US20110088254A1 - Manufacture of waterproof wire connectors - Google Patents

Manufacture of waterproof wire connectors Download PDF

Info

Publication number
US20110088254A1
US20110088254A1 US12/928,843 US92884310A US2011088254A1 US 20110088254 A1 US20110088254 A1 US 20110088254A1 US 92884310 A US92884310 A US 92884310A US 2011088254 A1 US2011088254 A1 US 2011088254A1
Authority
US
United States
Prior art keywords
gel
gel precursor
temperature
precursor
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/928,843
Inventor
Lloyd Herbert King, Jr.
James C. Keeven
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Patent Store LLC
Original Assignee
Patent Store LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Patent Store LLC filed Critical Patent Store LLC
Priority to US12/928,843 priority Critical patent/US20110088254A1/en
Publication of US20110088254A1 publication Critical patent/US20110088254A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/22End caps, i.e. of insulating or conductive material for covering or maintaining connections between wires entering the cap from the same end
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/52Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5216Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/34Applying different liquids or other fluent materials simultaneously
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49174Assembling terminal to elongated conductor
    • Y10T29/49176Assembling terminal to elongated conductor with molding of electrically insulating material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49208Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4922Contact or terminal manufacturing by assembling plural parts with molding of insulation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/532Conductor
    • Y10T29/53209Terminal or connector

Definitions

  • This invention relates generally to manufacturing waterproof wire connectors and, more specifically, to a process and apparatus for manufacturing wire connectors with cured gels.
  • a viscous sealant such as a silicone in a wire connector to waterproof the wire connector
  • Examples of use of viscous sealants in twist-on wire connectors is shown in King U.S. Pat. No. 5,113,037.
  • Other types of silicones such as silicone gels, which cure to a soft gel like consistency are used for protecting extremely delicate electronic components from shock and vibration as well as waterproofing the encapsulated components.
  • the silicone gels have a tacky surface and form a mechanical bond to most surfaces making them ideal for vibration protection.
  • the viscous sealants which remain in a viscous state, require no curing phase and can be injected directly into a wire connector while the conventional method of creating gels, which are made from mixing two components, require a curing phase that requires additional handling and processing.
  • the known process for formation of the silicone gels includes the mixing of a first silicone gel precursor with a second silicone gel precursor and then curing the gel mixture at an elevated temperature for a period of time.
  • the gel mixtures are cured by heating the gel mixture and maintaining the gel mixture at temperatures ranging from 25° C. to 150° C. at times ranging from 5 minutes to 24 hours.
  • the shorter cure times are used with gel mixtures that are cured at higher temperatures and the longer cure times are used with gel mixtures that are cured at lower temperatures which can require a separate or isolated curing of the product and the gel.
  • a silicone gel mixture is used in small amounts, for example in wire connectors such as twist-on wire connectors, oftentimes the silicone gel mixture may not cure properly.
  • Another difficulty in manufacturing wire connectors with gels is that curing the gel mixture by heating the wire connector and the gel mixture renders the manufacturing process more difficult and more costly.
  • Another manufacturing difficulty is that it has been found that when small amounts of a gel mixture are cured by the prior art proscribed curing process separation of the cured gel mixture can occur which leaves an oily film on the cured gel mixture oftentimes making it unacceptable for use in wire connectors.
  • a method and apparatus for manufacturing gel filled wire connectors where the wire connector remains at room temperature and the gel mixture in the wire connector cures to an unseparated state through a process of elevating the temperature of the gel precursors before dispensing the mixed gel precursors into the cavity of a wire connector, which can remain at room temperature, as the mixed gel precursors are allowed to cool and self cure in the wire connector.
  • FIG. 1 is a schematic of a system for dispensing gel precursors into the cavity of a wire connector
  • FIG. 2 is a partial sectional view of a twist on wire connector
  • FIG. 3 is a sectional view of the needle nozzle.
  • FIG. 1 is a partial schematic of a system 10 for dispensing a mixed heated silicone gel precursor into the cavity of a wire connector to form a wire connector with a gel therein without having to separately cure the gel in the wire connector.
  • System 10 includes a base member 11 that supports a container 12 containing a first silicone gel precursor 17 and a container 13 that contains a second silicone gel precursor 18 .
  • a source of compressed air 14 connects to base 11 to allow the container 12 to be pressurized and thereby cause the gel precursor 17 in container 12 to flow through hose 20 .
  • the source of compressed air 14 allows container 13 to be pressurized to cause the gel precursor 18 in container 13 to flow through hose 21 .
  • System 10 includes a first heat transfer member 20 for simultaneously heating and transferring the gel precursor in container 12 to an unheated dispensing valve 23 .
  • Heat transfer member 20 provides on the go heating of the first gel precursor 17 and may for example comprise a heated hose 20 that extends between container 12 and dispensing valve 23 .
  • heat transfer member 21 provides for simultaneously heating and transferring the gel precursor in container 13 to a dispensing valve 23 .
  • Heat transfer member 21 provides for on the go heating of the second gel precursor 18 and may for example also comprise a heated hose 21 that extends between container 13 and dispensing valve 23 .
  • heat transfer member 20 provides on the go heating of gel precursor 17 as the gel precursor travels from container 12 to dispensing valve 23 and similarly, heat transfer member 21 provides for on the go heating of gel precursor 18 as the gel travels from container 13 to dispensing valve 23 although other methods and means of heating the gel precursors may be used which do not use on the go heating.
  • An example of heat transfer members suitable for use herein are heated hoses which are commercially available from suppliers of hoses and can include a resistance heater located along the length of the hose.
  • the dispensing valve 23 which receives the heated gel precursors 17 and 18 is shown in section in FIG. 3 and includes a first chamber 36 containing gel precursor 17 and a second chamber 35 containing gel precursor 18 .
  • a remote controlled shut off valve 38 at the bottom of chamber 36 allows one to open and close port 39 to thereby control the delivery of precursor 17 to the needle nozzle 24 .
  • a remote controlled shut off valve 37 at the bottom of chamber 35 allows one to open and close port 40 to thereby control the delivery of precursor 18 to needle nozzle 24 .
  • Shut off valves 37 and 38 are remotely controlled by means such as by solenoids or the like (not shown).
  • FIG. 3 illustrates that the precursor 18 exits port 40 as a cylindrical strand 18 a and that precursor 17 similarly exits port 39 as a cylindrical strand 17 a .
  • the needle nozzle 14 mixing occurs.
  • the precursor 17 and precursor 18 reach the terminus end of the needle nozzle (designated by M x ) the precursor 17 and precursor 18 are mixed to form the mixed gel precursor 27 that is injected into a wire connecter.
