US20110088254A1 - Manufacture of waterproof wire connectors - Google Patents
Manufacture of waterproof wire connectors Download PDFInfo
- Publication number
- US20110088254A1 US20110088254A1 US12/928,843 US92884310A US2011088254A1 US 20110088254 A1 US20110088254 A1 US 20110088254A1 US 92884310 A US92884310 A US 92884310A US 2011088254 A1 US2011088254 A1 US 2011088254A1
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- Prior art keywords
- gel
- gel precursor
- temperature
- precursor
- heat transfer
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000002243 precursor Substances 0.000 claims abstract description 107
- 238000012546 transfer Methods 0.000 claims description 29
- 239000000203 mixture Substances 0.000 claims description 20
- 230000003028 elevating effect Effects 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 abstract description 21
- 238000010438 heat treatment Methods 0.000 abstract description 18
- 239000000499 gel Substances 0.000 description 130
- 238000000034 method Methods 0.000 description 18
- 238000000926 separation method Methods 0.000 description 8
- 238000013459 approach Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/22—End caps, i.e. of insulating or conductive material for covering or maintaining connections between wires entering the cap from the same end
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5216—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/34—Applying different liquids or other fluent materials simultaneously
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49176—Assembling terminal to elongated conductor with molding of electrically insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4922—Contact or terminal manufacturing by assembling plural parts with molding of insulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/532—Conductor
- Y10T29/53209—Terminal or connector
Definitions
- This invention relates generally to manufacturing waterproof wire connectors and, more specifically, to a process and apparatus for manufacturing wire connectors with cured gels.
- a viscous sealant such as a silicone in a wire connector to waterproof the wire connector
- Examples of use of viscous sealants in twist-on wire connectors is shown in King U.S. Pat. No. 5,113,037.
- Other types of silicones such as silicone gels, which cure to a soft gel like consistency are used for protecting extremely delicate electronic components from shock and vibration as well as waterproofing the encapsulated components.
- the silicone gels have a tacky surface and form a mechanical bond to most surfaces making them ideal for vibration protection.
- the viscous sealants which remain in a viscous state, require no curing phase and can be injected directly into a wire connector while the conventional method of creating gels, which are made from mixing two components, require a curing phase that requires additional handling and processing.
- the known process for formation of the silicone gels includes the mixing of a first silicone gel precursor with a second silicone gel precursor and then curing the gel mixture at an elevated temperature for a period of time.
- the gel mixtures are cured by heating the gel mixture and maintaining the gel mixture at temperatures ranging from 25° C. to 150° C. at times ranging from 5 minutes to 24 hours.
- the shorter cure times are used with gel mixtures that are cured at higher temperatures and the longer cure times are used with gel mixtures that are cured at lower temperatures which can require a separate or isolated curing of the product and the gel.
- a silicone gel mixture is used in small amounts, for example in wire connectors such as twist-on wire connectors, oftentimes the silicone gel mixture may not cure properly.
- Another difficulty in manufacturing wire connectors with gels is that curing the gel mixture by heating the wire connector and the gel mixture renders the manufacturing process more difficult and more costly.
- Another manufacturing difficulty is that it has been found that when small amounts of a gel mixture are cured by the prior art proscribed curing process separation of the cured gel mixture can occur which leaves an oily film on the cured gel mixture oftentimes making it unacceptable for use in wire connectors.
- a method and apparatus for manufacturing gel filled wire connectors where the wire connector remains at room temperature and the gel mixture in the wire connector cures to an unseparated state through a process of elevating the temperature of the gel precursors before dispensing the mixed gel precursors into the cavity of a wire connector, which can remain at room temperature, as the mixed gel precursors are allowed to cool and self cure in the wire connector.
- FIG. 1 is a schematic of a system for dispensing gel precursors into the cavity of a wire connector
- FIG. 2 is a partial sectional view of a twist on wire connector
- FIG. 3 is a sectional view of the needle nozzle.
- FIG. 1 is a partial schematic of a system 10 for dispensing a mixed heated silicone gel precursor into the cavity of a wire connector to form a wire connector with a gel therein without having to separately cure the gel in the wire connector.
- System 10 includes a base member 11 that supports a container 12 containing a first silicone gel precursor 17 and a container 13 that contains a second silicone gel precursor 18 .
- a source of compressed air 14 connects to base 11 to allow the container 12 to be pressurized and thereby cause the gel precursor 17 in container 12 to flow through hose 20 .
