US20080093054A1 - Manifold for a Two-Phase Cooling System - Google Patents
Manifold for a Two-Phase Cooling System Download PDFInfo
- Publication number
- US20080093054A1 US20080093054A1 US11/846,510 US84651007A US2008093054A1 US 20080093054 A1 US20080093054 A1 US 20080093054A1 US 84651007 A US84651007 A US 84651007A US 2008093054 A1 US2008093054 A1 US 2008093054A1
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- United States
- Prior art keywords
- manifold
- chamber
- coolant
- return
- thermal
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/877—With flow control means for branched passages
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- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A manifold for a two-phase cooling system for efficiently transferring coolant within a multi-phase cooling system. The manifold for a two-phase cooling system generally includes an extruded manifold having a supply chamber and a return chamber in thermal communication with one another to provide for efficient coolant transfer between a thermal server and a spray module.
Description
- I hereby claim benefit under Title 35, United States Code, Section 119(e) of U.S. provisional patent application Ser. No. 60/841,056 filed Aug. 29, 2006 (Docket No. ISR-662). The 60/841,056 application is currently pending. The 60/841,056 application is hereby incorporated by reference into this application.
- Not applicable to this application.
- 1. Field of the Invention
- The present invention relates generally to fluid distribution manifolds for two-phase liquid cooling systems and more specifically it relates to a manifold for efficiently transferring coolant within a multi-phase cooling system.
- 2. Description of the Related Art
- Any discussion of the related art throughout the specification should in no way be considered as an admission that such related art is widely known or forms part of common general knowledge in the field.
- Modern electronic devices (e.g. microprocessors, circuit boards and power supplies) and other heat producing devices have significant thermal management requirements. Conventional dry thermal management technology (e.g. forced air convection using fans and heat sinks) simply is not capable of efficiently thermally managing modern electronics.
- Single-phase liquid thermal management systems (e.g. liquid cold plates) and multi-phase liquid thermal management systems (e.g. spray cooling, pool boiling, flow boiling, jet impingement cooling, falling-film cooling, parallel forced convection, curved channel cooling and capillary pumped loops) have been in use for years for thermally managing various types of heat producing devices.
- Spray cooling technology is being adopted today as the most efficient option for thermally managing electronic systems. U.S. Pat. No. 5,220,804 entitled High Heat Flux Evaporative Spray Cooling to Tilton et al. describes the earlier versions of spray technology, as it relates to cooling electronics. U.S. Pat. No. 6,108,201 entitled Fluid Control Apparatus and Method for Spray Cooling to Tilton et al. also describes the usage of spray technology to cool a printed circuit board. U.S. Pat. No. 6,958,911 entitled Low Momentum Loss Fluid Manifold System to Cader et al. describes a manifold system for providing coolant to spray modules.
- The liquid coolant typically used within a spray cooling system is a dielectric fluid (e.g. perfluorocarbons and hydrofluoroethers) having a low vaporization temperature at standard atmospheric pressure. One common brand of dielectric liquid coolant for two-phase thermal management systems is a perfluorocarbon manufactured by Minnesota Mining and Manufacturing Company (3M®) under the federally registered trademark FLUORINERT®.
- Because of the inherent issues in the related art, there is a need for a new and improved manifold for a two-phase cooling system for an efficient coolant transfer system.
- The general purpose of the present invention is to provide a manifold for a two-phase cooling system that has many of the advantages of the coolant manifolds used in two-phase coolant systems mentioned heretofore. The invention generally relates to a coolant transfer manifold which includes an extruded manifold having a supply chamber and a return chamber in thermal communication with one another.
- There has thus been outlined, rather broadly, some of the features of the invention in order that the detailed description thereof may be better understood, and in order that the present contribution to the art may be better appreciated. There are additional features of the invention that will be described hereinafter and that will form the subject matter of the claims appended hereto.
- In this respect, before explaining at least one embodiment of the invention in detail, it is to be understood that the invention is not limited in its application to the details of construction or to the arrangements of the components set forth in the following description or illustrated in the drawings. The invention is capable of other embodiments and of being practiced and carried out in various ways. Also, it is to be understood that the phraseology and terminology employed herein are for the purpose of the description and should not be regarded as limiting.
- An object is to provide a manifold for a two-phase cooling system for efficiently transferring coolant within a multi-phase cooling system.
- Another object is to provide a manifold for a two-phase cooling system that utilizes an extruded structure for the manifold.
- An additional object is to provide a manifold for a two-phase cooling system that provides a supply chamber and a return chamber that co-exist in a single manifold structure.
- A further object is to provide a manifold for a two-phase cooling system that is cost effective to produce and efficient to install.
- Another object is to provide a manifold for a two-phase cooling system that transfers heat from the return chamber to the supply chamber in operation to improve the heat transfer coefficients in a spray module.
- Other objects and advantages of the present invention will become obvious to the reader and it is intended that these objects and advantages are within the scope of the present invention. To the accomplishment of the above and related objects, this invention may be embodied in the form illustrated in the accompanying drawings, attention being called to the fact, however, that the drawings are illustrative only, and that changes may be made in the specific construction illustrated and described within the scope of the appended claims.
- Various other objects, features and attendant advantages of the present invention will become fully appreciated as the same becomes better understood when considered in conjunction with the accompanying drawings, in which like reference characters designate the same or similar parts throughout the several views, and wherein:
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FIG. 1 is an upper perspective view of a two-phase cooling system incorporated within a server rack. -
FIG. 2 is an upper perspective view of the manifold attached to a rack. -
FIG. 3 is an upper perspective view of the manifold. -
FIG. 4 is an upper perspective view of an exemplary spray module. -
FIG. 5 is a cross sectional view taken along line 5-5 ofFIG. 3 illustrating the internal structure of the manifold. -
FIG. 6 is an end view of a manifold end cap. -
FIG. 7 is an upper perspective view of a fluid coupling assembly having male and female portions. -
FIG. 8 is a top cross sectional view of an alternative manifold embodiment. -
FIG. 9 is a top view of a cable and tube management arm system. -
FIG. 10 is a block diagram illustrating the fluid communications of the present invention. -
FIG. 11 is a cross sectional view taken along line 11-11 ofFIG. 3 illustrating the supply chamber, the return chamber and the venting chamber. - Turning now descriptively to the drawings, in which similar reference characters denote similar elements throughout the several views,
FIGS. 1 through 11 illustrate a manifold for a two-phase cooling system 10, which comprises an extruded manifold having a supply chamber and a return chamber in thermal communication with one another. - Now referring to
FIG. 1 , rack system is comprised of anetwork rack 12 housing one ormore servers 20. As is well known in the art of computer electronics and datacenters, therack 12 provides incremental mounting positions to theservers 20. Theservers 20 can be a wide range of sizes ranging from 1 U (1.75″) to greater than 12 U, or blade style. A typical seven foottall rack 12 can provide 42 rack mounting locations. - In the preferred embodiment of the present invention, at the bottom of
rack system 10 is at least onethermal server 30. As shown inFIG. 1 of the drawings, thethermal server 30 is preferably located at the bottom of therack 12 and pumps coolant into amanifold 40. Thethermal server 30 thermally conditions the heated return coolant received from thethermal management unit 60. -
Thermal server 30 provides the heat exchanger (condenser), pumps, and control systems needed to create the two-phase cooling system. As is generally known in the art, two-phase liquid cooling is a closed loop process wherein a coolant is pumped to a component to be cooled, wherein the coolant absorbs heat causing a phase change of the coolant to at least partially coolant vapor. The coolant vapor is condensed back into a liquid state and re-pumped. The coolant of the present invention is preferably a dielectric fluid, such as FLUORINERT (a trademark of the 3M Corporation), but is not limited to any particular fluid. For example, the present invention is applicable to water based systems. - The
thermal management unit 60 is utilized to thermally manage one or more heat producing devices (e.g. microprocessor). Thethermal management unit 60 is in thermal communication with the heat producing device either directly (e.g. spraying coolant upon the heat producing device) or indirectly (e.g. in thermal communication via a heat spreader or similar device). - As shown in
FIG. 4 of the drawings, thethermal management unit 60 has afluid inlet 62 and afluid exit 64. The coolant enters thethermal management unit 60 and absorbs heat fromheat spreader 66 which is contact with a component being thermally managed as further shown inFIG. 4 of the drawings. The spray module may be comprised of any thermal management device capable of thermally managing heat producing devices (e.g. spray modules, cold plates and the like). It is preferable that a two-phase spray module is utilized within the present invention. - The spray module preferably has a separate enclosed structure for retaining and thermally managing the heat producing devices. The spray module may have an integral card cage spray assembly or similar structure for retaining the heat producing devices. More than one spray module may be utilized within the present invention as can be appreciated. The spray module may include one or more spray nozzles for applying atomized coolant upon the heat producing devices. The spray module may be comprised of various well-known spray cooling systems currently available for thermally managing heat producing devices with an atomized coolant.
- The manifold 40 is preferably mounted to the
rack 12 in a vertical orientation as illustrated inFIG. 2 of the drawings. At each rack spacing, there is preferably asupply port 46 and areturn port 44 to provide and receive coolant with respect to a corresponding spray module. - At each
port male fluid connector 81, which connects to afemale connector 80 as illustrated inFIG. 7 of the drawings. Eachfemale port 80 delivers coolant to or from aspray module 60 via tubes (not shown). - The manifold 40 is preferably extruded from any of the common aluminum alloys.
FIG. 5 illustrates a cross sectional view of the extrudedmanifold 40 illustrating the formed recesses, or pockets, which follow the contour of the manifold. - By extruding down the length of the manifold 40 a
supply chamber 72 may coexist in the same structure as areturn chamber 73.Supply chamber 72 is in fluid connection withsupply ports 46, and conversely, returnchamber 73 is in fluid connection withreturn ports 44. Bothchambers return chamber 73 is preferably substantially larger than saidsupply chamber 72 as shown inFIGS. 5 and 11 of the drawings. Thechambers FIG. 11 of the drawings. - For example, according to the preferred embodiment of the present invention, the coolant being transferred in the
supply chamber 72 absorbs heat from the coolant being transferred in thereturn chamber 73. Although each closed loop system will operate at different states of pressure and temperature depending upon its design and boundary conditions, with the preferred embodiment the temperature of the coolant insupply chamber 72 is approximately 37 degrees Celsius, and the temperature of the coolant in the return chamber is approximately 54 degrees Celsius. By transferring some of the heat from the coolant in thereturn chamber 73 fluid to the coolant in thesupply chamber 72, the resulting coolant temperature inthermal management unit 60 can be increased. The resulting increase in coolant temperature within thethermal management unit 60 makes thethermal management unit 60 more effective at reducing electronic component temperatures due to increased heat transfer coefficients. - Another novel feature of the present invention is the creation of
insulation chambers 75 within the extrudedmanifold 40 as further shown inFIG. 5 of the drawings. Theinsulation chambers 75 reduce the amount of heat that can be transferred from the coolant, both the supply and return sides, to externally of the manifold. A significant goal of datacenter level cooling systems is to reduce the air cooling requirements of a rack system. By insulating thecoolant chambers manifold 40 may be greater than 50 degrees Celsius. - The
insulation chambers 75 are shown empty, but they could be filled with thermally insulating material for increased thermal performance. In addition, cooling water could flow through theinsulation chambers 75 for increased thermal performance. - As illustrated in
FIG. 3 of the drawings, the manifold 40 preferably has atop cap 51 and abottom cap 50. Although both caps can be bonded, onlybottom cap 50 is shown inFIG. 6 . Preferably,manifold cap 50 has ridges which protrude 0.100 inches into the length ofmanifold 40 and has 0.010 to 0.015 inches in clearance between the manifold walls and the cap ridges. Though other joining methods are possible (such as welding or brazing), these protrusion and clearance dimensions provide ample room for the epoxy adhesive, such as DP460, which is commercially available through 3M. Pins (not shown) may be inserted into the outside corners ofcap 50 to align the cap with themanifold channels 71. The pins may be a permanent feature or provided by a temporary gluing fixture, and provide the means to accurately aligncap 50 tomanifold 40 during the gluing or other joining process. It has been found that a hard anodizing, with no sealer, applied to both manifold 40 andcap 50 prior to bonding, creates an acceptable bonding surface that can withstand the rigors the pressure and temperature cycles of the system. Alternatively, cap 50 may be welded to cap 40. -
FIG. 7 shows the mating pair of fluid connectors,male connector 81 andfemale connector 80. Ideally,connectors snap ring 83 which resides co-axially on thefemale connector 80. To connect thefemale connector 80 to themale connector 81, thesnap ring 83 must be pulled back exposing the internal threads tofemale connector 80. When thefemale connector 80 is turned to the correct torque, thesnap ring 83 automatically moves forward indicating to the user theconnectors connectors snap ring 83 is pulled back and then twisted. This feature ensures that the mating pair is not easily disconnected by accident. Colors may be applied to the supply and return side so that users can easily distinguish which connector is for the supply and which one is for the return. Optionally, the supply and return connectors can be made different sizes. Because in a two phase system, pressure drops are more detrimental on the return side, it is more desirable to use as large of a connector on the return side as possible. The supply side can be smaller. In the preferred embodiment of the present invention, the supply side is 0.25 inches and the return side is 0.375 inches in diameter. With FLUORINERT, the o-ring material is preferably VITON® (a trademark of the DuPont corporation). - Two-phase liquid cooling systems have several design challenges, one being non-condensable gases. Non-condensable gasses are both needed to a small level, but also decrease thermal performance of the system above a certain level. The need to regulate non-condensable gases within a system is therefore necessary in order to provide the level of uptime that computing systems, especially datacenters, require. The preferred embodiment of the present invention utilizes such a system.
- Yet another novel feature of the present invention is the creating of an
active venting chamber 74. The purpose of ventingchamber 74 is to provide a place for the vertical separation of the liquid coolant, vaporized coolant and non-condensables (e.g. air) as part of the active venting system. A vacuum pump (not shown) is preferably fluidly connected to the ventingchamber 74 and draws gases and liquid out of thethermal server 30 and pushes it into ventingchamber 74. Liquid coolant falls to the bottom of ventingchamber 74 where it can be circulated back intothermal server 30. Coolant vapor within ventingchamber 74 falls just above the liquid level within the ventingchamber 74. Due to the higher pressures in comparison to the closed loop system, the vapor readily condenses to a liquid as to maintain the ventingchamber 74 in equilibrium. Air and other non-condensables rise to the top of the ventingchamber 74 wherein they can be removed via the opening of a release valve (e.g. solenoid valve) not shown in the drawings. -
FIG. 8 illustrates an alternative embodiment of the present invention. A cross sectional view of acoaxial tube manifold 100 is shown inFIG. 8 . Rather than run a supply and return line, this embodiment uses a single tube with the supply line at least partially surrounded co-axially by the return line (can also be visa-versa). This type of co-axial tube system is described U.S. Pat. No. 6,889,515 which is hereby incorporated by reference. - A
coaxial fluid connector 103 provides the ability to supply and return coolant within a single connector structure. The coaxialfluid connector 103 is preferably comprised of an inner tube and an outer tube surrounding said inner tube as illustrated in U.S. Pat. No. 6,889,515. - A
return chamber 101 is extruded withsupply chamber 102 as shown inFIG. 8 of the drawings. The coaxialfluid connector 103 mounts protrudes throughsupply chamber 102 intoreturn chamber 101. The supply coolant enters thesupply port 104 of the coaxialfluid connector 103. The return coolant leaves the coaxialfluid connector 103 through thereturn port 105 into thereturn chamber 101. The coaxialfluid connector 103 is preferably sealed via an o-ring (not shown) to thesupply chamber 102, but it is not necessary to seal thesupply chamber 102 to thereturn chamber 101. - Other embodiments of the present invention include having multiple manifolds connected to a single
thermal server 30 so that two arrays of servers 14 can be cooled with a singlethermal server 30. While the manifold 40 is shown with the fluid connectors in an equally spaced apart manner, in practice it may be more cost efficient and practical to place them as needed. - As shown in
FIG. 9 of the drawings, another feature of the present invention is acable arm 90 which provides a controlled bend radius and protection to the tubes (not shown) connecting the manifold 40 and individual servers 14 mounted in therack 12. Anarm end 92 mounts to the manifold holes 48 andserver end 94 attaches to the back of a server 14 at a PCI location. A plurality oflinks 96 are rotatably mounted into a chain structure so that they do not allow vertical translation of the chain, but allow horizontal bending to a desired minimum radius. - What has been described and illustrated herein is a preferred embodiment of the invention along with some of its variations. The terms, descriptions and figures used herein are set forth by way of illustration only and are not meant as limitations. Those skilled in the art will recognize that many variations are possible within the spirit and scope of the invention, which is intended to be defined by the following claims (and their equivalents) in which all terms are meant in their broadest reasonable sense unless otherwise indicated. Any headings utilized within the description are for convenience only and have no legal or limiting effect.
Claims (20)
1. A manifold for a coolant thermal management system, comprising:
a plurality of thermal management units in thermal communication with a plurality of heat producing devices, wherein said thermal management units each include a fluid inlet that receives a supply coolant and a fluid exit that returns a return coolant;
a thermal server for thermally conditioning said return coolant; and
a manifold including a supply chamber, a plurality of supply ports extending from the manifold, a return chamber, and a plurality of return ports extending from the manifold;
wherein said supply ports are in fluid communication with said supply chamber and said fluid inlet of said plurality of thermal management units;
wherein said return ports are in fluid communication with said return chamber and said fluid exit of said plurality of thermal management units;
wherein said thermal server is in fluid communication with said supply chamber and said return chamber, wherein said supply chamber transfers said supply coolant from said thermal server to said plurality of thermal management units and wherein said return chamber returns said return coolant from said plurality of thermal management units to said thermal server for thermal conditioning.
2. The manifold for a coolant thermal management system of claim 1 , wherein said manifold is comprised of an extruded structure.
3. The manifold for a coolant thermal management system of claim 1 , wherein said manifold is comprised of a unitary extruded aluminum structure.
4. The manifold for a coolant thermal management system of claim 1 , wherein said return chamber is in thermal communication with said supply chamber.
5. The manifold for a coolant thermal management system of claim 1 , wherein said return chamber is parallel to said supply chamber.
6. The manifold for a coolant thermal management system of claim 1 , wherein said return chamber and said supply chamber extend along a substantial length of said manifold.
7. The manifold for a coolant thermal management system of claim 1 , wherein said return chamber is adjacent to said supply chamber.
8. The manifold for a coolant thermal management system of claim 1 , wherein said plurality of supply ports and said plurality of return ports extend from said manifold in pairs.
9. The manifold for a coolant thermal management system of claim 1 , including a top cap attached to an upper end of said manifold and a bottom cap attached to a lower end of said manifold.
10. The manifold for a coolant thermal management system of claim 1 , including a venting chamber within said manifold, wherein said venting chamber is fluidly connected to said thermal server to receive gases within said thermal server.
11. The manifold for a coolant thermal management system of claim 1 , including an insulation chamber within said manifold, wherein said insulation chamber at least partially surrounds said return chamber.
12. The manifold for a coolant thermal management system of claim 11 , including an insulating material positioned within said insulation chamber.
13. The manifold for a coolant thermal management system of claim 1 , wherein said return chamber is substantially larger than said supply chamber.
14. A manifold for a coolant thermal management system, comprising:
a plurality of thermal management units in thermal communication with a plurality of heat producing devices, wherein said thermal management units each include a fluid inlet that receives a supply coolant and a fluid exit that returns a return coolant;
a thermal server for thermally conditioning said return coolant;
a manifold including a supply chamber and a return chamber; and
a plurality of coaxial fluid connectors extending into said manifold and in fluid communication with said plurality of thermal management units, wherein said coaxial fluid connectors have an inner tube and an outer tube surrounding said inner tube;
wherein said plurality of coaxial fluid connectors each include a supply port in fluid communication with said supply chamber;
wherein said plurality of coaxial fluid connectors each include a return port in fluid communication with said return chamber;
wherein said thermal server is in fluid communication with said supply chamber and said return chamber, wherein said supply chamber transfers said supply coolant from said thermal server to said plurality of thermal management units and wherein said return chamber returns said return coolant from said plurality of thermal management units to said thermal server for thermal conditioning.
15. The manifold for a coolant thermal management system of claim 14 , wherein said manifold is comprised of an extruded structure.
16. The manifold for a coolant thermal management system of claim 14 , wherein said manifold is comprised of a unitary extruded aluminum structure.
17. The manifold for a coolant thermal management system of claim 14 , wherein said return chamber is in thermal communication with said supply chamber.
18. The manifold for a coolant thermal management system of claim 14 , including a venting chamber within said manifold, wherein said venting chamber is fluidly connected to said thermal server to receive gases within said thermal server.
19. The manifold for a coolant thermal management system of claim 14 , including an insulation chamber within said manifold, wherein said insulation chamber at least partially surrounds said return chamber.
20. A manifold for a coolant thermal management system, comprising:
a plurality of thermal management units in thermal communication with a plurality of heat producing devices, wherein said thermal management units each include a fluid inlet that receives a supply coolant and a fluid exit that returns a return coolant;
a thermal server for thermally conditioning said return coolant;
a manifold including a supply chamber, a plurality of supply ports extending from the manifold, a return chamber, and a plurality of return ports extending from the manifold, wherein said return chamber is substantially larger than said supply chamber;
wherein said manifold is comprised of a unitary extruded aluminum structure;
wherein said return chamber is parallel to said supply chamber;
wherein said return chamber and said supply chamber extend along a substantial length of said manifold;
wherein said return chamber is adjacent to and in thermal communication with said supply chamber;
wherein said supply ports are in fluid communication with said supply chamber and said fluid inlet of said plurality of thermal management units;
wherein said return ports are in fluid communication with said return chamber and said fluid exit of said plurality of thermal management units;
wherein said plurality of supply ports and said plurality of return ports extend from said manifold in pairs;
wherein said thermal server is in fluid communication with said supply chamber and said return chamber, wherein said supply chamber transfers said supply coolant from said thermal server to said plurality of thermal management units and wherein said return chamber returns said return coolant from said plurality of thermal management units to said thermal server for thermal conditioning;
a top cap attached to an upper end of said manifold and a bottom cap attached to a lower end of said manifold;
a venting chamber within said manifold, wherein said venting chamber is fluidly connected to said thermal server to receive gases within said thermal server;
an insulation chamber within said manifold, wherein said insulation chamber at least partially surrounds said return chamber; and
an insulating material positioned within said insulation chamber.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US11/846,510 US20080093054A1 (en) | 2006-08-29 | 2007-08-28 | Manifold for a Two-Phase Cooling System |
PCT/US2007/077045 WO2008027931A2 (en) | 2006-08-29 | 2007-08-28 | Manifold for a two-phase cooling system |
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US84105606P | 2006-08-29 | 2006-08-29 | |
US11/846,510 US20080093054A1 (en) | 2006-08-29 | 2007-08-28 | Manifold for a Two-Phase Cooling System |
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US20080093054A1 true US20080093054A1 (en) | 2008-04-24 |
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US11/846,510 Abandoned US20080093054A1 (en) | 2006-08-29 | 2007-08-28 | Manifold for a Two-Phase Cooling System |
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US20210100134A1 (en) * | 2019-09-30 | 2021-04-01 | Baidu Usa Llc | Method for deploying liquid cooling solution in an air-cooled data center room |
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Also Published As
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WO2008027931A2 (en) | 2008-03-06 |
WO2008027931A3 (en) | 2008-11-20 |
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