US20090065187A1

US20090065187A1 - Adjustable cooling unit for semiconductor module

Info

Publication number: US20090065187A1
Application number: US11/867,931
Authority: US
Inventors: Jae Hyun SON
Original assignee: Hynix Semiconductor Inc
Current assignee: SK Hynix Inc
Priority date: 2007-09-10
Filing date: 2007-10-05
Publication date: 2009-03-12
Also published as: KR100910227B1; KR20090026601A

Abstract

A cooling unit for a semiconductor module includes a plate shaped first cooling body, a plate shaped second cooling body opposing the first cooling body and an adjustable cooling member placed between the first and second cooling bodies so that a distance between the first and second cooling bodies may be adjusted. Shapes of the cooling body include a honeycomb structure, cylinders, a hemicylindrical shape, a zigzag shape, and a bellows structure shape. By forming the cooling unit with an adjustable cooling member, the cooling unit can fit electronic devices of various sizes.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority to Korean patent application number 10-2007-91693 filed on Sep. 10, 2007, which is incorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

The present invention relates to a cooling unit for a semiconductor module, and more particularly to a cooling unit for a semiconductor module that is universally applicable to various kinds of electronic appliances.
Recently, a semiconductor package equipped with a high performance semiconductor device has been developed along with the development of technology for fabricating the semiconductor device. A semiconductor package is applied to most electronic appliances as the size of electronic appliances has become smaller. Performance of the smaller electronic devices has been enhanced due to the development of the semiconductor package equipped with the semiconductor device.
Additionally, as the performance of the semiconductor device has been enhanced, the semiconductor device has become able to store massive data and process the massive data in a short time.
However, the semiconductor device generates large amounts of heat while processing data, and the generated heat reduces the performance of the semiconductor device.
In order to rapidly radiate the heat generated from the semiconductor package including the semiconductor device, a semiconductor package equipped with a cooling unit for radiating heat generated from the semiconductor device has been developed.
However, when applying a conventional semiconductor package equipped with a cooling unit to various electronic appliances, there is a disadvantage in that the size of the cooling unit makes it difficult to apply the semiconductor package equipped with the cooling unit to certain electronic appliances.

BRIEF SUMMARY OF THE INVENTION

Embodiments of the present invention are directed to a cooling unit for a semiconductor module, which is universally applicable to various kinds of electronic appliances.
In one embodiment, a cooling unit for a semiconductor module may comprise a plate shaped first cooling body; a plate shaped second cooling body opposing the first cooling body; and a cooling member placed between the first and second cooling bodies that is adjustable in volume so that a distance between the first and second cooling bodies may be adjusted.
At least one of the first and second cooling members may include a metal.
The cooling member may have various different structures, one being a honeycomb structure having hexagonal sections.
The cooling member with a honeycomb structure includes a first cooling member formed a plurality of first adhesive parts having a first width and a plurality of first volume adjusting parts having a second width, the two of which are connected to each other and alternate.; a second cooling member having a plurality of second adhesive parts corresponding to the first adhesive parts and a plurality of second volume adjusting parts corresponding to the first volume adjusting parts; and an adhesive member is placed between the first and the second adhesive parts that contact each other.
At least two cooling members having the honeycomb structure may be placed such that they interconnect with each other.
In the honeycomb structure, the width of the first adhesive parts (the first width) may be narrower than the width of the volume adjusting parts (the second width).
Alternatively, the cooling member may have a hemicylindrical shape (for example the shape of a leaf spring) in which a curved face thereof is in contact with an inner face of the first cooling body and both ends thereof are in contact with an inner face of the second cooling body.
The cooling member with the hemicylindrical shape may have rumples for increasing a contact area between the cooling member and the first cooling body.
The cooling member may also have a zigzag shape.
The cooling member with the zigzag shape may also have rumples for increasing contact areas between the zigzag shape and the first and second cooling bodies.
Finally, the cooling member may also have a bellows shape.
In the cooling units described above, in order to couple the first cooling body to the second cooling body, the first cooling body includes a coupling protrusion that protrudes from side face of the first cooling body and extends toward the second cooling body. The second cooling body includes a coupling recess in which the coupling protrusion is inserted.
In order to connect the cooling unit to a semiconductor module, the cooling unit includes a protrusion part which protrudes from a side face of the first cooling body and the protrusion part has a through hole.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view illustrating a cooling unit for a semiconductor module in accordance with a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of the cooling unit shown in FIG. 1.

FIG. 3 is an exploded perspective view illustrating a cooling unit for a semiconductor module in accordance with a second embodiment of the present invention.

FIG. 4 is a cross-sectional view of the cooling unit shown in FIG. 3.

FIG. 5 is an exploded perspective view illustrating a cooling unit for a semiconductor module in accordance with a third embodiment of the present invention.

FIG. 6 is a cross-sectional view of the cooling unit shown in FIG. 5.

FIG. 7 is an exploded perspective view illustrating a cooling unit for a semiconductor module in accordance with a fourth embodiment of the present invention.

FIG. 8 is a cross-sectional view of the cooling unit shown in FIG. 7.

FIG. 9 is an exploded perspective view illustrating a cooling unit for a semiconductor module in accordance with a fifth embodiment of the present invention.

FIG. 10 is a cross-sectional view of the cooling unit shown in FIG. 9.

DESCRIPTION OF SPECIFIC EMBODIMENTS

A preferred embodiment of the present invention is directed to a cooling unit for a semiconductor module which includes a plate shaped first cooling body, a plate shaped second cooling body opposing to the first cooling body and a cooling member placed between the first and second cooling bodies that is adjustable in volume so as to adjust a distance between the first and second cooling bodies.
FIG. 1 is an exploded perspective view illustrating a cooling unit for a semiconductor module in accordance with a first embodiment of the present invention. FIG. 2 is a cross-sectional view of the cooling unit shown in FIG. 1.
Referring to FIGS. 1 and 2, the cooling unit 100, which can be applied to a semiconductor module, includes a first cooling body 110, a second cooling body 120 and a cooling member 130 that is adjustable in volume.
The first cooling body 110 has, for example, a plate shape. More specifically, the first cooling body 110 has, for example, the shape of a rectangular parallelepiped plate.
In the present embodiment, the rectangular parallelepiped first cooling body 110 includes a first face 111, a second face 112 that opposes the first face 111, and four side faces 113, 114, 115, 116.
Examples of material that may be used as the first cooling body 110 include aluminum, aluminum alloy, copper, copper alloy, and metal ally, etc. Alternatively, carbon compound or synthetic resin, which has similar thermal conductivity to metal, may be used as the first cooling body 110.
The second cooling body 120 opposes the first cooling body 110. The second cooling body 120 has, for example, a plate shape. More specifically, the second cooling body 120 has, for example, the shape of a rectangular parallelepiped plate. The second cooling body 120 has substantially the same shape and size as the first cooling body 110.
In the present embodiment, the rectangular parallelepiped second body 120 includes a third face 121, a fourth face 122 that opposes the third face 121, and four side faces 123, 124, 125, 126.
Examples of material that may be used as the second cooling body 120 include aluminum, aluminum alloy, copper, copper alloy, and metal ally, etc. Alternatively, carbon compound or synthetic resin, which has similar thermal conductivity to metal, may be used as the second cooling body 120.
In the present embodiment, the first and second cooling bodies 110 and 120 may include a metal having superior thermal conductivity. Alternatively, either of the first and second cooling bodies 110 and 120 may include a typical metal.
In the present embodiment, in order to couple the first cooling body 110 to the second cooling body 120, the first cooling body 110 is formed with a coupling protrusion 113 a, and the second cooling body 120 is formed with a coupling recess 127. The coupling protrusion 113 a formed on the first cooling body 110 is protruded, for example, in a bar shape from side faces 113 of the first cooling body 110, and the coupling protrusion 113 a protruded from the side faces 113 is bent toward the second cooling body 120. The side faces 123 and 125 of the second cooling body 120 are formed with coupling recesses 127 to which the respective coupling protrusions 113 a are coupled.
Referring specifically to FIG. 2, the cooling member 130 rapidly radiates heat transferred to the first cooling body 110 and/or the second cooling body 120 and adjusts a distance P between the first cooling body 110 and the second cooling body 120. In order to realize this, the cooling member 130 may have a honeycomb structure having hexagonal sections for volume adjustment.
Specifically, the cooling member 130 having a honeycomb structure includes a first cooling member 131, a second cooling member 132 and an adhesive member 133.
In the present embodiment, example of material that may be used as the first and second cooling members 131 and 132 include aluminum, aluminum alloy, copper, copper alloy, metal ally, etc. When looking at the the first and second cooling members 131 and 132 from the front, they may have, for example, the shape of a thin film having a small thickness.
When looking at the first cooling member 131 from the side, it has the shape of a rectangular sheet. Referring to FIG. 2, the first cooling member 131 includes a first adhesive part 131 a having a first width L1 and a first volume adjusting part 131 b having a second width L2. The first adhesive part 131 a and the first volume adjusting part 131 b are formed alternately in the first cooling member 131.
When looking at the second cooling member 132 from the side, it has the shape of a rectangular sheet. Referring to FIG. 2, the second cooling member 132 includes a second adhesive part 132 a having the first width L1 and a second volume adjusting part 132 b having the second width L2. The second adhesive part 132 a and the second volume adjusting part 132 b are formed alternately in the second cooling member 132.
In the present embodiment, the first adhesive part 131 a and the first volume adjusting part 131 b of the first cooling member 131 are formed at positions corresponding to the second adhesive part 132 a and the second volume adjusting part 132 b of the second cooling member 132.
In addition, in the present embodiment, the width L1 of the first adhesive part 131 a may be smaller than the width L2 of the first volume adjusting part 131 b.
The adhesive member 133 is placed between the first adhesive part 131 a of the first cooling member 131 and the corresponding second adhesive part 132 a of the second cooling member 132, thereby adhering the corresponding first cooling member 131 and second cooling member 132 to each other.
In the present embodiment, the cooling member 130 having the first and second cooling members 131 and 132 is placed between the first and second cooling bodies 110 and 120. The thickness of the cooling member 130 can be widened or narrowed by applying tension to sides of the first and second cooling members 131 and 132.
Although a single cooling member 130 is placed between the first and second cooling bodies 110 and 120 in the present embodiment, a plurality of cooling members 130 may be placed between the first and second cooling bodies 110 and 120.
Referring back to FIG. 1, in order to couple the cooling unit 100 (which includes the first cooling body 110, the second cooling body 120 and the cooling member 130) to a semiconductor module (not shown), a protrusion part 117 may be formed on the side faces 114 and 116 of the first cooling body 110. The protrusion parts 117 protrude in a rectangular shape from the side faces 114 and 116 of the first cooling body 110. The protrusion part 117 is formed with a through hole 118. The protrusion part 117 and a semiconductor module may be coupled to each other by a rivet, screw, etc.
FIG. 3 is an exploded perspective view illustrating a cooling unit for a semiconductor module in accordance with a second embodiment of the present invention. FIG. 4 is a cross-sectional view of the cooling unit shown in FIG. 3. The cooling unit in accordance with the second embodiment of the present invention is substantially the same as that of the first embodiment of the present invention, which is described above, except for the cooling member. Therefore, the descriptions of the duplicate parts will be omitted, and the same names and reference symbols will be given to the duplicate parts.
In the second embodiment, a cooling unit 100 includes a first cooling body 110, a second cooling body 120 and a cooling member 140.
The cooling member 140 is placed between the first cooling body 110 and the second cooling body 120.
The cooling member 140 has a plurality of cylinders 142. The plurality of cylinders 142 are arranged in a row between the first cooling body 110 and the second cooling body 120. The adjacent two cylinders of the cooling member 140 may be adhered to each other by an adhesive agent 144. Examples of material usable as the cylinders 142 of the cooling member 140 include aluminum, aluminum alloy, copper, copper alloy, metal ally, etc., these materials having superior thermal conductivity.
In the cooling unit 100 of the present embodiment, a volume of the cooling member may be adjusted by applying compressive force to the cooling member 140 placed between the first and second cooling bodies 110 and 120, which deforms the cylindrical cooling member 140 into an elliptical shape.
FIG. 5 is an exploded perspective view illustrating a cooling unit for a semiconductor module in accordance with a third embodiment of the present invention. FIG. 6 is a cross-sectional view of the cooling unit shown in FIG. 5. The cooling unit in accordance with the third embodiment of the present invention is substantially the same as the first embodiment of the present invention, which is described above, except for the cooling member. Therefore, descriptions of the duplicate parts will be omitted, and the same names and reference symbols will be given to the duplicate parts.
In the third embodiment a cooling unit 100 includes a first cooling body 110, a second cooling body 120 and a cooling member 150.
The cooling member 150 is placed between the first cooling body 110 and the second cooling body 120.
The cooling member 150 in accordance with the present embodiment has, for example, a shape of a leaf spring (or a hemicylindrical shape). A circumferential face of the cooling member 150 is placed, for example, on the first cooling body 110 and a pair of ends of the cooling member 150 is placed on the second cooling body 120. Examples of material usable as the cooling member 150 include aluminum, aluminum alloy, copper, copper alloy, etc.
In the present embodiment, in order to increase the contact area between the cooling member 150 and the first and second cooling bodies 110 and 120, the cooling member 150 may be formed to be irregular or rumpled.
In the cooling unit 100 in accordance with the present embodiment, an internal volume of the cooling member 150 can be adjusted by applying compressive force to the cooling member 150 placed between the first and second cooling bodies 110 and 120, such that the cooling member 150 having a shape of a leaf spring becomes deformed.
FIG. 7 is an exploded perspective view illustrating a cooling unit for a semiconductor module in accordance with a fourth embodiment of the present invention. FIG. 8 is a cross-sectional view of the cooling unit shown in FIG. 7. The cooling unit in accordance with the fourth embodiment of the present invention is substantially the same as the first embodiment of the present invention, which is described above, except for the cooling member. Therefore, descriptions of duplicate parts will be omitted and the same names and reference symbols will be given to the duplicate parts.
In the third embodiment, a cooling unit 100 includes a first cooling body 110, a second cooling body 120 and a cooling member 160.
The cooling member 160 is placed between the first cooling body 110 and the second cooling body 120.
The cooling member 160 in accordance with the present embodiment has, for example, a zigzag shape. A first face of the zigzag shaped cooling member 160 is placed, for example, on the first cooling body 110, and a second face of the zigzag shaped cooling member 160 is placed on the second cooling body 120. Examples of material usable as the cooling member 160 includes aluminum, aluminum alloy, copper, copper alloy, etc.
In the present embodiment, in order to increase the contact area between the cooling member 160 and the first and second cooling bodies 110 and 120, the cooling member 160 may be formed to be irregular or rumpled.
In the cooling unit 100 in accordance with the present embodiment, the internal volume of the cooling member 160 can be adjusted by applying compressive force to the cooling member 160, which is placed between the first and second cooling bodies 110 and 120, to deform the zigzag shaped cooling member 160.
FIG. 9 is an exploded perspective view illustrating a cooling unit for a semiconductor module in accordance with a fifth embodiment of the present invention. FIG. 10 is a cross-sectional view of the cooling unit shown in FIG. 9. The cooling unit in accordance with the fifth embodiment of the present invention is substantially the same as the first embodiment of the present invention, which is described in above, except for the cooling member. Therefore, descriptions of duplicate parts will be omitted, and the same name and reference symbol will be given to the duplicate parts.
In the fifth embodiment, a cooling unit 100 includes a first cooling body 110, a second cooling body 120 and a cooling member 170.
The cooling member 170 is placed between the first cooling body 110 and the second cooling body 120.
The cooling member 170 in accordance with the present embodiment has a bellows structure and includes, for example, a pair of cooling faces 171 and 172 which oppose each other, and bellows portions 173 connecting the edges of the cooling faces 171 and 172. The cooling face 171 of the cooling member 170is placed, for example, on the first cooling body 110 and the cooling face 172 of the cooling member 170 is placed on the second cooling body 120. Examples of material usable as the cooling member 160 include aluminum, aluminum alloy, copper, copper alloy, etc.
In the present embodiment, in order to increase the contact area between the cooling member 170 and the first and second cooling bodies 110 and 120, the cooling faces 171 and 172 may be formed to be irregular or rumpled.
In the cooling unit 100 in accordance with the present embodiment, a volume of the cooling member 170 can be adjusted by applying compressive force or tension to the bellows structure of the cooling member 170, which is placed between the first and second cooling bodies 110 and 120, such that the cooling member 170 becomes deformed.
The cooling unit in accordance with the present invention, which is described above, may be coupled to, for example, a semiconductor module on which a plurality of semiconductor packages is mounted. When the cooling unit 100 is coupled to a semiconductor module, the heat generated from the semiconductor module can be rapidly radiated, and the semiconductor module can be mounted to various different electronic appliances without there being a limit in the size of the cooling unit 100 to be mounted on the semiconductor module.
Although specific embodiments of the present invention have been described for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and the spirit of the invention as disclosed in the accompanying claims.

Claims

1. A cooling unit for a semiconductor module, comprising:

a plate shaped first cooling body;

a plate shaped second cooling body opposing the first cooling body; and

a cooling member placed between the first and second cooling bodies, the cooling member being adjustable in volume such that a distance between the first and second cooling bodies are adjusted.

2. The cooling unit for a semiconductor module according to claim 1, wherein at least one of the first and second cooling members includes a metal.

3. The cooling unit for a semiconductor module according to claim 1, wherein the cooling member has a honeycomb structure having a plurality of parallel parts and angled parts which form hexagonal sections.

4. The cooling unit for a semiconductor module according to claim 3, wherein the cooling member comprises:

a first cooling member having a plurality of first adhesive parts having a first width and a plurality of first volume adjusting part having a second width, wherein the first adhesive parts and the first volume adjusting parts are connected and alternate such that a first half of each hexagonal section is formed;

a second cooling member having a plurality of second adhesive parts corresponding to the first adhesive parts and a plurality of second volume adjusting parts corresponding to the first volume adjusting parts, such that a second half of the hexagonal sections that are opposite to the first half are formed; and

an adhesive member placed between the first and the second adhesive parts which contact each other.

5. The cooling unit for a semiconductor module according to claim 4, wherein a plurality of cooling members are placed in a manner such that the cooling members interconnect.

6. The cooling unit for a semiconductor module according to claim 4, wherein the first width is narrower than the second width.

7. The cooling unit for a semiconductor module according to claim 1, wherein the cooling member has a plurality of cylinders.

8. The cooling unit for a semiconductor module according to claim 7, wherein the plurality of cylinders are arranged in a row between the first cooling body and the second cooling body.

9. The cooling unit for a semiconductor module according to claim 1, wherein the cooling member has a hemicylindrical shape in which a curved face thereof is in contact with an inner face of the first cooling body and both ends thereof are in contact with an inner face of the second cooling body.

10. The cooling unit for a semiconductor module according to claim 9, wherein the cooling member has rumples for increasing a contact area between the cooling member and the first cooling body.

11. The cooling unit for a semiconductor module according to claim 1, wherein the cooling member contains a plurality of faces forming a zigzag shape, wherein a first face contacts the first cooling body, and a last face contacts the second cooling body.

12. The cooling unit for a semiconductor module according to claim 11, wherein the cooling member has rumples to increase a contact area between the first face and the first cooling body and the last face and the second cooling body.

13. The cooling unit for a semiconductor module according to claim 1, wherein the cooling member has a bellows structure shape.

14. The cooling unit for a semiconductor module according to claim 1, further comprising:

a coupling protrusion that protrudes from a side face of the first cooling body and extends toward the second cooling body, and

a coupling recess formed in the second cooling body in which the coupling protrusion is inserted.

15. The cooling unit for a semiconductor module according to claim 1, further comprising:

a protrusion part for connecting the cooling unit to a semiconductor module, wherein the protrusion part protrudes from a side face of the first cooling body and the protrusion part has a through hole.