US20110120017A1 - Variable seal pressure slit valve doors for semiconductor manufacturing equipment - Google Patents
Variable seal pressure slit valve doors for semiconductor manufacturing equipment Download PDFInfo
- Publication number
- US20110120017A1 US20110120017A1 US12/949,231 US94923110A US2011120017A1 US 20110120017 A1 US20110120017 A1 US 20110120017A1 US 94923110 A US94923110 A US 94923110A US 2011120017 A1 US2011120017 A1 US 2011120017A1
- Authority
- US
- United States
- Prior art keywords
- pressure
- door
- chamber
- slit valve
- actuator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05F—DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION; CHECKS FOR WINGS; WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05F15/00—Power-operated mechanisms for wings
- E05F15/50—Power-operated mechanisms for wings using fluid-pressure actuators
-
- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05F—DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION; CHECKS FOR WINGS; WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05F15/00—Power-operated mechanisms for wings
- E05F15/50—Power-operated mechanisms for wings using fluid-pressure actuators
- E05F15/56—Power-operated mechanisms for wings using fluid-pressure actuators for horizontally-sliding wings
-
- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05Y—INDEXING SCHEME RELATING TO HINGES OR OTHER SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS AND DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION, CHECKS FOR WINGS AND WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05Y2201/00—Constructional elements; Accessories therefore
- E05Y2201/40—Motors; Magnets; Springs; Weights; Accessories therefore
- E05Y2201/43—Motors
- E05Y2201/448—Fluid motors; Details thereof
- E05Y2201/458—Valves
-
- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05Y—INDEXING SCHEME RELATING TO HINGES OR OTHER SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS AND DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION, CHECKS FOR WINGS AND WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05Y2800/00—Details, accessories and auxiliary operations not otherwise provided for
- E05Y2800/10—Additional functions
- E05Y2800/12—Sealing
Abstract
Techniques for a door system for sealing an opening between two chambers in a semiconductor processing system are described. A sealing member seals the opening when a door is in a closed position. To selectively open and close the opening, an actuator moves the door. A valve actuator switch provides a first or second pressure to the actuator depending on the pressure inside a first chamber. In one embodiment, a sensor monitors the pressure inside the first chamber.
Description
- The present application is a divisional of U.S. patent application Ser. No. 10/990,125, filed Nov. 16, 2004, entitled “Variable Seal Pressure Slit Valve Doors for Semiconductor Manufacturing Equipment,” which claims the benefit of U.S. Provisional Application No. 60/576,737, filed Jun. 2, 2004, entitled “Variable Seal Pressure Slit Valve Doors for Semiconductor Manufacturing Equipment,” the disclosures of which are incorporated herein by reference for all purposes.
- The present invention generally relates to the construction of vacuum processing chambers used for processing substrates, and more specifically to techniques for variable seal pressure slit valve doors.
- In general, vacuum processing chambers for processing substrates include a substrate transfer opening, commonly known as a slit valve. A slit opening, a tunnel-like passage associated with the slit valve, is used to transfer substrates between a process chamber, also called a reactor chamber, and a transfer chamber. The slit valve opening is commonly sealed at an outside surface of the process chamber body by a blocking plate which moves over the slit valve opening. This blocking plate is a conventional slit valve door. A perfluoro elastomeric o-ring is generally attached to the conventional slit valve door to provide a seal.
- During processing, a high slit valve door sealing pressure is applied, typically about 80 psi to 90 psi, due to a large pressure gradient between the process and transfer chambers. High pressure, in the range of about 10 to 760 torr, is often used in a process chamber to enhance the process being performed, such as during wafer film deposition. Meanwhile, the transfer chamber is usually kept at 0.3 torr. The high sealing pressure introduces a tensile stress on the exposed surface of the tightly compressed o-ring.
- During a chamber cleaning process, the process chamber is usually at a much lower pressure, in the range of about 1 to 4 torr. The slit door, including the o-ring, is exposed to cleaning gases. These cleaning gases, such as fluorine, attack the chemical composition of the o-ring causing the formation of particle contaminants. These particles can contaminate the process chamber and damage substrates.
