US20090056915A1 - Electrically insulated heat sink with high thermal conductivity - Google Patents

Electrically insulated heat sink with high thermal conductivity Download PDF

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Publication number
US20090056915A1
US20090056915A1 US11/850,224 US85022407A US2009056915A1 US 20090056915 A1 US20090056915 A1 US 20090056915A1 US 85022407 A US85022407 A US 85022407A US 2009056915 A1 US2009056915 A1 US 2009056915A1
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United States
Prior art keywords
thermal conductivity
heat sink
high thermal
electrically insulated
heat
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Abandoned
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US11/850,224
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Hua-Hsin Tsai
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Individual
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Priority to US11/850,224 priority Critical patent/US20090056915A1/en
Publication of US20090056915A1 publication Critical patent/US20090056915A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

This invention relates to an electrically insulated heat sink with high thermal conductivity, which is made of ceramic material and is integrally formed with a plurality of post-shaped heat dissipating bodies on the upper end surface. A plurality of heat pipes charged with working liquid medium therein are disposed within the interior of the heat sink. According to this structure, the heat sink has good insulation, heat absorption and heat dissipation effects.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the invention
  • The present invention relates to an electrically insulated heat sink with high thermal conductivity, particularly to an innovative electrically insulated heat sink with high thermal conductivity which simultaneously has good insulation, heat absorption and heat dissipation effects.
  • 2. Brief Description of the Prior Art
  • The execution process of operation usually generates heat which should be dissipated effectively. Otherwise, the accumulated heat often causes the operation execution in the chip turning into abnormal, even causes chip damages. So far, the arrangement of heat sink mounted on the chip functioned as a heat conduction means plays an important role as means to dissipate the heat brought out from chip. In other words, the heat generated from chips is conducted to the heat sink. Then, a fan provided above the heat sink is used to exhaust the heat conducted to heat sink.
  • The popular heat sink (1) now available on the market, as shown in FIG. 1, is made of aluminum material which has a plurality of heat dissipating fins (11) integrally provided thereon. This heat sink (1) is fixed on and in surface contact with the upper surface of the chip such that the heat generated by the operation of the chip is absorbed by the heat sink (1). The heat thus absorbed is conducted to the heat dissipating fins (11) and is then dissipated away by a fan provided above heat dissipating fins (11), so that the temperature of the chip can be reduced.
  • While the existing heat sink can attain the effect of dissipating the heat generated from the chip, however the physical property of aluminum material used in the heat sink fails to reach 100% heat conduction efficiency for dissipating. Inasmuch as the operation speed of the up-to-date chip becomes more and more quick, thus the heat is induced much more than before. Hence, the type of heat sink made of aluminum cannot satisfy the demand of speedy heat dissipation.
    • SUMMARY OF THE INVENTION
  • In view of the above defects with respect to the existing heat sink, the inventor of the present invention provides an improved heat sink based on endless effort according to the abundant professional knowledge accumulated and practical manufacturing experience in the relevant field, so that a solution for the problems of the existing structure can be highly expected.
  • The main object of the present invention is to provide an electrically insulated heat sink with high thermal conductivity which simultaneously has good insulation, heat absorption and heat dissipation effects.
  • The above object and effectiveness can be achieved by the following skill:
  • The heat sink of the present invention is made of ceramic material and is integrally formed with a plurality of post-shaped heat dissipating bodies disposed on the upper end surface, and a plurality of heat pipes charged with working liquid medium therein which are disposed within the interior of the heat sink. According to this configuration, the heat sink has good insulation effect originated from the ceramic material. Furthermore, the heat sink has excellent heat absorption and heat dissipation capabilities to dissipate the heat generated from the heat source quickly in cooperation with the plurality of post-shaped heat dissipating bodies and the heat pipes charged with working liquid medium which are disposed within the heat sink.
  • Furthermore, the electrically insulated heat sink with high thermal conductivity is coated with a layer of coating material having high thermal conductivity so as to facilitate the heat dissipation effect of the heat sink.
  • Preferably, the layer of coating having high thermal conductivity is a carbon nanomaterial.
  • Preferably, the layer of coating having high thermal conductivity is a metal coating having high thermal conductivity.
  • On the other hand, the heat sink can be formed by the conglomerate of a plurality of ceramic granules. Each ceramic granule has a plurality of pores formed on the surface thereof. In this manner, the heat sink can obtain similar insulation, heat absorption and heat dissipation capabilities as that of the porous ceramic granules.
  • Preferably, the diameter of the ceramic granules can be of the same or different sizes.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present invention will be better understood by the detailed description of the following preferred embodiments with reference to the accompanying drawings, in which:
  • FIG. 1 is a schematic view showing the structure of the conventional heat sink.
  • FIG. 2 is a perspective exploded view showing the first preferred embodiment of the heat sink of the present invention.
  • FIG. 3 is a top view showing the first preferred embodiment of the heat sink of the present invention.
  • FIG. 4 is a side view showing the first preferred embodiment of the heat sink of the present invention.
  • FIG. 5 is a partial exploded view showing the first preferred embodiment of the heat sink of the present invention.
  • FIG. 6 is a perspective exploded view showing the second preferred embodiment of the heat sink of the present invention.
  • FIG. 7 is a partial exploded view showing the second preferred embodiment of the heat sink of the present invention.
  • FIG. 8 is a schematic view showing the third preferred embodiment of the heat sink of the present invention.
  • FIG. 9 is a schematic view showing the fourth preferred embodiment of the heat sink of the present invention.
  • FIG. 10 is a partial exploded view showing the fifth preferred embodiment of the heat sink of the present invention.
  • FIG. 11 is a partial exploded view showing the sixth preferred embodiment of the heat sink of the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The objects, the technical contents and the expected effectiveness of the present invention will become more apparent from the detailed description of the preferred embodiments in conjunction with the accompanying drawings.
  • Firstly referring to FIG. 2, 3 and 5, the electrically insulated heat sink (2) with high thermal conductivity is integrally molded by ceramic material into a predetermined configuration. The heat sink (2) has a base body (21), the bottom end surface (211) of which is formed as a flat surface, and a plurality of post-shaped heat dissipating bodies (22) are integrally formed on the upper end surface (212) therewith. The dimension of each post-shaped heat dissipating body (22) can be formed as arbitrary. A plurality of insertion holes (213) into each of which is inserted with a heat pipe (23) is provided within the base body (21). A working liquid medium is charged in each heat pipe (23).
  • The heat sink (2) thus formed in this configuration is then disposed on the heat source (3), such as chips, electronic parts, light emitting components or circuits, in such a manner that the bottom end surface (211) of the base body (21) of the heat sink (2) is in close contacted with the upper surface of the heat source (3). A fan (4) is disposed above the heat dissipating bodies (22) of the heat sink (2). The heat generated by the operation of the heat source (3) is absorbed rapidly by the heat sink (2) and is transferred to the heat dissipating bodies (22) by the high thermal conductivity of the ceramic material used in the heat sink (2), and finally is dissipated to the ambience by the fan (4) mounted above the heat dissipating bodies (22). Furthermore, the working liquid medium contained within the heat pipes (23) which are disposed in the base body (21) can facilitate the heat absorption and conduction, so that prompt heat dissipation and thus the temperature reduction of the heat source (3) can be further achieved.
  • In FIGS. 6 and 7, the second preferred embodiment of the electrically insulated heat sink (2) with high thermal conductivity is shown. The heat sink (2) in the second embodiment is mainly coated on the surface with a layer (24) of material having high thermal conductivity. The layer (24) of material having high thermal conductivity is carbon nanomaterial. The heat dissipation effect can be further accelerated by the coating of the layer (24) of material having high thermal conductivity. Alternatively, the layer (24) of material having high thermal conductivity can be a metal coating with high thermal conductivity.
  • In FIG. 8, the third preferred embodiment of the electrically insulated heat sink (2) with high thermal conductivity is shown. The heat sink (2) in the third embodiment is mainly to have the post-shaped heat dissipating bodies (22) of the base body (21) in the outmost periphery made higher than the other post-shaped heat dissipating bodies (22), so that the assembly of the fan (4) will become easy.
  • In FIG. 9, the fourth preferred embodiment of the electrically insulated heat sink (2) with high thermal conductivity is shown. The heat sink (2) in this embodiment is mainly obtained by coating a layer (24) of material having high thermal conductivity on the surface of the heat sink (2) in the third embodiment. The layer (24) of material having high thermal conductivity is carbon nanomaterial. The heat dissipation effect can be further accelerated by the coating of the layer (24) of material having high thermal conductivity. Alternatively, the layer (24) of material having high thermal conductivity can be a metal coating with high thermal conductivity.
  • In FIG. 10, the fifth preferred embodiment of the electrically insulated heat sink (2) with high thermal conductivity is shown. The heat sink (2) in this embodiment is formed by the conglomerate of a plurality of ceramic granules (25). Each ceramic granule (25) has a plurality of pores formed on the surface. In this manner, the heat sink (2) can obtain similar insulation, heat absorption and heat dissipation capabilities as that of the porous ceramic granules (25). Furthermore, the diameter of the ceramic granules (25) can be the same or different.
  • In FIG. 11, the sixth preferred embodiment of the electrically insulated heat sink (2) with high thermal conductivity is shown. The heat sink (2) in this embodiment is mainly obtained by coating a layer (24) of material having high thermal conductivity on the surface of the heat sink (2) in the fifth embodiment. The layer (24) of material having high thermal conductivity is carbon nanomaterial. The heat dissipation effect can be further accelerated by the coating of the layer (24) of material having high thermal conductivity. Alternatively, the layer (24) of material having high thermal conductivity can be a metal coating with high thermal conductivity.
  • Based on foregoing, the heat sink of the present invention is made of ceramic material such that the heat sink has excellent insulation property originated from ceramic material. Furthermore, the heat sink has excellent heat absorption and heat dissipation capabilities to dissipate the heat generated from the heat source quickly in cooperation with the plurality of post-shaped heat dissipating bodies and the heat pipes charged with working liquid medium therein. In this manner, normal operation process can be ensured in the heat source, such as chip, such that the damage caused by overheating of the heat source can be avoided.
  • Summing up above, the heat sink of the present invention depicted by preferred embodiment can reach expected effectiveness, and the specific configurations disclosed herein is not seen in the prior art of the same category.
  • While the present invention has been described with preferred embodiments in conjunction with the accompanying drawings, it is noted that the preferred embodiments and the drawings are purely for the convenience of description only, not intended to be restrictive on the scope of the present invention. Any modifications and variations or the equivalents brought out without departing from the spirit of the present invention is considered to be still within the scope of the present invention.

Claims (17)

1. An electrically insulated heat sink with high thermal conductivity, wherein the heat sink is made of ceramic material and is integrally formed with a plurality of post-shaped heat dissipating bodies disposed on the upper end surface, and a plurality of heat pipes charged with working liquid medium therein which are disposed within the interior of the heat sink.
2. An electrically insulated heat sink with high thermal conductivity in accordance with claim 1, wherein the heat sink is coated on the surface with a layer of coating having high thermal conductivity.
3. An electrically insulated heat sink with high thermal conductivity in accordance with claim 2, wherein the layer of coating having high thermal conductivity is carbon nanomaterial.
4. An electrically insulated heat sink with high thermal conductivity in accordance with claim 2, wherein the layer of coating having high thermal conductivity is a metal coating having high thermal conductivity.
5. An electrically insulated heat sink with high thermal conductivity in accordance with claim 1, wherein the post-shaped heat dissipating bodies of the base body in the outmost periphery are made higher than the other post-shaped heat dissipating bodies.
6. An electrically insulated heat sink with high thermal conductivity in accordance with claim 5, wherein the heat sink is coated on the surface with a layer of coating having high thermal conductivity.
7. An electrically insulated heat sink with high thermal conductivity in accordance with claim 6, wherein the layer of coating having high thermal conductivity is carbon nanomaterial.
8. An electrically insulated heat sink with high thermal conductivity in accordance with claim 6, wherein the layer of coating having high thermal conductivity is a metal coating having high thermal conductivity.
9. An electrically insulated heat sink with high thermal conductivity in accordance with claim 1, wherein the heat sink is formed by the conglomerate of a plurality of ceramic granules.
10. An electrically insulated heat sink with high thermal conductivity in accordance with claim 9, wherein each ceramic granule has a plurality of pores on its surface.
11. An electrically insulated heat sink with high thermal conductivity in accordance with claim 9, wherein the diameters of the ceramic granules are different.
12. An electrically insulated heat sink with high thermal conductivity in accordance with claim 9, wherein the diameters of the ceramic granules are the same.
13. An electrically insulated heat sink with high thermal conductivity in accordance with claim 10, wherein the diameters of the ceramic granules are different.
14. An electrically insulated heat sink with high thermal conductivity in accordance with claim 10, wherein the diameters of the ceramic granules are the same.
15. An electrically insulated heat sink with high thermal conductivity in accordance with claim 9, wherein the heat sink is coated on the surface with a layer of coating having high thermal conductivity.
16. An electrically insulated heat sink with high thermal conductivity in accordance with claim 15, wherein the layer of coating having high thermal conductivity is carbon nanomaterial.
17. An electrically insulated heat sink with high thermal conductivity in accordance with claim 15, wherein the layer of coating having high thermal conductivity is a metal coating having high thermal conductivity.
US11/850,224 2007-09-05 2007-09-05 Electrically insulated heat sink with high thermal conductivity Abandoned US20090056915A1 (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090084520A1 (en) * 2007-09-28 2009-04-02 Caterpillar Inc. Heat exchanger with conduit surrounded by metal foam
US20100019380A1 (en) * 2008-07-24 2010-01-28 Yi Min Lin Integrated circuit with micro-pores ceramic heat sink
US20110226512A1 (en) * 2010-03-22 2011-09-22 Yao-Tsung Kao Heatsink Device Having A Rapid Heatsink Effect
US20150153113A1 (en) * 2013-12-03 2015-06-04 International Business Machines Corporation Heat sink with air pathways through the base
DE102014200400A1 (en) * 2014-01-13 2015-07-16 Siemens Aktiengesellschaft Device for transferring heat between at least two streams present at different temperatures
US20160047604A1 (en) * 2014-08-15 2016-02-18 Ge Aviation Systems Llc Heat dissipating assembly
JP2017125676A (en) * 2017-04-07 2017-07-20 古河電気工業株式会社 heat sink

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3457476A (en) * 1965-02-12 1969-07-22 Hughes Aircraft Co Gate cooling structure for field effect transistors
US4884331A (en) * 1987-04-27 1989-12-05 Thermalloy Incorporated Method of manufacturing heat sink apparatus
US5366688A (en) * 1992-12-09 1994-11-22 Iowa State University Research Foundation, Inc. Heat sink and method of fabricating
US6163073A (en) * 1998-04-17 2000-12-19 International Business Machines Corporation Integrated heatsink and heatpipe
US6273185B1 (en) * 1999-12-14 2001-08-14 Foxconn Precision Components Co., Ltd. Heat sink and retainer for electronic integrated devices
US20020088609A1 (en) * 1997-06-30 2002-07-11 Tantoush Mohammad A. Scalable and modular heat sink-heat pipe cooling system
US6705388B1 (en) * 1997-11-10 2004-03-16 Parker-Hannifin Corporation Non-electrically conductive thermal dissipator for electronic components
US20070025085A1 (en) * 2005-07-29 2007-02-01 Hon Hai Precision Industry Co., Ltd. Heat sink

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3457476A (en) * 1965-02-12 1969-07-22 Hughes Aircraft Co Gate cooling structure for field effect transistors
US4884331A (en) * 1987-04-27 1989-12-05 Thermalloy Incorporated Method of manufacturing heat sink apparatus
US4884331B1 (en) * 1987-04-27 1994-05-03 Thermalloy Inc Method of manufacturing heat sink apparatus
US5366688A (en) * 1992-12-09 1994-11-22 Iowa State University Research Foundation, Inc. Heat sink and method of fabricating
US20020088609A1 (en) * 1997-06-30 2002-07-11 Tantoush Mohammad A. Scalable and modular heat sink-heat pipe cooling system
US6705388B1 (en) * 1997-11-10 2004-03-16 Parker-Hannifin Corporation Non-electrically conductive thermal dissipator for electronic components
US6163073A (en) * 1998-04-17 2000-12-19 International Business Machines Corporation Integrated heatsink and heatpipe
US6273185B1 (en) * 1999-12-14 2001-08-14 Foxconn Precision Components Co., Ltd. Heat sink and retainer for electronic integrated devices
US20070025085A1 (en) * 2005-07-29 2007-02-01 Hon Hai Precision Industry Co., Ltd. Heat sink

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090084520A1 (en) * 2007-09-28 2009-04-02 Caterpillar Inc. Heat exchanger with conduit surrounded by metal foam
US8069912B2 (en) * 2007-09-28 2011-12-06 Caterpillar Inc. Heat exchanger with conduit surrounded by metal foam
US20100019380A1 (en) * 2008-07-24 2010-01-28 Yi Min Lin Integrated circuit with micro-pores ceramic heat sink
US20110226512A1 (en) * 2010-03-22 2011-09-22 Yao-Tsung Kao Heatsink Device Having A Rapid Heatsink Effect
US20150153113A1 (en) * 2013-12-03 2015-06-04 International Business Machines Corporation Heat sink with air pathways through the base
DE102014200400A1 (en) * 2014-01-13 2015-07-16 Siemens Aktiengesellschaft Device for transferring heat between at least two streams present at different temperatures
US20160047604A1 (en) * 2014-08-15 2016-02-18 Ge Aviation Systems Llc Heat dissipating assembly
JP2017125676A (en) * 2017-04-07 2017-07-20 古河電気工業株式会社 heat sink

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