- the source of compressed air 14 allows container 13 to be pressurized to cause the gel precursor 18 in container 13 to flow through hose 21 .
- System 10 includes a first heat transfer member 20 for simultaneously heating and transferring the gel precursor in container 12 to an unheated dispensing valve 23 .
- Heat transfer member 20 provides on the go heating of the first gel precursor 17 and may for example comprise a heated hose 20 that extends between container 12 and dispensing valve 23 .
- heat transfer member 21 provides for simultaneously heating and transferring the gel precursor in container 13 to a dispensing valve 23 .
- Heat transfer member 21 provides for on the go heating of the second gel precursor 18 and may for example also comprise a heated hose 21 that extends between container 13 and dispensing valve 23 .
- heat transfer member 20 provides on the go heating of gel precursor 17 as the gel precursor travels from container 12 to dispensing valve 23 and similarly, heat transfer member 21 provides for on the go heating of gel precursor 18 as the gel travels from container 13 to dispensing valve 23 although other methods and means of heating the gel precursors may be used which do not use on the go heating.
- An example of heat transfer members suitable for use herein are heated hoses which are commercially available from suppliers of hoses and can include a resistance heater located along the length of the hose.
- the dispensing valve 23 which receives the heated gel precursors 17 and 18 is shown in section in FIG. 3 and includes a first chamber 36 containing gel precursor 17 and a second chamber 35 containing gel precursor 18 .
- a remote controlled shut off valve 38 at the bottom of chamber 36 allows one to open and close port 39 to thereby control the delivery of precursor 17 to the needle nozzle 24 .
- a remote controlled shut off valve 37 at the bottom of chamber 35 allows one to open and close port 40 to thereby control the delivery of precursor 18 to needle nozzle 24 .
- Shut off valves 37 and 38 are remotely controlled by means such as by solenoids or the like (not shown).
- FIG. 3 illustrates that the precursor 18 exits port 40 as a cylindrical strand 18 a and that precursor 17 similarly exits port 39 as a cylindrical strand 17 a .
- the needle nozzle 14 mixing occurs.
- the precursor 17 and precursor 18 reach the terminus end of the needle nozzle (designated by M x ) the precursor 17 and precursor 18 are mixed to form the mixed gel precursor 27 that is injected into a wire connecter.
- the heated gel precursor 17 in hose 20 and the heated gel precursor 18 in hose 21 are mixed in needle nozzle 24 immediately prior to dispensing from needle nozzle 24 to form a heated mixed gel precursor 27 .
- the heated mixed gel precursor 27 is then dispensed directly into a cavity or chamber in a wire connector 26 as illustrated in FIG. 1 .
- the gel precursors while heated above room temperature are kept in a heated and separate state until immediately prior to injection into the cavity of the wire connector.
- a plurality of wire connecters such as twist on wire connectors 26
- a moving support such as a conveyor 25 that moves wire connector 26 beneath the nozzle 24 so that the wire connector 26 is in a position to receive a charge of the heated mixed gel precursor 27 from nozzle 24 .
- the dispensing valve 23 is set for intermittent dispensing of the mixed gel precursor 27 by a controller (not shown) which opens and closes valves 37 and 38 .
- the nozzle 24 dispenses a charge of heated mixed gel precursor when wire connector 26 is located in a charge position beneath the needle nozzle 24 and suspends or interrupts dispensing to simultaneously allow the gel filled wire connector to move away from the charge position beneath nozzle 24 while an empty wire connector is moved to a charge or gel receiving position below needle nozzle 24 .
- the wire connectors 26 are twist on wire connectors having an open top and a spiral coil in the connector for engaging and securing wires therein. Although twist on wire connectors are shown other types of wire connectors may be filled by the apparatus and method of the present invention.
- the mixed heated gel precursor 27 is dispensed directly into the cavity of the twist on wire connectors 26 and cures in the wire connector which can remain at room temperature (typically about 20° C.), thus eliminating the need to heat the wire connectors or allow excessive time for an ambient cure that disrupts a normal manufacturing process.
- room temperature typically about 20° C.
- the process as described has been found to eliminate gel separation that can occur when a gel mixture is cured by the gel manufactures proscribed process. While needle nozzles are described herein other types of dispensers of nozzles that can mix the gel precursors may also be used.
- FIG. 2 is a partial sectional view of a twist on wire connector 26 revealing a cavity or chamber 26 a in the twist on wire connector 26 with the heated mixed gel precursor 27 therein.
- a twist on wire connector 26 is illustrated other types of wire connectors may be filled with a heated premixed silicone gel.
- the method may be used for injecting damping materials into wire connectors or other devices.
- the method includes injecting a heated mixed silicone gel precursor 27 into a cavity 26 a of wire connector 26 to form a silicone gel in a wire connector where the gel therein remains in an unseparated state therein.
- a heated mixed silicone gel precursor 27 into a cavity 26 a of wire connector 26 to form a silicone gel in a wire connector where the gel therein remains in an unseparated state therein.
- To heat the gel precursors one may direct a first gel precursor at room temperature through a heat transfer member maintained at a temperature in the range of about 45 C to 65 C at a flow rate that allows the first gel precursor to approach the temperature of the heat transfer member as the first gel precursor exits the heat transfer member and may also direct a second gel precursor at room temperature through a separate heat transfer member also maintained at a temperature in the range of about 45 C to 65 C at a flow rate that allows the second gel precursor to approach the temperature of the second heat transfer member as the second gel precursor exits the separate heat transfer member.
- a feature of the manufacturing process using system 10 is that it allows one to store two separate gel precursors at room temperature (typically about 20 degrees C.) and then in an on-the-go process temporarily heat the two separate gel precursors as they flow to a dispensing valve 23 which eliminates the need to heat the entire gel precursors.
- neither the dispensing valve 23 or the wire connectors 26 require heating to cure the gel in the wire connector thus eliminating the need for additional heating and at the same time avoiding gel separation that can occur with conventional curing that may render the wire connector unsuitable for use.
- the gel separation with conventional curing of silicone gel has been found to be more pronounced when the charge of dispensed gel is small. While there is no abrupt transition as to the size of the charge where gel separation occurs generally a more noticeable separation occurs when the charge is about 10 grams or less.
- the method includes directing the first gel precursor at the room temperature through a heat transfer member 20 which is maintained at a temperature in the range of about 45 C to 65 C at a rate that allows the first gel precursor to approach the temperature of the heat transfer member.
- the process of manufacturing a gel filled wire connector includes the steps of heating the gel precursors to the proper temperature and mixing the first gel precursor at a temperature approaching the temperature of the first heat transfer member 20 with the second gel precursor at the temperature approaching the temperature of the second heat transfer member 21 to form a heated mixed gel precursor 27 in a dispensing valve 23 .
- the heated mixed gel precursor can self cure at room temperature without additional heat to thereby produce a gel containing wire connector wherein the gel 27 in the wire connector remains in an unseparated state during the shelf life of the gel. While the gel precursors are mixed in an unheated needle nozzle 24 in some instances one may want to heat the needle nozzle.
- the invention herein provides a method and apparatus for eliminating the undesirable separation of cured silicone gels in wire connectors.
Abstract
A method of manufacturing gel containing wire connectors with a silicone gel that remains in an unseparated state wherein the temperature of the gel precursors are elevated before being mixed and dispensed into the cavity of a wire connector where the mixed gel precursors are allowed to cool and cure without the necessity of additional heating of either the mixed gel precursors or the wire connector.
Description
- This invention relates generally to manufacturing waterproof wire connectors and, more specifically, to a process and apparatus for manufacturing wire connectors with cured gels.
- None
- None
- None
- The concept of using a viscous sealant such as a silicone in a wire connector to waterproof the wire connector is known in the art. Examples of use of viscous sealants in twist-on wire connectors is shown in King U.S. Pat. No. 5,113,037. Other types of silicones such as silicone gels, which cure to a soft gel like consistency are used for protecting extremely delicate electronic components from shock and vibration as well as waterproofing the encapsulated components. Generally, the silicone gels have a tacky surface and form a mechanical bond to most surfaces making them ideal for vibration protection. The viscous sealants, which remain in a viscous state, require no curing phase and can be injected directly into a wire connector while the conventional method of creating gels, which are made from mixing two components, require a curing phase that requires additional handling and processing.
- The known process for formation of the silicone gels includes the mixing of a first silicone gel precursor with a second silicone gel precursor and then curing the gel mixture at an elevated temperature for a period of time. Typically, the gel mixtures are cured by heating the gel mixture and maintaining the gel mixture at temperatures ranging from 25° C. to 150° C. at times ranging from 5 minutes to 24 hours. Generally, the shorter cure times are used with gel mixtures that are cured at higher temperatures and the longer cure times are used with gel mixtures that are cured at lower temperatures which can require a separate or isolated curing of the product and the gel. Also when a silicone gel mixture is used in small amounts, for example in wire connectors such as twist-on wire connectors, oftentimes the silicone gel mixture may not cure properly. Another difficulty in manufacturing wire connectors with gels is that curing the gel mixture by heating the wire connector and the gel mixture renders the manufacturing process more difficult and more costly. Another manufacturing difficulty is that it has been found that when small amounts of a gel mixture are cured by the prior art proscribed curing process separation of the cured gel mixture can occur which leaves an oily film on the cured gel mixture oftentimes making it unacceptable for use in wire connectors.
- A method and apparatus for manufacturing gel filled wire connectors where the wire connector remains at room temperature and the gel mixture in the wire connector cures to an unseparated state through a process of elevating the temperature of the gel precursors before dispensing the mixed gel precursors into the cavity of a wire connector, which can remain at room temperature, as the mixed gel precursors are allowed to cool and self cure in the wire connector.
-
FIG. 1 is a schematic of a system for dispensing gel precursors into the cavity of a wire connector; -
FIG. 2 is a partial sectional view of a twist on wire connector; and -
FIG. 3 is a sectional view of the needle nozzle. -
FIG. 1 is a partial schematic of asystem 10 for dispensing a mixed heated silicone gel precursor into the cavity of a wire connector to form a wire connector with a gel therein without having to separately cure the gel in the wire connector.System 10 includes a base member 11 that supports acontainer 12 containing a firstsilicone gel precursor 17 and acontainer 13 that contains a secondsilicone gel precursor 18. A source of compressedair 14 connects to base 11 to allow thecontainer 12 to be pressurized and thereby cause thegel precursor 17 incontainer 12 to flow throughhose 20. Similarly, the source of compressedair 14 allowscontainer 13 to be pressurized to cause thegel precursor 18 incontainer 13 to flow throughhose 21. Silicone gels that are formed from two or more separate gel precursors are commercially available from various United States suppliers.System 10 includes a firstheat transfer member 20 for simultaneously heating and transferring the gel precursor incontainer 12 to anunheated dispensing valve 23.Heat transfer member 20 provides on the go heating of thefirst gel precursor 17 and may for example comprise aheated hose 20 that extends betweencontainer 12 and dispensingvalve 23. Similarly,heat transfer member 21 provides for simultaneously heating and transferring the gel precursor incontainer 13 to a dispensingvalve 23.Heat transfer member 21 provides for on the go heating of thesecond gel precursor 18 and may for example also comprise aheated hose 21 that extends betweencontainer 13 and dispensingvalve 23. In the example shownheat transfer member 20 provides on the go heating ofgel precursor 17 as the gel precursor travels fromcontainer 12 to dispensingvalve 23 and similarly,heat transfer member 21 provides for on the go heating ofgel precursor 18 as the gel travels fromcontainer 13 to dispensingvalve 23 although other methods and means of heating the gel precursors may be used which do not use on the go heating. An example of heat transfer members suitable for use herein are heated hoses which are commercially available from suppliers of hoses and can include a resistance heater located along the length of the hose. - The dispensing
valve 23, which receives the heatedgel precursors FIG. 3 and includes afirst chamber 36 containinggel precursor 17 and a second chamber 35 containinggel precursor 18. A remote controlled shut offvalve 38 at the bottom ofchamber 36 allows one to open and closeport 39 to thereby control the delivery ofprecursor 17 to theneedle nozzle 24. Similarly, a remote controlled shut offvalve 37 at the bottom of chamber 35 allows one to open and closeport 40 to thereby control the delivery ofprecursor 18 to needlenozzle 24. Shut offvalves -
FIG. 3 illustrates that theprecursor 18exits port 40 as acylindrical strand 18 a and thatprecursor 17 similarly exitsport 39 as acylindrical strand 17 a. As the stands proceeds down theneedle nozzle 14 mixing occurs. When theprecursor 17 andprecursor 18 reach the terminus end of the needle nozzle (designated by Mx) theprecursor 17 andprecursor 18 are mixed to form the mixedgel precursor 27 that is injected into a wire connecter. - As can be seen in
FIG. 1-FIG . 3, the heatedgel precursor 17 inhose 20 and the heatedgel precursor 18 inhose 21 are mixed inneedle nozzle 24 immediately prior to dispensing fromneedle nozzle 24 to form a heated mixedgel precursor 27. The heated mixedgel precursor 27 is then dispensed directly into a cavity or chamber in awire connector 26 as illustrated inFIG. 1 . As can be seen from the above the gel precursors while heated above room temperature are kept in a heated and separate state until immediately prior to injection into the cavity of the wire connector. - In operation of the manufacturing system 10 a plurality of wire connecters, such as twist on
wire connectors 26, are held in an upright position on a moving support such as aconveyor 25 that moveswire connector 26 beneath thenozzle 24 so that thewire connector 26 is in a position to receive a charge of the heated mixedgel precursor 27 fromnozzle 24. Typically, the dispensingvalve 23 is set for intermittent dispensing of the mixedgel precursor 27 by a controller (not shown) which opens and closesvalves nozzle 24 dispenses a charge of heated mixed gel precursor whenwire connector 26 is located in a charge position beneath theneedle nozzle 24 and suspends or interrupts dispensing to simultaneously allow the gel filled wire connector to move away from the charge position beneathnozzle 24 while an empty wire connector is moved to a charge or gel receiving position belowneedle nozzle 24. In the embodiment shown thewire connectors 26 are twist on wire connectors having an open top and a spiral coil in the connector for engaging and securing wires therein. Although twist on wire connectors are shown other types of wire connectors may be filled by the apparatus and method of the present invention. In thesystem 10 the mixed heatedgel precursor 27 is dispensed directly into the cavity of the twist onwire connectors 26 and cures in the wire connector which can remain at room temperature (typically about 20° C.), thus eliminating the need to heat the wire connectors or allow excessive time for an ambient cure that disrupts a normal manufacturing process. The process as described has been found to eliminate gel separation that can occur when a gel mixture is cured by the gel manufactures proscribed process. While needle nozzles are described herein other types of dispensers of nozzles that can mix the gel precursors may also be used. -
FIG. 2 is a partial sectional view of a twist onwire connector 26 revealing a cavity orchamber 26 a in the twist onwire connector 26 with the heated mixedgel precursor 27 therein. Although a twist onwire connector 26 is illustrated other types of wire connectors may be filled with a heated premixed silicone gel. In addition the method may be used for injecting damping materials into wire connectors or other devices. - Thus, the method includes injecting a heated mixed
silicone gel precursor 27 into acavity 26 a ofwire connector 26 to form a silicone gel in a wire connector where the gel therein remains in an unseparated state therein. To heat the gel precursors one may direct a first gel precursor at room temperature through a heat transfer member maintained at a temperature in the range of about 45 C to 65 C at a flow rate that allows the first gel precursor to approach the temperature of the heat transfer member as the first gel precursor exits the heat transfer member and may also direct a second gel precursor at room temperature through a separate heat transfer member also maintained at a temperature in the range of about 45 C to 65 C at a flow rate that allows the second gel precursor to approach the temperature of the second heat transfer member as the second gel precursor exits the separate heat transfer member. One then mixes the first gel precursor, which is at a temperature approaching the temperature of the first heat transfer member, with the second gel precursor, which is at a temperature approaching the temperature of the second heat transfer member to form a heated mixed gel precursor in a chamber 23 a of the dispensingvalve 23 where the temperature of both gels before mixture are the same or about the same. Next, one dispenses the heated mixedgel precursor 27 into a cavity of awire connector 26 and cures the mixed gel precursor without heating the wire connector, which is at room temperature, to produce a gel containingwire connector 26 wherein the gel in the wire connector remains in an unseparated state during the shelf life of the gel. It has been found that the method provides a cured gel that remain in an unseparated state i.e. no oily film if each of the gel precursors are heated sufficiently so that when the heated gel precursors are mixed they form a single heated mixed gel precursor that can be placed in a wire connector that need not be heated thereby eliminating a step of having to heat the wire connector to cure the gel. Although there is no bright line a temperature range of about 45° C. to 65° C. has been found an effective range for heating the gel precursors to enable formation of gel in a wire connector that remains in an unseparated state. Similarly, while no bright line a minimum temperature of about 25° C. above room temperature has been found effective for heating the gel precursors to enable formation of gel in a wire connector that remains in an unseparated state. - A feature of the manufacturing
process using system 10 is that it allows one to store two separate gel precursors at room temperature (typically about 20 degrees C.) and then in an on-the-go process temporarily heat the two separate gel precursors as they flow to a dispensingvalve 23 which eliminates the need to heat the entire gel precursors. In the present manufacturing process neither the dispensingvalve 23 or thewire connectors 26 require heating to cure the gel in the wire connector thus eliminating the need for additional heating and at the same time avoiding gel separation that can occur with conventional curing that may render the wire connector unsuitable for use. - With the method of the invention one can inject mixed silicone gel precursors into a cavity of an
empty wire connector 26 to form asilicone gel 27 wherein the gel therein remains in an unseparated state. Typically, the gel separation with conventional curing of silicone gel has been found to be more pronounced when the charge of dispensed gel is small. While there is no abrupt transition as to the size of the charge where gel separation occurs generally a more noticeable separation occurs when the charge is about 10 grams or less. - The method includes directing the first gel precursor at the room temperature through a
heat transfer member 20 which is maintained at a temperature in the range of about 45 C to 65 C at a rate that allows the first gel precursor to approach the temperature of the heat transfer member. Similarly, directing the second gel precursor at room temperature through a separateheat transfer member 21 maintained at a temperature in the range of about 45 C to 65 C at a rate that allows the second gel precursor to approach the temperature of the second heat transfer member. While the gel precursor are heated on the go as the gel precursor are transferred to a dispensing valve it is envisioned that other methods of heating the gel precursors prior to mixing the gel precursors may be used. - Thus the process of manufacturing a gel filled wire connector includes the steps of heating the gel precursors to the proper temperature and mixing the first gel precursor at a temperature approaching the temperature of the first
heat transfer member 20 with the second gel precursor at the temperature approaching the temperature of the secondheat transfer member 21 to form a heatedmixed gel precursor 27 in a dispensingvalve 23. One can then dispense the heatedmixed gel precursor 27 into acavity 26 a of awire connector 26 and then carry the wire connector with the mixed gel precursor to a storage bin for completion of the curing during the preparation of the product for shipping. - Once dispensed therein one can allow the heated mixed gel precursor to self cure at room temperature without additional heat to thereby produce a gel containing wire connector wherein the
gel 27 in the wire connector remains in an unseparated state during the shelf life of the gel. While the gel precursors are mixed in anunheated needle nozzle 24 in some instances one may want to heat the needle nozzle. - While the cause of the gel separation is not fully understood the invention herein provides a method and apparatus for eliminating the undesirable separation of cured silicone gels in wire connectors.
Claims (7)
1.-15. (canceled)
16. An apparatus for manufacturing a gel containing wire connector comprising:
a container for holding a first gel precursor;
a mixing valve;
a first heat transfer member for transferring the first gel precursor to the dispensing valve while elevating the temperature of the first gel precursor to a temperature approaching the temperature of the heat transfer member;
a second heat transfer member for transferring the second gel precursor to the dispensing valve while elevating the temperature of the second gel precursor to a temperature approaching the temperature of the second heat transfer member; and
a nozzle for receiving and mixing the first gel precursor and the second gel precursor and injecting a mixture of the first gel precursor and the second gel precursor into a wire connector.
17. The apparatus of claim 16 including a conveyor for carrying the wire connector to a position to receive the mixture of the first gel precursor and the second gel precursor and to carry the wire connector with the mixture of the first gel precursor and the second gel precursor to a storage bin for completion of the curing as the product is being prepared for shipment.
18. The apparatus of claim 16 wherein the first heat transfer member is a heated hose having a length sufficient so that the delivery of the first gel precursor through the heated hose is sufficient to bring the temperature of the first gel precursor to a temperature approaching the temperature of the heated hose as the first gel precursor discharges into the dispensing valve and the second heat transfer member is a heated hose having a length sufficient so that the delivery of the second gel precursor through the heated hose is sufficient to bring the temperature of the second gel precursor to a temperature approaching the temperature of the second heated hose as the second gel precursor discharges into the dispensing valve.
19. The apparatus of claim 16 including a plurality of twist on wire connectors held in an upright condition on a conveyor.
20. The apparatus of claim 18 including a pressure source for maintaining the first gel precursor and the second gel precursor at a pressure sufficient to force the first gel precursor and the second gel precursor into the dispensing valve.
21. The apparatus of claim 16 including a heater for maintaining the temperature of the first heat transfer member and the second heat transfer member at a temperature within the range of about 45 degrees C. to 65 degrees C.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/928,843 US20110088254A1 (en) | 2008-04-23 | 2010-12-21 | Manufacture of waterproof wire connectors |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/148,810 US7913383B1 (en) | 2008-04-23 | 2008-04-23 | Manufacture of waterproof wire connectors |
US12/928,843 US20110088254A1 (en) | 2008-04-23 | 2010-12-21 | Manufacture of waterproof wire connectors |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/148,810 Division US7913383B1 (en) | 2008-04-23 | 2008-04-23 | Manufacture of waterproof wire connectors |
Publications (1)
Publication Number | Publication Date |
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US20110088254A1 true US20110088254A1 (en) | 2011-04-21 |
Family
ID=43769741
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Application Number | Title | Priority Date | Filing Date |
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US12/148,810 Expired - Fee Related US7913383B1 (en) | 2008-04-23 | 2008-04-23 | Manufacture of waterproof wire connectors |
US12/928,843 Abandoned US20110088254A1 (en) | 2008-04-23 | 2010-12-21 | Manufacture of waterproof wire connectors |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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US12/148,810 Expired - Fee Related US7913383B1 (en) | 2008-04-23 | 2008-04-23 | Manufacture of waterproof wire connectors |
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US (2) | US7913383B1 (en) |
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WO2007147146A2 (en) * | 2006-06-16 | 2007-12-21 | Qualcomm Incorporated | Progressively broadcasting information in beacon signals |
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US3201685A (en) * | 1961-09-22 | 1965-08-17 | Remwood Chemical Company | Conductivity probe |
US3529320A (en) * | 1967-10-17 | 1970-09-22 | Westinghouse Electric Corp | Casting apparatus for encapsulating electrical conductors |
US5332313A (en) * | 1993-03-12 | 1994-07-26 | Dow Corning Corporation | Nozzle mixer assembly |
US5547713A (en) * | 1990-10-31 | 1996-08-20 | International Business Machines Corporation | Dual cure epoxy backseal formulation |
US5797546A (en) * | 1996-10-29 | 1998-08-25 | Morton International, Inc. | Weight-supported adjustable mixing and dispensing gun for two chemically reactive materials |
US20060048965A1 (en) * | 2004-09-09 | 2006-03-09 | Sumitomo Wiring Systems, Ltd. | Method and structure for waterproofing a terminal splice |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5357057A (en) * | 1982-10-12 | 1994-10-18 | Raychem Corporation | Protected electrical connector |
US4863535A (en) * | 1987-12-09 | 1989-09-05 | Minnesota Mining And Manufacturing Company | Electrical environmental sealant and method |
JP2970338B2 (en) * | 1993-09-22 | 1999-11-02 | 住友電装株式会社 | Automatic waterproofing device for wire connection |
US6267579B1 (en) * | 1998-12-23 | 2001-07-31 | Clinical Laboratory Development Group, Inc. | Apparatus for making a gradient gel |
US7956451B2 (en) * | 2004-12-18 | 2011-06-07 | Agere Systems Inc. | Packages for encapsulated semiconductor devices and method of making same |
-
2008
- 2008-04-23 US US12/148,810 patent/US7913383B1/en not_active Expired - Fee Related
-
2010
- 2010-12-21 US US12/928,843 patent/US20110088254A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3201685A (en) * | 1961-09-22 | 1965-08-17 | Remwood Chemical Company | Conductivity probe |
US3529320A (en) * | 1967-10-17 | 1970-09-22 | Westinghouse Electric Corp | Casting apparatus for encapsulating electrical conductors |
US5547713A (en) * | 1990-10-31 | 1996-08-20 | International Business Machines Corporation | Dual cure epoxy backseal formulation |
US5332313A (en) * | 1993-03-12 | 1994-07-26 | Dow Corning Corporation | Nozzle mixer assembly |
US5797546A (en) * | 1996-10-29 | 1998-08-25 | Morton International, Inc. | Weight-supported adjustable mixing and dispensing gun for two chemically reactive materials |
US20060048965A1 (en) * | 2004-09-09 | 2006-03-09 | Sumitomo Wiring Systems, Ltd. | Method and structure for waterproofing a terminal splice |
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US7913383B1 (en) | 2011-03-29 |
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