US20080057838A1 - Photoresist stripping apparatus and internal air circulating system thereof - Google Patents
Photoresist stripping apparatus and internal air circulating system thereof Download PDFInfo
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- US20080057838A1 US20080057838A1 US11/899,194 US89919407A US2008057838A1 US 20080057838 A1 US20080057838 A1 US 20080057838A1 US 89919407 A US89919407 A US 89919407A US 2008057838 A1 US2008057838 A1 US 2008057838A1
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- Prior art keywords
- air
- chamber
- set forth
- chambers
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/28—Splitting layers from work; Mutually separating layers by cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/18—Perforating by slitting, i.e. forming cuts closed at their ends without removal of material
Definitions
- the present invention relates to a photoresist stripping apparatus and, more particularly, to a photoresist stripping apparatus provided with an internal air circulating system.
- TFTs Thin-Film Transistors
- photoresists are used to define a configuration of the TFTs on a glass substrate. Then the photoresists are removed by using solvents such as Monoethanolamine (MEA), butoxydiglycol (BDG), N-Methyl-Pyrolidinone (NMP), etc.
- MEA Monoethanolamine
- BDG butoxydiglycol
- NMP N-Methyl-Pyrolidinone
- This removing process is known as a photoresist stripping process, and further includes steps of cleaning away the solvents, rinsing inter-media on the glass substrate with Isophorone (IPO) or Dimethyl Sulfoxide (DMSO), cleaning the glass substrate with water, and drying the glass substrate.
- Isophorone IP
- DMSO Dimethyl Sulfoxide
- a typical photoresist stripping apparatus usually has several reaction chambers connected one after another, and these chambers perform the above-mentioned steps respectively. Since these chambers are similar in structure, illustration of the photoresist stripping apparatus can be simplified by referring to only one such reaction chamber, such as that shown in FIG. 3 .
- one reaction chamber 11 of a photoresist stripping apparatus 10 has an inlet 12 , an outlet 13 , an exhaust port 21 , a transmitting mechanism 14 , a plurality of nozzles 15 , and four air knives 16 a, 16 b, 16 c, and 16 d.
- the air knives 16 a ⁇ 16 d are provided inside the reaction chamber 11 .
- the air knives 16 c and 16 d are positioned vertically at both sides of the inlet 12
- the air knives 16 a and 16 b are positioned vertically at both sides of the outlet 13 .
- All the air knives 16 a ⁇ 16 d communicate with an air supply pipe 19 , which in turn is connected with a plant system (not shown) and a pressure reducing device 20 .
- the transmitting mechanism 14 is inside the reaction chamber 11 , between the inlet 12 and outlet 13 .
- the transmitting mechanism 14 is for moving a glass substrate 100 into the reaction chamber 11 via the inlet 12 and out of the reaction chamber 11 via the outlet 13 .
- the nozzles 15 are located above the transmitting mechanism 14 .
- the nozzles 15 communicate with a cleaning fluid supply pipe 17 , which in turn is connected with the plant system and a pump 18 .
- the exhaust port 21 extends from an inner wall of the reaction chamber 11 and communicates with a pipe 22 and a pump 23 of the plant system, such that the pump 23 can extract and exhaust air inside the reaction chamber 11 .
- a cleaning fluid such as solvent or water or a combination thereof, originates from the plant system.
- the cleaning fluid is compressed by the pump 18 and then delivered into the reaction chamber 11 via the cleaning fluid supply pipe 17 .
- the cleaning fluid is then sprayed directly over the glass substrate 100 via the nozzles 15 to remove photoresist or particles on the glass substrate 100 .
- clean dry air (CDA) originating from the plant system is pressure regulated by the pressure reducing device 20 , and serves as an air source of the air knives 16 a ⁇ 16 d.
- the CDA passes through the air supply pipe 19 and blows upper and lower surfaces of the moving glass substrate 100 via the air knives 16 a ⁇ 16 d. Thereby, cleaning fluid remaining on the glass substrate 100 is removed, and the cleaning fluid is prevented from vaporizing into the surrounding environment.
- the apparatus includes a chamber, a plurality of air guiding means provided inside the chamber, a pump for extracting air inside the chamber, and a pipe for circulating and feeding the extracted air back into the chamber.
- the extracted air blows upper and lower surfaces of the substrate via the air guiding means.
- the chamber includes an inlet, an outlet, and a transmitting mechanism provided between the inlet and outlet for moving the substrate.
- the chamber basically includes a plurality of nozzles above the transmitting mechanism for spraying cleaning fluid, such as solvent or water or combination thereof, over the substrate to remove photoresist or particles on the substrate.
- the chamber includes an opening communicating with the pump and the circulating pipe.
- the opening is provided above the chamber and near the outlet.
- the chamber still further includes an air feeding unit for supplying CDA and an air exhaust unit for exhausting air inside the chamber to keep a constant negative pressure condition inside the chamber.
- FIG. 1 is a plan view of one reaction chamber of a photoresist stripping apparatus according to a first embodiment of the present invention.
- FIG. 2 is a plan view of two reaction chambers of a photoresist stripping apparatus according to a second embodiment of the present invention.
- FIG. 3 is a plan view of one reaction chamber of a conventional photoresist stripping apparatus.
- the air knives 43 a ⁇ 43 d are disposed inside the reaction chamber 31 .
- the air knives 43 c and 43 d are set vertically at both sides of the inlet 32
- the air knives 43 a and 43 b are set vertically at both sides of the outlet 33 .
- the internal air circulating system 40 is independent of an air feeding pipe 49 (see below), which air feeding pipe 49 is connected with a plant system.
- the inlet 32 and the outlet 33 are an entrance and an exit for a substrate 200 , respectively.
- the substrate 200 is a glass substrate.
- Each of the inlet 32 and outlet 33 can be closed by a movable gate to seal the reaction chamber 31 when necessary.
- the transmitting mechanism 34 is inside the reaction chamber 31 between the inlet 32 and outlet 33 , so that the substrate 200 can be moved into the reaction chamber 31 via the inlet 32 and out of the reaction chamber 31 via the outlet 33 .
- the nozzles 35 are above the transmitting mechanism 34 , and communicate with a pipe 36 , a pressure pump 38 , and a cleaning fluid storing tank 37 .
- the air suction port 44 and the air exhaust port 45 are located in a top inner wall of the reaction chamber 31 , while the air feeding port 48 is located in a bottom inner wall of the reaction chamber 31 .
- the air suction port 44 is an opening communicating with the extraction pump 41 and the circulating pipe 42 .
- the air exhaust port 45 communicates with a pipe 46 and an exhaust unit 47 of the plant system.
- the exhaust unit 47 includes an extraction pump for extracting and exhausting air inside the reaction chamber 31 , such that the reaction chamber 31 is always under a constant negative pressure condition.
- the air feeding port 48 communicates with the air feeding pipe 49 and an air feeding unit 50 .
- the air feeding unit 50 includes a pressure reducing device or an airflow controlling device for regulating pressure of CDA supplied from the plant system.
- a cleaning fluid such as solvent or water or a combination thereof, originates from the tank 37 .
- the cleaning fluid can be compressed by the pressure pump 38 and then delivered to the reaction chamber 31 .
- the cleaning fluid sprays directly over the substrate 200 through the nozzles 35 to remove photoresist or particles on the substrate 200 .
- the air inside the reaction chamber 31 is extracted and properly pressurized by the extraction pump 41 and fed back to the reaction chamber 31 through the circulating pipe 42 and the air knives 43 a ⁇ 43 d.
- the circulated air therefore passes through the air knives 43 a ⁇ 43 d and blows upper and lower surfaces of the moving substrate 200 to remove the cleaning fluid on the substrate 200 and prevent the cleaning fluid from vaporizing into the surrounding environment.
- CDA supplied from the plant system is regulated in pressure by the air feeding unit 50 and delivered to the reaction chamber 31 via the air feeding pipe 49 and the air feeding port 48 . This process is called air refreshing.
- the air suction port 44 is provided above the reaction chamber 31 and near the outlet 33 such that the local region around the outlet 33 is under a stronger negative pressure condition. The purpose is to shorten the path for circulating air near the outlet 33 and avoid any leakage of air containing vaporized cleaning fluid from the outlet 33 .
- each of the reaction chambers 31 a and 31 b is similar in structure to the reaction chamber 31 of the first embodiment.
- each reaction chamber 31 a, 31 b includes an internal air circulating system 40 a / 40 b independent of a plant system.
- the internal air circulating system 40 a / 40 b includes an extraction pump 41 a / 41 b, a circulating pipe 42 a / 42 b and air guiding means such as four air knives 431 a / 432 a, 431 b / 432 b, 431 c / 432 c, and 431 d / 432 d.
- air knives 431 a / 432 a, 431 b / 432 b, 431 c / 432 c, and 431 d / 432 d are examples of the structure of the reaction chambers 31 a and 31 b.
- the reaction chambers 31 a and 31 b are connected in series so that the outlet 33 a of the reaction chamber 31 a and the inlet 32 b of the reaction chamber 31 b communicate with each other.
- the transmitting mechanism 34 is provided at a constant level inside the reaction chambers 31 a and 31 b and between the inlet 32 a and the outlet 33 b, for moving a substrate 300 into and out of the reaction chambers 31 a and 31 b via the inlets 32 a and 32 b and the outlets 33 a and 33 b.
- the substrate 300 is a glass substrate.
- the nozzles 35 a and 35 b above the transmitting mechanism 34 communicate with pipes 36 a and 36 b, pressure pumps 38 a and 38 b, and cleaning fluid storing tanks 37 a and 37 b, respectively.
- the photoresist stripping apparatus 60 further includes an air feeding unit 61 and an air exhaust unit 62 .
- the air feeding unit 61 includes pressure reducing devices or airflow controlling devices 50 a and 50 b for regulating pressure of CDA supplied from the plant system.
- the air exhaust unit 62 can include a single extraction pump (not shown) for both reaction chambers 31 a and 31 b.
- the air exhaust unit 62 can include respective extraction pumps 47 a and 47 b for each reaction chamber 31 a and 31 b to extract and exhaust air inside the reaction chambers 31 a and 31 b such that the reaction chambers 31 a and 31 b are always under a constant negative pressure condition.
- each of the reaction chambers 31 a and 31 b is supplied with CDA from the plant system via the air feeding unit 61 to accomplish air refreshing.
- the CDA is pressure regulated by the pressure reducing devices or airflow controlling devices 50 a and 50 b of the air feeding unit 61 .
- the photoresist stripping apparatus employs an internal air circulating system for each reaction chamber.
- the internal air circulating system independently extracts the air inside each reaction chamber, and the extracted air is fed back and serves as an air source for the air knives. Further, the negative pressure of each reaction chamber is achieved directly by extracting the air inside the reaction chambers via an air exhaust unit.
- the amount of CDA supplied from the plant system can be substantially economized, and the loading on the air exhaust unit 62 can be mitigated. Accordingly, the operation cost of the plant system can be lowered.
Abstract
Description
- The present invention relates to a photoresist stripping apparatus and, more particularly, to a photoresist stripping apparatus provided with an internal air circulating system.
- In fabrication of Thin-Film Transistors (TFTs) for a liquid crystal display, photoresists are used to define a configuration of the TFTs on a glass substrate. Then the photoresists are removed by using solvents such as Monoethanolamine (MEA), butoxydiglycol (BDG), N-Methyl-Pyrolidinone (NMP), etc. This removing process is known as a photoresist stripping process, and further includes steps of cleaning away the solvents, rinsing inter-media on the glass substrate with Isophorone (IPO) or Dimethyl Sulfoxide (DMSO), cleaning the glass substrate with water, and drying the glass substrate.
