US20090321043A1 - Heat absorbing device - Google Patents

Heat absorbing device Download PDF

Info

Publication number
US20090321043A1
US20090321043A1 US12/146,542 US14654208A US2009321043A1 US 20090321043 A1 US20090321043 A1 US 20090321043A1 US 14654208 A US14654208 A US 14654208A US 2009321043 A1 US2009321043 A1 US 2009321043A1
Authority
US
United States
Prior art keywords
heat
moisture
absorbing device
proof cap
heat absorbing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/146,542
Inventor
Feng-Chang Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JINGWAY TECHNOLOGY Co Ltd
Original Assignee
JINGWAY TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JINGWAY TECHNOLOGY Co Ltd filed Critical JINGWAY TECHNOLOGY Co Ltd
Priority to US12/146,542 priority Critical patent/US20090321043A1/en
Assigned to JINGWAY TECHNOLOGY CO., LTD reassignment JINGWAY TECHNOLOGY CO., LTD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WANG, FENG-CHANG
Publication of US20090321043A1 publication Critical patent/US20090321043A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This invention relates to a heat absorbing device.
  • a conventional heat dissipating device 10 shown in FIG. 1 includes a heat semi-conductor 11 for performing hat change.
  • the heat semi-conductor 11 is provided with a cooling surface 111 to contact with air, but if the air is too cool, moisture in the air may condense thereon to become water drops. So water can be detrimental to an electronic part, and in order to avoid contacting with air, a heat guide plate 12 is attached around the heat semi-conductor 11 , having a hollow space in its interior for receiving the semi-conductor 11 , with the cooling surface 111 of the semi-conductor 11 contacting with the heat guide plate 12 for heat absorbing.
  • the heat guide plate 12 is provided with a sealing rubber ring 121 for insulating the semi-conductor 11 from contacting exterior air, and a heat dissipater 13 is connected with the heat guide surface 112 to dissipate heat.
  • the heat guide plate 12 has too large a dimension for wrapping around the semi-conductor 11 , so it also absorbs heat at the location not contacting the heat source, consequently cutting down the effectiveness of the semi-conductor 11 .
  • the purpose of this invention is to offer a heat absorbing device having excellent function of air insulating.
  • the features of the heat absorbing device are a heat converter, a heat semi-conductor, a cool guide plate, and a moisture-proof cap.
  • the heat semi-conductor is placed on the heat converter, and the cool guide plate is placed on the heat semi-conductor.
  • the moisture-proof cap has an accommodating space for receiving the heat converter and the heat semi-conductor, an upper opening for fitting sealingly the cool guide plate, and a combining mouth in the bottom for the combining member of the heat converter to be fitted sealingly in. Then the two ends of the moisture-proof cap combined sealingly with the heat converter and the cool guide plate to keep the heat semi-conductor completely insulated from exterior air.
  • the heat semi-conductor is directly and evenly connected to a heat source via the cool guide plate, it is boosted up in its efficacy.
  • FIG. 1 is a cross-sectional view of a conventional heat absorbing device
  • FIG. 2 is a perspective view of a heat absorbing device in the present invention
  • FIG. 3 is an exploded perspective view of the heat absorbing device in the present invention.
  • FIG. 4 is a cross-sectional view of the heat absorbing device in the present invention.
  • a heat absorbing device in the present invention includes a heat converter 20 , a heat semi-conductor 30 , a cool guide plate 40 , an anti-moisture cap 50 , a first sealing element 60 and a second sealing element 70 .
  • the heat converter 20 is composed of a nearly square main body 21 , and the main body 21 consists of a heat absorbing member 22 in an upper portion, and a linking member 23 around its bottom, with a linking hole 24 bored respectively at its four corners for receiving a bolt 25 therein.
  • the heat semi-conductor 30 has a cooling surface 31 and a heat dissipating surface 32 oppositely.
  • the cool guide plate 40 is made of a heat evenly transmitting material, having a stepped projection 41 around its circumference
  • the moisture-proof cap 50 is made of a material transmitting not so much heat, having a recessed accommodating space 51 , an upper opening 52 , a linking mouth 53 formed in the bottom, an annular edge 54 formed in the linking mouth 53 , and a threaded hole 55 formed respectively at four corners of the bottom.
  • the first sealing element 60 is annular, made of a material having sealing function.
  • the heat absorbing surface 22 of the heat converter 20 contacts the heat dissipating surface 32 of the semi-conductor 30 , and the cooling surface 31 of the heat semi-conductor 30 contacts the cool guide plate 40 .
  • the moisture-proof cap 50 is covered on the heat converter 20 , with the first sealing element 60 , the cool guide plate 30 and the heat converter 20 orderly placed in the accommodating space 51 .
  • the cool guide plate 40 is just fitted in the upper opening 52 , and the first element 60 resting around the stepped projection 41 of the cool guide plate 40 fits tightly around the upper opening 52 , enabling the stepped projection 41 to tightly contact the moisture-proof cap 50 .
  • the linking member 23 of the heat converter 20 overlaps the annular edge 54 of the moisture-proof cap 50 , and the second sealing element 70 is coated between the linking member 23 and the annular edge 54 .
  • the second sealing element 70 is a kind of sealing glue or a material having high sealing function.
  • the threaded holes 55 of the moisture-proof cap 50 overlap with the linking holes 24 for the bolts 25 to fasten them tightly.
  • the heat semi-conductor 30 conducts heat, heating up the heat dissipating surface 32 but cutting down the temperature of the cooling surface, with the heat absorbing surface 22 of the heat converter 20 takes off the heat energy produced by the heat dissipating surface 32 . Therefore, the cooling plate 40 performs lowering temperature owing to the cooling surface 31 , as the cooling surface 31 contacts the cool guide plate 40 . Moreover, the cool guide plate 40 is connected to a heat source (not shown), it dissipates heat produced thereby, with the cool guide plate 40 mixes temperature of the heat source with that of the cooling surface 31 , with the moisture-proof cap 50 performing insulation, permitting the cooling surface 31 to work with the heat source for stepping up the function of the heat absorbing device in the invention.

Abstract

A heat absorbing device includes a converter, a heat semi-conductor located on the converter, a cool guide plate placed on the heat semi-conductor, and a moisture-proof cap provided with a recessed accommodating space for receiving the heat converter and the heat semi-conductor. The moisture-proof cap has an upper opening that the cool guide plate is fitted closely in, and a combining mouth formed in its bottom for the combining member of the heat converter fitted closely therein, insulating the heat semi-conductor from exterior air.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • This invention relates to a heat absorbing device.
  • 2. Description of the Prior Art
  • A conventional heat dissipating device 10 shown in FIG. 1 includes a heat semi-conductor 11 for performing hat change. The heat semi-conductor 11 is provided with a cooling surface 111 to contact with air, but if the air is too cool, moisture in the air may condense thereon to become water drops. So water can be detrimental to an electronic part, and in order to avoid contacting with air, a heat guide plate 12 is attached around the heat semi-conductor 11, having a hollow space in its interior for receiving the semi-conductor 11, with the cooling surface 111 of the semi-conductor 11 contacting with the heat guide plate 12 for heat absorbing. At the same time, the heat guide plate 12 is provided with a sealing rubber ring 121 for insulating the semi-conductor 11 from contacting exterior air, and a heat dissipater 13 is connected with the heat guide surface 112 to dissipate heat.
  • However, the conventional heat dissipating device 10 has disadvantages described below although the cooling surface 12 of the semi-conductor 12 functions to insulate air.
  • 1. The heat guide plate 12 has too large a dimension for wrapping around the semi-conductor 11, so it also absorbs heat at the location not contacting the heat source, consequently cutting down the effectiveness of the semi-conductor 11.
  • 2. The sealing rubber ring 121 does seal up the heat dissipater completely, so air may flow into the heat dissipater 13, and if a gap occurs between the heat dissipater 13 and the sealing rubber ring 121 because of aging or inflating, air still can flow in to let moisture accumulate inside the heat guide plate 12, potentially causing some damage to the circuit of the semi-conductor 11.
    • SUMMARY OF THE INVENTION
  • The purpose of this invention is to offer a heat absorbing device having excellent function of air insulating.
  • The features of the heat absorbing device are a heat converter, a heat semi-conductor, a cool guide plate, and a moisture-proof cap. The heat semi-conductor is placed on the heat converter, and the cool guide plate is placed on the heat semi-conductor. The moisture-proof cap has an accommodating space for receiving the heat converter and the heat semi-conductor, an upper opening for fitting sealingly the cool guide plate, and a combining mouth in the bottom for the combining member of the heat converter to be fitted sealingly in. Then the two ends of the moisture-proof cap combined sealingly with the heat converter and the cool guide plate to keep the heat semi-conductor completely insulated from exterior air. In addition, the heat semi-conductor is directly and evenly connected to a heat source via the cool guide plate, it is boosted up in its efficacy.
    • BRIEF DESCRIPTION OF DRAWINGS
  • This invention will be better understood by referring to the accompanying drawings, wherein
  • FIG. 1 is a cross-sectional view of a conventional heat absorbing device;
  • FIG. 2 is a perspective view of a heat absorbing device in the present invention;
  • FIG. 3 is an exploded perspective view of the heat absorbing device in the present invention; and
  • FIG. 4 is a cross-sectional view of the heat absorbing device in the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • A heat absorbing device in the present invention, as shown in FIGS. 2 and 3, includes a heat converter 20, a heat semi-conductor 30, a cool guide plate 40, an anti-moisture cap 50, a first sealing element 60 and a second sealing element 70.
  • The heat converter 20 is composed of a nearly square main body 21, and the main body 21 consists of a heat absorbing member 22 in an upper portion, and a linking member 23 around its bottom, with a linking hole 24 bored respectively at its four corners for receiving a bolt 25 therein.
  • The heat semi-conductor 30 has a cooling surface 31 and a heat dissipating surface 32 oppositely.
  • The cool guide plate 40 is made of a heat evenly transmitting material, having a stepped projection 41 around its circumference
  • The moisture-proof cap 50 is made of a material transmitting not so much heat, having a recessed accommodating space 51, an upper opening 52, a linking mouth 53 formed in the bottom, an annular edge 54 formed in the linking mouth 53, and a threaded hole 55 formed respectively at four corners of the bottom.
  • The first sealing element 60 is annular, made of a material having sealing function.
  • In order to further understand the structural features, operational technique and expected effect, how to use the invention is to be described below.
  • As shown in FIG. 4, the heat absorbing surface 22 of the heat converter 20 contacts the heat dissipating surface 32 of the semi-conductor 30, and the cooling surface 31 of the heat semi-conductor 30 contacts the cool guide plate 40. Then the moisture-proof cap 50 is covered on the heat converter 20, with the first sealing element 60, the cool guide plate 30 and the heat converter 20 orderly placed in the accommodating space 51. Then the cool guide plate 40 is just fitted in the upper opening 52, and the first element 60 resting around the stepped projection 41 of the cool guide plate 40 fits tightly around the upper opening 52, enabling the stepped projection 41 to tightly contact the moisture-proof cap 50. Meanwhile, the linking member 23 of the heat converter 20 overlaps the annular edge 54 of the moisture-proof cap 50, and the second sealing element 70 is coated between the linking member 23 and the annular edge 54. The second sealing element 70 is a kind of sealing glue or a material having high sealing function. At the same time, the threaded holes 55 of the moisture-proof cap 50 overlap with the linking holes 24 for the bolts 25 to fasten them tightly. Thus the moisture cap 50, the cool guide plate 40 and the heat converter 20 are all sealed airtight, preventing the semi-conductor 30 from contacting exterior air at all.
  • In using, the heat semi-conductor 30 conducts heat, heating up the heat dissipating surface 32 but cutting down the temperature of the cooling surface, with the heat absorbing surface 22 of the heat converter 20 takes off the heat energy produced by the heat dissipating surface 32. Therefore, the cooling plate 40 performs lowering temperature owing to the cooling surface 31, as the cooling surface 31 contacts the cool guide plate 40. Moreover, the cool guide plate 40 is connected to a heat source (not shown), it dissipates heat produced thereby, with the cool guide plate 40 mixes temperature of the heat source with that of the cooling surface 31, with the moisture-proof cap 50 performing insulation, permitting the cooling surface 31 to work with the heat source for stepping up the function of the heat absorbing device in the invention.
  • While the preferred embodiment of the invention have been described above, it will be recognized and understood that various modifications may be made therein and the appended claims are intended to cover all such modifications that may fall within the spirit and scope of the invention.

Claims (8)

1. A heat absorbing device comprising:
a heat converter provided with a main body, said main body having a heat absorbing member formed in an upper portion and a combining member formed around its circumference;
a heat semi-conductor provided with a cooling surface and a heat dissipating surface, said heat dissipating surface contacting said heat absorbing member of said heat converter;
a cool guide plate made of a material possible to evenly conducting heat and contacting said cooling surface of said heat semi-conductor; and
a moisture-proof cap made of a material conducing less heat and provided with a recessed accommodating space for receiving said heat converter and said heat semi-conductor therein, said moisture-proof cap further provided with an upper opening in said recessed accommodating space, said cool guide plate fitted sealingly in said upper opening, said moisture-proof can having a bottom formed with a combining mouth for said combining member of said heat converter fitted sealingly therein.
2. The heat absorbing device as claimed in claim 1, wherein said cool guide plate has its circumference formed with an extended stepped projection, and said extended stepped projection pushes tightly just under an annular wall defining said upper opening of said moisture-proof cap.
3. The heat absorbing device as claimed in claim 1, wherein a first sealing element is deposited between said extended stepped projection of said cool guide plate and said moisture-proof cap.
4. The heat absorbing device as claimed in claim 1, wherein said first sealing element is a sealing rubber ring.
5. The heat absorbing device as claimed in claim 1, wherein said combining mouth of said moisture-proof cap is provided with an extended annular edge, which overlaps sealingly to said combining member of said heat converter.
6. The heat absorbing device as claimed in claim 5, wherein a second sealing element is deposited between said combining member of said heat converter and said annular edge of said moisture-proof cap.
7. The heat absorbing device as claimed in claim 6, wherein said second sealing element is a rubber.
8. The heat absorbing device as claimed in claim 1, wherein said moisture-proof cap is provided with threaded holes of a preset number, and said heat converter is provided with combining holes of the same number as that of said threaded holes of said moisture-proof cap, and said combining holes are aligned with said threaded holes for bolts to fasten them respectively.
US12/146,542 2008-06-26 2008-06-26 Heat absorbing device Abandoned US20090321043A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/146,542 US20090321043A1 (en) 2008-06-26 2008-06-26 Heat absorbing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/146,542 US20090321043A1 (en) 2008-06-26 2008-06-26 Heat absorbing device

Publications (1)

Publication Number Publication Date
US20090321043A1 true US20090321043A1 (en) 2009-12-31

Family

ID=41446000

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/146,542 Abandoned US20090321043A1 (en) 2008-06-26 2008-06-26 Heat absorbing device

Country Status (1)

Country Link
US (1) US20090321043A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140332182A1 (en) * 2011-05-17 2014-11-13 Carrier Corporation Heat Sink For Cooling Power Electronics

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4037270A (en) * 1976-05-24 1977-07-19 Control Data Corporation Circuit packaging and cooling
US4279292A (en) * 1978-09-29 1981-07-21 The United States Of America As Represented By The Secretary Of The Navy Charge coupled device temperature gradient and moisture regulator
US4694119A (en) * 1983-09-07 1987-09-15 Sundstrand Data Control, Inc. Heat shielded memory unit for an aircraft flight data recorder
US6061235A (en) * 1998-11-18 2000-05-09 Hewlett-Packard Company Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management
US6084178A (en) * 1998-02-27 2000-07-04 Hewlett-Packard Company Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
US6198630B1 (en) * 1999-01-20 2001-03-06 Hewlett-Packard Company Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
US6483185B1 (en) * 1998-09-22 2002-11-19 Mitsubishi Materials Corporation Power module substrate, method of producing the same, and semiconductor device including the substrate
US20030057548A1 (en) * 1999-07-15 2003-03-27 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US20030218057A1 (en) * 2000-11-07 2003-11-27 Craig Joseph Electrical bus with associated porous metal heat sink and method of manufacturing same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4037270A (en) * 1976-05-24 1977-07-19 Control Data Corporation Circuit packaging and cooling
US4279292A (en) * 1978-09-29 1981-07-21 The United States Of America As Represented By The Secretary Of The Navy Charge coupled device temperature gradient and moisture regulator
US4694119A (en) * 1983-09-07 1987-09-15 Sundstrand Data Control, Inc. Heat shielded memory unit for an aircraft flight data recorder
US6084178A (en) * 1998-02-27 2000-07-04 Hewlett-Packard Company Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
US6483185B1 (en) * 1998-09-22 2002-11-19 Mitsubishi Materials Corporation Power module substrate, method of producing the same, and semiconductor device including the substrate
US6061235A (en) * 1998-11-18 2000-05-09 Hewlett-Packard Company Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management
US6198630B1 (en) * 1999-01-20 2001-03-06 Hewlett-Packard Company Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
US20030057548A1 (en) * 1999-07-15 2003-03-27 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US20030218057A1 (en) * 2000-11-07 2003-11-27 Craig Joseph Electrical bus with associated porous metal heat sink and method of manufacturing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140332182A1 (en) * 2011-05-17 2014-11-13 Carrier Corporation Heat Sink For Cooling Power Electronics

Similar Documents

Publication Publication Date Title
RU2473006C2 (en) Lighting device with multiple light diodes with safe layout for electric wiring of light-diode array
US8787018B2 (en) Power converting apparatus and capacitor cover thereof
US20120187818A1 (en) Led light bulb equipped with light transparent shell fastening structure
US9581324B2 (en) LED illumination device having a heat sink with a plurality of sets of fins defining air tunnels of different sizes
US9673577B2 (en) Power plug device and the manufacturing method thereof
US20190082557A1 (en) Electrical enclosure with a great heat-dissipation and an ingress protection rating equal or greater than level 65
WO2015035799A1 (en) Device for fixing and protecting capacitor
US20090321043A1 (en) Heat absorbing device
JP6458575B2 (en) Power converter
KR102474123B1 (en) Heat radiation module and lighting apparatus having the same
WO2013084417A1 (en) Power conversion apparatus
US10165708B2 (en) Cooling mechanism used inside gimbal
CN113380669B (en) Intelligent packaging equipment and packaging method for frequency components
US11432440B2 (en) Power conversion apparatus
US7120025B2 (en) Imaging apparatus
CN101319769A (en) Explosion-proof lamp
KR200309470Y1 (en) Cooling-device with thermo-element
CN212298708U (en) High-efficient heat dissipation LED lamp
JP2009099331A (en) Electric component storage structure, and lighting fixture
CN104955293A (en) Electromagnetic device encapsulation shell
CN102221155A (en) Waterproof and dustproof lamp
KR101059959B1 (en) LED lamp with improved breakdown voltage characteristics
JP2008507089A (en) Lighting device
JP6418277B2 (en) lamp
JP2017022152A (en) Power apparatus

Legal Events

Date Code Title Description
AS Assignment

Owner name: JINGWAY TECHNOLOGY CO., LTD, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WANG, FENG-CHANG;REEL/FRAME:021153/0798

Effective date: 20080514

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION