US20110042226A1

US20110042226A1 - Manufacturing process of a high efficiency heat dissipating device

Info

Publication number: US20110042226A1
Application number: US12/545,853
Authority: US
Inventors: Shyh-Ming Chen
Original assignee: Individual
Current assignee: CLOCK LLC
Priority date: 2009-08-23
Filing date: 2009-08-23
Publication date: 2011-02-24

Abstract

A manufacturing process of a high efficiency heat dissipating device includes a plate or cylinder base, and a plurality of fins assembled to the base. The base and the fins are made of aluminum. An oxide layer to improve heat radiating are formed to surface of the base or the fins by an anodizing process. A heat pipe is additionally arranged to conduct the heat from the base to the fins. Or, in a heat dissipating device consists of the heat pipe and the fins, oxide layers are formed to the surfaces of the fins by the anodizing process. By the above structure, a heat radiating effect is improved and a visible appearance, an anti-pollution ability are formed to the heat dissipating device.

Description

FIELD OF THE PRESENT INVENTION

The present invention relates to manufacturing process of a high efficiency heat dissipating device, and particular to a heat dissipating device applied to a computer or an electronic component. By an anodizing process, a heat radiating effect is improved as well as an outer visible appearance and an anti-pollution ability.

DESCRIPTION OF THE PRIOR ART

A prior heat dissipating device for a computer or electronic component consists of a base attached to a heat source and fins assembled to the base, or further consists of a heat pipe connected to the base and the fins so as to conduct the heat from the base to the fins by directly or indirectly contact to the heat source. To improve a heat dissipation, heat dissipating device vendors spend lots of effort on components and structure of the heat dissipating device. The thermal conduction through a material is defined in the following formula:
Q=−KA*ΔT/ΔX
The Q is heat flow, the K is a thermal conductivity, the A is a cross section area of conducting surface, the ΔT is temperature difference, and the ΔX is conducting distance between the two temperatures. Therefore, more fins are assembled to the base, more area are added to radiate thermal energy. By changing the material of the base or the fins to aluminum or copper, the higher thermal conductivity thereof will also help. Moreover, by arranging a fan beside the heat dissipating device to lower the temperature of the fins will also raise the temperature difference so as to raise the heat flow.
However, by increasing the fins or air flow by the fan to raise the heat flow will meet a limit. That means the heat flow is limited for a heat dissipating device with a specification within a certain interval. The operating frequency of the computer and the electronic component are getting fast, and more heat generated usually exceed heat dissipating device's limit. The operation temperature of the computer and electronic component become higher so that the function and lifetime are damaged. Some vendors use water-cooling system or Thermo-Electric Heat dissipating device (TEC) to overcome the problem, but the water-cooling system is large-scaling, high cost, and having a water condensing and leakage problem. The TEC is a semiconductor-base heat dissipating device. In accordance with the Peltier Effect, heat energy will be conducted from a heat absorbing end of the TEC to another end which is a heat dissipating end. According to the First Law of Thermodynamics-Conservation of Energy, the heat energy is only transferred to another side of the TEC for dissipating by another heat dissipating device. Thus, the heat dissipating effect is not good and also the cost is high. The higher operating temperature of the electronic component caused by the TEC will further lower the temperature difference and the heat flow as well.

SUMMARY OF THE PRESENT INVENTION

Accordingly, the primary object of the present invention is to provide a manufacturing process of a high efficiency heat dissipating device. Without changing the specification of the heat dissipating device or using auxiliary water-cooling system or TEC, the heat conduction will be improved for meeting the needs of higher efficiency and heat-generating devices.
A secondary object of the present invention is to provide a manufacturing process of forming an oxide layer to a surface of the heat dissipating device by an anodizing process so that the heat dissipating device is durable, antioxidative, anti-polluted, and colorful.
To achieve above objects, the present invention provides the oxide layer to surfaces of the base and/or the fins by the anodizing process. The oxide layer has a higher energy radiating effect so that the heat is easier to be dissipated. After the temperature of the heat dissipating device is lowered, a temperature difference will improve the heat conduction from the heat source to the heat dissipating device. By the temperature gradient and interaction between, the contact temperature of the heat dissipating device will be lowered and the heat will be efficiently dissipated.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a pictorial drawing of a heat dissipating device assembled by a base and fins according to the present invention.

FIG. 2 is a manufacturing flow chart of an embodiment of the present invention.

FIG. 2A is another manufacturing flow chart of an embodiment of the present invention.

FIG. 2B is one another manufacturing flow chart of an embodiment of the present invention.

FIG. 3 is one another manufacturing flow chart of an embodiment of the present invention.

FIG. 4 is a pictorial drawing showing an embodiment with heat pipe of the present invention.

FIG. 5 is a pictorial drawing showing another embodiment with heat pipe of the present invention.

FIG. 6 is a schematic view showing an oxide layer formed to surfaces of the base and the fin.

FIG. 7 is an exploded view of an embodiment of the present invention.

FIG. 8 is an assembly drawing of an embodiment of the present invention shown in FIG. 7.

FIG. 9 is an exploded view of another embodiment of the present invention.

FIG. 10 is an assembly drawing of another embodiment of the present invention shown in FIG. 9.

DETAILED DESCRIPTION OF THE INVENTION

In order that those skilled in the art can further understand the present invention, a description will be provided in the following in details. However, these descriptions and the appended drawings are only used to cause those skilled in the art to understand the objects, features, and characteristics of the present invention, but not to be used to confine the scope and spirit of the present invention defined in the appended claims.
A manufacturing process of a high efficiency heat dissipating device is illustrated in FIG. 1. The heat dissipating device 10 includes a base 20, the base 20 has a side of a shape of a rectangle, a circle, a geometrical shape, or irregular shape contacted to a heat source. The heat source is not confined to integrated circuits, chips, or Light Emitting Diode modules. Another side of the base 20 is tightly combined with a plurality of fins 30 by welding, pressing, or heat pipe gluing. Heat from the heat source is thus conducted to the fins 30 for dissipating. The present invention has a main object which is to raise a unit heat radiation rate of the heat dissipating device 10.
In accordance with the Stefan-Boltzmann Law, a total energy radiated per unit surface area of a black body is proportional to the black body's absolute temperature:
Qb=AσT⁴.
The A is surface area, and the σ is the Stefan-Boltzmann constant. Qb is the total energy radiated from the black body. However, the emissivity of a material is the ratio of energy radiated of the material to that of a black body:
ε=Q/A/(Q/A)b
The Q/A is a total energy radiated per unit surface area of the material, while the (Q/A)b is a total energy radiated per unit surface area of a black body under the same temperature. A black body would have an ε=1, while any other material would have an ε<1. Therefore, a Non-black body would have a energy radiated Q=σAεT⁴. To improve the energy radiating effect of a material, increasing a surface area A or changing the σ can be done.
The present invention is to anodize one or both of the aluminum base 20 and fins 30 so as to form aluminum oxide layers to the surfaces thereof (referring to FIGS. 2, 3, and 6). The σ of a polished aluminum is 0.04, while the σ of the aluminum oxide is 0.8. Obviously, in accordance of the energy radiated formula mentioned above, the base 20 and fins 30 with the aluminum oxide surface will have a better energy dissipating effect.
Furthermore, by adjusting the voltages and processing time of the anodizing process of the base 20 and the fins 30, different color and thickness of oxide layer 40 can be controllable formed to the base 20 and the fins 30 so as to form a visible appearance thereto and an anti-pollution ability.
Moreover, the anodizing and assembling of the base 20, fins 30 of the present invention can be performed by the following orders. One is to anodize the base 20 and the fins 30 separately to form high energy radiating oxide layers 40 onto surfaces thereof (referring to FIGS. 2, 2A, and 2B), and then to tightly combine the base 20 and the fins 30 as a finished heat dissipating device 10. The other way (referring to FIG. 3) is to combine the base 20 and the fins 30 as a heat dissipating device 10 first, and then to anodize the heat dissipating device 10 to form oxide layers 40 onto surfaces of the base 20 and the fins 30 to increase the energy radiating effect.
Referring to FIG. 4, a heat pipe 50 is tightly arranged to the base 20 with one end of the heat pipe 50 and another end thereof to the fins 30 to improve the heat conduction. Also, high energy radiating oxide layers 40 are formed onto surfaces of the base 20, fins 30 and selectively onto a surface of the heat pipe 50 by the anodizing process.
Another embodiment of the heat dissipating device of the present invention having at least one heat pipe 50 is illustrated in FIG. 5. One end of the at least one heat pipe 50 is arranged to a plurality of fins 30 and another end thereof is arranged to a base 20, or directly attached to a heat source 60. Oxide layers 40 of aluminum oxide are formed onto surfaces of the fins 30 and the heat pipe 50 to improve the energy radiating effect. By adjusting the voltages and processing time of the anodizing process, different color and thickness of oxide layer 40 can be formed to the fins 30.
Therefore, according to the present invention, the base 20, fins 30, and the heat pipe 50 are applied to a heat dissipating device by the needs. By the anodizing process, oxide layers 40 are formed to the surfaces (as shown in FIG. 6). By adjusting the voltages and processing time of the anodizing process, different color and thickness of oxide layer 40 can be formed so as to form a visible appearance thereto and an anti-pollution ability. After the temperature of the heat dissipating device 10 is lowered, a temperature difference will improve the heat conduction from the heat source to the heat dissipating device 10. By the temperature gradient and interaction between, the contact temperature of the heat dissipating device 10 will be lowered and the heat will be efficiently dissipated.
With reference to FIGS. 7 and 8, an exploded drawing and an assembly drawing of another embodiment of the present invention are illustrated. A heat dissipating device 10 a have a cylindrical base 20 a and a plurality of fins 30 a assembled to an outer surface of the cylindrical base 20 a. The base 20 a and/or the fins 30 a are made of aluminum. By the anodizing process, high energy radiating oxide layers 40 a are formed to the surfaces of the base 20 a and/or the fins 30 a. By adjusting the voltages and processing time of the anodizing process, color and thickness of oxide layer 40 a can be adjusted.
The assembling of the base 20 a, fins 30 a of the present invention can be performed by the following orders. One is to anodize the base 20 a and/or the fins 30 a separately to form high energy radiating oxide layers 40 a onto surfaces thereof, and then to tightly combine the base 20 a and the fins 30 a as a finished heat dissipating device 10 a by a combining process. The other way is to combine the base 20 a and the fins 30 a as a heat dissipating device 10 a first, and then to anodize the heat dissipating device 10 a to form oxide layers 40 a onto surfaces of the base 20 a and the fins 30 a to increase the energy radiating effect.
Additionally, a carrier 70 a is arranged to an end or an inside of the base 20 a for being installed by a heat source. By the anodizing process, the high energy radiating oxide layer 40 a is formed to a surface of the carrier 70 a to improve the energy radiating effect.
With reference to FIGS. 9, and 10, an exploded drawing and an assembly drawing of one another embodiment of the present invention are illustrated. A heat dissipating device 10 c have a cylindrical base 20 c and a plurality of fins 30 c assembled to an outer surface of the cylindrical base 20 c. The base 20 c and the fins 30 c are integral made of aluminum. By the anodizing process, high energy radiating oxide layers 40 c are formed to the surfaces of the base 20 c and/or the fins 30 c. Additionally, a carrier 70 c is arranged to an end or an inside of the base 20 c for being installed by a heat source. By the anodizing process, the high energy radiating oxide layer 40 c is formed to a surface of the carrier 70 c to improve the energy radiating effect.
The present invention is thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the present invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.

Claims

1. A manufacturing process of a high efficiency heat dissipating device comprising the step of assembling a plurality of fins to a base;

performing an anodizing process, an oxide layer for improving a heat radiating effect being formed to a surface of at least one of the base or the fins.

2. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 1, wherein at least one of the base and the fins are made of aluminum; an aluminum oxide layer is formed to the surface of at least one of the base and the fins by the anodizing process to improve the heat radiating effect.

3. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 2, wherein colors and thicknesses of the oxide layer of the base and the fins are controllable by adjusting voltages and process time of the anodizing process.

4. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 2, wherein at least one of the base and the fins is anodized separately to form the high heat radiating oxide layer onto the surface thereof; and then tightly combining the base and the fins together as a finished heat dissipating device by a combining process.

5. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 2, wherein the base and the fins are combined together as a heat dissipating device firstly, and then the heat dissipating device is anodized to form oxide layers onto surfaces of the base and the fins.

6. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 2, comprising the step of arranging one end of at least one heat pipe tightly to the base, and another end thereof is arranged to the fins; oxide layers are formed to the surfaces of the base and the fins by the anodizing process to improve the heat radiating effect.

7. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 6, wherein an oxide layer is formed to a surface of the heat pipe by the anodizing process.

8. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 2, wherein the base is a plate body with a shape of one of a rectangle, a circle, a geometrical shape, and an irregular shape.

9. A manufacturing process of a high efficiency heat dissipating device comprising steps of: assembling a plurality of fins assembled to at least one heat pipe;

by an anodizing process, an oxide layer for improving a heat radiating effect being formed to a surface of at least one of the heat pipe and the fins.

10. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 9, wherein the fins is made of aluminum; the oxide layer of aluminum oxide is formed to the surfaces of the fins to improve the heat radiating effect.

11. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 10, wherein color and thickness of the oxide layer of the fins are controllable by adjusting voltages and process time of the anodizing process.

12. A manufacturing process of a high efficiency heat dissipating device comprising the steps of assembling a plurality of fins assembled to an outer surface of a cylindrical base; and

by an anodizing process, an oxide layer being formed to a surface of at least one of the base and the fins to improve a heat radiating effect.

13. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 12, wherein at least one of the base and the fins are made of aluminum; by the anodizing process, the oxide layer of aluminum oxide are formed to the surface of at least one of the base and the fins to improve the heat radiating effect.

14. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 13, wherein colors and thickness of the oxide layer of at least one of the base and the fins are controllable by adjusting voltages and process time of the anodizing process.

15. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 13, wherein the oxide layer is formed to the surface of at least one of the cylindrical base and fins to improve the heat radiating effect; and then the base and the fins are tightly combined together by a combining process.

16. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 13, wherein the base and the fins are tightly combined together to be as a heat dissipating device by a combining process; by anodizing the heat dissipating device, oxide layers are formed to the base and the fins.

17. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 13, wherein a carrier is arranged to one of an end or an inside of the base for being installed by a heat source.

18. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 17, wherein the oxide layer is formed to a surface of the carrier by the anodizing process to improve the heat radiating effect.

19. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 13, wherein the base and the fins being formed integrally; the oxide layer is formed to at least one of the base and the fins by the anodizing process to improve the heat radiating effect.

20. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 19, wherein a carrier is arranged to one of an end or an inside of the base for being installed by a heat source.