- A typical photoresist stripping apparatus usually has several reaction chambers connected one after another, and these chambers perform the above-mentioned steps respectively. Since these chambers are similar in structure, illustration of the photoresist stripping apparatus can be simplified by referring to only one such reaction chamber, such as that shown in
FIG. 3 . - Referring to
FIG. 3 , onereaction chamber 11 of aphotoresist stripping apparatus 10 has aninlet 12, anoutlet 13, an exhaust port 21, atransmitting mechanism 14, a plurality ofnozzles 15, and fourair knives reaction chamber 11. In particular, theair knives inlet 12, while the air knives 16 a and 16 b are positioned vertically at both sides of theoutlet 13. All the air knives 16 a˜16 d communicate with anair supply pipe 19, which in turn is connected with a plant system (not shown) and apressure reducing device 20. - The
transmitting mechanism 14 is inside thereaction chamber 11, between theinlet 12 andoutlet 13. Thetransmitting mechanism 14 is for moving aglass substrate 100 into thereaction chamber 11 via theinlet 12 and out of thereaction chamber 11 via theoutlet 13. Thenozzles 15 are located above thetransmitting mechanism 14. Thenozzles 15 communicate with a cleaningfluid supply pipe 17, which in turn is connected with the plant system and apump 18. The exhaust port 21 extends from an inner wall of thereaction chamber 11 and communicates with a pipe 22 and apump 23 of the plant system, such that thepump 23 can extract and exhaust air inside thereaction chamber 11. - A cleaning fluid, such as solvent or water or a combination thereof, originates from the plant system. The cleaning fluid is compressed by the
pump 18 and then delivered into thereaction chamber 11 via the cleaningfluid supply pipe 17. The cleaning fluid is then sprayed directly over theglass substrate 100 via thenozzles 15 to remove photoresist or particles on theglass substrate 100. Subsequently, clean dry air (CDA) originating from the plant system is pressure regulated by thepressure reducing device 20, and serves as an air source of the air knives 16 a˜16 d. The CDA passes through theair supply pipe 19 and blows upper and lower surfaces of the movingglass substrate 100 via the air knives 16 a˜16 d. Thereby, cleaning fluid remaining on theglass substrate 100 is removed, and the cleaning fluid is prevented from vaporizing into the surrounding environment. - Complete removal of liquid remaining on the
glass substrate 100 usually requires a plant system to provide a lot of CDA and keep the output pressure of the air knives 16 a˜16 d at a constant value. Further, thepump 23 is required to have a larger displacement than the amount of CDA supplied from the air knives 16 a˜16 d, so that thereaction chamber 11 is always under a negative pressure condition. This imposes a heavy loading on thepump 23, which may in turn elevate the cost of operating the plant system. - What is needed is a system that provides a solution to the above-mentioned problems.
- An exemplary apparatus for stripping photoresists from a substrate is provided. The apparatus includes a chamber, a plurality of air guiding means provided inside the chamber, a pump for extracting air inside the chamber, and a pipe for circulating and feeding the extracted air back into the chamber. The extracted air blows upper and lower surfaces of the substrate via the air guiding means.
- Basically, the chamber includes an inlet, an outlet, and a transmitting mechanism provided between the inlet and outlet for moving the substrate. Besides, the chamber basically includes a plurality of nozzles above the transmitting mechanism for spraying cleaning fluid, such as solvent or water or combination thereof, over the substrate to remove photoresist or particles on the substrate.
- Furthermore, the chamber includes an opening communicating with the pump and the circulating pipe. Preferably, the opening is provided above the chamber and near the outlet.
- The chamber still further includes an air feeding unit for supplying CDA and an air exhaust unit for exhausting air inside the chamber to keep a constant negative pressure condition inside the chamber.
- Various embodiments of the present invention can be more fully understood by reading the subsequent detailed description and examples with reference made to the accompanying drawings. In the drawings, all the views are schematic, and at least certain of the drawings are simplified.
-
FIG. 1 is a plan view of one reaction chamber of a photoresist stripping apparatus according to a first embodiment of the present invention. -
FIG. 2 is a plan view of two reaction chambers of a photoresist stripping apparatus according to a second embodiment of the present invention. -
FIG. 3 is a plan view of one reaction chamber of a conventional photoresist stripping apparatus. - A photoresist stripping apparatus according to various embodiments of the present invention includes a plurality of reaction chambers. Typically, there are several reaction chambers for performing steps of solvent cleaning, inter-media rinsing, water cleaning, and drying, respectively. These reaction chambers are similar in structure and connected one after another. In the following description and the drawings, for simplicity, only one reaction chamber of a first embodiment and two connected reaction chambers of a second embodiment are detailed and illustrated.
- Referring to
FIG. 1 , onereaction chamber 31 of aphotoresist stripping apparatus 30 of a first embodiment of the present invention is shown. Thereaction chamber 31 includes aninlet 32, anoutlet 33, atransmitting mechanism 34, a plurality ofnozzles 35, anair suction port 44, anair exhaust port 45, anair feeding port 48, and an internalair circulating system 40. The internalair circulating system 40 includes anextraction pump 41, a circulatingpipe 42, and a plurality of air guiding means such as fourair knives air knives 43 a˜43 d communicate with theextraction pump 41 via the circulatingpipe 42. Theair knives 43 a˜43 d are disposed inside thereaction chamber 31. Theair knives inlet 32, while the air knives 43 a and 43 b are set vertically at both sides of theoutlet 33. The internalair circulating system 40 is independent of an air feeding pipe 49 (see below), whichair feeding pipe 49 is connected with a plant system. - The
inlet 32 and theoutlet 33 are an entrance and an exit for asubstrate 200, respectively. Typically, thesubstrate 200 is a glass substrate. Each of theinlet 32 andoutlet 33 can be closed by a movable gate to seal thereaction chamber 31 when necessary. Thetransmitting mechanism 34 is inside thereaction chamber 31 between theinlet 32 andoutlet 33, so that thesubstrate 200 can be moved into thereaction chamber 31 via theinlet 32 and out of thereaction chamber 31 via theoutlet 33. Thenozzles 35 are above thetransmitting mechanism 34, and communicate with apipe 36, apressure pump 38, and a cleaningfluid storing tank 37. - The
air suction port 44 and theair exhaust port 45 are located in a top inner wall of thereaction chamber 31, while theair feeding port 48 is located in a bottom inner wall of thereaction chamber 31. Theair suction port 44 is an opening communicating with theextraction pump 41 and the circulatingpipe 42. Theair exhaust port 45 communicates with apipe 46 and anexhaust unit 47 of the plant system. Theexhaust unit 47 includes an extraction pump for extracting and exhausting air inside thereaction chamber 31, such that thereaction chamber 31 is always under a constant negative pressure condition. Theair feeding port 48 communicates with theair feeding pipe 49 and anair feeding unit 50. Theair feeding unit 50 includes a pressure reducing device or an airflow controlling device for regulating pressure of CDA supplied from the plant system. - A cleaning fluid, such as solvent or water or a combination thereof, originates from the
tank 37. The cleaning fluid can be compressed by thepressure pump 38 and then delivered to thereaction chamber 31. The cleaning fluid sprays directly over thesubstrate 200 through thenozzles 35 to remove photoresist or particles on thesubstrate 200. Subsequently, the air inside thereaction chamber 31 is extracted and properly pressurized by theextraction pump 41 and fed back to thereaction chamber 31 through the circulatingpipe 42 and theair knives 43 a˜43 d. The circulated air therefore passes through theair knives 43 a˜43 d and blows upper and lower surfaces of the movingsubstrate 200 to remove the cleaning fluid on thesubstrate 200 and prevent the cleaning fluid from vaporizing into the surrounding environment. Meanwhile, CDA supplied from the plant system is regulated in pressure by theair feeding unit 50 and delivered to thereaction chamber 31 via theair feeding pipe 49 and theair feeding port 48. This process is called air refreshing. - It is to be noted that, in this embodiment, the
air suction port 44 is provided above thereaction chamber 31 and near theoutlet 33 such that the local region around theoutlet 33 is under a stronger negative pressure condition. The purpose is to shorten the path for circulating air near theoutlet 33 and avoid any leakage of air containing vaporized cleaning fluid from theoutlet 33. - Referring to
FIG. 2 , tworeaction chambers photoresist stripping apparatus 60 according to a second embodiment of the present invention are shown. Each of thereaction chambers reaction chamber 31 of the first embodiment. In particular, eachreaction chamber air circulating system 40 a/40 b independent of a plant system. In other words, thereaction chamber 31 a/31 b includes aninlet 32 a/32 b, anoutlet 33 a/33 b, atransmitting mechanism 34, a plurality ofnozzles 35 a/35 b, an air suction port 44 a/44 b, anair exhaust port 45 a/45 b, anair feeding port 48 a/48 b, and an internalair circulating system 40 a/40 b. The internalair circulating system 40 a/40 b includes anextraction pump 41 a/41 b, a circulatingpipe 42 a/42 b and air guiding means such as fourair knives 431 a/432 a, 431 b/432 b, 431 c/432 c, and 431 d/432 d. In the following description, for simplicity, detailing of the structure of thereaction chambers - The
