US20100254109A1 - Mount assembly and method for manufacturing mount assembly - Google Patents
Mount assembly and method for manufacturing mount assembly Download PDFInfo
- Publication number
- US20100254109A1 US20100254109A1 US12/727,706 US72770610A US2010254109A1 US 20100254109 A1 US20100254109 A1 US 20100254109A1 US 72770610 A US72770610 A US 72770610A US 2010254109 A1 US2010254109 A1 US 2010254109A1
- Authority
- US
- United States
- Prior art keywords
- substrate
- mount assembly
- face
- pillar
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
- H05K2201/10318—Surface mounted metallic pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
Definitions
- the present invention relates to a mount assembly and a method for manufacturing the mount assembly.
- an endoscope to perform observation of a subject portion as being inserted into a body cavity of a subject has been known and widely utilized in a medical field and the like.
- Such an endoscope is configured to incorporate an electronic circuit module having electronic components such as an imaging element mounted at the distal end of an elongated flexible insertion device.
- an imaging element mounted at the distal end of an elongated flexible insertion device.
- the distal end of the insertion device has been desired to be thinned and miniaturized. Accordingly, a variety of technologies to miniaturize the electronic circuit module incorporated in the distal end has been disclosed.
- Japanese Laid-open Patent Publication No. 2007-194160 discloses a method for connecting printed substrates in the mutually perpendicular direction.
- the printed substrates are mechanically and electrically connected by inserting a protrusion formed at one printed substrate into a hole formed at the other printed substrate.
- component-mounting units are arranged to be perpendicular to a mount substrate face by arranging the component mounting units on a flexible substrate to be alternated between front and rear sides and folding wiring portions for connecting the respective component-mounting units.
- a mount assembly includes a member in which a mount component is mounted at least on one main face of the member and at which a member connecting electrode is formed; and a connection member that has a pillar-shaped parallel portion arranged so that a longitudinal direction of the parallel portion is parallel to the main face of the member, one end side of the parallel portion being connected to the member connecting electrode.
- a mount assembly includes a plurality of substrates of which main faces are arranged to be mutually parallel; an inter-substrate connection member which connects the substrates; and an inter-member connection member, on a substrate main face of at least one substrate, which has a pillar-shaped parallel portion having the longitudinal direction thereof arranged to be parallel to the substrate main face and having the other end side thereof arranged to be extended to an end of the member main face, and of which one end side is connected to a member connecting electrode formed on the substrate main face.
- a method for manufacturing a mount assembly includes an electrode forming step of forming a member connecting electrode on a main face of a member to which a mount component is mounted for each area to be cut and separated so as to be opposed to each other sandwiching a cutting position; a connecting step of arranging a connection member having a pillar-shaped portion which forms a parallel portion between the opposed member connecting electrodes formed in the electrode forming step so that the pillar-shaped portion is parallel to the main face of the member and to connect both end sides of the pillar-shaped portion respectively to the opposed member connecting electrodes; and an individuating step of dividing the member by cutting at the cutting position.
- FIG. 1 is a partial sectional view which illustrates an example of a mount assembly of a first embodiment
- FIG. 2 is a partial sectional view which illustrates an example of the mount assembly of the first embodiment
- FIG. 3 is a partial sectional view which illustrates a state that a substrate is connected to the mount assembly of the first embodiment
- FIG. 4 is a schematic perspective view which schematically illustrates the entire configuration of an electronic circuit module including the mount assembly of the first embodiment
- FIG. 5 is a partial sectional view which illustrates an example of a mount assembly of a second embodiment
- FIG. 6 is a partial sectional view which illustrates an example of the mount assembly of the second embodiment
- FIG. 7 is a partial sectional view which illustrates a state that a substrate is connected to the mount assembly of the second embodiment
- FIG. 8 is a partial sectional view which illustrates an example of a mount assembly of a third embodiment
- FIG. 9 is a partial sectional view which illustrates an example of the mount assembly of the third embodiment.
- FIG. 10 is a partial sectional view which illustrates a state that a substrate is connected to the mount assembly of the third embodiment
- FIG. 11 is a partial sectional view which illustrates an example of a mount assembly of a fourth embodiment
- FIG. 12 is a partial sectional view which illustrates an example of the mount assembly of the fourth embodiment
- FIG. 13 is a partial sectional view which illustrates a state that a substrate is connected to the mount assembly of the fourth embodiment
- FIG. 14 is a partial sectional view which illustrates an example of a mount assembly of a fifth embodiment
- FIG. 15 is a partial sectional view which illustrates a state that a substrate is connected to the mount assembly of the fifth embodiment
- FIG. 16 is a schematic perspective view which schematically illustrates the entire configuration of an electronic circuit module including the mount assembly of the fifth embodiment
- FIG. 17 is a partial sectional view which illustrates an example of a mount assembly of a sixth embodiment
- FIG. 18 is an explanatory view which illustrates position arrangement of member connecting electrodes formed on a substrate constituting the mount assembly of the sixth embodiment
- FIG. 19 is a side view of the mount assembly of the sixth embodiment viewing from one end side of the substrate;
- FIG. 20 is an explanatory schematic perspective view which illustrates the entire configuration of the mount assembly of the sixth embodiment
- FIG. 21 is an explanatory schematic perspective view which illustrates the entire configuration of the mount assembly of the sixth embodiment
- FIG. 22 is an explanatory view which illustrates a principle of a method for mount assembly manufacturing of a seventh embodiment
- FIG. 23 is an explanatory view which illustrates the principle of the method for mount assembly manufacturing of the seventh embodiment
- FIG. 24 is a schematic perspective view of a mount assembly manufactured by the method for mount assembly manufacturing of the seventh embodiment
- FIG. 25A is an explanatory view which illustrates a specific example of a process of the method for mount assembly manufacturing
- FIG. 25B is an explanatory view which illustrates a specific example of a process subsequent to FIG. 25A ;
- FIG. 25C is an explanatory view which illustrates a specific example of a process subsequent to FIG. 25B ;
- FIG. 26 is a partial sectional view which illustrates a state that a substrate is connected to the mount assembly manufactured by the method for manufacturing of FIGS. 25A to 25C ;
- FIG. 27 is a view which illustrates a modified example of position arrangement of member connecting electrodes formed on a substrate
- FIG. 28 is an explanatory view which illustrates a principle of a method for mount assembly manufacturing of the modified example
- FIG. 29 is a schematic perspective view which illustrates the entire configuration of a mount assembly of an eighth embodiment
- FIG. 30 is a view which illustrates a modified example of the mount assembly
- FIG. 31 is an explanatory view which illustrates a modified example of the method for connecting the other end side of a parallel portion formed on a connection member and a mount assembly connecting electrode;
- FIG. 32 is an explanatory view which illustrates another modified example of the method for connecting the other end side of a parallel portion formed on a connection member and a mount assembly connecting electrode;
- FIG. 33 is a perspective view which illustrates a configuration example of a mount assembly of a ninth embodiment
- FIG. 34 is a perspective view which illustrates the configuration example of the mount assembly of the ninth embodiment.
- FIG. 35 is an explanatory view which illustrates a configuration example of an inter-member connection member of the ninth embodiment
- FIG. 36 is a partial sectional view of the vicinity of the inter-member connection member which illustrates a state that a substrate as another member is connected to the mount assembly;
- FIG. 37 is an explanatory view which illustrates a configuration example of an inter-member connection member of modified example 1;
- FIG. 38 is a partial sectional view of a mount assembly having the inter-member connection member of modified example 1;
- FIG. 39 is an explanatory view which illustrates a configuration example of an inter-member connection member of modified example 2;
- FIG. 40 is a partial sectional view of a mount assembly having the inter-member connection member of modified example 2;
- FIG. 41 is an explanatory view which illustrates a configuration example of an inter-member connection member of modified example 3;
- FIG. 42 is a partial sectional view of a mount assembly having the inter-member connection member of modified example 3;
- FIG. 43 is an explanatory view which illustrates a configuration of an inter-member connection member of modified example 4.
- FIG. 44 is a partial sectional view of a mount assembly having the inter-member connection member of modified example 4.
- FIG. 45 is an explanatory view which illustrates the configuration of an inter-member connection member of a tenth embodiment
- FIG. 46 is a partial sectional view which illustrates a state that a substrate is connected to a mount assembly of the tenth embodiment
- FIG. 47 is a schematic perspective view which schematically illustrates the entire configuration of an electronic circuit module including the mount assembly of the tenth embodiment
- FIG. 48 is a partial sectional view of a mount assembly of an eleventh embodiment
- FIG. 49 is an explanatory view which illustrates position arrangement of member connecting electrodes formed on a first substrate in the eleventh embodiment
- FIG. 50 is a side view of the mount assembly viewing from one end side of the first substrate
- FIG. 51 is an explanatory schematic perspective view which illustrates the entire configuration of the mount assembly of the eleventh embodiment
- FIG. 52A is an explanatory view which illustrates a process of a method for mount assembly manufacturing of a twelfth embodiment
- FIG. 52B is an explanatory view which illustrates a process subsequent to FIG. 52A ;
- FIG. 52C is an explanatory view which illustrates a process subsequent to FIG. 52B ;
- FIG. 52D is an explanatory view which illustrates a process subsequent to FIG. 52C ;
- FIG. 52E is an explanatory view which illustrates a process subsequent to FIG. 52D ;
- FIG. 52F is an explanatory view which illustrates a process subsequent to FIG. 52E ;
- FIG. 53 is an explanatory view which illustrates a principle of a method for mount assembly manufacturing of a thirteenth embodiment
- FIG. 54A is an explanatory view which illustrates a specific example of a process of the method for mount assembly manufacturing of the thirteenth embodiment
- FIG. 54B is an explanatory view which illustrates a specific example of a process subsequent to FIG. 54A ;
- FIG. 54C is an explanatory view which illustrates a specific example of a process subsequent to FIG. 54B ;
- FIG. 55 is a partial sectional view which illustrates a state that a substrate is connected to the mount assembly manufactured by the method for manufacturing of FIGS. 54A to 54C ;
- FIG. 56 is a view which illustrates a modified example of position arrangement of member connecting electrodes formed on a substrate
- FIG. 57 is an explanatory view which illustrates a principle of a method for mount assembly manufacturing of the modified example
- FIG. 58 is a schematic perspective view which illustrates the entire configuration of a mount assembly of a fourteenth embodiment
- FIG. 59 is a partial sectional view of a mount assembly having an inter-member connection member of a modified example
- FIG. 60 is an explanatory view which illustrates a modified example of the method for connecting the other end side of a parallel portion formed on an inter-member connection member and a mount assembly connecting electrode;
- FIG. 61 is an explanatory view which illustrates another modified example of the method for connecting the other end side of a parallel portion formed on an inter-member connection member and a mount assembly connecting electrode.
- FIGS. 1 and 2 are partial sectional views illustrating an example of a mount assembly 1 of the first embodiment.
- the mount assembly 1 of the first embodiment includes a substrate 11 as a member and a connection member 13 .
- Mount components as electronic components such as electronic circuits (not illustrated) are mounted on the upper face as a main face of the substrate 11 , and then, a member connecting electrode 111 is formed at a predetermined position at one end side of the upper face while avoiding the mount components.
- the connection member 13 constituted with a single pillar-shaped member is formed of conductive material and forms a parallel portion.
- connection member 13 is arranged so that the longitudinal direction thereof is parallel to the substrate 11 as a side face of one end of the connection member 13 being contacted to the member connecting electrode 111 and the other end thereof is extended to the outside of the one end of the upper face of the substrate 11 .
- the connection member 13 is formed to have length determined by the distance from the member connecting electrode 111 to the one end of the substrate 11 .
- connection member 13 When manufacturing the mount assembly 1 , the connection member 13 is placed so that the longitudinal direction thereof is parallel to the main face of the substrate 11 , and then, the side face of the one end of the connection member 13 is contacted and connected to the member connecting electrode 111 by soldering and the like, for example. Subsequently, as illustrated in FIG. 2 , the vicinity of the connecting part between the member connecting electrode 111 and the connection member 13 is fixed and protected by being sealed with a resin 151 as a reinforcing member. With this configuration, reliability of the mount assembly 1 can be improved and handling as a component can be eased.
- FIG. 3 is a partial sectional view illustrating a state that a substrate 17 as another member is connected to the mount assembly 1 .
- the substrate 17 is arranged so that the right side face in FIG. 3 as a main face is directed to the substrate 11 side and the main face thereof is perpendicular to the main face of the substrate 11 at the outside of the one end of the substrate 11 .
- a mount assembly connecting electrode 171 is formed at a predetermined position of the right side face of the substrate 17 and is contacted and connected to the other end face of the connection member 13 extended to the outside of the one end of the substrate 11 by soldering and the like.
- the member connecting electrode 111 and the mount assembly connecting electrode 171 are connected, so that the mount assembly 1 and the substrate 17 are mechanically and electrically connected. Further, the vicinity of the connecting part between the mount assembly connecting electrode 171 and the connection member 13 is fixed and protected by being sealed with a resin 153 .
- connection member 13 constituted with the single pillar-shaped member it is possible to arrange the connection member 13 constituted with the single pillar-shaped member to be parallel to the main face of the substrate 11 , while one end thereof is connected to the member connecting electrode 111 which is formed at the main face of the substrate 11 and the other end is extended to the outside of the one end of the upper face of the substrate 11 .
- another member such as the substrate 17 which is arranged at the other end of the parallel portion so that the main face thereof is perpendicular to the main face of the substrate 11 can be connected. Accordingly, since it is only needed to connect the conductive connection member 13 to the member connecting electrode 111 on the substrate 11 without performing special processing on respective members to be connected, other members can be easily connected in high density.
- the member connecting electrode 111 and the mount assembly connecting electrode 171 can be connected with the pillar-shaped connection member 13 .
- the diameter of the connection member 13 is appropriately enlarged in consideration of the space on the substrate 11 . Accordingly, compared to a case of forming a wiring pattern on a substrate for connection, reliable connection can be actualized at low resistance.
- FIG. 4 is a schematic perspective view which schematically illustrates the entire configuration of an electronic circuit module 2 including the mount assembly of the first embodiment.
- the electronic circuit module 2 in FIG. 4 is provided with a plurality (i.e., five in the example of FIG. 4 ) of mount components 29 mounted on the upper face as a main face.
- the electronic circuit module 2 is provided with a substrate 21 having a plurality (i.e., four in the example of FIG. 4 ) of member connecting electrodes 211 formed at ends of short sides thereof and four connection members 231 to 234 having the longitudinal direction thereof arranged to be parallel to the main face of the substrate 21 and having one end respectively connected to the member connecting electrodes 211 .
- the electronic circuit module 2 includes the mount assembly described in the first embodiment.
- two substrates 271 , 272 are arranged at the outside of the respective short sides of the substrate 21 so that the main faces thereof are directed to the substrate 21 side and are perpendicular to the main face of the substrate 21 .
- the substrate 271 is connected by the connection members 231 , 232 and the substrate 272 is connected by the connection members 233 , 234 . Accordingly, in the electronic circuit module 2 including the mount assembly of the first embodiment, it is possible to mount the substrates 271 , 272 as other members on the mount assembly in high density.
- the member connecting electrode is formed at the end of a long side and another member such as a substrate is connected to the outside thereof.
- FIGS. 5 and 6 are partial sectional views illustrating an example of a mount assembly 3 of the second embodiment.
- the mount assembly 3 of the second embodiment includes a substrate 31 and two types of connection members 331 , 333 .
- Mount components (not illustrated) are mounted on the upper face as a main face of the substrate 31 , and then, member connecting electrodes 311 , 313 are formed at predetermined positions at one end side of the upper face while avoiding the mount components.
- connection member 331 is configured to be similar to the connection member 13 of the first embodiment. That is, the connection member 331 is arranged so that the longitudinal direction thereof is parallel to the substrate 31 as a side face of one end of the connection member 331 being contacted to the member connecting electrode 311 and the other end thereof is extended to the outside of the one end of the substrate 31 . Meanwhile, the connection member 333 is constituted with a first pillar-shaped member 334 and a second pillar-shaped member 335 which are formed of conductive material respectively.
- connection member 333 has an approximately L-shaped external shape in a state that one end face of the second pillar-shaped member 335 which supports the first pillar-shaped member 334 is connected to a side face of one end of the first pillar-shaped member 334 forming a parallel portion.
- the other end face of the second pillar-shaped member 335 of the connection member 333 is connected to the member connecting electrode 313 .
- the first pillar-shaped member 334 is arranged so that the longitudinal direction thereof is parallel to the main face of the substrate 31 and the other end thereof is extended to the outside of the one end of the substrate 31 .
- the length of the second pillar-shaped member 335 is determined so that the parallel portions of the respective connection members 331 , 333 which are arranged one above the other (i.e., the connection member 331 and the first pillar-shaped member 334 of the connection member 333 ) are not mutually contacted, in accordance with the position of a mount assembly connecting electrode of another member to be connected to the member connecting electrode 313 by the connection member 333 (i.e., in accordance with the height of the mount assembly connecting electrode of another member against the position of the main face of the substrate 31 ).
- connection member 331 When manufacturing the mount assembly 3 , the connection member 331 is placed so that the longitudinal direction thereof is parallel to the main face of the substrate 31 , and then, the side face of the one end of the connection member 331 is contacted and connected to the member connecting electrode 311 by soldering and the like, for example. Further, the other end face of the second pillar-shaped member 335 is connected to the member connecting electrode 313 as being vertically arranged thereon. Subsequently, the first pillar-shaped member 334 is placed so that the longitudinal direction thereof is parallel to the main face of the substrate 31 , and then, the side face of the one end thereof is contacted to the one end face of the second pillar-shaped member 335 and connected thereto via a metallic film.
- the side face of the one end of the first pillar-shaped member 334 and the one end face of the second pillar-shaped member 335 are previously connected by soldering and the like.
- a protection layer 351 is formed by filling resin onto the substrate 31 after the other end face of the second pillar-shaped member 335 is connected to the member connecting electrode 313 as being vertically arranged while connecting the connection member 331 to the member connecting electrode 311 .
- the vicinity of the connecting part between the first pillar-shaped member 334 and the second pillar-shaped member 335 is sealed with a resin 352 .
- FIG. 7 is a partial sectional view illustrating a state that a substrate 37 as another member is connected to the mount assembly 3 .
- the substrate 37 is arranged so that the right side face in FIG. 7 as a main face thereof is directed to the substrate 31 side and the main face thereof is perpendicular to the main face of the substrate 31 at the outside of one end of the substrate 31 .
- mount assembly connecting electrodes 371 , 373 are formed at predetermined positions of the right side face of the substrate 37 and are contacted and connected respectively to the other end faces of the connection members 331 , 333 extended to the outside of the one end of the substrate 31 by soldering and the like.
- the member connecting electrode 311 and the mount assembly connecting electrode 371 are connected and the member connecting electrode 313 and the mount assembly connecting electrode 373 are connected, so that the mount assembly 3 and the substrate 37 are mechanically and electrically connected.
- the vicinity of the connecting part between the mount assembly connecting electrode 371 and the connection member 331 is sealed with a resin 353 and the vicinity of the connecting part between the mount assembly connecting electrode 373 and the connection member 333 is sealed with a resin 354 , so that the vicinities of the connection parts are fixed and protected.
- connection member 333 having predetermined height by adjusting the length of the second pillar-shaped member 335 while obtaining similar effects to those of the first embodiment.
- connection can be achieved with overlapped arrangement of the parallel portions not to be mutually contacted. Accordingly, since the space above the substrate 31 can be effectively utilized, design flexibility is increased.
- connection members 331 , 333 it is also possible to utilize combination of connection members which are respectively configured to have different height of the parallel portion against the main face of the substrate 31 with second pillar-shaped members of different length.
- FIGS. 8 and 9 are partial sectional views illustrating an example of a mount assembly 4 of the third embodiment.
- the mount assembly 4 of the third embodiment includes a substrate 41 and a connection member 433 .
- Mount components (not illustrated) are mounted on the upper face as a main face of the substrate 41 , and then, a member connecting electrode 411 is formed at a predetermined position at one end side of the upper face while avoiding the mount components.
- the connection member 433 is constituted with a first pillar-shaped member 434 and a second pillar-shaped member 435 which are formed of conductive material respectively.
- One end face of the first pillar-shaped member 434 is connected to a side face of the second pillar-shaped member 435 .
- the first pillar-shaped member 434 is arranged so that the longitudinal direction thereof is parallel to the main face of the substrate 41 and the other end thereof is extended to the outside of the one end of the substrate 41 .
- the connecting position of the first pillar-shaped member 434 with respect to the second pillar-shaped member 435 is determined in accordance with the position of a mount assembly connecting electrode of another member to be connected to the member connecting electrode 411 by the connection member 433 (i.e., in accordance with the height of the mount assembly connecting electrode of another member against the main face position of the substrate 41 ), for example.
- the one end face of the first pillar-shaped member 434 is previously connected to the side face of the second pillar-shaped member 435 via a metallic film, for example. Then, the first pillar-shaped member 434 is placed so that the longitudinal direction thereof is parallel to the main face of the substrate 41 and the other end thereof is extended to the outside of the one end of the substrate 41 . Subsequently, the one end face of the second pillar-shaped member 435 is connected to the member connecting electrode 411 as being vertically arranged thereon.
- the vicinity of the connecting part may be fixed and protected by sealing the connecting part between the substrate 41 and the connection member 433 with resin.
- a protection layer 451 is formed by filling resin onto the substrate 41 after the second pillar-shaped member 435 is connected to the member connecting electrode 411 .
- FIG. 10 is a partial sectional view illustrating a state that a substrate 47 as another member is connected to the mount assembly 4 .
- the substrate 47 is arranged so that the right side face in FIG. 10 as a main face thereof is directed to the substrate 41 side and the main face thereof is perpendicular to the main face of the substrate 41 at the outside of the one end of the substrate 41 .
- a mount assembly connecting electrode 471 is formed at a predetermined position of the right side face of the substrate 47 and is contacted and connected to the other end face of the connection member 433 extended to the outside of the one end of the substrate 41 by soldering and the like.
- the member connecting electrode 411 and the mount assembly connecting electrode 471 are connected, so that the mount assembly 4 and the substrate 41 are mechanically and electrically connected. Further, the vicinity of the connecting part between the mount assembly connecting electrode 471 and the connection member 433 is sealed with a resin 453 , so that the vicinity of the connecting part is fixed and protected.
- the mount assembly 4 of the third embodiment similar effects to those of the first embodiment can be obtained.
- the height of the parallel portion (i.e., the first pillar-shaped member 434 ) against the main face of the substrate 41 can be adjusted by adjusting the connecting position of the first pillar-shaped member 434 against the second pillar-shaped member 435 . Accordingly, it is not necessary to form the second pillar-shaped member having different length for height adjustment unlike the second embodiment, so that cost can be reduced.
- connection member 433 it is also possible to utilize it in combination with the connection members described in the first and second embodiments.
- the connecting position of the first pillar-shaped member against the second pillar-shaped member is adjusted so as not cause mutual contacting of the parallel portions.
- connection members which are respectively configured to have different height of the parallel portion against the main face of the substrate 41 by differently arranging the connecting position of the first pillar-shaped member against the second pillar-shaped member.
- FIGS. 11 and 12 are partial sectional views illustrating an example of a mount assembly 5 of the fourth embodiment.
- the mount assembly 5 of the fourth embodiment includes a substrate 51 and a connection member 53 .
- Mount components (not illustrated) are mounted on the upper face as a main face of the substrate 51 , and then, a member connecting electrode 511 is formed at a predetermined position at one end side of the upper face while avoiding the mount components.
- the connection member 53 is configured to integrate the first and second pillar-shaped members which constitute the connection member 333 of the second embodiment or the connection member 433 of the third embodiment. In the example of FIG.
- connection member 53 has an L-shaped external shape obtained by bending a single pillar-shaped member formed of conductive material at a midpoint to form a parallel portion 531 . Then, the connection member 53 is arranged so that the proximal end thereof is contacted to the member connecting electrode 511 , the parallel portion 531 is parallel to the main face of the substrate 51 and the distal end thereof is extended to the outside of the one end of the substrate 51 .
- the length from the proximal end to the midpoint of the connection member 53 is determined in accordance with the position of a mount assembly connecting electrode of another member to be connected to the member connecting electrode 511 by the connection member 53 (i.e., in accordance with the height of the mount assembly connecting electrode of another member against the main face position of the substrate 51 ).
