coats theinner portion 60 with molten material of theouter portion 64 followed by allowing the molten material to cool, cure, harden or a combination thereof for forming thesecond portion 64. - As previously discussed, it is contemplated that the conductor of the present invention may be employed in a variety of articles of manufacture and may operate in a variety of capacities. The conductor of the present invention, however, has found particular utility for use in heaters. According to one embodiment, the conductor is attached to a substrate for forming a heater or at least a portion thereof.
- The conductor may be attached to a wide variety of substrates for forming a heater and the type of substrate will often depend upon the type of heater desired. Exemplary substrates include fabrics, panels, members, combinations thereof or the like. Moreover, various materials may be employed for forming the substrate. For example, the substrate may be formed of fibrous materials, polymeric materials, metals, combinations thereof or the like. In preferred embodiments. the substrate is formed of a fleece material, a gauze material a felt material or combinations thereof.
- For attaching the conductor to the substrate, various attachments may be employed such as adhesives, fasteners, combinations thereof or the like. It is also contemplated that the conductor may be interferingly attached to the substrate such as by interweaving the conductor with the substrate. As yet another alternative. a portion of the covering of the conductor may activate (e.g., soften or melt) and adhere itself to or integrate itself with the substrate. For example, the temperature of the covering of the conductor may be elevated by heating the covering such that one or more portions (e.g., the portions having lower melting points) are softened for allowing the covering to integrate itself with the substrate followed by lowering the temperature of the covering such that the covering hardens and attaches itself and the conductor to the substrate.
- As an example, it is contemplated that a heated member (e.g., a heated plate) may be contacted with the substrate of the heater while the substrate is contacted with the conductor. In turn the heated member conveys energy to the substrate, which conveys energy to the covering thereby softening the covering. In this manner, the softened covering is integrated with the substrate followed by lowering the temperature of the covering such that the covering hardens and attaches itself and the conductor to the substrate.
- Referring to
FIG. 3 , there is illustrated anexemplary heater 80 formed in accordance with an aspect of the present invention, For forming theheater 80, asubstrate 82 is provided and a conductor it attached thereto. For exemplary purposes, theconductor 50 ofFIG. 2 has been attached to thesubstrate 82 although, it shall be understood that any of the conductors discussed herein may also be used. - The
substrate 82 is preferably a fabric material that is provided as a sheet or panel. Preferred fabric materials include fleece materials, felt materials, combinations thereof or the like, Theconductor 50 is then arranged (e.g., patterned) upon thesubstrate 82 in a desired configuration. InFIG. 2 , theconductor 50 is patterned in a serpentine manner and forms two undulatingpathways 86 that are in a lateral or side-by-side relationship with each other. It shall be understood, however, that theconductor 50 may be patterned upon thesubstrate 82 in a myriad of configurations within the scope of the present invention. - For attaching the
conductor 50 to thesubstrate 82, energy (e.g., heat) is preferably applied to the covering 58 of theconductor 50 for heating and at least partially softening (e.g., melting at least theouter portion 64 of the covering 58 and preferably substantially only theouter portion 64 of thecovering 58. Although, such energy may be applied according to different techniques, it is preferable for the particular example shown that such energy be applied by flowing an electrical current through theconductive element 52 for heating the element and thecovering 58. - As the
outer portion 64 of the covering 58 softens, theportion 64 preferably integrates itself with thesubstrate 82 such as by flowing into thesubstrate 82, wetting a portion or surface of thesubstrate 82, combinations thereof or the like. After integration of theouter portion 64 of the covering 58 with thesubstrate 82, theportion 64 of the covering 58 is preferably allowed to cool and harden (e.g., solidify) thereby attaching (e.g., adhering) theconductor 52 to thesubstrate 82 for forming theheater 80. If desired, a plate or other member may be employed to place pressure or force upon thesubstrate 82, theconductor 50 or both for urging thesubstrate 82 andconductor 50 into more intimate contact during integration of the covering 58 with thesubstrate 82. - Advantageously for the conductor of
FIG. 2 , the melting point of theinner portion 60 of theconductor 50 is typically higher than the melting point of theouter portion 64 of theconductor 50 such that the heating of the covering 58 only substantially softens theouter portion 64 of theconductor 50 without substantially softening theinner portion 60. This allows theouter portion 64 of theconductor 50 to attach to the substrate without risking substantial repositioning or other damage of theconductive element 52, theinner portion 60 or both. - It should be understood that while use of materials with pre-selected melting points is one preferred method of providing a covering that will attach itself to a substrate, it is also contemplated that other methods may be employed as well. In particular, it is contemplated that a covering may be configured to activate (e.g., soften) and integrate itself within a substrate by various methods. For example, a covering may be activated by exposure to a condition such as heat, pressure, moisture, heat or the like to chemically or otherwise physically activate or soften.
- Vehicle Seat
- With regard to heaters formed with the conductor of the present invention, it has been found that heaters such as the
heater 80 ofFIG. 3 are particularly suitable for integration to seats of automotive vehicles. Of course, conductors and heaters formed according to the present invention find utility in other articles of manufacture such as boats. furniture or the like as well. - A heater according to the present invention may be located in various portions of an automotive vehicle seat such as a support portion, a backrest portion, a shoulder support portion or a headrest. The heater may be located between the trim of the seat and the foam cushioning of the seat. The heater may also be integrated into the trim of the seat, the foam cushioning of the seat or both.
- Referring to
FIG. 4 , a seat 90 of an automotive vehicle is illustrated wherein theheater 80 ofFIG. 3 has been placed in both aseat backrest component 92 and aseat support component 94. In the embodiment illustrated, eachcomponent trim layer 96 and afoam cushion 98 and each of theheaters 70 is positioned substantially between thefoam cushion 98 andtrim layer 96. Preferably, eachheater 70 is fastened to the seat 90 (e.g., thetrim layer 96, thecushion 98 or both) for maintaining theheater 80 stationary relative to the seat 90. - In operation, a temperature regulation unit may be employed in conjunction with the
heater 80. For example, a temperature regulation unit may include a controller and a thermostat configured for maintaining desired temperatures during heating. - Unless stated otherwise, dimensions and geometries of the various structures depicted herein are not intended to be restrictive of the invention, and other dimensions or geometries are possible. Plural structural components can be provided by a single integrated structure. Alternatively, a single integrated structure might be divided into separate plural components. In addition, while a feature of the present invention may have been described in the context of only one of the illustrated embodiments, such feature may be combined with one or more other features of other embodiments, for any given application. It will also be appreciated from the above that the fabrication of the unique structures herein and the operation thereof also constitute methods in accordance with the present invention.
- The preferred embodiment of the present invention has been disclosed. A person of ordinary skill in the art would realize however, that certain modifications would come within the teachings of this invention. Therefore, the following claims should be studied to determine the true scope and content of the invention.
Claims (20)
1. A method of manufacturing a heater comprising:
applying a covering around a conductor by extruding, brushing, dabbing, painting, pouring, pressing the covering onto the conductor or submerging the conductor in a bath;
patterning the covered conductor on at least one surface of a substrate; and activating the covering to attach the covered conductor to the substrate to form a heater.
2. The method of claim 1 wherein the activating step comprises applying heat to the covered conductor.
3 The method of claim 2 wherein the activating step comprises energizing the conductor to emit sufficient heat to activate the covering.
4. The method of claim 1 wherein the applying step further comprises extruding the covering around the conductor,
5. The method of claim 4 wherein the patterning step further comprises patterning the covered conductor on a fabric substrate selected from the group consisting of fleece, gauze and felt.
6. The method of claim 3 wherein the applying step further comprises applying a covering with a melting temperature gradient.
7. The method of claim 3 wherein the applying step further comprises applying a covering with an inner portion and an outer portion, wherein the portion have differing melting temperatures.
8. The method of claim 7 wherein the portions differ in melting temperature by at least 40° C.
9. The method of claim 1 further comprising attaching the covering attached substrate to a seat cushion, a trim cover or combinations thereof.
10. A method of manufacturing a heater consisting essentially of: patterning a conductor with a covering on at least one surface of a substrate; activating the covering to attach the conductor to the substrate to form a heater; incorporating the heater into a vehicle seat.
11. The method of claim 10 further consisting essentially of applying the covering around the conductor by extruding, brushing dabbing, painting, pouring, pressing the covering onto the conductor or submerging the conductor in a bath;
12. The method of claim 1I1 further consisting essentially of extruding the covering around the conductor.
13. The method of claim 1 0 wherein the activating step comprises applying heat to the covered conductor.
14. The method of claim 13 wherein the activating step comprises energizing the conductor to emit sufficient heat to activate the covering.
15. A method of manufacturing a heater comprising:
patterning a conductor with a covering on a substrate followed substantially immediately by
attaching the covered conductor to the substrate to form a heater by activating the covering.
