US20090206474A1 - Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film - Google Patents
Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film Download PDFInfo
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- US20090206474A1 US20090206474A1 US12/430,140 US43014009A US2009206474A1 US 20090206474 A1 US20090206474 A1 US 20090206474A1 US 43014009 A US43014009 A US 43014009A US 2009206474 A1 US2009206474 A1 US 2009206474A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
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- B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
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- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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Definitions
- the present invention relates generally to electrical devices and to the assembly of electrical devices. More particularly, the present invention relates to the assembly of radio frequency identification (RFID) interposers and/or devices.
- RFID radio frequency identification
- Pick and place techniques are often used to assemble electrical devices.
- Pick and place techniques typically involve complex robotic components and control systems that handle only one die at a time.
- Such techniques may utilize a manipulator, such as a robotic arm, to remove integrated circuit (IC) chips, or dies, from a wafer of IC chips and place them on a chip carrier, a transport, or directly to a substrate. If not directly mounted, the chips are subsequently mounted onto a substrate with other electrical components, such as antennas, capacitors, resistors, and inductors to form an electrical device.
- IC integrated circuit
- RFID inlays are identification transponders that typically have a substantially flat shape.
- the antenna for an inlay transponder may be in the form of a conductive trace deposited on a non-conductive support.
- the antenna has a suitable shape, such as a flat coil or other geometric shape. Leads for the antenna are also deposited, with nonconductive layers interposed as necessary. Memory and any control functions are provided by a chip mounted on the support and operatively connected through the leads to the antenna.
- An RFID inlay may be joined or laminated to selected label or tag materials made of films, papers, laminations of films and papers, or other flexible sheet materials suitable for a particular end use.
- the resulting RFID label stock or RFID tag stock may then be overprinted with text and/or graphics, die-cut into specific shapes and sizes into rolls of continuous labels, or sheets of single or multiple labels, or rolls or sheets of tags.
- Interposers include conductive leads or pads that are electrically coupled to the contact pads of the chips for coupling to the antennas. These pads generally provide a larger effective electrical contact area than ICs precisely aligned for direct placement without an interposer. The larger area reduces the accuracy required for placement of ICs during manufacture while still providing effective electrical connection. IC placement and mounting are serious limitations for high-speed manufacture.
- the prior art discloses a variety of RFID interposer or strap structures, typically using a flexible substrate that carries the interposer's contact pads or leads.
- RFID transponders include both integrated circuits and antennas for providing radio frequency identification functionality.
- Interposers include the integrated circuits but must be coupled to antennas in order to form complete RFID transponders.
- device refers both to an RFID transponder, and to an interposer that is intended to be incorporated in an RFID transponder.
- RFID devices generally have a combination of antennas and analog and/or digital electronics, which may include for example communications electronics, data memory, and control logic.
- RFID tags are used in conjunction with security-locks in cars, for access control to buildings, and for tracking inventory and parcels.
- Some examples of RFID tags and labels appear in U.S. Pat. Nos. 6,107,920, 6,206,292, and 6,262,292, all of which are hereby incorporated by reference in their entireties.
- An RFID device may be affixed to an item whose presence is to be detected and/or monitored.
- the presence of an RFID device, and therefore the presence of the item to which the device is affixed, may be checked and monitored by devices known as “readers.”
- RFID devices are produced by patterning, etching or printing a conductor on a dielectric layer and coupling the conductor to a chip.
- pick and place techniques are often used for positioning a chip on the patterned conductor.
- a web containing a plurality of chips may be laminated to a web of printed conductor material.
- An example of such a process is disclosed in commonly assigned U.S. patent application Ser. No. 10/805,938, filed on Mar. 22, 2004.
- the chips may be coupled to the conductor by any of a variety of suitable connecting materials and/or methods, such as, for example, by use of a conductive or non-conductive adhesive, by use of thermoplastic bonding materials, by use of conductive inks, by use of welding and/or soldering, or by electroplating.
- suitable connecting materials and/or methods such as, for example, by use of a conductive or non-conductive adhesive, by use of thermoplastic bonding materials, by use of conductive inks, by use of welding and/or soldering, or by electroplating.
- the material used for mechanically and/or electrically coupling the chip to the conductor requires heat and/or pressure to form a final interconnect—a process, in the case of adhesives, known as curing.
- Conventional thermocompressive bonding methods typically use some form of press for directing pressure and heat, via conduction or convection, to an RFID device assembly or web of RFID device assemblies.
- pressure and heat may be applied by compressing the RFID device assembly or web of RFID device assemblies between a pair of heating plates, and relying on conduction through the various media, including chip and antenna, to heat the connecting material.
- one of the heating plates may be equipped with pins for selectively applying pressure and/or heat to certain areas (e.g. only the chips), and again relying on conduction to heat the connecting material.
- an oven may be used wherein the whole assembly is held at elevated temperature and via convection the solder reflows. In the latter case, pressure may not be applied to the device.
- a method for embedding a chip in a substrate.
- the method includes heating the chip and pressing the chip into the substrate.
- the chip heated with thermal radiation, is pressed into a thermoplastic substrate.
- the heated chip heats the substrate in a localized region thereby softening the thermoplastic substrate and allowing the chip to be embedded therein.
- a method of making an electrical device including the steps of: placing a chip on a substrate, heating the substrate, and embedding the chip into the substrate while the substrate is at an elevated temperature.
- a method of making an electrical device including the steps of: heating a chip, embedding the chip in a substrate, and coupling the chip to an electrical component.
- a method of making an RFID transponder comprising the steps of: placing a chip having a bottom surface and a top surface on a thermoplastic substrate with the bottom surface of the chip contacting a top surface of the thermoplastic substrate, heating at least one of the thermoplastic substrate or chip with thermal radiation thereby elevating the temperature of the thermoplastic substrate and consequently softening the thermoplastic substrate, embedding the chip into the thermoplastic substrate by applying pressure to the chip while the substrate is heated to the elevated temperature, and coupling the chip to an antenna structure.
- the coupling includes depositing the antenna structure with conductive ink onto the thermoplastic substrate and connecting the antenna structure to the interposer leads of the RFID interposer.
- an RFID chip is placed on a substrate with the contacts of the chip facing away from the substrate and the chip and/or the substrate is heated while applying pressure thereby embedding the chip into the substrate.
- Heating or curing may be achieved in a variety of ways including applying electromagnetic radiation, for example infrared, near infrared, or ultraviolet radiation to the chip and/or web.
- the chip contacts can be simultaneously coupled with an electrical element, for example conductive leads or an antenna structure which can be preformed on a second substrate which can be laminated to the first substrate.
- the second substrate that includes the electrical element can be placed on the chip contacts such that the electrical element is facing away from the chip contacts.
- the chip contacts penetrate the second substrate and contact the electrical element.
- the second substrate may be thermoplastic, compressible, or curable.
- the electrical element on the second substrate can be formed by printing conductive ink. The application of electromagnetic radiation to the second substrate can further cure such ink and enhance its conductivity.
- a method of making an RFID transponder comprising: providing a web material, the web material including a continuous conductive element and a compressible substrate layer, forming a recess in the web material by compressing the compressible substrate layer, wherein forming the recess divides the conductive element thereby forming at least two antenna portions, placing a chip in the recess, and coupling the chip to the antenna portions.
- Forming the recess includes pressing together of the chip and web material and effects the placing and the coupling of the chip.
- a method of making an RFID transponder comprising: providing a web material, the web material including a compressible substrate layer and an antenna structure having a first antenna portion and a second antenna portion, forming a recess in the web material between the first and second antenna portions by compressing the compressible substrate layer, placing a chip in the recess, and coupling the chip to the antenna portions of the antenna structure.
- the forming the recess includes pressing together of the chip and web material and the pressing effects the placing and the coupling of the chip.
- the chip can be used as a forming tool that simultaneously forms a recess in the substrate and embeds the chip in the recess, thereby eliminating the need for the additional steps of separately forming a recess in the substrate and then aligning the chip with the recess prior to its insertion therein.
- an electrical device comprising a chip and a substrate.
- the chip is embedded in the substrate and at least partially encased by the substrate.
- the device includes an electrical element, such as an antenna structure, on a planarizer layer. Bond pads on the chip extend through the planarizer layer and are electrically coupled to the antenna structure.
- the substrate can be a thermoplastic material.
- FIG. 1 is a flowchart depicting a method of the present invention
- FIG. 2 is a side view of an electrical device of the present invention
- FIG. 3 is an oblique view of an electrical device of the present invention.
- FIG. 4 is a side view of an electrical device in a device for applying thermocompression in accordance with the present invention.
- FIG. 5A is a side view of an electrical device of the present invention.
- FIG. 5B is a side view of an electrical device of the present invention.
- FIG. 6 is an oblique view of a laminating device of the present invention.
- FIG. 7A is a side view of a system of the present invention.
- FIG. 7B is a side view of a system of the present invention.
- FIG. 8 is a side view of an electrical device in a device for applying thermocompression in accordance with the present invention of the present invention.
- FIG. 9 is a side view of an electrical device in a device for applying thermocompression in accordance with the present invention of the present invention.
- FIG. 10A is a side view of an electrical device in a device for applying thermocompression in accordance with the present invention of the present invention.
- FIG. 10B is a graph of the relative NIR radiation absorption rates of various exemplary materials that may be used in the present invention.
- FIG. 11 is a top view of a web substrate that may be used in accordance with a method of the present invention.
- FIG. 12 is a top view of another web substrate that may be used in accordance with a method of the present invention.
- FIG. 13 is a cross-sectional view of the web substrate of FIG. 11 ;
- FIG. 14 is a cross-sectional view of the web substrate of FIG. 11 during embedding of a chip therein;
- FIG. 15 is a cross-sectional view of the web substrate of FIG. 12 ;
- FIG. 16 is a cross-sectional view of the web substrate of FIG. 12 during embedding of a chip therein;
- FIG. 17 is a side view of a device for embedding a chip in a substrate in accordance with a method of the present invention.
- FIG. 18 is a side view of a device for embedding a chip in a substrate in accordance with a method of the present invention.
- FIG. 19 is a cross-sectional view of the components of an electrical device in accordance with the present invention.
- FIG. 20 is a cross-sectional view of an assembled electrical device formed with the components of FIG. 19 ;
- FIG. 21 is a cross-sectional view of a substrate having a chip embedded therein and a web having thereon antenna element portions;
- FIG. 22 is a cross-sectional view of an assembled electrical device in accordance with the present invention formed with the substrate and web of FIG. 21 ;
- FIG. 23 is a cross-sectional view of the components of an electrical device in accordance with the present invention.
- FIG. 24 is a cross-sectional view of an assembled electrical device formed with the components of FIG. 23 ;
- FIG. 25 is a top view of an electrical device in accordance with the present invention.
- FIG. 26 is a top view of the electrical device of FIG. 25 with the chip electrically connected to antenna element portions.
- a method of manufacturing electrical devices wherein a chip or other electrical component is embedded in a substrate.
- the substrate may be a thermoplastic material capable of deforming around the chip when heat and/or pressure is applied to the substrate.
- the substrate may include a compressible layer that can be compressed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured to the web and may be coupled to another electrical component.
- a method of manufacturing an RFID device is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.
- the electrical devices may be devices other than RFID devices.
- the electrical components can be used in accordance with the present invention.
- this method is well suited to the high-speed manufacture of RFID devices, it will be described in the context of an RFID device manufacturing process.
- the method 5 shown in FIG. 1 begins in process step number 10 , wherein a chip is placed on a web substrate.
- the chip can be part of an interposer structure, as described above.
- process step 12 the chip is embedded into the web substrate by applying heat and/or pressure to the chip and/or to the web. Once the chip is suitably embedded in the web substrate, the chip and/or the web are cooled in process step 14 . It will be appreciated that the step of cooling the chip and/or web can be achieved simply by ceasing to apply heat and/or pressure thereto.
- the chip is coupled to an antenna structure. As will be described in greater detail herein, the antenna structure may be applied or formed on the web before, during, or after the chip is embedded into the web.
- a chip 20 is placed on a web substrate 32 having a backing 36 .
- the chip 20 may include bumps 22 for coupling the chip 20 with an antenna or other electrical component.
- the chip 20 having a general rectangular cross section, has a top surface 24 , a bottom surface 25 , and side surfaces 26 a , 26 b , 26 c , 26 d .
- the bumps 22 are on the top surface 24 of the chip 20 such that when the chip 20 is embedded in the web substrate 32 the bumps 22 remain accessible for coupling to an electrical component.
- thermocompressive device 40 is positioned above the chip 20 and configured to compress the chip 20 against the web 32 in the direction of the arrow A.
- the backing 36 may be rigid or semi-rigid to provide adequate support to the web substrate 32 during compression.
- the thermocompressive device 40 includes a press for engaging the chip 20 .
- the thermocompressive device 40 may be any suitable thermocompressive device capable of applying heat and pressure.
- An example of a suitable thermocompressive device is disclosed in commonly assigned U.S. patent application Ser. No. 10/872,235 filed on Jul. 18, 2004. Conventional thermocompressive devices used for curing adhesives and/or solders also may be used.
- the thermal energy for heating the chip 20 and/or web substrate 32 may be applied via conduction through the press 42 of the thermocompressive device 40 .
- the thermocompressive device 40 may be configured to preheat the chip 20 and/or web substrate 32 to a predetermined temperature thereby ensuring that the web substrate 32 is adequately softened before applying pressure to the chip 20 . Preheating the chip 20 and/or web substrate 32 may prevent damage to the chip 20 when the chip 20 is compressed against the web substrate 32 .
- a conductive heating element that may be used to supply thermal energy is a Curie Point self-regulating heating element.
- a heating element is disclosed in U.S. Pat. No. 5,182,427 and embodied in the SmartHeat# technology currently manufactured by Metcal of Menlo Park, Calif.
- Such heating elements typically comprise a central copper core having a coating of a magnetized nickel metal alloy.
- a high frequency current is induced in the heating element and, due to the skin effect, tends to flow in the nickel metal alloy coating.
- Joule heating in the relatively high electrical resistance nickel metal alloy causes the coating temperature to increase. Once the temperature of the nickel metal alloy coating reaches its characteristic Curie Point, current no longer flows in the nickel metal alloy coating and instead flows through the low resistance central copper core.
- Curie Point temperature is essentially maintained at this point.
- the heating element heats rapidly to the Curie Point temperature and then self-regulates at that temperature.
- Curie Point self-regulating heating elements are advantageous because they are small, efficient, and temperature self-regulating, allowing a separate heating element to be assigned to each desired point of thermo-compression. It will be appreciated that other heating elements, such as standard resistive heating elements, may also be used.
- the web substrate 32 is heated by the thermocompressive device 40 and becomes increasingly pliable such that when the chip 20 is forced against the web substrate 32 by the thermocompressive device 40 , the web substrate 32 deforms around the chip 20 .
- the deformation of the web substrate 32 around the chip 20 is illustrated in FIG. 5A .
- the chip 20 in FIG. 5A is embedded in the web substrate 32 with the upper surface 24 of the chip 20 substantially level (e.g., flush) with the web substrate 32 .
- the sides 26 a , 26 b , 26 c , 26 d (not shown) of the chip 20 are essentially encased within the web substrate 32 .
- the chip 20 profile is superimposed within the web substrate's profile, thereby creating a uniform profile and, hence, a substantially flat structure.
- the bumps 22 on the chip 20 may extend slightly above the upper surface of the web substrate 32 for enabling the chip 20 to be coupled with an antenna structure or other electrical component.
- the upper surface 24 of the chip 20 can be slightly engulfed by the web substrate 32 thereby reducing the differential height between the bumps 22 and the surface of the web substrate 32 to facilitate printing leads to the bumps 22 .
- Typical chip thickness ranges from about 75 microns (3 mils) to 150 microns (6 mils) or greater.
- Typical web substrates or films used in web processing can range from 40 microns ( ⁇ 1.5 mils) to 200 microns (8 mils) or even greater. Embedding the chip into the substrate reduces the overall thickness of a resulting RFID device and produces a relatively flat RFID device.
- the web substrate will have a thickness that is equal or slightly greater than the chip thickness.
- the chip may be embedded in the web substrate such that there is virtually no surface bump thereby producing an interposer or device with a flat profile.
- thermocompressive device 40 is disengaged from the chip 20 and the web substrate 32 is allowed to cool. As the web substrate 32 cools it becomes less pliable and contracts slightly thereby securing the chip 20 within the web substrate 32 . It will be appreciated that the chip 20 is now at least partially encased within the web substrate 32 , secured mechanically within the web substrate by the web substrate 32 itself.
- the web substrate 32 may be a thermoplastic material capable of softening upon application of heat to the material and hardening upon cooling.
- the web substrate 32 may be a plastic film, polymer film, or any other thermoplastic material.
- the web substrate 32 may also be a thermoset material.
- the web substrate 32 can be curable with ultraviolet light.
- a plurality of chips 20 may be embedded in a web substrate 32 at predetermined intervals in one or more lanes. Alternatively, a plurality of chips 20 may be embedded in a sheet of substrate material at predetermined locations. Once the chips 20 are embedded in the web substrate 32 , the chips 20 may be coupled with antenna structures or other electrical components. The antenna structures or other electrical components may be transferred to the web or sheet substrate 32 or formed on the web or sheet substrate 32 before, during, or after embedding the chips 20 . Preformed antenna structures on or within the web substrate 32 can be provided such that when a chip 20 is embedded in the web substrate 32 it is electrically coupled (e.g., directly) to the antenna structure and mechanically coupled to the web substrate 32 . Further, a chip 20 can be embedded within the web substrate 32 adjacent to a preformed antenna structure, and electrically coupled to the antenna by a subsequent process such as printing conductive ink leads from the chip bumps to the antenna structure.
- a chip 20 is embedded in a substrate 32 having a backing 36 and preformed antenna elements 52 .
- the backing 36 which can provide rigidity to the substrate 32 , is typically not part of a finished device. However, in some instances a device may include the backing 36 .
- the preformed antenna elements 52 are disposed adjacent to the bumps 22 , or contacts, on the chip 20 . It will be appreciated that the chip 20 may be embedded in the web substrate 32 in a position to be coupled with the preformed antenna elements 52 . For example, coupling may be achieved by printing a conductive material to directly connect the antenna elements 52 with the bumps 22 on the chip 20 .
- the bumps 22 of the chip 20 may be embedded in the web substrate 32 in a manner such that the bumps 22 are in direct contact with the antenna elements 52 (e.g., with the chip 20 in a bumps down orientation), thereby coupling the chip 20 to the antenna elements 52 .
- a web substrate 32 having a plurality of embedded chips 20 is shown.
- the chips 20 are embedded in the web substrate 32 in a single row or lane.
- the web substrate 32 with embedded chips 20 is being laminated to a substrate 50 carrying antenna structures 52 .
- the chips 20 and antenna structures 52 may be indexed and coupled with the antenna structures 52 in any suitable manner. Typically, the pitch between the elements on the respective webs will be the same so that only an initial indexing is required.
- an antenna structure may be formed using foil stamping, conductive ink printing, metal plating, metal sputtering or evaporation, or any other form of conductive patterning may be used to form an antenna or other electrical component on the web substrate 32 .
- Electrical coupling of the contact points, or bumps 22 and the antenna structures 50 or other electrical components may be made by direct contact.
- conductive epoxy, isotropic conductive adhesive, anisotropic conductive adhesive, solder, or any other suitable means may be used to achieve the electrical coupling.
- the antenna structures 50 may be electrically coupled with the chips 20 at the time of formation.
- the antenna structures 50 may be formed or otherwise applied to the substrate 32 and coupled with the chips 20 at a subsequent time via conductive ink printing or other suitable process.
- a web substrate 32 having an optional backing 34 enters the system 100 from the left and advances to the right.
- a chip placement device 110 places chips 20 onto the web substrate 32 at predetermined intervals using nozzles 112 .
- the chip 20 is embedded in the web substrate 32 by a thermocompressive device 40 .
- heat is applied to the chip 20 and/or web substrate 32 thereby heating the web substrate 32 .
- the press 42 of the thermocompressive device 40 forces the chip 20 into compressive engagement with the web substrate 32 .
- the chip's top surface 24 is substantially flush with the web substrate 32 .
- the chip 20 includes bumps 22 that protrude slightly above the surface of the web substrate 32 .
- the web substrate 32 and embedded chips 20 next enter the laminating device 55 wherein a web of antenna structures 52 is indexed and laminated thereto.
- the RFID devices 62 on the web 60 may then be singulated from the web substrate 32 .
- FIG. 7B another system 120 for making RFID devices according to the method 5 ( FIG. 1 ) of the present invention is shown.
- the system 120 is similar to the system 100 of FIG. 7A in every respect except that in this embodiment, the chips 20 are embedded in the web substrate 32 as they pass between compression rollers 44 and 46 .
- the web substrate 32 may be heated prior to entering the compression rollers 44 and 46 .
- the compression rollers 44 and 46 may apply heat via conduction to the chip 20 and/or web substrate 32 .
- methods can be used to apply pressure to embed the chips in the substrate.
- the antenna web 52 can be provided in the form of support web 53 to which the inner surfaces of a plurality of, e.g., die- or laser-cut, antennas 50 are adhered by a releasable adhesive, and in which the outer surfaces of the lead- and body-portions of the antennas are respectively coated with uncured conductive and a non-conductive adhesives, such as described in U.S. Pat. No. 6,940,408 issued Sep. 6, 2005.
- the individual antennas are simultaneously peeled away from the support web and laminated to the web substrate 32 by the laminating device 55 , with the leads of the respective antennas in registration with and electrically coupled to the bumps 22 on respective ones of the chips 20 , and with the de-populated antenna support web then being wound onto a take-up spool (not shown).
- a compressive device 230 is configured to compress a chip 220 against a web substrate 222 having a backing 224 .
- An infrared energy source 240 is configured to supply thermal energy to the web substrate 222 and/or the chip 220 .
- the backing 224 may be relatively radiantly transparent compared to the web substrate 222 so that the infrared radiation may pass through the backing 224 and be absorbed by the web substrate 222 , thereby heating the web substrate 222 .
- the infrared radiation also may be directed at a relatively radiantly absorptive backing 224 thereby heating the backing 224 and consequently the web substrate 222 via conduction.
- the web substrate 222 and the backing 224 may be relatively radiantly transparent.
- the chip 220 would be relatively radiantly absorptive such that the infrared radiation from the infrared energy source 240 heats the chip 220 which in turn heats the web substrate 222 .
- the infrared heat source 240 has been activated thereby heating the web substrate 222 and causing the web substrate 222 to soften.
- the infrared thermocompressive device 230 compresses the chip 220 against the web substrate 222 thereby embedding the chip 220 in the web substrate 222 .
- the chip 220 is partially embedded in the web substrate 222 .
- the chip 220 is fully embedded in the web substrate 222 .
- the infrared thermocompressive device 230 is disengaged from the chip 220 , the infrared heat source 240 is deactivated, and the chip 220 , web substrate 222 , and backing 224 are allowed to cool.
- the web substrate 222 cools it becomes less pliable and contracts slightly thereby securing the chip 220 in a partially encased manner within the web substrate 222 .
- the chip 220 is now at least partially encased within the web substrate 222 , secured mechanically within the web substrate 222 by the web substrate 222 itself.
- Radiant energy heat transfer in comparison with conductive and convective heat transfer, is capable of achieving significantly higher heat fluxes. Radiant energy can provide extremely rapid heating because of the high speed of light and the possibility of applying heat directly to the material to be heated. Controlled radiant heating can achieve various process advantages, such as reduction of the cooling requirements of the system, and improved precision via coordination between localized heat and pressure.
- radiant heating may be applied directly to the material to be heated.
- the ability to precisely apply heat directly to areas to be heated is advantageous because less overall heat energy may be required as compared to conductive or convective heating methods. Further, because less overall heat energy is applied, once the embedding process is complete, the materials cool more rapidly allowing subsequent processing of the web substrate to begin more quickly.
- Radiant energy heating may be combined with other modes of heat transfer, for example conductive heating, to achieve advantageous effects.
- electromagnetic radiation heat transfer may be used to heat structures of the system (particularly the chips or backing material), which in turn may transfer heat by conduction to the web substrate.
- the electromagnetic radiation need not be applied directly to the material to be heated, but rather indirectly via thermal conduction from an adjacent structure such as a chip or backing.
- the radiant energy may pass through one or more a relatively radiantly-transparent materials before impinging upon and being absorbed by a relatively radiantly-absorptive material.
- a relatively radiantly-transparent material also referred to a “transparent material” refers to a material that is less absorptive to the radiant energy than the relatively radiantly-absorptive material (also referred to as an “absorptive material”).
- absorptive material also referred to as an “absorptive material”.
- the relative transparency or absorption of a material is a function of the wavelength of the radiation.
- each radiation source may have a unique power spectrum, which determines how much energy is emitted as a function of the wavelength of the radiation. Therefore, the radiant energy source may be chosen or adjusted in order to achieve the desired transmission or absorption effects of the materials.
- a near infrared (NIR) black-body source that emits at 3200 K is compared to the relative absorption spectra of various exemplary materials that may be used in the present invention.
- the graph shown in FIG. 10B is for explanatory purposes and the materials shown are merely exemplary materials that may be used in accordance with the present invention. The materials are in no way intended to limit the materials that may be used to practice the present invention. From the graph it can be seen that, over most of the wavelength spectrum, the exemplary materials that may be used in the system (clear silicone, polysulfone, PMMA (polymethyl methacrylate) absorb NIR radiation at a much lower rate than the polished silicon of which a chip may be comprised.
- the higher rate of absorption of NIR radiation by the polished silicon material allows the chips to be rapidly heated by NIR radiation while the substrate material remains relatively cool.
- many polymers such as PEEK (polyetheretherketone) or PEN (polyethylenenaphthalate), are available for use as the flexible platen material as most polymers are generally NIR transparent.
- Suitable electromagnetic radiation energy may be utilized for heating in this embodiment by using relatively-radiantly-transparent material for the backing and relatively-radiantly-absorptive materials for the web substrate and/or chip.
- a relatively-radiantly-absorptive chip positioned on the thermoplastic web substrate, to near infra-red (NIR) thermal radiation
- NIR near infra-red
- the chip is heated which thereby may heat the web substrate to sufficiently soften the web substrate such that the chip may be embedded therein.
- Other wavelengths of electromagnetic radiation may also be utilized with other materials in this embodiment.
- UV ultraviolet
- microwave energy may be suitable forms of energy for some applications.
- the form of electromagnetic radiation used will be dictated by the absorptive or non-absorptive properties absorption spectra of the component materials of the devices with respect to a particular form of electromagnetic radiation.
- AdPhos AG Bruckmuhl-Heufeld, Germany
- AdPhos infrared heating systems provide durable, high energy heating systems; and an AdPhos lamp nearly acts as a blackbody emitter operating at about 3200 K.
- Other radiant heaters and emitters that provide suitable thermal energy are available from various major lamp manufacturers (including Phillips, Ushio, General Electric, Sylvania, and Glenro). For example, these manufacturers produce emitters for epitaxial reactors used by the semiconductor industry. All of these emitters have temperatures over 3000 K. More broadly, however, suitable NIR sources may be emitters with temperatures over about 2000 K.
- AdPhos system An advantage of the AdPhos system is that whereas most such high energy NIR lamps have a rated life of less than 2000 hours, the AdPhos NIR systems are designed for 4000 to 5000 hours of service life.
- the radiant energy emissions of the AdPhos NIR lamps have most of their energy in a wavelength range of between 0.4 to 2 microns with the peak energy delivered around 800 nm, which is shifted to a lower wavelength than short-wave and medium-wave infrared sources, providing a higher energy output and other advantages in absorption of the electromagnetic radiation.
- a substrate 304 includes an optional antenna substrate layer 308 having thereon an antenna element 312 formed or deposited by any suitable process (e.g., patterning, etching, conductive ink printing etc.).
- the exemplary antenna element 312 shown is a simple dipole structure having first and second pole portions 314 and 316 on opposite sides of a chip attach region 318 .
- the antenna element 312 is discontinuous between the two pole portions 314 and 316 in the chip attach region 318 , bifurcated in conventional fashion to define a pair of fixed antenna leads to which a chip, or alternatively an interposer, can be attached.
- the antenna element 312 includes a tapered-down neck portion 322 in the chip-attach region 318 , as shown, wherein the neck 322 has a width equal to or smaller than the width of a chip to be attached thereto.
- the necked-down conductor configuration is disposed on the interposer 323 , and the antenna lead portions 314 and 316 are terminated in broader, blunt ends that are spaced further apart than in the embodiment of FIG. 11 .
- the substrate 304 further includes a compressible substrate layer 326 to which the antenna substrate 308 is attached.
- the compressible substrate layer 326 can be chosen from a wide variety of materials.
- One such material is an open-celled polymeric foam material.
- the density, thickness, flexibility, etc. of such a foam can be readily process-controlled to thereby achieve suitable foam properties such as flexibility in at least two axes, a high compressibility ratio with the application of reasonable levels of pressure and/or heat, and little or no spring-back, or resiliency, after compression.
- Crushable materials may also be used.
- a crushable material is generally considered to be permanently deformed upon the application of sufficient pressure.
- a crushable material once crushed, generally remains crushed and therefore does not tend to return to its original form (e.g., unlike some compressible materials such as a resilient foam, which will tend to return to its original form upon removal of pressure).
- compressible substrate layer 326 including certain types of pulped paper containing entrapped pockets of air.
- a compressible substrate 326 material comprising a foamed polymer, such as an open-celled foamed polyurethane or polyethylene material.
- the cells of such structures are filled with air, which has a lower dielectric constant than typical solid polymeric substrate materials of equivalent thickness, and this property may be used to advantage in providing RFID devices having self-compensating antennas, for example as discussed in co-pending U.S. patent application Ser. No. 10/700,596, filed Nov. 3, 2005.
- FIGS. 13-16 illustrate two alternative exemplary embodiments of a method of forming an RFID inlay using the exemplary compressible substrates 304 of FIGS. 11 and 12 in which an RFID transponder chip 364 is used as a forming tool whereby it is pressed into the substrate 304 to form a recess 344 and is thereby also embedded in the formed recess 344 at the same time.
- This process eliminates the need for the additional steps of separately forming a recess 344 in the substrate 304 and then precisely aligning the chip 364 with the recess prior to its insertion therein, and results in an RFID device having substantially planar upper and lower surfaces.
- the embedding operation can be performed by a thermocompressive device such as the NIR thermocompressive device described above, or in an appropriate case, by a simple calendaring operation, as illustrated in FIGS. 17 and 18 , respectively, and described further herein.
- a thermocompressive device such as the NIR thermocompressive device described above
- a simple calendaring operation as illustrated in FIGS. 17 and 18 , respectively, and described further herein.
- An advantage of either embodiment is that the chip 364 , or interposer 323 , as respectively illustrated in FIGS. 13-14 and 15 - 16 , can be electrically coupled to the leads of the antenna before, during, as well as after the embedding process.
- the recess 344 can be formed by the chip 364 through the application thereto of pressure, heat, or pressure and heat together such as by thermocompressive device described previously. As such electromagnetic radiation may be applied to the substrate to facilitate formation of the recess 344 .
- each of the antenna leads on either side of the recess 344 now each include two generally 90° bends. Accordingly, it will be appreciated that the material of the antenna element 312 should exhibit sufficient ductility to permit such deformation without cracking or breaking. As will be evident from FIG. 16 , the risk of cracking or breaking of an antenna lead through such deformation is substantially reduced in the interposer embodiment.
- a chip 364 which can be an RFID transponder chip, is shown mounted in the recess 344 and electrically coupled to the antenna leads 348 and 352 in a flip-chip mounting configuration. Electrical coupling of the chip 364 to the antenna leads 348 and 352 can be effected through one or more of several conventional mechanisms.
- the chip 364 can be coupled to the antenna leads 348 and 352 via conventional soldering, or conventional ICP, ACP or NCP adhesive-based coupling can also be used.
- a staking (or crimping) operation can be employed to couple the chip 364 to the antenna leads 348 and 352 wherein an appropriate elongated conductive structure, such as a chip bump (e.g., a stud bump) is formed on or attached to respective chip connection pads and forced into or even through the antenna leads 348 and 352 either before or during chip installation in such a way as to be captivated, or tightly gripped by, the compressed substrate material 304 (e.g., polymeric) located below the respective antenna portions 348 and 352 .
- a chip bump e.g., a stud bump
- a purely mechanical, direct, or ohmic pressure contact can also be used to couple the chip 364 to the antenna leads 348 and 352 , provided that the quality of the electrical contact can be maintained for the life of the RFID device.
- Such mechanical connection can be effected through pressure between the chip 364 and/or connectors and the antenna leads 348 and 352 .
- Such a connection has the advantage of eliminating the need for any of the above coupling processes, but alternatively may necessitate the provision of non-oxidizing (e.g., a plating of a noble metal) contact surfaces on both the chip contacts and the antenna leads.
- the antenna substrate 308 is optional but may be desirable for some applications. By way of example, it may be desirable for manufacturing reasons to fabricate the antenna structure separately from the substrate 304 , and then assemble the substrate 304 by bringing together the antenna layer 308 and the compressible layer 326 to thereby form the substrate 304 in a later step. In addition, the antenna substrate 308 may be desirable in applications where the surface of the compressible substrate material does not provide an ideal surface upon which an antenna element can be directly formed or deposited in a practical manner.
- the substrate 304 can include other layers in addition to the layers shown. Further, in some applications the antenna substrate 308 can be omitted and the antenna element 312 can be provided directly on the surface of the compressible substrate layer 326 .
- certain open-cell foamed materials e.g., thermoformable polyurethane (“TPU”) foam
- TPU thermoformable polyurethane
- exemplary illustrated embodiment includes a dipole antenna arrangement connected to a chip with pads disposed at opposite sides thereof, a wide variety of antenna and/or chip-pad configurations can also be used in accordance with the invention.
- the device 369 includes upper and lowers rollers 370 and 372 between which the substrate 304 and chip 364 pass.
- the upper and lower rollers 370 and 372 compress the chip 364 thereby embedding it into the compressible substrate 304 , as shown.
- heat can be applied to the substrate 304 either directly or indirectly to soften the substrate 304 as desired.
- the chip 364 can be embedded in the substrate 304 in accordance with the previously described methods.
- the chip 364 can be embedded in a thermoplastic substrate 304 using thermocompression, or the chip 364 can be inserted into a chip recess formed by compressing, crushing or punching the web substrate 304 , for example.
- an RFID device is formed by embedding the chip 364 having bond pads 384 (e.g., bumps) in a substrate 304 and coupling the chip to antenna element portions 348 and 352 on an upper surface of a planarizer layer 380 .
- the bond pads 384 are facing away from the substrate 304 (e.g., a bumps up orientation).
- thermocompression can be applied to the assembly (the substrate 304 , chip 364 , and planarizer layer 380 ) to embed the chip 364 and electrically couple the chip 364 to the antenna element portions 348 and 352 .
- the chip 364 when thermocompression is applied, the chip 364 is embedded in the substrate 304 with bond pads 384 on the chip 364 penetrating the planarizer layer 380 to make contact with the antenna element portions 348 and 352 on the upper surface of the planarizer layer 380 .
- the thermocompressive devices described herein can be used to apply thermocompression to assemble the device, as desired.
- the planarizer layer 380 can be a thermoplastic material that softens when heated to facilitate penetration by the bond pads.
- the bond pads can be shaped to enhance penetration of the planarizer layer 380 .
- the bond pads can be elongated and/or have pointed ends (e.g., stud bumps) to assist in penetration of the planarizer layer 380 .
- the planarizer layer 380 generally provides a planar upper surface of the resulting electrical device and can also serve to protect the chip 364 by sealing or otherwise covering the surface of the chip 364 .
- the planarizer layer 380 also electrically insulates the chip 364 from antenna element portions 348 and 352 on the planarizer layer 380 .
- a recess can be formed in the substrate 304 into which the chip 364 can be inserted and subsequently coupled to the antenna element portions 348 and 352 during lamination with the planarizer layer 380 .
- a chip 364 is provided embedded in a web substrate 304 .
- the chip 364 may be embedded in the substrate 304 in any suitable manner, including the methods set forth previously.
- a web 388 is provided having antenna element portions 348 and 352 formed thereon.
- the web 388 is laminated with the substrate 304 such that the chip 364 is connected to the antenna element portions 348 and 352 formed thereon.
- An adhesive 392 is used to secure the web 388 to the substrate 304 .
- the adhesive 392 can serve as a planarizer layer to form a flat profile of the resulting RFID device.
- the planarizer layer can insulate the circuits on the chip 364 and can reduce the registration tolerance required between the chip bumps or contacts 384 and the antenna element portions 348 and 352 .
- FIGS. 23 and 24 yet another embodiment in accordance with the present invention is shown wherein an RFID device is formed by embedding a chip 364 into substrate 304 and coupling the chip to antenna element portions 348 and 352 on a web 388 .
- the web 388 can be any suitable material such as PET.
- the bond pads 384 are facing away from the substrate 304 (e.g., a bumps up orientation).
- a thermoplastic planarizer layer 380 is provided between the chip 364 and the web 388 .
- the planarizer layer 380 can be a urethane film, such as Label Film T-161 available from Worthen Coated Fabrics of Grand Rapids, Mich.
- the film may have any suitable thickness, for example, 1.5 mils nominal thickness.
- the film when heated, acts like a hot melt adhesive to secure the web 388 to the chip 364 and/or the substrate 304 .
- the planarizer layer 380 can be preheated until tacky for receiving and holding a chip during assembly of the device.
- thermocompression in accordance with the methods previously described, can be applied to the assembly comprising the substrate 304 , chip 364 , and planarizer layer 380 to embed the chip 364 and electrically couple the chip 364 to the antenna element portions 348 and 352 .
- the bond pads 384 penetrate the planarizer layer 380 and thereby form an electrical connection with respective antenna element portions 348 and 352 .
- a chip 364 is embedded into a web substrate 304 having antenna element portions 348 and 352 formed thereon.
- the chip 364 can be embedded in the substrate 304 in accordance with the methods previously set forth.
- the chip 364 can be coupled to the antenna element portions 348 and 352 by printing conductive ink or otherwise forming conductive leads 398 to connect the chip 364 and the respective antenna element portions 348 and 352 .
- the methods and devices as described herein allow assembly of devices with less stringent precision in the alignment of the components due to the simultaneous planarization and connection of the chip. Further, because the bond pads 384 connect directly to the electrical elements when the assemblies are compressed, the invention eliminates the need to drill or otherwise form vias for depositing conductive material to connect the chips to electrical elements such as antennas.
- thermosetting or other types of curing such as with UV radiation can be used.
- couple, coupled, or coupling are broadly intended to be construed to include both direct electrical and reactive electrical coupling.
- Reactive coupling is broadly intended to include both capacitive and inductive coupling.
Abstract
An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.
Description
- This application is a division of U.S. application Ser. No. 11/314,988 filed Dec. 21, 2005, which is hereby incorporated by reference in its entirety.
- 1. Field of the Invention
- The present invention relates generally to electrical devices and to the assembly of electrical devices. More particularly, the present invention relates to the assembly of radio frequency identification (RFID) interposers and/or devices.
- 2. Description of the Related Art
- Pick and place techniques are often used to assemble electrical devices. Pick and place techniques typically involve complex robotic components and control systems that handle only one die at a time. Such techniques may utilize a manipulator, such as a robotic arm, to remove integrated circuit (IC) chips, or dies, from a wafer of IC chips and place them on a chip carrier, a transport, or directly to a substrate. If not directly mounted, the chips are subsequently mounted onto a substrate with other electrical components, such as antennas, capacitors, resistors, and inductors to form an electrical device.
- One type of electrical device that may be assembled using pick and place techniques is a radio frequency identification (RFID) transponder. RFID inlays, tags, and labels (collectively referred to herein as “transponders”) are widely used to associate an object with an identification code. Inlays (or inlay transponders) are identification transponders that typically have a substantially flat shape. The antenna for an inlay transponder may be in the form of a conductive trace deposited on a non-conductive support. The antenna has a suitable shape, such as a flat coil or other geometric shape. Leads for the antenna are also deposited, with nonconductive layers interposed as necessary. Memory and any control functions are provided by a chip mounted on the support and operatively connected through the leads to the antenna. An RFID inlay may be joined or laminated to selected label or tag materials made of films, papers, laminations of films and papers, or other flexible sheet materials suitable for a particular end use. The resulting RFID label stock or RFID tag stock may then be overprinted with text and/or graphics, die-cut into specific shapes and sizes into rolls of continuous labels, or sheets of single or multiple labels, or rolls or sheets of tags.
- In many RFID applications, it is desirable to reduce the size of the electrical components as small as possible. In order to interconnect very small chips with antennas in RFID inlays, it is known to use a structure variously called “interposers”, “straps”, and “carriers” to facilitate inlay manufacture. Interposers include conductive leads or pads that are electrically coupled to the contact pads of the chips for coupling to the antennas. These pads generally provide a larger effective electrical contact area than ICs precisely aligned for direct placement without an interposer. The larger area reduces the accuracy required for placement of ICs during manufacture while still providing effective electrical connection. IC placement and mounting are serious limitations for high-speed manufacture. The prior art discloses a variety of RFID interposer or strap structures, typically using a flexible substrate that carries the interposer's contact pads or leads.
- As noted above, RFID transponders include both integrated circuits and antennas for providing radio frequency identification functionality. Interposers, on the other hand, include the integrated circuits but must be coupled to antennas in order to form complete RFID transponders. As used in the present patent application the term “device” refers both to an RFID transponder, and to an interposer that is intended to be incorporated in an RFID transponder.
- RFID devices generally have a combination of antennas and analog and/or digital electronics, which may include for example communications electronics, data memory, and control logic. For example, RFID tags are used in conjunction with security-locks in cars, for access control to buildings, and for tracking inventory and parcels. Some examples of RFID tags and labels appear in U.S. Pat. Nos. 6,107,920, 6,206,292, and 6,262,292, all of which are hereby incorporated by reference in their entireties.
- An RFID device may be affixed to an item whose presence is to be detected and/or monitored. The presence of an RFID device, and therefore the presence of the item to which the device is affixed, may be checked and monitored by devices known as “readers.”
- Typically, RFID devices are produced by patterning, etching or printing a conductor on a dielectric layer and coupling the conductor to a chip. As mentioned, pick and place techniques are often used for positioning a chip on the patterned conductor. Alternatively, a web containing a plurality of chips may be laminated to a web of printed conductor material. An example of such a process is disclosed in commonly assigned U.S. patent application Ser. No. 10/805,938, filed on Mar. 22, 2004.
- The chips may be coupled to the conductor by any of a variety of suitable connecting materials and/or methods, such as, for example, by use of a conductive or non-conductive adhesive, by use of thermoplastic bonding materials, by use of conductive inks, by use of welding and/or soldering, or by electroplating. Typically, the material used for mechanically and/or electrically coupling the chip to the conductor requires heat and/or pressure to form a final interconnect—a process, in the case of adhesives, known as curing. Conventional thermocompressive bonding methods typically use some form of press for directing pressure and heat, via conduction or convection, to an RFID device assembly or web of RFID device assemblies. For example, pressure and heat may be applied by compressing the RFID device assembly or web of RFID device assemblies between a pair of heating plates, and relying on conduction through the various media, including chip and antenna, to heat the connecting material. Alternatively, one of the heating plates may be equipped with pins for selectively applying pressure and/or heat to certain areas (e.g. only the chips), and again relying on conduction to heat the connecting material. Alternatively, and especially in the case of solder, an oven may be used wherein the whole assembly is held at elevated temperature and via convection the solder reflows. In the latter case, pressure may not be applied to the device.
- However, conventional RFID inlay or interposer manufacturing techniques using flip-chip assembly are generally unable to produce devices at a rate fast enough to satisfy demand. Considerable effort is required to accurately align the chips with the antenna structures often limiting the rate at which devices may be produced. Further, conventional flip-chip manufacturing methods produce a device of varying thickness by placing the chip atop a substrate or other surface. Thus, the sides of the chips are generally exposed, making the device more vulnerable to damage. An ideal RFID tag or label would be very thin and also have a substantially uniform thickness. One of the problems with conventional RFID inlay and interposer manufacturing techniques, as well as the RFID devices themselves, is that the chip thickness is greater than the substrate thickness, frequently by a large factor. Placing the chip onto a film or web substrate creates a bump wherever the chip is located. Such a bump presents problems for printing equipment that may subsequently print text or graphics onto the label facestock. In the case of RFID labels or other devices that typically may be printed upon, the uneven surface of the device may interfere with the printing process causing distortion and/or printing errors.
- Therefore, it is desirable to provide a high-speed method of manufacturing electrical devices wherein the finished device has a relatively flat profile.
- From the foregoing it will be seen there is room for improvement of RFID transponders and manufacturing processes relating thereto.
- According to one aspect of the present invention, a method is provided for embedding a chip in a substrate. The method includes heating the chip and pressing the chip into the substrate. In one embodiment, the chip, heated with thermal radiation, is pressed into a thermoplastic substrate. The heated chip heats the substrate in a localized region thereby softening the thermoplastic substrate and allowing the chip to be embedded therein.
- According to one aspect of the present invention, a method of making an electrical device is provided including the steps of: placing a chip on a substrate, heating the substrate, and embedding the chip into the substrate while the substrate is at an elevated temperature.
- According to another aspect of the present invention, a method of making an electrical device is provided including the steps of: heating a chip, embedding the chip in a substrate, and coupling the chip to an electrical component.
- According to still another aspect of the invention, a method of making an RFID transponder is provided comprising the steps of: placing a chip having a bottom surface and a top surface on a thermoplastic substrate with the bottom surface of the chip contacting a top surface of the thermoplastic substrate, heating at least one of the thermoplastic substrate or chip with thermal radiation thereby elevating the temperature of the thermoplastic substrate and consequently softening the thermoplastic substrate, embedding the chip into the thermoplastic substrate by applying pressure to the chip while the substrate is heated to the elevated temperature, and coupling the chip to an antenna structure. The coupling includes depositing the antenna structure with conductive ink onto the thermoplastic substrate and connecting the antenna structure to the interposer leads of the RFID interposer.
- In one embodiment of the invention, an RFID chip is placed on a substrate with the contacts of the chip facing away from the substrate and the chip and/or the substrate is heated while applying pressure thereby embedding the chip into the substrate. Heating or curing may be achieved in a variety of ways including applying electromagnetic radiation, for example infrared, near infrared, or ultraviolet radiation to the chip and/or web. The chip contacts can be simultaneously coupled with an electrical element, for example conductive leads or an antenna structure which can be preformed on a second substrate which can be laminated to the first substrate. For example, the second substrate that includes the electrical element can be placed on the chip contacts such that the electrical element is facing away from the chip contacts. During the process of embedding and laminating, the chip contacts penetrate the second substrate and contact the electrical element. The second substrate may be thermoplastic, compressible, or curable. The electrical element on the second substrate can be formed by printing conductive ink. The application of electromagnetic radiation to the second substrate can further cure such ink and enhance its conductivity.
- According to yet another aspect of the present invention, a method of making an RFID transponder is provided comprising: providing a web material, the web material including a continuous conductive element and a compressible substrate layer, forming a recess in the web material by compressing the compressible substrate layer, wherein forming the recess divides the conductive element thereby forming at least two antenna portions, placing a chip in the recess, and coupling the chip to the antenna portions. Forming the recess includes pressing together of the chip and web material and effects the placing and the coupling of the chip.
- According to still another aspect of the invention, a method of making an RFID transponder is provided comprising: providing a web material, the web material including a compressible substrate layer and an antenna structure having a first antenna portion and a second antenna portion, forming a recess in the web material between the first and second antenna portions by compressing the compressible substrate layer, placing a chip in the recess, and coupling the chip to the antenna portions of the antenna structure. The forming the recess includes pressing together of the chip and web material and the pressing effects the placing and the coupling of the chip.
- In one embodiment, the chip can be used as a forming tool that simultaneously forms a recess in the substrate and embeds the chip in the recess, thereby eliminating the need for the additional steps of separately forming a recess in the substrate and then aligning the chip with the recess prior to its insertion therein.
- According to yet another aspect of the invention, an electrical device is provided comprising a chip and a substrate. The chip is embedded in the substrate and at least partially encased by the substrate. In one embodiment, the device includes an electrical element, such as an antenna structure, on a planarizer layer. Bond pads on the chip extend through the planarizer layer and are electrically coupled to the antenna structure. The substrate can be a thermoplastic material.
- To the accomplishment of the foregoing and related ends, the invention comprises the features hereinafter fully described and particularly pointed out in the claims. The following description and the annexed drawings set forth in detail certain illustrative embodiments of the invention. These embodiments are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Other objects, advantages, and novel features of the invention will become apparent from the following detailed description of the invention when considered in conjunction with the drawings.
- In the annexed drawings, which are not necessarily according to scale,
-
FIG. 1 is a flowchart depicting a method of the present invention; -
FIG. 2 is a side view of an electrical device of the present invention; -
FIG. 3 is an oblique view of an electrical device of the present invention; -
FIG. 4 is a side view of an electrical device in a device for applying thermocompression in accordance with the present invention; -
FIG. 5A is a side view of an electrical device of the present invention; -
FIG. 5B is a side view of an electrical device of the present invention; -
FIG. 6 is an oblique view of a laminating device of the present invention; -
FIG. 7A is a side view of a system of the present invention; -
FIG. 7B is a side view of a system of the present invention; -
FIG. 8 is a side view of an electrical device in a device for applying thermocompression in accordance with the present invention of the present invention; -
FIG. 9 is a side view of an electrical device in a device for applying thermocompression in accordance with the present invention of the present invention; -
FIG. 10A is a side view of an electrical device in a device for applying thermocompression in accordance with the present invention of the present invention; -
FIG. 10B is a graph of the relative NIR radiation absorption rates of various exemplary materials that may be used in the present invention; -
FIG. 11 is a top view of a web substrate that may be used in accordance with a method of the present invention; -
FIG. 12 is a top view of another web substrate that may be used in accordance with a method of the present invention; -
FIG. 13 is a cross-sectional view of the web substrate ofFIG. 11 ; -
FIG. 14 is a cross-sectional view of the web substrate ofFIG. 11 during embedding of a chip therein; -
FIG. 15 is a cross-sectional view of the web substrate ofFIG. 12 ; -
FIG. 16 is a cross-sectional view of the web substrate ofFIG. 12 during embedding of a chip therein; -
FIG. 17 is a side view of a device for embedding a chip in a substrate in accordance with a method of the present invention; -
FIG. 18 is a side view of a device for embedding a chip in a substrate in accordance with a method of the present invention; -
FIG. 19 is a cross-sectional view of the components of an electrical device in accordance with the present invention; -
FIG. 20 is a cross-sectional view of an assembled electrical device formed with the components ofFIG. 19 ; -
FIG. 21 is a cross-sectional view of a substrate having a chip embedded therein and a web having thereon antenna element portions; -
FIG. 22 is a cross-sectional view of an assembled electrical device in accordance with the present invention formed with the substrate and web ofFIG. 21 ; -
FIG. 23 is a cross-sectional view of the components of an electrical device in accordance with the present invention; -
FIG. 24 is a cross-sectional view of an assembled electrical device formed with the components ofFIG. 23 ; -
FIG. 25 is a top view of an electrical device in accordance with the present invention; and -
FIG. 26 is a top view of the electrical device ofFIG. 25 with the chip electrically connected to antenna element portions. - A method of manufacturing electrical devices is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip when heat and/or pressure is applied to the substrate. The substrate may include a compressible layer that can be compressed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured to the web and may be coupled to another electrical component. A method of manufacturing an RFID device is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.
- Referring to
FIG. 1 , amethod 5 of manufacturing electrical devices in web format will be described. It will be appreciated that the electrical devices may be devices other than RFID devices. Similarly, other electrical components besides antenna structures can be used in accordance with the present invention. However, because this method is well suited to the high-speed manufacture of RFID devices, it will be described in the context of an RFID device manufacturing process. - The
method 5 shown inFIG. 1 begins inprocess step number 10, wherein a chip is placed on a web substrate. As will be appreciated, the chip can be part of an interposer structure, as described above. Inprocess step 12, the chip is embedded into the web substrate by applying heat and/or pressure to the chip and/or to the web. Once the chip is suitably embedded in the web substrate, the chip and/or the web are cooled inprocess step 14. It will be appreciated that the step of cooling the chip and/or web can be achieved simply by ceasing to apply heat and/or pressure thereto. Inprocess step 16, the chip is coupled to an antenna structure. As will be described in greater detail herein, the antenna structure may be applied or formed on the web before, during, or after the chip is embedded into the web. - The above process steps are now described in greater detail, with reference to an illustrative embodiment. Turning to
FIGS. 2 and 3 , achip 20 is placed on aweb substrate 32 having abacking 36. Thechip 20 may includebumps 22 for coupling thechip 20 with an antenna or other electrical component. Thechip 20, having a general rectangular cross section, has atop surface 24, a bottom surface 25, and side surfaces 26 a, 26 b, 26 c, 26 d. In this figure, thebumps 22 are on thetop surface 24 of thechip 20 such that when thechip 20 is embedded in theweb substrate 32 thebumps 22 remain accessible for coupling to an electrical component. - In
FIG. 4 , athermocompressive device 40 is positioned above thechip 20 and configured to compress thechip 20 against theweb 32 in the direction of the arrow A. Thebacking 36 may be rigid or semi-rigid to provide adequate support to theweb substrate 32 during compression. Thethermocompressive device 40 includes a press for engaging thechip 20. In this embodiment, thethermocompressive device 40 may be any suitable thermocompressive device capable of applying heat and pressure. An example of a suitable thermocompressive device is disclosed in commonly assigned U.S. patent application Ser. No. 10/872,235 filed on Jul. 18, 2004. Conventional thermocompressive devices used for curing adhesives and/or solders also may be used. The thermal energy for heating thechip 20 and/orweb substrate 32 may be applied via conduction through thepress 42 of thethermocompressive device 40. Thethermocompressive device 40 may be configured to preheat thechip 20 and/orweb substrate 32 to a predetermined temperature thereby ensuring that theweb substrate 32 is adequately softened before applying pressure to thechip 20. Preheating thechip 20 and/orweb substrate 32 may prevent damage to thechip 20 when thechip 20 is compressed against theweb substrate 32. - An example of a conductive heating element that may be used to supply thermal energy is a Curie Point self-regulating heating element. Such a heating element is disclosed in U.S. Pat. No. 5,182,427 and embodied in the SmartHeat# technology currently manufactured by Metcal of Menlo Park, Calif. Such heating elements typically comprise a central copper core having a coating of a magnetized nickel metal alloy. A high frequency current is induced in the heating element and, due to the skin effect, tends to flow in the nickel metal alloy coating. Joule heating in the relatively high electrical resistance nickel metal alloy causes the coating temperature to increase. Once the temperature of the nickel metal alloy coating reaches its characteristic Curie Point, current no longer flows in the nickel metal alloy coating and instead flows through the low resistance central copper core. The Curie Point temperature is essentially maintained at this point. Thus, when the high frequency current is switched on, the heating element heats rapidly to the Curie Point temperature and then self-regulates at that temperature. Curie Point self-regulating heating elements are advantageous because they are small, efficient, and temperature self-regulating, allowing a separate heating element to be assigned to each desired point of thermo-compression. It will be appreciated that other heating elements, such as standard resistive heating elements, may also be used.
- Returning to
FIGS. 4 and 5A , theweb substrate 32 is heated by thethermocompressive device 40 and becomes increasingly pliable such that when thechip 20 is forced against theweb substrate 32 by thethermocompressive device 40, theweb substrate 32 deforms around thechip 20. The deformation of theweb substrate 32 around thechip 20 is illustrated inFIG. 5A . Thechip 20 inFIG. 5A is embedded in theweb substrate 32 with theupper surface 24 of thechip 20 substantially level (e.g., flush) with theweb substrate 32. Thesides chip 20 are essentially encased within theweb substrate 32. Thus, thechip 20 profile is superimposed within the web substrate's profile, thereby creating a uniform profile and, hence, a substantially flat structure. Thebumps 22 on thechip 20 may extend slightly above the upper surface of theweb substrate 32 for enabling thechip 20 to be coupled with an antenna structure or other electrical component. Theupper surface 24 of thechip 20 can be slightly engulfed by theweb substrate 32 thereby reducing the differential height between thebumps 22 and the surface of theweb substrate 32 to facilitate printing leads to thebumps 22. - Typical chip thickness ranges from about 75 microns (3 mils) to 150 microns (6 mils) or greater. Typical web substrates or films used in web processing can range from 40 microns (−1.5 mils) to 200 microns (8 mils) or even greater. Embedding the chip into the substrate reduces the overall thickness of a resulting RFID device and produces a relatively flat RFID device. Ideally, the web substrate will have a thickness that is equal or slightly greater than the chip thickness. Thus, the chip may be embedded in the web substrate such that there is virtually no surface bump thereby producing an interposer or device with a flat profile.
- Once the
chip 20 is embedded in theweb substrate 32 thethermocompressive device 40 is disengaged from thechip 20 and theweb substrate 32 is allowed to cool. As theweb substrate 32 cools it becomes less pliable and contracts slightly thereby securing thechip 20 within theweb substrate 32. It will be appreciated that thechip 20 is now at least partially encased within theweb substrate 32, secured mechanically within the web substrate by theweb substrate 32 itself. - The
web substrate 32 may be a thermoplastic material capable of softening upon application of heat to the material and hardening upon cooling. Thus, theweb substrate 32 may be a plastic film, polymer film, or any other thermoplastic material. Theweb substrate 32 may also be a thermoset material. In some applications, theweb substrate 32 can be curable with ultraviolet light. - It will be appreciated that a plurality of
chips 20 may be embedded in aweb substrate 32 at predetermined intervals in one or more lanes. Alternatively, a plurality ofchips 20 may be embedded in a sheet of substrate material at predetermined locations. Once thechips 20 are embedded in theweb substrate 32, thechips 20 may be coupled with antenna structures or other electrical components. The antenna structures or other electrical components may be transferred to the web orsheet substrate 32 or formed on the web orsheet substrate 32 before, during, or after embedding thechips 20. Preformed antenna structures on or within theweb substrate 32 can be provided such that when achip 20 is embedded in theweb substrate 32 it is electrically coupled (e.g., directly) to the antenna structure and mechanically coupled to theweb substrate 32. Further, achip 20 can be embedded within theweb substrate 32 adjacent to a preformed antenna structure, and electrically coupled to the antenna by a subsequent process such as printing conductive ink leads from the chip bumps to the antenna structure. - For example, in
FIG. 58 achip 20 is embedded in asubstrate 32 having abacking 36 and preformedantenna elements 52. Thebacking 36, which can provide rigidity to thesubstrate 32, is typically not part of a finished device. However, in some instances a device may include thebacking 36. The preformedantenna elements 52 are disposed adjacent to thebumps 22, or contacts, on thechip 20. It will be appreciated that thechip 20 may be embedded in theweb substrate 32 in a position to be coupled with the preformedantenna elements 52. For example, coupling may be achieved by printing a conductive material to directly connect theantenna elements 52 with thebumps 22 on thechip 20. Further, thebumps 22 of thechip 20 may be embedded in theweb substrate 32 in a manner such that thebumps 22 are in direct contact with the antenna elements 52 (e.g., with thechip 20 in a bumps down orientation), thereby coupling thechip 20 to theantenna elements 52. - In
FIG. 6 , aweb substrate 32 having a plurality of embeddedchips 20 is shown. In this figure, thechips 20 are embedded in theweb substrate 32 in a single row or lane. Theweb substrate 32 with embeddedchips 20 is being laminated to asubstrate 50 carryingantenna structures 52. Thechips 20 andantenna structures 52 may be indexed and coupled with theantenna structures 52 in any suitable manner. Typically, the pitch between the elements on the respective webs will be the same so that only an initial indexing is required. Once theweb substrate 32 ofchips 20 and theantenna structure substrate 52 containing theantenna structures 52 are laminated, individual RFID devices may be singulated from thefinished web 60. - It will be appreciated that other methods of forming an antenna structure are possible. For example, foil stamping, conductive ink printing, metal plating, metal sputtering or evaporation, or any other form of conductive patterning may be used to form an antenna or other electrical component on the
web substrate 32. Electrical coupling of the contact points, or bumps 22 and theantenna structures 50 or other electrical components may be made by direct contact. Alternatively, conductive epoxy, isotropic conductive adhesive, anisotropic conductive adhesive, solder, or any other suitable means may be used to achieve the electrical coupling. Theantenna structures 50 may be electrically coupled with thechips 20 at the time of formation. Alternatively, theantenna structures 50 may be formed or otherwise applied to thesubstrate 32 and coupled with thechips 20 at a subsequent time via conductive ink printing or other suitable process. - Turning now to
FIG. 7A , asystem 100 for making RFID devices according to the method 5 (FIG. 1 ) of the present invention will be described. Aweb substrate 32 having anoptional backing 34 enters thesystem 100 from the left and advances to the right. Achip placement device 110 places chips 20 onto theweb substrate 32 at predeterminedintervals using nozzles 112. After achip 20 is placed on theweb substrate 32, thechip 20 is embedded in theweb substrate 32 by athermocompressive device 40. As achip 20 enters thethermocompressive device 40, heat is applied to thechip 20 and/orweb substrate 32 thereby heating theweb substrate 32. Once theweb substrate 32 reaches a predetermined temperature, thepress 42 of thethermocompressive device 40 forces thechip 20 into compressive engagement with theweb substrate 32. After achip 20 progresses through thethermocompressive device 40, the chip'stop surface 24 is substantially flush with theweb substrate 32. In this embodiment, thechip 20 includesbumps 22 that protrude slightly above the surface of theweb substrate 32. Theweb substrate 32 and embeddedchips 20 next enter thelaminating device 55 wherein a web ofantenna structures 52 is indexed and laminated thereto. TheRFID devices 62 on theweb 60 may then be singulated from theweb substrate 32. - In
FIG. 7B , another system 120 for making RFID devices according to the method 5 (FIG. 1 ) of the present invention is shown. The system 120 is similar to thesystem 100 ofFIG. 7A in every respect except that in this embodiment, thechips 20 are embedded in theweb substrate 32 as they pass betweencompression rollers web substrate 32 may be heated prior to entering thecompression rollers compression rollers chip 20 and/orweb substrate 32. As will be appreciated, methods can be used to apply pressure to embed the chips in the substrate. - In a variation of the embodiments described above, and as illustrated by the dashed outlines of
FIGS. 7 A and 7B, theantenna web 52 can be provided in the form ofsupport web 53 to which the inner surfaces of a plurality of, e.g., die- or laser-cut,antennas 50 are adhered by a releasable adhesive, and in which the outer surfaces of the lead- and body-portions of the antennas are respectively coated with uncured conductive and a non-conductive adhesives, such as described in U.S. Pat. No. 6,940,408 issued Sep. 6, 2005. In this alternative variation, the individual antennas are simultaneously peeled away from the support web and laminated to theweb substrate 32 by thelaminating device 55, with the leads of the respective antennas in registration with and electrically coupled to thebumps 22 on respective ones of thechips 20, and with the de-populated antenna support web then being wound onto a take-up spool (not shown). - Turning now to
FIGS. 8-10A , a method of the present invention using an infrared thermocompressive device for embedding a chip in a web substrate will be described. InFIG. 8 , acompressive device 230 is configured to compress achip 220 against aweb substrate 222 having abacking 224. Aninfrared energy source 240 is configured to supply thermal energy to theweb substrate 222 and/or thechip 220. It will be appreciated that thebacking 224 may be relatively radiantly transparent compared to theweb substrate 222 so that the infrared radiation may pass through thebacking 224 and be absorbed by theweb substrate 222, thereby heating theweb substrate 222. However, the infrared radiation also may be directed at a relatively radiantlyabsorptive backing 224 thereby heating thebacking 224 and consequently theweb substrate 222 via conduction. It will also be appreciated that theweb substrate 222 and thebacking 224 may be relatively radiantly transparent. In such case thechip 220 would be relatively radiantly absorptive such that the infrared radiation from theinfrared energy source 240 heats thechip 220 which in turn heats theweb substrate 222. - In
FIG. 9 , theinfrared heat source 240 has been activated thereby heating theweb substrate 222 and causing theweb substrate 222 to soften. Theinfrared thermocompressive device 230 compresses thechip 220 against theweb substrate 222 thereby embedding thechip 220 in theweb substrate 222. In this figure, thechip 220 is partially embedded in theweb substrate 222. - Turning now to
FIG. 10A , thechip 220 is fully embedded in theweb substrate 222. Once thechip 220 is fully embedded in theweb substrate 222, theinfrared thermocompressive device 230 is disengaged from thechip 220, theinfrared heat source 240 is deactivated, and thechip 220,web substrate 222, and backing 224 are allowed to cool. As theweb substrate 222 cools it becomes less pliable and contracts slightly thereby securing thechip 220 in a partially encased manner within theweb substrate 222. It will be appreciated that thechip 220 is now at least partially encased within theweb substrate 222, secured mechanically within theweb substrate 222 by theweb substrate 222 itself. - The use of electromagnetic radiation as the heat source in the methods of the present invention offers various advantages. Radiant energy heat transfer, in comparison with conductive and convective heat transfer, is capable of achieving significantly higher heat fluxes. Radiant energy can provide extremely rapid heating because of the high speed of light and the possibility of applying heat directly to the material to be heated. Controlled radiant heating can achieve various process advantages, such as reduction of the cooling requirements of the system, and improved precision via coordination between localized heat and pressure.
- As stated, radiant heating may be applied directly to the material to be heated. The ability to precisely apply heat directly to areas to be heated is advantageous because less overall heat energy may be required as compared to conductive or convective heating methods. Further, because less overall heat energy is applied, once the embedding process is complete, the materials cool more rapidly allowing subsequent processing of the web substrate to begin more quickly.
- Radiant energy heating may be combined with other modes of heat transfer, for example conductive heating, to achieve advantageous effects. As mentioned above, electromagnetic radiation heat transfer may be used to heat structures of the system (particularly the chips or backing material), which in turn may transfer heat by conduction to the web substrate. Thus, the electromagnetic radiation need not be applied directly to the material to be heated, but rather indirectly via thermal conduction from an adjacent structure such as a chip or backing.
- As mentioned above, the radiant energy may pass through one or more a relatively radiantly-transparent materials before impinging upon and being absorbed by a relatively radiantly-absorptive material. As used herein, a relatively radiantly-transparent material (also referred to a “transparent material”) refers to a material that is less absorptive to the radiant energy than the relatively radiantly-absorptive material (also referred to as an “absorptive material”). It will be appreciated that the relative transparency or absorption of a material is a function of the wavelength of the radiation. Additionally, each radiation source may have a unique power spectrum, which determines how much energy is emitted as a function of the wavelength of the radiation. Therefore, the radiant energy source may be chosen or adjusted in order to achieve the desired transmission or absorption effects of the materials.
- For example, in
FIG. 10B , a near infrared (NIR) black-body source that emits at 3200 K is compared to the relative absorption spectra of various exemplary materials that may be used in the present invention. The graph shown inFIG. 10B is for explanatory purposes and the materials shown are merely exemplary materials that may be used in accordance with the present invention. The materials are in no way intended to limit the materials that may be used to practice the present invention. From the graph it can be seen that, over most of the wavelength spectrum, the exemplary materials that may be used in the system (clear silicone, polysulfone, PMMA (polymethyl methacrylate) absorb NIR radiation at a much lower rate than the polished silicon of which a chip may be comprised. The higher rate of absorption of NIR radiation by the polished silicon material allows the chips to be rapidly heated by NIR radiation while the substrate material remains relatively cool. It will be appreciated that many polymers, such as PEEK (polyetheretherketone) or PEN (polyethylenenaphthalate), are available for use as the flexible platen material as most polymers are generally NIR transparent. Suitable electromagnetic radiation energy may be utilized for heating in this embodiment by using relatively-radiantly-transparent material for the backing and relatively-radiantly-absorptive materials for the web substrate and/or chip. For example, by exposing a relatively-radiantly-absorptive chip, positioned on the thermoplastic web substrate, to near infra-red (NIR) thermal radiation, the chip is heated which thereby may heat the web substrate to sufficiently soften the web substrate such that the chip may be embedded therein. Other wavelengths of electromagnetic radiation may also be utilized with other materials in this embodiment. For example, ultraviolet (UV) or microwave energy may be suitable forms of energy for some applications. In general, the form of electromagnetic radiation used will be dictated by the absorptive or non-absorptive properties absorption spectra of the component materials of the devices with respect to a particular form of electromagnetic radiation. - One line of suitable commercially available high-energy NIR systems is supplied by AdPhos AG, Bruckmuhl-Heufeld, Germany (AdPhos). AdPhos infrared heating systems provide durable, high energy heating systems; and an AdPhos lamp nearly acts as a blackbody emitter operating at about 3200 K. Other radiant heaters and emitters that provide suitable thermal energy are available from various major lamp manufacturers (including Phillips, Ushio, General Electric, Sylvania, and Glenro). For example, these manufacturers produce emitters for epitaxial reactors used by the semiconductor industry. All of these emitters have temperatures over 3000 K. More broadly, however, suitable NIR sources may be emitters with temperatures over about 2000 K. An advantage of the AdPhos system is that whereas most such high energy NIR lamps have a rated life of less than 2000 hours, the AdPhos NIR systems are designed for 4000 to 5000 hours of service life. The radiant energy emissions of the AdPhos NIR lamps have most of their energy in a wavelength range of between 0.4 to 2 microns with the peak energy delivered around 800 nm, which is shifted to a lower wavelength than short-wave and medium-wave infrared sources, providing a higher energy output and other advantages in absorption of the electromagnetic radiation.
- Turning now to
FIGS. 11-18 , another method of manufacturing electrical devices in accordance with the present invention will be described. It will be appreciated that, although shown and described in the context of a single device inFIGS. 11-16 , the method is well suited for use in reel-to-reel operations for processing webs of substrate material to form multiple devices. InFIGS. 11-14 , asubstrate 304 includes an optionalantenna substrate layer 308 having thereon anantenna element 312 formed or deposited by any suitable process (e.g., patterning, etching, conductive ink printing etc.). Theexemplary antenna element 312 shown is a simple dipole structure having first andsecond pole portions region 318. Other antenna structures including a single, continuous antenna can be provided. In the illustrated embodiments, theantenna element 312 is discontinuous between the twopole portions region 318, bifurcated in conventional fashion to define a pair of fixed antenna leads to which a chip, or alternatively an interposer, can be attached. In the embodiment ofFIG. 11 , theantenna element 312 includes a tapered-downneck portion 322 in the chip-attachregion 318, as shown, wherein theneck 322 has a width equal to or smaller than the width of a chip to be attached thereto. In the embodiment ofFIG. 12 , the necked-down conductor configuration is disposed on theinterposer 323, and theantenna lead portions FIG. 11 . - Of importance, the
substrate 304 further includes acompressible substrate layer 326 to which theantenna substrate 308 is attached. Thecompressible substrate layer 326 can be chosen from a wide variety of materials. One such material is an open-celled polymeric foam material. The density, thickness, flexibility, etc. of such a foam can be readily process-controlled to thereby achieve suitable foam properties such as flexibility in at least two axes, a high compressibility ratio with the application of reasonable levels of pressure and/or heat, and little or no spring-back, or resiliency, after compression. Crushable materials may also be used. A crushable material is generally considered to be permanently deformed upon the application of sufficient pressure. A crushable material, once crushed, generally remains crushed and therefore does not tend to return to its original form (e.g., unlike some compressible materials such as a resilient foam, which will tend to return to its original form upon removal of pressure). A wide variety of other materials may be used for thecompressible substrate layer 326 including certain types of pulped paper containing entrapped pockets of air. - As those of skill in the art will appreciate, depending on the particular application at hand, there may be additional performance advantages with the use of a
compressible substrate 326 material comprising a foamed polymer, such as an open-celled foamed polyurethane or polyethylene material. The cells of such structures are filled with air, which has a lower dielectric constant than typical solid polymeric substrate materials of equivalent thickness, and this property may be used to advantage in providing RFID devices having self-compensating antennas, for example as discussed in co-pending U.S. patent application Ser. No. 10/700,596, filed Nov. 3, 2005. -
FIGS. 13-16 illustrate two alternative exemplary embodiments of a method of forming an RFID inlay using the exemplarycompressible substrates 304 ofFIGS. 11 and 12 in which anRFID transponder chip 364 is used as a forming tool whereby it is pressed into thesubstrate 304 to form arecess 344 and is thereby also embedded in the formedrecess 344 at the same time. This process eliminates the need for the additional steps of separately forming arecess 344 in thesubstrate 304 and then precisely aligning thechip 364 with the recess prior to its insertion therein, and results in an RFID device having substantially planar upper and lower surfaces. The embedding operation can be performed by a thermocompressive device such as the NIR thermocompressive device described above, or in an appropriate case, by a simple calendaring operation, as illustrated inFIGS. 17 and 18 , respectively, and described further herein. An advantage of either embodiment is that thechip 364, orinterposer 323, as respectively illustrated inFIGS. 13-14 and 15-16, can be electrically coupled to the leads of the antenna before, during, as well as after the embedding process. - It will be appreciated that, in either embodiment, the
recess 344 can be formed by thechip 364 through the application thereto of pressure, heat, or pressure and heat together such as by thermocompressive device described previously. As such electromagnetic radiation may be applied to the substrate to facilitate formation of therecess 344. - The inlay structures resulting from the compression or crushing operation are illustrated in
FIGS. 14 and 16 , respectively. It may be appreciated that, in the flip-chip embodiment ofFIG. 14 , each of the antenna leads on either side of therecess 344 now each include two generally 90° bends. Accordingly, it will be appreciated that the material of theantenna element 312 should exhibit sufficient ductility to permit such deformation without cracking or breaking. As will be evident from FIG. 16, the risk of cracking or breaking of an antenna lead through such deformation is substantially reduced in the interposer embodiment. - In
FIG. 14 , achip 364, which can be an RFID transponder chip, is shown mounted in therecess 344 and electrically coupled to the antenna leads 348 and 352 in a flip-chip mounting configuration. Electrical coupling of thechip 364 to the antenna leads 348 and 352 can be effected through one or more of several conventional mechanisms. By way of example, thechip 364 can be coupled to the antenna leads 348 and 352 via conventional soldering, or conventional ICP, ACP or NCP adhesive-based coupling can also be used. By way of further example, a staking (or crimping) operation (not illustrated) can be employed to couple thechip 364 to the antenna leads 348 and 352 wherein an appropriate elongated conductive structure, such as a chip bump (e.g., a stud bump) is formed on or attached to respective chip connection pads and forced into or even through the antenna leads 348 and 352 either before or during chip installation in such a way as to be captivated, or tightly gripped by, the compressed substrate material 304 (e.g., polymeric) located below therespective antenna portions chip 364 to the antenna leads 348 and 352, provided that the quality of the electrical contact can be maintained for the life of the RFID device. Such mechanical connection can be effected through pressure between thechip 364 and/or connectors and the antenna leads 348 and 352. Such a connection has the advantage of eliminating the need for any of the above coupling processes, but alternatively may necessitate the provision of non-oxidizing (e.g., a plating of a noble metal) contact surfaces on both the chip contacts and the antenna leads. - It will be appreciated that the
antenna substrate 308 is optional but may be desirable for some applications. By way of example, it may be desirable for manufacturing reasons to fabricate the antenna structure separately from thesubstrate 304, and then assemble thesubstrate 304 by bringing together theantenna layer 308 and thecompressible layer 326 to thereby form thesubstrate 304 in a later step. In addition, theantenna substrate 308 may be desirable in applications where the surface of the compressible substrate material does not provide an ideal surface upon which an antenna element can be directly formed or deposited in a practical manner. - It should be appreciated that the
substrate 304 can include other layers in addition to the layers shown. Further, in some applications theantenna substrate 308 can be omitted and theantenna element 312 can be provided directly on the surface of thecompressible substrate layer 326. By way of example, certain open-cell foamed materials (e.g., thermoformable polyurethane (“TPU”) foam) can be confected in a sheet form having a thin, non-porous “skin” formed on one or both sides thereof, and depending on the compatibility of the material and the particular processes selected for making the antenna, it is possible to form the antenna structure directly on the surface of the compressible substrate itself, thereby eliminating the need for a separate antenna substrate. - While the exemplary illustrated embodiment includes a dipole antenna arrangement connected to a chip with pads disposed at opposite sides thereof, a wide variety of antenna and/or chip-pad configurations can also be used in accordance with the invention.
- Turning to
FIGS. 17 and 18 , an exemplary device for embedding thechips 364 in thesubstrate 304 is shown. Thedevice 369 includes upper and lowersrollers substrate 304 andchip 364 pass. The upper andlower rollers chip 364 thereby embedding it into thecompressible substrate 304, as shown. As will be appreciated, heat can be applied to thesubstrate 304 either directly or indirectly to soften thesubstrate 304 as desired. - Turning to
FIGS. 19-26 , and initially toFIGS. 19 and 20 , additional embodiments in accordance with the invention will be described. In these embodiments, it will be appreciated that thechip 364 can be embedded in thesubstrate 304 in accordance with the previously described methods. As such, thechip 364 can be embedded in athermoplastic substrate 304 using thermocompression, or thechip 364 can be inserted into a chip recess formed by compressing, crushing or punching theweb substrate 304, for example. - In the embodiment depicted in
FIGS. 19 and 20 , an RFID device is formed by embedding thechip 364 having bond pads 384 (e.g., bumps) in asubstrate 304 and coupling the chip toantenna element portions planarizer layer 380. In the illustrated embodiment, thebond pads 384 are facing away from the substrate 304 (e.g., a bumps up orientation). In general, thermocompression can be applied to the assembly (thesubstrate 304,chip 364, and planarizer layer 380) to embed thechip 364 and electrically couple thechip 364 to theantenna element portions - With reference to
FIG. 20 , it will be appreciated that when thermocompression is applied, thechip 364 is embedded in thesubstrate 304 withbond pads 384 on thechip 364 penetrating theplanarizer layer 380 to make contact with theantenna element portions planarizer layer 380. It will be appreciated that the thermocompressive devices described herein can be used to apply thermocompression to assemble the device, as desired. Thus, theplanarizer layer 380 can be a thermoplastic material that softens when heated to facilitate penetration by the bond pads. The bond pads can be shaped to enhance penetration of theplanarizer layer 380. For example, the bond pads can be elongated and/or have pointed ends (e.g., stud bumps) to assist in penetration of theplanarizer layer 380. - The
planarizer layer 380 generally provides a planar upper surface of the resulting electrical device and can also serve to protect thechip 364 by sealing or otherwise covering the surface of thechip 364. Theplanarizer layer 380 also electrically insulates thechip 364 fromantenna element portions planarizer layer 380. - As an alternative to embedding the
chip 364 in thesubstrate 304, a recess can be formed in thesubstrate 304 into which thechip 364 can be inserted and subsequently coupled to theantenna element portions planarizer layer 380. - Turning to
FIGS. 21 and 22 , another embodiment in accordance with the present invention will be described. In this embodiment, achip 364 is provided embedded in aweb substrate 304. Thechip 364 may be embedded in thesubstrate 304 in any suitable manner, including the methods set forth previously. Aweb 388 is provided havingantenna element portions web 388 is laminated with thesubstrate 304 such that thechip 364 is connected to theantenna element portions web 388 to thesubstrate 304. The adhesive 392 can serve as a planarizer layer to form a flat profile of the resulting RFID device. The planarizer layer can insulate the circuits on thechip 364 and can reduce the registration tolerance required between the chip bumps orcontacts 384 and theantenna element portions - In
FIGS. 23 and 24 , yet another embodiment in accordance with the present invention is shown wherein an RFID device is formed by embedding achip 364 intosubstrate 304 and coupling the chip toantenna element portions web 388. Theweb 388 can be any suitable material such as PET. In the illustrated embodiment, thebond pads 384 are facing away from the substrate 304 (e.g., a bumps up orientation). Athermoplastic planarizer layer 380 is provided between thechip 364 and theweb 388. Theplanarizer layer 380 can be a urethane film, such as Label Film T-161 available from Worthen Coated Fabrics of Grand Rapids, Mich. The film may have any suitable thickness, for example, 1.5 mils nominal thickness. The film, when heated, acts like a hot melt adhesive to secure theweb 388 to thechip 364 and/or thesubstrate 304. In some instances, theplanarizer layer 380 can be preheated until tacky for receiving and holding a chip during assembly of the device. In general, thermocompression, in accordance with the methods previously described, can be applied to the assembly comprising thesubstrate 304,chip 364, andplanarizer layer 380 to embed thechip 364 and electrically couple thechip 364 to theantenna element portions bond pads 384 penetrate theplanarizer layer 380 and thereby form an electrical connection with respectiveantenna element portions - Turning to
FIGS. 25 and 26 , yet another embodiment in accordance with the presence invention will be described. In this embodiment, achip 364 is embedded into aweb substrate 304 havingantenna element portions chip 364 can be embedded in thesubstrate 304 in accordance with the methods previously set forth. Once embedded in thesubstrate 304, thechip 364 can be coupled to theantenna element portions conductive leads 398 to connect thechip 364 and the respectiveantenna element portions - The methods and devices as described herein allow assembly of devices with less stringent precision in the alignment of the components due to the simultaneous planarization and connection of the chip. Further, because the
bond pads 384 connect directly to the electrical elements when the assemblies are compressed, the invention eliminates the need to drill or otherwise form vias for depositing conductive material to connect the chips to electrical elements such as antennas. - It will further be appreciated that other methods of localized heating of the substrate can be used in accordance with the present invention. For example, ultrasonic heating can be used without departing from the scope of the invention. In addition, thermosetting or other types of curing such as with UV radiation can be used.
- Certain modifications and improvements will occur to those skilled in the art upon a reading of the foregoing description. It should be understood that the present invention is not limited to any particular type of electrical device. For the purposes of this application, couple, coupled, or coupling are broadly intended to be construed to include both direct electrical and reactive electrical coupling. Reactive coupling is broadly intended to include both capacitive and inductive coupling. One of ordinary skill in the art will recognize that there are different manners in which these elements can accomplish the present invention. The present invention is intended to cover what is claimed and any equivalents. The specific embodiments used herein are to aid in the understanding of the present invention, and should not be used to limit the scope of the invention in a manner narrower than the claims and their equivalents.
- Although the invention has been shown and described with respect to a certain embodiment or embodiments, it is obvious that equivalent alterations and modifications will occur to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. In particular regard to the various functions performed by the above described elements (components, assemblies, devices, compositions, etc.), the terms (including a reference to a “means”) used to describe such elements are intended to correspond, unless otherwise indicated, to any element which performs the specified function of the described element (i.e., that is functionally equivalent), even though not structurally equivalent to the disclosed structure which performs the function in the herein illustrated exemplary embodiment or embodiments of the invention. In addition, while a particular feature of the invention may have been described above with respect to only one or more of several illustrated embodiments, such feature may be combined with one or more other features of the other embodiments, as may be desired and advantageous for any given or particular application.
Claims (31)
1. A method of making an electrical device comprising:
heating a chip;
embedding the chip in a substrate; and
coupling the chip to an electrical component.
2. A method as set forth in claim 1 , wherein the embedding the chip in the substrate includes heating, with the chip, a region of the substrate in which the chip is to be embedded.
3. A method as set forth in claim 2 , wherein the heating includes conductive heating.
4. A method as set forth in claim 1 , further comprising laminating a planarizer layer to at least one of the chip or substrate, the planarizer layer including the electrical component.
5. A method as set forth in claim 4 , wherein the laminating includes pressing together of the planarizer layer and at least one of the chip or the substrate; and wherein the pressing effects the embedding and the coupling.
6. A method as set forth in claim 1 , wherein the chip is part of an RFID interposer that includes interposer leads attached to an RFID chip.
7. A method as set forth in claim 1 , wherein the substrate is a thermoplastic material.
8. A method as set forth in claim 1 , wherein the heating the chip includes applying electromagnetic radiation to the chip.
9. A method as set forth in claim 8 , wherein the applying electromagnetic radiation includes applying thermal radiation.
10. A method as set forth in claim 9 , wherein the applying electromagnetic radiation includes applying near infrared radiation
11. A method as set forth in claim 1 , wherein the embedding includes pressing the chip into the substrate with rollers.
12. A method as set forth in claim 1 , wherein the embedding includes pressing the chip into the substrate with a press.
13. A method as set forth in claim 1 , wherein the coupling the chip to an electrical component includes coupling the chip to an antenna structure.
14. A method as set forth in claim 1 , wherein the coupling includes laminating a web that includes the electrical component to the substrate.
15. A method as set forth in claim 1 , further comprising providing a planarizer layer between the chip and the web, wherein the planarizer layer is an adhesive.
16. A method as set forth in claim 1 , wherein the coupling includes printing a conductive material onto the substrate.
17. A method as set forth in claim 1 , wherein the coupling includes coupling the chip to an antenna structure preformed on the substrate.
18. The device formed by the method of claim 1 .
19. A method of making an RFID transponder comprising:
placing a chip having a bottom surface and a top surface on a thermoplastic substrate with the bottom surface of the chip contacting a top surface of the thermoplastic substrate;
heating at least one of the thermoplastic substrate or chip with thermal radiation thereby elevating the temperature of the thermoplastic substrate and consequently softening the thermoplastic substrate;
embedding the chip into the thermoplastic substrate by applying pressure to the chip while the substrate is heated to the elevated temperature; and
coupling the chip to an antenna structure, wherein the coupling includes:
depositing the antenna structure with conductive ink onto the thermoplastic substrate; and
connecting the antenna structure to the interposer leads of the RFID interposer.
20. The device formed by the method of claim 19 .
21. A method of making an RFID transponder comprising:
providing a web material, the web material including a continuous conductive element and a compressible substrate layer;
forming a recess in the web material by compressing the compressible substrate layer, wherein forming the recess divides the conductive element thereby forming at least two antenna portions;
placing a chip in the recess; and
coupling the chip to the antenna portions,
wherein the forming the recess includes pressing together of the chip and web material, and
wherein the pressing effects the placing and the coupling.
22. A method as set forth in claim 21 , wherein the compressible substrate layer is a foam material.
23. A method as set forth in claim 21 , wherein the compressible substrate layer is crushable.
24. A method of making an RFID transponder comprising:
providing a web material, the web material including a compressible substrate layer and an antenna structure having a first antenna portion and a second antenna portion;
forming a recess in the web material between the first and second antenna portions by compressing the compressible substrate layer;
placing a chip in the recess; and
coupling the chip antenna portions of the antenna structure;
wherein the forming the recess includes pressing together of the chip and web material, and
wherein the pressing effects the placing and the coupling.
25. A method as set forth in claim 24 , wherein the compressible substrate layer is a foam material.
26. A method as set forth in claim 24 , wherein the compressible substrate layer is crushable.
27. An electrical device comprising;
a chip; and
a substrate;
wherein the chip is embedded in the substrate; and
wherein the chip is at least partially encased by the substrate.
28. A device as set forth in claim 27 , further comprising an electrical component coupled to bond pads on the chip.
29. A device as set forth in claim 28 , wherein the electrical component is an antenna structure provided on a planarizer layer, and wherein the bond pads extend through the planarizer layer and are coupled to the antenna structure.
30. A device as set forth in claim 28 , wherein the bond pads are stud bumps.
31. A device as set forth in claim 27 , wherein the substrate is a thermoplastic substrate.
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140033515A1 (en) * | 2010-09-17 | 2014-02-06 | Apple Inc. | Systems and methods for integrating radio-frequency identification circuitry into flexible circuits |
US20140265830A1 (en) * | 2013-03-15 | 2014-09-18 | Consiglio Nazionale Delle Ricerche | Uv lamp and a cavity-less uv lamp system |
US10049319B2 (en) | 2014-12-16 | 2018-08-14 | Avery Dennison Retail Information Services, Llc | Method of assembly using moving substrates, including creating RFID inlays |
DE102017129625B3 (en) | 2017-12-12 | 2019-05-23 | Mühlbauer Gmbh & Co. Kg | Method and device for equipping an antenna structure with an electronic component |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7785932B2 (en) * | 2005-02-01 | 2010-08-31 | Nagraid S.A. | Placement method of an electronic module on a substrate and device produced by said method |
US8119458B2 (en) * | 2005-02-01 | 2012-02-21 | Nagraid S.A. | Placement method of an electronic module on a substrate |
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US20080179404A1 (en) * | 2006-09-26 | 2008-07-31 | Advanced Microelectronic And Automation Technology Ltd. | Methods and apparatuses to produce inlays with transponders |
JP4950676B2 (en) * | 2007-01-18 | 2012-06-13 | リンテック株式会社 | Circuit board manufacturing method |
JP4952280B2 (en) * | 2007-02-09 | 2012-06-13 | 富士通株式会社 | Electronic device manufacturing system and electronic device manufacturing method |
US20090091424A1 (en) | 2007-10-05 | 2009-04-09 | Manfred Rietzler | Transponder inlay for a personal document and method of manufacturing same |
DE102007050102A1 (en) * | 2007-10-16 | 2009-04-23 | Smartrac Ip B.V. | Method for producing a transmission module and transmission module |
JP5141187B2 (en) * | 2007-10-26 | 2013-02-13 | 富士通株式会社 | RFID tag manufacturing method |
CN102047402B (en) | 2008-06-02 | 2017-11-03 | Nxp股份有限公司 | A kind of electronic device manufacturing method |
WO2009147547A1 (en) | 2008-06-02 | 2009-12-10 | Nxp B.V. | Electronic device and method of manufacturing an electronic device |
JP2010237877A (en) * | 2009-03-30 | 2010-10-21 | Fujitsu Ltd | Rfid tag, and method for manufacturing the same |
US8089362B2 (en) * | 2009-04-08 | 2012-01-03 | Avery Dennison Corporation | Merchandise security kit |
WO2010132117A1 (en) * | 2009-05-13 | 2010-11-18 | American Bank Note Company | Cover and method of manufacturing the same |
DE102009043587A1 (en) * | 2009-09-30 | 2011-05-19 | Smartrac Ip B.V. | Functional laminate |
FR2951866B1 (en) | 2009-10-27 | 2011-11-25 | Arjowiggins Security | METHOD FOR MANUFACTURING A CARRIER INTEGRATING AN ELECTRONIC DEVICE |
FR2951867A1 (en) * | 2009-10-27 | 2011-04-29 | Arjowiggins Security | METHOD FOR MANUFACTURING A MEDIUM COMPRISING AN ELECTRONIC DEVICE |
US8936197B2 (en) * | 2009-11-17 | 2015-01-20 | Avery Dennison Corporation | Integral tracking tag for consumer goods |
US8701271B2 (en) * | 2010-04-14 | 2014-04-22 | Avery Dennison Corporation | Method of assembly of articles |
CA2813538C (en) * | 2010-10-14 | 2019-05-07 | Juha Maijala | Method and arrangement for attaching a chip to a printed conductive surface |
US8628018B2 (en) * | 2012-04-17 | 2014-01-14 | Nxp, B.V. | RFID circuit and method |
WO2014008937A1 (en) * | 2012-07-12 | 2014-01-16 | Assa Abloy Ab | Method of manufacturing a functional inlay |
US8866292B2 (en) * | 2012-10-19 | 2014-10-21 | Infineon Technologies Ag | Semiconductor packages with integrated antenna and methods of forming thereof |
US9721920B2 (en) | 2012-10-19 | 2017-08-01 | Infineon Technologies Ag | Embedded chip packages and methods for manufacturing an embedded chip package |
US9899339B2 (en) * | 2012-11-05 | 2018-02-20 | Texas Instruments Incorporated | Discrete device mounted on substrate |
US11133866B2 (en) | 2014-02-25 | 2021-09-28 | Pharmaseq, Inc. | All optical identification and sensor system with power on discovery |
FR3020591B1 (en) * | 2014-04-30 | 2016-05-20 | Etancheite Et Frottement J Massot | DEVICE COMPRISING AN ELASTOMER PART, AND ASSOCIATED MANUFACTURING METHOD. |
EP3259708A1 (en) * | 2015-02-20 | 2017-12-27 | Nid Sa | Method for producing a device comprising at least one electronic element associated with a substrate and an antenna |
US9418895B1 (en) | 2015-03-14 | 2016-08-16 | International Business Machines Corporation | Dies for RFID devices and sensor applications |
JP6574367B2 (en) * | 2015-09-29 | 2019-09-11 | 小林クリエイト株式会社 | RFID label affixing structure on form slip and RFID label affixing method |
US10882258B1 (en) | 2016-01-22 | 2021-01-05 | Pharmaseq, Inc. | Microchip affixing probe and method of use |
ES2584656B1 (en) * | 2016-05-13 | 2017-02-17 | Grifols, S.A. | RFID LABEL FOR DISPOSITION IN A BOTTLE FOR PRODUCTS DERIVED FROM BLOOD AND USE OF THE SAME |
US20180034162A1 (en) * | 2016-08-01 | 2018-02-01 | Honeywell International Inc. | Flexible printed antenna devices, methods, and systems |
US10320054B2 (en) * | 2016-10-28 | 2019-06-11 | Avery Dennison Retail Information Services, Llc | RFID tags designed to work on difficult substrates |
WO2019068077A1 (en) | 2017-09-29 | 2019-04-04 | Avery Dennison Retail Information Services, Llc | Systems and methods for transferring a flexible conductor onto a moving web |
SE542007C2 (en) | 2017-10-13 | 2020-02-11 | Stora Enso Oyj | A method and an apparatus for producing a radio-frequency identification transponder |
KR20220051304A (en) * | 2019-08-29 | 2022-04-26 | 에이지씨 가부시키가이샤 | Composition, method for manufacturing antenna and molded article |
US11443160B2 (en) | 2019-09-18 | 2022-09-13 | Sensormatic Electronics, LLC | Systems and methods for laser tuning and attaching RFID tags to products |
US10970613B1 (en) | 2019-09-18 | 2021-04-06 | Sensormatic Electronics, LLC | Systems and methods for providing tags adapted to be incorporated with or in items |
DE102019128088A1 (en) * | 2019-10-17 | 2021-04-22 | Rastal Gmbh & Co. Kg | Method for connecting a piece of crockery to an information carrier and device with a crockery item and an information carrier |
US11055588B2 (en) | 2019-11-27 | 2021-07-06 | Sensormatic Electronics, LLC | Flexible water-resistant sensor tag |
JP2023522540A (en) | 2020-02-14 | 2023-05-31 | ピー-チップ・アイピー・ホールディングス・インコーポレイテッド | optical trigger transponder |
CN111276790A (en) * | 2020-03-31 | 2020-06-12 | 西安理工大学 | Method for improving antenna performance of silk-screen printing RFID reader-writer |
FR3118514B1 (en) * | 2020-12-31 | 2023-03-03 | Axem Tech | Method of manufacturing an RFID identifier |
US11755874B2 (en) | 2021-03-03 | 2023-09-12 | Sensormatic Electronics, LLC | Methods and systems for heat applied sensor tag |
US11869324B2 (en) | 2021-12-23 | 2024-01-09 | Sensormatic Electronics, LLC | Securing a security tag into an article |
Citations (93)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3497171A (en) * | 1968-03-08 | 1970-02-24 | Utility Products Mfg Co | Means for supporting electrical devices |
US3724737A (en) * | 1971-10-06 | 1973-04-03 | E Bodnar | Spreader for slit web material |
US3989575A (en) * | 1975-04-16 | 1976-11-02 | Oliver Machinery Company | Split labeling apparatus |
US4215359A (en) * | 1977-12-13 | 1980-07-29 | U.S. Philips Corporation | Semiconductor device |
US4284466A (en) * | 1979-12-17 | 1981-08-18 | Western Electric Co., Inc. | Bonding head |
US4670084A (en) * | 1983-06-20 | 1987-06-02 | David Durand | Apparatus for applying a dye image to a member |
US4706050A (en) * | 1984-09-22 | 1987-11-10 | Smiths Industries Public Limited Company | Microstrip devices |
US4715923A (en) * | 1985-12-26 | 1987-12-29 | The Boeing Company | Apparatus for consolidating composite materials |
US4786907A (en) * | 1986-07-14 | 1988-11-22 | Amtech Corporation | Transponder useful in a system for identifying objects |
US4816839A (en) * | 1987-12-18 | 1989-03-28 | Amtech Corporation | Transponder antenna |
US5006856A (en) * | 1989-08-23 | 1991-04-09 | Monarch Marking Systems, Inc. | Electronic article surveillance tag and method of deactivating tags |
US5019417A (en) * | 1989-08-15 | 1991-05-28 | Northcutt Gerald G | Pipe lining system |
US5049980A (en) * | 1987-04-15 | 1991-09-17 | Kabushiki Kaisha Toshiba | Electronic circuit device and method of manufacturing same |
US5153983A (en) * | 1990-02-15 | 1992-10-13 | Matsushita Electric Industrial Co., Ltd. | Rotary head type electrical component placing apparatus |
US5182427A (en) * | 1990-09-20 | 1993-01-26 | Metcal, Inc. | Self-regulating heater utilizing ferrite-type body |
US5315486A (en) * | 1991-12-16 | 1994-05-24 | General Electric Company | Hermetically packaged HDI electronic system |
US5430441A (en) * | 1993-10-12 | 1995-07-04 | Motorola, Inc. | Transponding tag and method |
US5491483A (en) * | 1994-01-05 | 1996-02-13 | Texas Instruments Incorporated | Single loop transponder system and method |
US5528222A (en) * | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
US5557279A (en) * | 1993-09-28 | 1996-09-17 | Texas Instruments Incorporated | Unitarily-tuned transponder/shield assembly |
US5564888A (en) * | 1993-09-27 | 1996-10-15 | Doan; Carl V. | Pick and place machine |
US5585193A (en) * | 1993-07-16 | 1996-12-17 | Avery Dennison Corporation | Machine-direction oriented label films and die-cut labels prepared therefrom |
US5597640A (en) * | 1992-10-09 | 1997-01-28 | Signode Corporation | Oriented plastic strap |
US5606136A (en) * | 1995-04-10 | 1997-02-25 | Breed Automotive Technology, Inc. | Electrical lead crossover, sensing cell with electrical lead crossover, and method for making same |
US5660787A (en) * | 1992-10-09 | 1997-08-26 | Illinois Tool Works Inc. | Method for producing oriented plastic strap |
US5707660A (en) * | 1992-10-09 | 1998-01-13 | Signode Corporation | Apparatus for producing oriented plastic strap |
US5760530A (en) * | 1992-12-22 | 1998-06-02 | The United States Of America As Represented By The Secretary Of The Air Force | Piezoelectric tactile sensor |
US5793305A (en) * | 1991-04-03 | 1998-08-11 | Turner; Leigh Holbrook | Article sorting system |
US5800763A (en) * | 1994-10-06 | 1998-09-01 | Giesecke & Devrient Gmbh | Method for producing data carriers with embedded elements |
US5841193A (en) * | 1996-05-20 | 1998-11-24 | Epic Technologies, Inc. | Single chip modules, repairable multichip modules, and methods of fabrication thereof |
US5866952A (en) * | 1995-11-30 | 1999-02-02 | Lockheed Martin Corporation | High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate |
US5965494A (en) * | 1995-05-25 | 1999-10-12 | Kabushiki Kaisha Toshiba | Tunable resonance device controlled by separate permittivity adjusting electrodes |
US6018299A (en) * | 1998-06-09 | 2000-01-25 | Motorola, Inc. | Radio frequency identification tag having a printed antenna and method |
US6019865A (en) * | 1998-01-21 | 2000-02-01 | Moore U.S.A. Inc. | Method of forming labels containing transponders |
US6091332A (en) * | 1998-06-09 | 2000-07-18 | Motorola, Inc. | Radio frequency identification tag having printed circuit interconnections |
US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
US6133836A (en) * | 1998-02-27 | 2000-10-17 | Micron Technology, Inc. | Wireless communication and identification packages, communication systems, methods of communicating, and methods of forming a communication device |
US6140146A (en) * | 1999-08-03 | 2000-10-31 | Intermec Ip Corp. | Automated RFID transponder manufacturing on flexible tape substrates |
US6140967A (en) * | 1998-08-27 | 2000-10-31 | Lucent Technologies Inc. | Electronically variable power control in microstrip line fed antenna systems |
US6147606A (en) * | 1998-03-26 | 2000-11-14 | Intermec Ip Corp. | Apparatus and method for radio frequency transponder with improved read distance |
US6145901A (en) * | 1996-03-11 | 2000-11-14 | Rich; Donald S. | Pick and place head construction |
US6166613A (en) * | 1996-07-18 | 2000-12-26 | Matsushita Electric Industrial Co., Ltd. | Voltage-controlled resonator, method of fabricating the same, method of tuning the same, and mobile communication apparatus |
US6164551A (en) * | 1997-10-29 | 2000-12-26 | Meto International Gmbh | Radio frequency identification transponder having non-encapsulated IC chip |
US20010053675A1 (en) * | 2000-03-16 | 2001-12-20 | Andreas Plettner | Transponder |
US20010054755A1 (en) * | 2000-04-13 | 2001-12-27 | Richard Kirkham | Integrated package and RFID antenna |
US20020062898A1 (en) * | 1999-04-21 | 2002-05-30 | Austin Pixie A. | RF tag application system |
US20020088777A1 (en) * | 2001-01-11 | 2002-07-11 | David Grewell | Transparent pressure bladder |
US20020125566A1 (en) * | 2001-03-05 | 2002-09-12 | Yoshiyuki Tonami | High frequency circuit chip and method of producing the same |
US20020175873A1 (en) * | 2000-07-18 | 2002-11-28 | King Patrick F. | Grounded antenna for a wireless communication device and method |
US20020181208A1 (en) * | 2001-05-31 | 2002-12-05 | Credelle Thomas Lloyd | Multi-feature-size electronic structures |
US6504511B2 (en) * | 2000-04-18 | 2003-01-07 | Telefonaktiebolaget Lm Ericsson (Publ) | Multi-band antenna for use in a portable telecommunications apparatus |
US6535175B2 (en) * | 2000-06-01 | 2003-03-18 | Intermec Ip Corp. | Adjustable length antenna system for RF transponders |
US6542114B1 (en) * | 2000-09-07 | 2003-04-01 | Savi Technology, Inc. | Method and apparatus for tracking items using dual frequency tags |
US20030071118A1 (en) * | 2001-10-03 | 2003-04-17 | Gershman Anatole V. | Mobile object tracker |
US6555414B1 (en) * | 2000-02-09 | 2003-04-29 | Interuniversitair Microelektronica Centrum, Vzw | Flip-chip assembly of semiconductor devices using adhesives |
US6563463B1 (en) * | 1999-05-24 | 2003-05-13 | Hitachi, Ltd. | Wireless tag, its manufacturing and its layout |
US20030089444A1 (en) * | 2000-04-07 | 2003-05-15 | Roland Melzer | Method and apparatus for producing data carriers equipped with an integrated transponder |
US6577208B2 (en) * | 2001-02-26 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Radio frequency filter |
US20030136503A1 (en) * | 2002-01-18 | 2003-07-24 | Avery Dennison Corporation | RFID label technique |
US20030210188A1 (en) * | 2002-05-09 | 2003-11-13 | Ted Hebron | Multi-band antenna system including a retractable antenna and a meander antenna |
US6665193B1 (en) * | 2002-07-09 | 2003-12-16 | Amerasia International Technology, Inc. | Electronic circuit construction, as for a wireless RF tag |
US6667092B1 (en) * | 2002-09-26 | 2003-12-23 | International Paper Company | RFID enabled corrugated structures |
US20040001029A1 (en) * | 2002-06-27 | 2004-01-01 | Francis Parsche | Efficient loop antenna of reduced diameter |
US20040020036A1 (en) * | 2002-08-02 | 2004-02-05 | Matrics, Inc. | Method and apparatus for high volume assembly of radio frequency identification tags |
US20040026033A1 (en) * | 2000-04-04 | 2004-02-12 | Price David M. | High speed flip chip assembly process |
US20040032377A1 (en) * | 2001-10-29 | 2004-02-19 | Forster Ian James | Wave antenna wireless communication device and method |
US20040041262A1 (en) * | 2002-08-28 | 2004-03-04 | Renesas Technology Corp. | Inlet for an electronic tag |
US6701605B2 (en) * | 2001-10-09 | 2004-03-09 | Sonoco Development, Inc. | Conductive electrical element and antenna with ink additive technology |
US6706230B2 (en) * | 2000-09-05 | 2004-03-16 | Honda Giken Kogyo Kabushiki Kaisha | Auxiliary jig |
US20040052203A1 (en) * | 2002-09-13 | 2004-03-18 | Brollier Brian W. | Light enabled RFID in information disks |
US20040075607A1 (en) * | 2000-04-26 | 2004-04-22 | Cathey David A. | Automated antenna trim for transmitting and receiving semiconductor devices |
US20040108600A1 (en) * | 2001-12-28 | 2004-06-10 | Jimmy Liang | Method and apparatus for flip chip device assembly by radiant heating |
US20040125040A1 (en) * | 2002-12-31 | 2004-07-01 | Ferguson Scott Wayne | RFID device and method of forming |
US6784530B2 (en) * | 2002-01-23 | 2004-08-31 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module with embedded semiconductor chip and method of manufacturing |
US20040178267A1 (en) * | 2003-03-11 | 2004-09-16 | Zebra Technologies Corporation | System and Method for Selective Communication with RFID Transponders |
US20040178912A1 (en) * | 1999-09-02 | 2004-09-16 | Smith Freddie W. | Remote communication devices, radio frequency identification devices, wireless communication systems, wireless communication methods, radio frequency identification device communication methods, and methods of forming a remote communication device |
US6825553B2 (en) * | 2002-08-27 | 2004-11-30 | Micron Technology, Inc. | Multichip wafer level packages and computing systems incorporating same |
US6833610B2 (en) * | 2002-10-07 | 2004-12-21 | Advanced Semiconductor Engineering, Inc. | Bridge connection type of chip package and fabricating method thereof |
US20040256560A1 (en) * | 2003-03-07 | 2004-12-23 | Russell James T. | Optical system for a gas measurement system |
US6855892B2 (en) * | 2001-09-27 | 2005-02-15 | Matsushita Electric Industrial Co., Ltd. | Insulation sheet, multi-layer wiring substrate and production processes thereof |
US6856285B2 (en) * | 2002-03-04 | 2005-02-15 | Siemens Information & Communication Mobile, Llc | Multi-band PIF antenna with meander structure |
US6888502B2 (en) * | 2002-03-05 | 2005-05-03 | Precision Dynamics Corporation | Microstrip antenna for an identification appliance |
US6891110B1 (en) * | 1999-03-24 | 2005-05-10 | Motorola, Inc. | Circuit chip connector and method of connecting a circuit chip |
US6913057B2 (en) * | 2001-10-19 | 2005-07-05 | Nissei Plastic Industrial Co., Ltd. | IC-card manufacturing apparatus |
US6919508B2 (en) * | 2002-11-08 | 2005-07-19 | Flipchip International, Llc | Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing |
US6925701B2 (en) * | 2003-03-13 | 2005-08-09 | Checkpoint Systems, Inc. | Method of making a series of resonant frequency tags |
US6931725B2 (en) * | 1999-12-20 | 2005-08-23 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module, radio device having the same, and method for producing the same |
US6975016B2 (en) * | 2002-02-06 | 2005-12-13 | Intel Corporation | Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof |
US20050282355A1 (en) * | 2004-06-18 | 2005-12-22 | Edwards David N | High density bonding of electrical devices |
US7080446B2 (en) * | 2001-10-26 | 2006-07-25 | Matsushita Electric Works, Ltd. | Wiring board sheet and its manufacturing method, multilayer board and its manufacturing method |
US7158037B2 (en) * | 2004-03-22 | 2007-01-02 | Avery Dennison Corporation | Low cost method of producing radio frequency identification tags with straps without antenna patterning |
US7191507B2 (en) * | 2002-04-24 | 2007-03-20 | Mineral Lassen Llc | Method of producing a wireless communication device |
Family Cites Families (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2919998A1 (en) | 1979-05-17 | 1980-11-27 | Siemens Ag | ATTACHING THE CONNECTING WIRES OF SEMICONDUCTOR SYSTEMS TO THE CARRIER ELEMENTS |
CA2128947A1 (en) | 1994-07-27 | 1996-01-28 | Jean-Noel Audoux | Process for inserting a microcircuit into the body of an intelligent card and/or memory card, and card comprising a microcircuit thus inserted |
FR2724263B1 (en) | 1994-09-05 | 1996-11-08 | Valeo Electronique | ANTENNA USED FOR TRANSMITTING OR RECEIVING A RADIO FREQUENCY SIGNAL, A REMOTE TRANSMITTER AND RECEIVER AND A REMOTE CONTROL SYSTEM FOR VEHICLE INCORPORATING THE SAME |
DE19518936A1 (en) | 1995-05-23 | 1995-12-21 | Christian Dr Ing Philipp | Mounting of component to thermoplastic container wall |
US6243013B1 (en) * | 1999-01-08 | 2001-06-05 | Intermec Ip Corp. | Cascaded DC voltages of multiple antenna RF tag front-end circuits |
US5817207A (en) * | 1995-10-17 | 1998-10-06 | Leighton; Keith R. | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
US6281850B1 (en) * | 1996-02-16 | 2001-08-28 | Intermec Ip Corp. | Broadband multiple element antenna system |
US6215401B1 (en) * | 1996-03-25 | 2001-04-10 | Intermec Ip Corp. | Non-laminated coating for radio frequency transponder (RF tag) |
FR2749687B1 (en) * | 1996-06-07 | 1998-07-17 | Solaic Sa | MEMORY CARD AND METHOD FOR MANUFACTURING SUCH A CARD |
DE19731737A1 (en) | 1997-07-23 | 1998-09-17 | Siemens Ag | Chip-module mounting method e.g. for manufacture of chip card |
US6339385B1 (en) * | 1997-08-20 | 2002-01-15 | Micron Technology, Inc. | Electronic communication devices, methods of forming electrical communication devices, and communication methods |
US6329915B1 (en) * | 1997-12-31 | 2001-12-11 | Intermec Ip Corp | RF Tag having high dielectric constant material |
US6262292B1 (en) | 1998-06-30 | 2001-07-17 | Showa Denko K.K. | Method for producing cyanophenyl derivatives |
US6394330B1 (en) | 1998-08-13 | 2002-05-28 | 3M Innovative Properties Company | Method for slitting and processing a web into plural use supply forms |
KR100629923B1 (en) | 1998-09-30 | 2006-09-29 | 돗빤호무즈가부시기가이샤 | Conductive paste, curing method therof, method for fabricating antenna for contactless data transmitter-receiver, and contactless data transmitter-receiver |
US6285342B1 (en) * | 1998-10-30 | 2001-09-04 | Intermec Ip Corp. | Radio frequency tag with miniaturized resonant antenna |
US6262692B1 (en) * | 1999-01-13 | 2001-07-17 | Brady Worldwide, Inc. | Laminate RFID label and method of manufacture |
EP1035503B2 (en) * | 1999-01-23 | 2010-03-03 | X-ident technology GmbH | RFID-Transponder with printable surface |
JP2000244232A (en) * | 1999-02-17 | 2000-09-08 | Ngk Spark Plug Co Ltd | Micro-strip antenna |
CA2302957C (en) | 1999-03-24 | 2009-06-30 | Morgan Adhesives Company | Circuit chip connector and method of connecting a circuit chip |
US6278413B1 (en) * | 1999-03-29 | 2001-08-21 | Intermec Ip Corporation | Antenna structure for wireless communications device, such as RFID tag |
US6376769B1 (en) * | 1999-05-18 | 2002-04-23 | Amerasia International Technology, Inc. | High-density electronic package, and method for making same |
US6236314B1 (en) * | 1999-09-02 | 2001-05-22 | Micron Technology, Inc. | Transponder modules, RF tagging system, method of operating a transponder module and methods of tagging an object having a conductive surface |
US6259369B1 (en) * | 1999-09-30 | 2001-07-10 | Moore North America, Inc. | Low cost long distance RFID reading |
US6518885B1 (en) * | 1999-10-14 | 2003-02-11 | Intermec Ip Corp. | Ultra-thin outline package for integrated circuit |
TW569424B (en) * | 2000-03-17 | 2004-01-01 | Matsushita Electric Ind Co Ltd | Module with embedded electric elements and the manufacturing method thereof |
JP4450948B2 (en) | 2000-05-11 | 2010-04-14 | 株式会社アマダ | Folding method and bending system |
US6483473B1 (en) * | 2000-07-18 | 2002-11-19 | Marconi Communications Inc. | Wireless communication device and method |
TW511405B (en) * | 2000-12-27 | 2002-11-21 | Matsushita Electric Ind Co Ltd | Device built-in module and manufacturing method thereof |
JP4516228B2 (en) | 2001-02-23 | 2010-08-04 | 株式会社ハーマンプロ | Stripping spatula for grill grill |
WO2002080637A1 (en) * | 2001-04-02 | 2002-10-10 | Nashua Corporation | Circuit elements having an embedded conductive trace and methods of manufacture |
JP4513235B2 (en) | 2001-05-31 | 2010-07-28 | ソニー株式会社 | Flip chip mounting device |
JP4064808B2 (en) | 2001-12-25 | 2008-03-19 | 東芝松下ディスプレイテクノロジー株式会社 | Thermocompression bonding apparatus and thermocompression bonding method |
JP2003283120A (en) | 2002-03-25 | 2003-10-03 | Toppan Forms Co Ltd | Method of mutually connecting electrically conductive connecting sections |
CA2494487A1 (en) | 2002-08-02 | 2004-02-12 | Symbol Technologies, Inc. | Method and apparatus for high volume assembly of radio frequency identification tags |
WO2004039551A2 (en) | 2002-08-02 | 2004-05-13 | Avery Dennison Corporation | Process and apparatus for microreplication |
JP2004094553A (en) | 2002-08-30 | 2004-03-25 | Nooza:Kk | System and method for medical information processing service, server for providing service, and client |
GB2393076A (en) | 2002-09-12 | 2004-03-17 | Rf Tags Ltd | Radio frequency identification tag which has a ground plane not substantially larger than the area spanned by the patch antenna |
WO2004036689A1 (en) | 2002-10-16 | 2004-04-29 | Hrl Laboratories, Llc | Low profile slot or aperture antenna using backside fed frequency selective surface |
SG106662A1 (en) | 2002-11-15 | 2004-10-29 | Smartag S Pte Ltd | Rfid tag for an object having metallic portions, tag coupler and method thereof |
US6960124B2 (en) * | 2003-01-31 | 2005-11-01 | Wy Peron Lee | Cutting machine with environment control arrangement |
JP4082242B2 (en) * | 2003-03-06 | 2008-04-30 | ソニー株式会社 | Element transfer method |
JP4479209B2 (en) * | 2003-10-10 | 2010-06-09 | パナソニック株式会社 | Electronic circuit device, method for manufacturing the same, and apparatus for manufacturing electronic circuit device |
US7495344B2 (en) * | 2004-03-18 | 2009-02-24 | Sanyo Electric Co., Ltd. | Semiconductor apparatus |
TWI241007B (en) * | 2004-09-09 | 2005-10-01 | Phoenix Prec Technology Corp | Semiconductor device embedded structure and method for fabricating the same |
JP2007162144A (en) | 2005-12-09 | 2007-06-28 | Toray Ind Inc | Method for producing carbon fiber bundle |
-
2005
- 2005-12-21 US US11/314,988 patent/US8067253B2/en not_active Expired - Fee Related
-
2006
- 2006-12-14 CN CNA2006800488131A patent/CN101346735A/en active Pending
- 2006-12-14 EP EP06845457A patent/EP1964034B1/en not_active Not-in-force
- 2006-12-14 WO PCT/US2006/047777 patent/WO2007075352A2/en active Application Filing
- 2006-12-14 AT AT06845457T patent/ATE545107T1/en active
- 2006-12-14 EP EP11001269.7A patent/EP2323079A3/en not_active Withdrawn
- 2006-12-14 ES ES06845457T patent/ES2382209T3/en active Active
-
2009
- 2009-04-27 US US12/430,140 patent/US20090206474A1/en not_active Abandoned
Patent Citations (99)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3497171A (en) * | 1968-03-08 | 1970-02-24 | Utility Products Mfg Co | Means for supporting electrical devices |
US3724737A (en) * | 1971-10-06 | 1973-04-03 | E Bodnar | Spreader for slit web material |
US3989575A (en) * | 1975-04-16 | 1976-11-02 | Oliver Machinery Company | Split labeling apparatus |
US4215359A (en) * | 1977-12-13 | 1980-07-29 | U.S. Philips Corporation | Semiconductor device |
US4284466A (en) * | 1979-12-17 | 1981-08-18 | Western Electric Co., Inc. | Bonding head |
US4670084A (en) * | 1983-06-20 | 1987-06-02 | David Durand | Apparatus for applying a dye image to a member |
US4706050A (en) * | 1984-09-22 | 1987-11-10 | Smiths Industries Public Limited Company | Microstrip devices |
US4715923A (en) * | 1985-12-26 | 1987-12-29 | The Boeing Company | Apparatus for consolidating composite materials |
US4786907A (en) * | 1986-07-14 | 1988-11-22 | Amtech Corporation | Transponder useful in a system for identifying objects |
US5049980A (en) * | 1987-04-15 | 1991-09-17 | Kabushiki Kaisha Toshiba | Electronic circuit device and method of manufacturing same |
US4816839A (en) * | 1987-12-18 | 1989-03-28 | Amtech Corporation | Transponder antenna |
US5019417A (en) * | 1989-08-15 | 1991-05-28 | Northcutt Gerald G | Pipe lining system |
US5006856A (en) * | 1989-08-23 | 1991-04-09 | Monarch Marking Systems, Inc. | Electronic article surveillance tag and method of deactivating tags |
US5153983A (en) * | 1990-02-15 | 1992-10-13 | Matsushita Electric Industrial Co., Ltd. | Rotary head type electrical component placing apparatus |
US5182427A (en) * | 1990-09-20 | 1993-01-26 | Metcal, Inc. | Self-regulating heater utilizing ferrite-type body |
US5793305A (en) * | 1991-04-03 | 1998-08-11 | Turner; Leigh Holbrook | Article sorting system |
US5315486A (en) * | 1991-12-16 | 1994-05-24 | General Electric Company | Hermetically packaged HDI electronic system |
US5707660A (en) * | 1992-10-09 | 1998-01-13 | Signode Corporation | Apparatus for producing oriented plastic strap |
US5837349A (en) * | 1992-10-09 | 1998-11-17 | Illinois Tool Works Inc. | Method and apparatus for producing oriented plastic strap, and strap produced thereby |
US5688536A (en) * | 1992-10-09 | 1997-11-18 | Illinois Tool Works Inc. | Apparatus for producing oriented plastic strap |
US5660787A (en) * | 1992-10-09 | 1997-08-26 | Illinois Tool Works Inc. | Method for producing oriented plastic strap |
US5597640A (en) * | 1992-10-09 | 1997-01-28 | Signode Corporation | Oriented plastic strap |
US5760530A (en) * | 1992-12-22 | 1998-06-02 | The United States Of America As Represented By The Secretary Of The Air Force | Piezoelectric tactile sensor |
US5585193A (en) * | 1993-07-16 | 1996-12-17 | Avery Dennison Corporation | Machine-direction oriented label films and die-cut labels prepared therefrom |
US5564888A (en) * | 1993-09-27 | 1996-10-15 | Doan; Carl V. | Pick and place machine |
US5557279A (en) * | 1993-09-28 | 1996-09-17 | Texas Instruments Incorporated | Unitarily-tuned transponder/shield assembly |
US5430441A (en) * | 1993-10-12 | 1995-07-04 | Motorola, Inc. | Transponding tag and method |
US5491483A (en) * | 1994-01-05 | 1996-02-13 | Texas Instruments Incorporated | Single loop transponder system and method |
US5528222A (en) * | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
US5800763A (en) * | 1994-10-06 | 1998-09-01 | Giesecke & Devrient Gmbh | Method for producing data carriers with embedded elements |
US5606136A (en) * | 1995-04-10 | 1997-02-25 | Breed Automotive Technology, Inc. | Electrical lead crossover, sensing cell with electrical lead crossover, and method for making same |
US5965494A (en) * | 1995-05-25 | 1999-10-12 | Kabushiki Kaisha Toshiba | Tunable resonance device controlled by separate permittivity adjusting electrodes |
US5866952A (en) * | 1995-11-30 | 1999-02-02 | Lockheed Martin Corporation | High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate |
US6145901A (en) * | 1996-03-11 | 2000-11-14 | Rich; Donald S. | Pick and place head construction |
US5841193A (en) * | 1996-05-20 | 1998-11-24 | Epic Technologies, Inc. | Single chip modules, repairable multichip modules, and methods of fabrication thereof |
US6166613A (en) * | 1996-07-18 | 2000-12-26 | Matsushita Electric Industrial Co., Ltd. | Voltage-controlled resonator, method of fabricating the same, method of tuning the same, and mobile communication apparatus |
US6164551A (en) * | 1997-10-29 | 2000-12-26 | Meto International Gmbh | Radio frequency identification transponder having non-encapsulated IC chip |
US6019865A (en) * | 1998-01-21 | 2000-02-01 | Moore U.S.A. Inc. | Method of forming labels containing transponders |
US6133836A (en) * | 1998-02-27 | 2000-10-17 | Micron Technology, Inc. | Wireless communication and identification packages, communication systems, methods of communicating, and methods of forming a communication device |
US6147606A (en) * | 1998-03-26 | 2000-11-14 | Intermec Ip Corp. | Apparatus and method for radio frequency transponder with improved read distance |
US6091332A (en) * | 1998-06-09 | 2000-07-18 | Motorola, Inc. | Radio frequency identification tag having printed circuit interconnections |
US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
US6018299A (en) * | 1998-06-09 | 2000-01-25 | Motorola, Inc. | Radio frequency identification tag having a printed antenna and method |
US6140967A (en) * | 1998-08-27 | 2000-10-31 | Lucent Technologies Inc. | Electronically variable power control in microstrip line fed antenna systems |
US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
US6891110B1 (en) * | 1999-03-24 | 2005-05-10 | Motorola, Inc. | Circuit chip connector and method of connecting a circuit chip |
US20020062898A1 (en) * | 1999-04-21 | 2002-05-30 | Austin Pixie A. | RF tag application system |
US6563463B1 (en) * | 1999-05-24 | 2003-05-13 | Hitachi, Ltd. | Wireless tag, its manufacturing and its layout |
US6140146A (en) * | 1999-08-03 | 2000-10-31 | Intermec Ip Corp. | Automated RFID transponder manufacturing on flexible tape substrates |
US20040178912A1 (en) * | 1999-09-02 | 2004-09-16 | Smith Freddie W. | Remote communication devices, radio frequency identification devices, wireless communication systems, wireless communication methods, radio frequency identification device communication methods, and methods of forming a remote communication device |
US6931725B2 (en) * | 1999-12-20 | 2005-08-23 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module, radio device having the same, and method for producing the same |
US6555414B1 (en) * | 2000-02-09 | 2003-04-29 | Interuniversitair Microelektronica Centrum, Vzw | Flip-chip assembly of semiconductor devices using adhesives |
US20010053675A1 (en) * | 2000-03-16 | 2001-12-20 | Andreas Plettner | Transponder |
US20040026033A1 (en) * | 2000-04-04 | 2004-02-12 | Price David M. | High speed flip chip assembly process |
US20030089444A1 (en) * | 2000-04-07 | 2003-05-15 | Roland Melzer | Method and apparatus for producing data carriers equipped with an integrated transponder |
US20010054755A1 (en) * | 2000-04-13 | 2001-12-27 | Richard Kirkham | Integrated package and RFID antenna |
US6504511B2 (en) * | 2000-04-18 | 2003-01-07 | Telefonaktiebolaget Lm Ericsson (Publ) | Multi-band antenna for use in a portable telecommunications apparatus |
US20040075607A1 (en) * | 2000-04-26 | 2004-04-22 | Cathey David A. | Automated antenna trim for transmitting and receiving semiconductor devices |
US6535175B2 (en) * | 2000-06-01 | 2003-03-18 | Intermec Ip Corp. | Adjustable length antenna system for RF transponders |
US20020175873A1 (en) * | 2000-07-18 | 2002-11-28 | King Patrick F. | Grounded antenna for a wireless communication device and method |
US6706230B2 (en) * | 2000-09-05 | 2004-03-16 | Honda Giken Kogyo Kabushiki Kaisha | Auxiliary jig |
US6542114B1 (en) * | 2000-09-07 | 2003-04-01 | Savi Technology, Inc. | Method and apparatus for tracking items using dual frequency tags |
US20020088777A1 (en) * | 2001-01-11 | 2002-07-11 | David Grewell | Transparent pressure bladder |
US6577208B2 (en) * | 2001-02-26 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Radio frequency filter |
US20020125566A1 (en) * | 2001-03-05 | 2002-09-12 | Yoshiyuki Tonami | High frequency circuit chip and method of producing the same |
US6838377B2 (en) * | 2001-03-05 | 2005-01-04 | Murata Manufacturing Co., Ltd. | High frequency circuit chip and method of producing the same |
US20020181208A1 (en) * | 2001-05-31 | 2002-12-05 | Credelle Thomas Lloyd | Multi-feature-size electronic structures |
US6855892B2 (en) * | 2001-09-27 | 2005-02-15 | Matsushita Electric Industrial Co., Ltd. | Insulation sheet, multi-layer wiring substrate and production processes thereof |
US20030071118A1 (en) * | 2001-10-03 | 2003-04-17 | Gershman Anatole V. | Mobile object tracker |
US6701605B2 (en) * | 2001-10-09 | 2004-03-09 | Sonoco Development, Inc. | Conductive electrical element and antenna with ink additive technology |
US6913057B2 (en) * | 2001-10-19 | 2005-07-05 | Nissei Plastic Industrial Co., Ltd. | IC-card manufacturing apparatus |
US7080446B2 (en) * | 2001-10-26 | 2006-07-25 | Matsushita Electric Works, Ltd. | Wiring board sheet and its manufacturing method, multilayer board and its manufacturing method |
US20040032377A1 (en) * | 2001-10-29 | 2004-02-19 | Forster Ian James | Wave antenna wireless communication device and method |
US20040108600A1 (en) * | 2001-12-28 | 2004-06-10 | Jimmy Liang | Method and apparatus for flip chip device assembly by radiant heating |
US20030136503A1 (en) * | 2002-01-18 | 2003-07-24 | Avery Dennison Corporation | RFID label technique |
US6784530B2 (en) * | 2002-01-23 | 2004-08-31 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module with embedded semiconductor chip and method of manufacturing |
US7018866B2 (en) * | 2002-01-23 | 2006-03-28 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module with embedded semiconductor chip and method of manufacturing |
US6975016B2 (en) * | 2002-02-06 | 2005-12-13 | Intel Corporation | Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof |
US6856285B2 (en) * | 2002-03-04 | 2005-02-15 | Siemens Information & Communication Mobile, Llc | Multi-band PIF antenna with meander structure |
US6888502B2 (en) * | 2002-03-05 | 2005-05-03 | Precision Dynamics Corporation | Microstrip antenna for an identification appliance |
US7191507B2 (en) * | 2002-04-24 | 2007-03-20 | Mineral Lassen Llc | Method of producing a wireless communication device |
US20030210188A1 (en) * | 2002-05-09 | 2003-11-13 | Ted Hebron | Multi-band antenna system including a retractable antenna and a meander antenna |
US20040001029A1 (en) * | 2002-06-27 | 2004-01-01 | Francis Parsche | Efficient loop antenna of reduced diameter |
US6665193B1 (en) * | 2002-07-09 | 2003-12-16 | Amerasia International Technology, Inc. | Electronic circuit construction, as for a wireless RF tag |
US20040020036A1 (en) * | 2002-08-02 | 2004-02-05 | Matrics, Inc. | Method and apparatus for high volume assembly of radio frequency identification tags |
US6825553B2 (en) * | 2002-08-27 | 2004-11-30 | Micron Technology, Inc. | Multichip wafer level packages and computing systems incorporating same |
US7087992B2 (en) * | 2002-08-27 | 2006-08-08 | Micron Technology, Inc. | Multichip wafer level packages and computing systems incorporating same |
US20040041262A1 (en) * | 2002-08-28 | 2004-03-04 | Renesas Technology Corp. | Inlet for an electronic tag |
US20040052203A1 (en) * | 2002-09-13 | 2004-03-18 | Brollier Brian W. | Light enabled RFID in information disks |
US6667092B1 (en) * | 2002-09-26 | 2003-12-23 | International Paper Company | RFID enabled corrugated structures |
US6833610B2 (en) * | 2002-10-07 | 2004-12-21 | Advanced Semiconductor Engineering, Inc. | Bridge connection type of chip package and fabricating method thereof |
US20050269687A1 (en) * | 2002-11-08 | 2005-12-08 | Robert Forcier | Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing |
US6919508B2 (en) * | 2002-11-08 | 2005-07-19 | Flipchip International, Llc | Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing |
US20040125040A1 (en) * | 2002-12-31 | 2004-07-01 | Ferguson Scott Wayne | RFID device and method of forming |
US20040256560A1 (en) * | 2003-03-07 | 2004-12-23 | Russell James T. | Optical system for a gas measurement system |
US20040178267A1 (en) * | 2003-03-11 | 2004-09-16 | Zebra Technologies Corporation | System and Method for Selective Communication with RFID Transponders |
US6925701B2 (en) * | 2003-03-13 | 2005-08-09 | Checkpoint Systems, Inc. | Method of making a series of resonant frequency tags |
US7158037B2 (en) * | 2004-03-22 | 2007-01-02 | Avery Dennison Corporation | Low cost method of producing radio frequency identification tags with straps without antenna patterning |
US20050282355A1 (en) * | 2004-06-18 | 2005-12-22 | Edwards David N | High density bonding of electrical devices |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140033515A1 (en) * | 2010-09-17 | 2014-02-06 | Apple Inc. | Systems and methods for integrating radio-frequency identification circuitry into flexible circuits |
US8978988B2 (en) * | 2010-09-17 | 2015-03-17 | Apple Inc. | Systems and methods for integrating radio-frequency identification circuitry into flexible circuits |
US20140265830A1 (en) * | 2013-03-15 | 2014-09-18 | Consiglio Nazionale Delle Ricerche | Uv lamp and a cavity-less uv lamp system |
US9064681B2 (en) * | 2013-03-15 | 2015-06-23 | Heraeus Noblelight America Llc | UV lamp and a cavity-less UV lamp system |
US10049319B2 (en) | 2014-12-16 | 2018-08-14 | Avery Dennison Retail Information Services, Llc | Method of assembly using moving substrates, including creating RFID inlays |
DE102017129625B3 (en) | 2017-12-12 | 2019-05-23 | Mühlbauer Gmbh & Co. Kg | Method and device for equipping an antenna structure with an electronic component |
Also Published As
Publication number | Publication date |
---|---|
ATE545107T1 (en) | 2012-02-15 |
US8067253B2 (en) | 2011-11-29 |
ES2382209T3 (en) | 2012-06-06 |
WO2007075352A2 (en) | 2007-07-05 |
EP2323079A2 (en) | 2011-05-18 |
EP2323079A3 (en) | 2013-05-22 |
EP1964034B1 (en) | 2012-02-08 |
CN101346735A (en) | 2009-01-14 |
US20070141760A1 (en) | 2007-06-21 |
WO2007075352A3 (en) | 2007-10-11 |
EP1964034A2 (en) | 2008-09-03 |
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Legal Events
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