US20100155031A1 - Heat pipe and method of making the same - Google Patents
Heat pipe and method of making the same Download PDFInfo
- Publication number
- US20100155031A1 US20100155031A1 US12/491,245 US49124509A US2010155031A1 US 20100155031 A1 US20100155031 A1 US 20100155031A1 US 49124509 A US49124509 A US 49124509A US 2010155031 A1 US2010155031 A1 US 2010155031A1
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- Prior art keywords
- wick structure
- casing
- layer
- heat pipe
- auxiliary
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Definitions
- the present invention relates generally to an apparatus for transfer or dissipation of heat from heat-generating components, and more particularly to a heat pipe applicable in electronic products such as personal computers for removing heat from electronic components installed therein and a method for manufacturing the same.
- Heat pipes have excellent heat transfer performance due to their low thermal resistance, and are therefore an effective means for transfer or dissipation of heat from heat sources.
- heat pipes are widely used for removing heat from heat-generating components such as central processing units (CPUs) of computers.
- a heat pipe is usually a vacuum casing containing therein a working medium, which is employed to carry, under phase transitions between liquid state and vapor state, thermal energy from one section of the heat pipe (typically referring to as the “evaporator section”) to another section thereof (typically referring to as the “condenser section”).
- a wick structure is provided inside the heat pipe, lining an inner wall of the casing, for drawing the working medium back to the evaporator section after it is condensed at the condenser section.
- the wick structure currently available for the heat pipe includes fine grooves integrally formed at the inner wall of the casing, screen mesh or fiber inserted into the casing and held against the inner wall thereof, or sintered powders combined to the inner wall of the casing by sintering process.
- the evaporator section of the heat pipe is maintained in thermal contact with a heat-generating component.
- the working medium contained at the evaporator section absorbs heat generated by the heat-generating component and then turns into vapor. Due to the difference of vapor pressure between the two sections of the heat pipe, the generated vapor moves and thus carries the heat towards the condenser section where the vapor is condensed into condensate after releasing the heat into ambient environment by, for example, fins thermally contacting the condenser section. Due to the difference in capillary pressure which develops in the wick structure between the two sections, the condensate is then brought back by the wick structure to the evaporator section where it is again available for evaporation.
- the wick structure provided in the heat pipe is expected to provide a high capillary force and meanwhile generate a low flow resistance for the condensate.
- the heat pipe needs to be flattened to enable the miniaturization of electronic products, which results in the wick structure of the heat pipe being damaged. Therefore, the flow resistance of the wick structure is increased and the capillary force provided by the wick structure is decreased, which reduces the heat transfer capability of the heat pipe. If the condensate is not quickly brought back from the condenser section, the heat pipe will suffer a dry-out problem at the evaporator section.
- FIG. 1 is a longitudinal cross-sectional view of a heat pipe in accordance with a first embodiment of the present invention.
- FIG. 2 is a transverse cross-sectional view of the heat pipe of FIG. 1 .
- FIG. 3 is a flow chart showing a method for manufacturing the heat pipe of FIG. 1 .
- FIG. 4 is a transverse cross-sectional view of a heat pipe in accordance with a second embodiment of the present invention.
- a heat pipe 10 includes an elongated, round casing 12 containing a working fluid therein, a main wick structure 14 and an auxiliary wick structure 18 .
- the casing 12 is made of a highly thermally conductive material such as copper or aluminum.
- the casing 12 includes an evaporator section 121 , an opposing condenser section 122 , and an adiabatic section 123 disposed between the evaporator section 121 and the condenser section 122 .
- the main wick structure 14 is tube-shaped in profile, which is evenly distributed around and attached to an inner surface of the casing 12 .
- the main wick structure 14 defines a receiving space therein.
- the main wick structure 14 extends along a longitudinal direction of the casing 12 .
- the main wick structure 14 is usually selected from a porous structure such as fine grooves, sintered powder, screen mesh, or bundles of fiber, and provides a capillary force to drive condensed working fluid at the condenser section 122 to flow towards the evaporator section 121 of the heat pipe 10 .
- the auxiliary wick structure 18 is a longitudinal hollow tube, which is received in the receiving space of the main wick structure 14 and extends along the longitudinal direction of the casing 12 .
- the auxiliary wick structure 18 has a ring-like transverse cross section.
- the auxiliary wick structure 18 longitudinally defines a liquid channel 172 therein.
- An outer diameter of the auxiliary wick structure 18 is much smaller than a bore diameter of the main wick structure 14 .
- the auxiliary wick structure 18 is a multi-layered structure, which is outwardly and radially formed by a plurality of round layers such that each successive layer is attached to a previous layer.
- the auxiliary wick structure 18 includes a first layer 181 at an inner side and a second layer 182 at an outer side and attached immediately around the first layer 181 .
- An inner peripheral surface of the first layer 181 longitudinally defines the liquid channel 172 therein.
- An inner peripheral surface of the main wick structure 14 and an outer peripheral surface of the second layer 182 of the auxiliary wick structure 18 cooperatively define a vapor channel 171 in the casing 12 .
- the outer peripheral surface of the auxiliary wick structure 18 has a bottom side 164 contacting with the inner peripheral surface of the main wick structure 14 , and a top side 165 spaced from the inner peripheral surface of the main wick structure 14 .
- the first and the second layers 181 , 182 are formed by weaving a plurality of metal wires, such as copper wires. A plurality of pores is formed in the first and the second layer 181 , 182 , which provides a capillary action to the working fluid.
- the metal wires of the first layer 181 has a greater wire diameter than that of the metal wires of the second layer 182 , whereby the metal wires of the first layer 181 have a greater mechanical strength to support the whole auxiliary wick structure 18 , which prevents the auxiliary wick structure 18 from collapsing down to thereby maintain the intended shape of the pores and the liquid channel 172 .
- the second layer 182 since the metal wires of the second layer 182 have a smaller wire diameter than the metal wires of the first layer 181 , the second layer 182 has a smaller pore size than the first layer 181 , whereby the second layer 182 has a greater capillary action to absorb more working fluid.
- the working fluid is saturated in the main and the auxiliary wick structures 14 , 18 and is usually selected from a liquid such as water, methanol, or alcohol, which has a low boiling point and is compatible with the main and the auxiliary wick structures 14 , 18 .
- the working fluid can easily evaporate to vapor when it receives heat at the evaporator section 121 of the heat pipe 10 .
- the evaporator section 121 of the heat pipe 10 is placed in thermal contact with a heat source, for example, a central processing unit (CPU) of a computer, which needs to be cooled.
- a heat source for example, a central processing unit (CPU) of a computer, which needs to be cooled.
- the working fluid contained in the evaporator section 121 of the heat pipe 10 is vaporized into vapor upon receiving the heat generated by the heat source. Then, the generated vapor moves via the vapor channel 171 towards the condenser section 122 of the heat pipe 10 .
- the condensate is brought back by the main wick structure 14 and the auxiliary wick structure 18 to the evaporator section 121 of the heat pipe 10 for being available again for evaporation.
- a method for manufacturing the heat pipe 10 includes the following steps: providing an elongated pole, and weaving a plurality of first metal wires on an outer peripheral surface of the pole to form the first layer 181 ; weaving a plurality of second metal wires on an outer peripheral surface of the first layer 181 to form a second layer 182 ; removing the pole from the first layer 181 to form the auxiliary wick structure 18 , wherein the first layer 181 defines the liquid channel 172 therein; providing a casing 12 having a main wick structure 14 attached to an inner peripheral surface thereof, inserting the auxiliary wick structure 18 into the casing 12 ; vacuuming an interior of the casing 12 and filling the working fluid into the casing 12 ; and sealing the casing 12 .
- Table 1 below shows an average of maximum heat transfer rates (Qmax) and an average of heat resistances (Rth) of forty-five conventional round grooved heat pipes and forty-five round heat pipes 10 formed in accordance with the present disclosure.
- Qmax represents the maximum heat transfer rate of the heat pipe at an operational temperature of 50° C.
- Rth is obtained by dividing the margin between an average temperature of the evaporator section 121 and an average temperature of the condenser section 122 of the heat pipe 10 by Qmax.
- a diameter of the transverse cross section and a longitudinal length of each of the conventional grooved heat pipes are 6 mm and 160 mm, which are respectively equal to the transverse diameter and the longitudinal length of each of the present heat pipes 10 .
- Table 1 shows that the heat resistance of the present round heat pipe 10 is significantly less than that of the conventional round grooved heat pipe, whilst the Qmax of the round heat pipe 10 in accordance with the present disclosure is significantly more than that of the conventional round grooved heat pipe.
- a flat heat pipe 50 in accordance with a second embodiment of the present invention is obtained by flattening the heat pipe 10 of FIGS. 1 and 2 .
- the heat pipe 50 has the same structure as the heat pipe 10 except that the heat pipe 50 is a flat one. After the flattening operation, the auxiliary wick structure 18 is kept intact, and the auxiliary wick structure 18 spaces a gap from a top wall 52 of the heat pipe 50 .
- the heat transfer capability of the flat heat pipe 50 is not decreased due to the flattening operation.
- the heat transfer capability of the flat heat pipe 50 is better than a conventional flat heat pipe whose wick structure is damaged in the flattening operation.
- Table 2 below shows an average of maximum heat transfer rates (Qmax) and an average of heat resistances (Rth) of ten conventional flat grooved heat pipes and ten present heat pipes 50 , which are flattened to have a height of 3.5 mm. Before these heat pipes are flattened, they have the same transverse diameter and longitudinal length as the heat pipes mentioned in Table 1. Qmax and Rth in Table 2 have the same meaning as the Qmax and Rth in Table 1. Table 2 shows that the heat resistance of the present flat heat pipe 50 is significantly less than that of the conventional flat grooved heat pipes, whilst the Qmax of the flat present heat pipes 50 is significantly more than that of the conventional flat grooved heat pipes.
Abstract
Description
- 1. Technical Field
- The present invention relates generally to an apparatus for transfer or dissipation of heat from heat-generating components, and more particularly to a heat pipe applicable in electronic products such as personal computers for removing heat from electronic components installed therein and a method for manufacturing the same.
- 2. Description of Related Art
- Heat pipes have excellent heat transfer performance due to their low thermal resistance, and are therefore an effective means for transfer or dissipation of heat from heat sources. Currently, heat pipes are widely used for removing heat from heat-generating components such as central processing units (CPUs) of computers. A heat pipe is usually a vacuum casing containing therein a working medium, which is employed to carry, under phase transitions between liquid state and vapor state, thermal energy from one section of the heat pipe (typically referring to as the “evaporator section”) to another section thereof (typically referring to as the “condenser section”). Preferably, a wick structure is provided inside the heat pipe, lining an inner wall of the casing, for drawing the working medium back to the evaporator section after it is condensed at the condenser section. The wick structure currently available for the heat pipe includes fine grooves integrally formed at the inner wall of the casing, screen mesh or fiber inserted into the casing and held against the inner wall thereof, or sintered powders combined to the inner wall of the casing by sintering process.
- In operation, the evaporator section of the heat pipe is maintained in thermal contact with a heat-generating component. The working medium contained at the evaporator section absorbs heat generated by the heat-generating component and then turns into vapor. Due to the difference of vapor pressure between the two sections of the heat pipe, the generated vapor moves and thus carries the heat towards the condenser section where the vapor is condensed into condensate after releasing the heat into ambient environment by, for example, fins thermally contacting the condenser section. Due to the difference in capillary pressure which develops in the wick structure between the two sections, the condensate is then brought back by the wick structure to the evaporator section where it is again available for evaporation.
- In order to draw the condensate back timely, the wick structure provided in the heat pipe is expected to provide a high capillary force and meanwhile generate a low flow resistance for the condensate. In ordinary use, the heat pipe needs to be flattened to enable the miniaturization of electronic products, which results in the wick structure of the heat pipe being damaged. Therefore, the flow resistance of the wick structure is increased and the capillary force provided by the wick structure is decreased, which reduces the heat transfer capability of the heat pipe. If the condensate is not quickly brought back from the condenser section, the heat pipe will suffer a dry-out problem at the evaporator section.
- Therefore, it is desirable to provide a heat pipe with an improved heat transfer capability, whose wick structure will not be damaged when the heat pipe is flattened.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
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FIG. 1 is a longitudinal cross-sectional view of a heat pipe in accordance with a first embodiment of the present invention. -
FIG. 2 is a transverse cross-sectional view of the heat pipe ofFIG. 1 . -
FIG. 3 is a flow chart showing a method for manufacturing the heat pipe ofFIG. 1 . -
FIG. 4 is a transverse cross-sectional view of a heat pipe in accordance with a second embodiment of the present invention. - Referring to
FIGS. 1 and 2 , aheat pipe 10 includes an elongated,round casing 12 containing a working fluid therein, amain wick structure 14 and anauxiliary wick structure 18. - The
casing 12 is made of a highly thermally conductive material such as copper or aluminum. Thecasing 12 includes anevaporator section 121, anopposing condenser section 122, and anadiabatic section 123 disposed between theevaporator section 121 and thecondenser section 122. - The
main wick structure 14 is tube-shaped in profile, which is evenly distributed around and attached to an inner surface of thecasing 12. Themain wick structure 14 defines a receiving space therein. Themain wick structure 14 extends along a longitudinal direction of thecasing 12. Themain wick structure 14 is usually selected from a porous structure such as fine grooves, sintered powder, screen mesh, or bundles of fiber, and provides a capillary force to drive condensed working fluid at thecondenser section 122 to flow towards theevaporator section 121 of theheat pipe 10. - The
auxiliary wick structure 18 is a longitudinal hollow tube, which is received in the receiving space of themain wick structure 14 and extends along the longitudinal direction of thecasing 12. Theauxiliary wick structure 18 has a ring-like transverse cross section. Theauxiliary wick structure 18 longitudinally defines aliquid channel 172 therein. An outer diameter of theauxiliary wick structure 18 is much smaller than a bore diameter of themain wick structure 14. - The
auxiliary wick structure 18 is a multi-layered structure, which is outwardly and radially formed by a plurality of round layers such that each successive layer is attached to a previous layer. In the embodiment, theauxiliary wick structure 18 includes afirst layer 181 at an inner side and asecond layer 182 at an outer side and attached immediately around thefirst layer 181. An inner peripheral surface of thefirst layer 181 longitudinally defines theliquid channel 172 therein. An inner peripheral surface of themain wick structure 14 and an outer peripheral surface of thesecond layer 182 of theauxiliary wick structure 18 cooperatively define avapor channel 171 in thecasing 12. The outer peripheral surface of theauxiliary wick structure 18 has abottom side 164 contacting with the inner peripheral surface of themain wick structure 14, and atop side 165 spaced from the inner peripheral surface of themain wick structure 14. - The first and the
second layers second layer first layer 181 has a greater wire diameter than that of the metal wires of thesecond layer 182, whereby the metal wires of thefirst layer 181 have a greater mechanical strength to support the wholeauxiliary wick structure 18, which prevents theauxiliary wick structure 18 from collapsing down to thereby maintain the intended shape of the pores and theliquid channel 172. Moreover, since the metal wires of thesecond layer 182 have a smaller wire diameter than the metal wires of thefirst layer 181, thesecond layer 182 has a smaller pore size than thefirst layer 181, whereby thesecond layer 182 has a greater capillary action to absorb more working fluid. - The working fluid is saturated in the main and the
auxiliary wick structures auxiliary wick structures evaporator section 121 of theheat pipe 10. - In operation, the
evaporator section 121 of theheat pipe 10 is placed in thermal contact with a heat source, for example, a central processing unit (CPU) of a computer, which needs to be cooled. The working fluid contained in theevaporator section 121 of theheat pipe 10 is vaporized into vapor upon receiving the heat generated by the heat source. Then, the generated vapor moves via thevapor channel 171 towards thecondenser section 122 of theheat pipe 10. After the vapor releases the heat carried thereby and is condensed into the condensate in thecondenser section 122, the condensate is brought back by themain wick structure 14 and theauxiliary wick structure 18 to theevaporator section 121 of theheat pipe 10 for being available again for evaporation. - Referring to
FIG. 3 , a method for manufacturing theheat pipe 10 includes the following steps: providing an elongated pole, and weaving a plurality of first metal wires on an outer peripheral surface of the pole to form thefirst layer 181; weaving a plurality of second metal wires on an outer peripheral surface of thefirst layer 181 to form asecond layer 182; removing the pole from thefirst layer 181 to form theauxiliary wick structure 18, wherein thefirst layer 181 defines theliquid channel 172 therein; providing acasing 12 having amain wick structure 14 attached to an inner peripheral surface thereof, inserting theauxiliary wick structure 18 into thecasing 12; vacuuming an interior of thecasing 12 and filling the working fluid into thecasing 12; and sealing thecasing 12. - Table 1 below shows an average of maximum heat transfer rates (Qmax) and an average of heat resistances (Rth) of forty-five conventional round grooved heat pipes and forty-five
round heat pipes 10 formed in accordance with the present disclosure. Qmax represents the maximum heat transfer rate of the heat pipe at an operational temperature of 50° C. Rth is obtained by dividing the margin between an average temperature of theevaporator section 121 and an average temperature of thecondenser section 122 of theheat pipe 10 by Qmax. A diameter of the transverse cross section and a longitudinal length of each of the conventional grooved heat pipes are 6 mm and 160 mm, which are respectively equal to the transverse diameter and the longitudinal length of each of thepresent heat pipes 10. Table 1 shows that the heat resistance of the presentround heat pipe 10 is significantly less than that of the conventional round grooved heat pipe, whilst the Qmax of theround heat pipe 10 in accordance with the present disclosure is significantly more than that of the conventional round grooved heat pipe. -
TABLE 1 average of Qmax average of Rth Types of heat pipes (unit: w) (unit: ° C./w) Conventional grooved 65 0.025 heat pipes present heat pipes 95.5 0.024 - As shown in
FIG. 4 , aflat heat pipe 50 in accordance with a second embodiment of the present invention is obtained by flattening theheat pipe 10 ofFIGS. 1 and 2 . Theheat pipe 50 has the same structure as theheat pipe 10 except that theheat pipe 50 is a flat one. After the flattening operation, theauxiliary wick structure 18 is kept intact, and theauxiliary wick structure 18 spaces a gap from atop wall 52 of theheat pipe 50. The heat transfer capability of theflat heat pipe 50 is not decreased due to the flattening operation. The heat transfer capability of theflat heat pipe 50 is better than a conventional flat heat pipe whose wick structure is damaged in the flattening operation. - Table 2 below shows an average of maximum heat transfer rates (Qmax) and an average of heat resistances (Rth) of ten conventional flat grooved heat pipes and ten
present heat pipes 50, which are flattened to have a height of 3.5 mm. Before these heat pipes are flattened, they have the same transverse diameter and longitudinal length as the heat pipes mentioned in Table 1. Qmax and Rth in Table 2 have the same meaning as the Qmax and Rth in Table 1. Table 2 shows that the heat resistance of the presentflat heat pipe 50 is significantly less than that of the conventional flat grooved heat pipes, whilst the Qmax of the flatpresent heat pipes 50 is significantly more than that of the conventional flat grooved heat pipes. -
TABLE 2 average of Qmax average of Rth Types of heat pipes (unit: w) (unit: ° C./w) Conventional grooved 32 0.055 heat pipes Present heat pipes 64 0.033 - It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Claims (9)
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CN200810306425.X | 2008-12-22 | ||
CN200810306425XA CN101634532B (en) | 2008-12-22 | 2008-12-22 | Heat pipe manufacturing method |
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US20100155031A1 true US20100155031A1 (en) | 2010-06-24 |
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US12/491,245 Abandoned US20100155031A1 (en) | 2008-12-22 | 2009-06-25 | Heat pipe and method of making the same |
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CN (1) | CN101634532B (en) |
Cited By (8)
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US20120048518A1 (en) * | 2010-08-26 | 2012-03-01 | Foxconn Technology Co., Ltd. | Flat heat pipe with internal supporting element |
US20130213611A1 (en) * | 2012-02-22 | 2013-08-22 | Chun-Ming Wu | Heat pipe heat dissipation structure |
US20160095254A1 (en) * | 2014-09-29 | 2016-03-31 | International Business Machines Corporation | Managing heat transfer for electronic devices |
US20160153722A1 (en) * | 2014-11-28 | 2016-06-02 | Delta Electronics, Inc. | Heat pipe |
US20170049007A1 (en) * | 2015-08-11 | 2017-02-16 | High Power Lighting Corp. | Meshed cooling structure and cooling device having the same |
CN113664206A (en) * | 2020-05-15 | 2021-11-19 | 苏州铜宝锐新材料有限公司 | Method for manufacturing heat transfer structure |
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US11454456B2 (en) | 2014-11-28 | 2022-09-27 | Delta Electronics, Inc. | Heat pipe with capillary structure |
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Publication number | Priority date | Publication date | Assignee | Title |
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US20120048518A1 (en) * | 2010-08-26 | 2012-03-01 | Foxconn Technology Co., Ltd. | Flat heat pipe with internal supporting element |
US20130213611A1 (en) * | 2012-02-22 | 2013-08-22 | Chun-Ming Wu | Heat pipe heat dissipation structure |
US9170058B2 (en) * | 2012-02-22 | 2015-10-27 | Asia Vital Components Co., Ltd. | Heat pipe heat dissipation structure |
US20160095254A1 (en) * | 2014-09-29 | 2016-03-31 | International Business Machines Corporation | Managing heat transfer for electronic devices |
US20160153722A1 (en) * | 2014-11-28 | 2016-06-02 | Delta Electronics, Inc. | Heat pipe |
US11454456B2 (en) | 2014-11-28 | 2022-09-27 | Delta Electronics, Inc. | Heat pipe with capillary structure |
US11892243B2 (en) | 2014-11-28 | 2024-02-06 | Delta Electronics, Inc. | Heat pipe with capillary structure |
US20170049007A1 (en) * | 2015-08-11 | 2017-02-16 | High Power Lighting Corp. | Meshed cooling structure and cooling device having the same |
CN113664206A (en) * | 2020-05-15 | 2021-11-19 | 苏州铜宝锐新材料有限公司 | Method for manufacturing heat transfer structure |
JPWO2022190794A1 (en) * | 2021-03-09 | 2022-09-15 | ||
JP7311057B2 (en) | 2021-03-09 | 2023-07-19 | 株式会社村田製作所 | Heat spreading devices and electronics |
Also Published As
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CN101634532B (en) | 2011-06-15 |
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