US20090311900A1 - Socket with oppositely arrayed terminals - Google Patents
Socket with oppositely arrayed terminals Download PDFInfo
- Publication number
- US20090311900A1 US20090311900A1 US12/288,235 US28823508A US2009311900A1 US 20090311900 A1 US20090311900 A1 US 20090311900A1 US 28823508 A US28823508 A US 28823508A US 2009311900 A1 US2009311900 A1 US 2009311900A1
- Authority
- US
- United States
- Prior art keywords
- passageways
- socket
- terminals
- group
- contacting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
Definitions
- the present invention relates to a socket, especially to a socket electrically connecting a semiconductor package and a printed circuit board.
- An LGA (Land Grid Array) socket for electrically connecting a semiconductor package, comprises an insulating housing and terminals, the insulating housing is formed with a bottom wall and sidewalls extending from the bottom wall, the bottom wall and the sidewalls define a receiving space for receiving the semiconductor package, together.
- the terminal has a retaining portion mounted on the insulating housing, an elastic portion extending from the retaining portion and a soldering portion, a contacting portion is formed on an end of the elastic portion. The elastic portion is exposed beyond the bottom wall and received in the receiving space when the terminal is assembled, the soldering portion is used to solder to a printed circuit board.
- the semiconductor package When the semiconductor package assembles to the socket, the semiconductor package contacts the contacting portion of the terminal and presses the elastic portion of the terminal, so electrically connection between the semiconductor package and the printed circuit board is achieved by the terminals.
- the elastic portion of this type terminal can distort to get a better contacting effect between the semiconductor package and the terminal.
- the elastic portions of the terminals in such type socket are assembled toward a same direction, when the semiconductor package mounts and bears the terminals, the semiconductor package will be forced by elastic resistances generated by the elastic portions and toward one direction, which may cause worse contacting effects between the semiconductor package and some of the terminals and even may influence a contacting quality of the whole socket.
- Chinese Patent Issue No. 2779652 publishes another socket, which comprises an insulating housing and a plurality of terminals received in the insulating housing.
- the insulating housing defines a plurality of receiving slots arranged in matrix, the terminals are accepted in the receiving slots, the terminal has an elastic arm and a contacting portion formed on an end of the elastic portion.
- the receiving slots arranged in matrix are distributed in at least two areas, and the terminals in the two areas are oppositely arrayed.
- the extending directions of the elastic portions of the terminals in a same area are uniform, and are opposite to that of the elastic portions of the terminals in the other area, respectively.
- This type of socket disposes the terminals in an opposite way, after the terminals are pressed, horizontal frictions of the terminals acting on the semiconductor package can be reduces, and even finally are balanced.
- this type socket has limitations which includes an assembly of the semiconductor package being not convenient, and a setting of the insulating housing to the printed circuit board being not convenient either.
- An object of the invention is to provide a socket with oppositely arrayed terminals.
- a socket adapted for electrically connecting a semiconductor package to a printed circuit board comprises an insulating body and a plurality of terminals.
- the insulating body has a mating face, a mounting face opposite to the mating face and a plurality of passageways passing through the mating face and the mounting face, the insulating body is formed with two areas separated by a beeline thereof, and the passageways distributed on both of the two areas.
- the terminals are received in the passageways, and each terminal has an elastic arm protruding out of the mating face of the insulating body. Extending directions of the elastic arms of the terminals in same area are uniform, and are opposite with that of the elastic arms of the terminals in the other area. And the extending directions of all the terminals are parallel to the beeline.
- FIG. 1 is an assembled, perspective view of a socket in accordance with a preferred embodiment of present invention
- FIG. 2 is a top view of the socket in accordance with a preferred embodiment of present invention.
- FIG. 3 is a partially, section view of the socket in accordance with a preferred embodiment of present invention, wherein the socket is disposed between a semiconductor package and a printed circuit board;
- FIG. 4 is similar with the FIG. 3 , but two terminals in the socket are pressed by the semiconductor package;
- FIG. 5 is a perspective view of the terminal.
- a socket 100 in accordance with a preferred embodiment of present invention is disclosed for electrically connecting a semiconductor package 200 to a PCB (printed circuit board) 300 .
- the socket 100 has an insulating body 1 and a plurality of terminals 20 received in the insulating body 10 .
- the insulating body 10 is a rectangle board-like, and defines a mating face 101 , a mounting face 102 opposite to the mating face and a plurality of passageways 103 extending through the mating face 101 and the mounting face 102 and arranged in matrix for receiving the terminals 20 .
- the insulating body 10 is formed with two arrears: a first area 1011 and a second area 1012 , along a beeline L 1 .
- the first area 1011 and the second area 1012 are both in approximately rectangle shape, and define a first position hole 104 and a second position hole 105 , respectively, for engaging with the semiconductor package 200 .
- the first and the second holes 104 , 105 extend through the insulating body 10 , and occupy two opposite corners of the insulating body 10 , respectively. Referring to FIG. 2 , the passageways 103 in two adjacent lines of the first and the second areas 1011 , 1012 respectively are arranged in stagger way.
- the terminal 20 has a retaining base portion 201 , an elastic arm 202 upwardly bended from a side of the base portion 201 and a contacting arm 203 downwardly extending from the base portion 201 .
- the base portion 201 can reliably latch with the passageway 103 , so that the terminal 2 can be retained in the passageway 103 .
- An end of the elastic arm 202 is disposed into fork-shape with two distant contacting portions 2021 .
- an end of the contacting arm 203 is also disposed into fork-shape with two distant mating portions 2031 .
- the base portion 201 has two retaining arms (not labeled) vertically and downwardly extending from the base portion 2031 .
- the terminals 20 are received in the passageways 103 of the insulating body 10 in following manner: the terminals 20 in the first area 1011 and the terminals 20 in the second area 1012 are oppositely arrayed, and extending directions of the elastic arms 202 of the terminals 20 in a same area, such as the first area 1011 (the second area 1021 ) are uniform, toward left (right) in FIG. 2 , and opposite with that of the elastic arms 202 of the terminals 20 in the second area 1021 (the first area 1011 ). Furthermore the elastic arms 202 will not interfere with the first position hole 104 or the second position hole 105 . In this prefer embodiment, the extending directions of the elastic arms 202 of all the terminals 20 are parallel with the beeline L 1 of the insulating body 10 .
- FIG. 3 and FIG. 4 which is a partial, section view showing two adjacent terminals 20 in the first area 1011 and the second area 1021 , respectively, and on two sides of the beeline L 1 .
- the insulating body 10 is disposed between the semiconductor package 200 and the PCB 300 .
- the elastic arm 202 of the terminal 20 protrudes out of the mating face 101 of the insulating body 10 , the mating portion 2031 of the contacting arm 203 mates with the PCB 300 , neither the elastic arm 202 nor the contacting arm 203 distorts at this time; and then the semiconductor package 200 downwardly presses (referring to FIG. 4 ) the terminals 20 .
- the elastic arms 202 of the terminals 20 in both the two areas 1011 , 1021 are pressed to distort and generate horizontal and opposite frictions F 1 , F 2 , which can counteract an effect of each other, so a total horizontal friction of all the terminals 20 acting on the semiconductor package 200 is reduced, even gets balanceable. Synchronously, a horizontal movement of the semiconductor package 200 relative to the insulating body 10 caused by friction is lightened.
- the first position hole 104 and the second position hole 105 which both extend through the insualting body 10 , can engage with the PCB 300 to facilitate the insulating body 10 mounting to the printed circuit board 300 .
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a socket, especially to a socket electrically connecting a semiconductor package and a printed circuit board.
- 2. Description of the Related Art
- An LGA (Land Grid Array) socket, for electrically connecting a semiconductor package, comprises an insulating housing and terminals, the insulating housing is formed with a bottom wall and sidewalls extending from the bottom wall, the bottom wall and the sidewalls define a receiving space for receiving the semiconductor package, together. The terminal has a retaining portion mounted on the insulating housing, an elastic portion extending from the retaining portion and a soldering portion, a contacting portion is formed on an end of the elastic portion. The elastic portion is exposed beyond the bottom wall and received in the receiving space when the terminal is assembled, the soldering portion is used to solder to a printed circuit board. When the semiconductor package assembles to the socket, the semiconductor package contacts the contacting portion of the terminal and presses the elastic portion of the terminal, so electrically connection between the semiconductor package and the printed circuit board is achieved by the terminals. The elastic portion of this type terminal can distort to get a better contacting effect between the semiconductor package and the terminal.
- However, the elastic portions of the terminals in such type socket are assembled toward a same direction, when the semiconductor package mounts and bears the terminals, the semiconductor package will be forced by elastic resistances generated by the elastic portions and toward one direction, which may cause worse contacting effects between the semiconductor package and some of the terminals and even may influence a contacting quality of the whole socket.
- Chinese Patent Issue No. 2779652 publishes another socket, which comprises an insulating housing and a plurality of terminals received in the insulating housing. The insulating housing defines a plurality of receiving slots arranged in matrix, the terminals are accepted in the receiving slots, the terminal has an elastic arm and a contacting portion formed on an end of the elastic portion. The receiving slots arranged in matrix are distributed in at least two areas, and the terminals in the two areas are oppositely arrayed. The extending directions of the elastic portions of the terminals in a same area are uniform, and are opposite to that of the elastic portions of the terminals in the other area, respectively. This type of socket disposes the terminals in an opposite way, after the terminals are pressed, horizontal frictions of the terminals acting on the semiconductor package can be reduces, and even finally are balanced. However, this type socket has limitations which includes an assembly of the semiconductor package being not convenient, and a setting of the insulating housing to the printed circuit board being not convenient either.
- Hence, it is required to improve the disadvantages of the above sockets.
- An object of the invention is to provide a socket with oppositely arrayed terminals.
- To achieve the above-mentioned object, a socket adapted for electrically connecting a semiconductor package to a printed circuit board, comprises an insulating body and a plurality of terminals. The insulating body has a mating face, a mounting face opposite to the mating face and a plurality of passageways passing through the mating face and the mounting face, the insulating body is formed with two areas separated by a beeline thereof, and the passageways distributed on both of the two areas. The terminals are received in the passageways, and each terminal has an elastic arm protruding out of the mating face of the insulating body. Extending directions of the elastic arms of the terminals in same area are uniform, and are opposite with that of the elastic arms of the terminals in the other area. And the extending directions of all the terminals are parallel to the beeline.
- Other features and advantages of the present invention will become more apparent to those skilled in the art upon examination of the following drawings and detailed description of preferred embodiments, in which:
-
FIG. 1 is an assembled, perspective view of a socket in accordance with a preferred embodiment of present invention; -
FIG. 2 is a top view of the socket in accordance with a preferred embodiment of present invention; -
FIG. 3 is a partially, section view of the socket in accordance with a preferred embodiment of present invention, wherein the socket is disposed between a semiconductor package and a printed circuit board; -
FIG. 4 is similar with theFIG. 3 , but two terminals in the socket are pressed by the semiconductor package; and -
FIG. 5 is a perspective view of the terminal. - Reference will now be made in detail to the preferred embodiment of the present invention.
- Referring to
FIGS. 1-5 , asocket 100 in accordance with a preferred embodiment of present invention is disclosed for electrically connecting asemiconductor package 200 to a PCB (printed circuit board) 300. Thesocket 100 has an insulating body 1 and a plurality ofterminals 20 received in theinsulating body 10. - The
insulating body 10 is a rectangle board-like, and defines amating face 101, amounting face 102 opposite to the mating face and a plurality ofpassageways 103 extending through themating face 101 and themounting face 102 and arranged in matrix for receiving theterminals 20. Theinsulating body 10 is formed with two arrears: afirst area 1011 and asecond area 1012, along a beeline L1. Thefirst area 1011 and thesecond area 1012 are both in approximately rectangle shape, and define afirst position hole 104 and asecond position hole 105, respectively, for engaging with thesemiconductor package 200. The first and thesecond holes insulating body 10, and occupy two opposite corners of theinsulating body 10, respectively. Referring toFIG. 2 , thepassageways 103 in two adjacent lines of the first and thesecond areas - The
terminal 20 has aretaining base portion 201, anelastic arm 202 upwardly bended from a side of thebase portion 201 and a contactingarm 203 downwardly extending from thebase portion 201. Thebase portion 201 can reliably latch with thepassageway 103, so that the terminal 2 can be retained in thepassageway 103. An end of theelastic arm 202 is disposed into fork-shape with two distant contactingportions 2021. And an end of the contactingarm 203 is also disposed into fork-shape with twodistant mating portions 2031. Thebase portion 201 has two retaining arms (not labeled) vertically and downwardly extending from thebase portion 2031. - Referring to
FIGS. 1 and 2 , theterminals 20 are received in thepassageways 103 of theinsulating body 10 in following manner: theterminals 20 in thefirst area 1011 and theterminals 20 in thesecond area 1012 are oppositely arrayed, and extending directions of theelastic arms 202 of theterminals 20 in a same area, such as the first area 1011 (the second area 1021) are uniform, toward left (right) inFIG. 2 , and opposite with that of theelastic arms 202 of theterminals 20 in the second area 1021 (the first area 1011). Furthermore theelastic arms 202 will not interfere with thefirst position hole 104 or thesecond position hole 105. In this prefer embodiment, the extending directions of theelastic arms 202 of all theterminals 20 are parallel with the beeline L1 of theinsulating body 10. - Referring to
FIG. 3 andFIG. 4 , which is a partial, section view showing twoadjacent terminals 20 in thefirst area 1011 and the second area 1021, respectively, and on two sides of the beeline L1. Theinsulating body 10 is disposed between thesemiconductor package 200 and the PCB 300. Before thesemiconductor package 200 downwardly moves, theelastic arm 202 of theterminal 20 protrudes out of themating face 101 of theinsulating body 10, themating portion 2031 of the contactingarm 203 mates with thePCB 300, neither theelastic arm 202 nor the contactingarm 203 distorts at this time; and then thesemiconductor package 200 downwardly presses (referring toFIG. 4 ) theterminals 20. Theelastic arms 202 of theterminals 20 in both the twoareas 1011, 1021 are pressed to distort and generate horizontal and opposite frictions F1, F2, which can counteract an effect of each other, so a total horizontal friction of all theterminals 20 acting on thesemiconductor package 200 is reduced, even gets balanceable. Synchronously, a horizontal movement of thesemiconductor package 200 relative to theinsulating body 10 caused by friction is lightened. - The first position hole 104 and the
second position hole 105 which both extend through theinsualting body 10, can engage with the PCB 300 to facilitate theinsulating body 10 mounting to the printedcircuit board 300. - While the present invention has been described with reference to preferred embodiments, the description of the invention is illustrative and is not to be construed as limiting the invention. Various of modifications to the present invention can be made to preferred embodiments by those skilled in the art without departing from the true spirit and scope of the invention as defined by the appended claims.
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097210596U TWM349617U (en) | 2008-06-16 | 2008-06-16 | Electrical connector |
TW97210596 | 2008-06-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
US7625217B1 US7625217B1 (en) | 2009-12-01 |
US20090311900A1 true US20090311900A1 (en) | 2009-12-17 |
Family
ID=41350832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/288,235 Expired - Fee Related US7625217B1 (en) | 2008-06-16 | 2008-10-17 | Socket with oppositely arrayed terminals |
Country Status (2)
Country | Link |
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US (1) | US7625217B1 (en) |
TW (1) | TWM349617U (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US20100291774A1 (en) * | 2009-05-18 | 2010-11-18 | Hon Hai Precision Industry Co., Ltd. | Electrical socket having contact terminals arranged in fan-out pitch arrangement |
US20110230100A1 (en) * | 2010-03-17 | 2011-09-22 | Hon Hai Precision Industry Co., Ltd. | Socket connector with contact terminals arranged radially creating different pitches in different area |
CN102315532A (en) * | 2010-06-30 | 2012-01-11 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
US8147256B2 (en) * | 2010-04-20 | 2012-04-03 | Lotes Co., Ltd. | Electrical connector and terminal thereof |
US8172623B1 (en) * | 2010-12-07 | 2012-05-08 | Hon Hai Precision Ind. Co., Ltd. | Compression connector having contacting ends with co-used deforming section |
US20120149248A1 (en) * | 2010-12-07 | 2012-06-14 | Hon Hai Precision Industry Co., Ltd. | Compression connector configured with two housing liminted contacts therebetween |
US8851904B2 (en) * | 2012-08-02 | 2014-10-07 | Hon Hai Precision Industry Co., Ltd. | Shielding socket with two pieces housing components |
US10547136B2 (en) * | 2018-01-09 | 2020-01-28 | Lotes Co., Ltd | Electrical connector |
Families Citing this family (18)
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TWM348350U (en) * | 2008-04-21 | 2009-01-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
CN101997190B (en) * | 2009-08-14 | 2014-05-07 | 富士康(昆山)电脑接插件有限公司 | Electric connecting device |
TWM391758U (en) * | 2010-04-28 | 2010-11-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
CN201797115U (en) * | 2010-09-01 | 2011-04-13 | 富士康(昆山)电脑接插件有限公司 | Electric connector and conductive terminal thereof |
TWM485546U (en) * | 2014-01-15 | 2014-09-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
CN206283020U (en) * | 2016-11-23 | 2017-06-27 | 番禺得意精密电子工业有限公司 | Electric connector |
CN107492728A (en) * | 2017-01-12 | 2017-12-19 | 番禺得意精密电子工业有限公司 | Electric connector |
CN107994377B (en) * | 2017-03-14 | 2020-12-22 | 番禺得意精密电子工业有限公司 | Electric connector and terminal |
JP6837390B2 (en) * | 2017-06-12 | 2021-03-03 | モレックス エルエルシー | connector |
US10797424B2 (en) * | 2018-04-27 | 2020-10-06 | Fuding Precision Components (Shenzhen) Co., Ltd. | Electrical contact |
CN111262069B (en) * | 2018-11-30 | 2024-02-20 | 富顶精密组件(深圳)有限公司 | Conductive terminal |
JP2020098747A (en) * | 2018-12-19 | 2020-06-25 | タイコエレクトロニクスジャパン合同会社 | Interposer and manufacturing method for interposer |
JP7365099B2 (en) * | 2019-07-23 | 2023-10-19 | タイコエレクトロニクスジャパン合同会社 | interposer |
US11411338B2 (en) | 2019-08-13 | 2022-08-09 | Foxconn (Kunshan) Computer Connector Co., Ltd. | Mixer pitch arrangement for CPU socket |
US11799225B2 (en) * | 2019-09-27 | 2023-10-24 | Apple Inc. | Connector having contact array |
CN113054469B (en) * | 2019-12-26 | 2022-07-26 | 富士康(昆山)电脑接插件有限公司 | Electrical connector with improved contact arrangement |
JP6901602B1 (en) | 2020-03-27 | 2021-07-14 | 日本航空電子工業株式会社 | connector |
JP6901603B1 (en) * | 2020-03-27 | 2021-07-14 | 日本航空電子工業株式会社 | Board-to-board connector |
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- 2008-10-17 US US12/288,235 patent/US7625217B1/en not_active Expired - Fee Related
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US5221209A (en) * | 1991-08-22 | 1993-06-22 | Augat Inc. | Modular pad array interface |
US7044746B2 (en) * | 2002-10-16 | 2006-05-16 | Tyco Electronics Corporation | Separable interface electrical connector having opposing contacts |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100291774A1 (en) * | 2009-05-18 | 2010-11-18 | Hon Hai Precision Industry Co., Ltd. | Electrical socket having contact terminals arranged in fan-out pitch arrangement |
US7878818B2 (en) * | 2009-05-18 | 2011-02-01 | Hon Hai Precision Ind. Co., Ltd. | Electrical socket having contact terminals arranged in fan-out pitch arrangement |
US20110230100A1 (en) * | 2010-03-17 | 2011-09-22 | Hon Hai Precision Industry Co., Ltd. | Socket connector with contact terminals arranged radially creating different pitches in different area |
US8292666B2 (en) * | 2010-03-17 | 2012-10-23 | Hon Hai Precision Ind. Co., Ltd. | Socket connector with contact terminals arranged radially creating different pitches in different area |
US8147256B2 (en) * | 2010-04-20 | 2012-04-03 | Lotes Co., Ltd. | Electrical connector and terminal thereof |
CN102315532A (en) * | 2010-06-30 | 2012-01-11 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
US8172623B1 (en) * | 2010-12-07 | 2012-05-08 | Hon Hai Precision Ind. Co., Ltd. | Compression connector having contacting ends with co-used deforming section |
US20120149248A1 (en) * | 2010-12-07 | 2012-06-14 | Hon Hai Precision Industry Co., Ltd. | Compression connector configured with two housing liminted contacts therebetween |
US8523615B2 (en) * | 2010-12-07 | 2013-09-03 | Hon Hai Precision Industry Co., Ltd. | Compression connector configured with two housing liminted contacts therebetween |
US8851904B2 (en) * | 2012-08-02 | 2014-10-07 | Hon Hai Precision Industry Co., Ltd. | Shielding socket with two pieces housing components |
US10547136B2 (en) * | 2018-01-09 | 2020-01-28 | Lotes Co., Ltd | Electrical connector |
Also Published As
Publication number | Publication date |
---|---|
TWM349617U (en) | 2009-01-21 |
US7625217B1 (en) | 2009-12-01 |
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