- Until now there has been no satisfactory solution to overcome o-ring contaminants for a slit valve door due to chemical attack, in that conventional vacuum processing chambers are constructed in a configuration that gives rise to particles from o-rings in the process chamber.
- The present invention recognizes that the severity of the chemical attack on the exposed surface of o-ring is dependent on the level of tensile (or shear) stress experienced. Embodiments of the present invention provide techniques for a door system for sealing an opening between two chambers in a semiconductor processing system. The sealing pressure is adjusted to reduce the stress on the sealing member for the slit valve door. In this way, the chemical attack on the sealing member is reduced. Consequently, degradation of the sealing member is diminished and particle contamination is decreased.
- According to an embodiment of the present invention, the door system for sealing an opening between two chambers in a semiconductor processing system includes a door, sealing member, actuator, and valve actuator switch. The sealing member seals the opening when the door is in a closed position. To selectively open and close the opening, the actuator moves the door. The valve actuator switch provides a first or second pneumatic pressure to the actuator depending on a pressure inside a chamber.
- According to an another embodiment, a method for sealing an opening between two chambers in a semiconductor processing device includes providing a slit door having an o-ring mounted along edges of the slit door. The opening is closed with the slit door. In the closed position, the opening is sealed with the o-ring by applying pressure to the slit door. The pressure applied to the slit door in the closed position depends on a pressure gradient between the two chambers.
- In yet another embodiment, a method for sealing an opening between two regions in a semiconductor processing device is provided. During forming a film on a substrate position in a first region of the two regions, a first sealing pressure on a door is applied. Next, during cleaning of the first region, a second sealing pressure on the door is applied. The first sealing pressure is greater than the second sealing pressure.
- The foregoing, together with other features, embodiments, advantages of the present invention, will become more apparent when referring to the following specification, claims, and accompanying drawings.
-
FIG. 1 shows a simplified flow diagram of sealing a slit valve opening between two chambers in a vacuum processing chamber system according to an embodiment of the invention. -
FIG. 2 is a simplified block diagram illustrating an exemplary vacuum processing chamber system according to an embodiment of the present invention. -
FIG. 3 is a simplified block diagram illustrating a second exemplary vacuum processing chamber system according to an embodiment of the present invention. -
FIG. 4 is a front view of the slit valve and slit valve door according to an embodiment of the present invention. -
FIG. 5 is a cross-sectional side view of a slit valve according to an embodiment of the present invention. -
FIGS. 6( a) and 6(b) are simplified cross-sectional views of the actuator mechanism for the slit valve door according to an embodiment of the present invention in an open position and closed position, respectively. - Embodiments of the present invention provide techniques for a door system for sealing an opening between two chambers in a semiconductor processing system and, more particularly, techniques to substantially reduce particle contaminants from a slit valve o-ring due to a chamber cleaning process. The inventors recognize that slit valve o-rings, generally perfluoro elastomers, are chemically attacked more severely when under tensile (or shear) stress by the chemical species used during the chamber cleaning process, such as fluorine and nitrogen trifluoride (NF3). Accordingly, the present approach decouples the slit valve sealing pressure during the chamber cleaning process from the deposition process. Since the pressure is lower in the process chamber during the cleaning process, the slit valve sealing pressure can be lower during the chamber cleaning process than the deposition process. Slit valve sealing process is dependent on the pressure gradient between the transfer and process chambers to ensure maintenance of a proper seal.
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FIG. 1 shows a simplified flow diagram of sealing a slit valve opening between two chambers in a vacuum processing chamber system according to an embodiment of the invention. Insteps step 106, a first sealing pressure is applied to the slit valve door to seal the slit valve opening. Once the process chamber is sealed from the transfer chamber, deposition processing on the substrate can begin. During the deposition process, the process chamber is at a first pressure, which is generally much greater than the pressure in the transfer chamber. - After completion of the deposition process, a chamber cleaning process commences in
step 110. The pressure in the process chamber during the chamber cleaning process is generally lower than the pressure during the deposition process. Instep 114, a second sealing pressure is applied to the slit valve door to maintain the seal. According to an embodiment of the present invention, the second sealing pressure can be lower than the first sealing pressure. After completion of the chamber cleaning process instep 116, the slit valve door can be opened and the processed substrate can be removed from the process chamber as shown insteps step 112, the pressure gradient between the process chamber and transfer chamber can be determined or, alternatively, the pressure inside the process chamber can be determined. This information can be used to apply the appropriate second sealing pressure instep 114. - Although the steps above are listed in a specific order, the steps may take place in any order, as desired and depending on the specific application. These are general steps that may be applied to processing a semiconductor substrate. There may be additional or other steps, which may replace one or more above steps. Certain steps may be repeated. For example, the determine pressure gradient step may be done periodically at any division of time (e.g., every second, minute, hour, or day) or continuously during substrate processing.
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FIG. 2 is a simplified block diagram illustrating an exemplary vacuumprocessing chamber system 200 according to an embodiment of the present invention.Transfer chamber 202 is connected to processchamber 204 through aslit valve 206 and slitvalve opening 218. -
Slit valve 206 has a slitvalve door 208 movable in a direction generally parallel to the plane of theslit valve opening 218.Rods 212 connect slitvalve door 208 to thepneumatic actuator 210. In order to moverods 212, and thus slitvalve door 208, thepneumatic actuator 210 applies or relaxes sealing pressure torods 212. - Pressurized gas is provided to
pneumatic actuator 210 fromactuator switch 214.Actuator switch 214 can supplypneumatic actuator 210 with either a first or second pressure level. The first pressure level provides sufficient slit valve sealing pressure to seal theslit valve opening 218 when a high pressure gradient exists between thetransfer chamber 202 and theprocess chamber 204. This pressure gradient can be up to about 600 torr to about 760 torr during deposition processing of substrates. In order to provide proper seal under such conditions, the first pressure level can exceed 45 psi. In one embodiment, the first pressure level is the pressure supplied bypressurized gas source 216. - The second pressure provided by
actuator switch 214 is lower, and in some embodiments substantially lower, than the first pressure level. The second pressure level provides sufficient slit valve sealing pressure to seal theslit valve opening 218 when a lower pressure gradient exists between thetransfer chamber 202 and theprocess chamber 204. During the chamber cleaning process, this pressure gradient can be in the range of about 3 torr to about 10 torr. Under these conditions, the second pressure level can be about 20 psi, 10 psi, 5 psi, or even smaller. - In alternative embodiments,
actuator switch 214 can supply gas topneumatic actuator 210 at a plurality of pressure levels, for example, three, four, five, or more pressure levels. In this way, a closer minimum pressure level capable of sealing the slit valve opening 218 of the plurality of pressure levels for pressure gradient can be supplied topneumatic actuator 210. -
Pressurized gas source 216 suppliesactuator switch 214 with pressurized gas. The pressure level supplied by thepressurized gas source 216 is at least the maximum pressure level needed by vacuumprocessing chamber system 200, such as at least 45 psi.Pressurized gas source 216 can typically provide gas at about 80 psi to about 90 psi since semiconductor fabrication facilities generally provide pressurized gas lines operating at about 80 psi to about 90 psi. - In the specific embodiment of
FIG. 2 ,sensor 220 is provided to measure the pressure insideprocess chamber 204.Sensor 220 can send a signal when a preset pressure threshold is detected toactuator switch 214. This signal can be pneumatic or electrical, and analog or digital. Theactuator switch 214 then adjusts the sealing pressure level based on the information provided by thesensor 220. Alternatively,sensor 220 can transmit real-time data representing the measured pressure toactuator switch 214. Data transmission can be continuous or made at discrete intervals, such as every second, minute, or hour. In an alternative embodiment,sensor 220 can measure other environmental parameters insideprocess chamber 204, such as humidity, temperature, or chemical environment, to determine whether theprocess chamber 204 is being used for deposition processing or chamber cleaning. For example,sensor 220 could be used to detect the presence of chemical species used for cleaning. If cleaning chemicals are found in a sufficient concentration, theactuator switch 214 can apply a reduced slit value sealing pressure. - In yet another alternative embodiment, vacuum
processing chamber system 200 can signal theactuator switch 214 using a timer circuit (not shown). The timer circuit is synchronized at the start of wafer processing and configured to notifyactuator switch 214 at the completion of one or more wafer processing steps. For example, if a chamber cleaning process is scheduled to begin after a 30 minute deposition process, timer circuit can send a signal toactuator switch 214 after 30 minutes. Accordingly,actuator switch 214 can then reduce the slit valve sealing pressure during the cleaning process. A delay in the timer circuit signal may be introduced to ensure the pressure inprocess chamber 204 has dropped to the lower pressure expected for the chamber cleaning process before theactuator switch 214 reduces the sealing pressure. -
FIG. 3 is a simplified block diagram illustrating a second exemplary vacuum processing chamber system according to an embodiment of the present invention. Vacuumprocessing chamber system 200 includes asecond sensor 302 to monitor the pressure intransfer chamber 202. In this implementation, the pressure gradient existing between theprocess chamber 204 andtransfer chamber 202 can be calculated bycontrol logic 304 as the difference from the measured values ofsensor 118 and thesecond sensor 302.Control logic 304 can then directactuator switch 214 to supply an appropriate pressure level topneumatic actuator 210. Alternatively, a differential pressure switch can be used to monitor the pressure differences betweentransfer chamber 202 andprocess chamber 204. However, astransfer chamber 202 is typically maintained at about 0.3 torr during both the deposition process and chamber cleaning process,second sensor 302 may be unnecessary. Of course, even under such circumstances,second sensor 302 and the calculated pressure gradient can be used as a mechanism to verify pressure levels for improved accuracy, reliability, or safety. -
FIG. 4 is a front view ofslit valve 206 and slitvalve door 208 according to an embodiment of the present invention. As illustrated inFIG. 4 , sealingmember 402 is attached toslit valve door 208. While in one embodiment, sealingmember 402 is a perfluoro elastomeric o-ring, in other embodiments, sealingmember 402 may be any suitable sealing device with elastic properties. -
FIG. 4 also showstravel tubes 404.Travel tubes 404 allowrods 212 to pass throughslit valve 206 and attach toslit valve door 208. Although twotravel tubes 404 are depicted for tworods 212, one of ordinary skill will recognize that the present invention can use one, two, three, ormore rods 212, and may accordingly required a corresponding number oftravel tubes 404. -
FIG. 5 is a cross-sectional side view ofslit valve 206. As shownFIG. 5 , sealingmember 402 surrounds the circumference ofsilt valve opening 218 to form a seal when slitvalve door 208 is in the closed position. -
FIG. 6( a) illustrates slitdoor 208 in an open position to allow substrates to pass betweentransfer chamber 202 to processchamber 204 through theslit valve opening 218. -
FIG. 6( b) illustrates slitdoor 208 in a closed position to sealtransfer chamber 202 fromprocess chamber 204.Rods 212, which pass throughtravel tubes 404, are attached toslit door 208. To close slitdoor 208,rods 212 are extended bypneumatic actuator 210. - Although specific embodiments of the invention have been described, various modifications, alterations, alternative constructions, and equivalents are also encompassed within the scope of the invention. The described invention is not restricted to operation within certain chamber processing environments, but is free to operate within a plurality of processing environments. Additionally, although the present invention has been described using a particular series of steps, it should be apparent to those skilled in the art that the scope of the present invention is not limited to the described series of steps.
- Further, while the present invention has been described using a particular combination of hardware and software in the form of control logic and programming code and instructions, it should be recognized that other combinations of hardware and software are also within the scope of the present invention. Aspects of the present invention may be implemented only in hardware, or only in software, or using combinations thereof.
- It is understood that the examples and embodiments described herein are for illustrative purposes only and that various modifications or changes in light thereof will be suggested to persons skilled in the art and are to be included within the spirit and purview of this application and scope of the appended claims.
Claims (12)
1. A door system for sealing an opening between two chambers in a semiconductor processing system, the door system comprising:
a door;
a sealing member to seal the opening when the door is in a closed position;
an actuator to move the door to selectively open and close the opening;
a valve actuator switch configured to provide a first pressure and a second pressure to the actuator; and
wherein a pressure provided by the valve actuator to the actuator depends on a pressure inside a first chamber of the two chambers.
2. The system of claim 1 wherein the door is moveable generally parallel to a plane of the opening.
3. The system of claim 1 further comprising a sensor coupled to the valve actuator to measure the pressure inside the first chamber.
4. The system of claim 1 wherein the sealing member comprises an o-ring.
5. The system of claim 4 wherein the o-ring comprises a perfluoro elastomer.
6. The system of claim 4 wherein the o-ring is mounted along edges of the door.
7. The system of claim 1 wherein the first pressure is in a range of about 5 psi to about 20 psi.
8. The system of claim 7 wherein the first pressure is provided to the actuator when the pressure inside the first chamber is in the range of about 0.3 torr to about 10 torr.
9. The system of claim 7 wherein the second pressure is in the range of about 45 psi to about 90 psi.
10. The system of claim 9 wherein the second pressure is provided to the actuator when the pressure inside the first chamber is in the range of about 600 torr to about 760 torr.
11. The system of claim 1 wherein the door is a slit door.
12. The system of claim 1 wherein a pressure in a second chamber of the two chambers is in about the range of 0.3 torr to 10 torr.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US12/949,231 US20110120017A1 (en) | 2004-06-02 | 2010-11-18 | Variable seal pressure slit valve doors for semiconductor manufacturing equipment |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US57673704P | 2004-06-02 | 2004-06-02 | |
US10/990,125 US7841582B2 (en) | 2004-06-02 | 2004-11-16 | Variable seal pressure slit valve doors for semiconductor manufacturing equipment |
US12/949,231 US20110120017A1 (en) | 2004-06-02 | 2010-11-18 | Variable seal pressure slit valve doors for semiconductor manufacturing equipment |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/990,125 Division US7841582B2 (en) | 2004-06-02 | 2004-11-16 | Variable seal pressure slit valve doors for semiconductor manufacturing equipment |
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US20110120017A1 true US20110120017A1 (en) | 2011-05-26 |
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Application Number | Title | Priority Date | Filing Date |
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US10/990,125 Expired - Fee Related US7841582B2 (en) | 2004-06-02 | 2004-11-16 | Variable seal pressure slit valve doors for semiconductor manufacturing equipment |
US12/949,231 Abandoned US20110120017A1 (en) | 2004-06-02 | 2010-11-18 | Variable seal pressure slit valve doors for semiconductor manufacturing equipment |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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US10/990,125 Expired - Fee Related US7841582B2 (en) | 2004-06-02 | 2004-11-16 | Variable seal pressure slit valve doors for semiconductor manufacturing equipment |
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US20080087214A1 (en) * | 2006-08-04 | 2008-04-17 | Jae-Chull Lee | Load lock chamber with decoupled slit valve door seal compartment |
US20130153547A1 (en) * | 2010-07-02 | 2013-06-20 | Kazuhiko Katsumata | Multi-chamber heat treatment device |
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US7841582B2 (en) * | 2004-06-02 | 2010-11-30 | Applied Materials, Inc. | Variable seal pressure slit valve doors for semiconductor manufacturing equipment |
US20050268857A1 (en) * | 2004-06-02 | 2005-12-08 | Applied Materials, Inc. | Uniformly compressed process chamber gate seal for semiconductor processing chamber |
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US20080087214A1 (en) * | 2006-08-04 | 2008-04-17 | Jae-Chull Lee | Load lock chamber with decoupled slit valve door seal compartment |
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US20130153547A1 (en) * | 2010-07-02 | 2013-06-20 | Kazuhiko Katsumata | Multi-chamber heat treatment device |
WO2018209225A1 (en) * | 2017-05-11 | 2018-11-15 | E-Seismic Solutions, Llc | Seismic event responsive alert and utilities control system having a utilities control unit |
TWI716047B (en) * | 2018-07-27 | 2021-01-11 | 台灣積體電路製造股份有限公司 | Vacuum valve monitoring system and method |
US11435257B2 (en) | 2018-07-27 | 2022-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for monitoring vacuum valve closing condition in vacuum processing system |
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US20050269334A1 (en) | 2005-12-08 |
US7841582B2 (en) | 2010-11-30 |
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