US20100163608A1

US20100163608A1 - Method for depositing solder material on an electronic component part

Info

Publication number: US20100163608A1
Application number: US12/582,637
Authority: US
Inventors: Kenneth J. Huth; Lawrence C. Monterulo; John C. Sugrue
Original assignee: Semx Corp
Current assignee: Semx Corp
Priority date: 2005-12-30
Filing date: 2009-10-20
Publication date: 2010-07-01
Also published as: WO2007079261A2; WO2007079261A3; US7946470B2; US20070152017A1

Abstract

A method for accurately depositing a required volume of solder material on a specific area of a lead frame, substrate or other part (4) of an electronic component to be bonded by reflow of solder material to another part into a reliable, void-free connection during a subsequent assembly step comprises the following steps. Minute particles (3) of solder material whose cumulative volume corresponds to the total volume to be deposited are loaded into a cavity (2) cut into a fixture (1) made from a material such as graphite. The cavity delineates the specific area of deposit. The part (4) is then laid upon the fixture and immobilized thereon by a cover (7) made from a material such as graphite. The fixture and its enclosed part are then subjected to solder material melting temperature under a controlled atmosphere in a furnace. The cavity is patterned and dimensioned to accommodate the right number of uniformly dimensioned particles necessary to precisely create the desired deposit of solder material.

Description

PRIORITY APPLICATION

This is continuation of U.S. patent application Ser. No. 12/418,845, filed Apr. 6, 2009, a continuation of U.S. patent application Ser. No. 12/159,682, filed Jun. 30, 2008, a 371 of PCT/US06/49669 filed Dec. 29, 2006 which is a continuation-in-part of U.S. patent application Ser. No. 11/323,444 filed Dec. 12, 2005 and a continuation-in-part of U.S. patent application Ser. No. 11/523,895 filed Sep. 19, 2006.

FIELD OF THE INVENTION

This invention relates to microelectronic assemblies and packaging, and more particularly to the deposition of soldered strips or other shaped patches on electronic component parts such as lead frames, package lids, or substrates for later reflow and connection.

BACKGROUND

The extensive miniaturization of electronic circuits and their packaging requires the accurate deposition of minute, accurate quantity dabs, lines, or other shaped patches of solder over delineated areas of a component surface for future connecting of leads, lids and other parts by reflow.
The solder must be applied in controlled quantity and precisely on target in order to avoid bridging or unwanted gaps with other soldered points or circuit parts.
In the prior art, stamped soldered preforms are tack-welded to, or solder strips are laid on the electronic assembly or package in order to hold the solder in place for later remelting.
This invention results from attempts to devise a more precise method for depositing minute, accurate amounts of solder in precise locations without portions coming out of the demarcated area.

SUMMARY

The instant invention provides a method for more accurately depositing a specified amount of solder material on a precisely delineated area on a surface of an electronic component part that will be subsequently subjected to reflow.
In some embodiments the method can used in order to establish a reliable and void-free connection with another component part. In some embodiments the component part may be a lead frame, package lid, substrate or other part. In some embodiments the volume of required solder material is calculated as the product of the area to be covered by the solder material times the desired height of the solder patch or strip. In some embodiments this volume is used to calculate the number or amount of solder material particles which are loaded into a cavity cut in the exposed surface of a fixture made of high density graphite or other crucible-type material having a melting temperature substantially higher than the melting point of the solder material. In some embodiments the delineated area of the part upon which the solder material is to be deposited can be positioned against the exposed surface of the fixture, and the combined fixture and part are exposed to a temperature at least as high as the melting temperature of the solder material in a batch or belt furnace under a controlled atmosphere.
In some embodiments the top surface of the fixture can be shaped and dimensioned for intimate contact with the solder material deposit area. In some embodiments the cavity carved into said exposed surface can be shaped to be congruent with the deposit area when the part is positioned against the fixture with the particles in contact with said area.
In some embodiments the part can be secured upon the fixture with a cover of the same high melting point material.
In some embodiments the particles can be laid in one or more rows into the cavity. In some embodiments the particles can be selected to have the same calculated, uniform range of dimensions and can be symmetrical, spherical, cylindrical or other shapes.
In some embodiments the cumulative volume of all the particles is equal to the total metered volume of solder material to be deposited.
In some embodiments the cavity has a constant depth which is greater than the diameter or size of the particles. In some embodiments the fixture and part are inverted prior to introduction into the furnace so that the particles drop into contact with the area of deposit.
In other embodiments the cavity has a depth that is lesser than the diameter or other appropriate size dimension of the particles and pressure is applied to the cover to hold the particles in position and assure a better adhesion of the solder to the part. In some embodiments the fixture may or may not be inverted during heating depending on the flow characteristics of the materials involved.
In some embodiments the cavity has an arcuate bottom whose radius is commensurate with the radius of the particles.
In some embodiments the bottom of the cavity has a series of spherical depressions, each dimensioned to intimately nest a particle of solder material. In some embodiments these depressions are regularly spaced apart at a calculated interval as a function of the total volume of solder material to be deposited and the number and size of the particles.
In some embodiments the cavity is widened and/or segmented to form one or more variably shaped ditches sized to be filled with an array of particles.
Some embodiments provide a method for accurately depositing a metered volume of solder material of a given melting point on a delineated area of an electronic component part, said method comprising the steps of: providing a fixture having a top surface shaped and dimensioned for intimate contact with said area, and a melting temperature substantially higher than said melting point; carving into said top surface a cavity shaped to be congruent with said area; placing into said cavity a number of particles of said solder material; positioning said part against said top surface and said particles in contact with said area; and exposing said fixture and part to a temperature at least equal to said melting point; whereby the material of said particles melts and adheres to said area.
In some embodiments the method further comprises securing said part upon said fixture with a cover. In some embodiments said fixture is made of a material comprising high density graphite. In some embodiments said solder material comprises a metal alloy selected from the group consisting of gold alloys, tin alloys, lead alloys, copper alloys, and silver alloys. In some embodiments said solder material comprises a metal alloy selected from the group consisting of AuSn, AuGe, AuSi, AuAgCu, AgCu, and PbSnAg. In some embodiments said delineated area comprises an electronic package lead frame. In some embodiments said delineated area comprises a marginal, peripheral area of a microelectronic package lid. In some embodiments said cavity is segmented into a plurality of ditches. In some embodiments two of said plurality of ditches are differently dimensioned. In some embodiments said particles are laid in a single row into said cavity. In some embodiments said particles are substantially uniform. In some embodiments said particles are laid in a plurality of rows into said cavity. In some embodiments said particles are symmetrical, and have calculated dimensions. In some embodiments said particles are spherical, and have a calculated diameter and radius. In some embodiments the cumulative volume of said particles is equal to said metered volume. In some embodiments said cavity has a constant depth greater than said diameter. In some embodiments said step of positioning comprises inverting said fixture and part. In some embodiments said cavity has a constant depth lesser than said diameter. In some embodiments the method further comprises pressing said part against said fixture. In some embodiments said cavity has an arcuate bottom of a radius commensurate with the radius of said particles. In some embodiments said cavity has a series of spaced-apart bottom separators dimensioned to intimately nest said particles. In some embodiments said separators are regularly spaced-apart at a calculated interval.
Some embodiments provide a method for accurately depositing a volume of solder of a given melting point to a given height on a delineated area of given superficies on the face of an electronic component, said method comprising the steps of: providing a slab of material having a bottom surface shaped and dimensioned for intimate contact with a zone of said face including said area, and a melting temperature substantially higher than said melting point; drilling through said slab at least one bore substantially perpendicular to said bottom surface and having a lower opening in said bottom surface falling within said area when said bottom surface is in contact with said zone; carving into said bottom surface and around said bottom opening, a cavity at least as deep as said height and shaped to be congruent with said delineated area; intimately contacting said face with said slab's bottom surface; inserting into said bore, a particle of said solder, said particle having a volume substantially equal to a product of said superficies times said height; and exposing said component and slab to a temperature at least equal to said melting point; whereby said particle of solder melts, flows and deposits accurately over said delineated area.
In some embodiments said delineated area is elongated about an axis; said step of drilling comprises drilling a plurality of said bores leading to spaced-apart openings along a line parallel to said axis within said cavity; and said step of inserting comprises inserting at least one of said particles in each of said bores, said particles having a cumulative volume equal to said product. In some embodiments said material comprises high density graphite. In some embodiments said solder comprise a gold alloy. In some embodiments said alloy is Au/Sn. In some embodiments said delineated area comprises an electronic package lead attachment area on a lead frame. In some embodiments said delineated area comprises a marginal, peripheral area on an electronic package lid.
Some embodiments provide a device for accurately depositing a volume of solder to a given height on a limited area on the face of an electronic component which comprises: a slab of material having a top surface, and a bottom surface shaped and dimensioned for conformingly resting upon a zone of said face including said area; said slab having at least one bore having a upper opening in said top surface and a lower opening in said bottom surface, said lower opening being positioned above said area when said bottom surface rests upon said zone; and said slab further having a cavity in said bottom surface and around said bottom opening, said cavity having a depth greater than said height, and being shaped to congruently fit over said limited area. In some embodiments the device further comprise a plurality of said bores having lower openings positioned at regularly spaced-apart locations along a line. In some embodiments said limited area comprises at least one lead connection spot on an electronic package lead frame. In some embodiments said limited area comprises a marginal, peripheral area on an electronic package lid. In some embodiments the device further comprises a small volume of solder inserted in each of said bores. In some embodiments said volume is obtained by dividing the amount of solder to be deposited by the number of bores. In some embodiments each of said volume consists of a particle of solder. In some embodiments said particle of solder has a shape selected from the group consisting of a sphere, a cylinder, and a quadranglarly sided shape.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top plan view of the top surface of the fixture.

FIG. 2 is a diagrammatical cross-section of the cavity in a first embodiment of the fixture.

FIG. 3 is a partial diagrammatical cross-sectional view of the first embodiment of the fixture placed in a furnace.

FIG. 4 is a diagrammatical cross-section of a second embodiment of the cavity section.

FIG. 5 is a diagrammatical cross-sectional view of the cavity section in a third embodiment of the fixture.

FIG. 6 is a perspective partial view of a fourth embodiment of the cavity section.

FIG. 7 is a perspective partial view of a fifth embodiment of the cavity section.

FIG. 8 is a bottom plan view of a template according to the invention;

FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 8;

FIG. 10 is a cross-sectional view taken along line 10-10 of FIG. 8;

FIG. 11 is a top plan view of the template applied to a lead frame;

FIG. 12 is a bottom plan view of a template for an electronic package lid; and

FIG. 13 is a cross-sectional view of a package lid, template and framing fixture assembly.

DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

Referring now to the drawing, there is shown in FIG. 1 the top surface of a fixture 1 according to the invention. The fixture 1 is particularly adapted for depositing a strip of solder in a marginal area around the periphery of the lid of a microcircuit component. A cavity in the form of an elongate channel 2 carved in the top surface of the fixture is shaped and dimensioned to be congruent to the area targeted to receive a deposit of solder material. The cavity 2 has been filled with a number of uniformly dimensioned particles of solder material selected in this case to be in the shape of spheres 3. The cumulative volume of all the spheres contained within the cavity corresponds to the total volume of solder material to be deposited. Using uniformly dimensioned particles allows for precise control of the total volume of solder material to be deposited.
As more specifically illustrated in FIG. 2, the cavity 2 has a constant depth P that is greater than the diameter D of the spheres 3. The part upon which the solder material is to be deposited, in this case a microelectronic package lid 4, is held in a depression 5 in the top surface of the fixture that is shaped and dimensioned for intimate contact with the lower surface 6 of the lid. A cover 7 and releasable fastening means such as a clamp C is used to tightly secure the lid part 4 to the fixture 1.
The combined fixture, lid and cover is inverted prior to introducing it into a furnace 8 as shown in FIG. 3. The spheres 3 have dropped within the cavity 2 and come in contact with the lid 4. When the combination is subjected to a temperature at least as high as the melting temperature of the solder material melts and adheres to the under surface 6 of the lid.
In the second embodiment of the cavity illustrated in FIG. 4, the depth Q of the cavity 2 is lesser than the diameter D of the spheres 3. In this case, it is not absolutely necessary, but will typically be recommendable to invert the combination fixture lid and cover prior to introduction into the melting furnace. The decision whether or not to invert will depend on the characteristics of the materials involved including wettability of the lid by the chosen solder material. A pressure A is preferably applied to the lid to force the spheres in constant contact with the under surface 6 of the lid, and assure a better adhesion of the melted solder material to the lid.
As shown in FIG. 5, the bottom 9 of the cavity 2 is preferably arcuate with a radius commensurate with the radius of the spheres 3.
In a fourth embodiment of the cavity illustrated in FIG. 6, a series of holes 10 are carved at regularly spaced intervals I in the bottom of the cavity 2 to act as a localizer or separator for spaced apart particles. In this embodiment, each hole 10 is spherically concave and has the same radius as the spheres in order to intimately nest one of the spheres 3. It is noted that the hole radius can be slightly smaller than the spheres and still provide localization. Although the holes are shown having a partially spherical shape, other shapes either concave or convex which allow nesting or other localization of the spheres may be acceptable. The practicality of the selected shape is generally determined by which shape is easiest to form during the manufacturing of the fixture. Depending on the shape of the hole, the intended shape of the solder patch or strip, and the space formed between the hole boundaries and a nested particle, the fixture may require inverting prior to initiating melting.
In a fifth embodiment of the cavity illustrated in FIG. 7, the cavity is segmented into one or more ditches 15 having a specified shape and dimensioning. The size and shape of the particles is selected to form an array of particles 16 nested within each ditch and to provide the required amount of solder material. For example, in a ditch having a rounded corner rectangular shape in a top plan view, and having a first side dimension S and an orthogonal side dimension T, spherical particles are selected having a diameter so that an integer multiple of the diameter will substantially equal S and another integer multiple will substantially equal T. Depending on the acceptable range of volume of solder material, the above equalities need not be exact. Further, the ditches can be shaped differently from one another depending on the shape and dimensioning of the delineated area to receive the solder material.
In a first step in the disclosed process, the total volume of solder material to be deposited on the delineated area of a component part is calculated by multiplying the area of deposit by the desired height of the solder material strip or patch. The width of the desired strip or dimensions of the desired patch of deposited solder material determines the shape and dimensions of the cavity, whether it is segmented into ditches, whether it uses particle separating structures, and the size or size range of the substantially uniformly dimensioned particles. The word “substantially” is used because the particles may not need to be exactly uniform but could fall within an acceptable range so that the completed strip or patch of solder material is adequately dimensioned. Use of uniformly dimensioned particles provides a means for precise control of the total volume of solder material to be deposited. For example, if spherical particles are used, then the maximum diameter D of the spheres and the number of spheres is determined by dividing the total volume of solder material to be deposited by the volume of each sphere. Depending upon that number, the spheres may be laid in a single row contiguous to each other as shown on FIG. 1, multiple rows as shown in FIG. 7, or may be spaced-apart using separator nesting structures 10 shown in the embodiment of the cavity illustrated in FIG. 6. The interval I between the nesting structures 10 in a row is determined as a function of the number of required spheres of solder material and the total length of that row in the cavity 2. All of the calculated dimensions are preferably displayed in a spread sheet bearing as entries the various determinant parameters such as the width and length of the delineated area to be covered by the solder material, the desired thickness of the material, the length and width of the cavity etc. according to well-known techniques for convenient use by the manufacturer.
In the embodiments of the cavity illustrated in FIGS. 2-5, the loading of the spheres into the fixture can be done by pouring the spheres into the depression 5 in the top surface of the fixture that is shaped and configured to receive the component part and may also include a gate for excess sphere removal. Once the cavity has been filled, the excess spheres can be swept away through the gate, not shown on the drawing, practiced in the periphery of the fixture. It is important to note that the loading of particles having a shape other than spheres can be done through pouring so long as the groups of particles are flowable. Such flowable groups of particles can be in the form of nanoparticles or flowable metal powders made from techniques well known in the electronics industry. Optionally, the fixture may be vibrated to avoid clumping of particles and encourage packed nesting.
The pressure A applied on the lid in the second embodiment of the cavity illustrated in FIG. 4, is preferably imparted by a spring pressure clamp in the range of 750 to 1,000 milligrams (about 1.5 to 2 lbs.).
The oven is purged of all air and filled with a controlled atmosphere conducive to reflow of the solder material by being non-oxidizing and can be for example made of 5 percent hydrogen and 95 percent nitrogen. The temperature of the oven is then raised above the melting point of the solder material for a period of time sufficient to melt and join the particles.
In most applications, the delineated area of the component part upon which the solder material must be deposited is coated with gold for best adhesion with a solder material consisting of a gold alloy such as AuSn, AuGe, AuSi, and AuAgCu, or other alloys such as AgCu, PbSnAg or other known solder or brazing material which can include some metal alloys of gold, tin, lead, copper, and silver. The oven should be raised to a temperature that will melt the solder, such as about 340 degrees Celsius for AuSn solder, for approximately 15 minutes in order to assure complete melting and joining of the solder material and best adhesion to the component part.
Referring now to FIGS. 8-11, there is shown an alternate embodiment in which a soldering guide or template 101 particularly adapted to deposit a series of short strips, patches or spots 102 of solder, illustrated in dotted lines in FIG. 11 and oriented along an axis X-X′, upon a lead frame 103. The strips 102 will be later used by reflow process to connect outside leads to an electronic package. The template 101 is constituted by a slab of material having a melting temperature substantially higher than melting point of the solder such as a gold alloy solders such Au/Sn solder, preferably, a high density graphite.
The bottom surface 104 of the template is machined to intimately match and rest upon the zone into which the areas wherein the solder is to be deposited are located; in this case, the flat top surface 105 of the lead frame. A series of cavities 106 cut into the bottom face 104 of the template are shaped and dimensioned to congruently fit over the areas to be occupied and delineated by the solder strip 102. The depths D′ of the cavities must be at least as great as the desired height of the solder strip 102. A series of sets 107 of channels or bores 108 are drilled from the upper surface 109 of the template toward the cavities 106. Each set 107 of bores terminates into a number of lower openings 110 regularly spaced-apart in the roof 111 of a cavity along a line substantially parallel to the axis X-X′ of the cavities.
It should be understood that if the limited area that will receive the solder is a small spot, the cavity may be circular and be fed by a single channel or bore.
As illustrated in FIGS. 12 and 13, a quadrangular template 112 is specifically intended for use in depositing a continuous bead 113 of solder along a marginal, peripheral area of an electronic package lid 114 in accordance with the present embodiment. A cavity 115 matching the outline of the desired bead 113 is cut into the bottom surface 116 of the template 112. Bores 17 have their lower openings distributed at regularly spaced-apart locations along the roof of the cavity 115.
FIG. 13 illustrates the positioning of the template 112 over the package lid 114 within a special jig or fixture 118. A solder particle 119 of a defined volume shape such as a sphere and constituted by a metered volume of solder is inserted in the upper opening 120 of each bore.
The whole assembly 121 comprising the fixture 118, the package lid 114 and the loaded template 112 is then placed into an oven and exposed to a temperature sufficient to melt the solder under a controlled atmosphere. When melting, the solder from the particles flows into the cavities and deposits very accurately in the area limited by the overhead cavity 115. The solder is distributed evenly in a continuous strip to a thickness that depends upon the size and number of the solder particles 119.
After a cooling period, the template 112 is removed leaving a narrow bead of solder on the periphery of the lid 114 for future reflow attachment when the lid is installed upon an electronic package.
The particles 119 of solder are preferably manufactured according to processes well-known to people skilled in the art of metal particle fabrication.
The size of the particles and the diameter of the bores are determined by first calculating the total volume of the soldered strip or spot, that is, the product of superficies of the targeted area times the desired height of the solder deposit. This total volume is then divided by the number of bores leading to the cavity capping that area.
In many electronic package assembly applications where the width of the soldered traces falls within the range of about 0.3 millimeter (12 mils) and about 0.7 millimeter (28 mils), the particles can be spheres having a diameter between about 0.35 millimeter (14 mils) and about 0.65 millimeter (26 mils) with spacing between the bores of approximately 1 millimeter (40 mils). It should be understood that the particles can be provided in shapes other than spheres, such as cylinders, quadrangularly sided shapes such as blocks, or other readily manufactured shapes having a defined volume.

EXAMPLE

For the common Au/Sn solder, the electronic component and template assembly is preferably exposed to a temperature of approximately 360 degrees Celsius for thirty minutes in an oven hot zone under an atmosphere of 5% hydrogen and 95% nitrogen with a gas flow of 10 cubic feet per hour. The assembly is then moved to a cool zone for 20 minutes under continuous gas flow to prevent oxide formation.
While the preferred embodiments of the invention have been described, modifications can be made and other embodiments may be devised without departing from the spirit of the invention and the scope of the appended claims.

Claims

1. A method for accurately depositing a metered volume of solder material of a given melting point on a delineated area of an electronic component part, said method comprising the steps of:

providing a fixture having a top surface shaped and dimensioned for intimate contact with said area, and a melting temperature substantially higher than said melting point;

carving into said top surface a cavity shaped to be congruent with said area;

placing into said cavity a number of particles of said solder material;

positioning said part against said top surface and said particles in contact with said area; and

exposing said fixture and part to a temperature at least equal to said melting point;

whereby the material of said particles melts and adheres to said area.

2. The method of claim 1 which further comprises securing said part upon said fixture with a cover.

3. The method of claim 1, wherein said fixture is made of a material comprising high density graphite.

4. The method of claim 1, wherein said solder material comprises a metal alloy selected from the group consisting of gold alloys, tin alloys, lead alloys, copper alloys, and silver alloys.

5. The method of claim 1, wherein said solder material comprises a metal alloy selected from the group consisting of AuSn, AuGe, AuSi, AuAgCu, AgCu, and PbSnAg.

6. The method of claim 1, wherein said delineated area comprises an electronic package lead frame.

7. The method of claim 1, wherein said delineated area comprises a marginal, peripheral area of a microelectronic package lid.

8. The method of claim 1, wherein said cavity is segmented into a plurality of ditches.

9. The method of claim 8, wherein two of said plurality of ditches are differently dimensioned.

10. The method of claim 1, wherein said particles are laid in a single row into said cavity.

11. The method of claim 1, wherein said particles are substantially uniform.

12. The method of claim 1, wherein said particles are laid in a plurality of rows into said cavity.

13. The method of claim 1, wherein said particles are symmetrical, and have calculated dimensions.

14. The method of claim 1, wherein said particles are spherical, and have a calculated diameter and radius.

15. The method of claim 1, wherein the cumulative volume of said particles is equal to said metered volume.

16. The method of claim 14, wherein said cavity has a constant depth greater than said diameter.

17. The method of claim 1, wherein said step of positioning comprises inverting said fixture and part.

18. The method of claim 14, wherein said cavity has a constant depth lesser than said diameter.

19. The method of claim 1, which further comprises pressing said part against said fixture.

20. The method of claim 14, wherein said cavity has an arcuate bottom of a radius commensurate with the radius of said particles.

21. The method of claim 14, wherein said cavity has a series of spaced-apart bottom separators dimensioned to intimately nest said particles.

22. The method of claim 21, wherein said separators are regularly spaced-apart at a calculated interval.