US20080087316A1 - Thermoelectric device with internal sensor - Google Patents
Thermoelectric device with internal sensor Download PDFInfo
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- US20080087316A1 US20080087316A1 US11/546,928 US54692806A US2008087316A1 US 20080087316 A1 US20080087316 A1 US 20080087316A1 US 54692806 A US54692806 A US 54692806A US 2008087316 A1 US2008087316 A1 US 2008087316A1
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- semiconductor elements
- substrates
- sensor
- thermoelectric
- thermoelectric system
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60N—SEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
- B60N2/00—Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles
- B60N2/56—Heating or ventilating devices
- B60N2/5678—Heating or ventilating devices characterised by electrical systems
- B60N2/5692—Refrigerating means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0212—Control thereof of electric power, current or voltage
Definitions
- the present invention relates generally to thermoelectric devices and, more particularly, to a Peltier circuit.
- a Peltier circuit is a thermoelectric device comprising two sides. When voltage is applied in one direction, one side creates heat while the other side absorbs heat. Switching polarity of the circuit creates the opposite effect.
- the Peltier circuit comprises a closed circuit that includes dissimilar materials. As a DC voltage is applied to the closed circuit, a temperature change is produced at the junction of the dissimilar materials. Heat is either emitted or absorbed at the junction depending on the direction of current flow.
- the Peltier circuit can include several such junctions connected electrically in series. The junctions can be sandwiched between two ceramic plates, which form the cold side and the hot side of the device. The cold side can be thermally coupled to an object to be cooled and the hot side can be thermally coupled to a heat sink which dissipates heat to the environment.
- U.S. Patent Publication No. 2006-0130490 discloses a vehicle seat ventilation system that utilizes a Peltier circuit to provide heated and/or cooled air to a vehicle seat for enhancing passenger comfort. Specifically, air can be passed over the cold and/or hot side of the Peltier circuit to heat or cool the air, which is then directed to the vehicle seat.
- Use of a Peltier circuit is particularly advantageous in this application because the Peltier circuit is compact and allows a single device to provide heated and cooled air to the vehicle seat. That is, the air may be directed over a single surface of the Peltier circuit, and the voltage can be reversed throughout the circuit depending on whether heated or cooled air is desired.
- U.S. Patent Publication No. 2006-0130490 discloses a climate control system that can include a Peltier circuit for cooling and/or heating air supplied to a vehicle seat.
- a temperature sensor is used to measure the temperature of the air directed to the vehicle seat. Data from the temperature sensor can be used to control the amount and direction of voltage through the Peltier circuit.
- the temperature sensor should be reliable and provide accurate measurements. Accordingly, it would be desirable to provide a Peltier circuit with an improved arrangement for protecting the temperature sensor.
- thermoelectric device that includes a first and a second substrate spaced apart from each other to form a gap.
- a plurality of semiconductor elements are disposed between the first and second substrates within the gap.
- the plurality of semiconductor elements comprise a first group of semiconductor elements having a first set of electrical properties and a second group of semiconductor elements having a second set of electrical properties.
- a first set of electrical conductors is disposed between the plurality of semiconductors and the first substrate and a second set of electrical conductors are disposed between the plurality of semiconductors and the second substrate.
- the first set of electrical conductors and the second set of electrical conductors are arranged so the plurality of semiconductor elements are electrically coupled to each other in series with the first and second groups of semiconductor elements in an alternating arrangement.
- At least one sensor is disposed between the first and second substrates at a location spaced from a peripheral edge of the first and second substrates.
- a seal extends around the peripheral edge of the first and second substrates.
- thermoelectric system that includes a pair of opposing substrates, each substrate having a peripheral edge and a face that generally opposes a face of the other opposing substrate.
- a plurality of semiconductor elements is positioned between the opposing faces.
- the plurality of semiconductor elements includes at least two dissimilar semiconductor elements, the plurality of semiconductor elements electrically coupled in series by conductor elements arranged so the two dissimilar elements are connected in an alternating pattern.
- a sensor is positioned between the pair of opposing substrates at a location spaced from the peripheral edges of the opposing substrates.
- a seal extends around the plurality of semiconductor elements
- a climate controlled seat assembly that includes a seat cushion having an outer surface comprising a first side for supporting an occupant in a sitting position and a second side.
- An air passage extends from the second side into the seat cushion and is configured to deliver air to the first side of the seat cushion.
- a climate control system is in fluid communication with the air passage.
- the climate control system includes a thermoelectric device configured to heat and cool air deliver to the air passage.
- the thermoelectric device includes a pair of opposing substrates.
- a plurality of semiconductor and connection elements are disposed between the opposing substrates.
- a sensor is disposed between the pair of opposing substrates.
- a seal extends around the plurality of semiconductor and connection elements and the sensor.
- thermoelectric system that includes a pair of opposing substrates, each substrate having a peripheral edge and a face that generally opposes a face of the other opposing substrate.
- a plurality of semiconductor elements are disposed between the substrates elements.
- the plurality of semiconductor elements comprises at least two groups of dissimilar semiconductor elements that are alternately electrically coupled to each other in series.
- a sensor is positioned between the pair of opposing substrates at a location spaced from the peripheral edges of the opposing substrates.
- the system also includes means for sealing from moisture the plurality of semiconductor elements and the sensor positioned between the pair of opposing substrates.
- FIG. 1A is an exploded side perspective view of an embodiment of a thermoelectric apparatus
- FIG. 1B is a side perspective view of the assembled thermoelectric apparatus of FIG. 1A ;
- FIG. 2A is a side view of the thermoelectric apparatus of FIG. 1A ;
- FIG. 2B is an enlarged view of the portion labeled 2 B- 2 B in FIG. 2A ;
- FIG. 2C is a cross-section view taken through line 2 C- 2 C of FIG. 2A with certain portions of the thermoelectric apparatus removed;
- FIG. 2D is a modified embodiment of FIG. 2C ;
- FIG. 2E is a modified embodiment of FIG. 2C ;
- FIG. 3 is a schematic illustration of a ventilation system that includes the thermoelectric apparatus of FIG. 1A ;
- FIG. 4 is a schematic illustration of a conditioned assembly that includes the thermoelectric apparatus of FIG. 1A ;
- FIG. 5 is a schematic illustration of another embodiment of a conditioned assembly that includes the thermoelectric apparatus of FIG. 1A .
- FIGS. 1A , 1 B, 2 A, and 2 B illustrate an embodiment of a thermoelectric device 10 .
- FIG. 1A is an exploded view of the thermoelectric device 10 with its various components separated vertically for ease of inspection.
- FIG. 1B is a side perspective view of the assembled thermoelectric device 10 .
- FIG. 2A is a side view of the thermoelectric device 10 with portions (as explained below) removed.
- FIG. 2B is an enlarged view of a portion of FIG. 2A .
- the thermoelectric device 10 can include a plurality of dissimilar conductive elements 22 , 24 .
- pairs of dissimilar conductive elements 22 , 24 can be coupled together by a series 28 of opposing conductor tabs 28 , which are, in turn, disposed between a pair of opposing substrates 32 .
- each substrate 32 is thermally coupled to a heat transfer member 38 through a thermal conductive element 34 .
- a sensor 50 can be positioned between the opposing substrates 32 and a seal 60 can be provided between the opposing substrates 32 to protect the sensor 50 and the elements between the substrates 32 .
- FIGS. 2A and 2B are side views of the thermoelectric device with the seal 60 omitted to allow inspection of the components 22 , 24 , 28 between the substrates 32 .
- the dissimilar conductors 22 , 24 comprise alternating N-type semiconductor elements 22 and P-type semiconductor elements 24 .
- the N-type semiconductor elements 22 and P-type semiconductor elements 24 can be composed of a bismuth-tellurium alloy (Bi 2 Te 3 ). Other doped or non-doped metals can also be used.
- the end of each of the N-type semiconductor elements 22 and P-type semiconductor elements 24 can be coated with a diffusion barrier (not shown).
- the diffusion barrier can inhibit flow of electrons out of the semiconductor elements 22 , 24 .
- the diffusion barrier can comprise any of a number of materials, such as, for example, nickel, a titanium/tungsten alloy, and/or molybdenum.
- pairs of dissimilar semiconductor elements 22 , 24 can be coupled at their tops and bottoms with the conductor elements or tabs 28 .
- Semiconductor elements 22 , 24 of the same type are not disposed on the same conductor tab 28 . That is, each conductor tab 28 is coupled to only one N-type semiconductor element 22 and only one P-type semiconductor elements 24 .
- the upper and lower conductor tabs 28 are configured such that the semiconductor elements 22 , 24 are disposed in an alternating series. In this manner, the semiconductor elements are electrically connected in series with each other but, with respect to thermal energy, are in parallel with each other.
- a first N-type semiconductor element 22 can be coupled at its top to a first conductor tab 28 which can also be coupled to a first the P-type semiconductor element 24 to the right of the first N-type semiconductor element 22 .
- a second conductor tab 28 can be coupled to the first N-type semiconductor element 22 and can be coupled to a second P-type semiconductor element 24 to be disposed to the left of the first N-type thermoelectric element 22 .
- the conductor tabs 2 a are arranged on the conductor element 28 configured such that all the semiconductor elements 22 , 24 are connected in series with each other.
- the conductor tabs 28 can comprise a plurality of discrete elements coupled to the substrate 32 or an intermediate member.
- the tabs 28 can be formed by tracing or otherwise forming a layer of conductive material on the substrate and/or an intermediate element.
- the senor 50 can be disposed on either substrate 32 between the semiconductor elements 22 , 24 . As will be explained below, the sensor 50 can be position on the substrate 32 between the conductor tabs 28 . In dashed lines, FIG. 2A illustrates a sensor 52 in a modified location in which the sensor 52 is positioned on one of the conductor tabs 28 .
- thermoelectric device 10 can be positioned on the top and bottom sides of the thermoelectric device 10 .
- the thermoelectric device 10 is capable of operating without the heat transfer assemblies 38 , however, the presence of such assemblies 38 increases the efficiency of heat transfer from the thermoelectric device 10 to the ambient atmosphere or a fluid in contact with the thermoelectric device 10 .
- an electrically-conducting solder (not shown) can be used to mount the N-type semiconductor elements 22 and P-type semiconductor elements 24 to of the conductor tabs 28 .
- the conducting solder can comprise compound of tin and antimony, although other metals or non-metals can be used.
- bismuth can also be alloyed with tin to create the solder.
- Other methods of affixing the semiconductor elements 22 , 24 to the conductor tabs 28 can be used, provided an electrical connection is permitted between the semiconductor elements 22 , 24 and the conductor tabs 28 .
- the conductor tabs 28 can suitably be mounted to the substrate 32 via an adhesive.
- the substrates 32 are preferably configured to provide electrical insulation while providing for heat conduction.
- the substrates 32 can be constructed of a ceramic material such as, for example, alumina (ceramic) or silicon. Various other types of materials may be used, such an epoxy.
- the substrates 32 are preferably sufficiently rigid to maintain the shape of the thermoelectric device 10 .
- flexible substrates can be used.
- the thermoelectric device can be constructed in various shapes and have the ability to bend from one shape to another.
- the substrates 32 can act an electrical insulator.
- the typical thickness for a substrate can be between 50 and 500 micrometers, though other thicknesses can be used.
- the substrates 32 can be sufficiently large to cover completely the semiconductor elements 22 , 24 and conductor tabs 28 .
- the conductor tabs 28 can be coupled to the electrically-insulating substrate 32 through solder, epoxy, or any other mounting mechanism.
- the heat transfer layer 34 can be disposed between the substrate 32 and the heat transfer member 38 . Accordingly, in the illustrated embodiment, the heat transfer layer 34 can be disposed on the outside of each of the substrates 32 .
- the heat transfer layer 34 can be a plate composed of copper or another material that has high thermal conductivity.
- the heat transfer layer 34 can be between 10 and 400 micrometers thick, although thinner or thicker layers can be used.
- the heat transfer member 38 can be coupled to the heat transfer layer by a layer of heat-conducting solder 36 .
- the heat transfer member 38 can comprise a material of high thermal conductivity (e.g., copper), which is shaped into a plurality of fins.
- heat transfer between the heat transfer member 38 and the surrounding environment can be enhanced by providing a fluid transfer device (e.g., a fan) to move fluid (e.g., air) over and/or through the heat transfer member 38 .
- a fluid transfer device e.g., a fan
- fluid e.g., air
- thermoelectric elements 22 , 24 When a current is passed through the N-type semiconductor elements 22 in series with the P-type semiconductor elements 24 , one junction 28 on one side of the semiconductor elements 22 , 24 is heated and the junction 28 on the other side of the thermoelectric elements 22 , 24 is cooled. That is, when a voltage is applied in one direction in series through the semiconductor elements 22 , 24 , alternating junctions 28 of the N-type semiconductor elements 22 and P-type semiconductor elements 24 will heat and cool respectively. With reference to FIG. 2A , because the junctions 28 of the semiconductor elements 22 , 24 are located alternately on the top and bottom of the device 10 , when a voltage is applied in one direction through the semiconductor elements 22 , 24 the top of the thermoelectric device 10 heats and the bottom of the thermoelectric device 10 cools. When the current direction is reversed, the top of the thermoelectric device 10 is cooled and the bottom is heated. Current can be applied to the device 10 through electrical connectors 40 , which can be electrically coupled one of the junctions 28 .
- the sensor 50 can be disposed between the semiconductor elements 22 , 24 .
- the sensor 50 can be configured to determine any of a number of states of operation of the thermoelectric device 10 .
- the sensor 50 can be a temperature sensor, such as a thermistor.
- a thermistor with an internal resistance of about 1000 ⁇ can be used.
- Other resistances and other sensors that detect different operating states of the device 10 can also be used, including, but not limited to, thermocouples and resistance thermometers.
- the sensor 50 can determine the temperature of the thermoelectric device 10 at a point located among the semiconductor elements 22 , 24 .
- the sensor 50 can be disposed on a conductor tab 28 (e.g., element 52 ) between an N-type semiconductor element 22 and a P-type semiconductor element 24 , or can be disposed between any two conductor elements 22 , 24 while mounted or placed on the substrate 32 . In a modified embodiment, the sensor 50 can be disposed between a semiconductor element 22 , 24 and the edge of the substrate 32 .
- the seal 60 is shown surrounding the thermoelectric device 10 between the substrates 32 .
- the seal 60 is disposed between the two substrates 32 , and surround the plurality of semiconductor elements 22 , 24 .
- FIG. 2C is a top plan view of a bottom half of a thermoelectric device 10 .
- the semiconductor elements 22 , 24 can be disposed on the conductor tabs 28 in an alternating pattern.
- the sensor 50 can be placed on one of the substrates 32 between an N-type thermoelectric element 22 and a P-type thermoelectric element 24 .
- the wire 52 of the internal sensor 50 can extend through the seal 60 .
- the sensor 50 can have a wire 52 or other communication medium which extends through the seal 60 .
- the seal 60 can be constructed of any material sufficient to inhibit moisture or other contaminants from entering the thermoelectric device 10 .
- the seal 60 can comprise putty.
- plastics or epoxy can be used.
- RTV a commercially available silicone rubber sealant, can be used.
- the seal 60 can extend completely around the perimeter of thermoelectric device 10 to completely enclose the thermoelectric elements 22 , 24 and sensor 50 positioned between the substrate 32 .
- the seal 60 can extend at least partially between the substrates 32 and in between the thermoelectric elements 22 , 24 .
- FIG. 2D illustrates a thermoelectric device 10 ′ having a sensor 70 that has a substrate footprint greater than the preferred distance between two thermoelectric elements 22 ′, 24 ′. Accordingly, some of the thermoelectric elements 22 ′, 24 ′ have been removed to accommodate the sensor 50 ′.
- the sensor 50 ′ can be disposed at any location where a thermoelectric element 22 ′, 24 ′ is disposed between the sensor 50 ′ and an edge of the substrate 32 ′.
- the sensor 50 ′ provides information through a set of connecting traces 72 etched on the substrate 50 ′.
- the wire 52 described above can be used.
- the thermoelectric elements 22 ′, 24 ′ ordinarily disposed at the location of the connecting traces 72 are removed.
- the connecting traces 72 are composed of a metal, such as copper. Other electrically-conductive materials can also be used, such as gold.
- the connecting traces 72 are in communication with the sensor 50 ′, which is disposed in substantially the center of the substrate 32 ′. The connecting traces 72 extend from the sensor 50 ′ toward the edge of the substrate 32 ′.
- thermoelectric device 10 another embodiment of the thermoelectric device 10 is illustrated. Unless otherwise described, the components in FIG. 2D are substantially identical to those of FIGS. 2C and a prime (′) has been added to the number.
- the sensor 70 is disposed between the substrates 32 ′ and conductor elements 28 .
- the connecting traces 72 preferably extend from the sensor 70 towards an edge of the substrate 32 ′ between the conductor elements 28 .
- FIG. 2E illustrates a thermoelectric device 10 having a sensor 70 that has a substrate footprint greater than the preferred distance between two thermoelectric elements 22 ′, 24 ′. Accordingly, some of the thermoelectric elements (not shown) and/or conductor element 28 ′′ have been removed to accommodate the sensor 70 .
- the sensor 70 can be disposed at any location where a thermoelectric element (not shown) is disposed between the sensor 70 and an edge of the substrate 32 ′,.
- the sensor 70 provides information through a set of connecting traces 72 etched on the substrate 32 ′.
- the wire 52 described above can be used.
- the thermoelectric elements (not shown) ordinarily disposed at the location of the connecting traces 72 are removed.
- the connecting traces 72 are composed of a metal, such as copper. Other electrically-conductive materials can also be used, such as gold.
- the connecting traces 72 are in communication with the sensor 70 , which is disposed in substantially the center of the substrate 32 ′′.
- the connecting traces 72 extend from the sensor 50 ′′ toward the edge of the substrate 32 ′.
- a climate control system 99 for a seat assembly 100 is shown in combination with a pair of thermoelectric devices 10 a , 10 b , which can be arranged as described above.
- the seat assembly 100 is similar to a standard automotive seat.
- certain features and aspects of the climate control system 99 and seat assembly 100 described herein can also be used in a variety of other applications and environments.
- certain features and aspects of the system 99 and assembly 100 may be adapted for use in other vehicles, such as, for example, an airplane, a wheel chair, a boat, or the like.
- system 99 and assembly 100 can also be adapted for use in stationary environments, such as, for example, a chair, a sofa, a theater seat, a mattress, and an office seat that is used in a place of business and/or residence.
- the seat assembly 100 can comprise a seat portion 102 and a back portion 104 .
- the seat portion 102 and back portion 104 can each comprise a cushion 106 a , 106 b and a plurality of channels 108 a , 108 b disposed within and/or extending through the cushions 106 a , 106 b .
- Each of the channels 108 a , 108 b can be placed in fluid communication with the climate control system 99 through a conduit 10 a , 10 b .
- the conduits 10 a , 10 b are in communication with separate climate control devices 112 a , 112 b .
- the channels 108 a associated with the seat portion 102 are in communication with a different climate control device 112 a than the channels 108 b in the back portion.
- a single climate control device can be in fluid communication with the channels 108 a , 108 b the seat portion 102 and back portion 104 .
- multiple climate control devices can be associated with either the seat portion 102 and/or the back portion 104 .
- the channels 108 a , 108 b and/or conduits 110 a , 110 b can include resistive heating elements (not shown).
- the climate control devices 112 a , 112 b can each comprise the thermoelectric device 10 a , 10 b , which can be configured as described above, and a fluid transfer device 130 a , 130 b .
- the fluid transfer device 130 a , 130 b can be a radial or axial fan, or other device for transferring a fluid.
- the thermoelectric device 10 a , 10 b can be disposed between the fluid transfer device 130 a , 130 b and the conduits 110 a , 110 b .
- the thermoelectric device 10 a , 10 b can be configured to selectively heat or cool the fluid (e.g., air) delivered by the fluid transfer device 130 a , 130 b to the seat portion 102 and back portion 104 .
- the fluid transfer device 130 a , 130 b can be configured to transfer air to the channels 108 a , 108 b that is drawn past only one side of the thermoelectric device 10 a , 10 b .
- the climate control devices 112 a , 112 b can be configured to alternately supply heated or cooled air 122 a , 122 b through the plurality of conduits 110 a , 110 b to the seat 100 .
- the fluid transfer device 130 a , 130 b can also be used to withdraw air through the conduits 110 a , 110 b.
- each of the thermoelectric devices 10 a , 10 b include a pair of heat transfer members 38 (not shown in FIG. 3 ) as described above.
- the heat transfer members 38 form a waste heat exchanger and a generally opposing main heat exchanger, which can be thermally exposed to the air transferred by the fluid transfer device 130 a , 130 b .
- heat can be transferred to the air through the main heat exchanger or withdrawn from the air through the main heat exchanger.
- the climate control devices 112 a , 112 b can be controlled and operatively connected by an electronic control device 114 a , 114 b .
- the electronic control devices 114 a , 114 b can receive signals from a plurality of input sources 116 , 118 , 120 . In the illustrated embodiment, three input sources are shown, but more or fewer can be used.
- the electronic control devices 114 a , 114 b can be operatively connected with each other through an information connection 124 .
- the electronic control devices 114 a , 114 b can be configured change the operating state of the climate control devices 112 a , 112 b in response to a control signal or setting.
- the electronic control devices 114 a , 114 b can alter the speed at which fluid is transferred by the fluid transfer devices 130 a , 130 b or the operating state of the thermoelectric devices 10 a , 10 b to heat or cool the fluid.
- the sensor 50 (not shown in FIG. 3 ) disposed in the thermoelectric devices 10 a , 10 b can impart information through the wire 52 a , 52 b to the electronic control devices 114 a , 114 b , thereby allowing the devices 114 a , 114 b to determine accurately the operating temperature of the climate control devices 112 a , 112 b .
- the electronic control devices 114 a , 114 b can adjust the operation of the climate control devices 112 a , 112 b based at least in part on information provided by the sensor 50 .
- the electronic control devices 114 a , 114 b can change the direction or strength of current in the thermoelectric devices 10 a , 10 b , change the speed of operation of the fluid transfer device 130 a , 130 b , and/or shut down the devices 10 a , 10 b if there is a malfunction.
- an assembly 200 is shown in combination with a thermoelectric device 210 , which can be arranged according to the embodiment described above.
- the assembly 200 defines a cavity 201 , which can be enclosed (e.g., via a removable or retractable door or top).
- the assembly 200 can device one or more holders 202 for containers (e.g., a cup holder).
- the assembly 200 preferably includes one or more conductive elements or material 204 that surrounds at least partially cavities 201 , 202 so as to cool (or heat) articles positioned therein.
- the conductive material or elements 204 can be conductively coupled to the one side of the thermoelectric device 210 while the other side of the device 210 can be conductively coupled to a heat exchanger 212 positioned within a duct 206 .
- a fluid transfer device 208 can be used to pump air through the heat exchanger 212 .
- the thermoelectric device 210 can be used to withdraw heat from the cup holder 203 or cavity 201 to cool a container or article positioned therein and/or transfer heat to the cup holder 203 or cavity 201 to heat a container positioned
- FIG. 5 illustrates a modified embodiment of the assembly 230 .
- the assembly can include a cavity 301 , which can be enclosed (e.g., via a removable or retractable door or top).
- the assembly 300 can include one or more holders 303 for containers (e.g., a cup holder). Insulation 304 can be provided to insulate the cavity 301 or cup holder 303 .
- the thermoelectric device 310 has a first side coupled to a first heat exchanger 313 and a second side coupled to a second heat exchanger 312 . Each heat exchanger 313 , 312 is positioned within a duct 314 , 306 .
- Each duct 313 , 306 can be in communication with a fluid transfer device 308 or share a common fluid transfer device (not illustrated).
- the air on the first side of the device 313 is directed into the cavity 201 , 202 .
- conditioned (e.g., hot or cold) air can be directed into the assembly 300 to cool and/or heat objects and article positioned therein.
- the air delivered to the cavity 301 , 302 can be re-circulated to the fluid transfer device 308 through a recirculation passage 316 .
- Various components are described as being “operatively connected” to the control unit. It should be appreciated that this is a broad term that includes physical connections (e.g., electrical wires or hard wire circuits) and non-physical connections (e.g., radio or infrared signals). It should also be appreciated that “operatively connected” includes direct connections and indirect connections (e.g., through additional intermediate device(s)).
Abstract
Description
- 1. Field of the Invention
- The present invention relates generally to thermoelectric devices and, more particularly, to a Peltier circuit.
- 2. Description of the Related Art
- A Peltier circuit is a thermoelectric device comprising two sides. When voltage is applied in one direction, one side creates heat while the other side absorbs heat. Switching polarity of the circuit creates the opposite effect. In a typical arrangement, the Peltier circuit comprises a closed circuit that includes dissimilar materials. As a DC voltage is applied to the closed circuit, a temperature change is produced at the junction of the dissimilar materials. Heat is either emitted or absorbed at the junction depending on the direction of current flow. The Peltier circuit can include several such junctions connected electrically in series. The junctions can be sandwiched between two ceramic plates, which form the cold side and the hot side of the device. The cold side can be thermally coupled to an object to be cooled and the hot side can be thermally coupled to a heat sink which dissipates heat to the environment.
- U.S. Patent Publication No. 2006-0130490 (filed Jan. 31, 2005 and published Jun. 22, 2006) discloses a vehicle seat ventilation system that utilizes a Peltier circuit to provide heated and/or cooled air to a vehicle seat for enhancing passenger comfort. Specifically, air can be passed over the cold and/or hot side of the Peltier circuit to heat or cool the air, which is then directed to the vehicle seat. Use of a Peltier circuit is particularly advantageous in this application because the Peltier circuit is compact and allows a single device to provide heated and cooled air to the vehicle seat. That is, the air may be directed over a single surface of the Peltier circuit, and the voltage can be reversed throughout the circuit depending on whether heated or cooled air is desired.
- U.S. Patent Publication No. 2006-0130490 discloses a climate control system that can include a Peltier circuit for cooling and/or heating air supplied to a vehicle seat. A temperature sensor is used to measure the temperature of the air directed to the vehicle seat. Data from the temperature sensor can be used to control the amount and direction of voltage through the Peltier circuit. The temperature sensor should be reliable and provide accurate measurements. Accordingly, it would be desirable to provide a Peltier circuit with an improved arrangement for protecting the temperature sensor.
- Accordingly, one aspect of the present invention comprises a thermoelectric device that includes a first and a second substrate spaced apart from each other to form a gap. A plurality of semiconductor elements are disposed between the first and second substrates within the gap. The plurality of semiconductor elements comprise a first group of semiconductor elements having a first set of electrical properties and a second group of semiconductor elements having a second set of electrical properties. A first set of electrical conductors is disposed between the plurality of semiconductors and the first substrate and a second set of electrical conductors are disposed between the plurality of semiconductors and the second substrate. The first set of electrical conductors and the second set of electrical conductors are arranged so the plurality of semiconductor elements are electrically coupled to each other in series with the first and second groups of semiconductor elements in an alternating arrangement. At least one sensor is disposed between the first and second substrates at a location spaced from a peripheral edge of the first and second substrates. A seal extends around the peripheral edge of the first and second substrates.
- Another aspect of the present invention comprises a thermoelectric system that includes a pair of opposing substrates, each substrate having a peripheral edge and a face that generally opposes a face of the other opposing substrate. A plurality of semiconductor elements is positioned between the opposing faces. The plurality of semiconductor elements includes at least two dissimilar semiconductor elements, the plurality of semiconductor elements electrically coupled in series by conductor elements arranged so the two dissimilar elements are connected in an alternating pattern. A sensor is positioned between the pair of opposing substrates at a location spaced from the peripheral edges of the opposing substrates. A seal extends around the plurality of semiconductor elements
- Another aspect of the present invention comprises a climate controlled seat assembly that includes a seat cushion having an outer surface comprising a first side for supporting an occupant in a sitting position and a second side. An air passage extends from the second side into the seat cushion and is configured to deliver air to the first side of the seat cushion. A climate control system is in fluid communication with the air passage. The climate control system includes a thermoelectric device configured to heat and cool air deliver to the air passage. The thermoelectric device includes a pair of opposing substrates. A plurality of semiconductor and connection elements are disposed between the opposing substrates. A sensor is disposed between the pair of opposing substrates. A seal extends around the plurality of semiconductor and connection elements and the sensor.
- Yet another aspect of the present invention comprises a thermoelectric system that includes a pair of opposing substrates, each substrate having a peripheral edge and a face that generally opposes a face of the other opposing substrate. A plurality of semiconductor elements are disposed between the substrates elements. The plurality of semiconductor elements comprises at least two groups of dissimilar semiconductor elements that are alternately electrically coupled to each other in series. A sensor is positioned between the pair of opposing substrates at a location spaced from the peripheral edges of the opposing substrates. The system also includes means for sealing from moisture the plurality of semiconductor elements and the sensor positioned between the pair of opposing substrates.
-
FIG. 1A is an exploded side perspective view of an embodiment of a thermoelectric apparatus; -
FIG. 1B is a side perspective view of the assembled thermoelectric apparatus ofFIG. 1A ; -
FIG. 2A is a side view of the thermoelectric apparatus ofFIG. 1A ; -
FIG. 2B is an enlarged view of the portion labeled 2B-2B inFIG. 2A ; -
FIG. 2C is a cross-section view taken throughline 2C-2C ofFIG. 2A with certain portions of the thermoelectric apparatus removed; -
FIG. 2D is a modified embodiment ofFIG. 2C ; -
FIG. 2E is a modified embodiment ofFIG. 2C ; -
FIG. 3 is a schematic illustration of a ventilation system that includes the thermoelectric apparatus ofFIG. 1A ; -
FIG. 4 is a schematic illustration of a conditioned assembly that includes the thermoelectric apparatus ofFIG. 1A ; and -
FIG. 5 is a schematic illustration of another embodiment of a conditioned assembly that includes the thermoelectric apparatus ofFIG. 1A . -
FIGS. 1A , 1B, 2A, and 2B illustrate an embodiment of athermoelectric device 10.FIG. 1A is an exploded view of thethermoelectric device 10 with its various components separated vertically for ease of inspection.FIG. 1B is a side perspective view of the assembledthermoelectric device 10.FIG. 2A is a side view of thethermoelectric device 10 with portions (as explained below) removed.FIG. 2B is an enlarged view of a portion ofFIG. 2A . - With initial reference to
FIGS. 1A and 1B , thethermoelectric device 10 can include a plurality of dissimilarconductive elements conductive elements series 28 of opposingconductor tabs 28, which are, in turn, disposed between a pair of opposingsubstrates 32. In the illustrated embodiment, eachsubstrate 32 is thermally coupled to aheat transfer member 38 through a thermalconductive element 34. Asensor 50 can be positioned between the opposingsubstrates 32 and aseal 60 can be provided between the opposingsubstrates 32 to protect thesensor 50 and the elements between thesubstrates 32. -
FIGS. 2A and 2B are side views of the thermoelectric device with theseal 60 omitted to allow inspection of thecomponents substrates 32. In one embodiment, thedissimilar conductors type semiconductor elements 22 and P-type semiconductor elements 24. The N-type semiconductor elements 22 and P-type semiconductor elements 24 can be composed of a bismuth-tellurium alloy (Bi2Te3). Other doped or non-doped metals can also be used. The end of each of the N-type semiconductor elements 22 and P-type semiconductor elements 24 can be coated with a diffusion barrier (not shown). The diffusion barrier can inhibit flow of electrons out of thesemiconductor elements - As can be seen in
FIG. 2A , pairs ofdissimilar semiconductor elements tabs 28.Semiconductor elements same conductor tab 28. That is, eachconductor tab 28 is coupled to only one N-type semiconductor element 22 and only one P-type semiconductor elements 24. In addition, the upper andlower conductor tabs 28 are configured such that thesemiconductor elements - With continued reference to
FIG. 2A , a first N-type semiconductor element 22 can be coupled at its top to afirst conductor tab 28 which can also be coupled to a first the P-type semiconductor element 24 to the right of the first N-type semiconductor element 22. At the bottom of the first N-type semiconductor element 22, asecond conductor tab 28 can be coupled to the first N-type semiconductor element 22 and can be coupled to a second P-type semiconductor element 24 to be disposed to the left of the first N-typethermoelectric element 22. With reference back toFIG. 1A , the conductor tabs 2 a are arranged on theconductor element 28 configured such that all thesemiconductor elements conductor tabs 28 can comprise a plurality of discrete elements coupled to thesubstrate 32 or an intermediate member. In a modified embodiment, thetabs 28 can be formed by tracing or otherwise forming a layer of conductive material on the substrate and/or an intermediate element. - With continued reference to
FIG. 2A , thesensor 50 can be disposed on eithersubstrate 32 between thesemiconductor elements sensor 50 can be position on thesubstrate 32 between theconductor tabs 28. In dashed lines,FIG. 2A illustrates asensor 52 in a modified location in which thesensor 52 is positioned on one of theconductor tabs 28. - As mentioned above,
heat transfer assemblies 38 can be positioned on the top and bottom sides of thethermoelectric device 10. Thethermoelectric device 10 is capable of operating without theheat transfer assemblies 38, however, the presence ofsuch assemblies 38 increases the efficiency of heat transfer from thethermoelectric device 10 to the ambient atmosphere or a fluid in contact with thethermoelectric device 10. - With reference to
FIGS. 2A and 2B , an electrically-conducting solder (not shown) can be used to mount the N-type semiconductor elements 22 and P-type semiconductor elements 24 to of theconductor tabs 28. In one embodiment, the conducting solder can comprise compound of tin and antimony, although other metals or non-metals can be used. In one example, bismuth can also be alloyed with tin to create the solder. Other methods of affixing thesemiconductor elements conductor tabs 28 can be used, provided an electrical connection is permitted between thesemiconductor elements conductor tabs 28. In turn, theconductor tabs 28 can suitably be mounted to thesubstrate 32 via an adhesive. - The
substrates 32 are preferably configured to provide electrical insulation while providing for heat conduction. In one embodiment, thesubstrates 32 can be constructed of a ceramic material such as, for example, alumina (ceramic) or silicon. Various other types of materials may be used, such an epoxy. In such an embodiment, thesubstrates 32 are preferably sufficiently rigid to maintain the shape of thethermoelectric device 10. In other embodiments, flexible substrates can be used. When flexible substrates are used, the thermoelectric device can be constructed in various shapes and have the ability to bend from one shape to another. As mentioned above, thesubstrates 32 can act an electrical insulator. The typical thickness for a substrate can be between 50 and 500 micrometers, though other thicknesses can be used. In the illustrated embodiment, thesubstrates 32 can be sufficiently large to cover completely thesemiconductor elements conductor tabs 28. Theconductor tabs 28 can be coupled to the electrically-insulatingsubstrate 32 through solder, epoxy, or any other mounting mechanism. - With continued reference to
FIGS. 2A and 2B , theheat transfer layer 34 can be disposed between thesubstrate 32 and theheat transfer member 38. Accordingly, in the illustrated embodiment, theheat transfer layer 34 can be disposed on the outside of each of thesubstrates 32. In one embodiment, theheat transfer layer 34 can be a plate composed of copper or another material that has high thermal conductivity. Theheat transfer layer 34 can be between 10 and 400 micrometers thick, although thinner or thicker layers can be used. Theheat transfer member 38 can be coupled to the heat transfer layer by a layer of heat-conductingsolder 36. In the illustrated embodiment, theheat transfer member 38 can comprise a material of high thermal conductivity (e.g., copper), which is shaped into a plurality of fins. Other materials or shapes can also be used, such as copper alloys or circular members. Additionally, the heat transfer between theheat transfer member 38 and the surrounding environment can be enhanced by providing a fluid transfer device (e.g., a fan) to move fluid (e.g., air) over and/or through theheat transfer member 38. - When a current is passed through the N-
type semiconductor elements 22 in series with the P-type semiconductor elements 24, onejunction 28 on one side of thesemiconductor elements junction 28 on the other side of thethermoelectric elements semiconductor elements junctions 28 of the N-type semiconductor elements 22 and P-type semiconductor elements 24 will heat and cool respectively. With reference toFIG. 2A , because thejunctions 28 of thesemiconductor elements device 10, when a voltage is applied in one direction through thesemiconductor elements thermoelectric device 10 heats and the bottom of thethermoelectric device 10 cools. When the current direction is reversed, the top of thethermoelectric device 10 is cooled and the bottom is heated. Current can be applied to thedevice 10 throughelectrical connectors 40, which can be electrically coupled one of thejunctions 28. - As described above, the
sensor 50 can be disposed between thesemiconductor elements sensor 50 can be configured to determine any of a number of states of operation of thethermoelectric device 10. In the illustrated embodiment, thesensor 50 can be a temperature sensor, such as a thermistor. As an example, a thermistor with an internal resistance of about 1000Ω can be used. Other resistances and other sensors that detect different operating states of thedevice 10 can also be used, including, but not limited to, thermocouples and resistance thermometers. Thesensor 50 can determine the temperature of thethermoelectric device 10 at a point located among thesemiconductor elements sensor 50 can be disposed on a conductor tab 28 (e.g., element 52) between an N-type semiconductor element 22 and a P-type semiconductor element 24, or can be disposed between any twoconductor elements substrate 32. In a modified embodiment, thesensor 50 can be disposed between asemiconductor element substrate 32. - With reference back to
FIGS. 1A and 1B , theseal 60 is shown surrounding thethermoelectric device 10 between thesubstrates 32. In general, theseal 60 is disposed between the twosubstrates 32, and surround the plurality ofsemiconductor elements FIG. 2C is a top plan view of a bottom half of athermoelectric device 10. As can be seen, thesemiconductor elements conductor tabs 28 in an alternating pattern. Thesensor 50 can be placed on one of thesubstrates 32 between an N-typethermoelectric element 22 and a P-typethermoelectric element 24. Thewire 52 of theinternal sensor 50 can extend through theseal 60. - The
sensor 50 can have awire 52 or other communication medium which extends through theseal 60. Theseal 60 can be constructed of any material sufficient to inhibit moisture or other contaminants from entering thethermoelectric device 10. In some embodiments, theseal 60 can comprise putty. In other embodiments, plastics or epoxy can be used. In one particular embodiment, RTV, a commercially available silicone rubber sealant, can be used. In one embodiment, theseal 60 can extend completely around the perimeter ofthermoelectric device 10 to completely enclose thethermoelectric elements sensor 50 positioned between thesubstrate 32. In certain embodiments, theseal 60 can extend at least partially between thesubstrates 32 and in between thethermoelectric elements - With reference now to
FIG. 2D , another embodiment of thethermoelectric device 10 is illustrated. Unless otherwise described, the components inFIG. 2D are substantially identical to those ofFIG. 2C an a prime (′) has been added to the number.FIG. 2D illustrates athermoelectric device 10′ having asensor 70 that has a substrate footprint greater than the preferred distance between twothermoelectric elements 22′, 24′. Accordingly, some of thethermoelectric elements 22′, 24′ have been removed to accommodate thesensor 50′. Thesensor 50′ can be disposed at any location where athermoelectric element 22′, 24′ is disposed between thesensor 50′ and an edge of thesubstrate 32′. In the illustrated embodiment, thesensor 50′ provides information through a set of connectingtraces 72 etched on thesubstrate 50′. In other embodiments, thewire 52 described above can be used. Thethermoelectric elements 22′, 24′ ordinarily disposed at the location of the connecting traces 72 are removed. In the illustrated embodiment, the connecting traces 72 are composed of a metal, such as copper. Other electrically-conductive materials can also be used, such as gold. In the illustrated embodiment, the connecting traces 72 are in communication with thesensor 50′, which is disposed in substantially the center of thesubstrate 32′. The connecting traces 72 extend from thesensor 50′ toward the edge of thesubstrate 32′. - With reference now to
FIG. 2D , another embodiment of thethermoelectric device 10 is illustrated. Unless otherwise described, the components inFIG. 2D are substantially identical to those ofFIGS. 2C and a prime (′) has been added to the number. In the illustrated embodiment, thesensor 70 is disposed between thesubstrates 32′ andconductor elements 28. As illustrated, the connecting traces 72 preferably extend from thesensor 70 towards an edge of thesubstrate 32′ between theconductor elements 28. - With reference now to
FIG. 2E , another embodiment of thethermoelectric device 10 is illustrated. Unless otherwise described, the components inFIG. 2D are substantially identical to those ofFIG. 2C a double prime (″) has been added to the number.FIG. 2E illustrates athermoelectric device 10 having asensor 70 that has a substrate footprint greater than the preferred distance between twothermoelectric elements 22′, 24′. Accordingly, some of the thermoelectric elements (not shown) and/orconductor element 28″ have been removed to accommodate thesensor 70. Thesensor 70 can be disposed at any location where a thermoelectric element (not shown) is disposed between thesensor 70 and an edge of thesubstrate 32′,. In the illustrated embodiment, thesensor 70 provides information through a set of connectingtraces 72 etched on thesubstrate 32′. In other embodiments, thewire 52 described above can be used. The thermoelectric elements (not shown) ordinarily disposed at the location of the connecting traces 72 are removed. In the illustrated embodiment, the connecting traces 72 are composed of a metal, such as copper. Other electrically-conductive materials can also be used, such as gold. In the illustrated embodiment, the connecting traces 72 are in communication with thesensor 70, which is disposed in substantially the center of thesubstrate 32″. The connecting traces 72 extend from thesensor 50″ toward the edge of thesubstrate 32′. - With reference now to
FIG. 3 , aclimate control system 99 for aseat assembly 100 is shown in combination with a pair ofthermoelectric devices seat assembly 100 is similar to a standard automotive seat. However, it should be appreciated that certain features and aspects of theclimate control system 99 andseat assembly 100 described herein can also be used in a variety of other applications and environments. For example, certain features and aspects of thesystem 99 andassembly 100 may be adapted for use in other vehicles, such as, for example, an airplane, a wheel chair, a boat, or the like. Further, certain features and aspects of thesystem 99 andassembly 100 can also be adapted for use in stationary environments, such as, for example, a chair, a sofa, a theater seat, a mattress, and an office seat that is used in a place of business and/or residence. - The
seat assembly 100 can comprise a seat portion 102 and aback portion 104. The seat portion 102 andback portion 104 can each comprise acushion channels cushions channels climate control system 99 through aconduit conduits climate control devices channels 108 a associated with the seat portion 102 are in communication with a differentclimate control device 112 a than thechannels 108 b in the back portion. However, in other embodiments, a single climate control device can be in fluid communication with thechannels back portion 104. In other embodiments, multiple climate control devices can be associated with either the seat portion 102 and/or theback portion 104. In some embodiments, thechannels conduits 110 a, 110 b can include resistive heating elements (not shown). - In the illustrated embodiment, the
climate control devices thermoelectric device fluid transfer device fluid transfer device thermoelectric device fluid transfer device conduits 110 a, 110 b. As described above, thethermoelectric device fluid transfer device back portion 104. Thefluid transfer device channels thermoelectric device climate control devices air conduits 110 a, 110 b to theseat 100. Thefluid transfer device conduits 110 a, 110 b. - In the illustrated embodiments, each of the
thermoelectric devices FIG. 3 ) as described above. Theheat transfer members 38 form a waste heat exchanger and a generally opposing main heat exchanger, which can be thermally exposed to the air transferred by thefluid transfer device - The
climate control devices electronic control device 114 a, 114 b. Theelectronic control devices 114 a, 114 b can receive signals from a plurality ofinput sources electronic control devices 114 a, 114 b can be operatively connected with each other through aninformation connection 124. Theelectronic control devices 114 a, 114 b can be configured change the operating state of theclimate control devices electronic control devices 114 a, 114 b can alter the speed at which fluid is transferred by thefluid transfer devices thermoelectric devices FIG. 3 ) disposed in thethermoelectric devices wire 52 a, 52 b to theelectronic control devices 114 a, 114 b, thereby allowing thedevices 114 a, 114 b to determine accurately the operating temperature of theclimate control devices electronic control devices 114 a, 114 b can adjust the operation of theclimate control devices sensor 50. For example, theelectronic control devices 114 a, 114 b can change the direction or strength of current in thethermoelectric devices fluid transfer device devices - With reference now to
FIG. 4 , anassembly 200 is shown in combination with athermoelectric device 210, which can be arranged according to the embodiment described above. In the illustrated embodiment, theassembly 200 defines acavity 201, which can be enclosed (e.g., via a removable or retractable door or top). In a modified embodiment, theassembly 200 can device one ormore holders 202 for containers (e.g., a cup holder). In either embodiment, theassembly 200 preferably includes one or more conductive elements ormaterial 204 that surrounds at least partially cavities 201, 202 so as to cool (or heat) articles positioned therein. - The conductive material or
elements 204 can be conductively coupled to the one side of thethermoelectric device 210 while the other side of thedevice 210 can be conductively coupled to aheat exchanger 212 positioned within aduct 206. Afluid transfer device 208 can be used to pump air through theheat exchanger 212. In this manner, thethermoelectric device 210 can be used to withdraw heat from the cup holder 203 orcavity 201 to cool a container or article positioned therein and/or transfer heat to the cup holder 203 orcavity 201 to heat a container positioned -
FIG. 5 illustrates a modified embodiment of the assembly 230. As described above, the assembly can include acavity 301, which can be enclosed (e.g., via a removable or retractable door or top). In a modified embodiment, theassembly 300 can include one or more holders 303 for containers (e.g., a cup holder).Insulation 304 can be provided to insulate thecavity 301 or cup holder 303. In this embodiment, thethermoelectric device 310 has a first side coupled to afirst heat exchanger 313 and a second side coupled to asecond heat exchanger 312. Eachheat exchanger duct duct fluid transfer device 308 or share a common fluid transfer device (not illustrated). The air on the first side of thedevice 313 is directed into thecavity assembly 300 to cool and/or heat objects and article positioned therein. As shown by the dashed lines, in one embodiment, the air delivered to thecavity fluid transfer device 308 through arecirculation passage 316. - Various components are described as being “operatively connected” to the control unit. It should be appreciated that this is a broad term that includes physical connections (e.g., electrical wires or hard wire circuits) and non-physical connections (e.g., radio or infrared signals). It should also be appreciated that “operatively connected” includes direct connections and indirect connections (e.g., through additional intermediate device(s)).
- Although this invention has been disclosed in the context of certain preferred embodiments and examples, it will be understood by those skilled in the art that the present invention extends beyond the specifically disclosed embodiments to other alternative embodiments and/or uses of the invention and obvious modifications and equivalents thereof. In addition, while the number of variations of the invention have been shown and described in detail, other modifications, which are within the scope of this invention, will be readily apparent to those of skill in the art based upon this disclosure. It is also contemplated that various combinations or subcombinations of the specific features and aspects of the embodiments may be made and still fall within the scope of the invention. Accordingly, it should be understood that various features and aspects of the disclosed embodiments can be combined with, or substituted for, one another in order to perform varying modes of the disclosed invention. Thus, it is intended that the scope of the present invention herein disclosed should not be limited by the particular disclosed embodiments described above, but should be determined only by a fair reading of the claims.
Claims (22)
Priority Applications (4)
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US14/552,130 US9857107B2 (en) | 2006-10-12 | 2014-11-24 | Thermoelectric device with internal sensor |
US15/842,535 US20180172325A1 (en) | 2006-10-12 | 2017-12-14 | Thermoelectric device with internal sensor |
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Also Published As
Publication number | Publication date |
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WO2008045964A3 (en) | 2008-08-21 |
WO2008045964A2 (en) | 2008-04-17 |
US20180172325A1 (en) | 2018-06-21 |
US20150176870A1 (en) | 2015-06-25 |
US9857107B2 (en) | 2018-01-02 |
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