US20100090231A1 - Led package module - Google Patents
Led package module Download PDFInfo
- Publication number
- US20100090231A1 US20100090231A1 US12/571,754 US57175409A US2010090231A1 US 20100090231 A1 US20100090231 A1 US 20100090231A1 US 57175409 A US57175409 A US 57175409A US 2010090231 A1 US2010090231 A1 US 2010090231A1
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- Prior art keywords
- resin portion
- led
- color
- green
- red
- Prior art date
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- 239000011347 resin Substances 0.000 claims abstract description 127
- 229920005989 resin Polymers 0.000 claims abstract description 127
- 239000000758 substrate Substances 0.000 claims abstract description 23
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 15
- 230000003287 optical effect Effects 0.000 claims description 9
- 238000004383 yellowing Methods 0.000 abstract description 4
- 239000000919 ceramic Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48235—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a via metallisation of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
Definitions
- the present invention relates to LED package modules, and more particularly, to an LED package module for lighting that is used in lighting components or devices.
- LED package modules for lighting have silicon lenses and packages mounted with LED chips, phosphors and resin.
- LED package optical systems maintain stable optical output in an optimum state, protect light source devices, and ensure the reliability of light source devices for long-term use in any environment.
- UV LEDs may significantly reduce luminous efficiency due to the yellowing of plastics exposed to ultraviolet rays for extended periods.
- An aspect of the present invention provides an LED package module that prevents a reduction in luminous efficiency of an LED caused by yellowing to thereby increase luminous efficiency and achieve a reduction in size.
- an LED package module including: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from first color resin portion and the second color resin portion.
- the first color resin portion may be a red resin portion including a red phosphor
- the second color resin portion may be a green resin portion including a green phosphor
- the third color resin portion may be a blue resin portion including a blue phosphor.
- Each of the red resin portion and the green resin portion may be molded around one LED chip on the substrate and be substantially in the form of a dome, and the blue resin portion may be molded around both the red resin portion and the green resin portion and be substantially in the form of a dome.
- the LED package module may further include a body including a first layer provided on the substrate and receiving the plurality of separated LED chips, the red resin portion, and the green resin portion, and a second layer provided on the first layer and receiving the blue resin portion encompassing the red resin portion and the green resin portion.
- the body may include: a plurality of cavities provided in the first layer, receiving the plurality of LED chips, and filled with the red resin portion and the green resin portion; and an opening provided in the second layer and filled with the blue resin portion to encompass both the red resin portion and the green resin portion.
- a plurality of cavities may be provided on the substrate, receive the plurality of LED chips, and be filled with the red resin portion and the green resin portion, and an opening may be formed above the cavities and filled with the blue resin portion to encompass the red resin portion and the green resin portion.
- the plurality of LED chips may be inclined at predetermined angles so that central lines of optical paths of the plurality of LED chips cross each other.
- a bottom surface of each of the plurality of cavities to be mounted with the separated LED chips may be inclined at a predetermined angle to form an inclined surface so that central lines of optical paths of the plurality of LED chips cross each other.
- FIG. 1 is a view schematically illustrating a lateral cross section of an LED package module according to an exemplary embodiment of the present invention
- FIG. 2 is a plan view schematically illustrating the LED package module, illustrated in FIG. 1 ;
- FIG. 3 is a view schematically illustrating an LED package module according to another exemplary embodiment of the present invention.
- FIG. 4 is a view schematically illustrating a lateral cross-section of an LED package module according to another exemplary embodiment of the present invention.
- FIG. 1 is a view schematically illustrating a lateral cross-section of an LED package module according to an exemplary embodiment of the invention.
- FIG. 2 is a plan view schematically illustrating the LED package module, shown in FIG. 1 .
- an LED package module includes a substrate 10 , a body 20 , and a plurality of LED chips L 1 and L 2 .
- the LED chips L 1 and L 2 are positioned in the body 20 and mounted onto the substrate 10 by bonding.
- the substrate 10 is a ceramic substrate on which electrode patterns 12 are formed to provide an electrical connection with other components. Via electrodes 11 are formed in the substrate 10 to electrically connect the substrate 10 and the LED chips L 1 and L 2 mounted above the electrode patterns 12 .
- Heat sinks 15 are provided to dissipate heat from the LED chips L 1 and L 2 .
- Vias 14 are formed through the substrate 10 such that the heat sinks 15 and the LED chips L 1 and L 2 are thermally connected to each other.
- the body 20 has two layers. That is, a first layer 21 forms the lower side of the body 20 , and a second layer 22 forms the upper side thereof.
- the first layer 21 and the second layer 22 may be separately manufactured and then connected to each other. Alternatively, the first layer 21 and the second layer 22 may be formed integrally with each other.
- the first layer 21 includes a plurality of cavities 31 and 32 in which the plurality of LED chips L 1 and L 2 are respectively received.
- Each of the cavities 31 and 32 has a reflective surface inclined at a predetermined angle and a bottom surface through which the via 14 and the via electrode 11 are exposed.
- the via 14 is thermally connected to the LED chip L 1 or L 2 , and the via electrode 11 is connected to the LED chip L 1 or L 2 by bonding using wires w or flip chip bonding.
- the cavities 31 and 32 are filled with a red resin portion 41 including a red phosphor and a green resin portion 42 including a green phosphor, respectively.
- the heights of the red resin portion 41 and the green resin portion 42 filling the cavities 31 and 32 , respectively, do not exceed the height of the interface between the first layer 21 and the second layer 22 .
- An opening 33 is formed in the second layer 22 . As shown in FIGS. 1 and 2 , the opening 33 is preferably large enough to encompass both the cavities 31 and 32 that are formed in the first layer 21 .
- the opening 33 is filled with a blue resin portion 43 including a blue phosphor.
- the blue resin portion 43 fills the opening 33 to thereby encompass the red resin portion 41 and the green resin portion 42 that fill the cavities 31 and 32 , respectively.
- the red resin portion 41 and the green resin portion 42 are disposed adjacently on the first layer 21 .
- the blue resin portion 43 is placed in the opening 33 of the second layer 22 formed on the first layer 21 .
- Light generated from the LED chip L 1 around which the red resin portion 41 is molded supplies energy to the red phosphor included in the red resin portion 41 , thereby generating red light.
- Light generated from the LED chip L 2 around which the green resin portion 42 is molded supplies energy to the green phosphor included in the green resin portion 42 , thereby generating green light.
- the red light and the green light move toward the blue resin portion 43 .
- the red light and the green light are mixed together and affected by the blue phosphor included in the blue resin portion 43 to thereby generate white light, which is then emitted to the outside.
- the red resin portion 41 and the green resin portion 42 are disposed in the first layer 21
- the blue resin portion 43 is disposed in the second layer 22 formed on the first layer 21
- the red resin portion 41 and the green resin portion 42 are disposed in the first layer 21
- the blue resin portion 43 is disposed in the second layer 22 formed on the first layer 21 .
- the invention is not limited thereto, and the arrangement of the red, green, and blue resin portions can be changed.
- the body 20 of an LED package module according to the embodiment, illustrated in FIG. 3 includes a first layer 21 and a second layer 22 .
- the first layer 21 includes a plurality of cavities 31 and 32 .
- the second layer 22 has an opening 33 that is large enough to encompass both the cavities 31 and 32 .
- the first layer 21 and the second layer 22 may be separately manufactured and then are connected to each other, or be formed integrally with each other.
- the cavities 31 and 32 formed in the first layer 21 of the body 20 of the LED package module according to the embodiment, shown in FIG. 3 , include inclined surfaces 31 a and 32 a , respectively. That is, the bottom surface of each of the cavities 31 and 32 is inclined at a predetermined angle.
- the bottom surfaces of the cavities 31 and 32 form the inclined surfaces 31 a and 32 a , respectively, such that the central line of the optical path of a first LED chip L 1 and the central line of the optical path of a second LED chip L 2 cross each other.
- the cavities 31 and 32 have the inclined surfaces 31 a and 32 a at the bottom surfaces thereof, respectively, so that the LED chips L 1 and L 2 are inclined in a direction in which the LED chips L 1 and L 2 face each other.
- red light and green light can be effectively mixed together to thereby generate high quality white light.
- the two LED chips in the cavities are mounted so that they are inclined at predetermined angles in a direction in which they face each other.
- the invention is not limited thereto.
- the LED chips are inclined at predetermined angles in a direction in which all of the LED chips face each other, so that color separation can be prevented and color mixing can be more efficiently performed.
- the LED package module according to this embodiment is substantially the same as the LED package module according to the embodiment, illustrated in FIGS. 1 and 2 , except for the inclined surfaces formed on the cavities, a detailed description thereof will be omitted.
- the LED package module according to the embodiment, illustrated in FIG. 4 does not have a body.
- a plurality of LED chips L 1 and L 2 are separated from each other at a predetermined interval and mounted onto a substrate 10 . Resins having different colors are applied to the LED chips L 1 and L 2 .
- the LED chip L 1 is mounted onto the first substrate 10 , and a red resin portion 41 is in the form of a dome and molded around the first LED chip L 1 .
- a green resin portion 42 is in the form of a dome and molded around the second LED chip L 2 .
- a blue resin portion 43 is in the form of a dome and molded around the red resin portion 41 and the green resin portion 42 .
- the red resin portion 41 and the green resin portion 42 are disposed adjacently on the substrate 10 , and the blue resin portion 43 encompasses the red resin portion 41 and the green resin portion 42 .
- Light generated from the LED chip L 1 around which the red resin portion 41 is molded supplies energy to a red phosphor included in the red resin portion 41 , thereby generating red light.
- Light generated from the LED chip L 2 around which the green resin portion 42 is molded supplies energy to a green phosphor included in the green resin portion 42 , generating green light.
- red light and green light move toward the blue resin portion 43 .
- the red light and the green light are mixed together and affected by the blue phosphor included in the blue resin portion 43 to generate white light, which is then emitted to the outside.
- the arrangement of the red resin portion, the green resin portion, and the blue resin portion may be changed.
- white light is not necessarily emitted from the LED package module.
- the LED package module according to this embodiment, illustrated in FIG. 4 is substantially the same as the LED package module according to the embodiment, illustrated in FIG. 1 , that is, the substrate 10 and the via electrodes formed thereon, except for the above-described features, a detailed description thereof will be omitted.
- the LED package module prevents a reduction in luminous efficiency of an LED caused by yellowing, thereby increasing luminous efficiency and achieving a reduction in size.
Abstract
Description
- This application claims the priority of Korean Patent Application No. 10-2008-0101265 filed on Oct. 15, 2008, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.
- 1. Field of the Invention
- The present invention relates to LED package modules, and more particularly, to an LED package module for lighting that is used in lighting components or devices.
- 2. Description of the Related Art
- In general, light emitting diode (LED) package modules for lighting have silicon lenses and packages mounted with LED chips, phosphors and resin. LED package optical systems maintain stable optical output in an optimum state, protect light source devices, and ensure the reliability of light source devices for long-term use in any environment.
- Recently, applications and requirements for lighting for various purposes, including landscape lighting and other functional lighting, have greatly increased. The demand for high-power output has also increased accordingly. In order to meet various applications, the reduction in size, thickness, and weight has been demanded for the practicality and convenience of design. Therefore, heat-dissipating designs and mechanical designs of LED packages have been important issues.
- Research and development of mechanical packages and ceramic packages has been conducted for heat dissipation. In terms of mechanical design, chip-on-board (COB) technology has been used. Compared to existing plastic molding and lead-frame packaging technologies, the above-described technologies are very effective in the areas of mechanical design and heat-dissipating design.
- However, lighting package modules using ultra violet (UV) LEDs may significantly reduce luminous efficiency due to the yellowing of plastics exposed to ultraviolet rays for extended periods.
- An aspect of the present invention provides an LED package module that prevents a reduction in luminous efficiency of an LED caused by yellowing to thereby increase luminous efficiency and achieve a reduction in size.
- According to an aspect of the present invention, there is provided an LED package module including: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from first color resin portion and the second color resin portion.
- The first color resin portion may be a red resin portion including a red phosphor, the second color resin portion may be a green resin portion including a green phosphor, and the third color resin portion may be a blue resin portion including a blue phosphor.
- Each of the red resin portion and the green resin portion may be molded around one LED chip on the substrate and be substantially in the form of a dome, and the blue resin portion may be molded around both the red resin portion and the green resin portion and be substantially in the form of a dome.
- The LED package module may further include a body including a first layer provided on the substrate and receiving the plurality of separated LED chips, the red resin portion, and the green resin portion, and a second layer provided on the first layer and receiving the blue resin portion encompassing the red resin portion and the green resin portion.
- The body may include: a plurality of cavities provided in the first layer, receiving the plurality of LED chips, and filled with the red resin portion and the green resin portion; and an opening provided in the second layer and filled with the blue resin portion to encompass both the red resin portion and the green resin portion.
- A plurality of cavities may be provided on the substrate, receive the plurality of LED chips, and be filled with the red resin portion and the green resin portion, and an opening may be formed above the cavities and filled with the blue resin portion to encompass the red resin portion and the green resin portion.
- The plurality of LED chips may be inclined at predetermined angles so that central lines of optical paths of the plurality of LED chips cross each other.
- A bottom surface of each of the plurality of cavities to be mounted with the separated LED chips may be inclined at a predetermined angle to form an inclined surface so that central lines of optical paths of the plurality of LED chips cross each other.
- The above and other aspects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
-
FIG. 1 is a view schematically illustrating a lateral cross section of an LED package module according to an exemplary embodiment of the present invention; -
FIG. 2 is a plan view schematically illustrating the LED package module, illustrated inFIG. 1 ; -
FIG. 3 is a view schematically illustrating an LED package module according to another exemplary embodiment of the present invention; and -
FIG. 4 is a view schematically illustrating a lateral cross-section of an LED package module according to another exemplary embodiment of the present invention. - Exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
- First, with reference to
FIGS. 1 and 2 , an LED package module according to an exemplary embodiment of the invention will be described.FIG. 1 is a view schematically illustrating a lateral cross-section of an LED package module according to an exemplary embodiment of the invention.FIG. 2 is a plan view schematically illustrating the LED package module, shown inFIG. 1 . - As shown in
FIGS. 1 and 2 , an LED package module according to an exemplary embodiment of the invention includes asubstrate 10, abody 20, and a plurality of LED chips L1 and L2. The LED chips L1 and L2 are positioned in thebody 20 and mounted onto thesubstrate 10 by bonding. - The
substrate 10 is a ceramic substrate on whichelectrode patterns 12 are formed to provide an electrical connection with other components. Viaelectrodes 11 are formed in thesubstrate 10 to electrically connect thesubstrate 10 and the LED chips L1 and L2 mounted above theelectrode patterns 12. -
Heat sinks 15 are provided to dissipate heat from the LED chips L1 and L2.Vias 14 are formed through thesubstrate 10 such that the heat sinks 15 and the LED chips L1 and L2 are thermally connected to each other. - The
body 20 has two layers. That is, afirst layer 21 forms the lower side of thebody 20, and asecond layer 22 forms the upper side thereof. Thefirst layer 21 and thesecond layer 22 may be separately manufactured and then connected to each other. Alternatively, thefirst layer 21 and thesecond layer 22 may be formed integrally with each other. - The
first layer 21 includes a plurality ofcavities - Each of the
cavities via 14 and thevia electrode 11 are exposed. - The
via 14 is thermally connected to the LED chip L1 or L2, and thevia electrode 11 is connected to the LED chip L1 or L2 by bonding using wires w or flip chip bonding. - The
cavities red resin portion 41 including a red phosphor and agreen resin portion 42 including a green phosphor, respectively. - Preferably, the heights of the
red resin portion 41 and thegreen resin portion 42 filling thecavities first layer 21 and thesecond layer 22. - An
opening 33 is formed in thesecond layer 22. As shown inFIGS. 1 and 2 , theopening 33 is preferably large enough to encompass both thecavities first layer 21. - Then, the opening 33 is filled with a
blue resin portion 43 including a blue phosphor. - That is, the
blue resin portion 43 fills the opening 33 to thereby encompass thered resin portion 41 and thegreen resin portion 42 that fill thecavities - That is, the
red resin portion 41 and thegreen resin portion 42 are disposed adjacently on thefirst layer 21. Theblue resin portion 43 is placed in the opening 33 of thesecond layer 22 formed on thefirst layer 21. - Light generated from the LED chip L1 around which the
red resin portion 41 is molded supplies energy to the red phosphor included in thered resin portion 41, thereby generating red light. Light generated from the LED chip L2 around which thegreen resin portion 42 is molded supplies energy to the green phosphor included in thegreen resin portion 42, thereby generating green light. - Here, the red light and the green light move toward the
blue resin portion 43. In theblue resin portion 43, the red light and the green light are mixed together and affected by the blue phosphor included in theblue resin portion 43 to thereby generate white light, which is then emitted to the outside. - As the
red resin portion 41 and thegreen resin portion 42 are disposed in thefirst layer 21, and theblue resin portion 43 is disposed in thesecond layer 22 formed on thefirst layer 21, light ultimately passes through theblue resin portion 43 to thereby generate white light with high luminance. - In this embodiment, illustrated in
FIGS. 1 and 2 , thered resin portion 41 and thegreen resin portion 42 are disposed in thefirst layer 21, and theblue resin portion 43 is disposed in thesecond layer 22 formed on thefirst layer 21. However, the invention is not limited thereto, and the arrangement of the red, green, and blue resin portions can be changed. - However, when the color arrangement is changed, white light is not necessarily emitted.
- Referring to
FIG. 3 , an LED package module according to another exemplary embodiment of the invention will be described. - Like the body of the LED package module according to the embodiment, illustrated in
FIGS. 1 and 2 , thebody 20 of an LED package module according to the embodiment, illustrated inFIG. 3 , includes afirst layer 21 and asecond layer 22. Thefirst layer 21 includes a plurality ofcavities second layer 22 has anopening 33 that is large enough to encompass both thecavities - Here, in the same manner as the first and second layers of the LED package module according to the embodiment, shown in
FIG. 1 , thefirst layer 21 and thesecond layer 22 may be separately manufactured and then are connected to each other, or be formed integrally with each other. - The
cavities first layer 21 of thebody 20 of the LED package module according to the embodiment, shown inFIG. 3 , includeinclined surfaces cavities - That is, in the embodiment, illustrated in
FIG. 3 , the bottom surfaces of thecavities inclined surfaces - As shown in
FIG. 3 , thecavities inclined surfaces - In
FIG. 3 , the two LED chips in the cavities are mounted so that they are inclined at predetermined angles in a direction in which they face each other. However, the invention is not limited thereto. When more than two LED chips are mounted, the LED chips are inclined at predetermined angles in a direction in which all of the LED chips face each other, so that color separation can be prevented and color mixing can be more efficiently performed. - Since the LED package module according to this embodiment is substantially the same as the LED package module according to the embodiment, illustrated in
FIGS. 1 and 2 , except for the inclined surfaces formed on the cavities, a detailed description thereof will be omitted. - An LED package module according to another exemplary embodiment of the invention will now be described with reference to
FIG. 4 . - Basically, the LED package module according to the embodiment, illustrated in
FIG. 4 , does not have a body. - That is, a plurality of LED chips L1 and L2 are separated from each other at a predetermined interval and mounted onto a
substrate 10. Resins having different colors are applied to the LED chips L1 and L2. - In the LED package module according to the embodiment of the invention, illustrated in
FIG. 4 , the LED chip L1 is mounted onto thefirst substrate 10, and ared resin portion 41 is in the form of a dome and molded around the first LED chip L1. - When the second LED chip L2 is separated from the first LED chip L1, a
green resin portion 42 is in the form of a dome and molded around the second LED chip L2. - Further, a
blue resin portion 43 is in the form of a dome and molded around thered resin portion 41 and thegreen resin portion 42. - That is, the
red resin portion 41 and thegreen resin portion 42 are disposed adjacently on thesubstrate 10, and theblue resin portion 43 encompasses thered resin portion 41 and thegreen resin portion 42. - Light generated from the LED chip L1 around which the
red resin portion 41 is molded supplies energy to a red phosphor included in thered resin portion 41, thereby generating red light. Light generated from the LED chip L2 around which thegreen resin portion 42 is molded supplies energy to a green phosphor included in thegreen resin portion 42, generating green light. - Here, red light and green light move toward the
blue resin portion 43. In theblue resin portion 43, the red light and the green light are mixed together and affected by the blue phosphor included in theblue resin portion 43 to generate white light, which is then emitted to the outside. - Here, like the embodiment, illustrated in
FIG. 1 , the arrangement of the red resin portion, the green resin portion, and the blue resin portion may be changed. Here, white light is not necessarily emitted from the LED package module. - Since the LED package module according to this embodiment, illustrated in
FIG. 4 , is substantially the same as the LED package module according to the embodiment, illustrated inFIG. 1 , that is, thesubstrate 10 and the via electrodes formed thereon, except for the above-described features, a detailed description thereof will be omitted. - As set forth above, according to exemplary embodiments of the invention, the LED package module prevents a reduction in luminous efficiency of an LED caused by yellowing, thereby increasing luminous efficiency and achieving a reduction in size.
- While the present invention has been shown and described in connection with the exemplary embodiments, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
Priority Applications (1)
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US20200044115A1 (en) * | 2018-07-31 | 2020-02-06 | Nichia Corporation | Light-emittng device |
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Also Published As
Publication number | Publication date |
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US20120211780A1 (en) | 2012-08-23 |
KR20100042126A (en) | 2010-04-23 |
JP5379634B2 (en) | 2013-12-25 |
KR100982994B1 (en) | 2010-09-17 |
JP2010098313A (en) | 2010-04-30 |
US8278671B2 (en) | 2012-10-02 |
US8183583B2 (en) | 2012-05-22 |
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