US20080265333A1 - Structure and method for enhanced triple well latchup robustness - Google Patents
Structure and method for enhanced triple well latchup robustness Download PDFInfo
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- US20080265333A1 US20080265333A1 US12/169,667 US16966708A US2008265333A1 US 20080265333 A1 US20080265333 A1 US 20080265333A1 US 16966708 A US16966708 A US 16966708A US 2008265333 A1 US2008265333 A1 US 2008265333A1
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- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
- H01L27/0928—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors comprising both N- and P- wells in the substrate, e.g. twin-tub
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- H01L27/0921—Means for preventing a bipolar, e.g. thyristor, action between the different transistor regions, e.g. Latchup prevention
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- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/107—Substrate region of field-effect devices
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- H01L29/1087—Substrate region of field-effect devices of field-effect transistors with insulated gate characterised by the contact structure of the substrate region, e.g. for controlling or preventing bipolar effect
Definitions
- the embodiments of the invention generally relate to metal oxide semiconductor field effect transistor (MOSFET) devices, and, more particularly, to triple well technology in such MOSFET devices.
- MOSFET metal oxide semiconductor field effect transistor
- CMOS complementary metal oxide semiconductor
- BiCMOS bipolar CMOS
- SiGe Silicon Germanium
- the buried n+layer serves to isolate the p-well from the p-substrate. It was once believed that triple well technology would eliminate latchup. However, since in the process of isolating the p-well critical parameters that influence latchup robustness are modified, latchup remains a concern for the triple well technology in its current form. Additionally, because the buried n+ layer must overlap the n-wells in order to isolate the p-well, spacing issues present a problem in the current triple well CMOS formation process.
- CMOS device comprising a substrate with a first conductivity type (e.g., a p-substrate). Above the substrate is a first semiconductor layer with the first conductivity type (e.g., a buried p+ layer). Above the first semiconductor layer is a second semiconductor layer with a second conductivity type (e.g., an buried n+ layer).
- a first conductivity type e.g., a p-substrate
- first semiconductor layer with the first conductivity type e.g., a buried p+ layer
- second semiconductor layer with a second conductivity type e.g., an buried n+ layer
- the CMOS device also comprises both a first semiconductor well with the second conductivity type (e.g., an n-well) and a second semiconductor well with the first conductivity type (e.g., a p-well or an isolated epitaxial p-type area) that are positioned adjacent to each other and above the second semiconductor layer such that the second semiconductor well is isolated from the substrate.
- a first semiconductor well with the second conductivity type e.g., an n-well
- a second semiconductor well with the first conductivity type e.g., a p-well or an isolated epitaxial p-type area
- the first and second semiconductor layers can each have the same defined dimensions (e.g., the same length) and can be directly aligned.
- the first semiconductor layer can have first outer edges
- the second semiconductor layer can have second outer edges
- the first outer edges can be aligned directly below the second outer edges.
- the first semiconductor layer can comprise a blanket layer.
- the second semiconductor layer can have defined dimensions (e.g., a defined length) and, specifically, can have second outer edges that are positioned above the first semiconductor layer such that the first semiconductor layer extends laterally beyond the second outer edges.
- the first semiconductor layer can be placed either above or below the second semiconductor layer and can have defined dimensions (e.g., a defined length) with first outer edges.
- the first semiconductor layer and the second semiconductor layer can be positioned relative to each other such that at least one side of the second semiconductor layer extends laterally beyond one of the first outer edges of the first semiconductor layer.
- both the first and second semiconductor wells are positioned above the second semiconductor layer.
- the first semiconductor well is positioned above that side of the second semiconductor layer that extends beyond the first semiconductor layer such that the second semiconductor well and not the first semiconductor well is positioned above the first semiconductor layer.
- all three of the above-described embodiments of the invention address the issue of latchup by adding the second semiconductor layer (e.g., n+ layer) not only beneath the second semiconductor well (e.g., the p-well) but also beneath the first semiconductor well (e.g., the n-well).
- This n+ layer degrades the vertical pnp device lowering the vertical bipolar current gain of the pnp and reducing series shunt resistance of pnpn by lowering the n-well contact to p+device resistance (i.e., the effective n-well shunt resistance).
- all three of these embodiments eliminate the spacing issues by extending the n+ layer and address n-channel MOSFET threshold voltage scattering by providing the p+ layer.
- Each of these embodiments of the device can also comprise an isolation structure (e.g., a trench isolation structure (TI) or a deep trench isolation structure (DT)) within the device that extends from a top surface of the device to below an upper surface of the second semiconductor layer such that it eliminates lateral devices and, thereby, improves latchup robustness.
- the isolation structure can either bifurcate the first semiconductor well or can separate the first semiconductor well from the second semiconductor well. If the isolation structure separates the first and second semiconductor wells, then that portion of the second semiconductor layer below the second semiconductor well must abut the isolation structure to ensure that the second semiconductor well is isolated from the substrate.
- Each of these embodiments of the device can also comprise an additional isolation structure (e.g., either an additional trench isolation structure (TI) or an additional deep trench isolation structure (DT)) that surrounds the perimeter of the device in order to isolate the device from other devices on the substrate.
- an additional isolation structure e.g., either an additional trench isolation structure (TI) or an additional deep trench isolation structure (DT)
- each of these embodiments of the device can also comprise a sub-collector region having the second conductivity type between the first semiconductor well and the second semiconductor layer.
- the sub-collector region comprises a higher concentration of a second conductivity type dopant than either the first semiconductor well or the second semiconductor layer and further improves latchup robustness.
- Embodiments of the method of forming the triple well CMOS device described above comprise forming a first semiconductor layer with the first conductivity type (e.g., a buried p+ layer) above a substrate with the same first conductivity type (e.g., a p-substrate).
- a second semiconductor layer with a second conductivity type e.g., a buried n+ layer
- a first semiconductor well with the second conductivity type e.g., an n-well
- a second semiconductor well with the first conductivity type e.g., a p-well is formed adjacent to the first semiconductor well above the second semiconductor layer.
- the first semiconductor layer can be formed with defined dimensions (e.g., a defined length) such that it has first outer edges.
- the second semiconductor layer can also be formed with the same defined dimensions and can have second outer edges that are aligned directly above the first outer edges. Thus, both the first semiconductor layer and the second semiconductor layer are positioned below both of the wells.
- the first semiconductor layer can be formed as a blanket layer and the second semiconductor layer can be formed with defined dimensions (e.g., a defined length) such that it has second outer edges. The second outer edges can be positioned above the blanket layer such that both the first semiconductor layer and the second semiconductor layer are positioned below both of the wells.
- the first semiconductor layer can be formed with defined dimensions (e.g., a defined length) and, specifically, can be formed with first outer edges.
- the second semiconductor layer of this embodiment can be formed above the first semiconductor layer such that at least one side of the second semiconductor layer extends laterally beyond one of the first outer edges of the first semiconductor layer.
- both the first and second semiconductor wells are formed above the second semiconductor layer.
- the first semiconductor well is formed on that side of the second semiconductor layer that extends beyond the first semiconductor layer such that only the second semiconductor well is positioned above the first semiconductor layer.
- the method can comprise forming an isolation structure that extends from a top surface of the device to below an upper surface of the second semiconductor layer so as to eliminate lateral devices and, thereby, improve latchup robustness.
- the isolation structure can be formed to bifurcate the first semiconductor well.
- the isolation structure can be formed to separate the first semiconductor well and the second semiconductor well.
- This isolation structure can be formed as either a trench isolation structure (TI) that extends from the top surface of the device to below the upper surface of the second semiconductor layer but above the level of the first semiconductor layer.
- this isolation structure can be formed as a deep trench isolation structure (DT) that extends from the top surface of device into the substrate below the level of the first semiconductor layer.
- TI trench isolation structure
- DT deep trench isolation structure
- the method can also comprise forming an additional isolation structure around the perimeter of the device, simultaneously with forming the above-described isolation structure.
- This additional isolation structure can isolate the device from other devices formed on the same substrate.
- the method can comprise before forming the first semiconductor well, forming a sub-collector region with the second conductivity type above one side of the second semiconductor layer and then, forming the first semiconductor well above the sub-collector region.
- FIG. 1 is a schematic diagram illustrating a cross-section view of a triple well CMOS structure
- FIG. 2 is a schematic diagram illustrating a cross-section view of an embodiment of a triple well CMOS structure of the invention
- FIG. 3 is a schematic diagram illustrating a cross-section view of another embodiment of a triple well CMOS structure of the invention.
- FIGS. 4 a - b are schematic diagrams illustrating cross-section views of another embodiment of a triple well CMOS structure of the invention.
- FIG. 5 is a schematic diagram illustrating additional features incorporated into the structure of FIG. 3 ;
- FIG. 6 is a schematic diagram illustrating additional features incorporated into the structure of FIG. 3 ;
- FIG. 7 is a schematic diagram illustrating additional features incorporated into the structure of FIG. 3 ;
- FIG. 8 is a schematic diagram illustrating additional features incorporated into the structure of FIG. 3 ;
- FIG. 9 is a schematic diagram illustrating additional features incorporated into the structure of FIG. 4 ;
- FIG. 10 is a schematic diagram illustrating additional features incorporated into the structure of FIG. 4 ;
- FIG. 11 is a schematic diagram illustrating additional features incorporated into the structure of FIG. 4 ;
- FIG. 12 is a schematic diagram illustrating additional features incorporated into the structure of FIG. 4 ;
- FIG. 13 is a flow diagram illustrating an embodiment of the method of the invention.
- CMOS devices 10 that are formed using current state of the art triple well technology typically comprise a buried n+ layer 3 placed below the p-well 12 and a buried p+ layer 2 placed below the n-well 11 (or n-well/sub-collector combinations) at the same level as the n+ layer 3 , but not displaced.
- the p+ layer 2 compensates for n-channel MOSFET threshold voltage scattering.
- the n+ layer 3 serves to isolate the p-well 12 from the p-substrate 1 and, thereby, improves the latchup robustness under the n-well 11 .
- latchup remains a concern for the triple well technology in its current form (e.g., as illustrated in FIG. 1 ).
- the p+ layer 2 creates a low-resistance collector vertical pnp bipolar transistor and the n+ layer 3 creates a high npn bipolar current gain.
- These vertical devices when cross-coupled together, cause an increase in the bipolar current gain product.
- CMOS latchup is still a concern with current triple well technology.
- the pnp parasitic current gain can be significantly reduced below the base dual well CMOS levels.
- the addition of the n-type buried layer 3 increases the npn bipolar current gain.
- the reduction of the pnp bipolar current gain is a function of the buried layer design, but the increase in the npn bipolar current gain is inevitable because of the placement of the buried n-layer 3 under the p-well 12 of the n-channel MOSFET structure.
- the reduction of one bipolar current gain and the enhancement of the second bipolar current gain changes the relationships, as well as the sensitivity of the undershoot and the overshoot.
- CMOS latchup occurs in CMOS technology when a semiconductor pnpn network undergoes regenerative feedback between the parasitic pnp and npn bipolar current gain.
- a first criteria is that the pnp and npn bipolar transistors must be in forward active.
- a second criteria for CMOS latchup is when the following inequality is satisfied,
- I H ⁇ p ⁇ ( ⁇ n + 1 ) ⁇ I w + ( ⁇ p + 1 ) ⁇ ⁇ n ⁇ I sx ⁇ p ⁇ ⁇ n - 1
- I H ⁇ ⁇ ⁇ ⁇ p >> 1 ⁇ ⁇ I sx + ( ⁇ n + 1 ⁇ n ) ⁇ I w .
- the pnp bipolar current gain is significantly reduced below unity, the npn bipolar current gain is greater than unity, and the product of the bipolar current gain is greater than one.
- the symmetry of the product of the bipolar current gains in the triple well structure is distinct from the dual well bipolar current gain symmetry.
- the npn bipolar current gain is higher than the pnp bipolar current gain; in merged triple well structures, as illustrated in FIG. 1 , this asymmetry of bipolar gains is further enhanced with a greater difference between the npn and the pnp bipolar transistor.
- the triple well process may be more sensitive to the negative undershoot phenomena, but less sensitive to the positive overshoot phenomena.
- a very important advantage of the merged triple well structure over dual-well CMOS is that the latchup phenomena is not a strong function of the substrate doping concentration but a function of the p-well and the n-type isolation layer design choices.
- higher substrate doping concentrations can be used to further decrease the noise concern between digital, analog and RF circuits and sub-functions.
- the electrical isolation of the n-channel MOSFETs from the substrate can also reduce the effects from single event latchup (SEL) from ionizing radiation sources, heavy ions and alpha particles (see references [1-7]).
- the isolation from the substrate makes the merged triple well less sensitive to other sources of minority carrier injection into the substrate, such as Cable Discharge Events (CDE) (see references [8-13]).
- CDE Cable Discharge Events
- the triple well structure has advantages over the dual well structure; however, structural solutions are needed to improve the latchup robustness of this triple well structure. Additionally, because the n-layer 3 must overlap the n-well 11 in order to isolate the p-well 12 spacing issues present problems in the current triple well formation process.
- CMOS device structure that addresses the issue of latchup by adding an n+ buried layer not only beneath the p-well to isolate the p-well from the p-substrate but also beneath the n-wells.
- This n+ buried layer degrades the vertical pnp bipolar current gain.
- the structure eliminates the spacing issues between the n-well and n+ buried layer during the formation process by extending the n+ buried layer below the entire device and not just the p-well.
- the structure also addresses the issue of threshold voltage scattering by providing a p+ buried layer below the entire device under the n+ buried layer or below the p-well side of the device either under or above the n+ buried layer.
- FIGS. 2-4 illustrate three embodiments of the triple well CMOS device of the invention.
- FIG. 2 provides a triple well CMOS device 200 comprising a substrate 201 , with a first conductivity type (e.g., a low-doped p-type substrate (i.e., p-substrate)). Above the substrate 201 is a first semiconductor layer 202 also with this first conductivity type (e.g., a high-doped p-type layer (i.e., a buried p+ layer)). Above the first semiconductor layer 202 is a second semiconductor layer 203 with a second conductivity type (e.g., a high-doped n-type layer (i.e., a buried n+ layer).
- a first conductivity type e.g., a low-doped p-type substrate (i.e., p-substrate)
- a first semiconductor layer 202 also with this first conductivity type (e.g., a high-doped p-type layer (i.e., a
- the second semiconductor layer 203 is a first semiconductor well 211 with the second conductivity type (e.g., an n-well) and a second semiconductor well 212 with the first conductivity type (e.g., a p-well or an isolated expitaxial p-type region).
- the first semiconductor layer 202 can have the same dimensions and particularly, the same length as the second semiconductor layer 203 .
- the first semiconductor layer 202 can have first outer edges 222
- the second semiconductor layer 203 can have second outer edges 223
- the first outer edges 222 can be aligned directly below the second outer edges 223 .
- the primary function of the first semiconductor layer 202 is to compensate for n-channel MOSFET threshold voltage scattering and the primary function of the second semiconductor layer 203 is to isolate the second semiconductor well 212 from the substrate 201 .
- this embodiment creates a high capacitance triple well capacitor with the first 202 and second 203 semiconductor layers. It also provides a high-doping to low-doping interface (e.g., p+ layer to p-substrate interface) between the first semiconductor layer 202 and the substrate 201 having the same conductivity type and creates a low shunt resistance. This interface prevents minority carrier collection in the first semiconductor well (e.g., n-well) for external latchup.
- a high-doping to low-doping interface e.g., p+ layer to p-substrate interface
- FIG. 3 provides a triple well CMOS device 300 comprising a substrate 301 , with a first conductivity type (e.g., a low-doped p-type substrate (i.e., p-substrate)). Above the substrate 301 is a first semiconductor layer 302 also with this first conductivity type (e.g., a high-doped p-type layer (i.e., a buried p+ layer)). Above the first semiconductor layer 302 is a second semiconductor layer 303 with a second conductivity type (e.g., a high-doped n-type layer (i.e., a buried n+ layer).
- a first conductivity type e.g., a low-doped p-type substrate (i.e., p-substrate)
- a first semiconductor layer 302 also with this first conductivity type (e.g., a high-doped p-type layer (i.e., a
- the second semiconductor layer 303 is a first semiconductor well 311 with the second conductivity type (e.g., an n-well) and a second semiconductor well 312 with the first conductivity type (e.g., a p-well or an isolated expitaxial p-type region).
- the first semiconductor layer 302 can be longer than the second semiconductor layer 303 .
- the first semiconductor layer 302 can comprise a blanket layer over the substrate 301 .
- the second semiconductor layer 303 can have defined dimensions and, particularly, a defined length with second outer edges 323 above the blanket layer such that the first semiconductor layer 302 extends laterally beyond the second outer edges 323 .
- the primary function of the first semiconductor layer 302 is to compensate for n-channel MOSFET threshold voltage scattering and the primary function of the second semiconductor layer 303 is to isolate the second semiconductor well 312 from the substrate 301 .
- this embodiment creates a high capacitance triple well capacitor with the first 302 and second 303 semiconductor layers. It also provides a high-doping to low-doping interface (e.g., p+ layer to p-substrate interface) between the first semiconductor layer 302 and the substrate 301 having the same conductivity type and creates a low shunt resistance. This interface prevents minority carrier collection in the first semiconductor well (e.g., n-well) for external latchup.
- FIGS. 4 a and 4 b illustrate another embodiment of the triple well CMOS device structure of the invention.
- Each of the devices 400 a of FIGS. 4 a and 400 b of FIG. 4 b comprise a substrate with a first conductivity type (e.g., a low-doped p-type substrate (i.e., p-substrate)).
- a first conductivity type e.g., a low-doped p-type substrate (i.e., p-substrate)
- first semiconductor layer 402 with this first conductivity type e.g., a high-doped p-type layer (i.e., a buried p+ layer)
- second semiconductor layer 403 with a second conductivity type e.g., a high-doped n-type layer (i.e., a buried n+ layer).
- first semiconductor well 411 with the second conductivity type e.g., an n-well
- second semiconductor well 412 with the first conductivity type e.g., a p-well or an isolated expitaxial p-type region
- the first semiconductor layer 402 can be positioned either below the second semiconductor layer 403 (as illustrated in device 400 a of FIG. 4 a ) or above the second semiconductor layer 403 (as illustrated in device 400 b of FIG. 4 b ).
- the first semiconductor layer 402 has defined dimensions (e.g., a defined length) with first outer edges 422 a - b .
- one side 443 of the second semiconductor layer 403 extends laterally beyond one of the first outer edges (e.g., first outer edge 422 a ) of the first semiconductor layer 402 .
- the first semiconductor well 411 is positioned on that side 443 of the second semiconductor layer 403 that extends beyond the first semiconductor layer 402 such that the second semiconductor well 412 and not the first semiconductor well 411 is positioned above the first semiconductor layer 402 .
- the primary function of the first semiconductor layer 402 is to compensate for n-channel MOSFET threshold voltage scattering and the primary function of the second semiconductor layer 403 is to isolate the second semiconductor well 412 from the substrate 401 .
- This embodiment creates a low resistance region on the first semiconductor well 411 side of the device 400 and a lower pnp gain characteristic.
- This embodiment also allows for an increase in the collector resistance of the vertical npn transistor on the second semiconductor well 412 side of the device by increasing the sheet resistance of the n+ layer 403 under the isolated p-well 412 .
- the p+ layer 402 below the p-well compensates for n-channel MOSFET threshold voltage scattering.
- the CMOS devices 200 , 300 , and 400 a - b can further comprise a first n+ diffusion region 161 and a first p+ diffusion region 162 above the first semiconductor well 211 , 311 , 411 and a second n+ diffusion region 163 and a second p+ diffusion region 164 above the second semiconductor well 212 , 312 , 412 .
- the first n+ diffusion region 161 can represent a contact to the n-well.
- the first p+ diffusion region 162 can represent any p+ device, e.g., a p+ diode, a p-FET, a bipolar transistor, a p-doped resistor, etc.
- the second n+ diffusion region 163 can represent any n+ device, e.g., an n+ diode, an n-FET, a bipolar transistor, an n-doped resistor, etc.
- the second p+ diffusion region 164 can represent a contact to the p-well 212 , 312 , 412 .
- Each of diffusion regions 161 - 164 may be separated by shallow trench isolation structures (STI) 170 (e.g., insulator-filled trenches that extend into the wells just below the diffusion regions 161 - 164 ).
- STI shallow trench isolation structures
- all three of the above-described embodiments of the invention address the issue of latchup by adding the second semiconductor layer 203 , 303 , 403 (n+ layer) not only beneath the second semiconductor well 212 , 312 , 412 (p-well) but also beneath the first semiconductor well 211 , 311 , 411 (n-well).
- This second semiconductor layer 203 , 303 , 403 (n+ layer) degrades the vertical pnp bipolar current gain and also lowers the n-well contact to p+ device shunt resistance.
- all three of these embodiments eliminate the spacing issues between the n-well 211 , 311 , 411 and the n+ layer 203 , 303 , 403 by extending the n+ layer below the entire device.
- These embodiments also address n-channel MOSFET threshold voltage scattering by providing the p+ layer 202 , 302 , 402 .
- the semiconductor layers and wells of the invention may be doped with appropriate dopants at appropriate concentrations suitable to achieve the desired conductivity type and doping-level.
- a p-substrate, a p+ layer, and a p-well may each be doped with a suitable p-type dopant, such as, Boron.
- a suitable p-type dopant such as, Boron.
- an n+ layer, an n-well, and an n-type sub-collector region may each be doped with a suitable n-type dopant, such as, Phosphorus, Arsenic or Antimony.
- each of these above-described embodiments of the invention can also comprise an isolation structure that extends from the top surface of the device to below an upper surface of the second semiconductor layer serves to eliminate all lateral devices (e.g., lateral npn, pnp, or pnpn devices) and, thereby, improve latchup robustness.
- this isolation structure can be a trench isolation structure (TI) (e.g., an insulator-filled trench such as a back end of line (BEOL) BPSG or PSG inter-level dielectric-filled trench) that extends from the top surface of the device to below the upper surface of the second semiconductor layer.
- TI trench isolation structure
- this isolation structure can be a deep trench isolation structure (DT) (e.g., an oxide or other insulator-lined trench filled with a semiconductor material, such as polysilicon) that extends from the top surface of the device just below the STI structures 161 - 164 into the substrate below the level of the first semiconductor layer.
- DT deep trench isolation structure
- this isolation structure can either bifurcate the first semiconductor well or separate the first and second semiconductor wells. If the isolation structure separates the first and second semiconductor wells, then a portion of the second semiconductor layer below the second semiconductor well must abut the isolation structure.
- FIGS. 5-8 illustrate an isolation structure incorporated into device 300 of FIG. 3
- FIGS. 9-12 illustrate an isolation structure incorporated into a device 400 a of FIG. 4 a .
- isolation structures are not specifically illustrated for device 200 of FIG. 2 , those skilled in the art will recognize that due to the similarity of the devices 200 and 300 , the configuration would be the same as illustrated in FIGS. 5-8 . Similarly, while such isolation structures are not specifically illustrated for device 400 b of FIG. 4 b , those skilled in the art will recognize that due to the similarity of the devices 400 a and 400 b , the configuration would be the same as illustrated in FIGS. 9-12 .
- FIG. 5 illustrates an isolation structure 551 incorporated into the device 300 of FIG. 3 .
- the isolation structure 551 comprises a deep trench isolation structure (DT) that extends from the top surface 591 of the device 500 just below a shallow trench isolation structure (STI) 170 to below the upper surface 531 of the second semiconductor layer 503 through the first semiconductor layer 502 and into the substrate 501 .
- the isolation structure 551 bifurcates the first semiconductor well 511 .
- the second semiconductor layer 503 comprises two discrete portions 503 a and 503 b separated by a gap 553 such that it extends into the substrate 501 without contacting the second semiconductor layer 503 .
- it is anticipated that either one or both portions 503 a - b of the second semiconductor layer may abut the isolation structure 551 .
- FIG. 6 illustrates an isolation structure 651 incorporated into the device 300 of FIG. 3 .
- the isolation structure 651 comprises a trench isolation structure (TI) that extends from the top surface 691 of the device 600 to below an upper surface 631 of the second semiconductor layer 603 , but above the level of the first semiconductor layer 602 .
- the isolation structure 651 bifurcates the first semiconductor well 611 .
- the second semiconductor layer 603 comprises two discrete portions 603 a and 603 b separated by a gap 653 such that the isolation structure 651 extends between the portions 603 a - b but does contact them. However, it is anticipated that either one or both portions 603 a - b of the second semiconductor layer may abut the isolation structure 651 .
- FIG. 7 illustrates an isolation structure 751 incorporated into the device 300 of FIG. 3 .
- the isolation structure 751 comprises a deep trench isolation structure (DT) that extends from the top surface 791 of the device 700 just below a shallow trench isolation structure (STI) 170 to below the upper surface 731 of the second semiconductor layer 703 through the first semiconductor layer 702 and into the substrate 701 .
- the isolation structure 551 separates the first semiconductor well 711 from the second semiconductor well 712 . To ensure that the second semiconductor well 712 remains isolated from the substrate 701 that portion 703 b of the second semiconductor layer 703 that is positioned below the second semiconductor well 712 abuts the isolation structure 751 . While FIG. 7 illustrates both portions 703 a and 703 b abutting the isolation structure, it is understood that this is not required of portion 703 a.
- FIG. 8 illustrates an isolation structure 851 incorporated into the device 300 of FIG. 3 .
- the isolation structure 851 comprises a trench isolation structure (TI) that extends from the top surface 891 of the device 800 to below an upper surface 831 of the second semiconductor layer 803 but above the level of the first semiconductor layer 802 .
- the isolation structure 851 separates the first semiconductor well 811 from the second semiconductor well 812 .
- FIG. 9 illustrates an isolation structure 951 incorporated into the device 400 a of FIG. 4 a .
- the isolation structure 951 comprises a deep trench isolation structure (DT) that extends from the top surface 991 of the device 900 just below a shallow trench isolation structure (STI) 170 to below the upper surface 931 of the second semiconductor layer 903 adjacent to the first semiconductor layer 902 and into the substrate 901 below the level of the first semiconductor layer 902 .
- the isolation structure 951 bifurcates the first semiconductor well 911 .
- the second semiconductor layer 903 comprises two discrete portions 903 a and 903 b separated by a gap 953 such that the isolation structure 951 extends into the substrate without contacting the second semiconductor layer 903 .
- FIG. 10 illustrates an isolation structure 1051 incorporated into the device 400 a of FIG. 4 a .
- the isolation structure 1051 comprises a trench isolation structure (TI) that extends from the top surface 1091 of the device 1000 to below an upper surface 1031 of the second semiconductor layer 1003 but above an upper surface of the first semiconductor layer 1002 .
- the isolation structure 1051 bifurcates the first semiconductor well 1011 .
- the isolation trench 1051 contacts the second semiconductor layer 1003 .
- the semiconductor layer 1003 could comprises two discrete portions separated by a gap such that the isolation structure 1051 extends between the portions but does contact them.
- FIG. 11 illustrates an isolation structure 1151 incorporated into the device 400 a of FIG. 4 a .
- the isolation structure 1151 comprises a deep trench isolation structure (DT) that extends from the top surface 1191 of the device 1100 just below a shallow trench isolation structure (STI) 170 to below the upper surface 1131 of the second semiconductor layer 703 adjacent to first semiconductor layer 1102 and into the substrate 1101 .
- the isolation structure 1151 separates the first semiconductor well 1111 from the second semiconductor well 1112 .
- that portion 1103 b of the second semiconductor layer 1103 a - b that is positioned below the second semiconductor well 1112 abuts the isolation structure 751 . While FIG. 11 illustrates both portions 1103 a and 1103 b abutting the isolation structure, it is understood that this is not required of portion 1103 a.
- FIG. 12 illustrates an isolation structure 1251 incorporated into the device 400 a of FIG. 4 a .
- the isolation structure 1251 comprises a trench isolation structure (TI) that extends from the top surface 1291 of the device 1200 to below an upper surface 1231 of the second semiconductor layer 1203 , but above the level of the first semiconductor layer 1202 .
- the isolation structure 1251 separates the first semiconductor well 1211 from the second semiconductor well 1212 .
- that portion 1203 b of the second semiconductor layer 1203 a - b that is positioned below the second semiconductor well 1212 abuts the isolation structure 1251 . While FIG. 12 illustrates both portions 1203 a and 1203 b abutting the isolation structure 1251 , it is understood that this is not required of portion 1203 a.
- the type of isolation structure used can be a function of the type of wafer technology used to form the device and, particularly, a function of the thickness of the wafer.
- each of the above-described embodiments of the invention can also comprise an additional isolation structure 152 .
- the additional isolation structure 152 can be either an additional trench isolation structure (TI) (see FIGS. 6 , 8 , 10 , and 12 ) that extends from the top surface of the device to below an upper surface of the second semiconductor layer or an additional deep trench isolation structure (DT) (see FIGS. 5 , 7 , 9 , and 11 ) that extends from the top surface of the device just below a shallow trench isolation structure (STI) into the substrate.
- This additional isolation structure 152 can surround the perimeter of the device in order to isolate the device from other devices on the substrate.
- each of the above-described embodiments of the invention can also comprise a sub-collector region 160 positioned between the first semiconductor well and the second semiconductor layer.
- the sub-collector region 160 can comprise a semiconductor region having a higher concentration of the second conductivity type dopant than either the first semiconductor well or the second semiconductor layer. This sub-collector region with a very high doping concentration can further degrade the vertical bipolar current gain, providing a very low resistance shunt back to the first semiconductor well (n-well) so as to further prevent latchup from occurring.
- embodiments of the method of forming the triple well CMOS device with the required and optional features described above comprise forming above a substrate with a first type conductivity both a first semiconductor layer with the first conductivity type (e.g., a buried p+ layer) type (e.g., a p-substrate) ( 1302 ) and a second semiconductor layer with a second conductivity type (e.g., a buried n+ layer) ( 1308 ).
- first semiconductor layer with the first conductivity type e.g., a buried p+ layer
- a second semiconductor layer with a second conductivity type e.g., a buried n+ layer
- a first semiconductor well with the second conductivity type (e.g., an n-well) is formed above one side of the second semiconductor layer and second semiconductor well with the first conductivity type (e.g., a p-well) is formed above a second side of the second semiconductor layer adjacent to the first semiconductor well ( 1318 ).
- the above-mentioned buried layers and wells with differing conductivity types may be formed using well-known deposition, implantation and/or out-diffusion techniques.
- P-type wells and layers may be doped with appropriate levels of Boron.
- N-type wells and layers may be doped with appropriate levels of Phosphorus, Arsenic, or Antimony.
- the first semiconductor layer 202 can be formed (at process 1302 ) with a defined length such that it has first outer edges 222 ( 1306 ).
- the second semiconductor layer 203 can be formed (at process 1308 ) above the first semiconductor layer and with the same defined length such that it has second outer edges 223 that are aligned directly above the first outer edges 222 ( 1312 ).
- first and second semiconductor wells 211 and 212 are both formed above the second semiconductor layer 203 (at process 1318 ), they are also both formed above the first semiconductor layer 202 ( 1320 ).
- the first semiconductor layer 302 can be formed (at process 1302 ) as a blanket layer ( 1304 ).
- the second semiconductor layer 303 can be formed (at process 1308 ) above the first semiconductor layer and with defined dimensions (e.g., a defined length) such that it has second outer edges 323 that are above the blanket layer 303 ( 1310 ).
- defined dimensions e.g., a defined length
- the first semiconductor layer 402 and the second semiconductor layer 403 may be formed (at process 1302 and 1308 ) such that the first semiconductor layer 402 is either above or below the second semiconductor layer 403 relative to the substrate 401 .
- the first semiconductor layer 402 can be formed (at process 1306 ) with a defined length such that is has first outer edges 422 a - b ( 1306 ) and the second semiconductor layer 403 can be formed (at process 1308 ) such that at least one side 443 of the second semiconductor layer 403 extends laterally beyond at least one of the first outer edges (e.g., 422 a ).
- the first semiconductor well 411 is formed over the side 443 that extends laterally beyond the outer edge of the first semiconductor layer 402 .
- the second semiconductor well 412 and not the first semiconductor well 411 is formed above the first semiconductor layer 402 ( 1322 ).
- the method can comprise forming an isolation structure that extends from the top surface of the device to below an upper surface of the second semiconductor layer such that it eliminates all lateral devices (e.g., lateral npn, pnp, or pnpn devices) and, thereby, improves latchup robustness ( 1324 , see FIGS. 5-12 ).
- the isolation structure can be formed such that it bifurcates the first semiconductor well ( 1328 , see FIGS. 5-6 and 9 - 10 ).
- the isolation structure can be formed such that it separates the first semiconductor well and the second semiconductor well ( 1330 , see FIGS. 7-8 and 11 - 12 ). If the isolation structure separates the first and second semiconductor wells, it must further be formed such that a portion of the second semiconductor layer below the second semiconductor well abuts the isolation structure in order to isolate the second well from the substrate.
- the above-described isolation structure can be formed as a trench isolation structure (TI) (e.g., e.g., an insulator-filled trench such as a back end of line (BEOL) BPSG or PSG inter-level dielectric-filled trench) that extends from the top surface of the device to below an upper surface of the second semiconductor layer but above the level of the first semiconductor layer (see FIGS. 6 , 8 , 10 and 12 , and the above discussion of trench isolation structure).
- TI trench isolation structure
- BEOL back end of line
- the isolation structure can be formed as a deep trench isolation structure (DT) (e.g., an oxide or other insulator-lined trench filled with a semiconductor material, such as polysilicon) that extends from the top surface of the device just below the level of a shallow trench isolation structure (STI) into the substrate below the level of the first semiconductor layer (see FIGS. 5 , 7 , 9 and 11 and above discussion of deep trench isolation structure (DT)).
- DT deep trench isolation structure
- STI shallow trench isolation structure
- the method can also comprise forming an additional isolation structure 352 , 452 around a perimeter of the device ( 1326 , see FIGS. 5-12 ).
- the additional isolation structure can be formed simultaneously with the forming of the above-described isolation structure (at process 1324 ) and can similarly be formed as either a trench isolation structure (TI) (see FIGS. 6 , 8 , 10 and 12 ) or deep trench isolation structure (DT) (see FIGS. 5 , 7 , 9 and 12 ), depending on the wafer technology used to form the device.
- This additional isolation structure 352 , 452 can serve to isolate the device from other devices formed on the same substrate.
- the method can also optionally comprise before forming the first semiconductor well, forming a sub-collector region 360 , 460 with the second conductivity type above the second semiconductor layer and then, forming the first semiconductor well so that it is aligned above the sub-collector region ( 1316 , see FIGS. 5-12 ).
- the sub-collector region 360 , 460 can be formed by implanting a region above the second semiconductor layer with a higher concentration of the second conductivity type dopant than either the second semiconductor layer 303 , 403 or the subsequently formed first semiconductor well 311 , 411 .
- This sub-collector region with a very high doping concentration can further degrade the vertical bipolar current gain and provide a very low resistance shunt back to the first semiconductor well (n-well) so as to further prevent latchup from occurring.
- a first n+ diffusion region 161 and a first p+ diffusion region 162 can be formed above the first semiconductor well and a second n+ diffusion region 163 and a second p+ diffusion region 164 can be formed above the second semiconductor well.
- the first n+ diffusion region 161 can be formed as a contact to the n-well.
- the first p+ diffusion region 162 can be formed as any p+device, e.g., a p+diode, a p-FET, a bipolar transistor, a p-doped resistor, etc.
- the second n+ diffusion region 163 can be formed as any n+ device, e.g., an n+ diode, an n-FET, a bipolar transistor, an n-doped resistor, etc.
- the second p+ diffusion region 164 can be formed as a contact to the p-well 212 , 312 , 412 .
- shallow trench isolation structures (STI) 170 can be formed to isolate each of the diffusion regions 161 - 164 .
- CMOS device structure that establishes a triple well, compensates for threshold voltage scattering, improves latchup robustness, establishes a high well-substrate capacitor, provides low resistance in the substrate and shields the n+ buried layer from minority carrier injection, external latchup and SER issues.
- this triple well CMOS device structure addresses the issue of latchup by adding an n+ buried layer not only beneath the p-well to isolate the p-well from the p-substrate but also beneath the n-well. The n+ buried layer degrades the vertical pnp bipolar current gain and lowers n-well contact to p+ device shunt resistance.
- the structure eliminates the spacing issues between the n-well and n+ buried layer by entending the n+ buried layer below the entire device.
- the structure also addresses the issue of threshold voltage scattering by providing a p+ buried layer below the entire device under the n+ buried layer or below the p-well side of the device either under or above the n+ buried layer. Latchup robustness can further be improved by incorporating into the device an isolation structure that either bifurcates the first n-well or separates n-well and the p-well so as to eliminate lateral pnp, npn, or pnpn devices.
- Latchup robustness can also be improved by incorporating into the device a sub-collector region between the n+ buried layer and the n-well.
- device performance can be improved by providing additional isolation structures around the device perimeter so as to isolate the device from other devices on the same substrate.
Abstract
Description
- This application is a divisional of U.S. application Ser. No. 11/275,644 filed Jan. 20, 2006.
- 1. Field of the Invention
- The embodiments of the invention generally relate to metal oxide semiconductor field effect transistor (MOSFET) devices, and, more particularly, to triple well technology in such MOSFET devices.
- 2. Description of the Related Art
- Both noise isolation and the elimination of CMOS latchup are significant issues in advanced complementary metal oxide semiconductor (CMOS) technology and bipolar CMOS (BiCMOS) Silicon Germanium (SiGe) technology. More particularly, as MOSFET threshold voltages decrease, the need to isolate circuitry from noise sources becomes more important and has lead to an increased interest in “isolated MOSFETs” (i.e., triple well technology). In current triple well technology, a buried n-type layer (i.e., a buried n+ layer) is placed below the p-well and a buried p-type layer (i.e., a p+ layer) is placed below the n-well (or n-well/sub-collector combinations) at the same level, but not displaced. The buried n+layer serves to isolate the p-well from the p-substrate. It was once believed that triple well technology would eliminate latchup. However, since in the process of isolating the p-well critical parameters that influence latchup robustness are modified, latchup remains a concern for the triple well technology in its current form. Additionally, because the buried n+ layer must overlap the n-wells in order to isolate the p-well, spacing issues present a problem in the current triple well CMOS formation process.
- In view of the foregoing, embodiments of the invention provide a triple well CMOS device comprising a substrate with a first conductivity type (e.g., a p-substrate). Above the substrate is a first semiconductor layer with the first conductivity type (e.g., a buried p+ layer). Above the first semiconductor layer is a second semiconductor layer with a second conductivity type (e.g., an buried n+ layer). The CMOS device also comprises both a first semiconductor well with the second conductivity type (e.g., an n-well) and a second semiconductor well with the first conductivity type (e.g., a p-well or an isolated epitaxial p-type area) that are positioned adjacent to each other and above the second semiconductor layer such that the second semiconductor well is isolated from the substrate.
- In one embodiment of the device the first and second semiconductor layers can each have the same defined dimensions (e.g., the same length) and can be directly aligned. For example, the first semiconductor layer can have first outer edges, the second semiconductor layer can have second outer edges, and the first outer edges can be aligned directly below the second outer edges. In another embodiment of the device the first semiconductor layer can comprise a blanket layer. The second semiconductor layer can have defined dimensions (e.g., a defined length) and, specifically, can have second outer edges that are positioned above the first semiconductor layer such that the first semiconductor layer extends laterally beyond the second outer edges. In yet another embodiment the first semiconductor layer can be placed either above or below the second semiconductor layer and can have defined dimensions (e.g., a defined length) with first outer edges. The first semiconductor layer and the second semiconductor layer can be positioned relative to each other such that at least one side of the second semiconductor layer extends laterally beyond one of the first outer edges of the first semiconductor layer. As with the previously described embodiments, in this embodiment both the first and second semiconductor wells are positioned above the second semiconductor layer. However, the first semiconductor well is positioned above that side of the second semiconductor layer that extends beyond the first semiconductor layer such that the second semiconductor well and not the first semiconductor well is positioned above the first semiconductor layer.
- Thus, all three of the above-described embodiments of the invention address the issue of latchup by adding the second semiconductor layer (e.g., n+ layer) not only beneath the second semiconductor well (e.g., the p-well) but also beneath the first semiconductor well (e.g., the n-well). This n+ layer degrades the vertical pnp device lowering the vertical bipolar current gain of the pnp and reducing series shunt resistance of pnpn by lowering the n-well contact to p+device resistance (i.e., the effective n-well shunt resistance). Additionally, all three of these embodiments eliminate the spacing issues by extending the n+ layer and address n-channel MOSFET threshold voltage scattering by providing the p+ layer.
- Each of these embodiments of the device can also comprise an isolation structure (e.g., a trench isolation structure (TI) or a deep trench isolation structure (DT)) within the device that extends from a top surface of the device to below an upper surface of the second semiconductor layer such that it eliminates lateral devices and, thereby, improves latchup robustness. The isolation structure can either bifurcate the first semiconductor well or can separate the first semiconductor well from the second semiconductor well. If the isolation structure separates the first and second semiconductor wells, then that portion of the second semiconductor layer below the second semiconductor well must abut the isolation structure to ensure that the second semiconductor well is isolated from the substrate.
- Each of these embodiments of the device can also comprise an additional isolation structure (e.g., either an additional trench isolation structure (TI) or an additional deep trench isolation structure (DT)) that surrounds the perimeter of the device in order to isolate the device from other devices on the substrate.
- Lastly, each of these embodiments of the device can also comprise a sub-collector region having the second conductivity type between the first semiconductor well and the second semiconductor layer. The sub-collector region comprises a higher concentration of a second conductivity type dopant than either the first semiconductor well or the second semiconductor layer and further improves latchup robustness.
- Embodiments of the method of forming the triple well CMOS device described above comprise forming a first semiconductor layer with the first conductivity type (e.g., a buried p+ layer) above a substrate with the same first conductivity type (e.g., a p-substrate). A second semiconductor layer with a second conductivity type (e.g., a buried n+ layer) is formed above the first semiconductor layer. A first semiconductor well with the second conductivity type (e.g., an n-well) is formed above the second semiconductor layer. Additionally, a second semiconductor well with the first conductivity type (e.g., a p-well) is formed adjacent to the first semiconductor well above the second semiconductor layer.
- In one embodiment of the invention the first semiconductor layer can be formed with defined dimensions (e.g., a defined length) such that it has first outer edges. The second semiconductor layer can also be formed with the same defined dimensions and can have second outer edges that are aligned directly above the first outer edges. Thus, both the first semiconductor layer and the second semiconductor layer are positioned below both of the wells. Similarly, in another embodiment of the invention, the first semiconductor layer can be formed as a blanket layer and the second semiconductor layer can be formed with defined dimensions (e.g., a defined length) such that it has second outer edges. The second outer edges can be positioned above the blanket layer such that both the first semiconductor layer and the second semiconductor layer are positioned below both of the wells. In yet another embodiment of the invention, the first semiconductor layer can be formed with defined dimensions (e.g., a defined length) and, specifically, can be formed with first outer edges. The second semiconductor layer of this embodiment can be formed above the first semiconductor layer such that at least one side of the second semiconductor layer extends laterally beyond one of the first outer edges of the first semiconductor layer. In this embodiment both the first and second semiconductor wells are formed above the second semiconductor layer. However, the first semiconductor well is formed on that side of the second semiconductor layer that extends beyond the first semiconductor layer such that only the second semiconductor well is positioned above the first semiconductor layer.
- Additionally, the method can comprise forming an isolation structure that extends from a top surface of the device to below an upper surface of the second semiconductor layer so as to eliminate lateral devices and, thereby, improve latchup robustness. The isolation structure can be formed to bifurcate the first semiconductor well. Alternatively, the isolation structure can be formed to separate the first semiconductor well and the second semiconductor well. However, if the isolation structure separates the first and second semiconductor wells, it must further be formed such that a portion of the second semiconductor layer below the second semiconductor well abuts the isolation structure in order to isolate the second semiconductor well from the substrate. This isolation structure can be formed as either a trench isolation structure (TI) that extends from the top surface of the device to below the upper surface of the second semiconductor layer but above the level of the first semiconductor layer. Alternatively, this isolation structure can be formed as a deep trench isolation structure (DT) that extends from the top surface of device into the substrate below the level of the first semiconductor layer.
- The method can also comprise forming an additional isolation structure around the perimeter of the device, simultaneously with forming the above-described isolation structure. This additional isolation structure can isolate the device from other devices formed on the same substrate.
- To further improve latchup robustness within the device, the method can comprise before forming the first semiconductor well, forming a sub-collector region with the second conductivity type above one side of the second semiconductor layer and then, forming the first semiconductor well above the sub-collector region.
- These and other aspects of the embodiments of the invention will be better appreciated and understood when considered in conjunction with the following description and the accompanying drawings. It should be understood, however, that the following descriptions, while indicating embodiments of the invention and numerous specific details thereof, are given by way of illustration and not of limitation. Many changes and modifications may be made within the scope of the embodiments of the invention without departing from the spirit thereof, and the embodiments of the invention include all such modifications.
- The embodiments of the invention will be better understood from the following detailed description with reference to the drawings, in which:
-
FIG. 1 is a schematic diagram illustrating a cross-section view of a triple well CMOS structure; -
FIG. 2 is a schematic diagram illustrating a cross-section view of an embodiment of a triple well CMOS structure of the invention; -
FIG. 3 is a schematic diagram illustrating a cross-section view of another embodiment of a triple well CMOS structure of the invention; -
FIGS. 4 a-b are schematic diagrams illustrating cross-section views of another embodiment of a triple well CMOS structure of the invention; -
FIG. 5 is a schematic diagram illustrating additional features incorporated into the structure ofFIG. 3 ; -
FIG. 6 is a schematic diagram illustrating additional features incorporated into the structure ofFIG. 3 ; -
FIG. 7 is a schematic diagram illustrating additional features incorporated into the structure ofFIG. 3 ; -
FIG. 8 is a schematic diagram illustrating additional features incorporated into the structure ofFIG. 3 ; -
FIG. 9 is a schematic diagram illustrating additional features incorporated into the structure ofFIG. 4 ; -
FIG. 10 is a schematic diagram illustrating additional features incorporated into the structure ofFIG. 4 ; -
FIG. 11 is a schematic diagram illustrating additional features incorporated into the structure ofFIG. 4 ; -
FIG. 12 is a schematic diagram illustrating additional features incorporated into the structure ofFIG. 4 ; and -
FIG. 13 is a flow diagram illustrating an embodiment of the method of the invention. - The embodiments of the invention and the various features and advantageous details thereof are explained more fully with reference to the non-limiting embodiments that are illustrated in the accompanying drawings and detailed in the following description. It should be noted that the features illustrated in the drawings are not necessarily drawn to scale. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments of the invention. The examples used herein are intended merely to facilitate an understanding of ways in which the embodiments of the invention may be practiced and to further enable those of skill in the art to practice the embodiments of the invention. Accordingly, the examples should not be construed as limiting the scope of the embodiments of the invention.
- As mentioned above, and referring to
FIG. 1 ,CMOS devices 10 that are formed using current state of the art triple well technology typically comprise a buriedn+ layer 3 placed below the p-well 12 and a buriedp+ layer 2 placed below the n-well 11 (or n-well/sub-collector combinations) at the same level as then+ layer 3, but not displaced. Thep+ layer 2 compensates for n-channel MOSFET threshold voltage scattering. Then+ layer 3 serves to isolate the p-well 12 from the p-substrate 1 and, thereby, improves the latchup robustness under the n-well 11. However, while it was once believed that triple well technology would eliminate latchup, latchup remains a concern for the triple well technology in its current form (e.g., as illustrated inFIG. 1 ). Specifically, in the process of isolating the p-well 12, critical parameters that influence latchup robustness are modified. Namely, thep+ layer 2 creates a low-resistance collector vertical pnp bipolar transistor and then+ layer 3 creates a high npn bipolar current gain. These vertical devices, when cross-coupled together, cause an increase in the bipolar current gain product. Thus, CMOS latchup is still a concern with current triple well technology. - More particularly, by using triple well technology the pnp parasitic current gain can be significantly reduced below the base dual well CMOS levels. Additionally, the addition of the n-type buried
layer 3 increases the npn bipolar current gain. The reduction of the pnp bipolar current gain is a function of the buried layer design, but the increase in the npn bipolar current gain is inevitable because of the placement of the buried n-layer 3 under the p-well 12 of the n-channel MOSFET structure. The reduction of one bipolar current gain and the enhancement of the second bipolar current gain changes the relationships, as well as the sensitivity of the undershoot and the overshoot. - Latchup occurs in CMOS technology when a semiconductor pnpn network undergoes regenerative feedback between the parasitic pnp and npn bipolar current gain. A first criteria is that the pnp and npn bipolar transistors must be in forward active. A second criteria for CMOS latchup is when the following inequality is satisfied,
-
- when CMOS latchup is initiated the holding current condition can be expressed as
-
- In the case where the npn current gain is significantly increased,
-
- and the complimentary case,
-
- Thus, for the device of
FIG. 1 , the pnp bipolar current gain is significantly reduced below unity, the npn bipolar current gain is greater than unity, and the product of the bipolar current gain is greater than one. -
- Hence, the symmetry of the product of the bipolar current gains in the triple well structure is distinct from the dual well bipolar current gain symmetry. In advanced CMOS, typically the npn bipolar current gain is higher than the pnp bipolar current gain; in merged triple well structures, as illustrated in
FIG. 1 , this asymmetry of bipolar gains is further enhanced with a greater difference between the npn and the pnp bipolar transistor. As a result, the triple well process may be more sensitive to the negative undershoot phenomena, but less sensitive to the positive overshoot phenomena. A very important advantage of the merged triple well structure over dual-well CMOS is that the latchup phenomena is not a strong function of the substrate doping concentration but a function of the p-well and the n-type isolation layer design choices. In the scaling of CMOS, RF CMOS, and BiCMOS technology, higher substrate doping concentrations can be used to further decrease the noise concern between digital, analog and RF circuits and sub-functions. Additionally, the electrical isolation of the n-channel MOSFETs from the substrate can also reduce the effects from single event latchup (SEL) from ionizing radiation sources, heavy ions and alpha particles (see references [1-7]). The isolation from the substrate makes the merged triple well less sensitive to other sources of minority carrier injection into the substrate, such as Cable Discharge Events (CDE) (see references [8-13]). Thus, the triple well structure has advantages over the dual well structure; however, structural solutions are needed to improve the latchup robustness of this triple well structure. Additionally, because the n-layer 3 must overlap the n-well 11 in order to isolate the p-well 12 spacing issues present problems in the current triple well formation process. - In view of the foregoing, disclosed herein is a triple well CMOS device structure that addresses the issue of latchup by adding an n+ buried layer not only beneath the p-well to isolate the p-well from the p-substrate but also beneath the n-wells. This n+ buried layer degrades the vertical pnp bipolar current gain. The structure eliminates the spacing issues between the n-well and n+ buried layer during the formation process by extending the n+ buried layer below the entire device and not just the p-well. The structure also addresses the issue of threshold voltage scattering by providing a p+ buried layer below the entire device under the n+ buried layer or below the p-well side of the device either under or above the n+ buried layer.
-
FIGS. 2-4 illustrate three embodiments of the triple well CMOS device of the invention. -
FIG. 2 provides a triplewell CMOS device 200 comprising asubstrate 201, with a first conductivity type (e.g., a low-doped p-type substrate (i.e., p-substrate)). Above thesubstrate 201 is afirst semiconductor layer 202 also with this first conductivity type (e.g., a high-doped p-type layer (i.e., a buried p+ layer)). Above thefirst semiconductor layer 202 is asecond semiconductor layer 203 with a second conductivity type (e.g., a high-doped n-type layer (i.e., a buried n+ layer). Above thesecond semiconductor layer 203 is a first semiconductor well 211 with the second conductivity type (e.g., an n-well) and a second semiconductor well 212 with the first conductivity type (e.g., a p-well or an isolated expitaxial p-type region). In this particular embodiment of the invention, thefirst semiconductor layer 202 can have the same dimensions and particularly, the same length as thesecond semiconductor layer 203. For example, thefirst semiconductor layer 202 can have firstouter edges 222, thesecond semiconductor layer 203 can have secondouter edges 223, and the firstouter edges 222 can be aligned directly below the secondouter edges 223. - As with the prior art triple well technology, the primary function of the
first semiconductor layer 202 is to compensate for n-channel MOSFET threshold voltage scattering and the primary function of thesecond semiconductor layer 203 is to isolate the second semiconductor well 212 from thesubstrate 201. Additionally, this embodiment creates a high capacitance triple well capacitor with the first 202 and second 203 semiconductor layers. It also provides a high-doping to low-doping interface (e.g., p+ layer to p-substrate interface) between thefirst semiconductor layer 202 and thesubstrate 201 having the same conductivity type and creates a low shunt resistance. This interface prevents minority carrier collection in the first semiconductor well (e.g., n-well) for external latchup. -
FIG. 3 provides a triplewell CMOS device 300 comprising asubstrate 301, with a first conductivity type (e.g., a low-doped p-type substrate (i.e., p-substrate)). Above thesubstrate 301 is afirst semiconductor layer 302 also with this first conductivity type (e.g., a high-doped p-type layer (i.e., a buried p+ layer)). Above thefirst semiconductor layer 302 is asecond semiconductor layer 303 with a second conductivity type (e.g., a high-doped n-type layer (i.e., a buried n+ layer). Above thesecond semiconductor layer 303 is a first semiconductor well 311 with the second conductivity type (e.g., an n-well) and a second semiconductor well 312 with the first conductivity type (e.g., a p-well or an isolated expitaxial p-type region). In this particular embodiment of the invention, thefirst semiconductor layer 302 can be longer than thesecond semiconductor layer 303. For example, thefirst semiconductor layer 302 can comprise a blanket layer over thesubstrate 301. Thesecond semiconductor layer 303 can have defined dimensions and, particularly, a defined length with secondouter edges 323 above the blanket layer such that thefirst semiconductor layer 302 extends laterally beyond the secondouter edges 323. - As with the prior art triple well technology, the primary function of the
first semiconductor layer 302 is to compensate for n-channel MOSFET threshold voltage scattering and the primary function of thesecond semiconductor layer 303 is to isolate the second semiconductor well 312 from thesubstrate 301. Additionally, as with the embodiment illustrated inFIG. 2 , this embodiment creates a high capacitance triple well capacitor with the first 302 and second 303 semiconductor layers. It also provides a high-doping to low-doping interface (e.g., p+ layer to p-substrate interface) between thefirst semiconductor layer 302 and thesubstrate 301 having the same conductivity type and creates a low shunt resistance. This interface prevents minority carrier collection in the first semiconductor well (e.g., n-well) for external latchup. -
FIGS. 4 a and 4 b illustrate another embodiment of the triple well CMOS device structure of the invention. Each of thedevices 400 a ofFIGS. 4 a and 400 b ofFIG. 4 b comprise a substrate with a first conductivity type (e.g., a low-doped p-type substrate (i.e., p-substrate)). Above thesubstrate 401 are both afirst semiconductor layer 402 with this first conductivity type (e.g., a high-doped p-type layer (i.e., a buried p+ layer)) and asecond semiconductor layer 403 with a second conductivity type (e.g., a high-doped n-type layer (i.e., a buried n+ layer). Both a first semiconductor well 411 with the second conductivity type (e.g., an n-well) and a second semiconductor well 412 with the first conductivity type (e.g., a p-well or an isolated expitaxial p-type region) are positioned above thesecond semiconductor layer 403. However, in this particular embodiment of the invention, thefirst semiconductor layer 402 can be positioned either below the second semiconductor layer 403 (as illustrated indevice 400 a ofFIG. 4 a) or above the second semiconductor layer 403 (as illustrated indevice 400 b ofFIG. 4 b). Thefirst semiconductor layer 402 has defined dimensions (e.g., a defined length) with first outer edges 422 a-b. Regardless of whether thefirst semiconductor layer 402 is above or below thesecond semiconductor layer 403, oneside 443 of thesecond semiconductor layer 403 extends laterally beyond one of the first outer edges (e.g., firstouter edge 422 a) of thefirst semiconductor layer 402. Additionally, thefirst semiconductor well 411 is positioned on thatside 443 of thesecond semiconductor layer 403 that extends beyond thefirst semiconductor layer 402 such that the second semiconductor well 412 and not thefirst semiconductor well 411 is positioned above thefirst semiconductor layer 402. - As with the prior art triple well technology, the primary function of the
first semiconductor layer 402 is to compensate for n-channel MOSFET threshold voltage scattering and the primary function of thesecond semiconductor layer 403 is to isolate the second semiconductor well 412 from thesubstrate 401. This embodiment creates a low resistance region on the first semiconductor well 411 side of the device 400 and a lower pnp gain characteristic. This embodiment also allows for an increase in the collector resistance of the vertical npn transistor on the second semiconductor well 412 side of the device by increasing the sheet resistance of then+ layer 403 under the isolated p-well 412. Additionally, thep+ layer 402 below the p-well compensates for n-channel MOSFET threshold voltage scattering. - The
CMOS devices n+ diffusion region 161 and a firstp+ diffusion region 162 above the first semiconductor well 211, 311, 411 and a secondn+ diffusion region 163 and a secondp+ diffusion region 164 above the second semiconductor well 212, 312, 412. The firstn+ diffusion region 161 can represent a contact to the n-well. The firstp+ diffusion region 162 can represent any p+ device, e.g., a p+ diode, a p-FET, a bipolar transistor, a p-doped resistor, etc. The secondn+ diffusion region 163 can represent any n+ device, e.g., an n+ diode, an n-FET, a bipolar transistor, an n-doped resistor, etc. The secondp+ diffusion region 164 can represent a contact to the p-well 212, 312, 412. Each of diffusion regions 161-164 may be separated by shallow trench isolation structures (STI) 170 (e.g., insulator-filled trenches that extend into the wells just below the diffusion regions 161-164). - Thus, all three of the above-described embodiments of the invention (
devices second semiconductor layer second semiconductor layer n+ layer p+ layer - It should be understood that while the first conductivity type is described herein for illustration purposes as a p-type conductivity and the second conductivity type is described herein for illustration purposes as an n-type conductivity, the reverse conductivity is also anticipated. Additionally, those skilled in the art will recognize that the semiconductor layers and wells of the invention may be doped with appropriate dopants at appropriate concentrations suitable to achieve the desired conductivity type and doping-level. For example, a p-substrate, a p+ layer, and a p-well may each be doped with a suitable p-type dopant, such as, Boron. Alternatively, an n+ layer, an n-well, and an n-type sub-collector region may each be doped with a suitable n-type dopant, such as, Phosphorus, Arsenic or Antimony.
- In addition to the features described above, each of these above-described embodiments of the invention can also comprise an isolation structure that extends from the top surface of the device to below an upper surface of the second semiconductor layer serves to eliminate all lateral devices (e.g., lateral npn, pnp, or pnpn devices) and, thereby, improve latchup robustness. Specifically, this isolation structure can be a trench isolation structure (TI) (e.g., an insulator-filled trench such as a back end of line (BEOL) BPSG or PSG inter-level dielectric-filled trench) that extends from the top surface of the device to below the upper surface of the second semiconductor layer. Alternatively, this isolation structure can be a deep trench isolation structure (DT) (e.g., an oxide or other insulator-lined trench filled with a semiconductor material, such as polysilicon) that extends from the top surface of the device just below the STI structures 161-164 into the substrate below the level of the first semiconductor layer. Additionally, this isolation structure can either bifurcate the first semiconductor well or separate the first and second semiconductor wells. If the isolation structure separates the first and second semiconductor wells, then a portion of the second semiconductor layer below the second semiconductor well must abut the isolation structure. For example,
FIGS. 5-8 illustrate an isolation structure incorporated intodevice 300 ofFIG. 3 andFIGS. 9-12 illustrate an isolation structure incorporated into adevice 400 a ofFIG. 4 a. While such isolation structures are not specifically illustrated fordevice 200 ofFIG. 2 , those skilled in the art will recognize that due to the similarity of thedevices FIGS. 5-8 . Similarly, while such isolation structures are not specifically illustrated fordevice 400 b ofFIG. 4 b, those skilled in the art will recognize that due to the similarity of thedevices FIGS. 9-12 . - More particularly,
FIG. 5 illustrates anisolation structure 551 incorporated into thedevice 300 ofFIG. 3 . Theisolation structure 551 comprises a deep trench isolation structure (DT) that extends from thetop surface 591 of thedevice 500 just below a shallow trench isolation structure (STI) 170 to below theupper surface 531 of the second semiconductor layer 503 through thefirst semiconductor layer 502 and into thesubstrate 501. Theisolation structure 551 bifurcates thefirst semiconductor well 511. As illustrated, the second semiconductor layer 503 comprises twodiscrete portions gap 553 such that it extends into thesubstrate 501 without contacting the second semiconductor layer 503. However, it is anticipated that either one or both portions 503 a-b of the second semiconductor layer may abut theisolation structure 551. -
FIG. 6 illustrates anisolation structure 651 incorporated into thedevice 300 ofFIG. 3 . Theisolation structure 651 comprises a trench isolation structure (TI) that extends from thetop surface 691 of thedevice 600 to below anupper surface 631 of the second semiconductor layer 603, but above the level of thefirst semiconductor layer 602. Theisolation structure 651 bifurcates thefirst semiconductor well 611. As illustrated, the second semiconductor layer 603 comprises twodiscrete portions gap 653 such that theisolation structure 651 extends between the portions 603 a-b but does contact them. However, it is anticipated that either one or both portions 603 a-b of the second semiconductor layer may abut theisolation structure 651. -
FIG. 7 illustrates anisolation structure 751 incorporated into thedevice 300 ofFIG. 3 . Theisolation structure 751 comprises a deep trench isolation structure (DT) that extends from thetop surface 791 of thedevice 700 just below a shallow trench isolation structure (STI) 170 to below theupper surface 731 of the second semiconductor layer 703 through the first semiconductor layer 702 and into thesubstrate 701. Theisolation structure 551 separates the first semiconductor well 711 from thesecond semiconductor well 712. To ensure that the second semiconductor well 712 remains isolated from thesubstrate 701 thatportion 703 b of the second semiconductor layer 703 that is positioned below thesecond semiconductor well 712 abuts theisolation structure 751. WhileFIG. 7 illustrates bothportions portion 703 a. -
FIG. 8 illustrates anisolation structure 851 incorporated into thedevice 300 ofFIG. 3 . Theisolation structure 851 comprises a trench isolation structure (TI) that extends from thetop surface 891 of thedevice 800 to below anupper surface 831 of the second semiconductor layer 803 but above the level of thefirst semiconductor layer 802. Theisolation structure 851 separates the first semiconductor well 811 from thesecond semiconductor well 812. To ensure that the second semiconductor well 812 remains isolated from thesubstrate 801 thatportion 803 b of the second semiconductor layer 803 a-b that is positioned below thesecond semiconductor well 812 abuts theisolation structure 851. WhileFIG. 8 illustrates bothportions portion 803 a. -
FIG. 9 illustrates anisolation structure 951 incorporated into thedevice 400 a ofFIG. 4 a. Theisolation structure 951 comprises a deep trench isolation structure (DT) that extends from thetop surface 991 of thedevice 900 just below a shallow trench isolation structure (STI) 170 to below theupper surface 931 of the second semiconductor layer 903 adjacent to thefirst semiconductor layer 902 and into thesubstrate 901 below the level of thefirst semiconductor layer 902. Theisolation structure 951 bifurcates thefirst semiconductor well 911. As illustrated, the second semiconductor layer 903 comprises twodiscrete portions gap 953 such that theisolation structure 951 extends into the substrate without contacting the second semiconductor layer 903. However, it is anticipated that either one or both portions 903 a-b of the second semiconductor layer may abut theisolation structure 951. -
FIG. 10 illustrates anisolation structure 1051 incorporated into thedevice 400 a ofFIG. 4 a. Theisolation structure 1051 comprises a trench isolation structure (TI) that extends from thetop surface 1091 of thedevice 1000 to below anupper surface 1031 of thesecond semiconductor layer 1003 but above an upper surface of thefirst semiconductor layer 1002. Theisolation structure 1051 bifurcates thefirst semiconductor well 1011. As illustrated, theisolation trench 1051 contacts thesecond semiconductor layer 1003. However, it is understood that thesemiconductor layer 1003 could comprises two discrete portions separated by a gap such that theisolation structure 1051 extends between the portions but does contact them. -
FIG. 11 illustrates anisolation structure 1151 incorporated into thedevice 400 a ofFIG. 4 a. Theisolation structure 1151 comprises a deep trench isolation structure (DT) that extends from thetop surface 1191 of thedevice 1100 just below a shallow trench isolation structure (STI) 170 to below theupper surface 1131 of the second semiconductor layer 703 adjacent tofirst semiconductor layer 1102 and into thesubstrate 1101. Theisolation structure 1151 separates the first semiconductor well 1111 from thesecond semiconductor well 1112. To ensure that the second semiconductor well 1112 remains isolated from thesubstrate 1101, thatportion 1103 b of the second semiconductor layer 1103 a-b that is positioned below thesecond semiconductor well 1112 abuts theisolation structure 751. WhileFIG. 11 illustrates bothportions portion 1103 a. -
FIG. 12 illustrates an isolation structure 1251 incorporated into thedevice 400 a ofFIG. 4 a. The isolation structure 1251 comprises a trench isolation structure (TI) that extends from thetop surface 1291 of thedevice 1200 to below anupper surface 1231 of the second semiconductor layer 1203, but above the level of thefirst semiconductor layer 1202. The isolation structure 1251 separates the first semiconductor well 1211 from thesecond semiconductor well 1212. To ensure that the second semiconductor well 1212 remains isolated from thesubstrate 1201, thatportion 1203 b of the second semiconductor layer 1203 a-b that is positioned below thesecond semiconductor well 1212 abuts the isolation structure 1251. WhileFIG. 12 illustrates bothportions portion 1203 a. - The type of isolation structure used can be a function of the type of wafer technology used to form the device and, particularly, a function of the thickness of the wafer.
- Each of the above-described embodiments of the invention can also comprise an
additional isolation structure 152. For example, theadditional isolation structure 152 can be either an additional trench isolation structure (TI) (seeFIGS. 6 , 8, 10, and 12) that extends from the top surface of the device to below an upper surface of the second semiconductor layer or an additional deep trench isolation structure (DT) (seeFIGS. 5 , 7, 9, and 11) that extends from the top surface of the device just below a shallow trench isolation structure (STI) into the substrate. Thisadditional isolation structure 152 can surround the perimeter of the device in order to isolate the device from other devices on the substrate. - Lastly, each of the above-described embodiments of the invention can also comprise a
sub-collector region 160 positioned between the first semiconductor well and the second semiconductor layer. For example, as illustrated inFIGS. 5-12 , thesub-collector region 160 can comprise a semiconductor region having a higher concentration of the second conductivity type dopant than either the first semiconductor well or the second semiconductor layer. This sub-collector region with a very high doping concentration can further degrade the vertical bipolar current gain, providing a very low resistance shunt back to the first semiconductor well (n-well) so as to further prevent latchup from occurring. - Referring to
FIG. 13 , embodiments of the method of forming the triple well CMOS device with the required and optional features described above comprise forming above a substrate with a first type conductivity both a first semiconductor layer with the first conductivity type (e.g., a buried p+ layer) type (e.g., a p-substrate) (1302) and a second semiconductor layer with a second conductivity type (e.g., a buried n+ layer) (1308). A first semiconductor well with the second conductivity type (e.g., an n-well) is formed above one side of the second semiconductor layer and second semiconductor well with the first conductivity type (e.g., a p-well) is formed above a second side of the second semiconductor layer adjacent to the first semiconductor well (1318). The above-mentioned buried layers and wells with differing conductivity types may be formed using well-known deposition, implantation and/or out-diffusion techniques. P-type wells and layers may be doped with appropriate levels of Boron. N-type wells and layers may be doped with appropriate levels of Phosphorus, Arsenic, or Antimony. - More particularly, referring to
FIG. 2 , thefirst semiconductor layer 202 can be formed (at process 1302) with a defined length such that it has first outer edges 222 (1306). Thesecond semiconductor layer 203 can be formed (at process 1308) above the first semiconductor layer and with the same defined length such that it has secondouter edges 223 that are aligned directly above the first outer edges 222 (1312). Thus, when the first andsecond semiconductor wells - Similarly, referring to
FIG. 3 , thefirst semiconductor layer 302 can be formed (at process 1302) as a blanket layer (1304). Thesecond semiconductor layer 303 can be formed (at process 1308) above the first semiconductor layer and with defined dimensions (e.g., a defined length) such that it has secondouter edges 323 that are above the blanket layer 303 (1310). Thus, as with the embodiment described above, when the first andsecond semiconductor wells - Referring to
FIGS. 4 a-b, thefirst semiconductor layer 402 and thesecond semiconductor layer 403 may be formed (atprocess 1302 and 1308) such that thefirst semiconductor layer 402 is either above or below thesecond semiconductor layer 403 relative to thesubstrate 401. Regardless of the relative positioning of the first and second semiconductor layers 402 and 403, thefirst semiconductor layer 402 can be formed (at process 1306) with a defined length such that is has first outer edges 422 a-b (1306) and thesecond semiconductor layer 403 can be formed (at process 1308) such that at least oneside 443 of thesecond semiconductor layer 403 extends laterally beyond at least one of the first outer edges (e.g., 422 a). Then, when thewells first semiconductor well 411 is formed over theside 443 that extends laterally beyond the outer edge of thefirst semiconductor layer 402. Thus, only the second semiconductor well 412 and not thefirst semiconductor well 411 is formed above the first semiconductor layer 402 (1322). - Additionally, the method can comprise forming an isolation structure that extends from the top surface of the device to below an upper surface of the second semiconductor layer such that it eliminates all lateral devices (e.g., lateral npn, pnp, or pnpn devices) and, thereby, improves latchup robustness (1324, see
FIGS. 5-12 ). The isolation structure can be formed such that it bifurcates the first semiconductor well (1328, seeFIGS. 5-6 and 9-10). Alternatively, the isolation structure can be formed such that it separates the first semiconductor well and the second semiconductor well (1330, seeFIGS. 7-8 and 11-12). If the isolation structure separates the first and second semiconductor wells, it must further be formed such that a portion of the second semiconductor layer below the second semiconductor well abuts the isolation structure in order to isolate the second well from the substrate. - The above-described isolation structure can be formed as a trench isolation structure (TI) (e.g., e.g., an insulator-filled trench such as a back end of line (BEOL) BPSG or PSG inter-level dielectric-filled trench) that extends from the top surface of the device to below an upper surface of the second semiconductor layer but above the level of the first semiconductor layer (see
FIGS. 6 , 8, 10 and 12, and the above discussion of trench isolation structure). Alternatively, the isolation structure can be formed as a deep trench isolation structure (DT) (e.g., an oxide or other insulator-lined trench filled with a semiconductor material, such as polysilicon) that extends from the top surface of the device just below the level of a shallow trench isolation structure (STI) into the substrate below the level of the first semiconductor layer (seeFIGS. 5 , 7, 9 and 11 and above discussion of deep trench isolation structure (DT)). Well-known techniques may be used to form such DT or TI structures. - The method can also comprise forming an additional isolation structure 352, 452 around a perimeter of the device (1326, see
FIGS. 5-12 ). The additional isolation structure can be formed simultaneously with the forming of the above-described isolation structure (at process 1324) and can similarly be formed as either a trench isolation structure (TI) (seeFIGS. 6 , 8, 10 and 12) or deep trench isolation structure (DT) (seeFIGS. 5 , 7, 9 and 12), depending on the wafer technology used to form the device. This additional isolation structure 352, 452 can serve to isolate the device from other devices formed on the same substrate. - The method can also optionally comprise before forming the first semiconductor well, forming a sub-collector region 360,460 with the second conductivity type above the second semiconductor layer and then, forming the first semiconductor well so that it is aligned above the sub-collector region (1316, see
FIGS. 5-12 ). Specifically, the sub-collector region 360, 460 can be formed by implanting a region above the second semiconductor layer with a higher concentration of the second conductivity type dopant than either thesecond semiconductor layer - Lastly, the method can comprise completing the CMOS device formation process. For example, referring to
FIGS. 2-4 a-b, a firstn+ diffusion region 161 and a firstp+ diffusion region 162 can be formed above the first semiconductor well and a secondn+ diffusion region 163 and a secondp+ diffusion region 164 can be formed above the second semiconductor well. The firstn+ diffusion region 161 can be formed as a contact to the n-well. The firstp+ diffusion region 162 can be formed as any p+device, e.g., a p+diode, a p-FET, a bipolar transistor, a p-doped resistor, etc. The secondn+ diffusion region 163 can be formed as any n+ device, e.g., an n+ diode, an n-FET, a bipolar transistor, an n-doped resistor, etc. The secondp+ diffusion region 164 can be formed as a contact to the p-well 212, 312, 412. Additionally, shallow trench isolation structures (STI) 170 can be formed to isolate each of the diffusion regions 161-164. - Therefore, disclosed above is a CMOS device structure that establishes a triple well, compensates for threshold voltage scattering, improves latchup robustness, establishes a high well-substrate capacitor, provides low resistance in the substrate and shields the n+ buried layer from minority carrier injection, external latchup and SER issues. Specifically, this triple well CMOS device structure addresses the issue of latchup by adding an n+ buried layer not only beneath the p-well to isolate the p-well from the p-substrate but also beneath the n-well. The n+ buried layer degrades the vertical pnp bipolar current gain and lowers n-well contact to p+ device shunt resistance. The structure eliminates the spacing issues between the n-well and n+ buried layer by entending the n+ buried layer below the entire device. The structure also addresses the issue of threshold voltage scattering by providing a p+ buried layer below the entire device under the n+ buried layer or below the p-well side of the device either under or above the n+ buried layer. Latchup robustness can further be improved by incorporating into the device an isolation structure that either bifurcates the first n-well or separates n-well and the p-well so as to eliminate lateral pnp, npn, or pnpn devices. Latchup robustness can also be improved by incorporating into the device a sub-collector region between the n+ buried layer and the n-well. Lastly, device performance can be improved by providing additional isolation structures around the device perimeter so as to isolate the device from other devices on the same substrate.
- The foregoing description of the specific embodiments will so fully reveal the general nature of the invention that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments of the invention have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments of the invention can be practiced with modification within the spirit and scope of the appended claims.
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Also Published As
Publication number | Publication date |
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US7442996B2 (en) | 2008-10-28 |
US20070170515A1 (en) | 2007-07-26 |
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