US20100075548A1 - Compliant pin for retaining and electrically connecting a shield with a connector assembly - Google Patents
Compliant pin for retaining and electrically connecting a shield with a connector assembly Download PDFInfo
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- US20100075548A1 US20100075548A1 US12/236,131 US23613108A US2010075548A1 US 20100075548 A1 US20100075548 A1 US 20100075548A1 US 23613108 A US23613108 A US 23613108A US 2010075548 A1 US2010075548 A1 US 2010075548A1
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- United States
- Prior art keywords
- pin
- cavity
- beams
- longitudinal plane
- connector assembly
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
- H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
- H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
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- Coupling Device And Connection With Printed Circuit (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
Description
- The subject matter herein generally relates to electrical connectors and, more particularly, to compliant pins for electrical connectors.
- Known Eye-Of-Needle (“EON”) pins are used to mechanically and electrically connect shields in connector assemblies with at least one of another component of the connector assembly and a substrate. For example, known EON pins are used to electrically connect shields with the electric ground of a circuit board and/or a conductor that is electrically connected to the electric ground of the circuit board. The EON pins are press-fit into cavities in the circuit board and/or another component in the connector assembly. The EON pins include an approximately oval shaped opening enclosed by outwardly bent beams of the EON pins. The EON pins are press-fit into cavities by applying an insertion force on the EON pins in a loading direction directed into the cavities. Application of the insertion force on the EON pins in the loading direction forces the EON pins into the cavities. As the EON pins are forced into the cavities, the beams are bent toward each other. The beams engage the inner surface of the cavity to electrically and mechanically couple the pin with the circuit board and/or component in the connector assembly.
- These EON pins are relatively large when compared to the size and dimensions of other known signal pins used in the same connector assemblies. Moreover, these EON pins require relatively large insertion forces when compared to the structural integrity of the EON pins. For example, the insertion forces required to press-fit the EON pins into the cavities frequently cause the EON pins to buckle if the EON pins are not perfectly aligned with the cavities.
- In one embodiment, a compliant pin is configured to be press-fit into a cavity of at least one of a connector assembly and a substrate to retain the pin in the cavity. The pin includes a neck, a plurality of compliant beams, and an insertion tip. The neck interconnects the pin with the connector assembly. The beams are configured to engage an inner surface of the cavity to retain the pin in the cavity. The beams are arranged side-to-side and project along a longitudinal plane in a loading direction. The beams have arcuate portions that are arched in different directions transverse to the longitudinal plane. The arcuate portions are shaped to deflect toward the longitudinal plane without substantially engaging one another. The insertion tip interconnects the ends of the beams.
- In another embodiment, a connector assembly includes a contact module assembly and a shield. The contact module assembly includes a lead frame that has a cavity and is configured to electrically connect the connector assembly with an electric ground. The shield has a compliant pin press-fit into the cavity to retain the shield with respect to the lead frame and to electrically connect the shield with the electric ground. The pin includes a neck, a plurality of compliant beams and an insertion tip. The neck interconnects the pin with the shield. The beams are configured to engage an inner surface of the cavity to retain the pin in the cavity. The beams are arranged side-to-side and project along a longitudinal plane in a loading direction. The beams have arcuate portions that are arched in different directions transverse to the longitudinal plane. The arcuate portions arc shaped to deflect toward the longitudinal plane without substantially engaging one another. The insertion tip interconnects the ends of the beams.
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FIG. 1 is a perspective view of an electrical connector assembly according to one embodiment. -
FIG. 2 is an exploded view of the connector assembly shown inFIG. 1 . -
FIG. 3 is an assembled view of a contact module assembly shown inFIG. 2 with an example shield also shown inFIG. 2 affixed thereto. -
FIG. 4 is a perspective view of a compliant pin shown inFIG. 2 prior to the pin being press-fit into a lead frame shown inFIG. 2 according to one embodiment. -
FIG. 5 illustrates a portion of the lead frame shown inFIG. 2 and a dielectric body also shown inFIG. 2 . -
FIG. 6 is a side elevational view of the pin shown inFIG. 2 prior to loading the pin into a cavity shown inFIG. 5 . -
FIG. 7 is a side elevational view of the pin shown inFIG. 2 after being loaded into the cavity shown inFIG. 5 . -
FIG. 8 is a partial cross sectional view of a plurality of beams shown inFIG. 4 after the pin shown inFIG. 2 is press-fit into the cavity shown inFIG. 5 taken along line 8-8 inFIG. 7 . -
FIG. 1 is a perspective view of anelectrical connector assembly 100 according to one embodiment. While theconnector assembly 100 is described herein with particular reference to a backplane receptacle connector, it is to be understood that the benefits herein described are also applicable to other connectors in alternative embodiments. The following description is therefore provided for purposes of illustration, rather than limitation, and is but one potential application of the subject matter herein. Theconnector assembly 100 includes adielectric housing 102 having aforward mating end 104 that includes ashroud 106 having amating interface 108 at themating end 104. A plurality of mating contacts 200 (shown inFIG. 2 ), such as, for example, contacts within contact cavities I 10, are provided proximate to themating interface 108 and are configured to receive corresponding mating contacts (not shown) from a mating connector (not shown). Theshroud 106 includes anupper surface 112 and alower surface 114 betweenopposed sides lower surfaces sides forward edge portion 120. Analignment rib 122 is formed on theupper surface 112 andlower surface 114. Theforward edge portion 120 and thealignment ribs 122 cooperate to bring theconnector assembly 100 into alignment with the mating connector during the mating process so that the contacts in the mating connector are received in thecontact cavities 110 without damage. -
FIG. 2 is an exploded view of theconnector assembly 100. As shown inFIG. 2 , thehousing 102 also includes a rearwardly extendinghood 202. A plurality ofcontact module assemblies 204 are received in thehousing 102 from arearward end 206. Thecontact module assemblies 204 define aconnector mounting interface 208. Theconnector mounting interface 208 includes a plurality ofmounting contacts 220, such as, but not limited to, pin contacts, that are configured to be mounted to a substrate (not shown), such as, but not limited to, a circuit board. Themounting contacts 220 include ground and signal contacts. In one embodiment, themounting interface 208 is substantially perpendicular to themating interface 108 such that theelectrical connector assembly 100 interconnects electrical components that are substantially at a right angle to one another. Thehousing 102 may hold two or more different types ofcontact module assemblies 204, such as, but not limited to, contact module assemblies 204A, 204B. Alternatively, thehousing 102 may hold only a single type ofcontact module assembly 204, such as, but not limited to, any of the contact module assemblies 204A, 204B. - In an example embodiment, each of the
contact module assemblies 204 includes alead frame 216 that is partially housed in adielectric body 218. As illustrated inFIG. 2 , thelead frame 216 is enclosed within thebody 218, but is at least partially exposed by thebody 218 in certain areas. In one or more embodiments, thebody 218 is manufactured using an over-molding process. During the molding process, thelead frame 216 is encased in a dielectric material, which forms thebody 218. Themating contacts 200 andmounting contacts 220 extend from thebody 218 and thelead frame 216. Thecontact module assemblies 204 include ashield 212 that extends along one side thereof. Optionally, theshield 212 may define a ground plane for the respectivecontact module assembly 204. In the illustrated embodiment, theshield 212 includes a plurality ofcompliant pins 214 that electrically and mechanically connects to thelead frame 216. Optionally, theshield 212 may be used to provide shielding between adjacentcontact module assemblies 204. -
FIG. 3 is an assembled view of the contact module assembly 204A (shown inFIG. 2 ), with anexample shield 212 affixed thereto. WhileFIG. 3 illustrates the contact module assembly 204A, the contact module assembly 204B (shown inFIG. 2 ) also may include asimilar shield 212. Themating contacts 200 of the contact module assembly 204A include a plurality of conductors, including both ground and signal conductors (identified inFIG. 3 with a G for ground conductors or an S for signal conductors). The ground and signal conductors G, S extend at least partially into the contact module assembly 204A. During assembly, theshield 212 is mounted to the contact module assembly 204A. The compliant pins 214 of theshield 212 are electrically and mechanically connected to the ground conductors G of the mating and mountingcontacts shield 212 is electrically connected to less than all of the ground conductors G. When installed, theshield 212 defines a ground plane that is oriented parallel to, but in a non-coplanar relation with, the lead frame plane. In one embodiment, when theshield 212 is installed, theshield 212 at least partially covers each of the ground and signal conductors G, S of thelead frame 100. Theshield 212 also is electrically connected with one or more of the ground conductors G. The ground conductors G are electrically connected to an electrical ground of the substrate (not shown) to which the connector assembly 100 (shown inFIG. 1 ) is mounted and/or an electrical ground of the mating connector (not shown) that mates with theconnector assembly 100. As a result, theshield 212 may effectively shield the signal conductors S from an adjacent contact module assembly 204B (shown inFIG. 2 ) when the contact module assemblies 204A, 204B are assembled within thehousing 102. -
FIG. 4 is a perspective view of thecompliant pin 214 prior to thepin 214 being press-fit into thelead frame 216 shown inFIG. 2 according to one embodiment. Thecompliant pin 214 and shield 212 include, or are formed from, a conductive material such as a metal material. For example, thecompliant pin 214 and shield 212 may be homogeneously formed with one another from a common piece of conductive metal. In one embodiment, thepin 214 and theshield 212 are stamped and formed from a common sheet of metal. Thepin 214 and shield 212 may be coated with a conductive material, such as a conductive plating. - The
pin 214 is coupled with theshield 212 of the connector assembly 100 (shown inFIG. 1 ) by aneck 400. In the illustrated embodiment, theneck 400 is bent so that alongitudinal axis 416 of thepin 214 is approximately perpendicular to theshield 212. Alternatively, theneck 400 may be bent so that thelongitudinal axis 416 is not perpendicular to theshield 212. For example, thelongitudinal axis 416 may be parallel to theshield 212. - A plurality of
beams neck 400 and interconnects theneck 400 with aninsertion tip 406. Thebeams upper ends longitudinal plane 444 of thepin 214. The upper ends 436, 438 are interconnected by theneck 400 and the lower ends 440, 442 are interconnected by theinsertion tip 406. Thelongitudinal axis 416 of thepin 214 is disposed in thelongitudinal plane 444. In the illustrated embodiment, thelongitudinal plane 444 is transverse to theshield 212. For example, thelongitudinal plane 444 is not parallel to theshield 212 inFIG. 4 . In one embodiment, thelongitudinal plane 444 is transverse to theshield 212 by being disposed at an acute angle with respect to theshield 212. In another embodiment, thelongitudinal plane 444 is transverse to theshield 212 by being disposed approximately perpendicular to theshield 212. Alternatively, thepin 214 may be coupled to theshield 212 such that thelongitudinal plane 444 is not transverse to theshield 212. For example, thelongitudinal plane 444 may be parallel to theshield 212. - The
beams beams longitudinal plane 444 of thepin 214 in opposing directions. For example, thebeams different directions longitudinal plane 444 in the illustrated embodiment. The arcuate shape of thebeams FIG. 6 ) of thebeams FIG. 4 , theleft beam 402 is arched in onedirection 408 and theright beam 404 is arched in adifferent direction 410. In one embodiment, thedirections directions directions directions left beam 402 may be arched toward thedirection 410 and theright beam 404 may be arched toward theother direction 408. Thebeams beams longitudinal plane 444 indifferent beam planes longitudinal plane 444 in the illustrated embodiment. For example, the beam planes 412, 414 may be disposed at one or more acute angles with respect to thelongitudinal plane 444 or may be disposed approximately perpendicular to thelongitudinal plane 444. In the illustrated embodiment, beams 402, 404 are separated from one another by aseparation gap 422 that extends approximately perpendicular to the beam planes 412, 414 and along thelongitudinal plane 444 such that thebeams - The
neck 400 has aneck width 424 along thelongitudinal plane 444 that is greater than abeams width 426 of thebeams longitudinal plane 444 in the illustrated embodiment. For example, theneck width 424 between opposing neck sides 428, 430 of theneck 400 in thelongitudinal plane 444 is larger than thebeams width 426 betweenouter surfaces beams longitudinal plane 444. Providing theneck 400 with agreater neck width 424 than thebeams width 426 of thebeams pin 214 so as to reduce the possibility of thepin 214 buckling when thepin 214 is press-fit into a cavity 500 (shown inFIG. 5 ). - An
inner surface 418 of thepin 214 defines anopening 420 between thebeams inner surface 418 may define the approximately oval-shapedopening 420 in thelongitudinal plane 444 shown inFIG. 4 . Theopening 420 may have a different shape in another embodiment and/or in a different plane. Theopening 420 extends in thelongitudinal plane 444 between theneck 400 and theinsertion tip 406 and separates thebeams separation gap 422 defines the width of theopening 420 in thelongitudinal plane 444. - The
insertion tip 406 includes a pointed shape that is pointed along thelongitudinal axis 416 of thepin 214. The pointed shape of theinsertion tip 406 can reduce the force required to load thepin 214 into a cavity 500 (shown inFIG. 5 ) in the lead frame 216 (shown inFIG. 2 ). Theinsertion tip 406 projects away from theneck 400 along thelongitudinal plane 444 in the illustrated embodiment. -
FIG. 5 illustrates a portion of thelead frame 216 and thedielectric body 218 shown inFIG. 2 according to one embodiment. Thelead frame 216 extends in a plane that is transverse to the pin 214 (shown inFIG. 2 ) in one embodiment. For example, atop surface 508 of thelead frame 216 may be disposed approximately perpendicular to, or at an acute angle with respect to, the longitudinal plane 444 (shown inFIG. 4 ) of thepin 214. Thelead frame 216 includes a plurality ofcavities 500 that are each shaped to receive thepins 214. Thepins 214 are press-fit into thecavities 500 to mechanically secure and retain the shield 212 (shown inFIG. 2 ) with respect to thelead frame 216. Thedielectric body 218 includes a plurality ofaccess openings 502 located over thecavities 500. Theaccess openings 502 are positioned to permit thepins 214 to be loaded into thecavities 500 so that thedielectric body 218 is located between theshield 212 and thelead frame 216 when the connector assembly 100 (shown inFIG. 1 ) is assembled. As described below, thepins 214 are press-fit into thecavities 500 to mechanically and electrically couple theshield 212 with thelead frame 216. Thecavities 500 may be formed in thelead frame 216 such that an inner surface 616 (shown inFIG. 6 ) of thecavities 500 is electrically connected with thelead frame 216 and one or more ground conductors G. For example, thelead frame 216 may include, or be formed from a conductive material with thecavities 500 exposing an inner conductive portion of thelead frame 216. Alternatively, the inner surface 616 (shown inFIG. 6 ) of eachcavity 500 may include, or be at least partially coated with, a conductive material. Mounting theshield 212 to thelead frame 216 using thepins 214 can electrically connect theshield 212 to an electric ground of thelead frame 216. - The
cavities 500 define a polygon-shapedopening 506 in thetop surface 508 of thelead frame 216 in one embodiment. For example, each of thecavities 500 inFIG. 5 defines a rectangular shapedopening 506 in thelead frame 216. Alternatively, thecavities 500 may define a different shapedopening 506 or a polygon-shapedopening 506 that is a polygon shape other than a rectangle. Theopenings 506 have awidth 510 that is greater than aheight 504 in the illustrated embodiment. For example, thewidth 510 of theopenings 506 may be approximately 0.6 millimeters and theheight 504 may be approximately 0.4 millimeters. In one embodiment, thewidth 510 andheight 504 of theopenings 506 are smaller than the dimensions of openings (not shown) in known lead frames (not shown) that receive pins (not shown) to electrically and mechanically connect a shield (not shown) with the lead frame. Reducing the size of theopenings 506 can reduce the pitch of the pins 214 (shown inFIG. 2 ) that are press-fit into thecavities 500. For example, reducing the size of theopenings 506 can allow for thecavities 500 and thepins 214 to be provided closer together than in known connector assemblies. Reducing the size of theopenings 506 also can reduce the amount of conductive material that surrounds eachopening 506. For example, reducing the dimensions of theopenings 506 can reduce the amount of conductive material that is coated on thelead frame 216 around and/or in thecavities 500. -
FIG. 6 is a side elevational view of thepin 214 prior to loading thepin 214 into thecavity 500 according to one embodiment. Thelead frame 216 anddielectric body 218 are shown in cross-sectional view inFIG. 6 . Additionally, thepin 214 inFIG. 6 is presented as though viewed from a direction that is transverse to the beam planes 412, 414 (shown inFIG. 4 ) and is along the longitudinal plane 444 (shown inFIG. 4 ). Thelongitudinal plane 444 may be represented by thelongitudinal axis 416 as shown inFIG. 6 . Thepin 214 is loaded into thecavity 500 in aloading direction 608. Theloading direction 608 is approximately parallel to thelongitudinal axis 416 and along thelongitudinal plane 444 of thepin 214 in one embodiment. - As described above, the
beams directions 408, 410 (shown inFIG. 4 ). In the illustrated embodiment, thebeams opening 600 between thebeams beams longitudinal axis 416 and along the longitudinal plane 444 (shown inFIG. 4 ) of thepin 214. For example, theopening 600 is defined in a plane that is approximately parallel to the beam planes 412, 414 (shown inFIG. 4 ) and transverse to thelongitudinal plane 444. Each of thebeams angled surfaces contact surface 606 between the lower and upperangled surfaces pin 214 is loaded into thecavity 500 in theloading direction 608, the lowerangled surface 602 of eachbeam upper edge 610 of thecavity 500. Theupper edge 610 of thecavity 500 is the edge of the opening 506 (shown inFIG. 5 ) defined by thecavity 500. Adepth 612 of thebeams beams FIG. 4 ). Thedepth 612 of thebeams inner dimension 614 of thecavity 500. Theinner dimension 614 is the distance between opposing sides of aninner surface 616 of thecavity 500 in a direction that is parallel to the direction in which thedepth 612 is measured. -
FIG. 7 is a side elevational view of thepin 214 after being loaded into thecavity 500 according to one embodiment. In a manner similar toFIG. 6 ,FIG. 7 presents thelead frame 216 anddielectric body 218 in cross-sectional view and thepin 214 as though viewed from a direction that is transverse to the beam planes 412, 414 and is along thelongitudinal plane 444 as shown inFIG. 4 . The lowerangled surfaces 602 of thebeams upper edge 610 of thecavity 500 as thepin 214 is press-fit into thecavity 500 along theloading direction 608. Thebeams deflection directions pin 214 is press-fit into thecavity 500. For example, as described above and shown inFIG. 4 , theleft beam 402 is arched along thedirection 408 and theright beam 404 is arched along thedifferent direction 410. Pressing thepin 214 into thecavity 500 causes thebeams FIG. 4 ) indeflection directions beams longitudinal plane 444. In one embodiment, thedeflection directions deflection directions deflection directions deflection direction 700 of thebeam 402 is substantially opposite to thedirection 408 in which thebeam 402 is arched in the beam plane 412 (shown inFIG. 4 ) and thedeflection direction 702 of thebeam 404 is substantially opposite to thedirection 410 in which thebeam 404 is arched in the beam plane 414 (shown inFIG. 4 ). - Once the
pin 214 is press-fit into thecavity 500, the contact surfaces 606 of thebeams inner surface 616 and theupper edge 610 of thecavity 500 to retain thepin 214 in thecavity 500, and thus secure theshield 212 in position with respect to thelead frame 216. The contact surfaces 606 engage one or more of theinner surface 616 and theupper edge 610 to electrically connect thepin 214 and thelead frame 216. - With additional reference to
FIG. 4 , thebeams separation gap 422 prior to, during and after thepin 214 is press-fit into thecavity 500 in one embodiment. Thebeams beams beams deflection directions inner surface 418 of thepin 214 that are located proximate to thebeams beams cavity 500 such that thebeams greatest separation gap 422 in thelongitudinal plane 444 between thebeams pin 214 is press-fit into thecavity 500. For example, the initial width of theopening 420 may not substantially change after thepin 214 is press-fit into thecavity 500. In another example, theopening 420 separates thebeams neck 400 and theinsertion tip 406 before and after thepin 214 is press-fit into thecavity 500 and thebeams directions - The
beams pin 214 in theloading direction 608 to press-fit thepin 214 into thecavity 500. For example, thebeams pin 214 is press-fit into thecavity 500 to avoid requiring a loading force that would cause thepin 214 to buckle if thepin 214 is misaligned with respect to thecavity 500. In another example, the loading force that is applied to thepin 214 in theloading direction 608 to press-fit thepin 214 in thecavity 500 is reduced over known compliant pins. Reducing the amount of loading force that is required to press-fit thepin 214 into thecavity 500 can reduce the chances of thepin 214 buckling. For example, as the amount of insertion force that is required to press-fit a known pin (not shown) into a known cavity (not shown) increases, the pin is more likely to buckle. Conversely, as the amount of insertion force that is required to press-fit thepin 214 is reduced over known pins, thepin 214 is less likely to buckle when loaded into thecavity 500. - Keeping the
beams pin 214 is press-fit into thecavity 500 can prevent parts of thebeams pin 214. For example, a conductive plating on thepin 214 may be prevented from being skived from thebeams beams pin 214 into thecavity 500. In doing so, at least some of the conductive plating on thebeams pin 214, in one embodiment. - In the illustrated embodiment, the
beams deflection directions pin 214 is loaded into thecavity 500 sufficiently far so that the opening 600 (shown inFIG. 6 ) is closed in a plane that is approximately parallel to the beam planes 412, 414 and transverse to thelongitudinal plane 444. For example, theopening 600 that is visible from a direction that is transverse to the beam planes 412, 414 (shown inFIG. 4 ) prior to press-fitting thepin 214 into thecavity 500 may no longer be visible from this same direction after thepin 214 is loaded into thecavity 500. Theopening 600 may no longer be visible due to the biasing of thebeams directions opening 600 when viewed from the direction transverse to the beam planes 412,414. -
FIG. 8 is a partial cross-sectional view of thebeams FIG. 2 ) is press-fit into thecavity 500 taken along line 8-8 inFIG. 7 . Only cross-sections of thebeams FIG. 8 with the rest of thepin 214 removed from the view ofFIG. 8 . As described above, thebeams separation gap 422 prior to and after thepin 214 is press-fit into thecavity 500 in one embodiment. Thebeams FIG. 5 ) of thelead frame 216. For example, thebeams beams pin 214 in thecavity 500. For example, the cross-sectional shape of thebeams beams lead frame 216. Increasing the surface area of the interface between thebeams lead frame 216 can increase the amount of force required to remove thepin 214 from thecavity 500. - For example, the interface between the pin 214 (shown in
FIG. 2 ) and thelead frame 216 includes a plurality ofinterface areas beams inner surface 616 and theupper edge 610 of thecavity 500. While only theinner surface 616 is labeled inFIG. 8 , theupper edge 610 also may be labeled using the same arrow as is used to label the location of theinner surface 616. Theinterface areas inner surface 616 within thecavity 500 and/or theupper edge 610 of thecavity 500. The engagement between the substantially flat contact surfaces 606 and one or more of theinner surface 616 andupper edge 610 increases the surface area of theinterface areas pin 214 and thelead frame 216 when compared to known pins (not shown) and cavities (not shown) of a similar size and of a different shape. Increasing this surface area causes the force required to remove thepin 214 from thecavity 500 to be increased. - In one embodiment, the
width 510 of theopening 506 defined by thecavity 500 is greater than thebeam width 426 of thebeams opening 506 of thecavity 500 may be sufficiently large such that one ormore side gaps outside surfaces beams inner surface 616 of thecavity 500. The outside surfaces 432, 434 of thebeams 402. 404 include the outermost surfaces of thebeams beans width 426 of thebeams outside surfaces beams FIG. 4 ) of thepin 214. Theopening 506 may be sufficiently large to provide theside gaps pin 214 is press-fit into thecavity 500 to provide additional tolerance for the loading of thepin 214 into thecavity 500. For example, inclusion of theside gaps pin 214 in thecavity 500 so that thepin 214 does not need to be perfectly centered in theopening 506. - It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments, and are by no means limiting and merely are example embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means—plus-function format and are not intended to be interpreted based on 35 U.S.C. §112, sixth paragraph, unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
Claims (20)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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US12/236,131 US7862376B2 (en) | 2008-09-23 | 2008-09-23 | Compliant pin for retaining and electrically connecting a shield with a connector assembly |
TW098131172A TW201018004A (en) | 2008-09-23 | 2009-09-16 | Compliant pin for retaining and electrically connecting a shield with a connector assembly |
CN200910211686A CN101714730A (en) | 2008-09-23 | 2009-09-23 | Compliant pin for retaining and electrically connecting a shield with a connector assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US12/236,131 US7862376B2 (en) | 2008-09-23 | 2008-09-23 | Compliant pin for retaining and electrically connecting a shield with a connector assembly |
Publications (2)
Publication Number | Publication Date |
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US20100075548A1 true US20100075548A1 (en) | 2010-03-25 |
US7862376B2 US7862376B2 (en) | 2011-01-04 |
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Application Number | Title | Priority Date | Filing Date |
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US12/236,131 Active 2029-04-09 US7862376B2 (en) | 2008-09-23 | 2008-09-23 | Compliant pin for retaining and electrically connecting a shield with a connector assembly |
Country Status (3)
Country | Link |
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US (1) | US7862376B2 (en) |
CN (1) | CN101714730A (en) |
TW (1) | TW201018004A (en) |
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CN107331995A (en) * | 2017-03-31 | 2017-11-07 | 安费诺商用电子产品(成都)有限公司 | Small spacing high speed Orthogonal back panel connector |
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US10476210B1 (en) * | 2018-10-22 | 2019-11-12 | Te Connectivity Corporation | Ground shield for a contact module |
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Also Published As
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CN101714730A (en) | 2010-05-26 |
TW201018004A (en) | 2010-05-01 |
US7862376B2 (en) | 2011-01-04 |
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