- the parallel portion 531 of the connection member 53 is arranged to be parallel to the substrate 51 . Then, the proximal end of the parallel portion 531 is connected to the member connecting electrode 511 as being vertically arranged thereon so that the distal end thereof is extended to the outside of the one end of the substrate 51 .
- the vicinity of the connecting part may be fixed and protected by sealing the connecting part between the substrate 51 and the connection member 53 with resin.
- a protection layer 551 is formed by filling resin onto the substrate 51 after the proximal end of the connection member 53 is connected to the member connecting electrode 511 .
- FIG. 13 is a partial sectional view illustrating a state that a substrate 57 as another member is connected to the mount assembly 5 .
- the substrate 57 is arranged so that the right side face in FIG. 13 as a main face thereof is directed to the substrate 51 side and the main face thereof is perpendicular to the main face of the substrate 51 at the outside of the one end of the substrate 51 .
- a mount assembly connecting electrode 571 is formed at a predetermined position of the right side face of the substrate 57 and is contacted and connected to the other end face of the connection member 53 extended to the outside of the one end of the substrate 51 by soldering and the like.
- the member connecting electrode 511 and the mount assembly connecting electrode 571 are connected, so that the mount assembly 5 and the substrate 57 are mechanically and electrically connected. Further, the vicinity of the connecting part between the mount assembly connecting electrode 571 and the connection member 53 is sealed with a resin 553 , so that the vicinity of the connecting part is fixed and protected.
- the mount assembly 5 of the fourth embodiment similar effects to those of the first embodiment can be obtained.
- connection member 53 it is also possible to utilize it in combination with the connection members described in the first to third embodiments. In this case, the length from the proximal end to the midpoint is adjusted so as not cause mutual contacting of the parallel portions. Further, it is also possible to utilize combination of connection members which are configured to have different height of the parallel portion against the main face of the substrate 51 by differently arranging the length from the proximal end to the midpoint.
- FIG. 14 is a partial sectional view illustrating an example of a mount assembly 6 of the fifth embodiment.
- the mount assembly 6 of the fifth embodiment includes a substrate 61 and a connection member 63 which is configured to be similar to the connection member 53 of the fourth embodiment.
- Mount components (not illustrated) are mounted on the upper face as a main face of the substrate 61 , and then, a member connecting electrode 611 is formed at a predetermined position at one end side of the upper face while avoiding the mount components.
- the connection member 63 is arranged so that the proximal end is contacted to the member connecting electrode 611 and the longitudinal direction of a parallel portion 631 is parallel to the substrate 61 , as similar to the fourth embodiment.
- the distal end of the parallel portion 631 is located above the substrate 61 .
- FIG. 15 is a partial sectional view illustrating a state that a substrate 67 as another member is connected to the mount assembly 6 .
- the substrate 67 is arranged so that a main face thereof is perpendicular to the main face of the substrate 61 above the substrate 61 .
- a mount assembly connecting electrode 671 is formed at a predetermined position of the right side face of the substrate 67 in FIG. 15 as the main face thereof and is contacted and connected to the other end face of the connection member 63 extended to the outside of the one end of the substrate 61 by soldering and the like.
- the member connecting electrode 611 and the mount assembly connecting electrode 671 are connected, so that the mount assembly 6 and the substrate 67 are mechanically and electrically connected.
- the vicinity of the connecting part between the mount assembly connecting electrode 671 and the connection member 63 may be sealed with resin.
- the fifth embodiment it is possible to connect the substrate 67 at the inside of the mount assembly 6 so that the main face thereof is arranged to be perpendicular to the main face of the substrate 61 while obtaining similar effects to those of the fourth embodiment. Therefore, it is possible to actualize the mount assembly 6 having other members such as the substrate 67 connected thereto in higher density.
- the above description is performed on the case that the connection member constituted as in the fourth embodiment is applied.
- the connection members having other configurations described in the first to third embodiments may be similarly applied.
- FIG. 16 is a schematic perspective view which schematically illustrates the entire configuration of an electronic circuit module 7 including the mount assembly of the fifth embodiment.
- the electronic circuit module 7 in FIG. 16 is provided with a substrate 71 having a plurality of member connecting electrodes 711 formed at short side ends of the upper face as a main face (i.e., two each at both short side ends in the example of FIG. 16 ) and having a plurality of member connecting electrodes 712 (i.e., two in the example of FIG. 16 ) formed at predetermined positions at the center thereof.
- the electronic circuit module 7 includes connection members 731 to 736 connected to the respective member connecting electrodes 711 , 712 at the proximal ends thereof and includes the mount assembly of the fifth embodiment.
- Two substrates 771 , 772 are arranged at the outside of respective short sides of the substrate 71 so that respective main faces thereof are perpendicular to the main face of the substrate 71 .
- the substrate 771 is connected by the connection members 731 , 732 and the substrate 772 is connected by the connection members 733 , 734 .
- one substrate 773 is arranged on the substrate 71 so that a main face thereof is perpendicular to the main face of the substrate 71 and the substrate 773 is connected by the connection members 735 , 736 .
- mount components (not illustrated) are mounted on the substrate 71 , the substrate 773 is connected while avoiding the mount components.
- the electronic circuit module 7 including the mount assembly of the fifth embodiment other members such as the substrate 773 can be connected to the inside of the mount assembly (i.e., above the substrate 71 ) as well, so that the space above the substrate 71 can be effectively utilized. Therefore, it is possible to configure the electronic circuit module 7 to mount the substrates 771 , 772 , 773 as other members against the mount assembly in higher density.
- the substrates 771 , 772 , 773 it is also possible to form member connecting electrodes at an end of the long side and to connect other members such as a substrate at the outside thereof.
- FIG. 17 is a partial sectional view illustrating an example of a mount assembly 8 of the sixth embodiment.
- FIG. 18 is an explanatory view illustrating position arrangement of member connecting electrodes 811 , 813 formed on a substrate 81 .
- FIG. 19 is a side view of the mount assembly viewing from one end side of the substrate 81 .
- the mount assembly 8 of the sixth embodiment includes the substrate 81 and two types of connection members 831 , 833 .
- mount components (not illustrated) are mounted at the upper face as a main face of the substrate 81 and member connecting electrodes 811 , 813 are formed at predetermined positions of the one end side of the upper face while avoiding the mount components.
- FIG. 18 is an explanatory view illustrating position arrangement of member connecting electrodes 811 , 813 formed on a substrate 81 .
- FIG. 19 is a side view of the mount assembly viewing from one end side of the substrate 81 .
- the mount assembly 8 of the sixth embodiment includes the substrate 81 and two types of connection members
- connection members 831 are respectively connected to three of the member connecting electrodes 811 on the outer row and the connection members 833 are respectively connected to two of the member connecting electrodes 813 on the inner row.
- the height of the connection members 833 is determined so as not to cause interference between parallel portions of the connection members 831 and the connection members 833 in the vertical direction. As illustrated in FIG.
- connection members 831 , 833 are adjacently arranged so that the height of the parallel portions from the main face of the substrate 81 is alternately to be high and to be low.
- the connection members described in the first to fourth embodiments can be utilized as being appropriately combined for the combination of connection members respectively having different height of each parallel portion from the main face of the substrate 81 .
- FIGS. 20 and 21 are schematic perspective views illustrating the entire configuration of the mount assembly 8 of the sixth embodiment.
- FIG. 20 illustrates an example of the inner configuration of the mount assembly 8 .
- a plurality i.e., six in the example of FIG. 20
- mount components 891 to 896 are mounted on the substrate 81 of the mount assembly 8 .
- two types of the connection members 831 and the connection members 833 i.e., three of the connection members 831 and two of the connection members 833
- connection members 831 and the connection members 833 are also arranged at the other end of the substrate 81 and are connected respectively to the member connecting electrodes (not illustrated) on the substrate 81 .
- U-shaped inter-electrode connection members 835 , 836 respectively having different height are arranged on the substrate 81 .
- the respective inter-electrode connection members 835 , 836 are arranged so that the parts formed to be parallel to the main face of the substrate 81 are sterically intersected above the mount components 893 , 896 .
- the inter-electrode connection members 835 , 836 connect the electrodes (not illustrated) as the connecting target formed on the substrate 81 .
- the mount assembly 8 is sealed with a resin 85 in order to fix and protect inner members such as the mount components 891 to 896 and the connection members 831 , 833 and is modularized by performing polishing and the like on end faces thereof.
- inner members such as the mount components 891 to 896 and the connection members 831 , 833
- the mount assembly 8 of the sixth embodiment it is possible to arrange the parallel portions of the adjacent connection members 831 , 833 with a small pitch so that the mount assembly 8 can be miniaturized while obtaining similar effects to those of the abovementioned embodiments.
- the electrodes on the substrate 81 can be sterically connected by utilizing appropriate combination of the connection members 831 , 833 respectively having different height of the portion arranged to be parallel to the main face of the substrate 81 . With this configuration, the space above the substrate 81 can be effectively utilized and miniaturization can be achieved.
- reliable connection can be actualized at low resistance.
- the other end of the parallel portion formed at the connection member is extended to the outside of the one end of the upper face of the substrate constituting the mount assembly.
- the other end of the parallel portion is only required to be extended at least to the one end edge of the upper face of the substrate.
- an end face of a protection layer at one end side of the substrate is polished after forming the protection layer by filling resin onto the substrate, for example. In this manner, the other end face of the parallel portion may be exposed from a side face at the one end side of the mount assembly.
- the mount assembly is produced (i.e., manufactured) as a single body.
- a method for manufacturing a mount assembly is not limited to this.
- the seventh embodiment relates to a method for manufacturing a mount assembly.
- FIGS. 22 and 23 are explanatory views illustrating a principle of the method for mount assembly manufacturing of the seventh embodiment.
- FIG. 24 is a schematic perspective view of a mount assembly 9 manufactured by the method for mount assembly manufacturing of the seventh embodiment.
- the plurality of mount assemblies 9 are simultaneously produced on a single substrate 91 .
- mount components (not illustrated) are mounted on each section area A 9 defined by cutting positions as illustrated by dashed lines in FIG. 22 .
- the plurality of mount assemblies 9 are separated (i.e., individuated) by being cut at the cutting positions for the last time.
- member connecting electrodes 911 , 911 are formed on the main face of the substrate 91 sandwiching the cutting position as being opposed to each other.
- two couples of opposed member connecting electrodes 911 , 911 are formed respectively at an end of each section area A 9 as sandwiching each side.
- a member 93 having a pillar-shaped portion 931 to be a connection member when individuated into respective mount assemblies 9 as illustrated in FIG. 23 is placed between the opposed member connecting electrodes 911 , 911 .
- the pillar-shaped portion 931 forms a parallel portion of the connection member and the member 93 is arranged so that the pillar-shaped portion 931 passes over the cutting position.
- the modularized mount assembly 9 can be obtained as illustrated in FIG. 24 by being individuated by being cut at the cutting positions for the last time.
- FIGS. 25A to 25C are explanatory views illustrating a specific example of respective processes in the present method for mount assembly manufacturing.
- FIG. 26 is a partial sectional view illustrating a state that substrates 97 - 1 , 97 - 2 as other members are connected to the manufactured mount assemblies 9 ( 9 - 1 , 9 - 2 ).
- mount components (not illustrated) are previously mounted on the main face of the substrate 91 .
- the member connecting electrodes 911 , 911 are formed at the positions being opposed to each other sandwiching the cutting position indicated by a dashed line in FIG.
- each second pillar-shaped member 935 is connected to each member connecting electrode 911 as a support portion by soldering and the like as being vertically arranged thereon.
- the upper face of the protection layer 951 is polished to be planarized, so that the other end faces of the second pillar-shaped members 935 , 935 are exposed.
- metallic films 96 , 96 are formed at the other end faces of the exposed second pillar-shaped members 935 , 935 .
- a single pillar-shaped member 934 corresponding to the pillar-shaped portion 931 is arranged to be parallel to the main face of the substrate 91 , so that side faces of both ends are connected respectively to the other end faces of the second pillar-shaped members 935 , 935 via the metallic films 96 , 96 .
- the vicinity of the connecting part between the pillar-shaped member 934 and the metallic films 96 , 96 is sealed with a resin 952 and is fixed and protected.
- the mount assemblies 9 ( 9 - 1 , 9 - 2 ) are obtained by individuating with dicing, as illustrated in FIG. 25C .
- the mount assemblies 9 - 1 , 9 - 2 manufactured as described above are connected to the substrates 97 - 1 , 97 - 2 as other members respectively having a mount assembly connecting electrode 971 formed on a main face being similar to the abovementioned embodiments.
- the substrate 97 - 1 is arranged so that the left side face in FIG. 26 as the main face is directed to a substrate 91 - 1 side and the main face thereof is perpendicular to the main face of the substrate 91 - 1 at the outside of one end of the substrate 91 - 1 .
- the mount assembly connecting electrode 971 of the substrate 97 - 1 is connected to the other end face of the connection member 93 extended to the outside of the one end of the substrate 91 - 1 , so that the mount assembly 9 - 1 and the substrate 97 - 1 are mechanically and electrically connected.
- the substrate 97 - 2 is arranged so that the right side face in FIG. 26 as a main face is directed to a substrate 91 - 2 side and the main face thereof is perpendicular to the main face of the substrate 91 - 2 at the outside of the one end of the substrate 91 - 2 .
- the mount assembly connecting electrode 971 of the substrate 97 - 2 is connected to the other end face of the connection member 93 extended to the outside of the one end of the substrate 91 - 2 , so that the mount assembly 9 - 2 and the substrate 97 - 2 are mechanically and electrically connected.
- connection member having the configuration of the second embodiment is adopted.
- connection members of other configurations described in the first, third and forth embodiments can be also adopted similarly.
- an externally U-shaped member having support portions integrally formed at both ends of a pillar-shaped portion which forms a parallel portion is prepared.
- proximal ends of the respective support portions which are vertically arranged are connected onto the respective member connecting electrodes being opposed as sandwiching the cutting position while the pillar-shaped portion is arranged to be parallel to the main face of the substrate.
- FIG. 27 is a view illustrating a modified example of position arrangement of member connecting electrodes 1011 formed on a substrate 101 .
- FIG. 28 is an explanatory view illustrating a principle of a method for mount assembly manufacturing of the present modified example.
- FIG. 27 on a main face of the mount assembly manufactured by the method for manufacturing of the present modified example, three of member connecting electrodes 1011 are formed at the left end of the substrate 101 in FIG. 27 and one member connecting electrode 1011 is formed at the right end. In addition, two member connecting electrodes 1011 are formed respectively at the upper end and lower end.
- the respective member connecting electrodes 1011 are formed at the substrate 10 so that positions of the member connecting electrodes 1011 formed at adjacent section areas A 10 are to be mutually axisymmetric sandwiching a cutting position indicated by a dashed line in FIG. 28 .
- simultaneous producing can be performed even in the case that the number (including zero) of the member connecting electrodes to be formed at the end of the substrate differs for each end. More specifically, the simultaneous producing can be performed even in the case that the number of the member connecting electrodes formed at one opposed end is not the same, as long as the number of the member connecting electrodes formed at the other opposed end is the same.
- FIG. 29 is a schematic perspective view illustrating the entire configuration of a mount assembly 1100 of the eighth embodiment.
- a plurality i.e. nine in the example of FIG. 29
- other ends of connection members 1131 to 1139 are exposed at an end face of a protection layer 1150 on a substrate 1110 .
- a plurality i.e., four in the example of FIG. 29
- side face connecting electrodes 1151 to 1154 are formed at the end face, so that the side face connecting electrodes 1151 to 1154 are connected to other members respectively having a mount assembly connecting electrode formed on a main face thereof.
- connection member 1132 and the side face connecting electrode 1151 are connected via a wiring pattern P 1110 .
- the other end of the connection member 1138 and the side face connecting electrode 1152 are connected via a wiring pattern P 1130 .
- the other end of the connection member 1135 and the side face connecting electrode 1153 are connected via a wiring pattern P 1150 .
- the wiring patterns P 1110 , P 1130 , P 1150 are formed at the end face of the protection layer 1150 .
- the wiring patterns P 1110 , P 1130 , P 1150 can be formed by appropriately utilizing a thin-film method, an ink-jet method and the like, for example. At that time, it is also possible to form an insulating protection film at a part of the end face of the protection layer 1150 other than the side face connecting electrodes 1151 to 1154 .
- the side face connecting electrodes 1151 to 1154 to be connected to other members can be formed at the end face of the protection layer 1150 , connecting positions in the mount assembly 1100 with other members can be flexibly adjusted and design flexibility can be increased.
- FIG. 30 is a view illustrating an example of a modified example of a mount assembly 1200 .
- FIG. 30 illustrates a scene to connect a substrate 1270 as another member to the mount assembly 1200 .
- the mount assembly 1200 of the present modified example includes a substrate 1210 and two types of connection members 1231 , 1233 .
- a mount component 1290 is mounted on the upper face as a main face of the substrate 1210 , and then, a member connecting electrode 1211 is formed at a predetermined position at one end side of the upper face while avoiding the mount component 1290 .
- connection member 1231 is constituted similarly to the connection member 13 of the first embodiment.
- connection member 1233 is constituted similarly to the connection member 333 of the second embodiment.
- one end face of a second pillar-shaped member 1235 of the connection member 1233 is connected to a member connecting electrode 1291 formed on a main face of the mount component 1290 .
- a first pillar-shaped member 1234 is arranged so that the longitudinal direction thereof is parallel to the main face of the substrate 1210 (i.e., parallel to the main face of the mount component 1290 ) and the other end thereof is extended to the outside of the one end of the substrate 1210 .
- the mount assembly 1200 is connected to the substrate 1270 as another member having mount assembly connecting electrodes 1271 , 1273 formed on the main face thereof being similar to the abovementioned embodiments.
- the length of the second pillar-shaped member 1235 of the connection member 1233 is determined in accordance with the position of the mount assembly connecting electrode 1273 of the substrate 1270 connected to the member connecting electrode 1291 by the connection member 1233 (i.e., in accordance with the height of the mount assembly connecting electrode 1273 of the substrate 1270 against the main face position of the mount component 1290 where the member connecting electrode 1291 is formed).
- connection member of the connection member of the fourth embodiment is connected to the mount assembly connecting electrode formed at another member such as the substrate.
- the present invention is not limited to this.
- a modified example will be described having a connection member of a similar configuration to the connection member of the fourth embodiment as an example.
- connection members of the other configurations described in the first to third embodiments may be similarly adopted.
- FIG. 31 is an explanatory view of the modified example of a connection method between the other end side of a parallel portion 1331 formed at a connection member 1330 and a mount assembly connecting electrode 1371 of a substrate 1370 as another member.
- the proximal end of the connection member 1330 is connected to a member connecting electrode 1311 and a protection layer 1350 is formed by filling resin onto a substrate 1310 .
- a projection portion at the distal end side of the parallel portion 1331 of the connection member 1330 is folded upward, for example, along an end face of the protection layer 1350 .
- a mount assembly 1300 is connected to the substrate 1370 as another member where the mount assembly connecting electrode 1371 is formed.
- a side face of the other end of the folded parallel portion 1331 is connected to the mount assembly connecting electrode 1371 .
- the connection area of the parallel portion 1331 against the mount assembly connecting electrode 1371 can be widely ensured, so that the connection strength therebetween can be enhanced.
- FIG. 32 is an explanatory view of another modified example of a connection method of the other end side of a parallel portion 1431 formed at a connection member 1430 and a mount assembly connecting electrode 1471 of a substrate 1470 as another member.
- the other end side of the parallel portion 1431 is folded upward, for example, after the proximal end of the connection member 1430 is connected to a member connecting electrode 1411 .
- a protection layer 1450 is formed by filling resin onto a substrate 1410 and a side face of the other end of the parallel portion 1431 is exposed by polishing an end face of the protection layer 1450 at one end side of the substrate 1410 .
- a mount assembly 1400 is connected to the substrate 1470 as another member where the mount assembly connecting electrode 1471 is formed. Specifically, the side face of the other end of the exposed parallel portion 1431 is connected to the mount assembly connecting electrode 1471 . Similarly in this case, the connection area of the parallel portion 1431 against the mount assembly connecting electrode 1471 can be widely ensured, so that the connection strength therebetween can be enhanced.
- the substrate described as an example of a member constituting a mount assembly or another member may be an interconnection substrate having a wiring pattern formed or may be a substrate where an electronic circuit and the like are mounted inside.
- the substrate is connected to the mount assembly.
- another member to be the connection target is not limited to a substrate.
- the present invention can be applied to a case that a member such as an electronic component and an electronic circuit module is arranged so that a main face thereof is perpendicular to a main face of a substrate and is connected thereto.
- FIGS. 33 and 34 are perspective views illustrating a configuration example of a mount assembly 1 a of the ninth embodiment.
- a first substrate 11 a and a second substrate 13 a constituting the mount assembly 1 a are illustrated as being separated.
- the first substrate 11 a and the second substrate 13 a are illustrated in a connected state.
- the mount assembly 1 a in FIG. 33 is illustrated as being separated.
- the 33 includes the first substrate 11 a and the second substrate 13 a which are arranged to be opposed as main faces thereof being mutually parallel, an inter-substrate connection member 15 a which mechanically and electrically connects the first substrate 11 a and the second substrate 13 a , and an inter-member connection member 17 a which connects another member arranged at a side of the mount assembly 1 a.
- mount components C 11 as electronic components such as electronic circuits are mounted on the upper face as a main face.
- a plurality (i.e., four in the example of FIG. 33 ) of substrate connecting electrodes 111 a are formed at predetermined positions of the upper face avoiding the mount components C 11 and a plurality (i.e., three each at each short side in the example of FIG. 33 ) of member connecting electrodes 113 a are formed at predetermined positions of short side ends.
- mount components C 13 as electronic components such as electronic circuits are mounted on the upper face and substrate connecting electrodes 131 a are formed on the lower face.
- the substrate connecting electrodes 131 a are formed respectively at the positions which are to be opposed to the substrate connecting electrodes 111 a of the first substrate 11 a when the first substrate 11 a and the second substrate 13 a are arranged to be opposed.
- the inter-substrate connection member 15 a is a pillar-shaped member formed of conductive material.
- the inter-substrate connection member 15 a connects the first substrate 11 a and the second substrate 13 a as one end face being contacted to the substrate connecting electrode 111 a of the first substrate 11 a and the other end face being contacted to the substrate connecting electrode 131 a of the second substrate 13 a .
- the inter-substrate connection member 15 a is formed to have length determined by the height from the main face of the first substrate 11 a to the lower face of the second substrate 13 a.
- the inter-member connection member 17 a is constituted with a single pillar-shaped member formed of conductive material.
- FIG. 35 is an explanatory view illustrating a configuration example of the inter-member connection member 17 a .
- the inter-member connection member 17 a forms a parallel portion while being arranged so that the longitudinal direction thereof is parallel to the first substrate 11 a as a side face of one end being contacted to the member connecting electrode 113 a and the other end being extended to the outside of the one end of the upper face of the first substrate 11 a .
- the inter-member connection member 17 a is formed to have length determined by the distance from the member connecting electrode 113 a to the one end of the first substrate 11 a.
- the inter-substrate connection member 15 a is vertically arranged on the substrate connecting electrode 111 a of the first substrate 11 a having the mount component C 11 mounted and is connected by soldering and the like thereto, for example.
- the inter-member connection member 17 a is arranged so that the longitudinal direction thereof is parallel to the main face of the first substrate 11 a and the other end is extended to the outside of the corresponding short side end of the first substrate 11 a , and then, a side face of the one end of the inter-member connection member 17 a is contacted and connected to the member connecting electrode 113 a by soldering and the like.
- the first substrate 11 a and the second substrate 13 a are arranged to be mutually opposed.
- the substrate connecting electrode 131 a of the lower face is opposed to the substrate connecting electrode 111 a of the first substrate 11 a and the other end face of the inter-substrate connection member 15 a is contacted and connected to the substrate connecting electrode 131 a by soldering and the like.
- the mount assembly 1 a in which the first substrate 11 a and the second substrate 13 a are mechanically and electrically connected is obtained, as illustrated in FIG. 34 .
- a protection layer is formed by filling resin as a reinforcing member into a gap E between the first substrate 11 a and the second substrate 13 a , so that the inside members are fixed and protected.
- a protection layer by appropriately filling resin onto the second substrate 13 a as well and to fix and protect the inside members such as mount components.
- FIG. 36 is a partial sectional view of the vicinity of the inter-member connection member 17 a illustrating a state that a substrate 19 a as another member is connected to the mount assembly 1 a .
- the substrate 19 a is arranged so that the right side face in FIG. 36 as a main face is directed to the first substrate 11 a side and the main face thereof is perpendicular to the main face of the first substrate 11 a at the outside of the one end of the first substrate 11 a .
- a mount assembly connecting electrode 191 a is formed at a predetermined position of the right side face of the substrate 19 a and is contacted and connected to the other end face of the inter-member connection member 17 a extended to the outside of the one end of the first substrate 11 a by soldering and the like.
- the member connecting electrode 113 a and the mount assembly connecting electrode 191 a are connected, so that the mount assembly 1 a and the substrate 19 a are mechanically and electrically connected.
- the vicinity of the connecting part between the mount assembly connecting electrode 191 a and the inter-member connection member 17 a is fixed and protected by being sealed with a resin 18 a.
- the mount assembly 1 a of the ninth embodiment it is possible to arrange the inter-member connection member 17 a constituted with the single pillar-shaped member to be parallel to the main face of the first substrate 11 a , while one end thereof is connected to the member connecting electrode 113 a which is formed at the main face of the first substrate 11 a and the other end is extended to the outside the one end of the upper face of the first substrate 11 a . Then, the mount assembly 1 a having the second substrate 13 a laminated on the first substrate 11 a can be actualized.
- the second substrate 13 a arranged so that the main face thereof is perpendicular to the main face of the first substrate 11 a can be connected to the other end of the inter-member connection member 17 a (i.e., the parallel portion).
- the member connecting electrode 113 a and the mount assembly connecting electrode 191 a can be connected by the pillar-shaped inter-member connection member 17 a .
- the diameter of the inter-member connection member 17 a is appropriately enlarged in consideration of the space on the first substrate 11 a . Accordingly, compared to a case of forming a wiring pattern on the first substrate for connection, reliable connection can be actualized at low resistance.
- the inter-member connection member is constituted with a single pillar-shaped member.
- the configuration of the inter-member connection member is not limited to this.
- FIG. 37 is an explanatory view illustrating a configuration example of an inter-member connection member 27 a of modified example 1.
- the inter-member connection member 27 a of modified example 1 includes a first pillar-shaped member 271 a and a second pillar-shaped member 273 a as a support portion.
- the respective pillar-shaped members 271 a , 273 a formed of conductive material form an approximately L-shaped external shape as one end face of the second pillar-shaped member 273 a which supports the first pillar-shaped member 271 a is connected to a side face of one end of the first pillar-shaped member 271 a forming a parallel portion.
- the other end face of the second pillar-shaped member 273 a of the inter-member connection member 27 a is connected to a member connecting electrode 213 a of a first substrate 21 a .
- the first pillar-shaped member 271 a is arranged so that the longitudinal direction thereof is parallel to the main face of the first substrate 21 a and the other end thereof is extended to the outside of the one end of the first substrate 21 a .
- the length of the second pillar-shaped member 273 a is determined in accordance with the position of the mount assembly connecting electrode of the member to be connected to the member connecting electrode 213 a by the inter-member connection member 27 a (i.e., in accordance with the height of the mount assembly connecting electrode of another member against the main face position of the first substrate 21 a ).
- the other end face of the second pillar-shaped member 273 a is connected to the member connecting electrode 213 a as being vertically arranged thereon.
- the first pillar-shaped member 271 a is placed so that the longitudinal direction thereof is parallel to the main face of the first substrate 21 a , and then, the side face of the one end thereof is contacted to the one end face of the second pillar-shaped member 273 a and connected thereto via a metallic film.
- the side face of the one end of the first pillar-shaped member 271 a and the one end face of the second pillar-shaped member 273 a are previously connected by soldering and the like.
- FIG. 38 is a partial sectional view of a vicinity of the inter-member connection member 27 a illustrating a state that a substrate 29 a as another member is connected to a mount assembly 2 a having the inter-member connection member 27 a of modified example 1.
- the substrate 29 a is arranged so that the right side face in FIG. 38 as a main face is directed to the first substrate 21 a side and the main face thereof is perpendicular to the main face of the first substrate 21 a at the outside of the one end of the first substrate 21 a .
- a mount assembly connecting electrode 291 a is formed at a predetermined position of the right side face of the substrate 29 a and is contacted and connected to the other end face of the inter-member connection member 27 a extended to the outside of the one end of the first substrate 21 a by soldering and the like.
- the member connecting electrode 213 a and the mount assembly connecting electrode 291 a are connected, so that the mount assembly 2 a and the substrate 29 a are mechanically and electrically connected.
- the vicinity of the connecting part between the mount assembly connecting electrode 291 a and the inter-member connection member 27 a is fixed and protected by being sealed with a resin 28 a.
- the inter-member connection member 27 a having a predetermined height can be constituted by adjusting the length of the second pillar-shaped member 273 a.
- FIG. 39 is an explanatory view of a configuration example of the inter-member connection member 37 a of modified example 2.
- the inter-member connection member 37 a of modified example 2 includes a first pillar-shaped member 371 a and a second pillar-shaped member 373 a as a support portion.
- the respective pillar-shaped members 371 a , 373 a are formed of conductive material.
- One end face of the first pillar-shaped member 371 a is connected to a side face of the second pillar-shaped member 373 a .
- One end face of the second pillar-shaped member 373 a is contacted to a member connecting electrode 313 a of a first substrate 31 a .
- the first pillar-shaped member 371 a is arranged so that the longitudinal direction thereof is parallel to a main face of the first substrate 31 a and the other end thereof is extended to the outside of the one end of the first substrate 31 a .
- the connecting position of the first pillar-shaped member 371 a against the second pillar-shaped member 373 a is determined in accordance with the position of the mount assembly connecting electrode of another member to be connected to the member connecting electrode 313 a by the inter-member connection member 37 a (i.e., in accordance with the height of the mount assembly connecting electrode of another member against the main face position of the first substrate 31 a ).
- the one end face of the first pillar-shaped member 371 a is previously connected to the side face of the second pillar-shaped member 373 a via a metallic film, for example. Then, the first pillar-shaped member 371 a is arranged so that the longitudinal direction thereof is parallel to the main face of the first substrate 31 a and the other end thereof is extended to the outside of the one end of the first substrate 31 a .
- the one end face of the second pillar-shaped member 373 a is connected to the member connecting electrode 313 a as being vertically arranged thereon.
- FIG. 40 is a partial sectional view of the vicinity of an inter-member connection member 37 a illustrating a state that a substrate 39 a as another member is connected to a mount assembly 3 a having the inter-member connection member 37 a of modified example 2.
- the substrate 39 a is arranged so that the right side face in FIG. 40 as a main face is directed to the first substrate 31 a side and the main face thereof is perpendicular to the main face of the first substrate 31 a at the outside of the one end of the first substrate 31 a .
- a mount assembly connecting electrode 391 a is formed at a predetermined position of the right side face of the substrate 39 a and is contacted and connected to the other end face of the inter-member connection member 37 a extended to the outside of the one end of the first substrate 31 a by soldering and the like.
- the member connecting electrode 313 a and the mount assembly connecting electrode 391 a are connected, so that the mount assembly 3 a and the substrate 39 a are mechanically and electrically connected.
- the vicinity of the connecting part between the mount assembly connecting electrode 391 a and the inter-member connection member 37 a is fixed and protected by being sealed with a resin 38 a.
- the height of the parallel portion (i.e., the first pillar-shaped member 371 a ) against the main face of the first substrate 31 a can be adjusted by adjusting the connecting position of the first pillar-shaped member 371 a against the second pillar-shaped member 373 a . Accordingly, it is not necessary to form the second pillar-shaped member having different length for height adjustment unlike modified example 1, so that cost can be reduced.
- FIG. 41 is an explanatory view of a configuration example of an inter-member connection member 47 a of modified example 3.
- the inter-member connection member 47 a of modified example 2 integrates the first and second pillar-shaped members constituting the inter-member connection member 27 a of modified example 1 or the inter-member connection member 37 a of modified example 2.
- the inter-member connection member 47 a has an L-shaped external shape which is obtained by bending a single pillar-shaped member formed of conductive material at a midpoint to form a parallel portion 471 a .
- the inter-member connection member 47 a is arranged so that the proximal end thereof is contacted to a member connecting electrode 413 a of a first substrate 41 a , the parallel portion 471 a is parallel to the main face of the first substrate 41 a and the distal end thereof is extended to the outside of the one end of the first substrate 41 a .
- the length from the proximal end to the midpoint of the inter-member connection member 47 a is determined in accordance with the position of a mount assembly connecting electrode of another member to be connected to the member connecting electrode 413 a by the inter-member connection member 47 a (i.e., in accordance with the height of the mount assembly connecting electrode of another member against the main face position of the first substrate 41 a ).
- the parallel portion 471 a of the inter-member connection member 47 a is set to be parallel to the first substrate 41 a . Then, the proximal end is connected onto the member connecting electrode 413 a as being vertically arranged thereon so that the distal end of the parallel portion 471 a is extended to the outside of the one end of the first substrate 41 a.
- FIG. 42 is a partial sectional view of the vicinity of the inter-member connection member 47 a illustrating a state that a substrate 49 a as another member is connected to a mount assembly 4 a having the inter-member connection member 47 a of modified example 3.
- the substrate 49 a is arranged so that the right side face in FIG. 42 as a main face is directed to the first substrate 41 a side and the main face thereof is perpendicular to the main face of the first substrate 41 a at the outside of the one end of the first substrate 41 a .
- a mount assembly connecting electrode 491 a is formed at a predetermined position of the right side face of the substrate 49 a and is contacted and connected to the other end face of the inter-member connection member 47 a extended to the outside of the one end of the first substrate 41 a by soldering and the like.
- the member connecting electrode 413 a and the mount assembly connecting electrode 491 a are connected, so that the mount assembly 4 a and the substrate 49 a are mechanically and electrically connected.
- the vicinity of the connecting part between the mount assembly connecting electrode 491 a and the inter-member connection member 47 a is fixed and protected by being sealed with a resin 48 a.
- modified example 3 it is not necessary to connect the first and second pillar-shaped members which are formed separately unlike modified examples 1 and 2. Accordingly, the process to connect the first and second pillar-shaped members becomes unnecessary while the number of parts can be reduced. With this configuration, since the number of processes of manufacturing can be reduced, manufacturing the mount assembly 4 a can be performed more easily.
- FIG. 43 is an explanatory view of the configuration of inter-member connection members 571 a , 573 a of modified example 4.
- member connecting electrodes 513 a , 513 a are formed at predetermined positions at one end side of the upper face as a main face of a first substrate 51 a and two types of the inter-member connection members 571 a , 573 a are connected respectively to the member connecting electrodes 513 a , 513 a.
- the inter-member connection member 571 a configured to be similar to the inter-member connection member 17 a of the ninth embodiment is arranged to be contacted to the outer member connecting electrode 513 a and is arranged so that the longitudinal direction thereof is parallel to the first substrate 51 a and the other end is extended to the outside of one end of the first substrate 51 a .
- the inter-member connection member 573 a configured to be similar to the inter-member connection member 27 a of modified example 1 is constituted with a first pillar-shaped member 574 a and a second pillar-shaped member 575 a .
- One end face of the second pillar-shaped member 575 a of the inter-member connection member 573 a is connected to the inner member connecting electrode 513 a .
- the first pillar-shaped member 574 a is arranged so that the longitudinal direction thereof is parallel to a main face of the first substrate 51 a and the other end thereof is extended to the outside of the one end of the first substrate 51 a .
- the length of the second pillar-shaped member 575 a is determined so as not to cause interference between parallel portions of the inter-member connection members 571 a , 573 a which are arranged one above the other (i.e., the inter-member connection member 571 a and the first pillar-shaped member 574 a of the inter-member connection member 573 a ) in accordance with the position of a mount assembly connecting electrode of another member to be connected to the member connecting electrode 513 a by the inter-member connection member 573 a (i.e., in accordance with the height of the mount assembly connecting electrode of another member against the main face position of the first substrate 51 a ).
- the inter-member connection member 571 a When connecting the inter-member connection members 571 a , 573 a to the member connecting electrodes 513 a , 513 a , the inter-member connection member 571 a is placed so that the longitudinal direction thereof is parallel to the main face of the first substrate 51 a , and then, a side face of the one end of the inter-member connection member 571 a is connected to the member connecting electrode 513 a . Further, one end face of the second pillar-shaped member 575 a constituting the inter-member connection member 573 a is connected to the member connecting electrode 513 a as being vertically arranged thereon.
- the first pillar-shaped member 574 a is placed so that the longitudinal direction thereof is parallel to the main face of the first substrate 51 a , and then, the side face of the one end thereof is contacted to the other end face of the second pillar-shaped member 575 a and connected thereto via a metallic film.
- FIG. 44 is a partial sectional view of the vicinity of the inter-member connection members 571 a , 573 a illustrating a state that a substrate 59 a as another member is connected to a mount assembly 5 a having the inter-member connection members 571 a , 573 a of modified example 4.
- the substrate 59 a is arranged so that the right side face in FIG. 44 as a main face is directed to the first substrate 51 a side and the main face thereof is perpendicular to the main face of the first substrate 51 a at the outside of the one end of the first substrate 51 a .
- mount assembly connecting electrodes 591 a , 591 a are formed at predetermined positions of the right side face of the substrate 59 a and are contacted and connected respectively to the other end face of the inter-member connection member 571 a extended to the outside of the one end of the first substrate 51 a and the other end face of the second pillar-shaped member 575 a of the inter-member connection member 573 a by soldering and the like.
- the member connecting electrode 513 a and the mount assembly connecting electrode 591 a are connected while the member connecting electrode 513 a and the mount assembly connecting electrode 591 a are connected, so that the mount assembly 5 a and the substrate 59 a are mechanically and electrically connected.
- the vicinity of the connecting part between the mount assembly connecting electrode 591 a and the inter-member connection member 571 a is sealed with a resin 581 a and the vicinity of the connecting part between the mount assembly connecting electrode 591 a and the inter-member connection member 573 a is sealed with a resin 583 a , so that the vicinities of the connecting parts are fixed and protected.
- connection can be achieved with overlapped arrangement of the parallel portions not to be mutually contacted by utilizing combination of the two types of the inter-member connection members 571 a , 573 a . Accordingly, since the space above the first substrate 51 a may be effectively utilized, design flexibility is increased.
- connection members 571 a , 573 a it is also possible to constitute connection members having different height of the parallel portion against the main face of the first substrate 51 a by utilizing the second pillar-shaped member having different length and to utilize the combination thereof. Further, it is also possible to combine the connection members described in modified examples 2 and 3. For example, in the case that the inter-member connection members described in modified example 2 are combined, the connecting position of the first pillar-shaped member against the second pillar-shaped member is adjusted so as not to cause contact between respective parallel portions.
- the inter-member connection members are configured respectively to have different height of the parallel portion against the main face of the first substrate by varying the connecting position of the first pillar-shaped member against the second pillar-shaped member and that the combination thereof is utilized.
- the length from the proximal end to the midpoint is adjusted so as not cause contact between respective parallel portions.
- the inter-member connection members are configured respectively to have different height of the parallel portion against the main face of the first substrate 51 a by varying the length from the proximal end to the midpoint and that the combination thereof is utilized.
- FIG. 45 is an explanatory view of the configuration of an inter-member connection member 67 a of the tenth embodiment.
- a member connecting electrode 613 a is formed at a predetermined position of one end side of the upper face as a main face of a first substrate 61 a .
- the inter-member connection member 67 a configured to be similar to the inter-member connection member 47 a of modified example 3 is connected to the member connecting electrode 613 a .
- the inter-member connection member 67 a is arranged so that the proximal end thereof is contacted to the member connecting electrode 613 a and the longitudinal direction of a parallel portion 671 a is parallel to the first substrate 61 a .
- the distal end of the parallel portion 671 a is located above the first substrate 61 a.
- FIG. 46 is a partial sectional view illustrating a state that a substrate 69 a as another member is connected to a mount assembly 6 a .
- a protection layer formed by filling resin onto the first substrate 61 a is not illustrated.
- the substrate 69 a is arranged above the first substrate 61 a so that a main face thereof is perpendicular to the main face of the first substrate 61 a .
- a mount assembly connecting electrode 691 a is formed at a predetermined position of the right side face in FIG.
- the member connecting electrode 613 a and the mount assembly connecting electrode 691 a are connected, so that the mount assembly 6 a and the substrate 69 a are mechanically and electrically connected.
- the tenth embodiment it is possible to connect the substrate 69 a at the inside of the mount assembly 6 a so that the main face thereof is arranged to be perpendicular to the main face of the first substrate 61 a while obtaining similar effects to those of the ninth embodiment. Therefore, it is possible to actualize the mount assembly 6 a having other members such as the substrate 69 a connected thereto in higher density.
- the above description is performed on the case that the connection member constituted as in modified example 3 is applied.
- the connection members having other configurations described in the ninth embodiment and modified examples 1 and 2 may be similarly applied.
- FIG. 47 is a schematic perspective view which schematically illustrates the entire configuration of an electronic circuit module 7 a including the mount assembly of the tenth embodiment.
- FIG. 47 skips to illustrate a second substrate arranged to be opposed to a first substrate 71 a , an inter-substrate connection member connecting the second substrate to the first substrate 71 a , and a protection layer formed by filling resin onto the first substrate 71 a .
- the electronic circuit module 7 a in FIG. 47 is provided with the first substrate 71 a having a plurality of member connecting electrodes 711 a formed at short side ends of the upper face as a main face (i.e., two each at both short side ends in the example of FIG.
- the electronic circuit module 7 a includes the mount assembly described in the tenth embodiment. Then, two substrates 791 a , 792 a are arranged at the outside of the respective short sides of the first substrate 71 a so that main faces thereof are perpendicular to the main face of the first substrate 71 a .
- the substrate 791 a is connected by the inter-member connection members 771 a , 772 a and the substrate 792 a is connected by the inter-member connection members 775 a , 776 a .
- one substrate 793 a is arranged above the first substrate 71 a so that a main face thereof is perpendicular to the main face of the first substrate 71 a and is connected by the inter-member connection members 773 a , 774 a .
- mount components (not illustrated), inter-substrate connection members (not illustrated) for connecting to the second substrate and the like are mounted on the first substrate 71 a , and then, the substrate 793 a is connected while avoiding the mount components.
- the electronic circuit module 7 a including the mount assembly of the tenth embodiment other members such as the substrate 793 a can be connected to the inside of the mount assembly (i.e., above the first substrate 71 a ) as well, so that the space above the first substrate 71 a can be effectively utilized. Therefore, it is possible to configure the electronic circuit module 7 a to mount the substrates 791 a , 792 a , 793 a as other members against the mount assembly in higher density.
- the short side of the first substrate 71 a it is also possible to form member connecting electrodes at an end of the long side and to connect other members such as a substrate at the outside thereof.
- FIG. 48 is a partial sectional view of the vicinity of inter-member connection members 871 a , 873 a of a mount assembly 8 a of the eleventh embodiment.
- FIG. 49 is an explanatory view illustrating position arrangement of member connecting electrodes 811 a , 813 a formed on a first substrate 81 a .
- FIG. 50 is a side view of the mount assembly 8 a viewing from one end side of the first substrate 81 a .
- Mount components (not illustrated) are mounted on the upper face as a main face of the first substrate 81 a of the mount assembly 8 a of the eleventh embodiment. As illustrated in FIG.
- the member connecting electrodes 811 a , 813 a are formed at predetermined positions of the one end side of the upper face while avoiding the mount components. Specifically, as illustrated in FIG. 49 , a plurality (i.e., five in the example of FIG. 49 ) of member connecting electrode 811 a , 813 a arranged adjacently in two lines are formed at the one end side of the upper face of the first substrate 81 a .
- the inter-member connection members 871 a are respectively connected to three of the member connecting electrodes 811 a on the outer row and the inter-member connection members 873 a are respectively connected to two of the member connecting electrodes 813 a on the inner row.
- the height of the inter-member connection member 873 a is determined so as not to cause interference between parallel portions of the inter-member connection members 871 a and the inter-member connection members 873 a in the vertical direction.
- the inter-member connection members 871 a , 873 a are adjacently arranged so that the height of the parallel portions from the main face of the first substrate 81 a is alternately to be high and to be low.
- the connection members described in the ninth embodiment and modified examples 1 to 3 can be utilized as being appropriately combined for the combination of connection members having different height of each parallel portion from the main face of the first substrate 81 a.
- FIG. 51 is a schematic perspective view illustrating the entire configuration of the mount assembly 8 a of the eleventh embodiment.
- a plurality of mount components C 811 to C 816 and an inter-substrate connection member 85 a to connect the first substrate 81 a to a second substrate 83 a are mounted on the first substrate 81 a of the mount assembly 8 a .
- two types of the inter-member connection members 871 a , 873 a are arranged at the one end of the first substrate 81 a and are connected respectively to the member connecting electrodes (not illustrated) on the first substrate 81 a .
- inter-member connection members 871 a , 873 a are also arranged at the other end of the first substrate 81 a and are connected respectively to the member connecting electrodes (not illustrated) on the first substrate 81 a .
- U-shaped inter-electrode connection members 875 a , 876 a respectively having different height are arranged on the first substrate 81 a .
- the respective inter-electrode connection members 875 a , 876 a are arranged as the parts formed to be parallel to the main face of the first substrate 81 a as being sterically intersected above the mount components C 814 , C 815 so as to connect the electrodes (not illustrated) as the connecting target formed on the first substrate 81 a .
- the first substrate 81 a is connected to the second substrate 83 a arranged to be opposed thereto by the inter-substrate connection member 85 a .
- the mount assembly 8 a is modularized by filling resin between the first substrate 81 a and the second substrate 83 a and performing polishing and the like on the end faces thereof.
- the mount assembly 8 a of the eleventh embodiment it is possible to arrange the parallel portions of the adjacent inter-member connection members 871 a , 873 a with a small pitch in the case of connecting the plurality of inter-member connection members 871 a , 873 a while obtaining similar effects to those of the ninth embodiment. Accordingly, miniaturization of the mount assembly 8 a can be achieved. Further, as described with reference to FIG. 51 , the electrodes on the first substrate 81 a can be sterically connected by utilizing appropriate combination of the connection members 875 a , 876 a respectively having different height of the portion which is parallel to the main face of the first substrate 81 a . With this configuration, the space above the first substrate 81 a can be effectively utilized and miniaturization can be achieved. In addition, compared to a case of connecting by forming a wiring pattern on a substrate, reliable connection can be actualized at low resistance.
- FIGS. 52A to 52F are explanatory views illustrating respective processes of the method for mount assembly manufacturing in the twelfth embodiment.
- a mount component connecting electrode (not illustrated) for mounting the mount component C 91 , a substrate connecting electrode (not illustrated) and a member connecting electrode (not illustrated) are formed on predetermined positions of the upper face as a main face of a first substrate 91 a .
- the mount component C 91 is mounted at the mount component connecting electrode by soldering and the like, as illustrated in FIG. 52A .
- one end face of an inter-substrate connection member 95 a is connected to the substrate connecting electrode formed on the upper face as being vertically arranged thereon, as illustrated in FIG. 52B .
- one end of an inter-member connection member 97 a is connected to the member connecting electrode substrate formed on the upper face at a side end of the first substrate 91 a while the inter-member connection member 97 a is arranged so that the longitudinal direction thereof is parallel to the first substrate 91 a and the other end thereof is extended to the outside of the corresponding side end of the first substrate 91 a , as illustrated in FIG. 52C .
- the mount component C 91 , the inter-substrate connection member 95 a and the inter-member connection member 97 a are sealed with resin by forming a protection layer 98 a , as illustrated in FIG. 52D .
- the upper face of the protection layer 98 a is polished to be planarized and the other end face of each inter-substrate connection member 95 a is exposed, as illustrated in FIG. 52E .
- a metallic film 951 a is formed at the other end of the exposed inter-substrate connection member 95 a and a bump 952 a is formed on the metallic film 951 a , as illustrated in FIG. 52F .
- a second substrate (not illustrated) is arranged to be opposed to the first substrate 91 a via the bump 952 a so as to obtain mechanical and electrical connection. According to the present method for mount assembly manufacturing, opposed members can be reliably connected even when the length of the inter-substrate connection member 95 a cannot be accurately determined.
- FIG. 53 is an explanatory view illustrating a principle of the method for mount assembly manufacturing according to the thirteenth embodiment.
- a plurality of mount assemblies are simultaneously produced.
- inter-substrate connection members 105 a are mounted while mount components (not illustrated) are mounted on each section area A 101 defined by cutting positions as illustrated by dashed lines in FIG. 53 .
- mount components are mounted on each section area A 103 defined by cutting positions as illustrated by dashed lines in FIG. 53 .
- member connecting electrodes 1013 a , 1013 a respectively having one end of the inter-member connection member connected are formed on the main face of the substrate 101 a sandwiching the cutting position as being opposed to each other.
- two couples of opposed member connecting electrodes 1013 a , 1013 a are formed respectively at an end of each section area A 101 as sandwiching each side.
- a member 107 a having a pillar-shaped portion 1071 a to be an inter-member connection member when individuated into respective mount assemblies is placed between the opposed member connecting electrodes 1013 a , 1013 a .
- the pillar-shaped portion 1071 a forms a parallel portion of the inter-member connection member and the member 107 a is arranged so that the pillar-shaped portion 1071 a passes over the cutting position. Then, after performing processes of connecting the substrates 101 a , 103 a by an inter-substrate connection member 105 a , arranging a protection layer and the like, the modularized mount assembly can be obtained by being individuated as being cut at the cutting position for the last time.
- FIGS. 54A to 54C are explanatory views illustrating a specific example of respective processes in the present method for mount assembly manufacturing.
- FIG. 55 is a partial sectional view illustrating a state that substrates as other members are connected to the manufactured mount assembly. Following description is performed having a case to obtain a mount assembly to which the inter-member connection member 47 a of modified example 3 is applied as an example. In this description, mount components and inter-substrate connection member (not illustrated) are previously mounted on the main face of the substrate 101 a . As illustrated in FIG. 54A , the member connecting electrodes 1013 a , 1013 a are formed at the positions being opposed to each other sandwiching the cutting position indicated by a dashed line in FIG.
- the member 107 a having a U-shaped external shape in which support portions 1072 a , 1072 a are integrally formed at both ends of the pillar-shaped portion 1071 a forming a parallel portion is prepared in the present method for manufacturing.
- the proximal ends of the respective support portions 1072 a , 1072 a are connected respectively to the opposed member connecting electrode sandwiching the cutting position as being vertically arranged thereon while the pillar-shaped portion 1071 a is arranged to be parallel to the main face of the substrate 101 a .
- a protection layer 108 a is formed by filling resin onto the substrate 101 a , as illustrated in FIG. 54B . Then, proceeding to an individuating process after a connecting process of the second substrate 103 a , mount assemblies 10 a - 1 , 10 a - 2 are obtained by individuating with dicing, as illustrated in FIG. 54C .
- the mount assemblies 10 a - 1 , 10 a - 2 manufactured as described above are connected to substrates 109 a - 1 , 109 a - 2 as other members respectively having a mount assembly connecting electrode 1091 a formed on a main face being similar to the above-mentioned embodiments.
- the substrate 109 a - 1 is arranged so that the left side face in FIG. 55 as a main face is directed to a first substrate 101 a - 1 side and the main face thereof is perpendicular to the main face of the first substrate 101 a - 1 at the outside of one end of the first substrate 101 a - 1 .
- the mount assembly connecting electrode 1091 a of the substrate 109 a - 1 is connected to the other end face of an inter-member connection member 107 a - 1 extended to the outside of the one end of the first substrate 101 a - 1 , so that the mount assembly 10 a - 1 and the substrate 109 a - 1 are mechanically and electrically connected.
- the substrate 109 a - 2 is arranged so that the right side face in FIG. 55 as a main face is directed to a first substrate 101 a - 2 side and the main face thereof is perpendicular to the main face of the first substrate 101 a - 2 at the outside of one end of the first substrate 101 a - 2 .
- the mount assembly connecting electrode 1091 a of the substrate 109 a - 2 is connected to the other end face of an inter-member connection member 107 a - 2 extended to the outside of the one end of the first substrate 101 a - 2 , so that the mount assembly 10 a - 2 and the substrate 109 a - 2 are mechanically and electrically connected.
- the inter-member connection member having the configuration described in modified example 3 is adopted.
- the inter-member connection members of other configurations described in the ninth embodiment and modified examples 1 and 2 can be also adopted similarly.
- the connection member having the configuration described in modified example 1 is adopted, one end face of each second pillar-shaped member which is vertically arranged is connected to the opposed member connecting electrode sandwiching the cutting position in the connecting process.
- a single pillar-shaped member corresponding to the pillar-shaped portion is arranged to be parallel to a main face of a substrate to be the first substrate and the side face of each of both ends are connected to the other end face of the second pillar-shaped member.
- the process to connect the second pillar-shaped member and the pillar-shaped member is unnecessary unlike the present modified example. Therefore, the number of processes for manufacturing can be reduced.
- the member connecting electrodes are formed in the same number (i.e., two) at each end on the substrate constituting the mount assembly.
- the number of the member connecting electrodes formed at each end can be appropriately set.
- FIG. 56 is a view illustrating a modified example of position arrangement of the member connecting electrodes formed on the substrate.
- FIG. 57 is an explanatory view illustrating a principle of a method for manufacturing the mount assembly of the present modified example.
- FIG. 56 on a main face of the mount assembly manufactured by the method for manufacturing of the present modified example, three member connecting electrodes 1513 are formed at the left end of a substrate 1511 in FIG. 56 and one member connecting electrode 1513 is formed at the right end. In addition, two member connecting electrodes 1513 are formed respectively at the upper end and lower end.
- the respective member connecting electrodes 1513 are formed on a substrate 1510 so that positions of the member connecting electrodes 1513 formed at adjacent section areas A 1510 are to be mutually axisymmetric sandwiching a cutting position indicated by a dashed line in FIG. 57 .
- separation i.e., individuation
- simultaneous producing can be performed even in the case that the number (including zero) of the member connecting electrodes to be formed at the end of the substrate differs for each end. More specifically, the simultaneous producing can be performed even in the case that the number of the member connecting electrodes formed at one opposed end is not the same, as long as the number of the member connecting electrodes formed at the other opposed end is the same.
- FIG. 58 is a schematic perspective view illustrating the entire configuration of a mount assembly 1600 of the fourteenth embodiment.
- a plurality i.e. nine in the example of FIG. 58
- other ends of inter-member connection members 1671 to 1679 are exposed at an end face of a protection layer 1680 between a first substrate 1610 and a second substrate 1630 .
- a plurality i.e., four in the example of FIG.
- side face connecting electrodes 1681 to 1684 are formed at the end face, so that the side face connecting electrodes 1681 to 1684 are connected to other members respectively having a mount assembly connecting electrode formed on a main face thereof.
- the other end of the inter-member connection member 1672 and the side face connecting electrode 1681 are connected via a wiring pattern P 1610 .
- the other end of the inter-member connection member 1678 and the side face connecting electrode 1682 are connected via a wiring pattern P 1630 .
- the other end of the inter-member connection member 1675 and the side face connecting electrode 1683 are connected via a wiring pattern P 1650 .
- the wiring patterns P 1610 , P 1630 , P 1650 are formed at the end face of the protection layer 1680 .
- the wiring patterns P 1610 , P 1630 , P 1650 can be formed by appropriately utilizing a thin-film method, an ink-jet method and the like, for example. At that time, it is also possible to form an insulating protection film at a part of the end face of the protection layer 1680 other than the side face connecting electrodes 1681 to 1684 .
- the side face connecting electrodes 1681 to 1684 to be connected to other members can be formed at the end face of the protection layer 1680 , connecting positions in the mount assembly 1600 with other members can be flexibly adjusted and design flexibility can be increased.
- FIG. 59 is a partial sectional view of the vicinity of inter-member connection members 1771 , 1773 illustrating a scene to connect a substrate 1790 as another member to a mount assembly 1700 having the inter-member connection members 1771 , 1773 of the present modified example.
- the substrate 1790 is arranged so that the right side face in FIG. 59 as a main face thereof is directed to a first substrate 1710 side and the main face thereof is perpendicular to the main face of the first substrate 1710 at the outside of the one end of the first substrate 1710 .
- the inter-member connection member 1771 is constituted similarly to the inter-member connection member 17 a of the ninth embodiment and one end thereof is connected to a member connecting electrode 1713 on the first substrate 1710 .
- the inter-member connection member 1773 is constituted similarly to the inter-member connection member 27 a of modified example 1.
- one end face of a second pillar-shaped member 1775 of the inter-member connection member 1773 is connected to a member connecting electrode 1714 formed on a main face of a mount component C 1710 .
- a first pillar-shaped member 1774 is arranged so that the longitudinal direction thereof is parallel to the main face of the first substrate 1710 (i.e., parallel to the main face of the mount component C 1710 ) and the other end thereof is extended to the outside of the one end of the first substrate 1710 .
- the mount assembly 1700 is connected to the substrate 1790 as another member having mount assembly connecting electrodes 1791 , 1793 formed on the main face thereof.
- the length of the second pillar-shaped member 1775 of the inter-member connection member 1773 is determined in accordance with the position of the mount assembly connecting electrode 1793 of the first substrate 1710 connected to the member connecting electrode 1714 by the inter-member connection member 1773 (i.e., in accordance with the height of the mount assembly connecting electrode 1793 of the first substrate 1710 against the main face position of the mount component C 1710 where the member connecting electrode 1714 is formed).
- connection member of the other end face of the parallel portion formed at the connection member is connected to the mount assembly connecting electrode formed at another member such as the substrate.
- the present invention is not limited to this.
- a modified example will be described having a connection member of a similar configuration to the connection member of modified example 3 as an example.
- the connection members of the other configurations described in the ninth embodiment and modified examples 1 and 2 may be similarly adopted.
- FIG. 60 is an explanatory view of a modified example of a connection method between the other end side of a parallel portion 1871 formed at an inter-member connection member 1870 and a mount assembly connecting electrode 1891 of a substrate as another member.
- the proximal end of the inter-member connection member 1870 is connected to a member connecting electrode 1813 and a protection layer 1880 is formed by filling resin onto a first substrate 1810 .
- a projection portion at the distal end side of the parallel portion 1871 of the inter-member connection member 1870 is folded upward, for example, along an end face of the protection layer 1880 .
- a mount assembly 1800 is connected to a substrate 1890 as another member where the mount assembly connecting electrode 1891 is formed.
- a side face of the other end of the folded parallel portion 1871 is connected to the mount assembly connecting electrode 1891 .
- the connection area of the parallel portion 1871 against the mount assembly connecting electrode 1891 can be widely ensured, so that the connection strength therebetween can be enhanced.
- FIG. 61 is an explanatory view of another modified example of a connection method between the other end side of a parallel portion 1971 formed at an inter-member connection member 1970 and a mount assembly connecting electrode 1991 of a substrate as another member.
- the other end side of the parallel portion 1971 is folded upward, for example, after the proximal end of the inter-member connection member 1970 is connected to a member connecting electrode 1913 .
- a protection layer 1980 is formed by filling resin onto a first substrate 1910 and a side face of the other end of the parallel portion 1971 is exposed by polishing an end face of the protection layer 1980 at one end side of the first substrate 1910 .
- a mount assembly 1900 is connected to a substrate 1990 as another member where the mount assembly connecting electrode 1991 is formed. Specifically, the side face of the other end of the exposed parallel portion 1971 is connected to the mount assembly connecting electrode 1991 . Similarly in this case, the connection area of the parallel portion 1971 against the mount assembly connecting electrode 1991 can be widely ensured, so that the connection strength therebetween can be enhanced.
- the other end of the parallel portion formed at the connection member is extended to the outside of the one end of the upper face of the substrate constituting the mount assembly.
- the other end of the parallel portion is only required to be extended at least to the one end edge of the upper face of the substrate.
- an end face of a protection layer at one end side of the substrate is to be polished after forming the protection layer by filling resin onto the substrate, for example. In this manner, the other end face of the parallel portion may be exposed from a side face at the one end side of the mount assembly.
- the member connecting electrodes are formed at the first substrate located at the lower side and inter-member connection members are connected thereto among the substrates constituting the mount assembly by being arranged to be mutually opposed.
- the protection layer is formed by filling resin between the first and second substrates which are arranged to be mutually opposed.
- first and second substrates and the substrates described as examples of other members may be interconnection substrates respectively having a wiring pattern formed or may be substrates respectively having an electronic circuit and the like mounted inside.
- the substrate is connected to the mount assembly.
- another member to be the connection target is not limited to a substrate.
- the present invention can be applied to a case that a member such as an electronic component and an electronic circuit module is arranged so that a main face thereof is perpendicular to a main face of the substrate and is connected thereto.
- one end side of the parallel portion of the connection member arranged to be parallel to the main face of the member is connected to the member connecting electrode formed on the main face of the member. Then, another member of which main face is perpendicular to the main face of the member can be connected to the other end side of the parallel portion. Accordingly, another member can be easily connected to the mount assembly in high density.
- a plurality of substrates arranged as the respective main faces thereof are mutually parallel are connected by the inter-substrate connection member.
- One end side of the parallel portion of the inter-member connection member is connected to the member connecting electrode formed on the substrate main face of at least one substrate among these substrates while being arranged so that the other end side is extended to the end of the member main face and the longitudinal direction thereof is parallel to the substrate main face.
- the member arranged so that the main face thereof is perpendicular to the substrate main face can be connected to the other end side of the parallel portion. Accordingly, another member can be easily connected to the mount assembly in high density.
Abstract
A mount assembly includes a member in which a mount component is mounted at least on one main face of the member and at which a member connecting electrode is formed; and a connection member that has a pillar-shaped parallel portion arranged so that a longitudinal direction of the parallel portion is parallel to the main face of the member, one end side of the parallel portion being connected to the member connecting electrode.
Description
- This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2009-069076, filed on Mar. 19, 2009 and Japanese Patent Application No. 2009-069077, filed on Mar. 19, 2009, the entire contents of which are incorporated herein by reference.
- 1. Field of the Invention
- The present invention relates to a mount assembly and a method for manufacturing the mount assembly.
- 2. Description of the Related Art
- In the related art, an endoscope to perform observation of a subject portion as being inserted into a body cavity of a subject has been known and widely utilized in a medical field and the like. Such an endoscope is configured to incorporate an electronic circuit module having electronic components such as an imaging element mounted at the distal end of an elongated flexible insertion device. In order to ease pain of a patient, the distal end of the insertion device has been desired to be thinned and miniaturized. Accordingly, a variety of technologies to miniaturize the electronic circuit module incorporated in the distal end has been disclosed.
- Meanwhile, Japanese Laid-open Patent Publication No. 2007-194160 discloses a method for connecting printed substrates in the mutually perpendicular direction. In Japanese Laid-open Patent Publication No. 2007-194160, the printed substrates are mechanically and electrically connected by inserting a protrusion formed at one printed substrate into a hole formed at the other printed substrate.
- Further, in Japanese Laid-open Patent Publication No. 05-291724, component-mounting units are arranged to be perpendicular to a mount substrate face by arranging the component mounting units on a flexible substrate to be alternated between front and rear sides and folding wiring portions for connecting the respective component-mounting units.
- A mount assembly according to an aspect of the present invention includes a member in which a mount component is mounted at least on one main face of the member and at which a member connecting electrode is formed; and a connection member that has a pillar-shaped parallel portion arranged so that a longitudinal direction of the parallel portion is parallel to the main face of the member, one end side of the parallel portion being connected to the member connecting electrode.
- A mount assembly according to another aspect of the present invention includes a plurality of substrates of which main faces are arranged to be mutually parallel; an inter-substrate connection member which connects the substrates; and an inter-member connection member, on a substrate main face of at least one substrate, which has a pillar-shaped parallel portion having the longitudinal direction thereof arranged to be parallel to the substrate main face and having the other end side thereof arranged to be extended to an end of the member main face, and of which one end side is connected to a member connecting electrode formed on the substrate main face.
- A method for manufacturing a mount assembly according to still another aspect of the present invention includes an electrode forming step of forming a member connecting electrode on a main face of a member to which a mount component is mounted for each area to be cut and separated so as to be opposed to each other sandwiching a cutting position; a connecting step of arranging a connection member having a pillar-shaped portion which forms a parallel portion between the opposed member connecting electrodes formed in the electrode forming step so that the pillar-shaped portion is parallel to the main face of the member and to connect both end sides of the pillar-shaped portion respectively to the opposed member connecting electrodes; and an individuating step of dividing the member by cutting at the cutting position.
- The above and other features, advantages and technical and industrial significance of this invention will be better understood by reading the following detailed description of presently preferred embodiments of the invention, when considered in connection with the accompanying drawings.
-
FIG. 1 is a partial sectional view which illustrates an example of a mount assembly of a first embodiment; -
FIG. 2 is a partial sectional view which illustrates an example of the mount assembly of the first embodiment; -
FIG. 3 is a partial sectional view which illustrates a state that a substrate is connected to the mount assembly of the first embodiment; -
FIG. 4 is a schematic perspective view which schematically illustrates the entire configuration of an electronic circuit module including the mount assembly of the first embodiment; -
FIG. 5 is a partial sectional view which illustrates an example of a mount assembly of a second embodiment; -
FIG. 6 is a partial sectional view which illustrates an example of the mount assembly of the second embodiment; -
FIG. 7 is a partial sectional view which illustrates a state that a substrate is connected to the mount assembly of the second embodiment; -
FIG. 8 is a partial sectional view which illustrates an example of a mount assembly of a third embodiment; -
FIG. 9 is a partial sectional view which illustrates an example of the mount assembly of the third embodiment; -
FIG. 10 is a partial sectional view which illustrates a state that a substrate is connected to the mount assembly of the third embodiment; -
FIG. 11 is a partial sectional view which illustrates an example of a mount assembly of a fourth embodiment; -
FIG. 12 is a partial sectional view which illustrates an example of the mount assembly of the fourth embodiment; -
FIG. 13 is a partial sectional view which illustrates a state that a substrate is connected to the mount assembly of the fourth embodiment; -
FIG. 14 is a partial sectional view which illustrates an example of a mount assembly of a fifth embodiment; -
FIG. 15 is a partial sectional view which illustrates a state that a substrate is connected to the mount assembly of the fifth embodiment; -
FIG. 16 is a schematic perspective view which schematically illustrates the entire configuration of an electronic circuit module including the mount assembly of the fifth embodiment; -
FIG. 17 is a partial sectional view which illustrates an example of a mount assembly of a sixth embodiment; -
FIG. 18 is an explanatory view which illustrates position arrangement of member connecting electrodes formed on a substrate constituting the mount assembly of the sixth embodiment; -
FIG. 19 is a side view of the mount assembly of the sixth embodiment viewing from one end side of the substrate; -
FIG. 20 is an explanatory schematic perspective view which illustrates the entire configuration of the mount assembly of the sixth embodiment; -
FIG. 21 is an explanatory schematic perspective view which illustrates the entire configuration of the mount assembly of the sixth embodiment; -
FIG. 22 is an explanatory view which illustrates a principle of a method for mount assembly manufacturing of a seventh embodiment; -
FIG. 23 is an explanatory view which illustrates the principle of the method for mount assembly manufacturing of the seventh embodiment; -
FIG. 24 is a schematic perspective view of a mount assembly manufactured by the method for mount assembly manufacturing of the seventh embodiment; -
FIG. 25A is an explanatory view which illustrates a specific example of a process of the method for mount assembly manufacturing; -
FIG. 25B is an explanatory view which illustrates a specific example of a process subsequent toFIG. 25A ; -
FIG. 25C is an explanatory view which illustrates a specific example of a process subsequent toFIG. 25B ; -
FIG. 26 is a partial sectional view which illustrates a state that a substrate is connected to the mount assembly manufactured by the method for manufacturing ofFIGS. 25A to 25C ; -
FIG. 27 is a view which illustrates a modified example of position arrangement of member connecting electrodes formed on a substrate; -
FIG. 28 is an explanatory view which illustrates a principle of a method for mount assembly manufacturing of the modified example; -
FIG. 29 is a schematic perspective view which illustrates the entire configuration of a mount assembly of an eighth embodiment; -
FIG. 30 is a view which illustrates a modified example of the mount assembly; -
FIG. 31 is an explanatory view which illustrates a modified example of the method for connecting the other end side of a parallel portion formed on a connection member and a mount assembly connecting electrode; -
FIG. 32 is an explanatory view which illustrates another modified example of the method for connecting the other end side of a parallel portion formed on a connection member and a mount assembly connecting electrode; -
FIG. 33 is a perspective view which illustrates a configuration example of a mount assembly of a ninth embodiment; -
FIG. 34 is a perspective view which illustrates the configuration example of the mount assembly of the ninth embodiment; -
FIG. 35 is an explanatory view which illustrates a configuration example of an inter-member connection member of the ninth embodiment; -
FIG. 36 is a partial sectional view of the vicinity of the inter-member connection member which illustrates a state that a substrate as another member is connected to the mount assembly; -
FIG. 37 is an explanatory view which illustrates a configuration example of an inter-member connection member of modified example 1; -
FIG. 38 is a partial sectional view of a mount assembly having the inter-member connection member of modified example 1; -
FIG. 39 is an explanatory view which illustrates a configuration example of an inter-member connection member of modified example 2; -
FIG. 40 is a partial sectional view of a mount assembly having the inter-member connection member of modified example 2; -
FIG. 41 is an explanatory view which illustrates a configuration example of an inter-member connection member of modified example 3; -
FIG. 42 is a partial sectional view of a mount assembly having the inter-member connection member of modified example 3; -
FIG. 43 is an explanatory view which illustrates a configuration of an inter-member connection member of modified example 4; -
FIG. 44 is a partial sectional view of a mount assembly having the inter-member connection member of modified example 4; -
FIG. 45 is an explanatory view which illustrates the configuration of an inter-member connection member of a tenth embodiment; -
FIG. 46 is a partial sectional view which illustrates a state that a substrate is connected to a mount assembly of the tenth embodiment; -
FIG. 47 is a schematic perspective view which schematically illustrates the entire configuration of an electronic circuit module including the mount assembly of the tenth embodiment; -
FIG. 48 is a partial sectional view of a mount assembly of an eleventh embodiment; -
FIG. 49 is an explanatory view which illustrates position arrangement of member connecting electrodes formed on a first substrate in the eleventh embodiment; -
FIG. 50 is a side view of the mount assembly viewing from one end side of the first substrate; -
FIG. 51 is an explanatory schematic perspective view which illustrates the entire configuration of the mount assembly of the eleventh embodiment; -
FIG. 52A is an explanatory view which illustrates a process of a method for mount assembly manufacturing of a twelfth embodiment; -
FIG. 52B is an explanatory view which illustrates a process subsequent toFIG. 52A ; -
FIG. 52C is an explanatory view which illustrates a process subsequent toFIG. 52B ; -
FIG. 52D is an explanatory view which illustrates a process subsequent toFIG. 52C ; -
FIG. 52E is an explanatory view which illustrates a process subsequent toFIG. 52D ; -
FIG. 52F is an explanatory view which illustrates a process subsequent toFIG. 52E ; -
FIG. 53 is an explanatory view which illustrates a principle of a method for mount assembly manufacturing of a thirteenth embodiment; -
FIG. 54A is an explanatory view which illustrates a specific example of a process of the method for mount assembly manufacturing of the thirteenth embodiment; -
FIG. 54B is an explanatory view which illustrates a specific example of a process subsequent toFIG. 54A ; -
FIG. 54C is an explanatory view which illustrates a specific example of a process subsequent toFIG. 54B ; -
FIG. 55 is a partial sectional view which illustrates a state that a substrate is connected to the mount assembly manufactured by the method for manufacturing ofFIGS. 54A to 54C ; -
FIG. 56 is a view which illustrates a modified example of position arrangement of member connecting electrodes formed on a substrate; -
FIG. 57 is an explanatory view which illustrates a principle of a method for mount assembly manufacturing of the modified example; -
FIG. 58 is a schematic perspective view which illustrates the entire configuration of a mount assembly of a fourteenth embodiment; -
FIG. 59 is a partial sectional view of a mount assembly having an inter-member connection member of a modified example; -
FIG. 60 is an explanatory view which illustrates a modified example of the method for connecting the other end side of a parallel portion formed on an inter-member connection member and a mount assembly connecting electrode; and -
FIG. 61 is an explanatory view which illustrates another modified example of the method for connecting the other end side of a parallel portion formed on an inter-member connection member and a mount assembly connecting electrode. - In the following, preferred embodiments of the present invention will be described in detail with reference to the drawings. Here, the present invention is not limited to these embodiments.
-
FIGS. 1 and 2 are partial sectional views illustrating an example of amount assembly 1 of the first embodiment. As illustrated inFIG. 1 , themount assembly 1 of the first embodiment includes asubstrate 11 as a member and aconnection member 13. Mount components as electronic components such as electronic circuits (not illustrated) are mounted on the upper face as a main face of thesubstrate 11, and then, amember connecting electrode 111 is formed at a predetermined position at one end side of the upper face while avoiding the mount components. Meanwhile, theconnection member 13 constituted with a single pillar-shaped member is formed of conductive material and forms a parallel portion. That is, theconnection member 13 is arranged so that the longitudinal direction thereof is parallel to thesubstrate 11 as a side face of one end of theconnection member 13 being contacted to themember connecting electrode 111 and the other end thereof is extended to the outside of the one end of the upper face of thesubstrate 11. Theconnection member 13 is formed to have length determined by the distance from themember connecting electrode 111 to the one end of thesubstrate 11. - When manufacturing the
mount assembly 1, theconnection member 13 is placed so that the longitudinal direction thereof is parallel to the main face of thesubstrate 11, and then, the side face of the one end of theconnection member 13 is contacted and connected to themember connecting electrode 111 by soldering and the like, for example. Subsequently, as illustrated inFIG. 2 , the vicinity of the connecting part between themember connecting electrode 111 and theconnection member 13 is fixed and protected by being sealed with aresin 151 as a reinforcing member. With this configuration, reliability of themount assembly 1 can be improved and handling as a component can be eased. -
FIG. 3 is a partial sectional view illustrating a state that asubstrate 17 as another member is connected to themount assembly 1. Thesubstrate 17 is arranged so that the right side face inFIG. 3 as a main face is directed to thesubstrate 11 side and the main face thereof is perpendicular to the main face of thesubstrate 11 at the outside of the one end of thesubstrate 11. Then, a mountassembly connecting electrode 171 is formed at a predetermined position of the right side face of thesubstrate 17 and is contacted and connected to the other end face of theconnection member 13 extended to the outside of the one end of thesubstrate 11 by soldering and the like. In this manner, themember connecting electrode 111 and the mountassembly connecting electrode 171 are connected, so that themount assembly 1 and thesubstrate 17 are mechanically and electrically connected. Further, the vicinity of the connecting part between the mountassembly connecting electrode 171 and theconnection member 13 is fixed and protected by being sealed with aresin 153. - As described above, according to the
mount assembly 1 of the first embodiment, it is possible to arrange theconnection member 13 constituted with the single pillar-shaped member to be parallel to the main face of thesubstrate 11, while one end thereof is connected to themember connecting electrode 111 which is formed at the main face of thesubstrate 11 and the other end is extended to the outside of the one end of the upper face of thesubstrate 11. In addition, another member such as thesubstrate 17 which is arranged at the other end of the parallel portion so that the main face thereof is perpendicular to the main face of thesubstrate 11 can be connected. Accordingly, since it is only needed to connect theconductive connection member 13 to themember connecting electrode 111 on thesubstrate 11 without performing special processing on respective members to be connected, other members can be easily connected in high density. In addition, themember connecting electrode 111 and the mountassembly connecting electrode 171 can be connected with the pillar-shapedconnection member 13. At that time, it is also possible that the diameter of theconnection member 13 is appropriately enlarged in consideration of the space on thesubstrate 11. Accordingly, compared to a case of forming a wiring pattern on a substrate for connection, reliable connection can be actualized at low resistance. -
FIG. 4 is a schematic perspective view which schematically illustrates the entire configuration of anelectronic circuit module 2 including the mount assembly of the first embodiment. Theelectronic circuit module 2 inFIG. 4 is provided with a plurality (i.e., five in the example ofFIG. 4 ) ofmount components 29 mounted on the upper face as a main face. In addition, theelectronic circuit module 2 is provided with asubstrate 21 having a plurality (i.e., four in the example ofFIG. 4 ) ofmember connecting electrodes 211 formed at ends of short sides thereof and fourconnection members 231 to 234 having the longitudinal direction thereof arranged to be parallel to the main face of thesubstrate 21 and having one end respectively connected to themember connecting electrodes 211. In this manner, theelectronic circuit module 2 includes the mount assembly described in the first embodiment. Then, twosubstrates substrate 21 so that the main faces thereof are directed to thesubstrate 21 side and are perpendicular to the main face of thesubstrate 21. Thesubstrate 271 is connected by theconnection members substrate 272 is connected by theconnection members electronic circuit module 2 including the mount assembly of the first embodiment, it is possible to mount thesubstrates substrate 21, it is also possible that the member connecting electrode is formed at the end of a long side and another member such as a substrate is connected to the outside thereof. -
FIGS. 5 and 6 are partial sectional views illustrating an example of amount assembly 3 of the second embodiment. As illustrated inFIG. 5 , themount assembly 3 of the second embodiment includes asubstrate 31 and two types ofconnection members substrate 31, and then,member connecting electrodes - The
connection member 331 is configured to be similar to theconnection member 13 of the first embodiment. That is, theconnection member 331 is arranged so that the longitudinal direction thereof is parallel to thesubstrate 31 as a side face of one end of theconnection member 331 being contacted to themember connecting electrode 311 and the other end thereof is extended to the outside of the one end of thesubstrate 31. Meanwhile, theconnection member 333 is constituted with a first pillar-shapedmember 334 and a second pillar-shapedmember 335 which are formed of conductive material respectively. Theconnection member 333 has an approximately L-shaped external shape in a state that one end face of the second pillar-shapedmember 335 which supports the first pillar-shapedmember 334 is connected to a side face of one end of the first pillar-shapedmember 334 forming a parallel portion. The other end face of the second pillar-shapedmember 335 of theconnection member 333 is connected to themember connecting electrode 313. Then, the first pillar-shapedmember 334 is arranged so that the longitudinal direction thereof is parallel to the main face of thesubstrate 31 and the other end thereof is extended to the outside of the one end of thesubstrate 31. Here, the length of the second pillar-shapedmember 335 is determined so that the parallel portions of therespective connection members connection member 331 and the first pillar-shapedmember 334 of the connection member 333) are not mutually contacted, in accordance with the position of a mount assembly connecting electrode of another member to be connected to themember connecting electrode 313 by the connection member 333 (i.e., in accordance with the height of the mount assembly connecting electrode of another member against the position of the main face of the substrate 31). - When manufacturing the
mount assembly 3, theconnection member 331 is placed so that the longitudinal direction thereof is parallel to the main face of thesubstrate 31, and then, the side face of the one end of theconnection member 331 is contacted and connected to themember connecting electrode 311 by soldering and the like, for example. Further, the other end face of the second pillar-shapedmember 335 is connected to themember connecting electrode 313 as being vertically arranged thereon. Subsequently, the first pillar-shapedmember 334 is placed so that the longitudinal direction thereof is parallel to the main face of thesubstrate 31, and then, the side face of the one end thereof is contacted to the one end face of the second pillar-shapedmember 335 and connected thereto via a metallic film. Here, it is also possible that the side face of the one end of the first pillar-shapedmember 334 and the one end face of the second pillar-shapedmember 335 are previously connected by soldering and the like. - In addition, similar to the first embodiment, it is also possible that the vicinity of the connecting part between the
substrate 31 and therespective connection members FIG. 6 , aprotection layer 351 is formed by filling resin onto thesubstrate 31 after the other end face of the second pillar-shapedmember 335 is connected to themember connecting electrode 313 as being vertically arranged while connecting theconnection member 331 to themember connecting electrode 311. Further, after the one end face of the second pillar-shapedmember 335 is exposed and connected to the side face of the one end of the first pillar-shapedmember 334, the vicinity of the connecting part between the first pillar-shapedmember 334 and the second pillar-shapedmember 335 is sealed with aresin 352. -
FIG. 7 is a partial sectional view illustrating a state that asubstrate 37 as another member is connected to themount assembly 3. Thesubstrate 37 is arranged so that the right side face inFIG. 7 as a main face thereof is directed to thesubstrate 31 side and the main face thereof is perpendicular to the main face of thesubstrate 31 at the outside of one end of thesubstrate 31. Then, mountassembly connecting electrodes substrate 37 and are contacted and connected respectively to the other end faces of theconnection members substrate 31 by soldering and the like. In this manner, themember connecting electrode 311 and the mountassembly connecting electrode 371 are connected and themember connecting electrode 313 and the mountassembly connecting electrode 373 are connected, so that themount assembly 3 and thesubstrate 37 are mechanically and electrically connected. Further, the vicinity of the connecting part between the mountassembly connecting electrode 371 and theconnection member 331 is sealed with aresin 353 and the vicinity of the connecting part between the mountassembly connecting electrode 373 and theconnection member 333 is sealed with aresin 354, so that the vicinities of the connection parts are fixed and protected. - As described above, according to the
mount assembly 3 of the second embodiment, it is possible to constitute theconnection member 333 having predetermined height by adjusting the length of the second pillar-shapedmember 335 while obtaining similar effects to those of the first embodiment. In addition, by utilizing it in combination with the pillar-shapedconnection member 331, the connection can be achieved with overlapped arrangement of the parallel portions not to be mutually contacted. Accordingly, since the space above thesubstrate 31 can be effectively utilized, design flexibility is increased. - Here, not limited to the case of combining the
connection members substrate 31 with second pillar-shaped members of different length. -
FIGS. 8 and 9 are partial sectional views illustrating an example of amount assembly 4 of the third embodiment. As illustrated inFIG. 8 , themount assembly 4 of the third embodiment includes asubstrate 41 and aconnection member 433. Mount components (not illustrated) are mounted on the upper face as a main face of thesubstrate 41, and then, amember connecting electrode 411 is formed at a predetermined position at one end side of the upper face while avoiding the mount components. Meanwhile, theconnection member 433 is constituted with a first pillar-shapedmember 434 and a second pillar-shapedmember 435 which are formed of conductive material respectively. One end face of the first pillar-shapedmember 434 is connected to a side face of the second pillar-shapedmember 435. One end face of the second pillar-shapedmember 435 is contacted to themember connecting electrode 411. Then, the first pillar-shapedmember 434 is arranged so that the longitudinal direction thereof is parallel to the main face of thesubstrate 41 and the other end thereof is extended to the outside of the one end of thesubstrate 41. Here, the connecting position of the first pillar-shapedmember 434 with respect to the second pillar-shapedmember 435 is determined in accordance with the position of a mount assembly connecting electrode of another member to be connected to themember connecting electrode 411 by the connection member 433 (i.e., in accordance with the height of the mount assembly connecting electrode of another member against the main face position of the substrate 41), for example. - When manufacturing the
mount assembly 4, the one end face of the first pillar-shapedmember 434 is previously connected to the side face of the second pillar-shapedmember 435 via a metallic film, for example. Then, the first pillar-shapedmember 434 is placed so that the longitudinal direction thereof is parallel to the main face of thesubstrate 41 and the other end thereof is extended to the outside of the one end of thesubstrate 41. Subsequently, the one end face of the second pillar-shapedmember 435 is connected to themember connecting electrode 411 as being vertically arranged thereon. Here, similar to the first embodiment, the vicinity of the connecting part may be fixed and protected by sealing the connecting part between thesubstrate 41 and theconnection member 433 with resin. For example, as illustrated inFIG. 9 , aprotection layer 451 is formed by filling resin onto thesubstrate 41 after the second pillar-shapedmember 435 is connected to themember connecting electrode 411. -
FIG. 10 is a partial sectional view illustrating a state that asubstrate 47 as another member is connected to themount assembly 4. Thesubstrate 47 is arranged so that the right side face inFIG. 10 as a main face thereof is directed to thesubstrate 41 side and the main face thereof is perpendicular to the main face of thesubstrate 41 at the outside of the one end of thesubstrate 41. Then, a mountassembly connecting electrode 471 is formed at a predetermined position of the right side face of thesubstrate 47 and is contacted and connected to the other end face of theconnection member 433 extended to the outside of the one end of thesubstrate 41 by soldering and the like. In this manner, themember connecting electrode 411 and the mountassembly connecting electrode 471 are connected, so that themount assembly 4 and thesubstrate 41 are mechanically and electrically connected. Further, the vicinity of the connecting part between the mountassembly connecting electrode 471 and theconnection member 433 is sealed with aresin 453, so that the vicinity of the connecting part is fixed and protected. - As described above, according to the
mount assembly 4 of the third embodiment, similar effects to those of the first embodiment can be obtained. In addition, the height of the parallel portion (i.e., the first pillar-shaped member 434) against the main face of thesubstrate 41 can be adjusted by adjusting the connecting position of the first pillar-shapedmember 434 against the second pillar-shapedmember 435. Accordingly, it is not necessary to form the second pillar-shaped member having different length for height adjustment unlike the second embodiment, so that cost can be reduced. - Here, not limited to the case of utilizing one type of the
connection member 433, it is also possible to utilize it in combination with the connection members described in the first and second embodiments. In this case, the connecting position of the first pillar-shaped member against the second pillar-shaped member is adjusted so as not cause mutual contacting of the parallel portions. Further, it is also possible to utilize combination of connection members which are respectively configured to have different height of the parallel portion against the main face of thesubstrate 41 by differently arranging the connecting position of the first pillar-shaped member against the second pillar-shaped member. -
FIGS. 11 and 12 are partial sectional views illustrating an example of amount assembly 5 of the fourth embodiment. As illustrated inFIG. 11 , themount assembly 5 of the fourth embodiment includes asubstrate 51 and aconnection member 53. Mount components (not illustrated) are mounted on the upper face as a main face of thesubstrate 51, and then, amember connecting electrode 511 is formed at a predetermined position at one end side of the upper face while avoiding the mount components. Meanwhile, theconnection member 53 is configured to integrate the first and second pillar-shaped members which constitute theconnection member 333 of the second embodiment or theconnection member 433 of the third embodiment. In the example ofFIG. 11 , theconnection member 53 has an L-shaped external shape obtained by bending a single pillar-shaped member formed of conductive material at a midpoint to form aparallel portion 531. Then, theconnection member 53 is arranged so that the proximal end thereof is contacted to themember connecting electrode 511, theparallel portion 531 is parallel to the main face of thesubstrate 51 and the distal end thereof is extended to the outside of the one end of thesubstrate 51. Here, the length from the proximal end to the midpoint of theconnection member 53 is determined in accordance with the position of a mount assembly connecting electrode of another member to be connected to themember connecting electrode 511 by the connection member 53 (i.e., in accordance with the height of the mount assembly connecting electrode of another member against the main face position of the substrate 51). - When manufacturing the
mount assembly 5, theparallel portion 531 of theconnection member 53 is arranged to be parallel to thesubstrate 51. Then, the proximal end of theparallel portion 531 is connected to themember connecting electrode 511 as being vertically arranged thereon so that the distal end thereof is extended to the outside of the one end of thesubstrate 51. Here, similar to the first embodiment, the vicinity of the connecting part may be fixed and protected by sealing the connecting part between thesubstrate 51 and theconnection member 53 with resin. For example, as illustrated inFIG. 12 , aprotection layer 551 is formed by filling resin onto thesubstrate 51 after the proximal end of theconnection member 53 is connected to themember connecting electrode 511. -
FIG. 13 is a partial sectional view illustrating a state that asubstrate 57 as another member is connected to themount assembly 5. Thesubstrate 57 is arranged so that the right side face inFIG. 13 as a main face thereof is directed to thesubstrate 51 side and the main face thereof is perpendicular to the main face of thesubstrate 51 at the outside of the one end of thesubstrate 51. Then, a mountassembly connecting electrode 571 is formed at a predetermined position of the right side face of thesubstrate 57 and is contacted and connected to the other end face of theconnection member 53 extended to the outside of the one end of thesubstrate 51 by soldering and the like. In this manner, themember connecting electrode 511 and the mountassembly connecting electrode 571 are connected, so that themount assembly 5 and thesubstrate 57 are mechanically and electrically connected. Further, the vicinity of the connecting part between the mountassembly connecting electrode 571 and theconnection member 53 is sealed with aresin 553, so that the vicinity of the connecting part is fixed and protected. - As described above, according to the
mount assembly 5 of the fourth embodiment, similar effects to those of the first embodiment can be obtained. In addition, it is not necessary to connect the first and the second pillar-shaped members which are formed separately, unlike the second and third embodiments. Accordingly, the process to connect the first and second pillar-shaped members becomes unnecessary while decreasing the number of parts, so that the number of processes of manufacturing may be decreased. Therefore, manufacturing themount assembly 5 can be performed more easily. - Here, not limited to the case of utilizing one type of the
connection member 53, it is also possible to utilize it in combination with the connection members described in the first to third embodiments. In this case, the length from the proximal end to the midpoint is adjusted so as not cause mutual contacting of the parallel portions. Further, it is also possible to utilize combination of connection members which are configured to have different height of the parallel portion against the main face of thesubstrate 51 by differently arranging the length from the proximal end to the midpoint. -
FIG. 14 is a partial sectional view illustrating an example of amount assembly 6 of the fifth embodiment. As illustrated inFIG. 14 , themount assembly 6 of the fifth embodiment includes asubstrate 61 and aconnection member 63 which is configured to be similar to theconnection member 53 of the fourth embodiment. Mount components (not illustrated) are mounted on the upper face as a main face of thesubstrate 61, and then, amember connecting electrode 611 is formed at a predetermined position at one end side of the upper face while avoiding the mount components. Meanwhile, theconnection member 63 is arranged so that the proximal end is contacted to themember connecting electrode 611 and the longitudinal direction of aparallel portion 631 is parallel to thesubstrate 61, as similar to the fourth embodiment. However, in the fifth embodiment, the distal end of theparallel portion 631 is located above thesubstrate 61. -
FIG. 15 is a partial sectional view illustrating a state that asubstrate 67 as another member is connected to themount assembly 6. Thesubstrate 67 is arranged so that a main face thereof is perpendicular to the main face of thesubstrate 61 above thesubstrate 61. Then, a mountassembly connecting electrode 671 is formed at a predetermined position of the right side face of thesubstrate 67 inFIG. 15 as the main face thereof and is contacted and connected to the other end face of theconnection member 63 extended to the outside of the one end of thesubstrate 61 by soldering and the like. In this manner, themember connecting electrode 611 and the mountassembly connecting electrode 671 are connected, so that themount assembly 6 and thesubstrate 67 are mechanically and electrically connected. Here, not illustrated in the drawings, the vicinity of the connecting part between the mountassembly connecting electrode 671 and theconnection member 63 may be sealed with resin. - As described above, according to the fifth embodiment, it is possible to connect the
substrate 67 at the inside of themount assembly 6 so that the main face thereof is arranged to be perpendicular to the main face of thesubstrate 61 while obtaining similar effects to those of the fourth embodiment. Therefore, it is possible to actualize themount assembly 6 having other members such as thesubstrate 67 connected thereto in higher density. Here, the above description is performed on the case that the connection member constituted as in the fourth embodiment is applied. However, the connection members having other configurations described in the first to third embodiments may be similarly applied. -
FIG. 16 is a schematic perspective view which schematically illustrates the entire configuration of anelectronic circuit module 7 including the mount assembly of the fifth embodiment. Theelectronic circuit module 7 inFIG. 16 is provided with asubstrate 71 having a plurality ofmember connecting electrodes 711 formed at short side ends of the upper face as a main face (i.e., two each at both short side ends in the example ofFIG. 16 ) and having a plurality of member connecting electrodes 712 (i.e., two in the example ofFIG. 16 ) formed at predetermined positions at the center thereof. In addition, theelectronic circuit module 7 includesconnection members 731 to 736 connected to the respectivemember connecting electrodes substrates substrate 71 so that respective main faces thereof are perpendicular to the main face of thesubstrate 71. Thesubstrate 771 is connected by theconnection members substrate 772 is connected by theconnection members substrate 773 is arranged on thesubstrate 71 so that a main face thereof is perpendicular to the main face of thesubstrate 71 and thesubstrate 773 is connected by theconnection members substrate 71, thesubstrate 773 is connected while avoiding the mount components. In this manner, according to theelectronic circuit module 7 including the mount assembly of the fifth embodiment, other members such as thesubstrate 773 can be connected to the inside of the mount assembly (i.e., above the substrate 71) as well, so that the space above thesubstrate 71 can be effectively utilized. Therefore, it is possible to configure theelectronic circuit module 7 to mount thesubstrates substrate 71, it is also possible to form member connecting electrodes at an end of the long side and to connect other members such as a substrate at the outside thereof. -
FIG. 17 is a partial sectional view illustrating an example of amount assembly 8 of the sixth embodiment.FIG. 18 is an explanatory view illustrating position arrangement ofmember connecting electrodes substrate 81.FIG. 19 is a side view of the mount assembly viewing from one end side of thesubstrate 81. As illustrated inFIG. 17 , themount assembly 8 of the sixth embodiment includes thesubstrate 81 and two types ofconnection members substrate 81 andmember connecting electrodes FIG. 18 , a plurality (i.e., five in total in the example ofFIG. 18 ) ofmember connecting electrodes substrate 81. Theconnection members 831 are respectively connected to three of themember connecting electrodes 811 on the outer row and theconnection members 833 are respectively connected to two of themember connecting electrodes 813 on the inner row. The height of theconnection members 833 is determined so as not to cause interference between parallel portions of theconnection members 831 and theconnection members 833 in the vertical direction. As illustrated inFIG. 19 , viewing themount assembly 8 from the one end side of thesubstrate 81, theconnection members substrate 81 is alternately to be high and to be low. Here, not limited to the combination of theconnection members 831 and theconnection members 833 as illustrated inFIG. 17 , the connection members described in the first to fourth embodiments can be utilized as being appropriately combined for the combination of connection members respectively having different height of each parallel portion from the main face of thesubstrate 81. -
FIGS. 20 and 21 are schematic perspective views illustrating the entire configuration of themount assembly 8 of the sixth embodiment.FIG. 20 illustrates an example of the inner configuration of themount assembly 8. As illustrated inFIG. 20 , a plurality (i.e., six in the example ofFIG. 20 ) ofmount components 891 to 896 are mounted on thesubstrate 81 of themount assembly 8. As described with reference toFIGS. 17 to 19 , two types of theconnection members 831 and the connection members 833 (i.e., three of theconnection members 831 and two of the connection members 833) are arranged at the one end of thesubstrate 81 and are connected respectively to the member connecting electrodes (not illustrated) on thesubstrate 81. Similarly, two types of theconnection members 831 and the connection members 833 (i.e., three of theconnection members 831 and two of the connection members 833) are also arranged at the other end of thesubstrate 81 and are connected respectively to the member connecting electrodes (not illustrated) on thesubstrate 81. Further, U-shapedinter-electrode connection members substrate 81. Specifically, the respectiveinter-electrode connection members substrate 81 are sterically intersected above themount components inter-electrode connection members substrate 81. As illustrated inFIG. 21 , themount assembly 8 is sealed with aresin 85 in order to fix and protect inner members such as themount components 891 to 896 and theconnection members substrate 81, it is also possible to form member connecting electrodes at an end of the long side and to connect other members such as a substrate at the outside thereof. - As described above, according to the
mount assembly 8 of the sixth embodiment, it is possible to arrange the parallel portions of theadjacent connection members mount assembly 8 can be miniaturized while obtaining similar effects to those of the abovementioned embodiments. Further, as described with reference toFIG. 17 , the electrodes on thesubstrate 81 can be sterically connected by utilizing appropriate combination of theconnection members substrate 81. With this configuration, the space above thesubstrate 81 can be effectively utilized and miniaturization can be achieved. In addition, compared to a case of connecting by forming a wiring pattern on a substrate, reliable connection can be actualized at low resistance. - Here, in the abovementioned first to sixth embodiments, the other end of the parallel portion formed at the connection member is extended to the outside of the one end of the upper face of the substrate constituting the mount assembly. However, the other end of the parallel portion is only required to be extended at least to the one end edge of the upper face of the substrate. In this case, an end face of a protection layer at one end side of the substrate is polished after forming the protection layer by filling resin onto the substrate, for example. In this manner, the other end face of the parallel portion may be exposed from a side face at the one end side of the mount assembly.
- By the way, in the description of the above-mentioned embodiments, the mount assembly is produced (i.e., manufactured) as a single body. However, a method for manufacturing a mount assembly is not limited to this. The seventh embodiment relates to a method for manufacturing a mount assembly.
FIGS. 22 and 23 are explanatory views illustrating a principle of the method for mount assembly manufacturing of the seventh embodiment.FIG. 24 is a schematic perspective view of amount assembly 9 manufactured by the method for mount assembly manufacturing of the seventh embodiment. - In the present method for manufacturing, the plurality of
mount assemblies 9 are simultaneously produced on asingle substrate 91. On the main face as the upper face of thesubstrate 91, mount components (not illustrated) are mounted on each section area A9 defined by cutting positions as illustrated by dashed lines inFIG. 22 . Then, the plurality ofmount assemblies 9 are separated (i.e., individuated) by being cut at the cutting positions for the last time. In the present method for mount assembly manufacturing,member connecting electrodes substrate 91 sandwiching the cutting position as being opposed to each other. In the example ofFIG. 22 , two couples of opposedmember connecting electrodes FIG. 22 , amember 93 having a pillar-shapedportion 931 to be a connection member when individuated intorespective mount assemblies 9 as illustrated inFIG. 23 is placed between the opposedmember connecting electrodes portion 931 forms a parallel portion of the connection member and themember 93 is arranged so that the pillar-shapedportion 931 passes over the cutting position. Then, after performing a protection layer arranging process and the like, themodularized mount assembly 9 can be obtained as illustrated inFIG. 24 by being individuated by being cut at the cutting positions for the last time. -
FIGS. 25A to 25C are explanatory views illustrating a specific example of respective processes in the present method for mount assembly manufacturing.FIG. 26 is a partial sectional view illustrating a state that substrates 97-1, 97-2 as other members are connected to the manufactured mount assemblies 9 (9-1, 9-2). Following description is performed having a case to obtain a mount assembly to which theconnection member 333 of the second embodiment is applied as an example. In this description, mount components (not illustrated) are previously mounted on the main face of thesubstrate 91. As illustrated inFIG. 25A , themember connecting electrodes FIG. 25A on the main face of the substrate 91 (i.e., an electrode forming process). Next, proceeding to a connecting process, one end face of each second pillar-shapedmember 935 is connected to eachmember connecting electrode 911 as a support portion by soldering and the like as being vertically arranged thereon. Then, after forming aprotection layer 951 by filling resin onto thesubstrate 91, the upper face of theprotection layer 951 is polished to be planarized, so that the other end faces of the second pillar-shapedmembers FIG. 25B ,metallic films members portion 931 is arranged to be parallel to the main face of thesubstrate 91, so that side faces of both ends are connected respectively to the other end faces of the second pillar-shapedmembers metallic films metallic films resin 952 and is fixed and protected. Then, proceeding to an individuating process, the mount assemblies 9 (9-1, 9-2) are obtained by individuating with dicing, as illustrated inFIG. 25C . - The mount assemblies 9-1, 9-2 manufactured as described above are connected to the substrates 97-1, 97-2 as other members respectively having a mount
assembly connecting electrode 971 formed on a main face being similar to the abovementioned embodiments. Specifically, the substrate 97-1 is arranged so that the left side face inFIG. 26 as the main face is directed to a substrate 91-1 side and the main face thereof is perpendicular to the main face of the substrate 91-1 at the outside of one end of the substrate 91-1. Then, the mountassembly connecting electrode 971 of the substrate 97-1 is connected to the other end face of theconnection member 93 extended to the outside of the one end of the substrate 91-1, so that the mount assembly 9-1 and the substrate 97-1 are mechanically and electrically connected. Similarly, the substrate 97-2 is arranged so that the right side face inFIG. 26 as a main face is directed to a substrate 91-2 side and the main face thereof is perpendicular to the main face of the substrate 91-2 at the outside of the one end of the substrate 91-2. Then, the mountassembly connecting electrode 971 of the substrate 97-2 is connected to the other end face of theconnection member 93 extended to the outside of the one end of the substrate 91-2, so that the mount assembly 9-2 and the substrate 97-2 are mechanically and electrically connected. - As described above, according to the method for mount assembly manufacturing of the seventh embodiment, cost for manufacturing can be reduced and productivity can be improved since a plurality of mount assemblies can be produced at one time.
- In the description of the seventh embodiment, the connection member having the configuration of the second embodiment is adopted. However, the connection members of other configurations described in the first, third and forth embodiments can be also adopted similarly. For example, in the case that the connection member having the configuration described in the fourth embodiment is adopted, an externally U-shaped member having support portions integrally formed at both ends of a pillar-shaped portion which forms a parallel portion is prepared. In the connecting process, proximal ends of the respective support portions which are vertically arranged are connected onto the respective member connecting electrodes being opposed as sandwiching the cutting position while the pillar-shaped portion is arranged to be parallel to the main face of the substrate. With this configuration, the number of processes for manufacturing can be reduced since the process to connect the second pillar-shaped
members - Further, in the above description of the seventh embodiment, the member connecting electrodes are formed in the same number (i.e., two) at each end on the substrate constituting the mount assembly. However, the number of the member connecting electrodes formed at each end can be appropriately set.
FIG. 27 is a view illustrating a modified example of position arrangement ofmember connecting electrodes 1011 formed on asubstrate 101.FIG. 28 is an explanatory view illustrating a principle of a method for mount assembly manufacturing of the present modified example. - As illustrated in
FIG. 27 , on a main face of the mount assembly manufactured by the method for manufacturing of the present modified example, three ofmember connecting electrodes 1011 are formed at the left end of thesubstrate 101 inFIG. 27 and onemember connecting electrode 1011 is formed at the right end. In addition, twomember connecting electrodes 1011 are formed respectively at the upper end and lower end. In the connecting process of this case, as illustrated inFIG. 28 , the respectivemember connecting electrodes 1011 are formed at thesubstrate 10 so that positions of themember connecting electrodes 1011 formed at adjacent section areas A10 are to be mutually axisymmetric sandwiching a cutting position indicated by a dashed line inFIG. 28 . With this configuration, simultaneous producing can be performed even in the case that the number (including zero) of the member connecting electrodes to be formed at the end of the substrate differs for each end. More specifically, the simultaneous producing can be performed even in the case that the number of the member connecting electrodes formed at one opposed end is not the same, as long as the number of the member connecting electrodes formed at the other opposed end is the same. -
FIG. 29 is a schematic perspective view illustrating the entire configuration of amount assembly 1100 of the eighth embodiment. In themount assembly 1100 ofFIG. 29 , a plurality (i.e. nine in the example ofFIG. 29 ) of other ends ofconnection members 1131 to 1139 (specifically, other ends of parallel portions formed at theconnection members 1131 to 1139) are exposed at an end face of aprotection layer 1150 on asubstrate 1110. Then, a plurality (i.e., four in the example ofFIG. 29 ) of sideface connecting electrodes 1151 to 1154 are formed at the end face, so that the sideface connecting electrodes 1151 to 1154 are connected to other members respectively having a mount assembly connecting electrode formed on a main face thereof. Specifically, the other end of theconnection member 1132 and the sideface connecting electrode 1151 are connected via a wiring pattern P1110. The other end of theconnection member 1138 and the sideface connecting electrode 1152 are connected via a wiring pattern P1130. The other end of theconnection member 1135 and the sideface connecting electrode 1153 are connected via a wiring pattern P1150. Here, the wiring patterns P1110, P1130, P1150 are formed at the end face of theprotection layer 1150. The wiring patterns P1110, P1130, P1150 can be formed by appropriately utilizing a thin-film method, an ink-jet method and the like, for example. At that time, it is also possible to form an insulating protection film at a part of the end face of theprotection layer 1150 other than the sideface connecting electrodes 1151 to 1154. - According to the eighth embodiment, since the side
face connecting electrodes 1151 to 1154 to be connected to other members can be formed at the end face of theprotection layer 1150, connecting positions in themount assembly 1100 with other members can be flexibly adjusted and design flexibility can be increased. - In the above description of the first to eighth embodiments, the member connecting electrode formed on the substrate constituting the mount assembly and the mount assembly connecting electrode formed on the substrate as another member are connected. However, the present invention is not limited to this.
FIG. 30 is a view illustrating an example of a modified example of amount assembly 1200.FIG. 30 illustrates a scene to connect asubstrate 1270 as another member to themount assembly 1200. As illustrated inFIG. 30 , themount assembly 1200 of the present modified example includes asubstrate 1210 and two types ofconnection members mount component 1290 is mounted on the upper face as a main face of thesubstrate 1210, and then, amember connecting electrode 1211 is formed at a predetermined position at one end side of the upper face while avoiding themount component 1290. - The
connection member 1231 is constituted similarly to theconnection member 13 of the first embodiment. Meanwhile, theconnection member 1233 is constituted similarly to theconnection member 333 of the second embodiment. In the present modified example, one end face of a second pillar-shapedmember 1235 of theconnection member 1233 is connected to amember connecting electrode 1291 formed on a main face of themount component 1290. Then, a first pillar-shapedmember 1234 is arranged so that the longitudinal direction thereof is parallel to the main face of the substrate 1210 (i.e., parallel to the main face of the mount component 1290) and the other end thereof is extended to the outside of the one end of thesubstrate 1210. The vicinity of the connecting part between the first pillar-shapedmember 1234 and the second pillar-shapedmember 1235 is fixed and protected by being sealed with aresin 1252. Themount assembly 1200 is connected to thesubstrate 1270 as another member having mountassembly connecting electrodes member 1235 of theconnection member 1233 is determined in accordance with the position of the mountassembly connecting electrode 1273 of thesubstrate 1270 connected to themember connecting electrode 1291 by the connection member 1233 (i.e., in accordance with the height of the mountassembly connecting electrode 1273 of thesubstrate 1270 against the main face position of themount component 1290 where themember connecting electrode 1291 is formed). - In the above description of the first to sixth embodiments, the other end face of the parallel portion formed at the connection member is connected to the mount assembly connecting electrode formed at another member such as the substrate. However, the present invention is not limited to this. In the following, a modified example will be described having a connection member of a similar configuration to the connection member of the fourth embodiment as an example. Here, the connection members of the other configurations described in the first to third embodiments may be similarly adopted.
-
FIG. 31 is an explanatory view of the modified example of a connection method between the other end side of aparallel portion 1331 formed at aconnection member 1330 and a mountassembly connecting electrode 1371 of asubstrate 1370 as another member. In the example ofFIG. 31 , the proximal end of theconnection member 1330 is connected to amember connecting electrode 1311 and aprotection layer 1350 is formed by filling resin onto asubstrate 1310. Subsequently, a projection portion at the distal end side of theparallel portion 1331 of theconnection member 1330 is folded upward, for example, along an end face of theprotection layer 1350. Amount assembly 1300 is connected to thesubstrate 1370 as another member where the mountassembly connecting electrode 1371 is formed. Specifically, a side face of the other end of the foldedparallel portion 1331 is connected to the mountassembly connecting electrode 1371. With this configuration, compared to a case of connecting the other end face of theparallel portion 1331 to the mountassembly connecting electrode 1371, the connection area of theparallel portion 1331 against the mountassembly connecting electrode 1371 can be widely ensured, so that the connection strength therebetween can be enhanced. -
FIG. 32 is an explanatory view of another modified example of a connection method of the other end side of aparallel portion 1431 formed at aconnection member 1430 and a mountassembly connecting electrode 1471 of asubstrate 1470 as another member. In the example of FIG. 32, the other end side of theparallel portion 1431 is folded upward, for example, after the proximal end of theconnection member 1430 is connected to amember connecting electrode 1411. Subsequently, aprotection layer 1450 is formed by filling resin onto asubstrate 1410 and a side face of the other end of theparallel portion 1431 is exposed by polishing an end face of theprotection layer 1450 at one end side of thesubstrate 1410. Amount assembly 1400 is connected to thesubstrate 1470 as another member where the mountassembly connecting electrode 1471 is formed. Specifically, the side face of the other end of the exposedparallel portion 1431 is connected to the mountassembly connecting electrode 1471. Similarly in this case, the connection area of theparallel portion 1431 against the mountassembly connecting electrode 1471 can be widely ensured, so that the connection strength therebetween can be enhanced. - Here, the substrate described as an example of a member constituting a mount assembly or another member may be an interconnection substrate having a wiring pattern formed or may be a substrate where an electronic circuit and the like are mounted inside.
- In the description of the abovementioned embodiments, the substrate is connected to the mount assembly. However, another member to be the connection target is not limited to a substrate. For example, the present invention can be applied to a case that a member such as an electronic component and an electronic circuit module is arranged so that a main face thereof is perpendicular to a main face of a substrate and is connected thereto.
-
FIGS. 33 and 34 are perspective views illustrating a configuration example of amount assembly 1 a of the ninth embodiment. InFIG. 33 , afirst substrate 11 a and asecond substrate 13 a constituting themount assembly 1 a are illustrated as being separated. InFIG. 34 , thefirst substrate 11 a and thesecond substrate 13 a are illustrated in a connected state. Themount assembly 1 a inFIG. 33 includes thefirst substrate 11 a and thesecond substrate 13 a which are arranged to be opposed as main faces thereof being mutually parallel, aninter-substrate connection member 15 a which mechanically and electrically connects thefirst substrate 11 a and thesecond substrate 13 a, and aninter-member connection member 17 a which connects another member arranged at a side of themount assembly 1 a. - At the
first substrate 11 a of the lower side, mount components C11 as electronic components such as electronic circuits are mounted on the upper face as a main face. In addition, at thefirst substrate 11 a, a plurality (i.e., four in the example ofFIG. 33 ) ofsubstrate connecting electrodes 111 a are formed at predetermined positions of the upper face avoiding the mount components C11 and a plurality (i.e., three each at each short side in the example ofFIG. 33 ) ofmember connecting electrodes 113 a are formed at predetermined positions of short side ends. Meanwhile, at thesecond substrate 13 a of the upper side, mount components C13 as electronic components such as electronic circuits are mounted on the upper face andsubstrate connecting electrodes 131 a are formed on the lower face. Thesubstrate connecting electrodes 131 a are formed respectively at the positions which are to be opposed to thesubstrate connecting electrodes 111 a of thefirst substrate 11 a when thefirst substrate 11 a and thesecond substrate 13 a are arranged to be opposed. - The
inter-substrate connection member 15 a is a pillar-shaped member formed of conductive material. Theinter-substrate connection member 15 a connects thefirst substrate 11 a and thesecond substrate 13 a as one end face being contacted to thesubstrate connecting electrode 111 a of thefirst substrate 11 a and the other end face being contacted to thesubstrate connecting electrode 131 a of thesecond substrate 13 a. Theinter-substrate connection member 15 a is formed to have length determined by the height from the main face of thefirst substrate 11 a to the lower face of thesecond substrate 13 a. - The
inter-member connection member 17 a is constituted with a single pillar-shaped member formed of conductive material.FIG. 35 is an explanatory view illustrating a configuration example of theinter-member connection member 17 a. As illustrated inFIG. 35 , theinter-member connection member 17 a forms a parallel portion while being arranged so that the longitudinal direction thereof is parallel to thefirst substrate 11 a as a side face of one end being contacted to themember connecting electrode 113 a and the other end being extended to the outside of the one end of the upper face of thefirst substrate 11 a. Theinter-member connection member 17 a is formed to have length determined by the distance from themember connecting electrode 113 a to the one end of thefirst substrate 11 a. - When manufacturing the
mount assembly 1 a, theinter-substrate connection member 15 a is vertically arranged on thesubstrate connecting electrode 111 a of thefirst substrate 11 a having the mount component C11 mounted and is connected by soldering and the like thereto, for example. Theinter-member connection member 17 a is arranged so that the longitudinal direction thereof is parallel to the main face of thefirst substrate 11 a and the other end is extended to the outside of the corresponding short side end of thefirst substrate 11 a, and then, a side face of the one end of theinter-member connection member 17 a is contacted and connected to themember connecting electrode 113 a by soldering and the like. Subsequently, thefirst substrate 11 a and thesecond substrate 13 a are arranged to be mutually opposed. Then, thesubstrate connecting electrode 131 a of the lower face is opposed to thesubstrate connecting electrode 111 a of thefirst substrate 11 a and the other end face of theinter-substrate connection member 15 a is contacted and connected to thesubstrate connecting electrode 131 a by soldering and the like. In this manner, themount assembly 1 a in which thefirst substrate 11 a and thesecond substrate 13 a are mechanically and electrically connected is obtained, as illustrated inFIG. 34 . Then, a protection layer is formed by filling resin as a reinforcing member into a gap E between thefirst substrate 11 a and thesecond substrate 13 a, so that the inside members are fixed and protected. With this configuration, reliability of the mount assembly la can be improved and handling as a component can be eased. Here, it is also possible to form a protection layer by appropriately filling resin onto thesecond substrate 13 a as well and to fix and protect the inside members such as mount components. -
FIG. 36 is a partial sectional view of the vicinity of theinter-member connection member 17 a illustrating a state that asubstrate 19 a as another member is connected to themount assembly 1 a. Thesubstrate 19 a is arranged so that the right side face inFIG. 36 as a main face is directed to thefirst substrate 11 a side and the main face thereof is perpendicular to the main face of thefirst substrate 11 a at the outside of the one end of thefirst substrate 11 a. Then, a mountassembly connecting electrode 191 a is formed at a predetermined position of the right side face of thesubstrate 19 a and is contacted and connected to the other end face of theinter-member connection member 17 a extended to the outside of the one end of thefirst substrate 11 a by soldering and the like. In this manner, themember connecting electrode 113 a and the mountassembly connecting electrode 191 a are connected, so that themount assembly 1 a and thesubstrate 19 a are mechanically and electrically connected. Further, the vicinity of the connecting part between the mountassembly connecting electrode 191 a and theinter-member connection member 17 a is fixed and protected by being sealed with aresin 18 a. - As described above, according to the
mount assembly 1 a of the ninth embodiment, it is possible to arrange theinter-member connection member 17 a constituted with the single pillar-shaped member to be parallel to the main face of thefirst substrate 11 a, while one end thereof is connected to themember connecting electrode 113 a which is formed at the main face of thefirst substrate 11 a and the other end is extended to the outside the one end of the upper face of thefirst substrate 11 a. Then, themount assembly 1 a having thesecond substrate 13 a laminated on thefirst substrate 11 a can be actualized. Accordingly, other members such as thesecond substrate 13 a arranged so that the main face thereof is perpendicular to the main face of thefirst substrate 11 a can be connected to the other end of theinter-member connection member 17 a (i.e., the parallel portion). With this configuration, other members such as a substrate can be easily connected to themount assembly 1 a in high density. In addition, themember connecting electrode 113 a and the mountassembly connecting electrode 191 a can be connected by the pillar-shapedinter-member connection member 17 a. At that time, it is also possible that the diameter of theinter-member connection member 17 a is appropriately enlarged in consideration of the space on thefirst substrate 11 a. Accordingly, compared to a case of forming a wiring pattern on the first substrate for connection, reliable connection can be actualized at low resistance. - In the above description of the ninth embodiment, the inter-member connection member is constituted with a single pillar-shaped member. However, the configuration of the inter-member connection member is not limited to this.
-
FIG. 37 is an explanatory view illustrating a configuration example of aninter-member connection member 27 a of modified example 1. Theinter-member connection member 27 a of modified example 1 includes a first pillar-shapedmember 271 a and a second pillar-shapedmember 273 a as a support portion. The respective pillar-shapedmembers member 273 a which supports the first pillar-shapedmember 271 a is connected to a side face of one end of the first pillar-shapedmember 271 a forming a parallel portion. The other end face of the second pillar-shapedmember 273 a of theinter-member connection member 27 a is connected to amember connecting electrode 213 a of afirst substrate 21 a. Then, the first pillar-shapedmember 271 a is arranged so that the longitudinal direction thereof is parallel to the main face of thefirst substrate 21 a and the other end thereof is extended to the outside of the one end of thefirst substrate 21 a. Here, the length of the second pillar-shapedmember 273 a is determined in accordance with the position of the mount assembly connecting electrode of the member to be connected to themember connecting electrode 213 a by theinter-member connection member 27 a (i.e., in accordance with the height of the mount assembly connecting electrode of another member against the main face position of thefirst substrate 21 a). - When connecting the
inter-member connection member 27 a to themember connecting electrode 213 a, first, the other end face of the second pillar-shapedmember 273 a is connected to themember connecting electrode 213 a as being vertically arranged thereon. Subsequently, the first pillar-shapedmember 271 a is placed so that the longitudinal direction thereof is parallel to the main face of thefirst substrate 21 a, and then, the side face of the one end thereof is contacted to the one end face of the second pillar-shapedmember 273 a and connected thereto via a metallic film. Here, it is also possible that the side face of the one end of the first pillar-shapedmember 271 a and the one end face of the second pillar-shapedmember 273 a are previously connected by soldering and the like. -
FIG. 38 is a partial sectional view of a vicinity of theinter-member connection member 27 a illustrating a state that asubstrate 29 a as another member is connected to amount assembly 2 a having theinter-member connection member 27 a of modified example 1. Thesubstrate 29 a is arranged so that the right side face inFIG. 38 as a main face is directed to thefirst substrate 21 a side and the main face thereof is perpendicular to the main face of thefirst substrate 21 a at the outside of the one end of thefirst substrate 21 a. Then, a mountassembly connecting electrode 291 a is formed at a predetermined position of the right side face of thesubstrate 29 a and is contacted and connected to the other end face of theinter-member connection member 27 a extended to the outside of the one end of thefirst substrate 21 a by soldering and the like. In this manner, themember connecting electrode 213 a and the mountassembly connecting electrode 291 a are connected, so that themount assembly 2 a and thesubstrate 29 a are mechanically and electrically connected. Further, the vicinity of the connecting part between the mountassembly connecting electrode 291 a and theinter-member connection member 27 a is fixed and protected by being sealed with aresin 28 a. - As described above, according to modified example 1, the
inter-member connection member 27 a having a predetermined height can be constituted by adjusting the length of the second pillar-shapedmember 273 a. -
FIG. 39 is an explanatory view of a configuration example of theinter-member connection member 37 a of modified example 2. Theinter-member connection member 37 a of modified example 2 includes a first pillar-shapedmember 371 a and a second pillar-shapedmember 373 a as a support portion. The respective pillar-shapedmembers member 371 a is connected to a side face of the second pillar-shapedmember 373 a. One end face of the second pillar-shapedmember 373 a is contacted to amember connecting electrode 313 a of afirst substrate 31 a. Then, the first pillar-shapedmember 371 a is arranged so that the longitudinal direction thereof is parallel to a main face of thefirst substrate 31 a and the other end thereof is extended to the outside of the one end of thefirst substrate 31 a. Here, the connecting position of the first pillar-shapedmember 371 a against the second pillar-shapedmember 373 a is determined in accordance with the position of the mount assembly connecting electrode of another member to be connected to themember connecting electrode 313 a by theinter-member connection member 37 a (i.e., in accordance with the height of the mount assembly connecting electrode of another member against the main face position of thefirst substrate 31 a). - When connecting the
inter-member connection member 37 a to themember connecting electrode 313 a, the one end face of the first pillar-shapedmember 371 a is previously connected to the side face of the second pillar-shapedmember 373 a via a metallic film, for example. Then, the first pillar-shapedmember 371 a is arranged so that the longitudinal direction thereof is parallel to the main face of thefirst substrate 31 a and the other end thereof is extended to the outside of the one end of thefirst substrate 31 a. The one end face of the second pillar-shapedmember 373 a is connected to themember connecting electrode 313 a as being vertically arranged thereon. -
FIG. 40 is a partial sectional view of the vicinity of aninter-member connection member 37 a illustrating a state that asubstrate 39 a as another member is connected to amount assembly 3 a having theinter-member connection member 37 a of modified example 2. Thesubstrate 39 a is arranged so that the right side face inFIG. 40 as a main face is directed to thefirst substrate 31 a side and the main face thereof is perpendicular to the main face of thefirst substrate 31 a at the outside of the one end of thefirst substrate 31 a. Then, a mountassembly connecting electrode 391 a is formed at a predetermined position of the right side face of thesubstrate 39 a and is contacted and connected to the other end face of theinter-member connection member 37 a extended to the outside of the one end of thefirst substrate 31 a by soldering and the like. In this manner, themember connecting electrode 313 a and the mountassembly connecting electrode 391 a are connected, so that themount assembly 3 a and thesubstrate 39 a are mechanically and electrically connected. Further, the vicinity of the connecting part between the mountassembly connecting electrode 391 a and theinter-member connection member 37 a is fixed and protected by being sealed with aresin 38 a. - As described above, according to modified example 2, the height of the parallel portion (i.e., the first pillar-shaped
member 371 a) against the main face of thefirst substrate 31 a can be adjusted by adjusting the connecting position of the first pillar-shapedmember 371 a against the second pillar-shapedmember 373 a. Accordingly, it is not necessary to form the second pillar-shaped member having different length for height adjustment unlike modified example 1, so that cost can be reduced. -
FIG. 41 is an explanatory view of a configuration example of aninter-member connection member 47 a of modified example 3. Theinter-member connection member 47 a of modified example 2 integrates the first and second pillar-shaped members constituting theinter-member connection member 27 a of modified example 1 or theinter-member connection member 37 a of modified example 2. In the example ofFIG. 41 , theinter-member connection member 47 a has an L-shaped external shape which is obtained by bending a single pillar-shaped member formed of conductive material at a midpoint to form aparallel portion 471 a. Then, theinter-member connection member 47 a is arranged so that the proximal end thereof is contacted to amember connecting electrode 413 a of afirst substrate 41 a, theparallel portion 471 a is parallel to the main face of thefirst substrate 41 a and the distal end thereof is extended to the outside of the one end of thefirst substrate 41 a. Here, the length from the proximal end to the midpoint of theinter-member connection member 47 a is determined in accordance with the position of a mount assembly connecting electrode of another member to be connected to themember connecting electrode 413 a by theinter-member connection member 47 a (i.e., in accordance with the height of the mount assembly connecting electrode of another member against the main face position of thefirst substrate 41 a). - When connecting the
inter-member connection member 47 a to themember connecting electrode 413 a, theparallel portion 471 a of theinter-member connection member 47 a is set to be parallel to thefirst substrate 41 a. Then, the proximal end is connected onto themember connecting electrode 413 a as being vertically arranged thereon so that the distal end of theparallel portion 471 a is extended to the outside of the one end of thefirst substrate 41 a. -
FIG. 42 is a partial sectional view of the vicinity of theinter-member connection member 47 a illustrating a state that asubstrate 49 a as another member is connected to amount assembly 4 a having theinter-member connection member 47 a of modified example 3. Thesubstrate 49 a is arranged so that the right side face inFIG. 42 as a main face is directed to thefirst substrate 41 a side and the main face thereof is perpendicular to the main face of thefirst substrate 41 a at the outside of the one end of thefirst substrate 41 a. Then, a mountassembly connecting electrode 491 a is formed at a predetermined position of the right side face of thesubstrate 49 a and is contacted and connected to the other end face of theinter-member connection member 47 a extended to the outside of the one end of thefirst substrate 41 a by soldering and the like. In this manner, themember connecting electrode 413 a and the mountassembly connecting electrode 491 a are connected, so that themount assembly 4 a and thesubstrate 49 a are mechanically and electrically connected. Further, the vicinity of the connecting part between the mountassembly connecting electrode 491 a and theinter-member connection member 47 a is fixed and protected by being sealed with aresin 48 a. - As described above, according to modified example 3, it is not necessary to connect the first and second pillar-shaped members which are formed separately unlike modified examples 1 and 2. Accordingly, the process to connect the first and second pillar-shaped members becomes unnecessary while the number of parts can be reduced. With this configuration, since the number of processes of manufacturing can be reduced, manufacturing the
mount assembly 4 a can be performed more easily. -
FIG. 43 is an explanatory view of the configuration ofinter-member connection members member connecting electrodes first substrate 51 a and two types of theinter-member connection members member connecting electrodes - The
inter-member connection member 571 a configured to be similar to theinter-member connection member 17 a of the ninth embodiment is arranged to be contacted to the outermember connecting electrode 513 a and is arranged so that the longitudinal direction thereof is parallel to thefirst substrate 51 a and the other end is extended to the outside of one end of thefirst substrate 51 a. Meanwhile, theinter-member connection member 573 a configured to be similar to theinter-member connection member 27 a of modified example 1 is constituted with a first pillar-shapedmember 574 a and a second pillar-shapedmember 575 a. One end face of the second pillar-shapedmember 575 a of theinter-member connection member 573 a is connected to the innermember connecting electrode 513 a. Then, the first pillar-shapedmember 574 a is arranged so that the longitudinal direction thereof is parallel to a main face of thefirst substrate 51 a and the other end thereof is extended to the outside of the one end of thefirst substrate 51 a. Here, the length of the second pillar-shapedmember 575 a is determined so as not to cause interference between parallel portions of theinter-member connection members inter-member connection member 571 a and the first pillar-shapedmember 574 a of theinter-member connection member 573 a) in accordance with the position of a mount assembly connecting electrode of another member to be connected to themember connecting electrode 513 a by theinter-member connection member 573 a (i.e., in accordance with the height of the mount assembly connecting electrode of another member against the main face position of thefirst substrate 51 a). - When connecting the
inter-member connection members member connecting electrodes inter-member connection member 571 a is placed so that the longitudinal direction thereof is parallel to the main face of thefirst substrate 51 a, and then, a side face of the one end of theinter-member connection member 571 a is connected to themember connecting electrode 513 a. Further, one end face of the second pillar-shapedmember 575 a constituting theinter-member connection member 573 a is connected to themember connecting electrode 513 a as being vertically arranged thereon. Subsequently, the first pillar-shapedmember 574 a is placed so that the longitudinal direction thereof is parallel to the main face of thefirst substrate 51 a, and then, the side face of the one end thereof is contacted to the other end face of the second pillar-shapedmember 575 a and connected thereto via a metallic film. -
FIG. 44 is a partial sectional view of the vicinity of theinter-member connection members substrate 59 a as another member is connected to amount assembly 5 a having theinter-member connection members substrate 59 a is arranged so that the right side face inFIG. 44 as a main face is directed to thefirst substrate 51 a side and the main face thereof is perpendicular to the main face of thefirst substrate 51 a at the outside of the one end of thefirst substrate 51 a. Then, mountassembly connecting electrodes substrate 59 a and are contacted and connected respectively to the other end face of theinter-member connection member 571 a extended to the outside of the one end of thefirst substrate 51 a and the other end face of the second pillar-shapedmember 575 a of theinter-member connection member 573 a by soldering and the like. In this manner, themember connecting electrode 513 a and the mountassembly connecting electrode 591 a are connected while themember connecting electrode 513 a and the mountassembly connecting electrode 591 a are connected, so that themount assembly 5 a and thesubstrate 59 a are mechanically and electrically connected. Further, the vicinity of the connecting part between the mountassembly connecting electrode 591 a and theinter-member connection member 571 a is sealed with aresin 581 a and the vicinity of the connecting part between the mountassembly connecting electrode 591 a and theinter-member connection member 573 a is sealed with aresin 583 a, so that the vicinities of the connecting parts are fixed and protected. - As described above, according to modified example 4, the connection can be achieved with overlapped arrangement of the parallel portions not to be mutually contacted by utilizing combination of the two types of the
inter-member connection members first substrate 51 a may be effectively utilized, design flexibility is increased. - Here, not limited to the case of combining the
inter-member connection members first substrate 51 a by utilizing the second pillar-shaped member having different length and to utilize the combination thereof. Further, it is also possible to combine the connection members described in modified examples 2 and 3. For example, in the case that the inter-member connection members described in modified example 2 are combined, the connecting position of the first pillar-shaped member against the second pillar-shaped member is adjusted so as not to cause contact between respective parallel portions. Further, it is also possible that the inter-member connection members are configured respectively to have different height of the parallel portion against the main face of the first substrate by varying the connecting position of the first pillar-shaped member against the second pillar-shaped member and that the combination thereof is utilized. In the case that the inter-member connection members described in modified example 3 are combined, the length from the proximal end to the midpoint is adjusted so as not cause contact between respective parallel portions. Further, it is also possible that the inter-member connection members are configured respectively to have different height of the parallel portion against the main face of thefirst substrate 51 a by varying the length from the proximal end to the midpoint and that the combination thereof is utilized. - In the description of the ninth embodiment, the other end of the connection member forming the parallel portion is extended to the outside of the one end of the first substrate. However, it is also possible that the other end of the parallel portion is located above the first substrate.
FIG. 45 is an explanatory view of the configuration of aninter-member connection member 67 a of the tenth embodiment. In the present embodiment, amember connecting electrode 613 a is formed at a predetermined position of one end side of the upper face as a main face of afirst substrate 61 a. Then, theinter-member connection member 67 a configured to be similar to theinter-member connection member 47 a of modified example 3 is connected to themember connecting electrode 613 a. Similar to modified example 3, theinter-member connection member 67 a is arranged so that the proximal end thereof is contacted to themember connecting electrode 613 a and the longitudinal direction of aparallel portion 671 a is parallel to thefirst substrate 61 a. However, in the tenth embodiment, the distal end of theparallel portion 671 a is located above thefirst substrate 61 a. -
FIG. 46 is a partial sectional view illustrating a state that asubstrate 69 a as another member is connected to amount assembly 6 a. InFIG. 46 , a protection layer formed by filling resin onto thefirst substrate 61 a is not illustrated. Thesubstrate 69 a is arranged above thefirst substrate 61 a so that a main face thereof is perpendicular to the main face of thefirst substrate 61 a. Then, a mountassembly connecting electrode 691 a is formed at a predetermined position of the right side face inFIG. 46 as the main face of thesubstrate 69 a and is contacted and connected to the other end face of theparallel portion 671 a of theinter-member connection member 67 a located above thefirst substrate 61 a by soldering and the like. In this manner, themember connecting electrode 613 a and the mountassembly connecting electrode 691 a are connected, so that themount assembly 6 a and thesubstrate 69 a are mechanically and electrically connected. - As described above, according to the tenth embodiment, it is possible to connect the
substrate 69 a at the inside of themount assembly 6 a so that the main face thereof is arranged to be perpendicular to the main face of thefirst substrate 61 a while obtaining similar effects to those of the ninth embodiment. Therefore, it is possible to actualize themount assembly 6 a having other members such as thesubstrate 69 a connected thereto in higher density. Here, the above description is performed on the case that the connection member constituted as in modified example 3 is applied. However, the connection members having other configurations described in the ninth embodiment and modified examples 1 and 2 may be similarly applied. -
FIG. 47 is a schematic perspective view which schematically illustrates the entire configuration of anelectronic circuit module 7 a including the mount assembly of the tenth embodiment.FIG. 47 skips to illustrate a second substrate arranged to be opposed to afirst substrate 71 a, an inter-substrate connection member connecting the second substrate to thefirst substrate 71 a, and a protection layer formed by filling resin onto thefirst substrate 71 a. Theelectronic circuit module 7 a inFIG. 47 is provided with thefirst substrate 71 a having a plurality ofmember connecting electrodes 711 a formed at short side ends of the upper face as a main face (i.e., two each at both short side ends in the example ofFIG. 47 ) and having a plurality ofmember connecting electrodes 712 a (i.e., two in the example ofFIG. 47 ) at predetermined positions at the center thereof andinter-member connection members 771 a to 776 a having the proximal end respectively connected to eachmember connecting electrode electronic circuit module 7 a includes the mount assembly described in the tenth embodiment. Then, twosubstrates first substrate 71 a so that main faces thereof are perpendicular to the main face of thefirst substrate 71 a. Thesubstrate 791 a is connected by theinter-member connection members substrate 792 a is connected by theinter-member connection members substrate 793 a is arranged above thefirst substrate 71 a so that a main face thereof is perpendicular to the main face of thefirst substrate 71 a and is connected by theinter-member connection members first substrate 71 a, and then, thesubstrate 793 a is connected while avoiding the mount components. In this manner, according to theelectronic circuit module 7 a including the mount assembly of the tenth embodiment, other members such as thesubstrate 793 a can be connected to the inside of the mount assembly (i.e., above thefirst substrate 71 a) as well, so that the space above thefirst substrate 71 a can be effectively utilized. Therefore, it is possible to configure theelectronic circuit module 7 a to mount thesubstrates first substrate 71 a, it is also possible to form member connecting electrodes at an end of the long side and to connect other members such as a substrate at the outside thereof. -
FIG. 48 is a partial sectional view of the vicinity ofinter-member connection members mount assembly 8 a of the eleventh embodiment.FIG. 49 is an explanatory view illustrating position arrangement ofmember connecting electrodes first substrate 81 a.FIG. 50 is a side view of themount assembly 8 a viewing from one end side of thefirst substrate 81 a. Mount components (not illustrated) are mounted on the upper face as a main face of thefirst substrate 81 a of themount assembly 8 a of the eleventh embodiment. As illustrated inFIG. 48 , themember connecting electrodes FIG. 49 , a plurality (i.e., five in the example ofFIG. 49 ) ofmember connecting electrode first substrate 81 a. Theinter-member connection members 871 a are respectively connected to three of themember connecting electrodes 811 a on the outer row and theinter-member connection members 873 a are respectively connected to two of themember connecting electrodes 813 a on the inner row. The height of theinter-member connection member 873 a is determined so as not to cause interference between parallel portions of theinter-member connection members 871 a and theinter-member connection members 873 a in the vertical direction. As illustrated inFIG. 50 , viewing themount assembly 8 a from the one end side of thefirst substrate 81 a, theinter-member connection members first substrate 81 a is alternately to be high and to be low. Here, not limited to the combination of theinter-member connection members FIG. 48 , the connection members described in the ninth embodiment and modified examples 1 to 3 can be utilized as being appropriately combined for the combination of connection members having different height of each parallel portion from the main face of thefirst substrate 81 a. -
FIG. 51 is a schematic perspective view illustrating the entire configuration of themount assembly 8 a of the eleventh embodiment. As illustrated inFIG. 51 , a plurality of mount components C811 to C816 and aninter-substrate connection member 85 a to connect thefirst substrate 81 a to asecond substrate 83 a are mounted on thefirst substrate 81 a of themount assembly 8 a. As described with reference toFIGS. 48 to 50 , two types of theinter-member connection members first substrate 81 a and are connected respectively to the member connecting electrodes (not illustrated) on thefirst substrate 81 a. Similarly, two types of theinter-member connection members first substrate 81 a and are connected respectively to the member connecting electrodes (not illustrated) on thefirst substrate 81 a. Further, U-shapedinter-electrode connection members first substrate 81 a. Specifically, the respectiveinter-electrode connection members first substrate 81 a as being sterically intersected above the mount components C814, C815 so as to connect the electrodes (not illustrated) as the connecting target formed on thefirst substrate 81 a. Then, thefirst substrate 81 a is connected to thesecond substrate 83 a arranged to be opposed thereto by theinter-substrate connection member 85 a. Themount assembly 8 a is modularized by filling resin between thefirst substrate 81 a and thesecond substrate 83 a and performing polishing and the like on the end faces thereof. Here, not limited to the short side of thefirst substrate 81 a, it is also possible to form member connecting electrodes at an end of the long side and to connect other members such as a substrate at the outside thereof. - As described above, according to the
mount assembly 8 a of the eleventh embodiment, it is possible to arrange the parallel portions of the adjacentinter-member connection members inter-member connection members mount assembly 8 a can be achieved. Further, as described with reference toFIG. 51 , the electrodes on thefirst substrate 81 a can be sterically connected by utilizing appropriate combination of theconnection members first substrate 81 a. With this configuration, the space above thefirst substrate 81 a can be effectively utilized and miniaturization can be achieved. In addition, compared to a case of connecting by forming a wiring pattern on a substrate, reliable connection can be actualized at low resistance. - The twelfth embodiment relates to a method for manufacturing a mount assembly.
FIGS. 52A to 52F are explanatory views illustrating respective processes of the method for mount assembly manufacturing in the twelfth embodiment. In the method for mount assembly manufacturing, first, a mount component connecting electrode (not illustrated) for mounting the mount component C91, a substrate connecting electrode (not illustrated) and a member connecting electrode (not illustrated) are formed on predetermined positions of the upper face as a main face of afirst substrate 91 a. Next, the mount component C91 is mounted at the mount component connecting electrode by soldering and the like, as illustrated inFIG. 52A . Next, one end face of aninter-substrate connection member 95 a is connected to the substrate connecting electrode formed on the upper face as being vertically arranged thereon, as illustrated inFIG. 52B . Next, one end of aninter-member connection member 97 a is connected to the member connecting electrode substrate formed on the upper face at a side end of thefirst substrate 91 a while theinter-member connection member 97 a is arranged so that the longitudinal direction thereof is parallel to thefirst substrate 91 a and the other end thereof is extended to the outside of the corresponding side end of thefirst substrate 91 a, as illustrated inFIG. 52C . Next, the mount component C91, theinter-substrate connection member 95 a and theinter-member connection member 97 a are sealed with resin by forming aprotection layer 98 a, as illustrated inFIG. 52D . Next, the upper face of theprotection layer 98 a is polished to be planarized and the other end face of eachinter-substrate connection member 95 a is exposed, as illustrated inFIG. 52E . Then, ametallic film 951 a is formed at the other end of the exposedinter-substrate connection member 95 a and abump 952 a is formed on themetallic film 951 a, as illustrated inFIG. 52F . Subsequently, being not illustrated, a second substrate (not illustrated) is arranged to be opposed to thefirst substrate 91 a via thebump 952 a so as to obtain mechanical and electrical connection. According to the present method for mount assembly manufacturing, opposed members can be reliably connected even when the length of theinter-substrate connection member 95 a cannot be accurately determined. - By the way, in the description of the twelfth embodiment, the mount assembly is produced (i.e., manufactured) as a single body. However, a method for manufacturing a mount assembly is not limited to this.
FIG. 53 is an explanatory view illustrating a principle of the method for mount assembly manufacturing according to the thirteenth embodiment. - In the present method for manufacturing, a plurality of mount assemblies are simultaneously produced. On the main face of a
single substrate 101 a as the first substrate,inter-substrate connection members 105 a are mounted while mount components (not illustrated) are mounted on each section area A101 defined by cutting positions as illustrated by dashed lines inFIG. 53 . Similarly, on the main face of asingle substrate 103 a as the second substrate, mount components (not illustrated) are mounted on each section area A103 defined by cutting positions as illustrated by dashed lines inFIG. 53 . In the present method for mount assembly manufacturing,member connecting electrodes substrate 101 a sandwiching the cutting position as being opposed to each other. In the example ofFIG. 53 , two couples of opposedmember connecting electrodes member 107 a having a pillar-shapedportion 1071 a to be an inter-member connection member when individuated into respective mount assemblies is placed between the opposedmember connecting electrodes portion 1071 a forms a parallel portion of the inter-member connection member and themember 107 a is arranged so that the pillar-shapedportion 1071 a passes over the cutting position. Then, after performing processes of connecting thesubstrates inter-substrate connection member 105 a, arranging a protection layer and the like, the modularized mount assembly can be obtained by being individuated as being cut at the cutting position for the last time. -
FIGS. 54A to 54C are explanatory views illustrating a specific example of respective processes in the present method for mount assembly manufacturing.FIG. 55 is a partial sectional view illustrating a state that substrates as other members are connected to the manufactured mount assembly. Following description is performed having a case to obtain a mount assembly to which theinter-member connection member 47 a of modified example 3 is applied as an example. In this description, mount components and inter-substrate connection member (not illustrated) are previously mounted on the main face of thesubstrate 101 a. As illustrated inFIG. 54A , themember connecting electrodes FIG. 54A on the main face of thesubstrate 101 a (i.e., an electrode forming process). Next, proceeding to a connecting process, themember 107 a having a U-shaped external shape in whichsupport portions portion 1071 a forming a parallel portion is prepared in the present method for manufacturing. In the connecting process, the proximal ends of therespective support portions portion 1071 a is arranged to be parallel to the main face of thesubstrate 101 a. Next, proceeding to an arranging process, aprotection layer 108 a is formed by filling resin onto thesubstrate 101 a, as illustrated inFIG. 54B . Then, proceeding to an individuating process after a connecting process of thesecond substrate 103 a,mount assemblies 10 a-1, 10 a-2 are obtained by individuating with dicing, as illustrated inFIG. 54C . - As illustrated in
FIG. 55 , themount assemblies 10 a-1, 10 a-2 manufactured as described above are connected to substrates 109 a-1, 109 a-2 as other members respectively having a mountassembly connecting electrode 1091 a formed on a main face being similar to the above-mentioned embodiments. Specifically, the substrate 109 a-1 is arranged so that the left side face inFIG. 55 as a main face is directed to afirst substrate 101 a-1 side and the main face thereof is perpendicular to the main face of thefirst substrate 101 a-1 at the outside of one end of thefirst substrate 101 a-1. Then, the mountassembly connecting electrode 1091 a of the substrate 109 a-1 is connected to the other end face of an inter-member connection member 107 a-1 extended to the outside of the one end of thefirst substrate 101 a-1, so that themount assembly 10 a-1 and the substrate 109 a-1 are mechanically and electrically connected. Similarly, the substrate 109 a-2 is arranged so that the right side face inFIG. 55 as a main face is directed to afirst substrate 101 a-2 side and the main face thereof is perpendicular to the main face of thefirst substrate 101 a-2 at the outside of one end of thefirst substrate 101 a-2. Then, the mountassembly connecting electrode 1091 a of the substrate 109 a-2 is connected to the other end face of an inter-member connection member 107 a-2 extended to the outside of the one end of thefirst substrate 101 a-2, so that themount assembly 10 a-2 and the substrate 109 a-2 are mechanically and electrically connected. - As described above, according to the method for mount assembly manufacturing of the thirteenth embodiment, cost for manufacturing can be reduced and productivity can be improved since a plurality of mount assemblies can be produced at one time.
- In the above description, the inter-member connection member having the configuration described in modified example 3 is adopted. However, the inter-member connection members of other configurations described in the ninth embodiment and modified examples 1 and 2 can be also adopted similarly. For example, in the case that the connection member having the configuration described in modified example 1 is adopted, one end face of each second pillar-shaped member which is vertically arranged is connected to the opposed member connecting electrode sandwiching the cutting position in the connecting process. Then, a single pillar-shaped member corresponding to the pillar-shaped portion is arranged to be parallel to a main face of a substrate to be the first substrate and the side face of each of both ends are connected to the other end face of the second pillar-shaped member. In the case of the method for manufacturing in the thirteenth embodiment, the process to connect the second pillar-shaped member and the pillar-shaped member is unnecessary unlike the present modified example. Therefore, the number of processes for manufacturing can be reduced.
- Further, in the description of the thirteenth embodiment, the member connecting electrodes are formed in the same number (i.e., two) at each end on the substrate constituting the mount assembly. However, the number of the member connecting electrodes formed at each end can be appropriately set.
FIG. 56 is a view illustrating a modified example of position arrangement of the member connecting electrodes formed on the substrate.FIG. 57 is an explanatory view illustrating a principle of a method for manufacturing the mount assembly of the present modified example. - As illustrated in
FIG. 56 , on a main face of the mount assembly manufactured by the method for manufacturing of the present modified example, threemember connecting electrodes 1513 are formed at the left end of asubstrate 1511 inFIG. 56 and onemember connecting electrode 1513 is formed at the right end. In addition, twomember connecting electrodes 1513 are formed respectively at the upper end and lower end. In the connecting process of this case, as illustrated inFIG. 57 , the respectivemember connecting electrodes 1513 are formed on asubstrate 1510 so that positions of themember connecting electrodes 1513 formed at adjacent section areas A1510 are to be mutually axisymmetric sandwiching a cutting position indicated by a dashed line inFIG. 57 . Then, after thesubstrates -
FIG. 58 is a schematic perspective view illustrating the entire configuration of amount assembly 1600 of the fourteenth embodiment. In themount assembly 1600 ofFIG. 58 , a plurality (i.e. nine in the example ofFIG. 58 ) of other ends ofinter-member connection members 1671 to 1679 (specifically, other ends of parallel portions formed at theinter-member connection members 1671 to 1679) are exposed at an end face of aprotection layer 1680 between afirst substrate 1610 and asecond substrate 1630. Then, a plurality (i.e., four in the example ofFIG. 58 ) of sideface connecting electrodes 1681 to 1684 are formed at the end face, so that the sideface connecting electrodes 1681 to 1684 are connected to other members respectively having a mount assembly connecting electrode formed on a main face thereof. Specifically, the other end of theinter-member connection member 1672 and the sideface connecting electrode 1681 are connected via a wiring pattern P1610. The other end of theinter-member connection member 1678 and the sideface connecting electrode 1682 are connected via a wiring pattern P1630. The other end of theinter-member connection member 1675 and the sideface connecting electrode 1683 are connected via a wiring pattern P1650. Here, the wiring patterns P1610, P1630, P1650 are formed at the end face of theprotection layer 1680. The wiring patterns P1610, P1630, P1650 can be formed by appropriately utilizing a thin-film method, an ink-jet method and the like, for example. At that time, it is also possible to form an insulating protection film at a part of the end face of theprotection layer 1680 other than the sideface connecting electrodes 1681 to 1684. - According to the fourteenth embodiment, since the side
face connecting electrodes 1681 to 1684 to be connected to other members can be formed at the end face of theprotection layer 1680, connecting positions in themount assembly 1600 with other members can be flexibly adjusted and design flexibility can be increased. - In the above description of the ninth to fourteenth embodiments and modified examples, the member connecting electrode formed on the substrate constituting the mount assembly and the mount assembly connecting electrode formed on the substrate as another member are connected. However, the present invention is not limited to this.
FIG. 59 is a partial sectional view of the vicinity ofinter-member connection members substrate 1790 as another member to amount assembly 1700 having theinter-member connection members substrate 1790 is arranged so that the right side face inFIG. 59 as a main face thereof is directed to afirst substrate 1710 side and the main face thereof is perpendicular to the main face of thefirst substrate 1710 at the outside of the one end of thefirst substrate 1710. - The
inter-member connection member 1771 is constituted similarly to theinter-member connection member 17 a of the ninth embodiment and one end thereof is connected to amember connecting electrode 1713 on thefirst substrate 1710. Meanwhile, theinter-member connection member 1773 is constituted similarly to theinter-member connection member 27 a of modified example 1. In the present modified example, one end face of a second pillar-shapedmember 1775 of theinter-member connection member 1773 is connected to amember connecting electrode 1714 formed on a main face of a mount component C1710. Then, a first pillar-shapedmember 1774 is arranged so that the longitudinal direction thereof is parallel to the main face of the first substrate 1710 (i.e., parallel to the main face of the mount component C1710) and the other end thereof is extended to the outside of the one end of thefirst substrate 1710. Then, similar to the abovementioned embodiments, themount assembly 1700 is connected to thesubstrate 1790 as another member having mountassembly connecting electrodes member 1775 of theinter-member connection member 1773 is determined in accordance with the position of the mountassembly connecting electrode 1793 of thefirst substrate 1710 connected to themember connecting electrode 1714 by the inter-member connection member 1773 (i.e., in accordance with the height of the mountassembly connecting electrode 1793 of thefirst substrate 1710 against the main face position of the mount component C1710 where themember connecting electrode 1714 is formed). - In the above description of the embodiments and modified examples, the other end face of the parallel portion formed at the connection member is connected to the mount assembly connecting electrode formed at another member such as the substrate. However, the present invention is not limited to this. In the following, a modified example will be described having a connection member of a similar configuration to the connection member of modified example 3 as an example. Here, the connection members of the other configurations described in the ninth embodiment and modified examples 1 and 2 may be similarly adopted.
-
FIG. 60 is an explanatory view of a modified example of a connection method between the other end side of aparallel portion 1871 formed at aninter-member connection member 1870 and a mountassembly connecting electrode 1891 of a substrate as another member. In the example ofFIG. 60 , the proximal end of theinter-member connection member 1870 is connected to amember connecting electrode 1813 and aprotection layer 1880 is formed by filling resin onto afirst substrate 1810. Subsequently, a projection portion at the distal end side of theparallel portion 1871 of theinter-member connection member 1870 is folded upward, for example, along an end face of theprotection layer 1880. Amount assembly 1800 is connected to asubstrate 1890 as another member where the mountassembly connecting electrode 1891 is formed. Specifically, a side face of the other end of the foldedparallel portion 1871 is connected to the mountassembly connecting electrode 1891. With this configuration, compared to a case of connecting the other end face of theparallel portion 1871 to the mountassembly connecting electrode 1891, the connection area of theparallel portion 1871 against the mountassembly connecting electrode 1891 can be widely ensured, so that the connection strength therebetween can be enhanced. -
FIG. 61 is an explanatory view of another modified example of a connection method between the other end side of aparallel portion 1971 formed at aninter-member connection member 1970 and a mountassembly connecting electrode 1991 of a substrate as another member. In the example ofFIG. 61 , the other end side of theparallel portion 1971 is folded upward, for example, after the proximal end of theinter-member connection member 1970 is connected to amember connecting electrode 1913. Subsequently, aprotection layer 1980 is formed by filling resin onto afirst substrate 1910 and a side face of the other end of theparallel portion 1971 is exposed by polishing an end face of theprotection layer 1980 at one end side of thefirst substrate 1910. Amount assembly 1900 is connected to asubstrate 1990 as another member where the mountassembly connecting electrode 1991 is formed. Specifically, the side face of the other end of the exposedparallel portion 1971 is connected to the mountassembly connecting electrode 1991. Similarly in this case, the connection area of theparallel portion 1971 against the mountassembly connecting electrode 1991 can be widely ensured, so that the connection strength therebetween can be enhanced. - Here, in the abovementioned ninth to eleventh embodiments and modified examples 1 to 4, the other end of the parallel portion formed at the connection member is extended to the outside of the one end of the upper face of the substrate constituting the mount assembly. However, the other end of the parallel portion is only required to be extended at least to the one end edge of the upper face of the substrate. In this case, an end face of a protection layer at one end side of the substrate is to be polished after forming the protection layer by filling resin onto the substrate, for example. In this manner, the other end face of the parallel portion may be exposed from a side face at the one end side of the mount assembly.
- Further, in the above description of embodiments and modified examples, the member connecting electrodes are formed at the first substrate located at the lower side and inter-member connection members are connected thereto among the substrates constituting the mount assembly by being arranged to be mutually opposed. However, it is also possible to form member connecting electrodes and connects inter-member connection members thereto similarly at the second substrate of the upper side.
- Further, in the abovementioned embodiments and modified examples, the protection layer is formed by filling resin between the first and second substrates which are arranged to be mutually opposed. However, it is also possible to seal with resin the vicinity of connecting position between the inter-substrate connection member and the substrate connecting electrode of the first substrate, the vicinity of the connecting position between the inter-substrate connection member and the substrate connecting electrode of the second substrate, and the vicinity of the connecting position between the inter-member connection member and the member connecting electrode.
- Further, the first and second substrates and the substrates described as examples of other members may be interconnection substrates respectively having a wiring pattern formed or may be substrates respectively having an electronic circuit and the like mounted inside.
- In the description of the abovementioned embodiments and modified examples, the substrate is connected to the mount assembly. However, another member to be the connection target is not limited to a substrate. For example, the present invention can be applied to a case that a member such as an electronic component and an electronic circuit module is arranged so that a main face thereof is perpendicular to a main face of the substrate and is connected thereto.
- In the mount assembly according to the present invention, one end side of the parallel portion of the connection member arranged to be parallel to the main face of the member is connected to the member connecting electrode formed on the main face of the member. Then, another member of which main face is perpendicular to the main face of the member can be connected to the other end side of the parallel portion. Accordingly, another member can be easily connected to the mount assembly in high density.
- Further, in the mount assembly according to the present invention, a plurality of substrates arranged as the respective main faces thereof are mutually parallel are connected by the inter-substrate connection member. One end side of the parallel portion of the inter-member connection member is connected to the member connecting electrode formed on the substrate main face of at least one substrate among these substrates while being arranged so that the other end side is extended to the end of the member main face and the longitudinal direction thereof is parallel to the substrate main face. Then, the member arranged so that the main face thereof is perpendicular to the substrate main face can be connected to the other end side of the parallel portion. Accordingly, another member can be easily connected to the mount assembly in high density.
- The above and other features, advantages and technical and industrial significance of this invention will be better understood by reading the following detailed description of presently preferred embodiments of the invention, when considered in connection with the accompanying drawings.
Claims (21)
1. A mount assembly comprising:
a member in which a mount component is mounted at least on one main face of the member and at which a member connecting electrode is formed; and
a connection member that has a pillar-shaped parallel portion arranged so that a longitudinal direction of the parallel portion is parallel to the main face of the member, one end side of the parallel portion being connected to the member connecting electrode.
2. The mount assembly according to claim 1 ,
wherein the connection member is made up of one pillar-shaped member which forms the parallel portion, and
one end of the pillar-shaped member is connected to the member connecting electrode.
3. The mount assembly according to claim 1 ,
wherein the connection member is made up of a first pillar-shaped member which forms the parallel portion and a second pillar-shaped member of which one end is vertically arranged on the member connecting electrode and which supports one end of the first pillar-shaped member.
4. The mount assembly according to claim 3 ,
wherein the connection member is configured so that a side face of one end of the first pillar-shaped member is connected to the other end face of the second pillar-shaped member.
5. The mount assembly according to claim 3 ,
wherein the connection member is configured so that one end face of the first pillar-shaped member is connected to a side face of the second pillar-shaped member.
6. The mount assembly according to claim 3 ,
wherein the first pillar-shaped member and the second pillar-shaped member are integrally formed.
7. The mount assembly according to claim 3 ,
wherein the plurality of member connecting electrodes are formed on the main face of the member; and
a plurality of types of connection members respectively having different height of the other end of the parallel portion against the main face of the member are connected to the respective member connecting electrodes.
8. The mount assembly according to claim 1 ,
wherein a reinforcing member is arranged at least at the vicinity of a connecting position between the connection member and the member connecting electrode.
9. The mount assembly according to claim 7 ,
wherein a protection layer is formed on the main face of the member by filling a reinforcing member thereon; and
the other end of the parallel portion is exposed from an end face of the protection layer.
10. The mount assembly according to claim 9 ,
wherein a side face connecting electrode is formed at the end face of the protection layer where the other end of the parallel portion is exposed; and
a wiring pattern to connect at least one of the other ends of the parallel portions to the side face connecting electrode is formed.
11. The mount assembly according to claim 1 ,
wherein the other end of the parallel portion is extended above an end edge of the main face of the member.
12. The mount assembly according to claim 1 ,
wherein the other end of the parallel portion is located above the member.
13. A mount assembly comprising:
a plurality of substrates of which main faces are arranged to be mutually parallel;
an inter-substrate connection member which connects the substrates; and
an inter-member connection member, on a substrate main face of at least one substrate, which has a pillar-shaped parallel portion having the longitudinal direction thereof arranged to be parallel to the substrate main face and having the other end side thereof arranged to be extended to an end of the member main face, and of which one end side is connected to a member connecting electrode formed on the substrate main face.
14. The mount assembly according to claim 13 ,
wherein the inter-member connection member includes a support portion having one end thereof vertically arranged on the member connecting electrode to support the parallel portion.
15. The mount assembly according to claim 13 ,
wherein a reinforcing member is arranged at least around the inter-substrate connection member and the inter-member connection member.
16. The mount assembly according to claim 14 ,
wherein the plurality of member connecting electrodes are formed on a substrate main face where the inter-member connection member is connected; and
the inter-member connection members respectively with each support portion of different length are connected to the respective member connecting electrodes.
17. The mount assembly according to claim 16 ,
wherein a protection layer is formed on the substrate main face to which the inter-member connection member is connected by filling a reinforcing member thereon; and
the other end of the parallel portion is exposed from an end face of the protection layer.
18. The mount assembly according to claim 17 ,
wherein a side face connecting electrode is formed at the end face of the protection layer where the other end of the parallel portion is exposed; and
a wiring pattern to connect at least one of the other ends of the parallel portions to the side face connecting electrode is formed.
19. A method for manufacturing a mount assembly comprising:
an electrode forming step of forming a member connecting electrode on a main face of a member to which a mount component is mounted for each area to be cut and separated so as to be opposed to each other sandwiching a cutting position;
a connecting step of arranging a connection member having a pillar-shaped portion which forms a parallel portion between the opposed member connecting electrodes formed in the electrode forming step so that the pillar-shaped portion is parallel to the main face of the member and to connect both end sides of the pillar-shaped portion respectively to the opposed member connecting electrodes; and
an individuating step of dividing the member by cutting at the cutting position.
20. The method for manufacturing a mount assembly according to claim 19 , further comprising
including support portions to support the pillar-shaped portion at both ends of the pillar-shaped portion; and
a proximal end of the support portion and the opposed member connecting electrode are respectively connected in the connecting step.
21. The method for manufacturing a mount assembly according to claim 19 , further comprising an arranging step of arranging a reinforcing member at least at the vicinity of the connecting position between the member connecting electrode and the connection member after the connection process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/871,266 US9343863B2 (en) | 2009-03-19 | 2013-04-26 | Method for manufacturing mount assembly |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-069076 | 2009-03-19 | ||
JP2009069077A JP2010225700A (en) | 2009-03-19 | 2009-03-19 | Mounting structure and method for manufacturing mounting structure |
JP2009-069077 | 2009-03-19 | ||
JP2009069076A JP5657214B2 (en) | 2009-03-19 | 2009-03-19 | Stacked mounting structure |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/871,266 Division US9343863B2 (en) | 2009-03-19 | 2013-04-26 | Method for manufacturing mount assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100254109A1 true US20100254109A1 (en) | 2010-10-07 |
Family
ID=42826033
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/727,706 Abandoned US20100254109A1 (en) | 2009-03-19 | 2010-03-19 | Mount assembly and method for manufacturing mount assembly |
US13/871,266 Active 2031-02-07 US9343863B2 (en) | 2009-03-19 | 2013-04-26 | Method for manufacturing mount assembly |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/871,266 Active 2031-02-07 US9343863B2 (en) | 2009-03-19 | 2013-04-26 | Method for manufacturing mount assembly |
Country Status (1)
Country | Link |
---|---|
US (2) | US20100254109A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10368439B2 (en) | 2014-12-26 | 2019-07-30 | Intel Corporation | Assembly architecture employing organic support for compact and improved assembly throughput |
US10433423B2 (en) | 2016-03-22 | 2019-10-01 | Sumitomo Wiring Systems, Ltd. | Method for manufacturing circuit board, and circuit board |
US20210091039A1 (en) * | 2018-02-07 | 2021-03-25 | Micron Technology, Inc. | Semiconductor assemblies using edge stacking and methods of manufacturing the same |
US11503721B2 (en) | 2018-08-28 | 2022-11-15 | Lg Energy Solution, Ltd. | PCB assembly and manufacturing method thereof |
US11955457B2 (en) * | 2020-12-08 | 2024-04-09 | Micron Technology, Inc. | Semiconductor assemblies using edge stacking and methods of manufacturing the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6504270B2 (en) | 2016-01-27 | 2019-04-24 | 株式会社村田製作所 | Inductor component and method of manufacturing the same |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3136591A (en) * | 1962-02-12 | 1964-06-09 | Malco Mfg Co | Printed circuit board assembly |
US5433618A (en) * | 1993-06-04 | 1995-07-18 | Framatome Connectors International | Connector assembly |
US5781415A (en) * | 1995-08-10 | 1998-07-14 | Nec Corporation | Semiconductor package and mounting method |
US5796592A (en) * | 1996-04-23 | 1998-08-18 | Nec Corporation | Module mounting structure |
US5823795A (en) * | 1996-10-30 | 1998-10-20 | Hewlett-Packard Company | Connector between a daughterboard and a motherboard for high-speed single-ended electrical signals |
US5909915A (en) * | 1993-07-05 | 1999-06-08 | Mitsubishi Denki Kabushiki Kaisha | Resin-molded electronic circuit device |
US6200146B1 (en) * | 2000-02-23 | 2001-03-13 | Itt Manufacturing Enterprises, Inc. | Right angle connector |
US6280201B1 (en) * | 2000-01-21 | 2001-08-28 | Hewlett-Packard Company | Laminated 90-degree connector |
US6469255B2 (en) * | 2000-05-17 | 2002-10-22 | Sony Corporation | Composite wiring board and manufacturing method thereof |
US6641407B2 (en) * | 2000-09-19 | 2003-11-04 | Nissan Motor Co., Ltd. | Conductor interconnect structure connecting circuit boards |
US6843657B2 (en) * | 2001-01-12 | 2005-01-18 | Litton Systems Inc. | High speed, high density interconnect system for differential and single-ended transmission applications |
US20060118330A1 (en) * | 2004-12-07 | 2006-06-08 | Nitto Denko Corporation | Wired circuit board and connecting structure thereof |
US7112067B1 (en) * | 2005-04-11 | 2006-09-26 | Hon Hai Precision Ind. Co., Ltd | Connector assembly for printed circuit board interconnection |
US7514784B2 (en) * | 2004-12-16 | 2009-04-07 | Hitachi, Ltd. | Electronic circuit device and production method of the same |
US7606041B2 (en) * | 2005-12-20 | 2009-10-20 | Samsung Sdi Co., Ltd. | Apparatus and method for battery pack circuit board crack prevention |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3747209A (en) * | 1969-11-12 | 1973-07-24 | Bunker Ramo | Automated wiring system and method |
US3916513A (en) * | 1974-05-03 | 1975-11-04 | Ampex | Forming interconnections between circuit layers |
JPS50155561A (en) | 1974-06-07 | 1975-12-15 | ||
US4044460A (en) * | 1975-10-23 | 1977-08-30 | Schachter Herbert I | Method of mounting prefabricated contacts for printed circuit card connectors |
US4044888A (en) * | 1975-10-23 | 1977-08-30 | Schachter Herbert I | Prefabricated contacts for printed circuit card connectors |
JPS55181371U (en) | 1979-06-12 | 1980-12-26 | ||
JPS56162673U (en) | 1980-04-30 | 1981-12-03 | ||
JPH0749822Y2 (en) | 1991-06-10 | 1995-11-13 | 太陽誘電株式会社 | Surface mount hybrid integrated circuit module |
JPH0672249U (en) | 1991-09-20 | 1994-10-07 | オリンパス光学工業株式会社 | Integrated circuit device |
JPH05291724A (en) | 1991-12-09 | 1993-11-05 | Mitsubishi Electric Corp | Hybrid ic |
JPH08162570A (en) | 1994-12-01 | 1996-06-21 | Kokusai Electric Co Ltd | Hybrid integrated circuit |
JPH10308580A (en) | 1997-05-07 | 1998-11-17 | Rohm Co Ltd | Jointing method of modular board |
JP2001168493A (en) | 1999-12-07 | 2001-06-22 | Taiyo Yuden Co Ltd | Method for manufacturing electronic device, and electronic device |
JPWO2006035528A1 (en) | 2004-09-29 | 2008-05-15 | 株式会社村田製作所 | Stack module and manufacturing method thereof |
JP2007194160A (en) | 2006-01-23 | 2007-08-02 | Matsushita Electric Ind Co Ltd | Printed circuit board connecting method |
-
2010
- 2010-03-19 US US12/727,706 patent/US20100254109A1/en not_active Abandoned
-
2013
- 2013-04-26 US US13/871,266 patent/US9343863B2/en active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3136591A (en) * | 1962-02-12 | 1964-06-09 | Malco Mfg Co | Printed circuit board assembly |
US5433618A (en) * | 1993-06-04 | 1995-07-18 | Framatome Connectors International | Connector assembly |
US5909915A (en) * | 1993-07-05 | 1999-06-08 | Mitsubishi Denki Kabushiki Kaisha | Resin-molded electronic circuit device |
US5781415A (en) * | 1995-08-10 | 1998-07-14 | Nec Corporation | Semiconductor package and mounting method |
US5796592A (en) * | 1996-04-23 | 1998-08-18 | Nec Corporation | Module mounting structure |
US5823795A (en) * | 1996-10-30 | 1998-10-20 | Hewlett-Packard Company | Connector between a daughterboard and a motherboard for high-speed single-ended electrical signals |
US6280201B1 (en) * | 2000-01-21 | 2001-08-28 | Hewlett-Packard Company | Laminated 90-degree connector |
US6200146B1 (en) * | 2000-02-23 | 2001-03-13 | Itt Manufacturing Enterprises, Inc. | Right angle connector |
US6469255B2 (en) * | 2000-05-17 | 2002-10-22 | Sony Corporation | Composite wiring board and manufacturing method thereof |
US6641407B2 (en) * | 2000-09-19 | 2003-11-04 | Nissan Motor Co., Ltd. | Conductor interconnect structure connecting circuit boards |
US6843657B2 (en) * | 2001-01-12 | 2005-01-18 | Litton Systems Inc. | High speed, high density interconnect system for differential and single-ended transmission applications |
US20060118330A1 (en) * | 2004-12-07 | 2006-06-08 | Nitto Denko Corporation | Wired circuit board and connecting structure thereof |
US7514784B2 (en) * | 2004-12-16 | 2009-04-07 | Hitachi, Ltd. | Electronic circuit device and production method of the same |
US7112067B1 (en) * | 2005-04-11 | 2006-09-26 | Hon Hai Precision Ind. Co., Ltd | Connector assembly for printed circuit board interconnection |
US7606041B2 (en) * | 2005-12-20 | 2009-10-20 | Samsung Sdi Co., Ltd. | Apparatus and method for battery pack circuit board crack prevention |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10368439B2 (en) | 2014-12-26 | 2019-07-30 | Intel Corporation | Assembly architecture employing organic support for compact and improved assembly throughput |
US10433423B2 (en) | 2016-03-22 | 2019-10-01 | Sumitomo Wiring Systems, Ltd. | Method for manufacturing circuit board, and circuit board |
US20210091039A1 (en) * | 2018-02-07 | 2021-03-25 | Micron Technology, Inc. | Semiconductor assemblies using edge stacking and methods of manufacturing the same |
US11503721B2 (en) | 2018-08-28 | 2022-11-15 | Lg Energy Solution, Ltd. | PCB assembly and manufacturing method thereof |
US11955457B2 (en) * | 2020-12-08 | 2024-04-09 | Micron Technology, Inc. | Semiconductor assemblies using edge stacking and methods of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
US9343863B2 (en) | 2016-05-17 |
US20130232781A1 (en) | 2013-09-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10575399B2 (en) | Multilayer substrate | |
US20210249157A1 (en) | Transmission line substrate and electronic device | |
JP6865722B2 (en) | Connection structure of circuit body, bus bar and electronic element | |
CN107710406B (en) | High frequency module | |
US9343863B2 (en) | Method for manufacturing mount assembly | |
US7835160B2 (en) | Electronic circuit connection structure and its manufacturing method | |
US8975527B2 (en) | Circuit board | |
US10756462B2 (en) | Resin multilayer substrate and an electronic device and a joint structure of a resin multilayer substrate | |
WO2006059412A1 (en) | Wiring board, connection structure, and apparatus | |
JPWO2016189679A1 (en) | Imaging apparatus and endoscope | |
JP2011071036A (en) | Electronic circuit module | |
JP2022168758A (en) | Flexible wiring board, module, and electronic apparatus | |
JP2005252227A (en) | Film substrate, and the manufacturing method and image display substrate | |
JP5657214B2 (en) | Stacked mounting structure | |
US20090139758A1 (en) | Printed circuit board assembly and manufacturing method for the same | |
JP6236367B2 (en) | Sensor module and method of manufacturing sensor module | |
JP5932085B2 (en) | Stacked mounting structure | |
JP5877189B2 (en) | Stacked mounting structure | |
JP5424825B2 (en) | Stacked mounting structure | |
JP2010147084A (en) | Circuit board and flexible substrate | |
JP2016213348A (en) | High frequency module | |
US11956903B2 (en) | Transmission line, method of manufacturing transmission line, and electronic apparatus | |
JP5526250B2 (en) | Manufacturing method of mounting structure | |
JP2010225700A (en) | Mounting structure and method for manufacturing mounting structure | |
CN210745655U (en) | Electronic device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: OLYMPUS CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NAKAMURA, MIKIO;SEKIDO, TAKANORI;REEL/FRAME:024544/0689 Effective date: 20100604 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |