US20110108415A1

US20110108415A1 - Apparatus and method for plating a substrate

Info

Publication number: US20110108415A1
Application number: US12/938,797
Authority: US
Inventors: Uihyoung LEE; Namseog Kim; WoonHo Seo; Min-Suk Han; YoungHyun Ju; Ju-Il Choi
Original assignee: TKC CO Ltd; Samsung Electronics Co Ltd
Current assignee: TKC CO Ltd; Samsung Electronics Co Ltd
Priority date: 2009-11-10
Filing date: 2010-11-03
Publication date: 2011-05-12
Also published as: KR20110051588A; CN102051650A

Abstract

An apparatus for electroplating a substrate includes a substrate supporting member that supports the substrate such that a plating surface of the substrate faces upwardly, an anode electrode disposed at an upper part of the substrate supporting member, a power source for applying a voltage to the anode electrode and the substrate, and a plating solution supply member for supplying a plating solution onto the substrate.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This U.S. non-provisional patent application claims priority under 35 U.S.C. §119 of Korean Patent Application 10-2009-0108237, filed on Nov. 10, 2009, the entire disclosure of which is hereby incorporated by reference herein in it's entirety.

BACKGROUND

(i) Technical Field
The present disclosure herein relates to apparatus and method for plating a substrate, and more particularly, to apparatus and method for plating a semiconductor substrate with metals.
(ii) Description of the Related Art
Generally, in an apparatus for plating the substrate, a power source is connected to a plate formed of a plating material (for example, Cu) and the substrate, thereby forming a metal layer on the substrate. The processes for forming the metal layer on the substrate may include various processes such as, for example, chemical vapor deposition or physical vapor deposition. Nevertheless, an electroplating method has been recently used as one basic process for forming the metal layer on the substrate because the properties of the metal layer formed by this electroplating method are more beneficial compared to those of the metal layer formed by other processes.

SUMMARY

The present disclosure may provide apparatus and method for plating a substrate which can improve efficiency in a plating process.
Embodiments of the inventive concept provide an apparatus for electroplating a substrate, including: a substrate supporting member that supports the substrate such that a plating surface of the substrate faces upwardly, an anode electrode disposed at an upper part of the substrate supporting member, a power source for applying a voltage to the anode electrode and the substrate, and a plating solution supply member for supplying a plating solution onto the substrate.
In some embodiments, the plating solution supply member may include a plating solution discharge nozzle disposed at an upper part of the anode electrode and discharging downwardly the plating solution in a direction toward the substrate.
In other embodiments, the apparatus may further include: a plating bath having an opened lower part and accommodating the plating solution discharge nozzle and the anode electrode therein; and a first driving portion ascending and descending the substrate supporting member such that the opened lower part of the plating bath is opened and closed by the substrate.
In still other embodiments, the apparatus may further include: a ring-shaped contact plate provided at the opened lower part of the plating bath; and a plurality of metal pins installed at plural places along a circumferential direction of the contact plate and coming in contact with the plating surface of the substrate. In this configuration, the power source may apply the voltage to the plating surface of the substrate through the metal pins.
In even other embodiments, the substrate supporting member may include: a supporting plate; a plurality of chuck pins installed at edges of the supporting plate so as to be upwardly protruded from the supporting plate; and a chuck pin transferring unit moving the chuck pins between a supporting position which supports lateral parts of the substrate and a standby position farther away from a center of the supporting plate compared to the supporting position. In this configuration, the chuck pin transferring unit may include: movable roads disposed inside the supporting plate in a radial manner, the chuck pins being coupled to one end of a respective one of each of the movable roads; a vertical road provided inside a supporting shaft coupled to a lower part of the supporting plate so as to be movable in a vertical direction; connection members, one end of the connection members being hinge-coupled to the other end of a respective one of each of the movable roads, and the other end of the connection member being hinge-coupled to an upper end of the vertical road; and a second driving portion ascending and descending the vertical road.
In yet other embodiments, the apparatus may further include: a plating solution agitation member provided below the anode electrode inside the plating bath and agitating the plating solution supplied onto the substrate from the plating solution discharge nozzle.
In further embodiments, the plating solution agitation member may include: an agitation plate disposed below the anode electrode, a plurality of through holes are formed in the agitation plate to pass the plating solution therethrough; and a third driving portion for rotating the agitation plate around a self-center axis perpendicular to the agitation plate.
In still further embodiments, the size of the through holes may become smaller toward the periphery of the agitation plate from the center of the agitation plate.
In even further embodiments, the plating treatment portion may further include: a bowl provided below the plating bath so as to surround the substrate supporting member of a descent position, and a treatment fluid supply member provided outside the bowl; and the treatment fluid supply member may further include a de-ionized water supply member, a pre-treatment solution supply member, a chemical solution supply member and a dry gas supply member. The de-ionized water supply member supplies de-ionized water for rinsing the substrate before and after a plating process on the substrate, the pre-treatment solution supply member supplies non-additive plating solution for pre-treating the substrate after the rinsing process on the substrate, the chemical solution supply member supplies a chemical solution for cleaning the substrate after the plating process has been performed and the dry gas supply member supplies dry gas to the substrate after the plating, the rinsing and the cleaning processes. In this configuration, the bowl may recover at least one of the de-ionized water, the non-additive plating solution, and the chemical solution dispersed by rotation of the substrate.
In yet further embodiments, the apparatus may further include: a drip bath provided between the plating bath and the bowl to receive the plating solution falling from the plating bath; and a fourth driving portion moving the drip bath across inside and outside of a space between the plating bath and the bowl.
In yet further embodiments, the plating bath may include: an upper wall; a first sidewall extending downwardly from an edge of the upper wall; a second sidewall provided inside the first sidewall to surround the anode electrode and extending downwardly from the upper wall; and a ring-shaped contact plate coupled to a lower end of the second sidewall and coming in contact with an edge of the substrate due to the ascent of the substrate supporting member. In this configuration, the second sidewall may be formed with a plurality of overflow holes that cause the plating solution filled in a plating space formed by the second sidewall, the contact plate, and the substrate to overflow between the first sidewall and the second sidewall.
In yet further embodiments, the bowl may include: a first recovery vessel surrounding the substrate supporting member and having an opened upper part; a second recovery vessel having vessel-shaped upper and lower parts and provided to be movable in a vertical direction along a sidewall of the first recovery vessel; and a third recovery vessel coupled to the second recovery vessel to surround the second recovery vessel, an upper end of the third recovery vessel coming in contact with a lower end of the first sidewall of the plating bath by an ascent of the second recovery vessel. In addition, the plating solution, which is overflowed between the first and second sidewalls of the plating bath, may be recovered into the third recovery vessel.
In yet further embodiments, the second recovery vessel may include: a ring-shaped outside vertical wall disposed outside the first recovery vessel; a ring-shaped inside vertical wall disposed inside the first recovery vessel and surrounding the substrate supporting member; and a ring-shaped coupling plate coupled to an upper end of the inside vertical wall and an upper end of the outside vertical wall. In addition, an opening area of the coupling plate may be smaller than an area of the supporting plate of the substrate supporting member such that the second recovery vessel ascends and descends by the ascent and descent of the substrate supporting member, and the coupling plate may come in contact with the lower end of the second sidewall of the plating bath by the ascent of the second recovery vessel.
Embodiments of the inventive concept also provide a method of electroplating a substrate in a plating chamber, including: supporting the substrate in the plating chamber such that a plating surface of the substrate faces upwardly, disposing an anode electrode at an upper part of the substrate, applying a voltage to the anode electrode and the substrate, and supplying a plating solution onto the substrate to plate the plating surface of the substrate.
In some embodiments, the method may further include performing a rinsing process on the substrate by supplying de-ionized water to the substrate in the plating chamber prior and after performing the plating process on the substrate, performing a pre-treatment process on the substrate by supplying non-additive plating solution to the substrate in the plating chamber after performing the rinsing process on the substrate, performing a cleaning process on the substrate in the plating chamber by supplying a cleaning solution to substrate after performing the plating process on the substrate and supplying a drying gas to the substrate in the plating chamber to dry the substrate after the plating, the cleaning and the rinsing processes have been completed and the plating solution may be discharged downwardly from a plating solution discharge nozzle disposed at an upper part of the anode electrode in a direction toward the substrate.
In other embodiments, the method may further include: agitating the plating solution supplied onto the substrate.
In still other embodiments, the plating surface of the substrate may be plated in a plating bath located at a first height, and processes before and after the plating treatment may proceed in a bowl located at a second height lower than the first height.
In even other embodiments, the method may further include: receiving a plating solution falling from the plating bath by using a drip bath disposed between the first height and the second height.
In yet other embodiments, the method may further include: contacting the substrate with a ring-shaped bottom of a plating bath accommodating the anode electrode to fill a plating solution in a space formed by the substrate and sidewalls of the plating bath.
In further embodiments, a ring-shaped contact plate may be provided at an opened lower part of a plating bath accommodating the anode electrode, metal pins may be installed at plural places along a circumferential direction of the contact plate to come in contact with the substrate, and the power source may apply a voltage to the plating surface of the substrate through the metal pins.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the inventive concept and, together with the description, serve to explain principles of the inventive concept. In the drawings:

FIG. 1 is a plan view of a substrate plating apparatus according to an exemplary embodiment of the inventive concept;

FIG. 2 is a plan view illustrating an internal constitution of a plating chamber illustrated in FIG. 1;

FIG. 3 is a cross-sectional view of a plating treatment portion illustrated in FIG. 2;

FIG. 4 is a cross-sectional view of a substrate supporting member illustrated in FIG. 3;

FIG. 5 is a view illustrating an electrical connection between an anode electrode and a substrate; and

FIGS. 6 through 10 are views illustrating processes of plating the substrate by using the substrate plating apparatus according to an exemplary embodiment of the inventive concept.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

Advantages and features of the present invention and methods of accomplishing the same may be understood more readily by reference to the following detailed description of preferred embodiments and the accompanying drawings. The exemplary embodiments of the inventive concept may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the inventive concept to those skilled in the art, and the embodiments of the inventive concept will only be defined by the appended claims. Like reference numerals refer to like elements throughout the specification. Also, descriptions of well-known functions and constructions are omitted for clarity and conciseness.

Exemplary Embodiment

FIG. 1 is a plan view of a substrate plating apparatus according to an exemplary embodiment of the inventive concept.
Referring to FIG. 1, a substrate plating apparatus for electro-plating a substrate includes an equipment front-end module 1 and a process equipment 2. The process equipment 2 plates the substrate in a single wafer manner. The equipment front end module 1 is disposed in the front of the process equipment 2 along a first direction I and transfers the substrate between a container C for accommodating the substrates and the process equipment 2.
The front end module 1 has a plurality of load ports 10 and a frame 12. The load ports 10 are disposed in a row in a second direction II perpendicular to the first direction I. The container C for accommodating the substrate is placed on the load port 10 by a transfer device such as, for example, an overhead transfer. The container C may be an airtight container such as, for example, a Front Open Unified Pod (FOUP), and the substrate accommodated in the container C may be, for example, a wafer.
The frame 12 is disposed between the load ports 10 and the process equipment 2. The longitudinal direction of the frame 12 faces toward the second direction II. A frame robot 13 and a door opener are disposed in the frame 12. The frame robot 13 moves along a first transfer rail 15 extending in the second direction II and transfers the substrate between the container C placed on the load port 10 and the process equipment 2. The door opener opens and closes the door of the container C.
The process equipment 2 includes a substrate transferring unit 20, a buffer unit 30, and a number of plating chambers (40 a, 40 b, . . . , and 40 e). The substrate transferring unit 20 has a transfer passage 22 disposed at the other side of the front end module 1 so as to face toward the first direction I. A main transfer robot 24 is disposed in the transfer passage 22. The main transfer robot 24 moves along a second transfer rail 26 in the first direction I.
The buffer unit 30 is disposed between the substrate transferring unit 20 and the front end module 1 and provides a space holding temporarily the substrate loaded onto the process equipment 2 and the substrate unloaded from the process equipment 2.
The plating chambers (40 a, 40 b, . . . , and 40 e) are disposed at both sides of the substrate transferring unit 20 along the second direction II in a row and electroplates the substrate. The plating chambers (40 a, 40 b, . . . , and 40 e) may have a multi-layered structure stacked in a vertical direction.
The frame robot 13 pulls out the substrate to be plated from the container C and loads it onto the buffer unit 30. The main transfer robot 24 loads the substrate, which is loaded onto the buffer unit 30, onto the plating chambers (40 a, 40 b, . . . , and 40 e). The plating chambers (40 a, 40 b, . . . , and 40 e) conduct the plating process of the substrate and pre- and post-plating processes of the substrate. The main transfer unit 24 unloads the plated substrate from the plating chamber (40 a, 40 b, . . . , and 40 e) and loads the plated substrate onto the buffer unit 30. The frame robot 13 pulls out the substrate loaded onto the buffer unit 30 and stores it in the container C.
Since the plating chambers (40 a, 40 b, . . . , and 40 e) have the same configuration, the plating chamber 40 a will be described below for example.
FIG. 2 is a plan view illustrating an internal constitution of the plating chamber 40 a illustrated in FIG. 1. Referring to FIG. 2, the plating chamber 40 a includes a treatment room 100, a plating treatment portion 200, and a treatment fluid supply member 300. The treatment room 100 accommodates the plating treatment portion 200 and the treatment fluid supply member 300. An opening 110 is formed at one sidewall of the treatment room 100 to deliver the substrate. The opening 110 is opened and closed by a gate valve.
The plating treatment portion 200 may be disposed at the center of the treatment room 100. The plating treatment portion 200 conducts a pre-process, an electroplating process, and a post-process. The pre-process includes a pre-wet process of the substrate using de-ionized water and a pre-treatment process of the substrate using a non-additive plating solution. The electroplating process deposits a metal layer on the substrate by using the electrode and the plating solution containing the additives. The post-process includes a cleaning process of the substrate using chemical solutions and a drying process of the substrate using dry gases.
The treatment fluid supply member 300 is disposed at the circumference of the plating treatment portion 200. The treatment fluid supply member 300 supplies the treatment fluid to be used in the pre-process and the post-process to the plating treatment portion 200. The treatment fluid supply member 300 may include a de-ionized water supply member 320, a pre-treatment solution supply member 340, a chemical solution supply member 360, and a dry gas supply member 380.
The de-ionized water supply member 320 supplies the de-ionized water DIW for the pre-wet process and washing process of the substrate to the plating treatment portion 200. The pre-treatment solution supply member 340 supplies the non-additive plating solution for the pre-treatment of the substrate to the plating treatment portion 200. The chemical solution supply member 360 supplies the chemical solution for cleaning the substrate to the plating treatment portion 200. The dry gas supply member 380 supplies the dry gas for drying the substrate to the plating treatment portion 200.
Since the de-ionized water supply member 320, the pre-treatment solution supply member 340, and the dry gas supply member 380 may have the same configuration, the de-ionized water supply member 320 will be described below for example. The de-ionized water supply member 320 includes a nozzle 322, a supporting bar 324, and driver 326. The nozzle 322 is coupled to one end of the supporting bar 324. A rotating shaft is coupled to the other end of the supporting bar 324. The rotating shaft may rotate and may ascend and descend by the driver 326. The nozzle 322 receives the de-ionized water from a de-ionized water reservoir. The supporting bar 324 swings by the rotation of the rotating shaft and the nozzle 322 moves into the upper part of the substrate within the plating treatment portion 200 by the swing of the supporting bar 324. The nozzle 322 discharges the de-ionized water into the upper surface (that is, surface to be plated) of the rotating substrate.
The chemical solution supply member 360 includes a plurality of nozzles 362 a, 362 b, and 362 c, a supporting bar 364, and a bar moving system 366. The nozzles 362 a, 362 b, and 362 c are disposed at one side of the plating treatment portion 200 in parallel with each other in one direction. Each of the nozzles 362 a, 362 b, and 362 c has a protrusion 363 protruded toward the top thereof. The supporting bar 364 has a longitudinal direction perpendicular to the arrangement direction of the nozzles 362 a, 362 b, and 362 c. A holder is provided at a lower surface of the supporting bar 364 to couple with the protrusion 363 of the nozzles 362 a, 362 b, and 362 c.
The bar moving system 366 includes a bracket 367, a guide rail 369, and a driver. The guide rail 369 extends along the arrangement direction of the nozzles 362 a, 362 b, and 362 c in a straight line. The bracket 367 is movably coupled to the guide rail 369, and the supporting bar 364 is coupled to the bracket 367. The driver provides a driving force to move the bracket 369 in a straight line.
The nozzles 362 a, 362 b, and 362 c receive the chemical solution from chemical solution reservoirs storing different kinds of chemical solutions. The chemical solution may be, for example, sulfuric acid, nitric acid, ammonia, hydrofluoric acid, or mixtures of these with the de-ionized water.
The supporting bar 364 is coupled to any one of the nozzles 362 a, 362 b, and 362 c by the coupling between the holder and the protrusion 363. The supporting bar 364 moves in a straight line by the bar moving system 366, and the nozzle moves into the upper part of the substrate within the plating treatment portion 200 by the straight movement of the supporting bar 364. The nozzle discharges the chemical solution into the upper surface (that is, surface to be plated) of the rotating substrate.
FIG. 3 is a cross-sectional view of the plating treatment portion 200 illustrated in FIG. 2; and FIG. 4 is a cross-sectional view of a substrate supporting member illustrated in FIG. 3. Referring to FIGS. 3 and 4, the plating treatment portion 200 includes a substrate supporting member 210, a bowl 230, and a plating bath 240.
The substrate supporting member 210 supports the substrate such that the plating surface of the substrate faces upwardly. The substrate supporting member 210 has a disc-shaped supporting plate 211. Supporting pins 212 and chuck pins 213, which support the substrate, respectively, are coupled to the supporting plate 211. The supporting pins 212 are upwardly protruded from the upper surface of the supporting plate 211 and support the lower surface (that is, non-plated surface) of the substrate. The chuck pins 213 are installed at plural places along the edges so as to be upwardly protruded from the upper surface of the supporting plate 211. The chuck pins 213 support lateral parts of the substrate so as to align the substrate to a normal position and prevent the substrate W from being laterally deviated from the normal position when the supporting plate 211 rotates. A supporting shaft 214 is coupled to the lower surface of the supporting plate 211. The supporting shaft 214 may rotate and may ascend and descend by a first driving portion 216.
A chuck pin transferring unit 220 moves the chuck pins 213 between a supporting position that supports the sides of the substrate and a standby position farther away from the center of the supporting plate 211 compared to the supporting position. The chuck pin transferring unit 220 includes movable roads 222, a vertical road 224, connection members 226, and a second driving portion 228. The movable roads 222 are provided inside the supporting plate 211 and are horizontally disposed in a radial manner based on the center of the supporting plate 211. The chuck pins 213 are coupled to outer ends of the movable roads 222, respectively. The vertical road 224 is provided inside the supporting shaft 214 so as to be movable in a vertical direction. The connection members 226 may have, for example, a bar shape. One end of the connection member 226 is hinge-coupled to an inner end of the movable road 222 by a first hinge shaft 226 a, and the other end of the connection member 226 is hinge-coupled to an upper end of the vertical road 224 by a second hinge shaft 226 b. The vertical road 224 moves in a vertical direction by the second driving portion 228.
When the vertical road 224 descends by the second driving portion 228, the second hinge shaft 226 b descends, the first hinge shaft 226 a moves toward the center of the supporting plate 211, and the connection member 226 simultaneously rotates around the first hinge shaft 226 a and the second hinge shaft 226 b in a direction where an inclined angle increases. The movable road 222 horizontally moves toward the center of the supporting plate 211 by the movement of the first hinge shaft 226 a.
On the contrary, when the vertical road 224 ascends by the second driving portion 228, the second hinge shaft 226 b ascends, the first hinge shaft 226 a moves toward the edge of the supporting plate 211, and the connection member 226 simultaneously rotates around the first hinge shaft 226 a and the second hinge shaft 226 b in a direction where the inclined angle reduces. The movable road 222 horizontally moves toward the edge of the supporting plate 211 by the movement of the first hinge shaft 226 a.
The bowl 230 is provided so as to surround the substrate supporting member 210 of the descent position and recovers the treatment fluids which are dispersed by the rotation of the substrate in the pre-process and the post-process. The bowl 230 includes a first recovery vessel 232, a second recovery vessel 234, and a third recovery vessel 236. The first recovery vessel 232 has a vessel shape where the upper part is opened. For example, the first recovery vessel 232 has a bottom wall 232 a and a vertical sidewall 232 b extending upwardly from the edge of the bottom wall 232 a. The supporting shaft 214 of the substrate supporting member 210 is inserted into the hole formed at the center of the bottom wall 232 a.
The second recovery vessel 234 has a vessel shape where the upper and lower parts are opened. For example, the second recovery vessel 234 includes a ring-shaped outside vertical wall 234 a disposed outside the first recovery vessel 232, a ring-shaped inside vertical wall 234 b disposed inside the first recovery vessel 232, and a ring-shaped coupling plate 234 c coupled to the upper end of the outside vertical wall 234 a and the upper end of the inside vertical wall 234 b. One of the outside vertical wall 234 a and the inside vertical wall 234 b comes in contact with the side of the vertical sidewall of the first recovery vessel 232, and the lower surface of the coupling plate 234 c comes in contact with the upper end of the vertical sidewall 232 b of the first recovery vessel 232. The coupling plate 234 c is located higher than the supporting plate 211 of the descent position, and an opening of the coupling plate 234 c is provided so as to have an opening area smaller than an area of the supporting plate 211. Accordingly, when the supporting plate 211 ascends and descends, the second recovery vessel 234 may ascend and descend by the interference of the supporting plate 211 and the coupling plate 234 c. The coupling plate 234 c may come in contact with a lower end of a second sidewall 243 of the plating bath 240 by the ascent of the second recovery vessel 234.
The third recovery vessel 236 includes an annular bottom wall 236 a and a vertical wall 236 b extending upwardly from a circumferential edge of the bottom wall 236 a. An inner circumference of the bottom wall 236 a is coupled to the outside vertical wall 234 a of the second recovery vessel 234. The top of the vertical wall 236 b may come in contact with a lower end of a first sidewall 242 of the plating bath 240 by the ascent of the second recovery vessel 234. The third recovery vessel 236 recovers the plating solution overflowed into the space between the first and second sidewall 242 and 243 of the plating bath 240. The recovered plating solution is stored in a recovery tank 239 through a recovery line 238 connected to a drain hole 237 of the bottom wall 236 a.
The plating bath 240 is disposed above the bowl 230 to provide a space S where the plating process of the substrate proceeds. The plating bath 240 includes an upper wall 241, a first sidewall 242 extending downwardly from the circumferential edge of the upper wall 241, a second sidewall 243 provided inside the first sidewall 242, and a ring-shaped contact plate 245 coupled to the lower end of the second sidewall 243. A contact part 246 is provided at the inner circumference of the lower surface of the contact plate 245, and the substrate comes in contact with the contact part 246 by the ascent of the substrate supporting member 210.
An anode electrode 260 is horizontally disposed above the contact plate 245. The anode electrode 260 may have, for example, a plate shape. A hole, which will be described later, is formed at the center of the anode electrode 260. A plating solution discharge nozzle 251, which will be described later, is inserted into the hole. The anode electrode 260 is provided with a metal plate formed of materials intended to plate.
The anode electrode 260 and the substrate W receive the voltage from a power source 247, as illustrated in FIG. 5. For example, the anode of the power source 247 is connected to the anode electrode 260, whereas the cathode of the power source 247 is connected to metal pins 246-1 of the contact part 246 by a second conductive wire 248 b. The contact part 246 includes the metal pins 246-1 and a sealing member 246-2. The sealing member 246-2 is provided in the form of ring having a cross-section of shape “
” and may be coupled to the inner circumference of the lower surface of the contact plate 245. The sealing member 246-2 comes in contact with a photoresist layer PR on the substrate W, thereby preventing the plating solution supplied to the substrate from being leaked into the edge of the substrate W. The metal pins 246-1 may be installed at plural places along a circumferential direction of the contact plate 245 and be connected to the second conductive wire 248 b through the sealing member 246-2. The tip of the metal pins 246-1 comes in contact with a conductive seed layer W1 provided at the edge of the substrate W.
A plating solution supply member 250 includes a plating solution discharge nozzle 251 and a plating solution supply source 253. The plating solution discharge nozzle 251 may be provided in the form of, for example, a hollow tube. The plating solution discharge nozzle 251 is aligned in a vertical direction. The plating solution discharge nozzle 251 is inserted into an upper wall 241 of the plating bath 240. The plating solution discharge nozzle 251 may be inserted into the hole of the anode electrode 260 such that the lower end is protruded toward the bottom of the anode electrode. The plating solution discharge nozzle 251 is connected to the plating solution supply source 253 by a plating solution supply line 253. A valve 254 is disposed on the plating solution supply line 252 to control a supply flow rate of the plating solution.
An injection plate 255 is provided at the lower end of the plating solution discharge nozzle 251. A plurality of injection holes 255 a are formed in the injection plate 255. The plating solution may uniformly be discharged through the injection holes 255 a. The plating solution discharged through the injection plate 255 is filled in the plating space S formed by the second sidewall 243, the contact plate 245, and the substrate.
Overflow holes 244 are formed on the second sidewall 243 to overflow the plating solution during the plating process. When the level of the plating solution in the plating space S reaches the overflow holes 244, the plating solution is overflowed between the first sidewall 242 and the second sidewall 243 through the overflow holes 244. A drain hole 249 may be formed above the contact plate 245 on the second sidewall 243. The drain hole 249 discharges the plating solution within the plating bath 240 after the plating process in the plating bath 240 is finished.
A plating solution agitation member 270 is disposed between the contact plate 245 and the anode electrode 260. The plating solution agitation member 270 agitates the plating solution supplied to the substrate. Due to the agitation of the plating solution, the plating process may be performed without generating bubbles in a pattern forming portion having high-aspect ratio.
The plating solution agitation member 270 has a disc-shaped agitation plate 272 which is horizontally disposed below the anode electrode 260. A plurality of through holes 273 are formed in the agitation plate 272 to pass the plating solution. The size of the through holes 273 may become smaller toward the periphery from the center of the agitation plate 272. For this reason, much more plating solution is supplied to the center of the substrate, and a much larger intensity of an electric field is formed. Therefore, a plating layer is uniformly deposited by increasing the amount of plating deposition on the center of the substrate. The agitation plate 272 rotates around a self-center axis by a third driving portion 274.
The third driving portion 274 includes a ring-shaped driven gear 275 where tooth profiles are formed at the outer circumference, a disc-shaped driving gear 277 engaged with the driven gear 275, and a driver 279 providing a rotation force to the driving gear 277. The driven gear 275 supports the edge of the lower surface of the agitation plate 272.
Meanwhile, a drip bath 280 is disposed between the plating bath 240 and the bowl 230. The drip bath 280 moves to the outside of the space between the plating bath 240 and the bowl 230 during the plating process. Moreover, the drip bath 280 moves the space between the plating bath 240 and the bowl 230 to receive the plating solution, which falls from the plating bath 240, during the pre-process and post-process.
FIGS. 6 through 10 are views illustrating processes of plating the substrate by using the substrate plating apparatus according to the embodiment of the inventive concept. Referring to FIGS. 2 and 6 through 10, the process of plating the substrate may proceed in the order of substrate loading, pre-wet process, pre-treatment process, plating process, cleaning process, and drying process.
The substrate supporting member 210 may be ascended by the first driver 216 such that the supporting pins 212 and the chuck pins 213 are protruded toward the upper part of the bowl 230. The substrate W, the plating surface of which faces upwardly, is placed on the supporting pins 212 by the main transfer robot 24 (see FIG. 6).
The lateral part of the substrate placed on the supporting pins 212 is supported by the chuck pins 213. Since the lateral parts of the substrate is supported by the chuck pins 213, the substrate may be aligned to the normal position. By the first driving portion 216, the substrate supporting member 210 descends to the position at which the pre-process proceeds.
The pre-process includes the pre-wet process and the pre-treatment process. The de-ionized water supply member 320 is located at the center of the upper part of the substrate by the swing motion of a supporting bar 324. The nozzle 322 discharges the de-ionized water for the pre-wet process onto the plating surface of the substrate, and the substrate rotates as the supporting plate 211 rotates by the first driving portion 216.
When the pre-wet process is finished, the nozzle 322 of the de-ionized water supply member 320 returns to the standby position and the nozzle of the pre-treatment solution supply member 340 is located at the center of the upper part of the substrate. The nozzle supplies the non-additive plating solution to the rotating substrate and executes the pre-treatment process of the substrate. When the pre-treatment process is finished, the nozzle of the pre-treatment solution supply member 340 returns to the standby position (see FIG. 7).
When the pre-process is finished, the drip bath 280 moves to the outside of the space between the plating bath 240 and the bowl 230 by a fourth driving portion 282. By the first driving portion 216, the substrate supporting member 210 ascends to the position at which the plating process proceeds. At this time, the second recovery vessel 234 and the third recovery vessel 236 of the bowl 230 ascend together with the substrate supporting member 210. The upper end of the vertical wall 236 b of the third recovery vessel 236 comes in contact with the lower end of the first sidewall 242 of the plating bath 240, and the coupling plate 234 c of the second recovery vessel 234 comes in contact with the lower end of the second sidewall 243 of the plating bath 240. Moreover, the edge of the substrate comes in contact with the contact part 246 provided at the inner circumference of the lower surface of the contact plate 245.
At this state, the plating solution is supplied from the plating solution discharge nozzle 251. The plating solution is supplied to the plating surface of the substrate W via the injection plate 255 and the plating solution agitation member 270. If the power source is connected to the anode electrode 260, electrons (−) migrate from the anode electrode 260 to the plating surface of the substrate and positive ions (+) of metal are dissolved in the plating solution. If the electrons are gathered on the plating surface of the substrate, the electrons attract the positive ions of metal within the plating solution and a metal layer is plated on the plating surface of the substrate.
The plating solution is successively supplied under the plating process. When the level of the plating solution goes beyond a predetermined level, the plating solution is overflowed between the first sidewall 242 and the second sidewall 243 through the overflow holes 244 formed at the second sidewall 243 of the plating bath 240. The overflowed plating solution is recovered into the third recovery vessel 236, and the recovered plating solution is stored in the recovery tank 239 through the recovery line 238. The plating solution within the plating bath 240 is drained through the drain hole 249 formed at the second sidewall 243 after the plating process is finished (see FIG. 8).
When the plating process is finished, the substrate supporting member 210 may descend while rotating by the first driving portion 216. The plating solution remaining on the upper surface of the substrate is dispersed by the rotation of the substrate supporting member 210 and is recovered into the bowl 230. The substrate supporting member 210 descends to the position of the post-process, and the bowl 230 also descends together with the substrate supporting member 210. After the substrate supporting member 210 descends to the position of the post-process, the drip bath 280 returns to the space between the bowl 230 and the plating bath 240 by the fourth driving portion 282.
The post-process includes the cleaning process and the drying process. The cleaning process includes a chemical solution treatment process and a rinsing process. The nozzle 362 b of the chemical solution supply member 360 is located at the center of the upper part of the substrate by the straight movement of the supporting bar 364. The nozzle 362 b discharges the chemical solution for the chemical solution treatment of the substrate onto the plating surface of the substrate, and the substrate rotates as the supporting plate 211 rotates by the first driving portion 216.
When the chemical solution treatment process is finished, the nozzle 362 b of the chemical solution supply member 360 returns to the standby position, and the nozzle 322 of the de-ionized water supply member 320 is located at the center of the upper part of the substrate. The nozzle 322 supplies the de-ionized water to the rotating substrate and executes the rising process of the substrate. When the rinsing process is finished, the nozzle 322 of the de-ionized water supply member 320 returns to the standby position and the nozzle of the dry gas supply member 380 is located at the center of the upper part of the substrate. The nozzle of the dry gas supply member 380 supplies the dry gas to the rotating substrate and executes the drying process of the substrate. When the drying process is finished, the nozzle of the dry gas supply member 380 returns to the standby position (see FIG. 9).
When the post-process is finished, the substrate supporting member 210 is ascended by the first driving portion such that the supporting pins 212 and the chuck pins 213 are protruded toward the upper part of the bowl 230. The main transfer robot 24 unloads the plated substrate W from the plating chamber (see FIG. 10).
According to the exemplary embodiments of the inventive concept, since the substrate plating apparatus supports the substrate such that the plating surface upwardly faces, it is possible to execute the plating process without turning around the substrate.
Furthermore, according to the embodiment of the inventive concept, it is possible to minimize the plating poor due to the bubbles.
Moreover, according to the embodiment of the inventive concept, it is possible to deposit uniformly the plating layer on the plating surface of the substrate.
In addition, according to the embodiment of the inventive concept, since the substrate plating apparatus executes the pre-process, the plating process, and the post-process in one plating chamber, it is possible to prevent the contamination of the plating solution between different kinds of plating baths.
According to the exemplary embodiments of the inventive concept, it is possible to easily maintain and repair the facilities.
Furthermore, according to the exemplary embodiments of the inventive concept, it is possible to reduce the footprint of the facilities.
The above-disclosed subject matter is to be considered illustrative and not restrictive, and the appended claims are intended to cover all such modifications, enhancements, and other embodiments, which fall within the true spirit and scope of the inventive concept. Thus, to the maximum extent allowed by law, the scope of the inventive concept is to be determined by the broadest permissible interpretation of the following claims and their equivalents, and shall not be restricted or limited by the foregoing detailed description.

Claims

1. An apparatus for electroplating a substrate, comprising:

a substrate supporting member that supports the substrate such that a plating surface of the substrate faces upwardly;

an anode electrode disposed at an upper part of the substrate supporting member;

a power source for applying a voltage to the anode electrode and the substrate; and

a plating solution supply member for supplying a plating solution onto the substrate.

2. The apparatus of claim 1, wherein the plating solution supply member comprises a plating solution discharge nozzle disposed at an upper part of the anode electrode and discharging downwardly the plating solution in a direction toward the substrate.

3. The apparatus of claim 2, further comprising:

a plating bath having an opened lower part and accommodating the plating solution discharge nozzle and the anode electrode therein; and

a first driving portion ascending and descending the substrate supporting member such that the opened lower part of the plating bath is opened and closed by the substrate.

4. The apparatus of claim 3, further comprising:

a ring-shaped contact plate provided at the opened lower part of the plating bath; and

a plurality of metal pins installed at plural places along a circumferential direction of the contact plate and coming in contact with the plating surface of the substrate,

wherein the power source applies the voltage to the plating surface of the substrate through the metal pins.

5. The apparatus of claim 3, wherein the substrate supporting member includes:

a supporting plate;

a plurality of chuck pins installed at edges of the supporting plate so as to be upwardly protruded from the supporting plate; and

a chuck pin transferring unit moving the chuck pins between a supporting position which supports lateral parts of the substrate and a standby position farther away from a center of the supporting plate compared to the supporting position,

wherein the chuck pin transferring unit includes:

a plurality of movable roads disposed inside the supporting plate in a radial manner, the chuck pins being coupled to one end of a respective of each of the movable roads;

a vertical road provided inside a supporting shaft coupled to a lower part of the supporting plate so as to be movable in a vertical direction;

connection members, one end of the connection members being hinge-coupled to the other end of a respective one of each of the movable roads, and the other end of the connection members being hinge-coupled to an upper end of the vertical road; and

a second driving portion ascending and descending the vertical road.

6. The apparatus of claim 3, further comprising: a plating solution agitation member provided below the anode electrode inside the plating bath and agitating the plating solution supplied onto the substrate from the plating solution discharge nozzle.

7. The apparatus of claim 6, wherein the plating solution agitation member includes:

an agitation plate disposed below the anode electrode, a plurality of through holes are formed in the agitation plate to pass the plating solution therethrough; and

a third driving portion for rotating the agitation plate around a self-center axis perpendicular to the agitation plate.

8. The apparatus of claim 7, wherein a size of the through holes become smaller toward a periphery of the agitation plate from a center of the agitation plate.

9. The apparatus of claim 3, further comprising:

a bowl provided below the plating bath so as to surround the substrate supporting member of a descent position; and

a treatment fluid supply member provided outside the bowl,

wherein the treatment fluid supply member includes a de-ionized water supply member, a pre-treatment solution supply member, a chemical solution supply member and a dry gas supply member,

wherein the de-ionized water supply member supplies de-ionized water for rinsing the substrate before and after a plating process on the substrate, the pre-treatment solution supply member supplies non-additive plating solution for pre-treating the substrate after the rinsing process on the substrate, the chemical solution supply member supplies a chemical solution to clean the substrate after the plating process on the substrate and the dry gas supply member supplies dry gas to dry the substrate after the plating, the rinsing and the cleaning processes, and

wherein the bowl recovers at least one of the de-ionized water, the non-additive plating solution and the cleaning solution dispersed by rotation of the substrate.

10. The apparatus of claim 9, further comprising:

a drip bath provided between the plating bath and the bowl to receive the plating solution falling from the plating bath; and

a fourth driving portion moving the drip bath across inside and outside of a space between the plating bath and the bowl.

11. The apparatus of claim 9, wherein the plating bath includes:

an upper wall;

a first sidewall extending downwardly from an edge of the upper wall;

a second sidewall provided inside the first sidewall to surround the anode electrode and extending downwardly from the upper wall; and

a ring-shaped contact plate coupled to a lower end of the second sidewall and coming in contact with an edge of the substrate due to the ascent of the substrate supporting member,

wherein the second sidewall is formed with a plurality of overflow holes that cause the plating solution filled in a plating space formed by the second sidewall, the contact plate, and the substrate to overflow between the first sidewall and the second sidewall.

12. The apparatus of claim 11, wherein the bowl includes:

a first recovery vessel surrounding the substrate supporting member and having an opened upper part;

a second recovery vessel having vessel-shaped upper and lower parts and provided to be movable in a vertical direction along a sidewall of the first recovery vessel; and

a third recovery vessel coupled to the second recovery vessel to surround the second recovery vessel, an upper end of the third recovery vessel coming in contact with a lower end of the first sidewall of the plating bath by an ascent of the second recovery vessel, and

the plating solution, which is overflowed between the first and second sidewalls of the plating bath, is recovered into the third recovery vessel.

13. The apparatus of claim 12, wherein the second recovery vessel includes:

a ring-shaped outside vertical wall disposed outside the first recovery vessel;

a ring-shaped inside vertical wall disposed inside the first recovery vessel and surrounding the substrate supporting member; and

a ring-shaped coupling plate that is coupled to an upper end of the inside vertical wall and an upper end of the outside vertical wall, and

an opening area of the coupling plate is smaller than an area of the supporting plate of the substrate supporting member such that the second recovery vessel ascends and descends by the ascent and descent of the substrate supporting member, and the coupling plate comes in contact with the lower end of the second sidewall of the plating bath by the ascent of the second recovery vessel.

14-20. (canceled)