reaction chambers outlet 33 a of thereaction chamber 31 a and theinlet 32 b of thereaction chamber 31 b communicate with each other. The transmittingmechanism 34 is provided at a constant level inside thereaction chambers inlet 32 a and theoutlet 33 b, for moving asubstrate 300 into and out of thereaction chambers inlets outlets substrate 300 is a glass substrate. Thenozzles mechanism 34 communicate withpipes 36 a and 36 b, pressure pumps 38 a and 38 b, and cleaningfluid storing tanks - The
photoresist stripping apparatus 60 further includes anair feeding unit 61 and anair exhaust unit 62. Theair feeding unit 61 includes pressure reducing devices orairflow controlling devices air exhaust unit 62 can include a single extraction pump (not shown) for bothreaction chambers FIG. 2 , theair exhaust unit 62 can include respective extraction pumps 47 a and 47 b for eachreaction chamber reaction chambers reaction chambers - A cleaning fluid, such as solvent or water or a combination thereof, originates from the
tanks reaction chambers substrate 300 through thenozzles substrate 300. Subsequently, the internalair circulating systems reaction chambers substrate 300 and being carried to the next reaction chamber. Meanwhile, each of thereaction chambers air feeding unit 61 to accomplish air refreshing. Preferably, before entering thereaction chambers airflow controlling devices air feeding unit 61. - In each of the above-described embodiments, the photoresist stripping apparatus employs an internal air circulating system for each reaction chamber. The internal air circulating system independently extracts the air inside each reaction chamber, and the extracted air is fed back and serves as an air source for the air knives. Further, the negative pressure of each reaction chamber is achieved directly by extracting the air inside the reaction chambers via an air exhaust unit. Thus, the amount of CDA supplied from the plant system can be substantially economized, and the loading on the
air exhaust unit 62 can be mitigated. Accordingly, the operation cost of the plant system can be lowered. - It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set out in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms during which the appended claims are expressed.
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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TW95215586 | 2006-09-01 | ||
TW095215586U TWM308491U (en) | 2006-09-01 | 2006-09-01 | Photoresist striping apparatus with internal air circulating system |
Publications (1)
Publication Number | Publication Date |
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US20080057838A1 true US20080057838A1 (en) | 2008-03-06 |
Family
ID=38643044
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Application Number | Title | Priority Date | Filing Date |
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US11/899,194 Abandoned US20080057838A1 (en) | 2006-09-01 | 2007-09-04 | Photoresist stripping apparatus and internal air circulating system thereof |
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TW (1) | TWM308491U (en) |
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US20100311243A1 (en) * | 2009-06-05 | 2010-12-09 | Magic Technologies, Inc. | Bottom electrode etching process in MRAM cell |
CN102284915A (en) * | 2011-09-02 | 2011-12-21 | 王宝根 | Through type sand blasting machine capable of automatically recycling circulating fluid |
CN104070358A (en) * | 2014-06-27 | 2014-10-01 | 德清华腾金属材料有限公司 | Flat wire material processing device for chain |
CN106425882A (en) * | 2016-12-08 | 2017-02-22 | 浙江工贸职业技术学院 | Automatic unidirectional sand blasting machine |
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US20170221719A1 (en) * | 2015-07-08 | 2017-08-03 | Deca Technologies Inc. | Semiconductor device processing method for material removal |
US9962174B2 (en) | 2015-07-17 | 2018-05-08 | Kator, Llc | Transosseous method |
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US10154868B2 (en) | 2015-07-17 | 2018-12-18 | Kator, Llc | Transosseous method |
US11373885B2 (en) * | 2019-05-16 | 2022-06-28 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Wet etching apparatus |
US11504140B2 (en) | 2015-07-17 | 2022-11-22 | Crossroads Extremity Systems, Llc | Transosseous guide and method |
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