US20100025237A1 - Deposition apparatus for organic electroluminescent display device - Google Patents
Deposition apparatus for organic electroluminescent display device Download PDFInfo
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- US20100025237A1 US20100025237A1 US12/540,864 US54086409A US2010025237A1 US 20100025237 A1 US20100025237 A1 US 20100025237A1 US 54086409 A US54086409 A US 54086409A US 2010025237 A1 US2010025237 A1 US 2010025237A1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Definitions
- An embodiment of this document relates to a deposition apparatus for an organic electroluminescent display device.
- An organic electroluminescent display device is a display device using an organic electroluminescent element in which a light-emitting layer is formed between two electrodes.
- the organic electroluminescent element is an emissive display configured to display an image by driving N ⁇ M organic light-emitting diodes (OLEDs) arranged in a matrix form.
- OLEDs organic light-emitting diodes
- the organic electroluminescent display device may be divided into a passive matrix-type display and an active matrix-type display using thin film transistors.
- the organic electroluminescent element may be fabricated by performing a process of forming wirings and electrodes, a process of forming an insulating layer, a process of depositing an organic material, etc., and then performing an encapsulation process including a process of forming a passivation layer, and so on.
- the process of forming the electrodes, the process of depositing the organic material, etc. are for the most part performed within a vacuum chamber.
- an apparatus such as a mask
- an apparatus such as a plate in which magnets are arranged, is used so that the target substrate is closely adhered to the mask.
- a conventional deposition apparatus requires a scheme capable of solving a problem that, because of a difference in the intensity of magnetism of the magnets arranged in the plate, apparatuses are deformed when the target substrate is attached to or detached from the mask or shadowing is generated because of a weaken force to pull the mask.
- the deposition apparatus comprises a vacuum chamber, a deposition source placed on a bottom within the vacuum chamber, a mask configured to mask a source generated by the deposition source, a target substrate on which the source passing through the mask is deposited, a first plate placed on an upper side within the vacuum chamber, wherein magnets are arranged with them being spaced apart from each other on one side of the first plate, and a second plate placed below the first plate, wherein grooves into which the respective magnets are inserted are formed in the second plate.
- FIG. 1 shows the construction of a deposition apparatus according to an embodiment of this document
- FIGS. 2 and 3 are partially enlarged views of elements shown in FIG. 1 ;
- FIG. 4 shows experimental data according to the arrangement of magnets
- FIGS. 5 to 15 are exemplary views showing the arrangement of magnets every case in FIG. 4 ;
- FIG. 16 is a graph showing the property of MDF according to FIGS. 5 to 8 ;
- FIG. 17 is a graph showing the property of MDF according to FIGS. 9 to 15 ;
- FIG. 18 is a diagram showing deposition pattern data according to the arrangement of magnet polarities
- FIG. 19 is an exemplary view showing the configuration of a mask according to a measurement criterion
- FIG. 20 is an exemplary view showing measurement positions
- FIGS. 21 and 22 are exemplary views showing the arrangement of magnets according to the embodiment of this document.
- a deposition apparatus may comprise a vacuum chamber 110 , a deposition source 120 , a mask 160 , a target substrate 150 , a second plate 140 , and a first plate 130 .
- the deposition source 120 may be placed on the bottom within the vacuum chamber 110 .
- a source S contained within the deposition source 120 may be heated by heating means, etc., and evaporated and sublimated.
- the mask 160 may comprise openings and cutoff units so that the source S, evaporated or sublimated from the deposition source 120 placed under the vacuum chamber 110 , is selectively deposited on the target substrate 150 .
- the number of openings may correspond to the number of subpixels to be deposited on the target substrate 150 , but not limited thereto.
- the mask 160 may further comprise dummy openings for increasing deposition efficiency.
- the above-described mask 160 may be assembled with a frame and then arranged along with the target substrate 150 .
- the mask 160 and the frame may be made of material which reacts on magnetic force.
- the target substrate 150 may comprise a magnetic substrate or material which reacts on magnetic force.
- SUS 430 i.e., Stainless Steel Material (SUS) such as one of materials of magnetic substrates
- SUS Stainless Steel Material
- 36Alloy Invar, 42Alloy, SUS410, or SUS420 may be used as the magnetic substrate.
- elements formed in the target substrate 150 may comprise passive matrix-type or active matrix-type organic electroluminescent elements.
- the first plate 130 is placed at the top within the vacuum chamber 110 , and the magnets 135 spaced apart from each other are arranged on one side of the first plate 130 .
- the first plate 130 may have a yoke shape in order to improve magnetic force.
- the second plate 140 is placed below the first plate 130 . Grooves H into which the respective magnets 135 are inserted are formed in the second plate 140 . The shape of each of the grooves H formed in the second plate 140 may be identical to that of the magnets 135 .
- the second plate 140 functions to support the target substrate 150 pulled by the magnets 135 . If the thickness of the second plate 140 is too thin, the second plate 140 may be deformed too easily. If the thickness of the second plate 140 is too thick, the second plate 140 may not function to pull the mask 160 because the distance between the magnets 135 and the mask 160 is too wide.
- the grooves H into which the respective magnets 135 are inserted are formed in the second plate 140 .
- the grooves H formed in the second plate 140 may only have a size and shape which enable the magnets 135 to be inserted into the magnets 135 .
- cases 1 to 4 show data according to the distance between the magnets
- cases 5 to 11 show data according to the number of magnets.
- MDF magnet detach force
- FIG. 18 is a diagram showing deposition pattern data in the case where the magnets having the N polarity and the S polarity are alternately arranged with them being spaced apart from each other. From the data shown in FIG. 18 , it can be seen that, if the magnets having the N polarity and the S polarity are alternately arranged with them being spaced apart from each other, the shadowing problem can be solved because coalescence between the plates and the mask increases. From the data of FIG. 18 , it can be seen that a case 1 has the best condition.
- the shape of the magnet may have a tetrahedron, a polyhedron, or a cylinder.
- the magnets 135 having opposite polarities are alternately arranged with them being spaced apart from each other.
- force applied to the second plate 140 when the target substrate 150 is detached therefrom is proportional to the number of magnets 135 arranged on the first plate 130 , and the magnetic force of the magnets 135 is related to the arrangement of the magnets. Accordingly, if the arrangement of the magnets 135 is optimized when the target substrate 150 is detached from the second plate 140 , force applied to the second plate 140 can be reduced greatly. Consequently, the second plate 140 and other elements can be prevented from being deformed.
- the magnetic force of the magnets 135 arranged in the first plate 130 has a great effect on the second plate 140 and other elements. Accordingly, when the magnets 135 are arranged, a condition to minimize the MDF and secure surface magnetic force is required.
- first and second magnets having a distance “L 1 ” or “L 2 ” therebetween may be arranged according to the rules corresponding to the length ‘a’ or ‘ 2 a’.
- an SUS 430 substrate was used as the target substrate 150 , and an optimal condition was obtained when the length ‘a’ of the magnet was 10 mm.
- the magnetic force of the magnets 135 arranged in the first plate 130 is concerned with not only the distance between the magnets, but also the polarity between the magnets.
- the magnetic force of the magnets 135 arranged in the first plate 130 is related to the shape of the magnet.
- the MDF is concerned with the shape of the magnet 135 . It was found that, when the shape of the magnet was a polyhedron (i.e., a tetrahedron or more), the strength of magnetic force was strong near the edges of the polyhedron. Accordingly, when the shape of the magnet was close to a regular quadrilateral, the MDF was increased and so stronger force was applied to the elements. However, when the shape of the magnet was a cylinder, force applied to the elements was reduced because the surface area of the magnet was reduced and so the MDF could be reduced when the target substrate 150 was attached to or detached from the mask 160 .
- a polyhedron i.e., a tetrahedron or more
- the magnets 135 arranged on the second plate 140 may have a polyhedron (i.e., a tetrahedron or more) or a cylindrical shape.
- the magnets 135 may have a cylindrical shape because the magnets 135 having the cylindrical shape may have better effects than those of the magnets 135 having the tetrahedron.
- the embodiment of this document is advantageous in that it can provide the deposition apparatus for an organic electroluminescent display device, which is capable of solving the shadowing problem resulting from the hang of the target substrate when the elements placed in the vacuum chamber are aligned or the deformation problem of the elements.
Abstract
An embodiment of this document provides a deposition apparatus for an organic electroluminescent display device, comprising a vacuum chamber, a deposition source placed on a bottom within the vacuum chamber, a mask configured to mask a source generated by the deposition source, a target substrate on which the source passing through the mask is deposited, a first plate placed on an upper side within the vacuum chamber, wherein magnets are arranged with them being spaced apart from each other on one side of the first plate, and a second plate placed below the first plate, wherein grooves into which the respective magnets are inserted are formed in the second plate.
Description
- This application claims the benefit of Korean Patent Application No. 10-2009-0004844 filed on Jan. 21, 2009, which is hereby incorporated by reference.
- 1. Field
- An embodiment of this document relates to a deposition apparatus for an organic electroluminescent display device.
- 2. Related Art
- An organic electroluminescent display device is a display device using an organic electroluminescent element in which a light-emitting layer is formed between two electrodes. The organic electroluminescent element is an emissive display configured to display an image by driving N×M organic light-emitting diodes (OLEDs) arranged in a matrix form. The organic electroluminescent display device may be divided into a passive matrix-type display and an active matrix-type display using thin film transistors.
- The organic electroluminescent element may be fabricated by performing a process of forming wirings and electrodes, a process of forming an insulating layer, a process of depositing an organic material, etc., and then performing an encapsulation process including a process of forming a passivation layer, and so on. The process of forming the electrodes, the process of depositing the organic material, etc. are for the most part performed within a vacuum chamber. Here, in order to deposit material only on a specific portion of a target substrate, an apparatus, such as a mask, is generally used. When the deposition process is performed, an apparatus, such as a plate in which magnets are arranged, is used so that the target substrate is closely adhered to the mask.
- However, a conventional deposition apparatus requires a scheme capable of solving a problem that, because of a difference in the intensity of magnetism of the magnets arranged in the plate, apparatuses are deformed when the target substrate is attached to or detached from the mask or shadowing is generated because of a weaken force to pull the mask.
- An embodiment of this document provides a deposition apparatus for an organic electroluminescent display device. The deposition apparatus comprises a vacuum chamber, a deposition source placed on a bottom within the vacuum chamber, a mask configured to mask a source generated by the deposition source, a target substrate on which the source passing through the mask is deposited, a first plate placed on an upper side within the vacuum chamber, wherein magnets are arranged with them being spaced apart from each other on one side of the first plate, and a second plate placed below the first plate, wherein grooves into which the respective magnets are inserted are formed in the second plate.
- The accompany drawings, which are included to provide a further understanding of this document and are incorporated on and constitute a part of this specification illustrate embodiments of this document and together with the description serve to explain the principles of this document.
-
FIG. 1 shows the construction of a deposition apparatus according to an embodiment of this document; -
FIGS. 2 and 3 are partially enlarged views of elements shown inFIG. 1 ; -
FIG. 4 shows experimental data according to the arrangement of magnets; -
FIGS. 5 to 15 are exemplary views showing the arrangement of magnets every case inFIG. 4 ; -
FIG. 16 is a graph showing the property of MDF according toFIGS. 5 to 8 ; -
FIG. 17 is a graph showing the property of MDF according toFIGS. 9 to 15 ; -
FIG. 18 is a diagram showing deposition pattern data according to the arrangement of magnet polarities; -
FIG. 19 is an exemplary view showing the configuration of a mask according to a measurement criterion; -
FIG. 20 is an exemplary view showing measurement positions; and -
FIGS. 21 and 22 are exemplary views showing the arrangement of magnets according to the embodiment of this document. - Reference will now be made in detail embodiments of this document examples of which are illustrated in the accompanying drawings.
- A specific embodiment of this document is described below with reference to the accompanying drawings.
- Referring to
FIGS. 1 to 3 , a deposition apparatus according to an embodiment of this document may comprise avacuum chamber 110, adeposition source 120, amask 160, atarget substrate 150, asecond plate 140, and afirst plate 130. - The
deposition source 120 may be placed on the bottom within thevacuum chamber 110. A source S contained within thedeposition source 120 may be heated by heating means, etc., and evaporated and sublimated. - The
mask 160 may comprise openings and cutoff units so that the source S, evaporated or sublimated from thedeposition source 120 placed under thevacuum chamber 110, is selectively deposited on thetarget substrate 150. The number of openings may correspond to the number of subpixels to be deposited on thetarget substrate 150, but not limited thereto. For example, themask 160 may further comprise dummy openings for increasing deposition efficiency. Meanwhile, the above-describedmask 160 may be assembled with a frame and then arranged along with thetarget substrate 150. Themask 160 and the frame may be made of material which reacts on magnetic force. - The
target substrate 150 may comprise a magnetic substrate or material which reacts on magnetic force. For example, SUS 430 (i.e., Stainless Steel Material (SUS) such as one of materials of magnetic substrates) may be effectively adhered tomagnets 135 arranged in thefirst plate 130 and functions to shield magnetic force. 36Alloy Invar, 42Alloy, SUS410, or SUS420 may be used as the magnetic substrate. - Meanwhile, elements formed in the
target substrate 150 may comprise passive matrix-type or active matrix-type organic electroluminescent elements. - The
first plate 130 is placed at the top within thevacuum chamber 110, and themagnets 135 spaced apart from each other are arranged on one side of thefirst plate 130. Thefirst plate 130 may have a yoke shape in order to improve magnetic force. - The
second plate 140 is placed below thefirst plate 130. Grooves H into which therespective magnets 135 are inserted are formed in thesecond plate 140. The shape of each of the grooves H formed in thesecond plate 140 may be identical to that of themagnets 135. Thesecond plate 140 functions to support thetarget substrate 150 pulled by themagnets 135. If the thickness of thesecond plate 140 is too thin, thesecond plate 140 may be deformed too easily. If the thickness of thesecond plate 140 is too thick, thesecond plate 140 may not function to pull themask 160 because the distance between themagnets 135 and themask 160 is too wide. Accordingly, in order to prevent the deformation of thesecond plate 140 and maintain magnetic force to the extent that themask 160 may be pulled, the grooves H into which therespective magnets 135 are inserted are formed in thesecond plate 140. Here, the grooves H formed in thesecond plate 140 may only have a size and shape which enable themagnets 135 to be inserted into themagnets 135. - The arrangement of the magnets is described below.
- In experimental data,
cases 1 to 4 show data according to the distance between the magnets, andcases 5 to 11 show data according to the number of magnets. - From the data of the
cases 1 to 4, it can be seen that surface magnetic force decreases when the distance between the magnets increases. It can also be seen that magnet detach force (MDF) to detach the magnets is proportional to the number of the magnets, but is not related to the distance between the magnets. However, the MDF may differ when the magnets are arranged with them being brought in contact with each other. - From the data of the
cases 5 to 11, it can be seen that surface magnetic force increases when the number of magnets increases and the MDF also increases when the number of magnets increases. It can be seen that the MDF increases when the arrangement of the magnets is close to a regular quadrilateral. - It can be seen that a difference between the MDF according to the distance between the magnets and the MDF according to the number of magnets, as in the above-described
cases 1 to 4, has a tendency as shown inFIGS. 16 and 17 . -
FIG. 18 is a diagram showing deposition pattern data in the case where the magnets having the N polarity and the S polarity are alternately arranged with them being spaced apart from each other. From the data shown inFIG. 18 , it can be seen that, if the magnets having the N polarity and the S polarity are alternately arranged with them being spaced apart from each other, the shadowing problem can be solved because coalescence between the plates and the mask increases. From the data ofFIG. 18 , it can be seen that acase 1 has the best condition. Although not shown in the drawing, it was found that in the case where the magnets having either the N polarity or the S polarity were arranged with them being spaced apart from each other, a mask was lifted off because of local polarity formed by the magnetism of the mask, resulting in a severe shadowing problem upon deposition. - A method of arranging the magnets based on the experimental results is described below.
- Referring to
FIGS. 21 and 22 , when themagnets 135 are arranged on one side of thefirst plate 130, the shape of the magnet may have a tetrahedron, a polyhedron, or a cylinder. Here, themagnets 135 having opposite polarities are alternately arranged with them being spaced apart from each other. - According to the above-described experimental data, force applied to the
second plate 140 when thetarget substrate 150 is detached therefrom is proportional to the number ofmagnets 135 arranged on thefirst plate 130, and the magnetic force of themagnets 135 is related to the arrangement of the magnets. Accordingly, if the arrangement of themagnets 135 is optimized when thetarget substrate 150 is detached from thesecond plate 140, force applied to thesecond plate 140 can be reduced greatly. Consequently, thesecond plate 140 and other elements can be prevented from being deformed. - Optimized conditions when the magnets are arranged are described below with reference to the conditions obtained according to the experiments.
- As described above, the magnetic force of the
magnets 135 arranged in thefirst plate 130 has a great effect on thesecond plate 140 and other elements. Accordingly, when themagnets 135 are arranged, a condition to minimize the MDF and secure surface magnetic force is required. - As a result of analyzing the experimental data according to the
cases 1 to 11, it could be seen that, if the magnets are arranged at a distance of ‘a’ to ‘2a’ when the length of the magnet is ‘a’, the MDF and the surface magnetic force can be performed effectively. Thus, assuming that the length of the magnet is ‘a’, first and second magnets having a distance “L1” or “L2” therebetween may be arranged according to the rules corresponding to the length ‘a’ or ‘2a’. In this experiment, an SUS 430 substrate was used as thetarget substrate 150, and an optimal condition was obtained when the length ‘a’ of the magnet was 10 mm. - Meanwhile, this experiment showed that, when the distance between the magnets was ‘a’ or less, excessive force was applied to the elements when the
target substrate 150 was attached to or detached from themask 160 because the number of magnets was too many. From this experiment, it could be also seen that, when the distance between the magnets was ‘2a’ or more, it was difficult to secure a process property because themagnets 135 did not have magnetic force enough to pull themask 160. For the above reasons, when themagnets 135 are arranged in thefirst plate 130, themagnets 135 are arranged at the distance of ‘a’ to ‘2a’ based on the length ‘a’ corresponding to the length of the magnet. - On the other hand, although not shown in the drawing, according to an experiment using an SUS 430 as the
target substrate 150 under the above condition, it was found that, when the thickness of thesecond plate 140 was set to 15 mm, the depth of the groove H into which themagnet 135 would be inserted was set to 12 mm, and the length of the groove H was set to 11 mm in order to realize the magnetic force of 200 G, the deformation of thesecond plate 140 could be reduced and an optimal condition capable of securing magnetic force could be obtained. - As described above, the magnetic force of the
magnets 135 arranged in thefirst plate 130 is concerned with not only the distance between the magnets, but also the polarity between the magnets. - From the analysis result of the experimental data, it was found that, when the
magnets 135 were arranged in the lattice structure of the N polarity and the S polarity, the shadowing problem resulting from themask 160 could be solved because coalescence between the elements arranged within thevacuum chamber 110 was increased, thereby being capable of improving deposition efficiency. However, it was found that, when themagnets 135 having either only the N polarity or the S polarity were arranged in thefirst plate 130, themask 160 was lift off because of magnetic force locally formed by the magnetism of themask 160 and so the shadowing problem resulting from themask 160 became worse, thereby degrading deposition efficiency. For the above reasons, themagnets 135 having opposite polarities are alternately arranged in thefirst plate 130 with them being spaced apart from each other. - As described above, the magnetic force of the
magnets 135 arranged in thefirst plate 130 is related to the shape of the magnet. - From the analysis result of the above experimental data, it was found that the MDF is concerned with the shape of the
magnet 135. It was found that, when the shape of the magnet was a polyhedron (i.e., a tetrahedron or more), the strength of magnetic force was strong near the edges of the polyhedron. Accordingly, when the shape of the magnet was close to a regular quadrilateral, the MDF was increased and so stronger force was applied to the elements. However, when the shape of the magnet was a cylinder, force applied to the elements was reduced because the surface area of the magnet was reduced and so the MDF could be reduced when thetarget substrate 150 was attached to or detached from themask 160. Accordingly, themagnets 135 arranged on thesecond plate 140 may have a polyhedron (i.e., a tetrahedron or more) or a cylindrical shape. However, themagnets 135 may have a cylindrical shape because themagnets 135 having the cylindrical shape may have better effects than those of themagnets 135 having the tetrahedron. - As described above, the embodiment of this document is advantageous in that it can provide the deposition apparatus for an organic electroluminescent display device, which is capable of solving the shadowing problem resulting from the hang of the target substrate when the elements placed in the vacuum chamber are aligned or the deformation problem of the elements.
- The foregoing embodiments and advantages are merely exemplary and are not to be construed as limiting this document. The present teaching can be readily applied to other types of apparatuses. The description of the foregoing embodiments is intended to be illustrative, and not to limit the scope of the claims. Many alternatives, modifications, and variations will be apparent to those skilled in the art. In the claims, means-plus-function clauses are intended to cover the structures described herein as performing the recited function and not only structural equivalents but also equivalent structures. Moreover, unless the term “means” is explicitly recited in a limitation of the claims, such limitation is not intended to be interpreted under 35 USC 112(6).
Claims (10)
1. A deposition apparatus for an organic electroluminescent display device, comprising:
a vacuum chamber;
a deposition source placed on a bottom within the vacuum chamber;
a mask configured to mask a source generated by the deposition source;
a target substrate on which the source passing through the mask is deposited;
a first plate placed on an upper side within the vacuum chamber, wherein magnets are arranged with them being spaced apart from each other on one side of the first plate; and
a second plate placed below the first plate, wherein grooves into which the respective magnets are inserted are formed in the second plate.
2. The deposition apparatus of claim 1 , wherein when a length of the magnet is ‘a’, the magnets are arranged at a distance of ‘a’ to ‘2a’.
3. The deposition apparatus of claim 2 , wherein the length of the magnet ‘a’ is 10 mm.
4. The deposition apparatus of claim 1 , wherein the magnets having opposite polarities are alternately arranged.
5. The deposition apparatus of claim 1 , wherein a shape of each of the magnets is a cylinder.
6. The deposition apparatus of claim 1 , wherein a shape of each of the magnets is a tetrahedron.
7. The deposition apparatus of claim 1 , wherein a shape of each of the magnets is a polyhedron.
8. The deposition apparatus of claim 1 , wherein a shape of each of the grooves is identical to that of each of the magnets.
9. The deposition apparatus of claim 1 , wherein the target substrate comprises a magnetic substrate.
10. The deposition apparatus of claim 1 , wherein in the case where the target substrate is made of SUS 430, a thickness of the second plate is 15 mm, a depth of the groove is 12 mm, and a length of the groove is 11 mm.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR10-2009-0004844 | 1999-01-21 | ||
KR1020090004844A KR101303447B1 (en) | 2009-01-21 | 2009-01-21 | Evaporation Apparatus For Organic Light Emitting Display |
Publications (1)
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US20100025237A1 true US20100025237A1 (en) | 2010-02-04 |
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ID=41607217
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Application Number | Title | Priority Date | Filing Date |
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US12/540,864 Abandoned US20100025237A1 (en) | 1999-01-21 | 2009-08-13 | Deposition apparatus for organic electroluminescent display device |
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US (1) | US20100025237A1 (en) |
KR (1) | KR101303447B1 (en) |
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US20150083045A1 (en) * | 2013-09-25 | 2015-03-26 | Samsung Display Co., Ltd. | Mask fixing device and deposition apparatus having the same |
US9016234B2 (en) | 2011-02-14 | 2015-04-28 | Samsung Display Co., Ltd. | Mask holding device capable of changing magnetic means and deposition equipment using the same |
US20150155193A1 (en) * | 2013-12-02 | 2015-06-04 | Chih-Hsun Hsu | Electrostatic chuck with variable pixelated magnetic field |
JP2016003386A (en) * | 2014-06-19 | 2016-01-12 | 株式会社システム技研 | Deposition holder |
US20160042852A1 (en) * | 2014-08-05 | 2016-02-11 | Samsung Display Co., Ltd. | Magnet plate assembly, deposition apparatus including the magnet plate assembly, and deposition method using the magnet plate assembly |
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Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4198283A (en) * | 1978-11-06 | 1980-04-15 | Materials Research Corporation | Magnetron sputtering target and cathode assembly |
US4200515A (en) * | 1979-01-16 | 1980-04-29 | The International Nickel Company, Inc. | Sintered metal powder-coated electrodes for water electrolysis prepared with polysilicate-based paints |
US4486287A (en) * | 1984-02-06 | 1984-12-04 | Fournier Paul R | Cross-field diode sputtering target assembly |
US4526643A (en) * | 1983-03-24 | 1985-07-02 | Tokyo Shibaura Denki Kabushiki Kaisha | Dry etching apparatus using reactive ions |
US5527396A (en) * | 1992-06-30 | 1996-06-18 | Canon Kabushiki Kaisha | Deposited film forming apparatus |
JPH1041069A (en) * | 1996-04-18 | 1998-02-13 | Toray Ind Inc | Manufacture of organic electroluminescent |
US6132576A (en) * | 1997-09-05 | 2000-10-17 | Nordiko Limited | Vacuum sputtering apparatus |
US20020046945A1 (en) * | 1999-10-28 | 2002-04-25 | Applied Materials, Inc. | High performance magnetron for DC sputtering systems |
US20040142108A1 (en) * | 2002-12-03 | 2004-07-22 | Mitsuro Atobe | Mask vapor deposition method, mask vapor deposition system, mask, process for manufacturing mask, apparatus for manufacturing display panel, display panel, and electronic device |
US20050260017A1 (en) * | 2004-05-18 | 2005-11-24 | Matsushita Electric Industrial Co., Ltd. | Fixing apparatus, image forming apparatus, wire winding apparatus and method for producing magnetic excitation coil |
US20060207873A1 (en) * | 2005-03-18 | 2006-09-21 | Applied Materials, Inc. | Split magnet ring on a magnetron sputter chamber |
US20070007130A1 (en) * | 2005-07-11 | 2007-01-11 | Heraeus, Inc. | Enhanced magnetron sputtering target |
WO2008100139A1 (en) * | 2007-02-13 | 2008-08-21 | Fujifilm Manufacturing Europe B.V. | Substrate plasma treatment using magnetic mask device |
US20090277779A1 (en) * | 2008-05-12 | 2009-11-12 | Canon Anelva Corporation | Magnetic field generating apparatus, magnetic field generating method, sputtering apparatus, and method of manufacturing device |
US7718006B2 (en) * | 2005-05-16 | 2010-05-18 | Seiko Epson Corporation | Mask holding structure, film forming method, electro-optic device manufacturing method, and electronic apparatus |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101146978B1 (en) * | 2005-05-14 | 2012-05-23 | 삼성모바일디스플레이주식회사 | Substrate for EL device and method for fabricationg EL device using the same |
KR101169054B1 (en) * | 2005-10-13 | 2012-07-26 | 엘지디스플레이 주식회사 | Apparatus for fabricating organic electro luminescence display device |
-
2009
- 2009-01-21 KR KR1020090004844A patent/KR101303447B1/en active IP Right Grant
- 2009-08-13 US US12/540,864 patent/US20100025237A1/en not_active Abandoned
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4198283A (en) * | 1978-11-06 | 1980-04-15 | Materials Research Corporation | Magnetron sputtering target and cathode assembly |
US4200515A (en) * | 1979-01-16 | 1980-04-29 | The International Nickel Company, Inc. | Sintered metal powder-coated electrodes for water electrolysis prepared with polysilicate-based paints |
US4526643A (en) * | 1983-03-24 | 1985-07-02 | Tokyo Shibaura Denki Kabushiki Kaisha | Dry etching apparatus using reactive ions |
US4486287A (en) * | 1984-02-06 | 1984-12-04 | Fournier Paul R | Cross-field diode sputtering target assembly |
US5527396A (en) * | 1992-06-30 | 1996-06-18 | Canon Kabushiki Kaisha | Deposited film forming apparatus |
JPH1041069A (en) * | 1996-04-18 | 1998-02-13 | Toray Ind Inc | Manufacture of organic electroluminescent |
US6132576A (en) * | 1997-09-05 | 2000-10-17 | Nordiko Limited | Vacuum sputtering apparatus |
US20020046945A1 (en) * | 1999-10-28 | 2002-04-25 | Applied Materials, Inc. | High performance magnetron for DC sputtering systems |
US20040142108A1 (en) * | 2002-12-03 | 2004-07-22 | Mitsuro Atobe | Mask vapor deposition method, mask vapor deposition system, mask, process for manufacturing mask, apparatus for manufacturing display panel, display panel, and electronic device |
US20050260017A1 (en) * | 2004-05-18 | 2005-11-24 | Matsushita Electric Industrial Co., Ltd. | Fixing apparatus, image forming apparatus, wire winding apparatus and method for producing magnetic excitation coil |
US20060207873A1 (en) * | 2005-03-18 | 2006-09-21 | Applied Materials, Inc. | Split magnet ring on a magnetron sputter chamber |
US7718006B2 (en) * | 2005-05-16 | 2010-05-18 | Seiko Epson Corporation | Mask holding structure, film forming method, electro-optic device manufacturing method, and electronic apparatus |
US20070007130A1 (en) * | 2005-07-11 | 2007-01-11 | Heraeus, Inc. | Enhanced magnetron sputtering target |
WO2008100139A1 (en) * | 2007-02-13 | 2008-08-21 | Fujifilm Manufacturing Europe B.V. | Substrate plasma treatment using magnetic mask device |
US20100147794A1 (en) * | 2007-02-13 | 2010-06-17 | Fujifilm Manufacturing Europe B.V. | Substrate plasma treatment using magnetic mask device |
US20090277779A1 (en) * | 2008-05-12 | 2009-11-12 | Canon Anelva Corporation | Magnetic field generating apparatus, magnetic field generating method, sputtering apparatus, and method of manufacturing device |
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US9016234B2 (en) | 2011-02-14 | 2015-04-28 | Samsung Display Co., Ltd. | Mask holding device capable of changing magnetic means and deposition equipment using the same |
JP2015021142A (en) * | 2013-07-16 | 2015-02-02 | 株式会社システム技研 | Lock member and mask holder for substrate film deposition process |
US20150083045A1 (en) * | 2013-09-25 | 2015-03-26 | Samsung Display Co., Ltd. | Mask fixing device and deposition apparatus having the same |
US20150155193A1 (en) * | 2013-12-02 | 2015-06-04 | Chih-Hsun Hsu | Electrostatic chuck with variable pixelated magnetic field |
US10460968B2 (en) * | 2013-12-02 | 2019-10-29 | Applied Materials, Inc. | Electrostatic chuck with variable pixelated magnetic field |
JP2016003386A (en) * | 2014-06-19 | 2016-01-12 | 株式会社システム技研 | Deposition holder |
US20160042852A1 (en) * | 2014-08-05 | 2016-02-11 | Samsung Display Co., Ltd. | Magnet plate assembly, deposition apparatus including the magnet plate assembly, and deposition method using the magnet plate assembly |
US9583245B2 (en) * | 2014-08-05 | 2017-02-28 | Samsung Display Co., Ltd. | Magnet plate assembly, deposition apparatus including the magnet plate assembly, and deposition method using the magnet plate assembly |
KR20160117797A (en) * | 2015-03-31 | 2016-10-11 | 삼성디스플레이 주식회사 | Apparatus for evaporation |
KR102393204B1 (en) | 2015-03-31 | 2022-05-02 | 삼성디스플레이 주식회사 | Apparatus for evaporation |
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KR101303447B1 (en) | 2013-09-05 |
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