US20080090501A1 - Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device - Google Patents
Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device Download PDFInfo
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- US20080090501A1 US20080090501A1 US11/980,663 US98066307A US2008090501A1 US 20080090501 A1 US20080090501 A1 US 20080090501A1 US 98066307 A US98066307 A US 98066307A US 2008090501 A1 US2008090501 A1 US 2008090501A1
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- polishing
- unit
- washing
- semiconductor wafer
- polished
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- 238000005498 polishing Methods 0.000 title claims abstract description 202
- 238000005406 washing Methods 0.000 title claims abstract description 127
- 238000000034 method Methods 0.000 title claims description 23
- 239000004065 semiconductor Substances 0.000 title description 142
- 238000001035 drying Methods 0.000 claims abstract description 31
- 235000012431 wafers Nutrition 0.000 description 153
- 230000007246 mechanism Effects 0.000 description 19
- 238000010981 drying operation Methods 0.000 description 11
- 239000004744 fabric Substances 0.000 description 11
- 230000003749 cleanliness Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
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- B08B1/32—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
- F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67011—Apparatus for manufacture or treatment
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- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
- H03M13/00—Coding, decoding or code conversion, for error detection or error correction; Coding theory basic assumptions; Coding bounds; Error probability evaluation methods; Channel models; Simulation or testing of codes
- H03M13/37—Decoding methods or techniques, not specific to the particular type of coding provided for in groups H03M13/03 - H03M13/35
- H03M13/39—Sequence estimation, i.e. using statistical methods for the reconstruction of the original codes
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- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
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Abstract
A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
Description
- This is a continuation of U.S. patent application Ser. No. 11/221,924, filed Sep. 9, 2005, which is a continuation of U.S. patent application Ser. No. 09/233,039, filed Jan. 20, 1999, now U.S. Pat. No. 6,273,802, which is a division of application Ser. No. 08/767,060, filed Dec. 16, 1996, now U.S. Pat. No. 5,885,138, which is a Continuation-In-Part of application Ser. No. 08/309,193, filed Sep. 20, 1994, now U.S. Pat. No. 5,616,063, of application Ser. No. 08/563,295, filed Nov. 28, 1995, now U.S. Pat. No. 5,679,059, and of application Ser. No. 08/580,312, filed Dec. 28, 1995, now U.S. Pat. No. 5,827,110.
- 1. Field of the Invention
- The present invention relates to a polishing method and apparatus, and more particularly to such a method and apparatus for polishing a workpiece such as a semiconductor wafer. Further particularly, the present invention relates to such a method and apparatus wherein a workpiece to be polished and washed, particularly a dry workpiece, is loaded into the apparatus, is polished and then washed and dried therein, and wherein the resultant clean and dry polished workpiece is transferred from the apparatus. When a dry workpiece to be polished is loaded into the apparatus and a clean and dry polished workpiece is transferred from the apparatus, the method is referred to hereinafter as a “dry-in, dry-out” method. Still further particularly, the present invention relates to such a “dry-in, dry-out” method and apparatus including a plurality of operating units disposed in an array or cluster around at least one center robot having at least one robot arm, and having a transfer structure including separate and discrete transfer mechanisms including at least one first transfer mechanism for transferring a dry workpiece into the apparatus and for transferring the clean and dry polished workpiece from the apparatus, and at least one second transfer mechanism for transferring the workpiece between polishing and washing units of the apparatus.
- 2. Description of Related Art
- Recent rapid progress in semiconductor device integration demands smaller and smaller wiring patterns or interconnections and also narrower spaces between interconnections which connect active areas. One of the processes available for forming such interconnections is photolithography. Although a photolithographic process can form interconnections that are at most 0.5 μm wide, such process requires that surfaces on which pattern images are to be focused by a stepper be as flat as possible because the depth of focus of the optical system is relatively small.
- It is therefore necessary to make the surfaces of semiconductor wafers flat to enable use of photolithography. One customary way of flattening the surfaces of semiconductor wafers is to polish them with a polishing apparatus.
- Conventionally, such a polishing apparatus has a single function of polishing a semiconductor wafer. Therefore, in the case of washing a semiconductor wafer after polishing, the semiconductor wafer must be transferred or transported from the polishing apparatus to a washing apparatus. Further, in the case of polishing a semiconductor wafer again under different conditions after a first polishing operation, the semiconductor wafer must be transferred or transported from one polishing apparatus to another polishing apparatus. In such cases, the semiconductor wafers are manually transferred or transported by a movable container in which they are immersed in water to keep them from drying during transportation. However, since various apparatuses including a polishing apparatus and a washing apparatus are independently installed and the semiconductor wafers are transferred or transported by the movable container containing water therein, it is difficult to install the polishing apparatus, the washing apparatus and the like in a clean room of a semiconductor manufacturing plant and to automate completely various processes including a polishing process and a washing process.
- In order to solve the above problems, there has been proposed an apparatus which has a polishing unit and a washing unit provided in a common housing. Further, if necessary, a plurality of polishing units can be provided in a common housing. In a polishing apparatus which has a polishing unit and a washing unit, or a plurality of polishing units in a common housing, it is conceivable to construct a cluster type of polishing apparatus which integrates a plurality of units including a polishing unit and a washing unit, as employed in a semiconductor manufacturing process such as etching or chemical vapor deposition (CVD).
- However, in the case of constructing a cluster type of polishing apparatus which integrates a plurality of units and incorporates a universal transfer robot at a central position of the units, it is necessary to handle both a dirty and wet semiconductor wafer soiled with abrasive slurry or particles generated by the polishing operation and a clean and dry semiconductor wafer which is placed on a loading unit or an unloading unit. Therefore, a conventional robot incorporated in a cluster type of a semiconductor manufacturing processing apparatus cannot be used in a cluster type of polishing apparatus because such robot is not capable of handling separately both a clean semiconductor wafer and a dirty semiconductor wafer. If such conventional robot is incorporated into the polishing apparatus, a washing process and a drying process of the robot or a robot arm additionally are required, thus lowering throughput efficiency of the apparatus. Further, when such robot or the robot arm is left for a long time as it is, abrasive material or particles generated by the polishing operation adhere to the robot or the robot arm, resulting in contamination of subsequent semiconductor wafers or respective units of the polishing apparatus.
- Therefore, it is an object of the present invention to provide an improved polishing method and apparatus wherein it is possible to achieve polishing of a workpiece and then to achieve washing and drying of the workpiece.
- It is a further object of the present invention to provide such a method and apparatus wherein workpieces to be polished that are introduced to the apparatus are dry and wherein polished and cleaned workpieces that are discharged from the apparatus also are dry, wherein the method and apparatus operate according to a dry-in, dry-out principle.
- It is a yet further object of the present invention to provide such a method and apparatus wherein it is possible to overcome the above discussed and other prior art disadvantages and to provide a much greater degree of manufacturing flexibility than has been possible in the prior art.
- It is an even still further object of the present invention to provide such a polishing method and apparatus employing a cluster type arrangement of a plurality of units that perform various operations, as well as a transfer structure including exclusive means for handling a clean semiconductor wafer and exclusive means for handling a dirty semiconductor wafer. Thus, a transfer mechanism or mechanisms that handle a dry semiconductor wafer to be loaded into the apparatus and that handle a clean and dry semiconductor wafer that has been polished and then washed and dried and that is discharged from the apparatus are exclusive, discrete and separate from a transfer mechanism or mechanisms that transfer semiconductor wafers among polishing and washing systems of the apparatus. Thus, dry semiconductor wafers are loaded into the apparatus, and dry semiconductor wafers that have been polished and washed are transferred from the apparatus.
- In accordance with one aspect of the present invention, there is provided a method and apparatus wherein a workpiece to be polished is transferred from a loading unit to a polishing system, whereat the workpiece is polished to form a polished workpiece. The polished workpiece is transferred from the polishing unit to a washing unit defining washing and drying systems. The workpiece is washed and then dried at the washing unit to form a clean and dry polished workpiece. The thus clean and dry polished workpiece then is transferred from the washing unit to an unloading unit. In accordance with a further feature of the present invention, the workpiece to be polished is transferred in a dry condition from the loading unit to the polishing unit.
- According to another aspect of the present invention, there is provided a polishing method and apparatus for polishing a surface of a workpiece and washing the workpiece which has been polished. A universal transfer robot has at least one arm for transferring the workpiece. A plurality of units are disposed around the universal transfer robot and include a loading unit for receiving thereon the dry workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece which is transferred from the loading unit, a washing system and a drying system defined by at least one washing unit for washing and drying the workpiece which has been polished and an unloading unit for receiving thereon the resultant washed and dried polished workpiece. A transfer structure includes an exclusive transfer mechanism that transfers a clean workpiece and another exclusive transfer mechanism that transfers a dirty workpiece. The loading unit, the unloading unit, the polishing unit and the washing unit are disposed around the universal transfer robot. A workpiece, i.e. a dry workpiece, is picked up from the loading unit by the universal transfer robot, transferred to the polishing unit, and polished by the polishing unit. After the polishing operation, the thus dirty workpiece is transferred from the polishing unit to the washing unit by another exclusive transfer mechanism and is washed and dried by the washing unit. After such washing and drying operations, the resultant clean and dry polished workpiece is transferred from the washing unit to the unloading unit by the universal transfer robot.
- According to a further aspect of the present invention, the universal transfer robot has an arm for exclusively handling a clean workpiece and an arm for exclusively handling a dirty workpiece. The loading unit, the unloading unit, the polishing unit and the washing unit are disposed around the universal transfer robot. A workpiece, e.g. a dry workpiece, is picked up from the loading unit by the arm for exclusively handling a clean workpiece of the universal transfer robot, transferred to the polishing unit, and polished by the polishing unit. After such polishing operation, the thus dirty workpiece is transferred from the polishing unit to the washing unit by the arm for exclusively handling a dirty workpiece of the universal transfer robot, and is washed and dried by the washing unit. After such washing and drying operations, the resultant clean and dry polished workpiece is transferred from the washing unit to the unloading unit by the arm for exclusively handling a clean workpiece of the universal transfer robot.
- According to a still further aspect of the present invention, the transfer structure includes two universal transfer robots each having at least one arm for transferring the workpiece, and the plurality of units are disposed around the two universal transfer robots. One of the universal transfer robots transfers a clean workpiece and the other of the universal transfer robots transfers a dirty workpiece. The loading unit, the unloading unit, the polishing unit and the washing unit are disposed around the two universal transfer robots. A workpiece, e.g. a dry workpiece, is picked up from the loading unit by the universal transfer robot for exclusively handling a clean workpiece, transferred to the polishing unit, and polished by the polishing unit. After such polishing operation, the thus dirty workpiece is transferred from the polishing unit to the washing unit by the universal transfer robot for exclusively handling a dirty workpiece, and is washed and dried by the washing unit. After such washing and drying operations, the resultant clean and dry polished clean workpiece is transferred from the washing unit to the unloading unit by the universal transfer robot for exclusively handling a clean workpiece.
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FIG. 1 is a schematic plan view of an embodiment of a polishing apparatus according to the present invention; -
FIG. 2A is a schematic plan view of part of the polishing apparatus according to the present invention; -
FIG. 2B is a schematic plan view of a washing unit in the polishing apparatus according to the present invention; -
FIG. 3 is a cross-sectional view taken along line A1-A2 ofFIG. 2A ; -
FIG. 4 is a cross-sectional view taken along line B1-B2 ofFIG. 2A ; -
FIG. 5 is a cross-sectional view taken along line D1-C3-C2-C1 ofFIG. 2A ; -
FIG. 6 is a cross-sectional view taken along line D1-D2 ofFIG. 2A ; -
FIG. 6A is a view similar toFIG. 6 , but showing a modified washing unit; -
FIG. 7 is a schematic plan view of a second embodiment of a polishing apparatus according to the present invention; -
FIG. 8 is a schematic plan view of a third embodiment of a polishing apparatus according to the present invention; -
FIG. 9 is a schematic plan view of a fourth embodiment of a polishing apparatus according to the present invention; -
FIG. 10 is a schematic plan view of a fifth embodiment of a polishing apparatus according to the present invention; and -
FIG. 11 is a schematic plan view of a sixth embodiment of a polishing apparatus according to the present invention. - Each of the embodiments will be described with reference to polishing a workpiece in the form of a semiconductor wafer.
- A first embodiment of a polishing apparatus according to the present invention will be described below with reference to
FIG. 1 . As shown inFIG. 1 , the polishing apparatus has acenter robot 10 having arms 10-1 and 10-2 at a central part thereof. Thecenter robot 10 constitutes a universal transfer robot. Around thecenter robot 10 and in the area that can be accessed by the arm 10-1, there are provided aloading unit 11 on which a semiconductor wafer S to be polished, e.g. a dry semiconductor wafer, is placed, anunloading unit 12 on which a clean and dry semiconductor wafer S which has been polished and then cleaned and dried is placed, a polishing system including polishingunits washing unit 15 for washing and drying the polished semiconductor wafer S. - The polishing
unit 13 has a polishing head supporting arm 13-3, a turntable 13-4 and a top ring rotatably provided on the polishing head supporting arm 13-3. The polishingunit 14 has a polishing head supporting arm 14-3, a turntable 14-4 and a top ring rotatably provided on the polishing head supporting arm 14-3. An abrasive cloth is attached to each of respective upper surfaces of the turntables 13-4 and 14-4. Each of the polishing head supporting arms 13-3 and 14-3 constitutes an exclusive transferring device for transferring the semiconductor wafer S from a loading position 13-1, 14-1 of the polishing unit to the turntable 13-4, 14-4. Further, each of the polishing head supporting arms 13-3 and 14-3 constitutes an exclusive transferring device for transferring the polished semiconductor wafer S from the polishingunit washing unit 15. The polishing apparatus has a table 16 for a dressing tool 16-1 for dressing the abrasive cloth on the turntable 13-4 and a table 17 for a dressing tool 17-1 for dressing the abrasive cloth on the turntable 14-4. - In the polishing apparatus, the semiconductor wafer S to be polished is picked up under vacuum by the arm 10-1 of the
center robot 10, is inverted to dispose a surface thereof to be polished downwardly, and is transferred to the loading position 13-1 of the polishingunit 13. The top ring of the polishing head supporting arm 13-3 holds the semiconductor wafer S and presses the semiconductor wafer S against the abrasive cloth attached to the upper surface of the turntable 13-4. At this time, the turntable 13-4 is rotated, and the top ring is rotated about its own axis and swung on the turntable 13-4 by the polishing head supporting arm 13-3, whereby the semiconductor wafer S is polished. - After such polishing operation, the polished semiconductor wafer S is transferred to a loading position 15-1 of the
washing unit 15 by the polishing head supporting arm 13-3. The polishing head supporting arm 13-3 which releases the semiconductor wafer S at the loading position 15-1 chucks dressing tool 16-1 on the table 16 and presses the dressing tool 16-1 against the abrasive cloth on the turntable 13-4, thereby dressing such abrasive cloth. This dressing operation may be performed by an exclusive dressing mechanism. - The semiconductor wafer S which has been transferred to the loading position 14-1 of the polishing
unit 14 by the arm 10- 1 of thecenter robot 10 also is held by the top ring of the polishing head supporting arm 14-3 and pressed against the abrasive cloth attached to the upper surface of the turntable 14-4. After such polishing operation, the polished semiconductor wafer S is transferred to a loading position 15-2 of thewashing unit 15. Further, the polishing head supporting arm 14-3 which releases the semiconductor wafer S chucks dressing tool 17-1 on the table 17 and presses the dressing tool 17-1 against the abrasive cloth on the turntable 14-4, thereby dressing such abrasive cloth. - The polished semiconductor wafer S transferred to the loading position 15-1 or the loading position 15-2 is washed and dried in the
washing unit 15, and then is transferred to an unloading position 15-3. The polished semiconductor wafer S thus is cleaned and dried and is transferred from the unloading position 15-3 to theunloading unit 12 by the arm 10-2 of thecenter robot 10. All of the above described operations are performed entirely automatically. - Next, the polishing
unit 14 and thewashing unit 15 will be described in detail with reference toFIGS. 2A through 6A that further illustrate the embodiment of the present invention shown inFIG. 1 . However,FIGS. 2A-6A do not illustrate a dressing tool and a table therefor, but rather illustrate an exclusive dressing mechanism 15-11. - As shown in
FIG. 2A , the semiconductor wafer S placed on theloading unit 11 is picked up by the arm 10- 1 of thecenter robot 10, inverted to direct its surface to be polished downwardly by a reversing mechanism 11-2, and transferred to the loading position 14-1 of the polishingunit 14. As shown inFIG. 3 , the semiconductor wafer S is held under vacuum by the top ring 14-5 provided at the forward end of the polishing head supporting arm 14-3 and moved above the turntable 14-4. Thereafter, the top ring 14-5 is lowered, and the semiconductor wafer S held by the top ring 14-5 is pressed against the abrasive cloth on the turntable 14-4, whereby the semiconductor wafer S is polished. The turntable 14-4 is rotated by a motor 14-6 through a timing belt 14-7 (seeFIG. 4 ). As shown inFIG. 5 , after such polishing operation, the arm 14-3 and top ring 14-5 put the semiconductor wafer S into a washing receptacle 15-4 which is standing by at an opening of the loading position 15-2 of thewashing unit 15, and top ring 14-5 is washed by cleaning solvent. During such washing operation, the opening of the loading position 15-2 is closed by a shutter 15-5. The top ring 14-5 which releases the semiconductor wafer S is washed at the loading position by a washing mechanism of thewashing unit 15. - After such washing operation, the semiconductor wafer S is moved in direction a (
FIG. 5 ) and transferred to a reversing or inverting mechanism 15-6 by which the semiconductor wafer S is inverted to dispose its surface which has been polished upwardly and supplied to a primary washing station 15-7. A primary washing operation is carried out using cleaning solvent such as pure water at the primary washing station 15-7. Thereafter, the semiconductor wafer S is picked up by a transfer robot 15-8 in thewashing unit 15, moved in directions of arrows b and c and fed to a secondary washing station 15-9. A secondary washing operation is carried out using cleaning solvent such as pure water at the secondary washing station 15-9. - After the secondary washing operation, the semiconductor wafer S is dried. Thus, the workpiece may be dried in the manner shown schematically in
FIG. 6 , wherein after the secondary washing operation at station 15-9, the wafer is dried by a drying system, in this embodiment spin-dried by spinning a wafer holding station at high speed, for example by a motor. This spinning is indicated schematically by the circular arrow inFIG. 6 . The thus washed and dried polished wafer then is picked up by the arm 10-2 of thecenter robot 10, moved in directions of arrows d and e as shown inFIG. 6 , and transferred to theunloading unit 12. As shown inFIG. 2A , dressing mechanism 15-11 dresses the abrasive cloth on the turntable 14-4. The dressing mechanism 15-11 has a rotating brush 15-12 as shown inFIG. 3 . - An alternative drying arrangement is shown schematically in
FIG. 6A . Thus, the washing and drying system include a washing unit having a separate secondary washing station 15-9A and a separate drying station 15-9B. After secondary washing in station 15-9A, the thus cleaned wafer is transferred, for example by arm 10-2 ofrobot 10, to drying station 15-9B whereat the wafer is dried. The thus cleaned and dried polished wafer then is transferred by arm 10-2 ofrobot 10 and moved further in direction e to unloadingunit 12. - The drying arrangements shown schematically in
FIGS. 6 and 6 A may be in accordance with the structures shown in Ser. No. 08/563,295 and Ser. No. 08/580,312, the disclosures of which hereby are incorporated herein by reference. - In accordance with the present invention, the entire apparatus is compact in size and therefore may be positioned in enclosing structure, e.g. a
housing unit 30, shown schematically inFIGS. 6 and 6 A. Whenhousing unit 30 is provided with a necessary exhaust duct system, the polishing apparatus can be installed in a clean room without lowering the cleanliness thereof, without requiring a large amount of space in the clean room, and at any suitable and flexibly movable position within the clean room. - According to the first embodiment, the polishing apparatus comprises a
center robot 10 having arms 10-1 and 10-2 and constituting a universal transfer robot for transferring the semiconductor wafer S to the respective units, a plurality of units disposed around thecenter robot 10 and including aloading unit 11 for receiving thereon the semiconductor wafer S to be polished, anunloading unit 12 for receiving thereon the clean and dry semiconductor wafer S which has been polished, polishingunits center robot 10 that handles clean and dry semiconductor wafers S, and the polishing head supporting arms 13-3 and 14-3 that handle dirty and wet semiconductor wafers S. Particularly,center robot 10 handles a, e.g. dry, semiconductor wafer S from theloading unit 11 to the loading position of the particular polishing unit, andcenter robot 10 also handles a clean and dry polished semiconductor wafer S from the unloading position 15-3 of thewashing unit 15 to theunloading unit 12. On the other hand, the polishing head supporting arms 13-3 and 14-3 handle dirty and wet semiconductor wafers S from the respective polishing units to the washing unit. - The
center robot 10 has the arm 10-1 which is exclusively used for loading the semiconductor wafer to be polished and the arm 10-2 which is exclusively used for unloading the clean and dry semiconductor wafer which has been polished. This arrangement is preferable in a case where the degree of cleanliness of the semiconductor wafer S transferred from theloading unit 11 is different from that of the semiconductor wafer S transferred to theunloading unit 12. - Next, a further embodiment of the polishing apparatus according to the present invention will be described below with reference to
FIG. 7 . The parts shown inFIG. 7 which are identical to those ofFIG. 1 are denoted by identical reference numerals. The polishing apparatus has acenter robot 10 having arms 10-1 and 10-2 at a central part thereof. Around thecenter robot 10 and in an area that can be accessed by the arm 10-1, there are provided aloading unit 11, anunloading unit 12, polishingunits washing unit 15, andauxiliary spaces - In the
auxiliary spaces center robot 10 and fed to the thickness meter in theauxiliary space 18. Before a polishing operation, the thickness of the semiconductor wafer S is measured by the thickness meter, and then the wafer S is transferred to the loading position 13-1 of the polishingunit 13. - After a polishing operation, the polished semiconductor wafer S is transferred to the
washing unit 15 in the same manner as in the first embodiment and is washed and dried in thewashing unit 15. After such washing operation, the clean and dry polished semiconductor wafer S is fed to the thickness meter in theauxiliary space 18 by the arm 10-1 of the center robot. After measuring the thickness of the semiconductor wafer S which has been polished, the clean and dry polished semiconductor wafer S is transferred to theunloading unit 12 by the arm 10-2 of thecenter robot 10. -
FIG. 8 shows another embodiment of the polishing apparatus according to the present invention. The parts shown inFIG. 8 which are identical to those ofFIG. 1 are denoted by identical reference numerals. Around acenter robot 10 having arms 10-1 and 10-2 and in the area that can be accessed thereby, there are provided, in a hexagonal arrangement, aloading unit 11, anunloading unit 12, a polishing system including two polishingunits 13 and a polishingunit 14, awashing unit 15 provided between the polishingunit 14 and theunloading unit 12. This arrangement is preferable in the case where the polishingunit 13 requires twice as much time as the polishingunit 14 to polish a wafer. - In this case, the transfer of the semiconductor wafer S from the polishing
units 13 to thewashing unit 15 and the transfer of the semiconductor wafer S from the polishingunit 14 to thewashing unit 15 are performed, not by thecenter robot 10, but by another transfer means such as the polishing head supporting arms 13-3 and 14-3. However, the loading of the dry semiconductor wafer to the polishingunits washing units 15 are performed by the arms 10-1 and 10-2, respectively, of thecenter robot 10. That is, thecenter robot 10 does not handle the semiconductor wafer polished by the polishingunits center robot 10 are not contaminated by the semiconductor wafer which has been polished and to which abrasive slurry adheres. -
FIG. 9 shows a still further embodiment of the polishing apparatus according to the present invention. The parts shown inFIG. 9 which are identical to those ofFIG. 1 are denoted by identical reference numerals. The polishing apparatus is provided with a transfer structure includingcenter robot 10 having only one arm 10-1. In the case of providing only the arm 10-1, the transfer structure also includes exclusive transferring devices provided between the polishingunits units washing unit 15. This system is applicable to a case where the degree of cleanliness of the dry semiconductor wafer which is transferred from theloading unit 11 is substantially the same as that of the clean and dry polished semiconductor wafer which is transferred to theunloading unit 12. -
FIG. 10 shows a still further embodiment of the polishing apparatus according to the present invention. The parts shown inFIG. 10 which are identical to those ofFIG. 1 are denoted by identical reference numerals. Around acenter robot 10 having arms and in the area that can be accessed by the arms, there are provided in a hexagonal arrangement aloading unit 11, a polishing system including four polishingunits washing unit 15. Anunloading unit 12 is disposed at the end of thewashing unit 15. Further, astorage unit 23 is disposed adjacent to theloading unit 11 and theunloading unit 12. An automatic guidedvehicle 24 is employed to transfer a semiconductor wafer S which has been polished frm thestorage unit 23 and to convey a semiconductor wafer to be polished to thestorage unit 23. - Loading of the semiconductor wafer S onto the polishing
units washing unit 15 and removal of the semiconductor wafer S from theloading unit 11 and the polishingunits center robot 10. Further, the transfer of the semiconductor wafer from thewashing unit 15 to theunloading unit 12 is carried out by thecenter robot 10. Thecenter robot 10 of this embodiment forms the transfer structure including an arm for exclusively handling a clean semiconductor wafer (hereinafter referred as clean wafer handling arm) and an arm for exclusively handling a dirty semiconductor wafer (hereinafter referred as dirty wafer handling arm). The transfer of the, e.g. dry, semiconductor wafer from theloading unit 11 to one of the polishingunits washing unit 15 to theunloading unit 12 are carried out by the clean wafer handling arm, and the transfer of the semiconductor wafer between the polishingunits units washing unit 15 are carried out by the dirty wafer handling arm. For example, in the case of using thecenter robot 10 ofFIG. 1 , the arm 10-1 serves as the clean wafer handling arm and the arm 10-2 serves as the dirty wafer handling arm. This structure prevents as much as possible the semiconductor wafer from being contaminated. - According to this embodiment, the polishing apparatus comprises a
center robot 10 having arms 10-1 and 10-2 and constituting a universal transfer robot for transferring a semiconductor wafer S to the respective units, a plurality of units disposed around thecenter robot 10 and including aloading unit 11 for receiving thereon the semiconductor wafer S to be polished, e.g. a dry wafer, anunloading unit 12 for receiving thereon the clean and dry semiconductor wafer S which has been polished, a polishing system including polishingunits washing unit 15 for washing and drying the semiconductor wafer S. Thecenter robot 10 is provided with an arm exclusively for handling a clean semiconductor wafer and an arm exclusively for handling a dirty semiconductor wafer. The arm for exclusively handling a dirty semiconductor wafer is washed by a washing mechanism provided in thewashing unit 15 after handling the dirty semiconductor wafer. -
FIG. 11 shows still another embodiment of the polishing apparatus according to the present invention. The parts shown inFIG. 11 which are identical to those ofFIG. 1 are denoted by identical reference numerals. In this embodiment, the polishing apparatus comprises a transfer structure including acenter robot 10A for exclusively handling a clean semiconductor wafer and acenter robot 10B for exclusively handling a dirty semiconductor wafer. Further, the polishing apparatus comprises a polishing system including two polishingunits washing unit 15. - With the above structure, a, e.g. dry, semiconductor wafer S is picked up from a
loading unit 11 by thecenter robot 10A and transferred thereby to a loading position 13-1 of the polishingunit 13. After a polishing operation, the polished semiconductor wafer S is picked up from the polishingunit 13 by thecenter robot 10B and transferred thereby to a loading position 15-1 of thewashing unit 15. After washing and drying operations by washing and drying systems, the resultant clean and dry polished semiconductor wafer S is picked up from a loading position 15-3 of thewashing unit 15 by thecenter robot 10A and transferred thereby to anunloading unit 12. By the above manner, a polishing process and washing and drying processes are carried out. A polishing operation is conducted by the polishingunit 14 in the same manner as described above. - According to this embodiment, the semiconductor wafers S are polished simultaneously or at a certain time lag by the polishing
units units washing unit 15. That is, it is possible to deal with two semiconductor wafers with one washing unit for every two polishing units. Especially in the case where the cycle of the washing unit, i.e. the time interval between washing of a preceding semiconductor wafer and washing of a subsequent semiconductor wafer, is sufficiently shorter than the time required to polish semiconductor wafers, there is no downtime during the polishing operations. Thus, the processing speed of the overall apparatus is prevented from being lowered and the total system can be more compact in size. - Further, the polishing
units unit 13, washed by thewashing unit 15, and then polished by the polishingunit 14. Thereafter, the semiconductor wafer S can be washed and dried by thewashing unit 15. That is, the semiconductor wafer can be polished twice. Such polishing apparatus hasauxiliary spaces FIG. 11 . - According to this embodiment, the polishing apparatus comprises two
center robots center robots loading unit 11 for receiving thereon a semiconductor wafer S to be polished, e.g. a dry wafer, anunloading unit 12 for receiving thereon a clean and dry semiconductor wafer S which has been polished, polishingunits washing unit 15 for washing and drying a semiconductor wafer S which has been polished. Thecenter robot 10A handles only a clean semiconductor wafer, and thecenter robot 10B handles only a dirty semiconductor wafer. Thecenter robot 10B is washed by a washing mechanism provided in thewashing unit 15 after handling the dirty semiconductor wafer. - According to the above embodiments, since at least one polishing unit for performing chemical/mechanical polishing and at least one washing and drying unit are disposed around a center robot, the entire system is compact in size. Therefore, by providing an enclosing structure such as a housing unit (e.g. as shown at 30 in
FIG. 6, 6A ) to cover the entire system and an exhaust duct, the polishing apparatus can be installed in a clean room without lowering the cleanliness thereof. Further, the amount of space in the clean room required for installation of the polishing apparatus can be reduced. - In the above embodiments, although the
loading unit 11 and theunloading unit 12 are provided separately, theloading unit 11 and theunloading unit 12 may be formed integrally. For example, in the case where a semiconductor wafer is picked up from a basket containing semiconductor wafers and is put into the same basket after undergoing a polishing operation and washing and drying operations, the loading unit and the unloading unit are formed integrally. - The basket comprises a cassette which is placed on the loading unit and/or the unloading unit. A semiconductor wafer may be picked up from a cassette on the loading unit and the unloading unit and may be put into the same cassette on the loading unit and the unloading unit after undergoing a polishing operation and washing and drying operations. Further, a semiconductor wafer may be picked up from a cassette on the loading unit and may be put into a cassette on the unloading unit after undergoing a polishing operation and washing and drying operations.
- The cassette which is placed on the loading unit and/or the unloading unit may be in accordance with the structures shown in Ser. No. 08/563,295 and Ser. No. 08/580,312, the disclosures of which hereby are incorporated herein by reference.
- According to the present invention, a cluster type of polishing apparatus which integrates a plurality of units including a polishing unit defining a polishing system and a washing and drying unit defining washing and drying systems and which employs a universal transfer robot can be constructed. The polishing apparatus performs a series of processes including a polishing operation and washing and drying operations while saving installation space and improving processing speed by efficiently combining a plurality of units including at least one polishing unit and at least one washing and drying unit. In the case where the time required for polishing is longer than the cycle time of the washing and drying operations, the polishing system can include a plurality of polishing units to polish a plurality of semiconductor wafers and be associated washing and drying systems formed in one washing and drying unit. On the contrary, in the case where the cycle time of the washing and drying operations is longer than the time required for polishing, the washing and drying systems can be formed by a plurality of washing and drying units to wash and dry a plurality of semiconductor wafers and be associated with a polishing system in the form of one polishing unit. Further, according to the present invention, one or more polishing operations and one or more of each of washing and drying operations can be fully automated and can be changed or modified easily.
- Furthermore, according to the present invention, since the transfer structure includes exclusive means for handling a clean semiconductor wafer and exclusive means for handling a dirty semiconductor wafer that are provided separately, contamination of subsequent semiconductor wafers or of respective units of the polishing apparatus caused by the dirty semiconductor wafer can be prevented.
- Although the present invention has been described and illustrated with regard to specific features and embodiments thereof, it is to be understood that the present invention is not intended to be limited to such specifically described and illustrated features and embodiments. Rather, various modifications and changes to such specifically described and illustrated features and embodiments as would be apparent to one of ordinary skill in the art are contemplated as being within the scope of the present invention.
Claims (4)
1-19. (canceled)
20. A polishing method, for use in a polishing apparatus comprising a pair of first polishing units and a single second polishing unit, each for polishing a workpiece, wherein said polishing method comprises:
polishing the workpiece in one of said first polishing units for a first polishing time;
polishing the workpiece in said second polishing unit for a second polishing time, said first polishing time being longer than said second polishing time; and
washing the workpiece.
21. A polishing method according to claim 20 , further comprising:
drying the washed workpiece in a washing unit; and then removing the dried workpiece from said washing unit in clean and dry condition.
22. A polishing method according to claim 20 , wheein the workpiece to be polished is transferred by a robot, and the clean and dry workpiece, which has been polished and then washed, is transferred by said robot.
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US11/980,663 US20080090501A1 (en) | 1993-09-21 | 2007-10-31 | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
Applications Claiming Priority (21)
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JP259396/1993 | 1993-09-21 | ||
JP25939693 | 1993-09-21 | ||
US08/309,193 US5616063A (en) | 1993-09-21 | 1994-09-20 | Polishing apparatus |
JP319289/1994 | 1994-11-29 | ||
JP31928994A JP3315544B2 (en) | 1994-11-29 | 1994-11-29 | Semiconductor wafer polishing apparatus and method |
JP330210/1994 | 1994-12-06 | ||
JP330209/1994 | 1994-12-06 | ||
JP33020994 | 1994-12-06 | ||
JP33021094 | 1994-12-06 | ||
JP33916794A JPH08187660A (en) | 1994-12-28 | 1994-12-28 | Polishing device |
JP339165/1994 | 1994-12-28 | ||
JP33916594A JP3583490B2 (en) | 1994-12-28 | 1994-12-28 | Polishing equipment |
JP33916694A JP3583491B2 (en) | 1994-12-28 | 1994-12-28 | Polishing apparatus and method |
JP339167/1994 | 1994-12-28 | ||
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US8563295A | 1995-11-28 | 1995-11-28 | |
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US08/767,060 US5885138A (en) | 1993-09-21 | 1996-12-16 | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
US09/233,039 US6273802B1 (en) | 1993-09-19 | 1999-01-20 | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
US11/221,924 US20060009130A1 (en) | 1993-09-21 | 2005-09-09 | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
US11/980,663 US20080090501A1 (en) | 1993-09-21 | 2007-10-31 | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
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US09/804,234 Expired - Lifetime US6425806B2 (en) | 1993-09-21 | 2001-03-13 | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
US09/804,232 Expired - Fee Related US6547638B2 (en) | 1993-09-21 | 2001-03-13 | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
US09/804,231 Expired - Lifetime US6443808B2 (en) | 1993-09-21 | 2001-03-13 | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
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US11/980,667 Expired - Fee Related US7708618B2 (en) | 1993-09-21 | 2007-10-31 | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
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Also Published As
Publication number | Publication date |
---|---|
US20010010996A1 (en) | 2001-08-02 |
US6439971B2 (en) | 2002-08-27 |
US7708618B2 (en) | 2010-05-04 |
US20030148714A1 (en) | 2003-08-07 |
US6425806B2 (en) | 2002-07-30 |
US20060009130A1 (en) | 2006-01-12 |
US20010010997A1 (en) | 2001-08-02 |
US5885138A (en) | 1999-03-23 |
US20010011000A1 (en) | 2001-08-02 |
US6547638B2 (en) | 2003-04-15 |
US6273802B1 (en) | 2001-08-14 |
US6443808B2 (en) | 2002-09-03 |
US20010014572A1 (en) | 2001-08-16 |
US20080166949A1 (en) | 2008-07-10 |
US6966821B2 (en) | 2005-11-22 |
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