16. The method of claim 15 wherein the attaching step comprises heat activating the covering to attach the conductor to the substrate,
17. The method of claim 16 wherein the attaching step comprises energizing the conductor to emit sufficient heat to melt the covering,
18. The method of claim 17 further comprising incorporating the heater into a vehicle seat.
19. The method of claim 15 further comprising applying to the conductor with a covering having an inner portion and an outer portion, wherein the portion have differing melting temperatures.
20. The method of claim 15 further comprising extruding a covering around the conductor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/428,113 US20080016679A1 (en) | 2002-11-15 | 2006-06-30 | Covered conductor and heater formed therewith |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/295,491 US7223948B2 (en) | 2002-11-15 | 2002-11-15 | Covered conductor and heater formed therewith |
US11/127,562 US7141760B2 (en) | 2002-11-15 | 2005-05-12 | Covered conductor and heater formed therewith |
US11/428,113 US20080016679A1 (en) | 2002-11-15 | 2006-06-30 | Covered conductor and heater formed therewith |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/127,562 Division US7141760B2 (en) | 2002-11-15 | 2005-05-12 | Covered conductor and heater formed therewith |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080016679A1 true US20080016679A1 (en) | 2008-01-24 |
Family
ID=32297216
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/295,491 Active 2024-10-05 US7223948B2 (en) | 2002-11-15 | 2002-11-15 | Covered conductor and heater formed therewith |
US11/127,562 Expired - Lifetime US7141760B2 (en) | 2002-11-15 | 2005-05-12 | Covered conductor and heater formed therewith |
US11/428,113 Abandoned US20080016679A1 (en) | 2002-11-15 | 2006-06-30 | Covered conductor and heater formed therewith |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/295,491 Active 2024-10-05 US7223948B2 (en) | 2002-11-15 | 2002-11-15 | Covered conductor and heater formed therewith |
US11/127,562 Expired - Lifetime US7141760B2 (en) | 2002-11-15 | 2005-05-12 | Covered conductor and heater formed therewith |
Country Status (8)
Country | Link |
---|---|
US (3) | US7223948B2 (en) |
JP (1) | JP4118878B2 (en) |
KR (1) | KR20050086672A (en) |
CN (1) | CN1711185A (en) |
AU (1) | AU2003288086A1 (en) |
CA (1) | CA2505739C (en) |
DE (1) | DE10393741B4 (en) |
WO (1) | WO2004045901A1 (en) |
Cited By (1)
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US11457512B2 (en) | 2017-07-26 | 2022-09-27 | Kurabe Industrial Co., Ltd. | Cord-shaped heater, sheet-shaped heater and manufacturing method of sheet-shaped heater |
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US7306283B2 (en) | 2002-11-21 | 2007-12-11 | W.E.T. Automotive Systems Ag | Heater for an automotive vehicle and method of forming same |
WO2005089019A2 (en) * | 2004-03-08 | 2005-09-22 | W.E.T. Automotive Systems Ag | Flat heating element |
DE102005029617A1 (en) * | 2004-07-28 | 2006-03-23 | W.E.T. Automotive Systems Ag | Electrically conductive textile |
CA2528840A1 (en) * | 2004-12-08 | 2006-06-08 | W.E.T. Automotive Group, Ag | Bezel for heated handle |
US20060180583A1 (en) * | 2005-02-03 | 2006-08-17 | W.E.T. Automotive Group Ag | Glasses temperature regulation device |
US7827805B2 (en) | 2005-03-23 | 2010-11-09 | Amerigon Incorporated | Seat climate control system |
US20060214480A1 (en) * | 2005-03-23 | 2006-09-28 | John Terech | Vehicle seat with thermal elements |
US20090014437A1 (en) * | 2006-03-03 | 2009-01-15 | Nv Bekaert Sa | Glass-coated metallic filament cables for use in electrical heatable textiles |
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Also Published As
Publication number | Publication date |
---|---|
DE10393741T5 (en) | 2005-11-17 |
US20040094534A1 (en) | 2004-05-20 |
US20050199611A1 (en) | 2005-09-15 |
CA2505739A1 (en) | 2004-06-03 |
WO2004045901A1 (en) | 2004-06-03 |
CA2505739C (en) | 2008-12-30 |
JP4118878B2 (en) | 2008-07-16 |
KR20050086672A (en) | 2005-08-30 |
AU2003288086A1 (en) | 2004-06-15 |
US7223948B2 (en) | 2007-05-29 |
CN1711185A (en) | 2005-12-21 |
JP2006506784A (en) | 2006-02-23 |
US7141760B2 (en) | 2006-11-28 |
DE10393741B4 (en) | 2008-02-14 |
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