US20110042209A1 - Sputtering apparatus and recording medium for recording control program thereof - Google Patents
Sputtering apparatus and recording medium for recording control program thereof Download PDFInfo
- Publication number
- US20110042209A1 US20110042209A1 US12/934,497 US93449709A US2011042209A1 US 20110042209 A1 US20110042209 A1 US 20110042209A1 US 93449709 A US93449709 A US 93449709A US 2011042209 A1 US2011042209 A1 US 2011042209A1
- Authority
- US
- United States
- Prior art keywords
- rotations
- substrate
- support holder
- shutter
- substrate support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3492—Variation of parameters during sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Abstract
Disclosed is a sputtering device wherein a target (2) is disposed offset with respect to a substrate (7), wherein said sputtering device can ensure a uniform amount of deposition, even when a substrate support holder (6) has a low number of rotations of several rotations to several tens of rotations, and the amount of deposition is extremely small, such as a film thickness of 1 nm or less. A control unit (11) is provided to perform control using input of the values of a total whole number of rotations N and a fractional number of rotations α such that X=N+α (where N is the total whole number of rotations and is a positive whole number, and α is the fractional number of rotations and is a positive pure decimal) and, by input of the value of a deposition time T such that the rotational velocity V (rps) of the aforementioned substrate support holder (6) satisfies V·T=N+α when the total number of rotations of the aforementioned substrate support holder (6) is X, during the deposition time of T (seconds) for particles sputtered onto the surface of the aforementioned substrate (7) where a film is to be formed.
Description
- The present invention relates to a sputtering apparatus used for depositing a film forming material on a film forming surface of a substrate in, for example, a manufacturing process of electronic equipment such as a semiconductor device, a display device, etc. and a recording medium such as a magnetic recording medium on which a program used to control the drive of the sputtering apparatus is recorded.
- For example, it is known to use a slanting sputtering apparatus in order to deposit a film forming material uniformly on a film forming surface of a substrate by using a target smaller than the substrate in a manufacturing process of a semiconductor device. In the slanting sputtering apparatus, a sputtering cathode for supporting the target and a substrate support holder for supporting the substrate are arranged such that a surface of the target is positioned slantly with respect to the film forming surface of the substrate. The film forming material is deposited by flight of sputtering particles to the film forming surface of the substrate from an oblique direction by rotating the substrate support holder to rotate the film forming surface of the substrate in a given plane (see, for example,
Patent References - Meanwhile, since there are demands for a highly sophisticated semiconductor device, a technology of depositing a very small amount of material to provide a uniform film thickness of 10 nm or less is being demanded. For example, a technology of depositing MgO in thickness of 1 nm or less is being demanded for a transistor to lower power consumption by adjusting a threshold voltage (see, for example, Nonpatent Reference 1).
- Nonpatent Reference 1: IEDM Tech. Dig., by N. Mise et al., p. 527 (2007)
- When a very small amount of film forming material is deposited by a sputtering apparatus to form a film having a film thickness of 10 nm or less, and particularly 1 nm or less as described above, the deposition is completed in a short deposition time of several seconds to several tens of seconds.
- Meanwhile, when it is considered to maintain a high vacuum atmosphere to keep the quality of the film, the rotational velocity of the substrate support holder is limited to about 100 rpm according to the present industrial technology. Therefore, when the deposition time is several seconds to several tens of seconds, the number of rotations of the substrate support holder is about several tens of rotations αt most, and even if the number of rotations is increased to try to improve the uniformity of a deposition amount, it is difficult to increase further the number of rotations.
- The present invention provides a sputtering apparatus ensuring the uniformity of a deposition amount even when the substrate support holder has a low number of rotations of several rotations to several tens of rotations and the amount of deposition is extremely small to provide a film thickness of 10 nm or less and particularly 1 nm or less.
- The sputtering apparatus according to the invention has a sputtering cathode for supporting a target and a substrate support holder for supporting a substrate. The sputtering cathode and the substrate support holder are disposed such that a vertical line running through the center point of the target and a vertical line running through the center point of the substrate are mismatched with each other among vertical lines to a plane including the film forming surface of the substrate. Specifically, there are a case that the film forming surface of the substrate and the surface of the target are parallel to each other and their center points are displaced from each other and a case that the film forming surface of the substrate and the surface of the target are not parallel to each other, and the positions of their center points are displaced from each other. The substrate support holder is rotatable on a rotating axis which is perpendicular to the film forming surface of the substrate. And, a control unit is provided to control a rotational velocity V (rps) of the substrate support holder so as to satisfy:
-
V·T=N+α - by inputting the value of a deposition time T and the values of a total whole number of rotations N and a fractional number of rotations α, which are expressed as:
-
X=N+α (where, N is a total whole number of rotations which is a positive integer, and α is a fractional number of rotations which is a positive pure decimal) - when it is determined that a total number of rotations of the substrate support holder is X during the deposition time T (seconds) of sputtering particles onto the film forming surface of the substrate.
- As a preferable embodiment, the sputtering apparatus according to the invention is provided with a power supply unit for supplying power to the sputtering cathode, wherein the deposition time T is a time from the start to end of supplying the power from the power supply unit to the sputtering cathode.
- As a preferable embodiment, the sputtering apparatus according to the invention is also provided with a power supply unit for supplying power to the sputtering cathode and an openable/closable shutter disposed between the sputtering cathode and the substrate support holder, wherein the deposition time T is a time when the power is supplied from the power supply unit to the sputtering cathode and the shutter is open.
- The recording medium according to the invention is a recording medium on which recorded is a program for controlling a rotational velocity V (rps) of a substrate support holder of a sputtering apparatus which has a sputtering cathode for supporting a target and the substrate support holder for supporting a substrate, which are disposed to have a vertical line running through the center point of the target and a vertical line running through the center point of the substrate mismatched with each other among vertical lines with respect to a plane including a film forming surface of the substrate, and the substrate support holder is rotatable on a rotating axis perpendicular to the film forming surface of the substrate. And, the recording medium according to the invention records thereon the program for controlling the rotational velocity V of the substrate support holder by calculating
-
V·T=N+α - based on the value of a deposition time T and the values of a total whole number of rotations N and a fractional number of rotations α, which are expressed as:
-
X=N+α (where, N is a total whole number of rotations which is a positive integer, and α is a positive pure decimal) - when it is determined that the total number of rotations of the substrate support holder is X during the deposition time T (seconds) of sputtering particles onto the film forming surface of the substrate.
- As a preferable embodiment, the sputtering apparatus and the recording medium according to the invention include that the deposition time T is 1 to 400 seconds, the total whole number of rotations N is 1 to 100, the rotational velocity V of the substrate support holder is 0.016 to 3.5 rps, and the fractional number of rotations α is 0.2 to 0.8.
- According to the invention, a deposit film having a film thickness of 10 nm or less such as a gate insulating film or a multilayer magnetic film and particularly a deposit film having a film thickness of 1 nm or less can be deposited uniformly on substantially the entire area of the substrate.
- As a result, the present invention can provide a magnetic memory device such as a high-performance semiconductor device or a TMR (Tunneling Magneto Resistance) element.
-
FIG. 1 is a schematic sectional view showing an example of the sputtering apparatus according to the invention. -
FIG. 2 is a first timing chart showing a timing of start and end points of a deposition time T. -
FIG. 3 is a second timing chart showing a timing of start and end points of the deposition time T. -
FIG. 4 is a third timing chart showing a timing of start and end points of the deposition time T. -
FIG. 5 is a fourth timing chart showing a timing of start and end points of the deposition time T. -
FIG. 6 is a sectional view schematically showing an arrangement relationship between a substrate support holder and a sputtering cathode according to the invention. -
FIG. 7 is a sectional view schematically showing another arrangement relationship between a substrate support holder and a sputtering cathode according to the invention. -
FIG. 8 is a diagram showing the distribution of a deposition amount of Mg of Example 4. -
FIG. 9 is a diagram showing the distribution of a deposition amount of Mg of Comparative Example 1. -
FIG. 10 is a graph showing relationships between deviation angles β (fractional numbers of rotations α) and uniformity of deposition amounts according to Examples 1 to 4 and Comparative Example 1. -
FIG. 1 is a schematic sectional view showing an example of the sputtering apparatus according to the invention. - In the sputtering apparatus shown in
FIG. 1 , a sputteringcathode 3 for supporting atarget 2 is disposed at a ceiling portion of avacuum vessel 1. Asubstrate support holder 6 which is attached to a rotatingaxis 5 rotated by arotation drive mechanism 4 is arranged at the center of a bottom surface portion of thevacuum vessel 1. Thesubstrate support holder 6 supports horizontally asubstrate 7, and therotating axis 5 is disposed perpendicular to a film forming surface (surface exposed toward the target 2) of thesubstrate 7. Therefore, thesubstrate 7 can be rotated with the rotations of thesubstrate support holder 6 in a state that the film forming surface is positioned in a prescribed plane. - The
substrate support holder 6 is rotated at least for a deposition time (film forming time) T (seconds) when the sputtering particles from thetarget 2 are deposited on the film forming surface. Since the rotational velocity V (rps) of thesubstrate support holder 6 is readily controlled, it is desirably kept at a fixed level during the deposition time T. But, the rotational velocity V can also be varied during the deposition time T. For example, it can also be determined during the deposition time T to have a low rotational velocity in the early period and a fast rotational velocity in the latter half period and conversely a fast rotational velocity in the early period and a low rotational velocity in the latter half period. In addition, the rotational velocity V of thesubstrate support holder 6 can also be varied at a rate of a direct function or a quadratic function during the deposition time T. - In the example shown in
FIG. 1 , thesputtering cathode 3 and thesubstrate support holder 6 are disposed such that the surface (the surface exposed toward the substrate 7) of thetarget 2 is inclined against the film forming surface of thesubstrate 7. Therefore, the sputtering particles directed from thetarget 2 to the film forming surface of thesubstrate 7 are deposited by entering the film forming surface from an oblique direction. - A
DC power source 8 is connected as a power supply unit to the sputteringcathode 3. Prescribed DC power (e.g., 1 W to 1000 W, preferably 10 W to 750 W) can be applied from theDC power source 8 to the sputteringcathode 3. An RF power source can also be used as a power supply unit instead of theDC power source 8. - A
shutter 10 which can be opened and closed by ashutter drive mechanism 9 is arranged between the sputtering cathode 3 (target 2) and the substrate support holder 6 (substrate 7). When theshutter 10 is open, the sputtering particles generated from thetarget 2 can be deposited on the film forming surface of thesubstrate 7. But, when theshutter 10 is closed, flight of the sputtering particles generated from thetarget 2 to the film forming surface of thesubstrate 7 is blocked to prevent the deposition of the sputtering particles onto the film forming surface of thesubstrate 7. - A
control unit 11 controls the rotations of thesubstrate support holder 6, on and off of theDC power source 8 and open and close of theshutter 10. Thecontrol unit 11 comprises a CPU (central processing unit) 12, arecording medium 13 on which a control program is recorded and aninput portion 14. As thecontrol unit 11, a general-purpose computer can be used. Therecording medium 13 is a medium on which a program described later can be recorded in a callable state, and specifically a non-volatile memory such as a hard disk, a magnet-optical disk, a flexible disk, a flash memory, MRAM or the like usable for the general-purpose computer can be used. As theinput portion 14, a keyboard, a mouse, a touch panel, a voice-input means and the like can be used. - The
control unit 11 controls the rotational velocity V (rps) of thesubstrate support holder 6 by inputting the deposition time T together with the values of the total whole number of rotations N and the fractional number of rotations α, which are expressed as: -
X=N+α (where, N is a total whole number of rotations which is a positive integer, and α is a fractional number of rotations which is a positive pure decimal), - when it is determined that the total number of rotations of the
substrate support holder 6 is X during the deposition time T of the sputtering particles onto the film forming surface of thesubstrate 7. - For further description, a first digital value related to the deposition time T, a second digital value related to the total whole number of rotations N of the
substrate support holder 6 within the deposition time T and a third digital value related to the fractional number of rotations α are inputted from theinput portion 14 into theCPU 12 and recorded temporarily in it. These digital values can also be recorded on therecording medium 13 and read if necessary. - The
CPU 12 of thecontrol unit 11 is connected to therotation control mechanism 4, theDC power source 8 and theshutter drive mechanism 9. TheCPU 12 of thecontrol unit 11 controls the operations of theDC power source 8 and theshutter drive mechanism 9 at the required timing and also controls the operation of therotation control mechanism 4 in accordance with the above drive timing to control the rotational velocity V (rps) of thesubstrate support holder 6. - An operation command to and the control of the
rotation drive mechanism 4 are performed according to the first, second and third digital values, which are temporarily recorded in theCPU 12, by reading the control program recorded on therecording medium 13. The operation command to and the control of therotation drive mechanism 4 are executed by calculating: -
V·T=N+α - from the individual values of the deposition time T, the total whole number of rotations N and the fractional number of rotations α which are given as the first, second and third digital values and rotating the
substrate support holder 6 at the determined rotational velocity V for the prescribed deposition time T. In other words, the sputtering apparatus of the present invention controls the rotational velocity V of thesubstrate support holder 6 such that the total number of rotations X of thesubstrate holder 6 during the deposition time T is not an integer but has the fractional number of rotations α without fail. - The deposition time T according to the invention is determined from a thickness of a deposit film to be formed on the
substrate 7 and a deposition speed (deposition thickness per unit time of the film forming material to the substrate 7) of the used sputtering apparatus according to the invention. The deposition speed can be determined by performing a preliminary film forming experiment under the same conditions as those for formation of the deposit film on thesubstrate 7. The total whole number of rotations N can be selected arbitrarily in a range that an excessive load is not applied to therotation drive mechanism 4 depending on the ability of therotation drive mechanism 4. And, the fractional number of rotations α can be determined by performing the preliminary film forming experiment with the fractional number of rotations α varied by adjusting the rotational velocity V of thesubstrate support holder 6 with the total whole number of rotations N fixed to obtain the fractional number of rotations α at which a deposit film having a film thickness as uniform as possible can be formed. - For example, the start and end points of the deposition time T can be determined as on/off timing of the power supply unit (e.g., DC power source 8), open/close timing of the
shutter 10, or a combination of on/off timing of the power supply unit and open/close timing of theshutter 10 to the sputteringcathode 3. -
FIG. 2 toFIG. 5 show first to fourth timing charts each showing a timing of start and end points of the deposition time T. These timing charts are described additionally referring toFIG. 1 . - The first timing chart of
FIG. 2 shows a case that the deposition time T is determined by timings of opening and closing theshutter 10. TheCPU 12 of thecontrol unit 11 first introduces a sputtering gas into thevacuum vessel 1 of the sputtering apparatus with theshutter 10 in a closed state and turns “on” theDC power source 8 to supply a constant power to the sputteringcathode 3 to start discharge, thereby generating plasma at the front surface of thetarget 2. After that, theshutter drive mechanism 9 operates to open theshutter 10. The time when the opening operation of theshutter 10 is terminated (time when theshutter 10 is fully opened) is the start point of the deposition time T. And, when the deposition time T has elapsed from the termination of the opening operation of theshutter 10, theshutter drive mechanism 9 is operated again to close theshutter 10. In this case, the time of starting the closing operation of theshutter 10 is the end point of the deposition time T. - The second timing chart of
FIG. 3 shows a case that the deposition time T is determined by the on/off timing of the power supply unit (e.g., DC power source 8) to the sputteringcathode 3. This timing chart can be applied to a device not provided with theshutter 10 and a case that the sputtering apparatus is driven with theshutter 10 kept open. In the second timing chart, the time when theCPU 12 of thecontrol unit 11 introduces a sputtering gas into thevacuum vessel 1 of the sputtering apparatus and turns “on” theDC power source 8 is the start point of the deposition time T, and the time when theDC power source 8 is turned “off” later is the end point of the deposition time T. - The third timing chart of
FIG. 4 shows a first example of determining the deposition time T by a combination of the on/off timing of the power supply unit (e.g., DC power source 8) and the open/close timing of theshutter 10. The start point of the deposition time T in this third timing chart is same to the start point in the first timing chart. In the third timing chart, when the deposition time T has elapsed from the start point, theDC power source 8 is turned off with theshutter 10 in the open state, and then theshutter 10 is closed. And, the time when theDC power source 8 is turned “off” is the end point of the deposition time T. - The fourth timing chart of
FIG. 5 shows a second example of determining the deposition time T by a combination of the on/off timing of the power supply unit (e.g., DC power source 8) and the open/close timing of theshutter 10. TheCPU 12 of thecontrol unit 11 first introduces a sputtering gas into thevacuum vessel 1 of the sputtering apparatus with theshutter 10 in the closed state and operates theshutter drive mechanism 9 to open theshutter 10. Then, theDC power source 8 is turned “on” to supply a constant power to the sputteringcathode 3 to start discharge, thereby generating plasma at the front surface of thetarget 2. The start point of the deposition time T in this fourth timing chart is the time when theDC power source 8 is turned “on”. And, the end point of the deposition time T is same to the end point of the first timing chart. - The deposition time T according to the invention is determined as a time in which the necessary deposit film thickness is obtained, and the invention is particularly effective for formation of a thin deposit film and effective when the deposit film thickness is 10 nm or less and particularly 1 nm or less. In other words, the present invention is effective for formation of a deposit film having a short deposition time T, and the deposition time T according to the invention is preferably 1 to 400 seconds, and more preferably 1 to 30 seconds.
- The rotational velocity V of the
substrate support holder 6 according to the invention may be obtained by a generalrotation control mechanism 4 and preferably in a range of 0.016 to 3.5 rps, and more preferably in a range of 0.05 to 2 rps. Since a very low-speed rotation requires a special system for the rotation mechanism and the control mechanism, it is preferably 0.016 rps or more from the viewpoint of the cost. To maintain a high vacuum atmosphere by a simple sealing mechanism, the rotational velocity V is preferably 3.5 rps or less. And, it is more preferably 0.05 rps or more for more stable operation. Thesubstrate 7 is placed on thesubstrate support holder 6, which is accelerated from a stationary state, then the film formation is started when thesubstrate support holder 6 reaches a desired rotational velocity. After the film formation is terminated, thesubstrate support holder 6 is decelerated to return to the stationary state. Therefore, when the rotational velocity is increased, an influence on a throughput (the number of substrates per unit time processed by the apparatus) due to acceleration and deceleration time of thesubstrate support holder 6 increases, and when it is tried to decrease the acceleration and deceleration time, an excessive force is applied to the mechanism, and a maintenance cycle is decreased. Therefore, it is more preferable that thesubstrate support holder 6 has a rotational velocity V of 2 rps or less. - The total whole number of rotations N according to the invention becomes an integer of 1 or more, and generally in a range of 1 to 100 rotations, and preferably in a range of 1 to 50 rotations.
- The fractional number of rotations α according to the invention is determined by the preliminary film forming experiment as described above. For example, it is determined as 0.1 rotation (deviation angle β=36 degrees), 0.2 rotation (deviation angle β=72 degrees), 0.5 rotation (deviation angle β=180 degrees), 0.15 rotation (deviation angle β=54 degrees), 0.151 rotation (deviation angle β=54.36 degrees) or the like.
- Generally, the fractional number of rotations α is preferably 0.1 to 0.9 rotation, and more preferably 0.2 to 0.8 rotation. The above deviation angle β denotes an amount of angular deviation with the
rotating axis 5 at the center which is generated between the time of starting rotations and the time of stopping rotations αt one point on thesubstrate support holder 6. - The material used for the
target 2 of the invention includes, for example, a metal such as Hf (hafnium), Mg (magnesium), La (lanthanum), Zr (zirconium), Ta (tantalum), Ti (titanium), Al (aluminum), Co (cobalt), Fe (iron), Ni (nickel), Ru (ruthenium), Cu (copper), Pt (platinum), Mn (manganese) or Cr (chromium), an oxide such as magnesium oxide, hafnium oxide, lanthanum oxide, silicon oxide, tantalum oxide or chromium oxide, a carbide such as silicon carbide, or the like, but they are not exclusively limited. Thetarget 2 is preferably set to have a diameter smaller than that of thesubstrate 7. In a preferable embodiment, the diameter of thetarget 2 is in a range of 0.1 to 0.9 time, and preferably 0.3 to 0.7 time, larger than the diameter of thesubstrate 7. - As the
substrate 7 used in the present invention, for example, a silicon substrate, a gallium arsenide substrate, an AlTiC substrate, a glass substrate, a stainless substrate, an aluminum substrate, a plastic substrate and the like can be used, but they are not exclusively limited. - In the example shown in
FIG. 1 , the sputteringcathode 3 and thesubstrate support holder 6 are disposed such that the surface (surface exposed toward the substrate 7) of thetarget 2 is inclined with respect to the film forming surface of thesubstrate 7. But, the arrangement of the sputteringcathode 3 and thesubstrate support holder 6 according to the invention is not limited to the above. The film forming surface of thesubstrate 7 and the surface of thetarget 2 may be arranged to be parallel to each other when a vertical line running through the center point of thetarget 2 and a vertical line running through the center point of the substrate are mismatched with each other among vertical lines with respect to a plane including the film forming surface of thesubstrate 7. Arrangement examples of the sputteringcathode 3 and thesubstrate support holder 6 according to the invention are described below with reference toFIG. 6 andFIG. 7 . -
FIG. 6 andFIG. 7 are sectional views each schematically showing an arrangement relationship between a substrate and a target according to the invention, and members common to those ofFIG. 1 are denoted by like reference numerals. - In the drawings, 102 denotes a target; 103 a sputtering cathode; 106 a substrate support holder; 107 a substrate; (a) a vertical line (substrate vertical line (a)) running through a center (o) of the
substrate 107 among vertical lines with respect to a plane including the film forming surface of thesubstrate 107; and (b) a vertical line (substrate vertical line (b)) running through a center (p) of thetarget 102; and a shift amount (l) is a distance between the substrate vertical line (a) and the substrate vertical line (b). And, (c) inFIG. 7 is a vertical line (target vertical line (c)) running through the center (p) of thetarget 102 among vertical lines with respect to a plane including the surface of thetarget 102. - In the arrangement example shown in
FIG. 6 , the sputteringcathode 103 and thesubstrate support holder 106 are arranged such that the surface of thetarget 102 and the film forming surface of thesubstrate 107 are parallel to each other and the substrate vertical line (a) and the substrate vertical line (b) are not a common linear line but positioned separate from each other and are mismatched with each other. The sputteringcathode 103 and thesubstrate support holder 106 may be arranged such that even when the substrate vertical line (b) is arranged to become a linear line running inside the outer peripheral edge of thesubstrate 107, the substrate vertical line (b) becomes a linear line running outside the outer peripheral edge of thesubstrate 107. The shift amount (l) is preferably 50 to 800 mm, more preferably 100 to 500 mm, and much more preferably 150 to 400 mm. And, a distance from the center (p) of thetarget 102 to the plane including the film forming surface of thesubstrate 107 along the substrate vertical line (b) is preferably 50 to 800 mm, more preferably 100 to 500 mm, and much more preferably 150 to 400 mm. - In the arrangement example shown in
FIG. 7 , the sputteringcathode 103 and thesubstrate support holder 106 are arranged such that the surface of thetarget 102 is not parallel to the film forming surface of thesubstrate 107, and the substrate vertical line (a) and the substrate vertical line (b) are not a common linear line but positioned separate from each other and are mismatched with each other. A crossing angle θ between the substrate vertical line (a) and the target vertical line (c) is preferably 1 to 45 degrees, and more preferably 5 to 35 degrees. In this arrangement example, the sputteringcathode 103 and thesubstrate support holder 106 may also be arranged such that even when the substrate vertical line (b) is arranged to become a linear line running inside the outer peripheral edge of thesubstrate 107, the vertical line (B) becomes a linear line running outside the outer peripheral edge of thesubstrate 107. The shift amount (l) is preferably 50 to 800 mm, more preferably 100 to 500 mm, and much more preferably 150 to 400 mm. And, a distance from the center (p) of thetarget 102 to the plane including the film forming surface of thesubstrate 107 along the substrate vertical line (b) is preferably 50 to 800 mm, more preferably 100 to 500 mm, and much more preferably 150 to 400 mm. - When the
substrate 107 has a circular shape like a silicon wafer, the center point (o) of thesubstrate 107 is the center of the circular shape, and when it has a square shape like a glass substrate, it is an intersection of two diagonal lines. When it has a shape other than the circular or square shape, the center of gravity is determined to be the center point (o). They are also same for thetarget 102. - Using the sputtering apparatus shown in
FIG. 1 , Mg (magnesium) was deposited on a substrate. Film forming conditions are as follows. A deposition speed was determined by performing a preliminary film forming experiment for forming a deposit film of Mg. Specifically, deposition amounts were measured at 17 points in an area excluding an outer peripheral portion of 5 mm of a Si wafer having a diameter of 300 mm on which the Mg deposit film was formed in the same manner as the method described below, and the average of the 17 deposition amounts divided by the deposition time (film forming time) was determined as the deposition speed. And, a total whole number of rotations N was selected as a general value for ability of therotation drive mechanism 4 of the used sputtering apparatus. - (1) Deposition speed: 0.01418 nm per second
(2) Target Mg film thickness: 0.2 nm
(3) Deposition time T: 14.1 seconds (0.2÷0.01418=14.1)
(4) Total whole number of rotations N: 23 rotations.
(5) Total number of rotations X and fractional number of rotations α - Total number of rotations X=23.20 rotations, fractional number of rotations α=0.20 rotation (deviation angle β=72 degrees)
- Total number of rotations X=23.40 rotations, fractional number of rotations α=0.40 rotation (deviation angle β=144 degrees)
- Total number of rotations X=23.60 rotations, fractional number of rotations α=0.60 rotation (deviation angle β=216 degrees)
- Total number of rotations X=23.80 rotations, fractional number of rotations α=0.80 rotation (deviation angle β=288 degrees)
- Total number of rotations X=23.0 rotations, fractional number of rotations α=0 (deviation angle β=0 degree)
- (6) Arrangement of sputtering
cathode 103 and substrate support holder 106: Crossing angle θ=32.7 degrees, shift amount (l)=276 mm
(7) Power supply unit for sputtering cathode 3: DC power source 8 (power of 50 W) - Mg was deposited on the
substrate 7 in Examples 1 to 4 and Comparative Example 1 as described below, except that the fractional number of rotations α was varied as shown in the above (5). - The values of the above conditions (3) to (5), namely the values of deposition time T, total whole number of rotations N and fractional number of rotations α, were inputted into the
CPU 12 of thecontrol unit 11. Calculation was made by theCPU 12 such that the rotational velocity V (rps) of thesubstrate support holder 6 met V·T=N+α, and based on the calculated result, the rotational velocity V of therotation drive mechanism 4 was controlled together with the opening/closing action of theshutter 10 and the on/off operation of theDC power source 8. - First, a Si (silicon) wafer having a diameter of 300 mm was placed as the
substrate 7 on thesubstrate support holder 6, and the interior of thevacuum vessel 1 was evacuated to 5.3×10−7 Pa. - As the
target 2, metal Mg having purity of 99.9% was used. - Then, Ar gas was introduced into the
vacuum vessel 1 while evacuating thevacuum vessel 1 such that thevacuum vessel 1 had a low-pressure Ar gas atmosphere of 0.1 Pa therein. - When the Ar gas was introduced, the
substrate support holder 6 was started to rotate, so that thesubstrate 7 was rotated together with thesubstrate support holder 6. This rotation was determined to have a constant rotational velocity V calculated from the values of the deposition time T, the total whole number of rotations N and the fractional number of rotations α. - The
DC power source 8 was turned “on” with theshutter 10 in a closed state, and power controlled to constant power of 50 W was applied to the sputteringcathode 3 to start a discharge from thetarget 2 to generate plasma at the front surface of thetarget 2. The potential of the target against ground potential became negative, positive ions in the plasma entered thetarget 2, and sputtering of thetarget 2 of Mg was started. - In this state, the
shutter 10 was operated to open, and Mg was started to deposit onto thesubstrate 7. After the sputtering particles of Mg were deposited on thesubstrate 7 for a given deposition time T only, theDC power source 8 was turned “off” to block the application of power to the sputteringcathode 3, and the Mg deposition was terminated. The deposition time T was from the termination of the opening operation of theshutter 10 to the turn “off” of theDC power source 8, and the deposition time T was set to 14.1 seconds as shown in the (3) above. During the deposition time T of 14.1 seconds, thesubstrate support holder 6 was continued to rotate at the rotational velocity V calculated as described above. - The obtained Mg film was measured for the Mg deposition amount, and the distribution of a deposition amount was measured. The deposition amount was measured by X-ray fluorescence analysis. For the distribution of a deposition amount, the deposition amounts at 17 points in an area excluding an outer peripheral portion of 5 mm of a Si wafer having a diameter of 300 mm were measured, and a value three times larger than a ratio of a standard deviation to the average value of the 17 deposition amounts was determined as a value of uniformity.
-
FIG. 8 shows the measured results of the distribution of a deposition amount of Mg when the film was formed in Example 4 [total number of rotations X=23.80 rotations, fractional number of rotations α=0.80 rotation (deviation angle β=288 degrees)], which were standardized and shown at a rate to the average value of the deposition amounts.FIG. 9 shows the measured results of the distribution of a deposition amount of Mg when the film was formed in Comparative Example 1 [total number of rotations X=23.0 rotations, fractional number of rotations α=0 (deviation angle β=0 degree)] which were standardized and shown at a rate to the average value of the deposition amounts. In addition,FIG. 10 is a graph showing a relationship between the deviation angle β (fractional number of rotations α) varied in Examples 1 to 4 and Comparative Example 1 and the uniformity of deposition amounts in the Mg films obtained in Examples 1 to 4 and Comparative Example 1. - It is seen from
FIG. 8 toFIG. 10 that although the total whole number of rotations N is a small number of rotations such as 23 rotations and the deposition time T is also short such as 14.1 seconds, the distribution of the deposition amount can be suppressed by controlling to give the fractional number of rotations α of pure decimal, and the uniformity can be improved. -
- 1: Vacuum vessel
- 2, 102: Target
- 3, 103: Sputtering cathode
- 4: Rotation drive mechanism
- 5: Rotating axis
- 6, 106: Substrate support holder
- 7, 107: Substrate
- 8: DC power source
- 9: Shutter drive mechanism
- 10: Shutter mechanism
- 11: Control unit (computer)
- 12: CPU (processing unit)
- 13: Recording medium
- 14: Input portion
- a: Vertical line running through the center of a substrate among vertical lines with respect to a plane including a film forming surface
- b: Vertical line running through the center of a target among vertical lines with respect to a plane including a film forming surface
- c: Vertical line running through the center of a target among vertical lines with respect to a plane including a surface of the target
- o: Center of substrate
- p: Center of target
- l: Shift amount
- θ: Crossing angle
Claims (15)
1. A sputtering apparatus, comprising a sputtering cathode for supporting a target and a substrate support holder for supporting a substrate, which are disposed to have a vertical line running through the center point of the target and a vertical line running through the center point of the substrate mismatched with each other among vertical lines to a plane including a film forming surface of the substrate, and the substrate support holder being rotatable on a rotating axis which is perpendicular to the film forming surface of the substrate, wherein:
the sputtering apparatus has a control unit for controlling a rotational velocity V (rps) of the substrate support holder in a range of 0.016 to 3.5 rps to satisfy:
V·T=N+α,
V·T=N+α,
by inputting the value of a deposition time T in a range of 1 to 400 seconds and the values of a total whole number of rotations N in a range of 1 to 100 and a fractional number of rotations α in a range of 0.2 to 0.8, which are expressed as:
X=N+α (where, N denotes a total whole number of rotations which is a positive integer, and a denotes a fractional number of rotations which is a positive pure decimal)
X=N+α (where, N denotes a total whole number of rotations which is a positive integer, and a denotes a fractional number of rotations which is a positive pure decimal)
when it is determined that a total number of rotations of the substrate support holder is X during the deposition time T (seconds) of sputtering particles onto the film forming surface of the substrate.
2. (canceled)
3. (canceled)
4. The sputtering apparatus according to claim 1 , further comprising a power supply unit for supplying power to the sputtering cathode, wherein the deposition time T is a time from the start to end of supplying the power from the power supply unit to the sputtering cathode.
5. The sputtering apparatus according to claim 1 , further comprising a power supply unit for supplying power to the sputtering cathode and an openable/closable shutter disposed between the sputtering cathode and the substrate support holder, wherein the deposition time T is a time when the power is supplied from the power supply unit to the sputtering cathode and the shutter is open.
6. A recording medium on which recorded is a program for controlling a rotational velocity V (rps) of a substrate support holder of a sputtering apparatus which has a sputtering cathode for supporting a target and the substrate support holder for supporting a substrate, which are disposed to have a vertical line running through the center point of the target and a vertical line running through the center point of the substrate mismatched with each other among vertical lines with respect to a plane including a film forming surface of the substrate, and the substrate support holder being rotatable on a rotating axis perpendicular to the film forming surface of the substrate, wherein:
the recording medium records thereon the program for controlling the rotational velocity V of the substrate support holder in a range of 0.016 to 3.5 rps by calculating:
V·T=N+α
V·T=N+α
based on the value of a deposition time T in a range of 1 to 400 seconds and the values of a total whole number of rotations N in a range of 1 to 100 and a fractional number of rotations α in a range of 0.2 to 0.8, which are expressed as:
X=N+α (where, N is a total whole number of rotations which is a positive integer, and α is a fractional number of rotations which is a positive pure decimal)
X=N+α (where, N is a total whole number of rotations which is a positive integer, and α is a fractional number of rotations which is a positive pure decimal)
when it is determined that the total number of rotations of the substrate support holder is X during the deposition time T (seconds) of sputtering particles onto the film forming surface of the substrate.
7. (canceled)
8. (canceled)
9. The sputtering apparatus according to claim 5 , wherein the control unit controls the substrate support holder to rotate it and to maintain at the rotational velocity V, to operate the power supply unit with the shutter in a closed state, and then to operate the shutter to open it.
10. The sputtering apparatus according to claim 9 , wherein the control unit controls the power supply unit to stop its power after the deposition time T elapses from the termination of the opening operation of the shutter.
11. The sputtering apparatus according to claim 9 , wherein the control unit controls the shutter to start its closing operation after the deposition time T elapses from the termination of the opening operation of the shutter.
12. The sputtering apparatus according to claim 6 , wherein the sputtering apparatus is provided with a power supply unit for supplying power to the sputtering cathode, an openable/closable shutter is disposed between the sputtering cathode and the substrate support holder, and the deposition time T is a time when the power is supplied from the power supply unit to the sputtering cathode and the shutter is open.
13. The sputtering apparatus according to claim 12 , wherein the program controls to rotate the substrate support holder and to maintain at the rotational velocity V, to operate the power supply unit with the shutter in a closed state, and then to operate the shutter to open it.
14. The sputtering apparatus according to claim 13 , wherein the program controls the power supply unit to stop its power after the deposition time T elapses from the termination of the opening operation of the shutter.
15. The sputtering apparatus according to claim 13 , wherein the program controls the shutter to start its closing operation after the deposition time T elapses from the termination of the opening operation of the shutter.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-165718 | 2008-06-25 | ||
JP2008165718 | 2008-06-25 | ||
PCT/JP2009/060911 WO2009157341A1 (en) | 2008-06-25 | 2009-06-16 | Sputtering device and recording medium whereon a control program thereof is recorded |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/060911 A-371-Of-International WO2009157341A1 (en) | 2008-06-25 | 2009-06-16 | Sputtering device and recording medium whereon a control program thereof is recorded |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/575,244 Division US10378100B2 (en) | 2008-06-25 | 2014-12-18 | Sputtering apparatus and recording medium for recording control program thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110042209A1 true US20110042209A1 (en) | 2011-02-24 |
Family
ID=41444409
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/934,497 Abandoned US20110042209A1 (en) | 2008-06-25 | 2009-06-16 | Sputtering apparatus and recording medium for recording control program thereof |
US14/575,244 Active 2032-02-24 US10378100B2 (en) | 2008-06-25 | 2014-12-18 | Sputtering apparatus and recording medium for recording control program thereof |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/575,244 Active 2032-02-24 US10378100B2 (en) | 2008-06-25 | 2014-12-18 | Sputtering apparatus and recording medium for recording control program thereof |
Country Status (4)
Country | Link |
---|---|
US (2) | US20110042209A1 (en) |
JP (1) | JP5209717B2 (en) |
TW (1) | TWI428462B (en) |
WO (1) | WO2009157341A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110203734A1 (en) * | 2008-12-03 | 2011-08-25 | Canon Anelva Corporation | Plasma processing apparatus, magnetoresistive device manufacturing apparatus, magnetic thin film forming method, and film formation control program |
US20110209986A1 (en) * | 2008-12-26 | 2011-09-01 | Canon Anelva Corporation | Sputtering apparatus, sputtering method, and electronic device manufacturing method |
US20130092528A1 (en) * | 2010-06-30 | 2013-04-18 | Ulvac, Inc. | Film-forming device and film-forming method |
WO2013189935A1 (en) * | 2012-06-18 | 2013-12-27 | Oc Oerlikon Balzers Ag | Pvd apparatus for directional material deposition, methods and workpiece |
US9039873B2 (en) | 2010-12-28 | 2015-05-26 | Canon Anelva Corporation | Manufacturing apparatus |
US9991102B2 (en) | 2010-06-25 | 2018-06-05 | Canon Anelva Corporation | Sputtering apparatus, film deposition method, and control device |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130048494A1 (en) * | 2010-03-29 | 2013-02-28 | Ulvac, Inc. | Sputtering device |
JP2011246759A (en) * | 2010-05-26 | 2011-12-08 | Ulvac Japan Ltd | Film deposition device and film deposition method |
JP5836485B2 (en) | 2012-06-29 | 2015-12-24 | キヤノンアネルバ株式会社 | Sputtering apparatus and sputtering method |
JP6456010B1 (en) * | 2017-09-07 | 2019-01-23 | 株式会社アルバック | Sputtering equipment |
Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03193867A (en) * | 1989-12-25 | 1991-08-23 | Matsushita Electric Works Ltd | Method for metallizing inorganic substrate having through hole and conductive film-laminated inorganic substrate having through hole |
US5660930A (en) * | 1994-04-04 | 1997-08-26 | The Board Of Trustees Of The Leland Stanford Junior University | Multilayered thin films for perpendicular magnetic recording |
US6207499B1 (en) * | 1996-10-09 | 2001-03-27 | Oki Electric Industry Co., Ltd. | Semiconductor device, method of fabricating the same, and sputtering apparatus |
US6238531B1 (en) * | 1998-06-05 | 2001-05-29 | International Business Machines Corporation | Method and apparatus to improve the properties of ion beam deposited films in an ion beam sputtering system |
JP2001240965A (en) * | 2000-02-29 | 2001-09-04 | Showa Shinku:Kk | Method and apparatus for controlling film thickness distribution in thin film manufacturing apparatus |
US6547939B2 (en) * | 2001-03-29 | 2003-04-15 | Super Light Wave Corp. | Adjustable shadow mask for improving uniformity of film deposition using multiple monitoring points along radius of substrate |
US20050139467A1 (en) * | 2003-12-24 | 2005-06-30 | Nobuyuki Takahashi | Sputtering device |
US7008520B2 (en) * | 2003-05-14 | 2006-03-07 | Cyg Corporation | Sputtering device |
US7033461B2 (en) * | 2001-11-02 | 2006-04-25 | Ulvac, Inc. | Thin film forming apparatus and method |
US20060249372A1 (en) * | 2005-04-11 | 2006-11-09 | Intematix Corporation | Biased target ion bean deposition (BTIBD) for the production of combinatorial materials libraries |
US20060281314A1 (en) * | 2005-02-25 | 2006-12-14 | Canon Anelva Corporation | Wafer Holder And Method Of Holding A Wafer |
US7229532B2 (en) * | 2003-03-10 | 2007-06-12 | Canon Kabushiki Kaisha | Sputtering apparatus |
US20080188100A1 (en) * | 2005-01-18 | 2008-08-07 | Autoneworks Technologies, Ltd. | Press-Fit Terminal, a Method for Manufacturing the Same, and a Structure of Connection Between a Press-Fit Terminal and a Circuit Board |
US20080264775A1 (en) * | 2007-04-26 | 2008-10-30 | Canon Anelva Corporation | Sputtering film forming method, electronic device manufacturing method, and sputtering system |
US20090211897A1 (en) * | 2008-02-21 | 2009-08-27 | Canon Anelva Corporation | Sputtering apparatus and method for controlling the same |
US20090321246A1 (en) * | 2008-06-25 | 2009-12-31 | Canon Anelva Corporation | Method of fabricating and apparatus of fabricating tunnel magnetic resistive element |
US7655549B2 (en) * | 2005-02-25 | 2010-02-02 | Canon Anelva Corporation | Method for depositing a metal gate on a high-k dielectric film |
US20100078310A1 (en) * | 2008-09-30 | 2010-04-01 | Canon Anelva Corporation | Fabricating method of magnetoresistive element, and storage medium |
US20100080894A1 (en) * | 2008-09-29 | 2010-04-01 | Canon Anelva Corporation | Fabricating method of magnetoresistive element, and storage medium |
US20100120238A1 (en) * | 2007-06-07 | 2010-05-13 | Canon Anelva Corporation | Semiconductor manufacturing apparatus and method |
US20100133092A1 (en) * | 2007-09-07 | 2010-06-03 | Canon Anelva Corporation | Sputtering method and sputtering apparatus |
US20100178528A1 (en) * | 2007-06-19 | 2010-07-15 | Canon Anelva Corporation | Tunnel magnetoresistive thin film and magnetic multilayer film formation apparatus |
US20100200394A1 (en) * | 2007-10-04 | 2010-08-12 | Canon Anelva Corporation | Vacuum thin film forming apparatus |
US20100215460A1 (en) * | 2007-11-09 | 2010-08-26 | Canon Anelva Corporation | Inline-type wafer conveyance device |
US20100213047A1 (en) * | 2007-10-04 | 2010-08-26 | Canon Anelva Corporation | High-frequency sputtering device |
US20100224482A1 (en) * | 2008-11-28 | 2010-09-09 | Canon Anelva Corporation | Deposition apparatus and electronic device manufacturing method |
US20100239394A1 (en) * | 2007-11-09 | 2010-09-23 | Canon Anelva Corporation | Inline-type wafer conveyance device |
US20100243438A1 (en) * | 2008-11-28 | 2010-09-30 | Canon Anelva Corporation | Sputtering apparatus |
US7816283B2 (en) * | 2004-05-31 | 2010-10-19 | Canon Anelva Corporation | Method of depositing a higher permittivity dielectric film |
US20100316890A1 (en) * | 2007-10-26 | 2010-12-16 | Canon Anelva Corporation | Magnetic tunnel junction device with magnetic free layer having sandwich structure |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6081821A (en) * | 1983-10-12 | 1985-05-09 | Rohm Co Ltd | Molecular beam epitaxial equipment |
JPS61161708A (en) * | 1985-01-11 | 1986-07-22 | Nec Corp | Formation of thin film |
JP2620476B2 (en) | 1991-12-25 | 1997-06-11 | 株式会社コクブ | nail |
JPH06302516A (en) * | 1993-04-13 | 1994-10-28 | Hitachi Cable Ltd | Vapor growth method |
JP4223614B2 (en) * | 1999-01-12 | 2009-02-12 | キヤノンアネルバ株式会社 | Sputtering method and apparatus, and electronic component manufacturing method |
JP2000208876A (en) * | 1999-01-12 | 2000-07-28 | Sony Corp | Growing method of semiconductor layer, manufacture of semiconductor device, semiconductor light emitting device and its manufacture |
GB0127251D0 (en) * | 2001-11-13 | 2002-01-02 | Nordiko Ltd | Apparatus |
JP4573913B1 (en) | 2009-03-30 | 2010-11-04 | キヤノンアネルバ株式会社 | Semiconductor device manufacturing method and sputtering apparatus |
-
2009
- 2009-06-16 WO PCT/JP2009/060911 patent/WO2009157341A1/en active Application Filing
- 2009-06-16 JP JP2010517914A patent/JP5209717B2/en active Active
- 2009-06-16 US US12/934,497 patent/US20110042209A1/en not_active Abandoned
- 2009-06-24 TW TW98121194A patent/TWI428462B/en active
-
2014
- 2014-12-18 US US14/575,244 patent/US10378100B2/en active Active
Patent Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03193867A (en) * | 1989-12-25 | 1991-08-23 | Matsushita Electric Works Ltd | Method for metallizing inorganic substrate having through hole and conductive film-laminated inorganic substrate having through hole |
US5660930A (en) * | 1994-04-04 | 1997-08-26 | The Board Of Trustees Of The Leland Stanford Junior University | Multilayered thin films for perpendicular magnetic recording |
US6207499B1 (en) * | 1996-10-09 | 2001-03-27 | Oki Electric Industry Co., Ltd. | Semiconductor device, method of fabricating the same, and sputtering apparatus |
US6238531B1 (en) * | 1998-06-05 | 2001-05-29 | International Business Machines Corporation | Method and apparatus to improve the properties of ion beam deposited films in an ion beam sputtering system |
JP2001240965A (en) * | 2000-02-29 | 2001-09-04 | Showa Shinku:Kk | Method and apparatus for controlling film thickness distribution in thin film manufacturing apparatus |
US6547939B2 (en) * | 2001-03-29 | 2003-04-15 | Super Light Wave Corp. | Adjustable shadow mask for improving uniformity of film deposition using multiple monitoring points along radius of substrate |
US7033461B2 (en) * | 2001-11-02 | 2006-04-25 | Ulvac, Inc. | Thin film forming apparatus and method |
US7229532B2 (en) * | 2003-03-10 | 2007-06-12 | Canon Kabushiki Kaisha | Sputtering apparatus |
US7008520B2 (en) * | 2003-05-14 | 2006-03-07 | Cyg Corporation | Sputtering device |
US20050139467A1 (en) * | 2003-12-24 | 2005-06-30 | Nobuyuki Takahashi | Sputtering device |
US7816283B2 (en) * | 2004-05-31 | 2010-10-19 | Canon Anelva Corporation | Method of depositing a higher permittivity dielectric film |
US20080188100A1 (en) * | 2005-01-18 | 2008-08-07 | Autoneworks Technologies, Ltd. | Press-Fit Terminal, a Method for Manufacturing the Same, and a Structure of Connection Between a Press-Fit Terminal and a Circuit Board |
US20060281314A1 (en) * | 2005-02-25 | 2006-12-14 | Canon Anelva Corporation | Wafer Holder And Method Of Holding A Wafer |
US7655549B2 (en) * | 2005-02-25 | 2010-02-02 | Canon Anelva Corporation | Method for depositing a metal gate on a high-k dielectric film |
US20060249372A1 (en) * | 2005-04-11 | 2006-11-09 | Intematix Corporation | Biased target ion bean deposition (BTIBD) for the production of combinatorial materials libraries |
US20080264775A1 (en) * | 2007-04-26 | 2008-10-30 | Canon Anelva Corporation | Sputtering film forming method, electronic device manufacturing method, and sputtering system |
US20100120238A1 (en) * | 2007-06-07 | 2010-05-13 | Canon Anelva Corporation | Semiconductor manufacturing apparatus and method |
US20100178528A1 (en) * | 2007-06-19 | 2010-07-15 | Canon Anelva Corporation | Tunnel magnetoresistive thin film and magnetic multilayer film formation apparatus |
US20100133092A1 (en) * | 2007-09-07 | 2010-06-03 | Canon Anelva Corporation | Sputtering method and sputtering apparatus |
US20100200394A1 (en) * | 2007-10-04 | 2010-08-12 | Canon Anelva Corporation | Vacuum thin film forming apparatus |
US20100213047A1 (en) * | 2007-10-04 | 2010-08-26 | Canon Anelva Corporation | High-frequency sputtering device |
US20100316890A1 (en) * | 2007-10-26 | 2010-12-16 | Canon Anelva Corporation | Magnetic tunnel junction device with magnetic free layer having sandwich structure |
US20100215460A1 (en) * | 2007-11-09 | 2010-08-26 | Canon Anelva Corporation | Inline-type wafer conveyance device |
US20100239394A1 (en) * | 2007-11-09 | 2010-09-23 | Canon Anelva Corporation | Inline-type wafer conveyance device |
US20090211897A1 (en) * | 2008-02-21 | 2009-08-27 | Canon Anelva Corporation | Sputtering apparatus and method for controlling the same |
US20090321246A1 (en) * | 2008-06-25 | 2009-12-31 | Canon Anelva Corporation | Method of fabricating and apparatus of fabricating tunnel magnetic resistive element |
US20100080894A1 (en) * | 2008-09-29 | 2010-04-01 | Canon Anelva Corporation | Fabricating method of magnetoresistive element, and storage medium |
US20100078310A1 (en) * | 2008-09-30 | 2010-04-01 | Canon Anelva Corporation | Fabricating method of magnetoresistive element, and storage medium |
US20100224482A1 (en) * | 2008-11-28 | 2010-09-09 | Canon Anelva Corporation | Deposition apparatus and electronic device manufacturing method |
US20100243438A1 (en) * | 2008-11-28 | 2010-09-30 | Canon Anelva Corporation | Sputtering apparatus |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110203734A1 (en) * | 2008-12-03 | 2011-08-25 | Canon Anelva Corporation | Plasma processing apparatus, magnetoresistive device manufacturing apparatus, magnetic thin film forming method, and film formation control program |
US8377270B2 (en) | 2008-12-03 | 2013-02-19 | Canon Anelva Corporation | Plasma processing apparatus, magnetoresistive device manufacturing apparatus, magnetic thin film forming method, and film formation control program |
US20110209986A1 (en) * | 2008-12-26 | 2011-09-01 | Canon Anelva Corporation | Sputtering apparatus, sputtering method, and electronic device manufacturing method |
US8906208B2 (en) | 2008-12-26 | 2014-12-09 | Canon Anelva Corporation | Sputtering apparatus, sputtering method, and electronic device manufacturing method |
US9991102B2 (en) | 2010-06-25 | 2018-06-05 | Canon Anelva Corporation | Sputtering apparatus, film deposition method, and control device |
US10636634B2 (en) | 2010-06-25 | 2020-04-28 | Canon Anelva Corporation | Sputtering apparatus, film deposition method, and control device |
US20130092528A1 (en) * | 2010-06-30 | 2013-04-18 | Ulvac, Inc. | Film-forming device and film-forming method |
US9039873B2 (en) | 2010-12-28 | 2015-05-26 | Canon Anelva Corporation | Manufacturing apparatus |
US9752226B2 (en) | 2010-12-28 | 2017-09-05 | Canon Anelva Corporation | Manufacturing apparatus |
WO2013189935A1 (en) * | 2012-06-18 | 2013-12-27 | Oc Oerlikon Balzers Ag | Pvd apparatus for directional material deposition, methods and workpiece |
Also Published As
Publication number | Publication date |
---|---|
US20150101927A1 (en) | 2015-04-16 |
US10378100B2 (en) | 2019-08-13 |
WO2009157341A1 (en) | 2009-12-30 |
JP5209717B2 (en) | 2013-06-12 |
TWI428462B (en) | 2014-03-01 |
TW201014921A (en) | 2010-04-16 |
JPWO2009157341A1 (en) | 2011-12-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10378100B2 (en) | Sputtering apparatus and recording medium for recording control program thereof | |
JP5587822B2 (en) | Sputtering apparatus, sputtering method, and electronic device manufacturing method | |
KR101290706B1 (en) | Sputtering apparatus and sputtering method | |
US20180254172A1 (en) | Sputtering apparatus, film deposition method, and control device | |
US20120164354A1 (en) | Sputtering apparatus and manufacturing method of electronic device | |
TWI384472B (en) | Sputtering apparatus and film deposition method | |
US20070209932A1 (en) | Sputter deposition system and methods of use | |
EP0993511A1 (en) | Apparatus and method for multi-target physical vapour deposition | |
JPH10147864A (en) | Formation of thin film and sputtering device | |
JP6042196B2 (en) | Sputtering apparatus, sputtering apparatus control apparatus, and film forming method | |
JP4794514B2 (en) | Method and apparatus for manufacturing magnetic recording medium | |
TW201408807A (en) | Magnetron sputtering device, magnetron sputtering method, and storage medium | |
JP4005172B2 (en) | Double-sided simultaneous film formation method and apparatus | |
JP4974582B2 (en) | Deposition equipment | |
WO2001044534A1 (en) | Method and apparatus for thin film deposition | |
US20190355560A1 (en) | Pvd reactor with a function of alignment in covering an upper cover of the reactor | |
JPH0375363A (en) | Sputtering device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |