US20080302115A1 - Combined pressure compensator and cooling unit - Google Patents

Combined pressure compensator and cooling unit Download PDF

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Publication number
US20080302115A1
US20080302115A1 US11/760,417 US76041707A US2008302115A1 US 20080302115 A1 US20080302115 A1 US 20080302115A1 US 76041707 A US76041707 A US 76041707A US 2008302115 A1 US2008302115 A1 US 2008302115A1
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US
United States
Prior art keywords
container
water
electronic equipment
cooling
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/760,417
Inventor
Erik Eknes
Poul Andersen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coda Octopus Group Inc
Original Assignee
Coda Octopus Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coda Octopus Group Inc filed Critical Coda Octopus Group Inc
Priority to US11/760,417 priority Critical patent/US20080302115A1/en
Assigned to CODA OCTOPUS GROUP, INC. reassignment CODA OCTOPUS GROUP, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ANDERSEN, POUL A., EKNES, ERIK
Priority to PCT/US2008/066197 priority patent/WO2008154434A1/en
Publication of US20080302115A1 publication Critical patent/US20080302115A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/068—Hermetically-sealed casings having a pressure compensation device, e.g. membrane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/14—Safety or protection arrangements; Arrangements for preventing malfunction for preventing damage by freezing, e.g. for accommodating volume expansion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/521—Constructional features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the field of the invention is the field of electronics for underwater sonar, sonar and/or optical imaging, and other underwater data and computationally intensive operations.
  • FIG. 1 A prior art underwater sonar apparatus is shown in FIG. 1 .
  • a container 10 contains electronic equipment 12 in a coolant fluid 14 .
  • the electronic equipment 12 is connected through a connection (not shown) to a sonar transceiver 16 , an optical imaging apparatus, or other apparatus for investigation of the surroundings of the container 10 .
  • the container 10 is attached to a ship or to a remotely operated vehicle (ROV) and used to investigate the sea objects therein in the vicinity of the ship or ROV.
  • ROV remotely operated vehicle
  • the apparatus compensates for the pressure variations between coolant liquid cooling the electronic equipment and the surrounding water.
  • FIG. 1 is a sketch of a prior art apparatus for underwater sonar imaging.
  • FIG. 2 is a sketch of the prior art apparatus when pressure of coolant fluid
  • FIG. 3 is a sketch of the most preferred embodiment of the invention.
  • FIG. 4 is a sketch of the most preferred embodiment of the invention when pressure coolant fluid within the container containing electronic equipment rises higher than the pressure of outside cooling water.
  • FIG. 5 is a sketch of a preferred embodiment of the invention.
  • FIG. 7 is a sketch of a preferred embodiment of the invention.
  • FIG. 2 shows a sketch of the apparatus of FIG. 1 when the coolant liquid 14 is heated and expands.
  • the distortion of the container 10 is exaggerated in FIG. 2 for clarity. However, the distortion is sufficient to change the orientation of sensor 16 with respect to container 10 and to the ship or ROV mounting the container 10 .
  • the material and walls of container 10 must be much stronger and thicker to withstand the stress needed to hold the pressure of the fluid 14 .
  • the thicker walls mean that the heat transfer coefficient for transferred from the coolant fluid is reduced, and so that the temperature and thus pressure of the coolant fluid must rise yet further.
  • FIG. 3 shows a sketch of the most preferred embodiment of the invention.
  • a second container 30 is attached with a fluid connection to the first container 10 .
  • the coolant fluid circulates through the inside of container 10 and the inside of container 30 , and heat is transferred through the walls of container 10 and container 30 to the surrounding cooling water 18 .
  • the apparatus of the invention may be used for heat exchanging the heat from the coolant liquid to another liquid besides water.
  • FIG. 4 shows a sketch of the apparatus of FIG. 3 when a large heating load is generated by the electronic equipment 12 .
  • the volume of the second container 30 increases to contain the increased volume of the heated cooling fluid 14 .
  • the walls of the second container 30 can now be made very thin, which will make them very flexible and able to increase the volume of the container 30 with little extra cooling fluid pressure over the pressure of the outside water.
  • the thin walls cut down on the thermal resistance and increase heat transfer.
  • the volume of the second container 30 increases by 2% before the pressure inside container 10 is sufficient to distort container 10 unacceptably or to stress the material of container 10 to unacceptable limits.
  • the volume of the second container 30 increases by 5% before the pressure inside container 10 is sufficient to distort container 10 unacceptably or to stress the material of container 10 to unacceptable limits. In the most preferred embodiment of the invention, the volume of the second container 30 increases by 10% before the pressure inside container 10 is sufficient to distort container 10 unacceptably or to stress the material of container 10 to unacceptable limits.
  • Optional pumps 40 are shown which can circulate coolant fluid from the inside of container 10 through the inside of container 30 and increase cooling of the cooling fluid 14 .
  • the flow of cooling water is depicted by the arrow 42 .
  • FIG. 5 shows a preferred embodiment of the invention, wherein the second container 30 is contained within the first container 10 .
  • the cooling water circulates within the second container 30
  • the coolant liquid 14 is outside the second container 30 .
  • the volume of the second container 30 is reduced to compensate for the pressure change.
  • An optional scoop is shown to move the outside water or fluid through the second container 30 and increase cooling of the cooling fluid 14 .
  • FIG. 7 shows a sketch of a preferred embodiment of the invention, wherein the container 30 is a bellows 70 which allows great expansion with modest pressure difference between the coolant fluid 14 and the surrounding water.
  • An optional external shroud 72 is used to protect the bellows 70 , and to provide a channeling flow for the water circulation, as depicted by the arrows

Abstract

A container for containing underwater sensors such as sonar transceivers, sonar imaging devices, optical imaging devices, etc, electronic equipment and a cooling liquid for cooling the electronic equipment is connected to a second, variable volume container which acts both as a heat exchanger and as a pressure compensator for compensating the pressure difference between the cooling fluid and the surrounding water or other fluid.

Description

    FIELD OF THE INVENTION
  • The field of the invention is the field of electronics for underwater sonar, sonar and/or optical imaging, and other underwater data and computationally intensive operations.
    • BACKGROUND OF THE INVENTION
  • A prior art underwater sonar apparatus is shown in FIG. 1. A container 10 contains electronic equipment 12 in a coolant fluid 14. The electronic equipment 12 is connected through a connection (not shown) to a sonar transceiver 16, an optical imaging apparatus, or other apparatus for investigation of the surroundings of the container 10. The container 10 is attached to a ship or to a remotely operated vehicle (ROV) and used to investigate the sea objects therein in the vicinity of the ship or ROV.
    • RELATED PATENTS AND APPLICATIONS
  • The above identified patents and patent applications are assigned to the assignee of the present invention and are incorporated herein by reference in their entirety including incorporated material.
    • OBJECTS OF THE INVENTION
  • It is an object of the invention to produce an apparatus and method for cooling electronic equipment which is immersed in water or other liquid which can act as a heat sink for the heat produced by the electronic equipment. In addition, the apparatus compensates for the pressure variations between coolant liquid cooling the electronic equipment and the surrounding water.
    • SUMMARY OF THE INVENTION
  • A variable volume container is used to transfer heat through the container walls from the coolant cooling electronic equipment to the water surrounding the apparatus of the invention. When the pressure in the coolant rises because the coolant temperature rises, the volume of the container changes to compensate the pressure change.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a sketch of a prior art apparatus for underwater sonar imaging.
  • FIG. 2 is a sketch of the prior art apparatus when pressure of coolant fluid
  • FIG. 3 is a sketch of the most preferred embodiment of the invention.
  • FIG. 4 is a sketch of the most preferred embodiment of the invention when pressure coolant fluid within the container containing electronic equipment rises higher than the pressure of outside cooling water.
  • FIG. 5 is a sketch of a preferred embodiment of the invention.
  • FIG. 6 is a sketch of a preferred embodiment of the invention.
  • FIG. 7 is a sketch of a preferred embodiment of the invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • A container 10 contains electronic equipment 12 in a coolant fluid 14 in the prior art sketch of FIG. 1. Heat generated by the electronic equipment 12 and transferred to the coolant fluid 14 is conducted through the walls of the container 10 to the outside water or other fluid 18. The electronic equipment 12 is connected through a connection (not shown) to a sonar transceiver 16, an optical imaging apparatus, or other apparatus for investigation of the surroundings of the container 10. The container 10 is attached to a ship or submarine, to a remotely operated vehicle (ROV), or to an automated underwater vehicle (AUV) and used to investigate the undersea objects therein in the vicinity of the vehicle.
  • FIG. 2 shows a sketch of the apparatus of FIG. 1 when the coolant liquid 14 is heated and expands. The distortion of the container 10 is exaggerated in FIG. 2 for clarity. However, the distortion is sufficient to change the orientation of sensor 16 with respect to container 10 and to the ship or ROV mounting the container 10. In addition, the material and walls of container 10 must be much stronger and thicker to withstand the stress needed to hold the pressure of the fluid 14. The thicker walls mean that the heat transfer coefficient for transferred from the coolant fluid is reduced, and so that the temperature and thus pressure of the coolant fluid must rise yet further.
  • FIG. 3 shows a sketch of the most preferred embodiment of the invention. A second container 30 is attached with a fluid connection to the first container 10. In the embodiment shown, the coolant fluid circulates through the inside of container 10 and the inside of container 30, and heat is transferred through the walls of container 10 and container 30 to the surrounding cooling water 18. Of course, the apparatus of the invention may be used for heat exchanging the heat from the coolant liquid to another liquid besides water.
  • FIG. 4 shows a sketch of the apparatus of FIG. 3 when a large heating load is generated by the electronic equipment 12. The volume of the second container 30 increases to contain the increased volume of the heated cooling fluid 14. The walls of the second container 30 can now be made very thin, which will make them very flexible and able to increase the volume of the container 30 with little extra cooling fluid pressure over the pressure of the outside water. In addition, the thin walls cut down on the thermal resistance and increase heat transfer. In a preferred embodiment of the invention, the volume of the second container 30 increases by 2% before the pressure inside container 10 is sufficient to distort container 10 unacceptably or to stress the material of container 10 to unacceptable limits. In a more preferred embodiment of the invention, the volume of the second container 30 increases by 5% before the pressure inside container 10 is sufficient to distort container 10 unacceptably or to stress the material of container 10 to unacceptable limits. In the most preferred embodiment of the invention, the volume of the second container 30 increases by 10% before the pressure inside container 10 is sufficient to distort container 10 unacceptably or to stress the material of container 10 to unacceptable limits.
  • Optional pumps 40 are shown which can circulate coolant fluid from the inside of container 10 through the inside of container 30 and increase cooling of the cooling fluid 14. The flow of cooling water is depicted by the arrow 42.
  • Note that if the apparatus of FIG. 3 is used at great depths, the volume of the second container 30 can decrease to compensate for any compressibility of the cooling fluid 14.
  • FIG. 5 shows a preferred embodiment of the invention, wherein the second container 30 is contained within the first container 10. In this case, the cooling water circulates within the second container 30, and the coolant liquid 14 is outside the second container 30. In the case that the coolant fluid is heated and expands, the volume of the second container 30 is reduced to compensate for the pressure change. An optional scoop is shown to move the outside water or fluid through the second container 30 and increase cooling of the cooling fluid 14.
  • FIG. 6 shows an embodiment of the invention having simple construction and assembly. An array of tubes 60 are inserted through holes in the container 10, and provide a heat exchanger for exchanging heat between the coolant fluid 14 and the outside water. Optional funnels 62 are shown for funneling outside water through the tubes 60. If the tubes have thin walls, the heat transfer is maximized and the volume of the tubes will be reduced to compensate the pressure changes within the container 10.
  • FIG. 7 shows a sketch of a preferred embodiment of the invention, wherein the container 30 is a bellows 70 which allows great expansion with modest pressure difference between the coolant fluid 14 and the surrounding water. An optional external shroud 72 is used to protect the bellows 70, and to provide a channeling flow for the water circulation, as depicted by the arrows
  • Obviously, many modifications and variations of the present invention are possible in light of the above teachings. It is therefore to be understood that, within the scope of the appended claims, the invention may be practiced otherwise than as specifically described.

Claims (13)

1. An apparatus, comprising:
a first container for containing electronic equipment, wherein the electronic equipment is immersed in a liquid coolant, and wherein the apparatus is for immersing in water;
a second container for transferring heat from the liquid coolant to the water, wherein the volume of the second container varies to compensate pressure differences between the liquid coolant and the water.
2. The apparatus of claim 1, wherein the second container is contained within the first container, and wherein the water communicates between the inside of the second container and the outside of the first container.
3. The apparatus of claim 2, further comprising means for flowing the water through the inside of the second container.
4. The apparatus of claim 3, wherein the means for flowing is a scoop.
5. The apparatus of claim 3, wherein the means for flowing is a pump.
6. The apparatus of claim 2, wherein the second container is a pancake shaped container.
7. The apparatus of claim 2, wherein the second container is a bellows.
8. The apparatus of claim 1, wherein the second container is located outside the first container, and wherein the liquid coolant communicates between the inside of the first container and the inside of the second container, and wherein the water outside the first container and the outside of the second container cools the liquid coolant inside the second container.
9. The apparatus of claim 8, further comprising a pump for circulating the liquid coolant between the inside of the first container and the inside of the second container.
10. The apparatus of claim 8, wherein the second container is a pancake shaped container.
11. The apparatus of claim 8, wherein the second container is a bellows.
12. The apparatus of claim 1, wherein the second container is a pancake shaped container.
13. The apparatus of claim 1, wherein the second container is a bellows.
US11/760,417 2007-06-08 2007-06-08 Combined pressure compensator and cooling unit Abandoned US20080302115A1 (en)

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Application Number Priority Date Filing Date Title
US11/760,417 US20080302115A1 (en) 2007-06-08 2007-06-08 Combined pressure compensator and cooling unit
PCT/US2008/066197 WO2008154434A1 (en) 2007-06-08 2008-06-06 Combined pressure compensator and cooling unit

Applications Claiming Priority (1)

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US11/760,417 US20080302115A1 (en) 2007-06-08 2007-06-08 Combined pressure compensator and cooling unit

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EP2487327A1 (en) * 2011-02-09 2012-08-15 Siemens Aktiengesellschaft Subsea electronic system
CN102712352A (en) * 2010-01-19 2012-10-03 西门子公司 Subsea pressure compensation system
US20130167962A1 (en) * 2011-12-28 2013-07-04 Siemens Aktiengesellschaft Pressure compensator for a subsea device
EP2666956A1 (en) * 2012-05-21 2013-11-27 ABB Technology AG A modular electric system located under water
EP2679765A1 (en) * 2012-06-28 2014-01-01 ABB Technology Ltd Subsea unit comprising a two-phase cooling system
US20140352928A1 (en) * 2012-03-21 2014-12-04 Huawei Technologies Co., Ltd. Electronic Device, and Heat Dissipation System and Heat Dissipation Method of Electronic Device
EP2824275A1 (en) * 2013-07-09 2015-01-14 ABB Technology Ltd Subsea unit with cooling of electronic devices
US20150277452A1 (en) * 2014-03-28 2015-10-01 Knut Schonhowd Kristensen Pressure Compensation System
EP2928275A1 (en) * 2014-04-04 2015-10-07 ABB Technology Ltd Arrangement for cooling components of a subsea electric system
WO2015188882A1 (en) * 2014-06-13 2015-12-17 Abb Technology Ltd Arrangement for subsea housing of electric components and manufacturing of the same
US9258926B2 (en) * 2014-06-24 2016-02-09 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
EP2987950A1 (en) * 2014-08-22 2016-02-24 Siemens Aktiengesellschaft Sub-sea gas recovery system
US20160088767A1 (en) * 2013-05-16 2016-03-24 Abb Technology Ltd Subsea unit with conduction and convection cooling
US20160215913A1 (en) * 2015-01-23 2016-07-28 Siemens Aktiengesellschaft Pressure compensator for subsea device
US9408332B2 (en) 2014-06-24 2016-08-02 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
WO2016210018A1 (en) * 2015-06-26 2016-12-29 Microsoft Technology Licensing, Llc Underwater container cooling via integrated heat exchanger
US9560789B2 (en) 2014-06-24 2017-01-31 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9699939B2 (en) 2014-06-24 2017-07-04 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
EP3229571A3 (en) * 2016-04-07 2017-10-18 Hamilton Sundstrand Corporation Immersion cooled electronic assemblies
EP3241983A1 (en) * 2016-05-02 2017-11-08 Siemens Aktiengesellschaft Compartment for a subsea device
US9844167B2 (en) 2015-06-26 2017-12-12 Microsoft Technology Licensing, Llc Underwater container cooling via external heat exchanger
WO2018025016A1 (en) * 2016-08-01 2018-02-08 Iceotope Limited Thermal interface for modular immersion cooling of electronic components
US10244650B2 (en) 2014-08-22 2019-03-26 Abb Schweiz Ag Pressure compensated subsea electrical system
US10326398B2 (en) 2016-10-06 2019-06-18 Hamilton Sundstrand Corporation Linear motor actuators
EP3436760A4 (en) * 2016-03-31 2019-12-18 Clear PX Technologies Ltd Temperature controlling device and system having static cooling capacity
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US11191186B2 (en) 2014-06-24 2021-11-30 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
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CN102712352A (en) * 2010-01-19 2012-10-03 西门子公司 Subsea pressure compensation system
US9084358B2 (en) 2010-01-19 2015-07-14 Siemens Oil And Gas Offshore As Subsea pressure compensation system
EP2487327A1 (en) * 2011-02-09 2012-08-15 Siemens Aktiengesellschaft Subsea electronic system
EP2487326A1 (en) * 2011-02-09 2012-08-15 Siemens Aktiengesellschaft Subsea electronic system
US9038433B2 (en) * 2011-12-28 2015-05-26 Siemens Aktiengesellschaft Pressure compensator for a subsea device
US20130167962A1 (en) * 2011-12-28 2013-07-04 Siemens Aktiengesellschaft Pressure compensator for a subsea device
US20140352928A1 (en) * 2012-03-21 2014-12-04 Huawei Technologies Co., Ltd. Electronic Device, and Heat Dissipation System and Heat Dissipation Method of Electronic Device
EP2666956A1 (en) * 2012-05-21 2013-11-27 ABB Technology AG A modular electric system located under water
EP2679765A1 (en) * 2012-06-28 2014-01-01 ABB Technology Ltd Subsea unit comprising a two-phase cooling system
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EP2824275A1 (en) * 2013-07-09 2015-01-14 ABB Technology Ltd Subsea unit with cooling of electronic devices
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EP2928275A1 (en) * 2014-04-04 2015-10-07 ABB Technology Ltd Arrangement for cooling components of a subsea electric system
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