US20110169892A1 - Inkjet nozzle incorporating actuator with magnetic poles - Google Patents
Inkjet nozzle incorporating actuator with magnetic poles Download PDFInfo
- Publication number
- US20110169892A1 US20110169892A1 US13/052,995 US201113052995A US2011169892A1 US 20110169892 A1 US20110169892 A1 US 20110169892A1 US 201113052995 A US201113052995 A US 201113052995A US 2011169892 A1 US2011169892 A1 US 2011169892A1
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- US
- United States
- Prior art keywords
- nozzle
- ink
- layer
- etch
- piston
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Abstract
A nozzle for an inkjet printer includes a roof layer defining a nozzle port; a substrate layer defining a nozzle chamber wall supporting the roof layer; an actuator assembly attached to the substrate, the actuator assembly including a support and a lever arm cantilevered from the support to terminate in a piston within the nozzle chamber wall; and a solenoid provided at an end of the lever arm opposite to that of the piston, the solenoid including a movable magnetic pole and a fixed magnetic pole spaced apart from the movable magnetic pole.
Description
- The present application is a continuation of U.S. application Ser. No. 12/493,241 filed Jun. 29, 2009, which is a continuation of U.S. application Ser. No. 11/778,572 filed on Jul. 16, 2007, now issued as U.S. Pat. No. 7,566,113, which is a continuation of U.S. application Ser. No. 11/349,074 filed on Feb. 8, 2006, now issued as U.S. Pat. No. 7,255,424 which is a continuation of U.S. application Ser. No. 10/982,789 filed on Nov. 8, 2004, now issued as U.S. Pat. No. 7,086,720, which is a continuation of U.S. application Ser. No. 10/421,823 filed on Apr. 24, 2003, now issued as U.S. Pat. No. 6,830,316, which is a continuation of U.S. application Ser. No. 09/113,122 filed on Jul. 10, 1998, now issued as U.S. Pat. No. 6,557,977 all of which are herein incorporated by reference.
- The following US patents and US patent applications are hereby incorporated by cross-reference.
-
-
6,041,600 6,231,772 6,258,284 6,312,615 6,459,495 6,044,646 6,231,773 6,258,285 6,315,200 6,472,052 6,067,797 6,234,609 6,260,953 6,315,914 6,476,863 6,071,750 6,234,610 6,264,306 6,317,192 6,486,886 6,087,638 6,234,611 6,264,307 6,318,849 6,491,833 6,106,147 6,235,211 6,264,849 6,322,181 6,542,645 6,110,754 6,235,212 6,264,850 6,329,990 6,557,977 6,137,500 6,238,033 6,267,469 6,331,258 6,565,762 6,152,619 6,238,040 6,267,904 6,336,710 6,597,817 6,171,875 6,238,111 6,267,905 6,338,547 6,614,560 6,180,427 6,239,821 6,270,182 6,340,222 6,624,848 6,188,415 6,241,342 6,271,931 6,350,023 6,636,216 6,190,931 6,241,904 6,274,056 6,353,772 6,646,757 6,195,150 6,241,905 6,280,643 6,356,715 6,665,008 6,196,541 6,241,906 6,283,581 6,357,135 6,665,454 6,196,739 6,243,113 6,283,582 6,362,843 6,690,416 6,209,989 6,244,691 6,284,147 6,362,868 6,690,419 6,213,588 6,245,247 6,286,935 6,362,869 6,727,948 6,213,589 6,247,790 6,289,262 6,366,693 6,727,951 6,214,244 6,247,791 6,290,861 6,378,970 6,750,901 6,217,153 6,247,792 6,290,862 6,381,361 6,786,420 6,217,165 6,247,793 6,293,653 6,382,769 6,788,336 6,220,694 6,247,794 6,293,658 6,390,603 6,831,681 6,224,780 6,247,795 6,294,101 6,394,581 6,850,274 6,225,138 6,247,796 6,299,300 6,398,328 6,866,789 6,227,648 6,248,248 6,299,786 6,415,054 6,879,341 6,227,652 6,248,249 6,302,528 6,416,167 6,894,694 6,227,653 6,251,298 6,304,291 6,416,168 7,050,143 6,227,654 6,254,220 6,305,770 6,416,679 7,110,024 6,228,668 6,254,793 6,306,671 6,431,669 6,451,216 6,231,148 6,257,704 6,312,070 6,431,704 6,312,107 6,231,163 6,257,705 - This invention relates to the use of a shape memory alloy in a micro-electromechanical fluid ejection device. The present invention also relates to ink jet printing and in particular discloses a shape memory alloy ink jet printer. The present invention further relates to the field of drop on demand ink jet printing.
- Many different types of printing have been invented, a large number of which are presently in use. The known forms of print have a variety of methods for marking the print media with a relevant marking media. Commonly used forms of printing include offset printing, laser printing and copying devices, dot matrix type impact printers, thermal paper printers, film recorders, thermal wax printers, dye sublimation printers and ink jet printers both of the drop on demand and continuous flow type. Each type of printer has its own advantages and problems when considering cost, speed, quality, reliability, simplicity of construction and operation etc.
- In recent years, the field of ink jet printing, wherein each individual pixel of ink is derived from one or more ink nozzles has become increasingly popular primarily due to its inexpensive and versatile nature.
- Many different techniques on ink jet printing have been invented. For a survey of the field, reference is made to an article by J Moore, “Non-Impact Printing: Introduction and Historical Perspective”, Output Hard Copy Devices, Editors R Dubeck and S Sherr, pages 207-220 (1988).
- Ink Jet printers themselves come in many different types. The utilisation of a continuous stream ink in ink jet printing appears to date back to at least 1929 wherein U.S. Pat. No. 1,941,001 by Hansell discloses a simple form of continuous stream electro-static ink jet printing.
- U.S. Pat. No. 3,596,275 by Sweet also discloses a process of a continuous ink jet printing including the step wherein the ink jet stream is modulated by a high frequency electro-static field so as to cause drop separation. This technique is still utilized by several manufacturers including Elmjet and Scitex (see also U.S. Pat. No. 3,373,437 by Sweet et al)
- Piezoelectric ink jet printers are also one form of commonly utilized ink jet printing device. Piezoelectric systems are disclosed by Kyser et. al. in U.S. Pat. No. 3,946,398 (1970) which utilizes a diaphragm mode of operation, by Zolten in U.S. Pat. No. 3,683,212 (1970) which discloses a squeeze mode of operation of a piezoelectric crystal, Stemme in U.S. Pat. No. 3,747,120 (1972) discloses a bend mode of piezoelectric operation, Howkins in U.S. Pat. No. 4,459,601 discloses a piezoelectric push mode actuation of the ink jet stream and Fischbeck in U.S. Pat. No. 4,584,590 which discloses a shear mode type of piezoelectric transducer element.
- Recently, thermal ink jet printing has become an extremely popular form of ink jet printing. The ink jet printing techniques include those disclosed by Endo et al in GB 2007162 (1979) and Vaught et al in U.S. Pat. No. 4,490,728. Both the aforementioned references disclosed ink jet printing techniques rely upon the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture connected to the confined space onto a relevant print media. Manufacturers such as Canon and Hewlett Packard manufacture printing devices utilizing the electro-thermal actuator.
- As can be seen from the foregoing, many different types of printing technologies are available. Ideally, a printing technology should have a number of desirable attributes. These include inexpensive construction and operation, high-speed operation, safe and continuous long-term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction operation, durability and consumables.
- According to an aspect of the present disclosure, a nozzle for an inkjet printer, the nozzle comprises a roof layer defining a nozzle port; a substrate layer defining a nozzle chamber wall supporting the roof layer; an actuator assembly attached to the substrate, the actuator assembly including a support and a lever arm cantilevered from the support to terminate in a piston within the nozzle chamber wall; and a solenoid provided at an end of the lever arm opposite to that of the piston, the solenoid including a movable magnetic pole and a fixed magnetic pole spaced apart from the movable magnetic pole.
- Notwithstanding any other forms which may fall within the scope of the present invention, preferred forms of the invention will now be described, by way of example only, with reference to the accompanying drawings in which:
-
FIG. 1 is an exploded, perspective view of a single ink jet nozzle as constructed in accordance with the preferred embodiment of the invention; -
FIG. 2 is a cross-sectional view of a single ink jet nozzle in its quiescent state taken along line A-A inFIG. 1 ; -
FIG. 3 is a top cross sectional view of a single ink jet nozzle in its actuated state taken along line A-A inFIG. 1 ; -
FIG. 4 provides a legend of the materials indicated inFIGS. 5 to 15 ; -
FIG. 5 toFIG. 15 illustrate sectional views of the manufacturing steps in one form of construction of an ink jet printhead nozzle; -
FIG. 16 is an exploded perspective view illustrating the construction of a single ink jet nozzle of U.S. patent application Ser. No. 09/113,097 by the Applicant, referred to in the table of cross-referenced material as set out above; -
FIG. 17 is a perspective view, in part in section, of the ink jet nozzle ofFIG. 16 ; -
FIG. 18 provides a legend of the materials indicated inFIGS. 19 to 35 ; -
FIGS. 19 to 35 illustrate sectional views of the manufacturing steps in one form of construction of the ink jet printhead nozzle ofFIG. 16 ; -
FIG. 36 is a cut-out top view of an ink jet nozzle of U.S. patent application Ser. No. 09/113,061 by the Applicant, referred to in the table of cross-referenced material as set out above; -
FIG. 37 is an exploded perspective view illustrating the construction of the ink jet nozzle ofFIG. 36 ; -
FIG. 38 provides a legend of the materials indicated inFIGS. 39 to 59( a); and -
FIGS. 39 to 59(A) illustrate sectional views of the manufacturing steps in one form of construction of the ink jet printhead nozzle ofFIG. 36 . - In the preferred embodiment, shape memory materials are utilised to construct an actuator suitable for injecting ink from the nozzle of an ink chamber.
- Turning to
FIG. 1 , there is illustrated an explodedperspective view 10 of a single ink jet nozzle as constructed in accordance with the preferred embodiment. Theink jet nozzle 10 is constructed from a silicon wafer base utilizing back etching of the wafer to a boron doped epitaxial layer. Hence, theink jet nozzle 10 comprises alower layer 11 which is constructed from boron-doped silicon. The boron doped silicon layer is also utilized as a crystallographic etch stop layer. The next layer comprises thesilicon layer 12 that includes a crystallographic pit that defines anozzle chamber 13 having side walls etched at the conventional angle of 54.74 degrees. Thelayer 12 also includes the various required circuitry and transistors for example, a CMOS layer (not shown). After this, a 0.5-micron thick thermalsilicon oxide layer 15 is grown on top of thesilicon wafer 12. - After this, come various layers which can comprise two-level metal CMOS process layers which provide the metal interconnect for the CMOS transistors formed within the
layer 12. The various metal pathways etc. are not shown inFIG. 1 but for twometal interconnects memory alloy layer 20 and the CMOS metal layers 16. The shape memory metal layer is next and is shaped in the form of a serpentine coil to be heated by end interconnect/viaportions top nitride layer 22 is provided for overall passivation and protection of lower layers in addition to providing a means of inducing tensile stress to curl the shapememory alloy layer 20 in its quiescent state. - The preferred embodiment relies upon the thermal transition of a shape memory alloy 20 (SMA) from its martensitic phase to its austenitic phase. The basis of a shape memory effect is a martensitic transformation from a thermoelastic martensite at a relatively low temperature to an austenite at a higher temperature. The thermal transition is achieved by passing an electrical current through the SMA. The
layer 20 is suspended at the entrance to a nozzle chamber connected via leads 18, 19 to thelayers 16. - In
FIG. 2 , there is shown a cross-section of asingle nozzle 10 when in its quiescent state, the section being taken through the line A-A ofFIG. 1 . An actuator 30 that includes thelayers nozzle port 47 when in its quiescent state. InFIG. 3 , there is shown a corresponding cross-section for thenozzle 10 when in an actuated state. When energized, theactuator 30 straightens, with the corresponding result that the ink is pushed out of the nozzle. The process of energizing theactuator 30 requires supplying enough energy to raise theSMA layer 20 above its transition temperature so that theSMA layer 20 moves as it is transformed into its austenitic phase. - The SMA martensitic phase must be pre-stressed to achieve a different shape from the austenitic phase. For printheads with many thousands of nozzles, it is important to achieve this pre-stressing in a bulk manner. This is achieved by depositing the layer of
silicon nitride 22 using Plasma Enhanced Chemical Vapour Deposition (PECVD) at around 300° C. over the SMA layer. The deposition occurs while the SMA is in the austenitic shape. After the printhead cools to room temperature the substrate under the SMA bend actuator is removed by chemical etching of a sacrificial substance. Thesilicon nitride layer 22 is thus placed under tensile stress and curls away from thenozzle port 47. The weak martensitic phase of the SMA provides little resistance to this curl. When the SMA is heated to its austenitic phase, it returns to the flat shape into which it was annealed during the nitride deposition. The transformation is rapid enough to result in the ejection of ink from the nozzle chamber. - There is one
SMA bend actuator 30 for each nozzle. Oneend 31 of theSMA bend actuator 30 is mechanically connected to the substrate. The other end is free to move under the stresses inherent in the layers. - Returning to
FIG. 1 , the actuator layer is composed of three layers: -
- 1. The SiO2
lower layer 15. This layer acts as a stress ‘reference’ for the nitride tensile layer. It also protects the SMA from the crystallographic silicon etch that forms the nozzle chamber. This layer can be formed as part of the standard CMOS process for the active electronics of the printhead. - 2. An
SMA heater layer 20. An SMA such as a nickel titanium (NiTi) alloy is deposited and etched into a serpentine form to increase the electrical resistance so that the SMA is heated when an electrical current is passed through the SMA. - 3. A silicon
nitride top layer 22. This is a thin layer of high stiffness which is deposited using PECVD. The nitride stoichiometry is adjusted to achieve a layer with significant tensile stress at room temperature relative to the SiO2 lower layer. Its purpose is to bend the actuator at the low temperature martensitic phase, away from thenozzle port 47.
- 1. The SiO2
- As noted previously, the ink jet nozzle of
FIG. 1 can be constructed by utilizing a silicon wafer having a buried boron epitaxial layer. The 0.5 micronthick dioxide layer 15 is then formed havingside slots 45 which are utilized in a subsequent crystallographic etch. Next, thevarious CMOS layers 16 are formed including drive and control circuitry (not shown). TheSMA layer 20 is then created on top oflayers 15/16 and is connected with the drive circuitry. Thesilicon nitride layer 22 is then formed on thelayer 20. Each of thelayers various slots 45 which are utilized in a subsequent crystallographic etch. The silicon wafer is subsequently thinned by means of back etching with the etch stop being the boron-dopedsilicon layer 11. Subsequent etching of thelayer 11 forms thenozzle port 47 and anozzle rim 46. A nozzle chamber is formed by means of a crystallographic etch with theslots 45 defining the extent of the etch within thesilicon oxide layer 12. - A large array of nozzles can be formed on the same wafer which in turn is attached to an ink chamber for filling the nozzle chambers.
- One form of detailed manufacturing process which can be used to fabricate monolithic ink jet printheads operating in accordance with the principles taught by the present embodiment can proceed utilizing the following steps:
-
- 1. Using a double-sided
polished wafer 50, deposit 3 microns ofepitaxial silicon 11 heavily doped with boron. - 2.
Deposit 10 microns ofepitaxial silicon 12, either p-type or n-type, depending on the CMOS process used. - 3. Complete drive transistors, data distribution, and timing circuits using a 0.5-micron, one poly, 2 metal CMOS process to define the CMOS metal layers 16. This step is shown in
FIG. 5 . For clarity, these diagrams may not be to scale, and may not represent a cross section though any single plane of the nozzle.FIG. 4 is a key to representations of various materials in these manufacturing diagrams, and those of other cross-referenced ink jet configurations. - 4. Etch the CMOS oxide layers down to silicon or aluminum using Mask 1. This mask defines the nozzle chamber, and the edges of the printheads chips. This step is shown in
FIG. 6 . - 5. Crystallographically etch the exposed silicon using, for example, KOH or EDP (ethylenediamine pyrocatechol). This etch stops on <111>
crystallographic planes 51, and on the boron doped silicon buried layer. This step is shown inFIG. 7 . - 6.
Deposit 12 microns ofsacrificial material 52. Planarize down to oxide using CMP. Thesacrificial material 52 temporarily fills the nozzle cavity. This step is shown inFIG. 8 . - 7. Deposit 0.1 microns of high stress silicon nitride (Si3N4) 53.
- 8. Etch the
nitride layer 53 usingMask 2. This mask defines the contact vias from the shape memory heater to the second-level metal contacts. - 9. Deposit a seed layer.
- 10. Spin on 2 microns of resist, expose with Mask 3, and develop. This mask defines the shape memory wire embedded in the paddle. The resist acts as an electroplating mold. This step is shown in
FIG. 9 . - 11. Electroplate 1 micron of
Nitinol 55 on thesacrificial material 52 to fill the electroplating mold. Nitinol is a ‘shape memory’ alloy of nickel and titanium, developed at the Naval Ordnance Laboratory in the US (hence Ni—Ti-NOL). A shape memory alloy can be thermally switched between its weak martensitic state and its high stiffness austenitic state. - 12. Strip the resist and etch the exposed seed layer. This step is shown in
FIG. 10 . - 13. Wafer probe. All electrical connections are complete at this point, bond pads are accessible, and the chips are not yet separated.
- 14. Deposit 0.1 microns of high stress silicon nitride. High stress nitride is used so that once the sacrificial material is etched, and the paddle is released, the stress in the nitride layer will bend the relatively weak martensitic phase of the shape memory alloy. As the shape memory alloy, in its austenitic phase, is flat when it is annealed by the relatively high temperature deposition of this silicon nitride layer, it will return to this flat state when electrothermally heated.
- 15. Mount the
wafer 50 on aglass blank 56 and back-etch the wafer using KOH with no mask. This etch thins the wafer and stops at the buried boron doped silicon layer. This step is shown inFIG. 11 . - 16. Plasma back-etch the boron doped silicon layer to a depth of 1
micron using Mask 4. This mask defines thenozzle rim 46. This step is shown inFIG. 12 . - 17. Plasma back-etch through the boron doped layer using Mask 5. This mask defines the
nozzle port 47, and the edge of the chips. At this stage, the chips are still mounted on theglass blank 56. This step is shown inFIG. 13 . - 18. Strip the adhesive layer to detach the chips from the glass blank. Etch the
sacrificial layer 52 away. This process completely separates the chips. This step is shown inFIG. 14 . - 19. Mount the printheads in their packaging, which may be a molded plastic former incorporating ink channels which supply different colors of ink to the appropriate regions of the front surface of the wafer.
- 20. Connect the printheads to their interconnect systems.
- 21. Hydrophobize the front surface of the printheads.
- 22. Fill with ink and test the completed printheads. A filled nozzle is shown in
FIG. 15 .
- 1. Using a double-sided
- An embodiment of U.S. patent application Ser. No. 09/113,097 by the applicant is now described. This embodiment relies upon a magnetic actuator to “load” a spring, such that, upon deactivation of the magnetic actuator the resultant movement of the spring causes ejection of a drop of ink as the spring returns to its original position.
- In
FIG. 16 , there is illustrated an exploded perspective view of anink nozzle arrangement 60 constructed in accordance with the preferred embodiment. It would be understood that the preferred embodiment can be constructed as an array ofnozzle arrangements 60 so as to together form an array for printing. - The operation of the
ink nozzle arrangement 60 ofFIG. 16 proceeds by asolenoid 62 being energized by way of a drivingcircuit 64 when it is desired to print out an ink drop. The energizedsolenoid 62 induces a magnetic field in a fixed softmagnetic pole 66 and a moveable softmagnetic pole 68. The solenoid power is turned on to a maximum current for long enough to move themoveable pole 68 from its rest position to a stopped position close to the fixedmagnetic pole 66. Theink nozzle arrangement 60 ofFIG. 1 sits within an ink chamber filled with ink. Therefore, holes 70 are provided in the moveable softmagnetic pole 68 for “squirting” out of ink from around thesolenoid 62 when thepole 66 undergoes movement. - A fulcrum 72 with a
piston head 74 balances the moveable softmagnetic pole 66. Movement of themagnetic pole 66 closer to the fixedpole 66 causes thepiston head 74 to move away from anozzle chamber 76 drawing air into thechamber 76 via anink ejection port 78. Thepiston head 74 is then held open above thenozzle chamber 76 by means of maintaining a low “keeper” current through thesolenoid 62. The keeper level current throughsolenoid 62 is sufficient to maintain themoveable pole 68 against the fixed softmagnetic pole 66. The level of current will be substantially less than the maximum current level because a gap 114 (FIG. 35 ) between the twopoles ink ejection port 78 is a concave hemisphere due to the inflow of air. The surface tension on the meniscus exerts a net force on the ink which results in ink flow from an ink chamber into thenozzle chamber 76. This results in thenozzle chamber 76 refilling, replacing the volume taken up by thepiston head 74 which has been withdrawn. This process takes approximately 100 μs. - The current within
solenoid 62 is then reversed to half that of the maximum current. The reversal demagnetises themagnetic poles piston 74 to its rest position. Thepiston 74 is moved to its normal rest position by both magnetic repulsion and by energy stored in a stressedtorsional spring moveable pole 68. - The forces applied to the
piston 74 as a result of the reverse current andspring piston 74 and decreases as the spring elastic stress falls to zero. As a result, the acceleration ofpiston 74 is high at the beginning of a reverse stroke and the resultant ink velocity within thenozzle chamber 76 becomes uniform during the stroke. This results in an increased operating tolerance before ink flow over the printhead surface occurs. - At a predetermined time during the return stroke, the solenoid reverse current is turned off. The current is turned off when the residual magnetism of the movable pole is at a minimum. The
piston 74 continues to move towards its original rest position. - The
piston 74 overshoots the quiescent or rest position due to its inertia. Overshoot in the piston movement achieves two things: greater ejected drop volume and velocity, and improved drop break off as thepiston 74 returns from overshoot to its quiescent position. - The
piston 74 eventually returns from overshoot to the quiescent position. This return is caused by thesprings nozzle chamber 76, causing the ink ligament connecting the ink drop to the ink in thenozzle chamber 76 to thin. The forward velocity of the drop and the backward velocity of the ink in thenozzle chamber 76 are resolved by the ink drop breaking off from the ink in thenozzle chamber 76. - The
piston 74 stays in the quiescent position until the next drop ejection cycle. - A liquid ink printhead has one
ink nozzle arrangement 60 associated with each of the multitude of nozzles. Thearrangement 60 has the following major parts: -
- 1.
Drive circuitry 64 for driving thesolenoid 62. - 2. The
ejection port 78. The radius of theejection port 78 is an important determinant of drop velocity and drop size. - 3. The
piston 74. This is a cylinder which moves through thenozzle chamber 76 to expel the ink. Thepiston 74 is connected to one end of alever arm 84. The piston radius is approximately 1.5 to 2 times the radius of theejection port 78. The volume of ink displaced by thepiston 74 during the piston return stroke mostly determines the ink drop volume output. - 4. The
nozzle chamber 76. Thenozzle chamber 76 is slightly wider than thepiston 74. The gap 114 (FIGS. 34 & 35 ) between thepiston 74 and the nozzle chamber walls is as small as is required to ensure that the piston does not make contact with thenozzle chamber 76 during actuation or return. If the printheads are fabricated using 0.5 μm semiconductor lithography, then a 1μm gap 114 will usually be sufficient. Thenozzle chamber 76 is also deep enough so that air ingested through theejection port 78 when thepiston 74 returns to its quiescent state does not extend to thepiston 74. If it does, the ingested bubble may form a cylindrical surface instead of a hemispherical surface. If this happens, the nozzle will not refill properly. - 5. The
solenoid 62. This is a spiral coil of copper. Copper is used for its low resistivity and high electro-migration resistance. - 6. The fixed
magnetic pole 66 of ferromagnetic material. - 7. The moveable
magnetic pole 68 of ferromagnetic material. To maximise the magnetic force generated, the moveablemagnetic pole 68 and fixedmagnetic pole 66 surround thesolenoid 62 to define a torus. Thus, little magnetic flux is lost, and the flux is concentrated across the gap between the moveablemagnetic pole 68 and the fixedpole 66. The moveablemagnetic pole 68 has theholes 70 above thesolenoid 62 to allow trapped ink to escape. Theseholes 70 are arranged and shaped so as to minimise their effect on the magnetic force generated between the moveablemagnetic pole 68 and the fixedmagnetic pole 66. - 8. The
magnetic gap 114. Thegap 114 between the fixedpole 66 and themoveable pole 68 is one of the most important “parts” of the print actuator. The size of thegap 114 strongly affects the magnetic force generated, and also limits the travel of the moveablemagnetic pole 68. A small gap is desirable to achieve a strong magnetic force. The travel of thepiston 74 is related to the travel of the moveable magnetic pole 68 (and therefore the gap 114) by thelever arm 84. - 9. Length of the
lever arm 84. Thelever arm 84 allows the travel of thepiston 74 and the moveablemagnetic pole 68 to be independently optimised. At the short end of thelever arm 84 is the moveablemagnetic pole 68. At the long end of thelever arm 84 is thepiston 74. Thespring fulcrum 72. The optimum travel for the moveablemagnetic pole 68 is less than 1 mm, so as to minimise the magnetic gap. The optimum travel for thepiston 74 is approximately 5 μm for a 1200 dpi printer. Alever 84 resolves the difference in optimum travel with a 5:1 or greater ratio in arm length. - 10. The
springs 80, 82 (FIG. 1 ). Thesprings piston 74 to its quiescent position after a deactivation of thesolenoid 62. Thesprings fulcrum 72 of thelever arm 84. - 11. Passivation layers (not shown). All surfaces are preferably coated with passivation layers, which may be silicon nitride (Si3N4), diamond like carbon (DLC), or other chemically inert, highly impermeable layer. The passivation layers are especially important for device lifetime, as the active device is immersed in the ink.
- 1.
- As will be evident from the foregoing description, there is an advantage in ejecting the drop on deactivation of the
solenoid 62. This advantage comes from the rate of acceleration of the movingmagnetic pole 68. - The force produced by the moveable
magnetic pole 68 by an electromagnetically induced field is approximately proportional to the inverse square of the gap between the moveable and staticmagnetic poles solenoid 62 is off, this gap is at a maximum. When thesolenoid 62 is turned on, themoveable pole 68 is attracted to thestatic pole 66. As the gap decreases, the force increases, accelerating themovable pole 68 faster. The velocity increases in a highly non-linear fashion, approximately with the square of time. During the reverse movement of themoveable pole 68 upon deactivation, the acceleration of themoveable pole 68 is greatest at the beginning and then slows as the spring elastic stress falls to zero. As a result, the velocity of themoveable pole 68 is more uniform during the reverse stroke movement. - The velocity of the piston or
plunger 74 is constant over the duration of the drop ejection stroke. The piston orplunger 74 can be entirely removed from theink chamber 76 during the ink fill stage, and thereby the nozzle filling time can be reduced, allowing faster printhead operation. - However, this approach does have some disadvantages over a direct firing type of actuator:
-
- 1. The stresses on the
spring - 2. The
solenoid 62 must be provided with a “keeper” current for the nozzle fill duration. The keeper current will typically be less than 10% of the solenoid actuation current. However, the nozzle fill duration is typically around 50 times the drop firing duration, so the keeper energy will typically exceed the solenoid actuation energy. - 3. The operation of the actuator is more complex due to the requirement for a “keeper” phase.
- 1. The stresses on the
- The printhead is fabricated from two silicon wafers. A first wafer is used to fabricate the print nozzles (the printhead wafer) and a second wafer (the Ink Channel Wafer) is utilised to fabricate the various ink channels in addition to providing a support means for the first channel. The fabrication process then proceeds as follows:
-
- 1. Start with a single
crystal silicon wafer 90, which has a buriedepitaxial layer 92 of silicon which is heavily doped with boron. The boron should be doped to preferably 1020 atoms per cm3 of boron or more, and be approximately 3 μm thick, and be doped in a manner suitable for the active semiconductor device technology chosen. The wafer diameter of the printhead wafer should be the same as the ink channel wafer. - 2. Fabricate the drive transistors and
data distribution circuitry 64 according to the process chosen (eg. CMOS). - 3. Planarize the
wafer 90 using chemical mechanical planarization (CMP). - 4. Deposit 5 mm of glass (SiO2) over the second level metal.
- 5. Using a dual damascene process, etch two levels into the top oxide layer. Level 1 is 4 μm deep, and
level 2 is 5 μm deep.Level 2 contacts the second level metal. The masks for the static magnetic pole are used. - 6. Deposit 5 μm of nickel iron alloy (NiFe).
- 7. Planarize the wafer using CMP, until the level of the SiO2 is reached forming the
magnetic pole 66. - 8. Deposit 0.1 μm of silicon nitride (Si3N4).
- 9. Etch the Si3N4 for via holes for the connections to the solenoids, and for the
nozzle chamber region 76. - 10.
Deposit 4 μm of SiO2. - 11. Plasma etch the SiO2 in using the solenoid and support post mask.
- 12. Deposit a thin diffusion barrier, such as Ti, TiN, or TiW, and an adhesion layer if the diffusion layer chosen has insufficient adhesion.
- 13.
Deposit 4 μm of copper for forming thesolenoid 62 and spring posts 94. The deposition may be by sputtering, CVD, or electroless plating. As well as lower resistivity than aluminium, copper has significantly higher resistance to electromigration. The electro-migration resistance is significant, as current densities in the order of 3×106 Amps/cm2 may be required. Copper films deposited by low energy kinetic ion bias sputtering have been found to have 1,000 to 100,000 times larger electro-migration lifetimes larger than aluminium silicon alloy. The deposited copper should be alloyed and layered for maximum electro-migration lifetimes than aluminium silicon alloy. The deposited copper should be alloyed and layered for maximum electro-migration resistance, while maintaining high electrical conductivity. - 14. Planarize the wafer using CMP, until the level of the SiO2 is reached. A damascene process is used for the copper layer due to the difficulty involved in etching copper. However, since the damascene dielectric layer is subsequently removed, processing is actually simpler if a standard deposit/etch cycle is used instead of damascene. However, it should be noted that the aspect ratio of the copper etch would be 8:1 for this design, compared to only 4:1 for a damascene oxide etch. This difference occurs because the copper is 1 μm wide and 4 μm thick, but has only 0.5 μm spacing. Damascene processing also reduces the lithographic difficulty, as the resist is on oxide, not metal.
- 15. Plasma etch the
nozzle chamber 76, stopping at the boron dopedepitaxial silicon layer 92. This etch will be through around 13 μm of SiO2, and 8 μm of silicon. The etch should be highly anisotropic, with near vertical sidewalls. The etch stop detection can be on boron in the exhaust gasses. If this etch is selective against NiFe, the masks for this step and the following step can be combined, and the following step can be eliminated. This step also etches the edge of the printhead wafer down to the boron layer, for later separation. - 16. Etch the SiO2 layer. This need only be removed in the regions above the NiFe fixed magnetic poles, so it can be removed in the previous step if an Si and SiO2 etch selective against NiFe is used.
- 17. Conformably deposit 0.5 μm of high density Si3N4. This forms a corrosion barrier, so should be free of pinholes, and be impermeable to OH ions.
- 18. Deposit a thick sacrificial layer. This layer should entirely fill the nozzle chambers, and coat the entire wafer to an added thickness of 8 μm. The sacrificial layer may be SiO2.
- 19. Etch two depths in the sacrificial layer for a dual damascene process. The deep etch is 8 μm, and the shallow etch is 3 μm. The masks define the
piston 74, thelever arm 84, thesprings magnetic pole 68. - 20. Conformably deposit 0.1 μm of high density Si3N4. This forms a corrosion barrier, so should be free of pinholes, and be impermeable to OH ions.
- 21. Deposit 8 μm of nickel iron alloy (NiFe).
- 22. Planarize the wafer using CMP, until the level of the SiO2 is reached.
- 23. Deposit 0.1 μm of silicon nitride (Si3N4).
- 24. Etch the Si3N4 everywhere except the top of the plungers.
- 25. Open the bond pads.
- 26. Permanently bond the wafer onto a pre-fabricated ink channel wafer. The active side of the printhead wafer faces the ink channel wafer. The ink channel wafer is attached to a backing plate, as it has already been etched into separate ink channel chips.
- 27. Etch the printhead wafer to entirely remove the backside silicon to the level of the boron doped
epitaxial layer 92. This etch can be a batch wet etch in ethylenediamine pyrocatechol (EDP). - 28. Mask a
nozzle rim 96 from the underside of the printhead wafer. This mask also includes the chip edges. - 29. Etch through the boron doped
silicon layer 92, thereby creating the nozzle holes 70. This etch should also etch fairly deeply into the sacrificial material in thenozzle chambers 76 to reduce time required to remove the sacrificial layer. - 30. Completely etch the sacrificial material. If this material is SiO2 then a HF etch can be used. The nitride coating on the various layers protects the other glass dielectric layers and other materials in the device from HF etching. Access of the HF to the sacrificial layer material is through the nozzle, and simultaneously through the ink channel chip. The effective depth of the etch is 21 μm.
- 31. Separate the chips from the backing plate. Each chip is now a full printhead including ink channels. The two wafers have already been etched through, so the printheads do not need to be diced.
- 32. Test the printheads and TAB bond the good printheads.
- 33. Hydrophobize the front surface of the printheads.
- 34. Perform final testing on the TAB bonded printheads.
- 1. Start with a single
-
FIG. 17 shows a perspective view, in part in section, of a single inkjet nozzle arrangement 60 constructed in accordance with the preferred embodiment. - One alternative form of detailed manufacturing process which can be used to fabricate monolithic ink jet printheads operating in accordance with the principles taught by the present embodiment can proceed utilizing the following steps:
-
- 1. Using a double-sided
polished wafer 90 deposit 3 microns ofepitaxial silicon 92 heavily doped with boron. - 2.
Deposit 10 microns ofepitaxial silicon 98, either p-type or n-type, depending upon the CMOS process used. - 3. Complete a 0.5-micron, one poly, 2 metal CMOS process. This step is shown in
FIG. 19 . For clarity, these diagrams may not be to scale, and may not represent a cross section though any single plane of the nozzle.FIG. 18 is a key to representations of various materials in these manufacturing diagrams. - 4. Etch the CMOS oxide layers down to silicon or aluminum using Mask 1. This mask defines the
nozzle chamber 76, the edges of the printheads chips, and the vias for the contacts from the aluminum electrodes to two halves of the fixedmagnetic pole 66. - 5. Plasma etch the
silicon 90 down to the boron doped buriedlayer 92, using oxide fromstep 4 as a mask. This etch does not substantially etch the aluminum. This step is shown inFIG. 20 . - 6. Deposit a seed layer of cobalt nickel iron alloy. CoNiFe is chosen due to a high saturation flux density of 2 Tesla, and a low coercivity. [Osaka, Tetsuya et al, A soft magnetic CoNiFe film with high saturation magnetic flux density, Nature 392, 796-798 (1998)].
- 7. Spin on 4 microns of resist 99, expose with
Mask 2, and develop. This mask defines the fixedmagnetic pole 66 and the nozzle chamber wall, for which the resist 99 acts as an electroplating mold. This step is shown inFIG. 21 . - 8. Electroplate 3 microns of
CoNiFe 100. This step is shown inFIG. 22 . - 9. Strip the resist and etch the exposed seed layer. This step is shown in
FIG. 23 . - 10. Deposit 0.1 microns of silicon nitride (Si3N4).
- 11. Etch the nitride layer using Mask 3. This mask defines the contact vias from each end of the
solenoid 62 to the two halves of the fixedmagnetic pole 66. - 12. Deposit a seed layer of copper. Copper is used for its low resistivity (which results in higher efficiency) and its high electromigration resistance, which increases reliability at high current densities.
- 13. Spin on 5 microns of resist 101, expose with
Mask 4, and develop. This mask defines a spiral coil for thesolenoid 62, the nozzle chamber wall and the spring posts 94, for which the resist acts as an electroplating mold. This step is shown inFIG. 24 . - 14.
Electroplate 4 microns ofcopper 103. - 15. Strip the resist 101 and etch the exposed copper seed layer. This step is shown in
FIG. 25 . - 16. Wafer probe. All electrical connections are complete at this point, bond pads are accessible, and the chips are not yet separated.
- 17. Deposit 0.1 microns of silicon nitride.
- 18. Deposit 1 micron of
sacrificial material 102. This layer determines themagnetic gap 114. - 19. Etch the
sacrificial material 102 using Mask 5. This mask defines the spring posts 94 and the nozzle chamber wall. This step is shown inFIG. 26 . - 20. Deposit a seed layer of CoNiFe.
- 21. Spin on 4.5 microns of resist 104, expose with Mask 6, and develop. This mask defines the walls of the magnetic plunger or
piston 74, thelever arm 84, the nozzle chamber wall and the spring posts 94. The resist forms an electroplating mold for these parts. This step is shown inFIG. 27 . - 22.
Electroplate 4 microns ofCoNiFe 106. This step is shown inFIG. 13 . - 23. Deposit a seed layer of CoNiFe.
- 24. Spin on 4 microns of resist 108, expose with Mask 7, and develop. This mask defines the roof of the
magnetic plunger 74, the nozzle chamber wall, thelever arm 84, thesprings FIG. 29 . - 25. Electroplate 3 microns of
CoNiFe 110. This step is shown inFIG. 30 . - 26. Mount the
wafer 90 on aglass blank 112 and back-etch thewafer 90 using KOH, with no mask. This etch thins thewafer 90 and stops at the buried boron dopedsilicon layer 92. This step is shown inFIG. 31 . - 27. Plasma back-etch the boron doped
silicon layer 92 to a depth of 1 micron using Mask 8. This mask defines thenozzle rim 96. This step is shown inFIG. 32 . - 28. Plasma back-etch through the boron doped
layer 92 using Mask 9. This mask defines theink ejection port 78, and the edge of the chips. At this stage, the chips are separate, but are still mounted on theglass blank 112. This step is shown inFIG. 33 . - 29. Detach the chips from the
glass blank 112. Strip all adhesive, resist, sacrificial, and exposed seed layers. This step is shown inFIG. 34 . - 30. Mount the printheads in their packaging, which may be a molded plastic former incorporating ink channels which supply different colors of ink to the appropriate regions of the front surface of the wafer.
- 31. Connect the printheads to their interconnect systems.
- 32. Hydrophobize the front surface of the printheads.
- 33. Fill the completed printheads with ink and test them. A filled nozzle is shown in
FIG. 35 .
- 1. Using a double-sided
- The following description is of an embodiment of the invention covered by U.S. patent application Ser. No. 09/113,061 to the applicant. In this embodiment, a linear stepper motor is utilised to control a plunger device. The plunger device compresses ink within a nozzle chamber to cause the ejection of ink from the chamber on demand.
- Turning to
FIG. 36 , there is illustrated asingle nozzle arrangement 120 as constructed in accordance with this embodiment. Thenozzle arrangement 120 includes anozzle chamber 122 into which ink flows via a nozzlechamber filter portion 124 which includes a series of posts which filter out foreign bodies in the ink inflow. Thenozzle chamber 122 includes anink ejection port 126 for the ejection of ink on demand. Normally, thenozzle chamber 122 is filled with ink. - A
linear actuator 128 is provided for rapidly compressing a nickelferrous plunger 130 into thenozzle chamber 122 so as to compress the volume of ink within thechamber 122 to thereby cause ejection of drops from theink ejection port 126. Theplunger 130 is connected to a stepper movingpole device 132 of thelinear actuator 128 which is actuated by means of a three phase arrangement ofelectromagnets electro magnets electromagnets electromagnets plunger 130 viaactuator 128. Theactuator 128 is guided at one end by a means of aguide plunger 130 is coated with a hydrophobic material such as polytetrafluoroethylene (PTFE) which can form a major part of theplunger 130. The PTFE acts to repel the ink from thenozzle chamber 122 resulting in the creation ofmenisci 224, 226 (FIG. 59( a)) between theplunger 130 andside walls menisci plunger 130 within thenozzle chamber 122. Themenisci chamber 122 and hence theelectromagnets 134 to 156 can be operated in the atmosphere. - The
nozzle arrangement 120 is therefore operated to eject drops on demand by means of activating theactuator 128 by appropriately synchronised driving ofelectromagnets 134 to 156. The actuation of theactuator 128 results in theplunger 130 moving towards the nozzleink ejection port 126 thereby causing ink to be ejected from theport 126. Subsequently, theelectromagnets 134 to 156 are driven in reverse thereby moving theplunger 130 in an opposite direction resulting in the inflow of ink from an ink supply connected to an ink inlet port 166. - Preferably, multiple
ink nozzle arrangements 120 can be constructed adjacent to one another to form a multiple nozzle ink ejection mechanism. Thenozzle arrangements 120 are preferably constructed in an array print head constructed on a single silicon wafer which is subsequently diced in accordance with requirements. The diced print heads can then be interconnected to an ink supply which can comprise a through chip ink flow or ink flow from the side of a chip. - Turning now to
FIG. 37 , there is shown an exploded perspective of the various layers of thenozzle arrangement 120. Thenozzle arrangement 120 can be constructed on top of asilicon wafer 168 which has a standard electronic circuitry layer such as a two levelmetal CMOS layer 170. The twometal CMOS layer 170 provides the drive and control circuitry for the ejection of ink from thenozzles 120 by interconnection of the electromagnets to theCMOS layer 170. On top of theCMOS layer 170 is anitride passivation layer 172 which passivates the lower layers against any ink erosion in addition to any etching of the lowerCMOS glass layer 170 should a sacrificial etching process be used in the construction of thenozzle arrangement 120. - On top of the
nitride layer 172 are constructed various other layers. Thewafer layer 168, theCMOS layer 170 and thenitride passivation layer 172 are constructed with the appropriate vias for interconnection with the above layers. On top of thenitride layer 172 is constructed abottom copper layer 174 which interconnects with theCMOS layer 170 as appropriate. Next, a nickelferrous layer 176 is constructed which includes portions for the core of theelectromagnets 134 to 156 and theactuator 128 and guides 158, 160. On top of theNiFe layer 176 is constructed asecond copper layer 178 which forms the rest of the electromagnetic device. Thecopper layer 178 can be constructed using a dual damascene process. Next, aPTFE layer 180 is laid down followed by anitride layer 182 which defines theside filter portions 124 andside wall portions nozzle chamber 122. Theejection port 126 and anozzle rim 184 are etched into thenitride layer 182. A number ofapertures 186 are defined in thenitride layer 182 to facilitate etching away any sacrificial material used in the construction of the various lower layers including thenitride layer 182. - It will be understood by those skilled in the art of construction of micro-electromechanical systems (MEMS) that the
various layers 170 to 182 can be constructed using a sacrificial material to support the layers. The sacrificial material is then etched away to release the components of thenozzle arrangement 120. - For a general introduction to a micro-electro mechanical system (MEMS) reference is made to standard proceedings in this field including the proceedings of the SPIE (International Society for Optical Engineering), volumes 2642 and 2882 which contain the proceedings for recent advances and conferences in this field.
- One form of detailed manufacturing process which can be used to fabricate monolithic ink jet print heads operating in accordance with the principles taught by the present embodiment can proceed utilizing the following steps:
-
- 1. Using a double sided
polished wafer 188, complete drive transistors, data distribution, and timing circuits using a 0.5 micron, one poly, 2 metal CMOS process. This step is shown inFIG. 39 . For clarity, these diagrams may not be to scale, and may not represent a cross section though any single plane of thenozzle 120.FIG. 38 is a key to representations of various materials in these manufacturing diagrams, and those of other cross-referenced ink jet configurations. - 2. Deposit 1 micron of
sacrificial material 190. - 3. Etch the
sacrificial material 190 and the CMOS oxide layers down to second level metal using Mask 1. This mask definescontact vias 192 from the second level metal electrodes to the solenoids. This step is shown inFIG. 40 . - 4. Deposit a barrier layer of titanium nitride (TiN) and a seed layer of copper.
- 5. Spin on 2 microns of resist 194, expose with
Mask 2, and develop. This mask defines the lower side of a solenoid square helix. The resist 194 acts as an electroplating mold. This step is shown inFIG. 41 . - 6. Electroplate 1 micron of
copper 196. Copper is used for its low resistivity (which results in higher efficiency) and its high electromigration resistance, which increases reliability at high current densities. - 7. Strip the resist 198 and etch the exposed barrier and seed layers. This step is shown in
FIG. 42 . - 8. Deposit 0.1 microns of silicon nitride.
- 9. Deposit a seed layer of cobalt nickel iron alloy. CoNiFe is chosen due to a high saturation flux density of 2 Tesla, and a low coercivity. [Osaka, Tetsuya et al, A soft magnetic CoNiFe film with high saturation magnetic flux density, Nature 392, 796-798 (1998)].
- 10. Spin on 3 microns of resist 198, expose with Mask 3, and develop. This mask defines all of the soft magnetic parts, being the fixed magnetic pole of the electromagnets, 134 to 156, the moving poles of the
linear actuator 128, thehorizontal guides ink plunger 130. The resist 198 acts as an electroplating mold. This step is shown inFIG. 43 . - 11.
Electroplate 2 microns ofCoNiFe 200. This step is shown inFIG. 44 . - 12. Strip the resist 198 and etch the exposed seed layer. This step is shown in
FIG. 45 . - 13. Deposit 0.1 microns of silicon nitride (Si3N4) (not shown).
- 14. Spin on 2 microns of resist 202, expose with
Mask 4, and develop. This mask defines solenoidvertical wire segments 204, for which the resist acts as an electroplating mold. This step is shown inFIG. 46 . - 15. Etch the nitride down to copper using the
Mask 4 resist. - 16.
Electroplate 2 microns ofcopper 206. This step is shown inFIG. 47 . - 17. Deposit a seed layer of copper.
- 18. Spin on 2 microns of resist 208, expose with Mask 5, and develop. This mask defines the upper side of the solenoid square helix. The resist 208 acts as an electroplating mold. This step is shown in
FIG. 48 . - 19. Electroplate 1 micron of
copper 210. This step is shown inFIG. 49 . - 20. Strip the resist and etch the exposed copper seed layer, and strip the newly exposed resist. This step is shown in
FIG. 50 . - 21. Open the bond pads using Mask 6.
- 22. Wafer probe. All electrical connections are complete at this point, bond pads are accessible, and the chips are not yet separated.
- 23. Deposit 5 microns of
PTFE 212. - 24. Etch the
PTFE 212 down to the sacrificial layer using Mask 7. This mask defines theink plunger 130. This step is shown inFIG. 51 . - 25. Deposit 8 microns of
sacrificial material 214. Planarize using CMP to the top of thePTFE ink plunger 130. This step is shown inFIG. 52 . - 26. Deposit 0.5 microns of
sacrificial material 216. This step is shown inFIG. 53 . - 27. Etch all layers of sacrificial material using Mask 8. This mask defines the
nozzle chamber walls FIG. 54 . - 28. Deposit 3 microns of
PECVD glass 218. - 29. Etch to a depth of (approx.) 1 micron using Mask 9. This mask defines the
nozzle rim 184. This step is shown inFIG. 55 . - 30. Etch down to the sacrificial
layer using Mask 10. This mask defines the roof of thenozzle chamber 122, theink ejection port 126, and the sacrificialetch access apertures 186. This step is shown inFIG. 56 . - 31. Back-etch completely through the silicon wafer (with, for example, an ASE Advanced Silicon Etcher from Surface Technology Systems) using
Mask 11. Continue the back-etch through the CMOS glass layers until the sacrificial layer is reached. This mask definesink inlets 220 which are etched through thewafer 168. Thewafer 168 is also diced by this etch. This step is shown inFIG. 57 . - 32. Etch the sacrificial material away. The
nozzle chambers 122 are cleared, theactuators 128 freed, and the chips are separated by this etch. This step is shown inFIG. 58 . - 33. Mount the printheads in their packaging, which may be a molded plastic former incorporating ink channels which supply the appropriate color ink to the
ink inlets 220 at the back of the wafer. The package also includes a piezoelectric actuator attached to the rear of the ink channels. The piezoelectric actuator provides the oscillating ink pressure required for the ink jet operation. - 34. Connect the printheads to their interconnect systems. For a low profile connection with minimum disruption of airflow, TAB may be used. Wire bonding may also be used if the printer is to be operated with sufficient clearance to the paper.
- 35. Hydrophobize the front surface of the printheads.
- 36. Fill the completed printheads with
ink 222 and test them. A filled nozzle is shown inFIG. 59 .
- 1. Using a double sided
- It would be appreciated by a person skilled in the art that numerous variations and/or modifications may be made to the present invention as shown in the specific embodiment without departing from the spirit or scope of the invention as broadly described. The present embodiment is, therefore, to be considered in all respects to be illustrative and not restrictive.
- The presently disclosed ink jet printing technology is potentially suited to a wide range of printing systems including: color and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers, high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable color and monochrome printers, color and monochrome copiers, color and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic ‘minilabs’, video printers, PHOTO CD (PHOTO CD is a registered trademark of the Eastman Kodak Company) printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.
- The embodiments of the invention use an ink jet printer type device. Of course many different devices could be used. However presently popular ink jet printing technologies are unlikely to be suitable.
- The most significant problem with thermal ink jet is power consumption. This is approximately 100 times that required for high speed, and stems from the energy-inefficient means of drop ejection. This involves the rapid boiling of water to produce a vapor bubble which expels the ink. Water has a very high heat capacity, and must be superheated in thermal ink jet applications. This leads to an efficiency of around 0.02%, from electricity input to drop momentum (and increased surface area) out.
- The most significant problem with piezoelectric ink jet is size and cost. Piezoelectric crystals have a very small deflection at reasonable drive voltages, and therefore require a large area for each nozzle. Also, each piezoelectric actuator must be connected to its drive circuit on a separate substrate. This is not a significant problem at the current limit of around 300 nozzles per printhead, but is a major impediment to the fabrication of pagewidth printheads with 19,200 nozzles.
- Ideally, the ink jet technologies used meet the stringent requirements of in-camera digital color printing and other high quality, high speed, low cost printing applications. To meet the requirements of digital photography, new ink jet technologies have been created. The target features include:
- low power (less than 10 Watts)
- high resolution capability (1,600 dpi or more)
- photographic quality output
- low manufacturing cost
- small size (pagewidth times minimum cross section)
- high speed (<2 seconds per page).
- All of these features can be met or exceeded by the ink jet systems described above.
Claims (3)
1. A nozzle for an inkjet printer, the nozzle comprising:
a roof layer defining a nozzle port;
a substrate layer defining a nozzle chamber wall supporting the roof layer;
an actuator assembly attached to the substrate, the actuator assembly including a support and a lever arm cantilevered from the support to terminate in a piston within the nozzle chamber wall; and
a solenoid provided at an end of the lever arm opposite to that of the piston, the solenoid including a movable magnetic pole and a fixed magnetic pole spaced apart from the movable magnetic pole.
2. A nozzle as claimed in claim 1 , wherein the nozzle chamber wall defines a gap along a height of the nozzle chamber wall, the gap being dimensioned to pass the lever arm therethrough.
3. A nozzle as claimed in claim 1 , further comprising a fulcrum provided on the lever arm between the piston and the solenoid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/052,995 US20110169892A1 (en) | 1997-07-15 | 2011-03-21 | Inkjet nozzle incorporating actuator with magnetic poles |
Applications Claiming Priority (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPO8004A AUPO800497A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ26) |
AUPO8004 | 1997-07-15 | ||
AUPO7991A AUPO799197A0 (en) | 1997-07-15 | 1997-07-15 | Image processing method and apparatus (ART01) |
AUPO7991 | 1997-07-15 | ||
US09/113,122 US6557977B1 (en) | 1997-07-15 | 1998-07-10 | Shape memory alloy ink jet printing mechanism |
US10/421,823 US6830316B2 (en) | 1997-07-15 | 2003-04-24 | Ink jet printing mechanism that incorporates a shape memory alloy |
US10/982,789 US7086720B2 (en) | 1997-07-15 | 2004-11-08 | Micro-electromechanical fluid ejection device that incorporates a shape memory alloy based actuator |
US11/349,074 US7255424B2 (en) | 1997-07-15 | 2006-02-08 | Ink nozzle |
US11/778,572 US7566113B2 (en) | 1997-07-15 | 2007-07-16 | Inkjet nozzle incorporating serpentine actuator |
US12/493,241 US7934806B2 (en) | 1997-07-15 | 2009-06-29 | Inkjet nozzle incorporating piston actuator |
US13/052,995 US20110169892A1 (en) | 1997-07-15 | 2011-03-21 | Inkjet nozzle incorporating actuator with magnetic poles |
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US12/493,241 Continuation US7934806B2 (en) | 1997-07-15 | 2009-06-29 | Inkjet nozzle incorporating piston actuator |
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US09/113,122 Expired - Fee Related US6557977B1 (en) | 1997-07-15 | 1998-07-10 | Shape memory alloy ink jet printing mechanism |
US10/307,348 Expired - Fee Related US6764166B2 (en) | 1997-07-15 | 2002-12-02 | Ejecting ink using shape memory alloys |
US10/407,207 Expired - Fee Related US7252366B2 (en) | 1997-07-15 | 2003-04-07 | Inkjet printhead with high nozzle area density |
US10/407,212 Expired - Fee Related US7416280B2 (en) | 1997-07-15 | 2003-04-07 | Inkjet printhead with hollow drop ejection chamber formed partly of actuator material |
US10/421,823 Expired - Fee Related US6830316B2 (en) | 1997-07-15 | 2003-04-24 | Ink jet printing mechanism that incorporates a shape memory alloy |
US10/421,822 Expired - Fee Related US6723575B2 (en) | 1997-07-15 | 2003-04-24 | Method of fabricating a shape memory alloy ink jet printing mechanism |
US10/893,380 Expired - Fee Related US6938992B2 (en) | 1997-07-15 | 2004-07-19 | Nozzle arrangement with an electrically heated actuator |
US10/968,922 Expired - Fee Related US7066575B2 (en) | 1997-07-15 | 2004-10-21 | Micro-electromechanical fluid ejection device having a buckle-resistant actuator |
US10/982,789 Expired - Fee Related US7086720B2 (en) | 1997-07-15 | 2004-11-08 | Micro-electromechanical fluid ejection device that incorporates a shape memory alloy based actuator |
US11/026,046 Expired - Fee Related US7398597B2 (en) | 1997-07-15 | 2005-01-03 | Method of fabricating monolithic microelectromechanical fluid ejection device |
US10/882,774 Expired - Fee Related US7275811B2 (en) | 1997-07-15 | 2005-02-02 | High nozzle density inkjet printhead |
US11/064,011 Expired - Fee Related US7178903B2 (en) | 1997-07-15 | 2005-02-24 | Ink jet nozzle to eject ink |
US11/071,261 Expired - Fee Related US7175774B2 (en) | 1997-07-15 | 2005-03-04 | Method of fabricating inkjet nozzles |
US11/071,251 Expired - Fee Related US7147792B2 (en) | 1997-07-15 | 2005-03-04 | Method of fabricating inkjet nozzle chambers |
US11/080,496 Expired - Fee Related US7192119B2 (en) | 1997-07-15 | 2005-03-16 | Printhead nozzle arrangement with a micro-electromechanical shape memory alloy based actuator |
US11/159,193 Expired - Fee Related US7404625B2 (en) | 1997-07-15 | 2005-06-23 | Ink jet nozzle arrangement having paddle forming a portion of a wall |
US11/231,876 Expired - Fee Related US7284837B2 (en) | 1997-07-15 | 2005-09-22 | Fluid ejection device with micro-electromechanical fluid ejection actuators |
US11/298,635 Expired - Fee Related US7364270B2 (en) | 1997-07-15 | 2005-12-12 | Fluid ejection device having an elongate micro-electromechanical actuator |
US11/349,074 Expired - Fee Related US7255424B2 (en) | 1997-07-15 | 2006-02-08 | Ink nozzle |
US11/491,378 Expired - Fee Related US7350903B2 (en) | 1997-07-15 | 2006-07-24 | Inkjet printhead with common chamber and actuator material |
US11/540,569 Expired - Fee Related US7540592B2 (en) | 1997-07-15 | 2006-10-02 | Micro-electromechanical nozzle assembly with an arcuate actuator |
US11/766,713 Expired - Fee Related US7794053B2 (en) | 1997-07-15 | 2007-06-21 | Inkjet printhead with high nozzle area density |
US11/778,572 Expired - Fee Related US7566113B2 (en) | 1997-07-15 | 2007-07-16 | Inkjet nozzle incorporating serpentine actuator |
US11/841,647 Expired - Fee Related US7631956B2 (en) | 1997-07-15 | 2007-08-20 | Ink jet printhead with glass nozzle chambers |
US11/926,109 Expired - Fee Related US7568788B2 (en) | 1997-07-15 | 2007-10-28 | Printhead with barrier at chamber inlet |
US12/035,410 Expired - Fee Related US7635178B2 (en) | 1997-07-15 | 2008-02-21 | Nozzle apparatus for an inkjet printhead with a solenoid piston |
US12/037,054 Expired - Fee Related US7775632B2 (en) | 1997-07-15 | 2008-02-25 | Nozzle arrangement with expandable actuator |
US12/139,485 Expired - Fee Related US7771018B2 (en) | 1997-07-15 | 2008-06-15 | Ink ejection nozzle arrangement for an inkjet printer |
US12/493,241 Expired - Fee Related US7934806B2 (en) | 1997-07-15 | 2009-06-29 | Inkjet nozzle incorporating piston actuator |
US12/501,459 Expired - Fee Related US7914119B2 (en) | 1997-07-15 | 2009-07-12 | Printhead with columns extending across chamber inlet |
US12/620,574 Expired - Fee Related US7950775B2 (en) | 1997-07-15 | 2009-11-17 | Printhead integrated circuit having glass nozzle chambers |
US12/620,527 Expired - Fee Related US7959263B2 (en) | 1997-07-15 | 2009-11-17 | Printhead integrated circuit with a solenoid piston |
US12/848,966 Abandoned US20100295903A1 (en) | 1997-07-15 | 2010-08-02 | Ink ejection nozzle arrangement for inkjet printer |
US13/052,995 Abandoned US20110169892A1 (en) | 1997-07-15 | 2011-03-21 | Inkjet nozzle incorporating actuator with magnetic poles |
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Application Number | Title | Priority Date | Filing Date |
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US09/113,122 Expired - Fee Related US6557977B1 (en) | 1997-07-15 | 1998-07-10 | Shape memory alloy ink jet printing mechanism |
US10/307,348 Expired - Fee Related US6764166B2 (en) | 1997-07-15 | 2002-12-02 | Ejecting ink using shape memory alloys |
US10/407,207 Expired - Fee Related US7252366B2 (en) | 1997-07-15 | 2003-04-07 | Inkjet printhead with high nozzle area density |
US10/407,212 Expired - Fee Related US7416280B2 (en) | 1997-07-15 | 2003-04-07 | Inkjet printhead with hollow drop ejection chamber formed partly of actuator material |
US10/421,823 Expired - Fee Related US6830316B2 (en) | 1997-07-15 | 2003-04-24 | Ink jet printing mechanism that incorporates a shape memory alloy |
US10/421,822 Expired - Fee Related US6723575B2 (en) | 1997-07-15 | 2003-04-24 | Method of fabricating a shape memory alloy ink jet printing mechanism |
US10/893,380 Expired - Fee Related US6938992B2 (en) | 1997-07-15 | 2004-07-19 | Nozzle arrangement with an electrically heated actuator |
US10/968,922 Expired - Fee Related US7066575B2 (en) | 1997-07-15 | 2004-10-21 | Micro-electromechanical fluid ejection device having a buckle-resistant actuator |
US10/982,789 Expired - Fee Related US7086720B2 (en) | 1997-07-15 | 2004-11-08 | Micro-electromechanical fluid ejection device that incorporates a shape memory alloy based actuator |
US11/026,046 Expired - Fee Related US7398597B2 (en) | 1997-07-15 | 2005-01-03 | Method of fabricating monolithic microelectromechanical fluid ejection device |
US10/882,774 Expired - Fee Related US7275811B2 (en) | 1997-07-15 | 2005-02-02 | High nozzle density inkjet printhead |
US11/064,011 Expired - Fee Related US7178903B2 (en) | 1997-07-15 | 2005-02-24 | Ink jet nozzle to eject ink |
US11/071,261 Expired - Fee Related US7175774B2 (en) | 1997-07-15 | 2005-03-04 | Method of fabricating inkjet nozzles |
US11/071,251 Expired - Fee Related US7147792B2 (en) | 1997-07-15 | 2005-03-04 | Method of fabricating inkjet nozzle chambers |
US11/080,496 Expired - Fee Related US7192119B2 (en) | 1997-07-15 | 2005-03-16 | Printhead nozzle arrangement with a micro-electromechanical shape memory alloy based actuator |
US11/159,193 Expired - Fee Related US7404625B2 (en) | 1997-07-15 | 2005-06-23 | Ink jet nozzle arrangement having paddle forming a portion of a wall |
US11/231,876 Expired - Fee Related US7284837B2 (en) | 1997-07-15 | 2005-09-22 | Fluid ejection device with micro-electromechanical fluid ejection actuators |
US11/298,635 Expired - Fee Related US7364270B2 (en) | 1997-07-15 | 2005-12-12 | Fluid ejection device having an elongate micro-electromechanical actuator |
US11/349,074 Expired - Fee Related US7255424B2 (en) | 1997-07-15 | 2006-02-08 | Ink nozzle |
US11/491,378 Expired - Fee Related US7350903B2 (en) | 1997-07-15 | 2006-07-24 | Inkjet printhead with common chamber and actuator material |
US11/540,569 Expired - Fee Related US7540592B2 (en) | 1997-07-15 | 2006-10-02 | Micro-electromechanical nozzle assembly with an arcuate actuator |
US11/766,713 Expired - Fee Related US7794053B2 (en) | 1997-07-15 | 2007-06-21 | Inkjet printhead with high nozzle area density |
US11/778,572 Expired - Fee Related US7566113B2 (en) | 1997-07-15 | 2007-07-16 | Inkjet nozzle incorporating serpentine actuator |
US11/841,647 Expired - Fee Related US7631956B2 (en) | 1997-07-15 | 2007-08-20 | Ink jet printhead with glass nozzle chambers |
US11/926,109 Expired - Fee Related US7568788B2 (en) | 1997-07-15 | 2007-10-28 | Printhead with barrier at chamber inlet |
US12/035,410 Expired - Fee Related US7635178B2 (en) | 1997-07-15 | 2008-02-21 | Nozzle apparatus for an inkjet printhead with a solenoid piston |
US12/037,054 Expired - Fee Related US7775632B2 (en) | 1997-07-15 | 2008-02-25 | Nozzle arrangement with expandable actuator |
US12/139,485 Expired - Fee Related US7771018B2 (en) | 1997-07-15 | 2008-06-15 | Ink ejection nozzle arrangement for an inkjet printer |
US12/493,241 Expired - Fee Related US7934806B2 (en) | 1997-07-15 | 2009-06-29 | Inkjet nozzle incorporating piston actuator |
US12/501,459 Expired - Fee Related US7914119B2 (en) | 1997-07-15 | 2009-07-12 | Printhead with columns extending across chamber inlet |
US12/620,574 Expired - Fee Related US7950775B2 (en) | 1997-07-15 | 2009-11-17 | Printhead integrated circuit having glass nozzle chambers |
US12/620,527 Expired - Fee Related US7959263B2 (en) | 1997-07-15 | 2009-11-17 | Printhead integrated circuit with a solenoid piston |
US12/848,966 Abandoned US20100295903A1 (en) | 1997-07-15 | 2010-08-02 | Ink ejection nozzle arrangement for inkjet printer |
Country Status (1)
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US (34) | US6557977B1 (en) |
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WO2022049159A1 (en) | 2020-09-01 | 2022-03-10 | 3C Project Management Limited | Mems device with integrated cmos circuit |
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US8117751B2 (en) * | 1997-07-15 | 2012-02-21 | Silverbrook Research Pty Ltd | Method of forming printhead by removing sacrificial material through nozzle apertures |
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2006
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2007
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- 2007-08-20 US US11/841,647 patent/US7631956B2/en not_active Expired - Fee Related
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2008
- 2008-02-21 US US12/035,410 patent/US7635178B2/en not_active Expired - Fee Related
- 2008-02-25 US US12/037,054 patent/US7775632B2/en not_active Expired - Fee Related
- 2008-06-15 US US12/139,485 patent/US7771018B2/en not_active Expired - Fee Related
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2009
- 2009-06-29 US US12/493,241 patent/US7934806B2/en not_active Expired - Fee Related
- 2009-07-12 US US12/501,459 patent/US7914119B2/en not_active Expired - Fee Related
- 2009-11-17 US US12/620,574 patent/US7950775B2/en not_active Expired - Fee Related
- 2009-11-17 US US12/620,527 patent/US7959263B2/en not_active Expired - Fee Related
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2010
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2011
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