  • the heated gel precursor 17 in hose 20 and the heated gel precursor 18 in hose 21 are mixed in needle nozzle 24 immediately prior to dispensing from needle nozzle 24 to form a heated mixed gel precursor 27 .
  • the heated mixed gel precursor 27 is then dispensed directly into a cavity or chamber in a wire connector 26 as illustrated in FIG. 1 .
  • the gel precursors while heated above room temperature are kept in a heated and separate state until immediately prior to injection into the cavity of the wire connector.
  • a plurality of wire connecters such as twist on wire connectors 26
  • a moving support such as a conveyor 25 that moves wire connector 26 beneath the nozzle 24 so that the wire connector 26 is in a position to receive a charge of the heated mixed gel precursor 27 from nozzle 24 .
  • the dispensing valve 23 is set for intermittent dispensing of the mixed gel precursor 27 by a controller (not shown) which opens and closes valves 37 and 38 .
  • the nozzle 24 dispenses a charge of heated mixed gel precursor when wire connector 26 is located in a charge position beneath the needle nozzle 24 and suspends or interrupts dispensing to simultaneously allow the gel filled wire connector to move away from the charge position beneath nozzle 24 while an empty wire connector is moved to a charge or gel receiving position below needle nozzle 24 .
  • the wire connectors 26 are twist on wire connectors having an open top and a spiral coil in the connector for engaging and securing wires therein. Although twist on wire connectors are shown other types of wire connectors may be filled by the apparatus and method of the present invention.
  • the mixed heated gel precursor 27 is dispensed directly into the cavity of the twist on wire connectors 26 and cures in the wire connector which can remain at room temperature (typically about 20° C.), thus eliminating the need to heat the wire connectors or allow excessive time for an ambient cure that disrupts a normal manufacturing process.
  • room temperature typically about 20° C.
  • the process as described has been found to eliminate gel separation that can occur when a gel mixture is cured by the gel manufactures proscribed process. While needle nozzles are described herein other types of dispensers of nozzles that can mix the gel precursors may also be used.
  • FIG. 2 is a partial sectional view of a twist on wire connector 26 revealing a cavity or chamber 26 a in the twist on wire connector 26 with the heated mixed gel precursor 27 therein.
  • a twist on wire connector 26 is illustrated other types of wire connectors may be filled with a heated premixed silicone gel.
  • the method may be used for injecting damping materials into wire connectors or other devices.
  • the method includes injecting a heated mixed silicone gel precursor 27 into a cavity 26 a of wire connector 26 to form a silicone gel in a wire connector where the gel therein remains in an unseparated state therein.
  • a heated mixed silicone gel precursor 27 into a cavity 26 a of wire connector 26 to form a silicone gel in a wire connector where the gel therein remains in an unseparated state therein.
  • To heat the gel precursors one may direct a first gel precursor at room temperature through a heat transfer member maintained at a temperature in the range of about 45 C to 65 C at a flow rate that allows the first gel precursor to approach the temperature of the heat transfer member as the first gel precursor exits the heat transfer member and may also direct a second gel precursor at room temperature through a separate heat transfer member also maintained at a temperature in the range of about 45 C to 65 C at a flow rate that allows the second gel precursor to approach the temperature of the second heat transfer member as the second gel precursor exits the separate heat transfer member.
  • a feature of the manufacturing process using system 10 is that it allows one to store two separate gel precursors at room temperature (typically about 20 degrees C.) and then in an on-the-go process temporarily heat the two separate gel precursors as they flow to a dispensing valve 23 which eliminates the need to heat the entire gel precursors.
  • neither the dispensing valve 23 or the wire connectors 26 require heating to cure the gel in the wire connector thus eliminating the need for additional heating and at the same time avoiding gel separation that can occur with conventional curing that may render the wire connector unsuitable for use.
  • the gel separation with conventional curing of silicone gel has been found to be more pronounced when the charge of dispensed gel is small. While there is no abrupt transition as to the size of the charge where gel separation occurs generally a more noticeable separation occurs when the charge is about 10 grams or less.
  • the method includes directing the first gel precursor at the room temperature through a heat transfer member 20 which is maintained at a temperature in the range of about 45 C to 65 C at a rate that allows the first gel precursor to approach the temperature of the heat transfer member.
  • the process of manufacturing a gel filled wire connector includes the steps of heating the gel precursors to the proper temperature and mixing the first gel precursor at a temperature approaching the temperature of the first heat transfer member 20 with the second gel precursor at the temperature approaching the temperature of the second heat transfer member 21 to form a heated mixed gel precursor 27 in a dispensing valve 23 .
  • the heated mixed gel precursor can self cure at room temperature without additional heat to thereby produce a gel containing wire connector wherein the gel 27 in the wire connector remains in an unseparated state during the shelf life of the gel. While the gel precursors are mixed in an unheated needle nozzle 24 in some instances one may want to heat the needle nozzle.
  • the invention herein provides a method and apparatus for eliminating the undesirable separation of cured silicone gels in wire connectors.

Abstract

A method of manufacturing gel containing wire connectors with a silicone gel that remains in an unseparated state wherein the temperature of the gel precursors are elevated before being mixed and dispensed into the cavity of a wire connector where the mixed gel precursors are allowed to cool and cure without the necessity of additional heating of either the mixed gel precursors or the wire connector.

Description

    FIELD OF THE INVENTION
  • This invention relates generally to manufacturing waterproof wire connectors and, more specifically, to a process and apparatus for manufacturing wire connectors with cured gels.
  • CROSS REFERENCE TO RELATED APPLICATIONS
  • None
  • STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
  • None
  • REFERENCE TO A MICROFICHE APPENDIX
  • None
  • BACKGROUND OF THE INVENTION
  • The concept of using a viscous sealant such as a silicone in a wire connector to waterproof the wire connector is known in the art. Examples of use of viscous sealants in twist-on wire connectors is shown in King U.S. Pat. No. 5,113,037. Other types of silicones such as silicone gels, which cure to a soft gel like consistency are used for protecting extremely delicate electronic components from shock and vibration as well as waterproofing the encapsulated components. Generally, the silicone gels have a tacky surface and form a mechanical bond to most surfaces making them ideal for vibration protection. The viscous sealants, which remain in a viscous state, require no curing phase and can be injected directly into a wire connector while the conventional method of creating gels, which are made from mixing two components, require a curing phase that requires additional handling and processing.
  • The known process for formation of the silicone gels includes the mixing of a first silicone gel precursor with a second silicone gel precursor and then curing the gel mixture at an elevated temperature for a period of time. Typically, the gel mixtures are cured by heating the gel mixture and maintaining the gel mixture at temperatures ranging from 25° C. to 150° C. at times ranging from 5 minutes to 24 hours. Generally, the shorter cure times are used with gel mixtures that are cured at higher temperatures and the longer cure times are used with gel mixtures that are cured at lower temperatures which can require a separate or isolated curing of the product and the gel. Also when a silicone gel mixture is used in small amounts, for example in wire connectors such as twist-on wire connectors, oftentimes the silicone gel mixture may not cure properly. Another difficulty in manufacturing wire connectors with gels is that curing the gel mixture by heating the wire connector and the gel mixture renders the manufacturing process more difficult and more costly. Another manufacturing difficulty is that it has been found that when small amounts of a gel mixture are cured by the prior art proscribed curing process separation of the cured gel mixture can occur which leaves an oily film on the cured gel mixture oftentimes making it unacceptable for use in wire connectors.
  • SUMMARY OF THE INVENTION
  • A method and apparatus for manufacturing gel filled wire connectors where the wire connector remains at room temperature and the gel mixture in the wire connector cures to an unseparated state through a process of elevating the temperature of the gel precursors before dispensing the mixed gel precursors into the cavity of a wire connector, which can remain at room temperature, as the mixed gel precursors are allowed to cool and self cure in the wire connector.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic of a system for dispensing gel precursors into the cavity of a wire connector;
  • FIG. 2 is a partial sectional view of a twist on wire connector; and
  • FIG. 3 is a sectional view of the needle nozzle.
  • DESCRIPTION OF THE PREFERRED EMBODIMENT
  • FIG. 1 is a partial schematic of a system 10 for dispensing a mixed heated silicone gel precursor into the cavity of a wire connector to form a wire connector with a gel therein without having to separately cure the gel in the wire connector. System 10 includes a base member 11 that supports a container 12 containing a first silicone gel precursor 17 and a container 13 that contains a second silicone gel precursor 18. A source of compressed air 14 connects to base 11 to allow the container 12 to be pressurized and thereby cause the gel precursor 17 in container 12 to flow through hose 20. Similarly, the source of compressed air 14 allows container 13 to be pressurized to cause the gel precursor 18 in container 13 to flow through hose 21. Silicone gels that are formed from two or more separate gel precursors are commercially available from various United States suppliers. System 10 includes a first heat transfer member 20 for simultaneously heating and transferring the gel precursor in container 12 to an unheated dispensing valve 23. Heat transfer member 20 provides on the go heating of the first gel precursor 17 and may for example comprise a heated hose 20 that extends between container 12 and dispensing valve 23. Similarly, heat transfer member 21 provides for simultaneously heating and transferring the gel precursor in container 13 to a dispensing valve 23. Heat transfer member 21 provides for on the go heating of the second gel precursor 18 and may for example also comprise a heated hose 21 that extends between container 13 and dispensing valve 23. In the example shown heat transfer member 20 provides on the go heating of gel precursor 17 as the gel precursor travels from container 12 to dispensing valve 23 and similarly, heat transfer member 21 provides for on the go heating of gel precursor 18 as the gel travels from container 13 to dispensing valve 23 although other methods and means of heating the gel precursors may be used which do not use on the go heating. An example of heat transfer members suitable for use herein are heated hoses which are commercially available from suppliers of hoses and can include a resistance heater located along the length of the hose.
