US20110081022A1 - Audio jack with emi shielding - Google Patents
Audio jack with emi shielding Download PDFInfo
- Publication number
- US20110081022A1 US20110081022A1 US12/573,668 US57366809A US2011081022A1 US 20110081022 A1 US20110081022 A1 US 20110081022A1 US 57366809 A US57366809 A US 57366809A US 2011081022 A1 US2011081022 A1 US 2011081022A1
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- United States
- Prior art keywords
- contact
- audio
- cavity
- aperture
- enclosure
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- 239000002184 metal Substances 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 238000004891 communication Methods 0.000 claims description 33
- 230000000295 complement effect Effects 0.000 claims description 10
- 239000004606 Fillers/Extenders Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000012811 non-conductive material Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/58—Contacts spaced along longitudinal axis of engagement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2107/00—Four or more poles
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
Description
- The present application relates to electromagnetic shielding for electronic devices. More specifically, the application discloses an apparatus for shielding an audio jack to prevent electromagnetic interference and electrostatic discharging.
- Electronic devices often have electrical inputs and outputs carried over cables connectable to the device by connectors. The electrical signals flowing through these connectors are prone to mutual electromagnetic interference (EMI) and electrostatic discharge with the other operations of the device or from outside the device. EMI effects from electrical cables and connectors connected to integrated circuits can be significant, and can interfere with radio communication and audio equipment. Accordingly, manufacturers of integrated circuit devices with connectable electrical cables have a need to reduce the EMI effects of electrical connectors in electronic devices containing integrated circuits.
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FIG. 1 is a perspective view of an exemplary embodiment of an audio jack with EMI shielding. -
FIG. 2 shows two perspective views showing the exemplary embodiment fromFIG. 1 in two different orientations. -
FIG. 3 is a perspective view of the exemplary embodiment ofFIG. 1 mounted on a printed circuit board of an exemplary electronic device. -
FIG. 4 is a partially cut-away perspective view of an exemplary electronic device with the exemplary embodiment ofFIG. 1 mounted within. -
FIG. 5 is a cross-sectional view of the exemplary embodiment ofFIG. 1 mounted within an exemplary electronic device and having an exemplary plug inserted thereinto, the cross-section taken through a vertical plane along the longitudinal axis of the audio jack cavity. - The present application describes an audio jack with shielding against electromagnetic interference (EMI).
- In a first aspect, the application is directed to an audio jack for an audio plug for use in an electrical device, comprising a non-conductive enclosure having a front side and defining a cavity having an aperture within the front side for receiving the audio plug, the aperture having a first diameter, the cavity extending along a longitudinal axis; a conductive shielding formed from sheet metal folded over at least five sides of the enclosure including the front side, the shielding defining a shielding aperture centered on the enclosure aperture and having a second diameter larger than the first diameter; and a ground contact connected to the conductive shielding.
- In another aspect, the application is directed to a non-conductive stopping member extending from a surface of the enclosure, the non-conductive stopping member extending substantially perpendicular to the longitudinal axis of the cavity and adapted to abut a complementary surface, thereby transferring any forces upon the audio jack along the longitudinal axis to the complementary surface.
- In a further aspect, the ground contact is connected to the conductive shielding proximal to the shielding aperture.
- In a further aspect, the ground contact comprises a spring contact.
- In a further aspect, the application is directed to one or more cavity contacts situated within the cavity to come into electrical communication with one or more conductive surfaces of an inserted audio plug.
- In a further aspect, the application is directed to one or more PCB spring contacts adapted to connect to and electrically communicate with leads of a printed circuit board, each PCB contact being in electrical communication with one or more of the cavity contacts.
- In a further aspect, the application is directed to an electronic device incorporating the audio jack, comprising a rigid, non-conductive case defining an aperture centered on the on the enclosure aperture and having a diameter smaller than the second diameter.
- In a further aspect, the diameter of the case aperture is substantially the same as the first diameter.
- In a further aspect, the application is directed to an electronic device incorporating the audio jack, comprising a rigid, non-conductive case defining an aperture centered on the on the enclosure aperture and having a diameter smaller than the second diameter; an audio subsystem having a left stereo speaker signal output, a right stereo speaker signal output, and a microphone signal input; and a printed circuit board having a left stereo speaker lead in communication with the left stereo speaker signal output of the audio subsystem, a right stereo speaker lead in communication with the right stereo speaker signal output of the audio subsystem, and a microphone lead in communication with the microphone signal input of the audio subsystem, the left stereo speaker lead, right stereo speaker lead, and microphone lead being positioned such that each comes into contact with one or more of the PCB contacts of the audio jack when the audio jack is mounted on the printed circuit board.
- In a further aspect, the cavity contacts of the audio jack comprise a microphone cavity contact in communication with a PCB contact positioned to communicate with the microphone lead of the printed circuit board; a right speaker cavity contact in communication with a PCB contact positioned to communicate with the right speaker lead of the printed circuit board; and a left speaker cavity contact in communication with a PCB contact positioned to communicate with the right speaker lead of the printed circuit board.
- In a further aspect, the application is directed to a system ground; the printed circuit board further comprises a system ground lead in communication with the system ground and positioned to come into communication with one or more of the PCB contacts of the audio jack; and the cavity contacts further comprise a system ground cavity contact in communication with a PCB contact positioned to communicate with the system ground lead of the printed circuit board.
- In a further aspect, the microphone cavity contact, the system ground cavity contact, the right speaker cavity contact, and the left speaker cavity contact are arranged in sequence from the enclosure aperture to the distal end of the cavity.
- In a further aspect, the application is directed to an electronic device incorporating the audio jack, comprising a rigid, non-conductive case defining an aperture centered on the on the enclosure aperture and having a diameter smaller than the second diameter; and a stopping surface placed so as to abut and complement the non-conductive member of the enclosure and absorb any force on the audio jack along the longitudinal axis.
-
FIG. 1 andFIG. 2 show an exemplary embodiment of an audio jack with EMI shielding. In this embodiment, the jack comprises two distinct pieces: aconductive shielding 100 substantially enclosing anon-conductive enclosure 200. - The
enclosure 200 is formed from a non-conductive material such as a hard plastic. Theenclosure 200 is formed in this embodiment from a single piece of plastic. It is substantially a rectangular prism with an angled front face. Theenclosure 200 defines ahollow cavity 202 shaped to accommodate an electrical connector, namely an audio plug of the TRS (“tip-ring-sleeve”) or TRRS (“tip-ring-ring-sleeve”) variety. The shape of thecavity 202 is substantially complementary to the shape of the audio plug, and the front face of theenclosure 200 defines anaperture 204 through which a plug can be inserted into thecavity 202 along thelongitudinal axis 230 of thecavity 202. The elliptical shape of thisaperture 204 is such that, viewed along thelongitudinal axis 230 of thecavity 202, it presents a circular profile corresponding fairly closely to the diameter of a corresponding audio plug. - Within the
cavity 202 are one or more electrical contacts designed to communicate electrically with corresponding contacts on an inserted plug; the front-most of these contacts is shown inFIG. 2 as afirst cavity contact 210. These cavity contacts extend into spring contacts adapted to connect to the surface of a printed circuit board (PCB) of a device in which the jack is mounted. In this embodiment, five such spring contacts are shown, comprising a firstPCB spring contact 218, a secondPCB spring contact 220, a thirdPCB spring contact 222, a fourthPCB spring contact 224, and a fifthPCB spring contact 226. Each of these spring contacts may be an extension of one or more of the cavity contacts, such as thefirst cavity contact 210, and a single cavity contact may extend into more than one spring contact. Alternatively, one or more of these spring contacts may be an extension of an electrical component within theenclosure 200 other than one of the cavity contacts. - The
shielding 100 is formed from a conductive material, such as copper, gold, or another metal, that acts to block EMI. Theshielding 100 has five faces that substantially enclose five sides of theenclosure 200. These faces are designated herein with reference to their general orientation inFIG. 1 : abottom face 102, aback face 104, afront face 106, aleft face 108, and aright face 110. The top of the enclosure 200 (given the orientation ofFIG. 1 ) is at least partially exposed, showing the non-conductive material from which theenclosure 200 is formed. Theshielding 100 in this embodiment is formed from a single sheet of conductive material, which is stamped out in a specific shape, then folded and crimped to form the final shape. Thefront face 106 of theshielding 100 defines anelliptical aperture 114 larger than the diameter of a corresponding audio plug. This elliptical shape is slightly larger than that of the of theenclosure aperture 204, leaving a small gap between the inside circumference of theshielding aperture 114 and the circumference of theenclosure aperture 204, thereby preventing an inserted plug from coming into electrical contact with theshielding 100. It will be appreciated that although thecavity 202 is substantially cylindrical, theapertures front face 106. - The
bottom face 102 of theshielding 100 defines an opening through which amechanical stopping pin 208 of theenclosure 200 protrudes. Thefront face 106 of theshielding 100 is secured to theenclosure 200 in part through aclip 116 that extends around the corner between the front and top surfaces of theenclosure 200. - The
shielding 100 additionally comprises agrounding spring contact 112 extending from theshielding 100 proximal to thefront face 106 of theshielding 100 and to theshielding aperture 114. Thegrounding spring contact 112 is adapted to connect to the grounding plane of a PCB on which the jack is mounted and to thereby ground theshielding 100 to the resident device's system ground. The proximity of thegrounding spring contact 112 to thefront face 106 andshielding aperture 114 minimizes the interference effects created in the event of a spark discharge from an inserted plug due to electrostatic buildup on the plug: any plug which discharges an electrostatic charge into theshielding 100 by sparking over the gap between theshielding aperture 114 and theenclosure aperture 204 will have the charge grounded immediately to the system ground via thegrounding spring contact 112 without creating a current through the length of theshielding 100 during the discharge. Furthermore, the use of a singlegrounding spring contact 112 instead of multiple such contacts reduces the risk of ground loops and other unwanted electrical artifacts within theshielding 100. -
FIG. 3 shows the exemplary embodiment of the audio jack fromFIGS. 1 and 2 mounted on thePCB 302 of an exemplary electronic device. Thegrounding spring contact 112 is shown in contact with the grounding plane of thePCB 302, while the variousPCB spring contacts PCB 302. Here, thebottom face 102 of theshielding 100 is visible, with the mechanical stoppingpin 208 of theenclosure 200 protruding upward. Asecond cavity contact 212 is here visible, deeper within the cavity than thefirst cavity contact 210. -
FIG. 4 shows the exemplary audio jack ofFIGS. 1 to 3 mounted within an exemplaryelectronic device 300, with more components of thedevice 300 in place than inFIG. 3 . Here, a portion of theouter case 306 of the device is shown covering thefront face 106 of theshielding 100 and defining acase aperture 308 with the same cross-sectional profile as theenclosure aperture 204 viewed along thelongitudinal axis 230 of theenclosure cavity 202. This match between thecase aperture 308 and theenclosure aperture 204 ensures that an inserted plug cannot come into contact with theshielding 100, which has anaperture 114 larger in circumference than the other two. Thus, the only electrical communication between an inserted plug and theshielding 100 would be as a result of a spark jumping the gap between the plug surface and the edge of theshielding aperture 114. -
FIG. 5 shows a cross-sectional view of theenclosure cavity 202 of the exemplary audio jack ofFIGS. 1 to 4 in the context of an exemplaryelectronic device 300. The jack is here shown with itsbottom face 102 facing downward and thePCB 302 of thedevice 300 positioned above the top surface of theenclosure 200. The fourthPCB spring contact 224 is shown in contact with thePCB 302. Theclip 116 retaining thefront face 106 of the shielding 100 to theenclosure 200 is shown curving around the corner of theenclosure 200. The gap between the shieldingaperture 114 and theenclosure aperture 204 is also apparent in this view, as is the correspondence between the size of theenclosure aperture 204 and thecase aperture 308. Thedevice case 306, formed out of a non-conductive material such as hard plastic, encloses the various components of thedevice 300. - An
exemplary audio plug 400 is also shown here inserted into theenclosure cavity 202. Theaudio plug 400 is of a TRRS type, having an elongate cylindrical shape split up by insulating rings to form four separate contacts (tip, ring, ring, and sleeve). The contact most proximal to thebase 418 of theplug 400 is theplug sleeve contact 410. This is separated by a firstinsulating ring 416 from asecond plug contact 408 in the shape of a conductive ring, which is in turn separated by a secondinsulating ring 414 from athird plug contact 406, also in the shape of a ring, which is finally separated by a thirdinsulating ring 412 from theplug tip contact 404 at thedistal end 402 of theplug 400. In the exemplary embodiments of the audio jack described above, theplug sleeve contact 410 is in electrical communication with thefirst cavity contact 210 when theplug 400 is fully inserted into thecavity 202, and thesecond plug contact 408 is in electrical communication with thesecond cavity contact 212. Thethird plug contact 406 and plugtip contact 404 are also in electrical communication with a third cavity contact and end cavity contact (not shown), respectively. - A further feature of the audio jack shown in
FIG. 5 is the mechanism by which it is maintained in place within thedevice 300 housing. Theenclosure 200 has a mechanical stoppingpin 208 which protrudes through an opening in thebottom face 102 of the shielding 100 to hold the jack in place and resist longitudinal forces from anplug 400 inserted along thelongitudinal axis 230 of thecavity 202. This stoppingpin 208 acts in concert with a chamferedrear end 206 of thecavity 202 having a shape complementary to theplug tip 402. When thetip 402 of theplug 400 comes into contact with therear end 206 of thecavity 202, any further force of insertion along thelongitudinal axis 230 of thecavity 202 is absorbed by the stoppingpin 208 held in place by a complementary stoppingsurface 304 of thedevice 300. - This stopping mechanism has a dual purpose. First, it prevents any force from being transferred to the
rear surface 310 of the device housing in which the jack is situated. This may be important to prevent damage or wear to components located near therear surface 310 of the housing. In particular, therear surface 310 may be an integral part of another component of thedevice 300 that may be degraded by repeated contact forces. For example, the component may house gaskets or other sealing elements that may be dislodged or compromised by repetitive impact forces. Second, the stopping mechanism allows a small gap to be maintained between the outside surface of thedevice case 306 and thebase 418 of theplug 400. In this exemplary embodiment, theplug 400 has a base 418 wider than its sleeve; without the stopping mechanism in place, the plug might be inserted so far as to bring thebase 418 of theplug 400 into direct contact with thedevice case 306. This might have detrimental effects on theplug 400 and/ordevice 300, whereas leaving a small gap between them creates tolerances and prevents damage caused by contact between these two surfaces. - Many audio connectors include a non-conductive extender surrounding a plug aperture and extending to the exterior of the device case. The exemplary embodiments of the audio jack described above differ from this design in that there is no extender, and no part of the jack other than the interior of the
cavity 202 is visible from the outside of thedevice 300. This is a consequence of the circumference of thecase aperture 308 substantially matching that of theenclosure aperture 204, leaving no gap for interposition of an extender. The thickness of thedevice case 300 instead fulfills substantially the same function as a non-conductive extender, and results in an entire audio jack assembly with a shorter length than a typical extended audio jack. - In some embodiments, the different plug contacts may carry various audio signals, including speaker signals and microphone signals. For example, the
plug tip contact 404 may receive a left stereo speaker signal that is conveyed from a cavity end contact, and which is in turn conveyed from one of the PCB spring contacts, such as the fourthPCB spring contact 224. This fourthPCB spring contact 224 in such an embodiment would be mounted on thePCB 302 in communication with a left stereo speaker lead on thePCB 302, thereby receiving the left stereo speaker signal from an audio subsystem of thedevice 300. By the same token, thethird plug contact 406 might carry a right stereo speaker signal, which would be conveyed through a third cavity contact and the thirdPCB spring contact 222 from a right stereo speaker lead on thePCB 302. Thesecond plug contact 408 in such an embodiment might serve as a grounding contact, connecting theplug 400 to a system ground or separate audio ground for thedevice 300 via thesecond cavity contact 212 and the secondPCB spring contact 220. Theplug sleeve contact 410 might carry a microphone signal and convey it through thefirst cavity contact 210 to the firstPCB spring contact 218 and thence to a microphone signal lead on thePCB 302, feeding into the audio subsystem of thedevice 300. In such an embodiment, thefirst cavity contact 210 might serve some additional purpose as well, such as protecting against electrostatic discharge by communicating with an electrostatic discharge protection component of thedevice 300. Alternatively, the functions of the various cavity contacts and PCB spring contacts might be rearranged depending on the convention used in thedevice 300 and theplug 400. - In some embodiments, the cavity contacts may be placed so as to prevent the
plug sleeve contact 410 from coming into electrical communication with any of the cavity contacts when theplug 400 is fully inserted. Thefirst cavity contact 210 may come into electrical communication with thesecond plug contact 408 instead of theplug sleeve contact 410, and the other cavity contacts may correspondingly come into electrical communication with different plug contacts as well. - Some embodiments may use one of the PCB spring contacts to convey a non-audio signal, such as a signal indicating that the plug has been inserted. Alternatively, one or more of the PCB spring contacts could be used to ground the plug and/or to connect one or more contacts of the plug sleeve to additional electrical components of the PCB, such as an electrostatic discharge element. In some embodiments, one or more of the PCB spring contacts may be formed integrally with the shielding 100 or may be in electrical communication with the shielding 100, thereby using the
grounding spring contact 112 of the shielding 100 to ground any element in communication with that PCB spring contact. It will be further appreciated that the various spring contacts, including thegrounding spring contact 112, may take different forms in other embodiments, such as pins adapted for soldering to a printed circuit board. - In an alternate embodiment, the jack is not an audio jack, but is a shielded enclosure for some other type of electrical connector carrying one or more analog and/or digital signals.
- In a further alternate embodiment, the mechanical stopping
pin 208 may have a shape different from a pin and may come into contact with a complementary structure of thedevice 300 to hold the jack in place. Different embodiments may have the mechanical stoppingpin 208 or other stopping element protruding from different surfaces of the audio jack, and/or protruding in different directions. In some embodiments, the stopping element may be formed from a separate piece of material from the enclosure. - The various embodiments presented above are merely examples and are in no way meant to limit the scope of this disclosure. Variations of the innovations described herein will be apparent to persons of ordinary skill in the art, such variations being within the intended scope of the present application. In particular, features from one or more of the above-described embodiments may be selected to create alternative embodiments comprised of a sub-combination of features which may not be explicitly described above. In addition, features from one or more of the above-described embodiments may be selected and combined to create alternative embodiments comprised of a combination of features which may not be explicitly described above. Features suitable for such combinations and sub-combinations would be readily apparent to persons skilled in the art upon review of the present application as a whole. The subject matter described herein and in the recited claims intends to cover and embrace all suitable changes in technology.
Claims (12)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US12/573,668 US8215989B2 (en) | 2009-10-05 | 2009-10-05 | Audio jack with EMI shielding |
US13/492,376 US9153919B2 (en) | 2009-10-05 | 2012-06-08 | Audio jack with EMI shielding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US12/573,668 US8215989B2 (en) | 2009-10-05 | 2009-10-05 | Audio jack with EMI shielding |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US13/492,376 Continuation US9153919B2 (en) | 2009-10-05 | 2012-06-08 | Audio jack with EMI shielding |
Publications (2)
Publication Number | Publication Date |
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US20110081022A1 true US20110081022A1 (en) | 2011-04-07 |
US8215989B2 US8215989B2 (en) | 2012-07-10 |
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US12/573,668 Active 2030-08-06 US8215989B2 (en) | 2009-10-05 | 2009-10-05 | Audio jack with EMI shielding |
US13/492,376 Active 2031-05-04 US9153919B2 (en) | 2009-10-05 | 2012-06-08 | Audio jack with EMI shielding |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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US13/492,376 Active 2031-05-04 US9153919B2 (en) | 2009-10-05 | 2012-06-08 | Audio jack with EMI shielding |
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US (2) | US8215989B2 (en) |
Cited By (12)
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US20120051025A1 (en) * | 2010-08-31 | 2012-03-01 | Apple Inc. | Connector assembly |
US8602801B2 (en) * | 2012-02-23 | 2013-12-10 | Hewlett-Packard Development Company, L.P. | Electrical jack |
US20130329324A1 (en) * | 2012-06-09 | 2013-12-12 | Apple Inc. | Esd path for connector receptacle |
WO2014020232A1 (en) | 2012-07-30 | 2014-02-06 | Nokia Corporation | Audio-visual connector |
WO2014043716A2 (en) * | 2011-06-10 | 2014-03-20 | Aliphcom | Component protective overmolding using protective external coatings |
US8717748B2 (en) * | 2012-06-08 | 2014-05-06 | Apple Inc. | Audio jack for portable computing device |
US8920197B2 (en) | 2012-03-14 | 2014-12-30 | Apple Inc. | Connector receptacle with ground contact having split rear extensions |
US20160072236A1 (en) * | 2014-09-04 | 2016-03-10 | Stephen John Rois | Connecting plugs to jacks of electronic devices |
US20160095204A1 (en) * | 2014-09-30 | 2016-03-31 | Apple Inc. | 3d flex soldering |
US20160141779A1 (en) * | 2014-11-14 | 2016-05-19 | Sony Corporation | Jack socket and electronic device |
WO2017091687A1 (en) * | 2015-11-25 | 2017-06-01 | ExtraTech Systems, LLC | Esd tester |
DE102020209544A1 (en) | 2020-07-29 | 2022-02-03 | Robert Bosch Gesellschaft mit beschränkter Haftung | Electrical connector, circuit assembly and method of forming a circuit assembly |
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CN202004277U (en) * | 2010-11-29 | 2011-10-05 | 鸿富锦精密工业(深圳)有限公司 | Audio interface device |
US8668528B2 (en) | 2011-10-28 | 2014-03-11 | Apple Inc. | Split jack assemblies and methods for making the same |
KR101923472B1 (en) * | 2011-12-06 | 2018-11-29 | 엘지전자 주식회사 | Socket module and terminal having the same |
US9467766B2 (en) * | 2013-09-24 | 2016-10-11 | Xiaomi Inc. | Connection member for connecting headset plug, headset jack and electronic device |
CN106415944A (en) | 2014-04-23 | 2017-02-15 | 泰科电子公司 | Electrical connector with shield cap and shielded terminals |
CN204144492U (en) * | 2014-08-22 | 2015-02-04 | 富士康(昆山)电脑接插件有限公司 | Socket connector |
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Also Published As
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US20120250911A1 (en) | 2012-10-04 |
US9153919B2 (en) | 2015-10-06 |
US8215989B2 (en) | 2012-07-10 |
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