  • The dispensing valve 23, which receives the heated gel precursors 17 and 18 is shown in section in FIG. 3 and includes a first chamber 36 containing gel precursor 17 and a second chamber 35 containing gel precursor 18. A remote controlled shut off valve 38 at the bottom of chamber 36 allows one to open and close port 39 to thereby control the delivery of precursor 17 to the needle nozzle 24. Similarly, a remote controlled shut off valve 37 at the bottom of chamber 35 allows one to open and close port 40 to thereby control the delivery of precursor 18 to needle nozzle 24. Shut off valves 37 and 38 are remotely controlled by means such as by solenoids or the like (not shown).
  • FIG. 3 illustrates that the precursor 18 exits port 40 as a cylindrical strand 18 a and that precursor 17 similarly exits port 39 as a cylindrical strand 17 a. As the stands proceeds down the needle nozzle 14 mixing occurs. When the precursor 17 and precursor 18 reach the terminus end of the needle nozzle (designated by Mx) the precursor 17 and precursor 18 are mixed to form the mixed gel precursor 27 that is injected into a wire connecter.
  • As can be seen in FIG. 1-FIG. 3, the heated gel precursor 17 in hose 20 and the heated gel precursor 18 in hose 21 are mixed in needle nozzle 24 immediately prior to dispensing from needle nozzle 24 to form a heated mixed gel precursor 27. The heated mixed gel precursor 27 is then dispensed directly into a cavity or chamber in a wire connector 26 as illustrated in FIG. 1. As can be seen from the above the gel precursors while heated above room temperature are kept in a heated and separate state until immediately prior to injection into the cavity of the wire connector.
  • In operation of the manufacturing system 10 a plurality of wire connecters, such as twist on wire connectors 26, are held in an upright position on a moving support such as a conveyor 25 that moves wire connector 26 beneath the nozzle 24 so that the wire connector 26 is in a position to receive a charge of the heated mixed gel precursor 27 from nozzle 24. Typically, the dispensing valve 23 is set for intermittent dispensing of the mixed gel precursor 27 by a controller (not shown) which opens and closes valves 37 and 38. That is, the nozzle 24 dispenses a charge of heated mixed gel precursor when wire connector 26 is located in a charge position beneath the needle nozzle 24 and suspends or interrupts dispensing to simultaneously allow the gel filled wire connector to move away from the charge position beneath nozzle 24 while an empty wire connector is moved to a charge or gel receiving position below needle nozzle 24. In the embodiment shown the wire connectors 26 are twist on wire connectors having an open top and a spiral coil in the connector for engaging and securing wires therein. Although twist on wire connectors are shown other types of wire connectors may be filled by the apparatus and method of the present invention. In the system 10 the mixed heated gel precursor 27 is dispensed directly into the cavity of the twist on wire connectors 26 and cures in the wire connector which can remain at room temperature (typically about 20° C.), thus eliminating the need to heat the wire connectors or allow excessive time for an ambient cure that disrupts a normal manufacturing process. The process as described has been found to eliminate gel separation that can occur when a gel mixture is cured by the gel manufactures proscribed process. While needle nozzles are described herein other types of dispensers of nozzles that can mix the gel precursors may also be used.
  • FIG. 2 is a partial sectional view of a twist on wire connector 26 revealing a cavity or chamber 26 a in the twist on wire connector 26 with the heated mixed gel precursor 27 therein. Although a twist on wire connector 26 is illustrated other types of wire connectors may be filled with a heated premixed silicone gel. In addition the method may be used for injecting damping materials into wire connectors or other devices.
  • Thus, the method includes injecting a heated mixed silicone gel precursor 27 into a cavity 26 a of wire connector 26 to form a silicone gel in a wire connector where the gel therein remains in an unseparated state therein. To heat the gel precursors one may direct a first gel precursor at room temperature through a heat transfer member maintained at a temperature in the range of about 45 C to 65 C at a flow rate that allows the first gel precursor to approach the temperature of the heat transfer member as the first gel precursor exits the heat transfer member and may also direct a second gel precursor at room temperature through a separate heat transfer member also maintained at a temperature in the range of about 45 C to 65 C at a flow rate that allows the second gel precursor to approach the temperature of the second heat transfer member as the second gel precursor exits the separate heat transfer member. One then mixes the first gel precursor, which is at a temperature approaching the temperature of the first heat transfer member, with the second gel precursor, which is at a temperature approaching the temperature of the second heat transfer member to form a heated mixed gel precursor in a chamber 23 a of the dispensing valve 23 where the temperature of both gels before mixture are the same or about the same. Next, one dispenses the heated mixed gel precursor 27 into a cavity of a wire connector 26 and cures the mixed gel precursor without heating the wire connector, which is at room temperature, to produce a gel containing wire connector 26 wherein the gel in the wire connector remains in an unseparated state during the shelf life of the gel. It has been found that the method provides a cured gel that remain in an unseparated state i.e. no oily film if each of the gel precursors are heated sufficiently so that when the heated gel precursors are mixed they form a single heated mixed gel precursor that can be placed in a wire connector that need not be heated thereby eliminating a step of having to heat the wire connector to cure the gel. Although there is no bright line a temperature range of about 45° C. to 65° C. has been found an effective range for heating the gel precursors to enable formation of gel in a wire connector that remains in an unseparated state. Similarly, while no bright line a minimum temperature of about 25° C. above room temperature has been found effective for heating the gel precursors to enable formation of gel in a wire connector that remains in an unseparated state.
  • A feature of the manufacturing process using system 10 is that it allows one to store two separate gel precursors at room temperature (typically about 20 degrees C.) and then in an on-the-go process temporarily heat the two separate gel precursors as they flow to a dispensing valve 23 which eliminates the need to heat the entire gel precursors. In the present manufacturing process neither the dispensing valve 23 or the wire connectors 26 require heating to cure the gel in the wire connector thus eliminating the need for additional heating and at the same time avoiding gel separation that can occur with conventional curing that may render the wire connector unsuitable for use.
  • With the method of the invention one can inject mixed silicone gel precursors into a cavity of an empty wire connector 26 to form a silicone gel 27 wherein the gel therein remains in an unseparated state. Typically, the gel separation with conventional curing of silicone gel has been found to be more pronounced when the charge of dispensed gel is small. While there is no abrupt transition as to the size of the charge where gel separation occurs generally a more noticeable separation occurs when the charge is about 10 grams or less.
  • The method includes directing the first gel precursor at the room temperature through a heat transfer member 20 which is maintained at a temperature in the range of about 45 C to 65 C at a rate that allows the first gel precursor to approach the temperature of the heat transfer member. Similarly, directing the second gel precursor at room temperature through a separate heat transfer member 21 maintained at a temperature in the range of about 45 C to 65 C at a rate that allows the second gel precursor to approach the temperature of the second heat transfer member. While the gel precursor are heated on the go as the gel precursor are transferred to a dispensing valve it is envisioned that other methods of heating the gel precursors prior to mixing the gel precursors may be used.
  • Thus the process of manufacturing a gel filled wire connector includes the steps of heating the gel precursors to the proper temperature and mixing the first gel precursor at a temperature approaching the temperature of the first heat transfer member 20 with the second gel precursor at the temperature approaching the temperature of the second heat transfer member 21 to form a heated mixed gel precursor 27 in a dispensing valve 23. One can then dispense the heated mixed gel precursor 27 into a cavity 26 a of a wire connector 26 and then carry the wire connector with the mixed gel precursor to a storage bin for completion of the curing during the preparation of the product for shipping.
  • Once dispensed therein one can allow the heated mixed gel precursor to self cure at room temperature without additional heat to thereby produce a gel containing wire connector wherein the gel 27 in the wire connector remains in an unseparated state during the shelf life of the gel. While the gel precursors are mixed in an unheated needle nozzle 24 in some instances one may want to heat the needle nozzle.
  • While the cause of the gel separation is not fully understood the invention herein provides a method and apparatus for eliminating the undesirable separation of cured silicone gels in wire connectors.

Claims (7)

1.-15. (canceled)
16. An apparatus for manufacturing a gel containing wire connector comprising:
a container for holding a first gel precursor;
a mixing valve;
a first heat transfer member for transferring the first gel precursor to the dispensing valve while elevating the temperature of the first gel precursor to a temperature approaching the temperature of the heat transfer member;
a second heat transfer member for transferring the second gel precursor to the dispensing valve while elevating the temperature of the second gel precursor to a temperature approaching the temperature of the second heat transfer member; and
a nozzle for receiving and mixing the first gel precursor and the second gel precursor and injecting a mixture of the first gel precursor and the second gel precursor into a wire connector.
17. The apparatus of claim 16 including a conveyor for carrying the wire connector to a position to receive the mixture of the first gel precursor and the second gel precursor and to carry the wire connector with the mixture of the first gel precursor and the second gel precursor to a storage bin for completion of the curing as the product is being prepared for shipment.
18. The apparatus of claim 16 wherein the first heat transfer member is a heated hose having a length sufficient so that the delivery of the first gel precursor through the heated hose is sufficient to bring the temperature of the first gel precursor to a temperature approaching the temperature of the heated hose as the first gel precursor discharges into the dispensing valve and the second heat transfer member is a heated hose having a length sufficient so that the delivery of the second gel precursor through the heated hose is sufficient to bring the temperature of the second gel precursor to a temperature approaching the temperature of the second heated hose as the second gel precursor discharges into the dispensing valve.
19. The apparatus of claim 16 including a plurality of twist on wire connectors held in an upright condition on a conveyor.
20. The apparatus of claim 18 including a pressure source for maintaining the first gel precursor and the second gel precursor at a pressure sufficient to force the first gel precursor and the second gel precursor into the dispensing valve.
21. The apparatus of claim 16 including a heater for maintaining the temperature of the first heat transfer member and the second heat transfer member at a temperature within the range of about 45 degrees C. to 65 degrees C.
US12/928,843 2008-04-23 2010-12-21 Manufacture of waterproof wire connectors Abandoned US20110088254A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/928,843 US20110088254A1 (en) 2008-04-23 2010-12-21 Manufacture of waterproof wire connectors

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/148,810 US7913383B1 (en) 2008-04-23 2008-04-23 Manufacture of waterproof wire connectors
US12/928,843 US20110088254A1 (en) 2008-04-23 2010-12-21 Manufacture of waterproof wire connectors

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US12/148,810 Division US7913383B1 (en) 2008-04-23 2008-04-23 Manufacture of waterproof wire connectors

Publications (1)

Publication Number Publication Date
US20110088254A1 true US20110088254A1 (en) 2011-04-21

Family

ID=43769741

Family Applications (2)

Application Number Title Priority Date Filing Date
US12/148,810 Expired - Fee Related US7913383B1 (en) 2008-04-23 2008-04-23 Manufacture of waterproof wire connectors
US12/928,843 Abandoned US20110088254A1 (en) 2008-04-23 2010-12-21 Manufacture of waterproof wire connectors

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US12/148,810 Expired - Fee Related US7913383B1 (en) 2008-04-23 2008-04-23 Manufacture of waterproof wire connectors

Country Status (1)

Country Link
US (2) US7913383B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007147146A2 (en) * 2006-06-16 2007-12-21 Qualcomm Incorporated Progressively broadcasting information in beacon signals

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3201685A (en) * 1961-09-22 1965-08-17 Remwood Chemical Company Conductivity probe
US3529320A (en) * 1967-10-17 1970-09-22 Westinghouse Electric Corp Casting apparatus for encapsulating electrical conductors
US5332313A (en) * 1993-03-12 1994-07-26 Dow Corning Corporation Nozzle mixer assembly
US5547713A (en) * 1990-10-31 1996-08-20 International Business Machines Corporation Dual cure epoxy backseal formulation
US5797546A (en) * 1996-10-29 1998-08-25 Morton International, Inc. Weight-supported adjustable mixing and dispensing gun for two chemically reactive materials
US20060048965A1 (en) * 2004-09-09 2006-03-09 Sumitomo Wiring Systems, Ltd. Method and structure for waterproofing a terminal splice

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5357057A (en) * 1982-10-12 1994-10-18 Raychem Corporation Protected electrical connector
US4863535A (en) * 1987-12-09 1989-09-05 Minnesota Mining And Manufacturing Company Electrical environmental sealant and method
JP2970338B2 (en) * 1993-09-22 1999-11-02 住友電装株式会社 Automatic waterproofing device for wire connection
US6267579B1 (en) * 1998-12-23 2001-07-31 Clinical Laboratory Development Group, Inc. Apparatus for making a gradient gel
US7956451B2 (en) * 2004-12-18 2011-06-07 Agere Systems Inc. Packages for encapsulated semiconductor devices and method of making same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3201685A (en) * 1961-09-22 1965-08-17 Remwood Chemical Company Conductivity probe
US3529320A (en) * 1967-10-17 1970-09-22 Westinghouse Electric Corp Casting apparatus for encapsulating electrical conductors
US5547713A (en) * 1990-10-31 1996-08-20 International Business Machines Corporation Dual cure epoxy backseal formulation
US5332313A (en) * 1993-03-12 1994-07-26 Dow Corning Corporation Nozzle mixer assembly
US5797546A (en) * 1996-10-29 1998-08-25 Morton International, Inc. Weight-supported adjustable mixing and dispensing gun for two chemically reactive materials
US20060048965A1 (en) * 2004-09-09 2006-03-09 Sumitomo Wiring Systems, Ltd. Method and structure for waterproofing a terminal splice

Also Published As

Publication number Publication date
US7913383B1 (en) 2011-03-29

Similar Documents

Publication Publication Date Title
EP1155748A4 (en) Method and device for injecting a fixed quantity of liquid
US20130112280A1 (en) Automatic gate valve for hot melt adhesive lines
US20130115016A1 (en) Quick change hopper
US20130112709A1 (en) Melting system
JP2017093419A (en) Machine and method for making liquid and semi-liquid products of ice cream sector
US20130105004A1 (en) Hot melt dispensing system with heated accumulator
CN107073505A (en) The method that cohesive material is supplied for the remote batch feeding system of distribution system and to distribution system
CN101102940A (en) Liquid dispensing system
US7913383B1 (en) Manufacture of waterproof wire connectors
US9567117B2 (en) Device and method for filling a container
US20120313270A1 (en) Modified injection molding unit and method of delivering cooled molding material
US20230200433A1 (en) Automated deposition of highly viscous fluids into thin-walled cylinders
US9834390B2 (en) Bulk cargo blending hopper
US20050236422A1 (en) Portable apparatus for mixing and dispensing viscous materials
US4548652A (en) Method of purging a plural component mixing and dispensing system
US20120018008A1 (en) Apparatus for supplying source
US20150314318A1 (en) Thermal break for hot melt system fluid line
JP2001278389A (en) Device and method for filling liquid resin into syringe
US20040165476A1 (en) Two component coating mixing system
US20140263452A1 (en) Melting system
CN105835228A (en) Apparatus for manufacturing artificial stone molded product
KR200394429Y1 (en) Heating Apparatus using system for circulating hot water separately
US20060120981A1 (en) Apparatus and process for the production of multicoloured poured cosmetic products with various shapes
CN105934705B (en) Liquid crystal dripping device, LCD device preparation method
CN217566816U (en) Adhesive spraying device

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION